Radio frequency front-end module and electronic equipment

Abstract

The radio frequency front-end module comprises a substrate and a radio frequency assembly, the substrate comprises multiple metal layers, the multiple metal layers at least comprise a top metal layer and a bottom metal layer, and multiple bonding pads are formed on the bottom metal layer; the radio frequency assembly is arranged on the substrate, a metal wire is formed on the metal layer, and at least one terminal of the radio frequency assembly is connected with the bonding pad through the metal wire; wherein the metal wires comprise bottom metal wires, and the bottom metal wires are formed on the bottom metal layer. According to the radio frequency front-end module, the bottom metal wires are arranged on the bottom metal layer, the terminals of the radio frequency assembly can be connected with the bonding pads of the bottom metal layer through the bottom metal wires, the bottom metal wires are arranged at intervals between the bonding pads of the bottom metal layer, the area of the substrate can be more fully utilized, and miniaturization of the radio frequency front-end module is facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of radio frequency technology, and in particular to a radio frequency front-end module and an electronic device. BACKGROUND

[0002] With the rapid development of new generation information technology, the technologies in various subfields are constantly updated and improved, and higher requirements are also faced for various performance indicators and miniaturization of radio frequency front-end modules. For example, in order to reduce the interference between internal wires of the radio frequency front-end module, the prior art needs to increase the distance between the internal wires of the radio frequency front-end module, such as setting a metal layer between the internal wires for isolation, and the substrate of the radio frequency front-end module needs more metal layers, which is not conducive to the miniaturization of the radio frequency front-end module. SUMMARY

[0003] The present application provides a radio frequency front-end module and an electronic device, which can more fully utilize the area of the substrate of the radio frequency front-end module, and is conducive to the miniaturization of the radio frequency front-end module.

[0004] In a first aspect, an embodiment of the present application provides a radio frequency front-end module, which comprises: a substrate, the substrate comprising a plurality of metal layers, the plurality of metal layers comprising at least a top metal layer and a bottom metal layer, a plurality of pads being formed on the bottom metal layer; a radio frequency component, the radio frequency component being disposed on the substrate, the metal layers being formed with metal wires, at least one terminal of the radio frequency component being connected with the pads through the metal wires; wherein the metal wires comprise a bottom metal wire, the bottom metal wire being formed on the bottom metal layer.

[0005] In a second aspect, an embodiment of the present application provides an electronic device, which comprises the radio frequency front-end module described above.

[0006] The radio frequency front-end module and the electronic device provided by the embodiments of the present application can connect the terminal of the radio frequency component with the pads of the bottom metal layer through the bottom metal wire arranged on the bottom metal layer. Compared with the related art in which the bottom metal layer is only used to arrange the pads and the metal wires are arranged on other metal layers, the embodiments of the present application can arrange the bottom metal wire by using the interval between the pads of the bottom metal layer, and can more fully utilize the area of the substrate, which is conducive to the miniaturization of the radio frequency front-end module.

[0007] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the disclosure of the embodiments of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0009] Figure 1 is a schematic block diagram of a radio frequency front-end module provided by the embodiments of the present application; Figures 2 to 3b is a schematic block diagram of a radio frequency front-end module in some embodiments of the present application; Figures 4 to 6 is a schematic diagram of a bottom metal layer in some embodiments of the present application; Figures 7a to 7c is a schematic block diagram of a radio frequency front-end module in some other embodiments of the present application; Figure 8 is a schematic diagram of a bottom metal layer in some other embodiments of the present application; Figure 9 is a schematic block diagram of a radio frequency front-end module provided by the embodiments of the present application;

[0010] Legend of reference signs: 10, substrate; 11, metal layer; 110, metal trace; 110a, radio frequency signal trace; 111, top metal layer; 112, bottom metal layer; 1121, pad; 1121a, ground pad; 1122, bottom metal trace; 1122a, MIPI RFFE signal trace; 1122b, ground metal line; 113, middle metal layer; 1131, middle metal trace; 12, first metallized via; 13, second metallized via; 14, third metallized via; 20, radio frequency component; 21, terminal; 30, solder ball. DETAILED DESCRIPTION

[0011] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0012] It is to be understood that the application can assume various alternative embodiments, and should not be limited to the examples described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. In the drawings, like reference numerals refer to like elements throughout the several views, and the size and relative sizes of layers and regions can be exaggerated in some of the drawings for clarity.

[0013] For a thorough understanding of the application, reference should be made to the following detailed description, in conjunction with the accompanying drawings, in which:

[0014] Some embodiments of the application will now be described in detail in the following description, given with reference to the drawings. Figures 1 to 4 show schematic diagrams of a radio frequency front-end module according to embodiments of the application.

[0015] Reference will now be made to the drawings, wherein: Figure 1 Figure 1 is a schematic block diagram of a radio frequency front-end module according to an embodiment of the application.

[0016] As shown in Figure 1 , the radio frequency front-end module comprises a substrate 10 and a radio frequency component 20.

[0017] In some embodiments, the radio frequency component 20 comprises radio frequency devices and radio frequency passive components. Exemplarily, the radio frequency devices can comprise active, functional semiconductor components such as one or more of the following: radio frequency power amplifiers (PA), low noise amplifiers (LNA), radio frequency switches, filters, etc. integrated circuits (chips) or discrete transistors. Exemplarily, the radio frequency passive components can comprise passive, basic circuit building components such as one or more of the following: inductors, capacitors, resistors, antennas, etc.

[0018] In some embodiments, the radio frequency front-end module refers to the part between the antenna and the transceiver, mainly comprising two or more radio frequency devices such as radio frequency power amplifiers (PA), radio frequency switches, low noise amplifiers (LNA) and filters. Exemplarily, the radio frequency front-end module integrates multiple radio frequency devices in one package, thereby reducing external connection lines, improving radio frequency signal performance, reducing loss, and reducing cost.​

[0019] For example, the RF front-end module includes an RF switch, a filter, a low-noise amplifier, and multiple pads arranged on the substrate 10. The multiple pads include a ground (GND) pad 1121a, an antenna pad ANT connected to the RF switch, and an RF receiving pad RX connected to the low-noise amplifier. The RF devices and pads can form an RF signal receiving path.

[0020] For example, the radio frequency front-end module includes a radio frequency switch, a filter, a power amplifier and multiple pads arranged on the substrate 10. The multiple pads include a ground pad 1121a, an antenna pad ANT connected to the radio frequency switch and a radio frequency transmission pad TX connected to the power amplifier. A radio frequency signal transmission path can be formed through the above radio frequency devices and pads.

[0021] For example, such as Figure 2 As shown, the RF front-end module includes an RF switch, a filter, a power amplifier, a low-noise amplifier, and multiple pads arranged on the substrate 10. The multiple pads include a ground pad 1121a, an antenna pad ANT connected to the RF switch, an RF transmit pad TX connected to the power amplifier, and an RF receive pad RX connected to the low-noise amplifier. The above-mentioned RF devices and pads can form an RF receive path and a signal transmit path.

[0022] For example, the RF front-end module includes an RF switch, a filter, and multiple pads disposed on the substrate 10. The multiple pads include a ground pad 1121a, an antenna pad ANT connected to the RF switch, and a signal transmission pad connected to the filter.

[0023] like Figure 1 As shown, the substrate 10 includes multiple metal layers 11, each including at least a top metal layer 111 and a bottom metal layer 112. A dielectric layer may be disposed between each pair of adjacent metal layers 11. Exemplarily, when the substrate 10 has metal layers 11 on its back side, the top metal layer 111 is the metal layer on the front side of the substrate 10, and the bottom metal layer 112 is the metal layer on the back side of the substrate 10. When the substrate 10 does not have metal layers 11 on its back side, the top metal layer 111 is the metal layer on the front side of the substrate 10 furthest from the back side, and the bottom metal layer 112 is the metal layer on the front side of the substrate 10 closest to the back side. The back side of the substrate can be the side of a circuit board used for connecting to an electronic device. A plurality of pads 1121 are formed on the bottom metal layer 112.

[0024] In some implementations, the RF front-end module is packaged using a BGA (Ball Grid Array) package. For example... Figure 7cAs shown, the radio frequency front-end module can further include solder balls 30 disposed on the back of the substrate 10 of the radio frequency front-end module and connected to the pads 1121 on the bottom metal layer 112.

[0025] In some embodiments, the radio frequency front-end module is packaged in an LGA (Land Grid Array) package. The pads 1121 on the bottom metal layer 112 of the substrate 10 of the radio frequency front-end module can be connected to a circuit board of an electronic device.

[0026] The radio frequency component 20 is disposed on the substrate 10, and the metal layer 11 of the substrate 10 is formed with metal traces 110, and at least one terminal 21 of the radio frequency component 20 is connected to the pads 1121 of the bottom metal layer 112 through the metal traces 110.

[0027] Please refer to Figure 1 The metal traces 110 include bottom metal traces 1122 formed on the bottom metal layer 112.

[0028] In the embodiments of the present application, the terminals 21 of the radio frequency component 20 can be connected to the pads 1121 of the bottom metal layer 112 through the bottom metal traces 1122. Compared with the related art in which the bottom metal layer is only used to dispose pads and the metal traces are disposed on other metal layers, the present application can utilize the space between the pads 1121 of the bottom metal layer 112 to dispose the bottom metal traces 1122, which can make more full use of the area of the substrate 10 and is conducive to the miniaturization of the radio frequency front-end module.

[0029] In some embodiments, as shown in Figure 1 The radio frequency component 20 can be disposed on the top metal layer 111, but it can also be not limited to this, for example, part of the radio frequency component 20 can be disposed on the top metal layer 111, and part of the radio frequency component 20 can be disposed on the bottom metal layer 112, so as to improve the integration of the radio frequency front-end module by double-sided packaging. For the convenience of description, the embodiments of the present application are mainly described by taking the radio frequency component 20 disposed on the top metal layer 111 as an example.

[0030] In some embodiments, the radio frequency component 20 can be connected to the top metal layer 111 through a bonding wire, and / or the radio frequency component 20 can be flipped on the substrate 10, and the radio frequency component 20 is connected to the top metal layer 111 through a bump on the radio frequency component 20.

[0031] In some embodiments, as shown in Figure 3aAs shown, the RF component 20 is disposed on the top metal layer 111, and the substrate 10 further comprises a first metallized via 12, a first end of the first metallized via 12 is connected to the bottom metal trace 1122, and a second end of the first metallized via 12 is connected to the top metal layer 111 to connect with the terminal 21 of the RF component 20. At least one terminal 21 of the RF component 20 is connected to the pad 1121 of the bottom metal layer 112 through the bottom metal trace 1122 and the bottom metal layer 112.

[0032] For example, at least one terminal 21 of the RF component 20 is connected to the pad 1121 of the bottom metal layer 112 through the first metallized via 12 and the bottom metal trace 1122. This wiring method is more concise, and since the bottom metal layer 112 only has a metal layer 11 on one side, the coupling between the bottom metal trace 1122 and the metal trace 110 of the remaining metal layer 11 is weak, which can reduce electromagnetic interference.

[0033] For example, at least one pad 1121 of the RF front-end module is extended to the target position of the bottom metal layer 112 through the bottom metal trace 1122, connected to the top metal layer 111 through the first metallized via 12, and connected to the corresponding terminal 21 of the RF component 20 on the top metal layer 111.

[0034] Optionally, a second end of the first metallized via 12 is connected to a metal trace 110 of the top metal layer 111, the metal trace 110 of the top metal layer 111 is connected to the terminal 21 of the RF component 20, or the second end of the first metallized via 12 is connected to a connection point of the top metal layer 111, and the connection point is connected to the terminal 21 of the RF component 20. For example, the connection point can be provided with a pad, and the terminal of the RF impedance 20 can be connected to the pad of the connection point through a bonding wire or a bump.

[0035] In some embodiments, please refer to Figure 3bThe multi-layer metal layer 11 further comprises a top metal layer 111 and an intermediate metal layer 113 between the top metal layer 111 and the bottom metal layer 112, and the metal traces 110 further comprise an intermediate metal trace 1131 formed in the intermediate metal layer 113. The RF component 20 is disposed on the top metal layer 111. The substrate 10 further comprises a second metallized via 13 and a third metallized via 14. The RF component 20 is connected to the intermediate metal trace 1131 through the second metallized via 13, and the intermediate metal trace 1131 is connected to the bottom metal trace 1122 through the third metallized via 14. At least one terminal 21 of the RF component 20 is connected to the pad 1121 of the bottom metal layer 112 through the bottom metal trace 110. Optionally, the intermediate metal trace 1131 and the bottom metal trace 1122 can be parallel, or the intermediate metal trace 1131 and the bottom metal trace 1122 can intersect, or part of the intermediate metal trace 1131 and part of the bottom metal trace 1122 are parallel and the rest of the bottom metal trace 1122 intersects. The present application does not make specific limitations in this regard.

[0036] For example, at least one terminal 21 of the RF component 20 is connected to the pad 1121 of the bottom metal layer 112 through the second metallized via 13, the intermediate metal trace 1131, the third metallized via 14 and the bottom metal trace 1122. This wiring method has higher flexibility. It should be noted that the same terminal 21 of the RF component 20 can be connected to the pad 1121 through the intermediate metal trace 1131 of one intermediate metal layer 113 and the corresponding second metallized via 13 and third metallized via 14, or through the intermediate metal trace 1131 of multiple intermediate metal layers 113 and the corresponding metallized via.

[0037] In some embodiments, as shown in Figures 4 to 6 The bottom metal trace 1122 comprises at least part of the MIPI RFFE signal trace 1122a. Specifically, the MIPI RFFE signal trace 1122a is used to transmit the MIPI RFFE signal, and the MIPI RFFE signal comprises a clock (CLK) signal, a data (DATA) signal and a first power voltage (VIO) signal. For example, the data signal comprises instructions and / or data for controlling the working state and working parameters of the RF component, the clock signal is used to synchronize the transmission of the instructions and / or data, and the first power voltage signal is used to provide a power voltage to support the transmission of the instructions and / or data.

[0038] For example, as shown in Figures 4 to 6As shown, the plurality of pads 1121 of the bottom metal layer 112 includes MIPI RFFE pads, and a first end of at least part of the MIPI RFFE signal traces 1122a is connected to a corresponding MIPI RFFE signal pad, and a second end of the MIPI RFFE signal traces 1122a is connected to the MIPI RFFE terminal of the RF component 20.

[0039] For example, a first end of the MIPI RFFE signal traces 1122a is connected to a corresponding MIPI RFFE signal pad, and a second end of the MIPI RFFE signal traces 1122a is connected to the MIPI RFFE terminal of the RF component 20 through the first metallized via 12.

[0040] For example, a first end of the MIPI RFFE signal traces 1122a formed in the bottom metal layer 112 (i.e., the bottom metal traces 1122) is connected to a corresponding MIPI RFFE signal pad, and a second end of the MIPI RFFE signal traces 1122a formed in the bottom metal layer 112 is connected to the MIPI RFFE terminal of the RF component 20 through the third metallized via 14, the intermediate metal traces 1131, and the second metallized via 13. It is noted that the third metallized via 14, the intermediate metal traces 1131, and the second metallized via 13 on this path are also part of the entire MIPI RFFE signal transmission path corresponding to the MIPI RFFE signal pad, wherein the intermediate metal traces 1131 are disposed in the intermediate metal layer 113.

[0041] For example, the MIPI RFFE signal pads include a clock pad, a data transmission pad, and a first power voltage pad.

[0042] For example, referring to Figure 4 or Figure 5a or Figure 5b the MIPI RFFE signal traces 1122a include a clock signal trace connecting a clock (CLK) pad and a clock terminal of the RF component 20; and / or, the MIPI RFFE signal traces 1122a include a data transmission trace connecting a data (DATA) transmission pad and a data transmission terminal of the RF component 20; and / or, the MIPI RFFE signal traces 1122a include a first power voltage trace connecting a first power voltage (VIO) pad and a first power voltage terminal of the RF component 20. That is, at least one of a clock signal trace, a data transmission trace, and a first power voltage trace is disposed on the bottom metal layer 112.

[0043] In some embodiments, referring to Figure 5a or Figure 5b orFigure 7a and Figure 7b The plurality of pads 1121 of the bottom metal layer 112 includes radio frequency signal (RF) pads. The metal traces 110 includes radio frequency signal traces 110a which are connected with the radio frequency signal (RF) pads of the radio frequency front end module and the radio frequency signal terminals of the radio frequency component 20. For example, please refer to Figure 2 Referring to Figure 5a or Figure 5b The radio frequency signal pads includes at least one of the following: an antenna pad ANT, a radio frequency transmit pad TX, a radio frequency receive pad RX. The antenna pad ANT is the “entrance and exit” of the radio frequency signal. For the radio frequency transmit link, the antenna pad ANT is the output end, which outputs the high frequency radio frequency signal which has been processed and amplified, ready to be transmitted by the antenna. The radio frequency transmit pad TX is the input end of the transmit link, which receives the radio frequency signal output from the transmitter or transceiver. For the radio frequency receive link, the antenna pad ANT is the input end, which receives the weak radio frequency signal from the antenna and sends it to the radio frequency front end module for processing. The radio frequency receive pad RX is the output end, which outputs the processed radio frequency signal to the receiver or transceiver.

[0044] In some embodiments, referring to Figure 7a and Figure 7b The radio frequency signal traces 110a are formed in the top metal layer 111 of the substrate 10 and / or the intermediate metal layer 113 of the substrate 10. For example, in the case that at least part of the MIPI RFFE signal traces 1122a are arranged in the bottom metal layer 112, the bottom metal layer 112 does not arrange the radio frequency signal traces 110a. By arranging the radio frequency signal traces 110a in the top metal layer 111 and / or the intermediate metal layer 113 of the substrate 10, which is different from the metal layer 11 where the MIPI RFFE signal traces 1122a are arranged in the bottom metal layer 112, the isolation between the MIPI RFFE signal traces 1122a and the radio frequency signal traces 110a can be improved, preventing interference between each other. For example, the sensitivity (desense) requirement of the MIPI RFFE signal can be met, so that the interference of the MIPI RFFE signal to the radio frequency signal of the radio frequency signal traces 110a is controlled within a certain range.

[0045] Optionally, referring to Figure 7b The metal layer 11 where the radio frequency signal traces 110a are arranged is separated from the bottom metal layer 112 by at least one intermediate metal layer 113. As Figure 7b or Figure 7cAs shown, the substrate 10 includes four metal layers 11, the first metal layer, i.e., the top metal layer 111, the fourth metal layer, i.e., the bottom metal layer 112, the intermediate metal layer 113 close to the first metal layer is the second metal layer, and the intermediate metal layer 113 close to the fourth metal layer is the third metal layer; the MIPI RFFE signal trace 1122a is arranged on the fourth metal layer 112, the radio frequency signal trace 110a can be arranged on the first metal layer and / or the second metal layer, and the third metal layer is not provided with the radio frequency signal trace 110a. By arranging at least one intermediate metal layer 113 between the radio frequency signal trace 110a and the MIPI RFFE signal trace 1122a, the isolation degree between the MIPI RFFE signal trace 1122a and the radio frequency signal trace 110a can be further improved, and interference between them can be prevented.

[0046] It should be noted that in the related art, the bottom metal layer is only used to arrange the pads, and in addition to the bottom metal layer, a metal layer for forming the MIPI RFFE signal trace 1122a, a metal layer for forming the radio frequency signal trace, and a metal layer for isolating the metal layer where the MIPI RFFE signal trace 1122a is arranged from the metal layer where the radio frequency signal trace is arranged are needed. The number of metal layers required by the substrate is relatively large, and the cost is relatively high. Alternatively, in the related art, in order not to increase the number of layers of the substrate, the MIPI RFFE signal trace and the radio frequency signal trace are arranged on the same metal layer except the bottom metal layer. In order to improve the isolation degree between the MIPI RFFE signal and the radio frequency signal, a relatively large spacing needs to be maintained between the MIPI RFFE signal trace and the radio frequency signal trace, which will result in an increase in the area of the substrate and an increase in cost.

[0047] In the embodiment of the present application, the MIPI RFFE signal trace 1122a is formed on the bottom metal layer 112. Even if a metal layer 11 is arranged between the bottom metal layer 112 and the metal layer 11 for forming the radio frequency signal trace 110a for isolation, the number of layers required by the substrate 10 is relatively small, which is beneficial to the miniaturization of the radio frequency front-end module and can reduce the cost.

[0048] In some embodiments, referring to Figure 5a or Figure 5b or Figure 6 At least part of the radio frequency signal trace 110a is formed on the bottom metal layer 112; the first end of the radio frequency signal trace 110a formed on the bottom metal layer 112 is connected to the corresponding radio frequency signal pad (such as Figure 5a or Figure 5b RF1 to RF3 in Figure 6The second end of the RF signal trace 110a formed on the bottom metal layer 112 is connected to the RF signal terminal of the RF component 20. By placing at least a portion of the RF signal trace 110a on the bottom metal layer 112 and utilizing the spacing between the pads 1121 of the bottom metal layer 112, the area of ​​the substrate 10 can be utilized more fully, which is beneficial for the miniaturization of the RF front-end module. The connection of the second end of the RF signal trace 110a to the RF signal terminal of the RF component 20 can include the second end of the RF signal trace 110a being directly connected to the RF signal terminal of the RF component 20 after passing through a corresponding third metallized via 14, an intermediate metal trace 1131, and a second metallized via 13; or the second end of the RF signal trace 110a being connected to the RF signal terminal of the RF component 20 through other components, such as capacitors and / or inductors, after passing through a corresponding third metallized via 14, an intermediate metal trace 1131, and a second metallized via 13.

[0049] For example, please refer to Figure 6 The bottom metal layer 112 includes multiple pads 1121, including ground pads 1121a. Ground metal lines 1122b and at least a portion of MIPI RFFE signal traces 1122a are formed on the bottom metal layer 112. A first end of the ground metal line 1122b is connected to a corresponding ground pad 1121a, and a second end of the ground metal line 1122b is connected to a ground terminal of the RF component 20. For example, the second end of the ground metal line 1122b can be directly connected to the ground terminal via a via, or connected to the ground terminal via at least one intermediate metal layer 113 and vias connecting the ground metal line 1122b and the intermediate metal layer 113, and vias connecting the intermediate metal layer 113 and the ground terminal. RF signal traces 110a formed on the bottom metal layer 112 are located on one side of the ground metal line 1122b, and MIPI RFFE signal traces 1122a formed on the bottom metal layer 112 are located on the other side of the ground metal line 1122b. By providing a grounding metal line 1122b connected to the grounding pad 1121a on the bottom metal layer 112, the RF signal trace 110a formed on the bottom metal layer 112 and the MIPI RFFE signal trace 1122a formed on the bottom metal layer 112 are isolated. This can improve the isolation between the MIPI RFFE signal trace 1122a and the RF signal trace 110a, prevent mutual interference, and for example, meet the sensitivity requirements of the MIPI RFFE signal.

[0050] For example, at least part of the RF signal lines 110a are formed in the bottom metal layer 112, and the rest of the RF signal lines 110a are formed in the top metal layer 111 and / or the middle metal layer 113 of the substrate 10. The length of the RF signal lines 110a formed in the bottom metal layer 112 is less than the length of the RF signal lines 110a formed in the top metal layer 111 and / or the middle metal layer 113 of the substrate 10. The RF signal lines 110a are preferentially arranged in the top metal layer 111 and / or the middle metal layer 113. On the one hand, most of the RF signal lines 110a are in different metal layers 11 from the MIPI RFFE signal lines 1122a, which can improve the isolation between the MIPI RFFE signal lines 1122a and the RF signal lines 110a and prevent interference between them. On the other hand, the metal thickness of the top metal layer 111 can be set to be greater than the metal thickness of the bottom metal layer 112 to reduce the insertion loss of the RF signal lines 110a.

[0051] In some other embodiments, referring to Figure 8 The metal lines 110 include RF signal lines 110a, and the bottom metal lines 1122 include at least part of the RF signal lines 110a. The first end of the RF signal lines 110a in the bottom metal lines 1122 is connected to the RF signal pads, and the second end of the RF signal lines 110a in the bottom metal lines 1122 is connected to the RF signal terminals of the RF component 20. For example, the second end of the RF signal lines 110a is directly connected to the RF signal terminals through a via, or is connected to the RF signal terminals through at least one middle metal layer 113, a via connecting the second end of the RF signal lines 110a and the middle metal layer 113, and a via connecting the middle metal layer 113 and the RF signal terminals. At least part of the RF signal lines 110a are arranged in the bottom metal layer 112, and the RF signal lines 110a are arranged in the space between the pads 1121 of the bottom metal layer 112, which can make full use of the area of the substrate 10 and facilitate the miniaturization of the RF front-end module.

[0052] Exemplarily, the metal trace 110 further comprises a MIPI RFFE signal trace 1122a, at least part of the MIPI RFFE signal trace 1122a is formed on the top metal layer 111 of the substrate 10 and / or the middle metal layer 113 of the substrate 10. By arranging at least part of the MIPI RFFE signal trace 1122a on the top metal layer 111 and / or the middle metal layer 113 of the substrate 10, which is different from the metal layer 11 where the radio frequency signal trace 110a is arranged, the isolation between the MIPI RFFE signal trace 1122a and the radio frequency signal trace 110a can be improved, and interference between them can be prevented.

[0053] Optionally, the substrate 10 comprises four metal layers 11, i.e. the first metal layer to the fourth metal layer, the first metal layer is the top metal layer 111, and the fourth metal layer is the bottom metal layer 112. When the second metal layer to the fourth metal layer are provided with the radio frequency signal trace 110a, the MIPI RFFE signal trace 1122a can be arranged on the first metal layer, i.e. the top metal layer 111.

[0054] Exemplarily, the metal layer 11 where the MIPI RFFE signal trace 1122a formed on the top metal layer 111 of the substrate 10 and / or the middle metal layer 113 of the substrate 10 is at least one middle metal layer 113 away from the bottom metal layer 112. For example, when the substrate 10 comprises four metal layers 11, and the third metal layer and the fourth metal layer are provided with the radio frequency signal trace 110a, the MIPI RFFE signal trace 1122a can be arranged on the top metal layer 111, and the second metal layer can not be provided with the MIPI RFFE signal trace 1122a and the radio frequency signal trace 110a. By arranging at least one middle metal layer 113 between the radio frequency signal trace 110a and the MIPI RFFE signal trace 1122a, the isolation between the MIPI RFFE signal trace 1122a and the radio frequency signal trace 110a can be further improved, and interference between them can be prevented.

[0055] In some embodiments, please refer to Figures 5a to 6 When at least part of the radio frequency signal trace 110a is formed on the bottom metal layer 112, and at least part of the MIPI RFFE signal trace 1122a is also formed on the bottom metal layer 112, at least one pad 1121 is arranged between the radio frequency signal trace 110a and the MIPI RFFE signal trace 1122a on the bottom metal layer 112. That is, the distance between the radio frequency signal trace 110a and the MIPI RFFE signal trace 1122a on the bottom metal layer 112 is large, so as to improve the isolation between the MIPI RFFE signal trace 1122a and the radio frequency signal trace 110a, and prevent interference between them. Exemplarily, please refer toFigure 5a The bottom metal layer 112 further forms a ground pad 1121a; one or more ground pads 1121a are arranged between the RF signal trace 110a formed on the bottom metal layer 112 and the MIPI RFFE signal trace 1122a formed on the bottom metal layer 112, which can further improve the isolation between the MIPI RFFE signal trace 1122a and the RF signal trace 110a, and prevent interference between them. Of course, it is not limited to this. For example, as shown in Figure 5b , the pad 1121 between the RF signal trace 110a and the MIPI RFFE signal trace 1122a can also not be limited to the ground pad 1121a, but can also be other pads.

[0056] In some embodiments, as shown in Figure 4 or Figure 5a or Figure 6 , the bottom metal layer 112 further forms a ground pad 1121a, and one or more ground pads 1121a are arranged between the at least two bottom metal traces 1122. As shown in Figure 4 , a plurality of ground pads 1121a are arranged between the two MIPI RFFE signal traces 1122a (for example, the DATA signal trace and the VIO signal trace, or the CLK signal trace and the VIO signal trace); as shown in Figure 5a , a plurality of ground pads 1121a are arranged between the two MIPI RFFE signal traces 1122a, and a plurality of ground pads 1121a are arranged between the RF signal trace 110a and the MIPI RFFE signal trace 1122a; as shown in Figure 6 , a plurality of pads 1121a are arranged between the at least two adjacent bottom metal traces 1122. For example, as shown in Figure 4 or Figure 5a , in the case of LGA packaging of the RF front-end module, the large-area ground pad 1121a in the middle region of the bottom metal layer 112 can be used to isolate the adjacent bottom metal traces 1122, which can improve the isolation between the bottom metal traces 1122 and prevent interference between them.

[0057] The radio frequency front end module provided in the embodiment of the present application comprises a substrate 10 and a radio frequency component 20. The substrate 10 comprises a plurality of metal layers 11, the plurality of metal layers 11 at least comprise a top metal layer 111 and a bottom metal layer 112, and a plurality of pads 1121 are formed on the bottom metal layer 112. The radio frequency component 20 is arranged on the substrate 10, the metal layer 11 is formed with a metal trace 110, and at least one terminal 21 of the radio frequency component 20 is connected with the pad 1121 through the metal trace 110. The metal trace 110 comprises a bottom metal trace 1122, and the bottom metal trace 1122 is formed on the bottom metal layer 112. By arranging the bottom metal trace 1122 on the bottom metal layer 112, the terminal 21 of the radio frequency component 20 can be connected with the pad 1121 of the bottom metal layer 112 through the bottom metal trace 1122. Compared with the prior art in which the bottom metal layer is only used to arrange the pads and the metal traces are arranged on other metal layers, the substrate needs to have a larger area and / or needs more metal layers to arrange the metal traces, the embodiment of the present application can arrange the bottom metal trace 1122 by using the interval between the pads 1121 of the bottom metal layer 112, the area of the substrate 10 can be more fully utilized, and the miniaturization of the radio frequency front end module is facilitated.

[0058] Please refer to the foregoing embodiments Figure 9 As Figure 9 The electronic device provided in another embodiment of the present application is shown in the schematic block diagram. The electronic device comprises the radio frequency front end module described above.

[0059] The electronic device can be a mobile phone, a tablet computer, a vehicle-mounted terminal, and other communication devices, and of course, can also be other communication devices with communication functions, and the embodiment of the present application does not limit the specific types of the electronic device.

[0060] The specific principles and implementation manners of the electronic device provided in the embodiment of the present application are similar to those of the radio frequency front end module in the foregoing embodiments, and will not be described herein. The parts not mentioned in the embodiment of the present application can refer to the related description of the foregoing embodiments, and will not be described herein.

[0061] It should be understood that the terms used in the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0062] It will be understood that when an element or layer is referred to as being "on", "adjacent", "connected to" or "coupled to" another element or layer, it can be directly on, adjacent, connected or coupled to the other element or layer or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on", "directly adjacent", "directly connected to", or "directly coupled to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.

[0063] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0064] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0065] The specific embodiments described hereinabove are illustrative examples of the present application and, as such, numerous other modifications and / or improvements made to the application as described hereinabove can be made by those skilled in the art without departing from the scope of the application. The scope of the application is not to be limited by the specific illustrative embodiments described hereinabove. Rather, the scope of the application is to be defined solely by the claims that follow.

Claims

1. A radio frequency front-end module, characterized in that, The radio frequency front-end module includes: A substrate, the substrate comprising multiple metal layers, the multiple metal layers comprising at least a top metal layer and a bottom metal layer, wherein a plurality of pads are formed on the bottom metal layer; A radio frequency (RF) component is disposed on the substrate, and a metal layer is formed with metal traces. At least one terminal of the RF component is connected to the pad through the metal traces. The metal traces include bottom metal traces, which are formed in the bottom metal layer.

2. The radio frequency front-end module according to claim 1, characterized in that, The radio frequency component is disposed on the top metal layer, and the substrate further includes a first metallized via, the first end of the first metallized via being connected to the bottom metal trace, and the second end of the first metallized via being connected to the top metal layer to be connected to the terminal of the radio frequency component.

3. The radio frequency front-end module according to claim 1, characterized in that, The multilayer metal layer further includes the top metal layer and an intermediate metal layer between the top metal layer and the bottom metal layer, and the metal trace further includes an intermediate metal trace formed in the intermediate metal layer; The radio frequency component is disposed on the top metal layer. The substrate further includes a second metallized via and a third metallized via. The radio frequency component is connected to the intermediate metal trace through the second metallized via, and the intermediate metal trace is connected to the bottom metal trace through the third metallized via.

4. The radio frequency front-end module according to claim 1, characterized in that, The bottom metal traces include at least a portion of MIPI RFFE signal traces, which are used to transmit MIPI RFFE signals, including: clock signals, data signals, and a first power supply voltage signal.

5. The radio frequency front-end module according to claim 4, characterized in that, The plurality of pads include MIPI RFFE pads, and the first end of at least a portion of the MIPI RFFE signal traces is connected to the corresponding MIPI RFFE pad, and the second end of the MIPI RFFE signal traces is connected to the MIPI RFFE terminal of the RF component.

6. The radio frequency front-end module according to claim 5, characterized in that, The MIPI RFFE pads include clock pads, data transmission pads, and a first power supply voltage pad; wherein: The MIPI RFFE signal traces include clock signal traces, which connect the clock pads and the clock terminals of the RF components; and / or The MIPI RFFE signal traces include data transmission traces, which connect the data transmission pads and the data transmission terminals of the RF components; and / or The MIPI RFFE signal trace includes a first power supply voltage trace, which connects the first power supply voltage pad and the first power supply voltage terminal of the RF component.

7. The radio frequency front-end module according to claim 4, characterized in that, The plurality of pads include radio frequency (RF) signal pads, the metal traces include RF signal traces, and the RF signal traces are connected to the RF signal pads of the RF front-end module and the RF signal terminals of the RF components; the RF signal pads include at least one of the following: antenna pads, RF transmitting pads, and RF receiving pads.

8. The radio frequency front-end module according to claim 7, characterized in that, The radio frequency signal traces are formed on the top metal layer of the substrate and / or the middle metal layer of the substrate.

9. The radio frequency front-end module according to claim 8, characterized in that, The metal layer containing the radio frequency signal trace is separated from the bottom metal layer by at least one intermediate metal layer.

10. The radio frequency front-end module according to claim 7, characterized in that, At least a portion of the radio frequency signal traces are formed in the underlying metal layer; The first end of the RF signal trace formed on the bottom metal layer is connected to the corresponding RF signal pad, and the second end of the RF signal trace formed on the bottom metal layer is connected to the RF signal terminal of the RF component.

11. The radio frequency front-end module according to claim 10, characterized in that, The plurality of pads also includes a ground pad. A ground metal line and at least a portion of the MIPI RFFE signal traces are formed on the bottom metal layer. A first end of the ground metal line is connected to the ground pad, and a second end of the ground metal line is connected to the ground terminal of the RF component. The radio frequency signal trace formed on the bottom metal layer is located on one side of the ground metal line, and the MIPI RFFE signal trace formed on the bottom metal layer is located on the other side of the ground metal line.

12. The radio frequency front-end module according to claim 10, characterized in that, At least a portion of the radio frequency signal traces are formed in the top metal layer and / or the middle metal layer of the substrate; The length of the radio frequency signal trace formed on the bottom metal layer is less than the length of the radio frequency signal trace formed on the top metal layer and / or the middle metal layer of the substrate.

13. The radio frequency front-end module according to claim 1, characterized in that, The plurality of pads include radio frequency signal pads, the metal traces include radio frequency signal traces, and the bottom metal traces include at least a portion of the radio frequency signal traces; The first end of the RF signal trace in the bottom metal trace is connected to the RF signal pad, and the second end of the RF signal trace in the bottom metal trace is connected to the RF signal terminal of the RF component. The metal traces also include MIPI RFFE signal traces, at least a portion of which are formed in the top metal layer and / or the middle metal layer of the substrate.

14. The radio frequency front-end module according to claim 13, characterized in that, The MIPI RFFE signal traces located in the top metal layer and / or the middle metal layer of the substrate are separated from the bottom metal layer by at least one middle metal layer.

15. The radio frequency front-end module according to any one of claims 10-13, characterized in that, At least a portion of MIPI RFFE signal traces are also formed on the bottom metal layer, and at least one pad is spaced between the RF signal traces and the MIPI RFFE signal traces on the bottom metal layer.

16. The radio frequency front-end module according to claim 15, characterized in that, A grounding pad is also formed on the bottom metal layer; One or more ground pads are provided between the radio frequency signal traces formed on the bottom metal layer and the MIPI RFFE signal traces formed on the bottom metal layer.

17. The radio frequency front-end module according to any one of claims 1-14, characterized in that, A grounding pad is also formed on the bottom metal layer, and one or more of the grounding pads are provided between at least two bottom metal traces.

18. An electronic device, characterized in that, The electronic device includes the radio frequency front-end module as described in any one of claims 1 to 17.

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