High-pressure annealing device

Abstract

The invention discloses a high-pressure annealing device. The device comprises an inner cavity for providing an inner space, an outer cavity for accommodating the inner cavity, a heating module for performing a heating effect in the outer space between the inner cavity and the outer cavity, a cavity door for opening or closing at least any one of the lower part of the inner cavity and the lower part of the outer cavity through lifting work, and a control module arranged on the cavity door, the substrate holder which enters and exits the inner space and the shielding member which seals the lower part of the outer space according to the lifting operation of the cavity door can prevent the particles generated by the heating module from diffusing, thereby preventing the substrate (semiconductor wafer) from being polluted by the particles.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to a high-pressure annealing apparatus used when performing an annealing process for a substrate or the like. BACKGROUND

[0002] In an ion implantation process performed for manufacturing of a semiconductor device or the like, damage can be caused to a substrate such as a semiconductor wafer, and an annealing process can be performed for the purpose of recovering such damage or the like.

[0003] Generally, an annealing apparatus used when performing such an annealing process can include a chamber providing a substrate processing space for a heating process of a substrate, and a heating module raising a temperature of the substrate processing space in the chamber to a range required for a process by a heating action. The chamber can be configured to have a structure with an open lower portion, and the open lower portion is opened and closed by a door. The heating module can include a heater provided to surround the chamber. If the door is opened, a substrate can be carried into or out of the substrate processing space through the open lower portion of the chamber.

[0004] When a process is performed, the annealing apparatus thus configured is provided with high heat by the heating module, and thus a surface or the like of the heating module can be peeled off or detached by heat damage. In addition, due to thermal expansion of the heating module, friction can occur between components of the heating module. According to such peeling, detachment, friction, or the like, a large amount of particles can be generated. The generated particles can be diffused by flying and contaminate the surroundings.

[0005] In particular, in a process of carrying a substrate into or out of the substrate processing space, particles can be attached to a surface or the like of the substrate and contaminate the substrate. This can cause a decrease in yield.

[0006] (Patent Document 1) Korean Patent Laid-Open Publication No. 10-2006-0042705 (2006.05.15)

[0007] (Patent Document 2) Korean Patent Laid-Open Publication No. 10-2014-0039987 (2014.04.02)

[0008] (Patent Document 3) Korean Patent Laid-Open Publication No. 10-2015-0086831 (2015.07.29) SUMMARY

[0009] An embodiment of the present application provides a high-pressure annealing apparatus that can prevent contamination and the like caused by particles from a heating module.

[0010] An embodiment of the present application provides a high-pressure annealing apparatus that can achieve both prevention of contamination problems due to particles and stable support of a chamber.

[0011] The problem to be solved is not limited to this, and other problems not mentioned should be understood explicitly from the following description for those skilled in the art.

[0012] According to an embodiment of the present application, there is provided a high-pressure annealing apparatus, characterized by comprising: an internal chamber that provides an internal space for performing a heating process on a substrate (semiconductor wafer or the like) and is configured to have a structure with a lower portion open; an external chamber that accommodates the internal chamber and is configured to have a structure with a lower portion open; a heating module that heats the internal chamber in an external space between the internal chamber and the external chamber that are spaced apart from each other; a chamber door that opens and closes at least either one of the open lower portion of the internal chamber and the open lower portion of the external chamber opposite thereto by lifting work, and moves to a closed position when the lifting work is performed and moves to an open position when the lowering work is performed; a substrate support unit (substrate holder) that is loaded above the chamber door and is in and out (put in and out) of the internal space through the open lower portion of the internal chamber according to the lifting and lowering work of the chamber door; and a shield (shield cover) that blocks the open lower portion of the external space between the internal chamber and the external chamber.

[0013] According to an embodiment of the present application, a high-pressure annealing apparatus supplies a first gas as a reaction gas to the internal space at a first pressure (high pressure compared to atmospheric pressure), and supplies a second gas as a protective gas to the external space at a second pressure (the same pressure as the first pressure, or a pressure slightly higher or lower than the first pressure) predetermined in association with the first pressure.

[0014] The internal chamber can be provided by quartz as a non-metallic material. In addition, the external chamber can be provided by a metallic material. The shield can stably position the internal chamber on the internal space of the external chamber by supporting the lower end portion of the internal chamber made of quartz in a contact manner in a state of being coupled to the lower end portion of the external chamber made of a metallic material.

[0015] Specifically, the cover can include an upper cover module of a ring shape, a peripheral portion of which is coupled to a lower end portion of the outer cavity and a central portion of which seals the lower portion of the outer space while supporting a lower end portion of the inner cavity, a spacer of a ring shape for supporting the upper cover module from below, and a lower cover module of a ring shape, which is disposed below the upper cover module and seals the lower portion of the outer space while a peripheral portion thereof is coupled to the lower end portion of the outer cavity and a central portion thereof supports the spacer.

[0016] The inner cavity can be provided with a flange at the lower end portion thereof. The upper cover module can support the flange of the inner cavity.

[0017] The upper cover module can include an upper cover having a peripheral ring portion coupled to the lower end portion of the outer cavity and a central ring portion having a support upper surface supporting the flange of the inner cavity from below, and a pressurizing ring coupled to the upper cover above the upper cover and having a pressurizing lower surface pressurizing the flange.

[0018] A flange of the heating module coupled to the lower end portion of the outer cavity can be provided at a lower end portion of the heating module. The upper cover can be coupled to the lower end portion of the outer cavity via the heating module with the peripheral ring portion of the upper cover being coupled to the lower end portion of the heating module.

[0019] The heating module can be configured to have a ring protrusion disposed above the pressurizing ring. The upper cover module can further include an elastic member. The elastic member can be interposed between the ring protrusion and the pressurizing ring in a compressed state.

[0020] The upper cover module can further include a buffer pad interposed between the pressurizing lower surface of the pressurizing ring and the flange of the inner cavity.

[0021] According to an embodiment of the present application, there can be provided a high-pressure annealing apparatus including: an inner chamber which is open at a lower portion and provides an inner space for performing a heating process on a substrate; an outer chamber which is open at a lower portion and accommodates the inner chamber; a heating module which heats the inner chamber in an outer space provided between the inner chamber and the outer chamber; a chamber door which opens or closes at least either of the lower portion of the inner chamber and the lower portion of the outer chamber by a lifting operation; a substrate holder which is provided on the chamber door and enters and exits the inner space according to the lifting operation of the chamber door; and a shield which closes the lower portion of the outer space between the inner chamber and the outer chamber, the shield including an upper cover and a lower cover disposed below the upper cover and configured to double close the lower portion of the outer space through the upper cover and the lower cover.

[0022] The means for solving the problem will be more specific and explicit through the embodiments, drawings, etc. to be described below. In addition, various means for solving the problem other than the means mentioned below can be additionally proposed.

[0023] According to an embodiment of the present application, the shield which closes the lower portion of the outer space is included, and thus it is possible to prevent particles which can be generated from the heating module from being discharged from the outer space between the inner chamber and the outer chamber, and thereby it is possible to actively suppress the occurrence of a substrate contamination problem caused by the particles and a yield reduction caused thereby.

[0024] According to an embodiment of the present application, the shield is configured to support the inner chamber in a contact manner in a state of being coupled to the outer chamber, and thus it is possible to stably fix the position of the inner chamber which has brittleness without a separate support structure.

[0025] The effects of the present application are not limited to this, and other effects not mentioned can be clearly understood by those skilled in the art from the present specification and the attached drawings. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 FIG. 1 is a sectional view illustrating a high-pressure annealing apparatus according to an embodiment of the present application.

[0027] Figures 2 to 9 FIG. 2 is a view illustrating a structure, a coupling relationship, etc. of a shield applicable to a high-pressure annealing apparatus according to an embodiment of the present application.

[0028] (LEGEND OF DRAWINGS)

[0029] 100: inner chamber

[0030] 105: inner space (substrate processing space)

[0031] 150: inner door

[0032] 200: outer chamber

[0033] 205: outer space (protection space)

[0034] 250: outer door

[0035] 300: heating module

[0036] 400: lower cover module

[0037] 410: flange member

[0038] 420: coupling member

[0039] 430: lower cover

[0040] 500: upper cover module

[0041] 510: upper cover

[0042] 520: pressurizing ring

[0043] 530: elastic member

[0044] 540: cushion pad

[0045] 600: spacer

[0046] CE: shield DETAILED DESCRIPTION

[0047] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present application pertains can easily practice the present application. However, the present application can be implemented in various different ways and is not limited to the embodiments described herein.

[0048] In describing the embodiments of the present application, when it is judged that a specific description for a related well-known function or structure unnecessarily confuses the gist of the present application, the specific description thereof is omitted, and parts having similar functions and effects are designated by the same reference numerals throughout the drawings.

[0049] At least a part of the terms used in the specification are defined in consideration of the functions in the present application, and thus can vary according to the user, operator intention, custom, etc. Therefore, the terms should be interpreted based on the contents of the whole specification. Also, in the specification, when it is stated that a certain constituent element is included, unless there is a specific contrary expression, it means that other constituent elements can be further included rather than excluding other constituent elements. Also, when it is stated that a certain part is connected (or coupled) to other parts, this includes not only a case where the certain part is directly connected (or coupled) to the other parts, but also a case where the certain part is indirectly connected (or coupled) to the other parts through other parts.

[0050] On the other hand, in the drawings, the size or shape of the constituent elements, the thickness of lines, and the like can be somewhat exaggerated for the sake of convenience in understanding.

[0051] Embodiments of the present application relate to a high pressure annealing apparatus which can perform an annealing process or the like for a substrate such as a semiconductor wafer under high pressure conditions for the manufacture of a semiconductor device or the like, can prevent a contamination problem of the substrate due to particles from a heating module or the like, and can simply and safely fix an inner cavity to a reference position.

[0052] A high pressure annealing apparatus according to an embodiment of the present application is shown in Figure 1 . Figure 1 is a cross-sectional view briefly showing main parts of a high pressure annealing apparatus according to an embodiment of the present application.

[0053] As shown in Figure 1 , a high pressure annealing apparatus according to an embodiment of the present application can include an inner cavity 100 providing an inner space (substrate processing space) 105 capable of being blocked from the outside for a heating process of a substrate, an outer cavity 200 accommodating the inner cavity 100, and a heating module 300 disposed between the inner cavity 100 and the outer cavity 200 spaced apart from each other in an outer space (protection space) 205.

[0054] In addition, although not shown, the high pressure annealing apparatus according to an embodiment of the present application can further include a first gas supply and exhaust unit and a second gas supply and exhaust unit. The first gas supply and exhaust unit can supply a first gas to the inner space 105 and can exhaust the supplied first gas from the inner space 105. The first gas can be a reaction gas. The second gas supply and exhaust unit can supply a second gas to the outer space 205 and can exhaust the supplied second gas from the outer space 205. The second gas can be a protection gas.

[0055] In addition, the high pressure annealing apparatus according to an embodiment of the present application can further include at least one temperature sensor assembly 50 detecting a temperature of the heating module 300, a pressure gauge (not shown) for detecting a pressure of the inner space 105 and a pressure of the outer space 205, and a control unit (not shown) controlling the heating module 300 based on a detected temperature input from the temperature sensor assembly 50 and controlling the first gas supply and exhaust unit and the second gas supply and exhaust unit based on a detected pressure input from the pressure gauge.

[0056] When the annealing process is performed, the high-pressure annealing apparatus according to the embodiment of the present application configured as above can be such that the substrate is accommodated in the inner space 105, the inner cavity 100 is heated by the heating module 300, and thus the inner space 105 is composed of a high-temperature atmosphere for the heating process of the substrate, and the temperature of the inner space 105 is maintained at a set temperature required for the process by the control action of the control unit for the heating module 300.

[0057] In addition, when the annealing process is performed, the high-pressure annealing apparatus according to the embodiment of the present application can be such that the first gas (reaction gas) is supplied to the inner space 105 by the first gas supply / drain unit, and the second gas (protective gas) is supplied to the outer space 205 by the second gas supply / drain unit. The first gas (reaction gas) supplied to the inner space 105 can be raised to a reaction temperature by the heating action of the heating module 300, and thus the interface characteristics of the substrate can be improved, for example. It can be such that, during the process, the pressure of the inner space 105 is adjusted to a first pressure in a range required for the process according to the control of the control unit for the first gas supply / drain unit, and the pressure of the outer space 205 is adjusted to a second pressure in a range corresponding to the first pressure according to the control of the control unit for the second gas supply / drain unit. The first pressure (the pressure of the inner space 105) can be a pressure higher than the atmospheric pressure. For example, the first pressure can be several to several hundred atmospheres. The second pressure (the pressure of the outer space 205) provided by the second gas (protective gas) can be the same pressure as the first pressure. Alternatively, the second pressure can be slightly higher or slightly lower than the first pressure. If the pressures are thus adjusted, the inner cavity 100 or the like can be prevented from being damaged or broken by the pressure difference between the inner space 105 and the outer space 205.

[0058] The inner cavity 100 can be provided by a nonmetal material. If the material of the inner cavity 100 is adopted as a nonmetal, metal contamination of the substrate that can occur in a high-temperature and high-pressure environment can be prevented. The material of the inner cavity 100 can be quartz. The substrate can be carried into or out of the inner space 105 in a state of being supported by the substrate holder 60. The substrate holder 60 as a substrate support unit can be configured to be capable of supporting a plurality of substrates. For example, the substrate holder 60 can be a wafer boat that supports a plurality of substrates in a state of being stacked in the up-down direction.

[0059] The first gas supplied to the inner space 105 at the first pressure can be selected from various reaction gases for a heating process, such as hydrogen, deuterium, oxygen, ammonia, chlorine, and the like.

[0060] The outer cavity 200 can be configured to be provided outside the inner cavity 100, to accommodate the inner cavity 100, and to provide an outer space 205 between the inner cavity 100. The outer cavity 200 can be provided to have superior strength compared to the inner cavity 100. Such an outer cavity 200 can be, for example, a metal material, and can safely protect the inner cavity 100, which has brittleness, from external influences.

[0061] The second gas (protective gas) supplied to the outer space 205 at the second pressure can be selected from among inert gases such as argon, nitrogen, and the like.

[0062] The inner cavity 100 and the outer cavity 200 can all be formed to have a cross section in a substantially circular shape. The inner cavity 100 and the outer cavity 200 can all have a structure in which a lower portion thereof is open. According to the structure in which the lower portion of the inner cavity 100 and the outer cavity 200 is open, the inner cavity 100 can be provided at a lower end thereof in a shape in which an inner lower end opening 106 (open lower portion of the inner cavity 100) is in communication with the inner space 105 (see Figure 5 ), and the outer cavity 200 can be provided at a lower end thereof in a shape in which an outer lower end opening 206 (open lower portion of the outer cavity 200) is in communication with the outer space 205 (see Figure 4 ). The outer lower end opening 206 of the outer cavity 200 can be provided to have a height lower than the inner lower end opening 106 of the inner cavity 100. Thus, the outer lower end opening 206 of the outer cavity 200 can be disposed to be opposite to the inner lower end opening 106 below the inner lower end opening 106 of the inner cavity 100. The substrate holder 60 can be introduced into or discharged from the inner space 105 through the inner lower end opening 106 and the outer lower end opening 206, which are opposite to each other.

[0063] In Figure 1 , the reference numerals 150 and 250 are an inner door and an outer door, respectively, and the inner lower end opening 106 of the inner cavity 100 can be opened and closed by the inner door 150, and the outer lower end opening 206 of the outer cavity 200 can be opened and closed by the outer door 250. The inner cavity 100 and the outer cavity 200 can constitute a cavity 100, 200. Also, the inner door 150 and the outer door 250 can constitute a cavity door 150, 250. In addition, the cavity 100, 200 and the cavity door 150, 250 can constitute a cavity unit.

[0064] The outer door 250 can open and close the outer lower end opening 206 by a lifting operation with respect to the outer lower end opening 206, and when the outer lower end opening 206 is closed, the outer lower end opening 206 can be sealed by a ring-shaped sealing member S11 (see Figure 4 ). The sealing member S11 can be interposed between the outer cavity 200 and the outer door 250. As an example, the sealing member S11 can be provided at the outer lower end opening 206 side to be capable of being interposed between the outer cavity 200 and the outer door 250.

[0065] The outer door 250 can be accurately raised and lowered by a lifting drive unit (not shown) such as a lifter. An inner door 150 is provided on the outer door 250, so that if the outer door 250 is raised and lowered by power from the lifting drive unit, the inner door 150 can be raised and lowered together with the outer door 250. If the cavity doors 150 and 250 move to the closed position due to the rising operation of the outer door 250, and the outer door 250 closes the outer lower opening 206, then the inner door 150 can approach the inner lower opening 106 and close the inner lower opening 106. Conversely, if the cavity doors 150 and 250 move from the closed position to the open position due to the falling operation of the outer door 250, and the outer door 250 opens the outer lower opening 206, then the inner door 150 can be separated from the inner lower opening 106 and open the inner lower opening 106.

[0066] The substrate holder 60 can be provided on the inner door 150 and enters and exits the inner space 105 according to the lifting and lowering operation of the outer door 250. Specifically, if the cavity doors 150 and 250 are moved to the closed position by the lifting operation of the outer door 250, the substrate holder 60 can be inserted into the inner space 105 simultaneously through the outer lower end opening 206 and the inner lower end opening 106. Subsequently, if the cavity doors 150 and 250 are moved from the closed position to the open position by the lowering operation of the outer door 250, the substrate holder 60 can be discharged from the inner space 105 to the outside of the cavities 100 and 200 through the inner lower end opening 106 and the outer lower end opening 206. When the substrate holder 60 is discharged, the substrate can be loaded or unloaded relative to the substrate holder 60.

[0067] The heating module 300 can be formed with walls and a ceiling (i.e., an upper portion) surrounding the inner cavity 100. The heating module 300 can be provided either as part of the outer cavity 200 or separately from it. The heating module 300 may include a heater, provided as a hot wire, and a heater support member supporting the heater (hot wire) from the outside. As an example, the heater support member may be provided with an insulating material.

[0068] The heating module 300 may have multiple heating zones arranged vertically. The heaters of the heating module 300 may be divided into multiple units, with at least one heater configured in each of the multiple heating zones. The temperatures of the multiple heating zones can be adjusted independently. Multiple temperature sensor assemblies 50 may be configured, each positioned at a height corresponding to one of the multiple heating zones, to detect the temperature of the heating module 300 according to the heating zone. The control unit may control the heating module 300 according to the detected temperatures input from these temperature sensor assemblies 50.

[0069] When heating is performed, the heating module 300 remains at a high temperature. Therefore, particles may be generated on the surfaces of the heater (hot wire), heater support components, etc., due to thermal damage, causing them to peel or detach. Particles may also be generated through friction between the heater and the heater support components made of insulating material, caused by thermal expansion. These particles generated from the heating module 300 within the outer space 205 may fall towards the outer door 250 below the heating module 300, contaminating the outer door 250, etc., and may further become trapped between the outer cavity 200 and the outer door 250, leading to poor sealing. In particular, the generated particles may diffuse outwards during the insertion or removal of the substrate holder 60 relative to the inner space 105, potentially adhering to the substrate mounted in the substrate holder 60 and contaminating the substrate.

[0070] In order to solve the problem caused by particles from the heating module 300, the high-pressure annealing apparatus according to an embodiment of the present invention may further include a shielding member CE that seals the lower part of the outer space 205 from above the outer door 250 to prevent particles generated from the heating module 300 from being discharged from the outer space 205.

[0071] The structure and connection relationship of the shielding component CE are shown in Figures 2 to 9 . Figure 2 This is a perspective view showing the shielding member CE together with the inner cavity 100. Figure 3 It is a cross-sectional view showing a portion of the shielding element CE. Figure 4 as well as Figure 5 It is a cross-sectional view showing the disassembled state of the shielding component CE, etc.

[0072] Reference Figure 1 The shielding element CE can be provided as a cover structure having a lower portion that seals off the outer space 205 between the inner cavity 100 and the outer cavity 200. (Refer to...) Figure 3 The shielding member CE can be integrated with the lower end portion of the high-strength outer cavity 200, configured to support the lower end portion of the brittle inner cavity 100 in a contact manner, thereby more accurately fixing the position of the inner cavity 100 in the correct location. Furthermore, the shielding member CE may include an upper cover 510 and a lower cover 430 disposed below the upper cover 510, configured to double-securely seal the lower portion of the outer space 205 through the upper cover 510 and the lower cover 430. Such a shielding member CE is observed below.

[0073] Reference Figures 2 to 4The shielding member CE may include an upper cover module 500 with an annular structure that seals the lower part of the outer space 205 by being partially connected to the lower end of the outer cavity 200 and supporting the lower end of the inner cavity 100 in the center; a spacer 600 with an annular structure that supports the upper cover module 500 below; and a lower cover module 400 with an annular structure that is disposed below the upper cover module 500 and seals the lower part of the outer space 205 by being partially connected to the lower end of the outer cavity 200 and supporting the spacer 600 in the center.

[0074] Figure 6 This is a perspective view showing the assembly (joint) state of the lower cover module 400 and the spacer 600. Figure 7 as well as Figure 8 The exploded view shows the lower cover module 400 and the spacer 600, which are perspective views viewed from different angles. Figure 9 This is an exploded perspective view showing the top cover module 500 and the inner cavity 100 together.

[0075] Reference Figure 3 , Figure 5 , Figure 9 The inner cavity 100 may have an outwardly protruding flange 110 along the lower periphery. The upper cover module 500 may be provided with a flange 110 for contact support of such an inner cavity 100.

[0076] like Figures 2 to 5 and Figure 9 As shown, the upper cover module 500 may include an upper cover 510 with a circular ring structure and a pressure ring 520 with a circular structure. The upper cover 510 may be configured to have a peripheral ring portion 512 that is firmly attached to the lower end portion of the outer cavity 200 and a central ring portion 514 that has a supporting upper surface 513 that forms a flange 110 supporting the inner cavity 100 below. The pressure ring 520 may be located above the upper cover 510, attached to the upper cover 510, and configured to have a pressure lower surface 523 that pressurizes the flange 110 of the inner cavity 100.

[0077] The central opening 518 of the central ring portion 514 of the top cover 510 can be formed to a size and shape corresponding to the inner lower end opening 106 of the inner cavity 100 (see reference). Figure 5 The upper cover 510 and the pressure ring 520 can be joined together by bolts M52. Alternatively, the central ring portion 514 of the upper cover 510 may have internally threaded grooves F52 arranged at intervals along the circumferential direction, and the pressure ring 520 may have through holes H52 configured to correspond to the internally threaded grooves F52 of the central ring portion 514. Bolts M52, used to join the upper cover 510 and the pressure ring 520 together, are threaded into the internally threaded grooves F52 of the central ring portion 514 through the through holes H52 of the pressure ring 520 (see reference).Figure 3 as well as Figure 5 ).like Figure 5 As shown, to maintain airtightness, one or more sealing components such as O-rings can be inserted between the lower surface of the flange 110 constituting the inner cavity 100 and the upper surface 513 supporting the central ring portion 514 constituting the upper cover 510. Such sealing components S52 between the flange 110 of the inner cavity 100 and the central ring portion 514 of the upper cover 510 can be provided circumferentially on the upper surface 513 supporting the central ring portion 514 and are circular ring-shaped.

[0078] Reference Figures 3 to 5 A circular flange 310, which engages with the lower portion of the outer cavity 200, can be provided at the lower end of the heating module 300. The flange 310 of the heating module 300 can protrude outwards and be disposed along the circumference at the lower end of the heating module 300. The outer cavity 200 can have an annular step 210, providing a lower surface opposite to the upper surface of the flange 310 of the heating module 300, provided on the lower portion of the inner wall of the outer cavity 200. The outer cavity 200 and the heating module 300 can be joined together by bolts M31. The heating module 300 may have a flange 310 with through holes H31 spaced apart along the circumferential direction. The outer cavity 200 may have a step 210 with internal threaded grooves F21 corresponding to the through holes H31 of the heating module 300. Bolts M31 for connecting the outer cavity 200 and the heating module 300 are threaded into the internal threaded grooves F21 of the step 210 through the through holes H31 of the heating module 300. A sealing member S31 for maintaining airtightness may be inserted between the step 210 of the outer cavity 200 and the flange 310 of the heating module 300. The sealing member S31 between the step 210 of the outer cavity 200 and the flange 310 of the heating module 300 may be provided along the circumferential direction of the flange 310 of the heating module 300. The sealing member S31 between the step 210 of the outer cavity 200 and the flange 310 of the heating module 300 may be annular in shape.

[0079] The peripheral ring portion 512 is attached to the lower end portion of the heating module 300, thereby allowing the upper cover 510 to be attached to the lower end portion of the outer cavity 200 via the heating module 300. (Refer to...) Figure 5The heating module 300 and the upper cover 510 can be joined together by bolts M51. The peripheral ring portion 512 of the upper cover 510 may have through holes H51 arranged at intervals along the circumferential direction. The heating module 300 has internal threaded grooves F31 corresponding to the through holes H51 of the peripheral ring portion 512. The bolts M51 used to join the heating module 300 and the upper cover 510 are threaded into the internal threaded grooves F31 of the heating module 300 through the through holes H51 of the peripheral ring portion 512. The heating module 300 and the upper cover 510 can be kept airtight by a sealing member S51. The sealing member S51 for maintaining the airtightness between the heating module 300 and the upper cover 510 may be located between the lower end portion of the heating module 300 and the peripheral ring portion 512 of the upper cover 510. The sealing member S51 between the heating module 300 and the upper cover 510 may be provided along the circumferential direction of the peripheral ring portion 512. The sealing component S51 between the heating module 300 and the top cover 510 can be ring-shaped.

[0080] The heating module 300 may have an annular protrusion 320 disposed above the pressure ring 520. The cover module 500 may also include an elastic member (elastic ring) 530 provided as having a circular ring structure. The elastic member 530 may be positioned between the lower part of the annular protrusion 320 and the upper part of the pressure ring 520 in a vertically compressed state. If the elastic member 530 is positioned between the lower part of the annular protrusion 320 and the upper part of the pressure ring 520, and the cover 510 is attached to the heating module 300 by bolts M51, the elastic member 530 may be compressed vertically by the upper annular protrusion 320 and the lower pressure ring 520. Due to such vertical compression, the elastic member 530 may flatten relatively while its inner periphery deforms into a shape that fits tightly against the outer peripheral surface of the inner cavity 100. According to such an elastic member 530, the pressure ring 520 of the flange 110 of the inner cavity 100 can be stably maintained in a pressurized state, and the lower part of the inner cavity 100 can be naturally supported in the surrounding area.

[0081] Reference Figure 3 , Figure 9 The top cover module 500 may also include a pressure-below 523 between the pressure ring 520 (see reference). Figure 5A ring-shaped pad 540 is placed between the upper surface of the flange 110 of the inner cavity 100 and the inner cavity 100. The pad 540 is a cushioning pad 540 with shock-absorbing functions, etc., and can be configured to have a predetermined elasticity. For example, the cushioning pad 540 can be provided with an elastic material such as rubber, thus having a sealing function along with the shock-absorbing function. When pressure is applied to the flange 110 of the inner cavity 100 using the pressure ring 520, the cushioning pad 540 thus configured can absorb stress, impact, etc., that may be applied to the flange 110 of the inner cavity 100. Therefore, according to the cushioning pad 540, the problem of breakage of the brittle flange 110 of the inner cavity 100 can be prevented. Although not shown, on the support surface 513 of the central ring portion 514 of the upper cover 510 (see reference...) Figure 5 A pad that is actually the same as or similar to the buffer pad 540 may also be inserted between the flange 110 of the inner cavity 100 and the lower part of the inner cavity 100.

[0082] Reference Figure 1 , Figure 4 , Figure 6 The spacer 600 can be provided as a manifold 600. The annular body 610 of the manifold 600 can support a nozzle assembly 70 for distributing a first gas into the interior space 105. A first gas supply unit can be connected to the nozzle assembly 70 to supply the first gas into the interior space 105 through the nozzle assembly 70.

[0083] Reference Figure 3 , Figures 6 to 8 The lower cover module 400 may include an inward flange member 410, a central connecting member 420, and a lower cover 430 between the flange member 410 and the connecting member 420.

[0084] A flange member 410 may be provided at the lower end of the outer cavity 200. The flange member 410 may protrude inward and be disposed along the inner circumference of the lower end of the outer cavity 200. For example, the flange member 410 may be integral with the outer cavity 200 or welded to the outer cavity 200.

[0085] The connecting member 420 can be formed to have a ring structure. The connecting member 420 can be formed to have an opening corresponding to the inner lower end opening 106 of the inner cavity 100. The connecting member 420 can be provided to have a central connecting portion 424 having an opening corresponding to the inner lower end opening 106 of the inner cavity 100 and a peripheral connecting portion 422 formed around the central connecting portion 424.

[0086] The central connecting portion 424 of the connecting component 420 may have a protrusion 426 that engages with the annular lower end protrusion 630 of the manifold 600, which serves as a spacer (see reference). Figure 3 as well as Figure 4Alternatively, the manifold 600 may have an annular upper end protrusion 620, and the central ring portion 514 of the cover 510 may have a protrusion 516 that engages with the upper end protrusion 620 of the manifold 600 (see reference). Figure 3 as well as Figure 5 Although not illustrated, sealing components can be inserted between the top cover 510 and the manifold 600, and between the connecting component 420 and the manifold 600. The position of the manifold 600 can be secured by protrusions 426 and 516.

[0087] The lower cover 430 can be formed with a ring structure. The upper part of the peripheral portion of the lower cover 430 can be attached to the lower part of the flange member 410 by bolts M41. (See reference...) Figure 3 , Figure 4 , Figures 6 to 8 The through holes H41 extending vertically through the peripheral portion of the lower cover 430 can be arranged at intervals along the circumferential direction. The flange member 410 can have an internal threaded groove F41 corresponding to the through holes H41 of the peripheral portion of the lower cover 430. A bolt M41 for joining the flange member 410 and the lower cover 430 can be threaded into the internal threaded groove F41 of the flange member 410 through the through holes H41 of the peripheral portion of the lower cover 430. The flange member 410 and the lower cover 430 can be kept airtight by a sealing member S41. The sealing member S41 for maintaining the airtightness between the flange member 410 and the lower cover 430 can be located between the lower part of the flange member 410 and the upper part of the peripheral portion of the lower cover 430. The sealing member S41 between the flange member 410 and the lower cover 430 can be provided along the circumferential direction on the peripheral portion of the lower cover 430. The sealing member S41 between the flange member 410 and the lower cover 430 can be ring-shaped.

[0088] The upper part of the central portion of the lower cover 430 of the ring structure can be connected to the lower part of the peripheral connecting portion 422 of the connecting component 420 via bolt M42. (Refer to...) Figure 3 , Figure 4 , Figures 6 to 8The through holes H42 extending vertically through the central portion of the lower cover 430 can be arranged at intervals along the circumferential direction. The peripheral engagement portion 422 of the connecting member 420 can have an internal threaded groove F42 corresponding to the through holes H42 in the central portion of the lower cover 430. A bolt M42 for connecting the connecting member 420 and the lower cover 430 can be threaded into the internal threaded groove F42 of the peripheral engagement portion 422 of the connecting member 420 through the through holes H42 in the central portion of the lower cover 430. The connecting member 420 and the lower cover 430 can be kept airtight by a sealing member S42. The sealing member S42 for maintaining the airtightness between the connecting member 420 and the lower cover 430 can be located between the lower part of the peripheral engagement portion 422 of the connecting member 420 and the upper part of the central portion of the lower cover 430. The sealing member S42 between the connecting member 420 and the lower cover 430 can be provided along the circumferential direction in the central portion of the lower cover 430. The sealing component S42 between the connecting component 420 and the lower cover 430 can be ring-shaped.

[0089] On the other hand, such as Figure 1 As shown, when the lower inner opening 106 is closed, the inner door 150 can be configured to contact the connecting member 420 (or, the lower cover 430) of the lower cover module 400 instead of the lower end of the inner cavity 100. This prevents the inner door 150 from directly contacting the lower end of the inner cavity 100 when the lower inner opening 106 is closed, thus preventing a relatively large impact from being applied to the brittle inner cavity 100. Although not shown, a sealing member such as an O-ring can be inserted between the inner door 150 and the connecting member 420 to maintain an airtight seal when the lower inner opening 106 is closed. The elastic member 530 can absorb any impact that may be applied to the inner cavity 100 during the closing of the lower inner opening 106.

[0090] According to the shielding member CE configured as observed, the high-pressure annealing apparatus according to an embodiment of the present invention can be sealed in the lower part of the outer space 205 provided between the inner cavity 100 and the outer cavity 200, thus preventing particles that may be generated from the heating module 300 from being discharged from the outer space 205 between the inner cavity 100 and the outer cavity 200. This can actively suppress the occurrence of substrate contamination problems caused by particles and the resulting yield reduction. In addition, the shielding member CE of the high-pressure annealing apparatus according to an embodiment of the present invention can support the brittle inner cavity 100 in contact with the relatively strong outer cavity 200, thus stably fixing the brittle inner cavity 100 in position without a separate support structure.

[0091] The present invention has been described above, but it is not limited to the disclosed embodiments and accompanying drawings. Various modifications can be made by those skilled in the art without departing from the scope of the technical concept of the invention. Furthermore, the technical concepts described in the embodiments of the present invention can be implemented independently or in combination.

Claims

1. A high-pressure annealing apparatus, comprising: The inner cavity is open at the bottom and provides internal space for performing heat treatment on the substrate; The outer cavity is open at the bottom and accommodates the inner cavity; A heating module heats the inner cavity in an outer space provided between the inner cavity and the outer cavity; The cavity door, through a lifting operation, can open or close at least one of the lower parts of the inner cavity and the lower parts of the outer cavity; A substrate holder, provided on the cavity door, enters and exits the inner space according to the lifting operation of the cavity door; and A shielding element that seals off the lower part of the outer space between the inner cavity and the outer cavity.

2. The high-pressure annealing apparatus according to claim 1, characterized in that, A first gas is supplied to the inner space at a first pressure. A second gas is supplied to the outer space at a predetermined second pressure associated with the first pressure.

3. The high-pressure annealing apparatus according to claim 1 or 2, characterized in that, The inner cavity is made of quartz material. The shielding member is attached to the lower end portion of the outer cavity and is configured to support the lower end portion of the inner cavity in a contact manner.

4. The high-pressure annealing apparatus according to claim 1 or 2, characterized in that, The shielding member includes an upper cover and a lower cover disposed below the upper cover, and is configured to double seal the lower part of the outer space through the upper cover and the lower cover.

5. The high-pressure annealing apparatus according to claim 1 or 2, characterized in that, The shielding component includes: The ring-shaped top cover module has a peripheral portion that is joined to the lower end portion of the outer cavity and a central portion that seals the lower part of the outer space in a state that supports the lower end portion of the inner cavity. A ring-shaped spacer for supporting the upper cover module from below; and A ring-shaped lower cover module is disposed below the upper cover module, with its peripheral portion joined to the lower end portion of the outer cavity and its central portion sealing the lower part of the outer space in a state of supporting the spacer.

6. The high-pressure annealing apparatus according to claim 5, characterized in that, The inner cavity has a flange at its lower end. The upper cover module supports the flange of the inner cavity.

7. The high-pressure annealing apparatus according to claim 6, characterized in that, The top cover module includes: The upper cover has a peripheral ring portion and a central ring portion, the peripheral ring portion being coupled to the lower end portion of the outer cavity, and the central ring portion having a support surface that supports the flange of the inner cavity below; and A pressure ring is attached to the upper cover above the upper cover and has a pressure underside for pressurizing the flange.

8. The high-pressure annealing apparatus according to claim 7, characterized in that, The flange of the heating module that connects to the lower end portion of the outer cavity is provided on the lower end portion of the heating module. The upper cover is attached to the lower part of the heating module via the peripheral ring portion and is attached to the lower part of the outer cavity via the heating module.

9. The high-pressure annealing apparatus according to claim 7, characterized in that, The heating module has an annular protrusion disposed above the pressure ring. The top cover module also includes an elastic component. The elastic component is positioned between the annular protrusion and the pressure ring in a compressed state.

10. The high-pressure annealing apparatus according to claim 7, characterized in that, The top cover module also includes: A buffer pad is located between the pressure underside of the pressure ring and the flange of the inner cavity.

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