Jig module and circuit board testing method
By combining the design of the guide fixture and the probe carrier, the problem of testing circuit boards inside mechanical components was solved, achieving efficient electrical testing and production process optimization.
Patent Information
- Application Number
- CN202410941482.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2026-01-16
AI Technical Summary
In the prior art, it is difficult to effectively test the circuit board after it is assembled inside the mechanical components, resulting in a reduced test yield and a poor production process.
A fixture module is provided, including a guide fixture and a probe carrier. The guide fixture is aligned with test points on a circuit board through multiple through holes, and electrical tests are performed directly using a probe assembly.
It enables accurate alignment and electrical testing of circuit boards inside mechanical components, improving test yield and optimizing the production process.
Smart Images
Figure CN121348030A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a fixture module and a circuit board testing method, and more particularly to a fixture module and a circuit board testing method capable of aligning the internal circuit board of a mechanism component. Background Technology
[0002] Currently, during the production process of system products, testing is performed on the circuit boards after they have been assembled. Generally, at this stage, the circuit boards have not yet been assembled into the internal components. The circuit boards are placed on a fixture platform aligned with the test points on the circuit boards, allowing the probes of the testing instruments to press down and make electrical contact with the test points on the PCBA for testing.
[0003] The reason why testing cannot be performed after the circuit board is assembled inside the component is that the circuit board placed inside the component is surrounded by the internal structure, reducing the empty space around the test points and lengthening the probe's downward stroke. This increases the difficulty of aligning the probe with the test points, thus reducing the yield rate of successful testing. However, in the existing technology, the method of testing the circuit board on the fixture stage first and then assembling it into the component after testing is not conducive to optimizing the production process, making the arrangement of the test station more restrictive and inflexible, thus resulting in poor production efficiency.
[0004] Therefore, a fixture module and circuit board testing method are needed to solve the above problems. Summary of the Invention
[0005] This invention provides a fixture module and a circuit board testing method to solve the problem of inefficiency in the existing circuit board testing process.
[0006] To address the aforementioned technical problems, one technical solution adopted by this invention is to provide a fixture module suitable for a mechanism, comprising a guide fixture. The guide fixture is disposed within the mechanism along a travel direction, and a circuit board is disposed within the mechanism. The guide fixture includes a platform, a first alignment structure, and a second alignment structure. The platform has a top and a bottom, and includes multiple through holes penetrating the top and bottom. The first alignment structure and the second alignment structure are respectively disposed at the top and bottom of the platform. When the guide fixture is disposed within the mechanism, the first alignment structure is aligned with the mechanism along a first direction and a second direction, and the second alignment structure is aligned with the circuit board along a third direction, so that the multiple through holes are aligned with multiple test points on the circuit board. The first direction, the second direction, and the third direction are perpendicular to each other, and the third direction is parallel to the travel direction.
[0007] To address the aforementioned technical problems, another technical solution adopted by the present invention is to provide a circuit board testing method, comprising at least the following steps: providing a guiding fixture disposed inside a mechanism along a travel direction, the mechanism containing a circuit board, the guiding fixture including a platform, a first alignment structure, and a second alignment structure, the platform including multiple through holes penetrating the top and bottom, the first alignment structure and the second alignment structure being respectively disposed at the top and bottom of the platform; adjusting the first alignment structure to align with the mechanism along a first direction and a second direction; adjusting the second alignment structure to align with the circuit board along a third direction, so that the multiple through holes are aligned with multiple test points on the circuit board, wherein the first direction, the second direction, and the third direction are perpendicular to each other, and the third direction is parallel to the travel direction; providing a probe carrier to assemble multiple probe assemblies; and assembling the probe carrier onto the guiding fixture, so that the multiple probe assemblies pass through the multiple through holes and are electrically connected to the multiple test points respectively.
[0008] One beneficial effect of this invention is that the fixture module and circuit board testing method provided by this invention can place the guide fixture inside the mechanism, and align it with the mechanism in a first and second direction through a first alignment structure of the guide fixture, and align it with the mechanism in a third direction through a second alignment structure of the guide fixture, so that multiple through holes can be aligned with multiple test points on the circuit board. With the fixture module and circuit board testing method of this invention, the probe assembly can be directly inserted into the mechanism to insert into multiple through holes and contact the test points for electrical testing. Therefore, compared with the prior art, the circuit board can achieve the purpose of electrical testing with the probe assembly even when placed inside the mechanism.
[0009] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description
[0010] Figure 1 This is a schematic diagram of the circuit board inside the alignment mechanism of the guide fixture of the present invention.
[0011] Figure 2 This is a schematic diagram of a probe carrier carrying a probe assembly aligning with a circuit board via a guide fixture, as described in this invention.
[0012] Figure 3 This is a top view of the fixture module insertion mechanism of the present invention.
[0013] Figure 4 This is a cross-sectional schematic diagram of the guide fixture insertion mechanism of the present invention.
[0014] Figure 5 for Figure 4An enlarged schematic diagram of the V-shaped part.
[0015] Figure 6 This is a schematic diagram of the probe carrier of the present invention.
[0016] Figure 7 This is a cross-sectional schematic diagram of the probe carrier of the present invention.
[0017] Figure 8 This is another schematic diagram of the probe carrier of the present invention.
[0018] Explanation of key component symbols:
[0019] M Fixture Module
[0020] 1 guide fixture
[0021] 11 First alignment structure
[0022] 110 Top Surface
[0023] 111 First Wall
[0024] 112 Second Wall
[0025] 113 Third Wall
[0026] 114 Fourth Wall
[0027] 115 The Fifth Wall
[0028] 116 The Sixth Wall
[0029] 12 Second Parallel Structure
[0030] 121 First contact surface
[0031] 122 Second contact surface
[0032] 13 Platforms
[0033] 130 through hole
[0034] 131 Top
[0035] 132 Bottom
[0036] 2. Probe carrier
[0037] 21 Third alignment structure
[0038] 211 First convex part
[0039] 212 Second convex part
[0040] 213 Stop section
[0041] 22 platforms
[0042] 221 Cantilever bearing section
[0043] 2210 Limiting Hole
[0044] 2211 Column
[0045] U1 First U-shaped section
[0046] U2 Second U-shaped section
[0047] B circuit board
[0048] B1 test point
[0049] C1 First aperture
[0050] C2 Second Aperture
[0051] D. Travel Direction
[0052] P probe assembly
[0053] GP fixed gap
[0054] GP1 First Spacing
[0055] GP2 Second Spacing
[0056] H1 First Aperture
[0057] H2 Second Aperture
[0058] H3 Third Aperture
[0059] E mechanism components
[0060] E1 First trench wall
[0061] E2 Second Tank Wall
[0062] E3 Third Tank Wall
[0063] E4 Fourth Tank Wall
[0064] E5 Fifth Tank Wall
[0065] E6 Sixth Tank Wall Detailed Implementation
[0066] The following specific embodiments illustrate the implementation of the "Jig Module and Circuit Board Testing Method" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustration only and are not depictions of actual dimensions, as stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. Additionally, it should be understood that although terms such as "first," "second," and "third" may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. Furthermore, the term "or" used herein may, depending on the actual situation, include any combination of one or more of the associated listed items. Additionally, throughout this invention, "connection" refers to a physical connection between two elements, whether direct or indirect.
[0067] [Example]
[0068] See Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the circuit board inside the alignment mechanism of the guide fixture of the present invention. Figure 2 This is a schematic diagram of a probe carrier carrying a probe assembly aligning with a circuit board via a guide fixture, as described in this invention. This invention provides a fixture module M (see...). Figure 2 It is suitable for electrical testing between probe assembly P and circuit board B inside mechanism E.
[0069] The fixture module M includes a separable guide fixture 1 and a probe carrier 2. The guide fixture 1 is disposed inside the mechanism E along a travel direction D. The guide fixture 1 includes a platform 13, and a first alignment structure 11 and a second alignment structure 12 disposed on the platform 13. Specifically, the platform 13 has a top 131 and a bottom 132, and the first alignment structure 11 and the second alignment structure 12 are respectively disposed on the top 131 and the bottom 132. The platform 13 also has a plurality of through holes 130 that penetrate the top 131 and the bottom 132.
[0070] See Figure 3 As shown, Figure 3This is a top view of the fixture module insertion mechanism of the present invention. The first alignment structure 11 includes a first wall 111, a second wall 112, a third wall 113, a fourth wall 114, a fifth wall 115, and a sixth wall 116. The second wall 112 is vertically connected between the first wall 111 and the third wall 113, and the first wall 111, the second wall 112, and the third wall 113 together form a first U-shaped portion U1. The fifth wall 115 is vertically connected between the fourth wall 114 and the sixth wall 116, and the fourth wall 114, the fifth wall 115, and the sixth wall 116 together form a second U-shaped portion U2. There is a first distance GP1 between the first wall 111 and the third wall 113, and a second distance GP2 between the fourth wall 114 and the sixth wall 116, wherein the second distance GP2 is not equal to the first distance GP1.
[0071] See Figure 4 and Figure 5 As shown, Figure 4 This is a cross-sectional schematic diagram of the guide fixture insertion mechanism of the present invention. Figure 5 for Figure 4 An enlarged schematic diagram of the V-shaped portion. The second alignment structure 12 has a first abutment surface 121 and a second abutment surface 122, with the first abutment surface 121 perpendicularly connected to the second abutment surface 122. The diameter of at least one through hole 130 tapers from the top 131 of the platform 13 to the bottom 132 of the platform 13. Specifically, the through hole 130 has a first diameter C1 near the bottom 132 and a second diameter C2 near the top 131, with the first diameter C1 being smaller than the second diameter C2.
[0072] Furthermore, the first alignment structure 11 and the second alignment structure 12 belong to the peripheral structure of the guide fixture 1, and are designed to correspond to the internal structure of the mechanism component E. For example... Figure 3 As shown, for example, the mechanism E has an adapter structure corresponding to the first alignment structure 11, such as two grooves corresponding to the contour shapes of the first U-shaped part U1 and the second U-shaped part U2 respectively. One groove is composed of the first groove wall E1, the second groove wall E2 and the third groove wall E3, and the other groove is composed of the fourth groove wall E4, the fifth groove wall E5 and the sixth groove wall E6.
[0073] Therefore, when the guide fixture 1 is disposed inside the mechanism E, the first alignment structure 11 and the mechanism E are aligned along a first direction (parallel to the X-axis) and a second direction (parallel to the Y-axis), that is, the first U-shaped part U1 and the second U-shaped part U2 are respectively engaged in the two grooves. The first wall 111 and the third wall 113 of the first U-shaped part U1 abut against the first groove wall E1 and the third groove wall E3 respectively to achieve the limit in the X-axis direction. The second wall 112 of the first U-shaped part U1 abuts against the second groove wall E2 to achieve the limit in the Y-axis direction. The fourth wall 114 and the sixth wall 116 of the second U-shaped part U2 abut against the fourth groove wall E4 and the sixth groove wall E6 respectively to achieve the limit in the X-axis direction. The fifth wall 115 of the second U-shaped part U2 abuts against the fifth groove wall E5 to achieve the limit in the Y-axis direction. Furthermore, the design that the first U-shaped part U1 and the second U-shaped part U2 have different dimensions (i.e., the second spacing GP2 is not equal to the first spacing GP1) can form a foolproof structure, so that the guide fixture 1 can be set in the correct orientation within the mechanism E.
[0074] like Figure 5 As shown, for example, the second alignment structure 12 is aligned with circuit board B along a third direction (parallel to the Z-axis). Furthermore, if test point B1 of circuit board B is located at the edge of circuit board B, the second alignment structure 12 can also be aligned with circuit board B along a second direction. The first direction, the second direction, and the third direction are perpendicular to each other, and the third direction is parallel to the travel direction D (see...). Figure 1 In detail, when the second alignment structure 12 is aligned with the circuit board B, the first abutting surface 121 abuts against the edge of the circuit board B to achieve the limit in the Z-axis direction; the second abutting surface 122 abuts against the edge of the circuit board B to achieve the limit in the Y-axis direction.
[0075] Therefore, through the design of the first alignment structure 11 and the second alignment structure 12, the guide fixture 1 can be aligned with the internal structure of the mechanism E in the XY plane and with the circuit board B in the YZ plane (i.e., alignment can be achieved in the X, Y, and Z axis directions), thereby ensuring the accuracy of the relative positions of the guide fixture 1 with the mechanism E and the circuit board B. Figure 3 and Figure 4 As shown, after the alignment between the guide fixture 1, the mechanism E, and the circuit board B is completed, the multiple through holes 130 of the platform 13 are aligned with the multiple test points B1 on the circuit board B.
[0076] See Figure 2 , Figure 6 as well as Figure 8 As shown, Figure 6 and Figure 8This is a schematic diagram of the probe carrier of the present invention shown from different perspectives. After the alignment between the guide fixture 1, the mechanism E, and the circuit board B is completed, the probe carrier 2 can be assembled into the guide fixture 1 along the travel direction D. The probe carrier 2 can carry multiple probe assemblies P. The probe carrier 2 includes a third alignment structure 21 and a stage 22, with the third alignment structure 21 disposed on the stage 22. The third alignment structure 21 includes a first protrusion 211, a second protrusion 212, and a stop 213, with the stop 213 disposed between the first protrusion 211 and the second protrusion 212.
[0077] It is worth mentioning that the first U-shaped portion U1 and the second U-shaped portion U2 have a concave-convex structure, with a protruding structure on the side facing the mechanism E and a recessed structure on the side facing away from the mechanism E. The first U-shaped portion U1 and the second U-shaped portion U2 align with the mechanism E through their protruding sides and with the probe carrier 2 through their recessed sides. Therefore, when the probe carrier 2 is assembled onto the guide fixture 1 along the travel direction D, the first protrusion 211 engages with the recessed side of the first U-shaped portion U1, and the second protrusion 212 engages with the recessed side of the second U-shaped portion U2, thereby achieving alignment in the first direction (parallel to the X-axis) and the second direction (parallel to the Y-axis). Furthermore, the stop portion 213 abuts against the top surface 110 of the first alignment structure 11 to achieve alignment in the third direction (parallel to the Z-axis). Furthermore, when the probe carrier 2 is assembled onto the guide fixture 1 along the travel direction, the columns 2211 of the multiple cantilever bearing sections 221 are respectively inserted into the multiple through holes 130.
[0078] See Figure 2 , Figure 6 as well as Figure 7 As shown, Figure 7 This is a cross-sectional schematic diagram of the probe carrier of the present invention. The stage 22 includes a plurality of cantilever support segments 221, with a fixed gap GP between adjacent cantilever support segments 221. Therefore, each cantilever support segment 221 can operate independently without interference from adjacent cantilever support segments 221. Furthermore, the plurality of cantilever support segments 221 are made of an elastic material (e.g., plastic or rubber). At least one cantilever support segment 221 has a limiting hole 2210 and a column 2211, the limiting hole 2210 extending through the bottom of the column 2211 along its extension direction. Preferably, in the present invention, each cantilever support segment 221 has a limiting hole 2210 and a column 2211. A plurality of probe assemblies P are respectively inserted into the plurality of limiting holes 2210.
[0079] like Figure 2 , Figure 3 as well as Figure 7As shown, the limiting hole 2210 has a first aperture H1, a second aperture H2, and a third aperture H3. The second aperture H2 is located between the positions of the first aperture H1 and the third aperture H3. The first aperture H1 is located near the bottom of the column 2211, and the third aperture H3 is located inside the stage 22 (i.e., at the top of the column 2211). The first aperture H1 is smaller than the second aperture H2, and the second aperture H2 is smaller than the third aperture H3. In other words, the aperture of the limiting hole 2210 gradually decreases from the top to the bottom of the column 2211. Because the third aperture H3 at the top of the limiting hole 2210 is larger, the probe assembly P can be easily inserted into it. Furthermore, the probe assembly P can be positioned within the hole by the gradually decreasing aperture design of the limiting hole 2210, preventing the probe assembly P from wobbling. Since the multiple through holes 130 of platform 13 are aligned with the multiple test points B1 on circuit board B, the multiple probe components P inserted into the multiple limiting holes 2210 can be accurately aligned and electrically contact the multiple test points B1 respectively, so as to perform electrical testing.
[0080] Therefore, the probe carrier 2 can be aligned with the guide fixture 1 in the X-axis, Y-axis and Z-axis directions by means of the third alignment structure 21, and the probe assembly P can be aligned with the test point B1 by means of the gradually narrowing hole design of the limiting hole 2210 of the stage 22, thereby improving the yield of the connection electrical test.
[0081] It should also be noted that, due to the inherent tolerances in the manufacturing of both the mechanism E and the guide fixture 1, even when the probe carrier 2 is aligned using the third alignment structure 21 and assembled onto the guide fixture 1, the effects of these tolerances may not be completely eliminated. In other words, when the probe carrier 2 is assembled onto the guide fixture 1, the probe assembly P may not be directly aligned with the through hole 130, and there may still be a slight deviation between the probe assembly P and the through hole 130 in the horizontal direction perpendicular to the assembly direction. Therefore, this invention further utilizes the cantilever support sections 221, each with an independently operable and flexible structural design, to ensure that even if the probe assembly P is interfered with by horizontal deviation during assembly on the guide fixture 1, the structural design of the cantilever support sections 221 can still help the probe assembly P to be smoothly inserted into the through hole 130.
[0082] This invention provides a circuit board testing method, which utilizes the guide fixture 1 and probe carrier 2 provided by this invention. The guide fixture 1 and probe carrier 2 have been described in detail above and will not be repeated here. The circuit board testing method provided by this invention includes at least the following steps (see attached reference). Figures 1 to 7 As shown):
[0083] Step 1: A guide fixture 1 is provided and disposed inside the mechanism E along the travel direction D. A circuit board B is disposed inside the mechanism E. The guide fixture 1 includes a platform 13, a first alignment structure 11, and a second alignment structure 12. The platform 13 includes multiple through holes 130 passing through its top 131 and bottom 132. The first alignment structure 11 and the second alignment structure 12 are respectively disposed at the top 131 and bottom 132 of the platform 13.
[0084] Step 2: Adjust the first alignment structure 11 so that it is aligned with the mechanism component E along the first direction (parallel to the X-axis direction) and the second direction (parallel to the Y-axis direction).
[0085] Step 3: Adjust the second alignment structure 12 to align with the circuit board B along the second direction and the third direction (parallel to the Z-axis direction), so that the multiple through holes 130 are aligned with the multiple test points B1 on the circuit board B.
[0086] Step 4: Provide probe carrier 2 to assemble multiple probe components P.
[0087] Step 5: Assemble the probe carrier 2, which carries multiple probe components P, into the guiding fixture 1, so that the multiple probe components P pass through multiple through holes 130 respectively, and are electrically connected to multiple test points B1 on the circuit board B respectively.
[0088] In addition, step 3 also includes step 3-1: further adjusting the second alignment structure 12 and the circuit board B to align along the second direction.
[0089] [Beneficial Effects of the Examples]
[0090] The fixture module M and circuit board testing method provided by this invention enables the guide fixture 1 to be aligned with the internal structure of the mechanism E in the XY plane through the design of the first alignment structure 11; and enables the guide fixture 1 to be aligned with the circuit board B in the YZ plane through the design of the second alignment structure 12 (i.e., the guide fixture 1 can be aligned in the X, Y, and Z axis directions). Therefore, the provided fixture module M and circuit board testing method can ensure the accuracy of the relative positions of the guide fixture 1, the mechanism E, and the circuit board B. After the alignment between the guide fixture 1, the mechanism E, and the circuit board B is completed, the multiple through holes 130 of the platform 13 can be aligned with the multiple test points B1 on the circuit board B. The probe carrier 2 can be aligned with the guide fixture 1 in the X-axis, Y-axis, and Z-axis directions through the third alignment structure 21. Through the tapered hole design of the limiting hole 2210 of the stage 22, the probe assembly P can pass through the through hole 130 to align with and electrically contact the test point B1, thereby improving the yield of the electrical connection test.
[0091] The above-disclosed content is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of the claims of the present invention.
Claims
1. A jig module adapted for use with a device, the device having a circuit board disposed inside the device, the jig module comprising: a guide jig configured to be disposed inside the device along a travel direction, the guide jig comprising: a platform having a top portion and a bottom portion, the platform comprising a plurality of through holes extending through the top portion and the bottom portion; and a first alignment structure and a second alignment structure disposed on the top portion and the bottom portion of the platform, respectively; wherein, when the guide jig is disposed inside the device, the first alignment structure and the device are aligned along a first direction and a second direction, and the second alignment structure and the circuit board are aligned along a third direction, such that the plurality of through holes are aligned with a plurality of test points on the circuit board, wherein the first direction, the second direction, and the third direction are perpendicular to each other, and the third direction is parallel to the travel direction.
2. The fixture module of claim 1, wherein, The second alignment structure and the circuit board are further aligned along the second direction.
3. The fixture module of claim 2, wherein, The second alignment structure has a first abutting surface and a second abutting surface, the first abutting surface being connected perpendicularly to the second abutting surface; wherein, when the second alignment structure and the circuit board are aligned, the first abutting surface abuts against the circuit board along the third direction, and the second abutting surface abuts against the circuit board along the second direction.
4. The fixture module of claim 2, wherein, The first alignment structure comprises a first wall, a second wall, and a third wall, the second wall being connected perpendicularly between the first wall and the third wall, the first wall, the second wall, and the third wall collectively forming a first U-shaped portion, the first wall and the third wall having a first spacing therebetween.
5. The fixture module of claim 4, wherein, The first alignment structure further comprises a fourth wall, a fifth wall, and a sixth wall, the fifth wall being connected perpendicularly between the fourth wall and the sixth wall, the fourth wall, the fifth wall, and the sixth wall collectively forming a second U-shaped portion, the fourth wall and the sixth wall having a second spacing therebetween, the second spacing being different from the first spacing.
6. The tool module of claim 5, further comprising a probe carrier assembled to the guiding tool along the travel direction, the probe carrier comprising a third alignment structure, the third alignment structure comprising a first protrusion, a second protrusion, and a stopper disposed between the first protrusion and the second protrusion; wherein, When the probe carrier is assembled to the guide jig along the travel direction, the first protrusion is engaged in the first U-shaped portion, the second protrusion is engaged in the second U-shaped portion, and the stopper abuts against a top surface of the first alignment structure.
7. The probe module of claim 1, further comprising a probe carrier assembled to the guiding jig along the travel direction, the probe carrier comprising a carrier base, the carrier base comprising a plurality of cantilevered carrier segments, each of the cantilevered carrier segments having a fixed gap between two adjacent cantilevered carrier segments, at least one of the plurality of cantilevered carrier segments having a limiting hole and a post, the limiting hole extending through a bottom of the post along an extension direction of the post; wherein, When the probe carrier is assembled to the guide jig along the travel direction, the column of the at least one cantilevered support segment is inserted into at least one of the plurality of through holes.
8. The fixture module of claim 7, wherein, The limiting hole has a first hole diameter, a second hole diameter, and a third hole diameter, the first hole diameter being smaller than the second hole diameter, the second hole diameter being smaller than the third hole diameter, the second hole diameter being located between the first hole diameter and the third hole diameter, the first hole diameter being located proximate to the bottom of the column, and the third hole diameter being located inside the stage.
9. The fixture module of claim 1, wherein, At least one of the plurality of through holes has a first hole diameter proximate to the bottom and a second hole diameter proximate to the top, the first hole diameter being smaller than the second hole diameter. 10.A circuit board testing method, the circuit board testing method comprising at least the following steps: A guide jig is provided to be arranged inside a mechanism member along a stroke direction, the mechanism member has a circuit board arranged inside, the guide jig comprises a platform, a first alignment structure and a second alignment structure, the platform comprises a plurality of through holes, the plurality of through holes pass through a top portion and a bottom portion of the platform, the first alignment structure and the second alignment structure are arranged on the top portion and the bottom portion of the platform respectively; adjusting the first alignment structure and the mechanism member to be aligned along a first direction and a second direction; adjusting the second alignment structure and the circuit board to be aligned along a third direction, so that the plurality of through holes are aligned with a plurality of test points on the circuit board, wherein the first direction, the second direction and the third direction are perpendicular to each other, and the third direction is parallel to the stroke direction; providing a probe carrier to assemble a plurality of probe assemblies; and assembling the probe carrier to the guide jig, so that the plurality of probe assemblies pass through the plurality of through holes respectively, and are electrically connected to the plurality of test points respectively.
11. The circuit board testing method of claim 10, wherein, In the step of adjusting the second alignment structure and the circuit board to be aligned along the third direction, so that the plurality of through holes are aligned with the plurality of test points on the circuit board, further comprising: further adjusting the second alignment structure and the circuit board to be aligned along the second direction.
12. The circuit board testing method of claim 10, wherein, The probe carrier comprises a carrier, the carrier comprises a plurality of cantilevered carrying segments, adjacent two of the cantilevered carrying segments have a fixed gap, at least one of the plurality of cantilevered carrying segments has a limiting hole and a column, the limiting hole passes through the column along the extension direction of the column; wherein, when the probe carrier is assembled to the guide jig along the stroke direction, the column of the at least one cantilevered carrying segment is inserted into at least one of the plurality of through holes.
13. The circuit board testing method of claim 10, wherein, The second alignment structure has a first abutting surface and a second abutting surface, the first abutting surface is connected perpendicularly to the second abutting surface; wherein, when the second alignment structure is aligned with the circuit board, the first abutting surface abuts against the circuit board along the third direction, and the second abutting surface abuts against the circuit board along the second direction.
14. The circuit board testing method of claim 10, wherein, At least one of the plurality of through holes has a first aperture diameter near the bottom portion and a second aperture diameter near the top portion, the first aperture diameter is smaller than the second aperture diameter.