Heat dissipation processing method and electronic equipment

Abstract

The invention discloses a heat dissipation processing method and electronic equipment. The heat dissipation processing method comprises the steps that first configuration information corresponding to the current electronic equipment and a target device in operation in the electronic equipment are acquired; wherein a plurality of pieces of candidate configuration information are stored in the electronic equipment, and different pieces of candidate configuration information correspond to different running states of the electronic equipment; determining whether the first configuration information is matched with the target device; wherein the first configuration information at least comprises an operation device corresponding to the current electronic equipment; if the first configuration information is matched with the target device, performing heat dissipation processing on the electronic equipment according to a heat dissipation scheme in the first configuration information; and if the first configuration information is not matched with the target device, determining second configuration information so as to perform heat dissipation processing on the electronic equipment according to a heat dissipation scheme in the second configuration information.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation of electronic devices, and in particular to a heat dissipation processing method and an electronic device. BACKGROUND

[0002] Current electronic devices or workstations or servers, even if the systems are the same, the hardware configurations can be quite different. In order to achieve better production efficiency, the same heat dissipation control is usually adopted for the same CPU system, but the same CPU system can be matched with different hardware configurations, that is, the same heat dissipation control is adopted for different hardware configurations to dissipate heat, which leads to poor heat dissipation effect. SUMMARY

[0003] The purpose of the embodiments of the present application is to provide a heat dissipation processing method and an electronic device.

[0004] In a first aspect, the embodiments of the present application provide a heat dissipation processing method, comprising: obtaining first configuration information corresponding to a current electronic device and a target device in operation in the electronic device; wherein the electronic device stores a plurality of candidate configuration information, the first configuration information is one of the plurality of candidate configuration information, and different candidate configuration information corresponds to different operating states of the electronic device; determining whether the first configuration information matches the target device; wherein the first configuration information at least includes an operating device corresponding to the current electronic device; if the first configuration information matches the target device, performing heat dissipation processing on the electronic device according to a heat dissipation scheme in the first configuration information; if the first configuration information does not match the target device, determining second configuration information to perform heat dissipation processing on the electronic device according to a heat dissipation scheme in the second configuration information.

[0005] In a possible implementation, the determination of whether the first configuration information matches the target device comprises: determining a first device included in the first configuration information; wherein the first device is a device operated by the electronic device in an operating state corresponding to the first configuration information, and the devices and / or operating parameters operated in operating states corresponding to different candidate configuration information are different; determining whether the first device is consistent with the target device; if the first device is consistent with the target device, it is determined that the first configuration information matches the target device; if the first device is not consistent with the target device, it is determined that the first configuration information does not match the target device.

[0006] In a possible implementation, the determining the second configuration information if the first configuration information does not match the target device comprises: determining a difference device if the first configuration information does not match the target device; wherein the difference device is a target device that does not exist in the first configuration information; determining the second configuration information based on the difference device.

[0007] In a possible implementation, the determining the second configuration information based on the difference device comprises: determining whether the difference device exists in third configuration information corresponding to the electronic device; if the difference device exists, determining the second configuration information based on the third configuration information; if the difference device does not exist, obtaining parameter information of the difference device; adjusting the first configuration information based on the parameter information to obtain the second configuration information.

[0008] In a possible implementation, the heat dissipation processing method further comprises: associating and storing the target device, the difference device, and the second configuration information.

[0009] In a possible implementation, the heat dissipation processing of the electronic device comprises: obtaining a heat dissipation device and a health state thereof in the current electronic device; wherein the heat dissipation device at least includes a fan and a heat dissipation passage baffle; determining whether the heat dissipation device and the health state conform to a heat dissipation scheme of the first configuration information / a heat dissipation scheme of the second configuration information; if not, updating the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information, and performing heat dissipation processing on the electronic device according to the updated heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information.

[0010] In a possible implementation, the heat dissipation processing method further comprises: if the heat dissipation device and the health state do not conform to the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information, generating first alarm information and transmitting the first alarm information to a user.

[0011] In a possible implementation, after the heat dissipation processing of the electronic device, the method comprises: monitoring a target temperature of the target device; In a case where the duration that the target temperature is greater than the preset threshold value satisfies the alarm condition, second alarm information is generated and transmitted to the user.

[0012] In a possible implementation, the candidate configuration information is stored in a hidden partition of the electronic device.

[0013] In a second aspect, the embodiments of the present application further provide an electronic device, comprising: The acquisition module is configured to acquire first configuration information corresponding to a current electronic device and a target device in operation in the electronic device; wherein the electronic device stores a plurality of candidate configuration information, the first configuration information is one of the plurality of candidate configuration information, and different candidate configuration information corresponds to different operation states of the electronic device; The determination module is configured to determine whether the first configuration information matches the target device; wherein the first configuration information at least includes an operation device corresponding to the current electronic device; The heat dissipation module is configured to, if the first configuration information matches the target device, perform heat dissipation processing on the electronic device according to a heat dissipation scheme in the first configuration information; The heat dissipation module is further configured to, if the first configuration information does not match the target device, determine second configuration information to perform heat dissipation processing on the electronic device according to a heat dissipation scheme in the second configuration information. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the present application or prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments described in the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0015] Figure 1 A flow chart of a heat dissipation processing method provided by the present application is shown; Figure 2 A flow chart of determining whether the first configuration information matches the target device in a heat dissipation processing method provided by the present application is shown; Figure 3 A flow chart of determining the second configuration information in a case where the first configuration information does not match the target device in a heat dissipation processing method provided by the present application is shown; Figure 4 A flow chart of performing heat dissipation processing on the electronic device in a heat dissipation processing method provided by the present application is shown; Figure 5This application provides a partial structural schematic diagram of an electronic device. Figure 6 A schematic diagram of the structure of an electronic device provided in this application is shown; Figure 7 A schematic diagram of the structure of another electronic device provided in this application is shown. Detailed Implementation

[0016] Various embodiments and features of this application are described herein with reference to the accompanying drawings.

[0017] It should be understood that various modifications can be made to the embodiments described herein. Therefore, the above description should not be considered as limiting, but merely as an example of embodiments. Other modifications within the scope and spirit of this application will be apparent to those skilled in the art.

[0018] The accompanying drawings, which are included in and form part of this specification, illustrate embodiments of the present application and, together with the general description of the present application given above and the detailed description of the embodiments given below, serve to explain the principles of the present application.

[0019] These and other features of this application will become apparent from the following description of preferred forms of embodiments given as non-limiting examples, with reference to the accompanying drawings.

[0020] It should also be understood that although this application has been described with reference to some specific examples, those skilled in the art can certainly implement many other equivalent forms of this application, which have the features described in the claims and are therefore all within the scope of protection defined herein.

[0021] The above and other aspects, features and advantages of this application will become more apparent when taken in conjunction with the accompanying drawings and in view of the following detailed description.

[0022] Specific embodiments of this application are described thereafter with reference to the accompanying drawings; however, it should be understood that the claimed embodiments are merely examples of this application, which can be implemented in various ways. Well-known and / or repeated functions and structures are not described in detail to avoid unnecessary or redundant details that could obscure the application. Therefore, the specific structural and functional details claimed herein are not intended to be limiting, but merely serve as the basis and representative basis for the claims to teach those skilled in the art to use this application in a variety of substantially any suitable detailed structures.

[0023] This specification may use the phrases “in one embodiment,” “in another embodiment,” “in yet another embodiment,” or “in other embodiments,” all of which may refer to one or more of the same or different embodiments according to this application.

[0024] To facilitate understanding of this application, a heat dissipation method provided in this application will be described in detail below.

[0025] As an example, Figure 1 A flowchart of a heat dissipation method provided in an embodiment of this application is shown, wherein specific steps include S101-S104.

[0026] S101, obtain the first configuration information corresponding to the current electronic device and the target device that is running in the electronic device; wherein, the electronic device stores multiple candidate configuration information, the first configuration information is one of the multiple candidate configuration information, and different candidate configuration information corresponds to different operating states of the electronic device.

[0027] During the manufacturing phase of electronic devices, multiple candidate configuration information is set based on the electronic device system and its numerous hardware components. Different candidate configuration information corresponds to different operating states of the electronic device. For example, the candidate configuration information corresponding to the electronic device in the operating state is different from that corresponding to the electronic device in the sleep state. Optionally, when electronic devices are in the same operating state but the operating power of the same components is different, the corresponding candidate configuration information is also different. For example, when the electronic device is in the operating state, the candidate configuration information corresponding to the image acquisition device when it is at low power consumption is different from that corresponding to the image acquisition device when it is at high power consumption.

[0028] The candidate configuration information can be obtained from actual operating electronic devices or from simulated electronic device operation. For example, the candidate configuration information may include, in the corresponding operating state, the devices running in the electronic device, the current power consumption and / or maximum power consumption of each device, the attribute information of each device, the position of each device within the electronic device, and the heat dissipation devices of the electronic device and their positions. Furthermore, the devices included in different candidate configuration information, along with their corresponding current power consumption and the number of heat dissipation devices, can all be different.

[0029] During the startup or operation of an electronic device, the first configuration information corresponding to the current electronic device is obtained. Multiple candidate configuration information entries for the electronic device are stored in a hidden partition. This hidden partition is a portion of the storage area of ​​the Basic Input Output System (BIOS), used to store file data required for backup and recovery, thereby enabling the recovery of operating system software programs or data. Some data in this hidden partition is invisible to the user, and this data cannot be modified or deleted, thus supporting fixed software applications and ensuring data security.

[0030] It is worth noting that multiple candidate configuration information can be uploaded to the server or cloud at the same time, so that electronic devices of the same model can use the candidate configuration information and achieve resource sharing. Furthermore, after any electronic device updates and optimizes the candidate configuration information, the updated and optimized candidate configuration information can be synchronized to the server or cloud so that other electronic devices can directly apply it, which improves the heat dissipation efficiency of multiple devices to a certain extent.

[0031] The first configuration information is one of multiple candidate configuration information. Optionally, different identifiers are set for the operating states corresponding to the electronic device, and the candidate configuration information corresponding to each operating state is set to have the same identifier, so as to find the candidate configuration information corresponding to the current operating state based on the identifier information, that is, to obtain the first configuration information corresponding to the current electronic device. Of course, since the devices and / or the current power consumption of the devices included in different candidate configuration information are different, it is possible to query the devices currently running in the electronic device and the current power consumption of each device, and then find the candidate configuration information corresponding to the current operating state based on the devices currently running in the electronic device and the current power consumption of each device, etc. This application embodiment does not specifically limit this, as long as the first configuration information corresponding to the current electronic device can be obtained.

[0032] Furthermore, while obtaining the first configuration information corresponding to the current electronic device, the system queries the target devices that are currently running within the electronic device. Here, the electronic device contains a large number of devices, and the devices running in the electronic device vary depending on its operating state. That is, in a certain operating state, there are both running and non-running devices.

[0033] Optionally, the target device currently in operation can be queried based on the hardware interface of the electronic device, or the target device currently in operation can be determined based on the process of the electronic device.

[0034] S102, determine whether the first configuration information matches the target device; wherein, the first configuration information includes at least the operating device corresponding to the current electronic device.

[0035] After obtaining the first configuration information and the target device, since the first configuration information includes at least the operating device corresponding to the current electronic device, it is determined whether the first configuration information matches the target device.

[0036] As an example, Figure 2 A flowchart is shown to determine whether the first configuration information matches the target device, wherein the specific steps include S201-S204.

[0037] S201, determine the first device included in the first configuration information; wherein, the first device is the device that the electronic device operates in the operating state corresponding to the first configuration information, and the devices and / or operating parameters that operate in the operating states corresponding to different candidate configuration information are different.

[0038] S202, determine whether the first device is consistent with the target device.

[0039] S203, if the first device is consistent with the target device, then it is determined that the first configuration information matches the target device.

[0040] S204, if the first device is inconsistent with the target device, then it is determined that the first configuration information does not match the target device.

[0041] In specific implementation, the first configuration information is traversed to determine the first device included in the first configuration information, that is, to determine the device that the electronic device is running in the operating state corresponding to the first configuration information. The devices and / or operating parameters (such as power consumption, current, voltage, etc.) that are running in the operating states corresponding to different candidate configuration information are different.

[0042] Furthermore, the first device is compared one by one with the target device to determine whether all the first devices and target devices are consistent, that is, whether there is a one-to-one correspondence between the first devices and the target devices. If the first devices and target devices are consistent, that is, the target devices are all devices that the electronic device operates in the operating state corresponding to the first configuration information, then it is determined that the first configuration information matches the target devices; if the first devices and target devices are inconsistent, that is, there are devices among the target devices other than those that the electronic device operates in the operating state corresponding to the first configuration information, then it is determined that the first configuration information does not match the target devices.

[0043] S103, if the first configuration information matches the target device, perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the first configuration information.

[0044] When the first configuration information matches the target device, the electronic device is cooled according to the cooling scheme in the first configuration information. The cooling scheme includes at least the operating parameters of the cooling device. Cooling the electronic device according to the cooling scheme in the first configuration information means controlling the operation of the cooling device according to the operating parameters of the cooling device in the first configuration information to achieve heat dissipation.

[0045] S104, if the first configuration information does not match the target device, determine the second configuration information, and perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the second configuration information.

[0046] If the first configuration information does not match the target device, in order to avoid poor heat dissipation, the electronic device can be cooled according to the heat dissipation scheme in the first configuration information instead of the first. Instead, a second configuration information can be determined, and the electronic device can be cooled according to the heat dissipation scheme in the second configuration information. Correspondingly, when the first configuration information does not match the target device, the heat dissipation effect achieved by cooling the electronic device according to the heat dissipation scheme in the second configuration information is better than that achieved by cooling the electronic device according to the heat dissipation scheme in the first configuration information.

[0047] After obtaining the first configuration information, this application embodiment compares the operating device included in the first configuration information with the target device to determine whether to perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the first configuration information or according to the heat dissipation scheme in the second configuration information. That is, the heat dissipation scheme to be executed can be flexibly selected and configured, thereby ensuring that the heat dissipation effect of the electronic device under different operating states is better.

[0048] As an example, Figure 3 A flowchart is shown for determining the second configuration information when the first configuration information does not match the target device, wherein the specific steps include S301-S305.

[0049] S301, if the first configuration information does not match the target device, determine the different device; wherein, the different device is the target device that does not exist in the first configuration information.

[0050] S302, determine whether the different device exists in the third configuration information corresponding to the electronic device.

[0051] S303, if it exists, determine the second configuration information based on the third configuration information.

[0052] S304, if not present, retrieve parameter information for the different devices.

[0053] S305, based on the parameter information, adjusts the first configuration information to obtain the second configuration information.

[0054] If the first configuration information does not match the target device, meaning the target device contains a device other than the one operating in the electronic device under the first configuration information's corresponding operating state, then the discrepancy device is identified, i.e., the target device that does not exist in the first configuration information. It should be noted that all target devices are currently operating normally in the electronic device. However, if an abnormal device is detected in the current electronic device (such as a device not properly installed, or its operating parameters being outside the operating parameter range), a prompt message will be generated to alert the user of the target device's abnormality, allowing the user to promptly address the abnormal target device and ensure the normal operation of the electronic device.

[0055] After identifying the different device, the second configuration information is further determined based on the different device. Optionally, after identifying the different device, it is first determined whether the different device exists in the third configuration information corresponding to the electronic device, that is, whether the different device is a device that the electronic device has at the time of manufacture. For example, if the different device exists in the third configuration information corresponding to the electronic device, it indicates that the different device is a device that the electronic device has at the time of manufacture. In this case, the second configuration information is determined based on the third configuration information. For example, the matching degree between the first configuration information and the target device can be compared with the matching degree between the third configuration information and the target device, and the configuration information corresponding to the high matching degree can be determined as the second configuration information; or the first configuration information and the third configuration information can be fused according to a certain fusion rule to obtain the second configuration information, etc. The fusion rule can be set to calculate the weight of the operating parameters of the heat dissipation device in the matching information according to a certain weight to reconstruct new operating parameters, and then use the new operating parameters to generate the second configuration information.

[0056] In another example, if the different device is not present in the third configuration information corresponding to the electronic device, it indicates that the different device is not a device that was originally included in the electronic device at the factory, but rather a device added by the user. In this case, the parameter information of the different device is obtained. The parameter information of the different device can be manually entered by the user when adding the device, or it can be obtained by the processor of the electronic device through a web crawler. The parameter information of the different device can include its specifications (such as size information), rated current, rated voltage, maximum current, and maximum voltage.

[0057] After obtaining the parameter information of the different devices, the first configuration information is adjusted based on the parameter information to obtain the second configuration information. The electronic device stores a pre-trained adjustment model that can generate a heat dissipation scheme based on the running device and its available heat dissipation devices. When adjusting the first configuration information based on the parameter information, the first configuration information and the parameter information are input into the adjustment model. The adjustment model outputs a new heat dissipation scheme, and the second configuration information is generated based on this new heat dissipation scheme, the first configuration information, and the parameter information of the different devices.

[0058] Correspondingly, the target device, the differential device, and the second configuration information are associated and stored in a hidden partition of the electronic device for direct querying and application later.

[0059] Optionally, when performing heat dissipation treatment on electronic devices, one can refer to... Figure 4 The flowchart shown includes specific steps S401-S403.

[0060] S401, obtain the heat dissipation devices and their health status in the current electronic device; wherein the heat dissipation devices include at least a fan and a heat dissipation channel baffle.

[0061] S402, determine the heat dissipation device and its health status, and whether it conforms to the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information.

[0062] S403, if not, update the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information, and perform heat dissipation treatment on the electronic device according to the updated heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information.

[0063] In practical applications, heat dissipation devices can be individually configured for one or more components of an electronic device. These heat dissipation devices include at least a fan and a heat dissipation channel baffle. For example, a corresponding fan and heat dissipation channel baffle can be configured for the Central Processing Unit (CPU) to effectively dissipate heat from the CPU; similarly, corresponding fans and heat dissipation channel baffles can be configured for the CPU and adjacent hard drives to effectively dissipate heat from both. This application does not limit the specific configuration; the number and location of the heat dissipation devices are determined based on the layout and size of the electronic device, the size of the heat sink, and the dimensions of each component within the electronic device. Figure 5 The diagram shows a partial structural schematic of an electronic device, in which multiple heat dissipation channel baffles are shown.

[0064] Since heat dissipation components directly affect heat dissipation efficiency—for example, the cooling effect varies depending on whether a fan is running normally, malfunctioning, or not running; similarly, the cooling channel baffle's performance also differs depending on whether it is properly installed, malfunctioning, or deformed. Therefore, when cooling electronic devices, it is crucial to obtain information about the heat dissipation components and their health status. For instance, this can be achieved by querying the available heat dissipation components in the electronic device through a hardware interface, and simultaneously determining the health status of each component, such as whether it is properly installed, malfunctioning (e.g., not installed), and whether the cooling channel baffle is deformed. Each fan and each cooling channel baffle has a unique identifier to facilitate precise control and achieve effective heat dissipation.

[0065] Optionally, when determining the health status of the heat dissipation device, the device can be tested using pre-stored heat dissipation data, which includes temperature data of the device corresponding to the fan and the heat dissipation channel baffle when the heat dissipation channel baffle is installed normally, abnormally, or when the heat dissipation channel baffle is deformed.

[0066] When testing the health status of heat dissipation devices, the corresponding device is controlled to operate at 50% of its rated power, and other devices are controlled to operate at 10% of their rated power. Simultaneously, the fan speed is kept constant at F. After running for a certain period, the actual temperature T1 collected by the temperature sensor is acquired. Then, the actual temperature T1 is compared with the measured temperature T2, and the actual temperature T1 is compared with the measured temperature T3. T2 is the average of multiple temperatures measured when the heat dissipation channel baffle corresponding to T2 is properly installed and without deformation, using the same device and fan, and dissipating heat through the same heat dissipation channel baffle. T3 is the average of multiple temperatures measured when the heat dissipation channel baffle corresponding to T3 is properly installed but deformed, using the same device and fan, and dissipating heat through the same heat dissipation channel baffle.

[0067] Specifically, comparing the actual temperature T1 with the measured temperature T2 calculates the temperature difference ΔTa between T1 and T2, and comparing the actual temperature T1 with the measured temperature T3 calculates the temperature difference ΔTb between T1 and T3. If ΔT is less than the first temperature threshold, it indicates that the heat dissipation channel baffles corresponding to the fan are installed correctly and without deformation; if ΔT is greater than the second temperature threshold, it indicates that the heat dissipation channel baffles corresponding to the fan are improperly installed, such as missing baffles; if ΔT is greater than the first temperature threshold but less than the second temperature threshold, it indicates that there are deformed heat dissipation channel baffles corresponding to the fan, in which case the user can be prompted to repair or replace the heat dissipation channel baffles.

[0068] The first temperature threshold is the difference between the maximum and minimum temperatures measured when the same device and fan are running and the same heat dissipation channel baffle is used for heat dissipation, provided that the heat dissipation channel baffle is installed correctly and without deformation. The second temperature threshold is the difference between the maximum and minimum temperatures measured when the same device and fan are running and the same heat dissipation channel baffle is used for heat dissipation, provided that the heat dissipation channel baffle is installed correctly but with deformation.

[0069] For example, when testing the heat dissipation channel baffle corresponding to the CPU, the CPU is controlled to run at 50% of its rated power, other devices are controlled to run at 10% of their rated power, and the fan is controlled to run at speed F. After running for a certain period of time, the actual temperature T1CPU collected by the temperature sensor corresponding to the CPU is collected. Then, the actual temperature T1CPU is compared with the measured temperatures T2CPU and T3CPU to determine the health status of the heat dissipation device corresponding to the CPU based on the first and second temperature thresholds corresponding to the CPU, T1CPU, T2CPU, and T3CPU.

[0070] After obtaining the heat dissipation devices and their health status of the electronic device, it is further determined whether the heat dissipation devices and their health status conform to the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information. That is, it is determined whether the number of heat dissipation devices and the health status of each heat dissipation device are consistent with the number of heat dissipation devices and the health status of each heat dissipation device included in the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information. The heat dissipation scheme may include the number of heat dissipation devices and their location, such as the number of fans and their location and identification, the number of heat dissipation channel baffles and their location and identification, and may also include the rotation speed of each fan.

[0071] If they match, the heat dissipation device and its health status are determined, and the heat dissipation scheme conforms to the first configuration information / the second configuration information; if they do not match, the heat dissipation device and its health status are determined, and the heat dissipation scheme does not conform to the first configuration information / the second configuration information.

[0072] If the heat dissipation device and its health status do not conform to the heat dissipation scheme in the first configuration information / second configuration information, the heat dissipation scheme in the first configuration information / second configuration information is updated. For example, if a deformed heat dissipation channel baffle is detected in the current electronic device, the weight value of the fan speed in the heat dissipation scheme can be increased to improve the fan speed and achieve the expected heat dissipation purpose. The weight value is used to determine the fan's heat dissipation speed. Specifically, the fan's heat dissipation speed is the product of the fan's maximum speed and the weight value. When adjusting the weight value, a preset step size (e.g., 0.01) can be used. Of course, this preset step size is not limited to this and can be set according to the maximum speed, the corresponding heat dissipation device, the heat dissipation requirements of the electronic device, etc.

[0073] At the same time, the updated heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information is stored, and the reason for the update is marked, such as the presence of deformed heat dissipation channel baffles in the heat dissipation channel baffles of electronic devices and the identification of deformed heat dissipation channel baffles.

[0074] Accordingly, if the heat dissipation device and its health status do not conform to the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information, a first alarm message is generated and transmitted to the user so that the heat dissipation channel baffle can be repaired or replaced based on the first alarm message.

[0075] As another example, after the electronic device is cooled, the target temperature of the target device can be continuously monitored. If the target temperature exceeds a preset threshold for a certain duration, an alarm condition is met, a second alarm message is generated and transmitted to the user so that the user can manually cool the target device to prevent damage caused by overheating.

[0076] In practical applications, users may disable some devices according to actual needs. Therefore, after detecting the existence of disabled devices, the corresponding heat dissipation scheme is updated based on the disabled devices to dissipate heat from the electronic devices according to the updated heat dissipation scheme, so as to achieve timely and flexible heat dissipation.

[0077] The second aspect of this application also provides an electronic device corresponding to the heat dissipation treatment method. Since the principle of solving the problem by the electronic device in this application is similar to the heat dissipation treatment method described above, the implementation of the electronic device can refer to the implementation of the method, and the repeated parts will not be described again.

[0078] Figure 6 A schematic diagram of an electronic device provided in an embodiment of this application is shown, with reference to... Figure 6 It can be seen that electronic devices include: The acquisition module 601 is configured to acquire first configuration information corresponding to the current electronic device and a target device that is running in the electronic device; wherein, the electronic device stores multiple candidate configuration information, the first configuration information is one of the multiple candidate configuration information, and different candidate configuration information corresponds to different operating states of the electronic device; The determining module 602 is configured to determine whether the first configuration information matches the target device; wherein the first configuration information includes at least the operating device corresponding to the current electronic device; The heat dissipation module 603 is configured to perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the first configuration information if the first configuration information matches the target device. The heat dissipation module 603 is further configured to determine second configuration information if the first configuration information does not match the target device, so as to perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the second configuration information.

[0079] As another example, the determining module 602 is specifically configured as follows: The first device included in the first configuration information is determined; wherein, the first device is the device that the electronic device is running in the running state corresponding to the first configuration information, and the devices and / or running parameters are different in the running states corresponding to different candidate configuration information. Determine whether the first device is consistent with the target device; If the first device is identical to the target device, then the first configuration information is determined to match the target device; If the first device is inconsistent with the target device, then it is determined that the first configuration information does not match the target device.

[0080] As another example, the heat dissipation module 603 is further configured as follows: If the first configuration information does not match the target device, a different device is identified; wherein, the different device is the target device that does not exist in the first configuration information; Based on the aforementioned differences in the device, the second configuration information is determined.

[0081] As another example, the heat dissipation module 603 is further configured as follows: Determine whether the differential device exists in the third configuration information corresponding to the electronic device; If it exists, determine the second configuration information based on the third configuration information; If it does not exist, obtain the parameter information of the difference device; Based on the parameter information, the first configuration information is adjusted to obtain the second configuration information.

[0082] As another example, the electronic device further includes: The storage module 604 is configured to associate and store the target device, the differential device and the second configuration information.

[0083] As another example, the heat dissipation module 603 is further configured as follows: Obtain the heat dissipation devices and their health status in the current electronic device; wherein, the heat dissipation devices include at least a fan and a heat dissipation channel baffle; Determine whether the heat dissipation device and its health status conform to the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information; If not, update the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information, and perform heat dissipation treatment on the electronic device according to the updated heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information.

[0084] As another example, the electronic device further includes: The alarm module 605 is configured to generate a first alarm message and transmit it to the user if the heat dissipation device and the health status do not conform to the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information.

[0085] As another example, the alarm module 605 is further configured to: Monitor the target temperature of the target device; If the duration for which the target temperature exceeds a preset threshold meets the alarm conditions, a second alarm message is generated and transmitted to the user.

[0086] As another example, the candidate configuration information is stored in a hidden partition of the electronic device.

[0087] After obtaining the first configuration information, this application embodiment compares the operating device included in the first configuration information with the target device to determine whether to perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the first configuration information or according to the heat dissipation scheme in the second configuration information. That is, the heat dissipation scheme to be executed can be flexibly selected and configured, thereby ensuring that the heat dissipation effect of the electronic device under different operating states is better.

[0088] A third aspect of this application also provides a computer device, the structural schematic diagram of which can be shown as follows: Figure 7As shown, it includes at least a memory 701 and a processor 702. The memory 701 stores a computer program, and the processor 702 implements the method provided in any embodiment of this application when executing the computer program in the memory 701. Exemplarily, the steps of the electronic device computer program are as follows: S11-S14: S11, obtain the first configuration information corresponding to the current electronic device, and the target device that is running in the electronic device; wherein, the electronic device stores multiple candidate configuration information, the first configuration information is one of the multiple candidate configuration information, and different candidate configuration information corresponds to different operating states of the electronic device; S12, determine whether the first configuration information matches the target device; wherein, the first configuration information includes at least the operating device corresponding to the current electronic device; S13, if the first configuration information matches the target device, perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the first configuration information; S14, if the first configuration information does not match the target device, determine the second configuration information to perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the second configuration information.

[0089] A fourth aspect of this application also provides a storage medium, which is a computer-readable medium, carrying one or more computer programs that, when executed by a processor, implement the method provided in any embodiment of this application, including the following steps S21-S24: S21, obtain the first configuration information corresponding to the current electronic device, and the target device that is running in the electronic device; wherein, the electronic device stores multiple candidate configuration information, the first configuration information is one of the multiple candidate configuration information, and different candidate configuration information corresponds to different operating states of the electronic device; S22, determine whether the first configuration information matches the target device; wherein, the first configuration information includes at least the operating device corresponding to the current electronic device; S23, if the first configuration information matches the target device, perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the first configuration information; S24, if the first configuration information does not match the target device, determine the second configuration information to perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the second configuration information.

[0090] After obtaining the first configuration information, this application embodiment compares the operating device included in the first configuration information with the target device to determine whether to perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the first configuration information or according to the heat dissipation scheme in the second configuration information. That is, the heat dissipation scheme to be executed can be flexibly selected and configured, thereby ensuring that the heat dissipation effect of the electronic device under different operating states is better.

[0091] It should be understood that in the embodiments of this application, the processor may be a central processing unit (CPU), or it may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0092] Optionally, in this embodiment, the storage medium may include, but is not limited to, various media capable of storing program code, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard drive, magnetic disk, or optical disk. Optionally, in this embodiment, the processor executes the method steps described in the above embodiments according to the program code stored in the storage medium. Optionally, specific examples in this embodiment can refer to the examples described in the above embodiments and optional implementations, which will not be repeated here. Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed on a network of multiple computing devices. Optionally, they can be implemented using computer-executable program code, thereby storing them in a storage device for execution by a computing device. In some cases, the steps shown or described can be executed in a different order than those described here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any specific hardware and software combination.

[0093] Furthermore, although exemplary embodiments have been described herein, their scope includes any and all embodiments based on this application that have equivalent elements, modifications, omissions, combinations (e.g., schemes involving intersections of various embodiments), adaptations, or alterations. Elements in the claims will be interpreted broadly based on the language used in the claims and are not limited to the examples described in this specification or during the implementation of this application, which will be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered illustrative only, and the true scope and spirit are indicated by the following claims and the full scope of their equivalents.

[0094] The above description is intended to be illustrative and not restrictive. For example, the above examples (or one or more of them) can be used in combination with each other. Other embodiments may be used by those skilled in the art upon reading the above description. Furthermore, in the above detailed description, various features may be grouped together to simplify the application. This should not be construed as an intention that a disclosed feature not claimed is necessary for any claim. Rather, the subject matter of this application may be less than all the features of a particular disclosed embodiment. Thus, the following claims are incorporated herein by reference as examples or embodiments, wherein each claim is an independent, separate embodiment, and these embodiments are contemplated as being possible in various combinations or arrangements. The scope of this application should be determined by reference to the appended claims and the full scope of their equivalents.

[0095] The foregoing has described in detail several embodiments of this application, but this application is not limited to these specific embodiments. Those skilled in the art can make various variations and modifications based on the concept of this application, and all such variations and modifications should fall within the scope of protection claimed in this application.

Claims

1. A heat dissipation treatment method, comprising: Obtain the first configuration information corresponding to the current electronic device, and the target device that is running in the electronic device; wherein, the electronic device stores multiple candidate configuration information, the first configuration information is one of the multiple candidate configuration information, and different candidate configuration information corresponds to different operating states of the electronic device; Determine whether the first configuration information matches the target device; wherein, the first configuration information includes at least the operating device corresponding to the current electronic device; If the first configuration information matches the target device, the electronic device is cooled according to the heat dissipation scheme in the first configuration information; If the first configuration information does not match the target device, second configuration information is determined to perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the second configuration information.

2. The heat dissipation method according to claim 1, wherein determining whether the first configuration information matches the target device includes: The first device included in the first configuration information is determined; wherein, the first device is the device that the electronic device is running in the running state corresponding to the first configuration information, and the devices and / or running parameters are different in the running states corresponding to different candidate configuration information. Determine whether the first device is consistent with the target device; If the first device is identical to the target device, then the first configuration information is determined to match the target device; If the first device is inconsistent with the target device, then it is determined that the first configuration information does not match the target device.

3. The heat dissipation method according to claim 1, wherein determining the second configuration information if the first configuration information does not match the target device includes: If the first configuration information does not match the target device, a different device is identified; wherein, the different device is the target device that does not exist in the first configuration information; Based on the aforementioned differences in the device, the second configuration information is determined.

4. The heat dissipation method according to claim 3, wherein determining the second configuration information based on the differential device includes: Determine whether the differential device exists in the third configuration information corresponding to the electronic device; If it exists, determine the second configuration information based on the third configuration information; If it does not exist, obtain the parameter information of the difference device; Based on the parameter information, the first configuration information is adjusted to obtain the second configuration information.

5. The heat dissipation method according to claim 3 further includes: The target device, the differential device, and the second configuration information are associated and stored.

6. The heat dissipation method according to claim 1, wherein the heat dissipation treatment of the electronic device comprises: Obtain the heat dissipation devices and their health status in the current electronic device; wherein, the heat dissipation devices include at least a fan and a heat dissipation channel baffle; Determine whether the heat dissipation device and its health status conform to the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information; If not, update the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information, and perform heat dissipation treatment on the electronic device according to the updated heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information.

7. The heat dissipation method according to claim 6 further includes: If the heat dissipation device and its health status do not conform to the heat dissipation scheme of the first configuration information / the heat dissipation scheme of the second configuration information, a first alarm message is generated and transmitted to the user.

8. The heat dissipation method according to any one of claims 1-7, further comprising, after heat dissipation treatment of the electronic device: Monitor the target temperature of the target device; If the duration for which the target temperature exceeds a preset threshold meets the alarm conditions, a second alarm message is generated and transmitted to the user.

9. The heat dissipation method according to any one of claims 1-7, wherein the candidate configuration information is stored in a hidden partition of the electronic device.

10. An electronic device, comprising: The acquisition module is configured to acquire first configuration information corresponding to the current electronic device and a target device that is running in the electronic device; wherein, the electronic device stores multiple candidate configuration information, the first configuration information is one of the multiple candidate configuration information, and different candidate configuration information corresponds to different operating states of the electronic device; A determining module is configured to determine whether the first configuration information matches the target device; wherein the first configuration information includes at least the operating device corresponding to the current electronic device; A heat dissipation module is configured to perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the first configuration information if the first configuration information matches the target device; The heat dissipation module is further configured to determine second configuration information if the first configuration information does not match the target device, so as to perform heat dissipation treatment on the electronic device according to the heat dissipation scheme in the second configuration information.

Images