Head binding device, correction mounting system and die bonding equipment

Abstract

The invention relates to a binding head device, a correction mounting system and die bonding equipment. The binding head device is used for picking up a chip and mounting the chip on a substrate and comprises a driving assembly, a working assembly and a suction nozzle assembly, and the two ends of the working assembly are connected with the driving assembly and the suction nozzle assembly respectively; the working assembly comprises a rotating seat, a first elastic piece and an air bearing, a rotating shaft is arranged in the rotating seat and slidably mounted in the rotating seat, the two ends of the rotating shaft are a transmission end and a working end respectively, the transmission end of the rotating shaft is connected with the driving assembly, and the working end of the rotating shaft is connected with the suction nozzle assembly; a first cavity and a second cavity which penetrate through and communicate with each other are formed in the driving assembly and the rotating shaft correspondingly, the rotating shaft is sleeved with the air bearing, the outer side of the air bearing abuts against the inner wall face of the rotating base, one end of the first elastic piece abuts against the rotating shaft, and the other end of the first elastic piece abuts against the rotating base. When the rotating shaft and the rotating base slide relatively, the first elastic piece elastically deforms.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a binding head device, a correction mounting system and a die bonding equipment. BACKGROUND

[0002] The binding head device is an indispensable device in the integrated circuit packaging process, mainly used in the pickup and mounting of chips in the automatic chip mounting process of the semiconductor industry. The pickup of the chip is to take the chip from the wafer by the suction nozzle of the binding head device, and the mounting of the chip is to mount the taken chip to the lead frame.

[0003] However, the existing binding head device has poor effect when aligning and mounting the chip to the corresponding position of the lead frame, and it is difficult to meet the high precision requirement of chip mounting. In view of this, the present application provides a binding head device with high chip mounting precision, which can real-time align the upper surface of the chip and the mounting position recognition point during mounting, to solve the above technical problems. SUMMARY

[0004] To solve the technical problem that the existing binding head device of the chip mounter has poor effect when aligning and mounting the chip, and it is difficult to meet the high precision requirement of chip mounting, the present application provides a binding head device, a mounting method and a die bonding equipment.

[0005] The technical problem of the present application is solved by providing a binding head device for picking up a chip and mounting it to a substrate, the binding head device comprising a driving assembly, a working assembly and a suction nozzle assembly, two ends of the working assembly being connected with the driving assembly and the suction nozzle assembly respectively; the working assembly comprises a rotating seat, a first elastic member and an air floating bearing, a rotating shaft is arranged in the rotating seat, the rotating shaft is slidably installed in the rotating seat, two ends of the rotating shaft are transmission end and working end respectively, the transmission end of the rotating shaft is connected with the driving assembly, and the working end of the rotating shaft is connected with the suction nozzle assembly; the driving assembly and the rotating shaft are respectively provided with a first cavity and a second cavity which are through and communicated, the air floating bearing is sleeved on the rotating shaft, and the outer side of the air floating bearing abuts against the inner wall surface of the rotating seat, one end of the first elastic member abuts against the rotating shaft, and the other end abuts against the rotating seat, and the first elastic member is elastically deformed when the rotating shaft and the rotating seat slide relative to each other.

[0006] Preferably, the head binding device further comprises a guide assembly, the guide assembly comprising a guide shaft, a guide bearing and a guide block, one end of the guide shaft being fixed to the rotating shaft, the guide bearing being sleeved on the other end of the guide shaft, the guide shaft and the first elastic member being respectively arranged on two sides of the rotating shaft in the length direction, the guide shaft being arranged perpendicularly to the rotating shaft, the first elastic member being arranged in parallel to the rotating shaft, and the deformation direction of the first elastic member being the same as the sliding direction of the rotating shaft; the rotating seat is provided with a hollow channel penetrating in the horizontal direction, the guide shaft and the guide bearing being located in the hollow channel, the length of the hollow channel in the vertical direction being greater than the outer diameter of the guide bearing, the guide block being fixedly arranged on the rotating seat, the guide block abutting against the outer ring of the guide bearing, and the guide bearing being slidable relative to the guide block when the rotating shaft slides relative to the rotating seat.

[0007] Preferably, the driving assembly comprises a hollow rotary motor and a connecting piece, a fixing seat being arranged between the rotary motor and the connecting piece, the rotary motor being mounted on the fixing seat, the rotary motor, the fixing seat and the connecting piece being arranged in sequence; one side of the fixing seat facing the connecting piece is provided with a first limiting block, the outer peripheral surface of the connecting piece is provided with a second limiting block, and the first limiting block cooperates with the second limiting block when the rotary motor is working, so that the rotation angle range driven by the rotary motor is 0° to 240°.

[0008] Preferably, the head binding device further comprises a self-weight balancing assembly, the self-weight balancing assembly comprising a balancing shaft and a second elastic member, the balancing shaft being arranged in the hollow channel and arranged perpendicularly to the guide shaft and the rotating shaft, one end of the second elastic member being connected to the bottom of the connecting piece, and the other end of the second elastic member being connected to the balancing shaft; the rotating shaft is provided with a placing groove, the bottom end of the first elastic member abutting against the bottom wall of the placing groove, the side edge of the first elastic member abutting against the side wall of the placing groove, and the top end of the first elastic member abutting against the outer bottom wall of the rotating seat; the first elastic member is a compression spring, and the second elastic member is a tensile spring.

[0009] Preferably, the suction nozzle assembly comprises a suction assembly and a vacuum suction nozzle connected to one end of the suction assembly, the other end of the suction assembly being connected to the rotating shaft, and the vacuum suction nozzle being at least partially transparent; the suction assembly comprises a gas path guide seat, a first transparent sealing member and a sealing ring, the first transparent sealing member being sealingly fixed between the gas path guide seat and the rotating shaft, the end of the gas path guide seat away from the first transparent sealing member being detachably connected to the vacuum suction nozzle, and the sealing ring being sleeved on the outside of the first transparent sealing member.

[0010] Preferably, the head binding device further comprises a ventilation assembly, the ventilation assembly comprising a first air pipe joint arranged on the air floating bearing, the first air pipe joint being provided with a first air passage, the first air passage being used for air inlet of the air floating bearing; the first air passage is communicated with the internal air passage of the air floating bearing through the first air pipe joint.

[0011] Preferably, the ventilation assembly further comprises a second air pipe joint and a third air pipe joint arranged on the rotating shaft near one end of the vacuum suction nozzle, the second air pipe joint being provided with a second air passage, and the third air pipe joint being provided with a third air passage; the second air passage is communicated with the outside through the internal air passage of the vacuum suction nozzle, the air passage conducting seat and the rotating shaft in sequence, forming a nozzle adsorption air passage; the third air passage is communicated with the outside through the internal air passage of the vacuum suction nozzle, the air passage conducting seat and the rotating shaft in sequence, forming a material adsorption air passage; the nozzle adsorption air passage and the material adsorption air passage are not communicated with each other.

[0012] Preferably, the head binding device further comprises a force control detection assembly, the force control detection assembly comprising a position sensor and a magnetic piece matched with each other; the outer surface of the rotating seat is provided with a first positioning piece, the outer surface of the rotating shaft is provided with a second positioning piece, the first positioning piece is arranged in the vertical direction corresponding to the second positioning piece and there is a gap; the position sensor is installed on the first positioning piece, the magnetic piece is installed on the second positioning piece, and the magnetic piece is arranged corresponding to the working end of the position sensor.

[0013] The application further provides a correction mounting system for correcting the angle of the chip when picking up and mounting, the correction mounting system comprising a visual correction assembly and the above-mentioned head binding device, the visual correction assembly being arranged at one end of the first cavity away from the suction nozzle assembly.

[0014] The application further provides a die bonding device, the die bonding device comprising the above-mentioned head binding device.

[0015] Compared with the prior art, the head binding device, the correction mounting system and the die bonding device provided by the application have the following advantages: 1. The embodiment of the present application provides a head binding device for picking up a chip and mounting it on a substrate, the head binding device comprising a driving assembly, a working assembly and a suction nozzle assembly, the working assembly comprising a rotating seat, a first elastic member and an air floating bearing, the rotating seat being internally provided with a rotating shaft, the rotating shaft being slidably installed in the rotating seat, the two ends of the first elastic member abutting against the rotating shaft and the rotating seat respectively, the first elastic member being elastically deformed to provide a buffering effect when the rotating shaft and the rotating seat slide relative to each other, so as to avoid damage to the chip and / or the substrate caused by excessive mounting downward pressure during mounting, the force control efficiency being relatively high, and the internal space of the head binding device being less occupied; the air floating bearing being sleeved on the rotating shaft, capable of providing high-precision guiding constraint for the rotating shaft, reducing the radial deviation of the rotating shaft when moving in the vertical direction, and improving the stability of the rotating shaft when completing the lifting and rotating actions; the outer side of the air floating bearing further abutting against the inner wall surface of the rotating seat, capable of reducing the friction between the rotating shaft and the rotating seat, making the sliding of the rotating shaft relative to the rotating seat more smooth, reducing the influence of the vertical direction movement resistance on the mounting downward pressure during the working process of the head binding device, and improving the mounting downward pressure precision of the head binding device when mounting the chip on the substrate; the first cavity on the driving assembly and the second cavity on the rotating shaft being penetrated and communicated, capable of identifying the positions of the chip and the substrate and the corresponding mounting position identification points from the top of the chip after picking up and adsorbing the chip at the working end of the rotating shaft, so as to realize the real-time alignment mounting function, improve the mounting precision of the head binding device, and meet the high-precision requirement of chip mounting.

[0016] 2、The head binding device provided by the embodiment of the application, the guide assembly includes a guide shaft, a guide bearing and a guide block, the guide assembly can provide guidance for the rotating shaft in the vertical direction, the overall structure helps to ensure the stability and precision of the movement of the working end of the rotating shaft in the vertical direction, thereby improving the precision of the chip mounting; one end of the guide shaft is fixed to the rotating shaft, and the guide shaft is arranged perpendicularly to the rotating shaft, which can accurately limit the movement direction of the rotating shaft, avoid the rotating shaft from deviating during movement, and improve the mounting and guiding precision of the head binding device in the vertical direction; the length of the hollow channel in the vertical direction is greater than the outer diameter of the guide bearing, the sliding stroke of the rotating shaft can be limited by the guide bearing, and the vertical movement of the rotating shaft is further accurately guided, so that the rotating shaft is prevented from excessively sliding in the vertical direction and causing excessive mounting force, and the chip and the substrate are protected; further, the guide bearing is sleeved on the other end of the guide shaft, the guide block is fixed to the rotating seat and abuts against the outer ring of the guide bearing, so that the guide bearing can only slide relative to the guide block in the vertical direction and cannot rotate relative to the guide block; through this design, the rotating shaft can be prevented from deviating in the horizontal direction, the guide bearing can reduce friction during movement, the vertical movement of the rotating shaft is smoother, and the rotating shaft is further prevented from shaking during movement; the guide shaft and the first elastic member are located on both sides of the rotating shaft in the length direction respectively, and the first elastic member is arranged in parallel with the rotating shaft, the deformation direction of the first elastic member is the same as the sliding direction of the rotating shaft, the stress condition of the rotating shaft can be balanced, the sliding of the rotating shaft in the hollow channel is more stable, and the mounting precision is further ensured.

[0017] 3、The head binding device provided by the embodiment of the application, the fixed seat is arranged between the rotating motor and the connecting piece, the rotating motor, the fixed seat and the connecting piece are arranged in sequence, the rotating motor is installed on the fixed seat, the structure connection is stable, the power of the rotating motor can be accurately transmitted to the rotating shaft through the connecting piece, and the movement stability of the rotating shaft is improved; the first limiting block and the second limiting block cooperate to limit the rotation angle of the rotating motor driven by the rotating motor to 0°-240°, the rotating range of the suction nozzle assembly can be accurately controlled, the angle positioning requirement of the chip mounting is met, and under the premise that the rotation angle of the rotating motor driven by the rotating motor meets the mounting requirement, the wire on the head binding device is prevented from being wound, thereby affecting the use safety of the head binding device; the limiting structure can also prevent the rotating motor from excessively rotating, and prolong the service life of the head binding device.

[0018] 4、The head binding device provided by the embodiment of the application, the balance shaft and the second elastic member are exposed to the working assembly, the balance shaft is arranged in the hollow channel and arranged perpendicularly to the guide shaft and the rotating shaft, one end of the second elastic member is connected to the bottom of the connecting piece, and the other end is connected to the balance shaft, that is, the acting force of the second elastic member can drive the balance shaft to move, thereby driving the rotating shaft to be elastically reset in the vertical direction, and balancing the self-weight of the rotating shaft and the self-weight of the load located above the rotating shaft.

[0019] Understandably, the first elastic member is arranged in the placing groove formed on the rotating shaft, the bottom end of the first elastic member is connected to the rotating shaft, the top end is connected to the rotating seat, and the rotating shaft and the rotating seat can relatively slide through the first elastic member; the first elastic member is a compression spring, and the second elastic member is a tensile spring; the embodiment of the application adopts the compression spring as the driving force of the fitting down pressure, and cooperates with the tensile spring weight ratio, so that the adjustable range of the fitting down pressure can be expanded, and the high precision requirement of the chip mounting force can be ensured.

[0020] 5、The head binding device provided by the embodiment of the application, when the head binding device is used for picking up and mounting the chip, the air path guide seat is responsible for adsorbing the vacuum suction nozzle, and the chip is adsorbed by the vacuum suction nozzle to realize the picking up and mounting of the chip; the first transparent sealing piece placed at the end of the air path guide seat away from the vacuum suction nozzle can prevent air leakage of the vacuum, and the first transparent sealing piece is sealingly fixed between the air path guide seat and the rotating shaft, so that the feature recognition can be performed by the correction device through the first cavity, the second cavity and the first transparent sealing piece in sequence before the chip is mounted, the feature recognition includes the identification points of the chip and the mounting position, and the mounting precision of the head binding device is improved; the sealing ring is sleeved outside the first transparent sealing piece, and the first transparent sealing piece is sealingly fixed between the air path guide seat and the rotating shaft through the sealing ring, so that the first transparent sealing piece has good vacuum sealing property.

[0021] 6、The head binding device provided by the embodiment of the application, the first air pipe joint is provided with a first air path opening, the first air path opening is communicated with the internal air path of the air floating bearing through the first air pipe joint, can stably supply air for the air floating bearing, and ensures the normal work of the air floating bearing to improve the movement precision of the rotating shaft; the air inlet of the air floating bearing is separately provided, which can avoid the mutual interference between the air inlet of the air floating bearing and the vacuum air path of the suction nozzle assembly, and ensure the independence and stability of the respective air paths.

[0022] 7、The head binding device provided by the embodiment of the application, the second air pipe joint is provided with a second air path opening, the second air path opening is communicated with the outside through the internal air paths of the rotating shaft, the air path guide seat and the vacuum suction nozzle in sequence, forming a suction nozzle adsorption air path, the second air path opening can extract vacuum for the vacuum suction nozzle, reduces the influence of the suction nozzle vacuum air path on the mounting force control process, to avoid the deviation of the vacuum suction nozzle when picking up and mounting the chip; through the design, on the one hand, the sealing property of the vacuum extraction of the vacuum suction nozzle can be ensured, so as to ensure the stability of the chip adsorption when the vacuum suction nozzle picks up and mounts the chip, and the stability and reliability of the work of the head binding device are improved as a whole, on the other hand, the vacuum suction nozzle and the rotating shaft can be kept relatively stationary, so that the chip and the substrate will not be affected by the suction nozzle adsorption air path when they are in contact, and errors are avoided.

[0023] Understandably, the third gas joint is provided with a third gas port, the third gas port is communicated with the outside through the internal gas path of the rotary shaft, the gas path conduction seat and the vacuum suction nozzle in sequence, and forms a material adsorption gas path, so that the third gas port can make the chip stably adhere to the working end of the vacuum suction nozzle, and then realize the picking and mounting of the vacuum suction nozzle on the chip, and the mounting angle can be better adjusted during the mounting of the chip. Through the design, the rigidity of the binding head device for mounting the chip in the deep cavity can be guaranteed, and the high-precision requirement of the chip mounting position is met. It should be noted that the suction nozzle adsorption gas path and the material adsorption gas path are not communicated with each other, that is, the gas paths for adsorbing the vacuum suction nozzle and adsorbing the chip are independent of each other, so as to realize the adsorption of the vacuum suction nozzle and the adsorption of the chip by the vacuum suction nozzle respectively.

[0024] 8、The binding head device provided by the embodiment of the present application, the outer surfaces of the rotary seat and the rotary shaft are respectively provided with a first positioning member and a second positioning member, the position sensor is installed on the first positioning member, and the magnetic member is installed on the second positioning member. The position sensor and the magnetic member can realize the detection of the position when the binding head device is pressed to make the chip contact the substrate, and compared with the ordinary photoelectric sensor, the position sensor has a smaller size and a faster response speed, the non-contact sensing measurement method has the characteristics of high sensitivity and anti-electromagnetic interference, and there is no risk of physical wear and long service life. The structure of the position sensor and the magnetic member is small in size and flexible in installation, and a large amount of space of the binding head device is not occupied, which is beneficial to the miniaturization design of the whole equipment.

[0025] 9、The embodiment of the present application further provides a correction mounting system for correcting the angle of the chip during picking and mounting. The correction mounting system comprises a visual correction component and the above-mentioned binding head device, and the visual correction component is arranged at one end of the first cavity away from the suction nozzle component. It should be noted that the correction mounting system has the same beneficial effects as the above-mentioned binding head device, and will not be described here.

[0026] 10、The embodiment of the present application further provides a die bonding equipment comprising the above-mentioned binding head device. It should be noted that the die bonding equipment has the same beneficial effects as the above-mentioned binding head device, and will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating labor intensity.

[0028] Figure 1 It is the overall structure of the binding head device of the embodiment of the present application Figure One .

[0029] Figure 2 is the sectional view of the internal structure of the head binding device according to the embodiment of the present application.

[0030] Figure 3 is the overall structure schematic diagram of the head binding device according to the embodiment of the present application. Figure Two .

[0031] Figure 4 is the enlarged view of part A in Figure 2 .

[0032] Figure 5 is the overall structure schematic diagram of the head binding device according to the embodiment of the present application. Figure Three .

[0033] Figure 6 is the overall structure schematic diagram of the correction and mounting system according to the embodiment of the present application.

[0034] Figure 7 is the overall frame schematic diagram of the die bonding equipment according to the embodiment of the present application.

[0035] Explanation of the attached drawings: 10, head binding device; 20, correction and mounting system; 30, die bonding equipment; 1, driving assembly; 11, first cavity; 12, rotary motor; 13, connecting piece; 131, second limiting block; 14, fixed seat; 141, first limiting block; 2, working assembly; 21, rotary seat; 211, rotary shaft; 2111, second cavity; 2112, placing groove; 2113, second positioning piece; 212, first positioning piece; 213, hollow channel; 22, first elastic piece; 23, air floating bearing; 3, suction nozzle assembly; 31, suction assembly; 311, air path conduction seat; 312, first transparent sealing piece; 313, sealing ring; 32, vacuum suction nozzle; 321, observation channel; 322, second transparent sealing piece; 4, guiding assembly; 41, guiding shaft; 42, guiding bearing; 43, guiding block; 5, self-weight balance assembly; 51, balance shaft; 52, second elastic piece; 6, air ventilation assembly; 61, first air tube joint; 611, first air path opening; 62, second air tube joint; 621, second air path opening; 63, third air tube joint; 631, third air path opening; 7, force control detection assembly; 71, position sensor; 72, magnetic piece; 8, visual correction assembly. DETAILED DESCRIPTION

[0036] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely intended to explain the present application and should not be used to limit the present application. In the embodiments provided by the present application, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that the determination of B according to A does not mean that B is determined only according to A, but B can also be determined according to A and / or other information. It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present application. In various embodiments of the present application, it should be understood that the size of the serial number of the above processes does not mean the inevitable sequence of execution, and the execution sequence of the processes should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. In the flowcharts and block diagrams of the drawings of the present application, the possible implementation architecture, function and operation of the system, method and computer program product according to various embodiments of the present application are illustrated. In this regard, each block in the flowchart or block diagram can represent a module, a program segment or a part of code, which includes one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks can also occur in a different order from that indicated in the drawings. For example, two blocks indicated in succession can actually be executed in parallel, and sometimes they can be executed in reverse order, which is determined based on the functions involved. It should be particularly noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for executing the specified functions or operations, or can be implemented by a combination of special-purpose hardware and computer instructions.

[0037] Please refer to Figure 1 and Figure 2The embodiment of the present application provides a head binding device 10 for picking up a chip and attaching the chip to a substrate, the head binding device 10 comprising a driving assembly 1, a working assembly 2 and a suction nozzle assembly 3, two ends of the working assembly 2 being connected with the driving assembly 1 and the suction nozzle assembly 3 respectively; the working assembly 2 comprising a rotating seat 21, a first elastic member 22 and an air floating bearing 23, the rotating seat 21 being internally provided with a rotating shaft 211, the rotating shaft 211 being slidably installed in the rotating seat 21, two ends of the rotating shaft 211 being a transmission end and a working end respectively, the transmission end of the rotating shaft 211 being connected with the driving assembly 1, the working end of the rotating shaft 211 being connected with the suction nozzle assembly 3; the driving assembly 1 and the rotating shaft 211 being respectively provided with a first cavity 11 and a second cavity 2111 which are penetrating and communicated, the air floating bearing 23 being sleeved on the rotating shaft 211, and the outer side of the air floating bearing 23 being abutted against the inner wall surface of the rotating seat 21, one end of the first elastic member 22 being abutted against the rotating shaft 211, and the other end of the first elastic member 22 being abutted against the rotating seat 21, the first elastic member 22 being elastically deformed when the rotating shaft 211 and the rotating seat 21 slide relative to each other.

[0038] The head binding device 10 provided by the embodiment of the present application can be used for picking up and attaching a chip in the automatic attaching process in the semiconductor industry. The head binding device 10 is applied in occasions with high-precision requirements of attaching, and can expose features needing to be recognized when picking up and adsorbing the chip, and realizes the attaching process of real-time alignment and attachment of the upper surface of the chip and the recognition point of the attaching position.

[0039] Specifically, the working assembly 2 comprises the rotating seat 21, the rotating seat 21 is internally provided with the rotating shaft 211, the rotating shaft 211 is slidably installed in the rotating seat 21 and can move up and down relative to the rotating seat 21, and the working end of the rotating shaft 211 is exposed to the rotating seat 21, wherein the working end of the rotating shaft 211 is connected with the suction nozzle assembly 3, can be connected with suction nozzles of different specifications to adsorb different kinds of chips, and the suction nozzle is responsible for picking up, adsorbing and attaching the chip; the transmission end of the rotating shaft 211 is connected with the driving assembly 1, and the driving assembly 1 can control the rotating shaft 211 to rotate and correct the angle of the chip when picking up or attaching the chip. The rotating shaft 211 only makes fine adjustment during the up and down movement relative to the rotating seat 21, the whole head binding device 10 is lowered to the position where the suction nozzle of the working end of the rotating shaft 211 reaches the picking up position or the attaching position of the chip, and when the suction nozzle presses the chip and generates a downward pressure on the chip, the suction nozzle assembly 3 pushes the rotating shaft 211 upward relative to the rotating seat 21; after completing the attachment of the chip once, the whole head binding device 10 is raised to gradually reduce the downward pressure of the suction nozzle on the chip until the downward pressure disappears, and the rotating shaft 211 is lowered relative to the rotating seat 21 under the action of gravity.

[0040] Further, the working assembly 2 further comprises a first elastic member 22 and an air floating bearing 23, two ends of the first elastic member 22 abut against the rotating shaft 211 and the rotating seat 21 respectively, and the first elastic member 22 is elastically deformed to provide a buffering effect when the rotating shaft 211 slides relative to the rotating seat 21, so as to avoid damage to the chip and / or the substrate due to excessive mounting downward pressure during mounting, and the force control efficiency is higher, and the internal space of the binding head device 10 is less occupied, which is beneficial to miniaturization of the binding head device 10.

[0041] It should be noted that the air floating bearing 23 is sleeved on the rotating shaft 211, can provide high-precision guiding constraint for the rotating shaft 211, reduce the radial deviation of the rotating shaft 211 when moving in the vertical direction, and improve the stability of the rotating shaft 211 when completing the lifting and rotating actions; the outer side of the air floating bearing 23 further abuts against the inner wall surface of the rotating seat 21, can reduce the friction between the rotating shaft 211 and the rotating seat 21, make the sliding of the rotating shaft 211 relative to the rotating seat 21 more smooth, reduce the influence of the vertical movement resistance on the mounting downward pressure during the working process of the binding head device 10, and improve the precision of the mounting downward pressure of the binding head device 10 when mounting the chip to the substrate.

[0042] Understandably, the first cavity 11 on the driving assembly 1 and the second cavity 2111 on the rotating shaft 211 are penetrated and communicated, so that the position of the chip and the corresponding mounting position identification point of the substrate can be identified by the correction device from the top of the chip after the chip is picked up and adsorbed by the working end of the rotating shaft 211, so as to realize real-time alignment and mounting function, improve the mounting precision of the binding head device 10, and meet the high-precision requirement of chip mounting.

[0043] Please continue to refer to Figure 1 , Figure 2 and Figure 3 , the binding head device 10 further comprises a guiding assembly 4, the guiding assembly 4 comprises a guiding shaft 41, a guiding bearing 42 and a guiding block 43, one end of the guiding shaft 41 is fixed to the rotating shaft 211, the guiding bearing 42 is sleeved on the other end of the guiding shaft 41, the guiding shaft 41 and the first elastic member 22 are respectively arranged on both sides of the rotating shaft 211 in the length direction, the guiding shaft 41 is vertically arranged relative to the rotating shaft 211, the first elastic member 22 is parallelly arranged relative to the rotating shaft 211, and the deformation direction of the first elastic member 22 is the same as the sliding direction of the rotating shaft 211.

[0044] Further, the rotating seat 21 is provided with a hollow passage 213 penetrating in the horizontal direction, the guiding shaft 41 and the guiding bearing 42 are located in the hollow passage 213, the length of the hollow passage 213 in the vertical direction is greater than the outer diameter of the guiding bearing 42, the guiding block 43 is fixedly arranged on the rotating seat 21, the guiding block 43 abuts against the outer ring of the guiding bearing 42, and the guiding bearing 42 can slide relative to the guiding block 43 when the rotating shaft 211 slides relative to the rotating seat 21.

[0045] The guiding assembly 4 can provide guidance for the rotating shaft 211 in the vertical direction, and the overall structure helps to ensure the stability and accuracy of the movement of the working end of the rotating shaft 211 in the vertical direction, thereby improving the accuracy of the chip mounting.

[0046] Specifically, the length of the hollow channel 213 in the vertical direction is greater than the outer diameter of the guide bearing 42, which can limit the sliding stroke of the rotating shaft 211 through the guide bearing 42, further accurately guide the vertical movement of the rotating shaft 211, and prevent the rotating shaft 211 from excessive sliding in the vertical direction, which can cause excessive mounting force and damage the chip and the substrate. It can be understood that the guide bearing 42 is sleeved on the end of the guide shaft 41 away from the rotating shaft 211, the guide block 43 is fixedly arranged on the rotating seat 21 and abuts against the outer ring of the guide bearing 42, so that the guide bearing 42 can only slide relative to the guide block 43 in the vertical direction and cannot rotate relative to the guide block 43. Through this design, the rotating shaft 211 can be prevented from deviating in the horizontal direction, and the guide bearing 42 can reduce friction during movement, making the vertical movement of the rotating shaft 211 smoother and further preventing the rotating shaft 211 from shaking during movement.

[0047] It should be noted that the vertical arrangement of the guide shaft 41 and the rotating shaft 211 and the abutting arrangement of the outer ring of the guide bearing 42 and the rotating seat 21 form a multi-directional constraint stable structure, which can offset the lateral force that may be generated by the working end of the rotating shaft 211 during mounting, further suppress the slight shaking of the rotating shaft 211, and ensure the position accuracy of the binding head device 10 during mounting.

[0048] In the embodiment of the present application, the guide shaft 41 and the first elastic member 22 are located on both sides of the rotating shaft 211 in the length direction, and the first elastic member 22 is arranged parallel to the rotating shaft 211 to avoid mutual interference between the guide shaft 41 and the first elastic member 22 and affect the picking and mounting effect of the binding head device 10; the deformation direction of the first elastic member 22 is the same as the sliding direction of the rotating shaft 211, which can balance the stress of the rotating shaft 211 in the sliding direction, make the sliding of the rotating shaft 211 in the hollow channel 213 more stable, and further ensure the mounting accuracy.

[0049] In some embodiments, the top and bottom of the hollow channel 213 are provided with a limit for the guide bearing 42, and the guide bearing 42 can slide up and down in the vertical direction by a distance of 2-4 mm, preferably 3 mm, which is suitable for the force stroke range required by most types of chip mounting. By setting the upper and lower limits, it can prevent the force stroke from exceeding, on the one hand, it can avoid the damage of the chip and / or the substrate caused by the overstroke of the pressure material, on the other hand, it can also enhance the safety and durability of the guide assembly 4, and prolong the service life of the binding head device 10.

[0050] In some embodiments, the number of guide bearings 42 is at least two, and the guide bearings 42 do not slide relative to the guide shaft 41 after being sleeved; it can be understood that the purpose of setting the guide bearing 42 is mainly to limit the sliding stroke of the rotating shaft 211 and improve the stability of the binding head device 10 during mounting, therefore, the number of guide bearings 42 can be determined according to actual needs, and when the number of guide bearings 42 is increased, only the length of the guide shaft 41 needs to be adjusted accordingly, so that the guide bearing 42 does not slide relative to the guide shaft 41 when it is sleeved on the guide shaft 41, and the specific embodiments of the present embodiment cannot be used to limit the present application, any modification, equivalent replacement and improvement within the principles of the present application shall be included in the protection scope of the present application.

[0051] Please continue to refer to Figure 1 and Figure 2 , the driving assembly 1 comprises a hollow rotating motor 12 and a connecting piece 13, a fixed seat 14 is arranged between the rotating motor 12 and the connecting piece 13, the rotating motor 12 is installed on the fixed seat 14, and the rotating motor 12, the fixed seat 14 and the connecting piece 13 are sequentially arranged.

[0052] In the binding head device 10 provided by the embodiment of the present application, the fixed seat 14 is arranged between the rotating motor 12 and the connecting piece 13, the rotating motor 12, the fixed seat 14 and the connecting piece 13 are sequentially arranged, the rotating motor 12 is installed on the fixed seat 14, the structure connection is stable, and the power of the rotating motor 12 can be accurately transmitted to the rotating shaft 211 through the connecting piece 13, thereby improving the motion stability of the rotating shaft 211.

[0053] Further, a first limiting block 141 is arranged on the side of the fixed seat 14 facing the connecting piece 13, a second limiting block 131 is arranged on the outer circumferential surface of the connecting piece 13, and the first limiting block 141 cooperates with the second limiting block 131 when the rotating motor 12 works, so that the rotation angle range of the rotating motor 12 driven is 0°-240°.

[0054] It can be understood that the first limiting block 141 cooperates with the second limiting block 131 to limit the rotation angle of the rotating motor 12 to 0°-240°, accurately control the rotation range of the suction nozzle assembly 3, meet the angle positioning requirements of chip mounting, and avoid the wire on the head binding device 10 from winding, thereby affecting the use safety of the head binding device 10, under the premise that the rotation angle of the rotating motor 12 meets the mounting requirements.

[0055] In some embodiments, the number of first limiting blocks 141 is two, the number of second limiting blocks 131 is one, the two first limiting blocks 141 are symmetrically arranged, and the wire on the head binding device 10 that cannot rotate is located between the first limiting blocks 141, and the rotating motor 12 drives the connecting piece 13 to rotate when working; when the second limiting block 131 abuts against one of the first limiting blocks 141, the rotating motor 12 can only drive the connecting piece 13 to rotate in the other direction until the second limiting block 131 abuts against the other first limiting block 141, and the rotation angle of the second limiting block 131 driven by the rotating motor 12 in this process is 240°. It should be noted that when the head binding device 10 of the embodiment is assembled for the first time, the original position of the second limiting block 131 is on the symmetry axis of the two first limiting blocks 141, and the second limiting block 131 can realize ±120° rotation to abut against the two symmetrically arranged first limiting blocks 141. The limiting structure composed of the first limiting block 141 and the second limiting block 131 can also prevent the working end of the rotating motor 12 from excessive rotation, thereby prolonging the service life of the head binding device 10.

[0056] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , the head binding device 10 further comprises a self-weight balancing assembly 5, the self-weight balancing assembly 5 comprises a balancing shaft 51 and a second elastic member 52, the balancing shaft 51 is arranged in the hollow channel 213, and is arranged perpendicularly to the guide shaft 41 and the rotating shaft 211, respectively, one end of the second elastic member 52 is connected to the bottom of the connecting piece 13, and the other end is connected to the balancing shaft 51.

[0057] In the head binding device 10 provided by the embodiment of the application, the balancing shaft 51 and the second elastic member 52 are arranged outside the working assembly 2, one end of the second elastic member 52 is connected to the bottom of the connecting piece 13, the other end of the second elastic member 52 is connected to the balancing shaft 51, the balancing shaft 51 is arranged in the hollow channel 213, and is arranged perpendicularly to the guide shaft 41 and the rotating shaft 211, respectively, that is, the acting force of the second elastic member 52 can drive the balancing shaft 51 to move, thereby driving the rotating shaft 211 to elastically reset in the vertical direction, and balancing the self-weight of the rotating shaft 211 and the self-weight of the load located above the rotating shaft 211.

[0058] The hollow channel 213 is integrated with the balance shaft 51, the guide shaft 41 and the guide bearing 42, so that the structure of the guide assembly 4 is more compact, the external space of the head binding device 10 is not additionally occupied, the miniaturization and integration design of the head binding device 10 are facilitated, the centralized layout of the components facilitates the later maintenance and replacement, and the maintenance cost of the head binding device 10 is further reduced.

[0059] Further, the rotating shaft 211 is provided with a placing groove 2112, the bottom end of the first elastic member 22 abuts against the bottom wall of the placing groove 2112, the side edge of the first elastic member 22 abuts against the side wall of the placing groove 2112, and the top end of the first elastic member 22 abuts against the outer bottom wall of the rotating seat 21. Understandably, the first elastic member 22 is arranged in the placing groove 2112 formed in the rotating shaft 211, the bottom end of the first elastic member 22 is connected with the rotating shaft 211, the top end of the first elastic member 22 is connected with the rotating seat 21, and the rotating shaft 211 and the rotating seat 21 can relatively slide through the first elastic member 22.

[0060] In some embodiments, the first elastic member 22 is a compression spring, and the second elastic member 52 is a tension spring. The embodiment of the present application can expand the adjustable range of the fitting pressing force and ensure the high-precision requirement of the chip mounting force by adopting the compression spring as the driving force of the fitting pressing force and matching the tension spring weight ratio.

[0061] Please refer to Figure 2 and Figure 4 The suction nozzle assembly 3 comprises a suction assembly 31 and a vacuum suction nozzle 32 connected to one end of the suction assembly 31, the other end of the suction assembly 31 is connected with the rotating shaft 211, and the vacuum suction nozzle 32 is at least partially transparent; wherein the suction assembly 31 comprises a gas path guide seat 311, a first transparent sealing member 312 and a sealing ring 313, the first transparent sealing member 312 is sealingly fixed between the gas path guide seat 311 and the rotating shaft 211, the end of the gas path guide seat 311 away from the first transparent sealing member 312 is detachably connected with the vacuum suction nozzle 32, and the sealing ring 313 is sleeved outside the first transparent sealing member 312.

[0062] In the head binding device 10 provided by the embodiment of the present application, the gas path guide seat 311 is responsible for adsorbing the vacuum suction nozzle 32, and the chip is adsorbed by the vacuum suction nozzle 32 to realize the picking and mounting of the chip.

[0063] It can be understood that by arranging the first transparent sealing member 312 and placing the first transparent sealing member 312 on the air path guide seat 311 away from the vacuum nozzle 32, the vacuum leakage can be prevented, the first transparent sealing member 312 is sealingly fixed between the air path guide seat 311 and the rotating shaft 211, and the feature recognition including the identification points of the chip and the mounting position can be performed by the correction device sequentially through the first cavity 11, the second cavity 2111 and the first transparent sealing member 312 before the chip mounting, thereby improving the mounting precision of the binding head device 10; the sealing ring 313 is sleeved outside the first transparent sealing member 312, the first transparent sealing member 312 is sealingly fixed between the air path guide seat 311 and the rotating shaft 211 through the sealing ring 313, so as to ensure that the first transparent sealing member 312 has good vacuum sealing property. The sealing ring 313 of the embodiment of the application can be a nano sealing ring, as an important sealing element, the main functions thereof include preventing the leakage or seepage of liquid or gas, maintaining the air pressure difference between the inside and the outside of the device or even a complete vacuum state, and preventing the entry of pollutants and dust.

[0064] In some embodiments, the first transparent sealing member 312 used in the binding head device 10 is high-transmittance glass, and the light transmittance is at least 99%, which meets the feature recognition of the chip and the mounting position identification points performed by the correction device, and further ensures the precision during the chip mounting.

[0065] In some embodiments, the vacuum nozzle 32 is partially transparent or completely transparent, when the vacuum nozzle 32 is partially transparent, the feature recognition of the correction device sequentially through the first cavity 11, the second cavity 2111 and the first transparent sealing member 312 is also met, that is, the transparent part of the vacuum nozzle 32 at least exposes the identification points of the chip and the mounting position thereof; the vacuum nozzle 32 of the embodiment of the application is completely transparent, so as to eliminate the visual error of the correction device, and the higher alignment precision can reduce the defects such as bridging, open circuit and false welding caused by mispositioning.

[0066] In some embodiments, the observation channel 321 penetrating through both ends in the vertical direction of the vacuum nozzle 32 is further arranged, the second transparent sealing member 322 is arranged on one side of the vacuum nozzle 32 close to the air path guide seat 311, and the second transparent sealing member 322 is sealingly fixed with the vacuum nozzle 32, so as to prevent the vacuum leakage from the observation channel 321 and affect the adsorption effect of the vacuum nozzle 32 and / or the chip; the observation channel 321 is arranged on the vacuum nozzle 32 in the embodiment of the application, and the identification features of the substrate to be aligned during the subsequent mounting can be observed by sequentially passing through the first cavity 11, the second cavity 2111, the adsorption assembly 31 and the observation channel 321.

[0067] Optionally, the binding head device 10 further comprises a device capable of replacing the vacuum suction nozzle 32, such as a suction nozzle rack assembly. The end of the air path guide seat 311 away from the first transparent sealing member 312 can be connected to vacuum suction nozzles 32 of different sizes, and the replacement of the vacuum suction nozzle 32 can be automatic or manual, which can be set according to actual conditions. By setting the suction nozzle rack assembly, different sizes of vacuum suction nozzles 32 can be replaced.

[0068] Please refer to Figure 1 , Figure 2 and Figure 5 , the binding head device 10 further comprises a ventilation assembly 6, the ventilation assembly 6 comprises a first air pipe joint 61 arranged on the air floating bearing 23, the first air pipe joint 61 is provided with a first air path opening 611, the first air path opening 611 is used for air inlet of the air floating bearing 23; the first air path opening 611 is in communication with the internal air path of the air floating bearing 23 through the first air pipe joint 61.

[0069] In the binding head device 10 provided by the embodiment of the application, the first air path opening 611 is arranged on the first air pipe joint 61, and the first air path opening 611 is in communication with the internal air path of the air floating bearing 23 through the first air pipe joint 61, so that stable air supply can be provided for the air floating bearing 23, and the normal work of the air floating bearing 23 is ensured to improve the movement precision of the rotating shaft 211.

[0070] It can be understood that the separate arrangement of the air inlet of the air floating bearing 23 can avoid mutual interference between the air inlet of the air floating bearing 23 and the vacuum air path of the suction nozzle assembly 3, and ensure the independence and stability of the respective air paths. The friction coefficient of the air floating bearing 23 is usually between 0.0001 and 0.0002. In the embodiment of the application, the air floating bearing 23 with low friction is used as the Z-axis guide of the rotating shaft 211, so that the influence of the Z-axis movement resistance on the pressing force of the rotating shaft 211 is reduced, and the pressing force precision of the binding head device 10 is further improved.

[0071] Further, the ventilation assembly 6 further comprises a second air pipe joint 62 and a third air pipe joint 63 arranged on the rotating shaft 211 close to one end of the vacuum suction nozzle 32, the second air pipe joint 62 is provided with a second air path opening 621, and the third air pipe joint 63 is provided with a third air path opening 631; wherein the second air path opening 621 is in communication with the outside through the internal air paths of the rotating shaft 211, the air path guide seat 311 and the vacuum suction nozzle 32 in sequence, forming a suction nozzle adsorption air path; the third air path opening 631 is in communication with the outside through the internal air paths of the rotating shaft 211, the air path guide seat 311 and the vacuum suction nozzle 32 in sequence, forming a material adsorption air path.

[0072] The second air path opening 621 is in turn communicated with the outside through the rotating shaft 211, the air path guide seat 311 and the internal air path of the vacuum suction nozzle 32, and forms a suction nozzle adsorption air path. The second air path opening 621 can extract vacuum for the vacuum suction nozzle 32, reduces the influence of the suction nozzle vacuum air path on the mounting force control process, and avoids the deviation of the vacuum suction nozzle 32 when picking up and mounting the chip. Through this design, on the one hand, the sealing of the vacuum extraction for the vacuum suction nozzle 32 can be ensured, so as to ensure the stability of the chip adsorption when the vacuum suction nozzle 32 picks up and mounts the chip, and the stability and reliability of the binding head device 10 are improved. On the other hand, the vacuum suction nozzle 32 and the rotating shaft 211 can be kept relatively stationary, so that the chip and the substrate are not affected by the suction nozzle adsorption air path when they are in contact, thereby avoiding errors.

[0073] Understandably, the third air path opening 631 is in turn communicated with the outside through the rotating shaft 211, the air path guide seat 311 and the internal air path of the vacuum suction nozzle 32, and forms a material adsorption air path. The third air path opening 631 can make the chip stably adhere to the working end of the vacuum suction nozzle 32, and then realize the picking up and mounting of the chip by the vacuum suction nozzle 32, and can better adjust the mounting angle when mounting the chip. Through this design, the rigidity of the binding head device 10 for deep cavity mounting of the chip can be ensured, and the high precision requirement of the chip mounting position can be met.

[0074] It should be noted that the suction nozzle adsorption air path and the material adsorption air path are not communicated with each other, that is, the air paths for adsorbing the vacuum suction nozzle 32 and adsorbing the chip are independent of each other, so as to realize the adsorption of the vacuum suction nozzle 32 and the adsorption of the chip by the vacuum suction nozzle 32, respectively. Specifically, when the vacuum suction nozzle 32 and the air path guide seat 311 are in contact and the internal communication therebetween is realized, the second air pipe joint 62 is sealingly connected with an external air extraction device, the air extraction device is opened to continuously extract air from the suction nozzle adsorption air path, the gas in the internal air path of the rotating shaft 211, the air path guide seat 311 and the vacuum suction nozzle 32 is extracted, so that there is a pressure difference between the inside of the vacuum suction nozzle 32 and the outside atmosphere, and finally the stable connection of the vacuum suction nozzle 32 and the air path guide seat 311 is realized, so as to realize the picking up and mounting of the chip in the subsequent process, to ensure the rigidity of the deep cavity mounting and meet the high precision requirement of the chip mounting position. Similarly, the chip can be stably attached to the working end of the suction nozzle, that is, the third air pipe joint 63 is sealingly connected with another external air extraction device, and the air extraction device is opened to continuously extract air from the material adsorption air path, so as to extract the gas in the internal air path of the material adsorption air path.

[0075] In some embodiments, the first air pipe joint 61 is arranged on the outer circumferential surface of the air floating bearing 23, and the second air pipe joint 62 and the third air pipe joint 63 are arranged on the outer circumferential surface of the rotating shaft 211; wherein the first air pipe joint 61 needs to be sealedly connected with an external air supply device, and the second air pipe joint 62 and the third air pipe joint 63 need to be sealedly connected with different air exhaust devices, respectively; the rotation angle of the rotating motor 12 is limited to 0°-240° by cooperation of the first limiting block 141 and the second limiting block 131 to control the rotation range of the suction nozzle assembly 3, and under the premise that the rotation angle meets the mounting requirements, the wire winding between the air pipes of the head binding device 10 can be avoided, thereby affecting the safety and stability of the head binding device 10.

[0076] Please refer to Figure 2 and Figure 5 The head binding device 10 further comprises a force control detection assembly 7, which comprises a position sensor 71 and a magnetic piece 72 in cooperation; the outer surface of the rotating seat 21 is provided with a first positioning piece 212, and the outer surface of the rotating shaft 211 is provided with a second positioning piece 2113, the first positioning piece 212 is arranged in the vertical direction corresponding to the second positioning piece 2113 and there is a gap; the position sensor 71 is installed on the first positioning piece 212, the magnetic piece 72 is installed on the second positioning piece 2113, and the magnetic piece 72 is arranged corresponding to the working end of the position sensor 71.

[0077] In the head binding device 10 provided by the embodiments of the present application, the outer surface of the rotating seat 21 and the outer surface of the rotating shaft 211 are respectively provided with the first positioning piece 212 and the second positioning piece 2113, the position sensor 71 is installed on the first positioning piece 212, and the magnetic piece 72 is installed on the second positioning piece 2113, so that the in-place detection when the head binding device 10 is pressed to make the chip contact with the substrate can be realized by cooperation of the position sensor 71 and the magnetic piece 72.

[0078] It can be understood that, compared with the ordinary photoelectric sensor, the position sensor 71 has smaller volume and faster response speed, the non-contact sensing measurement method also has the characteristics of high sensitivity and anti-electromagnetic interference, no physical wear risk, and long service life; the position sensor 71 and the magnetic piece 72 have small structure volume and flexible installation, do not need to occupy a large amount of space of the head binding device 10, are conducive to the overall miniaturization design of the device, and also ensure the in-place detection accuracy when the chip contacts with the substrate.

[0079] It should be noted that in the prior art, when the chip contacts the substrate, a sensor is usually arranged at the side of the suction nozzle to detect the height variation of the suction nozzle to determine whether the chip contacts the substrate, which has many defects: on the one hand, the detection at the side of the suction nozzle will occupy the actual mounting space, and the efficiency of mounting the chip to the substrate is affected; on the other hand, when facing the mounting of multiple chip types, different suction nozzles of different sizes and lengths need to be replaced, and the detection reference of the sensor needs to be adjusted again after each replacement of the suction nozzle, so that the detection accuracy of the height variation of the suction nozzle is affected.

[0080] However, compared with the prior art, when the chip contacts the substrate, the rotating shaft 211 slides upward relative to the rotating seat 21, so that the second positioning member 2113 and the magnetic member 72 also move upward synchronously, and the position sensor 71 detects the magnetic member 72 to realize the in-place detection, which will not occupy the actual mounting space near the working end of the rotating shaft 211, and will not be affected by different types of suction nozzles, thereby ensuring the mounting efficiency, improving the detection accuracy when the chip contacts the substrate, and avoiding the situation that the chip is damaged by overpressure or the chip is not well mounted due to underpressure.

[0081] The position sensor 71 of the embodiment of the present application is a Hall element, and the magnetic member 72 is a magnet, so that the Hall element can induct the magnet to realize the in-place detection when the chip contacts the substrate; it can be understood that the position sensor 71 also includes but is not limited to a fiber sensor, a laser ranging sensor, a grating sensor, an infrared sensor, a capacitive sensor and an inductive sensor, and the type of the magnetic member 72 can be matched according to different position sensors 71, which will not be described here.

[0082] Please refer to Figure 1 and Figure 6 The embodiment of the present application also provides a correction mounting system 20 for correcting the angle of the chip during picking up and mounting, and the correction mounting system 20 comprises a visual correction assembly 8 and the above-mentioned binding head device 10.

[0083] It can be understood that the visual correction assembly 8 is arranged at one end of the first cavity 11 away from the suction nozzle assembly 3, and is responsible for real-time alignment correction of the upper surface of the chip and the mounting position recognition point during mounting of the chip.

[0084] The working flow of the correction mounting system 20 is as follows: the main body of the correction mounting system 20 controls the lowering of the binding head device 10, and when the vacuum suction nozzle 32 contacts the chip, the material vacuum is opened through the material suction air path, and after the vacuum suction nozzle 32 ensures stable adsorption of the chip, the main body of the correction mounting system 20 controls the lifting of the binding head device 10; after the binding head device 10 and the visual correction assembly 8 move above the mounting position, the main body of the correction mounting system 20 controls the lowering of the binding head device 10 again until it approaches the mounting position, real-time alignment is performed by the visual correction assembly 8, the mounting position is corrected according to the identification of the visual correction assembly 8, and after the correction is completed, the binding head device 10 is slightly pressed down to complete the chip mounting, the binding head device 10 is lifted after the material vacuum is closed, and one mounting action is completed.

[0085] It should be noted that the correction mounting system 20 of the embodiment of the present application has the same beneficial effects as the above-mentioned binding head device 10, which will not be repeated here.

[0086] Please refer to Figure 1 and Figure 7 The embodiment of the present application also provides a die bonding equipment 30, which comprises the above-mentioned binding head device 10. It should be noted that the die bonding equipment 30 has the same beneficial effects as the above-mentioned binding head device 10, which will not be repeated here.

[0087] The above describes a binding head device, a correction mounting system and a die bonding equipment disclosed by the embodiment of the present application in detail, and the principles and implementation modes of the present application are described by applying specific examples in this paper. The above description of the embodiments is only used to help understand the method of the present application and its core idea. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed, and the above description of the present application should not be understood as a limitation. Any modification, equivalent replacement and improvement within the principles of the present application should be included in the protection scope of the present application.

Claims

1. A bonding device for picking up chips and mounting them onto a substrate, characterized in that, The head binding device comprises a driving assembly, a working assembly and a suction nozzle assembly, two ends of the working assembly are connected with the driving assembly and the suction nozzle assembly respectively; The working assembly comprises a rotating seat, a first elastic member and an air floating bearing, a rotating shaft is arranged in the rotating seat, the rotating shaft is slidably installed in the rotating seat, two ends of the rotating shaft are a transmission end and a working end respectively, the transmission end of the rotating shaft is connected with the driving assembly, and the working end of the rotating shaft is connected with the suction nozzle assembly; The driving assembly and the rotating shaft are respectively provided with a first cavity and a second cavity penetrating and communicating, the air floating bearing is sleeved on the rotating shaft, the outer side of the air floating bearing abuts against the inner wall surface of the rotating seat, one end of the first elastic member abuts against the rotating shaft, and the other end abuts against the rotating seat, and the first elastic member is elastically deformed when the rotating shaft and the rotating seat slide relative to each other.

2. The head binding device according to claim 1, wherein: The head binding device further comprises a guide assembly, the guide assembly comprises a guide shaft, a guide bearing and a guide block, one end of the guide shaft is fixed to the rotating shaft, the guide bearing is sleeved on the other end of the guide shaft, the guide shaft and the first elastic member are respectively arranged on two sides of the rotating shaft in the length direction, the guide shaft is arranged perpendicularly to the rotating shaft, the first elastic member is arranged parallel to the rotating shaft, and the deformation direction of the first elastic member is the same as the sliding direction of the rotating shaft; A hollow channel penetrating in the horizontal direction is arranged on the rotating seat, the guide shaft and the guide bearing are located in the hollow channel, the length of the hollow channel in the vertical direction is greater than the outer diameter of the guide bearing, the guide block is fixedly arranged on the rotating seat, the guide block abuts against the outer ring of the guide bearing, and the guide bearing can slide relative to the guide block when the rotating shaft and the rotating seat slide relative to each other.

3. The head binding device according to claim 2, wherein: The driving assembly comprises a hollow rotary motor and a connecting piece, a fixed seat is arranged between the rotary motor and the connecting piece, the rotary motor is installed on the fixed seat, and the rotary motor, the fixed seat and the connecting piece are arranged in sequence; One side of the fixed seat facing the connecting piece is provided with a first limiting block, the outer peripheral surface of the connecting piece is provided with a second limiting block, and the first limiting block and the second limiting block are matched when the rotary motor works, so that the rotation angle range of the rotary motor driven by the rotary motor is 0°-240°.

4. The head binding device according to claim 3, wherein: The head binding device further comprises a self-weight balance assembly, the self-weight balance assembly comprises a balance shaft and a second elastic member, the balance shaft is arranged penetratingly in the hollow channel, and is arranged perpendicularly to the guide shaft and the rotating shaft respectively, one end of the second elastic member is connected with the bottom of the connecting piece, and the other end is connected with the balance shaft. The rotating shaft is provided with a placing groove, a bottom end of the first elastic member abuts against a bottom wall of the placing groove, a side edge of the first elastic member abuts against a side wall of the placing groove, and a top end of the first elastic member abuts against an outer bottom wall of the rotating seat. The first elastic member is a compression spring, and the second elastic member is a tension spring.

5. The head binding device according to claim 1, wherein: the suction nozzle assembly comprises a suction assembly and a vacuum suction nozzle connected to one end of the suction assembly, the other end of the suction assembly is connected to the rotating shaft, and the vacuum suction nozzle is at least partially transparent; the suction assembly comprises a gas path guide seat, a first transparent sealing member, and a sealing ring, the first transparent sealing member is sealingly fixed between the gas path guide seat and the rotating shaft, one end of the gas path guide seat away from the first transparent sealing member is detachably connected to the vacuum suction nozzle, and the sealing ring is sleeved on the outside of the first transparent sealing member.

6. The head binding device according to claim 5, wherein: the head binding device further comprises a ventilation assembly, the ventilation assembly comprises a first air pipe joint arranged on the air floating bearing, the first air pipe joint is provided with a first gas path opening, and the first gas path opening is used for air inlet of the air floating bearing; the first gas path opening is in communication with the internal gas path of the air floating bearing through the first air pipe joint.

7. The head binding device according to claim 6, wherein: the ventilation assembly further comprises a second air pipe joint and a third air pipe joint arranged on the rotating shaft near one end of the vacuum suction nozzle, the second air pipe joint is provided with a second gas path opening, and the third air pipe joint is provided with a third gas path opening; the second gas path opening is in communication with the outside through the internal gas paths of the rotating shaft, the gas path guide seat, and the vacuum suction nozzle in sequence, forming a suction nozzle suction gas path; the third gas path opening is in communication with the outside through the internal gas paths of the rotating shaft, the gas path guide seat, and the vacuum suction nozzle in sequence, forming a material suction gas path; the suction nozzle suction gas path and the material suction gas path are not in communication with each other.

8. The head binding device according to claim 1, wherein: the head binding device further comprises a force control detection assembly, the force control detection assembly comprises a position sensor and a magnetic member in cooperation; an outer surface of the rotating seat is provided with a first positioning member, an outer surface of the rotating shaft is provided with a second positioning member, the first positioning member is arranged in the vertical direction corresponding to the second positioning member and there is a gap, the position sensor is installed on the first positioning member, the magnetic member is installed on the second positioning member, and the magnetic member is arranged corresponding to the working end of the position sensor.

9. A correction mounting system for correcting the angle of a chip when picking up and mounting, characterized in that, The correction mounting system comprises a visual correction assembly and the head binding device according to any one of claims 1-8, and the visual correction assembly is arranged at one end of the first cavity away from the suction nozzle assembly.

10. A die bonding apparatus, characterized in that, The die bonding device comprises the head binding device according to any one of claims 1-8.

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