Light-emitting substrate and display device

Abstract

The invention provides a light-emitting substrate and a display device. The light-emitting substrate comprises a substrate body (1), a bearing base (4), a light-emitting chip (2) and protection glue (3). The bearing base (4) is arranged on one side of the base plate (1), and a first through hole is formed in the bearing base (4); the light-emitting chip (2) is arranged on the substrate (1) and located in the first through hole. The protection glue (3) is arranged on the side, away from the substrate (1), of the light-emitting chip (2), the protection glue (3) is arranged to package the light-emitting chip (2), the end face, away from the substrate (1), of the protection glue (3) is a top face, and the orthographic projection, on the substrate (1), of the circumferential edge of the top face is arranged to be overlapped with the orthographic projection, on the substrate (1), of the bearing substrate (4). According to the light-emitting substrate, the height, namely H, of the protection glue can be effectively increased, the light uniformizing capacity is improved, the backlight light mixing distance is reduced, the module thickness is effectively reduced, meanwhile, the number of used light-emitting chips can be reduced, and therefore the cost is reduced.

Description

Light-emitting substrate and display device Technical Field

[0001] This disclosure relates to, but is not limited to, the field of display technology, and particularly to a light-emitting substrate and a display device. Background Technology

[0002] Display panels with sub-millimeter light-emitting diodes (mini LEDs) are high-performance display devices. Their main principle is to reduce the size of the light-emitting diode (LED) chips within the backlight, allowing the display device to accommodate more LED chips, thereby achieving high brightness and high dynamic range. Currently, the light uniformity of mini LED backlight products is not ideal, and the light mixing distance is relatively large.

[0003] Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] This disclosure provides a light-emitting substrate, including a substrate, a supporting substrate, a light-emitting chip, and a protective adhesive;

[0006] The supporting base is disposed on one side of the substrate, and the supporting base is provided with a first through hole, which penetrates the supporting base in a direction perpendicular to the substrate.

[0007] The light-emitting chip is disposed on the substrate and located within the first through hole;

[0008] The protective adhesive is disposed on the side of the light-emitting chip away from the substrate, and the protective adhesive is configured to encapsulate the light-emitting chip;

[0009] The end face of the protective adhesive away from the substrate is the top surface, and the orthographic projection of the circumferential edge of the top surface onto the substrate is set to overlap with the orthographic projection of the supporting substrate onto the substrate.

[0010] In some exemplary embodiments, the top surface includes a first spherical surface that protrudes toward a side away from the substrate, the first spherical surface extending from the edge of the substrate to the end face of the supporting substrate away from the substrate, and the edge of the first spherical surface near the substrate forming the circumferential edge of the top surface;

[0011] The orthographic projection of the circumferential edge of the top surface onto the substrate lies within the orthographic projection of the supporting base onto the substrate.

[0012] In some exemplary embodiments, the supporting substrate is configured as annular and surrounds the light-emitting chip, and the space enclosed by the annular supporting substrate constitutes the first through hole.

[0013] In some exemplary embodiments, the orthographic projection of the supporting substrate onto the substrate is configured as an annular shape, an elliptical annular shape, a polygonal annular shape, a fan-shaped annular shape, or an arc-shaped annular shape.

[0014] In some exemplary embodiments, the supporting substrate includes a first end face and a first inclined surface, the first end face being located on the side of the supporting substrate away from the substrate, and the first end face being configured as an arc surface or a plane;

[0015] The first inclined surface is located on the side of the supporting substrate closer to the light-emitting chip, and the end of the first inclined surface away from the substrate is inclined towards the side away from the light-emitting chip.

[0016] In some exemplary embodiments, multiple light-emitting chips and multiple supporting substrates are provided, with each supporting substrate corresponding to a light-emitting chip, and the multiple supporting substrates are arranged in an array in a direction parallel to the substrate.

[0017] In some exemplary embodiments, the orthographic projection of the supporting substrate on the substrate is a first projection, and the orthographic projection of the light-emitting chip on the substrate is a second projection, wherein the first projection is located on the outer periphery of the second projection;

[0018] The minimum distance between the side of the first projection closest to the second projection and the side furthest from the second projection is L2, where L2 is greater than or equal to 1 mm.

[0019] In some exemplary embodiments, the light-emitting chip is arranged centrally in the first through hole in a direction parallel to the substrate, and the geometric center distance between the orthographic projections of two adjacent light-emitting chips on the substrate is L3, where L3 is greater than or equal to 5 mm.

[0020] In some exemplary embodiments, the minimum distance between the light-emitting chip and the wall of the first through hole is set to L4, where L4 is greater than or equal to 1 mm.

[0021] In some exemplary embodiments, the diameter of the first sphere is D, the maximum distance between the first sphere and the substrate is H, and the ratio of D to H is not greater than 3.5.

[0022] In some exemplary embodiments, 2 ≤ D / H ≤ 3.5.

[0023] In some exemplary embodiments, the maximum distance between the end of the supporting substrate away from the substrate and the substrate is L1, wherein the ratio of H to L1 is not less than 2 and not greater than 6.

[0024] In some exemplary embodiments, 2≤D≤2.5mm, 0.6mm≤H≤1mm, and 0.1mm≤L1≤0.5mm.

[0025] In some exemplary embodiments, the substrate includes a substrate, a circuit structure layer and a reflective layer stacked sequentially, and the reflective layer is provided with a second through-hole;

[0026] The light-emitting chip is disposed in the second through-hole and is connected to the circuit structure layer;

[0027] The supporting substrate is located on the side of the reflective layer away from the circuit structure layer and is disposed along the edge of the second through hole, and the supporting substrate covers the hole wall of the second through hole.

[0028] In some exemplary embodiments, the end face of the protective adhesive away from the substrate is provided with a reflective pattern.

[0029] In some exemplary embodiments, the material of the supporting substrate includes white glue or transparent glue.

[0030] This disclosure provides a display device, which includes the above-described light-emitting substrate.

[0031] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood.

[0032] Overview of the attached figures

[0033] The accompanying drawings are used to provide an understanding of the technical solutions of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure.

[0034] Figure 1 is a schematic diagram of the relevant light-emitting substrate;

[0035] Figure 2 is a schematic diagram of a light-emitting substrate in this exemplary embodiment;

[0036] Figure 3 is a schematic diagram of the AA-direction section in Figure 2;

[0037] Figure 4 is a cross-sectional view of a supporting base according to this exemplary embodiment;

[0038] Figure 5 is a cross-sectional view along the BB direction in Figure 2;

[0039] Figure 6 is a schematic diagram of another supporting base of this exemplary embodiment;

[0040] Figure 7 is a schematic diagram of another support substrate of this exemplary embodiment;

[0041] Figure 8 is a schematic diagram of another support substrate of this exemplary embodiment;

[0042] Figure 9 is a schematic diagram of a light-emitting chip according to an exemplary embodiment of this invention;

[0043] Figure 10 is a schematic projection of a light-emitting substrate according to an exemplary embodiment of the present invention;

[0044] Figure 11 is a schematic diagram of another light-emitting substrate according to this exemplary embodiment;

[0045] Figure 12 is a schematic diagram of another light-emitting substrate of this exemplary embodiment;

[0046] Figure 13 is a schematic diagram of another light-emitting substrate according to this exemplary embodiment;

[0047] Figure 14 is a schematic diagram of a circuit structure layer of this exemplary embodiment;

[0048] Figure 15 is a schematic diagram of a display device according to this exemplary embodiment.

[0049] Explanation of reference numerals in the attached drawings: 1-Substrate; 2-Light-emitting chip; 3-Protective adhesive; 4-Supporting substrate; 5-First through-hole; 6-First spherical surface; 7-First inclined surface; 8-First arc surface; 9-Light-emitting side; 10-First end face; 11-Second inclined surface; 12-Substrate; 13-Film material; 14-Display panel; 15-Top surface; 16-First edge; 17-Circuit structure layer; 18-Reflective layer; 19-Second through-hole; 20-First conductive layer; 21-Second conductive layer; 22-Buffer layer; 23-Protective layer.

[0050] Detailed Explanation

[0051] To make the objectives, technical solutions, and advantages of this disclosure clearer, embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. Note that the implementation methods can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be varied in various forms without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the content described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0052] The scale of the accompanying drawings in this disclosure can be used as a reference in actual manufacturing processes, but is not limited thereto. For example, the aspect ratio of the channel, the thickness and spacing of each film layer, and the width and spacing of each signal line can be adjusted according to actual needs. The number of pixels in the display panel and the number of sub-pixels in each pixel are not limited to the quantities shown in the figures. The accompanying drawings described in this disclosure are merely structural schematic diagrams, and one aspect of this disclosure is not limited to the shapes or values ​​shown in the figures.

[0053] The ordinal numbers “first,” “second,” and “third” used in this specification are used to avoid confusion among the constituent elements, not to limit their quantity.

[0054] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of each constituent element being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0055] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the specific meaning of these terms in this disclosure based on the specific circumstances.

[0056] In this specification, "electrical connection" includes the situation where components are connected together by elements that have a certain electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission and reception of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with various functions.

[0057] In this specification, "parallel" refers to two straight lines forming an angle of -10° or more and less than 10°, and therefore also includes angles of -5° or more and less than 5°. Similarly, "perpendicular" refers to two straight lines forming an angle of 80° or more and less than 100°, and therefore also includes angles of 85° or more and less than 95°.

[0058] In this specification, the terms "film" and "layer" may be interchanged. For example, "conductive layer" may sometimes be replaced with "conductive film." Similarly, "insulating film" may sometimes be replaced with "insulating layer."

[0059] In this specification, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined; they can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons. Small deformations due to tolerances are possible, as are chamfers, curved edges, and other variations.

[0060] In the embodiments of this disclosure, "about" means a value that is not strictly limited and is within the range of process and measurement errors.

[0061] Figure 1 is a schematic diagram of the relevant light-emitting substrate. Currently, the light-emitting substrate shown in Figure 1 typically includes a substrate 1, a light-emitting chip 2 and a protective adhesive 3 disposed on the substrate 1. The protective adhesive 3 encapsulates the light-emitting chip 2. During the fabrication of the light-emitting substrate, the protective adhesive 3 is formed on the substrate 1 through a dispensing process, with the bottom of the protective adhesive 3 contacting the light-emitting chip 2 and the substrate 1. The applicant has found that the light uniformity of the light-emitting substrate is related to the morphology of the protective adhesive 3. The morphology of the protective adhesive 3 includes its height H and its diameter D. The height H is the maximum dimension between the end of the protective adhesive 3 furthest from the substrate 2 and the end face of the substrate 3 closest to the protective adhesive 3. The diameter D of the protective adhesive 3 is the diameter of the arc surface formed by its outer surface, with the first direction perpendicular to the substrate 1. However, the morphology of the protective adhesive 3 is limited by the physicochemical properties of the protective adhesive 3 itself and the limitations of the dispensing process. Usually, the ratio of D to H is greater than 3.5. Under the structure shown in Figure 1, it is impossible to form a smaller D / H ratio, thus failing to achieve the ideal light uniformity.

[0062] Figure 2 is a schematic diagram of a light-emitting substrate according to this exemplary embodiment, and Figure 3 is a cross-sectional view along direction AA in Figure 2. This exemplary embodiment provides a light-emitting substrate. As shown in Figures 2 and 3, the light-emitting substrate may include a substrate 1, a supporting substrate 4, a light-emitting chip 2, and a protective adhesive 3. The supporting substrate 4 may be disposed on one side of the substrate 1, and a first through hole 5 may be provided on the supporting substrate 4. The light-emitting chip 2 may be disposed on the substrate 1 and located within the first through hole 5. The protective adhesive 3 may be disposed on the side of the light-emitting chip 2 away from the substrate 1, and the protective adhesive 3 may encapsulate the light-emitting chip 2. The end face of the protective adhesive 3 away from the substrate 1 is a top surface 15, and the orthographic projection of the circumferential edge (i.e., the first edge 16) of the top surface 15 onto the substrate 1 may overlap with the orthographic projection of the supporting substrate 4 onto the substrate 1. Thus, the light-emitting substrate of this example can improve the light uniformity of the lamp board, reduce the light mixing distance, reduce the number of light-emitting chips 2 used, and reduce costs.

[0063] In some exemplary embodiments, as shown in Figures 2 and 3, the light-emitting chip 2 may be a mini-LED, which may be a square or near-square chip, die-bonded on the substrate 1. The light-emitting chip 2 may include a light-transmitting substrate (not shown) and a semiconductor stack-up structure (not shown) on the light-transmitting substrate (not shown). The light-transmitting substrate (not shown) may include, but is not limited to, sapphire. In addition to an insulating substrate, the light-transmitting substrate (not shown) may be a conductive substrate or a semiconductor substrate that ensures light transmission characteristics.

[0064] In some exemplary embodiments, as shown in Figures 2 and 3, the substrate 1 may be provided with multiple connection pads (not shown in the figures). These connection pads can be connected to the N-pins or P-pins of the light-emitting chip 2, forming the light-emitting chip 2 and the substrate 1. Circuit patterns connected to each connection pad are formed on the substrate 1 to connect the multiple light-emitting chips 2 in series and / or in parallel. The light-emitting chips 2 can be electrically connected to the substrate 1 via a soldering process, a die-bonding process, or other die-bonding methods. The substrate 1 can be configured to block visible light, being non-transparent to visible light. When the substrate 1 blocks visible light, it can suppress light from entering the active device formed on the substrate 1 from the outside. The active device can be a transistor. However, it is not limited to this; for example, the substrate 1 can also be transparent to visible light. The substrate 1 may include any one of glass substrates, quartz substrates, sapphire substrates, ceramic substrates, etc., or a semiconductor substrate. The semiconductor substrate may be any one of single-crystal semiconductor substrates or polycrystalline semiconductor substrates made of materials such as silicon or silicon carbide, compound semiconductor substrates such as silicon-germanium, SOI (Silicon on Insulator) substrates, etc. The material of the substrate 1 may also include epoxy resin, triazine, silicone resin, or polyimide organic resin materials. However, it is not limited to these. For example, the substrate 1 may be a printed circuit board, or it may be a flexible circuit board, a light board, a light strip, a comb, etc., that is easily deformable.

[0065] Figure 4 is a cross-sectional view of a support substrate according to an exemplary embodiment of this invention. In some exemplary embodiments, as shown in Figures 2 to 4, the support substrate 4 may be a mesh adhesive, and the material may include white adhesive or transparent adhesive. In this example, the support substrate 4 may be white adhesive. A support substrate 4 made of white adhesive can improve the light efficiency of the light-emitting substrate, but it is not limited to this. For example, the support substrate 4 may be transparent adhesive. The support substrate 4 is located on one side of the substrate 1 in the first direction, that is, the support substrate 4 is located on the light-emitting side 9 of the substrate 1. The support substrate 4 defines a first through-hole 5, which forms a space to accommodate the light-emitting chip 2. The protective adhesive 3 can encapsulate and protect the light-emitting chip 2. Adjacent light-emitting chips 2 are separated by the support substrate 4, which can solve the problem of light crosstalk between adjacent light-emitting chips 2. The support substrate 4 can be divided into multiple regions, and each first through-hole 5 can be a sub-pixel. In addition, the support substrate 4 can focus the light emitted from the light-emitting chip 2, increase the light output of the light-emitting substrate, further improve the light utilization rate of the light-emitting substrate, and reduce power consumption. When preparing the substrate 4, white glue can be applied to the substrate 1 first, and then baked and pre-cured to form the substrate 4. The second direction (X) and the third direction (Y) are both perpendicular to the first direction, and the second direction (X) is perpendicular to the third direction (Y).

[0066] Figure 5 is a schematic cross-sectional view along the BB direction in Figure 2. In some exemplary embodiments, as shown in Figures 2 to 5, there may be multiple supporting substrates 4, which are spaced apart in a direction parallel to the substrate 1. Multiple light-emitting chips 2 are provided, with each supporting substrate 4 corresponding to a light-emitting chip 2. The supporting substrate 4 can be disposed on the outer periphery of the light-emitting chip 2 and form a ring. The space enclosed by the supporting substrate 4 constitutes a first through-hole 5. The light-emitting chips 2 are arranged in an array in a direction parallel to the substrate 1, that is, multiple light-emitting chips 2 are arranged in an array on a plane formed by the second direction (X) and the third direction (Y). The light-emitting chips 2 can be centrally arranged in the space enclosed by the supporting substrate 4 in a direction parallel to the substrate 1, forming the first through-hole 5. Because the light-emitting chips 2 are arranged in an array, both the supporting substrate 4 and the first through-hole 5 can be arranged in an array in a direction parallel to the substrate 1. The supporting substrate 4 is formed into a ring, such that the cross-section of the first through hole 5 in the direction parallel to the substrate 1 is circular, and the orthographic projection of the first through hole 5 on the substrate 1 is circular. However, it is not limited to this; for example, the supporting substrate 4 can be formed into an elliptical ring, a fan-shaped ring, or a polygonal ring, such that the cross-section of the first through hole 5 in the direction parallel to the substrate 1 is elliptical, fan-shaped, or polygonal, etc. In some exemplary embodiments, as shown in Figures 2 to 5, the surface of the supporting substrate 4 may include a first end face 10, a first inclined surface 7, and a second inclined surface 11. The first end face 10 is located on the side of the supporting substrate 4 away from the substrate 1, and the first end face 10 may be an arc surface. The first inclined surface 7 is located on the side of the supporting substrate 4 close to the light-emitting chip 2, and the end of the first inclined surface 7 away from the substrate 1 may be inclined towards the side away from the light-emitting chip 2. The second inclined surface 11 is located on the side of the supporting substrate 4 away from the light-emitting chip 2, and the end of the second inclined surface 11 away from the substrate 1 may be inclined towards the side close to the light-emitting chip 2. A first inclined surface 7, a first end face 10, and a second inclined surface 11 are connected in sequence. The end of the first inclined surface 7 away from the first end face 10 extends to the substrate 1, and the end of the second inclined surface 11 away from the first end face 10 also extends to the substrate 1. The first end face 10, the first inclined surface 7, and the second inclined surface 11 can all be arc-shaped with the same curvature, so that the first end face 10, the first inclined surface 7, and the second inclined surface 11 form a first arc surface 8. The first arc surface 8 protrudes away from the substrate 1, and the diameter of the first arc surface 8 is D1. The first inclined surface 7 can form the wall of the first through hole 5, and the cross-section supporting the substrate 4 is arc-shaped.

[0067] In some exemplary embodiments, as shown in Figures 2 to 5, the height of the support substrate 4 can be L1, and the maximum distance between the first end face 10 and the end face of the substrate 1 facing the support substrate 4 is L1, wherein 0.1mm≤L1≤0.5mm. If the support substrate 4 is made of a high-viscosity material, the value of L1 can be increased, which can effectively increase the height of the support substrate 4.

[0068] In some exemplary embodiments, as shown in Figures 2 to 5, since the end of the first inclined surface 7 away from the substrate 1 can be tilted away from the light-emitting chip 2, that is, the end of the hole wall of the first through hole 5 away from the substrate 1 can be tilted away from the light-emitting chip 2, the opening area (S) of the first through hole 5 is set to gradually increase from the substrate 1 towards the protective adhesive 3 in the direction perpendicular to the substrate 1 (first direction). The opening area (S) of the first through hole 5 can be the cross-section of the first through hole 5 in the direction parallel to the substrate 1. The first through hole 5 is formed in a trumpet shape. Therefore, the trumpet-shaped first through hole 5 can focus the light emitted from the light-emitting chip 2, increase the light output of the light-emitting substrate, further improve the light utilization rate of the light-emitting substrate, and reduce power consumption.

[0069] Figure 6 is a schematic diagram of another supporting substrate according to this exemplary embodiment. In some exemplary embodiments, as shown in Figure 6, multiple supporting substrates 4 are arranged in an array on the plane formed by the second direction (X) and the third direction (Y). The supporting substrates 4 are elliptical in shape on the plane formed by the second direction (X) and the third direction (Y), and the first through hole 5 is also elliptical, so that the orthographic projection of the first through hole 5 on the substrate is elliptical, that is, the cross-section of the first through hole 5 on the plane formed by the second direction (X) and the third direction (Y) is elliptical. However, it is not limited to this. For example, the cross-section of the first through hole 5 on the plane formed by the second direction (X) and the third direction (Y) can be fan-shaped or arc-shaped.

[0070] Figure 7 is a schematic diagram of another supporting substrate according to this exemplary embodiment. In some exemplary embodiments, as shown in Figure 7, multiple supporting substrates 4 are arranged in an array on a plane formed by the second direction (X) and the third direction (Y). The supporting substrates 4 are rectangular in shape on the plane formed by the second direction (X) and the third direction (Y). The first through hole 5 is enclosed in a rectangular shape, so that the orthographic projection of the first through hole 5 on the substrate is rectangular. That is, the cross-section of the first through hole 5 on the plane formed by the second direction (X) and the third direction (Y) is rectangular, and the corners of the rectangle can be rounded. However, it is not limited to this. For example, the cross-section of the first through hole 5 on the plane formed by the second direction (X) and the third direction (Y) can be a triangle, a pentagon, or a hexagon, or other polygons.

[0071] Figure 8 is a schematic diagram of another supporting substrate according to this exemplary embodiment. In some exemplary embodiments, as shown in Figure 8, the first end face 10 may be a plane, and the first end face 10 is parallel to the substrate 1. The height of the supporting substrate 4 may be the distance between the first end face 10 and the substrate 1.

[0072] Figure 9 is a schematic diagram of a light-emitting chip according to an exemplary embodiment of this invention. In some exemplary embodiments, as shown in Figures 2, 3, and 9, multiple light-emitting chips 2 may be provided, with the number of light-emitting chips 2 being the same as the number of first through holes 5. Multiple light-emitting chips 2 and multiple first through holes 5 correspond one-to-one, and the light-emitting chips 2 are located within the first through holes 5. The light-emitting chips 2 may be arranged centrally within the first through holes 5 in a direction parallel to the substrate 1, and there is a gap between the light-emitting chips 2 and the inner wall 8 of the first through holes 5. That is, on the plane formed by the second direction (X) and the third direction (Y), the light-emitting chips 2 are located at the center of the first through holes 5, such that the circumferential distance of the light-emitting chips 2 from the inner wall of the first through holes 5 on the plane formed by the second direction (X) and the third direction (Y) is L7. The minimum distance between the light-emitting chips 2 and the inner wall of the first through holes 5 may be set to L4, and the minimum distance between the light-emitting chips 2 and the hole wall of the first through holes 5 may be the distance between the first inclined surface 7 and the connection point of the substrate 1 and the light-emitting chips 2, wherein L4 is greater than or equal to 1 mm.

[0073] In some exemplary embodiments, as shown in Figures 2, 3, and 9, the distance between two adjacent light-emitting chips 2 in the second direction (X) is equal to the distance between two adjacent light-emitting chips 2 in the third direction (Y), and the distance between the geometric centroids of the orthographic projections of two adjacent light-emitting chips 2 in the second direction (X) is L3, wherein the value of L3 may be greater than or equal to 5 mm. However, this is not the only limitation; for example, the distance between two adjacent light-emitting chips 2 in the second direction (X) may not be equal to the distance between two adjacent light-emitting chips 2 in the third direction (Y), and the minimum distance between the geometric centroids of the orthographic projections of two adjacent light-emitting chips 2 in the second direction (X) or the third direction (Y) may be greater than 5 mm.

[0074] Figure 10 is a schematic projection of a light-emitting substrate according to an exemplary embodiment of this invention. In some exemplary embodiments, as shown in Figures 2, 3, 5, and 10, the protective adhesive 3 can serve as an encapsulating adhesive for the light-emitting chip 2, protecting it from external environmental factors such as water and oxygen. The protective adhesive 3 can also serve as a fluorescent adhesive, where light emitted by the light-emitting chip 2 excites the fluorescent adhesive to convert the light color, thereby enabling the adjustment of more display colors. The protective adhesive 3 corresponds one-to-one with the first through-hole 5. The protective adhesive 3 fills the first through-hole 5 and overflows from it, forming an encapsulation of the light-emitting chip 2. The end of the protective adhesive 3 away from the substrate 1 extends out of the first through-hole 5. The end face of the protective adhesive 3 away from the substrate 1 includes only a first spherical surface 6, which protrudes towards the light-emitting side 9. The edge of the first spherical surface 6 near the substrate 1 extends onto the second arc surface 7 supporting the substrate 4.

[0075] In some exemplary embodiments, as shown in Figures 2, 3, 5, and 10, the protective adhesive 3 covers the side of the supporting substrate 4 with the first through hole 5. The maximum distance between the top of the portion of the supporting substrate 4 covered by the protective adhesive 3 and the end face of the substrate 1 facing the light-emitting chip 2 is L5. The minimum distance between the end of the top surface 15 near the substrate 1 and the end face of the substrate 1 facing the light-emitting chip 2 is also L5. The maximum dimension of the top surface 15 in the first direction can be L6, that is, the minimum distance between the end of the top surface 15 away from the substrate 1 and the end face of the substrate 1 facing the light-emitting chip 2 is L6, wherein the sum of L5 and L6 is equal to the value of H.

[0076] In some exemplary embodiments, as shown in Figures 2, 3, 5, and 10, the top surface 15 may include a first spherical surface 6, which protrudes away from the substrate 1. The edge of the first spherical surface 6 near the substrate 1 is a first edge 16, which is located on the end face of the supporting base 4 away from the substrate 1, i.e., the first end face 10. The edge of the first spherical surface near the substrate 1 (the first edge 16) constitutes the circumferential edge of the top surface 16. The orthographic projection of the first edge 16 on the substrate 1 is a fourth projection S4, and the orthographic projection of the supporting base 4 on the substrate 1 may be a first projection S1. The fourth projection S4 is located within the first projection S1, that is, the orthographic projection of the circumferential edge of the top surface 15 on the substrate 1 is located within the orthographic projection of the supporting base 4 on the substrate 1.

[0077] In some exemplary embodiments, as shown in Figures 2, 3, 5, and 10, the orthographic projection of the supporting substrate 4 onto the substrate 1 is the first projection S1, the orthographic projection of the light-emitting chip 2 onto the substrate 1 is the second projection S2, and the orthographic projection of the first spherical surface 6 onto the substrate 1 is the third projection S3. The first projection S1 is annular, and the second projection S2 is located within the space enclosed by the first projection S1. The first projection S1 and the second projection S2 do not overlap, meaning the orthographic projection of the light-emitting chip 2 onto the substrate 1 does not overlap with the orthographic projection of the supporting substrate 4 onto the substrate 1. The second projection S2 overlaps with the third projection S3, and the third projection S3 is located within the second projection S2. That is, the orthographic projection of the light-emitting chip 2 onto the substrate 1 overlaps with the orthographic projection of the first spherical surface 6 onto the substrate 1, and the orthographic projection of the light-emitting chip 2 onto the substrate 1 is located within the orthographic projection of the first spherical surface 6 onto the substrate 1. The first projection S1 and the third projection S3 overlap, that is, the orthographic projection of the first spherical surface 6 on the substrate 1 and the orthographic projection of the supporting base 4 on the substrate 1 overlap. However, a portion of the orthographic projection of the first spherical surface 6 on the substrate 1 does not overlap with the orthographic projection of the supporting base 4 on the substrate 1. The minimum distance between the side of the first projection S1 closest to the second projection S2 and the side furthest from the second projection S2 is L2, and L2 is greater than or equal to 1 mm.

[0078] In some exemplary embodiments, as shown in Figures 2, 3, 5, and 10, the maximum dimension of the protective adhesive 3 in the direction perpendicular to the substrate 1 (the first direction) is H. In this example, the light-emitting substrate increases the value of H by adding a supporting substrate 4 and placing the edge of the first spherical surface 7 on the side of the supporting substrate 4 away from the substrate 1, thereby reducing the ratio of D to H and optimizing the light uniformity. The diameter of the first spherical surface 6 is D, where the ratio of D to H is not greater than 3.5, i.e., D / H ≤ 3.5. In this example, the value of D / H can be controlled within the range of 2 to 3.5. The ratio of D / H can be 2, but is not limited to this. For example, D / H is equal to 2.5, or equal to 3, or equal to 2.1, or equal to 3.2. The values ​​of H and D can be controlled according to the type of protective adhesive 3, the amount of adhesive, and the process flow, wherein 0.6mm ≤ H ≤ 1mm, and 2mm ≤ D ≤ 2.5mm. In this example, the value of D can be 2 and the value of H can be 1, so the ratio of D to H is 2, but it is not limited to this. For example, the value of D can be 2 and the value of H can be 0.8, so the ratio of D to H is 2.5; the value of D can be 2.5 and the value of H can be 1, so the ratio of D to H is 2.5.

[0079] In some exemplary embodiments, as shown in Figures 2, 3, 5 and 10, the maximum dimension of the protective adhesive 3 in the direction perpendicular to the substrate 1 (first direction) is H, and the maximum dimension of the supporting substrate 4 in the direction perpendicular to the substrate 1 is L1, wherein the ratio of H to L1 is not less than 2 and not greater than 6.

[0080] Figure 11 is a schematic diagram of another light-emitting substrate according to this exemplary embodiment. In some exemplary embodiments, the supporting substrate 4 has a first arc surface 8, which protrudes toward the light-emitting side 9. The diameter of the first arc surface 8 may be D1, and the first arc surface 8 extends onto the substrate 1 near the edge of the substrate. The end face of the protective adhesive 3 away from the substrate 1 may include a first spherical surface 6, which protrudes toward the light-emitting side 9. The diameter of the first spherical surface 6 may be D, and the first spherical surface 6 extends onto the first arc surface 8. Wherein, the value of D1 is greater than the value of D, that is, the diameter of the first arc surface 8 is greater than the diameter of the first spherical surface 6.

[0081] In some exemplary embodiments, the protective adhesive 3 has a reflective pattern on the end face (first spherical surface 6) away from the substrate 1, which can further enhance the light uniformity.

[0082] In some exemplary embodiments, as shown in Figures 2 and 3, during the fabrication of the light-emitting substrate, the light-emitting chip 2 can first be mounted on the substrate 1. The light-emitting chip 2 can be electrically connected to the substrate 1 through a soldering process. Then, white glue is coated around the light-emitting chip 2, and then dried and cured to set the white glue, forming a supporting substrate 4. At this time, the supporting substrate 4 forms a concave space (first through hole 5) around the light-emitting chip 2. Then, a dispensing process is performed to inject protective glue 3 into the first through hole 5, which, after curing, forms a first spherical surface 6.

[0083] Figure 12 is a schematic diagram of another light-emitting substrate according to this exemplary embodiment. In some exemplary embodiments, as shown in Figure 12, the substrate 1 may include a substrate 12, a circuit structure layer 17, and a reflective layer 18. The circuit structure layer 17 is located on one side of the substrate 12, and the reflective layer 18 is located on the side of the circuit structure layer 17 away from the substrate 12, forming that the substrate 12, the circuit structure layer 17, and the reflective layer 18 are arranged on one side in a first direction. The reflective layer 18 includes a plurality of second through holes 19 spaced apart, and a light-emitting chip 2 is disposed in each second through hole 19. The light-emitting chips 2 are all electrically connected to the circuit structure layer 17.

[0084] In some exemplary embodiments, as shown in FIG12, the substrate 12 may be made of glass. The circuit structure layer 17 may be a multilayer structure composed of a conductive layer and an insulating layer. The reflective layer 18 is used to reflect light incident on the surface of the reflective layer 18 away from the circuit structure layer 17, thereby improving the light utilization rate of the substrate 1. The material of the reflective layer 18 may be white ink, which has a light reflectivity of approximately 90%. However, it is not limited to this; for example, the reflective layer 18 may be a reflective sheet, which may be bonded to the side of the circuit structure layer 17 away from the substrate 12. The reflective sheet has a light reflectivity of approximately 98%.

[0085] In some exemplary embodiments, as shown in FIG12, the reflective layer 18 is prepared on the circuit structure layer 17 using a thermosetting white oil process and forms a second via 19. The second via 19 penetrates the reflective layer 18 in a first direction, and the distance between the wall of the second via 19 and the light-emitting chip 2 is relatively large and not less than 0.5 mm. The thickness of the reflective layer 17 can be greater than 30 micrometers. The substrate 4 covers the edge of one of the second via 19 and defines a first via 5 in the second via 19. The light-emitting chip 2 is located in the first via 5, and the substrate 4 is closer to the light-emitting chip 2 than the reflective layer 18. The substrate 4 covers the portion of the surface of the reflective layer 18 away from the substrate 12 that is close to the second via 19. The substrate 4 also covers the wall of the second via 19 and the portion of the surface of the circuit structure layer 17 exposed by the second via 19 that is close to the reflective layer 18. H is the distance between the end of the protective adhesive 3 away from the substrate and the end face of the reflective layer 18 away from the circuit structure layer 17.

[0086] Figure 13 is a schematic diagram of another light-emitting substrate according to this exemplary embodiment. In some exemplary embodiments, as shown in Figure 13, the substrate 1 may include a substrate 12, a circuit structure layer 17, and a reflective layer 18. The circuit structure layer 17 is located on one side of the substrate 12, and the reflective layer 18 is located on the side of the circuit structure layer 17 away from the substrate 12, forming that the substrate 12, the circuit structure layer 17, and the reflective layer 18 are arranged on one side in a first direction. The reflective layer 18 includes a plurality of second through holes 19 spaced apart, and a light-emitting chip 2 is disposed in each second through hole 19. The light-emitting chips 2 are all electrically connected to the circuit structure layer 17. The reflective layer 18 is prepared on the circuit structure layer 17 by a white oil exposure and development process to form the second through holes 19, such that the distance between the hole wall of the second through hole 19 and the light-emitting chip 2 is small and not greater than 0.1 mm. The substrate 4 covers the portion of the reflective layer 18 away from the substrate 12 and defines the first via 5. The orthographic projection of the second via 19 onto the substrate 12 lies within the orthographic projection of the first via 5 onto the substrate 12. The light-emitting chip 2 is located within the first via 5 and the second via 19. The reflective layer 18 is closer to the light-emitting chip 2 than the substrate 4. H is the distance between the end of the protective adhesive 3 away from the substrate and the end of the reflective layer 18 away from the circuit structure layer 17.

[0087] Figure 14 is a schematic diagram of a circuit structure layer according to an exemplary embodiment of the present invention. In some exemplary embodiments, as shown in Figure 14, the circuit structure layer 17 may include a first conductive layer 20, a second conductive layer 21, a buffer layer 22, and a protective layer 23. The second conductive layer 21, the first conductive layer 20, and the buffer layer 22 are stacked sequentially in the direction away from the light-emitting chip 2. The protective layer 23 is located on the side of the buffer layer 22 closest to the light-emitting chip 2 and covers the portion not covered by the second conductive layer 21 and the first conductive layer 20. The thickness of the second conductive layer 21 and the first conductive layer 20 may be 0.5 to 10 micrometers, the thickness of the buffer layer 22 may be 0 to 0.5 micrometers, and the thickness of the protective layer may be 0.5 to 1 micrometer. The structure of the circuit structure layer 17 and the thickness of each conductive layer and insulating layer are not limited thereto and can be adjusted according to product requirements.

[0088] Figure 15 is a schematic diagram of a display device according to an exemplary embodiment of the present invention. In some exemplary embodiments, as shown in Figure 15, the display device includes a display plate 14 in addition to a light-emitting substrate. The light-emitting substrate also includes a film 13. The film 13 is located on the side of the substrate 1 with the light-emitting chip 2 and is located between the substrate 1 and the display plate 14. The film 14 and the substrate 1 are arranged at intervals, and the distance between the substrate 1 and the film 13 is the light mixing distance W.

[0089] This disclosure provides a display device, which includes the aforementioned light-emitting substrate. The display device can be a smartphone, laptop, tablet, television, smart wearable device, etc. For example, smart wearable devices can include smartwatches, VR (virtual reality) devices, and AR (augmented reality) devices, etc. This application does not specifically limit the scope of the application.

[0090] In conjunction with the above embodiments, the light-emitting substrate of this example can effectively increase the height of the protective adhesive, reduce the D / H value, improve the light uniformity, reduce the backlight mixing distance, effectively reduce the module thickness, and at the same time reduce the number of light-emitting chips 2 used, thereby reducing costs.

[0091] While the embodiments disclosed herein are as described above, the content is merely for the purpose of facilitating understanding of this disclosure and is not intended to limit this disclosure. Any person skilled in the art to which this disclosure pertains may make any modifications and changes to the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the scope of patent protection for this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A light-emitting substrate, wherein, Includes substrate, supporting substrate, light-emitting chip and protective adhesive; The supporting base is disposed on one side of the substrate, and the supporting base is provided with a first through hole, which penetrates the supporting base in a direction perpendicular to the substrate. The light-emitting chip is disposed on the substrate and located within the first through hole; The protective adhesive is disposed on the side of the light-emitting chip away from the substrate, and the protective adhesive is configured to encapsulate the light-emitting chip; The end face of the protective adhesive away from the substrate is the top surface, and the orthographic projection of the circumferential edge of the top surface onto the substrate is set to overlap with the orthographic projection of the supporting substrate onto the substrate.

2. The light-emitting substrate according to claim 1, wherein, The top surface includes a first spherical surface that protrudes from the side away from the substrate. The first spherical surface extends from the edge of the substrate to the end face of the supporting base away from the substrate, and the edge of the first spherical surface near the substrate forms the circumferential edge of the top surface. The orthographic projection of the circumferential edge of the top surface onto the substrate lies within the orthographic projection of the supporting base onto the substrate.

3. The light-emitting substrate according to claim 2, wherein, The supporting substrate is configured as an annular shape and surrounds the light-emitting chip, and the space enclosed by the annular supporting substrate constitutes the first through hole.

4. The light-emitting substrate according to claim 3, wherein, The orthographic projection of the supporting substrate onto the substrate is configured as a circular ring, an elliptical ring, a polygonal ring, a fan-shaped ring, or an arc-shaped ring.

5. The light-emitting substrate according to claim 3, wherein, The supporting base includes a first end face and a first inclined surface. The first end face is located on the side of the supporting base away from the substrate. The first end face is configured as an arc surface or a plane. The first inclined surface is located on the side of the supporting substrate closer to the light-emitting chip, and the end of the first inclined surface away from the substrate is inclined towards the side away from the light-emitting chip.

6. The light-emitting substrate according to claim 3, wherein, Multiple light-emitting chips and multiple supporting substrates are provided, with each supporting substrate corresponding to a light-emitting chip. The multiple supporting substrates are arranged in an array in a direction parallel to the substrate.

7. The light-emitting substrate according to claim 3, wherein, The orthographic projection of the supporting substrate on the substrate is a first projection, and the orthographic projection of the light-emitting chip on the substrate is a second projection. The first projection is located on the outer periphery of the second projection. The minimum distance between the side of the first projection closest to the second projection and the side furthest from the second projection is L2, where L2 is greater than or equal to 1 mm.

8. The light-emitting substrate according to claim 3, wherein, The light-emitting chip is arranged centered in the first through hole in a direction parallel to the substrate, and the geometric center distance between the orthographic projections of two adjacent light-emitting chips on the substrate is L3, where L3 is greater than or equal to 5 mm.

9. The light-emitting substrate according to claim 8, wherein, The minimum distance between the light-emitting chip and the wall of the first through hole is set to L4, where L4 is greater than or equal to 1 mm.

10. The light-emitting substrate according to claim 2, wherein, The diameter of the first sphere is D, the maximum distance between the first sphere and the substrate is H, and the ratio of D to H is not greater than 3.

5.

11. The light-emitting substrate according to claim 10, wherein, 2≤D / H≤3.

5.

12. The light-emitting substrate according to claim 11, wherein, The maximum distance between the end of the supporting substrate away from the substrate and the substrate is L1, wherein the ratio of H to L1 is not less than 2 and not greater than 6.

13. The light-emitting substrate according to claim 12, wherein, 2≤D≤2.5mm, 0.6mm≤H≤1mm, 0.1mm≤L1≤0.5mm.

14. The light-emitting substrate according to claim 2, wherein, The substrate includes a substrate, a circuit structure layer and a reflective layer stacked sequentially, and the reflective layer is provided with a second through hole; The light-emitting chip is disposed in the second through-hole and is connected to the circuit structure layer; The supporting substrate is located on the side of the reflective layer away from the circuit structure layer and is disposed along the edge of the second through hole, and the supporting substrate covers the hole wall of the second through hole.

15. The light-emitting substrate according to any one of claims 1 to 14, wherein, The protective adhesive has a reflective pattern on its end face away from the substrate.

16. The light-emitting substrate according to any one of claims 1 to 14, wherein, The material of the supporting substrate includes white glue or transparent glue.

17. A display device, wherein, Includes the light-emitting substrate as described in any one of claims 1 to 16.

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