New energy large-size gum processing technology
By using laser equipment and multiple die-cutting processes with specific colored adhesive films, the problems of high mold costs and insufficient precision in large-size adhesive backing processing have been solved, achieving efficient and low-cost adhesive backing production.
Patent Information
- Application Number
- CN202511627674.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-07
- Publication Date
- 2026-01-20
AI Technical Summary
Existing technologies, when processing large-sized adhesive backing materials, are limited by the conditions of die-cutting equipment, resulting in high mold costs, long production cycles, and insufficient die-cutting accuracy, which affects product yield.
Laser equipment is used for multiple die-cuttings, along with adhesives and films of specific colors. Cutting is performed step by step through positioning holes, reducing mold requirements and improving precision and efficiency.
It saves on mold costs, shortens the production cycle, and improves die-cutting accuracy and product yield.
Smart Images
Figure CN121361132A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of die cutting, in particular to a new energy large-size back adhesive processing technology. BACKGROUND
[0002] When making some electrical products, it is often necessary to paste back adhesive (the back adhesive is generally selected as PSA double-sided pressure-sensitive adhesive) on the FPC (flexible circuit board) soft board, so the back adhesive needs to be processed first. For some large-size back adhesive, due to the limitation of related conditions of die cutting equipment, such as the need to specially make a mold for opening and cutting, the cost is high, the production cycle is long, and the die cutting precision is insufficient, which reduces the product yield. SUMMARY
[0003] To solve the above problems, the present application provides a new energy large-size back adhesive processing technology, which is based on laser equipment, processes large-size back adhesive by multiple laser die cutting, and uses specific color adhesive and film for positioning, saves the cost of mold, shortens the production cycle, and improves the die cutting precision and product yield.
[0004] According to one aspect of the present application, a new energy large-size back adhesive processing technology is provided, comprising the following steps: S1: a layer of blue release film is compounded below the magenta double-sided adhesive, and a layer of green protective film is compounded below the blue release film to form a film material, wherein the magenta double-sided adhesive needs to be processed four times; S2: first laser die cutting is performed on the film material, wherein the magenta double-sided adhesive is processed for the first time, the blue release film is cut for the first time, and a first bottom film positioning hole is die cut on the green protective film; S3: second laser die cutting is performed on the film material, wherein the film material is positioned by scanning each first bottom film positioning hole, the magenta double-sided adhesive is processed for the second time, the blue release film is cut for the second time, and a second bottom film positioning hole is die cut on the green protective film; S4: third laser die cutting is performed on the film material, wherein the film material is positioned by scanning each second bottom film positioning hole, the magenta double-sided adhesive is processed for the third time, the blue release film is cut for the third time, and a third bottom film positioning hole is die cut on the green protective film; S5: fourth laser die cutting is performed on the film material, and the film material is positioned by scanning each third bottom film positioning hole, wherein the magenta double-sided adhesive is processed for the fourth time, and the blue release film is cut for the fourth time.
[0005] In some embodiments, the method further comprises the step of S6: manually removing the waste. This is beneficial in that it supplements the subsequent steps of the processing procedure.
[0006] In some embodiments, the magenta double-sided adhesive tape has a thickness of 0.15 mm, the blue release film has a thickness of 0.075 mm, and the green protective film has a thickness of 0.078 mm. This is beneficial in that it describes the thickness dimensions of the magenta double-sided adhesive tape, the blue release film, and the green protective film.
[0007] In some embodiments, in step S1, a layer of transparent release film is further compounded above the magenta double-sided adhesive tape. This is beneficial in that it describes the composition of the film material.
[0008] In some embodiments, the transparent release film has a thickness of 0.025 mm. This is beneficial in that it describes the thickness dimensions of the transparent release film.
[0009] In some embodiments, the film material has a length of 1800 mm. This is beneficial in that it further describes the length of the film material.
[0010] In some embodiments, in steps S2-S5, the same laser equipment is used to perform laser die cutting four times. This is beneficial in that it can save the equipment cost of processing.
[0011] In some embodiments, the film material is divided into four processing areas of the same length, and four different laser equipment are used to simultaneously perform laser die cutting in the four processing areas in steps S2-S5. This is beneficial in that it can significantly improve the efficiency of processing. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 FIG. 1 is a schematic diagram of the layered film material for a new energy large-size adhesive processing procedure according to an embodiment of the present application; Figure 2 FIG. 2 is a schematic diagram of the film material structure after the first laser die cutting of the new energy large-size adhesive processing procedure shown in FIG. 1; Figure 1 FIG. 3 is a schematic diagram of the film material structure after the second laser die cutting of the new energy large-size adhesive processing procedure shown in FIG. 1; Figure 3 Figure 1 FIG. 4 is a schematic diagram of the film material structure after the third laser die cutting of the new energy large-size adhesive processing procedure shown in FIG. 1; Figure 4 FIG. 5 is a schematic diagram of the film material structure after the fourth laser die cutting of the new energy large-size adhesive processing procedure shown in FIG. 1. Figure 1 FIG. 5 is a schematic diagram of the film material structure after the fourth laser die cutting of the new energy large-size adhesive processing procedure shown in FIG. 1. Figure 5 Figure 1 FIG. 5 is a schematic diagram of the film material structure after the fourth laser die cutting of the new energy large-size adhesive processing procedure shown in FIG. 1.
[0013] In the diagram: magenta double-sided tape 1, blue release film 2, green protective film 3, transparent release film 4, first bottom film positioning hole 5, second bottom film positioning hole 6, third bottom film positioning hole 7. Detailed Implementation
[0014] The present invention will now be described in further detail with reference to the accompanying drawings.
[0015] The new energy large-size adhesive backing processing technology of this invention mainly includes the following steps.
[0016] S1: Composite material is formed to be processed.
[0017] like Figure 1 As shown, a layer of magenta release film 2 is laminated below the magenta double-sided adhesive 1, and a layer of green protective film 3 is laminated below the magenta release film 2. Finally, a layer of transparent release film 4 is laminated above the magenta double-sided adhesive 1, thus forming the film material to be processed. During the processing of this film material, the magenta double-sided adhesive 1 needs to undergo four laser die-cutting processes to meet the processing requirements.
[0018] Preferably, the thickness of the magenta double-sided adhesive 1 is 0.15mm, and the material type is SDK96115H; the thickness of the transparent release film 4 is 0.025mm, and the material type is GWLY2502; the thickness of the magenta release film 2 is 0.075mm, and the material type is SDK75T-T3B-TDS; and the thickness of the green protective film 3 is 0.078mm, and the material type is GWY7815-D0.078.
[0019] Preferably, the length of the membrane material is 1800 mm.
[0020] S2: Perform the first laser die-cutting.
[0021] like Figure 2 As shown, the film material is moved to the corresponding laser equipment for the first laser die-cutting. In this laser die-cutting, the magenta double-sided tape 1 is die-cut for the first time as required, and the magenta release film 2 is cut for the first time at the corresponding position as required. At the same time, multiple first bottom film positioning holes 5 are also die-cut on the green protective film 3.
[0022] S3: Perform the second laser die-cutting.
[0023] like Figure 3As shown, the film material after the first laser die-cutting is moved to the corresponding laser equipment for the second laser die-cutting. In this laser die-cutting, the film material is adjusted and positioned by scanning each of the first bottom film positioning holes 5. Then, the magenta double-sided tape 1 is die-cut a second time as required, and the magenta release film 2 is cut a second time at the corresponding position as required. At the same time, multiple second bottom film positioning holes 6 are also die-cut on the green protective film 3.
[0024] S4: Perform the third laser die-cutting.
[0025] like Figure 4 As shown, the film material after the second laser die-cutting is moved to the corresponding laser equipment for the third laser die-cutting. In this laser die-cutting, the film material is adjusted and positioned by scanning each of the second bottom film positioning holes 6. Then, the magenta double-sided adhesive 1 is die-cut a third time as required, and the magenta release film 2 is cut a third time at the corresponding position as required. At the same time, multiple third bottom film positioning holes 7 are also die-cut on the green protective film 3.
[0026] S5: Perform the fourth laser die-cutting.
[0027] The film material after the third laser die-cutting is moved to the corresponding laser equipment for the fourth laser die-cutting. In this laser die-cutting, the film material is adjusted and positioned by scanning each of the third bottom film positioning holes 7. Then, the magenta double-sided adhesive 1 is die-cut for the fourth time as required, and the magenta release film 2 is cut at the corresponding position as required.
[0028] S6: Manually remove waste generated during each laser die-cutting step.
[0029] Preferably, the equipment cost can be saved by circulating the film material and performing four laser die-cutting processes in S2 to S5 using the same laser equipment.
[0030] Preferably, the film material can be divided into four processing areas of the same length, and four different laser devices can be used to perform laser die-cutting in steps S2 to S5 simultaneously in the four processing areas. For example, a 1800mm film material can be divided into four 450mm processing areas and laser die-cutting can be performed simultaneously, thereby significantly improving the processing efficiency.
[0031] The above descriptions are merely some embodiments of the present invention. Those skilled in the art can make various modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.
Claims
1. A new energy large size back adhesive processing technology, characterized by: The method comprises the following steps S1: compound a layer of blue release film (2) below the magenta double-sided adhesive tape (1), and compound a layer of green protective film (3) below the blue release film (2), to form a film material, wherein the magenta double-sided adhesive tape (1) needs to be processed four times by die cutting; S2: perform first laser die cutting on the film material, wherein the magenta double-sided adhesive tape (1) is processed by first die cutting, the blue release film (2) is cut for the first time, and a first bottom film positioning hole (5) is die cut on the green protective film (3); S3: perform second laser die cutting on the film material, wherein the film material is positioned by scanning each first bottom film positioning hole (5), the magenta double-sided adhesive tape (1) is processed by second die cutting, the blue release film (2) is cut for the second time, and a second bottom film positioning hole (6) is die cut on the green protective film (3); S4: perform third laser die cutting on the film material, wherein the film material is positioned by scanning each second bottom film positioning hole (6), the magenta double-sided adhesive tape (1) is processed by third die cutting, the blue release film (2) is cut for the third time, and a third bottom film positioning hole (7) is die cut on the green protective film (3); S5: perform fourth laser die cutting on the film material, wherein the film material is positioned by scanning each third bottom film positioning hole (7), the magenta double-sided adhesive tape (1) is processed by fourth die cutting, and the blue release film (2) is cut for the fourth time.
2. The new energy large size back adhesive processing process according to claim 1, characterized in that: The method further comprises the following step S6: manually remove the waste.
3. The new energy large size back adhesive processing process according to claim 1, characterized in that: The thickness of the magenta double-sided adhesive tape (1) is 0.15 mm, the thickness of the blue release film (2) is 0.075 mm, and the thickness of the green protective film (3) is 0.078 mm.
4. The new energy large size back adhesive processing technology according to claim 1, characterized in that: In step S1, a layer of transparent release film (4) is further compounded above the magenta double-sided adhesive tape (1).
5. The new energy large size back adhesive processing technology according to claim 4, characterized in that: The thickness of the transparent release film (4) is 0.025 mm.
6. The new energy large size back adhesive processing technology according to claim 1, characterized in that: The length of the film material is 1800 mm.
7. The new energy large size back adhesive processing technology according to claim 1, characterized in that: In steps S2-S5, the same laser equipment is used for four times of laser die cutting.
8. The new energy large size back adhesive processing technology according to claim 1, characterized in that: The film material is divided into four processing areas of the same length, and four different laser equipment are used to simultaneously perform laser die cutting in the four processing areas in steps S2-S5.