Laminate molding system and method for manufacturing laminate molded article

Abstract

The present disclosure relates to a laminate molding system and a method of manufacturing a laminate molded article, in which the laminate molding system according to the present disclosure comprises: a pair of carrier films for sandwiching an object to be laminated between the pair of carrier films from above and below and conveying the object to be laminated in a conveying direction; the film unwinding machine is used for unwinding the carrier film; a laminating machine for pressing an object to be laminated to form a laminated molded article, the laminating machine being disposed on a downstream side with respect to the film unwinding machine; and a cooling part designed to cool the laminated molded article, the cooling part being provided on a downstream side with respect to the laminating machine. The cooling portion includes an airflow generating portion designed to flow the cooling air in a direction inclined at a predetermined angle toward a downstream side of the conveying direction with respect to a direction substantially perpendicular to the conveying direction.

Description

Technical Field

[0001] This disclosure relates to a lamination system and a method for manufacturing laminated articles. Background Technology

[0002] Japanese Patent JP 3821706 discloses a laminator in which a continuous laminate film is stacked on both surfaces of a conveyed object to be laminated, and is pressed and laminated while being heated by laminating rollers. A cooling fan is disposed on the downstream side relative to the laminating rollers. The cooling fan and the laminating rollers are kept separate from each other, and the cooling fan is tilted toward the opposite side of the laminating rollers to avoid cooling the laminating rollers. Summary of the Invention

[0003] The lamination unit is equipped with multiple cooling fans for uniformly cooling the object. When cooling air is directed from these fans in a direction perpendicular to the object, the airflow moves upstream towards the lamination section, which can lead to contamination of that section.

[0004] This disclosure aims to solve such problems, and its purpose is to provide a lamination system and a method for manufacturing laminated articles suitable for suppressing contamination in the lamination process. Other problems and novel features will become apparent from the description and accompanying drawings.

[0005] According to this disclosure, a lamination system includes: a pair of carrier films for sandwiching an object to be laminated between the pair of carrier films from above and below and conveying the object to be laminated along a conveying direction, the object being laminated being formed by laminating a laminating material onto the lamination target body; a film unwinding machine for unwinding the carrier films; a laminator for extruding the object to be laminated to form a laminated article, the laminator being disposed downstream of the film unwinding machine; a cooling section designed to cool the laminated article, the cooling section being disposed downstream of the laminator; and a film winding machine for unloading the laminated article placed on the carrier films, the film winding machine being disposed downstream of the laminator. The cooling section includes an airflow generating device for causing cooling air to flow in a direction inclined at a predetermined angle relative to a direction substantially perpendicular to the conveying direction toward the downstream side of the conveying direction.

[0006] According to this disclosure, a method for manufacturing a laminated article includes: sandwiching an object to be laminated, formed by laminating a laminated material onto a laminated target body, between a pair of carrier films from above and below, and conveying the object to be laminated along a conveying direction; extruding the conveyed object to be laminated to form a laminated article; cooling it by an airflow generating device for causing cooling air to flow at a predetermined angle downstream of the conveying direction relative to a direction substantially perpendicular to the conveying direction; and unloading the laminated article placed on the carrier films.

[0007] According to this disclosure, contamination in the section used to perform lamination processing can be suppressed. Attached Figure Description

[0008] The above and other objects, features and advantages of the present invention will be more fully understood from the detailed description and accompanying drawings given below.

[0009] Figure 1 This is a diagram illustrating a schematic construction of a laminator according to the first embodiment;

[0010] Figure 2 yes Figure 1 The side view of the cooling device shown;

[0011] Figure 3 yes Figure 1 A top view of the cooling device shown;

[0012] Figure 4 This diagram shows the upper cooling fan retracted from the cooling section;

[0013] Figure 5 This is a diagram used to illustrate the installation angle of the upper cooling fan;

[0014] Figure 6 This is a top view of the cooling device according to the second embodiment; and

[0015] Figure 7 yes Figure 6 Side view of the cooling device shown. Detailed Implementation

[0016] In the following description, the present disclosure will be illustrated by means of embodiments thereof; however, the claimed disclosure is not limited to the following embodiments. Furthermore, not all structures described in the embodiments are necessarily means of solving the problem. For clarity, the following description and drawings are appropriately omitted and simplified. In each drawing, the same reference numerals are assigned to the same elements, and repeated descriptions are omitted where necessary. In the following description, positional relationships indicated by terms such as “left,” “right,” “inner,” “outer,” “axis,” “center,” “horizontal,” and “orthogonal” are based on the positional relationships shown in the drawings and are intended to facilitate the description of embodiments of the present disclosure, and should not be construed as limiting the embodiments of the present disclosure.

[0017] Embodiments of this disclosure relate to a lamination system comprising: loading an object to be laminated, obtained by laminating a laminating material onto a lamination target body, from one side; performing a lamination process by extruding the object to be laminated under reduced pressure; and unloading the object to be laminated from the other side. Here, as an example of an object to be laminated, a substrate W temporarily bonded to at least a portion of a lamination film will be described.

[0018] First Implementation Method

[0019] Figure 1 This is a diagram illustrating a schematic construction of a laminator according to the first embodiment. Figure 1 As shown, the lamination system 100 includes a supply device 10, a molding device 20, a cooling device 30, and a recycling device 40.

[0020] The supply device 10 is located upstream of the forming device 20 in the system (i.e., upstream relative to the forming device 20). The cooling device 30 is located downstream of the forming device 20 in the system (i.e., downstream relative to the forming device 20). The recovery device 40 is located downstream of the cooling device 30 in the system (i.e., downstream relative to the cooling device 30). The forming device 20 includes a first section 21, a second section 22, and a third section 23. The second section 22 and the third section 23 are sequentially installed downstream of the first section 21 in the system (i.e., downstream relative to the first section 21). An example will be described below in which lamination is performed by a vacuum lamination device at the first section 21, planarization is performed by a first extrusion device at the second section 22, and planarization is performed by a second extrusion device at the third section 23. That is, in Figure 1 In the example shown, there is one "laminator" and two "planarization extrusion units".

[0021] The construction of the molding apparatus 20 is merely an example and is not limited thereto. The molding apparatus 20 may be designed to transport the substrate W using a film in a progressive feeding manner, and may include at least a first section 21. One or both of the second section 22 and the third section 23 may be omitted.

[0022] The supply device 10 includes an upper film unwinding device 11, an upper film cleaning device 12, a lower film unwinding device 13, a lower film cleaning device 14, and a substrate receiving unit 15. The supply device 10 corresponds to a "film unwinding machine". The upper film unwinding device 11 and the lower film unwinding device 13 are provided with film rolls formed by winding strip-shaped films. The upper film unwinding device 11 and the lower film unwinding device 13 supply a pair of carrier films, which are used to clamp the object to be laminated from above and below and transport the object to be laminated along the transport direction. The object to be laminated is a laminated target body formed by laminating a laminated film as a laminating material onto a substrate W.

[0023] A pair of carrier films are inserted into the lamination system 100, and the substrate W, which is to be laminated, is conveyed from one end of the lamination system 100 to the other end along a conveying surface parallel to the hot plate of the lamination system 100. Hereinafter, the carrier film unwound from the upper film unwinding device 11 is referred to as the upper film F1, and the carrier film unwound from the lower film unwinding device 13 is referred to as the lower film F2.

[0024] A laminated film (not shown) is disposed on a substrate W. The laminated film is a single sheet and is disposed on a lower film F2 in an overlapping manner with the substrate W. The laminated film is coated with a heat-sensitive adhesive, for example, and can adhere when heated. When the laminate of the laminated film and the substrate W is disposed on the lower film F2, at least a portion of the laminated film can be temporarily bonded.

[0025] The upper film cleaning device 12 and the lower film cleaning device 14 include, for example, adhesion rollers. The upper film cleaning device 12 and the lower film cleaning device 14 capture and remove dust adhering to the upper film F1 and the lower film F2, respectively, by means of the adhesion rollers. The upper film cleaning device 12 and the lower film cleaning device 14 may have the function of collecting particles (dust foreign matter) generated in the lamination system 100 and preventing the laminated film from being contaminated.

[0026] The substrate receiving unit 15 supplies substrate W between the upper thin film F1 and the lower thin film F2 at predetermined times, such that the pitch between substrate W and subsequent substrates W is constant. The pitch between substrates W is, for example, equal to the distance between the first section 21, the second section 22, and the third section 23. Therefore, after simultaneously processing different substrates W at each of the first section 21, the second section 22, and the third section 23, the substrate W on the first section 21 is transported to the second section 22, which is downstream of the first section 21, and the substrate W on the second section 22 is transported to the third section 23. The substrate W on the third section 23 is transported to the cooling device 30, which is downstream of the third section 23.

[0027] The supply device 10 may include at least one driven roller. The driven roller changes the orientation of the upper film and the lower film to horizontal, respectively. The substrate W is supplied to the horizontally oriented portions of the upper and lower films. The substrate W is transferred in a state sandwiched between the upper film F1 and the lower film F2. The substrate W sandwiched between the upper film F1 and the lower film F2 is processed in the first section 21, the second section 22, and the third section 23, respectively.

[0028] In this embodiment, the molding apparatus 20 includes a laminator for performing a lamination process on the object to be laminated (a substrate W with laminated films) under reduced pressure. In a predetermined transport direction ( Figure 1 The substrate W is transported along the transport surface (the placement surface on the lower thin film F2, which is in a horizontal state) in the direction of the white arrow in the middle.

[0029] At the first stage 21, lamination is performed using a vacuum laminator. In a vacuum chamber (not shown), the vacuum laminator heats and pressurizes the laminate consisting of a substrate W, an upper film F1, and a lower film F2 using a pressurizing body. The form of the pressurizing body is not particularly limited, but it can be, for example, an expandable elastic film (such as a diaphragm) or a plate-like body with a pressurizing surface made of resin (such as an elastomer) or metal.

[0030] For example, in a vacuum laminator, the lower plate is configured to move up and down relative to a fixed upper plate. When the lower plate rises and comes into contact with the upper plate, a chamber is formed. A hot plate heated by a heater (not shown) is attached to the lower center surface of the upper plate, and a heat-resistant elastic sheet is attached to the surface of the hot plate.

[0031] On the other hand, a hot plate heated by a heater (not shown) is connected to the central upper surface of the lower plate. A diaphragm, acting as a pressure agent, is attached to the surface of the hot plate of the lower plate. When pressurized air is delivered to the rear side of the diaphragm via a compressor (not shown), the diaphragm expands in the chamber, and the laminate is pressurized between the hot plates. Thus, the substrate W is laminated using the upper film F1 and the lower film F2, and a one-piece molded article is obtained. The above-described vacuum lamination apparatus is an example. For example, the diaphragm can be attached to the upper plate, and the substrate W can be extruded from the upper plate side. In the case where the lamination molding system 100 only includes a laminator, the one-piece molded article is a laminated article obtained by pressurizing the object to be laminated.

[0032] At the second stage 22, planarization can be performed by the first extrusion device. The first extrusion device also pressurizes the primary molded article, which has been laminated by a vacuum laminator, to improve the flatness of the laminated surface, thereby forming a secondary molded article through pressure. For example, in the first extrusion device, a lower plate is provided so that it can move up and down relative to a fixed upper plate. The first extrusion device has a pressurizing device, such as a hydraulic cylinder. A pressure block (not shown) is disposed on the opposite surfaces of the upper and lower plates. A temperature control device, such as a cylindrical heater, is disposed on the pressure block. A cushioning material, such as a rubber or resin film, is attached to the surface of the pressure block. A second extrusion device is disposed in series downstream of the first extrusion device. The second extrusion device further pressurizes the secondary molded article to form a flattened tertiary molded article. The tertiary molded article is a laminate obtained by the lamination molding system 100.

[0033] In the case where the lamination system 100 includes a laminator and a planarization extrusion device, the secondary and tertiary molded articles are still laminated articles obtained by pressurizing the object to be laminated. The laminated articles conveyed from the molding device 20 to the cooling device 30 are cooling objects to be cooled in the cooling device 30. In each figure, the primary, secondary, and tertiary molded articles are all referred to as substrate W. The second extrusion device may have the same construction as the first extrusion device.

[0034] In a lamination system, a cooling device 30 may be disposed downstream of the molding device 20. In other words, the cooling device 30 is a cooling section disposed downstream of the laminator in the lamination system for cooling the laminated article. The cooling device 30 has an airflow generating device for causing cooling air to flow at a predetermined angle downstream of the conveying direction relative to a direction substantially perpendicular to the conveying direction. The airflow generating device may be, for example, a cooling fan with rotating blades. The airflow generating device may also be other blowing mechanisms, such as slit-type air nozzles.

[0035] The explanation will take the example of multiple cooling fans 31 as the airflow generating device. The number of cooling fans 31 is not limited to the following example, and the airflow generating device may be a single cooling fan 31.

[0036] The cooling unit 30 includes multiple cooling fans 31. The cooling fans 31 are arranged along the conveying direction. Figure 1 In the example shown, five cooling fans 31 are arranged along the conveying direction on the upper surface of the substrate W. Five cooling fans 31 are also arranged along the conveying direction on the lower surface of the substrate W. The heated substrate W is sandwiched between the upper film F1 and the lower film F2 and conveyed to the cooling device 30. The construction of the cooling device 30 will be described in detail later.

[0037] The recycling device 40 is located downstream of the cooling device 30. The recycling device 40 includes an upper film winding device 41 and a lower film winding device 42. The recycling device 40 corresponds to a "film winding machine". In addition to recycling the carrier film, the recycling device 40 also has the function of recycling the laminate (the already laminated substrate W). The recycling device 40 cooperates with the supply device 10 to perform the conveying of the upper film F1 and the lower film F2. That is, the supply device 10 and the recycling device 40 convey the substrate W along the conveying surface in the conveying direction. The rotation of the upper film winding device 41 and the lower film winding device 42 is controlled by motors (not shown). The upper film winding device 41 controls the supply amount and film tension of the upper film F1 between the upper film winding device 41 and the upper film unwinding device 11. The lower film winding device 42 controls the supply amount and film tension of the lower film F2 between the lower film winding device 42 and the lower film unwinding device 13.

[0038] The upper film F1 is oriented upwards by at least one driven roller, and the upper film F1 is wound by the upper film winding device 41. After winding the upper film F1, the lower film F2 is horizontally conveyed at fixed intervals to another driven roller. This section serves as a discharge port from which the laminated substrate W is discharged. Subsequently, the lower film F2 is wound by the lower film winding device 42 located below through at least one driven roller.

[0039] Although not shown here, the lamination system 100 may be equipped with a control device for controlling the entire lamination system 100, which is connected to the supply device 10, the molding device 20, the cooling device 30, and the recovery device 40. The control device includes a processor and a memory, and the processor can execute programs stored in the memory to control the operation of each unit, such as the transport of the substrate W or the lamination process. The control device may also have the function of a flow adjustment device for adjusting the flow rate of cooling air flowing from the cooling device 30.

[0040] Now refer to Figure 2 and Figure 3 Explanation of cooling device 30. Figure 2 yes Figure 1 Side view of the cooling device 30 shown. Figure 3 This is a top view of the cooling device 30. Figure 2 and Figure 3In this system, the conveying direction is defined as the x-direction, and the direction perpendicular to the x-direction in the conveying surface is defined as the y-direction. The direction perpendicular to the conveying surface is defined as the z-direction. Among the multiple cooling fans 31, the cooling fan 31 disposed on the upper surface side of the substrate W is called the upper cooling fan 31a, and the cooling fan 31 disposed on the lower surface side of the substrate W is called the lower cooling fan 31b. In the cooling device 30, the area where the substrate W heated by the molding device 20 rests and is cooled by the cooling fans 31 is called the cooling section 32.

[0041] like Figure 3 As shown, when viewed from above, two rows of upper cooling fans 31a are arranged along the y-direction, with five upper cooling fans 31a in each row arranged along the conveying direction. That is, the cooling device 30 includes ten upper cooling fans 31a. Although not shown here, ten lower cooling fans 31b can be arranged in the same manner as the upper cooling fans 31a. That is, two rows of lower cooling fans 31b can be arranged along the y-direction below the lower film F2, with five lower cooling fans 31b in each row arranged along the conveying direction. Therefore, by arranging cooling fans 31 above and below the substrate W, the substrate W can be cooled quickly. Furthermore, the multiple cooling fans 31 are arranged in a grid pattern, thereby effectively cooling the entire surface of the substrate W.

[0042] The spacing between adjacent cooling fans 31 can be constant. However, the spacing between adjacent cooling fans 31 can vary. For example, the spacing between upstream cooling fans 31 can be smaller than the spacing between downstream cooling fans 31.

[0043] exist Figure 3 In the example shown, the upper cooling fan 31a is mounted on a track that spans the cooling section 32 along the y-direction. The upper cooling fan 31a can move in a direction orthogonal to the conveying direction. Figure 4 The diagram shows the upper cooling fan 31a retracted from above the cooling section 32. In the lamination system 100, when the laminated film is replaced or the cooling section 32 is maintained, the upper cooling fan 31a can retract from above the cooling section 32 to its side, as shown. Figure 4 As shown. This configuration makes it easier for the operator to perform his / her work, thereby improving the maintainability of the lamination system 100. The cooling fan 31 is movable in at least one of the following directions: the conveying direction (x direction), a direction substantially perpendicular to the conveying direction on the conveying surface (y direction), and a direction substantially perpendicular to the conveying surface (z direction).

[0044] like Figure 2As shown, the cooling fan 31 directs cooling air toward the substrate W in a direction inclined at a predetermined angle θ1 relative to the direction substantially perpendicular to the conveying surface (z-direction) toward the downstream side of the conveying direction (x-direction). Specifically, the upper cooling fan 31a directs cooling air in a direction inclined to the downstream side of the conveying direction relative to the direction perpendicular to the upper surface of the substrate W. The lower cooling fan 31b similarly directs cooling air in a direction inclined to the downstream side of the conveying direction relative to the direction perpendicular to the lower surface of the substrate W.

[0045] In the comparative example where the cooling fan 31 causes cooling air to flow in a direction perpendicular to the substrate W, the cooling air flowing onto the substrate W flows toward the molding apparatus 20 side, and particles can enter the molding apparatus 20 from the cooling apparatus 30 side. As a result, particles can enter between the substrate W and the upper film F1 and the lower film F2, or between these films and the hot plate, thereby causing defects.

[0046] In contrast, in this embodiment, the cooling air from the cooling fan 31 is inclined at a predetermined angle θ1 towards the downstream side of the conveying direction relative to the direction perpendicular to the substrate W. Therefore, the cooling air flows towards the recovery device 40 on the downstream side of the conveying direction, and not towards the molding device 20 on the upstream side of the conveying direction. Thus, particles can be prevented from entering the molding device 20 from the cooling device 30 side, and contamination inside the housing of the molding device 20, including the molding section and the substrate W, can be suppressed.

[0047] Furthermore, since the cooling air does not flow towards the molding apparatus 20 side, components other than the substrate W can be prevented from being cooled. For example, the hot plate disposed upstream of the cooling device 30 in the molding apparatus 20 can be prevented from being cooled. In addition, the air warmed by cooling the substrate W can flow from the substrate W outlet on the downstream side to the outside of the lamination molding system 100.

[0048] Figure 5 This diagram illustrates the mounting angle of the upper cooling fan 31a. It is assumed that the direction of the cooling air exiting the upper cooling fan 31a is perpendicular to the blowing surface 33 of the upper cooling fan 31a used to blow the cooling air. The angle θ2 formed by the blowing surface 33 of the upper cooling fan 31a and the xy plane parallel to the conveying surface is defined as the mounting angle. Multiple upper cooling fans 31a are mounted at an angle such that the blowing surface 33 faces the downstream side of the conveying direction. The mounting angles of the multiple upper cooling fans 31a are equal to each other. The aforementioned angle θ2 is equal to the angle θ1 at which the cooling air from the upper cooling fan 31a is inclined relative to the direction perpendicular to the substrate W towards the downstream side of the conveying direction.

[0049] Although not shown here, multiple lower cooling fans 31b are mounted at an angle θ2, such that the blowing surface 33 faces the downstream side of the conveying direction. The aforementioned angle θ2 is equal to the angle θ1 at which the cooling air from the lower cooling fans 31b is inclined towards the downstream side of the conveying direction relative to the direction perpendicular to the substrate W. Therefore, the mounting angles of the multiple upper cooling fans 31a and the multiple lower cooling fans 31b are fixed, making the installation of the cooling fans 31 easy.

[0050] Angle θ2 is, for example, 5 to 30 degrees, preferably 10 to 20 degrees. For example, the installation angle (angle θ2) of multiple cooling fans 31 can be 15 degrees. The installation angle of each cooling fan 31 can vary depending on the spacing between adjacent cooling fans 31, the balance between the upper cooling fan 31a and the lower cooling fan 31b, etc. For example, the installation angle of the most upstream cooling fan 31 can be 45 degrees, and the installation angle of the cooling fan 31 can decrease towards the downstream side.

[0051] When the substrate W is delivered from the molding apparatus 20 to the cooling apparatus 30 at the aforementioned pitch, there may be a situation where the substrate W stops at the upstream position of the cooling section 32, and no substrate W is placed at the downstream position of the cooling section 32. In this case, the control device can adjust the flow rate of cooling air from the multiple cooling fans 31 so that the flow rate of cooling air flowing towards the upstream region in the conveying direction is greater than the flow rate of cooling air flowing towards the downstream region. Therefore, strong cooling air can be directed to the placement position of the substrate W, and the substrate W can be effectively cooled.

[0052] The aforementioned control device can adjust the flow rate of cooling air from the cooling fans by configuring a portion of the multiple cooling fans, such that the flow rate of cooling air exiting from the cooling fan located downstream in the conveying direction is greater than the flow rate of cooling air exiting from the cooling fan located upstream in the conveying direction. Normally, when the flow rate of cooling air exiting from the downstream side is small, the cooling air exiting from the upstream side is blocked, causing it to flow laterally. As described above, by partially increasing the flow rate of cooling air exiting from the downstream cooling fan, it is easier for the cooling air exiting from the upstream cooling fan to flow downstream. Therefore, cooling air can flow in one direction along the conveying direction. Furthermore, dust stirring caused by turbulence at the outlet and backflow due to air bounce against the inner surface of the housing can be suppressed.

[0053] Note that the cooling device 30 may include a measuring device for measuring the temperature of the substrate W. The control device may adjust the flow rate of cooling air from the multiple cooling fans 31 according to the temperature of the substrate W. The control device may also adjust the flow rate of cooling air by, for example, changing the number of cooling fans to be operated among the multiple cooling fans 31. For example, the control device may set the cooling air generated by the cooling fans 31 to "strong wind" by operating ten upper cooling fans 31a, to "medium wind" by operating half (five) of the ten upper cooling fans 31a, and to "weak wind" by operating 1 / 5 of the ten upper cooling fans 31a.

[0054] Second Implementation Method

[0055] The lamination molding system 100 according to the second embodiment includes a supply device 10, a molding device 20, a cooling device 30A, and a recycling device 40. Since the supply device 10, the molding device 20, and the recycling device 40 are the same as those in the first embodiment, their description will be omitted. Figure 6 This is a top view of the cooling device 30A. Figure 7 This is a side view of the cooling device 30A. Figure 6 and Figure 7 In this diagram, the conveying direction is defined as the x-direction, and the direction perpendicular to the x-direction on the conveying surface is defined as the y-direction. The direction perpendicular to the conveying surface is defined as the z-direction.

[0056] In the second embodiment, multiple top-mounted cooling fans 31a are mounted on a mounting plate 34. For example... Figure 6 As shown, when viewed from above, each row of five upper cooling fans 31a arranged along the conveying direction is connected to a mounting plate 34, with two rows arranged along the y-direction. That is, the cooling device 30A includes cooling fan units 35, wherein ten upper cooling fans 31a are mounted to the mounting plate 34.

[0057] The cooling fan unit 35 can move in at least one of the following directions: the conveying direction (x direction), the direction substantially perpendicular to the conveying direction on the conveying surface (y direction), and the direction substantially perpendicular to the conveying surface (z direction). This allows the upper cooling fan 31a to retract from above the cooling section 32 to the side when the laminated film is replaced or maintenance work is performed on the cooling section 32.

[0058] Here, it is assumed that the direction of the cooling air blown out from the upper cooling fan 31a is perpendicular to the blowing surface 33 of the cooling air from the upper cooling fan 31a. Multiple upper cooling fans 31a are attached to the mounting plate 34, so that when the mounting plate 34 is parallel to the conveying surface, the blowing surface 33 is substantially perpendicular to the conveying surface.

[0059] like Figure 5 and Figure 6 As shown, frame 36 is configured to span cooling section 32 along the y-direction. Mounting plate 34 is attached to frame 36 on the downstream side so that it can rotate about pivot 37. By rotating mounting plate 34 downward about pivot 37 from a state parallel to the conveying surface, the angle at which cooling air flows out from multiple upper cooling fans 31a can be changed simultaneously.

[0060] When the mounting plate 34 is tilted at an angle θ3, each upper cooling fan 31a can cause cooling air to flow toward the substrate W in a direction tilted at a predetermined angle θ1 relative to the direction substantially perpendicular to the conveying surface (z direction) toward the downstream side of the conveying direction (x direction). This allows for easy variation of the angle of the cooling air from the multiple upper cooling fans 31a.

[0061] As described above, according to this embodiment, by suppressing the flow of cooling air towards the upstream side in the conveying direction, particles can be prevented from entering the molding apparatus 20. Furthermore, by making the mounting position, mounting angle, and the number of cooling fans 31 to be actuated variable, the substrate W can be effectively cooled. Moreover, by making the cooling fans 31 retractable from the cooling section 32, maintainability can be improved.

[0062] It should be noted that this disclosure is not limited to the above embodiments, and appropriate modifications can be made without departing from the spirit of the matter. In the above example, the direction of cooling air is changed by changing the installation angle of the cooling fan 31, but this disclosure is not limited to this. For example, the direction of cooling air can be changed by providing louvers in front of the blowing surface 33 of the cooling fan 31.

[0063] Those skilled in the art can combine the first and second embodiments as needed.

[0064] Based on the disclosure described herein, it will be apparent that embodiments thereof can be varied in many ways. Such variations should not be considered a departure from the spirit and scope of this disclosure, and all such modifications that are apparent to those skilled in the art are intended to be included within the scope of the claims.

Claims

1. A laminate molding system comprising: a pair of carrier films for sandwiching an object to be laminated between the pair of carrier films from above and below and conveying the object to be laminated in a conveyance direction, the object to be laminated being formed by laminating a laminate on a laminate target; a film unwinding machine for unwinding the carrier films; a laminating machine for pressing the object to be laminated to form a laminate molded product, the laminating machine being disposed on a downstream side with respect to the film unwinding machine; a cooling section designed to cool the laminate molded product, the cooling section being disposed on a downstream side with respect to the laminating machine; and a film winding machine for unloading the laminate molded product placed on the carrier films, the film winding machine being disposed on a downstream side with respect to the laminating machine, wherein the cooling section includes airflow-generating sections designed to flow cooling air in a direction inclined at a predetermined angle with respect to a direction substantially perpendicular to the conveyance direction toward a downstream side of the conveyance direction. The cooling section includes a plurality of the airflow-generating sections arranged in the conveyance direction.

2. The laminate molding system according to claim 1, wherein, The airflow-generating sections are cooling fans having rotating blades.

3. The laminate molding system according to claim 2, wherein, A flattening pressing device for pressing the laminate molded product to improve flatness of a laminate surface of the laminate is further included, the flattening pressing device being disposed on a downstream side with respect to the laminating machine, wherein the cooling section is disposed on a downstream side with respect to the flattening pressing device.

4. The laminate molding system according to claim 1, wherein, The cooling section includes a flow rate adjusting section designed to adjust flow rates of the cooling air from the plurality of airflow-generating sections so that the flow rate of the cooling air flowing toward an upstream side region in the conveyance direction is greater than the flow rate of the cooling air flowing toward a downstream side region in the conveyance direction.

5. The laminate molding system according to claim 2, wherein, The flow rate adjusting section adjusts the flow rates of the cooling air from a part of the plurality of airflow-generating sections so that the flow rate of the cooling air flowing out of the airflow-generating section disposed on the downstream side of the conveyance direction is greater than the flow rate of the cooling air flowing out of the airflow-generating section disposed on the upstream side of the conveyance direction.

6. The laminate molding system according to claim 5, wherein, Further comprising:

7. The laminate molding system of claim 1, wherein, a measuring section designed to measure a temperature of the laminate molded product; and a flow rate adjusting section designed to adjust the flow rates of the cooling air from the plurality of airflow-generating sections in accordance with the temperature of the laminate molded product. The flow rate adjusting section adjusts the flow rates of the cooling air by changing the number of the airflow-generating sections to be operated among the plurality of airflow-generating sections. The plurality of airflow-generating sections are movable in at least one of the conveyance direction, a direction substantially perpendicular to a conveyance plane, and a direction substantially perpendicular to the conveyance plane.

8. The laminate molding system according to claim 5, wherein, The plurality of cooling fans have mounting angles with respect to a plane parallel to a conveyance plane equal to each other.

9. The laminate molding system of claim 1, wherein, The plurality of cooling fans are respectively attached to one mounting plate, and the flow angles of the cooling air blown from the plurality of cooling fans are simultaneously changed by inclining the mounting plate with respect to a plane parallel to a conveyance plane.

10. The laminate molding system of claim 3, wherein, The cooling section includes:

11. The laminate molding system according to claim 3, wherein, a plurality of upper-side cooling fans disposed on an upper surface side of the laminate molded product; and 12. The laminate molding system of claim 3, wherein, ​ ​ a plurality of lower-side cooling fans provided on a lower surface side of the laminate molded article, wherein the upper-side cooling fan causes the cooling air to flow out in a direction inclined toward a downstream side of the conveyance direction with respect to a direction perpendicular to an upper surface of the laminate molded article, and wherein the lower-side cooling fan causes the cooling air to flow out in a direction inclined toward a downstream side of the conveyance direction with respect to a direction perpendicular to a lower surface of the laminate molded article.

13. A method of manufacturing a laminate molded article, comprising: sandwiching, from above and below, an object to be laminated formed by laminating a laminate material on a laminate target body, between a pair of carrier films, and conveying the object to be laminated in a conveyance direction; pressing the conveyed object to be laminated to form a laminate molded article; cooling by an air flow generation portion designed to cause cooling air to flow in a direction inclined at a predetermined angle toward a downstream side of the conveyance direction with respect to a direction substantially perpendicular to the conveyance direction; and unloading the laminate molded article placed on the carrier film.

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