Adhesive tape sheet

Abstract

An adhesive tape sheet includes an adhesive film including a first region attached to a semiconductor structure and vertically overlapping an edge of the semiconductor structure and a second region adjacent to the first region. The adhesive film includes a non-pattern portion and a plurality of pattern portions defined by cutout portions. A portion of the plurality of pattern portions includes an opening portion connected to the non-pattern portion in a first direction, and an extension portion having at least a portion extending from the opening portion in a second direction opposite to the first direction and defined by a cutout portion. A first group of the plurality of pattern portions is disposed on a first area, and a second group of the plurality of pattern portions is disposed on a second area. The first density of the first group and the second density of the second group are different.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0091434, filed on July 11, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. TECHNICAL FIELD

[0002] Example embodiments of the present disclosure relate to an adhesive tape sheet, a method of manufacturing an adhesive tape sheet, and a method of manufacturing a semiconductor device using an adhesive tape sheet. BACKGROUND

[0003] As electronic devices have been designed to have reduced weight and high performance, research and development of semiconductor devices having reduced size, high performance, and high reliability have been continuously conducted. SUMMARY

[0004] Example embodiments of the present disclosure are to provide an adhesive tape sheet including a plurality of patterns formed therein.

[0005] According to example embodiments of the present disclosure, an adhesive tape sheet includes an adhesive film including a first region and a second region, a semiconductor structure attached to the first region and vertically stacked with an edge of the semiconductor structure, the second region adjacent to the first region, wherein the adhesive film includes a non-patterned portion and a plurality of patterned portions defined by cut portions, wherein at least a portion of the plurality of patterned portions includes an opening portion connected to the non-patterned portion in a first direction and an extension portion having at least a portion extending from the opening portion in a second direction opposite to the first direction and defined by the cut portion, wherein a first group of the plurality of patterned portions is disposed on the first region, a second group of the plurality of patterned portions is disposed on the second region, and wherein a first density of the first group of the plurality of patterned portions and a second density of the second group of the plurality of patterned portions are different.

[0006] According to example embodiments of the present disclosure, an adhesive tape sheet includes an adhesive film including a non-patterned region and a patterned region, the patterned region having adhesive patterns defined by a cut pattern, wherein each of the cut pattern defines the adhesive patterns such that at least one side of each of the adhesive patterns is continuous with the non-patterned region and each of the other sides of the adhesive patterns is discontinuous with the non-patterned region, and wherein the patterned region includes a first region and a second region, the adhesive patterns are disposed in the first region at a first density, the adhesive patterns are disposed in the second region at a second density different from the first density.

[0007] According to example embodiments of the present disclosure, a method of manufacturing a semiconductor device includes: disposing a first preliminary semiconductor structure on a first adhesive tape sheet; and forming a second preliminary semiconductor structure by performing a first semiconductor process on the first preliminary semiconductor structure, wherein the first adhesive tape sheet includes a first non-pattern portion and a plurality of first pattern portions, the plurality of first pattern portions being defined by a first cut portion, wherein at least a portion of the plurality of first pattern portions includes a first opening portion connected to the first non-pattern portion in a first direction and a first extension portion having at least a portion extending from the first opening portion in a second direction opposite to the first direction and being defined by the first cut portion. BRIEF DESCRIPTION OF DRAWINGS

[0008] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0009] Figure 1 FIG. 1 is a vertical sectional view illustrating an adhesive tape sheet according to an example embodiment of the present disclosure.

[0010] Figure 2 FIG. 2 is a plan view illustrating an adhesive tape sheet according to an example embodiment of the present disclosure.

[0011] Figure 3A FIG. 3 is an enlarged view illustrating a portion of an adhesive tape sheet according to an example embodiment of the present disclosure.

[0012] Figure 3B FIG. 4 is an enlarged view illustrating a portion of an adhesive tape sheet according to an example embodiment of the present disclosure. Figure 3C

[0013] FIG. 5 is an enlarged view illustrating a portion of an adhesive tape sheet according to an example embodiment of the present disclosure. Figure 4

[0014] FIG. 6 is an enlarged view illustrating a portion of an adhesive tape sheet according to an example embodiment of the present disclosure. Figures 5A-5E

[0015] FIG. 7 is a perspective view illustrating an adhesive tape sheet according to an example embodiment of the present disclosure. Figure 6

[0016] FIG. 8 is an enlarged view illustrating a portion of an adhesive tape sheet according to an example embodiment of the present disclosure. Figure 7

[0017] FIG. 9 is a perspective view illustrating an adhesive tape sheet according to an example embodiment of the present disclosure. Figure 8

[0018] FIG. 10 is an enlarged view illustrating a portion of an adhesive tape sheet according to an example embodiment of the present disclosure. Figure 9

[0019] FIG. 11 is an enlarged view illustrating a portion of an adhesive tape sheet according to an example embodiment of the present disclosure.Figure 10 is a close-up view showing a portion of an adhesive tape sheet according to an example embodiment of the present disclosure.

[0020] Figure 11 is a close-up view showing a portion of an adhesive tape sheet according to an example embodiment of the present disclosure.

[0021] Figure 12 is a close-up view showing a portion of an adhesive tape sheet according to an example embodiment of the present disclosure.

[0022] Figure 13 is a perspective view showing a method of manufacturing an adhesive tape sheet according to an example embodiment of the present disclosure.

[0023] Figure 14 is a flowchart showing a process of a method of sequentially manufacturing a semiconductor device using an adhesive tape sheet according to an example embodiment of the present disclosure.

[0024] Figure 15 is a flowchart showing a process of a method of sequentially manufacturing a semiconductor device using an adhesive tape sheet according to an example embodiment of the present disclosure.

[0025] Figures 16-20 is a vertical sectional view showing a method of manufacturing a semiconductor device using an adhesive tape sheet according to an example embodiment of the present disclosure.

[0026] Figure 21 is a flowchart showing a process of a method of sequentially manufacturing a semiconductor device using an adhesive tape sheet according to an example embodiment of the present disclosure.

[0027] Figures 22-26 is a vertical sectional view showing a method of manufacturing a semiconductor device using an adhesive tape sheet according to an example embodiment of the present disclosure. DETAILED DESCRIPTION

[0028] Hereinafter, embodiments of the present disclosure will be described below with reference to the accompanying drawings.

[0029] Figure 1 is a vertical sectional view showing an adhesive tape sheet according to an example embodiment.

[0030] Figure 2 is a plan view showing an adhesive tape sheet according to an example embodiment.

[0031] Figure 3A is a close-up view showing a portion of an adhesive tape sheet according to an example embodiment, showing a region "A" in Figure 2

[0032] Referring to Figure 1 ​The adhesive tape sheet 1 can include a base layer 20, an adhesive layer 10 on the base layer 20, and a cover layer 30 on the adhesive layer 10. The base layer 20 can be implemented as a base film, the adhesive layer 10 can be referred to as an adhesive film, and the cover layer 30 can be referred to as a cover film.

[0033] The adhesive tape sheet 1 can be attached to an adherend and can protect or support the adherend. The adhesive tape sheet 1 can be implemented as a tape sheet used in a semiconductor process, but example embodiments thereof are not limited thereto. When the adhesive tape sheet 1 is used in a semiconductor process, the adherend can be implemented as a semiconductor wafer W or a chip C (for example, Figure 16 “W1” in FIG. 1, Figure 20 “C” in FIG. 2). For ease of description, an example in which the adhesive tape sheet 1 is used in a semiconductor process will be described.

[0034] The adhesive layer 10 can be attached to an adherend and can protect or support the adherend.

[0035] In one example embodiment, the adhesive layer 10 can prevent damage or contamination when the adherend is moved or handled. The adhesive layer 10 can protect one surface of the adherend by, for example, preventing scratches and debris from occurring on the adherend when the adherend is transported and handled.

[0036] In one example embodiment, the adhesive layer 10 can be a dicing tape used to fix a semiconductor wafer in a process of cutting the semiconductor wafer into individual chips. The adhesive layer 10 can enable a cutting blade to precisely cut the semiconductor wafer.

[0037] In one example embodiment, the adhesive layer 10 can fix and protect a semiconductor chip in a process of packaging the semiconductor chip.

[0038] In one example embodiment, the adhesive layer 10 can not require ultraviolet (UV) curing during a semiconductor process.

[0039] In one example embodiment, when the adhesive layer 10 is removed from the adherend, residue originating from the adhesive layer 10 can not remain on the adherend.

[0040] In one example embodiment, the adhesive layer 10 can be reused after a semiconductor process is performed.

[0041] The adhesive layer 10 can include a material suitable for the above-described purpose. The adhesive layer 10 can include a material having excellent flexibility, chemical resistance, and heat resistance. The adhesive layer 10 can include a soft elastomer or an elastomeric polymer (or an elastic polymer). The adhesive layer 10 can include, for example, at least one of a silicone elastomer, a polyurethane elastomer, an ethylene propylene diene monomer (EPDM) elastomer, a polybutadiene elastomer, and nitrile rubber. Throughout the specification, when an assembly is described as "including" or "comprising" a particular element or group of elements, it should be understood that, unless otherwise clearly and / or explicitly described in the context, the assembly is formed only by the described element or group of elements, or the described element or group of elements can be combined with additional elements to form the assembly. On the other hand, the term "consisting of indicates that the assembly is formed only by the listed element(s).

[0042] The thickness of the adhesive layer 10 can be 100 um or less. In one example embodiment, the thickness of the adhesive layer 10 can be in a range of 5 um or more and 100 um or less.

[0043] The base layer 20 can be disposed on one surface (e.g., a first surface) of the adhesive layer 10, and can be implemented as a support for supporting the adhesive layer 10. The base layer 20 can provide structural stability of the adhesive layer 10. The base layer 20 can provide stability, for example, which can maintain the physical form of the adhesive layer 10 and can withstand externally applied mechanical forces. The base layer 20 can provide heat resistance and chemical resistance to withstand various environmental conditions of a semiconductor process.

[0044] The base layer 20 can include a material suitable for the above-described purpose. The base layer 20 can include a material having excellent flexibility, chemical resistance, and heat resistance. The base layer 20 can include, for example, polyimide (PI), polyester (PET), polyurethane (PU), polyvinyl chloride (PVC), and polyolefin (PO).

[0045] The thickness of the base layer 20 can be 100 um or less. In one example embodiment, the thickness of the base layer 20 can be in a range of 25 um or more and 100 um or less.

[0046] The cover layer 30 can be a cover film disposed on the other surface (e.g., a second surface) of the adhesive layer 10 opposite to the one surface and covering the other surface of the adhesive layer 10. The cover layer 30 can protect the adhesive layer 10 from contact with an external environment. The cover layer 30 can protect the adhesive layer 10 from, for example, dust, contaminants, moisture, etc.

[0047] The cover layer 30 can include a material suitable for the above-described purpose. The cover layer 30 can include a material having excellent chemical resistance and heat resistance and being easily isolated from the adhesive layer 10. The cover layer 30 can include, for example, a polyethylene (PE), a polypropylene (PP), a polyester (PET), and a silicone-treated film.

[0048] The thickness of the cover layer 30 can be 50 um or less. In one example embodiment, the thickness of the cover layer 30 can be in a range of 30 um or more and 50 um or less.

[0049] The adhesive tape sheet 1 can be disposed in a state in which the cover layer 30 covers the adhesive layer 10. The cover layer 30 can be isolated from the adhesive layer 10 such that one surface of the adhesive layer 10 is exposed, and the exposed surface of the adhesive layer 10 can be attached to an adherend.

[0050] The adhesive tape sheet 1 can be disposed with the base layer 20 and the adhesive layer 10. For example, the adhesive tape sheet 1 can be disposed with the base layer 20 and the adhesive layer 10 without the cover layer 30.

[0051] Referring to Figure 2 and Figure 3A , the adhesive layer 10 can include a non-pattern portion NP and a plurality of pattern portions PP.

[0052] Each of the plurality of pattern portions PP can be defined by a cut portion IP. The cut portion IP can be a portion or a partial area that defines the pattern portion PP and divides the adhesive layer 10 into the non-pattern portion NP and the pattern portion PP. The non-pattern portion NP can refer to a portion other than the plurality of pattern portions PP. For example, the non-pattern portion NP can refer to a portion that is not defined by the cut portion IP. Accordingly, a side surface of the non-pattern portion NP and a side surface of the adhesive layer 10 can be aligned. In an example embodiment, the cut portion IP can be referred to as a cut pattern, and the pattern portion PP can be referred to as an adhesive pattern.

[0053] At least one side of the pattern portion PP can be physically connected to the non-pattern portion NP in one direction. The pattern portion PP can be defined to have an opening portion OP and an extension portion EP.

[0054] The opening portion OP can be defined as a portion or a partial area including a boundary portion Ld that separates the pattern portion PP from the non-pattern portion NP and is drawn by a dotted line. The opening portion OP can be disposed between the extension portion EP of the pattern portion PP and the non-pattern portion NP and can be physically connected to the non-pattern portion NP in the first direction D1. The cut portion IP of the pattern portion PP can provide physical separation of the extension portion EP of the pattern portion PP from the non-pattern portion NP. The opening portion OP of the pattern portion PP can provide physical connection of the extension portion EP of the pattern portion PP to the non-pattern portion NP. The physical connection provided by the opening portion OP is shown as the boundary portion Ld in Figure 3A .

[0055] The extension portion EP can be a portion or an area extending from the opening portion OP in a second direction D2 opposite to the first direction D1. The extension portion EP can include a first side s1 and a second side s2 extending from both ends of the opening portion OP in the second direction D2 and opposite to each other, respectively. The extension portion EP can further include a third side s3 connecting the first side s1 to the second side s2 in the horizontal direction and opposite to the opening portion OP. The first to third sides s1, s2, and s3 of the extension portion EP can be defined by the cutout portion IP.

[0056] The length of the pattern portion PP in the horizontal direction and the length in the vertical direction can be substantially the same. The length of the pattern portion PP in the horizontal direction can be defined as the length L1 of the opening portion OP in the horizontal direction, and the length of the pattern portion PP in the vertical direction can be defined as the length (or the maximum length) L2 of the extension portion EP in the vertical direction. For example, the length L1 of the opening portion OP in the horizontal direction and the length L2 of the extension portion EP in the vertical direction can be substantially the same.

[0057] The cutout portion IP can be a cutout pattern formed by penetrating the length in the thickness direction of the adhesive layer 10. The thickness of the cutout portion IP can not be defined. The cutout portion IP can be an open figure having an open shape with "no at least one side" from a planar perspective. For example, the cutout portion IP can have a profile of an incomplete polygonal shape (e.g., an open polygonal shape) or an incomplete circular shape (e.g., an open circular shape).

[0058] In one example embodiment, the cutout portion IP can be an open square shape. The cutout portion IP can have three sides formed along the first to third sides s1, s2, and s3 of the extension portion EP and four corners corresponding to the corners of the extension portion EP.

[0059] The plurality of pattern portions PP can be regularly arranged on the adhesive layer 10.

[0060] The configuration in which the plurality of pattern portions PP are regularly arranged on the adhesive layer 10 from the first perspective can indicate that the density of the plurality of pattern portions PP can be constant in the entire area of the adhesive layer 10.

[0061] The density of the plurality of pattern portions PP can be defined as a ratio of the number of the plurality of pattern portions PP in a randomly selected area of the adhesive layer 10 to the area (or "unit area") of the randomly selected area of the adhesive layer 10.

[0062] For example, the first ratio of the number of the plurality of pattern portions PP in the first area R1 to the area of the adhesive layer 10 can be the same as the second ratio of the number of the plurality of pattern portions PP in the second area R2 to the area of the adhesive layer 10.

[0063] Further, the second ratio can be the same as a third ratio of the number of the plurality of pattern portions PP in the third region R3 to the area of the adhesive layer 10. Here, the first region to the third region R1, R2, R3 can be regions randomly selected in the adhesive layer 10.

[0064] From a second perspective, the configuration in which the plurality of pattern portions PP are regularly arranged on the adhesive layer 10 can indicate that the shape and the size of the cutout portion IP can be substantially the same in the entire region of the adhesive layer 10. For example, the cutout portion IP can have an open square shape having substantially the same size in the first region to the third region R1, R2, and R3. From another perspective, the first length L1 and the second length L2 of the pattern portion PP in the first region R1 can be substantially the same as the first length L1 and the second length L2 of the pattern portion PP in the second region R2, respectively.

[0065] Figure 3B and Figure 3C is an enlarged view showing a portion of an adhesive tape sheet according to an example embodiment, showing a region "A" in Figure 2 .

[0066] Referring to Figure 3B , the adhesive layer 10a can be the same as or similar to the example described with reference to Figure 1-3A except that the adhesive layer 10a includes a configuration in which at least one pattern portion PP in which the length L1 of the opening portion OP in the horizontal direction is greater than the length L2 of the extension portion EP in the vertical direction.

[0067] From another perspective, the length of the cutout portion IP in the horizontal direction can be greater than the length in the vertical direction.

[0068] Referring to Figure 3C , the adhesive layer 10b can be the same as or similar to the example described with reference to Figure 1-3B except that the adhesive layer 10b includes a configuration in which at least one pattern portion PP in which the length L2 of the extension portion EP in the vertical direction is greater than the length L1 of the opening portion OP in the horizontal direction.

[0069] From another perspective, the length of the cutout portion IP in the vertical direction can be greater than the length in the horizontal direction.

[0070] Figure 4 is an enlarged view showing a portion of an adhesive tape sheet according to an example embodiment, showing a region "A" in Figure 2 .

[0071] Referring to Figure 4 , the example can be the same as or similar to the example described with reference to Figure 1-3C except that the cutout portion IP formed on the adhesive layer 10c has a configuration of a thickness.

[0072] The cutout portion IP can be formed to have a thickness along the first to third edges s1, s2, and s3 of the extension portion EP. The cutout portion IP can extend with a substantially uniform thickness along the first to third edges s1, s2, s3. The thickness of the cutout portion IP can be less than the length L1 of the opening portion OP and / or the length L2 of the extension portion EP.

[0073] Figures 5A-5E is an enlarged view showing a portion of an adhesive tape sheet according to an example embodiment, showing Figure 2 Region "A" in

[0074] Referring to Figure 5A , the adhesive layer 10d can be the same as or similar to the example described with reference to Figure 1-4 except that the cutout portion IP has a triangular shape with an opening.

[0075] Through the cutout portion IP, the extension portion EP can include the first edge s1 and the second edge s2 that respectively extend diagonally from the two ends of the opening portion OP and meet each other. Viewed from another perspective, the cutout portion IP can have two edges formed along the first and second edges s1, s2 of the extension portion EP and three corners corresponding to the corners of the extension portion EP.

[0076] Referring to Figure 5B , the adhesive layer 10e can be the same as or similar to the example described with reference to Figure 1-5A except that the cutout portion IP has a circular shape with an opening.

[0077] Through the cutout portion IP, the extension portion EP can have a side surface sa that extends from the two ends of the opening portion OP and has an arc shape. Viewed from another perspective, the cutout portion IP can have a side surface formed along the side surface sa of the extension portion EP and have an arc shape.

[0078] Referring to Figure 5C , the adhesive layer 10f can be the same as or similar to the example described with reference to Figure 1-5B except that the cutout portion IP has a spiral shape (e.g., an irregular pentagonal shape with an opening).

[0079] Through the cutout portion IP, the extension portion EP can include the first edge s1 and the second edge s2 that respectively extend in the second direction D2 from the two ends of the opening portion OP and face each other. The extension portion EP can further include the third edge s3 and the fourth edge s4 that respectively extend diagonally from the end of the first edge s1 and the end of the second edge s2 and meet each other on (or connect on) the opening portion OP. Viewed from another perspective, the cutout portion IP can be formed along the first to fourth edges s1, s2, s3, and s4 of the extension portion EP and can have a spiral shape with one side of the opening.

[0080] Referring to Figure 5D , the adhesive layer 10g can be the same as or similar to the examples described with reference to Figure 1-5C except that the cutout portion IP formed on the adhesive layer 10g has a square shape having an opening with a protrusion on the upper side.

[0081] The extension portion EP can include first and second sides s1 and s2 extending from both ends of the opening portion OP in the second direction D2 and facing each other, by the cutout portion IP.

[0082] The extension portion EP can further include third and fourth sides s3 and s4 extending in the horizontal direction from the ends of the first and second sides s1 and s2, respectively.

[0083] The extension portion EP can further include fifth and sixth sides s5 and s6 extending along the second direction D2 from the ends of the third and fourth sides s3 and s4 and facing each other, respectively.

[0084] The extension portion EP can further include a seventh side s7 extending along the horizontal direction from the ends of the fifth and sixth sides s5 and s6 and meeting each other on the opening portion OP.

[0085] Viewed from another perspective, the cutout portion IP can have a square shape having an opening with a protrusion on the upper portion.

[0086] Referring to Figure 5E , the adhesive layer 10h can be the same as or similar to the examples described with reference to Figure 1-5D except that the cutout portion IP has a star shape of an opening.

[0087] Figure 6 and Figure 8 are perspective views showing examples of peeling the adhesive tape sheet 1 (or "adhesive layer 10") in different directions. Figure 7 is an enlarged view showing a part of the area "B" in Figure 6 , and Figure 9 is an enlarged view showing a part of the area "C" in Figure 8 .

[0088] In the description with reference to Figure 6-9 , the terms "peeling" and "peeling force" can be used. The peeling can indicate the removal of the adhesive tape sheet 1 (or "adhesive layer 10") from the adherend, and the peeling force can be defined as a force for peeling the adhesive tape sheet 1 from the adherend. The adherend (not shown) can be attached to the lower portion of the adhesive layer 10.

[0089] In the description with reference to Figure 6 and Figure 7In the description of

[0090] In the description of Figure 8 and Figure 9 , the force applied to the adhesive layer 10 to peel the adhesive layer 10 from the adherend in the second direction D2 can be referred to as a second peeling force Fp2.

[0091] Figure 6 is a perspective view showing an example of peeling the adhesive layer 10 in the first direction D1. Figure 7 is an enlarged view showing a part of the region "B" in Figure 6 , which shows a relationship between forces applied to the adhesive layer 10.

[0092] In the description of Figure 6 and Figure 7 , a peeling force Fp1 in the first direction D1 can be applied to the adhesive layer 10. The first direction D1 can be a direction in which the opening portion OP of the pattern portion PP is connected to the non-pattern portion NP, and can be a direction opposite to the second direction D2 in which the extension portion EP of the pattern portion PP extends (see Figure 2-3C ).

[0093] When the peeling force Fp1 is applied in the first direction D1 along the non-pattern portion NP, a first stress sf1 and a second stress sf2 with respect to the peeling force Fp1 can occur.

[0094] The first stress sf1 can act on a boundary between the pattern portion PP and the non-pattern portion NP, for example, on both ends of the opening portion OP. The first stress sf1 can include a plurality of stresses having different vectors with respect to each of the both ends of the opening portion OP. Each vector of the plurality of stresses can include a direction crossing the first direction D1.

[0095] The second stress sf2 can act on the pattern portion PP, for example, on the extension portion EP. At least a part of the second stress sf2 can be due to adhesion between the adherend and the adhesive layer 10. The second stress sf2 can have a vector in the second direction D2 opposite to the first direction D1 in which the peeling force Fp1 is applied.

[0096] In one example embodiment, a peeling resistance due to the first stress sf1 and the second stress sf2 can be the greatest. Accordingly, the peeling force Fp1 can have a maximum value among a plurality of peeling forces for peeling the adhesive layer 10.

[0097] Figure 8 is a perspective view showing an example of peeling the adhesive layer 10 in the second direction D2. Figure 9 is an enlarged view showing a part of the region "B" in Figure 8An enlarged view of a portion of the region "C" in FIG. 1, showing a relationship between forces applied to the adhesive layer 10.

[0098] Referring to Figure 8 and Figure 9 , a peeling force Fp2 in a second direction D2 can be applied to the adhesive layer 10. The second direction D2 can be a direction in which the extension EP of the pattern portion PP extends, and can be opposite to the first direction D1 in which the opening portion OP of the pattern portion PP connects to the non-pattern portion NP (see Figure 2-3C ).

[0099] When the peeling force Fp2 is applied in the second direction D2 along the non-pattern portion NP, a first stress sf1 with respect to the peeling force Fp2 can occur.

[0100] The first stress sf1 can act on a boundary between the pattern portion PP and the non-pattern portion NP, for example, on both ends of the opening portion OP. The first stress sf1 can include a plurality of stresses having different vectors with respect to each of the both ends of the opening portion OP. Each vector of the plurality of stresses can include a direction crossing the second direction D2. Referring to Figure 8 , the first stress sf1 described can be smaller than the first stress sf1 described with reference to Figure 6 .

[0101] Differently from the example described with reference to Figure 6 , in an example embodiment, there can be no stress acting in the first direction D1 opposite to the second direction D2 in which the peeling force Fp2 is applied. This can be because the direction in which the peeling force Fp2 is applied and the direction in which the extension EP of the pattern portion PP extends can be substantially the same in the second direction D2. Accordingly, the second peeling force Fp2 can have a minimum value among a plurality of peeling forces for peeling the adhesive layer 10.

[0102] Referring to Figure 6-9 , the peeling forces Fp1 and Fp2 can be due to an external force directly physically applied to the adhesive layer 10, but example embodiments thereof are not limited thereto. The external force can be, for example, an indirect force transmitted to the adhesive layer 10 from a peeling force applied to a film attached to another surface of an adherend, which will be described with reference to Figure 17 and Figure 19 .

[0103] Figure 10 is an enlarged view showing a portion of an adhesive tape sheet according to an example embodiment.

[0104] Referring to Figure 10 , this example can be the same as or similar to the example described with reference to Figure 1-9 , except for a configuration in which a plurality of pattern portions PP are regularly arranged on the adhesive layer 100A.

[0105] From a first perspective, the configuration in which the plurality of pattern portions PP are partially regularly arranged can indicate that the density of the plurality of pattern portions PP can differ depending on the region of the adhesive layer 100A.

[0106] The density of the plurality of pattern portions PP can be defined as the ratio of the number of the plurality of pattern portions PP to the area (or "unit area") of the region of the adhesive layer 100A.

[0107] The adhesive layer 100A can be defined as the plurality of first to fourth regions R1, R2, R3, and R4 depending on the ratio of the number of the plurality of pattern portions PP to the area of the adhesive layer 100A.

[0108] In each of the plurality of first to fourth regions R1, R2, R3, and R4, the ratio of the number of the plurality of pattern portions PP1, PP2, PP3, and PP4 to the area of the adhesive layer 100A can be constant. For example, in the first region R1, a first ratio of the number of the plurality of pattern portions PP1 to the area of the adhesive layer 100A can be constant. In the second region R2, a second ratio of the number of the plurality of pattern portions PP2 to the area of the adhesive layer 100A can be constant. In the third region R3, a third ratio of the number of the plurality of pattern portions PP3 to the area of the adhesive layer 100A can be constant. In the fourth region R4, a fourth ratio of the number of the plurality of pattern portions PP4 to the area of the adhesive layer 100A can be constant.

[0109] In the plurality of first to fourth regions R1, R2, R3, and R4, the ratio of the number of each of the plurality of pattern portions PP1, PP2, PP3, and PP4 to the area of the adhesive layer 100A can differ. For example, the first to fourth ratios can differ.

[0110] From a second perspective, the configuration in which the plurality of pattern portions PP are partially regularly arranged can indicate that the arrangement of the plurality of pattern portions PP differs depending on the region of the adhesive layer 100A.

[0111] The arrangement of the plurality of pattern portions PP can be determined with respect to the direction in which the opening portion OP is connected to the non-pattern portion NP and / or the direction in which the extension portion EP extends from the opening portion OP.

[0112] For example, in the first to third regions R1, R2, and R3, the plurality of pattern portions PP1, PP2, and PP3 can be disposed such that the direction in which each of the opening portions OP1, OP2, and OP3 is connected to the non-pattern portion NP can be a first direction D1, and the direction in which the extension portions EP1, EP2, and EP3 extend from the opening portions OP1, OP2, and OP3 can be a second direction D2 opposite the first direction D1.

[0113] In the fourth region R4, the direction in which the opening portion OP4a of the pattern portion PP4a provided on the one side (e.g., the first side) is connected to the non-pattern portion NP can be the third direction D3, and the direction in which the extension portion EP4a extends from the opening portion OP4a can be the fourth direction D4 opposite to the third direction D3. Here, the third direction D3 and the fourth direction D4 can be directions perpendicular to the first direction D1 and the second direction D2 on the same plane. In addition, in the fourth region R4, the direction in which the opening portion OP4b of the pattern portion PP4b provided on the other side (e.g., the second side) opposite to the one side is connected to the non-pattern portion NP can be the fourth direction D4, and the direction in which the extension portion EP4b extends from the opening portion OP4b can be the third direction D3.

[0114] For example, in the fourth region R4, a plurality of pattern portions PP4 can be provided so that the opening portion OPa of the pattern portion PP4a provided on the one side (e.g., the first side) and the opening portion OP4b of the pattern portion PP4b provided on the other side (e.g., the second side) can be opposite to each other. Thus, when a peeling force is applied in the first direction D1 or the second direction D2, stress occurring in the opening portions OPa and OPb of the pattern portions PP4 of the fourth region R4 can be offset from each other. The fourth region R4 can be referred to as an offset region.

[0115] In each region of the adhesive layer 100A, the density of the plurality of pattern portions PP or the arrangement of the plurality of pattern portions PP can be determined or configured differently depending on the adherend.

[0116] In one example embodiment, the configuration (e.g., the configuration of the pattern portion PP) can be determined by the density of the pattern formed on one surface of the adherend. For example, the density of the pattern portion PP of the adhesive layer 100A corresponding to a region in which the density of the pattern of the adherend is relatively large can be configured to be larger than the density of the pattern portion PP of the adhesive layer 100A corresponding to a region in which the density of the pattern of the adherend is relatively small. The pattern (e.g., the pattern of the adherend) can include a semiconductor pattern provided in accordance with a connection pad and a connection bump formed on the one surface of the adherend.

[0117] Figure 11 and Figure 12 is an enlarged view showing a portion of the adhesive tape sheet according to an example embodiment.

[0118] Referring to Figure 11 and Figure 12 , the adhesive layer 100B and the adhesive layer 100C can be the same as or similar to the example described with reference to Figure 1-10 , except for the configuration in which the pattern portion PP is densely arranged along the edge of the region to which the adherend P1 and the adherend P2 are attached.

[0119] Referring to Figure 11 , a circular adherend P1 can be attached on the adhesive layer 100B. In an example embodiment, the adherend P1 can be a semiconductor wafer (e.g., W1) in which a plurality of semiconductor chips are formed. Figure 16

[0120] The adhesive layer 100B can be defined as having first to third regions R1, R2, and R3. The second region R2 can be defined as a region vertically completely overlapped with the adherend P1. For example, in a plan view, an edge (e.g., a boundary) of the second region R2 can not extend beyond an edge of the adherend P1. In another example, in a plan view, the edge of the second region R2 can be completely within the edge of the adherend P1. The first region R1 can be defined as a region formed along the edge of the adherend P1 around the second region R2. For example, in a plan view, the first region R1 can have a ring shape, but is not limited thereto. For example, in a plan view, a first portion of the first region R1 can be formed within the edge of the adherend P1, and a second portion of the first region R1 can extend beyond the edge of the adherend P1. The third region R3 can be defined as a region surrounding the first region R1 and not overlapped with the adherend P1 in a plan view.

[0121] A density of the pattern portions PP of the adhesive layer 100B in the first region R1 can be greater than a density of the pattern portions PP of the adhesive layer 100B in the second region R2 and / or a density of the pattern portions PP of the adhesive layer 100B in the third region R3. In one embodiment, a size of each of the plurality of pattern portions PP in the first region R1 can be smaller than a size of each of the plurality of pattern portions PP in the second region R2.

[0122] The second region R2 can include a plurality of partial regions, and the density of the pattern portions PP of the adhesive layer 100B can vary according to the plurality of partial regions. Among the plurality of partial regions, the density of the pattern portions PP of the adhesive layer 100B can be determined by a density of a pattern formed on one surface of the adherend P1. The pattern can include a semiconductor pattern disposed according to connection pads and connection bumps formed on the one surface of the adherend P1.

[0123] Referring to Figure 12 , a square-shaped adherend P2 can be attached on the adhesive layer 100C. In an example embodiment, the adherend P2 can be a semiconductor chip.

[0124] ​The adhesive layer 100C can be defined to have first to third regions R1, R2, and R3. The second region R2 can be defined as a region vertically completely overlapping the adherend P2. For example, in a plan view, an edge (e.g., a boundary) of the second region R2 can not extend beyond an edge of the adherend P2. In another example, in a plan view, an edge of the second region R2 can be completely within the edge of the adherend P2. The first region R1 can be defined as a region formed along the edge of the adherend P2 around the second region R2. For example, in a plan view, the first region R1 can have a square ring shape, but is not limited thereto. For example, in a plan view, a first portion of the first region R1 can be formed within the edge of the adherend P2, and a second portion of the first region R1 can extend beyond the edge of the adherend P2. The third region R3 can be defined as a region surrounding the first region R1 and not overlapping the adherend P2 in a plan view.

[0125] As described with reference to Figure 11 , the density of the pattern portion PP of the adhesive layer 100C in the first region R1 can be greater than the density of the pattern portion PP of the adhesive layer 100C in the second region R2 and / or the density of the pattern portion PP of the adhesive layer 100C in the third region R3.

[0126] The second region R2 can include a plurality of partial regions, and the density of the pattern portion PP of the adhesive layer 100C can vary according to the plurality of partial regions. Among the plurality of partial regions, the density of the pattern portion PP of the adhesive layer 100C can be determined by the density of a pattern formed on one surface of the adherend P2. The pattern can include a semiconductor pattern disposed according to a connection pad and a connection bump formed on the one surface of the adherend P2.

[0127] Figure 13 is a perspective view illustrating a method of manufacturing an adhesive tape sheet according to an example embodiment.

[0128] Referring to Figure 13 , a base layer 20 and an adhesive layer 10 can be disposed on a base 40.

[0129] The base 40 can be provided to perform a laser-based subtraction manufacturing technique to form an adhesive pattern (‘PP’ in Figure 2 ) on one surface of the adhesive layer 10, and the base 40 can fix and support the base layer 20 and the adhesive layer 10.

[0130] Using the laser-based subtraction manufacturing technique, various designs of the adhesive pattern can be applied to the one surface of the adhesive layer 10. For example, according to a use purpose of the adhesive tape sheet, various shapes of the adhesive pattern (‘PP’ in Figure 3B , Figure 3C , Figure 4 and Figures 5A-5Eor can be designed differently for each region of the adhesive layer (see Figure 10 "100A" in FIG. 10A, Figure 11 "100B" in FIG. 10B, and Figure 12 "100C" in FIG. 10C).

[0131] Thereafter, a cover layer (see "30" in FIG. 10D) can be provided on the adhesive layer 10, and thus the adhesive tape sheet 1 can be provided. Figure 1

[0132] Figure 14 is a flowchart illustrating a sequential process of a method of manufacturing a semiconductor device using an adhesive tape sheet according to an example embodiment.

[0133] Referring to Figure 14 , the manufacturing of the semiconductor device using the adhesive tape sheet 1 can include providing a first preliminary semiconductor structure on the adhesive tape sheet, and performing a plurality of semiconductor processes on the first preliminary semiconductor structure.

[0134] In one example embodiment, the first preliminary semiconductor structure can include a semiconductor wafer, and the semiconductor device can include a singulated semiconductor chip cut from the semiconductor wafer.

[0135] The manufacturing of the semiconductor device using the adhesive tape sheet 1 can include providing a first preliminary semiconductor structure on a first adhesive tape sheet (S10), forming a second preliminary semiconductor structure by performing a first semiconductor process on the first preliminary semiconductor structure (S20), forming a third preliminary semiconductor structure by performing a second semiconductor process on the second preliminary semiconductor structure (S30), providing the third preliminary semiconductor structure on a second adhesive tape sheet (S40), performing a third semiconductor process on the third preliminary semiconductor structure to form a fourth preliminary semiconductor structure (S50), and performing a fourth semiconductor process on the fourth preliminary semiconductor structure (S60).

[0136] In an example embodiment, the first semiconductor process, the second semiconductor process, and the third semiconductor process can be performed differently (see Figure 15 and Figure 21 ).

[0137] Figure 15 is a flowchart illustrating a sequential process of a method of manufacturing a semiconductor device using an adhesive tape sheet according to an example embodiment.

[0138] Figures 16-20 is a vertical sectional view illustrating a method of manufacturing a semiconductor device using an adhesive tape sheet according to an example embodiment, based on the flowchart of Figure 15 .

[0139] Referring to Figure 15 and Figure 16 ​The first preliminary semiconductor structure ST1 can be provided on the first adhesive tape sheet 1A (S100).

[0140] The first adhesive tape sheet 1A including the base layer 21 and the adhesive layer 11 can be provided. The base layer 21 and the adhesive layer 11 can be components corresponding to the base layer 20 and the adhesive layer 10 described with reference to Figure 1-3A In addition, the adhesive layer 11 of the first adhesive tape sheet 1A can include the same or similar configuration as the example configuration described with reference to Figure 3B 、 Figure 3C 、 Figure 4 and Figures 5A-5E In addition, the adhesive layer 11 of the first adhesive tape sheet 1A can include the same or similar configuration as the example configuration described with reference to Figure 10 The adhesive layer 11 of the first adhesive tape sheet 1A can also include a plurality of pattern portions PP arranged in a regular manner as described with reference to

[0141] The adhesive layer 11 can include a plurality of pattern portions PP defined by non-pattern portions NP and cutout portions IP. The opening portions OP of the plurality of pattern portions PP can be formed to be connected to the non-pattern portions NP in a first direction D1. The extension portions EP of the plurality of pattern portions PP can be formed to extend in a second direction D2 opposite to the first direction D1.

[0142] The ring-shaped frame R can be provided on the first adhesive tape sheet 1A. The ring-shaped frame R can be a component for dicing the first preliminary semiconductor structure ST1 on the first adhesive tape sheet 1A.

[0143] The first preliminary semiconductor structure ST1 can be provided on the first adhesive tape sheet 1A. The first preliminary semiconductor structure ST1 can include a semiconductor wafer W1 as an adherend attached to an upper surface of the first adhesive tape sheet 1A.

[0144] The semiconductor wafer W1 can include a circuit layer 120 formed on a front surface, a front surface insulating layer 121, a front connection pad 132, a connection bump 135, a through electrode 140 provided within a chip region separated by a scribe line SL, and a backside insulating layer 151 and a backside connection pad 152 formed on a back surface.

[0145] The first preliminary semiconductor structure ST1 can further include an adhesive layer c1 formed on a back surface of the semiconductor wafer W1 and a carrier substrate c2. The semiconductor wafer W1 can be provided on the first adhesive tape sheet 1A through the carrier substrate c2. The carrier substrate c2 can be a component to support and handle the semiconductor wafer W1. The semiconductor wafer W1 can be temporarily fixed and supported on the carrier substrate c2 through the adhesive layer c1. The adhesive layer c1 can cover the backside connection pad 152 on the backside insulating layer 151.

[0146] In one example embodiment, the semiconductor wafer W1 can be provided not to include the front surface insulating layer 121 and the connection bump 135. In this case, the adhesive layer 11 can cover the front connection pad 132.

[0147] The first adhesive tape sheet 1A can be defined to have the second region R2 to which the first preliminary semiconductor structure ST1 is attached and which is entirely vertically overlaid with the front surface of the first preliminary semiconductor structure ST1, the first region R1 which is formed along the edge of the first preliminary semiconductor structure ST1 and which surrounds the second region R2, and the third region R3 to which the first preliminary semiconductor structure ST1 is not attached and which surrounds the first region R1. In addition, the first adhesive tape sheet 1A can be defined to have an attachment region RR to which the annular frame R is attached.

[0148] The density of the plurality of pattern portions of the adhesive layer 11 in the regions R1, R2, R3 can be different. For example, the density of the plurality of pattern portions of the adhesive layer 11 in the first region R1 and the second region R2 can be greater than the density of the plurality of pattern portions of the adhesive layer 11 in the third region R3. The density of the plurality of pattern portions of the adhesive layer 11 in the second region R2 can be different depending on the pattern density of the front connection pad 132 and / or the connection bump 135 formed on the front surface of the semiconductor wafer W1. For example, the density of the plurality of pattern portions in the region overlaid with the scribe line SL in the second region R2 can be less than the density of the plurality of pattern portions in other regions in the second region R2.

[0149] Referring to Figure 15 and Figure 17 The first semiconductor process can be performed on the first preliminary semiconductor structure ST1, and a second preliminary semiconductor structure ST2 can be formed (S200).

[0150] The first semiconductor process can include debonding the carrier substrate c2 from the first preliminary semiconductor structure ST1 (S200a).

[0151] The debonding of the carrier substrate c2 (S200a) can include peeling the carrier substrate c2 in the first direction D1 by applying a peeling force Fp1 to the carrier substrate c2 in the first direction D1. A portion Fp1a of the peeling force Fp1 can be transmitted to the adhesive layer 11 of the first adhesive tape sheet 1A, and the portion Fp1a of the peeling force Fp1 can be applied to the adhesive layer 11 of the first adhesive tape sheet 1A in the first direction D1. Accordingly, the adhesive layer 11 of the first adhesive tape sheet 1A can have a strong adhesive force with respect to the first preliminary semiconductor structure ST1 in the debonding process. Accordingly, a crack occurring on the edge of the first preliminary semiconductor structure ST1 can be reduced by the debonding process, and a residue of the adhesive layer c1 on the back surface of the semiconductor wafer W1 can be reduced.

[0152] The first semiconductor process can further include removing a residue of the adhesive layer cl remaining on the back surface of the semiconductor wafer Wl (S200b). The adhesive layer cl can be removed using a solvent. The adhesive layer 11 of the first adhesive tape sheet 1A can have strong chemical resistance to the solvent by including the material described with reference to Figure 1 The material described with reference to

[0153] The second preliminary semiconductor structure ST2 can refer to the semiconductor wafer Wl from which the adhesive layer cl and the carrier substrate c2 are removed.

[0154] The third preliminary semiconductor structure ST3 can be formed by performing a second semiconductor process on the second preliminary semiconductor structure ST2 (S300). Thereafter, the third preliminary semiconductor structure ST3 can be disposed on the second adhesive tape sheet IB (S400). Figure 15 and Figure 18 The second semiconductor process can include cutting the first adhesive tape sheet 1A along the edges of the second preliminary semiconductor structure ST2 (S300a).

[0155] According to example embodiments, a UV curing process for the adhesive layer 11 can not be required before performing the second semiconductor process.

[0156] The third preliminary semiconductor structure ST3 can refer to the semiconductor wafer Wl and the cut first adhesive tape sheet 1A.

[0157] Disposing the third preliminary semiconductor structure ST3 (S400) can include flipping the third preliminary semiconductor structure ST3 and disposing the structure on the second adhesive tape sheet IB.

[0158] The second adhesive tape sheet IB can include a substrate layer 22 and an adhesive layer 12. The substrate layer 22 and the adhesive layer 12 can be components corresponding to the substrate layer 20 and the adhesive layer 10 described with reference to The adhesive layer 12 of the second adhesive tape sheet IB can include the same or similar configuration as the example configuration described with reference to

[0159] , Figure 1-3A , Figure 3B , Figure 3C , Figure 4 and Figures 5A-5E The adhesive layer 12 of the second adhesive tape sheet IB can also include the plurality of pattern portions PP arranged regularly described with reference to Figure 10

[0160] The adhesive layer 12 can include a plurality of patterned portions PP' defined by non-patterned portions NP' and cut-out portions IP'. The opening portions OP' of the plurality of patterned portions PP' can be formed to be connected to the non-patterned portions NP' in a third direction D3. The extension portions EP' of the plurality of patterned portions PP' can be formed to extend in a fourth direction D4 opposite to the third direction D3.

[0161] The setting of the third preliminary semiconductor structure ST3 (S400) can include setting the structure in a first direction (D1) of the third preliminary semiconductor structure ST3, the opening portions OP of the plurality of patterned portions PP of the adhesive layer 11 being connected to the non-patterned portions NP in the first direction can be directed in a direction opposite to the third direction D3. Figure 16 and Figure 17 The setting of the third preliminary semiconductor structure ST3 (S400) can include setting the structure in a first direction (D1) of the third preliminary semiconductor structure ST3, the opening portions OP of the plurality of patterned portions PP of the adhesive layer 11 being connected to the non-patterned portions NP in the first direction can be directed in a direction opposite to the third direction D3. Figure 16 and Figure 17 The setting of the third preliminary semiconductor structure ST3 (S400) can include setting the structure in a first direction (D1) of the third preliminary semiconductor structure ST3, the opening portions OP of the plurality of patterned portions PP of the adhesive layer 11 being connected to the non-patterned portions NP in the first direction can be directed in a direction opposite to the third direction D3.

[0162] Referring to Figure 15 and Figure 19 The fourth preliminary semiconductor structure ST4 can be formed by performing a third semiconductor process on the third preliminary semiconductor structure ST3 (S500).

[0163] The third semiconductor process can include debonding the first adhesive tape sheet 1A from the third preliminary semiconductor structure ST3 (S500a).

[0164] The debonding of the first adhesive tape sheet 1A (S500a) can include peeling the first adhesive tape sheet 1A in the third direction D3 by applying a peeling force Fp2 to the first adhesive tape sheet 1A in the third direction D3. A portion Fp2a of the peeling force Fp2 can be transmitted to the adhesive layer 12, and the portion Fp2a of the peeling force Fp2 can be applied to the adhesive layer 12 in the third direction D3. Thus, in the debonding process, the adhesive layer 12 can have a strong adhesive force to the third preliminary semiconductor structure ST3. Thus, cracks occurring at edges of the third preliminary semiconductor structure ST3 can be reduced by the debonding process. The first adhesive tape sheet 1A can be peeled relatively easily. The peeled first adhesive tape sheet 1A can be reused after cleaning.

[0165] The fourth preliminary semiconductor structure ST4 can be a semiconductor wafer W1 from which the first adhesive tape sheet 1A is removed.

[0166] Referring to Figure 15 and Figure 20 A fourth semiconductor process can be performed on the fourth preliminary semiconductor structure ST4 (S600).

[0167] The fourth semiconductor process can include singulating the fourth preliminary semiconductor structure ST4 into a plurality of semiconductor chips C along the scribe line SL using a blade wheel BW. In this case, the second adhesive tape piece 1B can also be cut into a plurality of components.

[0168] Thereafter, each of the singulated plurality of semiconductor chips C can be attached to an adhesive tape piece according to an example embodiment, and a subsequent semiconductor packaging process can be performed thereon. In the subsequent semiconductor packaging process, attaching each of the plurality of semiconductor chips C to the adhesive tape piece and removing the adhesive tape piece from each of the plurality of semiconductor chips C can be performed in the same manner as described with reference to Figures 16-20 The described examples are substantially the same.

[0169] Figure 21 is a flowchart illustrating a process of a method of sequentially manufacturing semiconductor devices using adhesive tape pieces according to an example embodiment.

[0170] Figures 22-26 is a vertical sectional view illustrating a method of manufacturing semiconductor devices using adhesive tape pieces according to an example embodiment, based on the flowchart of Figure 21

[0171] Referring to Figure 21 and Figure 22 , a first preliminary semiconductor structure ST1' can be provided on a first adhesive tape piece 1A (S1000).

[0172] The first preliminary semiconductor structure ST1' can be an adherend attached to the adhesive layer 11 of the first adhesive tape piece 1A, and can include a semiconductor wafer W2.

[0173] The semiconductor wafer W2 can include a region W2a in which a through electrode (not shown) provided in a chip region separated by the front connection pad 132, a circuit layer (not shown), and a scribe line SL is formed, and a region W2b which is removed through a subsequent polishing process (see Figure 24 ).

[0174] The first adhesive tape piece 1A can be attached to one surface of the first preliminary semiconductor structure ST1'. The first adhesive tape piece 1A can include a base layer 21 and an adhesive layer 11. The base layer 21 and the adhesive layer 11 can be components corresponding to the base layer 20 and the adhesive layer 10 described with reference to Figure 1-3A .

[0175] The adhesive layer 11 can include a plurality of pattern portions PP defined by a non-pattern portion NP and a cut portion IP. The opening portion OP of the plurality of pattern portions PP can be formed to be connected to the non-pattern portion NP in the second direction D2. The extension portion EP of the plurality of pattern portions PP can be formed to extend in the first direction D1 opposite to the second direction D2. ​

[0176] Referring to Figure 21 and Figure 23 A second preliminary semiconductor structure ST2' can be formed by performing a first semiconductor process on the first preliminary semiconductor structure ST1' (S2000).

[0177] The first semiconductor process can include dicing the first preliminary semiconductor structure ST1' (S2000a). The dicing can be a laser stealth dicing process using energy of the laser beam L to dice the interior of the semiconductor wafer W2 along the scribe line SL.

[0178] Referring to Figure 21 and Figure 24 A third preliminary semiconductor structure ST3' can be formed by performing a second semiconductor process on the second preliminary semiconductor structure ST2' (S3000).

[0179] The second semiconductor process can include grinding and / or polishing one region W2a of the semiconductor wafer W2 to remove the region W2b.

[0180] Referring to Figure 21 and Figure 25 The third preliminary semiconductor structure ST3' can be disposed on the second adhesive tape sheet 1B (S4000).

[0181] Disposing the third preliminary semiconductor structure ST3' (S4000) can include flipping the third preliminary semiconductor structure ST3' and disposing the structure on the second adhesive tape sheet 1B.

[0182] The second adhesive tape sheet 1B can include a base layer 22 and an adhesive layer 12. The base layer 22 and the adhesive layer 12 can be components corresponding to the base layer 20 and the adhesive layer 10 described with reference to Figure 1-3A .

[0183] The adhesive layer 12 can include a plurality of patterned portions PP' defined by non-patterned portions NP' and cutout portions IP'. The opening portions OP' of the plurality of patterned portions PP' can be formed to be connected to the non-patterned portions NP' in a third direction D3. The extension portions EP' of the plurality of patterned portions PP' can be formed to extend in a fourth direction D4 opposite to the third direction D3.

[0184] Disposing the third preliminary semiconductor structure ST3' (S4000) can include disposing the structure in a second direction (D2) in which the opening portions OP of the plurality of patterned portions PP of the adhesive layer 11 are connected to the non-patterned portions NP. From another perspective, the third preliminary semiconductor structure ST3' can be disposed such that a first direction (D1) in which the extension portions EP of the adhesive layer 11 extend can be directed in a direction opposite to the fourth direction D4. Figure 22 Figure 22 .​

[0185] Referring to Figure 21 and Figure 26 A fourth preliminary semiconductor structure can be formed by performing a third semiconductor process on the third preliminary semiconductor structure ST3' (S5000).

[0186] The third semiconductor process can include debonding the first adhesive tape sheet 1A from the third preliminary semiconductor structure ST3' (S5000a).

[0187] The debonding of the first adhesive tape sheet 1A (S5000a) can include applying a peeling force Fp3 to the first adhesive tape sheet 1A in the third direction D3 and peeling the first adhesive tape sheet 1A in the third direction D3. A portion Fp3a of the peeling force Fp3 can be transmitted to the adhesive layer 12 of the second adhesive tape sheet 1B, and the portion Fp3a of the peeling force Fp3 can be applied to the adhesive layer 12 of the second adhesive tape sheet 1B in the third direction D3. Accordingly, in the debonding process, the adhesive layer 12 of the second adhesive tape sheet 1B can have a strong adhesive force to the third preliminary semiconductor structure ST3'. Accordingly, a crack occurring at an edge of the third preliminary semiconductor structure ST3' can be reduced by the debonding process. The first adhesive tape sheet 1A can be peeled off relatively easily. The peeled first adhesive tape sheet 1A can be reused after cleaning.

[0188] The fourth preliminary semiconductor structure can refer to a semiconductor wafer W2 from which the first adhesive tape sheet 1A has been removed.

[0189] Thereafter, a fourth semiconductor process can be performed on the fourth preliminary semiconductor structure (S6000).

[0190] The fourth semiconductor process can include applying a pressure to a lower portion of the second adhesive tape sheet 1B such that the second adhesive tape sheet 1B can be bent upward, thereby singulating the fourth preliminary semiconductor structure into a plurality of semiconductor chips along the scribe line SL.

[0191] Thereafter, each of the singulated plurality of semiconductor chips can be attached to an adhesive tape sheet according to an example embodiment, and a subsequent semiconductor packaging process can be performed thereon. In the subsequent semiconductor packaging process, attaching the plurality of semiconductor chips to the adhesive tape sheet and removing the adhesive tape sheet from each of the plurality of semiconductor chips can be substantially the same as described with reference to Figures 22-26

[0192] According to the foregoing example embodiments, an adhesive tape sheet having a plurality of patterns formed therein can be provided.

[0193] Specifically, an adhesive tape sheet including an adhesive film having a plurality of patterns having the same density and formed in all regions, or having different densities in each region can be provided. ​

[0194] Further, a method of manufacturing a semiconductor device using an adhesive tape sheet can be provided. When the adhesive tape sheet is used, a crack occurring at an edge of a semiconductor structure can be reduced, a residue of an adhesive material can be reduced, and a UV curing process for the adhesive tape sheet can not be needed. Accordingly, a semiconductor device having relatively high reliability can be provided.

[0195] While example embodiments have been shown and described above, it will be clear to those of ordinary skill in the art that modifications and variations can be constructed without departing from the scope of the disclosure defined by the appended claims.

Claims

1. An adhesive tape sheet, comprising: An adhesive film has a first region and a second region. A semiconductor structure is attached to the first region, and the first region is vertically stacked with the edge of the semiconductor structure. The second region is adjacent to the first region. The adhesive film includes: a non-patterned portion; and multiple patterned portions defined by cutouts. Each of the plurality of patterned portions includes: an opening connected to a non-patterned portion in a first direction; and an extension having at least a portion extending from the opening in a second direction opposite to the first direction, and defined by a cutout. Wherein, a first group of patterned portions among the plurality of patterned portions is disposed on a first region, and a second group of patterned portions among the plurality of patterned portions is disposed on a second region, and The first density of the first group of patterned portions among the plurality of patterned portions is different from the second density of the second group of patterned portions among the plurality of patterned portions.

2. The adhesive tape sheet according to claim 1, wherein, The first density is greater than the second density.

3. The adhesive tape sheet according to claim 1, wherein, The ratio of the number of the first group of patterned portions to the unit area of ​​the first region of the adhesive film is greater than the ratio of the number of the second group of patterned portions to the unit area of ​​the second region of the adhesive film.

4. The adhesive tape sheet according to claim 1, wherein, The size of each of the first group of patterned portions is smaller than the size of each of the second group of patterned portions.

5. The adhesive tape sheet according to claim 1, wherein, The first region has a ring shape.

6. The adhesive tape sheet according to claim 1, wherein, The second region is the area surrounded by the first region.

7. The adhesive tape sheet according to claim 6, wherein, The second region has multiple regions, in which the multiple patterned portions have different densities.

8. The adhesive tape sheet according to claim 6, in, The adhesive tape further includes: a third region surrounding the first region. Among the plurality of patterned portions, the third group of patterned portions is disposed on the third region, and Among the plurality of patterned portions, the third density of the third group of patterned portions is lower than the first density.

9. The adhesive tape sheet according to claim 1, wherein, The extension of each of the plurality of patterned portions includes: The first side and the second side extend from both ends of the opening in a second direction, and are opposite to each other; and The third side connects the first side to the second side and is opposite to the opening.

10. The adhesive tape sheet according to claim 9, wherein, The length of the opening in the horizontal direction is greater than the maximum length of the extension in the vertical direction.

11. The adhesive tape sheet according to claim 9, wherein, The length of the opening in the horizontal direction is less than the maximum length of the extension in the vertical direction.

12. The adhesive tape sheet according to claim 1, wherein, The extension of each of the plurality of patterned portions includes: The first side and the second side each extend from both ends of the opening in a second direction and are opposite to each other; and The third and fourth sides extend diagonally from the ends of the first and second sides, respectively, and connect at the opening.

13. The adhesive tape sheet according to any one of claims 1 to 12, wherein, Adhesive films include elastic polymers.

14. The adhesive tape sheet according to any one of claims 1 to 12, wherein, The adhesive film includes at least one of silicone elastomer, polyurethane elastomer, ethylene propylene diene monomer elastomer, polybutadiene elastomer and nitrile rubber.

15. The adhesive tape sheet according to any one of claims 1 to 12, further comprising: Basement membrane, on the adhesive membrane.

16. An adhesive tape sheet, comprising: An adhesive film includes non-patterned areas and patterned areas, the patterned areas having an adhesive pattern defined by a cut pattern. Each defined adhesive pattern in the cut pattern is such that at least one side of each adhesive pattern is continuous with the unpatterned region, and each of the other sides of the adhesive pattern is discontinuous with the unpatterned region. The patterned area includes: A first region, wherein the adhesive pattern is disposed in the first region at a first density; and In the second region, the adhesive pattern is set at a second density, different from the first density.

17. The adhesive tape sheet according to claim 16, wherein, At least a portion of the adhesive pattern has an open polygonal shape or an open circular shape, wherein the open polygonal shape has at least one open side, and the open circular shape has at least one open side.

18. The adhesive tape sheet according to claim 16, wherein, At least a portion of the cut pattern extends along the other sides with a uniform thickness.

19. An adhesive tape sheet, comprising: The adhesive film includes multiple patterned portions defined by non-patterned portions and cut portions. Wherein, at least a portion of the plurality of patterned portions of the adhesive film includes: The opening is connected to the non-patterned portion in the first direction; and An extension extends from the opening in a second direction opposite to the first direction and is defined by a cutout. The adhesive film includes an elastic polymer.

20. The adhesive tape sheet according to claim 19, wherein, The extension of at least a portion of the plurality of patterned portions includes: The first side and the second side extend from both ends of the opening in a second direction, and are opposite to each other; and The third side connects the first side to the second side and is opposite to the opening.

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