Heat conduction type semiconductor defrosting system of air cooling refrigerator evaporator and control method of heat conduction type semiconductor defrosting system
By using a thermally conductive semiconductor defrosting system, the cold and heat are provided by the cold and hot ends of the semiconductor module, respectively, which solves the problems of temperature fluctuation and high energy consumption caused by electric heating defrosting in air-cooled refrigerators. This achieves efficient defrosting and temperature uniformity, and reduces energy consumption.
Patent Information
- Application Number
- CN202511594690.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-03
- Publication Date
- 2026-01-20
AI Technical Summary
The existing electric heating defrosting method of air-cooled refrigerators causes the refrigerator compartment temperature to rise rapidly, resulting in high energy consumption, uneven defrosting, high thermal resistance in the heat transfer path, and low heat utilization.
The system employs a thermally conductive semiconductor defrosting system, which utilizes the two ends of the semiconductor module to provide cooling and heating respectively. The heat and cooling are efficiently transferred through the heat-conducting block and heat pipe, replacing the traditional electric heating tube for defrosting and maintaining a stable temperature in the cold storage compartment during the defrosting process.
It improves defrosting efficiency, reduces refrigerator energy consumption, minimizes temperature fluctuations and rewarming of the refrigerator compartment during defrosting, and achieves temperature uniformity and efficient energy utilization during the defrosting process.
Smart Images
Figure CN121363840A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of refrigerator defrosting and semiconductor refrigeration technology, in particular to a heat-conducting semiconductor defrosting system for an evaporator of a forced air-cooled refrigerator and a control method thereof. BACKGROUND
[0002] The forced air-cooled refrigerator has an automatic defrosting function. The defrosting method currently used in the refrigerator is mainly electric heating defrosting. However, this defrosting method has great limitations: the hot steam generated in the defrosting process enters the refrigerator compartment, causing the temperature of the refrigerator compartment to rise rapidly, affecting the storage of goods; the electric heating pipe is arranged at the bottom of the evaporator, and heat needs to be transferred to the evaporator through convection and radiation for defrosting, the thermal resistance of the heat transfer path is extremely large, and a large amount of heat is used to heat the evaporator pipeline and defrosting water, the heat utilization rate is very low; the heating of the electric heating pipe to the evaporator is uneven, in order to avoid defrosting residues, the electric heating pipe usually needs to be heated to a high temperature, which increases the energy consumption of the refrigerator. SUMMARY
[0003] The purpose of the present application is to overcome the shortcomings of the prior art, provide a heat-conducting semiconductor defrosting system for an evaporator of a forced air-cooled refrigerator and a control method thereof, utilize semiconductor refrigeration technology, and utilize heat-conducting auxiliary defrosting. The present application reduces the high defrosting energy consumption of the refrigerator and the phenomenon of temperature rise in the refrigerator refrigeration compartment caused by the shutdown of the refrigerator compressor during the defrosting stage.
[0004] To achieve the above purpose, the present application adopts the following technical solutions.
[0005] The heat-conducting semiconductor defrosting system for the evaporator of the forced air-cooled refrigerator comprises: a freezer compartment 109, a refrigeration compartment 110, and a refrigerator refrigeration system, the refrigerator refrigeration system comprising: a compressor, a condenser, a throttling device, an evaporator 107, and an air duct system; wherein the compressor, the condenser, the throttling device, and the evaporator 107 are sequentially connected end to end to form a cycle; the evaporator 107 and a freezer air duct are vertically arranged in the intermediate compartment between the freezer compartment partition and the refrigerator back plate; and a fan is arranged in the freezer air duct. The semiconductor defrosting system comprises a cold guide plate 101, a semiconductor module 102, a first heat-conducting block 103, a heat pipe 104, a second heat-conducting block 105, and a heat-conducting plate 106 which are sequentially connected to form an integrated structure. The second heat-conducting block 105 is arranged on the upper end of the serpentine tube of the evaporator of the refrigerator refrigerating system, and a heat-conducting plate 106 is arranged in the center of the second heat-conducting block 105; the heat-conducting plate 106 is vertically arranged on the serpentine tube of the evaporator 107 and is arranged in parallel with the fins of the evaporator 107; heat pipes 104 are arranged on the left and right sides of the second heat-conducting block 105; a plurality of groups of cold-conducting plates 101, semiconductor modules 102 and first heat-conducting blocks 103 are arranged in the heat preservation layer in the partition layer between the freezing chamber 109 and the refrigerating chamber 110; each semiconductor module 102 comprises a first port and a second port, the cold-conducting plate 101 is arranged between the first port and the bottom plate of the refrigerating chamber, and the first heat-conducting block 103 is arranged between the second port and the top plate of the freezing chamber; the heat pipes 104 pass through the first heat-conducting block 103 and the second heat-conducting block 105 at two ends, respectively. Further comprising a controller and a temperature and humidity sensor, the controller and the temperature and humidity sensor are arranged in the evaporator cabin of the refrigerator refrigerating system, the temperature and humidity sensor obtains the temperature and humidity of the freezing chamber of the air-cooled refrigerator, and after the temperature and humidity signal is transmitted to the controller, the controller controls the start and stop of the compressor and the semiconductor defrosting system.
[0006] The controller is configured to: during the defrosting stage, the semiconductor module is arranged to have a forward current, and the direction of the current is unchanged; the first port provides cold energy, and the second port provides heat.
[0007] The semiconductor module 102 is a cuboid with a length of 40mm-60mm, a width of 40mm-60mm and a height of 3mm-6mm; the first heat-conducting block 103 and the second heat-conducting block 105 are both cuboids with a length of 50mm-80mm, a width of 50mm-80mm and a height of 10mm-30mm.
[0008] Thermal insulation material is arranged between the first port and the second port.
[0009] The heat pipe 104 is L-shaped and attached to the pipeline of the evaporator; the heat pipe uses the evaporation and condensation of the internal working medium to conduct heat, transmits a large amount of heat through unit cross-sectional area, and is a two-phase heat transfer element with high heat conduction performance.
[0010] The throttling device is one of a thermal expansion valve, a capillary valve or an electronic expansion valve.
[0011] The control method of the heat-conducting type semiconductor defrosting system of the air-cooled refrigerator evaporator meets the following conditions simultaneously: the temperature T1 of the refrigeration compartment 110 is less than the set temperature T11, the temperature T2 of the freezer compartment 109 is less than the set temperature T21, the relative humidity RH of the cabin where the evaporator 107 is located is greater than the set humidity RH2, and the periodic temperature change difference ΔT0 of the evaporator 107 is less than the set temperature difference ΔT01, or the continuous operation time t1 of the refrigerator refrigeration system is greater than the set operation time t11, the refrigerator enters the defrosting stage, the refrigerator refrigeration system is turned off, the semiconductor defrosting system is started, the semiconductor defrosting system is powered on, the semiconductor defrosting system is controlled to operate, the first port of the semiconductor module 102 provides cold energy to the refrigeration compartment 110 through the cold plate 101, reduces the temperature fluctuation of the refrigeration compartment 110 during defrosting, and reduces the rewarming phenomenon of the refrigeration compartment 110; the second port of the semiconductor module 102 conducts heat through the first heat-conducting block 103, the heat pipe 104, the second heat-conducting block 105, and the heat-conducting plate 106 to provide heat to the evaporator 107 of the refrigerator refrigeration system for defrosting; When the temperature T1 of the refrigeration compartment 110 is greater than the set temperature T11, or the temperature T2 of the freezer compartment 109 is greater than the set temperature T21, or the temperature T0 of the evaporator 107 is greater than the set temperature T01, or the continuous operation time t2 of the semiconductor module is greater than the set operation time t11, the refrigerator is in the refrigeration stage, the semiconductor defrosting system is turned off, and the evaporator of the refrigeration system normally works to provide cold energy to the freezer compartment 109. The refrigeration stage includes: opening the evaporator damper, powering on the fan, powering on the compressor, and powering off the semiconductor defrosting system. The refrigeration stage includes: powering off the compressor. The defrosting stage includes: closing the evaporator damper, powering off the fan, powering off the compressor, and powering on the semiconductor defrosting system. The defrosting stage includes: powering off the semiconductor defrosting system. In the semiconductor defrosting system, the heat released from the second port of the semiconductor module 102 is transferred to the first heat-conducting block 103 in a heat-conducting manner, and then transferred to the upper end second heat-conducting block 105 of the evaporator 107 through the heat pipe in the center of the first heat-conducting block 103, and then transferred to the frost layer on the surface of the evaporator through the heat-conducting plate 106 in the second heat-conducting block 105, thereby defrosting the surface of the air-cooled refrigerator evaporator in a heat-conducting manner. Part of the cold energy released from the first port of the semiconductor module 102 is conducted through the cold plate 101 to the refrigeration compartment 110, exchanges heat with the air in the refrigeration compartment 110, reduces the temperature fluctuation of the refrigeration compartment during defrosting, and reduces the rewarming phenomenon of the refrigeration compartment.
[0012] In the defrosting phase, the first port and the second port of the semiconductor module 102 work simultaneously.
[0013] The beneficial effects of the present application compared with the prior art are: The present application provides cold and heat at both ends of the semiconductor module by heat conduction, uses the heat released by the second port of the semiconductor to replace the electric heating tube to defrost the evaporator of the refrigerator, and provides the cold released by the first port of the semiconductor to the refrigerating compartment, reduces the temperature fluctuation caused by the shutdown of the compressor during the defrosting process of the refrigerating compartment, and suppresses the rewarming phenomenon caused by the shutdown of the compressor during the defrosting process, thereby achieving the purposes of improving the defrosting efficiency, reducing the energy consumption of the refrigerator, reducing the temperature fluctuation during defrosting, and suppressing the rewarming of the compartment during defrosting. The temperature uniformity during defrosting is guaranteed. The heating efficiency of the semiconductor defrosting is higher than that of the traditional electric heating rod. The present application introduces a semiconductor defrosting system, realizes the cooperative use of the cold of the first port and the heat of the second port of the semiconductor module, improves the energy utilization efficiency, uses the cold of the semiconductor to exchange heat with the air in the refrigerating compartment, provides strong guarantee for the temperature uniformity of the compartment during defrosting, uses the heat pipe with high thermal conductivity to efficiently transfer the cold of the semiconductor defrosting system to the cold plate and the heat conducting block, and efficiently transfer the heat of the semiconductor defrosting system to the evaporator of the refrigerator, the heat transfer path is efficient, and the energy consumption of the refrigerator is effectively reduced. The semiconductor defrosting system has small size and is convenient to arrange, can be directly attached and arranged in the area with the largest flow resistance and the most serious frosting, and realizes targeted and efficient defrosting. BRIEF DESCRIPTION OF DRAWINGS
[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0015] Figure 1 Structure diagram of the heat conduction type semiconductor defrosting system of the air-cooled refrigerator evaporator according to the present application; In the drawings: 101-cold plate, 102-semiconductor module, 103-first heat conducting block, 104-heat pipe, 105-second heat conducting block, 106-heat conducting plate, 107-evaporator, 108-side plate, 109-frozen compartment, 110-refrigerating compartment. DETAILED DESCRIPTION
[0016] In order to make the technical features, objectives and effects of the method more clearly understood, the technical solutions of the present application will be further described below in combination with the drawings and specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making innovative efforts fall within the scope of protection of the present application.
[0017] As shown in Figure 1 The present application provides a heat-conducting type semiconductor defrosting system for an evaporator of a refrigeration refrigerator, which comprises a freezing chamber 109, a refrigerating chamber 110, and a refrigerator refrigerating system.
[0018] The refrigerator refrigerating system comprises a compressor, a condenser, a throttling device, an evaporator 107, and an air duct system.
[0019] The compressor, the condenser, the throttling device, and the evaporator 107 are sequentially connected end to end to form a cycle; an evaporator (107) and a freezing air duct are vertically arranged in an intermediate cabin between a freezing chamber partition and a refrigerator back plate; and a fan is arranged in the freezing air duct.
[0020] The semiconductor defrosting system comprises a first heat-conducting block 103, a second heat-conducting block 105, a heat-conducting plate 106, a cold-conducting plate 101, a heat pipe 104, and a semiconductor module 102. The second heat-conducting block 105 is arranged on the upper end of a serpentine tube of the evaporator of the refrigerator refrigerating system, and the second heat-conducting block 105 is centrally provided with the heat-conducting plate 106; the heat-conducting plate 106 is vertically placed on the serpentine tube of the evaporator 107 and is placed in parallel with the fins of the evaporator 107; the heat pipes 104 are arranged on the left and right sides of the second heat-conducting block 105; a plurality of sets of the cold-conducting plate 101, the semiconductor module 102, and the first heat-conducting block 103 are arranged in a heat preservation layer in a partition layer between the freezing chamber 109 and the refrigerating chamber 110; each semiconductor module 102 comprises a first port and a second port, the cold-conducting plate 101 is arranged between the first port and a refrigerating chamber bottom plate, and the first heat-conducting block 103 is arranged between the second port and a freezing chamber top plate; the heat pipes 104 pass through the first heat-conducting block 103 and the second heat-conducting block 105 at both ends, respectively; the semiconductor defrosting system further comprises a controller, which is arranged in an evaporator cabin of the refrigerator refrigerating system and is used to acquire the temperature of the refrigerating chamber 110 and the freezing chamber 109 and the humidity of the freezing chamber 109.
[0021] Further, the controller is further configured to: during the defrosting phase, the semiconductor module is set to forward current, and the current direction is unchanged; the first port provides cold energy, and the second port provides heat. This has the advantage that, while defrosting is being performed using the second port of the semiconductor module, cold energy can also be supplemented to the refrigeration compartment using the first port of the semiconductor, while the effects of defrosting and preventing rewarming are both taken into account.
[0022] Further, the throttling device is one of a thermal expansion valve, a capillary valve, or an electronic expansion valve.
[0023] The semiconductor module 102 is a cuboid with a length of 40mm-60mm, a width of 40mm-60mm, and a height of 3mm-6mm; the first heat-conducting block 103 and the second heat-conducting block 105 are both cuboids with a length of 50mm-80mm, a width of 50mm-80mm, and a height of 10mm-30mm. Therefore, the overall volume of the semiconductor defrosting system is smaller than that of a conventional electric heating tube, and the semiconductor defrosting system is easier to arrange than a conventional electric heating tube.
[0024] Further, heat insulation material is arranged between the first port and the second port. Arranging the heat insulation material can maximize heat leakage reduction, maximize refrigeration efficiency, and effectively prevent internal components from being affected by water vapor and oxygen, thereby extending the service life.
[0025] Further, the heat pipe 104 is L-shaped and attached to the pipeline of the evaporator; the heat pipe uses evaporation and condensation of an internal working medium to perform heat transfer, and is a two-phase heat transfer element with extremely high heat conductivity, which has several orders of magnitude of improvement in heat conductivity compared to a conventional metal pipe.
[0026] Further, the heat released by the second port of the semiconductor module 102 in the semiconductor defrosting system is transferred to the first heat-conducting block 103 in a heat-conducting manner, and then transferred to the upper end of the evaporator through the heat pipe 104 in the center of the first heat-conducting block 103, and then transferred to the surface frost layer of the evaporator 107 through the heat-conducting plate 106 in the second heat-conducting block 105, thereby defrosting the surface of the evaporator 107 of the air-cooled refrigerator in a heat-conducting manner.
[0027] Further, part of the cold energy released by the first port of the semiconductor defrosting system is cooled by the cold-conducting plate 101, and then transferred to the refrigeration compartment 110 to exchange heat with the air in the refrigeration compartment 110, thereby reducing temperature fluctuations in the refrigeration compartment 110 during defrosting and alleviating the rewarming phenomenon of the refrigeration compartment 110.
[0028] Further, in the defrosting phase of the air-cooled refrigerator, the first port and the second port of the semiconductor module in the semiconductor defrosting system work simultaneously to defrost the evaporator 107 of the air-cooled refrigerator, which reduces the temperature fluctuation and rewarming phenomenon of the refrigeration compartment 110 caused by the shutdown of the compressor of the refrigerator refrigeration system, and ensures the temperature uniformity of the refrigeration compartment 110.
[0029] Further, the semiconductor module 102 in the semiconductor defrosting system is connected to the first heat-conducting block 103 and the heat-dissipating plate 101 through heat-conducting silicone grease.
[0030] Further, the heat released by the second port of the semiconductor module is transferred to the frost layer in a heat-conducting manner through the first heat-conducting block 103, the heat pipe 104, the second heat-conducting block 105, and the heat-conducting plate 106 to perform the defrosting process.
[0031] Further, the controller and the temperature and humidity sensor are arranged in the evaporator compartment of the refrigerator refrigeration system, the temperature and humidity sensor obtains the temperature and humidity of the freezing compartment of the air-cooled refrigerator, and after transmitting the temperature and humidity signals to the controller, the controller controls the start and stop of the compressor and the semiconductor defrosting system.
[0032] The control method of the heat-conducting semiconductor defrosting system of the evaporator of the air-cooled refrigerator comprises the following steps: When the temperature T1 of the refrigeration compartment 110 is less than the set temperature T11, the temperature T2 of the freezing compartment 109 is less than the set temperature T21, the relative humidity RH of the compartment where the evaporator 107 is located is greater than the set humidity RH2, and the periodical temperature change difference ΔT0 of the evaporator 107 is less than the set temperature difference ΔT01, or when the continuous operation time t1 of the compressor of the refrigerator refrigeration system is greater than the set operation time t11, the refrigerator enters the defrosting phase, the refrigerator refrigeration system is turned off, the semiconductor defrosting system is started, the semiconductor defrosting system is powered on, the operation of the semiconductor defrosting system is controlled, the first port of the semiconductor module 102 provides cold energy to the refrigeration compartment 110 through the heat-dissipating plate 101 to reduce the temperature fluctuation of the refrigeration compartment 110 during defrosting and alleviate the rewarming phenomenon of the refrigeration compartment 110; the second port of the semiconductor module 102 provides heat to the evaporator of the refrigerator refrigeration system through the first heat-conducting block 103, the heat pipe 104, the second heat-conducting block 105, and the heat-conducting plate 106 to perform defrosting.
[0033] When the temperature T1 of the refrigeration compartment 110 is greater than the set temperature T11, or the temperature T2 of the freezing compartment 109 is greater than the set temperature T21, or the temperature T0 of the evaporator 107 is greater than the set temperature T01, or the semiconductor module continuous operation time t2 is greater than the set operation time t11, the refrigerator is in the refrigeration phase, the semiconductor defrosting system is turned off, the evaporator of the refrigeration system is normally operated to provide cold energy for the freezing compartment 109.
[0034] Further, during the refrigeration phase operation of the air-cooled refrigerator, the evaporator air door is opened, the fan is powered on and operated, the compressor is powered on and operated, and the semiconductor defrosting system is powered off. Further, during the defrosting phase operation of the air-cooled refrigerator, the evaporator air door is closed, the fan is powered off, the compressor is powered off, and the semiconductor defrosting system is powered on. Further, the controller transmits an electric signal to the semiconductor defrosting system to control the semiconductor module to be powered on.
[0035] It can be understood that the same or similar parts in the above-mentioned embodiments can be mutually referred to, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.
[0036] It should be noted that the terms "first", "second", and the like used in the present application are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated.
[0037] The present application is not limited to the embodiments described above. The above description of the specific embodiments is intended to describe and illustrate the technical solutions of the present application, and the specific embodiments described above are only illustrative and not restrictive. Without departing from the purpose of the present application and the scope protected by the claims, those skilled in the art can make many forms of specific changes under the guidance of the present application, which are all within the protection scope of the present application.
[0038] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", and "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more examples in a suitable manner.
[0039] While embodiments of the present application have been shown and described above, it is to be understood that the above-described embodiments are merely illustrative of rather than limiting of the present application. Changes and modifications can be made by those skilled in the art within the scope of the present application as defined by the appended claims, and their equivalents.
Claims
1. A heat conduction type semiconductor defrosting system for an evaporator of an air-cooled refrigerator, characterized by, The air-cooled refrigerator comprises a freezing compartment (109), a refrigerating compartment (110) and a refrigerator refrigerating system, the refrigerator refrigerating system comprising a compressor, a condenser, a throttling device, an evaporator (107) and an air duct system; wherein the compressor, the condenser, the throttling device and the evaporator (107) are sequentially connected end to end to form a cycle; the evaporator (107) and a freezing air duct are vertically arranged in an intermediate compartment between a freezing compartment partition and a refrigerator back plate, and a fan is arranged in the freezing air duct; The semiconductor defrosting system comprises a cold conducting plate (101), a semiconductor module (102), a first heat conducting block (103), a heat pipe (104), a second heat conducting block (105) and a heat conducting plate (106) which are sequentially connected to form an integrated structure. The second heat conducting block (105) is arranged on the upper end of a serpentine pipe of an evaporator of the refrigerator refrigerating system, and the heat conducting plate (106) is arranged at the center of the second heat conducting block (105); the heat conducting plate (106) is vertically arranged on the serpentine pipe of the evaporator (107) and is arranged in parallel with fins of the evaporator (107); the heat pipe (104) is arranged on the left and right sides of the second heat conducting block (105); a plurality of sets of the cold conducting plate (101), the semiconductor module (102) and the first heat conducting block (103) are arranged in a heat preservation layer in a partition layer between the freezing compartment (109) and the refrigerating compartment (110); each semiconductor module (102) comprises a first port and a second port, the cold conducting plate (101) is arranged between the first port and a refrigerating compartment bottom plate, and the first heat conducting block (103) is arranged between the second port and a freezing compartment top plate; the heat pipe (104) passes through the first heat conducting block (103) and the second heat conducting block (105) at two ends thereof. Further comprising a controller and a temperature and humidity sensor, the controller and the temperature and humidity sensor are arranged in an evaporator compartment of the refrigerator refrigerating system, the temperature and humidity sensor acquires the temperature and humidity of the freezing compartment of the air-cooled refrigerator, and after transmitting the temperature and humidity signals to the controller, the controller controls the start and stop of the compressor and the semiconductor defrosting system.
2. The heat conduction type semiconductor defrosting system of the air-cooled refrigerator evaporator according to claim 1, characterized by, The controller is configured to: during the defrosting phase, the semiconductor module is arranged to have a forward current, and the current direction is unchanged; the first port provides cold energy, and the second port provides heat.
3. The heat conduction type semiconductor defrosting system of the air-cooled refrigerator evaporator according to claim 1, characterized in that, The semiconductor module (102) is a cuboid with a length of 40mm-60mm, a width of 40mm-60mm and a height of 3mm-6mm; the first heat conducting block (103) and the second heat conducting block (105) are cuboids with a length of 50mm-80mm, a width of 50mm-80mm and a height of 10mm-30mm.
4. The heat conduction type semiconductor defrosting system of the air-cooled refrigerator evaporator according to claim 1, characterized by, Thermal insulation material is arranged between the first port and the second port.
5. The heat conduction type semiconductor defrosting system of the air-cooled refrigerator evaporator according to claim 1, characterized in that, The heat pipe (104) is L-shaped and attached to a pipeline of the evaporator; the heat pipe uses evaporation and condensation of an internal working medium to perform heat transfer, transmits a large amount of heat through a unit cross-sectional area, and is a two-phase heat transfer element with high heat conduction performance.
6. The heat conduction type semiconductor defrosting system of the air-cooled refrigerator evaporator according to claim 1, characterized by, The throttling device is one of a thermal expansion valve, a capillary valve and an electronic expansion valve.
7. The control method of the heat-conduction type semiconductor defrosting system of the evaporator of the air-cooled refrigerator according to any one of claims 1 to 6, characterized by, When the temperature T1 of the refrigeration compartment (110) is less than the set temperature T11, the temperature T2 of the freezer compartment (109) is less than the set temperature T21, the relative humidity RH of the cabin where the evaporator (107) is located is greater than the set humidity RH2, and the periodic temperature change difference ΔT0 of the evaporator (107) is less than the set temperature difference ΔT01, or when the continuous running time t1 of the compressor of the refrigerator refrigeration system is greater than the set running time t11, the refrigerator enters the defrosting stage, the refrigerator refrigeration system is turned off, the semiconductor defrosting system is started, the semiconductor defrosting system is powered on, the semiconductor defrosting system is controlled to operate, the first port of the semiconductor module (102) provides cold energy to the refrigeration compartment (110) through the cold plate (101), reduces the temperature fluctuation of the refrigeration compartment (110) during defrosting, and reduces the rewarming phenomenon of the refrigeration compartment (110); the second port of the semiconductor module (102) conducts heat through the first heat conduction block (103), the heat pipe (104), the second heat conduction block (105), and the heat conduction plate (106), and provides heat to the evaporator (107) of the refrigerator refrigeration system to defrost; When the temperature T1 of the refrigeration compartment (110) is greater than the set temperature T11, or the temperature T2 of the freezer compartment (109) is greater than the set temperature T21, or the temperature T0 of the evaporator (107) is greater than the set temperature T01, or the continuous running time t2 of the semiconductor module is greater than the set running time t11, the refrigerator is in the refrigeration stage, the semiconductor defrosting system is turned off, and the evaporator of the refrigeration system normally works to provide cold energy to the freezer compartment (109); The refrigeration stage includes: opening the evaporator damper, powering on the fan, and powering on the compressor. The refrigeration stage includes: turning off the compressor. The defrosting stage includes: turning off the evaporator damper, turning off the fan, turning off the compressor, and powering on the semiconductor defrosting system. The defrosting stage includes: turning off the semiconductor defrosting system. In the semiconductor defrosting system, the heat released by the second port of the semiconductor module (102) is transferred to the first heat conduction block (103) in a heat conduction manner, and then the heat is transferred to the second heat conduction block (105) on the upper end of the evaporator (107) through the heat pipe in the center of the first heat conduction block (103), and then the heat is transferred to the frost layer on the surface of the evaporator through the heat conduction plate (106) in the second heat conduction block (105), thereby defrosting the surface of the evaporator of the air-cooled refrigerator in a heat conduction manner; part of the cold energy released by the first port of the semiconductor module (102) is cooled through the cold plate (101) and transferred to the refrigeration compartment (110), exchanges heat with the air in the refrigeration compartment (110), reduces the temperature fluctuation of the refrigeration compartment (110) during defrosting, and reduces the rewarming phenomenon of the refrigeration compartment (110).
8. The control method of the heat conduction type semiconductor defrosting system of the evaporator of the air-cooled refrigerator according to claim 7, characterized in that, In the defrosting stage, the first port and the second port of the semiconductor module (102) work simultaneously.