Inverted magnetron

Abstract

The invention discloses an inverted magnetron which comprises a supporting heat dissipation assembly, a permanent magnet, a resonant cavity, an external cathode (a hot cathode or a cold cathode can be selected), an antenna and a power supply line. The supporting heat dissipation assembly is composed of a ceramic supporting piece, a heat dissipation copper shell, an anode heat conduction upper shell, an anode heat conduction lower shell, a cathode upper cover and a cathode lower cover which are coaxial, the ceramic supporting piece is fixed to the center of the heat dissipation copper shell, the cathode upper cover and the cathode lower cover are arranged at the upper end and the lower end of the heat dissipation copper shell respectively, and the anode heat conduction shell is externally connected with the heat dissipation copper shell and internally connected with the resonant cavity. The external cathode surrounds the inner side of the ceramic supporting piece, the two ends of the external cathode are connected with the cathode cover, and the resonant cavity is arranged in the external cathode and makes contact with the anode heat conduction shell. The antenna is led upwards from the resonant cavity, and the power supply line is connected with the cathode cover to supply power. According to the scheme, miniaturization of the resonant cavity is achieved through inverted layout, efficient heat dissipation and an axial uniform magnetic field are combined, high-power millimeter waves are stably output at low cost, and the resonant cavity is suitable for the fields of communication, radar and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of magnetron, in particular to a magnetron with inverted structure. BACKGROUND

[0002] Millimeter wave technology has important application value in the fields of communication, radar, medical treatment and scientific research, etc. However, the realization of its signal source usually depends on the interaction of laser and crystal resonant cavity, which has problems of high cost, low output power and complex system. Although the traditional magnetron can generate microwaves efficiently, its structure design is difficult to directly adapt to the millimeter wave frequency band, mainly because of the following reasons: 1. Size limitation: the wavelength of millimeter wave is extremely short, which requires the size of the resonant cavity to be miniaturized. However, the cathode-anode layout of the traditional magnetron is "central cathode + peripheral anode resonant cavity", which makes it difficult to reduce the resonant cavity to millimeter level. Moreover, under the condition of small size, there are also problems of heat dissipation, assembly precision and stability, etc.

[0003] 2. Magnetic field uniformity and magnetic field strength requirement: millimeter wave generation requires an axial uniform magnetic field, but the layout of the permanent magnet of the traditional magnetron easily causes magnetic field distortion, affecting the efficiency of the resonant cavity; millimeter wave output requires higher magnetic field strength, and the size of the traditional magnetron limits the distance between the magnets, preventing the increase of the magnetic field strength.

[0004] 3. Heat management problem: after miniaturization, the heat of the anode and the resonant cavity is concentrated, and the traditional heat dissipation structure is difficult to effectively conduct heat in a compact space, which easily leads to performance degradation or device damage.

[0005] In the prior art, some schemes try to generate millimeter wave through semiconductor process or quantum cascade laser, but there are defects such as insufficient power (usually milliwatt level), high cost or poor environmental adaptability. The improvement of the traditional magnetron focuses on optimizing the magnetic field or the cathode structure, but it cannot break through the layout limitation of "cathode built-in", which leads to the difficulty in further reducing the size of the resonant cavity. SUMMARY

[0006] In view of the above deficiencies in the prior art, the present application aims to provide a magnetron with inverted structure, which exchanges the positions of the cathode and anode of the traditional magnetron (inverted), installs the anode originally placed in the periphery to the center position, and places the electron cathode originally placed in the center in the periphery, which has significant advantages in resonant cavity miniaturization, heat dissipation, magnetic field optimization, assembly stability and cost control, and provides a reliable solution for efficient and low-cost realization of millimeter wave technology.

[0007] The technical scheme adopted by the present application to achieve the above-mentioned purpose is: a magnetron with inverted structure, comprising: a resonant cavity group composed of a plurality of resonant cavities; The external cathode is arranged outside the resonant cavity. Further comprising: The permanent magnet is arranged at both ends of the external cathode. The antenna is led out from the resonant cavity The power supply line is electrically connected with the external cathode.

[0008] On the basis of the above technical solutions, in order to ensure that each functional and structural component of the inverted magnetron can be stably assembled and operated, and to meet the requirements of heat dissipation and power supply, the following technical solutions are provided.

[0009] Further comprising a support heat dissipation assembly, which comprises a ceramic support arranged coaxially, a heat dissipation copper shell, an anode heat conduction upper shell, an anode heat conduction lower shell, a cathode upper cover, and a cathode lower cover. The ceramic support is fixedly installed at the inner side center of the heat dissipation copper shell. The cathode upper cover and the cathode lower cover are arranged in the heat dissipation copper shell and are assembled to the upper and lower ends of the ceramic support, respectively. The outer edges of the anode heat conduction upper shell and the anode heat conduction lower shell are fixedly connected with the upper and lower ends of the heat dissipation copper shell, respectively. The inner edges of the anode heat conduction upper shell and the anode heat conduction lower shell are arranged at the inner sides of the cathode upper cover and the cathode lower cover, respectively. The external cathode is arranged at the inner side of the ceramic support. The cathode upper cover and the cathode lower cover are in contact with the upper and lower ends of the external cathode, respectively. The resonant cavity is arranged at the inner sides of the cathode upper cover and the cathode lower cover and is in contact with the anode heat conduction upper shell and the anode heat conduction lower shell. The outer side ends of the anode heat conduction upper shell and the anode heat conduction lower shell are both provided with the permanent magnet. The antenna is arranged along the axis of the support heat dissipation assembly. The power supply line is in contact with the cathode upper cover and the cathode lower cover.

[0010] On the basis of the above technical solutions, in order to ensure the stability of the installation of the ceramic support in the heat dissipation copper shell and the stability of the installation of the permanent magnet on the upper and lower sides of the heat dissipation copper shell, the following technical solutions are provided.

[0011] The support heat dissipation assembly further comprises an insulating positioning sleeve which is sleeved to the inner side of the heat dissipation copper shell. The inner wall of the heat dissipation copper shell is provided with a positioning step groove. The top end of the ceramic support is in abutment with the positioning step groove. The insulating positioning sleeve is in abutment with the bottom surface of the ceramic support and the outer edge of the anode heat conduction lower shell. The anode heat conduction upper shell and the heat dissipation copper shell are fixedly combined by means of threaded connection.

[0012] On the basis of the above technical solutions, in order to realize the packaging and combination of the support heat dissipation assembly and each component arranged therein, and to ensure the stable installation of the permanent magnet, the following technical solutions are provided.

[0013] Further comprising a package shielding connection upper shell and a package shielding connection lower shell, the package shielding connection upper shell is fixedly connected to the top end periphery of the heat dissipation copper shell and is arranged to extend upwards, the antenna is arranged at the inner side axis of the package shielding connection upper shell, the package shielding connection lower shell is fixedly connected to the bottom end periphery of the heat dissipation copper shell and is arranged to extend downwards, the power supply wire is arranged inside the package shielding connection lower shell, and the periphery of the package shielding connection upper shell and the package shielding connection lower shell is fixedly connected with the permanent magnet.

[0014] On the basis of the above technical solution, in order to ensure the coaxiality of the antenna arrangement and the protection effect, the following technical solution is provided.

[0015] The top end of the package shielding connection upper shell is fixedly connected with a ceramic isolation ring, the upper side of the ceramic isolation ring is fixedly connected with a sealing cover, the top end of the antenna is assembled to the sealing cover, and the periphery of the sealing cover is fixedly connected with a protective cover.

[0016] On the basis of the above technical solution, in order to ensure that the power supply wire can be stably assembled in the package shielding connection lower shell and realize effective electrical connection with the cathode upper cover, the cathode lower cover and the external cathode, the following technical solution is provided.

[0017] The bottom of the package shielding connection lower shell is fixedly connected with a ceramic seat, the bottom end of the ceramic seat is assembled with a positive electrode lug and a negative electrode lug, the anode heat-conducting lower shell is provided with a gap through opening, the cathode upper cover and the cathode lower cover are both provided with a clamping port and a wiring port, the end of the external cathode is in nested contact with the clamping port, the power supply wire includes two groups arranged through the gap through opening and connected with the positive electrode lug and the negative electrode lug respectively, and the two groups of power supply wires are connected with the two groups of wiring ports respectively.

[0018] On the basis of the above technical solution, in order to ensure that the resonant cavity can generate stable millimeter waves under the action of a magnetic field and a current, the following technical solution is provided.

[0019] The antenna is connected with a coaxially arranged signal microwave bridge, the periphery of the signal microwave bridge is assembled with resonant poles which are uniformly distributed in an annular array, the gap between adjacent resonant poles is the resonant cavity, and the number of the resonant cavities is even.

[0020] On the basis of the above technical solution, the following replacement scheme for the external cathode is provided. The external cathode is a hot cathode or a cold cathode.

[0021] The beneficial effects of the present application are as follows: 1. Realize millimeter wave high efficiency generation, reduce cost, adopt flip layout of built-in anode resonant cavity and external cathode, make external cathode surround the periphery of resonant cavity, greatly reduce the size of anode and resonant cavity (up to millimeter level), so as to directly generate millimeter wave, without relying on expensive laser crystal resonant cavity scheme. Compared with the traditional millimeter wave generation mode, the scheme has simple structure, low cost, and can provide higher output power, and is suitable for large-scale industrial application.

[0022] 2. Heat dissipation and thermal stability, support heat dissipation assembly to form an efficient heat conduction path, quickly conduct the heat of the resonant cavity and the anode to the heat dissipation copper shell, avoid performance decline or damage caused by local overheating. The ceramic support has insulation and structural support functions, ensures the symmetry and stability of the cathode assembly, and isolates the heat conduction path to improve the overall heat dissipation efficiency.

[0023] 3. Enhance the uniformity of magnetic field and improve the resonance efficiency, the upper and lower arrangement of permanent magnet provides axial uniform magnetic field, optimizes the electron motion trajectory, makes the electromagnetic field distribution in the resonant cavity more stable, and improves the millimeter wave generation efficiency.

[0024] 4. Compact structure, stable assembly, insulation positioning sleeve and positioning step groove ensure the accurate fixation of the ceramic support in the heat dissipation copper shell, avoid the influence of vibration or thermal deformation on performance. The packaging shielding shell, ceramic isolation ring and sealing cover can ensure the coaxiality of the antenna, prevent dust and interference, and improve the stability of signal transmission. The optimized layout of the power supply wire can connect the positive and negative electrodes through the gap and the ceramic seat, ensure the reliable electrical contact, and reduce energy loss. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a structural schematic diagram of the present application; Figure 2 is a structural schematic diagram of another view of the present application; Figure 3 is a structural schematic diagram of the internal structure of the present application; Figure 4 is a structural schematic diagram of the support heat dissipation assembly and the packaging shielding connection shell in the disassembled state; Figure 5 is a structural schematic diagram of the tungsten wire, tungsten wire power supply wire and related components in the support heat dissipation assembly; Figure 6 is a top view of the resonant cavity and tungsten wire.

[0026] In the figure: 11 ceramic support, 12 heat dissipation copper shell, 121 positioning step groove, 131 anode heat conduction upper shell, 132 anode heat conduction lower shell, 133 let go of the passageway, 141 cathode upper cover, 142 cathode lower cover, 143 clamping interface, 144 wiring port, 15 insulation positioning sleeve, 2 permanent magnet, 3 resonant cavity, 31 resonant pole, 32 signal microwave bridge, 4 external cathode, 5 antenna, 6 power supply wire, 71 encapsulation shielding connection upper shell, 711 ceramic isolation ring, 712 sealing cover, 713 protective cover, 72 encapsulation shielding connection lower shell, 721 ceramic seat, 722 positive ear, 723 negative ear. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0028] Please refer to Figures 1-6 , The inverted magnetron comprises a permanent magnet 2, a resonant cavity 3, an external cathode 4, an antenna 5, and a power supply wire 6. The resonant cavity 3 is arranged inside the external cathode 4. The permanent magnet 2 is arranged at both ends of the external cathode 4. The antenna 5 is led out from the resonant cavity 3. The power supply wire 6 is electrically connected with the external cathode 4.

[0029] In the embodiment, the external cathode 4 can be a hot cathode or a cold cathode. The hot cathode can be a spiral tungsten wire external hot cathode. The external cathode 4 provided in the accompanying drawings adopts a spiral tungsten wire. The cold cathode can be a graphene cold cathode and the like.

[0030] To ensure that each functional and structural component of the inverted magnetron can be stably assembled and operated, and to meet the requirements of heat dissipation and power connection, the following technical solutions are provided.

[0031] The support and heat dissipation assembly comprises a ceramic support 11, a heat dissipation copper shell 12, an anode heat conduction upper shell 131, an anode heat conduction lower shell 132, a cathode upper cover 141 and a cathode lower cover 142, the ceramic support 11 is fixedly installed at the inner side center of the heat dissipation copper shell 12, the cathode upper cover 141 and the cathode lower cover 142 are arranged in the heat dissipation copper shell 12 and are respectively assembled to the upper and lower ends of the ceramic support 11, the outer edges of the anode heat conduction upper shell 131 and the anode heat conduction lower shell 132 are fixedly connected with the upper and lower ends of the heat dissipation copper shell 12 respectively, the inner edges of the anode heat conduction upper shell 131 and the anode heat conduction lower shell 132 are arranged at the inner sides of the cathode upper cover 141 and the cathode lower cover 142 respectively, the external cathode 4 is arranged at the inner side of the ceramic support 11, the cathode upper cover 141 and the cathode lower cover 142 are in contact connection with the upper and lower ends of the external cathode 4 respectively, the resonant cavity 3 is arranged at the inner sides of the cathode upper cover 141 and the cathode lower cover 142 and is in contact connection with the anode heat conduction upper shell 131 and the anode heat conduction lower shell 132, the outer side ends of the anode heat conduction upper shell 131 and the anode heat conduction lower shell 132 are respectively provided with the permanent magnet 2, the antenna 5 is arranged along the axis of the support and heat dissipation assembly, and the power supply wire 6 is in contact connection with the cathode upper cover 141 and the cathode lower cover 142.

[0032] The magnetron adopts the layout mode that the anode resonant cavity 3 is arranged inside and the external cathode 4 is arranged outside, so that the external cathode 4 surrounds the periphery of the resonant cavity 3, the magnetron is reversely arranged, the size of the anode can be very small, the resonant cavity 3 can be millimeter level, and millimeter waves can be generated for a millimeter wave signal source.

[0033] The traditional millimeter wave is generated by laser in a crystal resonant cavity, the cost is high and the power is small, and the reversely arranged magnetron can generate large output power at low cost.

[0034] The designed support and heat dissipation assembly can realize stable assembly and operation of the permanent magnet 2, the resonant cavity 3, the external cathode 4, the antenna 5 and the power supply wire 6 in a narrow space, and meets the heat dissipation requirement of the magnetron.

[0035] Specifically, the ceramic support 11 can provide stable support and insulation effect, so as to ensure symmetrical arrangement and stable installation of the cathode upper cover 141 and the cathode lower cover 142, so that the external cathode 4 is stably assembled between the cathode upper cover 141 and the cathode lower cover 142, and the external cathode 4 is effectively powered through the connection of the power supply wire 6 with the cathode upper cover 141 and the cathode lower cover 142.

[0036] The setting of the heat dissipation copper shell 12 can ensure the stable installation of the ceramic support 11, and is insulated from the cathode upper cover 141 and the cathode lower cover 142 by the isolation of the ceramic support 11, and ensures the stable assembly of the anode heat-conducting upper shell 131 and the anode heat-conducting lower shell 132 and the effective heat transmission. The anode heat-conducting upper shell 131 and the anode heat-conducting lower shell 132 can ensure the stable installation of the resonant cavity 3 and effectively transmit the heat generated by the operation of the resonant cavity 3 to the heat dissipation copper shell 12 for high-efficiency heat dissipation. The two groups of permanent magnets 2 can provide a uniform magnetic field arranged in the axial direction to meet the magnetic field environment requirement of the operation of the resonant cavity 3.

[0037] In order to ensure the stability of the installation of the ceramic support 11 in the heat dissipation copper shell 12 and the stable installation of the permanent magnet 2 on the upper and lower sides of the heat dissipation copper shell 12, the following technical solutions are provided.

[0038] The support heat dissipation assembly further comprises an insulating positioning sleeve 15 sleeved to the inner side of the heat dissipation copper shell 12. The inner wall of the heat dissipation copper shell 12 is provided with a positioning step groove 121. The top end of the ceramic support 11 abuts against the positioning step groove 121. The insulating positioning sleeve 15 abuts against the bottom surface of the ceramic support 11 and the outer edge of the anode heat-conducting lower shell 132. The anode heat-conducting upper shell 131 is fixed and combined with the heat dissipation copper shell 12 by threaded connection.

[0039] The anode heat-conducting upper shell 131 is fixed and combined with the heat dissipation copper shell 12 by threaded connection, and the ceramic support 11 is assembled from the bottom end of the heat dissipation copper shell 12 and positioned by the insulating positioning sleeve 15. The insulating positioning sleeve 15 is made of ceramic material or thermosetting insulating rubber sleeve and has good structural strength and insulation performance. With the cooperation of the positioning step groove 121 and the insulating positioning sleeve 15, the stable installation of the ceramic support 11 in the heat dissipation copper shell 12 can be realized.

[0040] Assembly grooves are arranged at the top end and the bottom end of the ceramic support 11, so that the outer edges of the cathode upper cover 141 and the cathode lower cover 142 are adhesively fixed into the assembly grooves on the corresponding side, realizing the fixed combination of the cathode upper cover 141 and the cathode lower cover 142 with the ceramic support 11.

[0041] In order to realize the packaging combination of the support heat dissipation assembly and the components arranged therein, and ensure the stable installation of the permanent magnet 2, the following technical solutions are provided.

[0042] Further comprising a packaging shielding connection upper shell 71 and a packaging shielding connection lower shell 72, the packaging shielding connection upper shell 71 is fixedly connected to the top end periphery of the heat dissipation copper shell 12 and extends upwards, the antenna 5 is arranged at the inner side axis of the packaging shielding connection upper shell 71, the packaging shielding connection lower shell 72 is fixedly connected to the bottom end periphery of the heat dissipation copper shell 12 and extends downwards, the power supply wire 6 is arranged inside the packaging shielding connection lower shell 72, and the periphery of the packaging shielding connection upper shell 71 and the packaging shielding connection lower shell 72 is fixedly connected with the permanent magnet 2.

[0043] The packaging shielding connection upper shell 71 and the packaging shielding connection lower shell 72 can ensure that the magnetic field provided by the permanent magnet 2 passes normally, shield external interference, and fix the packaging, and are fixedly combined with the upper and lower ends of the heat dissipation copper shell 12 in a clamping or bonding manner, thereby realizing the packaging and fixation of the components of the heat dissipation assembly. The two groups of permanent magnets 2 are also assembled thereon in a clamping or bonding manner, realizing stable installation of the permanent magnets 2 and providing a stable magnetic field environment.

[0044] In order to ensure the coaxiality and protection effect of the antenna 5, the following technical solutions are provided.

[0045] The top end of the packaging shielding connection upper shell 71 is fixedly connected with a ceramic isolation ring 711, the upper side of the ceramic isolation ring 711 is fixedly connected with a sealing cover 712, the top end of the antenna 5 is assembled to the sealing cover 712, and the periphery of the sealing cover 712 is fixedly connected with a protective cover 713.

[0046] The ceramic isolation ring 711 can avoid the influence and interference of other components on the antenna 5 and ensure stable assembly of the protective cover 713 and the sealing cover 712. The design of the sealing cover 712 can ensure the coaxiality of the antenna 5 and effectively seal the antenna 5 to avoid dust and sundries from entering. The protective cover 713 is assembled to the periphery of the sealing cover 712, which can further protect the protective cover 713 and the antenna 5. The top end of the antenna 5 is led out from the sealing cover 712 and led out through the opening at the top end of the protective cover 713.

[0047] In order to ensure that the power supply wire 6 can be stably assembled in the packaging shielding connection lower shell 72 and realize effective electrical connection with the cathode upper cover 141, the cathode lower cover 142 and the external cathode 4, the following technical solutions are provided.

[0048] The bottom of the package shielding connecting lower shell 72 is fixedly connected with a ceramic seat 721, the bottom end of the ceramic seat 721 is equipped with a positive electrode ear 722 and a negative electrode ear 723, the anode heat-conducting lower shell 132 is provided with a let-passing opening 133, the cathode upper cover 141 and the cathode lower cover 142 are both provided with clamping interfaces 143 and wiring interfaces 144, the end of the external cathode 4 is in nested contact with the clamping interfaces 143, and the power supply wires 6 include two groups of wires penetrating through the let-passing opening 133 and connected with the positive electrode ear 722 and the negative electrode ear 723 respectively, and the two groups of power supply wires 6 are connected with the two groups of wiring interfaces 144 respectively.

[0049] The two groups of power supply wires 6 penetrate through the ceramic seat 721 to realize electrical connection with the positive electrode ear 722 and the negative electrode ear 723, one group of power supply wires 6 is directly electrically connected with the wiring interface 144 of the cathode lower cover 142 after penetrating through the corresponding let-passing opening 133, and the other group of power supply wires 6 is arranged to penetrate through the ceramic support 11 after penetrating through the corresponding let-passing opening 133 and realizes electrical connection with the wiring interface 144 on the cathode upper cover 141.

[0050] In order to ensure that the resonant cavity 3 can generate stable millimeter waves under the action of a magnetic field and current, the following technical solutions are provided.

[0051] The antenna 5 is connected with a coaxially arranged signal microwave bridge 32, the signal microwave bridge 32 is peripherally equipped with resonant poles 31 uniformly distributed in a ring array, the gap between adjacent resonant poles 31 is set as the resonant cavity 3, and the number of the resonant cavities 3 is even, for example, 8 or 16.

[0052] Under the action of the resonant poles 31, the resonant cavity 3 limits electromagnetic waves in a limited space inside it and forms a stable standing wave through geometric constraints and resonance conditions, realizes frequency selection and energy amplification, stably transmits outward through the signal microwave bridge 32 and the antenna 5, can screen specific wavelengths, generates coherent laser, and can also be used as an important component for frequency selection or frequency stabilization in a communication system.

[0053] It is obvious to those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0054] Furthermore, it should be understood that although the specification is described in terms of embodiments, not every embodiment includes every feature or implementation described herein. The specification can include implicit combinations of explicitly mentioned features and / or implicit combinations of implicitly mentioned features. Such combinations are also expressly included within the scope of the specification and an embodiment.

Claims

1. An inverted magnetron, characterized in that The utility model relates to a kind of magnetron, including: Resonant cavity group, by multiple resonant cavities (3) is formed; External cathode (4), it is arranged in the outside of resonant cavity (3); Further comprising: Permanent magnet (2), it is arranged in the both ends of external cathode (4); Antenna (5), it is led out by resonant cavity (3) Power supply line (6), it is electrically connected with external cathode (4).

2. An inverted magnetron as claimed in claim 1, characterised in that: The external cathode (4) is hot cathode or cold cathode.

3. The inverted magnetron of claim 1, wherein: Further comprising support heat dissipation component, the support heat dissipation component includes ceramic support (11) that keeps coaxial arrangement, heat dissipation copper shell (12), anode heat conduction upper shell (131), anode heat conduction lower shell (132), cathode upper cover (141), cathode lower cover (142), the ceramic support (11) is fixedly installed to the inside center of heat dissipation copper shell (12), the cathode upper cover (141), cathode lower cover (142) are arranged in heat dissipation copper shell (12) and are respectively assembled to the upper and lower ends of ceramic support (11), the outer edge of anode heat conduction upper shell (131), anode heat conduction lower shell (132) is fixedly connected with the upper and lower ends of heat dissipation copper shell (12) respectively, the inner edge of anode heat conduction upper shell (131), anode heat conduction lower shell (132) is arranged in the inside of cathode upper cover (141), cathode lower cover (142), the external cathode (4) is arranged in the inside of ceramic support (11), the cathode upper cover (141), cathode lower cover (142) are respectively with the upper and lower ends of external cathode (4) keep contact connection, the resonant cavity (3) is arranged in the inside of cathode upper cover (141), cathode lower cover (142) and keeps contact connection with anode heat conduction upper shell (131), anode heat conduction lower shell (132), the outside end of anode heat conduction upper shell (131), anode heat conduction lower shell (132) is assembled with the permanent magnet (2), the antenna (5) is arranged along the axis of support heat dissipation component, the power supply line (6) keeps contact connection with cathode upper cover (141), cathode lower cover (142).

4. An inverted magnetron as claimed in claim 3, characterised in that: The support heat dissipation component further includes insulating positioning sleeve (15) that is sleeved to the inside of heat dissipation copper shell (12), the inner wall of heat dissipation copper shell (12) is provided with positioning step groove (121), the top end of ceramic support (11) keeps abutment with positioning step groove (121), the insulating positioning sleeve (15) keeps abutment with the bottom surface of ceramic support (11), the outer edge of anode heat conduction lower shell (132), anode heat conduction upper shell (131) and heat dissipation copper shell (12) are fixedly combined by the way of threaded connection.

5. An inverted magnetron as claimed in claim 3, characterised in that: Also include a package shielding connection upper shell (71), package shielding connection lower shell (72), the package shielding connection upper shell (71) is fixedly connected to the top end of the heat dissipation copper shell (12) periphery and extends upwards and is arranged, the antenna (5) is arranged at the inside shaft of the package shielding connection upper shell (71), the package shielding connection lower shell (72) is fixedly connected to the bottom end of the heat dissipation copper shell (12) periphery and extends downwards and is arranged, the power supply wire (6) is arranged inside the package shielding connection lower shell (72), the periphery of the package shielding connection upper shell (71), package shielding connection lower shell (72) is fixedly connected with the permanent magnet (2).

6. An inverted magnetron as claimed in claim 5, characterised in that: The top end of the package shielding connection upper shell (71) is fixedly connected with a ceramic isolation ring (711), the upper side of the ceramic isolation ring (711) is fixedly connected with a sealing cover (712), the top end of the antenna (5) is assembled to the sealing cover (712), and the periphery of the sealing cover (712) is fixedly connected with a protective cover (713).

7. An inverted magnetron as claimed in claim 5, characterised in that: The bottom of the package shielding connection lower shell (72) is fixedly connected with a ceramic seat (721), the bottom end of the ceramic seat (721) is assembled with a positive ear (722) and a negative ear (723), the anode heat-conducting lower shell (132) is provided with a letting-through opening (133), the cathode upper cover (141) and the cathode lower cover (142) are provided with a clamping port (143) and a wiring port (144), respectively, the end of the external cathode (4) is in nested contact with the clamping port (143), and the power supply wire (6) includes two groups arranged through the letting-through opening (133) and connected with the positive ear (722) and the negative ear (723), respectively, and the two groups of power supply wires (6) are connected with the two groups of wiring ports (144), respectively.

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