Reinforcing and laminating method and flexible circuit board

Abstract

The invention relates to the technical field of flexible circuit board manufacturing, and discloses a reinforcing and pressing method and a flexible circuit board, the reinforcing and pressing method comprises the steps that a first substrate and a second substrate are stacked between a lower die of a press and an upper die of the press, the first substrate is located on one side, facing the lower die, of the second substrate, and the second substrate is located on one side, facing the upper die, of the second substrate; a first reinforcement is arranged on the side, facing the lower die, of the first substrate, a first adhesive layer is arranged between the first reinforcement and the first substrate, a second reinforcement is arranged on the side, facing the upper die, of the second substrate, and a second adhesive layer is arranged between the second reinforcement and the second substrate; and enabling the upper die and the lower die to be close to each other, enabling the lower die to extrude the first reinforcements, and enabling the upper die to extrude the second reinforcements. The invention provides a reinforcement pressing method and a flexible circuit board, which can improve the reinforcement pressing efficiency and reduce the production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of flexible circuit board manufacturing, and in particular to a reinforcing and pressing method and a flexible circuit board. BACKGROUND

[0002] With the popularity of new energy vehicles and charging piles, the quality requirements for flexible circuit boards (FPC) used by new energy batteries are also increasing, and the processing cost needs to be reduced. The flexible circuit board often needs to be reinforced and pressed (such as FR4).

[0003] The flexible circuit board used by the new energy battery is generally a large-size product, and the number of single boards is small. When using a conventional press for reinforcing and pressing, the efficiency is low, and the production cost is high, which cannot meet the requirements of mass production. SUMMARY

[0004] The present application provides a reinforcing and pressing method and a flexible circuit board, which can improve the pressing efficiency of the reinforcement and reduce the production cost.

[0005] In a first aspect, the embodiments of the present application provide a reinforcing and pressing method, comprising:

[0006] stacking a first substrate and a second substrate between a lower die of a press and an upper die of the press, the first substrate being located on a side of the second substrate facing the lower die, a first reinforcement being provided on a side of the first substrate facing the lower die, a first adhesive layer being provided between the first reinforcement and the first substrate, a second reinforcement being provided on a side of the second substrate facing the upper die, and a second adhesive layer being provided between the second reinforcement and the second substrate;

[0007] moving the upper die and the lower die towards each other, so that the lower die extrudes the first reinforcement, and the upper die extrudes the second reinforcement.

[0008] In some embodiments, a hard plate is provided between the first substrate and the second substrate.

[0009] In some embodiments, one side of the upper die facing the lower die is a projection surface; wherein a normal projection of the first reinforcement on the projection surface is located inside a normal projection of the hard plate on the projection surface, and / or a normal projection of the second reinforcement on the projection surface is located inside a normal projection of the hard plate on the projection surface.

[0010] In some embodiments, the thermal conductivity of the hard plate is 100 W / (m·K)-3000 W / (m·K).

[0011] In some embodiments, the upper mold is connected with a hanger; before the first substrate and the second substrate are placed on the lower mold of the press and the upper mold of the press, the reinforcing press bonding method further comprises:

[0012] The hard plate is lifted using the hanger, so that the hard plate is spaced apart from the lower mold and the hard plate is spaced apart from the upper mold;

[0013] The first substrate and the first reinforcing are placed on the lower mold, and the second substrate and the second reinforcing are placed on the hard plate;

[0014] The upper mold and the lower mold are moved close to each other, which comprises moving the lower mold towards the upper mold.

[0015] In some embodiments, the hanger comprises a connecting rod and a hook connected with each other, and the connecting rod is rotatably connected with the upper mold; the hard plate is lifted using the hanger, which comprises suspending the hook on the edge of the hard plate; when the lower mold is moved towards the upper mold, the lower mold presses the hook and the connecting rod rotates relative to the upper mold.

[0016] In some embodiments, the hanger comprises a chain and a hook connected with each other, and the chain is connected with the upper mold; the hard plate is lifted using the hanger, which comprises suspending the hook on the edge of the hard plate.

[0017] In some embodiments, a first release film is arranged between the lower mold and the first reinforcing; and / or, a second release film is arranged between the upper mold and the second reinforcing.

[0018] In some embodiments, the lower mold comprises a lower hot plate and a lower silica gel assembly arranged on the side of the lower hot plate facing the first reinforcing; and / or, the upper mold comprises an upper hot plate and an upper silica gel assembly arranged on the side of the upper hot plate facing the second reinforcing.

[0019] In a second aspect, the embodiments of the present application provide a flexible circuit board, which is processed by the reinforcing press bonding method as described in the first aspect.

[0020] The reinforcing and pressing method provided by the embodiments of the present application has the beneficial effects that: the first substrate and the second substrate are first placed in a laminated manner between the lower die of the pressing machine and the upper die of the pressing machine, the first substrate is located on the side of the second substrate facing the lower die, the side of the first substrate facing the lower die is provided with a first reinforcing part, the first reinforcing part is provided with a first glue layer between the first reinforcing part and the first substrate, the side of the second substrate facing the upper die is provided with a second reinforcing part, the second reinforcing part is provided with a second glue layer between the second reinforcing part and the second substrate, the upper die and the lower die are then moved close to each other, so that the lower die extrudes the first reinforcing part and the upper die extrudes the second reinforcing part, and thus the pressing of the first substrate and the first reinforcing part and the pressing of the second substrate and the second reinforcing part are simultaneously completed, so that the pressing efficiency of the reinforcing part is improved and the production cost is reduced.

[0021] The flexible circuit board provided by the present application has the beneficial effects compared with the prior art, which can be explained by referring to the beneficial effects of the reinforcing and pressing method provided by the present application, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0023] Figure 1 is a flow chart of the reinforcing and pressing method in one of the embodiments of the present application;

[0024] Figure 2 is a structural schematic view of the first substrate, the second substrate, the lower die, the upper die and the hard plate in one of the embodiments of the present application;

[0025] Figure 3 is Figure 2 the right view of the first substrate, the second substrate, the lower die, the upper die and the hard plate shown in

[0026] Figure 4 is the schematic view of moving the Figure 3 upper die and the lower die close to each other, so that the lower die extrudes the first reinforcing part and the upper die extrudes the second reinforcing part.

[0027] The meanings of the marks in the figures are as follows:

[0028] 10, the first substrate;

[0029] 11, the first reinforcing part;

[0030] 20, the second substrate;

[0031] 21, the second reinforcing part;

[0032] 30, lower mold;

[0033] 31, first silicone pad; 32, second silicone pad;

[0034] 40, upper mold;

[0035] 41, sand aluminum foil; 42, third silicone pad;

[0036] 50, hard plate;

[0037] 60, hanger;

[0038] 61, connecting rod; 62, hook;

[0039] 70, first release film;

[0040] 71, second release film; 73, third release film; 74, fourth release film. DETAILED DESCRIPTION

[0041] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0042] It should be noted that when an element is referred to as being “fixed to” or “set on” another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0043] In addition, the terms “first”, “second” are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with “first”, “second” can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of “plurality” is two or more, unless otherwise specifically limited.

[0044] In the description of the present application, the reference “one embodiment”, “some embodiments” or “embodiments” means that the specific features, structures or characteristics described in connection with the embodiment are included in one or more embodiments of the present application. Therefore, the statements “in one embodiment”, “in some embodiments”, “in other some embodiments”, “in other embodiments” and the like appearing in different places in the specification are not necessarily all referring to the same embodiment, but mean “one or more but not all embodiments”, unless otherwise specifically emphasized. In addition, in one or more embodiments, specific features, structures or characteristics can be combined in any suitable manner.

[0045] With the popularity of new energy vehicles and charging piles, the quality requirements for flexible printed circuit (FPC) used by new energy batteries are also increasing, and the processing cost needs to be reduced, and the flexible printed circuit often needs to be laminated with reinforcement (such as FR4, etc.).

[0046] The flexible printed circuit used by new energy batteries is generally a large-size product, and the number of single boards is small. The conventional press has only two layers of openings on the upper and lower sides, and only one board can be laminated with reinforcement at a time, which is low in efficiency, large in size, high in power requirement (generally 33kW per table) for heating, and low in the number of laminated reinforcements at a time, resulting in high cost and being unable to meet the requirements of mass processing.

[0047] Therefore, the present application provides a reinforcement lamination method and a flexible printed circuit. The first substrate and the second substrate are first placed in layers between the lower die of the press and the upper die of the press, and the first substrate is located on the side of the second substrate facing the lower die. The side of the first substrate facing the lower die is provided with a first reinforcement, and the first reinforcement is provided with a first adhesive layer between the first reinforcement and the first substrate. The side of the second substrate facing the upper die is provided with a second reinforcement, and the second reinforcement is provided with a second adhesive layer between the second reinforcement and the second substrate. Then the upper die and the lower die are moved closer to each other, so that the lower die extrudes the first reinforcement, and the upper die extrudes the second reinforcement. Therefore, the lamination of the first substrate and the first reinforcement and the lamination of the second substrate and the second reinforcement are completed at the same time, thereby improving the lamination efficiency of the reinforcement and reducing the production cost.

[0048] In order to illustrate the technical solutions of the present application, the following will be described in conjunction with specific drawings and examples.

[0049] Please refer to Figures 1 to 4 , in a first aspect, the present application provides a reinforcement lamination method, comprising:

[0050] S100: Place the first substrate 10 and the second substrate 20 in layers between the lower die 30 of the press and the upper die 40 of the press. The first substrate 10 is located on the side of the second substrate 20 facing the lower die 30. The side of the first substrate 10 facing the lower die 30 is provided with a first reinforcement 11, and the first reinforcement 11 is provided with a first adhesive layer between the first reinforcement 11 and the first substrate 10. The side of the second substrate 20 facing the upper die 40 is provided with a second reinforcement 21, and the second reinforcement 21 is provided with a second adhesive layer between the second reinforcement 21 and the second substrate 20.

[0051] The first substrate 10 and the second substrate 20 can be flexible soft boards, the upper mold 40 can include an upper heating disc, the lower mold 30 can include a lower heating disc, the first reinforcing 11 and the second reinforcing 21 can be FR4, aluminum sheets or steel sheets, and the like, and the first reinforcing 11 and the second reinforcing 21 can be provided in multiple numbers. The first adhesive layer and the second adhesive layer can be semi-cured thermosetting adhesives, and the like. The first reinforcing 11 is pre-stuck to the first substrate 10 through the first adhesive layer, and the second reinforcing 21 is pre-stuck to the second substrate 20 through the second adhesive layer.

[0052] S200: The upper mold 40 and the lower mold 30 are moved close to each other, so that the lower mold 30 extrudes the first reinforcing 11, and the upper mold 40 extrudes the second reinforcing 21.

[0053] The upper mold 40 and the lower mold 30 can be moved close to each other by keeping the upper mold 40 stationary and moving the lower mold 30 towards the upper mold 40, or by keeping the lower mold 30 stationary and moving the upper mold 40 towards the lower mold 30, or by moving the upper mold 40 and the lower mold 30 towards each other. The press can be provided with pressing parameters: pre-pressing 10S-20S, forming 130S-180S, pressure 90KG-110KG, and starting pressing.

[0054] When the lower mold 30 extrudes the first reinforcing 11, the first reinforcing 11 can be tightly attached to the first substrate 10, and other parts of the lower mold 30 extrude the first substrate 10. When the upper mold 40 extrudes the second reinforcing 21, the second reinforcing 21 can be tightly attached to the second substrate 20, and other parts of the upper mold 40 extrude the first substrate 20.

[0055] As can be seen from the above, the reinforcing pressing method provided by the embodiments of the present application can simultaneously complete the pressing of the first substrate 10 and the first reinforcing 11 and the pressing of the second substrate 20 and the second reinforcing 21, thereby improving the pressing efficiency of the reinforcing and reducing the production cost.

[0056] The reinforcing pressing method provided by the embodiments of the present application uses the double-sided filling pressing principle to combine and press multiple substrates with single-sided reinforcing, thereby improving the pressing efficiency, ensuring the pressing quality, and saving the electricity cost.

[0057] It should be noted that after the upper mold 40 and the lower mold 30 are moved close to each other, the first reinforcing part 11 is pressed by the lower mold 30, and the second reinforcing part 21 is pressed by the upper mold 40, that is, after the pressing is completed, the appearance inspection can be performed to ensure that there is no whitening and compaction problem in the pressed first reinforcing part 11 and the second reinforcing part 21, and there is no pressure mark on the first substrate 10 and the second substrate 20.

[0058] Please refer to Figures 2 to 4 In some embodiments, a hard plate 50 is arranged between the first substrate 10 and the second substrate 20.

[0059] By adopting the above scheme, the first substrate 10 and the second substrate 20 can be supported by the hard plate 50, so that the first substrate 10 and the second substrate 20 are flat and have no pressure marks, and the first substrate 10 and the first reinforcing part 11 and the second substrate 20 and the second reinforcing part 21 are tightly attached.

[0060] It should be noted that the hard plate 50 needs to have a certain thickness and hardness to support the first substrate 10 and the second substrate 20. For example, the hard plate 50 can be a metal plate (such as an aluminum plate or a steel plate) or a ceramic plate.

[0061] The side of the upper mold 40 facing the lower mold 30 is a projection surface.

[0062] As an implementable manner, the orthographic projection of the first reinforcing part 11 on the projection surface is located inside the orthographic projection of the hard plate 50 on the projection surface.

[0063] In this way, the side of the first substrate 10 away from the first reinforcing part 11 can be supported by the hard plate 50, so that the part of the first substrate 10 opposite to the first reinforcing part 11 is prevented from being pressed.

[0064] As another implementable manner, the orthographic projection of the second reinforcing part 21 on the projection surface is located inside the orthographic projection of the hard plate 50 on the projection surface.

[0065] In this way, the side of the second substrate 20 away from the second reinforcing part 21 can be supported by the hard plate 50, so that the part of the second substrate 20 opposite to the second reinforcing part 21 is prevented from being pressed.

[0066] Optionally, the thermal conductivity of the hard plate 50 is 100 W / (m·K)-3000 W / (m·K), such as 100 W / (m·K), 200 W / (m·K), or 300 W / (m·K).

[0067] In this way, the heat of the lower mold 30 can be conducted to the second substrate 20 through the first substrate 10, the first reinforcing material 11 and the hard plate 50, and the heat of the upper mold 40 can be conducted to the first substrate 10 through the second substrate 20, the second reinforcing material 21 and the hard plate 50, so that the first adhesive layer and the second adhesive layer can be heated more quickly, thereby improving the pressing and bonding efficiency of the first substrate 10 and the first reinforcing material 11 and the second substrate 20 and the second reinforcing material 21.

[0068] For example, the hard plate 50 can be an aluminum plate.

[0069] For example, the hard plate 50 can be an aluminum plate. Figures 2 to 4 In some embodiments, the upper mold 40 is connected with a hanger 60, and the reinforcing pressing method further comprises the following steps of:

[0070] First, the hard plate 50 is lifted by the hanger 60, so that the hard plate 50 is spaced apart from the lower mold 30 and the upper mold 40.

[0071] In some embodiments, the hard plate 50 is lifted by the hanger 60 after the opening of the press.

[0072] Secondly, the first substrate 10 and the first reinforcing material 11 are placed on the lower mold 30, and the second substrate 20 and the second reinforcing material 21 are placed on the hard plate 50.

[0073] Then, the upper mold 40 and the lower mold 30 are moved close to each other, including moving the lower mold 30 towards the upper mold 40.

[0074] By using the above scheme, after each pressing is completed, when the next pressing is performed, the hard plate 50 does not need to be removed and then the first substrate 10 and the first reinforcing material 11 are placed on the lower mold 30, and the hard plate 50 does not need to be placed on the first substrate 10 and then the second substrate 20 and the second reinforcing material 21 are placed on the hard plate 50, and the hard plate 50 can be lifted by the hanger 60 by using the movement of the upper mold 40 itself, which is simple and convenient to operate and saves time and effort.

[0075] It can be understood that the switch of the press can be started by both hands, the oil cylinder of the lower mold 30 starts to rise to lift the lower hot plate, the hard plate 50, the second substrate 20 and the second reinforcing material 21 to the pressing height, and the lower mold 30 and the upper mold 40 automatically apply pressure to start pressing.

[0076] Optionally, the hanging piece 60 comprises a connecting link 61 and a hook 62, the connecting link 61 is rotatably connected with the upper mold 40; using the hanging piece 60 to lift the hard plate 50 comprises: suspending the hook 62 on the edge of the hard plate 50; when the lower mold 30 is moved in the direction of approaching the upper mold 40, the lower mold 30 extrudes the hook 62, and the connecting link 61 rotates relative to the upper mold 40.

[0077] In this way, when the lower mold 30 is moved in the direction of approaching the upper mold 40, the connecting link 61 rotates relative to the upper mold 40, avoiding the interference of the connecting link 61 and the hook 62 to the movement of the lower mold 30, and affecting the extrusion of the lower mold 30 to the first reinforcing 11.

[0078] As another implementable manner, the hanging piece 60 comprises a connecting chain and a hook 62, the connecting chain is connected with the upper mold 40; using the hanging piece 60 to lift the hard plate 50 comprises: suspending the hook 62 on the edge of the hard plate 50.

[0079] In this way, when the lower mold 30 is moved in the direction of approaching the upper mold 40, the chain is bent, avoiding the interference of the chain and the hook 62 to the movement of the lower mold 30, and affecting the extrusion of the lower mold 30 to the first reinforcing 11.

[0080] Please refer to Figures 2 to 4 In some embodiments, a first release film 70 is arranged between the lower mold 30 and the first reinforcing 11; and / or, a second release film 71 is arranged between the upper mold 40 and the second reinforcing 21.

[0081] In this way, after the pressing is completed, the lower mold 30 and the first reinforcing 11 and the upper mold 40 and the second reinforcing 21 can be separated.

[0082] It can be understood that part of the first release film 70 is located between the lower mold 30 and the first substrate 10, and part of the second release film 71 is located between the upper mold 40 and the second substrate 20.

[0083] Optionally, a third release film 73 is arranged between the first substrate 10 and the hard plate 50, and a fourth release film 74 is arranged between the second substrate 20 and the hard plate 50.

[0084] In this way, after the pressing is completed, the first substrate 10 and the hard plate 50 and the second substrate 20 and the hard plate 50 can be separated.

[0085] It can be understood that the first release film 70 and the third release film 73 can be placed on the lower mold 30 with the first substrate 10 and the first reinforcing 11, and the second release film 71 and the fourth release film 74 can be placed on the hard plate with the second substrate 20 and the second reinforcing 21.

[0086] Optionally, the lower mold 30 comprises a lower hot plate and a lower silica gel assembly arranged on the side of the lower hot plate facing the first reinforcing 11; and / or the upper mold 40 comprises an upper hot plate and an upper silica gel assembly arranged on the side of the upper hot plate facing the second reinforcing 21.

[0087] In this way, the first reinforcing 11 and the first substrate 10 can be buffered by the lower silica gel assembly, so as to ensure that the first reinforcing 11 and the first substrate 10 are closely attached, and the first substrate 10 is prevented from being pressed to form an indentation. In addition, the second reinforcing 21 and the second substrate 20 can be buffered by the upper silica gel assembly, so as to ensure that the second reinforcing 21 and the second substrate 20 are closely attached, and the second substrate 20 is prevented from being pressed to form an indentation.

[0088] For example, the lower silica gel assembly comprises a first silica gel pad 31 (such as a red silica gel pad) and a second silica gel pad 32 (such as a green silica gel pad), and the upper silica gel assembly comprises a sand aluminum foil 41 and a third silica gel pad 42 (such as a green silica gel pad).

[0089] In this way, the lower silica gel assembly and the upper silica gel assembly have good filling properties, and do not affect the effective heating of the first adhesive layer and the second adhesive layer.

[0090] The lower silica gel assembly and the upper silica gel assembly can be fixed by using double-sided high-temperature-resistant glue. The lower silica gel assembly and the upper silica gel assembly are fixed auxiliary materials of the press, and the service life is 15000 times. The two layers of green silica gel pads are fixed auxiliary materials, so that the upper and lower layers of green silica gel do not move during operation, and the service life is 7500 times.

[0091] In a second aspect, the embodiments of the present application provide a flexible circuit board, which is processed by the reinforcing and pressing method as in the first aspect.

[0092] The flexible circuit board provided by the embodiments of the present application has the following advantages. First, the first substrate 10 and the second substrate 20 are first placed in a stacked manner between the lower mold 30 of the press and the upper mold 40 of the press. The first substrate 10 is located on the side of the second substrate 20 facing the lower mold 30. The first reinforcing 11 is arranged on the side of the first substrate 10 facing the lower mold 30. The first adhesive layer is arranged between the first reinforcing 11 and the first substrate 10. The second reinforcing 21 is arranged on the side of the second substrate 20 facing the upper mold 40. The second adhesive layer is arranged between the second reinforcing 21 and the second substrate 20. Then, the upper mold 40 and the lower mold 30 are moved close to each other, so that the lower mold 30 extrudes the first reinforcing 11, and the upper mold 40 extrudes the second reinforcing 21. In this way, the pressing of the first substrate 10 and the first reinforcing 11 and the pressing of the second substrate 20 and the second reinforcing 21 are completed at the same time, so as to improve the pressing efficiency of the reinforcing and reduce the production cost.

[0093] The above examples are only used to illustrate the technical solutions of the present application, but not limit the same; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalent ones; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A method of reinforcing a press-fit, characterized in that, The method comprises the following steps: stacking the first substrate and the second substrate between a lower die of a press and an upper die of the press, the first substrate being located on a side of the second substrate facing the lower die, a first reinforcing part being arranged on a side of the first substrate facing the lower die, a first glue layer being arranged between the first reinforcing part and the first substrate, a second reinforcing part being arranged on a side of the second substrate facing the upper die, and a second glue layer being arranged between the second reinforcing part and the second substrate; moving the upper die and the lower die towards each other so that the lower die presses the first reinforcing part and the upper die presses the second reinforcing part.

2. The reinforcing press-bonding method according to claim 1, characterized by, The first substrate and the second substrate are provided with a hard plate.

3. The reinforcing press-bonding method according to claim 2, characterized by, A projection surface is arranged on a side of the upper die facing the lower die; a normal projection of the first reinforcing part on the projection surface is located inside a normal projection of the hard plate on the projection surface; and / or a normal projection of the second reinforcing part on the projection surface is located inside the normal projection of the hard plate on the projection surface.

4. The reinforcing press bonding method according to claim 2, characterized by, The thermal conductivity of the hard plate is 100 W / (m·K)-3000 W / (m·K).

5. The reinforcing press bonding method according to claim 2, characterized by, The upper die is connected with a hanging part; before the step of stacking the first substrate and the second substrate between the lower die of the press and the upper die of the press, the reinforcing part pressing method further comprises the following steps: using the hanging part to lift the hard plate so that the hard plate is spaced apart from the lower die and the upper die; placing the first substrate and the first reinforcing part on the lower die and placing the second substrate and the second reinforcing part on the hard plate; The step of moving the upper die and the lower die towards each other comprises moving the lower die towards the upper die.

6. The reinforcing press bonding method according to claim 5, characterized by The hanging part comprises a connecting rod and a hook connected with each other, the connecting rod being rotatably connected with the upper die; the step of using the hanging part to lift the hard plate comprises suspending the hook from an edge of the hard plate; when the lower die is moved towards the upper die, the lower die presses the hook and the connecting rod rotates relative to the upper die.

7. The reinforcing press bonding method according to claim 5, characterized by The hanging part comprises a chain and a hook connected with each other, the chain being connected with the upper die; the step of using the hanging part to lift the hard plate comprises suspending the hook from an edge of the hard plate.

8. The reinforcing press-bonding method according to any one of claims 1 to 7, characterized by, A first release film is arranged between the lower die and the first reinforcing part; and / or a second release film is arranged between the upper die and the second reinforcing part.

9. The reinforced press bonding method according to any one of claims 1 to 7, characterized by, The lower die comprises a lower hot plate and a lower silica gel assembly arranged on a side of the lower hot plate facing the first reinforcing part; and / or the upper die comprises an upper hot plate and an upper silica gel assembly arranged on a side of the upper hot plate facing the second reinforcing part.

10. A flexible wiring board, characterized by, The flexible circuit board is processed by the reinforcing part pressing method according to any one of claims 1 to 9.

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