Controller structure

By encapsulating the power devices and control board in the motor controller with an insulating shell and cover, and using metal connecting wires and insulating sealant, the problems of large size and poor reliability of traditional motor controllers are solved, and a controller structure with high integration and high reliability is achieved.

CN121368093APending Publication Date: 2026-01-20ZINSIGHT TECH (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202511673531.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-11-14
Publication Date
2026-01-20

AI Technical Summary

Technical Problem

Traditional motor controllers, due to the lack of insulation, result in large control board sizes and compromise vibration reliability, making it difficult to achieve high reliability and high power density.

Method used

The power devices and control board are encapsulated with an insulating shell and cover plate, and the circuit connection is achieved through metal connecting wires and terminals. The encapsulation is completed with insulating sealant, and the reliability is improved by combining a shielding layer and a locking structure.

Benefits of technology

It achieves high integration and miniaturization of the controller, while improving reliability in vibration and high humidity environments, meeting the requirements of high reliability and high power density.

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Abstract

The invention provides a controller structure, which comprises an insulating shell, the side wall of the insulating shell defines an accommodating space, the bottom of the insulating shell comprises a first opening, and the top of the insulating shell comprises a second opening; the insulating cover plate is positioned above the second opening; the first circuit board covers the first opening; the second circuit board is positioned above the first circuit board and is positioned in the accommodating space; one part of the metal connecting wire is embedded in the insulating shell, and the other part of the metal connecting wire is exposed in an accommodating space defined by the insulating shell; partial circuits of the first circuit board and the second circuit board are connected through metal connecting wires; the metal terminal is embedded in the insulating shell, one end of the metal terminal is exposed in the accommodating space and used for being electrically connected with the first circuit board, and the other end of the metal terminal penetrates through the side wall of the insulating shell and extends outwards; the connector is assembled on the second circuit board, and a window is formed in the area, opposite to the connector, of the insulating cover plate; or the connector is assembled on the side wall of the insulating shell and laterally extends out; the plug connector is electrically connected with the first circuit board and / or the second circuit board.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of motor controller, in particular to a controller structure. BACKGROUND

[0002] With the progress of science and technology and the demand of industry, various types of motor controllers gradually develop towards high reliability and high power density. The traditional motor controller is often connected by welding independent power devices and control boards. The traditional control board is generally not insulated, and the size is very large according to the safety requirements, while the size of the controller is often determined by the control board. At the same time, the large area of the control board is often the key difficulty affecting the vibration reliability.

[0003] Therefore, how to reduce the size of the controller and ensure good reliability is a problem to be solved at present. SUMMARY

[0004] The purpose of the present application is to provide a controller structure, which integrates power devices and control boards to reduce the size of the controller and ensure good reliability.

[0005] In order to achieve the above purpose, the present application provides a controller structure, comprising:

[0006] An insulating shell, the side wall of the insulating shell forms a containing space; the bottom of the insulating shell contains a first opening, and the top of the insulating shell contains a second opening;

[0007] An insulating cover plate, which is located above the second opening and covers at least part of the second opening;

[0008] A first circuit board and devices mounted thereon, the first circuit board covers the first opening, and the devices thereon face the containing space;

[0009] A second circuit board and devices mounted thereon, the second circuit board is located above the first circuit board and in the containing space;

[0010] A metal connecting line, part of which is embedded in the insulating shell, and the other part is exposed in the containing space formed by the insulating shell; part of the circuits of the first circuit board and the second circuit board are connected by the metal connecting line;

[0011] A metal terminal, which is embedded in the insulating shell, one end of which is exposed in the containing space for electrical connection with the first circuit board, and the other end of which passes through the side wall of the insulating shell and extends outward;

[0012] A connector is assembled on the second circuit board, and the area opposite to the connector on the insulating cover plate is provided with a window; or the connector is assembled on the side wall of the insulating shell and extends laterally; the connector is electrically connected with the first circuit board and / or the second circuit board.

[0013] An insulating sealant is filled in the space surrounded by the insulating shell, the insulating cover plate and the first circuit board.

[0014] In an optional solution, the devices mounted on the first circuit board include power devices and / or part of the devices of the control circuit, and the devices mounted on the second circuit board include at least part of the devices of the control circuit.

[0015] In an optional solution, the devices on the first circuit board are electrically connected with the metal connecting lines and the metal terminals through bonding wires or copper bridges; and / or,

[0016] The second circuit board is electrically connected with the metal connecting lines through bonding wires or copper bridges.

[0017] In an optional solution, the controller structure further comprises a shielding layer, which is located between the first circuit board and the second circuit board.

[0018] In an optional solution, the controller structure further comprises a locking structure, which comprises a first locking hole formed in the insulating shell, a second locking hole formed in the insulating cover plate and a fastener passing through the first locking hole and the second locking hole.

[0019] In an optional solution, the part of the metal connecting lines exposed in the accommodating space is divided into two layers, the lower layer of the metal connecting lines is electrically connected with the first circuit board, and the upper layer of the metal connecting lines is electrically connected with the second circuit board.

[0020] In an optional solution, the controller structure further comprises a third circuit board and devices mounted thereon, the third circuit board is arranged on the inner edge of the bottom of the insulating shell and is located on the side of the first circuit board and is arranged above or below the second circuit board; the third circuit board is connected with at least one of the metal connecting lines, the first circuit board and the second circuit board.

[0021] In an optional solution, the devices mounted on the first circuit board, the second circuit board and the third circuit board include power devices and at least part of the devices of the control circuit; wherein the power devices and / or part of the devices of the control circuit are mounted on the first circuit board, and at least part of the devices of the control circuit are mounted on the second circuit board and / or the third circuit board.

[0022] Optionally, the first circuit board is sequentially provided with a first insulating layer, a first wiring layer, a second insulating layer and a second wiring layer from bottom to top.

[0023] Optionally, the other end of the metal terminal extends out of the side wall of the insulating shell in a manner comprising:

[0024] the other end extends out of the side wall of the insulating shell in a manner comprising:

[0025] the other end extends out of the side wall of the insulating shell in a manner comprising:

[0026] the other end extends out of the side wall of the insulating shell in a manner comprising:

[0027] The application has the advantages that the power device and the control board are highly integrated, the size of the controller is reduced, and good reliability is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0028] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which like reference characters refer to like parts throughout the figures, and in which:

[0029] Figure 1 Fig. 1 is a structural schematic diagram of a controller structure before assembly in Embodiment 1 of the present application.

[0030] Figure 2 Fig. 2 is a sectional view of the controller structure in Embodiment 1 of the present application.

[0031] Figure 3 Fig. 3 is a plan view of the controller structure in Embodiment 1 of the present application.

[0032] Figure 4 Fig. 4 is a front view of the controller structure in Embodiment 1 of the present application.

[0033] Figure 5 Fig. 5 is a sectional view of the controller structure with a shielding layer structure in Embodiment 1 of the present application.

[0034] Figure 6 Fig. 6 is a structural schematic diagram of a controller structure before assembly in Embodiment 2 of the present application.

[0035] Figure 7 Fig. 7 is a sectional view of the controller structure in Embodiment 2 of the present application.

[0036] Figure 8 Fig. 8 is a structural schematic diagram of a first circuit board in Embodiment 3 of the present application.

[0037] BRIEF DESCRIPTION OF DRAWINGS

[0038] 1 - Insulating housing; 2 - Insulating cover plate; 3 - First circuit board; 4 - Second circuit board; 5 - First opening; 6 - Second opening; 7 - Upper metal connecting line; 8 - Lower metal connecting line; 9 - Metal terminal connecting part; 10 - Metal terminal locking part; 11 - Support column; 12 - First locking hole; 13 - Second locking hole; 14 - Bonding wire; 15 - Power device; 16 - Passive device; 17 - Insulating sealant; 18 - Side wall; 19 - Shield layer; 20 - Third circuit board; 21 - First insulating layer; 22 - First wiring layer; 23 - Second insulating layer; 24 - Second wiring layer; 25 - Heat dissipation layer; 26 - Metal connecting line; 27 - Metal terminal; 28 - Plug-in component. DETAILED DESCRIPTION

[0039] The application will be further described below in conjunction with the drawings and specific embodiments. According to the following description and drawings, the advantages and features of the application will be more apparent, however, it should be noted that the concept of the technical solution of the application can be implemented in many different forms and is not limited to the specific embodiments described herein. The drawings are all very simplified and use non-precise proportions, only for the purpose of facilitating and clearly assisting the description of the embodiments of the application.

[0040] It should be understood that when an element or layer is referred to as being "on", "adjacent", "connected to", or "coupled to" another element or layer, it can be directly on, adjacent, connected or coupled to the other element or layer, or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on", "directly adjacent", "directly connected to", or "directly coupled to" another element or layer, then there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.

[0041] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and / or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is inverted, then a dependent element or feature described as "below" or "beneath" another element or feature would then be oriented "above" and / or "over" the other element or feature. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0042] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0043] Embodiment 1

[0044] With reference to Figures 1 to 5 The present embodiment provides a controller structure comprising:

[0045] An insulating housing 1, a side wall 18 of the insulating housing 1 enclosing a receiving space; a bottom of the insulating housing 1 comprising a first opening 5, a top of the insulating housing 1 comprising a second opening 6;

[0046] An insulating cover plate 2, the insulating cover plate 2 being located above the second opening 6 and at least partially covering the second opening 6;

[0047] A first circuit board 3 and components mounted thereon, the first circuit board 3 covering the first opening 5, the components mounted thereon facing the receiving space;

[0048] A second circuit board 4 and components mounted thereon, the second circuit board 4 being located above the first circuit board 3 and within the receiving space;

[0049] Metallic connecting line 26, one part of which is embedded in the insulating shell 1, and the other part of which is exposed in the accommodating space surrounded by the insulating shell 1; the metallic connecting line 26 is used to connect the partial circuits of the first circuit board 3 and the second circuit board 4;

[0050] Metallic terminal 27, which is embedded in the insulating shell 1, one end of which is exposed in the accommodating space, and the other end of which penetrates through the side wall of the insulating shell 1 and extends outward. The part of the metallic terminal 27 exposed in the accommodating space is defined as a metallic terminal connecting part 9, and the part of the metallic terminal 27 extending out of the side wall is defined as a metallic terminal locking part 10. The metallic terminal connecting part 9 is used to realize internal electrical connection, and the metallic terminal locking part 10 is used to connect external devices;

[0051] Connector 28, which is assembled on the second circuit board 4, and the area of the insulating cover plate 2 opposite to the connector 28 is provided with a window; or the connector 28 is assembled on the side wall of the insulating shell 1 and extends laterally; the connector 28 is electrically connected with the first circuit board 3 and / or the second circuit board 4;

[0052] Insulating sealant 17, which is filled in the space surrounded by the insulating shell 1, the insulating cover plate 2 and the first circuit board 3.

[0053] In the embodiment, the other end of the metallic terminal 27 extends out of the side wall of the insulating shell 1 in the following ways: the other end penetrates through the side wall 18 of the insulating shell 1 longitudinally and extends upward; or the other end penetrates through the side wall 18 of the insulating shell 1 laterally and extends laterally; or the other end is divided into two branches, the first branch penetrates through the side wall 18 of the insulating shell 1 laterally and extends laterally, and the second branch penetrates through the side wall of the insulating shell longitudinally and extends upward. The metallic terminal locking part is designed in various extending ways, which can be more convenient for electrical connection with external devices.

[0054] Specifically, the devices mounted on the first circuit board 3 and the second circuit board 4 include power devices 15 and at least part of the devices of the control circuit. The devices of the control circuit include a microprocessor and its peripheral circuit, a sampling circuit, a communication circuit, and an isolated power supply. The second circuit board can also be mounted with a drive circuit, a sampling circuit, and passive devices 16 (such as decoupling capacitors, sampling resistors, etc.). The drive circuit includes a gate drive chip and its peripheral circuit, a gate drive resistor, and a gate absorption circuit. In this embodiment, the power devices 15 or the power devices 15 and part of the devices of the control circuit are welded on the first circuit board 3, and the remaining devices are arranged on the first circuit board 3 and the second circuit board 4 according to design requirements. The power devices 15 are electrically connected to the metal connecting lines and the metal terminals (metal terminal connecting portions 9) through bonding wires 14 or copper bridges; and the second circuit board 4 is electrically connected to the metal connecting lines through bonding wires 14 or copper bridges. In a specific example, the devices mounted on the first circuit board 3 include power devices 15 and passive devices 16, and the devices mounted on the second circuit board include a control circuit, a drive circuit, a sampling circuit, etc.

[0055] In this embodiment, the part of the metal connecting lines exposed in the accommodation space is divided into two layers, the lower layer of metal connecting lines 8 is electrically connected to the first circuit board 3, and the upper layer of metal connecting lines 7 is electrically connected to the second circuit board 4. In this way, local connection can be achieved, and the length of the bonding wires can be shortened as much as possible.

[0056] In this embodiment, the first circuit board 3 and the second circuit board 4 can be ceramic substrates, copper substrates, aluminum substrates, printed circuit boards, etc.

[0057] In this embodiment, the controller structure further includes a shielding layer 19 located between the first circuit board 3 and the second circuit board 4. The material of the shielding layer 19 can be metal, conductive and magnetic plastic, or other materials with electromagnetic shielding effect.

[0058] In this embodiment, the controller structure further includes a locking structure, which includes a first locking hole 12 formed in the insulating shell 1, a second locking hole 13 formed in the insulating cover plate 2, and a fastener (such as a screw) passing through the first locking hole 12 and the second locking hole 13; the insulating cover plate 2 is fixed on the insulating shell 1 through the locking structure.

[0059] In this embodiment, when installing the first circuit board 3, the device portion of the first circuit board 3 is inserted into the insulating housing 1 from below to above from the first opening 5. The size of the first circuit board 3 can be slightly larger than the size of the first opening 5, so as to cover the first opening 5. In other embodiments, the first circuit board 3 can also be placed into the insulating housing 1 from above to below, in which case the first circuit board 3 can be placed on the inner side of the bottom of the insulating housing 1 around the first opening 5. Of course, the first circuit board 3 can also be clamped at the first opening 5, in which case the lower surface of the first circuit board 3 is substantially flush with the lower surface of the insulating housing 1. The present solution only requires that the first circuit board 3 covers the first opening 5, and the covering manner is not limited.

[0060] In this embodiment, the lower surface of the insulating cover plate 2 is provided with a downward support column 11, which passes through the second circuit board 4 to contact the upper surface of the first circuit board 1. The controller structure further comprises an insulating sealant 17 filled in the space surrounded by the insulating housing 1, the insulating cover plate 2 and the first circuit board 3. The insulating sealant 17 completely covers the upper surface of the first circuit board 3 and at least part of the second circuit board 4. The insulating sealant 17 can be epoxy resin, silicone gel, etc. The support column 11 of the present embodiment can press the first circuit board 3 during the product assembly stage.

[0061] The present application highly integrates the power device and the control board, reduces the size of the controller, and ensures good reliability. Further, through the insulating sealant, the control board can be protected together with the power device, and the control board that is insulated and protected can greatly shorten the creepage distance of the terminal, thereby greatly reducing the size of the control board. Further, the control board is protected by the insulating sealant, and can have excellent reliability performance in harsh and severe environments such as vibration and high humidity.

[0062] Embodiment 2

[0063] Reference Figure 6 and Figure 7The difference between the embodiment and the embodiment 1 is that the controller structure further comprises a third circuit board 20 and devices mounted thereon, the third circuit board 20 is arranged on the inner edge of the bottom of the insulating shell 1, is arranged on the side of the first circuit board 3, and is arranged above and below the second circuit board 4; the third circuit board 20 is connected to at least one of the metal connecting line, the first circuit board 3, and the second circuit board 4. The devices mounted on the first circuit board 3, the second circuit board 4, and the third circuit board 20 include at least part of the devices of the power device and the control circuit; wherein the power device is mounted on the first circuit board 3, and at least part of the devices of the control circuit are mounted on the second circuit board and / or the third circuit board. The devices of the control circuit include a microprocessor and its peripheral circuit, a sampling circuit, a communication circuit, and an isolated power supply. The second circuit board and the third circuit board can also be mounted with a driving circuit, a sampling circuit, and passive devices 16 (such as decoupling capacitors, sampling resistors, etc.). The driving circuit includes a gate drive chip and its peripheral circuit, a gate drive resistor, and a gate absorption circuit. In the embodiment, the power device or the power device 15 and part of the devices of the control circuit are mounted on the first circuit board 3, and the remaining devices are arranged on the first circuit board 3, the second circuit board 4, and the third circuit board 20 according to design requirements.

[0064] In different specific examples, the devices mounted on the first circuit board are power devices and passive devices such as decoupling capacitors and sampling resistors. The devices mounted on the second circuit board are control circuits, driving circuits, and sampling circuits. The devices mounted on the third circuit board are decoupling capacitors, sampling resistors, control circuits, driving circuits, and sampling circuits.

[0065] The embodiment can disperse the devices on the first circuit board 3, the second circuit board 4, and the third circuit board 20 to reduce the size of the controller by adding the third circuit board 20. The connection mode of the third circuit board 20 has multiple cases, which can be connected only with the first circuit board 3, connected only with the metal connecting line, or connected with the metal connecting line, the first circuit board 3, etc.

[0066] Embodiment 3

[0067] Reference Figure 8 The difference between the embodiment and the embodiment 1 or the embodiment 2 is that the first circuit board 3 sequentially comprises a first insulating layer 21, a first wiring layer 22, a second insulating layer 23, and a second wiring layer 24 from bottom to top; wherein the heat conduction performance and the insulation performance of the first insulating layer 21 are better than those of the second insulating layer 23. The first insulating layer 21 (lower layer) has high heat conduction and high insulation requirements, such as ceramic materials and high-heat-conduction resin materials with a thermal conductivity greater than 2 W / mK; and the material of the second insulating layer 23 is ordinary PP, PI, FR4 material, etc.

[0068] The wiring layer between the first insulating layer 21 and the second insulating layer 23 is the first wiring layer 22, which can be connected to power devices, decoupling capacitors, sampling resistors, etc. The wiring layer above the second insulating layer 23 is the second wiring layer 24, which can be connected to decoupling capacitors, sampling resistors, control circuits, etc. In this embodiment, a heat dissipation layer 25 is further arranged on the lower surface of the first insulating layer 21.

[0069] The above description is only a description of the preferred embodiments of the present application, and does not limit the scope of the present application in any way. Any modification or change made by a person of ordinary skill in the art based on the above disclosure is within the protection scope of the claims.

Claims

1. A controller structure, characterized by, The controller structure comprises: an insulating shell, a side wall of which encloses a receiving space; a bottom of the insulating shell comprises a first opening, and a top of the insulating shell comprises a second opening; an insulating cover plate is located above the second opening and at least partially covers the second opening; a first circuit board and devices mounted thereon, the first circuit board covers the first opening, and the devices mounted thereon face the receiving space; a second circuit board and devices mounted thereon, the second circuit board is located above the first circuit board and in the receiving space; a metal connecting line, a part of which is embedded in the insulating shell, and another part of which is exposed in the receiving space enclosed by the insulating shell; parts of the first circuit board and the second circuit board are connected by the metal connecting line; a metal terminal is embedded in the insulating shell, one end of which is exposed in the receiving space and used for electrical connection with the first circuit board, and the other end of which penetrates through the side wall of the insulating shell and extends outward; a connector is assembled on the second circuit board, and a region of the insulating cover plate opposite to the connector is provided with a window; or the connector is assembled on the side wall of the insulating shell and extends sideways; the connector is electrically connected with the first circuit board and / or the second circuit board; an insulating sealant is filled in a space enclosed by the insulating shell, the insulating cover plate and the first circuit board.

2. The controller structure of claim 1, wherein, The devices mounted on the first circuit board include power devices and / or part of devices of a control circuit, and the devices mounted on the second circuit board include at least part of devices of the control circuit.

3. The controller structure of claim 2, wherein, The devices on the first circuit board are electrically connected with the metal connecting line and the metal terminal by bonding wires or copper bridges; and / or, the second circuit board is electrically connected with the metal connecting line by bonding wires or copper bridges.

4. The controller structure of claim 1, wherein, The controller structure further comprises a shielding layer located between the first circuit board and the second circuit board.

5. The controller structure of claim 1, wherein, The controller structure further comprises a locking structure, which comprises a first locking hole provided in the insulating shell, a second locking hole provided in the insulating cover plate, and a fastener penetrating through the first locking hole and the second locking hole.

6. The controller structure of claim 1, wherein, The part of the metal connecting line exposed in the receiving space is divided into two layers, the lower layer of the metal connecting line is electrically connected with the first circuit board, and the upper layer of the metal connecting line is electrically connected with the second circuit board.

7. The controller structure of claim 1, wherein, The controller structure further comprises a third circuit board and devices mounted thereon, the third circuit board is arranged on an inner edge of the bottom of the insulating shell, located on a side edge of the first circuit board, and arranged above and below the second circuit board; the third circuit board is connected to at least one of the metal connecting line, the first circuit board and the second circuit board.

8. The controller structure of claim 7, wherein, The devices mounted on the first circuit board, the second circuit board and the third circuit board include power devices and at least part of devices of a control circuit; wherein the power devices and / or part of devices of the control circuit are mounted on the first circuit board, and at least part of devices of the control circuit are mounted on the second circuit board and / or the third circuit board.

9. The controller structure of claim 1, wherein, The first circuit board is sequentially provided with a first insulating layer, a first wiring layer, a second insulating layer and a second wiring layer from bottom to top.

10. The controller structure of claim 1, wherein, The other end of the metal terminal extends out of the side wall of the insulating shell in a manner comprising: The other end longitudinally penetrates the side wall of the insulating shell and extends upward; Or, the other end transversely penetrates the side wall of the insulating shell and extends sideways; Or, the other end is divided into two branches, wherein a first branch transversely penetrates the side wall of the insulating shell and extends sideways, and a second branch longitudinally penetrates the side wall of the insulating shell and extends upward.

Citation Information

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