Resin composition, pellets, and molded article

Abstract

Provided are a resin composition, pellets, and a molded article with which a molded article having a low YI value and a high light transmittance in the visible region can be obtained. The resin composition contains a polycarbonate resin and contains 0.01-1.5 parts by mass of a compound represented by formula (1) and 0.01-1.5 parts by mass of an epoxy compound and / or an oxetane compound per 100 parts by mass of the polycarbonate resin, and the content of a phosphite ester compound having a structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass of the resin composition.

Description

TECHNICAL FIELD

[0001] The present application relates to a resin composition, a pellet, and a molded article. In particular, it relates to a resin composition in which a polycarbonate resin is a main component. BACKGROUND

[0002] In the past, polycarbonate resins have been widely used for various purposes because of their excellent properties. In particular, as one of the utilization modes of polycarbonate resins, they have been fully utilized in components such as power housings, lighting lenses, lighting housings, and light guide members, which require transparency.

[0003] For example, Patent Literature 1 discloses a polycarbonate resin composition pellet containing a polycarbonate resin (A), an aromatic compound represented by the following formula (B), and a phosphorus-based stabilizer (C), the content of the aromatic compound (B) in the pellet being 0.001 to 1 mass%, and the content of the phosphorus-based stabilizer (C) being 0.003 to 0.5 mass%.

[0004] [Chemical Formula 1]

[0005]

[0006] (In the formula, Y is an organic group not containing any of nitrogen, sulfur, and halogen, or a hydrogen atom.

[0007] In the case where Y is a hydrogen atom, X is an alkyl group or an aryl group optionally having a substituent, and in the case where Y is an organic group not containing any of nitrogen, sulfur, and halogen, X is an organic group not containing any of nitrogen, sulfur, and halogen, and in this case, X and Y can be the same or different.

[0008] g represents an integer of 1 or 2.

[0009] n represents an integer of 0 to 5, and in the case where n is 2 or more, the n X's can be the same or different.

[0010] k represents an integer of 1 to 4, and in the case where k is 2 or more, Y is two or more -(CH2) g OY groups can be the same or different. In this case, n + k is 6 or less.

[0011] Prior Art Documents

[0012] Patent Literature

[0013] Patent Literature 1: International Publication No. 2019 / 198321 SUMMARY

[0014] PROBLEMS TO BE SOLVED BY THE INVENTION

[0015] Here, for resin molded articles used in components requiring transparency, such as power casings, lighting lenses, lighting housings, and light guide components, a low YI value and high transmittance are required. In this regard, the molded articles formed from the resin composition described in Patent Document 1 have excellent YI values.

[0016] However, the results of the inventors' research indicate that molded articles formed from the resin composition described in Patent Document 1 may not be suitable for applications requiring high light transmittance in the visible region.

[0017] To address this problem, the present invention aims to provide resin compositions, granules, and molded articles that can produce molded articles with low YI values ​​and high light transmittance in the visible region.

[0018] Problem Solving Methods

[0019] Based on the above-mentioned problems, the inventors conducted research and found that the above problems can be solved by substantially not cooperating with a given phosphite compound, and further cooperating with an epoxide compound and / or an oxetane compound in a given amount.

[0020] Specifically, the above problem was solved by the following method.

[0021] <1> A resin composition comprising a polycarbonate resin, and comprising, relative to 100 parts by weight of the polycarbonate resin:

[0022] The compound shown in formula (1) is present in parts by mass of 0.01 to 1.5 parts, and

[0023] 0.01 to 1.5 parts by weight of epoxides and / or oxetanes.

[0024] The content of the phosphite compound having the structure shown in formula (P) is more than 0% by mass and less than 0.01% by mass of the resin composition.

[0025] [Chemical Formula 2]

[0026]

[0027] (In equation (1), R) 1 ~R 3 Each is independently a hydrogen atom, or a hydrocarbon group with 1 to 10 substituted or unsubstituted carbon atoms, R 4 A hydrocarbon group with 1 to 10 carbon atoms, either substituted or unsubstituted, or with -OR 5 The group represented by R 5 (A hydrocarbon group consisting of 1 to 10 hydrogen atoms, or substituted or unsubstituted carbon atoms, where n is an integer from 0 to 2.)

[0028] [Chemical Formula 3]

[0029]

[0030] <2> The resin composition according to <1>, wherein

[0031] in the formula (1), R 1 ~R 3 each independently is a hydrogen atom or a methyl group, R 4 is a hydrogen atom, a methyl group or a group represented by -OR 5 , R 5 is a hydrogen atom or a methyl group.

[0032] <3> The resin composition according to <1>, wherein

[0033] in the formula (1), n is 1.

[0034] <4> The resin composition according to <1>, wherein

[0035] the formula (1) is represented by formula (1-1).

[0036] [Chemical Formula 4]

[0037]

[0038] (in formula (1-1), R 11 ~R 31 each independently is a hydrogen atom or a methyl group, R 41 is a hydrogen atom, a methyl group or a group represented by -OR 51 , R 51 is a hydrogen atom or a methyl group.)

[0039] <5> The resin composition according to <4>, wherein

[0040] in the formula (1-1), R 11 is a hydrogen atom or a methyl group, R 21 is a hydrogen atom or a methyl group, R 31 is a methyl group or a methoxy group.

[0041] <6> The resin composition according to any one of <1> to <5>, wherein

[0042] the compound represented by the formula (1) is a compound selected from the group consisting of

[0043] [Chemical Formula 5]

[0044]

[0045] <7> A particle which is a particle of the resin composition according to any one of <1> to <6>.

[0046] <8> A molded product, which is made of <1> ~ <6> The resin composition described in any one of the above statements is formed.

[0047] <9> A molded product, which is made of <7> The aforementioned particle formation.

[0048] The effects of the invention

[0049] According to the present invention, resin compositions, granules, and molded articles that can produce molded articles with low YI values ​​and high light transmittance in the visible region can be provided. Detailed Implementation

[0050] Hereinafter, a method for implementing the present invention (hereinafter referred to as "this embodiment") will be described in detail. It should be noted that the following embodiment is an example for illustrating the present invention, and the present invention is not limited to this embodiment.

[0051] It should be noted that in this specification, "~" is used to indicate the lower and upper limits of the values ​​contained before and after it.

[0052] Unless otherwise specified, all physical property values ​​and characteristic values ​​in this specification are values ​​at 23°C.

[0053] Unless otherwise specified, the measurement methods described in this specification are based on the time point of January 1, 2023, and may vary from year to year.

[0054] The resin composition of this embodiment comprises 0.01 to 1.5 parts by mass of the compound shown in formula (1), and 0.01 to 1.5 parts by mass of an epoxy compound and / or an oxetane compound, wherein the content of the phosphite compound having the structure shown in formula (P) is more than 0% by mass and less than 0.01% by mass of the resin composition.

[0055] [Chemical Formula 6]

[0056]

[0057] (In equation (1), R) 1 ~R 3 Each is independently a hydrogen atom, or a hydrocarbon group with 1 to 10 substituted or unsubstituted carbon atoms, R 4 A hydrocarbon group with 1 to 10 carbon atoms, either substituted or unsubstituted, or with -OR 5 The group represented by R 5 (A hydrocarbon group consisting of 1 to 10 hydrogen atoms, or substituted or unsubstituted carbon atoms, where n is an integer from 0 to 2.)

[0058] [Chemical Formula 7]

[0059]

[0060] By being configured in such a manner, it is possible to obtain a resin composition that can provide a molded article having a low YI value and a high light transmittance in the visible region. In particular, it is possible to obtain a resin composition that can provide a molded article having a low initial YI value and a low YI value after heating. Furthermore, it is possible to obtain a resin composition that can provide a molded article having a small ΔYI value (YI value after heating - initial YI value).

[0061] That is, in the present embodiment, by compounding the compound represented by formula (1), color tone improvement is achieved. It is considered that the benzene ring-CH2 moiety of the compound represented by formula (1) undergoes a reduction reaction, and color tone increase is suppressed.

[0062] On the other hand, the epoxy compound and / or the oxetane compound can also suppress a decrease in light transmittance of visible light. Furthermore, the epoxy compound and / or the oxetane compound can stabilize the degree of increase in YI value upon heating.

[0063] In addition, in the present embodiment, the content of the phosphite compound having the structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass of the resin composition. That is, the phosphite compound having the structure represented by formula (P) is not contained or substantially not contained. By being configured in such a manner, it is possible to obtain a resin composition that can provide a molded article having a high light transmittance in the visible region.

[0064] Hereinafter, the resin composition of the present embodiment will be described.

[0065] <Polycarbonate Resin>

[0066] The resin composition of the present embodiment contains a polycarbonate resin.

[0067] The polycarbonate resin can be any polycarbonate resin containing a -[O-R-OC(=O)]- unit (R is an organic group, preferably a hydrocarbon group, more preferably an aliphatic group, an aromatic group, or a group containing both an aliphatic group and an aromatic group, and a group having a linear structure or a branched structure) having a carbonate bond in the main chain, and is not particularly limited. In the present embodiment, the polycarbonate resin is preferably an aromatic polycarbonate resin, and more preferably a polycarbonate resin having a bisphenol skeleton. By using such a polycarbonate resin, the resulting molded article can achieve more excellent heat resistance and toughness. In the present embodiment, the polycarbonate resin having a bisphenol skeleton is preferably such that 90 mol% or more of all the structural units are structural units having a bisphenol skeleton, more preferably such that 90 mol% or more of all the structural units are structural units having a skeleton of at least one of bisphenol A, bisphenol C, and bisphenol AP, and further more preferably such that 90 mol% or more of all the structural units are structural units having a bisphenol A skeleton.

[0068] In addition, the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 10,000 or more, more preferably 12,000 or more, and further more preferably 15,000 or more. By being 10,000 or more, the resulting molded article has a tendency to further improve in durability. The upper limit of the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 50,000 or less, more preferably 40,000 or less, further more preferably 30,000 or less, further more preferably 25,000 or less, and further more preferably 20,000 or less. By being 50,000 or less, the resulting molded article has a tendency to further improve in moldability.

[0069] The viscosity average molecular weight (Mv) is the limiting viscosity [η] (unit: dL / g) at 25°C calculated from the viscosity formula of Schnell, i.e., η = 1.23 x 10 -4 × Mv 0.83 calculated value.

[0070] In the case where two or more polycarbonate resins are used, the viscosity average molecular weight is that of the mixture.

[0071] The method for producing the polycarbonate resin is not particularly limited, and a method produced by a known phosgene method (interfacial polymerization method), a melt method (transesterification method) can be used. In the case where the melt method is used, a polycarbonate resin having an adjusted amount of OH group at the terminal group can be used.

[0072] The polycarbonate resin used in the present embodiment can be a recycled product (including a recycled product, a material recycled product, a chemical recycled product, and the like) of a polycarbonate resin, a defective product, or an end material at the time of molding of a thermoplastic resin.

[0073] In addition to the above, the polycarbonate resin can be described in detail with reference to the description of paragraphs 0013 to 0041 of Japanese Patent Application Publication No. 2021-084942 and paragraphs 0030 to 0035 of Japanese Patent Application Publication No. 2021-119211, which are incorporated herein.

[0074] The content of the polycarbonate resin in the resin composition of the present embodiment is preferably 85% by mass or more, more preferably 90% by mass or more, further preferably 95% by mass or more, further preferably 97% by mass or more, and more further preferably 98% by mass or more, of the resin composition. The upper limit of the content of the polycarbonate resin in the above-described resin composition is an amount in which the total of the polycarbonate resin, the compound represented by formula (1), and the epoxy compound and / or the oxetane compound becomes 100% by mass.

[0075] The resin composition of the present embodiment can contain only one kind of polycarbonate resin, or can contain two or more kinds. In the case of containing two or more kinds, the total amount is preferably in the above-described range.

[0076] <Compound represented by formula (1)>

[0077] The resin composition of the present embodiment contains 0.01 to 1.5 parts by mass of the compound represented by formula (1) with respect to 100 parts by mass of the polycarbonate resin. By containing the compound represented by formula (1), the YI value of the obtained molded article can be reduced.

[0078] [Chemical formula 8]

[0079]

[0080] (In formula (1), R 1 ~R 3 each independently is a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, R 4 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or a group represented by -OR 5 , R 5 is a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 0 to 2.)

[0081] (In formula (1), R 1 ~R 3 each independently is a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, preferably a hydrogen atom, or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, more preferably a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, more preferably a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, and further preferably a hydrogen atom or a methyl group.

[0082] In formula (1), R 4 is preferably a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or a group represented by -OR 5 is preferably a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a group represented by -OR 5 is more preferably a hydrogen atom, an unsubstituted alkyl group having 1 to 5 carbon atoms, or a group represented by -OR 5 is more preferably a hydrogen atom, an unsubstituted alkyl group having 1 to 3 carbon atoms, or a group represented by -OR 5 is further preferably a hydrogen atom, a methyl group, or a group represented by -OR 5 is further preferably a hydrogen atom, a methyl group, or a group represented by -OR

[0083] In formula (1), R 5 is a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, preferably a hydrogen atom, or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, more preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms, more preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 3 carbon atoms, further preferably a hydrogen atom or a methyl group.

[0084] In formula (1), n is an integer of 0 to 2, preferably 0 or 1, more preferably 1.

[0085] Formula (1) is preferably represented by formula (1-1).

[0086] [Chemical Formula 9]

[0087]

[0088] (In formula (1-1), R 11 to R 31 are each independently a hydrogen atom or a methyl group, R 41 is a hydrogen atom, a methyl group, or a group represented by -OR 51 is a hydrogen atom or a methyl group.) 51

[0089] In formula (1-1), R 11 is preferably a hydrogen atom or a methyl group, R 21 is preferably a hydrogen atom or a methyl group, R 31 is preferably a methyl group or a methoxy group. In addition, R 41 is preferably a hydrogen atom, a methyl group, or a methoxy group.

[0090] ​In the present embodiment, the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring in the compound represented by formula (1) is preferably 2 or more, more preferably 3 or more, and further preferably 4 or more. By being 2 or more, there is a tendency for the transmittance in the short wavelength region to further increase. In addition, the upper limit of the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring in the compound represented by formula (1) is preferably 5 or less, and more preferably 4 or less. By being 4 or less, there is a tendency for the transmittance in the short wavelength region to further increase.

[0091] The total number of the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring in the compound represented by formula (1) and the number of hydrogen atoms bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring in the compound represented by formula (1) is preferably 3 or more, more preferably 4 or more, further preferably 5 or more, and further preferably 6 or more. By being 3 or more, there is a tendency for the transmittance in the short wavelength region to further increase. In addition, the total number of the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring in the compound represented by formula (1) and the number of hydrogen atoms bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring in the compound represented by formula (1) is preferably 6 or less. By being 6 or less, there is a tendency for the transmittance in the short wavelength region to further increase.

[0092] In the case where the resin composition of the present embodiment contains two or more compounds represented by formula (1), the total number of the number of hydrogen atoms (or the number of hydrogen atoms at the benzyl group) of each compound represented by formula (1) and the additive concentration is multiplied, and the total of the products is calculated.

[0093] Examples of the compound represented by formula (1) are shown below. Obviously, the compound represented by formula (1) in the present embodiment is not limited to these.

[0094] [Chemical Formula 10]

[0095]

[0096] The content of the compound represented by formula (1) in the resin composition of the present embodiment is 0.01 parts by mass or more, preferably 0.05 parts by mass or more, more preferably 0.08 parts by mass or more, further preferably 0.1 parts by mass or more, further preferably 0.2 parts by mass or more, and more further preferably 0.5 parts by mass or more, relative to 100 parts by mass of the polycarbonate resin. By being equal to or more than the above lower limit value, there is a tendency for the transmittance in the short wavelength region to further increase. In addition, the content of the compound represented by formula (1) is 1.5 parts by mass or less, preferably 1.3 parts by mass or less, more preferably 1.2 parts by mass or less, further preferably 1.1 parts by mass or less, further preferably 1.0 parts by mass or less, and more further preferably 0.9 parts by mass or less, relative to 100 parts by mass of the polycarbonate resin. By being equal to or less than the above upper limit value, there is a tendency for the effect of reducing mold deposit to further increase.

[0097] The resin composition of the present embodiment can contain only one compound represented by formula (1), or can contain two or more. In the case of containing two or more, the total amount is preferably within the above range.

[0098] <Epoxide compound and / or oxetane compound>

[0099] The resin composition of the present embodiment contains an epoxide compound and / or an oxetane compound. By containing an epoxide compound and / or an oxetane compound, it is possible to obtain a molded article that has a reduced YI value and YI value after heating, and excellent light transmittance of visible light.

[0100] An epoxide compound refers to a compound containing an epoxy group, and can contain only one epoxy group in one molecule, or can contain two or more, preferably one to four, further preferably one to three, and further preferably two.

[0101] An oxetane compound refers to a compound containing an oxetanyl group, and can contain only one oxetanyl group in one molecule, or can contain two or more, preferably one to four, further preferably one to three, and further preferably two.

[0102] In the present embodiment, it is preferable to contain at least an epoxide compound.

[0103] The molecular weight of the epoxide compound and / or oxetane compound is not particularly limited, and is preferably 100 or more, and is preferably 1500 or less, more preferably 1000 or less, further preferably 800 or less, and can be 500 or less.

[0104] The epoxide compound and / or oxetane compound is preferably an alicyclic epoxide compound and / or an alicyclic oxetane compound.

[0105] The alicyclic epoxy compound and / or alicyclic oxetane compound used in the present embodiment is preferably a compound represented by formula (2), a compound represented by formula (3), and a compound represented by formula (4), more preferably a compound represented by formula (2) and / or a compound represented by formula (4), and further preferably a compound represented by formula (2).

[0106] Formula (2)

[0107] [Chemical Formula 11]

[0108]

[0109] (In formula (2), A 1 represents a divalent organic group.)

[0110] In formula (2), A 1 is preferably a hydrocarbon group having 1 to 10 carbon atoms, -O-, -C(=O)-, or a group formed by combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, -O-, -C(=O)-, or a group formed by combination of two or more of the above groups. The alkylene group can be in any of a linear, branched, or cyclic form, is preferably linear or branched, and is further preferably linear.

[0111] As a preferred example of the compound represented by formula (2), the following compound can be exemplified.

[0112] [Chemical Formula 12]

[0113]

[0114] Formula (3)

[0115] [Chemical Formula 13]

[0116]

[0117] (In formula (3), A 2 and A 3 each independently represents a divalent organic group.)

[0118] In formula (3), A 2 each independently is preferably a hydrocarbon group having 1 to 10 carbon atoms, is preferably an alkylene group having 1 to 10 carbon atoms, and is more preferably an alkylene group having 1 to 3 carbon atoms.

[0119] In formula (3), A 3preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -0-, -C(=0)-, or a group formed by combining two or more of the above groups, further preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -0-, or a group formed by combining two or more of the above groups. Note that A 3 the end portion (vicinity of the oxygen atom) is preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 12 carbon atoms, further preferably an alkylene group having 1 to 10 carbon atoms.

[0120] As a preferable example of the compound represented by formula (3), the following compound can be exemplified.

[0121] [Chemical Formula 14]

[0122]

[0123] n is an arbitrary integer, and is preferably 1 to 11.

[0124] [Chemical Formula 15]

[0125]

[0126] Formula (4)

[0127] [Chemical Formula 16]

[0128]

[0129] (in formula (4), A 4 and A 5 each independently represent a divalent organic group. R a is an alkyl group having 1 to 5 carbon atoms, and nb is 0 or 1.

[0130] In formula (4), A 4 each independently is preferably a hydrocarbon group having 1 to 20 carbon atoms, -0-, -C(=0)-, or a group formed by combining two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -0-, -C(=0)-, or a group formed by combining two or more of the above groups, further preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, or a group formed by combining two or more of the above groups, further preferably an alkylene group having 1 to 10 carbon atoms, more further preferably an alkylene group having 1 to 3 carbon atoms, and still further preferably an ethylene group and a methylene group.

[0131] In formula (4), A 5 is preferably a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C(=O)-, or a group formed by combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C(=O)-, or a group formed by combination of two or more of the above groups, further preferably a group selected from an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, or a group formed by combination of two or more of the above groups. Note that the end portion (vicinity of the oxygen atom) of A 5 is preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 12 carbon atoms, further preferably an alkylene group having 1 to 10 carbon atoms, further preferably an alkylene group having 1 to 3 carbon atoms.

[0132] R a is preferably an alkyl group having 1 to 3 carbon atoms, preferably a methyl group or an ethyl group.

[0133] nb is preferably 1.

[0134] As a preferable example of the compound represented by formula (4), the following compound can be exemplified.

[0135] [Chemical Formula 17]

[0136]

[0137] As a preferable example of the epoxy compound and / or the oxetane compound used in the present embodiment, in addition to the above, the compounds described in paragraphs 0043 to 0069 of Japanese Patent Application Publication No. 2021-038306, paragraphs 0023 to 0037 of Japanese Patent Application Publication No. 2021-031658 can be used, and these contents are incorporated into the present specification.

[0138] The content of the epoxy compound and / or the oxetane compound (preferably, the epoxy compound) in the resin composition of the present embodiment is 0.01 parts by mass or more, preferably 0.05 parts by mass or more, more preferably 0.08 parts by mass or more, further preferably 0.1 parts by mass or more, further preferably 0.2 parts by mass or more, and more further preferably 0.5 parts by mass or more, relative to 100 parts by mass of the polycarbonate resin. By being set to the above lower limit value or more, there is a tendency that the long-term heat stability is further improved. In addition, the content of the epoxy compound and / or the oxetane compound (preferably, the epoxy compound) is 1.5 parts by mass or less, preferably 1.3 parts by mass or less, more preferably 1.2 parts by mass or less, further preferably 1.1 parts by mass or less, further preferably 1.0 parts by mass or less, and more further preferably 0.9 parts by mass or less, relative to 100 parts by mass of the polycarbonate resin. By being set to the above upper limit value or less, there is a tendency that the effect of further improving the reduction of the mold deposit is improved.

[0139] The resin composition of the present embodiment can contain only one kind of epoxy compound and oxetane compound (preferably, epoxy compound), or can contain two or more kinds. In the case of containing two or more kinds, the total amount is preferably in the above range.

[0140] <Stabilizer>

[0141] The resin composition of the present embodiment can contain a stabilizer other than the phosphite compound having the structure represented by formula (P).

[0142] As the stabilizer, a heat stabilizer and an antioxidant can be given.

[0143] In addition, as the stabilizer, a phenol-based, an amine-based, a phosphorus-based, a sulfide-based, and the like can be given. Among them, in the present embodiment, a phosphorus-based heat stabilizer is preferably contained.

[0144] As the phosphorus-based heat stabilizer, any known phosphorus-based heat stabilizer can be used. As specific examples, phosphorus-containing oxo acids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid; acid pyrophosphate metal salts such as acid pyrophosphate sodium, acid pyrophosphate potassium, and acid pyrophosphate calcium; phosphates of Group 1 or Group 2B metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate; organic phosphate ester compounds, organic phosphite ester compounds, organic phosphonate ester compounds, and the like can be given, and an organic phosphite ester compound other than the phosphite compound having the structure represented by formula (P) is particularly preferable.

[0145] As the organic phosphite compound, for example, triphenyl phosphite, tris(monononylphenyl) phosphite, tris(monononyl / dinonyl-phenyl) phosphite, tris(2,4-di-tert-butylphenyl) phosphite, monooctyldiphenyl phosphite, dioctylmonophenyl phosphite, monodecyl-diphenyl phosphite, didecylmonophenyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, 2,2-methylenebis(4,6-di-tert-butylphenyl) octyl phosphite, and the like can be given.

[0146] As such an organic phosphite compound, specifically, for example, "ADEKA STAB (registered trademark. The same applies hereafter) 1178", "ADEKA STAB 2112", "ADEKA STAB HP-10" manufactured by ADEKA Corporation, "JP-351", "JP-360", "JP-3CP" manufactured by Jyouhoku Chemical Industry Co., Ltd., "Irgafos (registered trademark. The same applies hereafter) 168" manufactured by BASF Corporation, and the like can be given.

[0147] As the phosphorus-based heat stabilizer used in the present embodiment, in addition to the above, reference can be made to the description in paragraphs 0127 to 0133 of Japanese Patent Application Publication No. 2022-067329, which is incorporated into the present specification.

[0148] As the phenolic antioxidant, a hindered phenolic antioxidant is preferably used.

[0149] As specific examples of the hindered phenolic antioxidant, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], 2,4-dimethyl-6-(1-methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphonate, 4,6-bis(octylthiomethyl) o-cresol, ethylene bis(oxyethylene) bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], hexamethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazin-2-ylamino)phenol, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, and the like can be given.

[0150] Among them, pentaerythritol tetrakis [3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate are preferred. As such hindered phenol-based antioxidants, specifically, for example, "Irganox (registered trademark. The same hereinafter) 1010", "Irganox 1076" manufactured by BASF Co., "ADEKA STAB AO-50", "ADEKA STAB AO-60" manufactured by ADEKA Co., and the like can be mentioned.

[0151] The content of the stabilizer (phosphorus-based stabilizer other than the phosphite compound having the structure represented by formula (P)) in the resin composition of the present embodiment is usually 0.001 parts by mass or more, preferably 0.005 parts by mass or more, more preferably 0.01 parts by mass or more, and, on the other hand, 1 part by mass or less, preferably 0.5 parts by mass or less, more preferably 0.3 parts by mass or less, with respect to 100 parts by mass of the polycarbonate resin. By setting the content of the stabilizer to the above range, the effect of adding the stabilizer can be more effectively exerted.

[0152] The resin composition of the present embodiment can contain only one stabilizer, or can contain two or more. In the case of containing two or more, the total amount is preferably in the above range.

[0153] In the resin composition of the present embodiment, the content of the phosphite compound having the structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass, preferably less than 0.001% by mass, more preferably less than 0.0001% by mass, of the resin composition. Thereby, by being configured so that the compound represented by formula (P) is substantially not contained in the resin composition, a molded article excellent in visible light transmittance can be obtained.

[0154] [Chemical Formula 18]

[0155]

[0156] As the compound represented by formula (P), disteradyl pentaerythritol diphosphite, bis (decyl) pentaerythritol diphosphite, bis (tridecyl) pentaerythritol diphosphite, bis (nonylphenyl) pentaerythritol diphosphite can be exemplified.

[0157] <Release Agent>

[0158] The resin composition of the present embodiment can contain a release agent. By incorporating the release agent, the releasability can be further improved.

[0159] As the releasing agent, for example, aliphatic carboxylic acid, salt of aliphatic carboxylic acid, ester of aliphatic carboxylic acid and alcohol, aliphatic hydrocarbon compound having a number average molecular weight of 200 to 15000, silicone-based silicone oil, ketone wax, Light amide, etc. can be mentioned, and aliphatic carboxylic acid, salt of aliphatic carboxylic acid, and ester of aliphatic carboxylic acid and alcohol are preferable.

[0160] Detailed contents of the releasing agent can be referred to the description of paragraphs 0055 to 0061 of Japanese Patent Application Publication No. 2018-095706, which are incorporated into the present specification.

[0161] In the case where the resin composition of the present embodiment contains a releasing agent, the content thereof in the resin composition is preferably 0.01 to 3% by mass.

[0162] The resin composition of the present embodiment can contain only one kind of releasing agent, or can contain two or more kinds. In the case of containing two or more kinds, the total amount is preferably within the above range.

[0163] <Other Components>

[0164] The resin composition of the present embodiment can contain other components than the above, as needed, provided that the desired properties are not significantly impaired. If examples of other components are listed, various resin additives, etc. can be mentioned.

[0165] As the resin additive, for example, ultraviolet absorbers, colorants (dyes, pigments), antistatic agents, flame retardants, flame retardant aids, anti-dripping agents, anti-fogging agents, anti-blocking agents, flowability improvers, plasticizers, dispersants, antibacterial agents, etc. can be mentioned. Note that the resin additive can contain one kind, or two or more kinds in any combination and ratio.

[0166] <Properties of the Resin Composition>

[0167] It is preferable that the resin composition of the present embodiment have a low YI value when molded into a 300 mm long optical path molded product. Specifically, the YI value of the resin composition of the present embodiment when molded into a 300 mm long optical path molded product is preferably 17.4 or lower, more preferably 15.0 or lower, and further preferably 13.0 or lower. Note that, as the lower limit value of the YI value, 0 is ideal, but 1.0 or higher, further 5.0 or higher, and particularly 10.0 or higher can also sufficiently satisfy the required performance. Such a low YI value can be achieved by incorporating the compound represented by formula (1).

[0168] The resin composition of the present embodiment is preferably low in YI value when molded into a 300 mm long optical path molded product and heated. Specifically, the ΔYI value when the resin composition of the present embodiment is molded into a 300 mm long optical path molded product and heated at 120°C for 500 h is preferably 15 or less, more preferably 10 or less, and further preferably 5 or less. In addition, as the lower limit value of the YI value, 0 is ideal, but 1.0 or more, further 5 or more, and particularly 15 or more can also sufficiently satisfy the required performance. Such a low YI value can be achieved by compounding the compound represented by formula (1) and the epoxy compound and / or the oxetane compound.

[0169] The light transmittance at a wavelength of 400 nm when the resin composition of the present embodiment is molded into a 300 mm long optical path molded product is preferably 40% or more, more preferably 42% or more, more preferably 48% or more, further preferably 50% or more, and further preferably 52% or more. In addition, the upper limit of the light transmittance at a wavelength of 400 nm is not particularly limited, and actually 42% or less, or 40% or less can also sufficiently satisfy the required performance.

[0170] The light transmittance at a wavelength of 420 nm when the resin composition of the present embodiment is molded into a 300 mm long optical path molded product is preferably 52% or more, more preferably 55% or more, more preferably 59% or more, further preferably 61% or more, and further preferably 63% or more. In addition, the upper limit of the light transmittance at a wavelength of 420 nm is not particularly limited, and actually 52% or less, or 50% or less can also sufficiently satisfy the required performance.

[0171] The light transmittance at a wavelength of 500 nm when the resin composition of the present embodiment is molded into a 300 mm long optical path molded product is preferably 57% or more, more preferably 60% or more, more preferably 63% or more, further preferably 66% or more, and further preferably 69% or more. In addition, the upper limit of the light transmittance at a wavelength of 500 nm is not particularly limited, and actually 57% or less, or 55% or less can also sufficiently satisfy the required performance.

[0172] The YI value and the light transmittance were measured according to the method described in the Examples described below.

[0173] <Method for producing resin composition>

[0174] The production method of the resin composition of the present embodiment is not limited, and a publicly known production method of a resin composition can be widely used. For example, a method in which a polycarbonate resin, the compound represented by formula (1), an epoxy compound and / or an oxetane compound, and other components as needed are preliminarily mixed using various mixers such as a tumbler mixer, a Henschel mixer, and the like, and then melt-kneaded using a Banbury mixer, a roll, a Brabender extruder, a single-screw kneading extruder, a twin-screw kneading extruder, a kneader, or the like can be exemplified. Note that the temperature of the melt-kneading is not particularly limited, and is usually in the range of 240 to 320°C.

[0175] <Shaped article>

[0176] The shaped article of the present embodiment is formed from the resin composition or the pellet of the present embodiment. The resin composition (e.g., pellet) described above can be molded into a shaped article by various molding methods. The shape of the shaped article is not particularly limited, and can be appropriately selected depending on the purpose of use of the shaped article, and for example, a film shape, a rod shape, a cylindrical shape, a ring shape, a circular shape, an elliptical shape, a polygonal shape, a special-shaped article, a hollow article, a frame shape, a box shape, a panel shape, a button shape, or the like can be exemplified.

[0177] The method of molding into a shaped article is not particularly limited, and a publicly known molding method can be used, and for example, an injection molding method, an injection compression molding method, an extrusion molding method, a special-shaped extrusion method, a transfer molding method, a hollow molding method, a gas-assisted hollow molding method, a blow molding method, an extrusion blow molding, an IMC (in-mold coating) molding method, a rotational molding method, a multilayer molding method, a two-color molding method, an insert molding method, a sandwich molding method, a foaming molding method, a press molding method, or the like can be exemplified. In particular, the resin composition of the present embodiment is suitable for a shaped article obtained by an injection molding method, an injection compression molding method, or an extrusion molding method. However, the resin composition of the present embodiment is of course not limited to a shaped article obtained by these methods.

[0178] The shaped article of the present embodiment can be widely used for a shaped article containing a polycarbonate resin, and in particular, an optical member.

[0179] Specifically, it can be preferably used for electrical / electronic equipment / members, OA equipment / members, information terminal equipment / members, mechanical members, home electric appliances, vehicle members, architectural members, various containers, leisure goods / variety goods, lighting equipment, and the like, and more specifically, it can be preferably used for power cases, lighting lenses, lighting cases, light guide members, and the like. Further specifically, it can be used for a light guide, a lens, or the like that conducts light from a light source such as an LED in a headlamp (headlight) or a tail lamp, a fog lamp, or the like for a vehicle such as an automobile or a motorcycle.

[0180] As for the use of the resin composition of the present embodiment, in addition to the above, reference can be made to the description of 0098 to 0105 of Japanese Patent Application Publication No. 2020-189992, which is incorporated into the present specification.

[0181] Examples

[0182] The present application will be described more specifically below with reference to examples. The materials, amounts, ratios, processing contents, processing steps, and the like shown in the following examples can be appropriately changed as long as the gist of the present application is not deviated. Therefore, the scope of the present application is not limited to the specific examples shown below.

[0183] In the case where the measuring apparatus and the like used in the examples are difficult to obtain due to suspension of production or the like, measurement can be performed using other apparatuses having equivalent performance.

[0184] 1. Raw materials

[0185] The materials shown in Table 1 below were used.

[0186]

[0187] 2. Examples 1 to 11 and Comparative Examples 1 to 4

[0188] <Compound>

[0189] Each component described in Table 1 was mixed uniformly in the proportions described in Tables 2 to 4 (all in mass parts) using a drum mixer to obtain a mixture. The mixture was supplied to a single-screw extruder "VS40-32V" manufactured by Tanabe Plastics Machinery Co., Ltd., and kneaded under the conditions of a screw rotation speed of 80 rpm, a discharge amount of 20 kg / hr, and a cylinder temperature of 250°C, and extruded in the form of a strand from the front end of the extrusion nozzle. The extrudate was quenched by a water tank and pelletized by cutting using a pelletizer to obtain pellets of the resin composition.

[0190] <Measurement of light transmittance>

[0191] Each resin composition (pellets) obtained above was dried at 120°C for 4 to 8 hours by a hot-air circulating dryer, and a 300 mm long-path molded product (6 mm x 4 mm x 300 mm, L / d = 50) was molded at a temperature of 280°C by an injection molding machine ("S-2000i 150B" manufactured by FANUC Corporation).

[0192] The 300 mm long-path molded product obtained above was used as a test piece, and the light transmittance at a wavelength of 400 nm, 420 nm, 440 nm, 460 nm, 480 nm, and 500 nm in a 2° field of view under C light source was measured using a long-path spectrophotometric colorimeter.

[0193] The long path length spectrophotometric colorimeter used was "ASA1" manufactured by Nippon Denshoku Industries Co., Ltd.

[0194] <Measurement of YI value>

[0195] After each of the above-obtained resin compositions (pellets) was dried at 120°C for 4 to 8 hours by a hot air circulation type drier, a 300 mm long path length molded product (6 mm x 4 mm x 300 mm, L / d = 50) was molded at a temperature of 280°C by an injection molding machine ("S-2000i 150B" manufactured by FANUC Corporation). For the molded product, the YI (Yellow Index) value of the 300 mm long path length molded product was measured in a 2° field of view under C light source using a long path length spectrophotometric colorimeter.

[0196] The long path length spectrophotometric colorimeter used was "ASA1" manufactured by Nippon Denshoku Industries Co., Ltd.

[0197]

[0198]

[0199]

[0200]

[0201] In the above table, "the compound of formula (1) or the like" means the compound represented by formula (1) or the comparative compound.

[0202] In the above table, "the number of protons at the benzyl position" means the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring in the compound represented by formula (1). In addition, "the number of protons at the benzyl position (including OH group)" means the total number of the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring in the compound represented by formula (1) and the number of hydrogen atoms bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring in the compound represented by formula (1). In addition, "the relative number of protons" means the value obtained by multiplying the number of protons at the benzyl position of each compound represented by formula (1) by the additive concentration and calculating the total thereof.

[0203] From the above results, it can be clear that the resin composition of the present embodiment has resulted in a molded product having a low YI value and a high light transmittance.

[0204] In contrast, in the case where a compound other than the compound represented by formula (1) is used, even if a structurally similar compound is used, the YI value increases.

[0205] In addition, in Examples 1 to 9, the stabilizer was replaced from ADK STAB 2112 to ADK STAB PEP-36 (manufactured by ADEKA, a phosphite compound having a structure shown in Formula (P)), and otherwise similarly, the result was that the YI value was relatively high.

[0206] [Chemical Formula 19]

[0207]

[0208] In addition, as the phosphite compound having a structure shown in Formula (P), in the case where DOVERPHOS S-9228 (registered trademark) manufactured by DOVER Chemical Co. was used, the YI value was also relatively high.

Claims

1. A resin composition comprising a polycarbonate resin, and comprising, with respect to 100 parts by mass of the polycarbonate resin: 0.01 to 1.5 parts by mass of a compound represented by formula (1), and 0.01 to 1.5 parts by mass of an epoxy compound and / or an oxetane compound, a content of a phosphite compound having a structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass of the resin composition, In formula (1), R 1 3 each independently is a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, R 4 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or a group represented by -OR 5 , R 5 is a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 0 to 2.​ 。 2. The resin composition according to claim 1, wherein In the formula (1), R 1 3 each independently is a hydrogen atom or a methyl group, R 4 is a hydrogen atom, a methyl group or a group represented by -OR 5 , R 5 is a hydrogen atom or a methyl group.​ 3. The resin composition according to claim 1, wherein in the formula (1), n is 1.

4. The resin composition according to claim 1, wherein the formula (1) is represented by formula (1-1), In equation (1-1), R 11 ~R 31 Each is independently a hydrogen atom or a methyl group, R 41 It is a hydrogen atom, a methyl group, or an OR group. 51 The group represented by R 51 It can be a hydrogen atom or a methyl group.

5. The resin composition according to claim 4, wherein In the formula (1-1), R 11 is a hydrogen atom or a methyl group, R 21 is a hydrogen atom or a methyl group, R 31 is a methyl group or a methoxy group.

6. The resin composition according to claim 1, wherein the compound represented by formula (1) is a compound selected from the group consisting of 。 7. A pellet which is the resin composition according to any one of claims 1 to 6.

8. A molded article formed from the resin composition according to any one of claims 1 to 6.

9. A molded article formed from the pellet according to claim 7.

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