An automated semiconductor device inspection handler and method

Abstract

The application provides an automatic semiconductor device detection and sorting machine and method, which comprises a rack, a clamping and feeding device, a sorting device, a flying detection device, a picking and feeding detection device, a buffer area between the flying detection device and the picking and feeding detection device, and a picking and feeding area on one side of the picking and feeding detection device. Through the cooperation of the taking and placing mechanism and the buffer clamping jaw mechanism, the blue film in the storage area is transferred to the sorting device. After being sorted by the sorting device, the semiconductor device is adsorbed by the suction nozzle assembly. After the bottom surface and the four surfaces are detected by the visual detection module and the side detection module respectively, the first carrying assembly sequentially carries the tray and the cover plate in order and transports them to the detection assembly to detect the top surface of the semiconductor device. When an unqualified semiconductor device is detected, it is picked out, and at the same time, the qualified semiconductor device is filled into the corresponding position to realize the full tray state. Then, re-inspection is carried out again, thereby improving the production efficiency and the yield.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor devices, in particular to an automatic semiconductor device detection and sorting machine and method. BACKGROUND

[0002] In the application of semiconductor devices, semiconductor chips in integrated circuit manufacturing are of great significance. Detecting whether the performance parameters of semiconductor chips in integrated circuits meet the design requirements can help to find and eliminate potential quality problems in time, quickly classify products, reduce the defective rate, and improve product reliability, thereby improving production efficiency, reducing manufacturing cost, and optimizing process.

[0003] For example, Chinese patent application No. 202511178504.7, published on November 4, 2025, discloses a semiconductor device sorting machine, which includes a bearing base, a carrying device, a sorting device, and a detection device located at the upper end of the bearing base. The upper end of the bearing base is also provided with a first limiting component for limiting semiconductor devices and a second limiting component for limiting the tray. The sorting device is located between the first limiting component and the second limiting component. The sorting device includes a first sorting wheel and a second sorting wheel. The sorting wheel includes a wheel body and a plurality of suction cups equally distributed around the arc surface of the wheel body. The first side plane of the wheel body is fixed with a driving shaft, and the second side plane is provided with a negative pressure component communicating with the plurality of suction cups.

[0004] The above patent document transports chips in three-dimensional planes through the first sorting wheel and the second sorting wheel, realizes rapid detection of the six surfaces of the chip by combining the visual detection element, and then restores the posture of the chip by using the third sorting wheel to realize rapid and accurate detection of the six surfaces of the chip, thereby solving the problem of low detection efficiency of traditional detection. However, it can only realize the detection of a single semiconductor device, and cannot realize the taking, discharging, and loading of multiple semiconductor devices into the tray for subsequent discharging and stacking, thereby facilitating subsequent conveying and packaging. In addition, if there are unqualified products after detecting a single semiconductor device and placing it in the tray, manual feeding will result in low production efficiency, and manual feeding cannot ensure the reliability of the detection. SUMMARY

[0005] The purpose of the present application is to provide an automatic semiconductor device detection and sorting machine and method, which can efficiently detect chips of different sizes, thereby saving time and cost in the whole chip detection and conveying process, and improving the yield.

[0006] To achieve the above objectives, the technical solution of the present invention is: an automated semiconductor device inspection and sorting machine, comprising a frame, a gripping and feeding device, a sorting device, and further comprising a fly-snap detection device, a pick-and-place detection device, a buffer zone located between the fly-snap detection device and the pick-and-place detection device, and a pick-and-place area located on one side of the pick-and-place detection device; the gripping and feeding device comprises a pick-and-place module, a moving module, and a buffer module disposed opposite to the moving module, the moving module driving the pick-and-place module to alternately move between the moving module and the buffer module to grip and transport the blue film to the sorting device;

[0007] The flying camera detection device includes a sorting turntable, a suction nozzle assembly spaced apart on the sorting turntable, a vision detection module, a first side detection module, a second side detection module, and a receiving module arranged opposite each other on both sides below the sorting turntable. The sorting turntable adsorbs semiconductor devices from the blue film on the sorting platform. The vision detection module detects the bottom surface of the semiconductor device, and the side detection module detects the four sides of the semiconductor device.

[0008] The material buffer area is provided with a jig storage area, a cover plate placement area and a material tray buffer area. The first conveying component grabs the material tray in the material tray buffer area and the cover plate in the cover plate placement area and places them on the first receiving component and the material tray respectively. When the material tray is full, the cover plate and the material tray are moved together to the material picking and replenishing detection device.

[0009] The picking and replenishing detection device includes a detection component, a second conveying component, and a picking and replenishing area. After the first conveying component transports the tray to the detection component, the detection component performs top surface detection on the semiconductor devices in the tray. The second conveying component picks up the unqualified semiconductor devices and moves them to the picking and replenishing area. Then, qualified semiconductor devices are picked up from the picking and replenishing area and added to the tray to achieve a full tray. After re-inspection, the second conveying component transports the tray to the subsequent process.

[0010] The beneficial effects of the present application are as follows: the material taking and placing are realized by the taking and placing module and the buffer module moving alternately, the blue film in the storage area is transferred to the sorting platform, the transfer process does not occupy too much space, the space utilization rate of the equipment is effectively improved, and the feeding efficiency is provided; the semiconductor devices on the blue film are adsorbed by the suction nozzle assembly on the sorting turntable, the semiconductor devices are adsorbed, the sorting turntable rotates, and the bottom surface of the semiconductor devices on the suction nozzle assembly is detected by the visual detection module during the rotation of the sorting turntable, the side surface of the semiconductor devices on the suction nozzle assembly is detected by the side surface detection module, so that detection of five surfaces is realized, after detection, the suction nozzle assembly drives the detected semiconductor devices to be unloaded onto the first receiving assembly, so that the rotating feeding and unloading can be realized by the sorting turntable, the work efficiency is improved, after the bottom surface, four surface detection are completed by the visual detection module, the first side surface detection module and the second side surface detection module, the tray and the cover plate can be sequentially and orderly carried by the first carrying assembly, the first receiving assembly receives the detected semiconductor devices, the tray receives the full tray, and the cover plate and the tray are moved to the picking and supplementing detection device together for top surface detection, and when the unqualified semiconductor devices are detected, the picking and supplementing area is selected to fill the corresponding position to realize the full tray state, and then the detection assembly is used for re-inspection, so that whether the picked and supplemented semiconductor devices have defects can be detected again, and the reliability of detection is ensured, and since the entire sorting process and the material taking and feeding process are realized by one equipment, the efficiency is higher. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 It is a schematic diagram of the automatic semiconductor device detection and sorting machine of the present application. Figure 2 It is a top view of the automatic semiconductor device detection and sorting machine of the present application. Figure 3 It is a schematic diagram of the carrier film mechanism containing semiconductor devices of the present application. Figure 4 It is a schematic diagram of the structure of the clamping and feeding device. Figure 5 It is a schematic diagram of the structure of the clamping and feeding device from another perspective. Figure 6 It is a schematic diagram of the structure of the taking and placing module of the present application. Figure 7 It is a schematic diagram of the structure of the buffer module of the present application. Figure 8 It is a schematic diagram of the structure of the buffer module of the present application. Figure 7 It is an enlarged view of A in the middle. Figure 9 It is a top view of the snapshot detection device. Figure 10 It is a schematic diagram of the mounting plate and the visual detection module. Figure 11 It is a schematic diagram of the first side surface detection module. Figure 12 It is a schematic diagram of the second side surface detection module. Figure 13 It is a schematic diagram of the material receiving module. Figure 14 It is a perspective view of the top rod pressing mechanism. Figure 15 It is a side view of the top rod pressing mechanism.Figure 16 Fig. 2 is a schematic view of a curved arm down-pressing mechanism; Figure 17 Fig. 3 is a schematic view of a curved arm down-pressing mechanism from a side; Figure 18 Fig. 4 is a schematic view of a suction nozzle assembly; Figure 19 Fig. 5 is a schematic view of a cover plate clamping mechanism; Figure 20 Fig. 6 is a schematic view of a cover plate clamping mechanism; Figure 21 Fig. 7 is a schematic view of a tray buffering mechanism in the present application; Figure 22 Fig. 8 is a schematic view of a tray positioning mechanism and a lifting mechanism in the present application; Figure 23 Fig. 9 is a schematic view of a cover plate jig and a support body in the present application; Figure 24 Fig. 10 is a schematic view of a first sliding groove on a disc in the present application; Figure 25 Fig. 11 is a top view of a tray positioning mechanism in the present application; Figure 26 Fig. 12 is a schematic view of a detection assembly in the present application.

[0012] Explanation of reference numerals: a1-rack; a2-pinch feeding device; a200-pick-and-place device; a3-sorting stage; a4-flying detection device; a5-picking detection device; a6-cover plate pinch mechanism; a70-semi-tray buffer area; a71-jig storage area; a72-tray buffer area; a73-cover plate placement area; b1-pick-and-place module; b10-pick-and-place seat; b11-first pick-and-place assembly; b111-first pick-and-place moving mechanism; b112-first pick-and-place mechanism; b1000-space; b1111-first pick-and-place motor; b1112-first pick-and-place belt; b1113-first linear guide rail; b1114-first sliding block; b1121-first holder bottom plate; b1122-first holder finger; b1123-first clamping jaw base; b1124-first clamping drive; b1125-first clamping jaw fixing plate; b1126-first clamping jaw sensor; b12-second pick-and-place assembly; b121-second pick-and-place moving mechanism; b122-second pick-and-place mechanism; b2-moving module; b21-Y-axis linear module; b22-Z-axis linear module; b3-buffer module; b31-buffer support; b32-buffer clamping jaw mechanism; b321-buffer holder bottom plate; b322-buffer holder finger; b323-buffer clamping jaw base; b324-buffer limiting plate; b325-buffer clamping jaw sensor; b326-buffer clamping jaw fixing plate; b327-buffer clamping drive; b328-buffer clamping gap; b33-third linear guide rail; b34-transverse driving mechanism; b400-film loading mechanism; b401-ring; b402-blue film; b403-semiconductor device; c1-sorting turntable; c11-suction nozzle assembly; c111-lifting frame of swing arm; c112-return spring; c113-spring guide shaft; c114-bearing; c115-suction nozzle gland; c116-guide rail mounting seat; c117-suction nozzle swing arm; c118-vacuum suction nozzle; c119-telescopic rod; c120-pad; c121-stiffener of swing arm; c122-cushioning spring; c2-suction nozzle downward pressing module; c21-rod downward pressing mechanism; c211-first stiffener; c212-first plate body; c213-rod linear guide rail; c214-first fixing seat; c215-first cam mechanism; c216-first compression spring; c217-first rod; c218-first driving motor; c219-first adjusting plate; c22-curved arm downward pressing mechanism; c221-second stiffener; c222-second plate body; c223-second linear guide rail; c224-second fixing seat; c225-second cam mechanism; c226-second compression spring; c227-second rod; c228-curved arm assembly; c3-mounting plate; c4-vision detection module; c41-laser detection module; c411-first base; c412-first linear module; c413-first fixing plate; c414-second linear module; c415-detection light source;c42-infrared detection module; c43-visible light detection module; c44-first side detection module; c441-first prism block; c442-fourth linear module; c443-fourth fixed plate; c444-first camera; c445-connector; c45-second side detection module; c451-second prism block; c452-side detection cylinder; c453-fixed frame; c454-fifth fixed plate; c455-second camera; c5-material receiving module; c51-material receiving jig; c52-jig bottom plate; c53-stand plate; c54-connection plate; c55-linear module; 11a-first material receiving assembly; 02c-first carrying assembly; 03c-tray positioning mechanism; 04c-tray buffering mechanism; 05c-jack-up mechanism; 1c-horizontal driving module; 2c-longitudinal driving module; 5c-Z-direction driving module; 6c-connection seat; 7c-first driving member; 8c-positioning column; 9c-first connection block; 10c-first clamping plate; 11c-cover jig; 12c-clamping member; 13c-first sensor; 14c-first clamping hole; 30c-bottom plate; 31c-supporting body; 32c-tray jig body; 33c-first limiting portion; 34c-first protrusion; 35c-first guide groove; 36c-first limiting boss; 37c-first step portion; 38c-second step portion; 39c-third step portion; 40c-second limiting boss; 41c-fourth step portion; 42c-fifth step portion; 43c-third fixed plate; 431c-first slot; 44c-connection block; 45c-fourth fixed plate; 46c-first motor; 47c-disc; 48c-third limiting block; 49c-second slide rail; 50c-second slide block; 51c-positioning rod; 120c-first slide groove; 52c-connection column; 53c-base; 54c-third cylinder; 55c-third jacking rod; 56c-first guide column; 57c-fourth limiting block; 13a-detection assembly; 131a-conveying base; 1311a-detection longitudinal movement assembly; 1312a-detection tray receiving assembly; 132a-detection frame; 1321a-detection two-dimensional module; 14a-second carrying assembly; 15a-picking-up area; 151a-stacking area. DETAILED DESCRIPTION

[0013] The application will be further described in conjunction with the drawings and specific embodiments.

[0014] As Figure 1 and Figure 2As shown, the present application provides an automatic semiconductor device detection and sorting machine, which comprises a rack a1, a clamping and feeding device a2, a sorting platform a3, a flying detection device a4, a pick-up detection device a5, a buffer area between the flying detection device a4 and the pick-up detection device a5, and a pick-up area on one side of the pick-up detection device a5. The buffer area is provided with a half-disk buffer area a70, a jig storage area a71 adjacent to the half-disk buffer area a70, a cover plate placement area a73, and a tray buffer area a72 between the cover plate placement area a73 and the half-disk buffer area a70. The first carrying assembly 02c is provided with a cover plate clamping mechanism a6. The cover plate placement area a73 is provided with a cover plate buffer mechanism. The tray buffer area a72 is provided with a tray buffer mechanism 04c. The sorting platform a3 is used for placing a film loading mechanism b400. The lower end of the flying detection device a4 is provided with a first material receiving assembly 11a and a cover plate clamping mechanism a6, and a tray clamping mechanism. The tray clamping mechanism clamps the tray on the tray buffer area and places it on the first material receiving assembly 11a. The flying detection device a4 is used to detect the back and side of the semiconductor device on the suction nozzle assembly to determine OK and NG products, and to transport the OK product to the first material receiving assembly 11a. Then, the first material receiving assembly 11a receives the semiconductor device from the suction nozzle assembly of the flying detection device a4. If the tray is full of semiconductor devices, the cover plate clamping mechanism a6 clamps the cover plate from the cover plate placement area and places it on the pick-up detection device a5 after being full of semiconductor devices. At the same time, the cover plate clamping mechanism a6 places the cover plate on the cover plate placement area. The pick-up detection device a5 detects the front of the semiconductor device. If the tray is not full of semiconductor devices, the carrying assembly (not shown in the figure) is used to clamp and place the tray that is not full of semiconductor devices to the half-disk buffer area. In the next suction nozzle assembly, when the semiconductor device detection detects the OK product, the carrying assembly is used to clamp and place the tray that is not full of semiconductor devices in the half-disk buffer area under the corresponding suction nozzle assembly of the first material receiving assembly for loading until the tray is full.

[0015] After the tray is full of the corresponding semiconductor devices of this type, the cover plate clamping mechanism a6 clamps the cover plate of the same size as the tray from the cover plate placement area and places it on the pick-up detection device a5 for front detection. In this embodiment, different trays correspond to different sizes of cover plates, that is, different cover plates are replaced when different trays are clamped for placing the corresponding semiconductor devices. If the pick-up detection device detects the front of the semiconductor device, and the unqualified product is removed from the tray, the qualified product is clamped from the pick-up area and placed in the tray to make the tray full. Then, the full tray is placed in the isolation paper and then stacked, bundled, sealed, and labeled, and the like, until the whole detection and sorting process is completed, such as Figure 3As shown, the carrier film mechanism b400 includes a ring b401, a blue film b402, and semiconductor devices b403. The blue film b402 is disposed inside the ring b401, and multiple semiconductor devices b403 are disposed on the blue film b402.

[0016] like Figure 4 and Figure 5 As shown, the gripping and feeding device a2 includes a gripping and placing module b1, a moving module b2, and a buffer module b3. The gripping and placing module b1 includes a gripping and placing seat b10, at least one first gripping and placing component b11, and at least one second gripping and placing component b12. The first gripping and placing component b11 includes a first gripping and placing moving mechanism b111 and a first gripping and placing mechanism b112, and the second gripping and placing component b12 includes a second gripping and placing moving mechanism b121 and a second gripping and placing mechanism b122. The buffer module b3 includes a buffer support b31 and a buffer gripper mechanism b32.

[0017] like Figure 5 and Figure 6 As shown, the first pick-and-place moving mechanism b111 includes a first pick-and-place motor b1111, a first pick-and-place driving wheel, a first pick-and-place driven wheel, and a first pick-and-place belt b1112. The first pick-and-place motor b1111 is mounted on the pick-and-place base b10. The first pick-and-place driving wheel is mounted on one end of the pick-and-place base b10 via a first rotating shaft and a bearing, and rotates with the first rotating shaft. The output shaft of the first pick-and-place motor b1111 is connected to the first rotating shaft. The first pick-and-place driven wheel is mounted on the other end of the pick-and-place base b10 via a second rotating shaft and a bearing, and rotates with the second rotating shaft. The first pick-and-place belt b1112 is fitted between the first pick-and-place driving wheel and the first pick-and-place driven wheel. A first linear guide rail b1113 is mounted on the pick-and-place base b10, and a first slider b1114 is slidably mounted on the first linear guide rail b1113.

[0018] like Figure 6As shown, the first pick-and-place mechanism b112 includes a first hand bottom plate b1121, a first hand finger b1122, a first jaw base b1123, a first clamping drive b1124, a first jaw fixing plate b1125 fixed on the first sliding block b1114, a first jaw fixing plate b1125 fixed on the first pick-and-place belt b1112, the first hand bottom plate b1121 fixed on the first jaw fixing plate b1125, the first jaw base b1123 fixed on the first hand bottom plate b1121, the first clamping drive b1124 installed on the first jaw base b1123, in this embodiment, the first clamping drive b1124 is a thin air cylinder, the first hand finger b1122 is arranged on the output shaft of the first clamping drive b1124, in this embodiment, the first hand finger b1122 is fixed on the output shaft of the first clamping drive b1124, one end of the first hand finger b1122 extends out of the first jaw base b1123, a first clamping gap is formed between the first hand bottom plate b1121 and the first hand finger b1122, the first pick-and-place mechanism b112 is located on one side of the first clamping gap, which is the pick-and-place position of the first pick-and-place mechanism b112, the first jaw sensor b1126 is installed on the first hand bottom plate b1121 and located on one side of the first jaw base b1123, the first jaw sensor b1126 is used to sense whether the film carrying mechanism has arrived. In this embodiment, when the first pick-and-place motor b1111 works, the first pick-and-place motor b1111 drives the first pick-and-place driving wheel to rotate, the first pick-and-place belt b1112 is driven to move by the first pick-and-place driving wheel, so that the first jaw fixing plate b1125 can be driven to move in the X-axis direction, the first hand bottom plate b1121, the first hand finger b1122, the first jaw base b1123, the first clamping drive b1124 and the first jaw sensor b1126 are driven to move in the X-axis direction by the first jaw fixing plate b1125. In this movement process, the first sliding block b1114 moves on the first linear guide rail b1113 to guide the movement of the first jaw fixing plate b1125.

[0019] In this embodiment, when the first clamping drive b1124 works, the first clamping drive b1124 drives the first hand finger b1122 to move relative to the first hand bottom plate b1121, when the first hand finger b1122 moves towards the first hand bottom plate b1121, the first clamping gap becomes smaller, so that the edge of the film carrying mechanism can be clamped, when the first hand finger b1122 moves away from the first hand bottom plate b1121, the first clamping gap becomes larger, so that the film carrying mechanism can be released.

[0020] As Figure 6As shown, the structure of the second pick-and-place moving mechanism b121 is provided as the structure of the first pick-and-place moving mechanism b111, and the structure of the second pick-and-place mechanism b122 is the same as that of the first pick-and-place mechanism b112 except that the pick-and-place positions are oppositely arranged and the upper and lower positions are staggered. In order to distinguish the names, the components in the first pick-and-place moving mechanism and the first pick-and-place mechanism are named with "first", and the components in the second pick-and-place moving mechanism and the second pick-and-place mechanism are named with "second".

[0021] As shown in Figure 6 , the first hand supporting bottom plate b1121 is arranged in an arc shape on one side of the first clamping seam; the second hand supporting bottom plate in the second pick-and-place mechanism b122 is arranged in an arc shape on one side of the second clamping seam. As shown in Figure 3 , the shape of the film carrying mechanism is generally circular. When one side of the first hand supporting bottom plate b1121 and the second hand supporting bottom plate is arranged in an arc shape, the first hand supporting bottom plate b1121 and the second hand supporting bottom plate can better dock with the shape of the film carrying mechanism when the film carrying mechanism is picked up or placed, and the ring of the film carrying mechanism can be easily clamped.

[0022] As shown in Figure 6 , the first inclined surface b11211 is arranged on the upper surface of both ends of the first hand supporting bottom plate b1121 arranged in an arc shape; and the second inclined surface is arranged on the upper surface of both ends of the second hand supporting bottom plate arranged in an arc shape. With this structure, the first inclined surface b11211 and the second inclined surface can guide the film carrying mechanism when it enters the first pick-and-place mechanism and the second pick-and-place mechanism.

[0023] As shown in Figure 5 , the moving module b2 includes a Y-axis linear module b21 and a Z-axis linear module b22, the pick-and-place module b1 is slidably arranged on the Z-axis linear module b22 and can move along the Z-axis direction, the Z-axis linear module b22 is slidably arranged on the Y-axis linear module b21 and can move along the Y-axis direction. By slidably connecting the pick-and-place module b1 to the Z-axis linear module b22, when the Z-axis linear module b22 moves on the Y-axis linear module b21, the pick-and-place module b1 moves on the Y-axis at the same time. Meanwhile, the pick-and-place module b1 can move on the Z-axis linear module b22, so that the pick-and-place module b1 can move along the Y-axis and Z-axis directions at the same time, and does not occupy too much equipment area. In this embodiment, the Y-axis linear module b21 and the Z-axis linear module b22 both adopt the existing motor, screw and nut structure.

[0024] The buffer clamping jaw mechanism b32 is arranged on the buffer support b31, and the clamping direction of the buffer clamping jaw mechanism b32 is arranged towards the pick-and-place module b1. As shown in Figure 7 and Figure 8As shown, the third linear guide rail b33 extending along the X-axis direction is arranged on the buffer support b31, the third slider sliding on the third linear guide rail is arranged, the transverse driving mechanism b34 is arranged between the buffer support b31 and the buffer clamp jaw mechanism b32, and the transverse driving mechanism b34 is a pneumatic cylinder in the embodiment, so that the buffer clamp jaw mechanism b32 is driven to move in the X-axis direction, and the position of the buffer clamp jaw mechanism b32 in the X-axis direction is changed.

[0025] In the application, the taking and placing position of the first taking and placing mechanism b112 and the taking and placing position of the second taking and placing mechanism b122 are oppositely arranged in the X-axis direction; the taking and placing position of the first taking and placing mechanism b112 is oppositely arranged with the taking and placing device a200 of the taking and placing area, and the taking and placing device a200 is a multi-layer device with lifting feeding in the prior art, which is not described herein; the taking and placing position of the second taking and placing mechanism b122 is oppositely arranged with the sorting stage a3. The buffer module b3 and the taking and placing module b1 are oppositely arranged in the Y-axis direction, and the space b1000 is arranged between the taking and placing module b1 and the buffer module b3; the clamping direction of the buffer clamp jaw mechanism b32 is arranged towards the taking and placing module b1, and the buffer clamp jaw mechanism b32 is provided with two or more than two.

[0026] In the embodiment, one first pick-and-place assembly b11 is provided, one second pick-and-place assembly b12 is provided, the first pick-and-place assembly b11 and the second pick-and-place assembly b12 are arranged in a staggered manner in the Z-axis direction, and two buffer gripper mechanisms b32 are provided, and the two buffer gripper mechanisms b32 are arranged in a staggered manner in the Z-axis direction.

[0027] In the embodiment, the sorting stage a3 adopts the structure of the application No. 202510569244.X, which will not be described here.

[0028] As shown in Figure 9 and Figure 10 , the flying shot detection device a4 comprises a sorting turntable c1, the sorting turntable c1 is provided with two or more suction nozzle assemblies c11 arranged at equal intervals, a suction nozzle pressing mold group c2 is arranged above the sorting turntable c1, an installation plate c3, a visual detection mold group c4 and a material collecting mold group c5 are further arranged below the sorting turntable c1, the installation plate c3 is installed on the rack a1, the visual detection mold group c4 is arranged on the installation plate c3 and arranged in sequence along the rotation path of the sorting turntable c1, and the visual detection mold group c4 comprises a laser detection mold group c41, an infrared detection mold group c42 and a visible light detection mold group c43; the installation plate c3 is provided with a hollow area directly below the rotation path of the sorting turntable c1, so that the visual detection mold group c4 can be aligned with the semiconductor device above.

[0029] As shown in Figure 10 , the laser detection mold group c41 comprises a first base c411, a first linear mold group c412, a first fixed plate c413, a second linear mold group c414 and a detection light source c415, the first base c411 is arranged on the hollow area at one end of the installation plate c3, the first linear mold group c412 is arranged on the first base c411 and arranged perpendicularly to the installation plate c3, the first fixed plate c413 is arranged on the guide rail slider of the first linear mold group c412, the first linear mold group c412 is arranged in sliding connection with the second linear mold group c414, the second linear mold group c414 is arranged on the installation plate c3 through a mounting assembly and arranged in parallel with the installation plate c3, and the top end of the first fixed plate c413 is provided with the detection light source c415. By arranging the first linear mold group c412 to move horizontally on the second linear mold group c414, the detection light source can follow the detection of the semiconductor device in the rotation path directly below, and by arranging the first fixed plate c413 to move vertically on the first linear mold group c412, the focal length can be adjusted to make the detection more accurate.

[0030] As shown in Figure 9 and Figure 10As shown, the horizontal moving modules in the infrared detection module c42 and the visible light detection module c43 have the same structure as the second linear module c414 in the laser detection module c41, and the vertical moving modules in the infrared detection module c42 and the visible light detection module c43 have the same structure as the first linear module c412 in the laser detection module c41.

[0031] like Figure 11 As shown, the side detection module includes a first side detection module c44 and a second side detection module c45. The first side detection module c44 includes a first prism block c441, a fourth linear module c442, and a fourth fixing plate c443. The fourth linear module c442 is fixedly installed below the sorting turntable and is parallel to the mounting plate c3. The fourth fixing plate c443 consists of two parallel plates with a first camera c444 positioned between them. The detection end of the first camera c444 faces upward. One end of the fourth fixing plate c443 is connected by a connector c44. 5 is slidably connected to the fourth linear module c442. The other end of the fourth fixing plate c443 extends vertically upward and then toward the center of the first camera c444. A first prism block c441 is provided on the other end of the fourth fixing plate c443. The inclined surface of the first prism block c441 is inclined downward, so that the images of the two opposite sides of the semiconductor device can be acquired by the first camera under the reflection of the first prism block c441. There is a gap between the two first prism blocks c441 for the semiconductor device to pass through by the suction nozzle assembly. The gap is greater than the distance between the two opposite sides of the semiconductor device.

[0032] like Figure 12As shown, the second side detection module c45 includes a second prism block c451, a side detection cylinder c452, a fixed frame c453 and a fifth fixed plate c454, the fifth fixed plate c454 is vertically arranged with the mounting plate c3, one end of the fifth fixed plate c454 is fixedly arranged below the sorting turntable, the other end of the fifth fixed plate c454 is provided with the side detection cylinder c452, one end of the fixed frame c453 is connected with the side detection cylinder c452, the other end of the fixed frame c453 is arranged extending towards the sorting turntable c1, the other end of the fixed frame c453 is provided with two oppositely arranged second prism blocks c451, the inclined surface of the second prism block c451 is arranged towards the lower side, a space for accommodating the other two opposite sides of the semiconductor device is arranged between the two second prism blocks c451, a second camera c455 is correspondingly arranged below each of the two second prism blocks c451, the detection end of the second camera c455 is arranged towards the upper side, so that the second camera c455 can record the external shape picture of the other two opposite sides of the semiconductor device under the reflection of the second prism block c451, the transverse distance of the space is greater than the distance between the other opposite sides of the semiconductor device, the straight line where the two first prism blocks c441 are located is vertically arranged with the straight line where the two second prism blocks c451 are located, and the side detection cylinder c452 can drive the second prism block c451 to move along the vertical direction.

[0033] In this embodiment, the laser detection module c41 moves horizontally synchronously with the sorting turntable c1, the optimal focal length of the vision detection module is determined according to the measured distance value, and then the focal length of the vision detection module is adjusted according to the optimal focal length. The determination of the optimal focal length is achieved by moving the second linear module c414 of the laser detection module c41 at the same speed as the sorting turntable c1 or by rotating the sorting turntable, so that the laser detection module c41 moves relatively to the sorting turntable. Then, the distance of the semiconductor device adsorbed on a suction nozzle assembly is detected, and the optimal focal length value is determined according to the multi-point distance detection value. For example, the average value of the distance values detected by the multi-point position detection to the bottom of the semiconductor device is taken as the optimal distance value. Then, the optimal distance value and the corresponding infrared detection module and visible light detection module are used to determine the optimal focal length of the infrared detection module and the visible light detection module, so as to realize automatic focusing. For example, the optimal focal length values of the cameras in the visible light detection module and the infrared detection module are a certain value. Then, the difference between the optimal distance value and the optimal focal length value is determined to determine the distance of the vertical movement. When the semiconductor device moves to the position of the infrared detection module, the infrared detection module moves horizontally or the sorting turntable c1 rotates, so that the infrared detection module moves relatively to the sorting turntable. The infrared detection module obtains pictures of the internal structure of the semiconductor device at multiple angles, one of which is the picture of the semiconductor device at the left corner position of the detection area, one is the picture of the semiconductor device in the middle of the detection area, and then the picture of the semiconductor device at the right corner position of the detection area. Then, the multiple pictures are spliced to form a complete picture. Then, the infrared detection module is used to obtain two or more pictures of the semiconductor device on the suction nozzle assembly at the optimal focal length and determine the final semiconductor device picture to detect the internal shape of the semiconductor device. Specifically, by comparing the final semiconductor device picture with the preset semiconductor device picture, if the similarity exceeds the preset value, it is determined to be qualified, otherwise it is unqualified, i.e. NG semiconductor device. When moving to the visible light detection module, the visible light detection module moves horizontally or the sorting turntable c1 rotates, so that the visible light detection module moves relatively to the sorting turntable. The visible light detection module obtains two or more pictures. The visible light detection module can also obtain multiple angle pictures and form a final picture like the infrared detection module. The visible light detection module forms the final semiconductor device picture by image splicing technology. The visible light detection module is used to obtain two or more pictures of the semiconductor device on the suction nozzle assembly at the optimal focal length and determine the final semiconductor device picture to detect the external surface of the semiconductor device. The final semiconductor device picture is compared with the preset visible light semiconductor device picture. If the similarity does not exceed the preset value, it is determined to be qualified, otherwise it is unqualified, i.e. NG semiconductor device.

[0034] As Figure 9 and Figure 13As shown, the material receiving module c5 arranged at the unloading end of the sorting turntable, the material receiving module c5 includes a receiving jig c51, a jig bottom plate c52, a vertical plate c53, a connecting plate c54 and a linear module c55, the receiving jig c51 is provided with a groove at the center, the jig bottom plate c52 is provided with two or more receiving jigs c51, one side of the jig bottom plate c52 is fixedly connected with one end of the vertical plate c53, the other end of the vertical plate c53 is arranged on the connecting plate c54, the connecting plate c54 is connected with the linear module c55 through fasteners, one end of the linear module c55 is arranged below the rotating path of the sorting turntable c1, the other end of the linear module c55 extends out of the sorting turntable c1, and limit blocks are further arranged at both ends of the guide rail of the linear module c55. The receiving jig c51, the jig bottom plate c52 and the vertical plate c53 are connected on the linear module c55 through the connecting plate c54, so that the NG products can be cleaned in time, and the work efficiency is improved.

[0035] As shown in Figure 9 , Figure 14 to Figure 17 , the nozzle down-pressing module c2 includes a top rod down-pressing mechanism c21 and a curved arm down-pressing mechanism c22, and both are arranged on the sorting turntable c1, the sorting turntable c1 is provided with two top rod down-pressing mechanisms c21, one top rod down-pressing mechanism c21 is arranged on the opposite side above the visual detection module c4, and the other top rod down-pressing mechanism c21 is arranged opposite to the curved arm down-pressing mechanism c22.

[0036] The top rod down mechanism c21 includes a first reinforcing rib c211, a first plate body c212, a top rod linear guide rail c213, a first fixed seat c214, a first cam mechanism c215, a first compression spring c216, a first top rod c217 and a first drive motor c218, the first reinforcing rib c211 is arranged on the sorting turntable c1, the first reinforcing rib c211 is two plates which are first inclined upward, then outward and then upward, one end of the first reinforcing rib c211 is fixedly connected with the sorting turntable c1, and the other end of the first reinforcing rib c211 is connected with one side of the first plate body c212, the other side of the other side of the first plate body c212 is provided with the top rod linear guide rail c213, the two sides of one side of the first fixed seat c214 are connected with the sliders on the top rod linear guide rail c213 through fasteners, the first cam mechanism c215 is arranged between the first fixed seat c214 and the first plate body c212, the first top rod c217 is arranged at the lower end of the first plate body c212, the first compression spring c216 is symmetrically arranged between the first cam mechanism c215 and the first top rod c217, the first drive motor c218 is fixed on the first plate body c212, and the output end of the first drive motor c218 is connected with the first cam mechanism c215, the first plate body c212 is provided with a first adjusting plate c219, the first adjusting plate c219 is provided with the first compression spring c216, the other end of the first compression spring c216 is connected with the other end of the first top rod c217, when the first drive motor c218 drives the first cam mechanism c215 to swing, the first top rod c217 slides in the first adjusting plate c219 and is arranged downward, the first compression spring c216 can guide and reset, the first top rod c217 abuts against the suction nozzle assembly, so that the suction nozzle assembly moves downward to adsorb the semiconductor device.

[0037] The curved arm pressing mechanism c22 comprises a second reinforcing rib c221, a second plate body c222, a second linear guide rail c223, a second fixed seat c224, a second cam mechanism c225, a second compression spring c226, a second drive motor, a second top rod c227 and a curved arm assembly c228; the second reinforcing rib c221 is arranged on the upper surface of the sorting turntable c1, the second reinforcing rib c221 is two triangular plate bodies, the second reinforcing rib c221 is vertically connected with the side plate surface of the sorting turntable c1, the second reinforcing rib c221 is fixedly connected with the second plate body c222, two sides of the other side surface of the second plate body c222 are respectively provided with the second linear guide rail c223, two sides of one surface of the second fixed seat c224 are connected and arranged with the sliders on the second linear guide rail c223 through fasteners, the sliders are slidingly arranged with the second linear guide rail c223, the second cam mechanism c225 is arranged between the second fixed seat c224 and the second plate body c222, the second top rod c227 is arranged at the lower end of the second plate body c222, the second compression spring c226 is symmetrically arranged between the second cam mechanism c225 and the second top rod c227, and the curved arm assembly c228 is arranged at the bottom end of the second plate body c222; the setting structure and working principle of the second compression spring c226, the second cam mechanism c225 and the second drive motor are the same as those of the first compression spring, the first cam mechanism and the first drive motor. Wherein, the shape of the curved arm assembly c228 is arranged as a smooth surface parallel to the bottom of the sorting turntable c1 on the upper surface, and the lower surface of the curved arm assembly c228 is a smooth surface gradually convex downward from both ends to the center.

[0038] As Figure 18As shown, the suction nozzle assembly c11 includes a swing arm lifting frame c111, a return spring c112, a spring guide shaft c113, a bearing c114, a suction nozzle pressure cover c115, a guide rail mounting seat c116, a suction nozzle swing arm c117, a vacuum suction nozzle c118, a swing arm reinforcing rib c121 and a buffer spring c122. The guide rail mounting seat c116 is arranged on the sorting turntable c1 by fasteners. The suction nozzle pressure cover c115 is arranged in connection with the top of the guide rail mounting seat c116 by fasteners. The suction nozzle pressure cover c115 is arranged in outward symmetrical extension. The extension direction of the suction nozzle pressure cover c115 is provided with the swing arm lifting frame c111. The upper end of the swing arm lifting frame c111 is provided with the bearing c114. The lower end of the swing arm lifting frame c111 is protruded to both sides. The protrusions at the lower end of the swing arm lifting frame c111 are provided with the telescopic rod c119 between the extension end of the suction nozzle pressure cover c115. The telescopic rod c119 is provided with the return spring c112. The bottom of the swing arm lifting frame c111 is provided with the spring guide shaft c113. The lower end of the swing arm lifting frame c111 is further provided with the cushion block c120. One end of the cushion block c120 is connected with the suction nozzle swing arm c117 by the fixing sheet. The other end of the suction nozzle swing arm c117 is arranged in outward extension. The end of the suction nozzle swing arm c117 is provided with the vacuum suction nozzle c118. The upper end of the cushion block c120 is further provided with the swing arm reinforcing rib c121. The swing arm reinforcing rib c121 is arranged in extension in the same direction as the suction nozzle swing arm c117. The end of the swing arm reinforcing rib c121 is sequentially provided with the buffer spring c122 and the adjusting rod. In the embodiment, the end of the swing arm reinforcing rib c121 and the end of the suction nozzle swing arm c117 are provided with the through hole. The buffer spring c122 is fixed in the end of the swing arm reinforcing rib c121 and the end of the suction nozzle swing arm c117 through the through hole. One end of the adjusting rod passes through the through hole and is fixed in the end of the swing arm reinforcing rib c121 and the end of the suction nozzle swing arm c117 by the bolt.

[0039] When the sorting turntable c1 drives the suction nozzle assembly c11 to rotate through the curved arm pressing mechanism c22, the bearing c114 slides on the lower surface of the curved arm assembly c228. When sliding to the center, the swing arm lifting frame c111 is driven by the protrusion extending downward of the curved arm assembly c228 to move downward by a certain distance. In the embodiment, the downward moving distance is 2 mm. At this time, the swing arm lifting frame c111 just abuts against the second top rod c227. At this time, the second cam mechanism c225 performs secondary pressing to make the suction nozzle assembly c11 move downward by a certain distance. In the embodiment, the downward moving distance is 1.5 mm. Thus, the curved arm assembly c228 can be used to pre-press, the pressing time of the top rod is reduced, the working efficiency of the equipment is increased, and the upward force can be buffered through the buffer spring c122 and the adjusting rod arranged on the suction nozzle swing arm c117 after the suction nozzle swing arm c117 is pressed to contact the semiconductor device.

[0040] As Figure 2 andFigure 19 As shown, the cover plate clamping mechanism a6 is used to clamp a cover plate from the cover plate placement area a73 and place it into the material tray on the first receiving assembly 11a, or to clamp a fixture, or to clamp a material tray. The cover plate clamping mechanism a6 includes a first conveying assembly 02c with a connecting seat 6c, a first clamping mechanism fixed to the bottom of the connecting seat 6c, a cover plate fixture 11c disposed at the lower end of the first clamping mechanism, and a clamping assembly disposed on the cover plate fixture 11c.

[0041] like Figure 19 As shown, the first transport component 02c is a first transport three-dimensional module, which is an existing three-dimensional module capable of X-axis, Y-axis, and Z-axis movement. The first transport three-dimensional module is mounted on the frame a1. The first transport component 02c specifically includes a transverse drive module 1c and a longitudinal drive module 2c mounted on the frame a1. The two ends of the longitudinal drive module 2c are slidably mounted on the transverse drive module 1c. The longitudinal drive module 2c is provided with a Z-axis drive module 5c. One end of the connecting seat 6c is fixed to the output end of the Z-axis drive module 5c, and the other end of the connecting seat 6c is fixedly connected to the first clamping mechanism. Figure 20 As shown, the first gripping mechanism includes a first driving component 7c and two or more gripping plates 10c connected to the output end of the first driving component 7c via a first connecting block. The first gripping plates 10c are relatively offset on both sides of the cover plate fixture 11c. In this way, through the cooperation of the transverse driving module 1c, the longitudinal driving module 2c and the Z-axis driving module 5c, the first gripping mechanism can be driven to move precisely above the cover plate placement area, thereby facilitating the cover plate fixture 11c to abut against the cover plate. Under the action of the first driving component 7c, the two first gripping plates 10c can be driven to grasp the cover plate. In this embodiment, the first driving component 7c can be a pneumatic finger structure, or it can be selected as an electric gripper according to the actual driving stroke required.

[0042] like Figure 2 to Figure 20As shown, the clamping assembly includes a clamping cylinder, a clamping piece 12c fixedly connected with the output end of the clamping cylinder, and a first sensor 13c obliquely arranged with the moving direction of the clamping piece 12c and arranged at the opposite side of the clamping piece 12c, the first sensor 13c is a proximity sensor, used to detect whether the positioning column passes through the first through hole, the clamping cylinder is arranged on the top surface of the cover plate jig 11c, the clamping piece 12c is provided with a first clamping hole 14c matched with the positioning column 8c, the opening direction of the first clamping hole 14c is in the same horizontal straight line with the moving direction of the clamping piece 12c, the moving direction of the clamping piece 12c is arranged vertically to the moving direction of the first clamping plate 10c, and the first sensor 13c is arranged at the side opposite to the first clamping hole 14c, so that the clamping piece 12c can be driven by the clamping cylinder to move vertically to the moving direction of the first clamping plate 10c, and then the first clamping hole 14c is horizontally clamped into the positioning column 8c, and the first sensor 13c can detect whether the positioning column 8c is clamped into the first clamping hole 14c, so that the limiting boss on the positioning column 8c can limit the clamping piece 12c in the vertical direction, and then the clamping piece 12c can move in the vertical direction to drive the cover plate to lift, and the first clamping plate 10c can clamp the cover plate from both sides of the cover plate, so that the cover plate can be stably clamped and moved, and in addition, by adjusting the distance between the two first clamping plates 10c, and then matching the clamping of the clamping piece 12c and the positioning column 8c by the clamping cylinder, different sizes of cover plates can be clamped, so that the same clamping device can clamp and transfer cover plates of different sizes, and the working efficiency of clamping cover plates of different sizes is effectively improved.

[0043] As Figure 2 and Figure 23 、 Figure 20 As shown, the tray buffer area a72 is provided with a tray buffer mechanism 04c, the tray buffer mechanism 04c includes a support body 31c fixed on the bottom plate 30c, a tray positioning mechanism in the support body 31c, and a jacking mechanism 05c in sliding connection with the bottom plate 30c, after the first carrying assembly 02c drives the cover plate jig 11c to abut against the cover plate in the cover plate placing area a73, the positioning column 8c on the cover plate protrudes out of the cover plate jig 11c, the clamping assembly clamps the positioning column 8c along the top surface of the cover plate jig 11c, after the first clamping mechanism moves downward, when the first clamping mechanism clamps the cover plate and the tray, the first clamping mechanism moves downward to clamp the cover plate and the tray from both sides of the cover plate and the tray, the tray positioning mechanism positions along the diagonal line of the tray jig on the support body 31c, and the jacking mechanism drives the tray jig to lift to match the height of the clamped cover plate, so that the cover plate covers the jacked tray.

[0044] As Figure 23As shown, the bottom of the bottom plate 30c is provided with two or more first guide columns 56c, and a first gap is formed on one side of the support body 31c fixed to the bottom plate 30c. The top of the support body 31c is fixed with a tray jig, which includes a tray jig body 32c and a first limiting part 33c symmetrically arranged about the diagonal line of the tray jig body 32c. The two sides of the tray jig body 32c along the diagonal line direction are provided with first protrusions 34c, and the first protrusions 34c and the first limiting part 33c form a first guide groove 35c therebetween. The first limiting part 33c is provided with a first limiting boss 36c, and the first limiting boss 36c is provided with a first step part 37c, a second step part 38c higher than the first step part 37c, and a third step part 39c higher than the second step part 38c. The first step part 37c and the second step part 38c are spaced apart and have different heights, and the height difference between the first step part 37c and the second step part 38c is equal to the height difference between the second step part 38c and the third step part 39c. The first limiting boss 36c is symmetrically provided with a second limiting boss 40c on both sides thereof. The first limiting boss 36c and the second limiting boss 40c are provided with a clearance space therebetween. The second limiting boss 40c is provided with a fourth step part 41c aligned with the second step part 38c and a fifth step part 42c aligned with the third step part 39c. In this way, the tray placed on the tray jig body 32c is positioned by the combined action of the tray jig body 32c, the first step part 37c, and the second limiting boss 40c. The tray placed on the first step part 37c is positioned by the combined action of the second step part 38c and the fourth step part 41c. The tray placed on the second step part 38c and the fourth step part 41c is positioned by the combined action of the third step part 39c and the fifth step part 42c. In this way, different step parts can be used to position and store trays of different sizes.

[0045] As Figure 21 to Figure 23As shown, the tray positioning mechanism 03c comprises a third fixed plate 43c, a fourth fixed plate 45c connected with the third fixed plate 43c through a connecting block 44c, a first motor 46c, a disc 47c arranged between the third fixed plate 43c and the fourth fixed plate 45c, and a tray positioning assembly slidingly arranged with the disc 47c. The two ends of the fourth fixed plate 45c are respectively connected with third limiting protrusions 48c fixed on the jacking mechanism 05c. The tray positioning assembly comprises a second sliding rail 49c connected with the third fixed plate 43c, two second sliding blocks 50c slidingly connected with the second sliding rail 49c, and positioning rods 51c connected with the second sliding blocks 50c and protruding out of the first guide slot 35c to be arranged with the tray jig. Two positioning rods 51c are arranged on each second sliding block 50c. The two sides of the third fixed plate 43c are provided with first grooves 431c matched with the positioning rods 51c. The disc 47c is provided with two first sliding grooves 120c symmetrically arranged about the center of the disc 47c and spirally arranged outward from the center of the disc 47c. As shown in Figure 24 As shown, the first sliding groove 120c is shown in the direction B of the first pulley movement, and the other first sliding groove 120c is shown in the direction C of the first pulley movement. The bottom of the second sliding block 50c is provided with a first pulley slidingly connected with the first sliding groove. The output end of the first motor 46c fixed on the fourth fixed plate 45c is fixedly connected with a second connecting block fixed on the bottom of the disc 47c after penetrating through the fourth fixed plate 45c. In this way, when the trays are stacked on the tray jig, the disc 47c can be rotated by the first motor 46c. Since the first sliding groove 120c on the disc 47c is spirally arranged outward, the first pulley slidingly arranged with the first sliding groove 120c drives the two second sliding blocks 50c to slide along the second sliding rail 49c, and then drives the positioning rods 51c on the two second sliding blocks 50c to relatively move along the diagonal line of the tray jig in the first guide slot 35c, so as to position the trays stacked on the tray jig, and ensure that the trays stacked on the tray jig are placed neatly and prevent the stacked trays from being deviated.

[0046] As shown in Figure 21 to Figure 23 The jacking mechanism 05c comprises a base 53c connected with the rack through a connecting column 52c and a third cylinder 54c arranged on the base 53c. The output end of the third cylinder 54c is fixedly connected with a third jack 55c penetrating through the base 53c and abutting against the bottom plate 30c. The base 53c is provided with a first guide hole matched with a first guide column 56c. The end of the first guide column 56c is provided with a fourth limiting protrusion 57c. In this way, the third jack 55c can be driven by the third cylinder 54c to jack up the bottom plate 30c, and then drive the support body 31c connected with the bottom plate 30c and the tray jig to rise, so as to drive the trays positioned by the tray positioning assembly to rise to the expected height, so as to ensure that the clamped cover plate is accurately placed on the tray.

[0047] As Figure 2 shown, the pick-and-place material detection device a5 includes a detection assembly 13a, a second carrying assembly 14a, and a pick-and-place material area 15a.

[0048] As Figure 2 and Figure 26 shown, the detection assembly 13a includes a conveying base 131a, a conveying mechanism, and a detection device, the conveying base 131a is arranged on the rack a1, the conveying mechanism includes detection longitudinal movement assemblies 1311a, in this embodiment, three detection longitudinal movement assemblies 1311a are arranged, the detection longitudinal movement assemblies 1311a are provided with detection tray receiving assemblies 1312a, the detection longitudinal movement assemblies 1311a are existing screw rod and nut movement structures, and the detection tray receiving assemblies 1312a are used to place the cover plate clamping mechanism a6 to clamp the cover plate and the tray full of semiconductor devices from the first receiving assembly.

[0049] The detection device includes a detection frame 132a, the detection frame 132a is provided with a detection two-dimensional module 1321a, and the lower end of the detection two-dimensional module 1321a is provided with a front detection camera, the detection two-dimensional module 1321a is used to drive the camera to move along the X-axis and Z-axis directions, and the front detection of the semiconductor device is specifically obtained by the front detection camera. The appearance of the semiconductor device is detected, and the front picture of the semiconductor device is compared with the front picture of the preset semiconductor device, if the similarity is within the preset range, it is determined that the semiconductor device is OK, otherwise it is NG, and the detection two-dimensional module 1321a is a structure for moving along the X-axis and Z-axis directions through a driving motor and a sliding rail.

[0050] As Figure 2 shown, the second carrying assembly 14a includes a second carrying three-dimensional module, the second carrying three-dimensional module is provided with a clamping hand device, the clamping hand device includes a second clamping jaw and a semiconductor device suction cup, and the second carrying three-dimensional module has the same structure as the first carrying three-dimensional module.

[0051] As Figure 1 and Figure 2 shown, more than one pick-and-place material area 15a is arranged at the output end of the conveying mechanism, in this embodiment, three groups of pick-and-place material areas 15a are arranged.

[0052] The second carrying three-dimensional module drives the second gripper and the semiconductor device suction cup to move along the X-axis, Y-axis and Z-axis directions. After the front detection camera detects the front of the semiconductor device to determine OK products (i.e. qualified semiconductor devices) and NG products (i.e. unqualified semiconductor devices), an empty tray is placed as an NG tray and an OK tray in the picking and replenishing area 15a. The second carrying assembly picks up the unqualified semiconductor devices to the NG tray in the picking and replenishing area, and then the second carrying assembly adsorbs the qualified semiconductor devices on the OK tray in the picking and replenishing area to the tray for preliminary detection to replenish the tray. After the tray is replenished, the full tray is placed on the detection tray receiving assembly 1312a and is conveyed to the detection device below for re-inspection. If the re-inspection is successful, the full tray is conveyed to the next process by the second carrying assembly. If the re-inspection fails, a qualified product is picked up from the picking and replenishing area to replenish the tray until it is qualified.

[0053] As shown in Figure 1 The picking and replenishing area 15a is provided with a stacking area 151a on one side. The stacking area 151a is a stacking station. In the stacking process, an electrostatic film is placed between adjacent trays, and then a cover plate is placed on the uppermost tray. Then, the tray is banded, labeled and unloaded.

[0054] As shown in Figure 1 to Figure 26 An automatic semiconductor device detection and sorting method includes the following specific steps:

[0055] S1 The first taking and placing assembly b11 moves. The first taking and placing moving mechanism b111 drives the first taking and placing mechanism b112 to move towards the blue film storage area. The first taking and placing mechanism b112 clamps and takes out the blue film needed to be taken out from the blue film storage area. The first taking and placing moving mechanism b111 drives the taking and placing assembly b1 clamping the blue film to move towards the buffer assembly b3 in the opposite direction. The buffer gripper mechanism b32 clamps the blue film. The first taking and placing mechanism b112 releases the blue film. The second taking and placing mechanism clamps the other side of the blue film, and the buffer gripper mechanism b32 releases the clamping of the blue film. The second taking and placing moving mechanism b121 and the second taking and placing mechanism insert the blue film into the sorting stage a3.

[0056] In the process of rotating the suction nozzle assembly c11 driven by the S2 sorting turntable c1, the suction position of the conductor device b403 on the sorting stage is aligned by the curved arm pressing mechanism c22, the suction nozzle assembly c11 presses and suctions the semiconductor device b403, and at the same time the sorting turntable c1 starts to rotate in the first rotating direction. When the suctioned semiconductor device b403 passes directly above the laser detection module c41, the bottom surface of the suctioned semiconductor device is detected, and the optimal focus adjustment value is determined according to the optimal distance value; when passing directly above the infrared detection module c42, the inside of the bottom surface of the semiconductor device is detected under the optimal focus adjustment value, forming the internal shape picture of the semiconductor device; when passing directly above the visible light detection module c43, the outside of the bottom surface of the semiconductor device is detected under the optimal focus adjustment value, forming the external shape picture of the semiconductor device; when passing through the first side detection module c44, the two opposite side surfaces of the semiconductor device are detected by rotating through the reserved gap between the first prism block c441, forming the external shape pictures of the two opposite side surfaces of the semiconductor device; when passing through the second side detection module c45, the two other opposite side surfaces of the semiconductor device are detected by rotating through the reserved space between the second prism block c451, forming the external shape pictures of the two other opposite side surfaces of the semiconductor device, to complete the detection of the bottom surface and four surfaces of the semiconductor device.

[0057] S3 The tray in the tray buffer area a72 is grabbed by the first carrying assembly 02c and moved to the first material receiving assembly 11a, and then moved to the upper side of the jig storage area a71 by the first clamping mechanism, and the jig in the jig storage area a71 is clamped to the tray to receive the semiconductor devices on the sorting turntable c1 after detection. When the tray is not full, the tray with insufficient semiconductor devices is grabbed and placed in the half-tray buffer area a70, and when the suction nozzle assembly of the sorting turntable next time suctions qualified semiconductor devices, the tray with insufficient semiconductor devices is grabbed from the half-tray buffer area a70 and placed on the first material receiving assembly for replenishment until the tray is full. When the tray is full, the first clamping mechanism is moved to the upper side of the cover plate placement area, the cover plate is clamped and placed on the tray, and the cover plate and the full tray are clamped and transported to the detection assembly;

[0058] S4, by detecting the conveying mechanism of the assembly 13a, transports the tray loaded with semiconductor devices, and at the same time, uses the front detection camera to take pictures of the semiconductor devices to form images; if there are unqualified semiconductor devices in the tray, the second conveying assembly 14a is used to pick up the unqualified semiconductor devices into the pick-up area 15a, and the qualified semiconductor devices are picked up from the pick-up area 15a and filled into the corresponding position of the tray, then the tray after the preliminary detection and filling is conveyed to the position below the front detection camera for re-inspection, and after the re-inspection, the second conveying assembly 14a is used to convey the qualified full tray to the next workbench for the process of pasting isolation paper, bundling and sealing, and labeling, and after the completion, the tray is unloaded; in the stacking station, the tray loaded with semiconductor devices, the static film are placed from bottom to top at intervals, and then the cover plate is placed on the uppermost tray loaded with semiconductor devices, and after the stacking, the processes of bundling, sealing, labeling and unloading are sequentially performed, and if there are unqualified full trays after the processes, the second conveying assembly is used to pick up the qualified semiconductor devices from the pick-up area again for re-filling, and then the re-inspection is performed again until the qualified re-inspection is obtained.

Claims

1. An automated semiconductor device inspection and sorting machine, comprising a frame, a clamping and feeding device, and a sorting device, characterized in that: It also includes a flying camera detection device, a material picking and replenishing detection device, a buffer zone located between the flying camera detection device and the material picking and replenishing detection device, and a material picking and replenishing area located on one side of the material picking and replenishing detection device; the clamping and feeding device includes a picking and placing module, a moving module, and a buffer module arranged opposite to the moving module. The moving module drives the picking and placing module to move alternately between the moving module and the buffer module to clamp and convey the blue film to the sorting device. The picking and placing module includes a picking and placing seat, at least one first picking and placing component, and at least one second picking and placing component. The first picking and placing component includes a first picking and placing moving mechanism and a first picking and placing mechanism. The second picking and placing component includes a second picking and placing moving mechanism and a second picking and placing mechanism. The flying camera detection device includes a sorting turntable, suction nozzle assemblies spaced apart on the sorting turntable, a vision detection module, a side detection module, and a receiving module positioned opposite each other on both sides below the sorting turntable. The sorting turntable is also equipped with a top rod pressing mechanism and a curved arm pressing mechanism. The sorting turntable adsorbs semiconductor devices from the blue film on the sorting platform. The vision detection module detects the bottom surface of the semiconductor devices, and the side detection module detects the four sides of the semiconductor devices. The vision detection module includes a laser detection module, an infrared detection module, and a visible light detection module. The material buffer zone is provided with a jig storage area, a cover plate placement area and a material tray buffer area. The material buffer zone also includes a half-tray buffer area. The material tray buffer area is located between the cover plate placement area and the half-tray buffer area. The first conveying component grabs the material tray from the material tray buffer area and the cover plate from the cover plate placement area and places them on the first receiving component and the material tray respectively. When the material tray is full, the cover plate and the material tray are moved together to the material picking and replenishment detection device. The material picking and replenishing detection device includes a detection component, a second conveying component, and a material picking and replenishing area. The detection component includes a conveying base, a conveying mechanism, and a detection device. The detection device includes a detection frame with a two-dimensional detection module on it. A front detection camera is installed at the lower end of the two-dimensional detection module. After the material tray is conveyed to the detection component by the first conveying component, the semiconductor devices in the material tray are inspected from the top surface by the detection component. The second conveying component picks up the unqualified semiconductor devices and moves them to the material picking and replenishing area. Then, qualified semiconductor devices are picked up from the material picking and replenishing area and added to the material tray to achieve a full tray. After re-inspection, the material tray is conveyed to the subsequent process by the second conveying component.

2. The automated semiconductor device inspection and sorting machine according to claim 1, characterized in that: The first receiving component transports the semiconductor devices from the nozzle assembly to the tray. Simultaneously, when the tray on the first receiving component is not full of semiconductor devices, the tray is picked up and placed in the half-tray buffer area for buffering. When the semiconductor devices on the flying detection device are qualified products, the tray that is not full of semiconductor devices in the half-tray buffer area is placed back onto the first receiving component for receiving until the tray is full. When the tray is full of semiconductor devices, a cover plate of the same size as the tray is picked up from the cover plate placement area and placed on the tray full of semiconductor devices before being sent to the picking and replenishing detection device.

3. The automated semiconductor device inspection and sorting machine according to claim 1, characterized in that: The first pick-and-place moving mechanism includes a first pick-and-place motor, a first pick-and-place driving wheel, a first pick-and-place driven wheel, and a first pick-and-place belt. The first pick-and-place motor is mounted on a pick-and-place base. The first pick-and-place driving wheel is mounted on one end of the pick-and-place base via a first rotating shaft and a bearing. The first pick-and-place driving wheel rotates together with the first rotating shaft. The output shaft of the first pick-and-place motor is connected to the first rotating shaft. The first pick-and-place driven wheel is mounted on the other end of the pick-and-place base via a second rotating shaft and a bearing. The first pick-and-place driven wheel rotates with the second rotating shaft. The first pick-and-place belt is fitted between the first pick-and-place driving wheel and the first pick-and-place driven wheel. A first linear guide rail is mounted on the pick-and-place base, and a first slider is slidably arranged on the first linear guide rail.

4. The automated semiconductor device inspection and sorting machine according to claim 3, characterized in that: The buffer module includes a buffer bracket and a buffer gripper mechanism mounted on the buffer bracket. The gripping direction of the buffer gripper mechanism is oriented towards the pick-and-place module. A third linear guide rail is mounted on the buffer bracket, and a third slider is slidably mounted on the third linear guide rail. A transverse drive mechanism is provided between the buffer bracket and the buffer gripper mechanism. The buffer gripper mechanism includes a buffer support base plate, buffer support fingers, a buffer gripper base, a buffer limit plate, a buffer gripper sensor, a buffer gripper fixing plate, and a buffer clamping drive. One end of the buffer gripper fixing plate is fixed to the third slider, the buffer support base plate is fixed to the buffer gripper fixing plate, the buffer gripper base is fixed to the buffer support base plate by bolts, the buffer clamping drive is mounted on the buffer base, and the buffer support fingers are mounted on the output shaft of the buffer clamping drive.

5. The automated semiconductor device inspection and sorting machine according to claim 1, characterized in that: The push rod pressing mechanism includes a first reinforcing rib, a first plate, a push rod linear guide rail, a first fixed seat, a first cam mechanism, a first compression spring, a first push rod, and a first drive motor. One end of the first reinforcing rib is fixedly connected to the sorting turntable, and the other end of the first reinforcing rib is connected to one side of the first plate. The two sides of the other side of the first plate are respectively provided with push rod linear guide rails. The two sides of one side of the first fixed seat are connected to the sliders on the push rod linear guide rails by fasteners. The first cam mechanism is located between the first fixed seat and the first plate. The first push rod is located at the lower end of the first plate. The first compression spring is symmetrically located between the first cam mechanism and the first push rod. The first drive motor is fixed on the first plate, and the output end of the first drive motor is connected to the first cam mechanism. A first adjusting plate is provided on the first plate, and a first compression spring is provided on the first adjusting plate. The other end of the first compression spring is connected to the other end of the first push rod. The crank arm pressing mechanism includes a second reinforcing rib, a second plate, a second linear guide rail, a second fixed seat, a second cam mechanism, a second compression spring, a second drive motor, a second push rod, and a crank arm assembly. The second reinforcing rib is fixedly connected to the sorting turntable and the second plate. The second plate has two second linear guide rails on its other side. The two sides of the second fixed seat are connected to sliders on the second linear guide rails by fasteners. The sliders slide on the second linear guide rails. The second cam mechanism is located between the second fixed seat and the second plate. The second push rod is located at the lower end of the second plate. The second compression spring is symmetrically located between the second cam mechanism and the second push rod. The crank arm assembly is located at the bottom end of the second plate.

6. The automated semiconductor device inspection and sorting machine according to claim 1, characterized in that: It also includes a cover plate clamping mechanism, which includes a first conveying assembly with a connecting seat, a first clamping mechanism fixed to the bottom of the connecting seat, a cover plate fixture set at the lower end of the first clamping mechanism, and a clamping assembly set on the cover plate fixture. The cover plate fixture is provided with a positioning post. The clamping assembly includes a clamping cylinder, a snap-fit ​​component fixedly connected to the output end of the clamping cylinder, and a first sensor that is inclined to the moving direction of the snap-fit ​​component and set on the opposite side of the snap-fit ​​component. The first sensor is used to detect whether a positioning post passes through the first through hole. The snap-fit ​​component is provided with a first bayonet that matches the positioning post. The opening direction of the first bayonet is on the same horizontal straight line as the moving direction of the snap-fit ​​component.

7. The automated semiconductor device inspection and sorting machine according to claim 1, characterized in that: It also includes a tray buffering mechanism disposed on the tray buffer area. The tray buffering mechanism includes a support body fixed to the base plate, a tray positioning mechanism located within the support body, and a lifting mechanism slidably connected to the base plate. The tray positioning mechanism includes a third fixed plate, a fourth fixed plate connected to the third fixed plate via a connecting block, a first motor, a disc disposed between the third and fourth fixed plates, and a tray positioning assembly slidably disposed with the disc. The two ends of the fourth fixed plate are respectively connected to a third limiting protrusion fixed to the lifting mechanism. A tray fixture is fixed to the top of the support body. The tray fixture includes a tray fixture body and a section about the tray fixture body. The first limiting part is symmetrically arranged diagonally. The material tray fixture body has a first protrusion on both sides along the diagonal direction. A first guide groove is formed between the first protrusion and the first limiting part. The material tray positioning assembly includes a second slide rail connected to a third fixed plate, two second sliders slidably connected to the second slide rail, and a positioning rod connected to the second slider and protruding from the material tray fixture after passing through the first guide groove. Two positioning rods are provided on each second slider. The third fixed plate has a first slot on both sides that matches the positioning rod. The disc has two first slide grooves that are symmetrical about the center of the disc and spirally unfolded from the center of the disc outward.

8. An automated semiconductor device detection and sorting method, characterized in that: The automated semiconductor device inspection and sorting machine according to any one of claims 1-7 achieves the following steps: S1 uses the moving module to drive the pick-and-place module to pick up one side of the blue film and remove it. After the pick-and-place module moves in the opposite direction, it moves towards the buffer module and uses the buffer module to hold the blue film. After the pick-and-place module picks up the other side of the blue film again, it moves to the sorting platform. The S2 sorting turntable drives the suction nozzle assembly to rotate and adsorb the semiconductor devices on the blue film on the sorting platform. Then, the bottom and four sides of the semiconductor devices are inspected by the vision inspection module and the side inspection module, respectively. S3 uses the first conveying component to grab the material tray in the material tray buffer area and move it to the first receiving component. Then, it uses the first clamping mechanism to move it above the fixture storage area and clamp the fixture in the fixture storage area onto the material tray to receive the semiconductor devices on the sorting turntable after testing. When the tray is full, the first clamping mechanism moves to the cover plate placement area, clamps the cover plate to cover the material tray, and clamps the cover plate and the full material tray together and transports them to the testing component. S4 conveys the tray loaded with semiconductor devices through the conveying mechanism of the detection component, and simultaneously uses a front-facing inspection camera to capture images of the semiconductor devices. If there are unqualified semiconductor devices in the tray, the second handling component picks up the unqualified semiconductor devices and moves them to the picking and replenishing area. Then, qualified semiconductor devices are picked up from the picking and replenishing area and placed in the corresponding positions on the tray. After the initial inspection and replenishment, the tray is conveyed by the conveying mechanism to the area below the front-facing inspection camera for re-inspection. After the re-inspection, the qualified full tray is conveyed to the next process by the second handling component.

9. The automated semiconductor device detection and sorting method according to claim 8, characterized in that: Step S1 further includes: moving the first pick-and-place component by the moving module, moving the first pick-and-place mechanism towards the storage area by the first pick-and-place moving mechanism, clamping and removing the blue film to be removed from the storage area by the first pick-and-place mechanism, moving the first pick-and-place mechanism in the opposite direction by the first pick-and-place moving mechanism, moving the pick-and-place module holding the blue film towards the buffer module by the moving module, clamping the blue film by the buffer gripper mechanism, releasing the blue film by the first pick-and-place mechanism, clamping the other side of the blue film by the second pick-and-place mechanism, releasing the clamping of the blue film by the buffer gripper mechanism, and inserting the blue film onto the sorting platform by the second pick-and-place moving mechanism and the second pick-and-place mechanism.

10. The automated semiconductor device detection and sorting method according to claim 8, characterized in that: Step S2 also includes: The curved arm pressing mechanism aligns with the adsorption position of the semiconductor device on the sorting device. The suction nozzle assembly presses down to adsorb the semiconductor device, and at the same time, the sorting turntable starts to rotate in the first rotation direction. When the adsorbed semiconductor device passes directly above the laser detection module in the vision inspection module, the bottom surface of the adsorbed semiconductor device is photographed and detected, and the optimal focal length adjustment value is determined according to the optimal distance value. When it passes directly above the visible light detection module in the vision inspection module, the bottom surface of the semiconductor device is photographed and detected at the optimal focal length adjustment value, forming an image of the external shape of the semiconductor device. Step S3 also includes: when the tray is not full, grabbing the trays of semiconductor devices that are not full on the first receiving component and moving them to the half-tray buffer area.

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