Automatic positioning device based on semiconductor crystal ingot rotation

By employing a positioning method that combines laser displacement sensors and proximity switches with shock absorption and fixing mechanisms, the problems of low positioning accuracy and easy damage to semiconductor ingots have been solved. This method achieves micron-level precise positioning and stable clamping, improving positioning efficiency and consistency.

CN121374884AActive Publication Date: 2026-01-23WEISHI ADVANCED INTELLIGENT TECH (SUZHOU) CO LTD
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Patent Information

Application Number
CN202511955226.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-23
Publication Date
2026-01-23
Estimated Expiration
2045-12-23

AI Technical Summary

Technical Problem

Existing semiconductor ingot positioning devices have low positioning accuracy and are easily damaged. They lack a real-time detection and feedback mechanism and cannot achieve micron-level precise positioning or prevent the ingot from shifting during rotation or sliding.

Method used

A laser displacement sensor is used to detect the radial runout of the crystal ingot side. Combined with a proximity switch, the second platform is accurately positioned at an angle. A shock absorption mechanism reduces vibration interference. The platform position and angle are dynamically adjusted by a controller. Combined with the design of a beveled surface fixing mechanism and locking components, the crystal ingot is prevented from shifting. An elastic buffer layer is used to improve clamping stability.

Benefits of technology

It achieves micron-level positioning accuracy, reduces platform vibration interference, improves positioning efficiency and consistency, avoids ingot damage, and enhances the automated control of the positioning device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the invention provides an automatic positioning device based on semiconductor crystal ingot rotation, which relates to the technical field of semiconductor crystal ingot processing equipment and comprises a rack, a first linear guide rail and a second linear guide rail are arranged on two sides of the rack, and a first platform is slidably arranged on the first linear guide rail and the second linear guide rail. A first driving part is arranged on the first platform, a second platform is rotationally arranged on the first platform, a damping mechanism is arranged between the second platform and the first platform, a second driving part is further arranged on the first platform, a fixing mechanism and a bracket are arranged on the second platform, the bracket is arranged in the middle of the second platform, and the fixing mechanism comprises a clamping assembly and a locking assembly. A laser displacement sensor and three first proximity switches are arranged at the rotating position, close to the second platform, of the first platform, and a second proximity switch is arranged in the middle of the bracket. The method has the effects of improving the positioning precision and reducing the damage rate of the crystal ingot.
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Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductor crystal ingot processing equipment, and particularly relates to a semiconductor crystal ingot rotary automatic positioning device. BACKGROUND

[0002] In the processing of semiconductor crystal ingots (such as monocrystalline silicon ingots, sapphire crystal ingots and the like), the crystal ingots need to be accurately positioned to ensure the accuracy of subsequent cutting, polishing and the like. The existing crystal ingot positioning devices mostly adopt pure mechanical structures, and positioning is achieved through guide rail sliding, rotating platforms and cylinder clamping, but the following defects exist: firstly, the positioning accuracy depends on the mechanical fitting tolerance, and it is difficult to achieve micron-level accurate positioning; secondly, there is a lack of real-time detection feedback mechanism, and the offset of the crystal ingot in the rotating or sliding process cannot be dynamically corrected; thirdly, the crystal ingot bottom support is easily damaged due to rigid contact when clamped, and platform vibration easily causes positioning drift.

[0003] In view of the above problems, the semiconductor crystal ingot automatic positioning device needs to solve the problems of low positioning accuracy and easy damage of the crystal ingot. SUMMARY

[0004] In order to solve the problems of low positioning accuracy and easy damage of the crystal ingot of the existing semiconductor crystal ingot positioning device, the application provides a semiconductor crystal ingot rotary automatic positioning device.

[0005] The semiconductor crystal ingot rotary automatic positioning device provided by the application adopts the following technical scheme: A semiconductor crystal ingot rotary automatic positioning device, comprising a rack, first linear guides and second linear guides are arranged in parallel along the vertical direction on both sides of the rack, a first platform is slidably arranged on the first linear guides and the second linear guides, a first driving member for driving the first platform to slide on the first linear guides and the second linear guides is arranged on the first platform, a second platform is rotatably arranged on the first platform, a second driving member for driving the second platform to rotate is further arranged on the first platform, a damping mechanism is arranged between the second platform and the first platform, a fixing mechanism for fixing a crystal ingot bottom support and a bracket for placing the crystal ingot bottom support are arranged on the second platform, the bracket is arranged in the middle of the second platform, the fixing mechanism comprises a clamping assembly and a locking assembly, a laser displacement sensor and three first proximity switches are arranged on the first platform close to the rotating position of the second platform, an L-shaped support for realizing angle positioning is arranged on the second platform and matched with the three first proximity switches, a second proximity switch is arranged in the middle of the bracket, a controller is further arranged on the rack, and the controller is electrically connected with the first proximity switches, the laser displacement sensor, the second proximity switch, the first driving member and the second driving member.

[0006] Optionally, the clamping assembly comprises a third linear guide rail and a fourth linear guide rail arranged in parallel at the bottom of the second platform, and the first support part and the second support part are arranged to slide on the third linear guide rail and the fourth linear guide rail, the first support part and the second support part are respectively located on both sides of the bracket, the second platform is provided with cavities for sliding of the first support part and the second support part, the first support part and the second support part extend from the bottom of the second platform to the top of the second platform through the cavities, and the first cylinder and the second cylinder are arranged on the second platform and located on the sides of the first support part and the second support part respectively, and the first cylinder and the second cylinder are fixedly connected with the first support part and the second support part respectively.

[0007] Optionally, the locking assembly comprises a third cylinder and a fourth cylinder arranged at the bottom of the second platform, the third cylinder and the fourth cylinder are arranged vertically upward, and the first support part and the second support part are provided with square holes at the top of the second platform, so that the piston rods of the third cylinder and the fourth cylinder are lifted into the corresponding square holes to lock the first support part and the second support part.

[0008] Optionally, the piston rod head of the third cylinder and the fourth cylinder is provided with a first beveled surface, the first beveled surface faces the bracket, the square hole is smaller than the maximum diameter of the piston rod of the third cylinder and the fourth cylinder, the square hole is provided with a square hole beveled surface parallel to the first beveled surface at the square hole facing the first beveled surface, the lower part of the ingot bottom support is provided with a second beveled surface, and the first support part and the second support part are both provided with a support part beveled surface parallel to the second beveled surface at the part facing the bracket.

[0009] Optionally, the first driving member comprises a first motor, a rack is arranged on one side of the frame, and a gear is arranged on the output end of the first motor and engaged with the rack.

[0010] Optionally, the second driving member comprises a second motor, and the second motor is connected with the second platform.

[0011] Optionally, the support part beveled surface is provided with an elastic buffer layer.

[0012] Optionally, the damping mechanism comprises an annular damping pad and uniformly distributed damping springs, the annular damping pad is sleeved outside the output shaft of the second driving member, and the damping springs are arranged at the edge position of the bottom of the second platform.

[0013] In summary, the present application has at least one of the following beneficial technical effects: The radial runout amount of the crystal ingot is detected by a laser displacement sensor, the second platform rotation angle is accurately positioned by three first proximity switches, the damping mechanism reduces vibration interference in the platform rotation and sliding process, the positioning accuracy is further improved, the controller dynamically adjusts the first platform position and the second platform rotation angle, and micron-level positioning is realized; the inclined surface cooperation and locking assembly design of the fixing mechanism avoid the crystal ingot bottom support from deviating and separating when rotating, and the elastic buffer layer improves the clamping stability; the full-closed-loop automatic control reduces manual intervention and improves positioning efficiency and consistency. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a schematic diagram of the overall structure of the present application; Figure 2 is a schematic diagram of the first platform and the second platform structure of the present application; Figure 3 is a schematic diagram of the second platform structure of the present application; Figure 4 is a schematic diagram of the second platform bottom structure of the present application; Figure 5 is a schematic diagram of the second platform part section of the present application.

[0015] BRIEF DESCRIPTION OF DRAWINGS: 1, rack; 11, first linear guide rail; 12, second linear guide rail; 2, first platform; 21, first motor; 22, rack; 23, gear; 24, second motor; 3, second platform; 31, fixing mechanism; 32, bracket; 331, third linear guide rail; 332, fourth linear guide rail; 341, first support part; 342, second support part; 343, cavity; 351, first air cylinder; 352, second air cylinder; 353, third air cylinder; 354, fourth air cylinder; 355, piston rod; 356, first inclined surface; 357, square hole; 4, crystal ingot; 41, crystal ingot bottom support; 411, second inclined surface; 5, laser displacement sensor; 61, first proximity switch; 62, second proximity switch. DETAILED DESCRIPTION

[0016] The terminology used in the following description merely for the purpose of describing particular embodiments and is not intended to limit the application. As used in this description and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated items. The term "or" as used herein refers to any or all possible combinations of one or more of the associated items, i.e., items connected by "or" are to be taken separately and cumulatively, unless otherwise indicated by context.

[0017] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" or "in other embodiments" or "in still other embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment, unless otherwise indicated by context. The term "comprising," "including," "containing," and "having" and their variations, as used herein, mean "including but not limited to," unless otherwise indicated by context.

[0018] The following detailed description of the application is presented in connection with Figures 1-5 The application is described in further detail.

[0019] The embodiments of the present application disclose a kind of automatic positioning device based on semiconductor crystal ingot rotation, refer to Figure 1 and Figure 2, including rack 1, first linear guide rail 11 and second linear guide rail 12 are vertically parallel on both sides of rack 1, first platform 2 is slidably arranged on first linear guide rail 11 and second linear guide rail 12, first platform 2 is provided with first driving part for driving first platform to slide on first linear guide rail 11 and second linear guide rail, first driving part includes first motor 21, rack 1 is provided with rack 22 on one side, first motor 21 is provided with gear 23 at output end, gear 23 engages rack 22, vertical sliding of first platform 2 along guide rail is realized through gear and rack transmission, second platform 3 is rotatably arranged on first platform 2, second driving part for driving second platform to rotate is further arranged on first platform 2, second driving part includes second motor 24, second motor 24 is connected with second platform 3, drives second platform 3 to rotate around central axis, second platform 3 is provided with fixing mechanism 31 for fixing ingot bottom support 41 and bracket 32 for placing ingot bottom support 41, ingot 4 is arranged on ingot bottom support 41, laser displacement sensor 5 and three first proximity switches 61 are mounted on first platform 2 close to rotating position of second platform 3, L-shaped supports are uniformly distributed in circle at corresponding position of bottom of second platform 3, when second platform 3 rotates, L-shaped supports trigger different first proximity switches 61, realize accurate positioning of rotating angle, such as 0°, 120°, 240° positioning, laser displacement sensor 5 is towards side surface of ingot 4, for real-time detection of radial runout of ingot 4, damping mechanism is arranged between second platform 3 and second driving part, damping mechanism includes annular damping pad and uniformly distributed damping springs, annular damping pad is sleeved outside output shaft of second driving part, damping springs are arranged at edge position of bottom of second platform, damping mechanism reduces vibration interference in rotating and sliding process of second platform.

[0020] With reference to Figure 3 and Figure 4, the bracket 32 is arranged in the middle of the second platform 3, and the top center of the bracket 32 is embedded with a second proximity switch 62 for detecting whether the crystal ingot bottom support 41 is placed in place. The fixing mechanism 31 comprises a third linear guide rail 331 and a fourth linear guide rail 332 arranged in parallel at the bottom of the second platform 3, and a first supporting part 341 and a second supporting part 342 are slidably arranged on the third linear guide rail 331 and the fourth linear guide rail 332. The first supporting part 341 and the second supporting part 342 are respectively located on both sides of the bracket 32, and a cavity 343 is opened on the second platform 3 to facilitate the sliding of the first supporting part 341 and the second supporting part 342. The first supporting part 341 and the second supporting part 342 extend from the bottom of the second platform 3 to the top of the second platform 3 through the cavity 343. The second platform 3 is provided with a first air cylinder 351 and a second air cylinder 352, and the first air cylinder 351 and the second air cylinder 352 are respectively located on one side of the first supporting part 341 and the second supporting part 342. The first air cylinder 351 and the second air cylinder 352 are respectively fixedly connected with the first supporting part 341 and the second supporting part 342, and are used to respectively push the first supporting part 341 and the second supporting part 342 to move towards and away from the bracket 32. The bottom of the second platform is further provided with a third air cylinder 353 and a fourth air cylinder 354, and the third air cylinder 353 and the fourth air cylinder 354 are arranged vertically upward. The first supporting part 341 and the second supporting part 342 are provided with square holes 357 on the top part of the second platform 3, so that the piston rods of the third air cylinder 353 and the fourth air cylinder 354 can be lifted into the corresponding square holes 357 to lock the first supporting part 341 and the second supporting part 342.

[0021] Referring to Figure 5 The head of the piston rod 355 of the third air cylinder 353 and the fourth air cylinder 354 is provided with a first bevel 356, and the first bevel 356 faces the bracket 32. The square hole 357 is smaller than the maximum diameter of the piston rod 355 of the third air cylinder 353 and the fourth air cylinder 354, and the square hole 357 is provided with a square hole bevel parallel to the first bevel 356. When the crystal ingot bottom support 41 is clamped, the piston rod 355 is lifted, the first bevel 356 is tightly matched with the square hole bevel, and the locking of the first supporting part 341 and the second supporting part 342 is realized. The lower part of the crystal ingot bottom support 41 is provided with a second bevel 411, and the first supporting part 341 and the second supporting part 342 are provided with a supporting part bevel parallel to the second bevel 411, which further improves the clamping stability and prevents the crystal ingot bottom support 41 from rotating and deviating. An elastic buffer layer is arranged on the supporting part bevel, and the elastic buffer layer can be silica gel. The elastic buffer layer can avoid damage caused by rigid contact between the metal supporting part and the crystal ingot bottom support 41.

[0022] The device further comprises a controller, which is electrically connected with the first proximity switch 61, the laser displacement sensor 5, the second proximity switch 62, the first motor 21 and the second motor 24 respectively. In operation, the ingot bottom support 41 is placed on the bracket 32, and the first proximity switch 8 feeds back the signal to the controller after detection; the controller starts the first cylinder 351 and the second cylinder 352, and pushes the first supporting part 341 and the second supporting part 342 to clamp the ingot bottom support 41, then the third cylinder 353 and the fourth cylinder 354 act, and the first supporting part 341 and the second supporting part 342 are locked; the laser displacement sensor 5 detects the radial runout of the ingot 4, and the second proximity switch 62 positions the rotation angle of the second platform 3; the controller adjusts the first motor 21 and the second motor 24 according to the detection data, so as to realize the accurate positioning of the ingot 4.

[0023] The above are only the preferred embodiments of the present application, and the protection scope of the present application is not limited to the above-mentioned embodiments, but any equivalent modification or change made by those skilled in the art according to the disclosed content of the present application shall be included in the protection scope recorded in the claims.

Claims

1. A kind of based on semiconductor crystal ingot rotation automation positioning device, including rack (1), first linear guide (11) and second linear guide (12) are arranged in parallel along vertical direction on both sides of the rack (1), first platform (2) is slidably arranged on the first linear guide (11) and second linear guide (12), the first platform (2) is equipped with the first drive piece of driving first platform (2) sliding on the first linear guide (11) and second linear guide (12), second platform (3) is rotatably arranged on the first platform (2), the first platform (2) is also equipped with the second drive piece of driving second platform (3) rotation, it is characterized by: The second platform (3) is provided with a damping mechanism between the second driving member, the second platform (3) is provided with a fixing mechanism (31) for fixing the crystal ingot bottom support (41) and a bracket (32) for placing the crystal ingot bottom support (41), the bracket (32) is arranged in the middle of the second platform (3), the fixing mechanism (31) comprises a clamping assembly and a locking assembly, the first platform (2) is provided with a laser displacement sensor (5) and three first proximity switches (61) near the rotating part of the second platform (3), the second platform (3) is provided with an L-shaped support matched with the three first proximity switches (61) for realizing angle positioning, the middle of the bracket (32) is provided with a second proximity switch (62), the rack (1) is further provided with a controller, and the controller is electrically connected with the first proximity switch (61), the laser displacement sensor (5), the second proximity switch (62), the first driving member and the second driving member respectively.

2. A device for automatic positioning of a semiconductor crystal ingot based on its rotation according to claim 1, characterized in that: The clamping assembly comprises a third straight guide rail (331) and a fourth straight guide rail (332) arranged in parallel at the bottom of the second platform (3), the third straight guide rail (331) and the fourth straight guide rail (332) are slidably provided with a first supporting part (341) and a second supporting part (342), the first supporting part (341) and the second supporting part (342) are respectively located on both sides of the bracket (32), the second platform (3) is provided with a cavity (343) for facilitating the sliding of the first supporting part (341) and the second supporting part (342), the first supporting part (341) and the second supporting part (342) extend from the bottom of the second platform (3) to the top of the second platform (3) through the cavity (343), the second platform (3) is provided with a first cylinder (351) and a second cylinder (352), the first cylinder (351) and the second cylinder (352) are respectively located on one side of the first supporting part (341) and the second supporting part (342), and the first cylinder (351) and the second cylinder (352) are respectively fixedly connected with the first supporting part (341) and the second supporting part (342).

3. A device for automatic positioning of a semiconductor crystal ingot based on its rotation according to claim 2, characterized in that: The locking assembly comprises a third cylinder (353) and a fourth cylinder (354) arranged at the bottom of the second platform (3), the third cylinder (353) and the fourth cylinder (354) are arranged vertically upward, the first supporting part (341) and the second supporting part (342) are provided with square holes (357) at the top part of the second platform (3), so that the piston rods (355) of the third cylinder (353) and the fourth cylinder (354) can be lifted into the corresponding square holes (357) to lock the first supporting part (341) and the second supporting part (342).

4. The automatic positioning device based on the rotation of semiconductor ingot according to claim 3, wherein: The piston rod (355) head of the third cylinder (353) and the fourth cylinder (354) is provided with a first bevel (356) facing the bracket (32), the square hole (357) is smaller than the maximum diameter of the piston rod (355) of the third cylinder (353) and the fourth cylinder (354), the square hole (357) is provided with a square hole bevel parallel to the first bevel (356) at the first bevel (356) facing position, the lower part of the ingot bottom support (41) is provided with a second bevel (411), and the first support part (341) and the second support part (342) are both provided with a support part bevel parallel to the second bevel (411) at the bracket (32) facing position.

5. The automatic positioning device based on the rotation of semiconductor ingot according to claim 1, wherein: The first driving member comprises a first motor (21), and the rack (22) is arranged on one side of the frame (1); the gear (23) is arranged on the output end of the first motor (21); and the gear (23) is engaged with the rack (22).

6. The automated positioning device based on the rotation of a semiconductor ingot according to claim 1, wherein: The second driving member comprises a second motor (24), and the second motor (24) is connected with the second platform (3).

7. The automated positioning device based on the rotation of a semiconductor ingot according to claim 4, wherein: The support part bevel is provided with an elastic buffer layer.

8. The automated positioning device based on the rotation of a semiconductor ingot according to claim 1, wherein: The damping mechanism comprises an annular damping pad and uniformly distributed damping springs, the annular damping pad is sleeved outside the output shaft of the second driving member, and the damping springs are arranged at the edge position of the bottom of the second platform (3).

Citation Information

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