Heat medium heating device

Abstract

The present invention provides a heat medium heating device capable of improving heat dissipation efficiency of an electronic component having heat generating properties. A heat medium heating device (10) is provided with: a circuit board (12); an electronic component (13) disposed on the circuit board; a metal flow path member (22) through which the heat medium (M) flows in a flow path (21) in the interior of the flow path member (22); and a heater (11) that is disposed in the flow path and heats the heat medium, the heat medium heating device (10) being characterized in that a heat sink section (22H) that is connected to the outer surface of the flow path and that has an installation surface for the electronic component is integrally formed with the flow path member.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat medium heating device. BACKGROUND

[0002] As a heat medium heating device used for a vehicle air conditioning device, a device described in Japanese Patent Application Publication No. 2018-133300 (Patent Literature 1) has been known. The heat medium heating device has a case in which a heat medium flows, a PTC heater that heats the heat medium, and a control substrate that controls the PTC heater. The case has a substrate housing portion that houses the control substrate. The control substrate has an electronic component. The publication describes that, for the electronic component, an electronic component having heat generation properties such as an IGBT (Insulated Gate Bipolar Transistor) and an FET (Field Effect Transistor) and an electronic component other than the same can be used.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Publication No. 2018-133300 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] In the above-described structure, the electronic component is arranged in a space inside the substrate housing portion and does not contact members other than the substrate main body of the control substrate. In this case, when an electronic component having heat generation properties is used as the electronic component, heat generated from the electronic component is transferred to air inside the substrate housing portion. In this case, there is a possibility that heat cannot be sufficiently dissipated from the electronic component, and thus the electronic component does not normally function.

[0008] The present application has been achieved based on the above-described circumstances, and an object thereof is to provide a heat medium heating device capable of improving heat dissipation efficiency of an electronic component having heat generation properties.

[0009] SOLUTION TO PROBLEM

[0010] The heat medium heating device of the present application has: a circuit board; an electronic component arranged on the circuit board; a flow path member made of metal, in which a heat medium flows in a flow path inside the flow path member itself; and a heater arranged in the flow path and heating the heat medium, in which a heat sink portion is formed integrally with the flow path member, the heat sink portion is connected to an outer surface of the flow path, and the heat sink portion has a placement surface of the electronic component.

[0011] According to such a structure, heat of the electronic component can be transferred from the heat sink portion to the heat medium inside the flow path, and heat dissipation efficiency of the electronic component can be improved.

[0012] In the heat medium heating device of the present application, the flow path can be cylindrical, and the heat sink portion can be connected to an outer surface of the cylindrical flow path.

[0013] According to such a structure, since the flow path is cylindrical, the heat medium can flow smoothly inside the flow path. Further, since the heat sink portion is connected to the outer surface of the flow path in such a manner as to enter the outer surface, the height (distance) of the heat sink portion from the flow path can be suppressed to downsize the heat medium heating device, and the contact area of the heat sink portion with the flow path can be increased.

[0014] In the heat medium heating device of the present application, the flow path can be cylindrical, and the heat sink portion can be connected to an outer surface of the cylindrical flow path.

[0015] According to such a structure, the bubbles generated in the heat medium by heating of the heater flow along the flow direction, are easily discharged to the outside from the flow path of which the diameter is increased, and the case where the heater is left burning with the bubbles remaining in the flow path can be suppressed.

[0016] In the heat medium heating device of the present application, the heater can have an axial extension, and the heater can have a through-hole along the axial direction. The heat medium introduced from one end side of the through-hole can flow out to the outer surface side of the heater from the other end side of the through-hole, and then be turned back at an inner wall surface of the flow path, and flow along the outer surface of the heater to the opposite side in the axial direction. An angle portion of the inner wall surface of the flow path, which faces the other end of the through-hole, can be curved.

[0017] According to such a structure, when the heat medium is turned back at the inner wall surface of the flow path after flowing out to the outer surface side of the heater from the other end side of the through-hole, the heat medium flows smoothly at the angle portion which is curved, and thus heat dissipation efficiency of the electronic component via the heat medium can be further improved.

[0018] In the heat medium heating device of the present application, the heater can be cylindrical.

[0019] According to such a structure, the heat medium flows smoothly along the outer surface of the heater, and thus heat dissipation efficiency of the electronic component via the heat medium can be further improved.

[0020] Effects of the Invention

[0021] According to the present application, a heat medium heating device capable of improving heat dissipation efficiency of an electronic component having heat generation property can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 This is an exploded perspective view of a heat medium heating device according to an embodiment of the present invention.

[0023] Figure 2 This is a three-dimensional diagram of a heat medium heating device.

[0024] Figure 3 It is along Figure 2 A cross-sectional view along line AA.

[0025] Figure 4 From and Figure 3 A cross-sectional view of the flow path obtained by cutting the paper perpendicular to its surface.

[0026] Explanation of reference numerals in the attached figures

[0027] 10. Heating device for heat medium; 11. Heater; 11H. Through hole; 11e. The other end of the through hole; 12. Circuit board; 13. Electronic component; 21. Flow path; 21e. Corner of the inner wall of the flow path; 22. Flow path component; 22H. Heat sink; M. Heat medium; L. Length direction; AX. Axial direction. Detailed Implementation

[0028] The embodiments of the present invention will be described below.

[0029] Figure 1 This is an exploded perspective view of the heat medium heating device according to an embodiment of the present invention. Figure 2 This is a 3D diagram of a heat medium heating device. Figure 3 It is along Figure 2 A cross-sectional view along line AA.

[0030] Furthermore, this disclosure is not limited to these examples, but is indicated by the claims and is intended to include all modifications within the meaning and scope equivalent to the claims. In the following description, for multiple identical components, sometimes only some components are labeled with reference numerals while the reference numerals for other components are omitted.

[0031] In this specification, the structure of the heat medium heating device 10 is described by setting the positive Z-axis direction as upward, the negative Z-axis direction as downward, the positive X-axis direction as forward, and the positive Y-axis direction as right. However, the actual usage of the heat medium heating device 10 may involve a different configuration.

[0032] The heat medium heating device 10 of this embodiment is a device for heating liquids such as water (an example of a heat medium). The heat medium heating device 10 is installed, for example, in an electric vehicle (EV) for heating the vehicle interior and maintaining the temperature of the battery.

[0033] like Figure 1As shown, the heat medium heating device 10 includes a heater 11, a circuit board 12, and a housing 20 for housing the heater 11 and the circuit board 12.

[0034] The housing 20 has a flow path member 22 and various components 24 to 26 (described later) assembled on the flow path member 22, and a flow path 21 is formed inside the flow path member 22. Furthermore, the heat medium M flows in the flow path 21 and is heated by the heater 11 disposed in the flow path 21.

[0035] In this example, heater 11 is a ceramic heater. Heater 11 includes a cylindrical member 11A and a heating resistor (not shown) embedded inside the cylindrical member 11A.

[0036] The cylindrical component 11A is mainly composed of ceramic materials such as alumina. The heating resistor is made of metals such as tungsten and has a meandering, thin wire shape. The heating resistor heats up by receiving voltage from a power supply device.

[0037] The heater 11 can be manufactured, for example, by sandwiching a metal pattern that serves as a heating resistor between ceramic blanks, winding it around a rod-shaped mold component, and then firing it. The heater 11 has a flange portion 11B that is brazed to the outer peripheral surface of the cylindrical component 11A. The flange portion 11B is plate-shaped and annular. The flange portion 11B is located near the left end of the cylindrical component 11A.

[0038] like Figure 1 As shown, an electronic component 13 for controlling the output of the heater 11 is disposed on one side (lower surface) of the circuit board 12. The electronic component 13 is, for example, a switching element such as a FET or IGBT. The electronic component 13 has the characteristic of easily generating heat, and although the heat generated is less than that of the heater 11, it still generates heat when energized.

[0039] The electronic component 13 includes a main body 13A and a lead portion 13B that is electrically connected to the circuit board 12. The main body 13A is made of resin and has semiconductor components embedded inside. The lead portion 13B is disposed on the side of the main body 13A. Alternatively, the lead portion 13B may be disposed on the upper surface of the main body 13A (the surface opposite to the circuit board 12).

[0040] Although not shown in detail, the circuit board 12 has leads and various wirings that connect to the heater 11. Furthermore, these wirings are electrically connected to an external power source via external connectors C1 and C2. Additionally, external connectors C1 and C2 are mounted on the side of the flow path component 22. Figure 1 (positive X-axis direction).

[0041] like Figure 1 As shown, the housing 20 has a flow path component 22 and various components 24 to 26 assembled on the flow path component 22.

[0042] The flow path member 22 is substantially box-shaped, and integrally has a cylindrical portion 22t (see FIG. 2) that constitutes an outer surface of the flow path 21 and is cylindrical on the lower side. Figure 3 Further, a heater 11 is arranged inside the cylindrical portion 22t, and a gap between the cylindrical portion 22t and the heater 11 forms the flow path 21.

[0043] The front side (left side of the Y axis) of the cylindrical portion 22t is open. Further, a discharge port 22Y that is an end portion of the flow path 21 is integrally formed with the cylindrical portion 22t in a manner that protrudes from one side surface (positive direction of the X axis) of the cylindrical portion 22t. Figure 1 Figure 1

[0044] The flow path member 22 is made of metal, and can be formed by aluminum die casting, for example.

[0045] Further, on the outer surface of the cylindrical portion 22t, a heat sink portion 22H that is flat is integrally connected with the cylindrical portion 22t. The flat surface (upper surface) of the heat sink portion 22H becomes a placement surface of the electronic component 13.

[0046] Further, the circuit board 12 is housed in an internal space of the flow path member 22 on the upper side than the cylindrical portion 22t, and the main body portion 13A of the electronic component 13 (two in this example) mounted to the lower surface of the circuit board 12 is in contact with the flat surface (upper surface) of the heat sink portion 22H.

[0047] In this example, a resin-made holding member 15 that holds the electronic component 13 and a resin-made insulating sheet (not shown) are sandwiched between the main body portion 13A of the electronic component 13 and the heat sink portion 22H. However, as long as the main body portion 13A and the heat sink portion 22H are separated, no member can be sandwiched therebetween, or a gap can exist therebetween.

[0048] Further, a clip 17 that has elasticity is arranged on the upper side of the main body portion 13A, and the main body portion 13A is sandwiched between the clip 17 and the holding member 15.

[0049] Further, the opening of the upper surface of the flow path member 22 in which the circuit board 12 is housed is closed by the lid portion 23 with a frame-shaped sealing member (seal) S1.

[0050] In this example, the lid portion 23 is also made of metal. By making the flow path member 22 and the lid portion that surround the circuit board 12 made of metal, an electromagnetic shielding effect that shields the circuit board 12 from noise from the outside can be obtained.

[0051] Further, the front side (left side of the Y axis) of the cylindrical portion 22t is open. Further, a discharge port 22Y that is an end portion of the flow path 21 is integrally formed with the cylindrical portion 22t in a manner that protrudes from one side surface (positive direction of the X axis) of the cylindrical portion 22t. Figure 1 ​​The opening on the left side of the Y axis is provided with a frame-shaped sealing member (O-ring) S2, a sealing member (O-ring) S3, a flange holder 24, and a sealing member (O-ring) S4 in this order.

[0052] The heater 11 penetrates through these sealing members S2, S3, the flange holder 24, and the sealing member S4, and the face on the right side of the Y axis in the flange portion 11B of the heater 11 is in contact with the sealing member S4.

[0053] Further, on the opposite face of the flange portion 11B, a sealing member (O-ring) S5, a heater base holder 25, a sealing member (O-ring) S6, and a side cover 26 are provided in this order.

[0054] Further, these sealing members S5 and S6 liquid-tightly seal both faces of the heater base holder 25, and the sealing member S5 is in close contact with the base end of the heater 11. In addition, the flange portion 11B of the heater 11 is liquid-tightly sealed by the sealing member S4. Further, the flange portion 11B of the heater 11 and the base of the heater 11 are cantilevered by the flange holder 24 and the heater base holder 25.

[0055] In addition, a temperature sensor 25b is inserted into the heater base holder 25 in a manner of being pressed by the bifurcated portion of the clamp 25a. In addition, the clamp 25a is fixed to the heater base holder 25 by a screw member not shown. A wire harness (not shown) for output extraction is extended from the temperature sensor 25b, and the wire harness is connected to the circuit board 12.

[0056] Likewise, an outlet-side temperature sensor (not shown) is also provided near the circuit board 12 inside the flow path member 22, and the outlet-side temperature sensor is fixed by a clamp 27a having the same shape as the clamp 25a.

[0057] On the other hand, the side cover 26 is formed with an introduction port 26X as one end portion of the flow path 21 in a manner of protruding to the left side of the Y axis, and the sealing member S6 liquid-tightly seals between the side cover 26 (the introduction port 26X) and the heater base holder 25. Thereby, the introduction port 26X communicates with the flow path 21 on the side of the cylindrical portion 22t.

[0058] Further, the opening portion of the flow path member 22 that surrounds the cylindrical portion 22t on the outside is closed by the side cover 26 with the sealing member S2 interposed therebetween.

[0059] As described above, the heater 11 is assembled Figure 2 The heat medium heating device 10 shown in FIG. 1 is assembled.

[0060] Next, the features of the present application will be described with reference to Figure 3 to the drawings.

[0061] As described above Figure 3As shown, the heat sink portion 22H, which has the mounting surface of the electronic component 13 on the top, is connected to the outer surface of the flow path 21 (cylinder portion 22t) and is integrally formed with the flow path member 22.

[0062] With this structure, the heat of the electronic component 13 can be transferred from the metal heat sink 22H to the heat medium M inside the flow path 21, thereby improving the heat dissipation efficiency of the electronic component 13.

[0063] In addition, such as Figure 4 As shown, in this example, the flow path 21 is cylindrical (with an annular cross-section), and the heat sink portion 22H is connected to the cylindrical outer surface of the flow path 21 (cylindrical portion 22t). Furthermore, Figure 4 From and Figure 3 A sectional view obtained by cutting the paper perpendicular to its surface.

[0064] With this structure, since the flow path 21 (cylinder 22t) is cylindrical, the heat medium M can flow smoothly inside the flow path 21. Furthermore, since the radiator section 22H is connected to the outer surface of the flow path 21 (cylinder 22t) by entering the outer surface of the flow path 21, the height (distance) of the radiator section 22H from the flow path 21 (cylinder 22t) can be suppressed, thereby miniaturizing the heat medium heating device 10, and the contact area between the radiator section 22H and the flow path 21 can be increased.

[0065] In addition, regarding the "cylindrical" shape of the flow path 21, it is not necessary for the flow path 21 to have the same diameter over its entire length. For example, it can be reduced in diameter in one direction along the length, and the reduction and expansion of diameter can be repeated along the length.

[0066] Here, "connected to the cylindrical outer surface of the flow path 21" means that there is no gap G between the heat sink 22H and the outer surface of the flow path 21 (cylindrical part 22t).

[0067] In contrast, assuming a gap G is provided between the heat sink section 220H and the outer surface of the flow path 21 (cylinder section 22t), a heat sink section 220H is formed. Figure 4 As shown by the dashed line, the height (distance) of the heat sink section 220H from the flow path 21 increases, thus making the heat medium heating device 10 larger. In addition, the contact area between the heat sink section 220H and the flow path 21 is reduced due to the gap G, resulting in poorer heat dissipation efficiency for the electronic component 13 compared to the case without gap G.

[0068] In addition, such as Figure 3 As shown, in this example, the flow path 21 is cylindrical and extends along the length direction L, and the flow path 21 expands in diameter along the flow direction F of the heat medium M in the length direction L.

[0069] According to such a structure, the bubbles of the heat medium M generated by heating of the heater 11 flow along the flow direction F, are easily discharged from the flow path 21 to the outside (the discharge port 22Y), and the case where the heater 11 is left burning with the bubbles remaining in the flow path 21 can be suppressed.

[0070] In addition, as described later, in the present example, the heater 11 has the through-hole 11H, and the heat medium M also flows in the through-hole 11H, but the "flow path 21" refers to a portion surrounded by the flow path member 22 (the cylindrical portion 22t). That is, in the present example, the "flow path 21" refers to a region between the inner surface of the cylindrical portion 22t and the outer surface of the heater 11.

[0071] Therefore, the flow direction F of the heat medium M in the "flow path 21" is the flow direction of the heat medium M between the inner surface of the cylindrical portion 22t and the outer surface of the heater 11, and is a direction toward the left of the Y axis of Figure 3 . Also, the flow path 21 is expanded toward the left of the Y axis of Figure 3 , and therefore the "flow path 21 is expanded along the flow direction F of the heat medium M".

[0072] Further, as shown in Figure 3 , in the present example, the heater 11 is in a shape extending along the axial direction AX, and has the through-hole 11H along the axial direction AX. Also, the heat medium M introduced from the one end side of the through-hole 11H (the left of the Y axis of Figure 3 ) flows out to the outer surface side of the heater 11 from the other end 11e side of the through-hole 11H, and turns back at the inner wall surface of the flow path 21, and flows along the outer surface of the heater 11 to the opposite side in the axial direction AX (the left of the Y axis of ​ ).

[0073] Here, the corner portion 21e of the inner wall surface of the flow path 21 facing the other end 11e of the through-hole 11H is a curved surface.

[0074] According to such a structure, when the heat medium M turns back at the inner wall surface of the flow path 21 after flowing out to the outer surface side of the heater 11 from the other end 11e side of the through-hole 11H, the heat medium M smoothly flows at the corner portion 21e which is a curved surface, and therefore the heat dissipation efficiency of the electronic component 13 via the heat medium M can be further improved.

[0075] In addition, in the present example, the axial direction AX is parallel to the length direction L, but is not limited thereto, and the axial direction AX can also cross the length direction L.

[0076] Further, in the present example, the heater 11 is in a cylindrical shape.

[0077] According to such a structure, the heat medium M smoothly flows along the outer surface of the heater 11, and therefore the heat dissipation efficiency of the electronic component 13 via the heat medium M can be further improved.

[0078] The present application is not limited to the above-described embodiments, and of course encompasses various modifications and equivalents within the spirit and scope of the present application.

[0079] In the above-described embodiments, the heater 11 is a ceramic heater, but can be a PTC heater, a sheath heater.

[0080] In the above-described embodiments, the heater is cylindrical, but the shape of the heater can be appropriately changed.

[0081] The cross-sectional shape of the flow path is not limited either.

Claims

1. A heat medium heating device, comprising: a circuit board; an electronic component disposed on the circuit board; a flow path member made of metal, in which a heat medium flows through a flow path inside the flow path member; and a heater disposed on the flow path to heat the heat medium, wherein a heat sink portion is formed integrally with the flow path member, the heat sink portion being connected to an outer surface of the flow path and having a disposition surface of the electronic component.

2. The heat medium heating device according to claim 1, wherein the flow path is cylindrical, and the heat sink portion is connected to a cylindrical outer surface of the flow path.

3. The heat medium heating device according to claim 1 or 2, wherein the flow path is cylindrical and extends in a length direction, and the flow path expands in a diameter in a flow direction of the heat medium in the length direction.

4. The heat medium heating device according to claim 1 or 2, wherein the heater is elongated in an axial direction, and the heater has a through-hole in the axial direction, the heat medium introduced from one end side of the through-hole flows out to an outer surface side of the heater from the other end side of the through-hole, turns back at an inner wall surface of the flow path, and flows in the opposite side in the axial direction along the outer surface of the heater, and a corner portion of the inner wall surface of the flow path facing the other end of the through-hole is curved.

5. The heat medium heating device according to claim 1 or 2, wherein the heater is cylindrical. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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