Extension device and test system of solid state disk

Abstract

The invention discloses an expansion device and a test system for a solid state disk. The expansion device for the solid state disk comprises a mainboard, a PCIE (Peripheral Component Interface Express) socket structure and a hard disk interface structure, the PCIE socket structure is arranged on the mainboard, and the PCIE socket structure is used for being matched with a PCIE plug slot of a test machine in a plug-in mode. The hard disk interface structure is arranged on the mainboard, the hard disk interface structure and the PCIE socket structure are arranged at an interval, and the hard disk interface structure is used for installing a solid state disk. Therefore, according to the solid state disk expansion device, the PCIE socket structure and the hard disk interface structure are integrated on the same mainboard, and the PCIE socket structure is directly inserted into the PCIE plug-in slot of the test machine, so that a compact and external-cable-free connection mode between the solid state disk and the test machine is realized. A long-distance external cable used for signal transmission in a traditional test is omitted, so that the problems of signal attenuation and transmission time sequence deviation caused by cable impedance mismatching, crosstalk and electromagnetic interference are effectively avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of testing, in particular to a solid state disk expansion device and a testing system. BACKGROUND

[0002] In the field of computer hardware testing and development, especially when performing function verification and performance testing on a solid state disk (SSD) on a PC testing machine. At present, the common SSD expansion method is to connect the signal of the SSD to an independent expansion test board through an external cable. The testing machine is connected with the interface on the test board through the cable, thereby realizing the access and control of the SSD. However, since the signal needs to be transmitted through a long external cable, factors such as the material, length and shielding performance of the cable will introduce impedance mismatch, crosstalk and electromagnetic interference, resulting in signal attenuation and timing deviation increase, which seriously affects the stability of high-speed data transmission of the solid state disk. SUMMARY

[0003] The embodiments of the present application provide a solid state disk expansion device and a testing system, which can solve at least one of the above technical problems.

[0004] In a first aspect, the embodiments of the present application provide a solid state disk expansion device, comprising:

[0005] a mainboard;

[0006] a PCIE socket structure, the PCIE socket structure is arranged on the mainboard, and the PCIE socket structure is used for plugging into a PCIE insertion slot of a testing machine; and

[0007] a hard disk interface structure, the hard disk interface structure is arranged on the mainboard, the hard disk interface structure is arranged at intervals with the PCIE socket structure, and the hard disk interface structure is used for mounting the solid state disk.

[0008] In some embodiments, the number of hard disk interface structures is multiple, and the mainboard is provided with hard disk interface structures on opposite sides.

[0009] In some embodiments, the mainboard is provided with multiple solid state disk mounting positions, each solid state disk mounting position corresponds to a hard disk interface structure, and each solid state disk mounting position extends along the length direction of the mainboard.

[0010] In some embodiments, the PCIE socket structure extends along the length direction of the mainboard.

[0011] In some embodiments, the hard disk interface structure is an M.2 interface structure.

[0012] In some embodiments, the solid state disk expansion device further comprises a clock buffer module, the clock buffer module is arranged on the mainboard, and the clock buffer module is used for filtering the phase jitter of the differential clock signal.

[0013] In some embodiments, the expansion device of the solid state disk further comprises a state indicator light module, the state indicator light module is arranged on the mainboard, and the state indicator light module comprises a power indicator light, the power indicator light is used to display the power state of the solid state disk.

[0014] In some embodiments, the state indicator light module further comprises a read-write state indicator light, the read-write state indicator light is used to display the read-write state of the solid state disk.

[0015] In some embodiments, the state indicator light module further comprises a standby state indicator light, the standby state indicator light is used to display the standby state of the solid state disk.

[0016] In the first aspect, the embodiments of the present application provide a test system, comprising:

[0017] a test machine, the test machine is provided with a PCIE insertion slot;

[0018] the expansion device of the solid state disk in any of the above embodiments, the PCIE insertion port structure of the expansion device of the solid state disk is inserted and matched with the PCIE insertion slot of the test machine; and

[0019] a solid state disk, the solid state disk is installed on the hard disk interface structure of the expansion device of the solid state disk.

[0020] In the expansion device of the solid state disk and the test system provided by the embodiments of the present application, the expansion device of the solid state disk comprises a mainboard, a PCIE insertion port structure and a hard disk interface structure. The PCIE insertion port structure is arranged on the mainboard, and the PCIE insertion port structure is used to be inserted and matched with the PCIE insertion slot of the test machine. The hard disk interface structure is arranged on the mainboard, and the hard disk interface structure is arranged apart from the PCIE insertion port structure, and the hard disk interface structure is used to install the solid state disk. In this way, the expansion device of the solid state disk of the present application integrates the PCIE insertion port structure and the hard disk interface structure on the same mainboard, and makes the PCIE insertion port structure directly inserted into the PCIE insertion slot of the test machine, so as to realize the compact connection mode without external cable between the solid state disk and the test machine. Since the long distance external cable for signal transmission in the traditional test is omitted, the problems of signal attenuation and transmission time sequence deviation caused by cable impedance mismatch, crosstalk and electromagnetic interference are effectively avoided. The structure significantly improves the integrity and stability of high-speed signals in the transmission process, and guarantees the reliable test of the solid state disk in the high bandwidth and low delay working state. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only represent some of the embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in the drawings without creative labor.

[0022] Figure 1 The structural schematic diagram of the expansion device of the solid state disk provided by the embodiments of the present application.

[0023] Figure 2 The structural schematic diagram of the expansion device of the solid state disk provided by the embodiments of the present application from another perspective.

[0024] Explanation of reference numerals:

[0025] 10, expansion device of solid state disk; 100, mainboard; 110, solid state disk mounting position; 200, PCIE socket structure; 300, hard disk interface structure; 400, clock buffer module; 500, status indicator light module; 510, power indicator light; 520, read-write status indicator light; 530, standby status indicator light;

[0026] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present application more clear, the following will further describe the embodiments of the present application in combination with the accompanying drawings.

[0028] The following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings represent the same or similar elements. The implementation described in the following exemplary embodiments does not represent all the implementations consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0029] In the description of the present application, it should be understood that the terms "first", "second" and the like are only for the purpose of description and should not be understood as indicating or implying relative importance. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, unless otherwise specified, "multiple" means two or more. "And / or", the association between the associated objects, means that there can be three relationships, for example, A and / or B, which can represent the existence of A alone, the existence of A and B, and the existence of B alone. The character " / " generally represents a "or" relationship between the associated objects before and after it.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application. As used in this description, the singular forms "a", "an" and "the" include plural references unless the context clearly dictates otherwise.

[0031] Referring to Figure 1 and Figure 2 , the embodiment of the present application proposes a solid state disk expansion device 10, which comprises a mainboard 100, a PCIE socket structure 200 and a hard disk interface structure 300. The PCIE socket structure 200 is arranged on the mainboard 100, and is used for plugging into the PCIE insertion slot of the test machine. The hard disk interface structure 300 is arranged on the mainboard 100, and is arranged separately from the PCIE socket structure 200. The hard disk interface structure 300 is used for mounting the solid state disk.

[0032] In this way, the solid state disk expansion device of the present application integrates the PCIE socket structure 200 and the hard disk interface structure 300 on the same mainboard 100, and directly inserts the PCIE socket structure 200 into the PCIE insertion slot of the test machine, thereby realizing a compact connection mode between the solid state disk and the test machine without external cables. Since the long external cable for signal transmission in the traditional test is omitted, the problems of signal attenuation and transmission timing deviation caused by cable impedance mismatch, crosstalk and electromagnetic interference are effectively avoided. The structure significantly improves the integrity and stability of high-speed signals in the transmission process, and ensures the reliable test of the solid state disk in the high-bandwidth and low-delay working state.

[0033] The mainboard 100 serves as the structure and electrical connection basis of the entire device, and provides mechanical support and circuit wiring channels. The mainboard 100 adopts a multi-layer printed circuit board design, and is internally arranged with high-speed differential signal lines conforming to the PCIE protocol standard, to ensure that the electrical performance of data transmission meets the requirements of high-speed communication.

[0034] The PCIE socket structure 200 is fixedly installed at one end of the mainboard 100, and its electrical contacts are connected with the PCIE signal lines inside the mainboard 100. The PCIE socket structure 200 is adapted in size to the standard PCIE slot, and can be directly inserted into the PCIE insertion slot on the mainboard 100 of the test machine. Through this physical connection, the test machine can communicate with the solid state disk through the PCIE protocol, to realize operations such as command issuing, data reading and writing, and state monitoring. The direct connection of the PCIE socket structure 200 and the test machine slot avoids the problem of signal path lengthening caused by using external extension cables, shortens the signal transmission distance, and improves the signal integrity.

[0035] The hard disk interface structure 300 is arranged in another area of the mainboard 100, and is spaced apart from the PCIE socket structure 200 in space to form a reasonable layout structure. The hard disk interface structure 300 is designed according to the physical form and electrical interface standard of the current mainstream solid state disk, and supports the access of the M.2 specification solid state disk. The M.2 interface type is compatible with multiple protocol modes, which can include but is not limited to the NVMe protocol based on the PCIE bus and the SATA protocol, to ensure that the expansion device 10 can adapt to the M.2 solid state disk with different controller architectures and communication protocols. The hard disk interface structure 300 includes a mechanical buckle or a screw mounting position for fixing the solid state disk, and a connector for docking with the gold finger of the solid state disk. The connector is electrically connected with the PCIE socket structure 200 through a signal line inside the mainboard 100 to build a complete signal path from the test machine to the solid state disk.

[0036] In use, the PCIE socket structure 200 is first inserted into the PCIE slot of the test machine to complete the physical and electrical connection between the device and the test machine. Then, the solid state disk to be tested is installed on the hard disk interface structure 300 to ensure that the connector is in close contact with the gold finger of the solid state disk. The test machine recognizes the newly connected storage device through the BIOS or operating system, and starts the test program to verify the function, test the performance, or debug the firmware of the solid state disk. During the entire test process, the signal is transmitted in the shortest path inside the mainboard 100 without passing through external cables, thereby minimizing the influence of signal reflection, crosstalk and electromagnetic interference.

[0037] In some embodiments, the number of hard disk interface structures 300 is multiple, and the opposite sides of the mainboard 100 are each provided with a hard disk interface structure 300.

[0038] The number of hard disk interface structures 300 is set to multiple to improve the multi-device testing capability and application flexibility of the device. The multiple hard disk interface structures 300 are arranged on the opposite sides of the mainboard 100 respectively to form a double-sided installable expansion layout. This layout fully utilizes the space resources of the mainboard 100, and significantly improves the solid state disk access density in unit space without increasing the overall projection area of the device.

[0039] The mainboard 100 adopts a double-sided wiring multilayer printed circuit board structure, and multiple groups of high-speed signal lines conforming to the PCIE channel distribution rules are preset inside. One end of each group of signal lines is connected with the PCIE socket structure 200, and the other end is led out to the hard disk interface structures 300 on the two sides of the mainboard 100 respectively to ensure that each interface can independently receive the PCIE signal from the test machine. The signal lines on the two sides of the mainboard 100 are designed through impedance matching and equal-length wiring processing to reduce the phase difference and reflection phenomenon of high-speed signals in the transmission process, and to ensure the stability of synchronous transmission of multiple signals.

[0040] The hard disk interface structure 300 is designed according to the physical specifications of solid state disks, and supports the installation of NVMe solid state disks with common length specifications such as M.22280 and M.22260. Each hard disk interface structure 300 is equipped with an independent connector and a fixing mechanism. The connector is welded to the surface of the mainboard 100 and is electrically connected through a gold finger plug. The fixing mechanism includes detachable fixing screws or elastic compression buckles, which are used to stabilize the solid state disk in a vibration or movement test environment and prevent the contact from loosening.

[0041] The plurality of hard disk interface structures 300 are symmetrically distributed on both sides of the mainboard 100, forming a balanced mechanical structure to avoid bending or plug loosening of the mainboard 100 due to excessive load on one side. When solid state disks are installed on both sides at the same time, each hard disk communicates with the test machine through an independent PCIE channel or a shared channel mode. The specific connection mode is determined by the signal switching circuit or the BIOS recognition logic on the mainboard 100. The test machine can sequentially or in parallel access each solid state disk to perform batch read-write testing, life verification, or compatibility detection.

[0042] In some embodiments, the mainboard 100 is provided with a plurality of solid state disk mounting positions 110, each corresponding to a hard disk interface structure 300, and each solid state disk mounting position 110 extends along the length direction of the mainboard 100.

[0043] Each solid state disk mounting position 110 corresponds to a hard disk interface structure 300, forming an independent solid state disk access unit. The solid state disk mounting position 110 is a physical area on the mainboard 100 for positioning and fixing the solid state disk, and its position is accurately aligned with the connector of the hard disk interface structure 300, ensuring that the gold finger can be accurately inserted into the connector during installation to achieve reliable electrical connection.

[0044] The plurality of solid state disk mounting positions 110 are arranged in sequence along the length direction of the mainboard 100, forming a linear layout structure. This layout makes full use of the longitudinal space of the mainboard 100, allowing the solid state disk mounting positions 110 to be distributed in order on the surface of the mainboard 100, avoiding signal wiring intersection and electromagnetic interference superposition. The linearly arranged mounting positions facilitate user identification and operation, supporting the installation of multiple solid state disks from one end of the mainboard 100 to the other end, improving the space utilization efficiency and test throughput capacity of the device.

[0045] Each solid state disk mounting position 110 is provided with clear identification marks on the mainboard 100, including numbers, interface type prompts, and installation direction guides. The identification marks are formed on the surface of the mainboard 100 by silk printing or laser etching, enhancing readability and durability. Adequate operating gaps are reserved around the mounting positions to facilitate manual tightening of the fixing screws or operation of the buckle device, avoiding installation difficulties or tool interference due to limited space.

[0046] The linear arrangement of the solid state disk mounting positions 110 matches the layout of the PCIE signal channels inside the mainboard 100. Multiple groups of high-speed differential signal lines inside the mainboard 100 are arranged in parallel along the length direction, and each group of lines is connected to one hard disk interface structure 300, ensuring that the signal transmission paths between each solid state disk are independent of each other. The signal lines are strictly controlled for impedance and designed to be equal in length, reducing the timing deviation and crosstalk risk of high-speed signals during multi-channel parallel transmission, and ensuring the data transmission stability of each solid state disk under high load working conditions.

[0047] In some embodiments, the PCIE socket structure 200 extends along the length direction of the mainboard 100, coordinating with the overall structural layout of the mainboard 100. The extension direction is parallel to the long side of the mainboard 100, forming a longitudinally aligned connection structure that keeps the insertion direction of the PCIE socket structure 200 consistent with the mounting direction of the mainboard 100. This layout optimizes the space occupation of the device inside the test machine, facilitating the overall insertion and fixation of the device into the PCIE slot of the test machine.

[0048] The PCIE socket structure 200 uses a standard specification connector, whose pin arrangement is compatible with the PCIE 3.0 or PCIE 4.0 protocol, supporting x4 channel high-speed data transmission. The connector is fixed to one end of the mainboard 100 through surface mounting or through-hole welding, and its electrical contacts are directly connected to the PCIE main signal lines inside the mainboard 100. The signal lines are symmetrically arranged along the length direction of the mainboard 100, maintaining equal length and equal distance between differential pairs, ensuring the impedance continuity and timing consistency of high-speed signals during transmission.

[0049] The longitudinal extension design of the PCIE socket structure 200 shortens the transmission path of the signal from the test machine to the hard disk interface structure 300. After entering the mainboard 100, the signal is transmitted in a straight line along the length direction to each hard disk interface structure 300, reducing the risk of signal reflection and loss caused by wire bending and interlayer switching. This wiring path is particularly suitable for scenarios where multiple hard disks work in parallel, ensuring that each hard disk interface structure 300 can obtain stable and low-delay signal input.

[0050] This structure also improves the mechanical stability of the device. The PCIE socket structure 200 extends along the length direction, forming a larger contact area and connection strength with the mainboard 100, enhancing the anti-vibration and anti-plug force capability during the insertion process. In the test environment, this design effectively prevents communication interruption or poor contact caused by loose connection when frequently plugging or moving equipment.

[0051] In some embodiments, the hard disk interface structure 300 is an M.2 interface structure. The hard disk interface structure 300 adopts the M.2 interface structure, which is adapted to the current mainstream physical specification and electrical standard of high-speed solid state disks. The M.2 interface structure supports the PCIe data transmission mode under the NVMe protocol, and can meet the test requirements of high-performance solid state disks in high-bandwidth and low-latency applications. The interface structure is compatible with solid state disks of various M.2 specifications, including common length sizes such as 2280, 2260, and 2242, thereby improving the universality and adaptability of the expansion device.

[0052] The M.2 interface structure includes an M.2 connector and a fixing assembly. The M.2 connector is welded to the surface of the mainboard 100, and the pin definition thereof conforms to the M.2 interface specification, supports PCIe x4 channel data transmission, and is compatible with the SATA signal mode, thereby realizing access support for different types of M.2 solid state disks. Wear-resistant metal contacts are arranged inside the connector to ensure good electrical contact performance after multiple plugging and unplugging operations. The mounting position of the connector is precisely positioned to ensure accurate alignment of the signal lines of the mainboard 100 when the solid state disk is inserted.

[0053] The fixing assembly is arranged at one end of the M.2 connector and includes a mounting hole and a detachable fixing screw. The mounting hole is matched with the fixing screw hole at the tail of the M.2 solid state disk, and the fixing screw is screwed into the screw hole of the solid state disk through the mounting hole, thereby realizing mechanical locking. This fixing mode effectively prevents the solid state disk from loosening due to vibration or movement during testing, thereby ensuring the stability and reliability of the connection.

[0054] The layout of the M.2 interface structure is cooperatively designed with the high-speed signal lines on the mainboard 100. The PCIe differential signal lines inside the mainboard 100 are led out from the PCIE socket structure 200 and arranged along the shortest path to the M.2 connector, thereby reducing signal transmission delay and interference risk. The signal lines are designed with impedance matching, and the impedance is controlled within 85Ω±10%, thereby meeting the requirements of high-speed differential signal transmission. The power lines and ground lines are reasonably distributed to reduce the influence of power noise on signal integrity.

[0055] The M.2 interface structure supports the hot plug detection function, and the mainboard 100 is configured with corresponding detection pin circuits, which can identify the installation and removal state of the solid state disk in real time and send a state signal to the test machine system. This function facilitates device identification and fault alarm in the automatic test process.

[0056] In some embodiments, the expansion device 10 for the solid state disk further includes a clock buffer module 400, which is arranged on the mainboard 100. The clock buffer module 400 is used for phase jitter filtering of a differential clock signal.

[0057] The clock buffer module 400 is integrated on the mainboard 100 and is a key component of the signal integrity guarantee system. The clock buffer module 400 is used to receive the differential clock signal input from the test machine via the PCIE socket structure 200, and perform phase jitter filtering and signal regeneration processing on the clock signal to improve the stability and purity of the clock signal.

[0058] The clock buffer module 400 uses a dedicated clock buffer integrated circuit that supports 100MHz base frequency differential clock input specified by the PCIE protocol and has the technical characteristics of low phase noise and low additional jitter. The integrated circuit integrates a phase-locked loop (PLL) and a multi-clock driving unit inside, which can filter and shape the input clock signal, effectively suppress periodic jitter (Periodic Jitter) and random jitter (Random Jitter) caused by long-distance transmission or power fluctuations, and ensure that the output clock signal meets the clock accuracy requirements of PCIE Gen3, Gen4, and even higher version protocols.

[0059] The output end of the clock buffer module 400 is connected to the plurality of hard disk interface structures 300 on the mainboard 100 through independent clock wires, providing a purified synchronous clock source for each hard disk interface structure 300. This design avoids the problem of accumulated jitter caused by directly using the original clock signal of the test machine, especially when multiple hard disks are working in parallel, ensuring that each solid state disk controller can obtain consistent and stable reference clock, reducing the risk of data sampling errors or link training failures caused by clock deviation.

[0060] The power input end of the clock buffer module 400 is configured with a low-noise linear voltage stabilizing circuit and a multi-stage decoupling capacitor network, effectively suppressing the interference of power noise on the clock circuit. The clock signal wire uses a differential pair form, controls the characteristic impedance and transmission delay, and the wire length is designed to be equal in length to reduce the clock skew between channels. The clock connector cooperates with the ground shielding structure to further improve the anti-electromagnetic interference capability.

[0061] In some embodiments, the expansion device 10 of the solid state disk further includes a status indicator light module 500, which is arranged on the mainboard 100. The status indicator light module 500 includes a power indicator light 510 for displaying the power state of the solid state disk.

[0062] The status indicator light module 500 is installed on the surface of the mainboard 100 and is used to feedback the working state of the device and the running information of the solid state disk in real time. As an important part of human-computer interaction, the status indicator light module 500 provides intuitive visual indication for the test personnel, facilitating quick judgment of equipment connection, power supply, and data transmission.

[0063] The state indicator light module 500 is composed of a plurality of function indicator lights, including the power indicator light 510. The power indicator light 510 is connected to the power management unit of the mainboard 100 through a circuit, and is used to display the power supply state of the solid state disk. When the expansion device is connected to the test machine through the PCIE socket structure 200 and obtains stable power supply, the power indicator light 510 is activated and continuously lit, indicating that the solid state disk has entered the power-on preparation state. The power indicator light 510 is implemented by using a single-color or double-color light-emitting diode, and the color change thereof can correspond to different power supply levels, for example, green represents normal power supply, and red represents voltage abnormality or power supply interruption.

[0064] The driving circuit of the power indicator light 510 is integrated in the power monitoring network of the mainboard 100, and the circuit detects the voltage value and current state supplied to the solid state disk in real time. If power supply abnormalities such as voltage drop, overcurrent or short circuit are detected, the power indicator light 510 will issue a warning signal through flashing or color change, prompting the user to troubleshoot connection faults or power supply compatibility problems. This function helps to discover hardware connection defects in time at the beginning of testing, and avoids damage to the solid state disk or loss of test data due to unstable power supply.

[0065] The layout of the state indicator light module 500 is located in the easily observable area of the mainboard 100, usually close to the PCIE socket structure 200 or the solid state disk mounting position 110, to ensure that it can be clearly identified when used inside or outside the test machine case. Light columns or reflective coatings are provided around the indicator lights to enhance the visibility and uniformity of light. The installation positions of all the indicator lights correspond to the function identifiers one by one, and are marked with printed characters such as “PWR” or “POWER”, to improve the operation recognition efficiency.

[0066] In some embodiments, the state indicator light module 500 further includes a read-write state indicator light 520, which is used to display the read-write state of the solid state disk.

[0067] The read-write state indicator light 520 and the power indicator light 510 together constitute a complete running state feedback system. The read-write state indicator light 520 is used to display the data read and write operation state of the solid state disk in real time, and provides visual indication of dynamic working information for the tester. The indicator light detects the data transmission activity signal of the PCIE bus on the mainboard 100 to determine whether the solid state disk is performing data interaction.

[0068] The read-write status indicator 520 is connected to a signal monitoring circuit of the mainboard 100, which monitors the data channel between the hard disk interface structure 300 and the PCIE socket structure 200 in real time. When the solid state disk receives a read command from the test machine and starts transmitting data, the read-write status indicator 520 is triggered and lit or flashed; when the solid state disk performs a write operation and receives host write data, the read-write status indicator 520 is also activated. The flashing frequency of the indicator is positively correlated with the activity level of data transmission, and high-frequency flashing indicates continuous high-load reading and writing, constant light indicates continuous data flow, and extinguishing indicates no data activity.

[0069] The read-write status indicator 520 is implemented by independent light-emitting diodes, which are distinguished in color from the power indicator 510, and are usually blue or amber in color to avoid user confusion between power status and data status. The read-write status indicators 520 corresponding to the plurality of solid state disk mounting positions 110 can be arranged side by side, and each indicator independently responds to the data activity of the corresponding hard disk, supporting independent state monitoring during parallel testing of multiple disks. This design enables the tester to intuitively determine the workload distribution of each solid state disk and identify abnormal silence or continuous high-load devices.

[0070] The driving logic of the read-write status indicator 520 is integrated into the control circuit of the mainboard 100, and automatic response can be achieved without additional external controllers. The circuit has filtering and debouncing functions to prevent false flashing of the indicator due to transient signal fluctuations and to ensure the accuracy of the display results. The response delay of the indicator is controlled at the millisecond level, which can truly reflect the real-time read-write behavior of the solid state disk.

[0071] This read-write status indication function significantly improves the transparency and debugging efficiency of the testing process. During performance testing, firmware verification, or compatibility detection, the tester can observe the change pattern of the read-write status indicator 520 to quickly confirm whether the solid state disk is correctly identified, whether the command is effectively executed, and whether there are problems such as communication interruption or response stagnation.

[0072] In some embodiments, the status indicator light module 500 further includes a standby status indicator 530 for displaying the standby status of the solid state disk.

[0073] The standby status indicator 530 is used to indicate whether the solid state disk is currently in a low-power running mode or an idle state. The standby status indicator 530 detects the power management signal and bus activity status of the solid state disk to determine whether it enters the idle or low-power idle mode defined by the NVMe protocol or AHCI specification, and feeds back the status information in real time.

[0074] The standby state indicator lamp 530 is connected to the power management monitoring circuit on the mainboard 100, which continuously monitors the link state signal between the hard disk interface structure 300 and the PCIE bus and the power mode register information of the solid state disk controller. When the solid state disk completes the data read / write operation, if no new host command is received within the preset time, the controller automatically enters the standby state to reduce power consumption. At this time, the monitoring circuit identifies that the link enters the L1 or L2 low-power state, triggers the standby state indicator lamp 530 to light up or slowly flash at a specific frequency, indicating that the solid state disk has entered the energy-saving operation mode.

[0075] The standby state indicator lamp 530 uses a different color or display mode from the power indicator lamp 510 and the read / write state indicator lamp 520, usually using yellow or green constant / slow flashing mode, to clearly distinguish the power supply state, data activity state and low power state. A plurality of standby state indicator lamps 530 can be arranged one-to-one with a plurality of hard disk interface structures 300 to realize visual monitoring of the independent power state of multiple solid state disks. This design facilitates test personnel to evaluate the power management strategy execution of the solid state disk and verify its energy efficiency performance in actual application scenarios.

[0076] The introduction of the standby state indicator lamp 530 enhances the observability of the dynamic power behavior of the solid state disk. When performing power consumption tests, energy efficiency certifications or long-term stability verifications, test personnel can observe the changes in the indicator lamp to determine whether the solid state disk enters the standby mode as expected, whether there are problems such as abnormal wake-up or inability to sleep. This function plays an important auxiliary role in identifying firmware defects, driver compatibility issues or system power strategy configuration errors.

[0077] The embodiment of the application also provides a test system, which comprises a test machine, a solid state disk and the expansion device 10 of the solid state disk of any of the above embodiments. The test machine is provided with a PCIE insertion slot. The PCIE insertion port structure 200 of the expansion device 10 of the solid state disk is inserted and matched with the PCIE insertion slot of the test machine. The solid state disk is installed on the hard disk interface structure 300 of the expansion device 10 of the solid state disk.

[0078] The test machine is the control and data processing core of the test system, and is provided with a standard PCIE insertion slot on the built-in mainboard 100. The PCIE insertion slot supports PCIE 3.0 or PCIE 4.0 protocol, provides a high-speed data transmission channel and stable power supply, and is used for accessing external expansion equipment and realizing communication control with the device under test.

[0079] The expansion device 10 of the solid state disk is physically and electrically connected with the PCIE insertion slot of the test machine through the PCIE insertion structure 200. After the PCIE insertion structure 200 is inserted into the PCIE insertion slot, a reliable mechanical fixation and signal conduction path are formed. The mainboard 100 of the expansion device obtains working power supply and PCIE master control signals from the test machine through the connection, and directly transmits the signals to the hard disk interface structure 300 thereon. The connection mode eliminates the external extension cable used in the traditional test, avoids signal attenuation, impedance mismatch and electromagnetic interference problems caused by insufficient cable length and shielding performance, and significantly improves the integrity and stability of high-speed signal transmission.

[0080] The solid state disk is installed on the hard disk interface structure 300 of the expansion device and is electrically connected through the gold finger and the connector insertion. The solid state disk can be an M.2 NVMe type or other storage device with an adaptive interface specification. During installation, the solid state disk is locked on the solid state disk mounting position 110 of the expansion device through a fixing screw or a buckle mechanism, so as to ensure stable contact during the test and prevent the connection from loosening due to vibration or thermal expansion and contraction.

[0081] During the running of the test system, the test machine identifies the solid state disk accessed through the expansion device through BIOS or an operating system, and lists it as an accessible storage device. After the test software is started, the solid state disk is executed for function verification, performance test, firmware programming or life durability evaluation. Since the signal is transmitted in the shortest path inside the mainboard 100 of the expansion device, and the circuit design and clock purification process are optimized, the solid state disk can stably run under the condition close to the real working environment, and the test result is more accurate and more representative.

[0082] In the drawings of the embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present application, it should be understood that the orientations or positional relationships indicated by terms such as "upper", "lower", "left", "right" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationship in the drawings are only used for exemplary illustration, and cannot be understood as a limitation on the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

[0083] The above is only a preferred embodiment of the present application, and does not limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An expansion device of a solid state drive, characterized by, The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device.

2. The expansion device of a solid state drive according to claim 1, wherein, The application relates to a solid state disk expansion device.

3. The expansion device of a solid state drive according to claim 2, wherein, The application relates to a solid state disk expansion device.

4. The expansion device of a solid state drive according to claim 1, wherein, The application relates to a solid state disk expansion device.

5. The expansion device of a solid state drive according to claim 1, wherein, The application relates to a solid state disk expansion device.

6. The expansion device of a solid state drive according to claim 1, wherein, The application relates to a solid state disk expansion device.

7. The expansion device of a solid state drive according to claim 1, wherein, The application relates to a solid state disk expansion device.

8. The expansion device of a solid state drive according to claim 7, wherein, The application relates to a solid state disk expansion device.

9. The expansion device of a solid state drive according to claim 7, wherein, The application relates to a solid state disk expansion device.

10. A test system, characterized by The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. The application relates to a solid state disk expansion device. 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