Medium window uniform-temperature heat dissipation device, medium window uniform-temperature heat dissipation method and etching equipment

Abstract

The embodiment of the invention provides a medium window uniform-temperature heat dissipation device, a medium window uniform-temperature heat dissipation method and etching equipment, and relates to the technical field of semiconductor manufacturing, the medium window uniform-temperature heat dissipation device comprises a fan, a wind plate, a conductive coil and a cooling liquid inlet and outlet connector, the wind plate is located between the fan and the medium window, and the wind plate, the fan and the medium window are coaxially arranged; the air plate comprises a center hole and an air plate body located on the periphery of the center hole, the air plate body is partially hollowed out to form at least one air uniformizing channel, the overflowing area of each air uniformizing channel is gradually increased in the direction gradually close to the center hole, the conductive coil is of a hollow structure, and the cooling liquid inlet and outlet connector is communicated with the interior of the conductive coil. The interior of the conductive coil serves as a cooling liquid channel. The temperature difference between the central area and the edge area of the dielectric window is reduced while the overall cooling of the dielectric window is realized, so that the risk of explosion of the dielectric window due to large temperature difference is reduced, air cooling and liquid cooling can be performed on the dielectric window at the same time, the upper limit of radio frequency power is increased, and higher radio frequency power can be adopted.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a dielectric window temperature equalization and heat dissipation device, a dielectric window temperature equalization and heat dissipation method, and an etching equipment. Background Technology

[0002] Etching is a crucial process in semiconductor manufacturing. Etching equipment includes a vacuum chamber, a dielectric window, and conductive coils. The dielectric window is mounted on the top cover of the vacuum chamber, and the conductive coils are positioned above it. Under the influence of radio frequency (RF) signals from the RF receiver, the conductive coils generate an electric field, which excites the reactive gas within the vacuum chamber to produce plasma, thus etching the semiconductor device. The closer to the center of the dielectric window, the stronger the electric field, the higher the plasma density, and the greater the heat released by ion collisions, resulting in a higher temperature at the center of the dielectric window compared to its edges. Dielectric windows are typically made of ceramic; however, ceramic dielectric windows can crack if the temperature difference is too great.

[0003] Therefore, how to reduce the risk of the medium window shattering is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0004] To solve the above-mentioned technical problems, this application provides a medium window temperature equalization and heat dissipation device, characterized in that the medium window temperature equalization and heat dissipation device includes a fan and a fan plate, the fan plate is located between the fan and the medium window and the three are arranged coaxially, the fan plate includes a central hole and a fan plate body located around the central hole, the fan plate body is partially hollowed out to form at least one air equalization channel, and the flow area of ​​each air equalization channel gradually increases along the direction gradually closer to the central hole.

[0005] One embodiment of the medium window temperature equalization and heat dissipation device is that the air plate body has multiple hollows, each hollow extending along a different radial direction of the air plate body, and each hollow forming an air equalization channel.

[0006] One embodiment of the medium window temperature equalization and heat dissipation device is that the air plate body has multiple sets of hollows, each set is located on the same radial direction of the air plate body, each set forms a uniform air channel, and each set includes multiple hollows, with each hollow in the same set located on a different diameter circumference of the air plate body.

[0007] One embodiment of the medium window temperature equalization and heat dissipation device includes a conductive coil and a coolant inlet / outlet connector. The conductive coil has a hollow structure, and the coolant inlet / outlet connector is connected to the interior of the conductive coil, so that the interior of the conductive coil serves as a coolant channel.

[0008] One embodiment of the dielectric window temperature equalization and heat dissipation device includes a thermally conductive pad located between the disc-shaped body of the conductive coil and the dielectric window. The front side of the thermally conductive pad contacts the disc-shaped body of the conductive coil, and the back side of the thermally conductive pad contacts the dielectric window.

[0009] In one embodiment of the medium window temperature equalization and heat dissipation device, the heat-conducting pad is partially recessed from the front side to the back side to form a heat dissipation groove.

[0010] In one embodiment of the dielectric window temperature equalization and heat dissipation device, the disk-shaped body of the conductive coil is routed along the heat dissipation groove.

[0011] One embodiment of the medium window temperature equalization and heat dissipation device includes a connecting plate located between the disc-shaped body of the conductive coil and the air plate. The connecting plate is fixed relative to the medium window and is connected to the disc-shaped body of the conductive coil and the air plate, so that the conductive coil and the air plate are fixed relative to the medium window.

[0012] In one embodiment of the medium window temperature equalization and heat dissipation device, the air plate is connected to the connecting plate via a first adjustable component, the first adjustable component being able to adjust the distance between the air plate and the connecting plate, so that the distance between the air plate and the medium window is adjustable; and / or, the connecting plate is fixed relative to the medium window via a second adjustable component, the second adjustable component being able to adjust the distance between the connecting plate and the medium window, so that the distance between the air plate and the medium window is adjustable.

[0013] In one embodiment of the medium window temperature equalization and heat dissipation device, the first adjustable component includes a connecting column, one end of which is threadedly connected to the air vane, and the other end of which is threadedly connected to the connecting plate, so as to change the distance between the air vane and the connecting plate by rotating the connecting column.

[0014] In one embodiment of the medium window temperature equalization and heat dissipation device, the second adjustable component includes a shim, which is disposed below the connecting plate to adjust the distance between the connecting plate and the medium window by replacing the shims of different thicknesses.

[0015] This application also provides a method for uniform temperature dissipation of a medium window, which involves air cooling of the medium window. During the air cooling process, air is blown towards the medium window through an air duct, and the medium window is uniformly cooled by making the flow area of ​​the air duct different for different temperature regions of the medium window.

[0016] One implementation of the medium window temperature equalization and heat dissipation method involves liquid cooling of the medium window.

[0017] One implementation of the medium window uniform temperature heat dissipation method involves using air cooling and liquid cooling together, sequentially, or selectively.

[0018] This application also provides an etching apparatus, including a dielectric window, a vacuum chamber, a shielding cover, and a dielectric window temperature equalization and heat dissipation device as described in any one of the above. The dielectric window is connected to the top side cover of the vacuum chamber, the shielding cover is located on the top side of the vacuum chamber and covers the dielectric window, the fan is connected to the top plate of the shielding cover, and the fan plate is located inside the shielding cover.

[0019] The technical effects of this application include: reducing the temperature difference between the central and edge regions of the dielectric window while achieving overall cooling of the dielectric window, thereby reducing the risk of the dielectric window cracking due to large temperature differences; enabling simultaneous air cooling and liquid cooling of the dielectric window; increasing the upper limit of radio frequency power; and enabling the use of higher radio frequency power and achieving higher etching rates. Attached Figure Description

[0020] Figure 1 A three-dimensional schematic diagram of a partial structure of an embodiment of the etching apparatus provided in this application;

[0021] Figure 2 for Figure 1 A three-dimensional schematic diagram of the stroke panel;

[0022] Figure 3 for Figure 1 A 3D schematic diagram of the thermal pad;

[0023] Figure 4 for Figure 1 A three-dimensional schematic diagram of the connecting plate and the coil;

[0024] Figure 5 for Figure 1 A three-dimensional schematic diagram of the connecting plate and the air deflector;

[0025] Figure 6 This is a plan view of the air deflector according to another embodiment.

[0026] The annotations in the attached figures are explained as follows:

[0027] 1 Fan, 2 Medium window, 3 Air vane, 3a Center hole, 3b Air vane body, A Air distribution channel, 4 Thermal pad, 4a Spiral heat dissipation groove, 5 Coil, 5a Stud, 6 Coolant inlet, 7 Connecting plate, 8 Shielding cover, 9 Cavity cover, 9a Protrusion, 10 Gasket, 11 Connecting post. Detailed Implementation

[0028] This application provides a dielectric window temperature equalization and heat dissipation device, a dielectric window temperature equalization and heat dissipation method, and an etching apparatus. To enable those skilled in the art to better understand the technical solutions of this application, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments.

[0029] like Figure 1 As shown, the etching equipment includes a dielectric window 2, a vacuum chamber (only the top side cover 9 of the vacuum chamber is shown in the figure), a shielding cover 8, and a dielectric window heat dissipation device.

[0030] The medium window 2 is sealed and fixedly connected to the top side cover 9 of the vacuum chamber. The medium window 2 is made of high-strength, insulating, high-temperature resistant, and resistant to various acid and alkali corrosion materials, such as ceramic or quartz.

[0031] The vacuum chamber serves as the reaction chamber, into which a reaction gas is introduced during the etching process.

[0032] The shielding cover 8 is fixed to the top side of the vacuum chamber, covering the medium window 2. In the figure, one side plate of the shielding cover 8 is hidden to clearly show the internal structure of the shielding cover 8.

[0033] The medium window heat dissipation device includes at least a fan 1 and a fan plate 3. The fan 1 is connected to the top plate of the shielding cover 8, and the fan plate 3 is located inside the shielding cover 8. The fan plate 3 is located between the fan 1 and the medium window 2, and the fan plate 3, the fan 1 and the medium window 2 are arranged coaxially.

[0034] like Figure 2 As shown, the air vane 3 includes a central hole 3a and an air vane body 3b located around the central hole 3a. The air vane body 3b is partially hollowed out to form at least one air distribution channel A, and the flow area of ​​each air distribution channel A gradually increases along the direction gradually closer to the central hole 3a.

[0035] During operation, fan 1 rotates, and air flows through the air distribution channel A and the central hole 3a of the air plate 3 towards the medium window 2, dissipating heat from the medium window 2. Since the central area of ​​the air plate 3 is completely hollowed out to form the central hole 3a, and the flow area of ​​each air distribution channel A on the air plate body 3b around the central hole 3a gradually increases in the direction of gradually approaching the central hole 3a, the air volume of the medium window 2 is greater closer to the center, and thus the heat dissipation is greater. This makes the temperature drop in the central area of ​​the medium window 2 greater than that in the edge area, thereby reducing the temperature difference between the central area and the edge area of ​​the medium window 2 while achieving overall cooling of the medium window 2. This reduces the risk of the medium window 2 cracking due to the large temperature difference.

[0036] In some embodiments, such as Figure 2As shown, the main body 3b of the air distribution plate has multiple hollows (multiple means two or more, 20 in the figure). Each hollow extends along a different radial direction of the main body 3b of the air distribution plate, and each hollow forms a uniform air distribution channel A. A total of 20 uniform air distribution channels A are formed. The 20 uniform air distribution channels A are arranged at equal angles on the entire circumference of the main body 3b of the air distribution plate. The distance between the two side walls of each hollow gradually increases in the direction of gradually approaching the central hole 3a, so that the flow area of ​​each uniform air distribution channel A gradually increases in the direction of gradually approaching the central hole 3a. Figure 2 In the middle, the two rectangular holes on the main body 3b of the wind plate are clearance holes.

[0037] In some embodiments, such as Figure 6 As shown, the main body 3b of the air distribution plate has multiple sets of perforations (multiple sets refer to two or more sets, eight sets in the figure). Each set is located on the same radial direction of the main body 3b of the air distribution plate, and each set includes multiple perforations (multiple sets refer to two or more sets, three in the figure). The perforations in the same set are located on different diameter circumferences of the main body 3b of the air distribution plate, and each set forms a uniform airflow channel A. A total of 8 uniform airflow channels A are formed in the figure. The 8 uniform airflow channels A are arranged at equal angular intervals on the entire circumference of the main body 3b of the air distribution plate. Among the three perforations in each set, the one furthest from the central hole 3a has the smallest area, the one in the middle has a larger area, and the one closest to the central hole 3a has the largest area. This makes the flow area of ​​each uniform airflow channel A gradually increase along the direction closer to the central hole 3a.

[0038] In practice, the form of the air distribution channel A can be designed according to actual needs, as long as the flow area of ​​the air distribution channel A gradually increases along the direction closer to the central hole 3a, and is not limited to this. Figure 2 and Figure 6 The format of the presentation.

[0039] In some embodiments, such as Figure 1 As shown, the dielectric window heat dissipation device further includes a conductive coil 5 and a coolant inlet / outlet connector 6. The conductive coil 5 is located on the top side of the dielectric window 2 and inside the shielding cover 8. The conductive coil 5 includes a disc-shaped body and a wiring portion extending from the disc-shaped body, with the wiring portion passing upward through the air plate 3. During operation, the conductive coil 5 can generate an electric field under radio frequency action to excite the reaction inside the vacuum cavity and generate plasma. The conductive coil 5 has a hollow structure, and its interior is connected to the coolant inlet / outlet connector 6 to serve as a coolant channel. During operation, the coolant inlet / outlet connector 6 is connected to a coolant tank, and the coolant circulates between the conductive coil 5 and the coolant tank, thereby liquid cooling the dielectric window 2. To avoid the coolant affecting the electric field, an insulating coolant can be selected. In actual use, air cooling, liquid cooling, or both can be used together.

[0040] When liquid cooling and air cooling are used together, the temperature drop of dielectric window 2 is greater than when air cooling is used alone. When air cooling is used alone, the temperature drop of dielectric window 2 is relatively small. Therefore, to avoid overheating of dielectric window 2, a lower RF power is usually used. The lower the RF power, the lower the excited plasma density, and the lower the etching rate, so it cannot meet the high etching rate requirements. When liquid cooling and air cooling are used together, the temperature drop of dielectric window 2 is relatively large, so a higher RF power can be used, thereby meeting the high etching rate requirements.

[0041] In some embodiments, such as Figure 1 As shown, the dielectric window heat dissipation device further includes a thermal pad 4. The front side of the thermal pad 4 contacts the disc-shaped body of the conductive coil 5. The thermal pad 4 is located between the disc-shaped body of the conductive coil 5 and the dielectric window 2. The front side of the thermal pad 4 contacts the disc-shaped body of the conductive coil 5, and the back side of the thermal pad 4 contacts the dielectric window 2. This arrangement can improve the heat exchange efficiency between the coolant in the conductive coil 5 and the dielectric window 2. At the same time, the heat from the dielectric window 2 can also be transferred to the thermal pad 4 and then to the conductive coil 5 itself. The thermal pad 4 itself has good heat dissipation performance, and the conductive coil 5, which is generally made of metal, also has good heat dissipation performance, thus further improving the heat dissipation efficiency of the dielectric window 2.

[0042] In some embodiments, the thermal pad 4 is made of thermally conductive silicone. In actual implementation, it is not limited to this; any material with good thermal conductivity and insulation is acceptable.

[0043] In some embodiments, such as Figure 1 As shown, a heat dissipation groove 4a is formed by a partial indentation on the front side of the thermal pad 4 towards the back side. This increases the heat dissipation area of ​​the thermal pad 4, improves its heat dissipation performance, and thus enhances the heat dissipation efficiency of the dielectric window 2.

[0044] In some embodiments, such as Figure 1 As shown, the disc-shaped body of the conductive coil 5 runs along the heat dissipation groove 4a. In this way, the disc-shaped body of the heat-conducting coil 5 is in contact with both side walls and the bottom wall of the heat dissipation groove at the same time, which increases the contact area between the conductive coil 5 and the heat-conducting pad 4, thereby improving the heat exchange efficiency between the coolant and the medium window 2 and the heat dissipation efficiency of the medium window 2.

[0045] In some embodiments, such as Figure 1As shown, the dielectric window heat dissipation device includes a connecting plate 7. The connecting plate 7 is located between the disc-shaped body of the conductive coil 5 and the air plate 3. The connecting plate 7 is fixed relative to the dielectric window 2 and connected to the disc-shaped body of the conductive coil 5, thus fixing the position of the conductive coil 5. The connecting plate 7 is also connected to the air plate 3, thus fixing the position of the air plate 3. In the figure, a boss is provided on the top side cover 9 of the vacuum chamber, and the connecting plate 7 is fixed to the boss by threaded fasteners, thereby fixing the connecting plate 7 relative to the dielectric window 2. In the figure, the connecting plate 7 presses down on the disc-shaped body of the conductive coil 5, and a copper stud 5a is welded to the disc-shaped body of the conductive coil 5. One end of the stud 5a passes through the connecting plate 7 and is fixed with a matching nut, thereby fixing the position of the conductive coil 5.

[0046] In some embodiments, such as Figure 1 As shown, the air vane 3 is connected to the connecting plate 7 via a first adjustable component. The first adjustable component can adjust the distance between the air vane 3 and the connecting plate 7, making the distance between the air vane 3 and the medium window 2 adjustable. Alternatively, the connecting plate 7 is fixed relative to the medium window 2 via a second adjustable component, which can also adjust the distance between the connecting plate 7 and the medium window 2, making the distance between the air vane 3 and the medium window 2 adjustable. In other words, the distance between the air vane 3 and the medium window 2 can be changed by adjusting the distance between the air vane 3 and the connecting plate 7 and / or by adjusting the distance between the connecting plate 7 and the medium window 2. The cooling rate of the medium window 2 can be adjusted by changing the distance between the air vane 3 and the medium window 2.

[0047] Figure 1 In this design, the first adjustable component includes a connecting post 11. One end of the connecting post 11 is threadedly connected to the air vane 3, and the other end is threadedly connected to the connecting plate 7. The length of the threaded connection is adjusted by rotating the connecting post 11, thereby changing the distance between the air vane 3 and the connecting plate 7. This first adjustable component has a simple structure and is easy to adjust. In actual implementation, the first adjustable component can also be configured with other structures, such as a slider-slide groove mating structure or a telescopic tube structure.

[0048] Figure 1 In this design, the second adjustable component includes a shim 10, which is positioned below the connecting plate 7. The distance between the connecting plate 7 and the medium window 2 can be adjusted by replacing shims 10 of different thicknesses. This second adjustable component has a simple structure and is easy to adjust. In actual implementation, the second adjustable component can also be configured with other structures, such as a slider-slide groove mating structure or a telescopic tube structure.

[0049] The method for uniform temperature dissipation of the medium window provided in this application is as follows: the medium window is air-cooled. During the air-cooling process, air is blown towards the medium window through an air duct. For example, in the above embodiment, the air duct includes a uniform airflow channel A and a central hole 3a. The medium window is uniformly cooled by making the flow area of ​​the air duct different for different temperature regions of the corresponding medium window. Specifically, the flow area of ​​the air duct is larger for regions with higher temperatures of the corresponding medium window.

[0050] In some embodiments, the method for heat dissipation of the medium window is to further liquid cool the medium window.

[0051] In some embodiments, the method for uniform heat dissipation of the medium window is as follows: air cooling and liquid cooling are used together, sequentially, or selectively. When used sequentially, air cooling can be used first and liquid cooling can be used later, or vice versa.

[0052] In summary, the technical effects of this application embodiment include: while achieving overall cooling of the dielectric window 2, the temperature difference between the central region and the edge region of the dielectric window 2 is reduced, thereby reducing the risk of the dielectric window 2 cracking due to large temperature difference; it can simultaneously perform air cooling and liquid cooling on the dielectric window 2; it increases the upper limit of radio frequency power; and it can use higher radio frequency power and achieve a higher etching rate.

[0053] The above examples illustrate the principles and implementation methods of this application. The descriptions of these embodiments are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A medium window temperature equalization and heat dissipation device, characterized in that, The medium window temperature equalization and heat dissipation device includes a fan (1) and a fan plate (3). The fan plate (3) is located between the fan (1) and the medium window (2) and the three are arranged coaxially. The fan plate (3) includes a central hole (3a) and a fan plate body (3b) located around the central hole (3a). The fan plate body (3b) is partially hollowed out to form at least one air equalization channel (A). The flow area of ​​each air equalization channel (A) gradually increases along the direction that gradually approaches the central hole (3a).

2. The medium window temperature equalization and heat dissipation device according to claim 1, characterized in that, The main body of the air panel (3b) has multiple cutouts, each cutout extending along a different radial direction of the main body of the air panel (3b), and each cutout forming a uniform airflow channel (A).

3. The medium window temperature equalization and heat dissipation device according to claim 1, characterized in that, The main body of the air plate (3b) is provided with multiple sets of hollows, each set located on the same radial direction of the main body of the air plate (3b), each set forming a uniform airflow channel (A), each set including multiple hollows, and each hollow in the same set located on a different diameter circumference of the main body of the air plate (3b).

4. The medium window temperature equalization and heat dissipation device according to any one of claims 1-3, characterized in that, The medium window temperature equalization and heat dissipation device also includes a conductive coil (5) and a coolant inlet / outlet connector (6). The conductive coil (5) has a hollow structure, and the coolant inlet / outlet connector (6) is connected to the inside of the conductive coil (5), so that the inside of the conductive coil (5) serves as a coolant channel.

5. The medium window temperature equalization and heat dissipation device according to claim 4, characterized in that, The medium window temperature equalization and heat dissipation device also includes a heat-conducting pad (4), which is located between the disc-shaped body of the conductive coil (5) and the medium window (2). The front side of the heat-conducting pad (4) is in contact with the disc-shaped body of the conductive coil (5), and the back side of the heat-conducting pad (4) is in contact with the medium window (2).

6. The medium window temperature equalization and heat dissipation device according to claim 5, characterized in that, The heat-conducting pad (4) has a partial indentation on the front side towards the back side to form a heat dissipation groove (4a).

7. The medium window temperature equalization and heat dissipation device according to claim 6, characterized in that, The disc-shaped body of the conductive coil (5) runs along the heat dissipation groove (4a).

8. The medium window temperature equalization and heat dissipation device according to claim 4, characterized in that, The medium window temperature equalization and heat dissipation device includes a connecting plate (7), which is located between the disc-shaped body of the conductive coil (5) and the air plate (3). The connecting plate (7) is fixed relative to the medium window (2). The connecting plate (7) is connected to the disc-shaped body of the conductive coil (5) and also to the air plate (3), so that the conductive coil (5) and the air plate (3) are fixed relative to the medium window (2).

9. The medium window temperature equalization and heat dissipation device according to claim 8, characterized in that, The air vane (3) is connected to the connecting plate (7) via a first adjustable component. The first adjustable component can adjust the distance between the air vane (3) and the connecting plate (7) so that the distance between the air vane (3) and the medium window (2) is adjustable; and / or, the connecting plate (7) is fixed relative to the medium window (2) via a second adjustable component. The second adjustable component can adjust the distance between the connecting plate (7) and the medium window (2) so that the distance between the air vane (3) and the medium window (2) is adjustable.

10. The medium window temperature equalization and heat dissipation device according to claim 9, characterized in that, The first adjustable component includes a connecting post (11), one end of which is threaded to the air plate (3) and the other end of which is threaded to the connecting plate (7) so as to change the distance between the air plate (3) and the connecting plate (7) by rotating the connecting post (11).

11. The medium window temperature equalization and heat dissipation device according to claim 9, characterized in that, The second adjustable component includes a shim (10) disposed below the connecting plate (7) to adjust the distance between the connecting plate (7) and the medium window (2) by replacing the shim (10) with one of different thicknesses.

12. A method for uniform temperature dissipation through a medium window, characterized in that, A fan is used to cool the medium window. An air duct is constructed between the fan and the medium window. When the fan is turned on, the air blows through the air duct to the medium window. The medium window is made to uniformly temperature by making the flow area of ​​the air duct different for different temperature areas of the medium window.

13. The method for uniform temperature dissipation through a medium window according to claim 12, characterized in that, Liquid cooling is applied to the medium window.

14. The method for uniform temperature dissipation through a medium window according to claim 13, characterized in that, Air cooling and liquid cooling can be used together, sequentially, or one can be used at a time.

15. An etching apparatus, characterized in that, The device includes a medium window (2), a vacuum chamber, a shield (8), and a medium window temperature equalization and heat dissipation device according to any one of claims 1-11. The medium window (2) is connected to the top side cavity cover (9) of the vacuum chamber. The shield (8) is located on the top side of the vacuum chamber and covers the medium window (2). The fan (1) is connected to the top plate of the shield (8). The fan plate (3) is located inside the shield (8).

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