Semiconductor metrology apparatus

Abstract

The application provides a semiconductor measuring device, which comprises a cavity, a measuring component, a workbench and a sealing component. The measuring component is installed on the cavity and communicates with the internal space, and is responsible for performing accurate measurement on materials in a vacuum environment. The workbench is at least partially arranged inside the cavity, and is used for carrying the materials and driving the materials to reciprocally move between an opening position of the cavity and a measuring position corresponding to the measuring component, so as to complete the operations such as feeding, positioning and moving out of the materials. The sealing component is installed on the cavity, and has two working states. When it is necessary to maintain the cleanliness of the local environment where the measuring component is located or to break the vacuum of the cavity main body, the sealing component can act to separate the measuring component from the cavity main body space, so as to form effective sealing protection for the measuring component. When the vacuum environment is established and maintained in the cavity, the sealing component is separated from the measuring component, so as to leave a smooth measuring path for the measuring process.

Description

Technical Field

[0001] This application belongs to the field of measurement equipment technology, and more specifically, relates to a semiconductor measurement device. Background Technology

[0002] In the field of semiconductor metrology, these instruments are used to detect chip performance and defects during semiconductor manufacturing. Real-time monitoring is required throughout the entire production process after almost every major process step is completed to ensure controllable product quality, playing a crucial role in guaranteeing product quality. Front-end metrology equipment focuses on process monitoring and is used in almost every manufacturing step. Equipment such as EBI (Electron Beam Defect Detection), XPS (X-ray Photoelectron Spectroscopy), and LEXRF (Light Element X-ray Fluorescence Spectroscopy) all rely on a vacuum environment for measurement. This typically requires a highly stable vacuum environment to minimize interference from air fluctuations, particulate contamination, and oxidation reactions. Therefore, the relevant metrology equipment must be equipped with a dedicated chamber capable of maintaining a good vacuum level. To maintain the cleanliness and stable pressure inside the vacuum chamber while allowing for sample loading, unloading, and replacement, current technologies generally employ a transition structure with a transfer chamber. This transfer chamber acts as a buffer zone between the vacuum chamber and the external atmospheric environment. Through segmented vacuuming and venting cycles, the sample is transferred to the measurement station without significantly disrupting the internal environment of the main vacuum chamber. Although this structure effectively ensures the vacuum level of the core measurement area, its multi-chamber layout inevitably increases the overall complexity and physical size of the equipment, resulting in it occupying a large space in cleanrooms or laboratories, which places high demands on site layout and space utilization. Summary of the Invention

[0003] This application provides a semiconductor measurement device to solve the technical problem that the existing devices are large in size and occupy a lot of space.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0005] A semiconductor measurement device is provided, comprising:

[0006] A cavity having an opening for material inlet and outlet, and a valve for opening and closing the opening; the cavity is used to provide a vacuum environment;

[0007] A measuring component is installed in the cavity and communicates with the cavity;

[0008] A worktable, at least partially disposed within the cavity, is used to move materials placed in the cavity between the opening of the cavity and the measurement position corresponding to the measuring component.

[0009] A sealing component, installed in the cavity, is used to isolate the measuring component from the cavity before the vacuum environment of the cavity is broken, so as to seal the measuring component.

[0010] As a further improvement to the above technical solution:

[0011] Optionally, the sealing component is disposed opposite to the measuring component, and after the worktable is moved away from the measuring position, the sealing component can cover the measuring component to seal the measuring component.

[0012] Optionally, the sealing component includes:

[0013] A sealing element having a cover plate portion and a guide rod portion, the cover plate portion being able to cover the measuring component, one end of the guide rod portion being connected to the cover plate portion and movably passing through the cavity, the guide rod portion at least partially extending out of the cavity;

[0014] A sealing drive is installed on the outside of the cavity and is driven to connect with the guide rod to drive the sealing member to cover the measuring component or separate from the measuring component;

[0015] A sealing sleeve is telescopically connected between the cavity and the sealing drive member. A sealed space that can communicate with the cavity is formed inside the sealing sleeve, and the portion of the guide rod extending out of the cavity is disposed within the sealed space.

[0016] Optionally, the worktable includes a chuck, a four-axis motion component, and a drive component. The chuck and the four-axis motion component are disposed inside the cavity, and the drive component is disposed outside the cavity and is drivenly connected to the four-axis motion component.

[0017] Optionally, the four-axis motion component includes a first guide, a first slide, a first lead screw, and a first lead screw nut, and the driving component includes a first driving component;

[0018] The first guide extends along a first axial direction, and the first slide is slidably engaged with the first guide; the first lead screw is driven to connect with the first drive, and the first lead screw nut is connected to the first lead screw and to the first slide; the first drive drives the first lead screw to rotate, thereby driving the first lead screw nut to move on the first lead screw, thereby causing the first slide to move on the first guide.

[0019] Optionally, the four-axis motion component includes a second guide, a second slide, a second lead screw, a second lead screw nut, and a first transmission assembly, and the driving component includes a second driving component;

[0020] The second guide member is mounted on the first slide and extends along the second axis, and the second slide and the second guide member are slidably engaged; the second lead screw is mounted on the first slide, and the second lead screw nut is connected to the second lead screw and connected to the second slide; the first transmission assembly is tractively connected between the second lead screw and the second drive member; the second drive member drives the second lead screw to rotate through the first transmission assembly, so as to drive the second lead screw nut to move on the second lead screw, thereby driving the second slide to move on the second guide member.

[0021] Optionally, the first transmission assembly includes:

[0022] The first connector is connected to the first slide.

[0023] The first spline sleeve is rotatably inserted through the first connector and is connected to the second lead screw drive.

[0024] A first spline shaft passes through the first spline sleeve, and the first spline sleeve is slidably connected to the first spline shaft so as to slide on the first spline shaft as the first slide moves; the first spline shaft is driven to be connected to the second driving member so as to drive the first spline shaft to rotate the first spline sleeve, thereby transmitting the rotation of the first spline sleeve to the rotation of the second lead screw.

[0025] Optionally, the second slide has a mounting channel extending along a third axis, and the four-axis motion component further includes:

[0026] Lead screw spline shaft,

[0027] A ball screw assembly is installed in the mounting channel, and the ball screw assembly is used to drive the screw spline shaft to move along a third axis;

[0028] And / or, a ball spline assembly, mounted in the mounting channel, the ball spline assembly being used to drive the lead screw spline shaft to rotate about a third axis.

[0029] Optionally, the ball screw assembly includes a ball screw sleeve, a ball screw drive worm, a ball screw drive worm, and a ball screw drive shaft. The ball screw sleeve is installed in the mounting channel. The ball screw drive shaft passes through the ball screw drive worm and is splinedly connected to the ball screw drive worm. The ball screw drive worm meshes with the ball screw drive worm. The ball screw drive worm is connected to the ball screw sleeve to drive the ball screw sleeve to work. The ball screw spline shaft passes through the ball screw sleeve, and the ball screw sleeve is used to drive the ball screw spline shaft to move along a third axis.

[0030] Optionally, the driving component includes a third driving component, and the four-axis motion component further includes a second transmission assembly;

[0031] The second transmission assembly includes:

[0032] The second connector is connected to the first slide.

[0033] The second spline sleeve is rotatably inserted through the second connector and is connected to the ball screw drive shaft.

[0034] The second spline shaft passes through the second spline sleeve, and the second spline sleeve is slidably connected to the second spline shaft so as to slide on the second spline shaft as the first slide moves; the second spline shaft is driven to be connected to the third driving member so as to drive the second spline shaft to rotate the second spline sleeve, thereby transmitting the rotation of the second spline sleeve to the rotation of the ball screw drive shaft.

[0035] Optionally, the ball spline assembly includes a ball spline sleeve, a ball spline drive worm, a ball spline drive worm, and a ball spline drive shaft. The ball spline sleeve is installed in the mounting channel. The ball spline drive shaft passes through the ball spline drive worm and is splinedly connected to it. The ball spline drive worm meshes with the ball spline drive worm. The ball spline drive worm is connected to the ball spline sleeve to drive the ball spline sleeve to work. The lead screw spline shaft passes through the ball spline sleeve, and the ball spline sleeve drives the lead screw spline shaft to rotate around a third axis.

[0036] Optionally, the driving component includes a fourth driving component, and the four-axis motion component further includes a third transmission assembly;

[0037] The third transmission component includes:

[0038] The third connector is connected to the first slide.

[0039] The third spline sleeve is rotatably inserted through the third connector and is connected to the ball spline drive shaft.

[0040] The third spline shaft passes through the third spline sleeve, and the third spline sleeve is slidably connected to the third spline shaft so as to slide on the third spline shaft as the first slide moves; the third spline shaft is driven to be connected to the fourth driving member so as to drive the third spline shaft to rotate the third spline sleeve, thereby transmitting the rotation of the third spline sleeve to the rotation of the ball spline drive shaft.

[0041] Optionally, it also includes a magnetohydrodynamic (MHD) sealing coupling, the input end of which is connected to the drive component, and the output end of which is connected to the four-axis motion component.

[0042] Compared to existing technologies, the advantages of the semiconductor measurement device of this application are as follows:

[0043] The semiconductor measurement device of this application includes a cavity, a measuring component, a stage, and a sealing component. The cavity, as the main structure of the device, provides a vacuum environment to meet precision measurement requirements. The cavity has an opening for material entry and exit and is equipped with a valve to open and close the opening, achieving controllable isolation between the cavity and the external environment. The measuring component is mounted on the cavity and communicates with the internal space, responsible for performing precise measurements of the material in a vacuum environment. The stage is at least partially located inside the cavity, used to carry the material and move it back and forth between the cavity opening and the corresponding measuring position of the measuring component, completing operations such as material feeding, positioning, and removal. The sealing component is mounted on the cavity and has two operating states: when it is necessary to maintain a clean local environment for the measuring component or to break the vacuum of the main cavity, the sealing component can operate to isolate the measuring component from the main cavity space, thereby forming an effective seal for the measuring component; when a vacuum environment is established and maintained within the cavity, the sealing component separates from the measuring component, leaving a clear measurement path for the measurement process.

[0044] This application introduces a dynamically openable and closable sealing component, which eliminates the transfer chamber while still ensuring that the measuring component is isolated from the cavity environment that may be disturbed during the non-working phase. This simplifies the equipment structure and reduces the overall size while maintaining equipment performance, effectively saving equipment floor space. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 A three-dimensional structural schematic diagram of the semiconductor measurement equipment provided in this application;

[0047] Figure 2 A cross-sectional structural schematic diagram of the semiconductor measurement equipment provided in this application;

[0048] Figure 3 A partial structural diagram of the stage of the semiconductor measurement equipment provided in this application. Figure 1 ;

[0049] Figure 4 A partial structural diagram of the stage of the semiconductor measurement equipment provided in this application. Figure 2 ;

[0050] Figure 5 This is a cross-sectional view of the worktable of the semiconductor measurement equipment provided in this application.

[0051] The following are the labeling elements in the figure:

[0052] 1. Cavity; 11. Opening; 12. Valve;

[0053] 2. Measuring components;

[0054] 3. Worktable; 31. Chuck; 32. Four-axis motion component; 321. First guide; 322. First slide; 323. First lead screw; 324. First lead screw nut; 325. Second guide; 326. Second slide; 327. Second lead screw; 328. Second lead screw nut; 329. First transmission assembly; 3291. First connector; 3292. First spline sleeve; 3293. First spline shaft; 3210. Lead screw spline shaft; 3211. Ball screw assembly; 32111. Ball screw sleeve; 32112. Ball screw drive worm gear; 32113. Ball screw drive worm gear; 32114. Ball screw drive shaft; 3212, Ball spline assembly; 32121, Ball spline sleeve; 32122, Ball spline drive worm; 32123, Ball spline drive worm; 32124, Ball spline drive shaft; 3213, Second transmission assembly; 32131, Second connector; 32132, Second spline sleeve; 32133, Second spline shaft; 3214, Third transmission assembly; 32141, Third connector; 32142, Third spline sleeve; 32143, Third spline shaft; 33, Drive component; 331, First drive component; 332, Second drive component; 333, Third drive component; 334, Fourth drive component; 34, Magnetohydrodynamic sealing coupling;

[0055] 4. Sealing components; 41. Sealing element; 411. Cover plate; 412. Guide rod; 42. Sealing drive component; 43. Sealing sleeve. Detailed Implementation

[0056] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0057] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0059] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0060] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0061] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of the present invention.

[0062] In the following description, suffixes such as "circuit," "component," "part," or "unit" are used only for the purpose of illustrative purposes and have no specific meaning in themselves. Therefore, they can be used interchangeably.

[0063] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings.

[0064] To achieve a compact structure and effectively reduce the space occupied by semiconductor measurement equipment, this application provides a semiconductor measurement device. The improved concept of this device lies in eliminating the independent transfer chamber in the traditional layout, and reducing the overall size while ensuring the vacuum environment of the chamber and the measurement accuracy by optimizing the internal sealing and material transfer mechanism.

[0065] like Figure 1 and Figure 2 As shown, the semiconductor measurement device mainly includes a cavity 1, a measurement component 2, a worktable 3, and a sealing component 4.

[0066] The cavity 1, as the main structure of the equipment, is used to provide a vacuum environment to meet the requirements of precision measurement. The cavity 1 is provided with an opening 11 for material to enter and exit, and is equipped with a valve 12 that can open and close the opening 11 to achieve controllable isolation between the cavity 1 and the external environment.

[0067] The measuring component 2 is installed on the cavity 1 and communicates with the internal space, and is responsible for performing accurate measurement of materials in a vacuum environment.

[0068] The workbench 3 is at least partially located inside the cavity 1, and is used to carry materials and drive them to move back and forth between the opening 11 of the cavity 1 and the measurement position corresponding to the measuring component 2, so as to complete the feeding, positioning and removal of materials.

[0069] The sealing component 4 is installed in the cavity 1 and has two working states: when it is necessary to maintain the cleanliness of the local environment where the measuring component 2 is located or when it is necessary to break the vacuum of the main body of the cavity 1, the sealing component 4 can be activated to isolate the measuring component 2 from the main body of the cavity 1, thereby forming an effective sealing protection for the measuring component 2; when a vacuum environment is established and maintained in the cavity 1, the sealing component 4 is separated from the measuring component 2, leaving a smooth measurement path for the measurement process.

[0070] This application introduces a dynamically openable and closable sealing component 4, which eliminates the transfer chamber while still ensuring that the measuring component 2 is isolated from the cavity environment that may be disturbed during the non-working phase. This simplifies the equipment structure and reduces the overall volume while maintaining equipment performance, effectively saving equipment floor space.

[0071] like Figure 1 and Figure 2As shown in some specific embodiments of this application, the sealing component 4 and the measuring component 2 are arranged opposite to each other within the cavity 1. After the worktable 3 completes the measurement of the material and moves away from the measurement position, the sealing component 4 can move toward and cover the measuring component 2, thereby isolating the measuring end of the measuring component 2 from the internal space of the cavity 1 and achieving a reliable seal. This relative arrangement shortens the travel distance required for the sealing component 4 to switch between open and closed states, which not only improves the response speed of the sealing operation but also reduces the space occupied by the moving components within the cavity. Furthermore, it helps improve the alignment accuracy and sealing surface fit during closing, thereby enhancing the overall airtightness.

[0072] like Figure 1 and Figure 2 As shown, in some specific embodiments of this application, the sealing component 4 further includes a sealing element 41, a sealing drive element 42, and a sealing sleeve 43.

[0073] The sealing element 41 includes a cover plate portion 411 and a guide rod portion 412. The cover plate portion 411 is configured to cover the measuring port of the measuring component 2, thereby effectively isolating the measuring component 2 from the internal environment of the cavity 1. One end of the guide rod portion 412 is connected to the cover plate portion 411, and the other end is movably inserted through the wall of the cavity 1 and extends at least partially to the outside of the cavity 1.

[0074] The sealing drive 42 is installed on the outside of the cavity 1 and is connected to the guide rod 412 to provide power to drive the seal 41 to perform the closing or opening action; the sealing drive 42 can be a hydraulic cylinder, pneumatic cylinder or electric push rod and other drive devices.

[0075] To maintain the vacuum integrity of cavity 1, the sealing sleeve 43 is configured as a telescopic structure, with its two ends respectively sealed to the outer wall of cavity 1 and the movable end of sealing drive 42, thereby forming a sealed space inside that can communicate with cavity 1. This sealed space completely covers the part of guide rod 412 that extends out of cavity 1.

[0076] Since the guide rod 412 needs to reciprocate relative to the cavity 1, there will inevitably be a gap between them, which may become a leakage path that damages the vacuum. By setting a sealing sleeve 43, the moving parts are isolated from the external atmosphere, and the movement of the guide rod 412 can be accommodated, thereby effectively avoiding the problem of vacuum drop or external gas intrusion caused by the gap.

[0077] like Figure 2As shown in some specific embodiments of this application, the worktable 3 specifically includes a chuck 31 for supporting materials, a four-axis motion component 32, and a drive component 33 as a power source. The chuck 31 and the four-axis motion component 32 are both housed inside the cavity 1 and operate in a vacuum environment; while the drive component 33 is located outside the cavity 1. The drive component 33 passes through the wall of the cavity 1 via a specific transmission mechanism (such as a magnetohydrodynamic sealing coupling 34 or a spline transmission assembly) to establish a drive connection with the internal four-axis motion component 32, thereby transmitting power to the vacuum cavity, driving the four-axis motion component 32 to move the material within the cavity 1, and ultimately positioning the material at the measurement position corresponding to the measurement component 2.

[0078] By placing the drive unit 33 on the outside of the cavity 1, it can be prevented from operating in a vacuum environment, fundamentally eliminating the vacuum arcing phenomenon that may occur due to medium breakdown, and greatly improving the safety and reliability of equipment operation. Secondly, there is no need to lay any power cables or control cables for the drive unit 33 inside the cavity 1. This not only simplifies the internal structural layout of the cavity 1 and reduces the complexity of the vacuum sealing design, but more importantly, it avoids a series of problems such as gas release, aging, and connection failure that may occur with cables and their connectors in a vacuum environment, thus improving the long-term operational stability of the equipment in a vacuum environment.

[0079] like Figure 3 and Figure 4 As shown, in some specific embodiments of this application, the four-axis motion component 32 includes a component for realizing the first axial motion. The component includes a first guide 321, a first slide 322, a first lead screw 323 and a first lead screw nut 324, and is powered by a first drive component 331 located outside the cavity 1.

[0080] The first guide member 321 is installed on the inner wall of the cavity 1 along a first axial direction, such as the X-axis in a spatial coordinate system, and its function is to provide motion guidance; specifically, it can be a guide rail. The first slide block 322 forms a sliding engagement with the first guide member 321. The first lead screw 323 is rotatably mounted, its axis is parallel to the first guide member 321, and one end is drivenly connected to the first drive member 331. The first lead screw nut 324 is screwed onto the first lead screw 323 and simultaneously maintains a fixed connection with the first slide block 322. The first drive member 331 can specifically be a stepper motor or a servo motor.

[0081] When the first driving member 331 is activated, it will drive the first lead screw 323 to rotate around its axis. This rotational motion is converted into linear motion along the axis of the first lead screw 323 by the first lead screw nut 324, thereby driving the first slide block 322 to move along the first guide member 321.

[0082] like Figure 3 andFigure 4 As shown, in some specific embodiments of this application, the four-axis motion component 32 further includes a component for realizing a second axial motion, which includes a second guide 325, a second slide 326, a second lead screw 327, a second lead screw nut 328, and a first transmission component 329, and is powered by a second drive component 332.

[0083] The second guide member 325 is specifically a guide rail mounted on the first slide 322, extending along a second axis perpendicular to the first axis, such as the Y-axis in a spatial coordinate system. The second slide 326 slides in cooperation with the second guide member 325, enabling movement in this direction. The second lead screw 327 is rotatably supported on the first slide 322, with its axis parallel to the second guide member 325. The second lead screw nut 328 is screwed onto the second lead screw 327 and connected to the second slide 326. The second drive member 332 is located outside the cavity 1, and its output power is transmitted to the second lead screw 327 through the first transmission assembly 329, thereby driving the second lead screw 327 to rotate. The rotational motion of the second lead screw 327 is converted into linear motion by the second lead screw nut 328, which in turn drives the second slide 326 and its load to move along the second guide member 325. The second drive member 332 can be a stepper motor or a servo motor, etc. This nested motion structure enables the worktable 3 to perform two-dimensional movement and positioning within the plane defined by the first and second axes.

[0084] like Figure 3 and Figure 4 As shown, in some specific embodiments of this application, since the second lead screw 327 is mounted on the first slide block 322 which can move along the first axis, while the second drive member 332 is fixedly mounted on the cavity 1, there is a relative displacement between the two. To solve this power transmission problem, a first transmission assembly 329 is provided, the function of which is to stably and flexibly transmit the rotational power output by the second drive member 332 to the second lead screw 327 whose position changes.

[0085] The first transmission assembly 329 specifically includes a first connecting member 3291, a first spline sleeve 3292, and a first spline shaft 3293. The first connecting member 3291 is fixedly connected to the first slide block 322 and moves with it. The first spline sleeve 3292 is rotatably supported in the first connecting member 3291, and one end of it is connected to the second lead screw 327 through a structure such as bevel gear meshing, helical gear meshing, or universal coupling. The first spline shaft 3293 is drivenly connected to the output end of the second driving member 332, and a portion of its shaft section passes through the inner hole of the first spline sleeve 3292. The two form a circumferential transmission fit that can slide axially through the spline pair.

[0086] When the second driving component 332 operates, it drives the first spline shaft 3293 to rotate. The torque is transmitted to the first spline sleeve 3292 through the spline pair, which in turn drives the second lead screw 327 to rotate. During this process, when the first slide block 322 drives the second lead screw 327 and the first connecting component 3291 to move along the first axial direction, the first spline sleeve 3292 can slide freely on the first spline shaft 3293, thereby effectively compensating for the relative displacement between the two, ensuring the continuity and reliability of power transmission, and at the same time not affecting the normal rotation of the second lead screw 327.

[0087] like Figures 3 to 5 As shown, in some specific embodiments of this application, the second slide 326 is provided with a mounting channel extending along the third axis, for example, the Z-axis direction in a spatial coordinate system. The four-axis motion component 32 further integrates a lead screw spline shaft 3210, a ball screw assembly 3211, and / or a ball spline assembly 3212 to realize linear motion along the third axis and rotational motion about the axis.

[0088] The chuck 31 is fixedly installed at the end of the lead screw spline shaft 3210 to support materials. The ball screw assembly 3211 is disposed in the mounting channel, and its nut part engages with the threaded section on the lead screw spline shaft 3210. When the ball screw assembly 3211 is driven, it can convert the rotational motion into linear movement of the lead screw spline shaft 3210 along the third axis, thereby realizing the lifting and positioning of materials.

[0089] The ball spline assembly 3212 is also located in the mounting channel, while the spline nut part cooperates with the spline section on the lead screw spline shaft 3210, so that the lead screw spline shaft 3210 can transmit torque and rotate precisely around the third axis under the constraint of the spline pair, thereby realizing the angle adjustment of the chuck 31 and the material.

[0090] Through the coordinated or selective configuration of the ball screw assembly 3211 and the ball spline assembly 3212, the screw spline shaft 3210 can achieve two degrees of freedom of motion: translation along the Z-axis and rotation about the Z-axis.

[0091] like Figures 3 to 5As shown in some specific embodiments of this application, the ball screw assembly 3211 specifically includes a ball screw sleeve 32111, a ball screw drive worm gear 32112, a ball screw drive worm 32113, and a ball screw drive shaft 32114. The ball screw sleeve 32111 is installed in the mounting channel of the second slide 326. The ball screw drive shaft 32114 passes through the ball screw drive worm gear 32113, and the two are connected by a spline pair, so that the ball screw drive worm gear 32113 can rotate together with the ball screw drive shaft 32114, while allowing the ball screw drive worm gear 32113 to have a degree of freedom of movement along the axial direction of the ball screw drive shaft 32114. The ball screw drive worm 32112 and the ball screw drive worm 32113 mesh with each other to form a worm gear transmission pair, and the ball screw drive worm 32112 maintains a transmission connection with the ball screw sleeve 32111. The screw spline shaft 3210 passes through the ball screw sleeve 32111, and its threaded section mates with the ball nut inside the ball screw sleeve 32111.

[0092] When the ball screw drive shaft 32114 is driven to rotate, it drives the ball screw drive worm 32113 to rotate, which in turn drives the meshing ball screw drive worm 32112 to rotate. The rotational motion of the ball screw drive worm 32112 is ultimately converted into the rotation of the ball screw sleeve 32111. Since the rotation of the ball screw sleeve 32111 is constrained, according to the ball screw transmission principle, this rotation will force the threaded spline shaft 3210 to produce linear motion along the third axis.

[0093] like Figures 3 to 5 As shown in some specific embodiments of this application, in order to drive the ball screw assembly 3211 to work, the driving member 33 further includes a third driving member 333, and the four-axis motion component 32 is also provided with a second transmission assembly 3213 for transmitting power. The second transmission assembly 3213 includes a second connector 32131, a second spline sleeve 32132, and a second spline shaft 32133.

[0094] The second connecting member 32131 is connected to the first slide block 322. The second spline sleeve 32132 is rotatably inserted into the second connecting member 32131, and one end of it is connected to the ball screw drive shaft 32114 through a structure such as bevel gear meshing, helical gear meshing, or universal coupling. The second spline shaft 32133 is inserted into the second spline sleeve 32132, and the two form a circumferential transmission fit that allows axial relative sliding through the spline pair. The input end of the second spline shaft 32133 is drivenly connected to the third drive member 333.

[0095] When the third drive member 333 is working, it drives the second spline shaft 32133 to rotate. The torque is transmitted to the second spline sleeve 32132 through the spline pair, which in turn drives the ball screw drive shaft 32114 to rotate. Since the first slide block 322 drives the second connecting member 32131 and the associated ball screw drive shaft 32114 to move along the first axis, and the third drive member 333 is fixedly installed, the second spline sleeve 32132 can slide on the second spline shaft 32133 accordingly, thereby automatically compensating for the relative displacement and ensuring that the power of the third drive member 333 can still be continuously and stably transmitted when the position of the ball screw drive shaft 32114 changes.

[0096] like Figures 3 to 5 As shown, in some specific embodiments of this application, the ball spline assembly 3212 specifically includes a ball spline sleeve 32121, a ball spline drive turbine 32122, a ball spline drive worm 32123, and a ball spline drive shaft 32124.

[0097] The ball spline sleeve 32121 is installed in the mounting channel of the second slide 326. The ball spline drive shaft 32124 passes through the ball spline drive worm 32123, and the two are connected by a spline pair, allowing the ball spline drive worm 32123 to rotate with the ball spline drive shaft 32124, while also allowing the ball spline drive worm 32123 to have a degree of freedom of movement along the axial direction of the ball spline drive shaft 32124. The ball spline drive worm 32122 meshes with the ball spline drive worm 32123 to form a worm gear reduction mechanism, and the ball spline drive worm 32122 maintains a transmission connection with the ball spline sleeve 32121. The lead screw spline shaft 3210 passes through the ball spline sleeve 32121, and its outer spline section mates with the spline nut inside the ball spline sleeve 32121.

[0098] When the ball spline drive shaft 32124 is driven to rotate, it drives the ball spline drive worm gear 32123 to rotate, which in turn drives the ball spline drive worm gear 32122 to rotate. The rotational motion of the ball spline drive worm gear 32122 is ultimately transmitted to the ball spline sleeve 32121, causing it to rotate. The rotation of the ball spline sleeve 32121 is transmitted to the lead screw spline shaft 3210 through its internal spline nut pair, thereby driving the lead screw spline shaft 3210 and the chuck 31 mounted at its end to rotate around the third axis.

[0099] like Figures 3 to 5 As shown in some specific embodiments of this application, in order to drive the ball spline assembly 3212 to work, the drive member 33 further includes a fourth drive member 334, and the four-axis motion component 32 is also provided with a third transmission assembly 3214 for transmitting power.

[0100] The third transmission assembly 3214 includes a third connector 32141, a third spline sleeve 32142, and a third spline shaft 32143. The third connector 32141 is fixedly connected to the first slide block 322. The third spline sleeve 32142 is rotatably supported in the third connector 32141 by bearings, and one end of the sleeve is connected to the ball spline drive shaft 32124 via a structure such as bevel gear meshing, helical gear meshing, or universal coupling. The third spline shaft 32143 passes through the third spline sleeve 32142, and the two form an axially sliding transmission fit through a spline pair. The input end of the third spline shaft 32143 is drivenly connected to the fourth drive component 334.

[0101] When the fourth drive member 334 operates, it drives the third spline shaft 32143 to rotate. The torque is transmitted to the third spline sleeve 32142 through the spline pair, which in turn drives the ball spline drive shaft 32124 to rotate. Since the first slide 322 drives the entire ball spline assembly 3212 and the third connecting member 32141 to move along the first axis, and the fourth drive member 334 is fixedly installed on the cavity 1, the third spline sleeve 32142 can slide freely on the third spline shaft 32143. This effectively compensates for the relative displacement between the power output end and the execution end, ensuring that the ball spline drive shaft 32124 can obtain a stable and reliable power input in any working position to drive the lead screw spline shaft 3210 to achieve rotational motion.

[0102] like Figures 3 to 5 As shown in some specific embodiments of this application, the worktable 3 further includes a magnetohydrodynamic (MHD) sealed coupling 34. This coupling utilizes the special properties of magnetohydrodynamics under the influence of a magnetic field to achieve non-contact transmission of rotational power while providing extremely high sealing performance. The input end of the MHD sealed coupling 34 is connected to the output shaft of the drive member 33 located outside the cavity 1, while its output end passes through the wall of the cavity 1 and is connected to the corresponding input shaft of the four-axis motion member 32 inside the cavity 1. By employing the MHD sealed coupling 34, the rotational motion of the drive member 33 can be effectively transmitted to the motion member within the vacuum environment. At the same time, the coupling can reliably isolate the vacuum environment inside the cavity 1 from the external atmospheric environment, effectively preventing gas leakage through the gap at the transmission shaft penetration point.

[0103] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A semiconductor measurement device, characterized in that, include: The cavity (1) has an opening (11) for material inlet and outlet, and a valve (12) for opening and closing the opening (11); the cavity (1) is used to provide a vacuum environment; The measuring component (2) is installed in the cavity (1) and communicates with the cavity (1); The worktable (3) is at least partially located inside the cavity (1). The worktable (3) is used to move the material placed in the cavity (1) between the opening (11) of the cavity (1) and the measurement position corresponding to the measuring component (2). A sealing component (4) is installed in the cavity (1). The sealing component (4) is arranged opposite to the measuring component (2). After the worktable (3) is moved away from the measuring position, the sealing component (4) can cover the measuring component (2) to seal the measuring component (2). After the worktable (3) completes the measurement of the material and moves away from the measurement position, the sealing component (4) can move toward the measuring component (2) and cover it, thereby isolating the measuring end of the measuring component (2) from the internal space of the cavity (1); before maintaining the local environment where the measuring component (2) is located, or before breaking the vacuum environment of the cavity (1), the sealing component (4) is used to separate the measuring component (2) from the cavity (1) to seal the measuring component (2); when a vacuum environment is established and maintained in the cavity (1), the sealing component (4) separates from the measuring component (2); The sealing component (4) includes: The sealing element (41) has a cover plate portion (411) and a guide rod portion (412). The cover plate portion (411) can cover the measuring component (2). One end of the guide rod portion (412) is connected to the cover plate portion (411) and is movably inserted through the cavity (1). The guide rod portion (412) extends at least partially out of the cavity (1). A sealing drive (42) is installed on the outside of the cavity (1) and driven to connect with the guide rod (412) to drive the sealing (41) to cover the measuring component (2) or separate from the measuring component (2); A sealing sleeve (43) is telescopically connected between the cavity (1) and the sealing drive (42). A sealed space that can communicate with the cavity (1) is formed inside the sealing sleeve (43). The part of the guide rod (412) that extends out of the cavity (1) is located in the sealed space.

2. The semiconductor measurement device as described in claim 1, characterized in that, The worktable (3) includes a chuck (31), a four-axis motion component (32), and a drive component (33). The chuck (31) and the four-axis motion component (32) are located inside the cavity (1), and the drive component (33) is located outside the cavity (1) and is drivenly connected to the four-axis motion component (32).

3. The semiconductor measurement device as described in claim 2, characterized in that, The four-axis motion component (32) includes a first guide (321), a first slide (322), a first lead screw (323), and a first lead screw nut (324), and the drive component (33) includes a first drive component (331); The first guide member (321) extends along the first axial direction, and the first slide block (322) is slidably engaged with the first guide member (321); the first lead screw (323) is drivenly connected to the first drive member (331), and the first lead screw nut (324) is connected to the first lead screw (323) and to the first slide block (322); the first drive member (331) drives the first lead screw (323) to rotate, thereby driving the first lead screw nut (324) to move on the first lead screw (323), thereby driving the first slide block (322) to move on the first guide member (321).

4. The semiconductor measurement device as described in claim 3, characterized in that, The four-axis motion component (32) includes a second guide (325), a second slide (326), a second lead screw (327), a second lead screw nut (328), and a first transmission assembly (329); the drive component (33) includes a second drive component (332). The second guide member (325) is mounted on the first slide (322) and extends along the second axis. The second slide (326) is slidably engaged with the second guide member (325). The second lead screw (327) is mounted on the first slide (322). The second lead screw nut (328) is connected to the second lead screw (327) and connected to the second slide (326). The first transmission assembly (329) is tractively connected between the second lead screw (327) and the second drive member (332). The second drive member (332) drives the second lead screw (327) to rotate through the first transmission assembly (329) so as to drive the second lead screw nut (328) to move on the second lead screw (327), thereby driving the second slide (326) to move on the second guide member (325).

5. The semiconductor measurement device as described in claim 4, characterized in that, The first transmission assembly (329) includes: The first connector (3291) is connected to the first slide (322). The first spline sleeve (3292) is rotatably inserted through the first connector (3291) and is connected to the second lead screw (327) for transmission. The first spline shaft (3293) is inserted into the first spline sleeve (3292). The first spline sleeve (3292) is slidably connected to the first spline shaft (3293) so that it slides on the first spline shaft (3293) as the first slide block (322) moves. The first spline shaft (3293) is driven to be connected to the second drive member (332) so as to drive the first spline shaft (3293) to rotate the first spline sleeve (3292), thereby transmitting the rotation of the first spline sleeve (3292) to the second lead screw (327) to rotate.

6. The semiconductor measurement device as described in claim 4, characterized in that, The second slide (326) has a mounting channel extending along a third axis, and the quadrilateral motion component (32) further includes: Lead screw spline shaft (3210). A ball screw assembly (3211) is installed in the mounting channel, the ball screw assembly (3211) being used to drive the screw spline shaft (3210) to move along a third axis; And / or, a ball spline assembly (3212), mounted in the mounting channel, the ball spline assembly (3212) being used to drive the lead screw spline shaft (3210) to rotate about a third axis.

7. The semiconductor measurement device as described in claim 6, characterized in that, The ball screw assembly (3211) includes a ball screw sleeve (32111), a ball screw drive worm (32112), a ball screw drive worm (32113), and a ball screw drive shaft (32114). The ball screw sleeve (32111) is installed in the mounting channel, and the ball screw drive shaft (32114) passes through the ball screw drive worm (32113) and is splinedly connected to the ball screw drive worm (32113). The ball screw drive worm (32112) meshes with the ball screw drive worm (32113), and the ball screw drive worm (32112) is connected to the ball screw sleeve (32111) to drive the ball screw sleeve (32111) to work. The screw spline shaft (3210) passes through the ball screw sleeve (32111), and the ball screw sleeve (32111) is used to drive the screw spline shaft (3210) to move along the third axis.

8. The semiconductor measurement device as described in claim 7, characterized in that, The drive unit (33) includes a third drive unit (333), and the four-axis motion component (32) further includes a second transmission assembly (3213). The second transmission assembly (3213) includes: The second connector (32131) is connected to the first slide (322). The second spline sleeve (32132) is rotatably inserted through the second connector (32131) and is connected to the ball screw drive shaft (32114) for transmission. The second spline shaft (32133) passes through the second spline sleeve (32132), and the second spline sleeve (32132) is slidably connected to the second spline shaft (32133) so as to slide on the second spline shaft (32133) as the first slide (322) moves; the second spline shaft (32133) is driven to be connected to the third drive member (333) so as to drive the second spline shaft (32133) to drive the second spline sleeve (32132) to rotate, thereby transmitting the rotation of the second spline sleeve (32132) to the ball screw drive shaft (32114) to rotate.

9. The semiconductor measurement device as described in claim 6, characterized in that, The ball spline assembly (3212) includes a ball spline sleeve (32121), a ball spline drive worm (32122), a ball spline drive worm (32123), and a ball spline drive shaft (32124). The ball spline sleeve (32121) is installed in the mounting channel, and the ball spline drive shaft (32124) passes through the ball spline drive worm (32123) and is splinedly connected to the ball spline drive worm (32123). The ball spline drive worm (32122) meshes with the ball spline drive worm (32123), and the ball spline drive worm (32122) is connected to the ball spline sleeve (32121) to drive the ball spline sleeve (32121) to work. The lead screw spline shaft (3210) passes through the ball spline sleeve (32121), and the ball spline sleeve (32121) is used to drive the lead screw spline shaft (3210) to rotate around the third axis.

10. The semiconductor measurement device as described in claim 9, characterized in that, The drive unit (33) includes a fourth drive unit (334), and the four-axis motion component (32) further includes a third transmission assembly (3214). The third transmission assembly (3214) includes: The third connector (32141) is connected to the first slide (322). The third spline sleeve (32142) is rotatably inserted through the third connector (32141) and is connected to the ball spline drive shaft (32124) for transmission. The third spline shaft (32143) passes through the third spline sleeve (32142), and the third spline sleeve (32142) is slidably connected to the third spline shaft (32143) so as to slide on the third spline shaft (32143) as the first slide (322) moves; the third spline shaft (32143) is driven to be connected to the fourth drive member (334) so ​​as to drive the third spline shaft (32143) to drive the third spline sleeve (32142) to rotate, thereby transmitting the rotation of the third spline sleeve (32142) to the rotation of the ball spline drive shaft (32124).

11. The semiconductor measurement device as described in claim 2, characterized in that, It also includes a magnetic fluid sealing coupling (34), the input end of which is connected to the drive unit (33), and the output end of which is connected to the four-axis motion component (32).

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