Thinned wafer extracting and conveying mechanism

Abstract

The invention discloses a thinned wafer extracting and conveying mechanism, which comprises a clamping mechanism mounting rack, a suspender, two longitudinal walls, a longitudinal driving mechanism, two horizontal guide rails and a horizontal driving mechanism, and is characterized in that the clamping mechanism mounting rack is suspended below the suspender, a thinned wafer clamping mechanism is arranged in the clamping mechanism mounting rack, and longitudinal slide blocks slidably arranged on the longitudinal guide rails of the longitudinal walls are arranged on two sides of the clamping mechanism mounting rack; gears meshed with longitudinal racks on the side surfaces of the longitudinal walls are respectively arranged at two ends of the lifting rod; a rod end belt pulley connected with a machine end belt pulley on a machine shaft of the longitudinal driving mechanism through a belt is arranged in the middle of the lifting rod; a horizontal sliding block at the bottom of the longitudinal wall is slidably arranged on the horizontal guide rail; and the horizontal driving mechanism is in driving connection with one longitudinal wall. The thinned wafer extracting and conveying mechanism can drive the thinned wafer clamping mechanism to move in the longitudinal direction and the horizontal direction, the thinned wafer clamping mechanism can be driven to go deep into and get close to the thinned wafer through longitudinal movement, then the thinned wafer is guided and clamped, and the stability of the thinned wafer during transferring is greatly improved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment technology, and specifically relates to a thinned wafer extraction and transport mechanism. Background Technology

[0002] A silicon wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Silicon wafers are the carrier used in the production of integrated circuits, and generally refer to monocrystalline silicon wafers. Monocrystalline silicon wafers are made by drawing and refining ordinary silicon sand, followed by a series of processes including dissolution, purification, and distillation to produce monocrystalline silicon rods. After polishing and slicing, the monocrystalline silicon rods become wafers. During the wafer manufacturing process, the wafers typically need to be cleaned and dried. First, the wafers are placed in a transfer box, then the transfer box is immersed in a cleaning solution according to the process specifications to clean the wafers. Finally, the cleaned wafers are placed in an oven to bake and dry.

[0003] This necessitates repeatedly moving and placing wafers into different cassettes during different processes. In existing technology, the wafer cassette transfer process typically involves a lifting mechanism to first lift the wafer from its corresponding set of cassettes, then placing it into a basket. A robotic arm then clamps the basket on opposite sides and moves it axially to another set of cassettes. When the wafer is thin, the lifting mechanism supports the lower part of the thinned wafer, causing the upper part to wobble and potentially clump together, rendering the wafer unusable. Summary of the Invention

[0004] The present invention addresses the technical problem that existing wafer extraction and transport mechanisms are not suitable for thinner wafers and cannot guarantee the stability of thinned wafers during transport, resulting in the scrapping of thinned wafers. The purpose is to provide a thinned wafer extraction and transport mechanism.

[0005] The thinned wafer extraction and transport mechanism of the present invention includes:

[0006] A clamping mechanism mounting frame is provided with at least one thinning wafer clamping mechanism, and longitudinal sliders are provided on both sides of the clamping mechanism mounting frame;

[0007] A horizontally positioned boom is provided, with the clamping mechanism mounting frame suspended below the boom. Gears are provided at both ends of the boom, and a boom end pulley is provided in the middle of the boom.

[0008] Two longitudinal walls are symmetrically spaced apart. The sides of the longitudinal walls are provided with longitudinal racks and longitudinal guide rails. The gear of the lifting rod is meshed with the longitudinal rack. The longitudinal slider of the clamping mechanism mounting frame is slidably mounted on the longitudinal guide rail. The bottom of the two longitudinal walls is provided with horizontal sliders respectively.

[0009] A longitudinal drive mechanism, wherein a machine end pulley is provided on the machine shaft of the longitudinal drive mechanism, and the rod end pulley is connected to the machine end pulley by a belt;

[0010] Two horizontal guide rails are arranged in parallel intervals, and the horizontal slider at the bottom of the longitudinal wall slides on the horizontal guide rails;

[0011] The horizontal drive mechanism is connected to one of the longitudinal walls.

[0012] Preferably,

[0013] The horizontal drive mechanism is a cylinder module, which includes a cylinder, a cylinder module moving seat, and a transport slider. The transport slider is slidably mounted on the cylinder module moving seat and is driven by the cylinder.

[0014] A connecting block is provided on one side of the longitudinal wall, and the connecting block is connected to the transport slider.

[0015] Preferably, the longitudinal drive mechanism is a longitudinal drive servo motor.

[0016] Preferably, the clamping mechanism mounting bracket has:

[0017] The wafer thinning clamping mechanism is mounted on the frame base;

[0018] The top plate of the frame is fixed with the suspension rod, and two longitudinal sliders are respectively located on both sides of the top plate of the frame.

[0019] At least two pairs of connecting columns, with their lower ends connected to the frame base and their upper ends connected to the frame top plate;

[0020] A protective cover is installed on the top plate of the frame.

[0021] Preferably, the wafer thinning clamping mechanism comprises, from top to bottom:

[0022] Two upper clamping walls are symmetrically arranged on the upper part of the mechanism, and the upper clamping walls have longitudinally spaced upper toothed grooves;

[0023] Two rotatable central support walls are symmetrically arranged in the middle of the mechanism. The central support walls have longitudinally spaced central toothed grooves, and the central support walls are respectively provided with a first and a second rotating shaft.

[0024] Two lower guide walls are symmetrically arranged at the bottom of the mechanism. The lower guide walls have longitudinally spaced lower tooth grooves, wherein the corresponding upper tooth groove, middle tooth groove and lower tooth groove are all in the same plane in the longitudinal direction.

[0025] The wafer thinning clamping mechanism further includes:

[0026] The drive cylinder is located outside the base of the clamping mechanism mounting bracket;

[0027] The four-bar linkage is composed of the first and second rotating shafts forming the two frame shafts of the four-bar linkage. The drive cylinder drives the four-bar linkage so that the first rotating shaft and the second rotating shaft rotate in opposite directions.

[0028] Preferably, the rotatable central support wall has:

[0029] Wafer entry / exit positions are aligned in a straight line with the upper clamping wall and the lower guide wall;

[0030] After rotation, the wafer support position forms an obtuse angle with the upper clamping wall.

[0031] Preferably, the four-bar linkage further includes:

[0032] The first and second connecting rods are fixed on the first and second rotating shafts, and the connecting rod is connected between the first and second connecting rods.

[0033] Preferably, the first connecting rod is located above the first rotating axis, and the second connecting rod is located below the second rotating axis.

[0034] Preferably, the piston rod of the drive cylinder is driven to be connected to the first rotating shaft via a transition rod. One end of the transition rod is fixedly connected to the second end of the first connecting rod. The lower middle part of the first connecting rod is fixedly connected to the first rotating shaft in a non-rotatable manner. The first end of the first connecting rod is pivotally connected to one end of the connecting rod. The other end of the transition rod is pivotally connected to the piston rod of the cylinder.

[0035] The positive and progressive effects of this invention are as follows:

[0036] 1) This invention designs a thinning wafer clamping mechanism with two upper clamping walls, two rotatable middle support walls, and two lower guide walls. By rotating the middle support walls, when they are aligned longitudinally with the upper clamping walls and lower guide walls (i.e., when the wafer is in the entry / exit position), the wafer can be guided into or out by the lower guide walls. This is particularly suitable for thinning wafers with poor stability. When the middle support walls are rotated to form an obtuse angle with the upper clamping walls (i.e., when the wafer is in the lifting position), the thinning wafer that has been guided into the wafer can be effectively lifted and clamped, preventing the thinning wafer from shaking during the process of entering or exiting the conversion box, thereby improving the yield of thinning wafers. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the overall structure of the wafer thinning transfer box conversion device of the present invention;

[0038] Figure 2This is a front view of the thinned wafer extraction and transport mechanism of the present invention located at the first opening position;

[0039] Figure 3 This is a front view of the thinned wafer extraction and transport mechanism of the present invention located at the second opening position;

[0040] Figure 4A This is a schematic diagram of the thinned wafer extraction and transport mechanism of the present invention;

[0041] Figure 4B This is a front view of the thinned wafer extraction and transport mechanism of the present invention before longitudinal driving;

[0042] Figure 4C This is a front view of the thinned wafer extraction and transport mechanism of the present invention after longitudinal driving;

[0043] Figure 4D This is a schematic diagram of the longitudinal drive mechanism structure of the present invention;

[0044] Figure 4E This is another schematic diagram of the longitudinal drive mechanism of the present invention;

[0045] Figure 4F for Figure 4D A magnified view of a portion of the image;

[0046] Figure 4G This is a schematic diagram of the horizontal drive mechanism of the present invention;

[0047] Figure 5A This is a schematic diagram of the wafer thinning clamping mechanism of the present invention;

[0048] Figure 5B This is a front view of the wafer thinning clamping mechanism of the present invention;

[0049] Figure 5C This is a side view of the wafer thinning clamping mechanism of the present invention;

[0050] Figure 5D For along Figure 5B The dashed cross-section shows a schematic diagram of the wafer support position.

[0051] Figure 5E For along Figure 5B The dashed cross-section shows a schematic diagram of the wafer in / out position.

[0052] Figure 6A This is a flowchart of the wafer thinning transfer box conversion method of the present invention;

[0053] Figure 6B This is a flowchart of the thinning wafer transfer box conversion method of the present invention. Detailed Implementation

[0054] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0055] like Figure 1 As shown, the wafer thinning transfer box conversion device of the present invention includes a worktable 1, a first lifting mechanism 2a, a second lifting mechanism 2b, and a wafer thinning extraction and transport mechanism 3. The worktable 1 has a first opening 11 for placing the first wafer thinning transfer box and a second opening 12 for placing the second wafer thinning transfer box. The first lifting mechanism 2a is installed below the first opening 11 and can pass through the first opening 11 to lift the wafer thinning in the first wafer thinning transfer box at the first opening 11 upward. The second lifting mechanism 2b is installed below the second opening 12 and can pass through the second opening 12 to receive the wafer thinning moved to the second opening 12 and place it downward into the second wafer thinning transfer box.

[0056] Specifically, continue as follows Figure 2 and Figure 3As shown, both the first and second lifting mechanisms include a wafer lifting mechanism 21 and a wafer carrying mechanism 22. The wafer lifting mechanism 21 is fixed below the worktable. Further, one side of the wafer lifting mechanism 21 is fixed to the side wall below the worktable 11. The wafer carrying mechanism 22 is mounted on the top of the wafer lifting mechanism 21 and is respectively located below the first opening 11 and the second opening 12. The wafer lifting mechanism 21 can drive the corresponding wafer carrying mechanism 22 to lift up and down within the first opening 11 and the second opening 12. In this example, the wafer lifting mechanism 21 is a vertically lifting screw slide module, but it could also be other vertically lifting mechanisms. A mounting platform 211 that can follow the slide is provided on the screw linear slide. The wafer carrying mechanism 22 is fixed on the mounting platform 211, and thus the mounting platform 211 of the wafer lifting mechanism 21 drives the wafer carrying mechanism 22 to move up and down below the first opening 11 or the second opening 12. The wafer carrier mechanism 22 includes a support rod 221 and a wafer stage 222 for carrying the thinned wafers. The bottom end of the support rod 221 is fixed to the mounting stage 211, and the wafer stage 222 is fixedly mounted on the top end of the support rod 221. Furthermore, two support rods 221 and wafer stages 222 are arranged side-by-side on the mounting stage 211, and both wafer stages 22 are located below either a first thinned wafer transfer box or a second thinned wafer transfer box arranged side-by-side. It should be noted that the number of wafer stages 222 is not fixed, as long as it corresponds to the number of thinned wafer transfer boxes on the worktable 10. The mounting platform 211 on the wafer lifting mechanism 21 drives the wafer stage 222 on the support rod 221 to pass through the first opening 11 and the bottom of the first thinned wafer transfer box, lifting the thinned wafer in the first thinned wafer transfer box upwards, or passing through the second opening 12 and the bottom of the second thinned wafer transfer box, receiving the thinned wafer above the second thinned wafer transfer box 52 and placing it downwards into the second thinned wafer transfer box 52. Furthermore, the top of the wafer stage 222 has a tilting clamp with several slots for securing the thinned wafer, facilitating its fixation and support.

[0057] In this example, continuing as follows Figures 4A-4GAs shown, the thinned wafer extraction and transport mechanism 3 is mounted above the worktable 1. The wafer extraction and transport mechanism 3 has a clamping mechanism mounting frame 31, a lifting rod 32, two longitudinal walls 33, two horizontally spaced guide rails 34, a longitudinal drive mechanism 35, and a horizontal drive mechanism 36. The horizontally arranged lifting rod 32 is driven and connected to the longitudinal drive mechanism 35. Specifically, the middle of the lifting rod 32 is provided with a rod end pulley 321, while the shaft of the longitudinal drive mechanism 35 is provided with a machine end pulley. The rod end pulley 321 and the machine end pulley are connected by a belt drive. That is to say, when the longitudinal drive mechanism 35 is driven, the lifting rod 32 can be driven to rotate by the machine end pulley, the belt, and the rod end pulley 321 in sequence. Gears 322 are provided at both ends of the lifting rod 32, and longitudinal racks 331 that can be meshed with the gears 322 are provided on the inner side walls of the two longitudinal walls 33. When the boom 32 is driven to rotate, it further drives the gear 322 to mesh longitudinally along the rack 331, thus converting the rotation of the boom 32 into longitudinal movement. Of course, the aforementioned longitudinal drive mechanism 35 is a servo motor with a built-in brake. In addition, continuing as... Figures 4D-4F As shown, the aforementioned clamping mechanism mounting frame 31 is suspended below the boom 32, and longitudinal sliders 312 that can slide along the longitudinal guide rails 332 of the corresponding longitudinal wall 33 are respectively provided on both sides of the clamping mechanism mounting frame 31. That is, when the gears 322 at both ends of the boom 32 mesh and rotate on the longitudinal rack 331, they also synchronously drive the longitudinal sliders 312 to slide longitudinally along the longitudinal guide rails 332 of the corresponding longitudinal wall 33, thereby further realizing the longitudinal movement of the clamping mechanism mounting frame 31.

[0058] And continue as Figure 2 , Figure 4A and Figures 5A-5E As shown, the clamping mechanism mounting frame 31 also has a thinned wafer clamping mechanism 311. Before the transfer, the thinned wafer clamping mechanism 311 is positioned above the first thinned wafer transfer box located at the first opening 11. When the longitudinal drive mechanism 35 drives the clamping mechanism mounting frame 31 to move longitudinally downward, the thinned wafer clamping mechanism 311 moves downward and approaches the top of the first thinned wafer transfer box. When the first lifting mechanism 2a contacts and lifts the thinned wafer in the first thinned wafer transfer box, the thinned wafer can be guided into the thinned wafer clamping mechanism 311 and lifted and clamped.

[0059] Specifically, such as Figure 5D and Figure 5EAs shown, the wafer thinning clamping mechanism 311 includes, from top to bottom, two upper clamping walls 311a symmetrically spaced at its upper part, two rotatable middle support walls 311b symmetrically spaced at its middle part, and two lower guide walls 311c symmetrically spaced at its lower part. The upper clamping walls 311a have longitudinally spaced upper toothed grooves; the middle support walls 311b have longitudinally spaced middle toothed grooves; and the lower guide walls 311c have longitudinally spaced lower toothed grooves. The corresponding upper toothed grooves, middle toothed grooves, and lower toothed grooves, as well as the thinned wafer installed in the wafer thinning transfer box below them, are all in the same plane in the longitudinal direction. When the thinned wafer is lifted upwards on the first lifting mechanism 2a, the upper end of the thinned wafer is gradually guided along the lower toothed groove on the lower guide wall 311c into the middle and upper toothed grooves, and finally completely enters the space between the two upper clamping walls 311a and the two middle support walls 311b within the thinned wafer clamping mechanism 311, whereby it can be clamped by the two middle support walls 311b rotating inwards relative to each other. Continuing as... Figure 5CAs shown, the wafer thinning clamping mechanism 311 also includes a drive cylinder 3111 and a four-bar linkage mechanism driven by the drive cylinder 3111. The four-bar linkage mechanism includes two frame shafts, namely a first rotating shaft 3112 and a second rotating shaft 3113, a connecting rod 3114, a first connecting rod 3115, and a second connecting rod 3116. The first connecting rod 3115 is located above the first rotating shaft 3112, and its lower end is directly fixedly connected to the first rotating shaft 3112; the second connecting rod 3116 is located below the second rotating shaft 3113, and its upper end is fixedly connected to the second rotating shaft 3113. In addition, the first connecting rod 3115 and the second connecting rod 3116 are connected to each other by the aforementioned connecting rod 3114. One end of the connecting rod 3114 is fixedly connected to the upper end of the first connecting rod 3115, and the other end is fixedly connected to the lower end of the second connecting rod 3116. This staggered connection allows the first connecting rod 3115 to rotate clockwise, which, with the help of the connecting rod 3114, drives the second connecting rod 3116 to rotate in the opposite direction. The clockwise rotation of the first connecting rod 3115, which is also the clockwise rotation of the first rotating shaft 3112, in turn drives the second connecting rod 3116 to rotate in the opposite direction, which in turn drives the second rotating shaft 3113 to rotate in the opposite direction. This achieves the opposite rotation of the first rotating shaft 3112 and the second rotating shaft 3113. The first rotating shaft 3112 and the connecting rod 3115 are driven to rotate by the drive cylinder 3111. Specifically, as shown in the figure, the piston rod of the drive cylinder 3111 is driven to connect to the first rotating shaft 3112 via a transition rod 3117. One end of the transition rod 3117 is fixedly connected to the second end of the first connecting rod 3115, while the other end is pivotally connected to the piston rod of the drive cylinder 3111. The first end of the first connecting rod 3115 is pivotally connected to one end of the connecting rod 3114, while the lower middle part of the first connecting rod 3115 is fixedly connected to the first rotating shaft 3112 without relative rotation. Therefore, when the drive cylinder 3111 drives the first rotating shaft 3112 to rotate clockwise via the transition rod 3117, the first connecting rod 3115 and the connecting rod 3114 drive the second connecting rod 3116 and the second rotating shaft 3113 to rotate in the opposite direction, i.e., counterclockwise. Continuing as... Figure 5A and Figure 5C As shown, the first and second rotation axes are respectively mounted on the corresponding middle support wall 311b. Before rotation and clamping, the middle support wall 311b is aligned in a straight line with the upper clamping wall 311a and the lower guide wall 311c in the longitudinal direction to form a wafer entry / exit position that facilitates the guidance of the wafer, i.e., the thinned wafer, into the wafer. Figure 5EAs shown in Figure 5, in this state, the wafer can be guided from the lower guide wall into or out of the upper clamping wall, preventing the thinned wafer from shaking during entry or exit from the conversion box. This is particularly suitable for thinned wafers with poor stability. After the wafer is fully guided in, the drive cylinder 3111 drives the first and second rotating shafts to rotate in opposite directions via a four-bar linkage mechanism, which in turn drives the symmetrical middle support wall 311b to rotate in opposite directions to form a wafer lifting position that forms an obtuse angle with the upper clamping wall 311a (as shown in Figure 5). That is, the wafer is rotated to the toothed groove in the middle support wall 311b to grip and lift it. Compared with using a robot to clamp the wafer on both sides, the rotational lifting can effectively avoid damaging the wafer and improve the yield of thinned wafers.

[0060] In addition, continue as Figures 4A-4G As shown, the clamping mechanism mounting frame 31 also includes a base 313, on which the thinned wafer clamping mechanism 311 is mounted; a top plate 314, on which the lifting rod 32 is fixed; the two longitudinal sliders 312 are respectively located on both sides of the top plate 314; at least two pairs of connecting posts 315, the lower end of which is connected to the base 313, the upper end of which is connected to the top plate 314, and a protective cover 316 is mounted on the top plate. Continuing as... Figure 4G As shown, the bottom of each of the two longitudinal walls 33 is provided with a horizontal slider 333. A horizontal drive mechanism 36 is driven to one of the longitudinal walls 33, and the two horizontal sliders 333 slide on the corresponding horizontal guide rails 34. That is to say, driven by the horizontal drive mechanism 36, one of the longitudinal walls 33 can move back and forth laterally along the horizontal guide rails 34. On both sides of the top plate 314, there are also limiting blocks 317. The limiting blocks 313 are fastened to the corresponding longitudinal walls 33. As shown in the figure, the limiting blocks 317 are also limited and surrounded on the corresponding longitudinal sliders 312 of the clamping mechanism mounting frame 31.

[0061] Specifically, continue as follows Figures 4B-4G As shown, the horizontal drive mechanism 36 is a cylinder module, which includes a cylinder 361, a cylinder module moving seat 362, and a transport slider 363. The transport slider 363 is slidably mounted on the cylinder module moving seat 362 and is driven by the cylinder 361. That is, the cylinder 361 can drive the transport slider 363 to move horizontally along the outer surface of the cylinder module moving seat 362, and the transport slider 363 is fixedly connected to the horizontal slider 333 of one of the longitudinal walls 33, thereby driving the horizontal movement of the longitudinal wall 33.

[0062] like Figure 6A and Figure 6B As shown, the present invention also provides a method for thinning wafer transfer box conversion, comprising:

[0063] Step S1: The thinned wafer extraction and transport mechanism 3's thinned wafer gripping mechanism 3 moves to directly above the first thinned wafer transport box, which is pre-placed at the first opening position 11. The first lifting mechanism 2a rises to contact the thinned wafer inside the first thinned wafer transport box. Specifically, this includes: Step S11: The horizontal drive mechanism 36 of the thinned wafer extraction and transport mechanism 3 drives the thinned wafer gripping mechanism 311 to move horizontally to directly above the first thinned wafer transport box, which is pre-placed at the first opening position 11; Step S12: The vertical drive mechanism 35 of the thinned wafer extraction and transport mechanism 3 drives the thinned wafer gripping mechanism 311 to descend, causing the lower wall openings between the two lower guide walls 311c of the thinned wafer gripping mechanism 311 to approach each other and be vertically aligned with the upper opening of the first thinned wafer transport box; Step S13: The first lifting mechanism 2a rises to contact the thinned wafer inside the first thinned wafer transport box.

[0064] In step S2, the first lifting mechanism 2a continues to rise, guiding the thinned wafer in the first thinned wafer transfer box to the two lower guide walls 311c of the thinned wafer clamping mechanism 311 and lifting it between the two upper clamping walls 311a of the thinned wafer clamping mechanism 311. Then, the two middle support walls 311b of the thinned wafer clamping mechanism 311 rotate inward relative to each other to lift the thinned wafer. The first lifting mechanism 2a descends and returns to the initial position. Specifically, the process includes: Step S21, where the wafer stage 222 of the first lifting mechanism 2a continues to rise, guiding the thinned wafer in the first thinned wafer transfer box via the two lower guide walls 311c of the thinned wafer gripping mechanism 311 to be lifted between the two middle support walls 311b and the two upper clamping walls 311a at the wafer entry / exit position; Step S22, driving the four-bar linkage of the thinned wafer gripping mechanism 311, the first and second rotating shafts rotate in opposite directions, causing the two middle support walls 311b to rotate inward relative to each other to the wafer lifting position, so as to lift the thinned wafer that enters between the two upper clamping walls 311a; Step S23, the longitudinal drive mechanism 35 of the thinned wafer extraction and transport mechanism 3 drives the thinned wafer gripping mechanism 311 to rise, so that the lower opening between the two lower guide walls 311c of the thinned wafer gripping mechanism 311 moves away from the upper box opening of the first thinned wafer transfer box; Step S24, the first lifting mechanism 2a descends and returns to the initial position.

[0065] Step S3: The thinned wafer gripping mechanism 311 moves horizontally to directly above the second thinned wafer transfer box, and the second lifting mechanism 2b rises to contact the thinned wafer gripped by the thinned wafer gripping mechanism 311. Specifically, this includes: Step S31: The horizontal drive mechanism 36 of the thinned wafer extraction and transport mechanism 3 drives the thinned wafer gripping mechanism 311 to move horizontally to directly above the second thinned wafer transfer box, which is pre-placed at the second opening position 12; Step S32: The vertical drive mechanism 35 of the thinned wafer extraction and transport mechanism 3 drives the thinned wafer gripping mechanism 311 to descend, causing the lower wall openings between the two lower guide walls 311c of the thinned wafer gripping mechanism 311 to approach each other and be vertically aligned with the upper opening of the second thinned wafer transfer box; Step S33: The second lifting mechanism 2b rises to contact the thinned wafer gripped by the thinned wafer gripping mechanism 311.

[0066] In step S4, the two middle support walls 311b of the thin wafer gripping mechanism 311 rotate outward relative to each other to release the wafer. The second lifting mechanism 2b descends and guides the thinned wafer between the two upper clamping walls 311a of the thinned wafer gripping mechanism 311 through the two lower guide walls 311c to be transported and placed in the second thinned wafer transfer box. The second lifting mechanism 2b continues to descend and return to the initial position. Specifically, the steps include: Step S41, reverse driving the four-bar linkage of the thinned wafer gripping mechanism 311, rotating the first and second rotating shafts to drive the two middle support walls 311b to rotate outward relative to each other to the wafer entry / exit position, so as to release the thinned wafer between the two upper clamping walls 311a; Step S42, the wafer stage 222 of the second lifting mechanism 2b descends to guide the thinned wafer down through the two lower guide walls 311c of the thinned wafer gripping mechanism 311 and place it in the second thinned wafer transfer box; Step S43, the longitudinal driving mechanism 35 of the thinned wafer extraction and transport mechanism 3 drives the thinned wafer gripping mechanism 311 to rise so that the lower wall opening between the two lower guide walls 311c of the thinned wafer gripping mechanism 311 moves away from the upper box opening of the second thinned wafer transfer box; Step S44, the second lifting mechanism 2b descends to return to the initial position.

[0067] The two upper clamping walls 311a, two middle supporting walls 311b, and two lower guide walls 311c are symmetrically arranged from top to bottom on the wafer thinning clamping mechanism 311. In the wafer entry / exit position, the middle supporting walls 311b, upper clamping walls 311a, and lower guide walls 311c are arranged in a straight line longitudinally. In the wafer lifting position, the middle supporting walls 311b, after rotation, form an obtuse angle with the upper clamping walls 311a. Furthermore, the upper clamping walls 311a have longitudinally spaced upper toothed grooves; the middle supporting walls 311b have longitudinally spaced middle toothed grooves; and the lower guide walls 311c have longitudinally spaced lower toothed grooves. The corresponding upper, middle, and lower toothed grooves are all in the same plane longitudinally. In the wafer entry / exit position, the wafer can be introduced or exported along the lower toothed grooves; in the wafer lifting position, the wafer is lifted within the upper and middle toothed grooves.

[0068] The present invention has been described in detail above with reference to the accompanying drawings and embodiments. Those skilled in the art can make various modifications to the present invention based on the above description. Therefore, certain details in the embodiments should not be construed as limiting the present invention, and the scope of protection of the present invention shall be defined by the appended claims.

Claims

1. A thinned wafer extraction and transport mechanism, characterized in that, The thinned wafer extraction and transport mechanism includes: A clamping mechanism mounting frame is provided with at least one thinning wafer clamping mechanism, and longitudinal sliders are provided on both sides of the clamping mechanism mounting frame; A horizontally positioned boom is provided, with the clamping mechanism mounting frame suspended below the boom. Gears are provided at both ends of the boom, and a boom end pulley is provided in the middle of the boom. Two longitudinal walls are symmetrically spaced apart. The sides of the longitudinal walls are provided with longitudinal racks and longitudinal guide rails. The gear of the lifting rod is meshed with the longitudinal rack. The longitudinal slider of the clamping mechanism mounting frame is slidably mounted on the longitudinal guide rail. The bottom of the two longitudinal walls is provided with horizontal sliders respectively. A longitudinal drive mechanism, wherein a machine end pulley is provided on the machine shaft of the longitudinal drive mechanism, and the rod end pulley is connected to the machine end pulley by a belt; Two horizontal guide rails are arranged in parallel intervals, and the horizontal slider at the bottom of the longitudinal wall slides on the horizontal guide rails; The horizontal drive mechanism is connected to one of the longitudinal walls.

2. The thinned wafer extraction and transport mechanism as described in claim 1, characterized in that... The horizontal drive mechanism is a cylinder module, which includes a cylinder, a cylinder module moving seat, and a transport slider. The transport slider is slidably mounted on the cylinder module moving seat and is driven by the cylinder. A connecting block is provided on one side of the longitudinal wall, and the connecting block is connected to the transport slider.

3. The thinned wafer extraction and transport mechanism as described in claim 1, characterized in that... The longitudinal drive mechanism is a servo motor for longitudinal drive.

4. The thinned wafer extraction and transport mechanism as described in claim 1, characterized in that... The clamping mechanism mounting bracket has: The wafer thinning clamping mechanism is mounted on the frame base; The top plate of the frame is fixed with the suspension rod, and two longitudinal sliders are respectively located on both sides of the top plate of the frame. At least two pairs of connecting columns, with their lower ends connected to the frame base and their upper ends connected to the frame top plate; A protective cover is installed on the top plate of the frame.

5. The thinned wafer extraction and transport mechanism as described in claim 1, characterized in that... The wafer thinning clamping mechanism includes, from top to bottom: Two upper clamping walls are symmetrically arranged on the upper part of the mechanism, and the upper clamping walls have longitudinally spaced upper toothed grooves; Two rotatable central support walls are symmetrically arranged in the middle of the mechanism. The central support walls have longitudinally spaced central toothed grooves, and the central support walls are respectively provided with a first and a second rotating shaft. Two lower guide walls are symmetrically arranged at the bottom of the mechanism. The lower guide walls have longitudinally spaced lower tooth grooves, wherein the corresponding upper tooth groove, middle tooth groove and lower tooth groove are all in the same plane in the longitudinal direction. The wafer thinning clamping mechanism further includes: The drive cylinder is located outside the base of the clamping mechanism mounting bracket; The four-bar linkage is composed of the first and second rotating shafts forming the two frame shafts of the four-bar linkage. The drive cylinder drives the four-bar linkage so that the first rotating shaft and the second rotating shaft rotate in opposite directions.

6. The thinned wafer extraction and transport mechanism as described in claim 5, characterized in that, The rotatable central support wall has: Wafer entry / exit positions are aligned in a straight line with the upper clamping wall and the lower guide wall; After rotation, the wafer support position forms an obtuse angle with the upper clamping wall.

7. The thinned wafer extraction and transport mechanism as described in claim 5, characterized in that, The four-bar linkage also includes: The first and second connecting rods are fixed on the first and second rotating shafts, and the connecting rod is connected between the first and second connecting rods.

8. The thinned wafer extraction and transport mechanism as described in claim 7, characterized in that, The first connecting rod is located above the first rotating axis, and the second connecting rod is located below the second rotating axis.

9. The thinned wafer extraction and transport mechanism as described in claim 7 or 8, characterized in that, The piston rod of the drive cylinder is connected to the first rotating shaft via a transition rod. One end of the transition rod is fixedly connected to the second end of the first connecting rod. The lower middle part of the first connecting rod is fixedly connected to the first rotating shaft in a non-rotatable manner. The first end of the first connecting rod is pivotally connected to one end of the connecting rod. The other end of the transition rod is pivotally connected to the piston rod of the cylinder.

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