Film coating device for gold bump ECD wafer level packaging

Abstract

The invention discloses a film coating device for gold bump ECD wafer level packaging, and relates to the technical field of gold bump ECD wafer level packaging processing equipment, and the technical key points are that the film coating device comprises a gold bump ECD wafer level packaging film coating machine body; the control panel is arranged on the outer wall of the gold bump ECD wafer level packaging coating machine body through a screw; the lifting wafer carrying platform is mounted and connected to the inner side of the lower end of the gold bump ECD wafer level packaging coating machine body; the pneumatic adsorption mechanism is mounted and connected to the middle of the inner side of the lifting wafer carrying table; the adsorption lifting mechanism is installed and connected in the middle of the inner side of the pneumatic adsorption mechanism, and the technical effects are that the adsorption lifting mechanism can adsorb a wafer workpiece placed on the adsorption lifting mechanism through negative pressure suction force on the inner side of the lifting wafer carrying platform, when the wafer workpiece is taken, the wafer workpiece is lifted and exposed, and then the negative pressure suction force disappears; and a worker can conveniently take the coated wafer workpiece.

Description

TECHNICAL FIELD

[0001] The application relates to a gold bump ECD wafer level packaging processing equipment technical field, in particular to a film plating device for gold bump ECD wafer level packaging. BACKGROUND

[0002] The gold bump ECD wafer level packaging is an advanced semiconductor packaging technology, and the core is to complete all packaging processes on a wafer, and finally reduce the chip size to be close to an IC chip, and the gold bump ECD wafer level packaging needs to be plated when being processed, and a film plating device for the gold bump ECD wafer level packaging needs to be used when the film plating is performed.

[0003] The existing Chinese patent CN210765501U discloses a wafer film plating process device in the field of vacuum film plating, which is disclosed on June 16, 2020, and comprises an upper cavity, an inner cavity, a lower cavity, a wafer feeding and discharging mechanism, and a wafer carrying device, wherein the upper cavity is located on the upper part of the lower cavity, the lower cavity has a feeding port on one side, the inner cavity is located in the upper cavity, the feeding and discharging mechanism is located on the lower part of the lower cavity, and the inner cavity and the lower part of the upper cavity are provided with an opening, so that the inner cavity and the lower cavity are communicated, and the wafer carrying device can move between the lower cavity and the inner cavity. The wafer film plating process and the feeding and discharging process are separated in space, each is allocated with a dedicated running space, so that the control and prevention of the particulate pollution of other cavities after the reaction in the inner cavity are facilitated, and batch film plating can be realized under the guarantee of the film area uniformity of the film plating.

[0004] However, in actual use, the wafer carrying device is not very convenient to assemble and disassemble when the whole is plated and the workpiece is placed and processed, and the assembly and disassembly are not very efficient.

[0005] Therefore, a new film plating device for gold bump ECD wafer level packaging is proposed to solve the above technical problems. SUMMARY

[0006] (I) Technical problems to be solved

[0007] In view of the defects of the prior art, the film plating device for gold bump ECD wafer level packaging solves the problem that the wafer carrying device is not very convenient to assemble and disassemble when the whole is plated and the workpiece is placed and processed, and the assembly and disassembly are not very efficient.

[0008] (II) Technical solutions

[0009] To achieve the above object, the present application provides the following technical scheme: a plating device for gold bump ECD wafer level packaging, comprising:

[0010] A gold bump ECD wafer level packaging plating machine body;

[0011] A control panel is mounted on the outer wall of the gold bump ECD wafer level packaging plating machine body by screws;

[0012] A lifting wafer carrier is mounted and connected to the inner side of the lower end of the gold bump ECD wafer level packaging plating machine body;

[0013] A pneumatic adsorption mechanism is mounted and connected to the inner side of the lifting wafer carrier;

[0014] An adsorption lifting mechanism is mounted and connected to the inner side of the pneumatic adsorption mechanism.

[0015] Preferably, the gold bump ECD wafer level packaging plating machine body comprises a lower wafer plating machine box, a four-hole mounting bottom plate is fixedly connected to the lower end of the lower wafer plating machine box, a maintenance panel is mounted by screws at the front end groove of the lower wafer plating machine box, a hinged door is movably mounted at the feed inlet of the front end of the lower wafer plating machine box, an upper wafer plating machine box is fixedly connected through the upper end of the lower wafer plating machine box, a gold bump ECD wafer plating device is fixedly connected to the inner side of the upper end of the upper wafer plating machine box, and a lifting wafer carrier is mounted in the inner side of the lower wafer plating machine box.

[0016] Preferably, the lifting wafer carrier comprises a movable closure plate, two second electric telescopic cylinders are fixedly connected to the lower end diagonal corners of the movable closure plate, the second electric telescopic cylinders are mounted by screws on the inner bottom end of the lower wafer plating machine box, and a pneumatic adsorption mechanism is mounted in the inner side of the movable closure plate.

[0017] Preferably, the pneumatic adsorption mechanism comprises a concave shell, a gas conveying pipe is fixedly connected through the lower end of the concave shell, an adsorption lifting mechanism is mounted in the inner side of the concave shell, a corrugated expansion pipe is mounted by screws at the lower end of the gas conveying pipe, a gas pump is mounted by screws at the lower end of the corrugated expansion pipe, and the gas pump is mounted by screws on the inner bottom end of the lower wafer plating machine box.

[0018] Preferably, the adsorption lifting mechanism comprises a hollow adsorption disc, a connecting end rod is fixedly connected to the lower end of the hollow adsorption disc, a first electric telescopic cylinder is fixedly connected to the lower end of the connecting end rod, a cylinder mounting disc is fixedly connected to the periphery of the first electric telescopic cylinder, and the first electric telescopic cylinder is mounted by screws on the lower end of the concave shell through the cylinder mounting disc.

[0019] Preferably, the hollow adsorption disc is sleeved in the inside of the movable closing plate, and a gap groove is arranged between the hollow adsorption disc and the movable closing plate.

[0020] Preferably, a groove hole corresponding to the size of the concave shell is arranged between the upper wafer coating machine box and the lower wafer coating machine box.

[0021] (Three) beneficial effects

[0022] Compared with the prior art, the present application provides a coating device for gold bump ECD wafer level packaging, which has the following beneficial effects:

[0023] 1. The adsorption lifting mechanism can adsorb the wafer workpiece placed above through the negative pressure adsorption force in the inside of the lifting wafer carrier, and when taking, the wafer workpiece is lifted to expose, and then the negative pressure adsorption force disappears, so that personnel can take the wafer workpiece after coating.

[0024] 2. The lifting wafer carrier can be lifted in the inside of the lower end of the gold bump ECD wafer level packaging coating machine body, so that the workpiece can be lifted for coating after being loaded, and the pneumatic adsorption mechanism can generate negative pressure adsorption force in the inside of the lifting wafer carrier, so as to adsorb the workpiece by negative pressure. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the present application;

[0026] Figure 2 It is a schematic diagram of the internal three-dimensional structure of the present application;

[0027] Figure 3 It is a schematic diagram of the combination structure of the lifting wafer carrier, adsorption lifting mechanism and pneumatic adsorption mechanism of the present application;

[0028] Figure 4 It is a schematic diagram of the combination structure of the adsorption lifting mechanism and pneumatic adsorption mechanism of the present application;

[0029] Figure 5 It is a schematic diagram of the adsorption lifting mechanism structure of the present application.

[0030] In the drawings:

[0031] 1. Gold bump ECD wafer coating device; 2. Upper wafer coating machine box; 3. Control panel; 4. Lower wafer coating machine box; 41. Four-hole mounting bottom plate; 5. Opening and closing box door; 6. Overhaul panel; 7. Movable closing plate; 71. Concave shell; 72. Gas conveying pipe; 73. Corrugated expansion pipe; 74. Air pump; 8. First electric telescopic cylinder; 81. Hollow adsorption disc; 82. Connecting end rod; 83. Cylinder mounting disc; 9. Second electric telescopic cylinder. DETAILED DESCRIPTION

[0032] In this invention, unless otherwise stated, the directional terms such as "up" and "down" generally refer to the directions shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" generally refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention.

[0033] Example 1

[0034] This embodiment provides a technical solution: a coating apparatus for gold bump ECD wafer-level packaging, such as... Figures 1-5 As shown, it includes a gold bump ECD wafer-level packaging coating machine body, a control panel 3, a lifting wafer transport platform, a pneumatic adsorption mechanism, and an adsorption lifting mechanism.

[0035] The control panel 3 is mounted on the outer wall of the gold bump ECD wafer-level packaging coating machine body via screws. The control panel 3 can be programmed with corresponding data for operation control. The gold bump ECD wafer-level packaging coating machine body can effectively enclose and protect the machine. The lifting wafer transport platform is installed and connected to the inner side of the lower end of the gold bump ECD wafer-level packaging coating machine body. The lifting wafer transport platform can be raised and lowered from the inner side of the lower end of the gold bump ECD wafer-level packaging coating machine body, so that the workpiece can be lifted for coating after loading. The pneumatic adsorption mechanism is installed and connected to the middle of the inner side of the lifting wafer transport platform. The pneumatic adsorption mechanism can generate negative pressure suction on the inner side of the lifting wafer transport platform, which can adsorb the workpiece under negative pressure. The adsorption lifting mechanism is installed and connected to the middle of the inner side of the pneumatic adsorption mechanism. The adsorption lifting mechanism can adsorb the wafer workpiece placed above by the negative pressure suction on the inner side of the lifting wafer transport platform. When picking it up, it is lifted and exposed, and then the negative pressure suction disappears, making it easy for personnel to pick up the coated wafer workpiece.

[0036] The ECD wafer-level packaging coating machine for gold bumps includes a lower wafer coating chassis 4. A four-hole mounting base plate 41 is fixedly connected to the lower end of the lower wafer coating chassis 4. The lower wafer coating chassis 4 can be mounted in a designated position via screws through the four-hole mounting base plate 41. A maintenance panel 6 is installed in the recessed area at the front of the lower wafer coating chassis 4 via screws, facilitating personnel to open and maintain it. A hinged door 5 is movably installed at the feed inlet at the front of the lower wafer coating chassis 4. The lower wafer coating chassis 4 is connected to the upper wafer coating chassis 2, which allows for wafer packaging coating operations to be performed inside the upper wafer coating chassis 2. The upper inner side of the upper wafer coating chassis 2 is fixedly connected to the upper bump ECD wafer coating device 1, allowing coating operations to be performed through the gold bump ECD wafer coating device 1. The lower wafer coating chassis 4 is equipped with a lifting wafer transport platform, which can be lifted and lowered for coating operations.

[0037] As Figures 1-3 The lifting wafer carrier platform includes a movable closing plate 7, two second electric telescopic cylinders 9 are fixed at the lower end diagonal corners of the movable closing plate 7, the telescopic rods of the second electric telescopic cylinders 9 can drive the movable closing plate 7 to lift when telescoping, the second electric telescopic cylinders 9 are installed on the inner bottom end of the lower wafer coating machine box 4 through screws, can be stably installed and placed, and are convenient to install and dismount, a pneumatic suction mechanism is installed in the middle of the inner side of the movable closing plate 7, the pneumatic suction mechanism can be lifted when the movable closing plate 7 lifts, so that the lifting is convenient for coating operation.

[0038] In use, the control panel 3 can set corresponding data programs for operation control, the gold bump ECD wafer level packaging coating machine body can be effectively wrapped and protected for use, the lifting wafer carrier platform can lift on the inner side of the lower end of the gold bump ECD wafer level packaging coating machine body, so that the workpiece can be lifted for coating after being loaded, the pneumatic suction mechanism can generate a negative pressure suction force on the inner side of the lifting wafer carrier platform, so that the workpiece can be negatively pressure-sucked, the suction lifting mechanism can suction the wafer workpiece placed above through the negative pressure suction force on the inner side of the lifting wafer carrier platform, when taking, the wafer workpiece after coating is lifted and exposed, and then the negative pressure suction force disappears, so that personnel can take the wafer workpiece after coating.

[0039] Embodiment two

[0040] This embodiment is further optimized on the basis of the embodiment one, and the same parts as the foregoing technical solutions will not be described herein again, as Figures 2-5 To better achieve the present application, the following setting mode is particularly adopted: the pneumatic suction mechanism includes a concave shell 71, the concave shell 71 is fixed on the movable closing plate 7 and can be stably installed and placed, a gas conveying pipeline 72 is fixed through the middle of the lower end of the concave shell 71, the concave shell 71 can receive negative pressure gas through the gas conveying pipeline 72 at the lower end, a suction lifting mechanism is installed in the middle of the inner side of the concave shell 71, the negative pressure gas in the concave shell 71 can be conveniently pneumatically sucked to the gold bump ECD wafer workpiece placed above through the suction lifting mechanism, a corrugated telescopic pipe 73 is installed at the lower end of the gas conveying pipeline 72 through screws, the gas conveying pipeline 72 can receive the negative pressure gas conveyed by the corrugated telescopic pipe 73, the corrugated telescopic pipe 73 can change the length by telescoping, so that the lifting coating will not be hindered, a gas pump 74 is installed at the lower end of the corrugated telescopic pipe 73 through screws, the corrugated telescopic pipe 73 can receive the negative pressure gas of the gas pump 74, and the gas pump 74 is installed at the inner bottom end of the lower wafer coating machine box 4 through screws, so as to be conveniently installed and placed.

[0041] A slot hole corresponding in size to the concave shell 71 is formed between the upper wafer coating machine box 2 and the lower wafer coating machine box 4, so that the coating can be performed through the slot hole, and the movable closing plate 7 can effectively close.

[0042] The adsorption lifting mechanism comprises a hollow adsorption disc 81, a connecting end rod 82 is fixedly connected to the middle of the lower end of the hollow adsorption disc 81, the connecting end rod 82 can drive the hollow adsorption disc 81 to lift when lifting, a gold bump ECD wafer workpiece can be placed above the hollow adsorption disc 81, the gold bump ECD wafer workpiece can be adsorbed by negative pressure gas through the mesh of the hollow adsorption disc 81, so as to be effectively fixed, the lower end of the connecting end rod 82 is fixedly connected with a first electric telescopic cylinder 8, the connecting end rod 82 can change the height position through the telescopic rod of the first electric telescopic cylinder 8, the periphery of the first electric telescopic cylinder 8 is fixedly connected with a cylinder mounting disc 83, which can be correspondingly mounted, and the first electric telescopic cylinder 8 is mounted on the lower end of the concave shell 71 through the screws on the cylinder mounting disc 83, so that the first electric telescopic cylinder 8 can be stably placed and telescoped.

[0043] The hollow adsorption disc 81 is sleeved in the interior of the movable sealing plate 7 and can be positioned and moved in the interior, and a gap groove is arranged between the hollow adsorption disc 81 and the movable sealing plate 7, so that the movable sealing plate 7 and the hollow adsorption disc 81 can be conveniently moved and gas can be conveniently flowed and transported.

[0044] The wiring diagram of the control panel 3 and the gold bump ECD wafer coating device 1 in the present application belongs to the common knowledge in the art, the working principle thereof is a known technology, and the model thereof is selected according to actual use, so the control panel 3 and the gold bump ECD wafer coating device 1 will not be explained in detail.

[0045] The above is only a specific embodiment of the present application, but the technical features of the present application are not limited thereto. Any simple change, equivalent replacement or modification made on the basis of the present application to solve the same technical problem and achieve the same technical effect is also covered by the protection scope of the present application.

Claims

1. A plating apparatus for gold bump ECD wafer level packaging, characterized in that, Include: Gold bump ECD wafer level packaging film coating machine body; Control panel (3), the control panel (3) is installed on the outer wall of gold bump ECD wafer level packaging film coating machine body by screw; Lift wafer carrier, the lift wafer carrier is installed and connected in the inner side of the lower end of gold bump ECD wafer level packaging film coating machine body; Pneumatic suction mechanism, the pneumatic suction mechanism is installed and connected in the middle of the inner side of lift wafer carrier; Suction lifting mechanism, the suction lifting mechanism is installed and connected in the middle of the inner side of pneumatic suction mechanism.

2. The coating device for gold bump ECD wafer level packaging according to claim 1, wherein: The gold bump ECD wafer level packaging film coating machine body includes the lower side wafer film coating machine box (4), the lower end of the lower side wafer film coating machine box (4) is fixedly connected with the four-hole mounting bottom plate (41), the front end recess of the lower side wafer film coating machine box (4) is installed with the maintenance panel (6) through screw, the movable mounting open-close box door (5) is installed at the feed inlet of the front end of the lower side wafer film coating machine box (4), the upper end of the lower side wafer film coating machine box (4) is fixedly connected with the upper side wafer film coating machine box (2), the upper end of the upper side wafer film coating machine box (2) is fixedly connected with the gold bump ECD wafer film coating device (1), and the inner side of the lower side wafer film coating machine box (4) is provided with the lift wafer carrier.

3. The coating device for gold bump ECD wafer level packaging according to claim 2, characterized in that: The lift wafer carrier includes a movable closure plate (7), two second electric telescopic cylinders (9) are fixedly connected at the obliquely opposite corners of the lower end of the movable closure plate (7), the second electric telescopic cylinders (9) are installed on the inner bottom end of the lower side wafer film coating machine box (4) through screws, and the inner side of the movable closure plate (7) is provided with the pneumatic suction mechanism.

4. The coating apparatus for gold bump ECD wafer-level packaging according to claim 3, characterized in that: The pneumatic suction mechanism includes a concave shell (71), a gas conveying pipeline (72) is fixedly connected through the middle of the lower end of the concave shell (71), the suction lifting mechanism is installed in the middle of the inner side of the concave shell (71), the lower end of the gas conveying pipeline (72) is installed with a corrugated expansion pipe (73) through a screw, the lower end of the corrugated expansion pipe (73) is installed with a gas pump (74) through a screw, and the gas pump (74) is installed on the inner bottom end of the lower side wafer film coating machine box (4) through a screw.

5. The coating device for gold bump ECD wafer level packaging according to claim 4, characterized in that: The suction lifting mechanism includes a hollow suction disc (81), a connecting end rod (82) is fixedly connected in the middle of the lower end of the hollow suction disc (81), a first electric telescopic cylinder (8) is fixedly connected to the lower end of the connecting end rod (82), a cylinder mounting disc (83) is fixedly connected to the periphery of the first electric telescopic cylinder (8), and the first electric telescopic cylinder (8) is installed on the lower end of the concave shell (71) through screws on the cylinder mounting disc (83).

6. The coating apparatus for gold bump ECD wafer level packaging of claim 5, wherein: The hollow suction disc (81) is sleeved in the inner part of the movable closure plate (7), and a gap groove is formed between the hollow suction disc (81) and the movable closure plate (7).

7. The coating apparatus for gold bump ECD wafer level packaging of claim 2, wherein: The upper side wafer film coating machine box (2) and the lower side wafer film coating machine box (4) are provided with a slot hole corresponding in size to the concave shell (71).

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