Resin composition for lens, cured product for lens, and lens

Abstract

A resin composition for a lens, which contains: a photo-cationic polymerization initiator (X) that contains a salt formed from an anion represented by general formula (1) and a cation; an epoxy compound (Y) that contains two or more epoxy groups in each molecule; and a stabilizer that has an alkali dissociation constant (pKb) of 6.0 or more.

Description

TECHNICAL FIELD

[0001] The present application relates to a resin composition for lenses, a cured product for lenses, and a lens. BACKGROUND

[0002] At present, electronic devices such as smartphones, tablet terminals, and notebook computers are equipped with cameras. Furthermore, with the miniaturization and high performance of these devices, there is a strong demand for miniaturization and high performance of the lenses of the cameras mounted thereon.

[0003] In the lenses of the cameras mounted on these electronic devices, it is known to use silicone resins and acrylic resins as materials. In addition, it is also known to use epoxy resins as materials in the above lenses. As such technologies, for example, the technologies described in Patent Documents 1 to 3 can be cited.

[0004] Patent Document 1 discloses a process aimed at obtaining a molding process and an organic silicone encapsulant composition suitable for use therein, the process comprising: 1) heating a mold having a mold cavity at a temperature range of 100°C to 200°C; 2) supplying to the assembly an amount of an organic silicone composition containing a mold release agent, the composition having a viscosity range of 50 cps to 3,000 cps at the operating temperature of the process, preventing the organic silicone encapsulant composition from flowing out of and back into the assembly; 3) injecting the organic silicone composition into the mold cavity from the assembly through a gate, where the mold cavity has a top and a bottom, an air vent (vent hole) is located at the top of the mold cavity, the air vent containing a passage of 0.1 mm to 1 mm wide x 0.0001 mm to 0.001 mm deep; the gate is located at the bottom of the mold cavity, the injection is performed for 5 seconds within a pressure range of 1,000 psi to 10,000 psi; 4) maintaining the organic silicone composition within 1,000 psi to 10,000 psi for a time sufficient to prevent the organic silicone composition from flowing out of the mold cavity; 5) curing the product of step 4).

[0005] Further, Patent Literature 2 discloses a curable resin composition for Fresnel lens, which aims to obtain a curable resin composition for Fresnel lens having excellent adhesion to a plastic substrate, which does not easily cause defects or cracks due to external force while maintaining a high elastic modulus, and which exhibits excellent shape retention in a wide temperature range, and a Fresnel lens using the curable resin composition for Fresnel lens, the curable resin composition for Fresnel lens containing, as essential components, an epoxy (meth) acrylate having two or more (meth) acryloyl groups obtained by reacting an epoxy resin having a cyclic structure with an epoxy equivalent of 450 g / eq or more and (meth) acrylic acid, a 3-functional (meth) acrylate having a specific structure, a (meth) acrylate having a propylene oxide structure and two or more hydroxyl groups and a molecular weight of 700 or less, and a monofunctional (meth) acrylate having a cyclic structure.

[0006] Further, Patent Literature 3 discloses a curable composition for lens, which aims to provide a curable composition for lens capable of forming a lens having excellent transfer precision of a mold, and excellent heat resistance and optical properties, the curable composition for lens containing at least an alicyclic epoxy compound (A) having a specific structure, a cationic polymerization initiator (B), and a polysiloxane (C) having a specific structure, and containing 0.01 to 5% by weight of the above polysiloxane (C) with respect to the total amount (100% by weight) of the curable composition.

[0007] Prior Art Documents

[0008] Patent Literature

[0009] Patent Literature 1: Japanese Patent Application Laid-Open No. 2008-545553

[0010] Patent Literature 2: Japanese Patent Application Laid-Open No. 2003-131004

[0011] Patent Literature 3: Japanese Patent Application Laid-Open No. 2019-189874 SUMMARY

[0012] PROBLEMS TO BE SOLVED BY THE INVENTION

[0013] The conventional material for lens has room for improvement in terms of each property required for a lens such as optical properties and heat resistance.

[0014] The present application provides a resin composition for lens capable of forming a cured product for lens having improved performance balance of high refractive index, high light transmittance, high heat resistance, and resistance to bleeding.

[0015] Further, an object of the present application is to provide a cured product for lenses and a lens, in which the balance of properties of high refractive index, high light transmittance, high heat resistance, and resistance to bleeding is improved.

[0016] Means for solving the problem

[0017] The present inventors have conducted intensive studies in order to solve the above problem. As a result, it has been found that the above problem can be solved by using, in combination, a specific photocationic polymerization initiator, an epoxy compound, and a specific stabilizer, thereby completing the present application.

[0018] That is, according to the present application, a resin composition for lenses, a cured product for lenses, and a lens as shown below are provided. [1]

[0020] A resin composition for lenses, comprising:

[0021] a photocationic polymerization initiator (X) comprising a salt formed from an anion and a cation represented by the following general formula (1);

[0022] an epoxy compound (Y) comprising two or more epoxy groups in a molecule; and

[0023] a stabilizer having a base dissociation constant pKb of 6.0 or more according to the following <Method for measuring base dissociation constant pKb>.

[0024] <Method for measuring base dissociation constant pKb>

[0025] A stabilizer 0.1 g is dissolved in 100 g of an aqueous solution containing 80 mass% of methanol, and the solution is titrated with a 3N-HCl aqueous solution while measuring the pH with a pH meter, thereby obtaining a pH titration curve. The pKb value is calculated from the obtained pH titration curve by a graphical method. [2]

[0027] The resin composition for lenses according to the above [1], wherein the stabilizer contains a stabilizer comprising one or two or more of the partial structures represented by the following general formula (6) and the following general formula (7).

[0028] [Chemical Formula 1]

[0029]

[0030] (In the above general formula (1), R 1 ~R 4 each independently represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.)

[0031] [Chemical Formula 2]

[0032]

[0033] (in the above general formula (6), R a represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0034] [Chemical Formula 3]

[0035]

[0036] (in the above general formula (7), O• represents an oxyl group.) [3]

[0038] The lens resin composition according to the above [1] or [2], wherein the base dissociation constant pKb of the stabilizer is 12.0 or less. [4]

[0040] A lens resin composition comprising:

[0041] a photocationically polymerization initiator (X) including a salt formed from an anion and a cation represented by the following general formula (1);

[0042] an epoxy compound (Y) including 2 or more epoxy groups in a molecule; and

[0043] a stabilizer including one or two or more partial structures selected from the group consisting of a partial structure represented by the following general formula (6) and a partial structure represented by the following general formula (7).

[0044] [Chemical Formula 4]

[0045]

[0046] (in the above general formula (1), R 1 R 4 each independently represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0047] [Chemical Formula 5]

[0048]

[0049] (in the above general formula (6), R a represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0050] [Chemical Formula 6]

[0051]

[0052] (In the above general formula (7), O• represents an oxyl group.) [5]

[0054] The lens resin composition according to any one of the above [1] to [4], wherein the content of the stabilizer is 0.01 parts by mass or more and 5.0 parts by mass or less with respect to 100 parts by mass of the epoxy compound (Y). [6]

[0056] The lens resin composition according to any one of the above [1] to [5], wherein the epoxy compound (Y) is represented by the following general formula (2).

[0057] [Chem. 7]

[0058]

[0059] (In the above general formula (2), R 5 , R 6 , R 8 , and R 9 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a trifluoromethyl group, R 7 each independently represent a hydrogen atom or a glycidyl group, and n is an average number of repetitions and represents a real number within a range of 0 to 30.) [7]

[0061] The lens resin composition according to any one of the above [1] to [6], wherein the photocationic polymerization initiator (X) contains at least one selected from an anion represented by the following formula (3) and an anion represented by the following formula (4) as an anion.

[0062] [Chem. 8]

[0063]

[0064] [Chem. 9]

[0065] [8]

[0067] The lens resin composition according to any one of the above [1] to [7], wherein the photocationic polymerization initiator (X) contains a sulfonium ion as a cation. [9]

[0069] The lens resin composition according to any one of the above [1] to [8], further containing a monofunctional epoxy compound (Z) represented by the following general formula (5).

[0070] [Chem. 10]

[0071]

[0072] (In the above general formula (5), A is selected from a single bond, an oxygen atom, a sulfur atom, R 10 is an alkylene group having 1 to 8 carbon atoms, and any methylene group can be replaced with an oxygen atom.

[10]

[0074] The lens resin composition according to the above [9], wherein the monofunctional epoxy compound (Z) contains o-phenylphenol glycidyl ether.

[11]

[0076] The lens resin composition according to any one of the above [1] to

[10] , further comprising an oxetane compound (W).

[12]

[0078] The lens resin composition according to the above

[11] , wherein the oxetane compound (W) contains a biphenyl type oxetane compound.

[13]

[0080] The lens resin composition according to any one of the above [1] to

[12] , wherein the viscosity of the lens resin composition is 100 mPa-s or more and 5,000 mPa-s or less when measured with an E-type viscometer at a temperature of 25°C and a rotation speed of 2.5 rpm.

[14]

[0082] The lens resin composition according to any one of the above [1] to

[13] , wherein the lens resin composition is coated on a glass substrate with a thickness of 250 μm, UV exposure is performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6,000 mJ / cm 2 , and the cured product obtained by heating at 120°C for 30 minutes in a nitrogen atmosphere has a refractive index of 1.55 or more.

[15]

[0084] The lens resin composition according to any one of the above [1] to

[14] , wherein the lens resin composition is coated on a glass substrate with a thickness of 250 μm, UV exposure is performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6,000 mJ / cm 2 , and the cured product obtained by heating at 120°C for 30 minutes in a nitrogen atmosphere has a refractive index of 1.55 or more.

[0085] (Measurement Conditions)

[0086] Measurement method: transmission method

[0087] Measurement wavelength: 400 nm

[0088] Reference: air

[0089] Detector: integrating sphere / photomultiplier tube (200 nm to 850 nm)

[0090] Integrating sphere: PbS (850 nm to 2600 nm)

[16]

[0092] The lens resin composition according to any one of the above [1] to

[15] , wherein the lens resin composition is coated on a glass substrate at a thickness of 250 μm, UV exposure is performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6000 mJ / cm 2 The cured product thus obtained is heated under a nitrogen atmosphere at 120°C for 30 minutes, and the transmittance in the thickness direction of the cured product after the following heat resistance test is measured using a UV-visible near-infrared spectrophotometer under the following measurement conditions, and is 70% or more.

[0093] (Measurement conditions)

[0094] Measurement method: transmission method

[0095] Measurement wavelength: 400 nm

[0096] Reference: air

[0097] Detector: integrating sphere / photomultiplier tube (200 nm to 850 nm)

[0098] Integrating sphere: PbS (850 nm to 2600 nm)

[0099] (Heat resistance test)

[0100] The cured product is heated in an oven set to 125°C for 168 hours under an air atmosphere.

[17]

[0102] The lens resin composition according to any one of the above [1] to

[16] is used for a wafer-level lens.

[18]

[0104] A cured product for a lens obtained by curing the lens resin composition according to any one of the above [1] to

[17] .

[19]

[0106] A lens provided with the cured product for a lens according to the above

[18] .

[0107] Effects of Invention

[0108] The lens resin composition of the present application can form a cured product with improved balance of high refractive index, high light transmittance, high heat resistance, and resistance to bleeding by having the above configuration.

[0109] In addition, the lens cured product of the present application is obtained by curing the above lens resin composition, and thus has improved balance of high refractive index, high light transmittance, high heat resistance, and resistance to bleeding.

[0110] Further, the lens of the present application has improved balance of high refractive index, high light transmittance, high heat resistance, and resistance to bleeding because it has the above lens cured product. BRIEF DESCRIPTION OF DRAWINGS

[0111] [ Figure 1 ] is a plan view showing an example of the configuration of a wafer-level lens array having a plurality of wafer-level lenses. DETAILED DESCRIPTION

[0112] Hereinafter, the present application will be described based on the embodiments.

[0113] In the present embodiment, "A to B" indicating a numerical range means A or more and B or less, if not otherwise specified.

[0114] In the present embodiment, if not otherwise specified, a group such as an alkyl group "having a substituent" means that a hydrogen atom present in its structure is substituted with a substituent. The position of the substituent and the number of the substituents are not particularly limited. Note that, when the substituent has a carbon atom, the number of carbon atoms of the group having a substituent does not include the number of carbon atoms of the substituent. For example, in the case of ethyl having a phenyl group as a substituent, it is regarded as an alkyl group having a carbon atom number of 2.

[0115] The non-volatile component in the present embodiment means a component of the lens resin composition other than a volatile component such as a solvent.

[0116] [Lens resin composition]

[0117] The lens resin composition of the first embodiment of the present application contains: a photocationic polymerization initiator (X) including a salt formed from an anion and a cation represented by the following general formula (1); an epoxy compound (Y) including 2 or more epoxy groups in a molecule; and a stabilizer having an alkaline dissociation constant pKb of 6.0 or more based on the following <Method for measuring alkaline dissociation constant pKb>.

[0118] <Method for measuring alkaline dissociation constant pKb>

[0119] A stabilizer 0.1 g was dissolved in 100 g of an aqueous solution containing 80 mass% of methanol, and the solution was titrated with a 3N-HCl aqueous solution while measuring the pH with a pH meter, thereby obtaining a pH titration curve. Using the obtained pH titration curve, the pKb value was calculated by a graphic method.

[0120] [Chemical Formula 11]

[0121]

[0122] In General Formula (1), R 1 ~R 4 each independently represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0123] The lens resin composition of the first embodiment of the present application can form a cured product in which the balance of properties of high refractive index, high light transmittance, high heat resistance, and resistance to bleeding is improved. If the generation of bleeding during ultraviolet curing and heating is suppressed, the generation of foreign matter can be suppressed. The detailed mechanism is not clear, but it is presumed that the photocationic polymerization initiator containing anionic gallium hardly generates a strong acid component even upon heating, and thus the deterioration caused by heating, such as the generation of coloring and foreign matter, is suppressed. In addition, the photocationic polymerization initiator containing anionic gallium can exhibit the polymerization performance of the current technical level, and the adverse effects on each property of high refractive index, high light transmittance, and high heat resistance are suppressed. It is further considered that the stabilizer having an alkaline dissociation constant pKb of 6.0 or more according to the above <Method for measuring alkaline dissociation constant pKb> can prevent the combination with a strong acid component and can suppress the bleeding caused by the change in compatibility by being used in combination with the photocationic polymerization initiator containing anionic gallium which hardly generates a strong acid component even upon heating.

[0124] From the viewpoint of further improving the balance of properties of high refractive index, high light transmittance, high heat resistance, coloring resistance, and bleeding resistance, the above alkaline dissociation constant pKb of the stabilizer in the lens resin composition of the first embodiment of the present application is preferably 6.0 or more, more preferably 7.0 or more, further preferably 8.0 or more, further preferably 9.0 or more, further preferably 10.0 or more, and preferably 15.0 or less, more preferably 14.0 or less, further preferably 13.0 or less, further preferably 12.0 or less, further preferably 11.5 or less.

[0125] That is, from the viewpoint of further improving the balance of properties of high refractive index, high light transmittance, high heat resistance, color resistance, and bleeding resistance, the above base dissociation constant pKb of the stabilizer in the lens resin composition of the first embodiment of the present application is 6.0 or greater, preferably 6.0 or greater and 15.0 or less, more preferably 7.0 or greater and 14.0 or less, further preferably 8.0 or greater and 13.0 or less, further preferably 9.0 or greater and 12.0 or less, further preferably 10.0 or greater and 11.5 or less.

[0126] The stabilizer in the lens resin composition of the first embodiment of the present application preferably contains a stabilizer containing one or two or more partial structures selected from the group consisting of the partial structure represented by the following general formula (6) and the partial structure represented by the following general formula (7), and more preferably contains a stabilizer containing the partial structure represented by the following general formula (6).

[0127] [Chemical Formula 12]

[0128]

[0129] In the general formula (6), R a represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0130] [Chemical Formula 13]

[0131]

[0132] In the general formula (7), O· represents an oxyl group.

[0133] The lens resin composition of the second embodiment of the present application contains: a photocationic polymerization initiator (X) containing a salt formed from an anion and a cation represented by the following general formula (1); an epoxy compound (Y) containing two or more epoxy groups in a molecule; and a stabilizer containing one or two or more partial structures selected from the group consisting of the partial structure represented by the following general formula (6) and the partial structure represented by the following general formula (7); and preferably contains: a photocationic polymerization initiator (X) containing a salt formed from an anion and a cation represented by the following general formula (1); an epoxy compound (Y) containing two or more epoxy groups in a molecule; and a stabilizer containing the partial structure represented by the following general formula (6).

[0134] [Chemical Formula 14]

[0135]

[0136] In the general formula (1), R 1 ~R 4 each independently represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0137] [Chemical Formula 15]

[0138]

[0139] In General Formula (6), R a represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0140] [Chemical Formula 16]

[0141]

[0142] In General Formula (7), O represents an oxyl group.

[0143] The lens resin composition of the second embodiment of the present application can form a cured product in which the balance of properties of high refractive index, high light transmittance, high heat resistance, and resistance to bleeding is improved. If the generation of bleeding during ultraviolet curing and heating is suppressed, the generation of foreign matter can be suppressed. The detailed mechanism is not clear, but it is presumed that the photocationic polymerization initiator containing anionic gallium hardly generates a strong acid component even upon heating, and thus the deterioration caused by heating such as coloring and the generation of foreign matter is suppressed. In addition, the photocationic polymerization initiator containing anionic gallium can exhibit the polymerization performance of the current technical level, and suppresses adverse effects on each property of high refractive index, high light transmittance, and high heat resistance. It is further considered that the stabilizer containing one or two or more partial structures selected from the group consisting of the partial structure represented by General Formula (6) and the partial structure represented by General Formula (7) can prevent the combination with a strong acid component and can suppress bleeding caused by a change in compatibility by being used in combination with the photocationic polymerization initiator containing anionic gallium which hardly generates a strong acid component even upon heating.

[0144] Hereinafter, each component contained in the lens resin composition of the first embodiment of the present application and the second embodiment of the present application (hereinafter, collectively referred to as the present embodiment) will be described in detail.

[0145] [Photocationic Polymerization Initiator (X)]

[0146] The lens resin composition of the present embodiment contains a photocationic polymerization initiator (X) containing a salt formed of an anion and a cation represented by General Formula (1) below.

[0147] [Chemical Formula 17]

[0148]

[0149] In General Formula (1), R 1 ~R 4 each independently represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0150] R of general formula (1) 1 R of general formula (1) 4 The alkyl group having 1 to 18 carbon atoms represented by R is not limited to any one of a straight chain, a branched chain or a cyclic structure.

[0151] As specific examples thereof, there can be mentioned an alkyl group such as methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, hexyl, octyl, 2-ethylhexyl or decyl; a cyclic alkyl group such as cyclopentyl, cyclohexyl, cyclooctyl, norbornyl, bicyclononyl or tricyclodecanyl; and the like.

[0152] R of general formula (1) 1 R of general formula (1) 4 As specific examples of the aryl group having 6 to 14 carbon atoms represented by R, there can be mentioned a phenyl group, a tolyl group, a naphthyl group, a biphenyl group, a terphenyl group, a phenanthryl group or an anthryl group, and the like.

[0153] R of general formula (1) 1 R of general formula (1) 4 The alkyl group having 1 to 18 carbon atoms or the aryl group having 6 to 14 carbon atoms represented by R can have a substituent.

[0154] R of general formula (1) 1 R of general formula (1) 4 The substituent which the alkyl group having 1 to 18 carbon atoms or the aryl group having 6 to 14 carbon atoms represented by R can have is not particularly limited. For example, there can be mentioned a halogen atom, a hydrocarbon group, a halogen-containing group, an oxygen-containing group, a sulfur-containing group, a nitrogen-containing group and the like.

[0155] As the halogen atom, there can be mentioned a fluorine atom, a chlorine atom or a bromine atom, and the like.

[0156] As the hydrocarbon group, there can be mentioned an alkyl group such as methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, hexyl, octyl, 2-ethylhexyl or decyl; a cyclic alkyl group such as cyclopentyl, cyclohexyl, cyclooctyl, norbornyl, bicyclononyl or tricyclodecanyl; an aryl group such as phenyl, tolyl, naphthyl, biphenyl, terphenyl, phenanthryl or anthryl; an aralkyl group such as benzyl or phenylethyl; a dienyl divalent derivative group such as 1,3-butadienyl, isoprenyl (2-methyl-1,3-butadienyl), meso-prenyl (1,3-pentadienyl), 2,4-hexadienyl, 1,4-diphenyl-1,3-pentadienyl or cyclopentadienyl; and the like.

[0157] R of general formula (1) 1 R of general formula (1) 4 As the halogen-containing group which the alkyl group having 1 to 18 carbon atoms or the aryl group having 6 to 14 carbon atoms represented by R can have, there can be mentioned a halogen-containing hydrocarbon group such as trifluoromethyl, pentafluoroethyl, 1,1,1,3,3,3-hexafluoro-2-propyl or nonafluoro-t-butyl; a halogen-containing aryl group such as pentafluorophenyl, pentachlorophenyl; and the like.

[0158] As the oxygen-containing group, there can be mentioned an alkoxy group such as methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy or t-butoxy; an aryloxy group such as phenoxy, 2,6-dimethylphenoxy or 2,4,6-trimethylphenoxy; an ester group such as acetyloxy, benzoyloxy, methoxycarbonyl, phenoxycarbonyl or p-chlorophenoxycarbonyl; an ether group; an acyl group such as formyl, acetyl, benzoyl, p-chlorobenzoyl or p-methoxybenzoyl; a carboxyl group; a carbonate group; a hydroxyl group; a peroxyl group; a carboxylic anhydride group; a furyl group and the like.

[0159] As the sulfur-containing group, there can be mentioned a mercapto group; a thioester group such as acetylthio, benzoylthio, methylthiocarbonyl or phenylthiocarbonyl; a dithioester group; an alkylthio group such as methylthio or ethylthio; an arylthio group such as phenylthio, methylphenylthio or naphthylthio; a thioacyl group; a thioether group; a thiocyanate group; an isothiocyanate group; a sulfonate group such as methylsulfonate, ethylsulfonate or phenylsulfonate; a sulfonamide group such as phenylsulfonamide, N-methylsulfonamide or N-methyl-p-toluenesulfonamide; a thio-carboxyl group; a dithio-carboxyl group; a sulfo group; a sulfonyl group; a sulfinyl group; a sulfenyl group and the like.

[0160] As the nitrogen-containing group, there can be mentioned an amino group; an alkylamino group such as dimethylamino or ethylmethylamino; an arylamino group such as diphenylamino; an imino group; an alkylimino group such as methylimino, ethylimino, propylimino or butylimino; an arylimino group such as phenylimino; an amide group; an alkylamide group such as acetamide or N-methylacetamide; an arylamide group such as N-methylbenzamide; an imide group; an alkylimide group such as acetylimide; an arylimide group such as benzoylimide; a pyrrolidinyl group; a hydrazine group; a hydrazone group; a nitro group; a nitroso group; a cyano group; an isocyano group; a cyanate group; an amidine group; a diazo group; an amino group and the like.

[0161] Preferably, 3 or more of R 1 ~R 4 are aryl groups having 6 to 14 carbon atoms, more preferably R 1 ~R 4 are all aryl groups having 6 to 14 carbon atoms, and further preferably R 1 ~R 4 are all aryl groups having 6 to 8 carbon atoms, and further preferably R 1 ~R 4 are all aryl groups having 6 carbon atoms.

[0162] R 1 ~R 4It is preferable to have a halogen atom as the substituent, and it is more preferable to have a fluorine atom as the substituent. Specifically, the photocationic polymerization initiator (X) preferably contains at least one selected from anions represented by the following formula (3) and anions represented by the following formula (4) as the anion. Thereby, the heat resistance of the cured product for lenses formed from the resin composition for lenses can be further improved.

[0163] [Chemical Formula 18]

[0164]

[0165] [Chemical Formula 19]

[0166]

[0167] The photocationic polymerization initiator (X) contains a cation that forms a salt with the anion represented by the general formula (1).

[0168] The cation that forms a salt with the anion represented by the general formula (1) is not particularly limited as long as it is a monovalent cation. For example, oxonium ions, ammonium ions, phosphonium ions, sulfonium ions, or iodonium ions, and the like can be exemplified.

[0169] As the oxonium ion, oxoniums such as trimethyl oxonium, diethylmethyl oxonium, triethyl oxonium, and tetramethylene methyl oxonium; pyryliums such as 4-methyl pyrylium, 2,4,6-trimethyl pyrylium, 2,6-di-t-butyl pyrylium, and 2,6-diphenyl pyrylium; chromeniums such as 2,4-dimethyl chromenium and 1,3-dimethyl isochromenium; and isochromeniums can be exemplified.

[0170] As the ammonium ion, pyrrolidiniums such as N,N-dimethyl pyrrolidinium, N-ethyl-N-methyl pyrrolidinium, and N,N-diethyl pyrrolidinium; imidazoliniums such as N,N'-dimethyl imidazolinium, N,N'-diethyl imidazolinium, N-ethyl-N'-methyl imidazolinium, 1,3,4-trimethyl imidazolinium, and 1,2,3,4-tetramethyl imidazolinium; tetrahydropyrimidiniums such as N,N'-dimethyl tetrahydropyrimidinium; morpholiniums such as N,N'-dimethyl morpholinium; piperidiniums such as N,N'-diethyl piperidinium; pyridiniums such as N-methyl pyridinium, N-benzyl pyridinium, and N-benzoylmethyl pyridinium; imidazoles such as N,N'-dimethyl imidazole; quinolines such as N-methyl quinolinium, N-benzyl quinolinium, and N-benzoylmethyl quinolinium; isoquinolines such as N-methyl isoquinolinium; thiazoliums such as benzyl benzothiazolium and benzoylmethyl benzothiazolium; acridiniums such as benzyl acridinium and benzoylmethyl acridinium; and the like can be exemplified.

[0171] As the phosphonium ion, tetraphenylphosphonium, tetra-p-tolylphosphonium, tetra(2-methoxyphenyl)phosphonium, tetra(3-methoxyphenyl)phosphonium, tetra(4-methoxyphenyl)phosphonium, and the like tetraarylphosphonium; triphenylbenzylphosphonium, triphenylbenzoylmethylphosphonium, triphenylmethylphosphonium, and triphenylbutylphosphonium, and the like triarylphosphonium; triethylbenzylphosphonium, tributylbenzylphosphonium, tetraethylphosphonium, tetrabutylphosphonium, tetrahexylphosphonium, triethylbenzoylmethylphosphonium, and tributylbenzoylmethylphosphonium, and the like tetraalkylphosphonium, and the like can be exemplified.

[0172] Examples of sulfonium ions include triphenylsulfonium, tri-p-tolylsulfonium, tri-o-tolylsulfonium, tris(4-methoxyphenyl)sulfonium, 1-naphthyldiphenylsulfonium, 2-naphthyldiphenylsulfonium, tris(4-fluorophenyl)sulfonium, tri-1-naphthylsulfonium, tri-2-naphthylsulfonium, tris(4-hydroxyphenyl)sulfonium, 4-(phenylthio)phenyldiphenylsulfonium, 4-(p-tolylthio)phenyldi-p-tolylsulfonium, 4-(4-methoxyphenylthio)phenylbis(4-methoxyphenyl)sulfonium, 4-(phenylthio)phenylbis(4-fluorophenyl)sulfonium, 4-(phenylthio)phenylbis(4-methoxyphenyl)sulfonium, and 4-(phenylthio)phenyldi-p-tolylsulfonium. Sulfonium, [4-(4-biphenylthio)phenyl]-4-biphenylphenylsulfonium; [4-(2-thioxanthonethio)phenyl]diphenylsulfonium, bis[4-(diphenylsulfonium)phenyl]sulfide, bis[4-{bis[4-(2-hydroxyethoxy)phenyl]sulfonium}phenyl]sulfonium, bis{4-[bis(4-fluorophenyl)sulfonium]phenyl}sulfonium, bis{4-[bis(4-methylphenyl)sulfonium]phenyl}sulfonium, bis{4-[bis(4-methoxyphenyl)sulfonium]phenyl}sulfonium, 4-(4-benzoyl-2-chlorophenylthio)phenylbis(4-fluorophenyl)sulfonium, 4-(4-benzoyl-2-chlorophenylthio)phenylbis(4-fluorophenyl)sulfonium, 4-(4-benzoylphenylthio)phenylbis(4-fluorophenyl)sulfonium, 4-(4-benzoylphenylthio)phenyldiphenylsulfonium, 7-isopropyl-9-oxo-10-thia-9,10-dihydroanthracene-2-yldi-p-tolylsulfonium, 7-isopropyl-9-oxo-10-thia-9,10-dihydroanthracene-2-yldiphenylsulfonium, 2-[(di-p-tolyl)sulfonium]thioxanthone, 2-[(diphenyl)sulfonium]thioxanthone, 4-(9-oxo-9H-thioxanth-2-yl)thiophenyl-9-oxo-9H-thioxanth-2-ylphenylsulfonium, 4-[4-(4-tert-butylbenzoyl)sulfonium]thioxanthone Triaryl sulfoniums including 4-[4-(4-tert-butylbenzoyl)phenylthio]phenyl diphenyl sulfonium, 4-[4-(benzoylphenylthio)]phenyl diphenyl sulfonium, 4-[4-(benzoylphenylthio)]phenyl diphenyl sulfonium, 5-(4-methoxyphenyl)thioanthraquinone, 5-phenylthioanthraquinone, 5-tolylthioanthraquinone, 5-(4-ethoxyphenyl)thioanthraquinone, and 5-(2,4,6-trimethylphenyl)thioanthraquinone; diphenylbenzoylmethyl sulfonium, diphenyl-4-nitrobenzoylmethyl sulfonium, diphenylbenzyl sulfonium, and diphenylmethyl sulfonium;monofunctional onium salt such as phenylmethylbenzylsulfonium, 4-hydroxyphenylmethylbenzylsulfonium, 4-methoxyphenylmethylbenzylsulfonium, 4-acetyloxycarbonylphenylmethylbenzylsulfonium, 4-hydroxyphenyl(2-naphthylmethyl)methylsulfonium, 2-naphthylmethylbenzylsulfonium, 2-naphthylmethyl(l-ethoxycarbonyl)ethylsulfonium, phenylmethylbenzoylmethylsulfonium, 4-hydroxyphenylmethylbenzoylmethylsulfonium, 4-methoxyphenylmethylbenzoylmethylsulfonium, 4-acetyloxycarbonylphenylmethylbenzoylmethylsulfonium, 2-naphthylmethylbenzoylmethylsulfonium, 2-naphthylstearylbenzoylmethylsulfonium, and 9-anthrylmethylbenzoylmethylsulfonium; trialkylsulfonium such as dimethylbenzoylmethylsulfonium, benzoylmethyltetrahydrothiophenium, dimethylbenzylsulfonium, benzyltetrahydrothiophenium, and stearylmethylbenzoylmethylsulfonium; and the like.

[0173] As the iodonium ion, diphenyliodonium, di-p-tolyl iodonium, bis(4-dodecylphenyl)iodonium, bis(4-methoxyphenyl)iodonium, (4-octyloxyphenyl)phenyl iodonium, bis(4-decyloxy)phenyl iodonium, 4-(2-hydroxytetradecyloxy)phenylphenyl iodonium, 4-isopropylphenyl(p-tolyl)iodonium, and 4-isobutylphenyl(p-tolyl)iodonium, and the like can be exemplified.

[0174] The photo cationic polymerization initiator (X) preferably contains at least one selected from the group consisting of an ammonium ion, a phosphonium ion, a sulfonium ion, and an iodonium ion as a cation, more preferably contains at least one selected from the group consisting of a sulfonium ion and an iodonium ion, further preferably contains a sulfonium ion, further preferably contains a triaryl sulfonium.

[0175] The photo cationic polymerization initiator (X) preferably contains a salt formed from at least one selected from the group consisting of an anion represented by the following formula (3) and an anion represented by the following formula (4) and a sulfonium ion. Thereby, the heat resistance of the cured product for lenses formed from the resin composition for lenses can be further improved.

[0176] [Chemical Formula 20]

[0177]

[0178] [Chemical Formula 21]

[0179]

[0180] The following exemplifies specific examples of the anion contained in the photo cationic polymerization initiator (X), but the anion contained in the photo cationic polymerization initiator (X) in the present embodiment is not limited to these.

[0181] [Chemical Formula 22]

[0182]

[0183] The photocationic polymerization initiator (X) can be synthesized, for example, according to the known method described in International Publication No. 2018 / 020974 or the like. In addition, CPI-310FG (trade name, photocationic polymerization initiator, manufactured by San-Apro Co., Ltd.) or the like, which is commercially available, can be used.

[0184] The lower limit value of the content of the photocationic polymerization initiator (X) in the lens resin composition of the present embodiment is preferably 0.05 parts by mass or more, more preferably 0.07 parts by mass or more, further preferably 0.1 parts by mass or more, further preferably 0.5 parts by mass or more, further preferably 1.0 parts by mass or more, and further preferably 1.5 parts by mass or more, relative to 100 parts by mass of the epoxy compound (Y). Thereby, the performance balance of high refractive index and high heat resistance can be improved.

[0185] In addition, the upper limit value of the content of the photocationic polymerization initiator (X) in the lens resin composition of the present embodiment is preferably 15 parts by mass or less, more preferably 10 parts by mass or less, further preferably 8 parts by mass or less, and further preferably 6 parts by mass or less, relative to 100 parts by mass of the epoxy compound (Y). Thereby, the performance balance of high light transmittance and exudation resistance can be improved.

[0186] The photocationic polymerization initiator (X) can be used singly or in a mixture of a plurality of kinds. In the case of using a mixture of a plurality of kinds, the total of the contents of the respective photocationic polymerization initiators (X) is taken as the content of the photocationic polymerization initiator (X).

[0187] Note that, when the molar absorption coefficient of the photocationic polymerization initiator (X) at a wavelength of 300 to 380 nm is high, the content can be adjusted to an appropriate content according to the volume and thickness at the time of using the lens resin composition.

[0188] <epoxy compound (Y)>

[0189] The lens resin composition of the present embodiment contains an epoxy compound (Y) containing two or more epoxy groups in a molecule.

[0190] As the epoxy compound (Y) containing two or more epoxy groups in a molecule, diethylene glycol diglycidyl ether, hexanediol diglycidyl ether, dimethylolpropane diglycidyl ether, polypropylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane triglycidyl ether, and pentaerythritol tetraglycidyl ether, or the like can be exemplified.

[0191] Further, as the epoxy compound (Y) containing two or more epoxy groups in a molecule, alicyclic epoxy resins such as 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and ε-caprolactone-modified 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate can also be exemplified.

[0192] Further, as the epoxy compound (Y) containing two or more epoxy groups in a molecule, epoxy resins having aromatic rings such as bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, biphenyl-phenol novolak type epoxy compounds, and epoxy compounds in which a part or all of the alcoholic hydroxyl groups possessed in the structures of these epoxy compounds are epoxidized can also be exemplified.

[0193] As the commercially available product of the epoxy compound (Y), EPICLON series (bisphenol A type epoxy resins, manufactured by DIC Corporation) represented by EXA-850CRP, jER series (manufactured by Mitsubishi Chemical Corporation) represented by jER828, YD series (manufactured by Nitto Chemical Co., Ltd.) represented by YD-127, TECHMORE VG 3101L (3-functional epoxy resin, manufactured by Printec Corporation), and the like can be exemplified.

[0194] The epoxy compound (Y) is preferably an epoxy compound having an aromatic ring. Thereby, the refractive index of the cured product obtained by curing the lens resin composition can be increased, and the optical properties of the lens can be improved.

[0195] The epoxy compound (Y) is preferably a compound represented by the following general formula (2).

[0196] [Chemical Formula 23]

[0197]

[0198] In the general formula (2), R 5 , R 6 , R 8 , and R 9 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a trifluoromethyl group, R 7 represents a hydrogen atom or a glycidyl group, and n is an average repetition number and represents a real number in the range of 0 to 30.

[0199] As the alkyl group having 1 to 4 carbon atoms represented by R 5 , R 6 , R 8 , and R 9 , an alkyl group having 1 to 4 carbon atoms among the alkyl groups exemplified as the alkyl group having 1 to 18 carbon atoms represented by R 1 to R 4 can be exemplified.

[0200] R 5 , R 6 , R 8 and R 9 is preferably an alkyl group having 1 to 4 carbon atoms or a trifluoromethyl group, more preferably a methyl group or a trifluoromethyl group, and further preferably a methyl group.

[0201] n is preferably 1 to 20, and more preferably 5 to 15. Note that n is calculated from the value of the weight average molecular weight calculated in polystyrene based on the measurement results of GPC (gel permeation chromatography).

[0202] The epoxy equivalent of the epoxy compound (Y) is not particularly limited, and is preferably 100 g / eq or more and 200 g / eq or less, and more preferably 120 g / eq or more and 180 g / eq or less. Note that the epoxy equivalent in this specification refers to the value measured according to the method of JIS K 7236.

[0203] When the nonvolatile components of the lens resin composition of the present embodiment are taken as 100% by mass in total, the lower limit value of the content of the epoxy compound (Y) is preferably 40% by mass or more, more preferably 45% by mass or more, and further preferably 50% by mass or more. Thereby, the performance balance of high light transmittance and resistance to bleeding can be improved.

[0204] When the nonvolatile components of the lens resin composition of the present embodiment are taken as 100% by mass in total, the upper limit value of the content of the epoxy compound (Y) is preferably 99% by mass or less, more preferably 90% by mass or less, further preferably 80% by mass or less, further preferably 70% by mass or less, and further preferably 60% by mass or less. Thereby, the performance balance of high refractive index and high heat resistance can be improved.

[0205] The epoxy compound (Y) can be used singly or in a mixture of a plurality of kinds. When a plurality of kinds are used in a mixture, the total of the contents of the respective epoxy compounds (Y) is taken as the content of the epoxy compound (Y).

[0206] <Stabilizer>

[0207] The lens resin composition of the present embodiment contains a stabilizer containing one or two or more kinds of partial structures selected from the group consisting of the partial structure represented by the following general formula (6) and the partial structure represented by the following general formula (7).

[0208] [Chemical Formula 24]

[0209]

[0210] In the general formula (6), R a represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0211] [Chemical Formula 25]

[0212]

[0213] In General Formula (7), O• represents an oxy group.

[0214] R of General Formula (6) a The alkyl group having 1 to 18 carbon atoms represented by R

[0215] As specific examples thereof, there can be mentioned an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a t-butyl group, a hexyl group, an octyl group, a 2-ethylhexyl group or a decyl group; a cycloalkyl group such as a cyclopentyl group, a cyclohexyl group, a cyclooctyl group, a norbornyl group, a bicyclononyl group or a tricyclodecane group; and the like.

[0216] R of General Formula (6) a As specific examples of the aryl group having 6 to 14 carbon atoms represented by R

[0217] R of General Formula (6) a The alkyl group having 1 to 18 carbon atoms or the aryl group having 6 to 14 carbon atoms represented by R

[0218] R of General Formula (6) a The substituents which the alkyl group having 1 to 18 carbon atoms or the aryl group having 6 to 14 carbon atoms represented by R

[0219] As the halogen atom, there can be mentioned a fluorine atom, a chlorine atom or a bromine atom, and the like.

[0220] As the hydrocarbon group, there can be mentioned an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a t-butyl group, a hexyl group, an octyl group, a 2-ethylhexyl group or a decyl group; a cycloalkyl group such as a cyclopentyl group, a cyclohexyl group, a cyclooctyl group, a norbornyl group, a bicyclononyl group or a tricyclodecane group; an aryl group such as a phenyl group, a tolyl group, a naphthyl group, a biphenyl group, a terphenyl group, a phenanthryl group or an anthryl group; an aralkyl group such as a benzyl group or a phenylethyl group; a dienyl divalent derivative group such as a 1,3-butadienyl group, an isoprenyl group (2-methyl-1,3-butadienyl group), a meso-prenyl group (1,3-pentadienyl group), a 2,4-hexadienyl group, a 1,4-diphenyl-1,3-pentadienyl group or a cyclopentadienyl group; and the like.

[0221] R of General Formula (6) aThe halogen-containing group that the alkyl group having 1 to 18 carbon atoms or the aryl group having 6 to 14 carbon atoms can have can be exemplified by a halogen-containing hydrocarbon group such as a trifluoromethyl group, a pentafluoroethyl group, a 1,1,1,3,3,3-hexafluoro-2-propyl group, or a nonafluoro-t-butyl group; a halogen-containing aryl group such as a pentafluorophenyl group, a pentachlorophenyl group, or the like.

[0222] As the oxygen-containing group, an alkoxy group such as a methoxy group, an ethoxy group, an n-propoxy group, an iso-propoxy group, an n-butoxy group, an iso-butoxy group, or a t-butoxy group; an aryloxy group such as a phenoxy group, a 2,6-dimethylphenoxy group, or a 2,4,6-trimethylphenoxy group; an ester group such as an acetyloxy group, a benzoyloxy group, a methoxycarbonyl group, a phenoxycarbonyl group, or a p-chlorophenoxycarbonyl group; an ether group; an acyl group such as a formyl group, an acetyl group, a benzoyl group, a p-chlorobenzoyl group, or a p-methoxybenzoyl group; a carboxyl group; a carbonate group; a hydroxyl group; a peroxyl group; a carboxylic anhydride group; a furanyl group, or the like can be exemplified.

[0223] As the sulfur-containing group, a mercapto group; a thioester group such as an acetylthio group, a benzoylthio group, a methylthiocarbonyl group, or a phenylthiocarbonyl group; a dithioester group; an alkylthio group such as a methylthio group or an ethylthio group; an arylthio group such as a phenylthio group, a methylphenylthio group, or a naphthylthio group; a thioacyl group; a thioether group; a thiocyanate group; an isothiocyanate group; a sulfonate ester group such as a methylsulfonate group, an ethylsulfonate group, or a phenylsulfonate group; a sulfonamide group such as a phenylsulfonamide group, an N-methylsulfonamide group, or an N-methyl-p-toluenesulfonamide group; a thio carboxyl group; a dithio carboxyl group; a sulfo group; a sulfonyl group; a sulfinyl group; a sulfinyl group; or the like can be exemplified.

[0224] As the nitrogen-containing group, an amino group; an alkylamino group such as a dimethylamino group or an ethylmethylamino group; an arylamino group such as a diphenylamino group; an imino group; an alkyl imino group such as a methyl imino group, an ethyl imino group, a propyl imino group, or a butyl imino group; an aryl imino group such as a phenyl imino group; an amide group; an alkyl amide group such as an acetyl amide group or an N-methyl acetyl amide group; an aryl amide group such as an N-methyl benzoyl amide group; an imide group; an alkyl imide group such as an acetyl imide group; an aryl imide group such as a benzoyl imide group; a pyrrolidinyl group; a hydrazine group; a hydrazone group; a nitro group; a nitroso group; a cyano group; an isocyano group; a cyanate group; an amidine group; a diazo group; an amino group, or the like can be exemplified.

[0225] The stabilizer containing the partial structure represented by General Formula (6) preferably contains R a A compound having 1 to 15 carbon atoms is preferable, a compound having 6 to 12 carbon atoms is more preferable, a compound having 8 to 12 carbon atoms is further preferable, and a compound having 11 carbon atoms is further preferable. By this, the balance of the high refractive index, the high light transmittance, the high heat resistance, and the exudation resistance of the cured product for lenses using the resin composition of the present embodiment can be further improved.

[0226] As the stabilizer containing one or two or more partial structures selected from the group consisting of the partial structure represented by General Formula (6) and the partial structure represented by General Formula (7), for example, hindered amine-based antioxidants such as bis[2,2,6,6-tetramethyl-1-(undecyloxy)piperidin-4-yl]=carbonate, bis[1-(octyloxy)-2,2,6,6-tetramethyl-4-piperidyl]sebacate, 2-[[4,6-bis[butyl[1-(cyclohexyloxy)-2,2,6,6-tetramethylpiperidin-4-yl]amino]-1,3,5-triazin-2-yl]amino]ethanol, bis(2,2,6,6-tetramethyl-4-piperidyl-1-oxy)sebacate, and the like can be given. As commercially available products of such stabilizers, for example, LA-81 and the like of the ADKSTAB series manufactured by ADEKA Corporation, Tinuvin 123, Tinuvin 152, and the like manufactured by BASF Corporation can be given.

[0227] The lower limit value of the content of the stabilizer of the present embodiment, that is, the lower limit value of the content of the stabilizer containing one or two or more partial structures selected from the group consisting of the partial structure represented by General Formula (6) and the partial structure represented by General Formula (7), with respect to 100 parts by mass of the epoxy compound (Y) is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, further preferably 0.10 parts by mass or more, further preferably 0.15 parts by mass or more. Thereby, the performance balance of high light transmittance and bleeding resistance of the cured product for lenses using the resin composition of the present embodiment can be further improved.

[0228] In addition, the upper limit value of the content of the stabilizer of the present embodiment, that is, the upper limit value of the content of the stabilizer containing one or two or more partial structures selected from the group consisting of the partial structure represented by General Formula (6) and the partial structure represented by General Formula (7), with respect to 100 parts by mass of the epoxy compound (Y) is preferably 5.0 parts by mass or less, more preferably 3.0 parts by mass or less, further preferably 1.0 parts by mass or less, further preferably 0.5 parts by mass or less, further preferably 0.3 parts by mass or less, further preferably 0.2 parts by mass or less. Thereby, the performance balance of high refractive index and high heat resistance of the cured product for lenses using the resin composition of the present embodiment can be further improved.

[0229] That is, from the viewpoint of further improving the balance of properties of the high refractive index, high heat resistance, high light transmittance, and exudation resistance of the cured product for lenses using the resin composition of the present embodiment, the content of the stabilizer of the present embodiment is preferably 0.01 parts by mass or more and 5.0 parts by mass or less, more preferably 0.01 parts by mass or more and 3.0 parts by mass or less, further preferably 0.01 parts by mass or more and 1.0 parts by mass or less, further preferably 0.05 parts by mass or more and 0.5 parts by mass or less, further preferably 0.10 parts by mass or more and 0.3 parts by mass or less, further preferably 0.15 parts by mass or more and 0.2 parts by mass or less, with respect to 100 parts by mass of the epoxy compound (Y).

[0230] The resin composition for lenses of the present embodiment can contain an antioxidant other than the above-described stabilizer.

[0231] As the antioxidant other than the above-described stabilizer, a phenol-based antioxidant, a phosphorus-based antioxidant, a sulfide-based antioxidant, and a hindered amine-based antioxidant, and the like can be exemplified.

[0232] The antioxidant other than the above-described stabilizer preferably contains a phenol-based antioxidant, and more preferably contains a hindered phenol-based antioxidant.

[0233] As the hindered phenol-based antioxidant, 2,6-di-tert-butylhydroxytoluene and pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], and the like can be exemplified.

[0234] As the commercially available product of the hindered phenol-based antioxidant, AO-20, AO-30, AO-40, AO-50, AO-60, and AO-80 of the ADKSTAB series manufactured by ADEKA Co., Ltd., and the like can be exemplified.

[0235] As the phosphorus-based antioxidant, phosphine-based compounds such as trialkylphosphine and triarylphosphine, trialkyl phosphite, and triaryl phosphite, and the like can be exemplified.

[0236] As the commercially available product of the phosphorus-based antioxidant, PEP-4C, PEP-8, PEP-24G, PEP-36, HP-10, 260, 522A, 329K, 1178, 1500, 135A, and 3010 of the ADKSTAB series manufactured by ADEKA Co., Ltd., and the like can be exemplified.

[0237] As the commercially available product of the sulfide-based antioxidant, AO-26, AO-412S, and AO-503A of the ADKSTAB series manufactured by ADEKA Co., Ltd., and the like can be exemplified.

[0238] As the hindered amine-based antioxidant, 2,4-bis[N-butyl-N-(l-cyclohexyloxy-2,2,6,6- tetramethylpiperidin-4-yl)amino]-6-(2-hydroxyethyloxy)-l,3,5-triazine, bis(2,2,6,6-tetramethyl-l- (octyloxy)-4-piperidinyl) sebacate, and the like can be exemplified.

[0239] As the commercially available hindered amine-based antioxidant, hindered amine-based antioxidants such as TINUVIN series 111 FDL, 123, 144, 152, 292, and 5100 manufactured by BASF Co. can be exemplified.

[0240] In the case where the lens resin composition of the present embodiment further contains an antioxidant other than the above-mentioned stabilizer, the content thereof can be appropriately set according to the purpose. From the viewpoint of obtaining a cured product having little coloring, the lower limit value of the content of the antioxidant other than the above-mentioned stabilizer in the lens resin composition of the present embodiment is preferably 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, further preferably 0.3 parts by mass or more, further preferably 0.5 parts by mass or more, further preferably 0.8 parts by mass or more, with respect to 100 parts by mass of the epoxy compound (Y). In addition, from the viewpoint of obtaining a resin composition having excellent curability, the upper limit value of the content of the antioxidant other than the above-mentioned stabilizer is preferably 5.0 parts by mass or less, more preferably 3.0 parts by mass or less, further preferably 1.0 parts by mass or less.

[0241] [Other Components]

[0242] The lens resin composition of the present embodiment can contain, as necessary, a monofunctional epoxy compound (Z), an oxetane compound (W), a solvent, an adhesion-imparting agent, a polyol compound, a polyphenol compound, a sensitizer, an ion trapping agent, a photocationic polymerization initiator (X) other than the photocationic polymerization initiator (other photocationic polymerization initiator), and the like.

[0243] [Monofunctional epoxy compound (Z)]

[0244] The lens resin composition of the present embodiment preferably further contains a monofunctional epoxy compound (Z) represented by General Formula (5).

[0245] Thereby, the heat resistance of the lens cured product formed from the lens resin composition can be further improved. In addition, the glass adhesion of the lens resin composition can be improved.

[0246] [Formula 26]

[0247]

[0248] In General Formula (5), A is selected from a single bond, an oxygen atom, and a sulfur atom, and R10 is an alkylene group having 1 to 8 carbon atoms, and optionally, a methylene group can be substituted with an oxygen atom.

[0249] A is preferably a single bond.

[0250] R 10 is preferably an alkylene group having 1 to 4 carbon atoms, and more preferably an alkylene group having 1 to 2 carbon atoms.

[0251] R 10 is preferably substituted with an oxygen atom.

[0252] As the monofunctional epoxy compound (Z), a o-phenylphenol glycidyl ether is preferable.

[0253] As the monofunctional epoxy compound (Z), commercially available products such as OPP-EP (o-phenylphenol glycidyl ether, manufactured by Yamao Chemical Co., Ltd.) and OPP-G (o-phenylphenol glycidyl ether, manufactured by Mikuni Corporation) can be exemplified.

[0254] When the lens resin composition of the present embodiment contains the monofunctional epoxy compound (Z), the lower limit value of the content of the monofunctional epoxy compound (Z) in the lens resin composition of the present embodiment is preferably 1% by mass or more, more preferably 5% by mass or more, further preferably 10% by mass or more, further preferably 20% by mass or more, further preferably 30% by mass or more, and further preferably 35% by mass or more, in the nonvolatile components of the lens resin composition of the present embodiment. Thereby, the heat resistance of the lens cured product formed from the lens resin composition can be further improved.

[0255] In addition, when the lens resin composition of the present embodiment contains the monofunctional epoxy compound (Z), the upper limit value of the content thereof is preferably 70% by mass or less, more preferably 60% by mass or less, further preferably 50% by mass or less, and further preferably 40% by mass or less, in the nonvolatile components of the lens resin composition of the present embodiment. Thereby, the glass bonding property of the lens resin composition can be further improved.

[0256] In the case where the resin composition for lenses of the present embodiment contains the monofunctional epoxy compound (Z), the lower limit value of the content of the monofunctional epoxy compound (Z) in the resin composition for lenses of the present embodiment is preferably 1 part by mass or more, more preferably 5 parts by mass or more, further preferably 10 parts by mass or more, further preferably 20 parts by mass or more, further preferably 30 parts by mass or more, further preferably 40 parts by mass or more, further preferably 50 parts by mass or more, further preferably 60 parts by mass or more, and further preferably 65 parts by mass or more, relative to 100 parts by mass of the epoxy compound (Y). Thereby, the heat resistance of the cured product for lenses formed from the resin composition for lenses can be further improved.

[0257] In addition, in the case where the resin composition for lenses of the present embodiment contains the monofunctional epoxy compound (Z), the upper limit value of the content thereof is preferably 200 parts by mass or less, more preferably 150 parts by mass or less, further preferably 100 parts by mass or less, further preferably 80 parts by mass or less, and further preferably 75 parts by mass or less, relative to 100 parts by mass of the epoxy compound (Y). Thereby, the glass adhesion of the resin composition for lenses can be further improved.

[0258] The monofunctional epoxy compound (Z) can be used singly or in a mixture of a plurality of kinds, and in the case where a plurality of kinds are used in a mixture, the total of the contents of the respective monofunctional epoxy compounds (Z) is taken as the content of the monofunctional epoxy compound (Z).

[0259] (Oxetane compound (W))

[0260] The resin composition for lenses of the present embodiment preferably further contains an oxetane compound (W).

[0261] Thereby, the heat resistance of the cured product for lenses formed from the resin composition for lenses can be further improved. In addition, the glass adhesion of the resin composition for lenses can be improved. In addition, the curability of the resin composition can be improved.

[0262] The oxetane compound (W) is not particularly limited, and a generally known oxetane compound can be used. As specific examples of the oxetane compound (W), for example, oxetane, 2-methyloxetane, 3-methyloxetane, 2,2-dimethyloxetane, 3,3-dimethyloxetane, 3-ethyl-3-hydroxymethyloxetane, and a biphenyl-type oxetane, and the like can be given.

[0263] The oxetane compound (W) can be used singly or in a mixture of a plurality of kinds, and in the case where a plurality of kinds are used in a mixture, the total of the contents of the respective oxetane compounds (W) is taken as the content of the oxetane compound (W).

[0264] The oxetane compound (W) preferably contains a biphenyl type oxetane compound. As specific examples of the biphenyl type oxetane, for example, xylylene bisoxetane and the like can be given.

[0265] As commercially available products of the oxetane compound (W), ARON OXETANE OXT-101 (3-ethyl-3-hydroxymethyloxetane, manufactured by Toagosei Co., Ltd.) and ARON OXETANE OXT-121 (xylylene bisoxetane, manufactured by Toagosei Co., Ltd.) and the like can be given.

[0266] In the case where the lens resin composition of the present embodiment contains the oxetane compound (W), the lower limit value of the content of the oxetane compound (W) in the lens resin composition of the present embodiment is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, further preferably 1% by mass or more, further preferably 2% by mass or more, further preferably 3% by mass or more, further preferably 4% by mass or more, in the nonvolatile components of the lens resin composition of the present embodiment. Thereby, the heat resistance of the lens cured product formed from the lens resin composition and the curability of the lens resin composition can be further improved.

[0267] In addition, in the case where the lens resin composition of the present embodiment contains the oxetane compound (W), the upper limit value of the content of the oxetane compound (W) in the lens resin composition of the present embodiment is preferably 50% by mass or less, more preferably 40% by mass or less, further preferably 30% by mass or less, further preferably 20% by mass or less, further preferably 10% by mass or less, further preferably 5% by mass or less. Thereby, the glass bonding property of the lens resin composition can be further improved.

[0268] In the case where the lens resin composition of the present embodiment contains the oxetane compound (W), the lower limit value of the content of the oxetane compound (W) in the lens resin composition of the present embodiment is preferably 1 part by mass or more, more preferably 5 parts by mass or more, further preferably 9 parts by mass or more, with respect to 100 parts by mass of the epoxy compound (Y). Thereby, the heat resistance of the lens cured product formed from the lens resin composition and the curability of the lens resin composition can be further improved.

[0269] In addition, in the case where the lens resin composition of the present embodiment contains the oxetane compound (W), the upper limit of the content of the oxetane compound (W) in the lens resin composition of the present embodiment is preferably 200 parts by mass or less, more preferably 150 parts by mass or less, further preferably 100 parts by mass or less, further preferably 80 parts by mass or less, further preferably 60 parts by mass or less, further preferably 40 parts by mass or less, further preferably 25 parts by mass or less, further preferably 15 parts by mass or less, further preferably 10 parts by mass or less. Thereby, the glass adhesion of the lens resin composition can be further improved.

[0270] (Solvent)

[0271] The solvent contained in the lens resin composition of the present embodiment is not particularly limited, and a solvent capable of dissolving each component of the lens resin composition is preferably used. As such an organic solvent, ketones such as acetone, ethyl methyl ketone, methyl isobutyl ketone, cyclohexanone, and cyclopentanone; aromatic hydrocarbons such as toluene, xylene, methoxybenzene, and tetramethylbenzene; glycol ethers such as diethylene glycol dimethyl ether, dipropylene glycol dimethyl ether, and dipropylene glycol diethyl ether; esters such as ethyl lactate, butyl lactate, propyl lactate, ethyl acetate, methyl acetoacetate, ethyl acetoacetate, methyl propionate, ethyl propionate, propyl propionate, isopropyl propionate, methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, methyl-3-methoxypropionate, ethyl-3-methoxypropionate, ethyl-3-ethoxypropionate, propyl-3-methoxypropionate, butyl acetate, butyl cellosolve acetate, carbitol acetate, and propylene glycol monomethyl ether acetate; lactones such as α-acetyllactone, β-propiolactone, γ-butyrolactone, and δ-valerolactone; alcohols such as methanol, ethanol, cellosolve, and methyl cellosolve; aliphatic hydrocarbons such as octane and decane; and petroleum-based solvents such as petroleum ether, naphtha, hydrogenated naphtha, and solvent naphtha can be exemplified.

[0272] In the case where the lens resin composition of the present embodiment contains a solvent, the content thereof is not particularly limited as long as the effect of the present application is not impaired, and is, for example, 95 parts by mass or less, preferably 10 to 90 parts by mass, when the total of all components of the lens resin composition of the present embodiment is set to 100 parts by mass.

[0273] The solvent can be used singly or in a mixture of a plurality of kinds, and in the case of using a mixture of a plurality of kinds, the total of the contents of the respective solvents is taken as the content of the solvent.

[0274] In the case where the epoxy compound (Y) is liquid at normal temperature (25°C), coating or the like can be favorably performed even in the case where no solvent is used or substantially no solvent is used.

[0275] (Adhesion-imparting agent)

[0276] The adhesion-imparting agent contained in the lens resin composition of the present embodiment is not particularly limited, and a publicly known silane coupling agent, titanium coupling agent, or the like can be used. From the viewpoint of improving the adhesion to glass, a silane coupling agent is preferably used.

[0277] As the silane coupling agent, 3-chloropropyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris(2-methoxyethoxy)silane, 3-methacryloyloxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-mercaptopropyltrimethoxysilane, 8-glycidyloctyltrimethoxysilane, and the like can be exemplified.

[0278] When the lens resin composition of the present embodiment contains the adhesion-imparting agent, the content of the adhesion-imparting agent in the lens resin composition of the present embodiment is not particularly limited as long as the effect of the present application is not impaired, and in the nonvolatile components of the lens resin composition of the present embodiment, it is preferably 15% by mass or less, more preferably 10% by mass or less, further preferably 5% by mass or less, further preferably 2% by mass or less, further preferably 1% by mass or less.

[0279] When the lens resin composition of the present embodiment contains the adhesion-imparting agent, the content of the adhesion-imparting agent in the lens resin composition of the present embodiment is not particularly limited as long as the effect of the present application is not impaired, and in the nonvolatile components of the lens resin composition of the present embodiment, it is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, further preferably 0.8% by mass or more.

[0280] The adhesion-imparting agent can be used singly or in a mixture of a plurality of kinds, and in the case of using a mixture of a plurality of kinds, the total of the contents of the respective adhesion-imparting agents is taken as the content of the adhesion-imparting agent.

[0281] (polyol compound)

[0282] When the lens resin composition of the present embodiment contains the polyol compound, the polyol compound is not particularly limited, and is typically a polyester polyol compound containing a hydroxyl group that reacts with an epoxy group under the influence of a strong acid catalyst. For example, the polyol compound listed in Japanese Patent Publication No. 5901070 can be used.

[0283] In the case where the resin composition for lenses of the present embodiment contains the polyol compound, the content of the polyol compound in the resin composition for lenses of the present embodiment is not particularly limited as long as the effect of the present application is not impaired, and is, for example, 1 to 30 parts by mass, preferably 2 to 25 parts by mass, with respect to 100 parts by mass of the epoxy compound (Y).

[0284] The polyol compound can be used singly or in a mixture of a plurality of kinds, and in the case of using a mixture of a plurality of kinds, the total of the contents of the respective polyol compounds is taken as the content of the polyol compound.

[0285] The polyol compound contained in the resin composition for lenses of the present embodiment is a compound that can cure the epoxy compound with a high crosslinking density by heating. For example, the polyphenol compound listed in Japanese Patent Publication No. 5967824 can be used.

[0286] (Polyphenol compound)

[0287] In the case where the resin composition for lenses of the present embodiment contains the polyphenol compound, the content of the polyphenol compound in the resin composition for lenses of the present embodiment is not particularly limited as long as the effect of the present application is not impaired, and is, for example, 3 to 40 parts by mass, preferably 4 to 30 parts by mass, more preferably 5 to 25 parts by mass, with respect to 100 parts by mass of the epoxy compound (Y).

[0288] The polyphenol compound can be used singly or in a mixture of a plurality of kinds, and in the case of using a mixture of a plurality of kinds, the total of the contents of the respective polyphenol compounds is taken as the content of the polyphenol compound.

[0289] (Sensitizer)

[0290] The sensitizer contained in the resin composition for lenses of the present embodiment functions to supply absorbed light energy to the photocationic polymerization initiator. For example, thioxanthone-based compounds, anthracene compounds having an alkoxy group at the 9-position and the 10-position (9,10-dialkoxyanthracene derivatives), and the like can be exemplified.

[0291] In the case where the resin composition for lenses of the present embodiment contains the sensitizer, the content of the sensitizer in the resin composition for lenses of the present embodiment is not particularly limited as long as the effect of the present application is not impaired, and is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, with respect to 100 parts by mass of the photocationic polymerization initiator (X).

[0292] In the case where the lens resin composition of the present embodiment contains a sensitizer, the content of the sensitizer in the lens resin composition of the present embodiment is not particularly limited as long as the effect of the present application is not impaired, and is, for example, 0.1 parts by mass or more with respect to 100 parts by mass of the photocationic polymerization initiator (X).

[0293] The sensitizer can be used singly or in a mixture of a plurality of kinds, and in the case of using a mixture of a plurality of kinds, the total of the contents of the respective sensitizers is taken as the content of the sensitizer.

[0294] (Ion-trapping agent)

[0295] The ion-trapping agent contained in the lens resin composition of the present embodiment can reduce adverse effects caused by ions from the photocationic polymerization initiator (X). For example, an organoaluminum compound or an onium weak acid salt compound that generates a weak acid by ultraviolet irradiation can be used as the ion-trapping agent.

[0296] In the case where the lens resin composition of the present embodiment contains an ion-trapping agent, the content of the ion-trapping agent in the lens resin composition of the present embodiment is not particularly limited as long as the effect of the present application is not impaired. In the case of an organoaluminum compound, it is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the photocationic polymerization initiator (X). In the case of an onium weak acid salt compound, it is preferably 0.001 to 2 parts by mass with respect to 100 parts by mass of the photocationic polymerization initiator (X).

[0297] The ion-trapping agent can be used singly or in a mixture of a plurality of kinds, and in the case of using a mixture of a plurality of kinds, the total of the contents of the respective ion-trapping agents is taken as the content of the ion-trapping agent.

[0298] (Other photocationic polymerization initiator)

[0299] The lens resin composition of the present embodiment can contain a photocationic polymerization initiator other than the photocationic polymerization initiator (X) (other photocationic polymerization initiator).

[0300] The other photocationic polymerization initiator contained in the lens resin composition of the present embodiment is not particularly limited, and a publicly known photocationic polymerization initiator can be used.

[0301] As the other photocationic polymerization initiator, an onium salt compound having a structure represented by the following formula (A) can be exemplified. 20 ) s B(Phf) 4-s ] - (In the formula, R 20represents phenyl or biphenyl. Phf represents phenyl in which at least one hydrogen atom is replaced with at least one selected from the group consisting of perfluoroalkyl group, perfluoroalkoxy group, and halogen atom. s is an integer of 0 to 3, BF4 - , [(Rf n PF 6-n ] - (Rf: alkyl group in which 80% or more of hydrogen atoms are replaced with fluorine atoms, n: an integer of 0 to 5), AsF6 - , SbF6 - , pentafluorohydroxyantimonate, and the like as an anion.

[0302] The content of the other photocationic polymerization initiator in the lens resin composition of the present embodiment is not particularly limited as long as the effect of the present application is not impaired, and is preferably 50 parts by mass or less, more preferably 20 parts by mass or less, and further preferably 10 parts by mass or less, relative to 100 parts by mass of the photocationic polymerization initiator (X).

[0303] The other photocationic polymerization initiator can be used singly or in a mixture of a plurality of kinds, and in the case of a mixture of a plurality of kinds, the total of the contents of the respective other photocationic polymerization initiators is taken as the content of the other photocationic polymerization initiator.

[0304] (Other additives)

[0305] The lens resin composition of the present embodiment can contain, in addition to the above components, various additives such as a thermoplastic resin, a colorant, a thickening agent, an antifoaming agent, a leveling agent, and the like, as needed.

[0306] <Manufacturing method>

[0307] The lens resin composition of the present embodiment can be obtained by stirring and mixing the above components by a usual method. Alternatively, it can be dispersed and mixed using a disperser such as a dissolver, a homogenizer, a three-roll mill, and the like, as needed. In addition, after mixing, it can be further filtered using a screen, a membrane filter, and the like.

[0308] <Physical properties>

[0309] The viscosity of the lens resin composition of the present embodiment can be measured, for example, using an E-type viscometer.

[0310] The lower limit value of the viscosity of the lens resin composition of the present embodiment when measured using an E-type viscometer at a temperature of 25°C and a rotation speed of 2.5 rpm is preferably 100 mPa-s or more, more preferably 200 mPa-s or more, further preferably 500 mPa-s or more, and further preferably 700 mPa-s or more. Thereby, the curability of the lens resin composition is improved.

[0311] In addition, the upper limit value of the viscosity is preferably 5000 mPa-s or less, more preferably 3000 mPa-s or less, further preferably 2000 mPa-s or less, and further preferably 1500 mPa-s or less. Thus, the moldability of the lens resin composition is improved.

[0312] For the lens resin composition of the present embodiment, the lens resin composition described above is applied to a glass plate at a thickness of 250 μm, UV exposure is performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6000 mJ / cm 2 The lower limit value of the refractive index of the lens cured product obtained by performing UV exposure under the conditions described above and heating under conditions of 120°C for 30 minutes in a nitrogen atmosphere is preferably 1.55 or more, more preferably 1.56 or more, further preferably 1.57 or more, further preferably 1.58 or more, and further preferably 1.59 or more.

[0313] By setting the refractive index of the lens cured product to be the lower limit value or more, the optical properties of the lens are improved.

[0314] In addition, the upper limit value of the refractive index of the lens cured product is not particularly limited and is, for example, 1.90 or less, 1.80 or less, 1.75 or less, or 1.70 or less.

[0315] The refractive index of the lens cured product can be measured using an Abbe refractometer.

[0316] For the lens resin composition of the present embodiment, the lens resin composition described above is applied to a glass plate at a thickness of 250 μm, UV exposure is performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6000 mJ / cm 2 The lower limit value of the refractive index of the lens cured product obtained by performing UV exposure under the conditions described above and heating under conditions of 120°C for 30 minutes in a nitrogen atmosphere is preferably 1.55 or more, more preferably 1.56 or more, further preferably 1.57 or more, further preferably 1.58 or more, and further preferably 1.59 or more.

[0317] In addition, the upper limit value of the transmittance is not particularly limited and is, for example, 100% or less.

[0318] (Measurement Conditions)

[0319] Measurement method: transmission method

[0320] Measurement wavelength: 400 nm

[0321] Reference: air

[0322] Detector: Integrating sphere / photomultiplier tube (200 nm to 850 nm)

[0323] Integrating sphere: PbS (850 nm to 2600 nm)

[0324] For the lens resin composition of the present embodiment, the above lens resin composition was applied to a glass plate at a thickness of 250 μm, UV exposure was performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6000 mJ / cm 2 The lower limit value of the transmittance in the thickness direction (after the heat resistance test) measured using a UV-visible near-infrared spectrophotometer under the following (measurement conditions) is preferably 70% or greater, more preferably 72% or greater, further preferably 74% or greater, further preferably 76% or greater, further preferably 78% or greater, further preferably 79% or greater. Thereby, a lens having higher transparency can be produced.

[0325] In addition, the upper limit value of the transmittance (after the heat resistance test) is not particularly limited, and is, for example, 100% or less.

[0326] (Measurement conditions)

[0327] Measurement method: transmission method

[0328] Measurement wavelength: 400 nm

[0329] Reference: atmosphere

[0330] Detector: Integrating sphere / photomultiplier tube (200 nm to 850 nm)

[0331] Integrating sphere: PbS (850 nm to 2600 nm)

[0332] <Use>

[0333] The lens resin composition of the present embodiment is suitable for use as a wafer-level lens.

[0334] A wafer-level lens refers to a lens produced by simultaneously producing several lenses on a wafer-shaped resin (wafer-level lens array) and dicing the same.

[0335] Figure 1 is a plan view showing an example of the configuration of a wafer-level lens array having a plurality of wafer-level lenses. As shown in the drawing, a wafer-level lens array 1 is formed by simultaneously producing a plurality of wafer-level lenses 2 on a wafer-shaped resin 3. Figure 1As shown, the wafer-level lens array 1 has a substrate 2 and a plurality of lenses 10 arranged on the substrate 2. The plurality of lenses 10 are arranged one-dimensionally or two-dimensionally with respect to the substrate 2. The lenses 10 formed on the wafer-level lens array 1 are cut one by one later.

[0336] Therefore, the wafer-level lens can produce several hundreds of lenses at a time, and has an advantage of excellent production efficiency.

[0337] Further, the wafer-level lens has an advantage that a lens which is limited in injection molding and which is required to be thin and small can be produced. The wafer-level lens has a size of, for example, a diameter of about 1 to 10 mm and a thickness of about 100 to 2000 μm, and with this size, the wafer-level lens is suitable for a camera of an electronic device such as a smartphone, a tablet terminal, and a notebook computer.

[0338] The lens resin composition of the present embodiment can form a cured product for a lens having improved balance of high refractive index, high light transmittance, high heat resistance, and resistance to bleeding, and is thus suitable for a wafer-level lens which is required to be thin and small.

[0339] [Cured product for a lens]

[0340] The cured product for a lens of the present embodiment can be obtained by curing the lens resin composition described above.

[0341] In addition, in order to mount a member such as a wafer-level lens having the cured product for a lens of the present embodiment to a circuit substrate, the cured product for a lens of the present embodiment can be subjected to reflow soldering treatment in a temperature environment of 30°C or higher and 300°C or lower.

[0342] The glass transition temperature (Tg) of the cured product for a lens of the present embodiment based on the following (Method) is preferably 70°C or higher and 200°C or lower, more preferably 70°C or higher and 180°C or lower, further preferably 80°C or higher and 160°C or lower, further preferably 90°C or higher and 140°C or lower, and further preferably 100°C or higher and 120°C or lower.

[0343] (Method)

[0344] A lens resin composition was dropped on a PDMS substrate (120 x 80 x 1 mm t) and clamped with the same PDMS substrate as described above with a silicone spacer having a thickness of 250 μm and fixed with a jig. In this case, UV exposure was performed using a metal halide lamp at an irradiation intensity of UVA of 500 mW / cm and a cumulative irradiation amount of 6000 mJ / cm 2 to cure the lens resin composition.

[0345] Next, the cured lens resin composition was released from the PDMS substrate, and heated at 120°C for 30 minutes under a nitrogen atmosphere, thereby obtaining a lens cured product before reflow soldering treatment.

[0346] Next, the lens cured product before reflow soldering treatment was subjected to reflow soldering heat treatment under the conditions shown in Table 1 below, thereby obtaining a lens cured product after reflow soldering treatment.

[0347] Then, the solid viscoelasticity of the lens cured product after reflow soldering treatment was measured under the following conditions.

[0348] Apparatus: RSA-G2 (manufactured by TA Instruments)

[0349] Deformation mode: Tensile

[0350] Temperature range: -50°C to 180°C

[0351] Temperature increase: 3°C / min

[0352] Frequency: 1 Hz

[0353] Environment: N2 atmosphere

[0354] Then, the temperature at which the value of tan δ showed a maximum value was determined as Tg, based on the results of the viscoelasticity measurement.

[0355] [Table 1]

[0356]

[0357] The refractive index of the lens cured product of the present embodiment is preferably 1.55 or greater, more preferably 1.56 or greater, further preferably 1.57 or greater, further preferably 1.58 or greater, and further preferably 1.59 or greater. The refractive index can be obtained by the above-mentioned steps as a measurement step of the refractive index of the lens cured product.

[0358] In addition, the upper limit of the refractive index of the lens cured product is not particularly limited, and is, for example, 1.90 or less, 1.80 or less, 1.75 or less, or 1.70 or less.

[0359] The lower limit of the transmittance in the thickness direction of the lens cured product of the present embodiment (before heat resistance test) is preferably 70% or greater, more preferably 75% or greater, further preferably 80% or greater, and further preferably 82% or greater. The transmittance can be obtained by the above-mentioned steps as a measurement step of the transmittance of the lens cured product.

[0360] In addition, the upper limit of the transmittance is not particularly limited, and is, for example, 100% or less.

[0361] The cured product for lenses of the present embodiment is improved in the balance of high refractive index, high light transmittance, high heat resistance, and resistance to bleeding, and is thus suitable for use in a wafer-level lens that requires thinness and smallness.

[0362] [Transparency]

[0363] The lens of the present embodiment is provided with the cured product for lenses described above.

[0364] The lens of the present embodiment can be manufactured, for example, by imprint molding. Imprint molding refers to a processing technique in which a lens resin composition is clamped with a lens molding mold and a pattern is transferred. The lens resin composition clamped with the lens molding mold is cured by heating or light irradiation.

[0365] Light irradiation can be performed, for example, by using a mercury lamp, a xenon lamp, a carbon arc lamp, a metal halide lamp, sunlight, an electron beam source, a laser light source, an LED light source, or the like, and irradiation is performed in a range in which the cumulative irradiation amount is, for example, 500 to 5000 mJ / cm 2

[0366] The lens resin composition (cured product for lenses) clamped with the lens molding mold and cured is sometimes used directly as a lens, but the cured product for lenses is sometimes layered with another material.

[0367] As an example of another material layered with the cured product for lenses, glass can be given, for example. Glass is rich in variety, and a glass having a high refractive index can be selected, and thus is suitable as a raw material for a lens that requires high optical properties. In addition, glass has the advantage of excellent heat resistance.

[0368] In addition, a resin can also be used. A resin is excellent in processability, and is suitable for forming a lens simply and inexpensively.

[0369] In addition, in the case where a wafer-level molding mold is used as the lens molding mold, a wafer-level lens array can be obtained, and a lens can be obtained by singulating the obtained wafer-level lens array one by one. The wafer-level lens array is as described above.

[0370] The lens of the present embodiment is improved in the balance of high refractive index, high light transmittance, high heat resistance, and resistance to bleeding, and is thus suitable for use as a wafer-level lens that requires thinness and smallness.

[0371] The diameter of the wafer-level lens is, for example, 1 to 10 mm, and is preferably 1 to 5 mm. In addition, the thickness of the wafer-level lens is, for example, 100 to 2000 μm, and is preferably 100 to 1000 μm.

[0372] The wafer-level lens is suitable for use in a camera of an electronic device such as a smartphone, a tablet terminal, or a notebook computer.

[0373] ​The above describes embodiments of the present application, but these are examples of the present application, and various configurations other than the above can also be employed.

[0374] In addition, the present application is not limited to the above-described embodiments, and modifications, improvements, and the like within a range capable of achieving the object of the present application are included in the present application.

[0375] Examples

[0376] The embodiments of the present application will be described below based on examples, but the embodiments of the present application are not limited to these examples.

[0377] Preparation of the resin composition for lenses

[0378] The raw materials described in Table 3 were stirred and mixed while being heated at 50°C until uniform, thereby obtaining the resin composition for lenses of each example and each comparative example.

[0379] The raw materials described in Table 3 were stirred and mixed while being heated at 50°C until uniform, thereby obtaining the resin composition for lenses of each example and each comparative example.

[0380] • Photocationic polymerization initiator (X): triaryl sulfonium-tetrakis(pentafluorophenyl) gallate, manufactured by San-Apro Co., Ltd., product name: CPI-310 FG

[0381] • Photocationic polymerization initiator: thio phenyl diphenyl sulfonium tris (pentafluoroethyl) trifluorophosphate, manufactured by San-Apro Co., Ltd., product name: CPI-210S

[0382] • Epoxy compound (Y): bisphenol A type epoxy resin, manufactured by DIC Co., Ltd., product name: EXA-850 CRP, epoxy equivalent: 158 to 168 g / eq

[0383] • Monofunctional epoxy compound (Z): o-phenyl phenol glycidyl ether, manufactured by Yidoshi Synthetic Co., Ltd., product name: OPP-EP

[0384] • Oxetane compound (W): biphenyl type oxetane compound (xylylene bisoxetane), manufactured by Toagosei Co., Ltd., product name: ARON OXETANE OXT-121

[0385] • Adhesion-imparting agent: silane coupling agent (3-glycidoxypropyltrimethoxysilane), manufactured by Shin-Etsu Chemical Co., Ltd., product name: KBM-403

[0386] • Antioxidant: phenol-based antioxidant (pentaerythritol tetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]), manufactured by ADEKA Co., Ltd., product name: ADKSTAB AO-60

[0387] • Light stabilizer 1: Hindered amine-based light stabilizer (bis[2,2,6,6-tetramethyl-1- (undecyloxy)piperidin-4-yl] carbonate), manufactured by ADEKA Corporation, product name: ADKSTAB LA-81, base dissociation constant pKb: 11.3

[0388] • Light stabilizer 2: Hindered amine-based light stabilizer (bis(1,2,2,6,6-pentamethyl-4- piperidyl) sebacate), manufactured by ADEKA Corporation, product name: ADKSTAB LA-72, base dissociation constant pKb: 5.8

[0389] • Light stabilizer 3: Hindered amine-based light stabilizer (bis[1-(octyloxy)-2,2,6,6- tetramethyl-4-piperidyl] sebacate), manufactured by BASF Corporation, product name: Tinuvin 123, base dissociation constant pKb: 11.5

[0390] • Light stabilizer 4: Hindered amine-based light stabilizer (2-[[4,6-bis[butyl[1- (cyclohexyloxy)-2,2,6,6-tetramethylpiperidin-4-yl]amino]-1,3,5-triazin-2-yl]amino]ethanol), manufactured by BASF Corporation, product name: Tinuvin 152, base dissociation constant pKb: 10.6

[0391] • Light stabilizer 5: Hindered amine-based light stabilizer (bis(2,2,6,6-tetramethyl-4- piperidyl-1-oxy) sebacate), manufactured by Tokyo Chemical Industry Co., Ltd., base dissociation constant pKb: 10.1

[0392] < Base dissociation constant pKb>

[0393] The base dissociation constant pKb of each light stabilizer was measured by the following method.

[0394] Each light stabilizer 0.1 g was dissolved in 100 g of an aqueous solution containing 80% by mass of methanol, and the solution was titrated with a 3N-HCl aqueous solution while being measured with a pH meter (manufactured by HORIBA, Ltd.) to thereby obtain a pH titration curve. Using the obtained pH titration curve, the pKb value was calculated by a graphical method.

[0395] < Viscosity>

[0396] The viscosity of the lens resin composition of each of the examples and comparative examples was measured using a type E viscometer (TVE-25L, manufactured by Tokyo Keiki Inc.) at a temperature of 25°C and a rotation speed of 2.5 rpm. The cone plate was appropriately selected from 1° 34' x R24, 3° x R14, and 3° x R9.7 according to the viscosity of the sample. The results are shown in Table 3.

[0397] < Production of lens cured product 1>

[0398] On a PDMS substrate (120 x 80 x 1 mm t, manufactured by Du Pont-Dow Corning Toray Co., Ltd.), a resin composition for lenses was dropped, and was clamped with a spacer made of silicone having a thickness of 250 μm and a PDMS substrate as described above, and was fixed with a jig. Using a metal halide lamp, UV exposure was performed in such a manner that the irradiation intensity of UVA was 500 mW / cm, and the cumulative irradiation amount was 6000 mJ / cm 2 , and the resin composition for lenses was cured.

[0399] Next, the cured resin composition for lenses was released from the PDMS substrate, and was heated at 120°C for 30 minutes under a nitrogen atmosphere, whereby a cured product 1 for lenses before reflow soldering treatment was obtained.

[0400] <Reflow Soldering Treatment>

[0401] For the cured product 1 for lenses before reflow soldering treatment in each of the examples and the comparative examples, a reflow soldering heating treatment was performed using a bench heating furnace device (SVO-1, manufactured by SHINAPEX Co., Ltd.) under the conditions shown in Table 2 below, whereby a cured product 1 for lenses after reflow soldering treatment was obtained.

[0402] [Table 2]

[0403]

[0404] <Measurement of Refractive Index>

[0405] The refractive index of the cured product 1 for lenses after reflow soldering treatment in each of the examples and the comparative examples was measured using an Abbe refractometer (DR-M2, manufactured by ATAGO Co., Ltd.). As an interference filter, RE-3520 (589 nm, D line, manufactured by ATAGO Co., Ltd.) was used, and as an intermediate liquid, RE-1196 (monobromonaphthalene, manufactured by ATAGO Co., Ltd.) was used, and the sample temperature was set to 25°C, and the measurement was performed. The results are shown in Table 3.

[0406] <Measurement of Glass Transition Temperature (Tg)>

[0407] The solid viscoelasticity of the cured product 1 for lenses after reflow soldering treatment in each of the examples and the comparative examples was measured under the following conditions.

[0408] Apparatus: RSA-G2 (manufactured by TA Instruments)

[0409] Deformation mode: Tensile

[0410] Temperature range: -50°C to 180°C

[0411] Temperature increase: 3°C / min

[0412] Frequency: 1 Hz

[0413] Ambient: N2 atmosphere

[0414] Then, the temperature at which the value of tan δ shows a maximum was measured as Tg from the results of the viscoelasticity measurement.

[0415] <Production of cured product 2 for lens>

[0416] A resin composition for lens was dropped on a PDMS substrate (120 x 80 x 1 mm t, manufactured by Du Pont-Dow Elastomers Co., Ltd.), and was sandwiched with a borosilicate glass substrate (D 263t eco, 120 x 80 x 0.2 mm t, manufactured by SCHOTT) having a thickness of 250 pm and was fixed with a jig. UV exposure was performed using a metal halide lamp at an irradiation intensity of 500 mW / cm of UVA and a cumulative irradiation amount of 6000 mJ / cm 2 to cure the resin composition for lens.

[0417] Next, the cured resin composition for lens was released from the PDMS substrate, and was heated at 120°C for 30 minutes under a nitrogen atmosphere to obtain a cured product 2 for lens before reflow soldering treatment.

[0418] <Reflow soldering treatment>

[0419] The cured product 2 for lens before reflow soldering treatment in each of the examples and comparative examples was subjected to reflow soldering heat treatment using a benchtop heating furnace device (SVO-1, manufactured by SHINAPEX Co., Ltd.) under the conditions shown in Table 2 above to obtain a cured product 2 for lens after reflow soldering treatment.

[0420] <Transmittance>

[0421] The transmittance in the thickness direction of the cured product 2 for lens after reflow soldering treatment in each of the examples and comparative examples was measured under the following (measurement conditions) to obtain the transmittance before heat resistance test. Note that the measurement was performed by attaching the cured product 2 for lens to an integrating sphere, and the light entrance surface was a glass surface. The results are shown in Table 3.

[0422] (Measurement conditions)

[0423] Measuring device: UH 4150 (ultraviolet-visible near-infrared spectrophotometer, manufactured by Hitachi High-Tech Corporation)

[0424] Measurement method: transmission method

[0425] Measurement wavelength: 400 nm

[0426] Reference: atmosphere

[0427] Detector: Integrating sphere / photomultiplier tube (200 nm to 850 nm)

[0428] Integrating sphere: PbS (850 nm to 2600 nm)

[0429] <Light transmittance after heat resistance test>

[0430] First, the lens-use cured product 2 after the reflow soldering treatment was heated in an oven set to 125°C for 168 hours in an air atmosphere, whereby a heat resistance test was performed. For the lens-use cured product 2 after the heat resistance test, the light transmittance in the thickness direction was measured under the above conditions to obtain the light transmittance after the heat resistance test. The results are shown in Table 3.

[0431] <Evaluation of presence or absence of foreign matter>

[0432] For the lens-use cured product 2 before and after the reflow soldering treatment in each of the examples and comparative examples and the lens-use cured product 2 after the heat resistance test obtained in the above <Light transmittance after heat resistance test>, observation was performed on the presence or absence of foreign matter on the resin surface using a 3D measurement laser microscope (LEXT OLS5000, manufactured by Olympus Corporation) at a magnification of 50 times. At this time, in a case where 10 or more convex components having a diameter of 1.0 μm or more and a height of 50 nm or more were confirmed within an observation range of 250 μm square, it was determined that foreign matter had been generated. The results are shown in Table 3.

[0433] [Table 3]

[0434]

[0435] Foreign matter was not confirmed to have been generated in each of the examples, whereas foreign matter was confirmed to have been generated in Comparative Example 1. This is because the occurrence of bleeding during ultraviolet curing and heating was suppressed in the resin composition of each of the examples. In addition, the refractive index and the light transmittance of each of the examples were at a high level to the same degree as in Comparative Example 1. On the other hand, it was found that the light transmittance after the heat resistance test of Comparative Examples 2 and 3, which did not contain the specific photocationic polymerization initiator (X), decreased, and the heat resistance was poor. From this, it was found that the performance balance of the lens-use resin composition of the examples, in which the refractive index, the light transmittance, the heat resistance, and the resistance to bleeding were high, was improved compared to the lens-use resin compositions of each of the comparative examples.

[0436] This application claims priority based on Japanese Application No. 2023-107856, filed June 30, 2023, the disclosure of which is incorporated herein in its entirety.

[0437] The present application also includes the following modes.

[0438] 1. A lens-use resin composition, comprising:

[0439] a photocationic polymerization initiator (X) containing a salt formed from an anion and a cation represented by the following general formula (1);

[0440] an epoxy compound (Y) containing 2 or more epoxy groups in a molecule; and

[0441] a stabilizer containing a partial structure represented by the following general formula (6).

[0442] [Chem. 27]

[0443]

[0444] (in the above general formula (1), R 1 R 4 each independently represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0445] [Chem. 28]

[0446]

[0447] (in the above general formula (6), R a represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms.

[0448] 2. The lens resin composition according to 1, wherein the epoxy compound (Y) is represented by the following general formula (2).

[0449] [Chem. 29]

[0450]

[0451] (in the above general formula (2), R 5 R 6 R 8 and R 9 each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or a trifluoromethyl group, R 7 each independently represents a hydrogen atom or a glycidyl group, and n is an average repeating number and represents a real number in the range of 0 to 30.

[0452] 3. The lens resin composition according to 1 or 2, wherein the above photocationic polymerization initiator (X) contains at least one selected from an anion represented by the following formula (3) and an anion represented by the following formula (4) as an anion.

[0453] [Chem. 30]

[0454]

[0455] [Chem. 31]

[0456]

[0457] 4. The lens resin composition according to any one of 1. to 3., wherein the photo cationic polymerization initiator (X) contains a sulfonium ion as a cation.

[0458] 5. The lens resin composition according to any one of 1. to 4., further containing a monofunctional epoxy compound (Z) represented by the following general formula (5).

[0459] [Chem. 32]

[0460]

[0461] (In the above general formula (5), A is selected from a single bond, an oxygen atom, a sulfur atom, R 10 is an alkylene group having 1 to 8 carbon atoms, and any methylene group can be substituted with an oxygen atom.

[0462] 6. The lens resin composition according to 5., wherein the monofunctional epoxy compound (Z) contains o-phenylphenol glycidyl ether.

[0463] 7. The lens resin composition according to any one of 1. to 6., further containing an oxetane compound (W).

[0464] 8. The lens resin composition according to 7., wherein the oxetane compound (W) contains a biphenyl type oxetane compound.

[0465] 9. The lens resin composition according to any one of 1. to 8., wherein the viscosity of the lens resin composition is 100 mPa-s or more and 5,000 mPa-s or less when measured with an E-type viscometer at a temperature of 25°C and a rotation speed of 2.5 rpm.

[0466] 10. The lens resin composition according to any one of 1. to 9., wherein the lens resin composition is coated on a glass substrate with a thickness of 250 μm, UV exposure is performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6,000 mJ / cm 2 , and the cured product obtained by heating under a nitrogen atmosphere at 120°C for 30 minutes has a refractive index of 1.55 or more.

[0467] 11. The lens resin composition according to any one of 1. to 10., wherein the lens resin composition is coated on a glass substrate with a thickness of 250 μm, UV exposure is performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6,000 mJ / cm 2UV exposure was performed under the conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6000 mJ / cm, and heating was performed under the conditions of 120°C for 30 minutes in a nitrogen atmosphere. The cured product thus obtained had a transmittance of 70% or more in the thickness direction, as measured using a UV-visible near-infrared spectrophotometer under the following (measurement conditions).

[0468] (Measurement Conditions)

[0469] Measurement method: transmission method

[0470] Measurement wavelength: 400 nm

[0471] Reference: air

[0472] Detector: integrating sphere / photomultiplier tube (200 nm to 850 nm)

[0473] Integrating sphere: PbS (850 nm to 2600 nm)

[0474] 12. The lens resin composition according to any one of 1. to 11., wherein the lens resin composition is coated on a glass substrate at a thickness of 250 μm, UV exposure is performed under the conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6000 mJ / cm, and heating is performed under the conditions of 120°C for 30 minutes in a nitrogen atmosphere. The cured product thus obtained has a transmittance of 70% or more in the thickness direction, as measured using a UV-visible near-infrared spectrophotometer under the following (measurement conditions) after the following (heat resistance test). 2

[0475] (Measurement Conditions)

[0476] Measurement method: transmission method

[0477] Measurement wavelength: 400 nm

[0478] Reference: air

[0479] Detector: integrating sphere / photomultiplier tube (200 nm to 850 nm)

[0480] Integrating sphere: PbS (850 nm to 2600 nm)

[0481] (Heat Resistance Test)

[0482] The cured product was heated in an oven set to 125°C for 168 hours in an air atmosphere.

[0483] 13. The lens resin composition according to any one of 1. to 12. for use in wafer-level lenses.

[0484] ​14. A cured product for a lens, obtained by curing the resin composition for a lens described in any one of 1.~13.

[0485] 15. A lens having the cured product for a lens described in 14.

[0486] BRIEF DESCRIPTION OF DRAWINGS

[0487] 1 wafer-level lens array

[0488] 2 substrate

[0489] 10 lens.

Claims

1. A resin composition for lenses, comprising: a photocationically polymerizable initiator (X) comprising a salt formed from an anion and a cation represented by the following general formula (1); an epoxy compound (Y) comprising two or more epoxy groups in a molecule; and a stabilizer having a base dissociation constant pKb of 6.0 or more based on a method for measuring a base dissociation exponent pKb, wherein the method for measuring a base dissociation exponent pKb is a method for measuring a base dissociation exponent pKb of a stabilizer, comprising: dissolving 0.1 g of the stabilizer in 100 g of an aqueous solution containing 80% by mass of methanol, titrating the solution with a 3N aqueous hydrochloric acid solution, and measuring a pH using a pH meter, thereby obtaining a pH titration curve; and calculating a pKb value from the obtained pH titration curve by a graphical method. The stabilizer contains a stabilizer comprising one or two or more partial structures represented by a partial structure represented by the following general formula (6) and a partial structure represented by the following general formula (7) selected from the group consisting of [Chemical Formula 1] [Chemical Formula 2] [Chemical Formula 3] In the general formula (7), O• represents an oxy group.

2. The lens resin composition according to claim 1, wherein The base dissociation constant pKb of the stabilizer is 12.0 or less.

4. A resin composition for lenses, comprising: a photocationically polymerizable initiator (X) comprising a salt formed from an anion and a cation represented by the following general formula (1); an epoxy compound (Y) comprising two or more epoxy groups in a molecule; and a stabilizer comprising one or two or more partial structures selected from the group consisting of a partial structure represented by the following general formula (6) and a partial structure represented by the following general formula (7), In the general formula (1), R 1 4 each independently represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms,​ The stabilizer contains a stabilizer comprising one or two or more partial structures represented by a partial structure represented by the following general formula (6) and a partial structure represented by the following general formula (7) selected from the group consisting of In the general formula (6), R a represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms, [Chemical Formula 4] [Chemical Formula 5] 3. The lens resin composition according to claim 1 or 2, wherein [Chemical Formula 6] In the general formula (7), O• represents an oxy group. The content of the stabilizer is 0.01 parts by mass or more and 5.0 parts by mass or less with respect to 100 parts by mass of the epoxy compound (Y). The epoxy compound (Y) is represented by the following general formula (2), [Chemical Formula 7] The photocationically polymerizable initiator (X) comprises at least one selected from an anion represented by the following formula (3) and an anion represented by the following formula (4) as an anion, In the general formula (1), R 1 4 each independently represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms,​ [Chemical Formula 8] In the general formula (6), R a represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms, [Chemical Formula 9] The photocationically polymerizable initiator (X) comprises a sulfonium ion as a cation.

5. The lens resin composition according to any one of claims 1 to 4, wherein 9. The resin composition for lenses according to any one of claims 1 to 8, further comprising a monofunctional epoxy compound (Z) represented by the following general formula (5), 6. The lens resin composition according to any one of claims 1 to 5, wherein [Chemical Formula 10] The monofunctional epoxy compound (Z) comprises o-phenylphenol glycidyl ether. In the general formula (2), R 5 , R 6 , R 8 , and R 9 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a trifluoromethyl group, R 7 each independently represent a hydrogen atom or a glycidyl group, and n is an average repeating number and represents a real number within a range of 0 to 30.

7. The lens resin composition according to any one of claims 1 to 6, wherein 11. The resin composition for lenses according to any one of claims 1 to 10, further comprising an oxetane compound (W). The oxetane compound (W) comprises a biphenyl-type oxetane compound. The viscosity of the resin composition for lenses is 100 mPa-s or more and 5000 mPa-s or less when measured with an E-type viscometer at a temperature of 25°C and a rotation speed of 2.5 rpm. 。 8. The lens resin composition according to any one of claims 1 to 7, wherein Measurement conditions: Measurement method: transmission method Measurement wavelength: 400 nm In the general formula (5), A is selected from a single bond, an oxygen atom, a sulfur atom, R 10 is an alkylene group having 1 to 8 carbon atoms, and any methylene group can be replaced with an oxygen atom.

10. The lens resin composition according to claim 9, wherein, Reference: air Detector: integrating sphere / photomultiplier tube, 200 nm to 850 nm 12. The lens resin composition according to claim 11, wherein, Integrating sphere: PbS, 850 nm to 2600 nm.

13. The lens resin composition according to any one of claims 1 to 12, wherein Measurement conditions:

14. The lens resin composition according to any one of claims 1 to 13, wherein The lens resin composition was coated on a glass substrate at a thickness of 250 μm, UV exposure was performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6000 mJ / cm 2 The cured product obtained by heating at 120°C for 30 minutes under a nitrogen atmosphere had a refractive index of 1.55 or more.

15. The lens resin composition according to any one of claims 1 to 14, wherein The lens resin composition was coated on a glass substrate at a thickness of 250 μm, UV exposure was performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6000 mJ / cm 2 The cured product thus obtained had a light transmittance in the thickness direction of 70% or more as measured using a UV-visible near-infrared spectrophotometer under the following measurement conditions, Measurement method: transmission method Measurement wavelength: 400 nm Reference: air ​ ​ ​ 16. The lens resin composition according to any one of claims 1 to 15, wherein The lens resin composition was coated on a glass substrate at a thickness of 250 μm, UV exposure was performed under conditions of a wavelength of 365 nm, an irradiation intensity of 500 mW / cm, and a cumulative irradiation amount of 6000 mJ / cm 2 The cured product thus obtained was subjected to a heat resistance test, and the light transmittance in the thickness direction of the cured product after the heat resistance test was measured using a UV- visible near-infrared spectrophotometer under the following measurement conditions. ​ ​ ​ ​ Detector: Integrating sphere / photomultiplier tube, 200 nm to 850 nm Integrating sphere: PbS, 850 nm to 2600 nm Heat resistance test: The cured product was heated in an oven set to 125°C for 168 hours under an air atmosphere.

17. The resin composition for lenses according to any one of claims 1 to 16, which is used for wafer-level lenses.

18. A cured product for lenses, which is obtained by curing the resin composition for lenses according to any one of claims 1 to 17.

19. A lens provided with the cured product for lenses according to claim 18.

Images