An immersion heat dissipation and defoaming device

Abstract

This invention relates to the field of power module heat dissipation technology and discloses an immersion heat dissipation and defoaming device, comprising a chip body, a chip circuit board, an arc-shaped flow guide plate, and an insulating layer. The chip body is soldered onto the chip circuit board. Two arc-shaped flow guide plates are symmetrically arranged on both sides of the chip circuit board. The insulating layer is sandwiched between the arc-shaped flow guide plates and the chip circuit board. An insulating coolant flows on the top of the chip circuit board, and air bubbles flow on the top of the insulating layer. The insulating coolant flows in an arc shape, concentrating it on the surface of the power semiconductor chip, increasing the flow velocity of the coolant around the chip, and improving the heat dissipation performance of the chip surface and sides. Simultaneously, the flow grooves on the inner wall of the arc-shaped flow guide plate further optimize the flow field, causing the coolant to be diverted into a high-speed jet, flushing heat dissipation blind areas such as the chip edges, further reducing the temperature gradient.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of power module heat dissipation technology, in particular to a submersion heat dissipation and bubble elimination device. BACKGROUND

[0002] With the continuous improvement of power module power density, the traditional cooling method has been difficult to meet the gradually increasing heat dissipation demand.

[0003] As a kind of efficient heat dissipation method, submersion cooling is becoming an effective solution to this heat dissipation problem: first, submersion cooling directly immerses the main heat generating power semiconductor chip in the insulating cooling liquid, reducing the thermal resistance between the heat generating component and the insulating cooling liquid, greatly improving the heat dissipation efficiency; secondly, compared with the traditional heat dissipation method, the chip directly contacts with the insulating cooling liquid, which can better balance the module temperature distribution and reduce the temperature gradient; finally, the insulating cooling liquid itself has good electrical insulation performance, which can ensure the safe operation of the circuit to a certain extent.

[0004] A bubble blocking plate is arranged around the chip, and the bubble density is smaller than that of the cooling liquid, so that the bubble escapes along the top of the bubble blocking plate, but this device is only suitable for low power density scenes, when the chip power density increases, the bubble generation rate exceeds the natural escape rate, and the "bubble accumulation" is easily formed between the bubble blocking plate and the chip, which increases the thermal resistance.

[0005] However, with the operation of the power module and the submersion cooling system, on the one hand, the local overheating around the chip causes the nearby insulating cooling liquid to evaporate; on the other hand, during the flow of the insulating cooling liquid, there is a sharp change in pressure between each flow position; the above reasons all cause bubbles in the insulating cooling liquid, compared with the liquid insulating cooling liquid, when these bubbles accumulate around the power semiconductor chip, a heat insulation layer is formed, which hinders the heat dissipation; in addition, the dielectric strength of the bubble is much lower than that of the insulating cooling liquid, and the flow and external electric field are easy to cause the bubble to deform, causing the high concentration of the electric field in it, causing local discharge, threatening the insulation reliability of the module, since the bubble causes breakdown, it is the main reason for the damage of the submersion power module, therefore, it is difficult to ensure that the insulating cooling liquid flows through the chip effectively and maintains high heat dissipation efficiency while avoiding bubbles flowing with the insulating cooling liquid to the chip and the main conductive area where there is a large voltage difference. SUMMARY

[0006] The present application provides a submersion heat dissipation and bubble elimination device, which solves the problems raised in the background art.

[0007] The application provides the following technical scheme: a heat dissipation and defoaming device for immersion, comprising a chip body, a chip circuit board, arc-shaped flow guide plates and an insulating layer, the chip body is welded on the chip circuit board; the number of the arc-shaped flow guide plates is two, and the two arc-shaped flow guide plates are symmetrically arranged on the two sides of the chip circuit board, the insulating layer is arranged between the arc-shaped flow guide plates and the chip circuit board, and the inner arc surface of the arc-shaped flow guide plate is provided with a flow channel.

[0008] As a preferred technical scheme of the application, the two arc-shaped flow guide plates and the corresponding insulating layers jointly form a bubble guide system, the bubble guide system is fixed on the two sides of the chip circuit board through insulating fasteners, and the insulating fasteners are ceramic bolts.

[0009] As a preferred technical scheme of the application, the inner arc surface of the arc-shaped flow guide plate is arranged towards the chip body, and the inner arc surface of the arc-shaped flow guide plate assists in guiding the flow path of the insulating cooling liquid near the chip body to be an arc-shaped track.

[0010] As a preferred technical scheme of the application, the curvature center of the arc-shaped track is directed away from the chip body, the insulating cooling liquid tends to flow towards the chip circuit board, and the bubble body tends to flow towards the inner arc surface of the arc-shaped flow guide plate.

[0011] As a preferred technical scheme of the application, the inner wall of the flow channel is additionally provided with a hydrophobic low-resistance layer, and the top of the insulating layer is provided with a hydrophilic coating layer.

[0012] As a preferred technical scheme of the application, the top of the hydrophilic coating layer is fixedly provided with a micro-nano-pore adsorption layer, and the top of the micro-nano-pore adsorption layer is provided with a micro convex dot array.

[0013] As a preferred technical scheme of the application, the distance between the top of the insulating layer and the top of the chip circuit board is greater than the distance between the top of the chip circuit board and the top of the chip body, and the top of the insulating layer and the inner arc surface of the arc-shaped flow guide plate form a bubble isolation channel.

[0014] As a preferred technical scheme of the application, the insulating layer is prepared from an insulating material with high dielectric strength and low oil absorption, the dielectric strength of the insulating material is not less than 20 kV / mm, and the insulating material is a composite of epoxy resin and polytetrafluoroethylene.

[0015] As a preferred technical scheme of the application, one side of the insulating layer is closely attached to the inner side of the arc-shaped flow guide plate, and the other side of the insulating layer is closely attached to the surface of the chip circuit board.

[0016] As a preferred technical scheme of the present application, the arc-shaped flow guide plate guides the insulation cooling liquid to form a high-speed flow area on the surface of the chip body, and the flow speed of the high-speed flow area is greater than the flow speed of the bubble isolation channel, thereby forming an outward velocity gradient.

[0017] The present application has the following advantages:

[0018] 1. The immersion heat dissipation and bubble elimination device, by the installation of the arc-shaped flow guide plate, the insulation cooling liquid flow is arc-shaped, the insulation cooling liquid is concentrated on the surface of the power semiconductor chip, the flow speed of the insulation cooling liquid around the chip is increased, and the heat dissipation performance of the surface and the side of the chip is improved; meanwhile, the flow-through groove in the inner wall of the arc-shaped flow guide plate further optimizes the flow field, the cooling liquid is divided to form a high-speed jet flow, and the chip edge and other heat dissipation blind areas are washed, thereby further reducing the temperature gradient.

[0019] 2. The immersion heat dissipation and bubble elimination device, by the arc-shaped flow guide plate, the bubbles generated in the insulation cooling liquid flow process can be separated by centrifugal action, and in cooperation with the one-way flow guiding characteristic of the flow-through groove, the bubbles are quickly discharged along the groove body, so that the bubbles are prevented from flowing to a large voltage difference area to form a weak point of electrical insulation and cause breakdown, and the safety and reliability of the system are ensured.

[0020] 3. The immersion heat dissipation and bubble elimination device, the insulation layer is made of a material with high dielectric strength and low oil absorption, which can isolate the electric field path between the bubbles and the conductive part, and a hydrophilic coating, a micro-nano-pore adsorption layer and a micro convex dot array on the top of the insulation layer form multiple obstacles to prevent the separated bubbles from contacting the conductive part and eliminate the hidden danger of partial discharge or short circuit.

[0021] 4. The immersion heat dissipation and bubble elimination device, by tightly attaching the arc-shaped flow guide plate to the inner side of the insulation layer, a closed "bubble isolation channel" is formed with the flow guide plate, even if the bubbles deviate due to irregular flow, they will be blocked by the surface of the insulation layer and difficult to approach the conductive area, at the same time, the flow speed of the insulation cooling liquid is high in the center of the flow channel and low at the edge, forming an outward velocity gradient, if the bubbles try to move to the center (conductive area), they will be "pushed back" to the vicinity of the insulation layer by the high-speed insulation cooling liquid, further limiting the irregular motion range of the bubbles and enhancing the insulation effect of the insulation layer.

[0022] 5. The immersion heat dissipation and bubble elimination device, by the micro-nano-pore adsorption layer, micro bubbles can be efficiently adsorbed and promoted to fuse into large bubbles, and the bubble discharge efficiency is improved; the hydrophobic low-resistance layer on the inner wall of the flow-through groove reduces the flow resistance of the bubbles, realizes directional and rapid discharge of the bubbles, and avoids backflow and accumulation of the bubbles. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a schematic diagram of the three-dimensional structure of the present application;

[0024] Figure 2The schematic diagram of the flow path of the insulating cooling liquid of the present application is shown in the figure.

[0025] Figure 3 The schematic diagram of the flow path of the bubble body of the present application is shown in the figure.

[0026] Figure 4 The schematic diagram of the structure of the present application is shown in the figure.

[0027] Figure 5 The schematic diagram of the structure of the arc-shaped flow guide plate of the present application is shown in the figure.

[0028] Figure 6 The schematic diagram of the structure of the hydrophobic low-resistance layer of the present application is shown in the figure.

[0029] Figure 7 The schematic diagram of the structure of the array of micro convex dots of the present application is shown in the figure.

[0030] Figure 8 The schematic diagram of the structure of the array of micro convex dots of the present application is shown in the figure. Figure 7 The schematic diagram of the structure of the array of micro convex dots of the present application is shown in the figure.

[0031] In the figure: 1, the chip body; 2, the chip circuit board; 3, the arc-shaped flow guide plate; 4, the insulating layer; 5, the hydrophobic low-resistance layer; 6, the micro-nano-pore adsorption layer; 7, the array of micro convex dots; 8, the insulating cooling liquid; 9, the bubble body; 10, the hydrophilic coating; 11, the flow channel. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0033] Please refer to Figures 1-8The utility model provides an immersion heat dissipation defoaming device, including chip body 1, chip circuit board 2, arc flow guide plate 3 and insulating layer 4, chip body 1 is welded on chip circuit board 2, the number of arc flow guide plate 3 is two, and two arc flow guide plates 3 are respectively arranged on the both sides of chip circuit board 2, and the insulating layer 4 is clamped between arc flow guide plate 3 and chip circuit board 2, and the top of chip circuit board 2 flows with insulating coolant 8, and the top of insulating layer 4 flows with bubble body 9, the inner arc surface of arc flow guide plate 3 is provided with flow channel 11, flow channel 11 adopts similar Tesla valve structure, has the characteristics of " positive conduction, reverse resistance", the groove width gradually changes along the flow direction, the groove depth and the inner arc surface of arc flow guide plate 3 are smoothly connected, and there is no obvious step, avoiding the local eddy current, the inclined flow guide tooth is arranged in the groove body, and the discharge direction (positive direction) of bubble body 9 is inclined, forming a positive flow channel, when bubble body 9 flows along the positive direction, the flow guide tooth plays a guiding role, and the flow resistance is less than or equal to 0.02 N / m, ensuring that the bubble passes quickly, when bubble body 9 attempts to backflow, the flow guide tooth and the groove wall form a closed resistance cavity, and the reverse flow resistance is greater than or equal to 0.08 N / m, which is 4-5 times of the positive resistance, effectively blocking the backflow of bubbles to the conductive area, the inlet end of flow channel 11 and the flow guide inlet of arc flow guide plate 3 are smoothly connected, the outlet end and the flow guide inlet of arc flow guide plate 3 are smoothly connected, and the outlet end of flow channel 11 can be connected with the external bubble collecting cavity of the device, thereby assisting small bubbles, the groove body of flow channel 11 is connected with the main flow channel of insulating coolant 8 all the time, ensuring that, under the action of centrifugal force, after bubble body 9 enters the groove body of flow channel 11, under the synergistic action of self-buoyancy and fluid thrust, it can be directed and discharged along the positive channel, realizing the efficient separation and non-backflow discharge of bubbles.

[0034] In a preferred embodiment, the two arc flow guide plates 3 and the corresponding insulating layers 4 together form a bubble guiding system, which is fixed to the two sides of the chip circuit board 2 by insulating fasteners. The insulating fasteners are ceramic bolts, which have excellent electrical insulation performance (dielectric strength ≥ 30 kV / mm) and temperature resistance (long-term use temperature ≤ 200°C), so that the fasteners do not become electric field concentration points. At the same time, the mechanical strength of the ceramic bolts meets the device assembly requirements, ensuring that the bubble guiding system is connected stably to the chip circuit board 2 and does not loosen under the conditions of insulating coolant 8 flushing and equipment vibration, thereby ensuring the sealing of the flow channel.

[0035] In a preferred embodiment, the inner arc surface of the arc-shaped flow guide plate 3 is arranged towards the chip body 1, and the inner arc surface of the arc-shaped flow guide plate 3 helps guide the flow path of the insulating cooling liquid 8 near the chip body 1 to be an arc-shaped trajectory, so that the insulating cooling liquid 8 forms a smooth arc-shaped flow, avoiding flow field disorder caused by excessive curvature or excessive flow resistance caused by too small curvature. The flow guide plate is made of an aluminum alloy substrate surface anodized, which not only ensures lightweight structure, but also improves the corrosion resistance of the cooling liquid and reduces the disturbance to the fluid.

[0036] In a preferred embodiment, the center of curvature of the arc-shaped trajectory points away from the chip body 1, and the density difference between the insulating cooling liquid 8 and the bubble body 9 generates a centrifugal effect, and the insulating cooling liquid 8 tends to flow towards the chip circuit board 2, and the bubble body 9 tends to flow towards the inner arc surface of the arc-shaped flow guide plate 3. The centrifugal separation mechanism based on the density difference is as follows: the density of the insulating cooling liquid 8 is usually 850-950 kg / m 3 , the density of the bubble body 9 (mainly air) is about 1.2 kg / m 3 , and the density ratio is 700-790 times. In the arc-shaped flow channel, the centrifugal acceleration of the fluid is a=v 2 / r (v is the flow rate of the fluid, and r is the curvature radius of the arc-shaped trajectory). When the insulating cooling liquid 8 flows, the centrifugal force generated can provide significant radial separation power for the bubble body 9, ensuring that the bubble body 9 quickly migrates to the inner arc surface of the arc-shaped flow guide plate 3, while the insulating cooling liquid 8 continues to converge to the surface of the chip body 1, ensuring the fluid contact efficiency required for heat dissipation.

[0037] In a preferred embodiment, the inner wall of the flow-through groove 11 is provided with a hydrophobic low-resistance layer 5, the top of the insulating layer 4 is provided with a hydrophilic coating layer 10, the flow-through groove 11 is continuously arranged along the inner arc surface of the arc-shaped flow guide plate 3, and the length is consistent with the axial length of the arc-shaped flow guide plate 3, ensuring that the bubble body 9 can fully cover and enter the groove body of the flow-through groove 11. The hydrophobic low-resistance layer 5 is prepared by a polytetrafluoroethylene spraying process, and the surface water contact angle is ≥110°, which can greatly reduce the adhesion between the bubble body 9 and the groove wall of the flow-through groove 11, so that the bubble flow resistance is reduced by more than 40%. The hydrophilic coating layer 10 is made of a silane coupling agent modified epoxy resin material, and the surface water contact angle is ≤30°, which can significantly increase the flow resistance of the bubble body 9 on the surface of the insulating layer 4, and promote the migration of the bubble body 9 to the flow-through groove 11.

[0038] In a preferred embodiment, the top of the hydrophilic coating 10 is fixedly equipped with a micro-nano-porous adsorption layer 6, the top of the micro-nano-porous adsorption layer 6 is provided with an array of micro-protruding dots 7, the micro-nano-porous adsorption layer 6 is made of modified ceramic porous material, this structure can capture micro-bubbles through capillary condensation effect and surface adsorption, and promote the fusion of bubbles into large bubbles, thereby improving the discharge power of the bubble body 9, increasing the volume and buoyancy of the large bubbles, overcoming the adhesion of the hydrophilic coating 10, and moving quickly to the inner wall of the flow channel 11 under the action of centrifugal force of the arc-shaped flow channel, thereby avoiding the problem of slow drifting of small bubbles on the top of the insulating layer 4 due to insufficient buoyancy, the array of micro-protruding dots 7 is made of ultraviolet curing resin material and is integrally formed on the surface of the micro-nano-porous adsorption layer 6 through a 3D printing process, the array is continuously arranged along the side edge of the insulating layer 4 close to the arc-shaped flow guide plate 3, forming a physical flow guide barrier to prevent the bubble body 9 from escaping in the gap area of the slot.

[0039] In a preferred embodiment, the distance between the top of the insulating layer 4 and the top of the chip circuit board 2 is greater than the distance between the top of the chip circuit board 2 and the top of the chip body 1, the top of the insulating layer 4 and the inner arc surface of the arc-shaped flow guide plate 3 form a bubble isolation channel, the installation of the bubble isolation channel ensures that the bubble body 9 has sufficient flow space, while avoiding the decrease of centrifugal separation efficiency caused by too wide channel, and the bubble isolation channel and the high-speed flow area on the surface of the chip body 1 form a stable velocity gradient, providing a power basis for bubble blocking.

[0040] In a preferred embodiment, the insulating layer 4 is made of insulating material with high dielectric strength and low oil absorption, the dielectric strength of the insulating material is not less than 20 kV / mm, the insulating material is composed of epoxy resin and polytetrafluoroethylene, which can balance the dielectric properties and processing properties of the material, the dielectric strength of the composite insulating material can reach 25-35 kV / mm, which is much higher than the dielectric strength of the bubble body 9 (about 3 kV / mm), which can effectively block the electric field path between the bubble and the conductive area, the oil absorption rate of the material is ≤0.5%, which can avoid the decrease of insulating performance caused by adsorbed oil stains, and the material has excellent resistance to immersion in cooling liquid, after immersion in insulating cooling liquid 8 at 80℃ for 1000h, there is no aging phenomenon such as swelling, cracking and discoloration.

[0041] In a preferred embodiment, one side of the insulating layer 4 is closely attached to the inner side of the arc-shaped flow guide plate 3, and the other side of the insulating layer 4 is closely attached to the surface of the chip circuit board 2, the attachment surface is treated by vacuum bonding process, and silicone sealant resistant to cooling liquid is coated on the edge of the attachment surface to ensure the sealing performance and avoid leakage of the insulating cooling liquid 8 and escape of the bubble body 9 from the gap, the side of the insulating layer 4 attached to the arc-shaped flow guide plate 3 is processed into an arc-shaped surface matching the inner arc surface of the flow guide plate to ensure close attachment, and the side of the insulating layer 4 attached to the chip circuit board 2 is a flat surface, which is fixed by ceramic bolt compression to ensure the stability of the assembled structure.

[0042] In a preferred embodiment, the arc-shaped flow guide plate 3 guides the insulating coolant 8 to form a high-speed flow area on the surface of the chip body 1, and the flow speed of the high-speed flow area is greater than the flow speed of the bubble isolation channel, forming an outward velocity gradient, and the high-speed flow area covers the upper surface and side surface of the chip body 1, and the flow speed ranges from 0.8 to 1.5 m / s, which can increase the convective heat transfer coefficient of the surface of the chip body 1 to 1500-2000 W / (m 2 K), ensuring the heat dissipation efficiency; the flow speed in the bubble isolation channel is 0.2-0.5 m / s, and the ratio of the two flow speeds is 3-7:1, forming a stable outward velocity gradient, and the fluid thrust generated by the velocity gradient can prevent the bubble body 9 from moving towards the central conductive area, and when the bubble body 9 tries to migrate towards the chip body 1, it will be subjected to a lateral thrust of the high-speed flowing insulating coolant 8 and be "pushed back" into the bubble isolation channel and the flow channel 11, further strengthening the bubble isolation effect.

[0043] Working principle:

[0044] 1. Flow field guidance and centrifugal separation: when the insulating coolant 8 flows near the chip body 1 through the bubble guide system, it is guided by the arc-shaped flow guide plate 3 to flow along an arc-shaped trajectory, and the center of curvature of the arc-shaped trajectory points away from the chip body 1. Due to the fact that the density of the insulating coolant 8 is much greater than that of the bubble body 9, a significant centrifugal effect is generated in the curved motion, and the insulating coolant 8 tends to deviate from the arc-shaped trajectory and flow close to the intermediate conductive area (the area where the chip body 1 and the chip circuit board 2 are located), while the bubble body 9 is "flung" to the inner arc side of the arc-shaped flow guide plate 3 under the action of centrifugal force and the extrusion of the insulating coolant 8;

[0045] 2. Bubble directional discharge: the flow channel 11 on the inner arc surface of the arc-shaped flow guide plate 3 precisely matches the flow path of the bubble body 9, and the hydrophobic low-resistance layer 5 on the inner wall of the flow channel 11 greatly reduces the flow resistance of the bubble body 9, so that the bubble body 9 is quickly discharged along the positive channel of the flow channel 11 to the outside of the device or the bubble collection area, and at the same time, the flow channel 11 adopts an asymmetric structure design similar to a Tesla valve, which forms a reverse resistance to the bubble body 9 that tries to flow back, completely avoiding the bubble body 9 from flowing back to the conductive area;

[0046] 3. Multiple bubble barriers and fusion: the hydrophilic coating 10 on the top of the insulating layer 4 increases the surface adhesion and flow resistance of the bubble body 9, making it difficult for the bubble body 9 to stay on the surface of the insulating layer 4; the micro-nano-pore adsorption layer 6 absorbs small bubbles through capillary condensation effect, promotes the fusion of small bubbles into large bubbles, and improves the discharge power of the bubble body 9; the micro convex dot array 7 destroys the smooth flow of the bubble body 9 through physical structure, "forces" the bubble body 9 deviating from the flow channel 11 into the flow channel 11, forming a "hydrophilic barrier + adsorption fusion + physical diversion" triple protection;

[0047] 4. Insulation protection and flow field stabilization: the high dielectric strength property of insulation layer 4 itself cuts off the electric field path between bubble body 9 and the conductive area, ensuring that the physical distance between bubble body 9 and the conductive part is always greater than the safe insulation distance, at the same time, the arc-shaped flow guide plate 3 guides the insulation coolant 8 to form a high-speed flow area on the surface of the chip body 1, the flow rate of this area is greater than that of the bubble isolation channel, forming an outward velocity gradient, when the bubble body 9 tries to move towards the center conductive area, it will be "pushed back" to the vicinity of the insulation layer 4 by the high-speed flowing insulation coolant 8, further limiting the movement range of the bubble body 9;

[0048] The synergistic effect of arc-shaped flow guide plate 3, insulation layer 4 and hydrophobic low resistance layer 5, hydrophilic coating 10, micro-nano-porous adsorption layer 6, and micro convex dot array 7 realizes the efficient separation, directional discharge and multiple protection of bubble body 9, while ensuring the safety and reliability of the system, realizing the high-efficiency immersion cooling of the power semiconductor device.

[0049] It should be noted that the relational terms such as first and second, and the like, are used solely to distinguish one from another entity or action, without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0050] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An immersion heat-dissipation defoaming device, comprising a chip body (1), a chip circuit board (2), an arc-shaped flow guide plate (3) and an insulation layer (4), characterized in that: The chip body (1) is welded on the chip circuit board (2); the number of the arc-shaped flow guide plates (3) is two, and the two arc-shaped flow guide plates (3) are symmetrically arranged on the two sides of the chip circuit board (2), the insulating layer (4) is arranged between the arc-shaped flow guide plate (3) and the chip circuit board (2), and the inner arc surface of the arc-shaped flow guide plate (3) is provided with a flow channel (11); the inner arc surface of the arc-shaped flow guide plate (3) is arranged towards the chip body (1), the arc-shaped flow guide plate (3) assists in guiding the flow path of the insulating cooling liquid (8) near the chip body (1) to be an arc-shaped track; the curvature center of the arc-shaped track is directed away from the chip body (1), the insulating cooling liquid (8) tends to flow towards the chip circuit board (2), and the bubble body (9) tends to flow towards the inner arc surface of the arc-shaped flow guide plate (3).

2. The submersion heat sink defoaming device of claim 1, wherein: The two arc-shaped flow guide plates (3) and the corresponding side insulating layer (4) jointly constitute a bubble guiding system, the bubble guiding system is fixed on the two sides of the chip circuit board (2) through an insulating fastener, and the insulating fastener is a ceramic bolt.

3. The submersion heat sink anti-foaming device of claim 1, wherein: The inner wall of the flow channel (11) is additionally provided with a hydrophobic low-resistance layer (5), and the top of the insulating layer (4) is provided with a hydrophilic coating (10).

4. The immersion heat sink defoaming device of claim 3, wherein: The top of the hydrophilic coating (10) is fixedly provided with a micro-nano-pore adsorption layer (6), and the top of the micro-nano-pore adsorption layer (6) is provided with a micro convex dot array (7).

5. The immersion heat sink anti-foaming device of claim 1, wherein: The distance between the top of the insulating layer (4) and the top of the chip circuit board (2) is greater than the distance between the top of the chip circuit board (2) and the top of the chip body (1), and the top of the insulating layer (4) and the inner arc surface of the arc-shaped flow guide plate (3) form a bubble isolation channel.

6. The submersion heat sink anti-foaming device of claim 1, wherein: The insulating layer (4) is prepared from an insulating material with high dielectric strength and low oil absorption, the dielectric strength of the insulating material is not less than 20 kV / mm, and the insulating material is composed of epoxy resin and polytetrafluoroethylene.

7. The immersion heat sink anti-foaming device of claim 1, wherein: One side of the insulating layer (4) is closely attached to the inner side of the arc-shaped flow guide plate (3), and the other side of the insulating layer (4) is closely attached to the surface of the chip circuit board (2).

8. The immersion heat sink anti-foaming device of claim 1, wherein: The arc-shaped flow guide plate (3) guides the insulating cooling liquid (8) to form a high-speed flow region on the surface of the chip body (1), and the flow speed of the high-speed flow region is greater than that of the bubble isolation channel, thereby forming an outward velocity gradient.

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