Adjustable semiconductor material polishing apparatus and method

Abstract

This invention discloses an adjustable semiconductor material polishing device and its usage method, relating to the field of semiconductor polishing technology. It consists of a base and an optical fiber clamping plate above it, with a polishing disc main frame housed within the base. This invention addresses the problems existing in current optical fiber polishing machines by making the following improvements: 1. Setting up multiple polishing discs, one for each process, namely coarse-grained, medium-grained, fine-grained, and ultra-fine-grained polishing discs; 2. Based on improvement 1, an adjustable, automated polishing disc switching method is adopted to sequentially polish the discs from coarse to fine. This process requires no manual intervention, avoiding frequent disc changes and the need to clean the polishing discs during disc changes, thus accelerating the polishing progress. Furthermore, each process corresponds to its own polishing disc, eliminating the sharing of polishing discs and preventing insufficient cleaning from affecting the next process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor polishing technology, and in particular to an adjustable semiconductor material polishing device and polishing method. Background Technology

[0002] Semiconductor materials are a class of electronic materials with semiconductor properties (conductivity between that of conductors and insulators) that can be used to make semiconductor devices and integrated circuits. For example, silicon wafers are the core raw materials and physical carriers in the semiconductor integrated circuit manufacturing process. They are composed of thin disk-shaped substrate materials made of high-purity single-crystal silicon.

[0003] The grinding process of silicon wafers is a key step in silicon wafer manufacturing to achieve high-precision surface processing of materials. Its purpose is to remove the damaged layer on the material surface, achieve thickness control or obtain ultra-high flatness, and lay the foundation for subsequent photolithography, etching and other processes.

[0004] Fiber optic polishing machines are a representative type of semiconductor material polishing equipment, especially for silicon wafer processing. They typically consist of four stages—coarse grinding, medium grinding, fine grinding, and polishing—depending on the required end-face precision, with each stage using a finer-grit abrasive disc. Coarse grinding removes burrs and smooths the end face, using coarse-grit abrasive discs (such as 120# or 320#). Medium grinding refines the end-face roughness, using medium-grit abrasive discs (such as 600# or 800#). Fine grinding improves the end-face smoothness, using fine-grit abrasive discs (such as 1200# or 1500#). Polishing achieves a mirror finish, using ultra-fine-grit abrasive discs (such as 2000# or higher) or polishing discs (such as diamond polishing films).

[0005] Therefore, existing fiber optic polishing machines use a single polishing disc, which requires frequent replacement of the polishing disc according to usage needs. This results in slow polishing progress, and the polishing disc needs to be cleaned after replacing the polishing disc to avoid affecting the next process. Summary of the Invention

[0006] The purpose of this invention is to solve the problem in the prior art that a single grinding disc is used and the grinding disc needs to be replaced in each process, and to propose an adjustable semiconductor material grinding device and grinding method.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: an adjustable semiconductor material polishing device, comprising a base and an optical fiber clamping plate above it, wherein a polishing disc main frame is provided inside the base, and at least two polishing disc assemblies are provided on the polishing disc main frame. During operation, multiple polishing disc assemblies are stacked sequentially. Each polishing disc assembly is provided with a sliding protrusion and a guide groove corresponding to the sliding protrusion. The guide groove has a "U"-shaped structure and is composed of a working vertical groove, a lower polishing disc assembly guide horizontal groove, a lifting vertical groove, and an upper polishing disc assembly guide horizontal groove. The polishing disc main frame is provided with a guide drive, a lifting drive, and a guide drive.

[0008] An adjustable semiconductor material polishing device includes the following process in use: the outgoing drive rotates along the polishing disk main frame to slide the lower polishing disk assembly along the lower polishing disk assembly outgoing horizontal groove until it falls above the lifting drive; the lifting drive slides along the lifting vertical groove to transport the polishing disk assembly above it upward to the upper polishing disk assembly in the upper inlet horizontal groove; the inlet drive rotates along the polishing disk main frame to transport the polishing disk assembly in the upper inlet horizontal groove to the top of the working vertical groove.

[0009] Preferably, the grinding disc main frame is a cylindrical structure, and the slide protrusion is a T-shaped structure, which includes a horizontal connecting part and an arc-shaped outer edge. The width and length of the horizontal connecting part are both smaller than the width and length of the arc-shaped outer edge.

[0010] Preferably, both the outgoing drive and the incoming drive are driven by a rotary motor, and the lifting drive is driven by a vertical linear drive.

[0011] Preferably, the outgoing drive component has an arc-shaped structure and is driven by a turntable below it, the turntable being located within the grinding disc main frame.

[0012] Preferably, the top of the export drive component is provided with an export drive protrusion, the grinding disc main frame is provided with a lower ring slide rail, the lower ring slide rail is an inner and outer double slide rail structure, the top of the export drive component is located at the bottom of the lower ring slide rail, and the export drive protrusion is located between the inner and outer double slide rail structure, and the top is protruding.

[0013] Preferably, the bottom of the lower ring slide rail is provided with a disengagement slide, which is located below the lifting drive member. When the guide drive member slides along the disengagement slide, the guide drive protrusion disengages from the grinding disc assembly located at the bottommost position, and the grinding disc assembly is located on the lifting drive member. The lifting drive member is a block structure that slides along the lifting vertical groove and is driven by a screw.

[0014] Preferably, as the outgoing drive member continues to rotate, the screw is driven to rotate by a braking part, which includes: a braking boss disposed on the inner side wall of the outgoing drive member; a wire pull slider that slides within the grinding disc main frame via an "L"-shaped slide rail and is braked by the braking boss, and is positioned by a positioning protrusion that protrudes outward to the inner wall of the "L"-shaped slide rail when it slides to the end of the "L"-shaped slide rail; and a wire take-up roller that is fixedly sleeved on the outer wall of the screw and connected to the wire pull slider via a wire, the outer wall of the wire take-up roller being provided with a torsion spring; when the wire pull slider slides due to the braking boss, the wire brake screw rotates, driving the lifting drive member to move along the lifting vertical groove to the top, the positioning protrusion positioning the wire pull slider, and the torsion spring storing force.

[0015] Preferably, the inlet drive component is an arc-shaped block structure with a pushing protrusion, which slides on an upper ring slide rail within the grinding disc main frame and is driven by an inlet pull rope. As the outlet drive component continues to rotate, the inlet pull rope is pulled by the braking part two. The inlet drive component is connected to the inner wall of the grinding disc main frame through a return spring. The braking part two includes: a gear disc, which is coaxially arranged with the turntable through a connecting shaft, and the outer wall of the gear disc is provided with an outwardly convex arc-shaped tooth wall structure; a gear and wire spool assembly, which consists of a coaxial gear and a wire spool, the gear and the tooth wall structure meshing, and the inlet pull rope is wound around the wire spool.

[0016] Preferably, the lower ring slide rail is provided with a locking position, which is located directly below the working vertical groove and is provided with a positioning pin. The bottom of the grinding disc assembly is provided with a positioning hole corresponding to the positioning pin. The bottom of the positioning pin is connected to a horizontally arranged driving protrusion through a connecting rib. The outer wall of the outgoing driving component is provided with a driving guide groove corresponding to the driving protrusion. The driving guide groove includes a lower extension slide groove and a smooth groove. The projected length of the driving guide groove is the same as the arc length of the outer wall of the outgoing driving component.

[0017] The beneficial effects of this invention are as follows: This invention makes the following improvements to address the problems existing in the current fiber polishing machine: 1. Multiple polishing discs are set up, with one polishing disc corresponding to each process; 2. Based on improvement 1, an adjustable automatic switching method for polishing discs is adopted to sequentially achieve polishing from coarse to fine. This process does not require manual intervention, avoiding the frequent replacement of polishing discs and the process of cleaning the polishing discs during the replacement process, thereby speeding up the polishing progress. At the same time, each process corresponds to its own polishing disc, and there is no situation of sharing polishing discs, which also avoids the problem of insufficient cleaning affecting the production of the next process. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an adjustable semiconductor material grinding device proposed in this invention;

[0019] Figure 2 This is a connection structure diagram of the grinding disc main frame and the grinding disc assembly;

[0020] Figure 3 To export the driver component, lift the driver component, and import the driver component's drive structure diagram;

[0021] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0022] Figure 5 This is a structural diagram of the grinding disc assembly.

[0023] In the diagram: 1. Base; 100. Connecting ring; 101. Drive gear; 102. Gear ring; 2. Fiber optic clamp; 3. Grinding disc main frame; 30. Outgoing drive component; 300. Outgoing drive protrusion; 31. Lifting drive component; 32. Incoming drive component; 33. Lower ring slide rail; 330. Positioning pin; 331. Drive protrusion; 332. Lower extension slide groove; 333. Smooth groove; 334. Disengagement slide; 34. Upper ring slide rail; 4. Grinding disc assembly; 40. Slide protrusion; 400. Horizontal connection part; 401. Arc-shaped outer edge; 41. Working vertical groove; 42. Lower grinding disc assembly guide. 43. Horizontal groove; 44. Vertical groove for lifting; 45. Upper grinding disc assembly for guiding into the horizontal groove; 46. Chassis; 47. Limiting ring; 48. Grinding disc; 5. Turntable; 6. Screw; 7. Braking part one; 70. Braking boss; 71. Pulling cable slider; 710. "L" shaped slide rail; 711. Positioning protrusion; 72. Pulling cable take-up roller; 73. Pulling cable; 74. Torsion spring; 85. Braking part two; 80. Pushing protrusion; 81. Pulling cable guide; 82. Return spring; 83. Gear disc; 830. Gear wall structure; 84. Connecting shaft; 85. Gear and spool assembly; 850. Gear; 851. spool. Detailed Implementation

[0024] Reference Figures 1-5 An adjustable semiconductor material polishing device is disclosed, wherein the semiconductor material can be silicon wafer. This is a fiber optic polishing machine, a type of existing technology. It mainly consists of a base 1 and an optical fiber clamping plate 2 above it. The base 1 serves as the basic support structure of the fiber optic polishing machine, used to install and fix other components, ensuring the stability of the polishing machine during operation. The optical fiber clamping plate 2 is used to fix the optical fiber, ensuring that the fiber maintains a stable position and orientation during polishing, preventing the fiber from shaking or shifting, which would affect the polishing quality.

[0025] Furthermore, the fiber optic clamp 2 consists of a base main frame, a core positioning structure of the positioning component, a clamping mechanism, an anti-fouling and sealing structure, an adapter interface compatibility design, and marking and installation positioning components. The core function of the fiber optic clamp 2 is to ensure that the fiber optic connector ferrule maintains a preset angle and pressure with the polishing disc during the polishing process through precise positioning and stable clamping, ultimately achieving high-precision polishing of the fiber end face, such as flat, spherical, and oblique spherical surfaces, which directly affects the loss and reliability of the fiber optic connection.

[0026] Based on the existing technology, in order to achieve the purpose of automated replacement of grinding discs, the present invention improves the existing technology with the following structure: (Refer to...) Figure 1 and Figure 2 The base 1 is equipped with a grinding disc main frame 3, which is provided with a guide slide. The guide slide has a "U" shaped structure and is connected by a working vertical groove 41, a lower grinding disc assembly guide horizontal groove 42, a lifting vertical groove 43, and an upper grinding disc assembly guide horizontal groove 44.

[0027] Furthermore, the grinding discs are disposed on the grinding disk assembly 4 within the base 1. The grinding disk assembly 4 comprises multiple sets. In the initial working state, the multiple grinding disk assemblies 4 are stacked sequentially and distributed along the length of the working vertical groove 41. In the initial state, the smallest grinding disc is located at the top of the grinding disk assembly 4, and then the grinding discs in the multiple grinding disk assemblies 4 below it decrease in size sequentially. In some embodiments, taking four sets of grinding disk assemblies 4 as an example, each grinding disk assembly 4 contains grinding disc A, grinding disc B, grinding disc C, and grinding disc D, respectively. The precision of grinding discs A, B, C, and D increases progressively. Therefore, in the initial state, the arrangement order of the grinding discs within the working vertical groove 41 is as follows: grinding disc D, grinding disc A, grinding disc B, and grinding disc C.

[0028] Additionally, it should be noted that the working vertical slot 41 is located below the fiber optic clamp 2, and the top of the working vertical slot 41 has an opening, which facilitates the placement of the stacked grinding disc assembly 4 onto the grinding disc main frame 3. When in use, the four sets of grinding disc assemblies 4 containing grinding discs are placed in sequence. When changing, the four sets of grinding disc assemblies 4 containing grinding discs are removed as a whole. This avoids the need to change the grinding discs during processing; they can simply be placed in as a whole before processing and removed as a whole after processing.

[0029] The process of automating the replacement of grinding discs in this invention is as follows: the grinding discs at the bottom are transferred to the top in sequence. Specifically, the arrangement order after the first replacement of the grinding discs is as follows: grinding disc C, grinding disc D, grinding disc A, and grinding disc B;

[0030] The arrangement order after the second replacement of the grinding discs is as follows: grinding disc B, grinding disc C, grinding disc D, and grinding disc A; the arrangement order after the third replacement of the grinding discs is as follows: grinding disc A, grinding disc B, grinding disc C, and grinding disc D.

[0031] Based on the above automatic replacement principle and combined with the structural basis of the guide slide, the process of each replacement of the grinding disc is to switch the grinding disc at the bottom to the top. This process is divided into the following three steps. This embodiment takes the first replacement of the grinding disc as an example: In the initial state, the grinding disc assembly 4 containing grinding disc D, grinding disc A, grinding disc B and grinding disc C are arranged vertically along the working vertical groove 41.

[0032] Step 1 Switching: The grinding disc assembly 4 containing grinding disc C slides along the horizontal groove 42 of the lower grinding disc assembly until it moves to the end connected to the lifting vertical groove 43. During this process, the top of the stacked grinding disc assembly 4 containing grinding disc D, grinding disc A and grinding disc B is left empty, leaving the position of the next grinding disc assembly 4 vacant.

[0033] Second step switching: The grinding disc assembly 4 containing the grinding disc C slides vertically upward along the lifting vertical groove 43 until it moves to the end that is connected to the upper grinding disc assembly guide horizontal groove 44.

[0034] Third step switching: The grinding disc assembly 4 containing the grinding disc C slides along the upper grinding disc assembly guide horizontal groove 44 until it moves to the top of the working vertical groove 41 (directly above the grinding disc D).

[0035] In some embodiments, the structural basis for changing the grinding disc each time is as follows: 1. Initial state: First, the cross-section of the guide groove is T-shaped. To facilitate the sliding and switching of the grinding disc assembly 4, the grinding disc main frame 3 is cylindrical, and the outer wall of the grinding disc assembly 4 is provided with a sliding protrusion 40 corresponding to the guide groove. The sliding protrusion 40 slides along the inner wall of the guide groove, thereby driving the grinding disc assembly 4 to slide along the guide groove and changing the arrangement order of the grinding disc assembly 4. In some embodiments, the sliding protrusion 40 includes a horizontal connecting part 400 and an arc-shaped outer edge 401. To prevent the sliding protrusion 40 from disengaging from the guide groove, the width and length of the horizontal connecting part 400 are both smaller than the width and length of the arc-shaped outer edge 401.

[0036] In addition, the grinding disc main frame 3 is provided with a locking position located directly below the working vertical groove 41. This position is composed of a vertically retractable positioning pin 330. Furthermore, each grinding disc assembly 4 has a positioning hole at its bottom corresponding to the positioning pin 330. When the positioning pin 330 is inserted into the positioning hole, the bottom grinding disc assembly 4 is locked and cannot be pushed, ensuring the stability of the multiple grinding disc assemblies 4 stacked vertically, i.e., the grinding stage in the working state. Conversely, when the positioning pin 330 is disengaged from the positioning hole, the bottom grinding disc assembly 4 is unlocked, can be pushed, and slides along the lower grinding disc assembly's horizontal groove 42.

[0037] 2. First step of the switching process: The rotating guide drive 30 inside the grinding disc main frame 3 slides the grinding disc assembly 4 located below along the lower grinding disc assembly guide horizontal groove 42 until it moves to the other end of the lower grinding disc assembly guide horizontal groove 42.

[0038] In some embodiments, the output drive 30 has an arc-shaped structure and is driven by a turntable 5 below it. The turntable 5 is located inside the grinding disc main frame 3 and is driven by an external rotating motor installed in the base 1.

[0039] In addition, the grinding disc main frame 3 is provided with a slide rail for the rotation of the output drive 30. The slide rail is a lower ring slide rail 33, which has an inner and outer double slide rail structure. The top of the output drive 30 is located at the bottom of the lower ring slide rail 33.

[0040] Furthermore, for the drive component 30 to move the grinding disc assembly 4 located at the bottom, an unlocking function is required first, that is, to release the locking of the positioning pin 330 to the positioning hole. Furthermore, the unlocking structure needs to be coordinated with the movement process of the drive component 30. For this purpose, the unlocking structure is set as follows: the bottom of the positioning pin 330 is connected to a horizontally set drive protrusion 331 through a connecting rib. The outer wall of the drive component 30 is provided with a drive guide groove corresponding to the drive protrusion 331. The drive guide groove includes a lower extension slide groove 332 and a smooth groove 333. The projected length of the drive guide groove is the same as the arc length of the outer wall of the drive component 30, that is, the two ends of the drive guide groove are open.

[0041] The unlocking process is as follows: As the export drive component 30 rotates, the drive protrusion 331 moves to the opening of the lower extension slide groove 332, causing the drive protrusion 331 to slide along the drive guide groove. When the drive protrusion 331 slides along the lower extension slide groove 332, it moves downward in the vertical direction, and then drives the positioning pin 330 to move downward through the connecting rib, so that the positioning pin 330 is disengaged from the positioning hole (unlocking). When the drive protrusion 331 continues to slide along the smooth groove 333, the bottom grinding disc assembly 4 slides horizontally along the lower grinding disc assembly export horizontal groove 42 under the push of the export drive component 30.

[0042] The locking process is as follows: First, the positioning pin 330 slides vertically on the lower ring slide rail 33, and its outer wall is fitted with a locking spring. The two ends of the locking spring are connected to the lower ring slide rail 33 and the connecting rib. When unlocked, the driving protrusion 331 disengages from the smooth groove 333, and the positioning pin 330 returns to its vertical position under the drive of the locking spring. Since multiple grinding disc assemblies 4 are stacked sequentially through the slide protrusion 40, the position of the positioning hole is determined. After the grinding disc assembly 4 at the bottom is removed, the positioning hole on the new grinding disc assembly 4 reconnects with the positioning pin 330.

[0043] After the positioning pin 330 and the lowest grinding disc assembly 4 are unlocked, the movement of the lowest grinding disc assembly 4 is as follows: The top of the outgoing drive component 30 is provided with an outgoing drive protrusion 300. The outgoing drive protrusion 300 is located between the inner and outer double slide rail structures and is set with a protruding top. As the outgoing drive component 30 rotates, the vertical part protruding from the top surface of the inner and outer double slide rails abuts against the outer wall of the lowest grinding disc assembly 4, causing the grinding disc assembly 4 to rotate with the rotation of the outgoing drive protrusion 300 and the outgoing drive component 30, that is, to slide horizontally along the outgoing horizontal groove 42 of the lower grinding disc assembly.

[0044] It should be added that: in order to ensure that the export drive protrusion 300 can contact the outer wall of the bottom grinding disc assembly 4 after the positioning pin 330 and the bottom grinding disc assembly 4 are unlocked, the position of the lower extension groove 332 on the export drive component 30 should be before the export drive protrusion 300.

[0045] 3. Second step switching process: The driving component that drives the grinding disc assembly 4 to slide along the lifting vertical groove 43 is the lifting driving component 31, which is a block structure. It slides along the lifting vertical groove 43 and is driven by the screw 6. When the grinding disc assembly 4 is mounted on the lifting driving component 31, it rotates with the screw 6, driving the grinding disc assembly 4 to move upward.

[0046] In some implementations, the rotation of the screw 6 can be driven by an external rotary motor.

[0047] In this embodiment, the rotation of the screw 6 can also be achieved through some transmission structures, namely, in conjunction with the movement and transmission structure of the drive component 30. The specific settings are as follows: First, in the initial state, the top of the lifting drive component 31 is flush with the top of the lower ring slide rail 33, that is, the lower ring slide rail 33 is provided with a storage groove corresponding to the lifting drive component 31, so as to ensure that the grinding disc assembly 4 after the first step of the switching process accurately falls on the lifting drive component 31.

[0048] Secondly, once the contact between the guide drive protrusion 300 and the grinding disc assembly 4 resting on the lifting drive member 31 is released, the bottom of the lower ring slide rail 33 is provided with a disengagement slide 334, which is located below the lifting drive member 31. When the guide drive member 30 slides along the inclined surface of the disengagement slide 334, the guide drive protrusion 300 gradually disengages from the grinding disc assembly 4 located at the bottom. The end of the guide drive member 30 is provided with a contact surface that is the same as the inclined surface of the disengagement slide 334.

[0049] It should be added that: 1. The export drive component 30 slides vertically on the turntable 5 via an elastic telescopic component, which can be composed of a telescopic rod and a telescopic spring. That is, when the export drive component 30 slides along the disengagement slide 334, the export drive component 30 moves relative to the turntable 5, compressing the telescopic spring, ensuring that the change in the vertical position of the export drive component 30 does not affect its rotation mode; 2. In some embodiments, to facilitate the disengagement of the export drive protrusion 300 and the grinding disc assembly 4, similarly, the export drive protrusion 300... One way to elastically extend the top of the export drive component 30 is as follows: the top of the export drive component 30 is provided with an export drive protrusion 300 receiving groove, the bottom of the receiving groove is connected to the bottom of the export drive protrusion 300 through a spring component, and the end face of the export drive protrusion 300 is provided with an abutting slope, which contacts the grinding disc assembly 4. When the grinding disc assembly 4 is located on the lifting drive component 31, it rotates with the export drive component 30, which can squeeze the export drive protrusion 300 into the receiving groove and squeeze the spring component.

[0050] Finally, as the lead-out drive 30 continues to rotate, the screw 6 is driven to rotate via the brake unit 7, which includes a brake boss 70, a wire pull slider 71, and a wire take-up roller 72. The brake boss 70 is disposed on the inner side wall of the lead-out drive 30.

[0051] The pull-wire slider 71 slides within the grinding disc main frame 3 via the "L"-shaped slide rail 710 and is braked by the braking boss 70. The braking boss 70 and the pull-wire slider 71 have the same inclined contact surface on one side. The pull-wire slider 71 is guided and constrained by the "L"-shaped slide rail 710, which consists of an arc-shaped track and a vertical track, and has two layers of rails, with the braking boss 70 located between the upper and lower layers of rails. When the pull-wire slider 71 is braked by the braking boss 70 and slides to the horizontal arc end of the "L"-shaped slide rail 710, the pull-wire slider 71 moves into the vertical track under the action of the inclined contact surface, and is then positioned by the positioning protrusion 711 that can protrude outward to the inner wall of the "L"-shaped slide rail 710. The outer wall of the pull-wire slider 71 is provided with a locking hole corresponding to the positioning protrusion 711. When the positioning protrusion 711 is positioned with the locking hole, the lifting drive 31 moves to the top, and the grinding disc assembly 4 is located in the upper grinding disc assembly guide horizontal groove 44.

[0052] It should be added that the positioning protrusion 711 can be driven by either electronic or mechanical means.

[0053] When the positioning protrusion 711 is electronically driven, a sensor is installed at the inner end of the vertical track. The sensor can be a pressure sensor or a distance sensor. The positioning protrusion 711 is driven by a cylinder or a lead screw driven by a motor. When the sensor receives a signal from the pull-wire slider 71, the controller drives the positioning protrusion 711 to move linearly and engage with the locking hole. In addition, a pressure sensor can be installed on the lifting drive component 31. When a pressure change is received, the controller feeds back to the drive component of the positioning protrusion 711, releasing the positioning protrusion 711 from the locking hole.

[0054] When the positioning protrusion 711 is mechanically driven, it has a trigger protrusion and a release protrusion. When the trigger protrusion is activated, it drives the locking disc structure to rotate via transmission structure one. The locking disc structure, through a connecting rod protrusion, drives the positioning protrusion 711 backward. When the trigger protrusion is deactivated, the locking disc structure automatically resets under the action of a storage spring, driving the positioning protrusion 711 forward and engaging with the locking hole. When the release protrusion is deactivated, it drives the locking disc structure via transmission structure two, causing the positioning protrusion 711 to disengage from the locking hole. The triggering of the protrusion is a continuous process, while the deactivation process is a sequential process. Furthermore, the speed of the positioning protrusion 711 after reset is greater than the reset speed of the pull-wire slider 71. The transmission structure for this process is a conventional manual mechanism and will not be described in detail.

[0055] The take-up roller 72 is fixedly sleeved on the outer wall of the screw 6 and is connected to the take-up slider 71 by a pull wire 73. The outer wall of the take-up roller 72 is provided with a torsion spring 74.

[0056] The second step of the overall switching process is as follows: When the pull wire slider 71 is slid by the braking boss 70, the brake screw 6 is rotated through the pull wire 73, which drives the lifting drive 31 to move along the lifting vertical groove 43 to the top, the positioning protrusion 711 positions the pull wire slider 71, and the torsion spring 74 stores power.

[0057] 4. Third step switching process: The driving force for the movement of the grinding disc assembly 4 along the horizontal groove 44 of the upper grinding disc assembly is the guide drive component 32, which is an arc-shaped block structure with a pushing protrusion 80, and slides on the upper ring slide rail 34 inside the grinding disc main frame 3.

[0058] In some embodiments, the rotation of the drive unit 32 can be driven by an external rotary motor.

[0059] In this embodiment, the rotation of the inlet drive 32 can also be achieved through some transmission structures, that is, in conjunction with the movement and transmission structure of the outlet drive 30. The specific settings are as follows: the inlet drive 32 is driven by the inlet pull rope 81, that is, it continues to rotate with the outlet drive 30. The inlet pull rope 81 is pulled by the brake part 2 8. The inlet drive 32 is connected to the inner wall of the grinding disc main frame 3 through the return spring 82. The brake part 2 8 includes a toothed disc 83 and a gear coil assembly 85.

[0060] Reference Figure 3 The toothed disc 83 is coaxially set with the turntable 5 via the connecting shaft 84 and rotates inside the grinding disc main frame 3. The grinding disc main frame 3 can be hollow. The outer wall of the toothed disc 83 is provided with an outwardly convex arc-shaped tooth wall structure 830, which is located at a section of the toothed disc 83.

[0061] The gear and spool assembly 85 consists of a coaxial gear 850 and a spool 851. The gear 850 meshes with the tooth wall structure 830, and the guide rope 81 is wound around the spool 851.

[0062] The second step of the overall switching process is as follows: As the turntable 5 rotates, when the meshing teeth on the outer wall of the tooth wall structure 830 mesh with the gear 850 and push the protrusion 80 to contact the outer wall of the grinding disc assembly 4, as the turntable 5 continues to rotate, the gear 850 drives the coil 851 to rotate, and then the guide pull rope 81 brakes the guide drive 32 to slide along the upper grinding disc assembly guide horizontal groove 44, thereby braking the grinding disc assembly 4 to slide horizontally along the upper grinding disc assembly guide horizontal groove 44 until the grinding disc assembly 4 moves to the top of the working vertical groove 41.

[0063] It should be added that: in the working state, the guide drive 32 remains in contact with the outer wall of the topmost grinding disc assembly 4; and when the meshing teeth of the outer wall of the tooth wall structure 830 are not meshing with the gear 850, the guide drive 32 is reset under the action of the reset spring 82.

[0064] In some embodiments, the structure of the grinding disc assembly 4 can be referred to Figure 5 It consists of a chassis 45, a limiting ring 46, and a grinding disc 47. The grinding disc 47 is disposed between the chassis 45 and the limiting ring 46 and can rotate relative to the chassis 45 and the limiting ring 46. The grinding pad is mounted on the grinding disc 47, and the slide protrusion 40 is disposed on the outer wall of the chassis 45.

[0065] To facilitate the rotation of the grinding disc 47, in some embodiments, the shape of the grinding disc 47 is as follows: Figure 5The base 1 has a cover plate on top, and a connecting ring 100 is elastically connected to the bottom of the cover plate. The connecting ring 100 has a drive gear 101 driven by a servo motor. The drive gear 101 meshes with a gear ring 102. The gear ring 102 and the grinding disc 47 are meshed through a meshing part, wherein the meshing part has a triangular prism-shaped meshing tooth structure. When the meshing tooth structure provided below the gear ring 102 meshes with the meshing tooth structure on the grinding disc 47, the grinding disc 47 self-adjusts and rotates, thereby causing the gear ring 102 to drive the grinding disc 47 to rotate.

[0066] During the polishing of the optical fiber on the optical fiber clamp 2, after the optical fiber clamp 2 descends, it contacts the connecting ring 100 and causes it to descend further. As a result, the toothed ring 102 engages with the polishing disc 47. After the servo motor operates, it drives the polishing disc 47 to rotate, thereby enabling the polishing disc on the polishing disc 47 to rotate relative to the optical fiber end clamped on the optical fiber clamp 2, thus completing the polishing process.

[0067] It should be noted that, to facilitate the rotation of the grinding disc 47, a rolling bearing or ball bearing structure can be added between the inner walls of the base 45 and the limiting ring 46 to reduce the frictional impact during the rotation of the grinding disc 47. Additionally, the base 45 and the limiting ring 46 can be connected by threads to allow for disassembly and easy replacement of the grinding disc 47.

[0068] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An adjustable semiconductor material grinding device, comprising a base (1) and an optical fiber clamp (2) above it, characterized in that, The base (1) is provided with a grinding disc main frame (3), and the grinding disc main frame (3) is provided with at least two grinding disc assemblies (4). During operation, multiple grinding disc assemblies (4) are stacked one on top of the other. The grinding disc assembly (4) is provided with a sliding protrusion (40), and the grinding disc main frame (3) is provided with a guide groove corresponding to the sliding protrusion (40). The guide groove has a "U" shaped structure and is composed of a working vertical groove (41), a lower grinding disc assembly outlet horizontal groove (42), a lifting vertical groove (43), and an upper grinding disc assembly inlet horizontal groove (44). The grinding disc main frame (3) is provided with an outgoing drive (30), a lifting drive (31) and an ingoing drive (32). The outgoing drive component (30) has an arc-shaped structure and is driven by the turntable (5) below it. The turntable (5) is located inside the grinding disc main frame (3). The top of the export drive component (30) is provided with an export drive protrusion (300), and the grinding disc main frame (3) is provided with a lower ring slide rail (33). The lower ring slide rail (33) is an inner and outer double slide rail structure. The top of the export drive component (30) is located at the bottom of the lower ring slide rail (33), and the export drive protrusion (300) is located between the inner and outer double slide rail structures, with the top protruding upward. The inlet drive (32) is an arc-shaped block structure with a pushing protrusion (80), which slides on the upper ring slide rail (34) inside the grinding disc main frame (3) and is driven by the inlet pull rope (81); As the guide drive (30) rotates, the guide rope (81) is pulled by the brake part two (8). The guide drive (32) is connected to the inner wall of the grinding disc main frame (3) through the return spring (82). The brake part two (8) includes: The toothed disc (83) is coaxially arranged with the turntable (5) via a connecting shaft (84), and the outer wall of the toothed disc (83) is provided with an outwardly convex arc-shaped tooth wall structure (830). The gear-coil assembly (85) consists of a coaxial gear (850) and a coil (851), wherein the gear (850) meshes with the tooth wall structure (830), and the guide rope (81) is wound around the coil (851).

2. The adjustable semiconductor material grinding equipment according to claim 1, characterized in that, The grinding disc main frame (3) is a cylindrical structure, and the slide protrusion (40) is a T-shaped structure, which includes a horizontal connecting part (400) and an arc-shaped outer edge (401). The width and length of the horizontal connecting part (400) are both smaller than the width and length of the arc-shaped outer edge (401).

3. The adjustable semiconductor material grinding equipment according to claim 1, characterized in that, Both the outgoing drive (30) and the incoming drive (32) are driven by a rotary motor, and the lifting drive (31) is driven by a vertical linear drive.

4. The adjustable semiconductor material grinding equipment according to claim 1, characterized in that, The bottom of the lower ring slide rail (33) is provided with a disengagement slide (334), which is located below the lifting drive (31). When the outgoing drive (30) slides along the disengagement slide (334), the outgoing drive protrusion (300) disengages from the grinding disc assembly (4) located at the bottom, and the grinding disc assembly (4) is located on the lifting drive (31). The lifting drive component (31) is a block structure that slides along the lifting vertical groove (43). The lifting drive component (31) is driven by a screw (6).

5. The adjustable semiconductor material grinding equipment according to claim 4, characterized in that, As the lead-out drive (30) rotates, the screw (6) is driven to rotate via the braking unit (7), which includes: A braking boss (70) is disposed on the inner sidewall of the outgoing drive member (30); The pull-line slider (71) slides within the grinding disc main frame (3) via the "L"-shaped slide rail (710) and is braked by the braking boss (70). When it slides to the end of the "L"-shaped slide rail (710), it is positioned by the positioning protrusion (711) that can protrude outward to the inner wall of the "L"-shaped slide rail (710). A wire take-up roller (72) is fixedly sleeved on the outer wall of the screw (6) and connected to the wire take-up slider (71) by a wire (73). A torsion spring (74) is provided on the outer wall of the wire take-up roller (72). When the pull wire slider (71) slides under the braking boss (70), the pull wire (73) brake screw (6) rotates, driving the lifting drive (31) to move along the lifting vertical groove (43) to the top, the positioning protrusion (711) positions the pull wire slider (71), and the torsion spring (74) stores force.

6. The adjustable semiconductor material grinding equipment according to claim 1, characterized in that, The lower ring slide rail (33) is provided with a locking position, which is located directly below the working vertical groove (41) and is provided with a positioning pin (330). The bottom of the grinding disc assembly (4) is provided with a positioning hole corresponding to the positioning pin (330). The bottom of the positioning pin (330) is connected to a horizontally arranged driving protrusion (331) by a connecting rib. The outer wall of the outgoing driving member (30) is provided with a driving guide groove corresponding to the driving protrusion. The driving guide groove includes a lower extension slide groove (332) and a smooth groove (333). The projected length of the driving guide groove is the same as the arc length of the outer wall of the outgoing driving member (30).

7. A method using the adjustable semiconductor material grinding apparatus according to claim 1, characterized in that, Includes the following processes: The outgoing drive (30) rotates along the grinding disc main frame (3) to slide the grinding disc assembly (4) located below along the lower grinding disc assembly outgoing horizontal groove (42) until it falls above the lifting drive (31); The lifting drive (31) slides along the lifting vertical groove (43) to transport the grinding disc assembly (4) above it upward into the upper grinding disc assembly guide horizontal groove (44); The import drive (32) rotates along the upper grinding disc assembly import horizontal groove (44) to transport the grinding disc assembly (4) in the upper grinding disc assembly import horizontal groove (44) to the top of the working vertical groove (41).

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