Gluing and developing equipment

Abstract

The invention discloses gluing and developing equipment. The gluing and developing equipment comprises a process chamber, the heating element is arranged in the process chamber and is used for heating the wafer; the lifting control module comprises a plurality of lifting parts, and the plurality of lifting parts are movably arranged in the process chamber along the axial direction of the heating part and are used for driving the wafer to move; the cavity cover module comprises a cover main body, and the cover main body is detachably arranged in the process cavity to seal the process cavity; the cooling unit comprises a cooling piece movably placed on the lifting control module; the specific heat capacity C of the cooling piece is larger than or equal to 700 J / (kg.K); during cooling, the temperature of the heating piece and the temperature of the cover main body are both higher than the initial temperature of the cooling piece; the lifting control module drives the cooling piece to get close to the heating piece so as to cool the heating piece; the lifting control module drives the cooling part to get close to the cover body so as to cool the cover body. The cooling efficiency of the heater and the cover body can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a coating and developing apparatus. Background Technology

[0002] In the photolithography process of semiconductor manufacturing, the hot plate unit of the resist coating and developing equipment is responsible for completing key heat treatment steps such as soft baking after resist coating and baking after exposure. These processes place extremely high demands on the temperature control accuracy, stability, and heating / cooling rates of the hot plate unit. Among these, the rapid cooling capability of the hot plate unit's heater directly determines the equipment's production cycle time and capacity. If the hot plate cannot quickly cool down from the process temperature of the previous cycle to the set temperature of the next cycle after completing a process cycle, it will become a bottleneck restricting the overall capacity of the machine.

[0003] In existing technology, a rapid cooling device is installed below the heater to blow compressed air upwards from below, utilizing forced convection heat transfer to remove heat from the heater. However, the cooling rate of the heater using forced convection heat transfer with compressed air is related to the gas flow rate, and the compressed air flow rate provided to the hot plate unit is limited. This means that the rapid cooling device has a bottleneck in cooling rate. Furthermore, the blowing process introduces particulate matter into the process chamber, which can affect subsequent wafer processing.

[0004] Therefore, it is necessary to provide a new coating and developing device to solve the above-mentioned problems existing in the prior art. Summary of the Invention

[0005] The technical problem to be solved by this application is how to provide a coating and developing device that can improve the cooling efficiency of the heater and the cover.

[0006] To solve the above-mentioned technical problems, according to an embodiment of this application, a coating and developing apparatus is provided, including a process chamber; A heating element, disposed within the process chamber, is used to heat the wafer; The lifting control module includes multiple lifting components, all of which are movably disposed in the process chamber along the axial direction of the heating element, for driving the wafer to move; A cavity cover module includes a cover body, which is detachably disposed in the process cavity to seal the process cavity; The cooling unit includes a cooling component movably placed within the lifting control module; the specific heat capacity C of the cooling component is ≥700 J / (kg·K); and during cooling, the temperatures of the heating component and the cover body are both higher than the initial temperature of the cooling component; during the cooling process, the cooling component is placed within the lifting control module; the lifting control module moves the cooling component closer to the heating component to cool the heating component; the lifting control module moves the cooling component closer to the cover body to cool the cover body; after cooling is complete, the cooling component is removed from the lifting control module.

[0007] According to an embodiment of this application, the cooling component includes a cooling body and a plurality of protrusions spaced apart at one end of the cooling body; the protrusions are used to abut against the inner wall of the cavity cover module to create a gap between the cavity cover module and the cooling component.

[0008] According to an embodiment of this application, the cooling unit further includes a driving mechanism and a support member; the support member is movably disposed on the driving mechanism along the radial direction of the process chamber and is used to support the cooling member; the driving mechanism is disposed outside the process chamber to drive the support member to move; The driving mechanism drives the carrier to enter the process chamber from outside the process chamber to place the cooling component on the lifting control module; or the driving mechanism drives the carrier to move from inside the process chamber to outside the process chamber to transfer the cooling component to the outside of the process chamber.

[0009] According to an embodiment of this application, the carrier is provided with a plurality of receiving channels, which pass through the end of the carrier near the process chamber along the movement direction of the carrier; the positions of the plurality of receiving channels correspond to the positions of the plurality of lifting members, so that when the carrier is placed in the process chamber, the plurality of lifting members are respectively placed in the corresponding receiving channels.

[0010] According to an embodiment of this application, the cooling unit further includes a cooling liquid circulation pipe, which is coiled inside the support member; the cooling liquid circulation pipe is used to introduce coolant to cool the cooling member placed on the support member.

[0011] According to an embodiment of this application, the cooling element is made of silicon.

[0012] According to an embodiment of this application, the heating element includes a heater, a support, and a plurality of temperature sensors; the heater is used to heat the wafer; the support is disposed on the inner wall of the process chamber to support the heater; the plurality of temperature sensors are spaced apart at the ends of the heater to detect the temperature of the heater.

[0013] According to an embodiment of this application, the heater is provided with multiple lifting channels at intervals; each lifting component is movably disposed in the corresponding lifting channel; the lifting control module further includes a lifting plate and a lifting controller for driving the lifting plate to move; multiple lifting components are disposed on the lifting plate, and the lifting controller drives the lifting plate to move so that multiple lifting components simultaneously approach the heater or approach the cover body.

[0014] According to an embodiment of this application, the cavity cover module further includes a lifting mechanism and an exhaust component; the lifting mechanism is connected to the cover body and is used to drive the cover body away from or near the process chamber to open or close the process chamber; the exhaust component is disposed on the cover body and communicates with the process chamber to exhaust gas.

[0015] According to an embodiment of this application, a cooling device is also included for cooling the cooling components; during operation, one of the cooling components is placed on the support member, and the remaining cooling components are placed on the cooling device for cooling.

[0016] By adopting the above technical solution, after wafer processing, the temperature of the heater and the cover body in the process chamber is relatively high. At this time, the cooling component is transferred to the process chamber. Inside the process chamber, the cooling component is supported by a lifting component. The lifting component moves the cooling component closer to the heating component, thereby cooling the heating component. The lifting component moves the cooling component closer to the cover body, thereby cooling the cover body. The cooling component cooling method does not introduce trace particles into the process chamber, and avoids secondary baking of the heater by the cover body. In addition, the material of the cooling component is the same as that of the wafer, thereby reducing the possibility of introducing new impurities and improving the efficiency of subsequent wafer processing. At the same time, the heat capacity of the cooling component can be adjusted by adjusting the thickness of the cooling component to achieve the effect of absorbing more heat. In addition, the device does not involve gas purging during cooling, has good cooling uniformity, and can cool both the heater and the cover body, solving the problem of secondary baking of the heating component by the cover body. Moreover, it does not introduce additional hardware devices, effectively solving the shortcomings of traditional rapid cooling solutions. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the main structure of a coating and developing device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a cooling component according to an embodiment of the present invention; Figure 3 This is a schematic diagram showing the positional relationship of various components when a carrier delivers a cooling component into a process chamber according to an embodiment of the present invention. Figure 4This is a schematic diagram showing the positional relationship of various components when a cooling component cools the cover body according to an embodiment of the present invention. Figure 5 This is a schematic diagram showing the positional relationship of various components when a cooling component cools a heating component according to an embodiment of the present invention. Figure 6 This is a schematic diagram showing the positional relationship of various components when the cooling component is removed and the process chamber is closed, according to an embodiment of the present invention.

[0018] Figure label: 1. Heating element; 101. Heater; 102. Support element; 103. Temperature sensor; 104. Lifting channel; 2. Cooling unit; 5. Cooling element; 501. Cooling body; 502. Protruding structure; 204. Drive mechanism; 203. Support block; 201. Bearing element; 202. Cooling liquid circulation pipe; 3. Cavity cover module; 301. Cover body; 302. Lifting mechanism; 303. Exhaust element; 4. Lifting control module; 401. Lifting element; 402. Lifting plate; 403. Lifting controller. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0020] The following is in conjunction with the appendix Figure 1-6 The specific embodiments of the present invention will be further described in detail below.

[0021] In existing technologies, a common rapid cooling solution involves placing a rapid airflow cooling device below the heater, blowing compressed air upwards from below, and utilizing forced convection heat transfer to remove heat from the heater. However, this method has a series of significant and insurmountable drawbacks in actual semiconductor manufacturing environments. First, there's the cooling rate issue. The cooling rate of a heater utilizing forced convection heat transfer with compressed air is related to the gas flow rate, but the compressed air flow rate provided to the heat exchanger unit is limited, creating a bottleneck in the cooling rate of traditional rapid airflow cooling devices. Second, there's the contamination issue. Even after filtration, compressed air may still contain trace amounts of particulate matter. Directly blowing air onto the back of the heater can easily cause particulate matter to rise or splash, leading to DPA (Displacement Per Amount) problems. Simultaneously, oil, moisture, and other contaminants in the compressed air undergo thermochemical reactions or thermal decomposition upon contact with the high-temperature back of the heater, producing molecular-level contaminants that are difficult to remove. These contaminants can migrate to the wafer surface, causing defects in the photoresist. Finally, there's the issue of cooling uniformity. A perfectly uniform distribution of airflow on the back of the heater is difficult to achieve, resulting in different cooling rates in different areas of the heater and creating instantaneous non-uniform temperature fields. This uneven cooling generates localized thermal stress within the heater. Long-term cyclic use may lead to heater deformation, cracking, or damage, shortening its lifespan and affecting the long-term temperature uniformity of the hot plate surface. There's also the problem of slow plate cover cooling, causing secondary heating of the heater. Traditional rapid cooling systems can only cool the heater. Once the heater reaches the designated temperature, the plate cover, relying solely on natural convection, cools much slower, resulting in a plate cover temperature significantly higher than the heater temperature. This causes the plate cover to passively heat the heater, leading to a secondary heating and making it difficult to reach the designated temperature for an extended period. Finally, there's the issue of equipment complexity. Each hot plate unit requiring rapid cooling needs a high-flow, stable rapid cooling system, significantly increasing system complexity and manufacturing costs. The additional gas system occupies valuable internal space and introduces new maintenance requirements (such as periodic filter replacement, pipeline sealing checks, and leak prevention) and gas supply requirements, reducing equipment reliability.

[0022] Therefore, in order to solve the above-mentioned series of problems, embodiments of the present invention provide a coating and developing apparatus, including a process chamber; Heating element 1, located within the process chamber, is used to heat the wafer; The lifting control module 4 includes multiple lifting components 401, which are movably disposed in the process chamber along the axial direction of the heating component 1 to drive the wafer to move. The cavity cover module 3 includes a cover body 301, which is detachably disposed in the process cavity to seal the process cavity; The cooling unit 2 includes a cooling component 5 movably mounted on the lifting control module 4. The specific heat capacity C of the cooling component 5 is ≥700 J / (kg·K). During cooling, the temperatures of the heating element 1 and the cover body 301 are both higher than the initial temperature of the cooling component 5. During the cooling process, the cooling component 5 is placed on the lifting control module 4. The lifting control module 4 moves the cooling component 5 closer to the heating element 1 to cool the heating element 1. The lifting control module 4 also moves the cooling component 5 closer to the cover body 301 to cool the cover body 301. After cooling is complete, the cooling component 5 is removed from the lifting control module 4. It is worth noting that, here, the cooling component 5 movably mounted on the lifting control module 4 means that when cooling is required, the cooling component 5 is placed on the lifting control module 4; when cooling is not required, the cooling component 5 is placed in a temporary storage unit or in a cooling device for cooling the cooling component 5.

[0023] In some embodiments, the coating and developing equipment includes a process chamber, and a heating element 1 is disposed within the process chamber to heat the wafer placed inside the process chamber. Specifically, the wafer is placed on multiple lifting elements 401 within the process chamber, and the multiple lifting elements 401 can move synchronously, thereby driving the wafer to move within the process chamber; more specifically, the multiple lifting elements 401 are all rod-shaped and can rise or fall along the axial direction of the process chamber, thereby driving the wafer to rise or fall within the process chamber, realizing the adjustment of the distance between the wafer and the heating element 1, thus facilitating the wafer processing process.

[0024] In some embodiments, the cover body 301 is disposed above the process chamber and is used to close the opening at the top of the process chamber; when the cover body 301 contacts the process chamber, it closes the opening at the top of the process chamber; when the cover body 301 separates from the process chamber, it opens the opening at the top of the process chamber.

[0025] In some embodiments, a cooling unit 2 is also provided, wherein the cooling unit 2 includes a cooling component 5. During the cooling process, the cover body 301 needs to be opened, and then the cooling component 5 is placed on the lifting component 401; that is, the lifting component 401 supports the cooling component 5, and at the same time, the lifting component 401 rises or falls in the process chamber, which can drive the cooling component 5 to rise or fall in the process chamber, thereby bringing the cooling component 5 closer to the heating component 1 or closer to the cover body 301. Specifically, when it is necessary to cool down the heating element 1, the lifting element 401 is moved to bring the cooling element 5 closer to the end face of the heating element 1, thereby cooling down the heating element 1; when it is necessary to cool down the cover body 301, the lifting element 401 is moved to bring the cooling element 5 closer to the cover body 301, thereby cooling down the cover body 301; it is worth noting that during the cooling process, the end face of the cooling element 5 will not directly contact the heating element 1 or the cover body 301, but will leave a certain gap to reduce the possibility of uneven temperature due to local contact.

[0026] In some specific embodiments, in order to ensure that the cooling component 5 can cool the cover body 301 and the heating component 1, the specific heat capacity C of the cooling component 5 is set to be ≥700 J / (kg·K). Specifically, the material of the cooling component 5 can be silicon, silicon carbide, or other materials whose specific heat capacity can meet the above conditions. There are no restrictions here. The main focus is on meeting the above conditions in terms of specific heat capacity and being able to cool the cover body 301 and the heating component 1.

[0027] In some more specific embodiments, during cooling, the temperature of the heating element 1 and the temperature of the cavity cover module 3 are both higher than the initial temperature of the cooling element 5, so that when the heating element 1 is close to the cover body 301, it can cool the cover body 301, and when the heating element 1 is close to the heating element 1, it can cool the heating element 1.

[0028] In some embodiments, in order to enable a gap between the cooling component 5 and the cover body 301 or the heating component 1 during the cooling process, the cooling component 5 is provided to include a cooling body 501 and a plurality of protruding structures 502 spaced apart at one end of the cooling body 501; the protruding structures 502 are used to abut against the inner wall of the cavity cover module 3 so that there is a gap between the cavity cover module 3 and the cooling component. Specifically, multiple protrusions 502 are evenly spaced along the circumference of the cooling body 501 on one end face of the cooling body 501. When the cooling component 5 is placed in the process chamber and supported by the lifting component 401, the lifting component 401 abuts against the end face of the cooling body 501. At this time, the protrusions 502 are placed on the top surface of the cooling body 501, and the lifting component 401 is placed on the bottom surface of the cooling body 501. Therefore, during the cooling process of the heating component 1, the lifting component 401 will stop moving when it is lowered to the predetermined position, so that there is a gap between the end face of the heating component 1 and the end face of the lifting component 401. During the cooling process of the cover body 301, the lifting component 401 rises until the protrusions 502 abut against the end face of the cover body 301. At this time, due to the restriction of the protrusions 502, the cover body 301 and the cooling component 5 will not directly contact each other, thereby reducing the possibility of uneven temperature caused by local contact.

[0029] In some specific embodiments, the material of the protrusion structure 502 is the same as that of the cooling component 5; the two are fixed by integral molding or by detachable fixing, and the fixing method is not limited, as long as the position of the protrusion structure 502 on the cooling component 5 does not change.

[0030] In some specific embodiments, the material of the protruding structure 502 is different from that of the cooling component 5; the specific material is not limited, as long as it does not affect the cooling process of the cooling component 5. The two are fixed in a detachable manner, and the specific fixing method is not limited, as long as the position of the protruding structure 502 on the cooling component 5 does not change.

[0031] In some embodiments, to facilitate the transfer of the cooling element 5 between the inside and outside of the process chamber, the cooling unit 2 further includes a driving mechanism 204 and a support member 201. The support member 201 is radially movable on the driving mechanism 204 and is used to support the cooling element 5. The driving mechanism 204 is located outside the process chamber to drive the support member 201 to move. Specifically, the support member 201 can be plate-shaped, block-shaped, or other shapes that can support the cooling element 5. The specific shape is not limited here, as long as it can support the cooling element 5. At the same time, the support member 201 is connected to the driving mechanism 204, and the driving mechanism 204 can drive the support member 201 to move, thereby driving the cooling element 5 to move. More specifically, the drive mechanism 204 is located outside the process chamber. The drive mechanism 204 includes a drive rail and a drive component mounted on the drive rail. The drive rail extends radially along the process chamber, and the drive component can move along the length of the drive rail to approach or move away from the process chamber. To facilitate the movement of the drive component, an actuator is also provided. The actuator can be a pneumatic cylinder, an electric cylinder, or a combination of a lead screw module and a motor; no limitation is made here, as long as it can drive the drive component to move on the drive rail. Simultaneously, the support component 201 is connected to the drive component, enabling the drive component to drive the support component 201 to move synchronously during movement. Specifically, the end of the support component 201 furthest from the process chamber is connected to the drive component, allowing the support component 201 to extend into the process chamber, reducing the possibility of interference between the drive component and the side wall of the process chamber during movement.

[0032] In some specific embodiments, a support block 203 is provided on the drive component, that is, the carrier component 201 is connected to the drive component through the support block 203, that is, connected to the drive mechanism 204; the support block 203 is detachably connected to the drive component, that is, detachably connected to the drive mechanism 204, and the support block 203 is detachably connected to the carrier component 201, thereby facilitating the replacement of support blocks 203 of different heights to adjust the height of the carrier component 201. Specifically, the support block 203 is detachably connected to the end of the carrier component 201 away from the process chamber, so that the carrier component 201 can enter the process chamber while the support block 203 does not interfere with the side wall of the process chamber, thereby facilitating the transfer of the cooling component 5 from the outside of the process chamber to the inside of the process chamber, or from the inside of the process chamber to the outside of the process chamber.

[0033] During operation, when cooling is required, the cooling component 5 is placed on the carrier 201. The drive mechanism 204 drives the carrier 201 from outside the process chamber into the process chamber and places the cooling component 5 on the lifting component 401 of the lifting control module 4. After the cooling component 5 is placed, the carrier 201 moves to the outside of the process chamber. At this time, the lifting component 401 rises or falls, thereby cooling the cover body 301 or the heating component 1. After cooling is completed, the carrier 201 moves back into the process chamber and carries the cooling component 5 on the lifting component 401. The used cooling component 5 is then transferred to the outside of the process chamber. That is, the drive mechanism 204 drives the carrier 201 from inside the process chamber to outside the process chamber to transfer the cooling component 5 to the outside of the process chamber.

[0034] In some embodiments, in order to facilitate the placement of the cooling component 5 on the lifting component 401, and to ensure that the lifting component 401 does not affect the transfer of the carrier component 201 to the outside of the process chamber after the cooling component 5 is placed on the lifting component 401, the carrier component 201 is provided with multiple receiving channels, which pass through the end of the carrier component 201 near the process chamber along the movement direction of the carrier component 201. Specifically, taking the plate-shaped support member 201 as an example, the support member 201 is provided with multiple receiving channels. The receiving channels pass through the support member 201 along its thickness direction, allowing the lifting member 401 to pass through the receiving channels and rise or fall within them to support the cooling member 5. At the same time, the receiving channels pass through the end of the support member 201 near the process chamber along its movement direction, meaning one end of the support member 201 is open. When the support member 201 moves from the outside of the process chamber toward the inside of the process chamber, it will not collide with the lifting member 401. When the lifting member 401 supports the cooling member 5, the support member 201 moves from the inside of the process chamber toward the outside of the process chamber. During this movement, because the receiving channels pass through the end of the support member 201 near the process chamber along its movement direction, the lifting member 401 will not interfere with the movement of the support member 201 from the inside of the process chamber toward the outside of the process chamber.

[0035] In some specific embodiments, the positions of the multiple receiving channels correspond to the positions of the multiple lifting members 401, so that when the carrier 201 is placed in the process chamber, the multiple lifting members 401 are respectively placed in the corresponding receiving channels.

[0036] In some more specific embodiments, one receiving channel corresponds to one lifting member 401, and there is no interference between the carrying member 201 and the lifting member 401 during the movement of the carrying member 201.

[0037] In some more specific embodiments, one receiving channel corresponds to multiple lifting members 401, and no interference occurs between the carrying member 201 and the lifting member 401 during the movement of the carrying member 201.

[0038] In some embodiments, the cooling unit 2 further includes a cooling liquid circulation pipe 202, which is coiled inside the support member 201. The cooling liquid circulation pipe 202 is used to introduce coolant to cool the cooling member 5 placed on the support member 201. Specifically, in order to reduce the temperature rise of the cooling member 5 due to heat exchange with the air during the movement of the support member 201 from the outside to the inside of the process chamber, a cooling liquid circulation pipe 202 is provided inside the support member 201. The cooling liquid circulation pipe 202 is used to introduce coolant, and the temperature of the coolant is less than or equal to the initial temperature of the cooling member 5. This reduces the heat exchange efficiency between the cooling member 5 and the air, reduces the rate of temperature change of the cooling member 5, and allows the cooling member 5 to maintain its initial temperature as much as possible after moving into the process chamber, facilitating the cooling process of the cover body 301 or the heating member 1.

[0039] In some specific embodiments, the cooling liquid circulation pipe 202 is coiled inside the support member 201. The cooling liquid circulation pipe 202 has an inlet and an outlet, both of which are located at the ends of the support member 201, so that the cooling liquid can flow in the cooling liquid circulation pipe 202 and thus flow within the support body to facilitate the cooling process.

[0040] In some more specific embodiments, the cooling liquid circulation pipe 202 is circumferentially coiled inside the carrier 201.

[0041] In some more specific embodiments, the cooling liquid circulation pipe 202 is coiled and folded back and forth inside the carrier 201.

[0042] In some embodiments, the coating and developing equipment also includes a cooling device for cooling the cooling components 5. During operation, one cooling component 5 is placed on the carrier 201, and the remaining cooling components 5 are placed in the cooling device for cooling. The cooling device is used to cool the cooling components 5 to bring their temperature to the required temperature. The cooling device is a prior art technology and is not limited here. The cooling device can hold multiple cooling components 5, that is, it can cool multiple cooling components 5 simultaneously. During the cooling process, the cooling components 5 are sent to the process chamber by the carrier 201 for cooling. If the heat capacity of the heating element or the cover body 301 is small and the temperature difference to be cooled is small, a single cooling component 5 is sufficient to cool both. In this case, the cooling component 5 can be directly pushed onto the cover body 301. After cooling the heating element 1, the cooling component 5 can continue to cool the cover body 301 due to its low temperature, thereby saving the time of re-transferring the film and improving the machine's productivity. If the heat capacity of the heating main component or the cover body 301 is large at this time, and the temperature difference that needs to be cooled is large, a single cooling component 5 is not enough to cool it to the specified temperature. Two or more thickened cooling silicon wafers can be used to absorb its heat to achieve rapid cooling. That is, after one of the cooling components 5 has cooled down, the carrier 201 is transferred to the outside of the process chamber, and then the cooling component 5 cooled to the predetermined temperature is taken from the cooling equipment and transferred to the inside of the process chamber to continue cooling.

[0043] In some embodiments, the heating element 1 includes a heater 101, a support member 102, and multiple temperature sensors 103. Specifically, the heater 101 is used to heat the wafer and is located inside the process chamber. The support member 102 is located on the inner wall of the process chamber to support the heater 101. Specifically, the support member 102 is annular and surrounds the heater 101, contacting the bottom of the heater 101 to support it. More specifically, one or multiple support members 102 can be provided. When only one support member 102 is provided, it is the aforementioned annular arrangement. When multiple support members 102 are provided, they are evenly spaced along the circumference of the heater 101 on the side wall of the process chamber, and each support member 102 is in contact with the heater 101 to support it. Meanwhile, multiple temperature sensors 103 are spaced apart at the ends of the heater 101 to detect the temperature of the heater 101. Specifically, multiple temperature sensors 103 are all located at the bottom of the heater 101, that is, at the end of the heater 101 away from the cover body 301. At the same time, multiple temperature sensors 103 are evenly distributed circumferentially at the bottom of the heater 101 to detect the temperature of the heater 101, thereby monitoring the temperature of the wafer heating process and the temperature of the heater 101 during the cooling process.

[0044] In some embodiments, to facilitate the movement of the lifting member 401, multiple lifting channels 104 are provided at intervals on the heater 101. The positions of the multiple lifting channels 104 correspond one-to-one with the positions of the multiple lifting members 401, so that each lifting member 401 can be movably disposed in the corresponding lifting channel 104. During the process of the lifting member 401 supporting the cooling member 5, the lifting member 401 rises from the lifting channel 104 and contacts the bottom of the cooling member 5, thereby supporting the cooling member 5.

[0045] In some embodiments, to ensure the synchronous movement of multiple lifting components 401 and thus the stability of the cooling component 5, the lifting control module 4 further includes a lifting plate 402 and a lifting controller 403 for driving the lifting plate 402. Both the lifting plate 402 and the lifting controller 403 are located at the bottom of the heating component 1. They can be placed inside or outside the process chamber, without limitation, as long as they can coordinate the synchronous movement of multiple lifting components 401 without affecting wafer processing and the cooling process of the heating component 1. Multiple lifting components 401 are all located on the lifting plate 402. Specifically, the multiple lifting components 401 are evenly spaced on the lifting plate 402. Their arrangement can be by snap-fit, bolt fixing, or integral molding, without limitation, as long as the position of the lifting components 401 on the lifting plate 402 does not change. The lifting controller 403 drives the lifting plate 402 to move, so as to move multiple lifting components 401 to move closer to the heater 101 or closer to the cover body 301 at the same time. The lifting controller 403 can be a cylinder, an electric cylinder or other device that can drive the lifting plate 402 to move. There are no restrictions here, as long as it can drive the lifting plate 402 to move.

[0046] In some embodiments, the cavity cover module 3 further includes a lifting mechanism 302 and an exhaust component 303; wherein the lifting mechanism 302 is connected to the cover body 301 and is used to drive the cover body 301 away from or towards the process chamber to open or close the process chamber; specifically, the lifting mechanism 302 is located outside the process chamber, and the lifting mechanism 302 can be a cylinder, an electric cylinder, or other device capable of moving the cover body 301, without limitation, as long as it can move the cover body 301; taking the lifting mechanism 302 as an example of a cylinder, the piston rod of the cylinder is connected to the cover body 301, and the connection method can be snap-fit ​​or bolt. The specific connection method is not limited here, as long as the two can move synchronously. When the lifting mechanism 302 is activated, its piston rod rises, causing the cover body 301 to rise, thus separating the cover body 301 from the process chamber. At this time, the process chamber opens, allowing the cooling component 5 to be transferred from the outside to the inside of the process chamber, or vice versa. The piston rod of the lifting mechanism 302 then descends, causing the cover body 301 to descend, thus bringing it into contact with the process chamber. At this time, the process chamber is sealed, allowing wafer processing. An exhaust component 303 is located on the cover body 301 and communicates with the process chamber to exhaust gas. Specifically, the exhaust component 303 is used to exhaust waste gas during wafer processing. The exhaust component 303 is existing technology and will not be described in detail here.

[0047] The implementation principle of the coating and developing equipment in this application embodiment is as follows: After wafer processing is completed, the temperature of the heater 101 and the cover body 301 in the process chamber is relatively high. At this time, the cooling component 5 is transferred to the process chamber. The cooling component 5 is supported by the lifting component 401 in the process chamber. The lifting component 401 moves the cooling component 5 closer to the heating component 1, thereby cooling the heating component 1. The lifting component 401 moves the cooling component 5 closer to the cover body 301, thereby cooling the cover body 301. The cooling method using the cooling component 5 will not introduce trace particles into the process chamber, and at the same time avoids the secondary baking of the heater 101 by the cover body. In addition, the material of the cooling component 5 is the same as that of the wafer, thereby reducing the possibility of introducing new impurities and improving the efficiency of subsequent wafer processing.

[0048] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A coating and developing device, characterized in that, Including process chambers; A heating element, disposed within the process chamber, is used to heat the wafer; The lifting control module includes multiple lifting components, all of which are movably disposed in the process chamber along the axial direction of the heating element, for driving the wafer to move; A cavity cover module includes a cover body, which is detachably disposed in the process cavity to seal the process cavity; The cooling unit includes a cooling component that is movably mounted on the lifting control module; The specific heat capacity C of the cooling component is ≥700 J / (kg·K); and during cooling, the temperature of both the heating component and the cover body is higher than the initial temperature of the cooling component; during the cooling process, the cooling component is placed in the lifting control module; the lifting control module moves the cooling component closer to the heating component to cool the heating component; the lifting control module moves the cooling component closer to the cover body to cool the cover body; after cooling is completed, the cooling component is removed from the lifting control module.

2. The coating and developing equipment according to claim 1, characterized in that, The cooling component includes a cooling body and a plurality of protrusions spaced apart at one end of the cooling body; the protrusions are used to abut against the inner wall of the cavity cover module to create a gap between the cavity cover module and the cooling component.

3. The coating and developing equipment according to claim 1, characterized in that, The cooling unit further includes a driving mechanism and a support member; the support member is movably disposed on the driving mechanism along the radial direction of the process chamber and is used to support the cooling member; the driving mechanism is disposed outside the process chamber to drive the support member to move; The driving mechanism drives the carrier to enter the process chamber from outside the process chamber to place the cooling component on the lifting control module; or the driving mechanism drives the carrier to move from inside the process chamber to outside the process chamber to transfer the cooling component to the outside of the process chamber.

4. The coating and developing equipment according to claim 3, characterized in that, The carrier has multiple receiving channels, which pass through the end of the carrier near the process chamber along the movement direction of the carrier; the positions of the multiple receiving channels correspond to the positions of the multiple lifting components, so that when the carrier is placed in the process chamber, the multiple lifting components are respectively placed in the corresponding receiving channels.

5. The coating and developing equipment according to claim 3, characterized in that, The cooling unit further includes a cooling liquid circulation pipe, which is coiled inside the support member; the cooling liquid circulation pipe is used to introduce coolant to cool the cooling member placed on the support member.

6. The coating and developing equipment according to claim 1, characterized in that, The cooling component is made of silicon.

7. The coating and developing equipment according to claim 1, characterized in that, The heating element includes a heater, a support, and multiple temperature sensors; the heater is used to heat the wafer; the support is disposed on the inner wall of the process chamber to support the heater; the multiple temperature sensors are spaced apart at the ends of the heater to detect the temperature of the heater.

8. The coating and developing equipment according to claim 7, characterized in that, The heater is provided with multiple lifting channels at intervals; each lifting component is movably disposed in the corresponding lifting channel; the lifting control module also includes a lifting plate and a lifting controller for driving the movement of the lifting plate; Multiple lifting components are disposed on the lifting plate, and the lifting controller drives the lifting plate to move so that the multiple lifting components simultaneously move closer to the heater or closer to the cover body.

9. The coating and developing equipment according to claim 1, characterized in that, The cavity cover module also includes a lifting mechanism and an exhaust component; the lifting mechanism is connected to the cover body and is used to drive the cover body away from or towards the process chamber to open or close the process chamber; The exhaust fan is located on the cover body and communicates with the process chamber to exhaust gas.

10. The coating and developing apparatus according to any one of claims 1-9, characterized in that, It also includes a cooling device for cooling the cooling components; during operation, one of the cooling components is placed on the support, and the remaining cooling components are placed on the cooling device for cooling.

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