Liquid cooling heat dissipation device for server

Abstract

The application belongs to the technical field of heat dissipation systems, and particularly relates to a liquid cooling heat dissipation device for a server, which comprises a cold plate body, a main liquid inlet pipe, a secondary liquid inlet pipe and a liquid outlet pipe; the cold plate body is internally provided with a liquid cooling flow channel, one end of the liquid cooling flow channel is in communication with the main liquid inlet pipe, and the other end is in communication with the liquid outlet pipe; the cold plate body is further internally provided with a liquid cooling nozzle pipe, one end of the liquid cooling nozzle pipe is in communication with the secondary liquid inlet pipe, and the other end extends to a place where the cold plate body is attached to a heat generating device, a liquid passing gap exists between the outer wall of the liquid cooling nozzle pipe and the inner wall of the liquid cooling flow channel, the liquid passing gap is in communication with the liquid cooling flow channel, the liquid cooling nozzle pipe is provided with main nozzle holes, at least part of the main nozzle holes are arranged obliquely to the liquid outlet pipe, one end of the main nozzle holes is in communication with the liquid cooling nozzle pipe, and the other end is in communication with the liquid passing gap. The liquid cooling heat dissipation device for the server can realize forced cooling of the place where the cold plate body is attached to the heat generating device, and rapidly reduce the temperature of the heat generating device.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of heat dissipation systems, in particular to a liquid cooling heat dissipation device for servers. BACKGROUND

[0002] The server chip liquid cooling plate technology has become a mainstream heat dissipation scheme in high-power and high-heat flux density scenarios, but there are still significant deficiencies in the flow channel design, especially when gas-liquid phase change occurs. The flow channel may be blocked due to the following reasons: when the cooling liquid absorbs the heat of the chip in the liquid cooling plate channel, the temperature in the local area reaches the saturation temperature, and nucleate boiling occurs, forming bubbles. These bubbles are easily limited to expand and coalesce in the micro-scale channel, and eventually form a continuous gas column or gas bomb, blocking the entire channel cross-section, which causes flow blockage. One is that the bubbles are limited to grow, forming a "stretched bubble flow" or "slug flow"; two is that the gas-liquid alternately blocks, the gas bomb and the liquid plug are alternately distributed, causing local pressure fluctuation and instantaneous flow interruption; three is local dryout and hot spot, which is due to the gas plug occupying the channel, the liquid film is blown dry or evaporated, the wall loses liquid phase cooling, and the local temperature rises sharply, forming a "hot spot" or "dryout point", further exacerbating boiling instability.

[0003] In related technologies, the liquid cooling plate flow channel is designed for single-phase flow, and is not partitioned for the phase change process. When the cooling liquid undergoes nucleate boiling, the gas phase is mixed and chaotic, and there is a lack of steam and cooling liquid guiding mechanism. Therefore, the current liquid cooling plate still has the problem of flow blockage during the gas-liquid phase change, which seriously affects the cooling effect of the liquid cooling plate on the chip, leading to performance degradation or even burning of the chip. SUMMARY

[0004] Therefore, the present application aims to provide a liquid cooling heat dissipation device for servers to solve the problem of flow blockage during the gas-liquid phase change of the liquid cooling heat dissipation device.

[0005] To achieve the above-mentioned purpose, the technical scheme of the present application is as follows:

[0006] A liquid cooling heat dissipation device for servers, the device comprising a cold plate body, a main liquid inlet pipe, a secondary liquid inlet pipe and a liquid outlet pipe; a liquid cooling flow channel is provided in the cold plate body, one end of the liquid cooling flow channel is in communication with the main liquid inlet pipe, and the other end is in communication with the liquid outlet pipe; a liquid cooling nozzle is also provided in the cold plate body, one end of the liquid cooling nozzle is in communication with the secondary liquid inlet pipe, and the other end extends to the place where the cold plate body is attached to the heat generating equipment; a liquid passage gap exists between the outer wall of the liquid cooling nozzle and the inner wall of the liquid cooling flow channel, the liquid passage gap is in communication with the liquid cooling flow channel, main nozzles are provided on the liquid cooling nozzle, at least part of the main nozzles are inclined to the liquid outlet pipe, one end of the main nozzles is in communication with the liquid cooling nozzle, and the other end is in communication with the liquid passage gap, so that the liquid flow sprayed by the main nozzles can flow to the liquid outlet pipe through the liquid passage gap and the liquid cooling flow channel.

[0007] Further, the device comprises a heat-conducting sheet, at least part of the heat-conducting sheet is provided with a containing groove for containing the liquid-cooled nozzle, the cold plate body is provided with a containing cavity for containing the heat-conducting sheet, and the heat-conducting sheet divides the containing cavity into the liquid-cooled flow channel.

[0008] Further, the liquid-cooled nozzle is arranged at intervals of at least two, and there is a flow-through gap between two adjacent liquid-cooled nozzles, the flow-through gap is in communication with the liquid-cooled flow channel, and the flow-through gap and the liquid-cooled flow channel are in a grid shape.

[0009] Further, the liquid-cooled nozzle is arranged at intervals of at least two, and there is a flow-through gap between two adjacent liquid-cooled nozzles, the flow-through gap is in communication with the liquid-cooled flow channel, and the flow-through gap and the liquid-cooled flow channel are in a grid shape.

[0010] Further, the liquid-cooled flow channel is in series or parallel, at least part of the heat-conducting sheet is provided with a phase-change flow channel, one end of the phase-change flow channel is in communication with the flow-through gap through the containing groove, and the other end is in communication with the liquid outlet pipe through the liquid-cooled flow channel.

[0011] Further, the liquid-cooled flow channel is in series, at least part of the heat-conducting sheet is provided with a phase-change flow channel, a part of the main nozzle is arranged corresponding to the phase-change flow channel, and the other part is arranged corresponding to the liquid-cooled flow channel, one end of the phase-change flow channel is in communication with the corresponding main nozzle, and the other end is in communication with the liquid outlet pipe.

[0012] Further, the device further comprises an exhaust pipe, one end of the exhaust pipe is in communication with the phase-change flow channel, and the other end is in communication with the liquid outlet pipe.

[0013] Further, the liquid-cooled flow channel is in series, at least part of the heat-conducting sheet is provided with a phase-change flow channel, a part of the main nozzle is arranged corresponding to the phase-change flow channel, and the other part is arranged corresponding to the liquid-cooled flow channel, one end of the phase-change flow channel is in communication with the corresponding main nozzle, and the other end is in communication with the liquid outlet pipe.

[0014] Further, the liquid-cooled flow channel comprises a straight section, an inlet section and an outlet section, along the length direction of the liquid-cooled flow channel, the inlet section is located near the main inlet pipe in the cold plate body, the outlet section is located near the liquid outlet pipe in the cold plate body, the straight section is located between the inlet section and the outlet section, the straight section, the main inlet pipe and the liquid outlet pipe are arranged in parallel with each other, and the length direction of the liquid-cooled nozzle is perpendicular to the length direction of the straight section.

[0015] Further, the liquid cooling nozzle is provided with a flow guide part, and the flow guide part is provided with an arc surface or an inclined surface for guiding the flow of liquid.

[0016] Compared with the prior art, the liquid cooling heat dissipation device for a server has the following advantages:

[0017] (1) The liquid cooling heat dissipation device for a server has the following advantages: the liquid cooling nozzle is provided in the cold plate body, and one end of the liquid cooling nozzle is communicated with the secondary liquid inlet pipe, and the other end extends to the position where the cold plate body is attached to the heat generating equipment, so that when the temperature of the heat generating equipment is high, the liquid cooling heat dissipation device can supply additional cooling liquid to the liquid cooling nozzle through the secondary liquid inlet pipe, realize forced cooling of the position where the cold plate body is attached to the heat generating equipment, quickly reduce the temperature of the heat generating equipment, and reduce the amount of bubbles formed due to nucleate boiling of the cooling liquid; at the same time, by supplying additional cooling liquid to the liquid cooling nozzle, the cooling liquid sprayed through the main spray hole of the liquid cooling nozzle can also accelerate the flow speed of the cooling liquid in the local high heat area of the liquid cooling flow channel, prevent bubbles from gathering in the local area to form continuous air columns or air bullets, effectively reduce the possibility of flow blockage in the heat concentration area of the liquid cooling flow channel, and improve the continuous cooling effect and stability of the liquid cooling heat dissipation device for a server.

[0018] (2) The liquid cooling heat dissipation device for a server has the following advantages: the liquid cooling flow channel is connected in series or parallel, and the phase change flow channel is provided on at least part of the heat conduction sheet, which can not only increase the contact area between the heat conduction sheet and the cooling liquid, thereby improving the overall cooling efficiency of the liquid cooling heat dissipation device, but also can be used for concentrated nucleate boiling of the cooling liquid, thereby avoiding the influence of bubbles on the flow of the cooling liquid in the liquid cooling flow channel and the flow gap, ensuring that the cooling liquid can continuously and stably pass through the liquid cooling flow channel and the flow gap to cool the heat generating equipment, and further improving the reliability and stability of the liquid cooling heat dissipation device. BRIEF DESCRIPTION OF DRAWINGS

[0019] The accompanying drawings, which form a part of the present application, are used to provide further understanding of the present application, and the schematic embodiments of the present application and their descriptions are used to explain the present application, and do not constitute improper limitations on the present application. In the drawings:

[0020] Figure 1 FIG. 1 is a structural schematic view of a liquid cooling heat dissipation device for a server according to an embodiment of the present application;

[0021] Figure 2 FIG. 2 is an exploded view of the liquid cooling heat dissipation device for a server according to the embodiment of the present application; Figure 1

[0022] Figure 3 FIG. 3 is a vertical sectional view of the liquid cooling heat dissipation device for a server according to the embodiment of the present application;

[0023] Figure 4 ​Horizontal sectional view of the liquid cooling heat dissipation device for a server according to the first embodiment of the present application;

[0024] Figure 5 Structure schematic diagram of the liquid cooling flow channel in the liquid cooling heat dissipation device for a server according to the first embodiment of the present application;

[0025] Figure 6 Structure schematic diagram of the liquid cooling nozzle in the liquid cooling heat dissipation device for a server according to the first embodiment of the present application;

[0026] Figure 7 Structure schematic diagram of the liquid cooling heat dissipation device for a server according to the second embodiment of the present application;

[0027] Figure 8 Vertical sectional view of the liquid cooling heat dissipation device for a server according to the second embodiment of the present application;

[0028] Figure 9 Horizontal sectional view of the liquid cooling heat dissipation device for a server according to the second embodiment of the present application;

[0029] Figure 10 Structure schematic diagram of the liquid cooling flow channel in the liquid cooling heat dissipation device for a server according to the second embodiment of the present application;

[0030] Figure 11 Structure schematic diagram of the liquid cooling heat dissipation device for a server according to the third embodiment of the present application;

[0031] Figure 12 Vertical sectional view of the liquid cooling heat dissipation device for a server according to the third embodiment of the present application;

[0032] Figure 13 Structure schematic diagram of the liquid cooling flow channel in the liquid cooling heat dissipation device for a server according to the third embodiment of the present application;

[0033] Figure 14 Structure schematic diagram of the liquid cooling heat dissipation device for a server according to the third embodiment of the present application with an exhaust pipe;

[0034] Figure 15 Explosion view of Figure 14 ;

[0035] Figure 16 Structure schematic diagram of the liquid cooling heat dissipation device for a server according to the fourth embodiment of the present application;

[0036] Figure 17 Horizontal sectional view of the liquid cooling heat dissipation device for a server according to the fourth embodiment of the present application;

[0037] Figure 18A cross-sectional view of the heat-conducting sheet in the liquid cooling heat dissipation device for a server according to Embodiment Four of the present application;

[0038] Figure 19 A structural schematic view of the phase-change flow channel and the liquid outlet section in communication in the liquid cooling heat dissipation device for a server according to Embodiment Four of the present application.

[0039] Legend of reference signs:

[0040] 1, cold plate body; 2, main liquid inlet pipe; 3, liquid outlet pipe; 4, secondary liquid inlet pipe; 5, liquid cooling nozzle; 6, main nozzle hole; 7, side nozzle hole; 8, flow gap; 9, liquid cooling flow channel; 10, liquid passage gap; 11, liquid inlet section; 12, flat section; 13, liquid outlet section; 14, containing groove; 15, flow guide part; 16, phase-change flow channel; 17, heat-conducting sheet; 18, air passage gap; 19, exhaust pipe; 20, opening. DETAILED DESCRIPTION

[0041] The present application will be further described in conjunction with the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only the parts related to the present application are shown in the drawings, but not all the structures.

[0042] Embodiment One

[0043] Figure 1 A structural schematic view of the liquid cooling heat dissipation device for a server according to Embodiment One of the present application. Referring to Figures 1 to 6 This device includes a cold plate body 1, a main liquid inlet pipe 2, a secondary liquid inlet pipe 4, and a liquid outlet pipe 3; the cold plate body 1 is provided with a liquid cooling flow channel 9, one end of the liquid cooling flow channel 9 is in communication with the main liquid inlet pipe 2, and the other end is in communication with the liquid outlet pipe 3; the cold plate body 1 is further provided with a liquid cooling nozzle 5, one end of the liquid cooling nozzle 5 is in communication with the secondary liquid inlet pipe 4, and the other end extends to the place where the cold plate body 1 is attached to the heat generating equipment, there is a liquid passage gap 10 between the outer wall of the liquid cooling nozzle 5 and the inner wall of the liquid cooling flow channel 9, the liquid passage gap 10 is in communication with the liquid cooling flow channel 9, the liquid cooling nozzle 5 is provided with a main nozzle hole 6, at least part of the main nozzle hole 6 is arranged obliquely to the liquid outlet pipe 3, and one end of the main nozzle hole 6 is in communication with the liquid cooling nozzle 5, and the other end is in communication with the liquid passage gap 10, so that the liquid flow sprayed by the main nozzle hole 6 can flow to the liquid outlet pipe 3 through the liquid passage gap 10 and the liquid cooling flow channel 9. Among them, the liquid passage gap 10 can meet the flow needs of the cooling liquid in the liquid cooling flow channel 9, avoiding the local obstruction of the liquid cooling flow channel 9 by the liquid cooling nozzle 5.

[0044] Specifically, the main liquid inlet pipe 2 and the liquid outlet pipe 3 are fixed on the cold plate body 1, the liquid cooling flow channel 9 is displaced in the cold plate body 1, and a cavity for liquid flow is formed in the cold plate body 1. The cooling liquid flowing in through the main liquid inlet pipe 2 first enters the liquid cooling flow channel 9, and the cooling liquid contacts the cold plate body 1 to cool the cold plate body 1, and then cools the heat generating device attached to the cold plate body 1. Then, the cooling liquid is discharged from the cold plate body 1 through the liquid outlet pipe 3.

[0045] Among them, the liquid cooling nozzle 5 can be arranged at the attachment position of the cold plate body 1 and the heat generating device. For example, the liquid cooling nozzle 5 is fixed on the secondary liquid inlet pipe 4, and the liquid cooling nozzle 5 extends into the liquid cooling flow channel 9 and extends to the attachment position of the cold plate body 1 and the heat generating device, so that the liquid cooling nozzle 5 can be arranged close to the heat generating device.

[0046] When the heat generating device needs to be cooled, the secondary liquid inlet pipe 4 can supply additional cooling liquid to the liquid cooling nozzle 5. The cooling liquid in the liquid cooling nozzle 5 can not only directly force cool the attachment position of the cold plate body 1 and the heat generating device, quickly reduce the temperature of the local high-heat area of the cold plate body 1, and avoid the formation of bubbles due to nucleate boiling of the cooling liquid at the attachment position of the cold plate body 1 and the heat generating device, but also accelerate the flow speed of the cooling liquid in the local high-heat area of the liquid cooling flow channel 9. At this time, even if the cooling liquid in the local area forms bubbles due to nucleate boiling, the bubbles can also quickly move along the liquid cooling flow channel 9 under the driving of the liquid flow sprayed out of the main spray hole 6 and be discharged through the liquid outlet pipe 3, avoiding the bubbles gathering in the local area to form continuous gas columns or gas bullets, preventing the bubbles from blocking the passage cross section of the entire liquid cooling flow channel 9, effectively reducing the possibility of flow blockage in the heat concentration area of the liquid cooling flow channel 9, and enabling the cooling liquid to continuously flow along the liquid cooling flow channel 9 to cool the cold plate body 1.

[0047] With the above arrangement, when the temperature of the cooling liquid is relatively low or insufficient to cause nucleate boiling, only the main liquid inlet pipe 2 can be used to transport cooling liquid into the liquid cooling flow channel 9, and the cooling liquid contacts the cold plate body 1 to achieve cooling, ensuring the cooling effect of the liquid cooling heat dissipation device on the chip and reducing the power consumption of the liquid cooling heat dissipation device. When the chip or other heat generating device is overclocked or the temperature of the cooling liquid is relatively high, causing the cooling liquid to possibly undergo nucleate boiling, the secondary liquid inlet pipe 4 can also be used to transport cooling liquid to the liquid cooling nozzle 5, so that the cooling liquid in the liquid cooling nozzle 5 forces cool the attachment position of the heat generating device and the cold plate body 1, and the cooling liquid sprayed out of the main spray hole 6 of the liquid cooling nozzle 5 can drive the liquid flow in the local area of the liquid cooling flow channel 9 to flow quickly. Not only can this quickly reduce the temperature at the attachment position of the cold plate body 1 and the heat generating device, achieving rapid cooling of the heat generating device, but also can avoid the local area of the liquid cooling flow channel 9 being blocked by bubbles, which is conducive to improving the continuous cooling effect of the liquid cooling heat dissipation device.

[0048] In one preferred embodiment of the present embodiment, referring to Figures 3 to 5 The device comprises a heat-conducting sheet 17, at least part of the heat-conducting sheet 17 is provided with a containing groove 14 for containing the liquid-cooled nozzle 5, and the cold plate body 1 is provided with a containing cavity for containing the heat-conducting sheet 17, and the heat-conducting sheet 17 divides the containing cavity into liquid-cooled flow channels 9.

[0049] Specifically, the heat-conducting sheet 17 is fixedly connected with the cold plate body 1, for example, by means of integral molding or welding. The heat-conducting sheet 17 is arranged in the containing cavity of the cold plate body 1 in a spaced manner and divides the containing cavity into a plurality of liquid-cooled flow channels 9. These liquid-cooled flow channels 9 can be connected in parallel with each other or connected in series to form an entire channel. As long as the liquid-cooled flow channels 9 can realize the communication of the main liquid inlet pipe 2 and the liquid outlet pipe 3, the cooling liquid can continuously flow along the liquid-cooled flow channels 9 to realize the cooling of the cold plate body 1.

[0050] By means of the above arrangement, the heat-conducting sheet 17 can play a good heat-conducting role, which is conducive to increasing the contact area of the cold plate body 1 and the cooling liquid in the liquid-cooled flow channels 9 and reducing the flow speed of the cooling liquid in the liquid-cooled flow channels 9, thereby improving the cooling efficiency and cooling effect of the cooling liquid on the cold plate body 1.

[0051] In one preferred embodiment of the present embodiment, referring to Figures 2 to 5 The liquid-cooled nozzles 5 are arranged at least in two, and there is a flow-through gap 8 between the adjacent two liquid-cooled nozzles 5. The flow-through gap 8 is communicated with the liquid-cooled flow channels 9 and the flow-through gap 8 and the liquid-cooled flow channels 9 are in a grid shape. For example, the liquid-cooled nozzles 5 can be arranged in two, four or more, and each liquid-cooled nozzle 5 is arranged in parallel with each other and communicated with the secondary liquid inlet pipe 4 to realize the liquid supply to the liquid-cooled nozzle 5. By arranging a plurality of liquid-cooled nozzles 5 in a spaced manner, the area of the cold plate body 1 that can be covered by the liquid-cooled nozzles 5 is increased, thereby better realizing the forced cooling of the large-area heating equipment. Those skilled in the art can adjust the number and arrangement of the liquid-cooled nozzles 5 according to actual needs, which will not be described here.

[0052] The flow-through gap 8 is arranged between the adjacent two liquid-cooled nozzles 5, and a plurality of liquid-cooled nozzles 5 can form a plurality of flow-through gaps 8, and the plurality of flow-through gaps 8 can be communicated with each liquid-cooled flow channel 9 to form a grid-shaped flow channel system. At this time, the cooling liquid can flow to the liquid outlet pipe 3 through the flow channel system and finally be discharged from the cold plate body 1 through the liquid outlet pipe 3. It should be noted that, preferably, the flow-through cross-sectional area of the flow-through gap 8 is smaller than the flow-through cross-sectional area of the liquid-cooled flow channel 9, and the flow-through cross-sectional area of the flow-through gap 8 is smaller than the flow-through cross-sectional area of the liquid-passing gap 10, so that the cooling liquid flow through the flow-through gap 8 is always smaller than the cooling liquid flow in the liquid-cooled flow channel 9, thereby ensuring that in the grid-shaped flow channel system, the cooling liquid still mainly flows through the liquid-cooled flow channel 9.

[0053] Secondly, since the liquid cooling nozzle 5 is close to the heat generating device, the flow gap 8 is also located at the side of the liquid cooling flow channel 9 close to the heat generating device. By introducing the cooling liquid into the flow gap 8, the cooling liquid in the flow gap 8 is rapidly heated under the action of the heat generating device and the cooling plate body 1 heating the cooling liquid. Due to thermal expansion and contraction and natural convection, the high-temperature cooling liquid in the flow gap 8 will flow into the liquid cooling flow channel 9, and the exchange of cooling liquid is realized, thereby ensuring that the cooling liquid with lower temperature continuously exists in the flow gap 8, and the cooling liquid with higher temperature can be discharged from the cooling plate body 1 along with the cooling liquid in the liquid cooling flow channel 9, which is beneficial to further improve the residence time of the low-temperature cooling liquid in the cooling plate body 1 and improve the cooling effect of the cooling liquid on the contact part of the cooling plate body 1 and the heat generating device.

[0054] By using the above arrangement, by arranging multiple liquid cooling nozzles 5 in the cooling plate body 1 at intervals, and using the adjacent two liquid cooling nozzles 5 to form the flow gap 8, the flow gap 8 can form a grid-shaped flow channel system with the liquid cooling flow channel 9. When the cooling liquid flows along the flow channel system, not only can convection and exchange be realized, ensuring that the cooling liquid with lower temperature can be closer to the contact part of the cooling plate body 1 and the heat generating device, improving the cooling effect of the cooling liquid on the heat generating device, but also the grid-shaped flow channel system can reduce the flow speed of the cooling liquid and increase the coverage area of the cooling liquid, thereby being beneficial to improve the cooling efficiency of the cooling liquid.

[0055] In a preferred embodiment of the present embodiment, referring to Figures 2 to 5 , the liquid cooling nozzle 5 is provided with a side jet hole 7 at a position corresponding to the flow gap 8. One end of the side jet hole 7 communicates with the liquid cooling nozzle 5, and the other end is obliquely arranged to the secondary liquid inlet pipe 4, so that the liquid jet of the side jet hole 7 can flow to the secondary liquid inlet pipe 4 through the flow gap 8 communicated therewith, and finally flow to the liquid outlet pipe 3 through the liquid cooling flow channel 9 to discharge the cooling plate body 1.

[0056] By using the above arrangement, when the secondary liquid inlet pipe 4 supplies additional cooling liquid to the liquid cooling nozzle 5, the cooling liquid in the liquid cooling nozzle 5 can be sprayed not only from the main jet hole 6 but also from the side jet hole 7. The cooling liquid sprayed through the side jet hole not only can directly force cool the contact part of the cooling plate body 1 and the heat generating device, rapidly reduce the temperature of the local high-temperature area of the cooling plate body 1, and avoid the formation of bubbles due to the nucleate boiling of the cooling liquid caused by the excessive heat at the contact part of the cooling plate body 1 and the heat generating device, but also can accelerate the flow speed of the cooling liquid in the flow gap 8. Even if bubbles are generated in the cooling liquid in the flow gap 8 due to nucleate boiling, it is not easy to cause the flow gap 8 to be blocked, which is beneficial to improve the stability and reliability of the grid-shaped flow channel system, thereby ensuring that the cooling liquid can continuously cool and cool the cooling plate body 1 through the grid-shaped flow channel system.

[0057] In a preferred embodiment of the present embodiment, referring to Figure 4The liquid cooling flow channel 9 includes a straight section 12, a liquid inlet section 11 and a liquid outlet section 13. In the length direction of the liquid cooling flow channel 9, the liquid inlet section 11 is located close to the main liquid inlet pipe 2 in the cold plate body 1, the liquid outlet section 13 is located close to the liquid outlet pipe 3 in the cold plate body 1, and the straight section 12 is located between the liquid inlet section 11 and the liquid outlet section 13. The straight section 12, the main liquid inlet pipe 2 and the liquid outlet pipe 3 are arranged in parallel with each other, and the length direction of the liquid cooling jet pipe 5 is perpendicular to the length direction of the straight section 12.

[0058] When the heat generating device has a large heat generating amount, the parallel arrangement of the straight section 12, the main liquid inlet pipe 2 and the liquid outlet pipe 3 is conducive to improving the smoothness of the cooling liquid in the liquid cooling flow channel 9, avoiding local blockage of the cooling liquid when flowing, so that the cooling liquid can quickly pass through the liquid cooling flow channel 9 and take away heat.

[0059] By arranging the length direction of the liquid cooling jet pipe 5 to be perpendicular to the length direction of the straight section 12, the liquid cooling jet pipe 5 can form a cross-shaped structure or a grid-shaped structure with the straight section 12 of the liquid cooling flow channel 9, which is conducive to expanding the number and area of the liquid cooling flow channel 9 that can be covered by the liquid cooling jet pipe 5, and also enables the liquid cooling jet pipe 5 and the cooling liquid to more evenly cool the cold plate body 1 and the heat generating device at the bonding position, avoiding local overheating at the bonding position of the cold plate body 1 and the heat generating device, and further reducing the probability of nucleate boiling of the cooling liquid when the liquid cooling jet pipe 5 is forced to cool.

[0060] Optionally, the liquid cooling flow channel 9 can further include an inclined section and a curved section, both of which are located between the liquid inlet section 11 and the liquid outlet section 13, and the inclined section, the curved section and the straight section 12 can be connected in series or in parallel.

[0061] By arranging the inclined section and the curved section, the flow resistance of the liquid cooling flow channel 9 can be increased for a heat generating device with a small heat generating amount, which is conducive to increasing the residence time of the cooling liquid in the liquid cooling flow channel 9, thereby improving the cooling efficiency of the cooling liquid on the cold plate body 1.

[0062] In one preferred embodiment of the present embodiment, referring to Figure 5 and Figure 6 The liquid cooling jet pipe 5 is provided with a flow guide part 15, and the flow guide part 15 is provided with an arc surface or an inclined surface for guiding the flow of liquid. For example, the liquid cooling jet pipe 5 is provided with a flow guide part 15 at the positions facing the liquid inlet section 11 and the liquid outlet section 13, and the flow guide part 15 is provided with an arc surface or an inclined surface for guiding the flow of liquid. In this way, when the cooling liquid flows along the liquid cooling flow channel 9, the cooling liquid can quickly pass over the liquid cooling jet pipe 5 along the arc surface or the inclined surface of the flow guide part 15, avoiding turbulent flow or blockage of the cooling liquid at the edge of the liquid cooling jet pipe 5, and improving the smoothness of the cooling liquid flow.

[0063] The liquid cooling heat dissipation device for a server disclosed in the embodiment is provided with a liquid cooling nozzle 5 in the cold plate body 1, and the liquid cooling nozzle 5 is communicated with the secondary liquid inlet pipe 4 at one end and extends to the place where the cold plate body 1 is attached to the heat generating equipment at the other end. When the temperature of the heat generating equipment is high, the liquid cooling heat dissipation device can supply additional cooling liquid to the liquid cooling nozzle 5 through the secondary liquid inlet pipe 4, so as to realize forced cooling of the place where the cold plate body 1 is attached to the heat generating equipment, quickly reduce the temperature of the heat generating equipment and reduce the amount of bubbles formed due to nucleate boiling of the cooling liquid. At the same time, the additional cooling liquid supplied to the liquid cooling nozzle 5 can also accelerate the flow speed of the cooling liquid in the local high heat area of the liquid cooling flow channel 9 through the main nozzle hole 6 of the liquid cooling nozzle 5, so as to prevent bubbles from gathering in the local area to form continuous air columns or air bullets, effectively reduce the possibility of flow blockage in the heat concentration area of the liquid cooling flow channel 9, and improve the continuous cooling effect and stability of the liquid cooling heat dissipation device for the server.

[0064] Embodiment two

[0065] Figure 7 The structure diagram of the liquid cooling heat dissipation device for a server disclosed in the embodiment two of the application. The embodiment is an optimization based on the above-mentioned embodiment one. Referring to Figure 4 , Figures 7 to 10 , the specific optimization is that the liquid cooling flow channels 9 are connected in series or in parallel, at least part of the heat conduction sheets 17 are provided with phase change flow channels 16, one end of the phase change flow channels 16 is communicated with the flow-through gap 8 through the accommodating groove 14, and the other end of the phase change flow channels 16 is communicated with the liquid outlet pipe 3 through the liquid cooling flow channel 9.

[0066] Referring to Figures 7 to 10 , taking the series connection of the liquid cooling flow channels 9 as an example, the heat conduction sheets 17 are arranged in the accommodating cavity to form the series connection of the liquid cooling flow channels 9, that is, one end of the liquid cooling flow channel 9 is communicated with the main liquid inlet pipe 2, and the other end of the liquid cooling flow channel 9 is communicated with the liquid outlet pipe 3. The phase change flow channels 16 can be arranged on part or all of the heat conduction sheets 17 intersecting with the liquid cooling nozzle 5, and the phase change flow channels 16 are communicated with the flow-through gap 8 below through the accommodating groove 14, so that the cooling liquid in the flow-through gap 8 can enter the phase change flow channels 16 and finally be discharged through the phase change flow channels 16, the liquid cooling flow channel 9 and the liquid outlet pipe 3. It should be noted that, in order to ensure that the bubbles generated by the nucleate boiling of the cooling liquid in the phase change flow channels 16 are discharged, the phase change flow channels 16 need to be located above the flow-through gap 8 along the direction of gravity, and there is a ventilation gap 18 between the heat conduction sheet 17 above and the inner wall of the accommodating cavity, the ventilation gap 18 is communicated with the liquid cooling flow channel 9, and the flow-through cross-sectional area of the ventilation gap 18 is smaller than that of the liquid cooling flow channel 9, so as to ensure that the ventilation gap 18 only meets the need of gas passing through and most of the cooling liquid can still flow along the liquid cooling flow channel 9.

[0067] With the above arrangement, by arranging the phase change flow channel 16 on the heat conduction sheet 17 and connecting the phase change flow channel 16 with the flow-through gap 8, it is equivalent to further increasing the phase change flow channel 16 in the grid-shaped flow channel system. The phase change flow channel 16 not only can increase the contact area between the heat conduction sheet 17 and the cooling liquid and improve the cooling effect of the cooling liquid on the heat conduction sheet 17, thereby further improving the cooling efficiency of the cooling liquid on the entire cold plate body 1; but also can be used for concentrated nucleate boiling of the cooling liquid. Since the flow direction of the cooling liquid in the phase change flow channel 16 is different from the horizontal flow direction in the liquid cooling flow channel 9 and the flow-through gap 8, and is not easily affected by the liquid flow in the liquid cooling flow channel 9, the cooling liquid flow rate in the phase change flow channel 16 is slower, and the cooling liquid is more likely to first undergo nucleate boiling in the phase change flow channel 16. By using nucleate boiling to quickly absorb the heat on the heat conduction sheet 17, the cooling effect of the heat conduction sheet 17 on the cold plate body 1 can be improved.

[0068] In addition, by limiting the nucleate boiling of the cooling liquid in the phase change flow channel 16, even if local gas blocking or unstable boiling occurs in the phase change flow channel 16, it will not interfere with the liquid cooling flow channel 9 between the side walls of the heat conduction sheet 17. Most of the heat of the heat conduction sheet 17 can still be taken away by the cooling liquid in the liquid cooling flow channel 9 and the flow-through gap 8, so that the local temperature rise caused by the loss of liquid phase cooling on all walls is avoided. In addition, the cooling liquid in the flow-through gap 8 can also continuously supplement into the phase change flow channel 16 from below, maintaining the nucleate boiling of the cooling liquid in the phase change flow channel 16.

[0069] Correspondingly, referring to Figure 8 and Figure 10 , and referring to Figure 4 and Figure 5 , the liquid cooling flow channel 9 is also parallel, and the heat conduction sheet 17 is arranged in the containing cavity to form parallel liquid cooling flow channels 9, that is, each liquid cooling flow channel 9 is connected with the main liquid inlet pipe 2 at one end and connected with the liquid outlet pipe 3 at the other end. Among them, the phase change flow channel 16 can be arranged on part or all of the heat conduction sheet 17 intersecting with the liquid cooling jet pipe 5, and the phase change flow channel 16 is connected with the flow-through gap 8 through the containing groove 14, so that the cooling liquid in the flow-through gap 8 can enter the phase change flow channel 16, and finally be discharged through the phase change flow channel 16, the liquid cooling flow channel 9 and the liquid outlet pipe 3. Here, it will not be described again.

[0070] The liquid cooling heat dissipation device for a server has the advantages that the liquid cooling flow channels 9 are connected in series or in parallel, the phase change flow channels 16 are arranged on at least part of the heat conduction sheets 17, one end of each phase change flow channel 16 is communicated with the flow-through gap 8 through the accommodating groove 14, and the other end of each phase change flow channel 16 is communicated with the liquid outlet pipe 3 through the liquid cooling flow channel 9. The phase change flow channels 16 can not only increase the contact area between the heat conduction sheets 17 and the cooling liquid and improve the cooling efficiency of the whole liquid cooling heat dissipation device, but also can be used for centralized nucleate boiling of the cooling liquid, so that the bubbles generated by the nucleate boiling of the cooling liquid do not affect the flow of the cooling liquid in the liquid cooling flow channels 9 and the flow-through gap 8, the cooling liquid can continuously and stably flow through the liquid cooling flow channels 9 and the flow-through gap 8 to cool the heat generating equipment, and the reliability and stability of the liquid cooling heat dissipation device are further improved.

[0071] Embodiment three

[0072] Figure 11 The structure diagram of the liquid cooling heat dissipation device for a server in Embodiment Three of the present application is shown. Embodiment Three is an optimization based on Embodiment One, referring to Figures 11 to 13 , and referring to Figure 9 , the specific optimization is that the liquid cooling flow channels 9 are connected in series, the phase change flow channels 16 are arranged on at least part of the heat conduction sheets 17, a part of the main spray holes 6 are arranged corresponding to the phase change flow channels 16, and the other part of the main spray holes 6 are arranged corresponding to the liquid cooling flow channels 9, one end of each phase change flow channel 16 is communicated with the corresponding main spray hole 6, and the other end of each phase change flow channel 16 is communicated with the liquid outlet pipe 3. Among them, the phase change flow channels 16 and the corresponding main spray holes 6 are arranged one by one, that is, one phase change flow channel 16 is communicated with one main spray hole 6 on the liquid cooling spray pipe 5.

[0073] Specifically, the heat conduction sheets 17 are arranged in the accommodating cavity to form the liquid cooling flow channels 9 connected in series, that is, one end of each liquid cooling flow channel 9 is communicated with the main liquid inlet pipe 2, and the other end of each liquid cooling flow channel 9 is communicated with the liquid outlet pipe 3. Among them, the phase change flow channels 16 can be arranged on part or all of the heat conduction sheets 17 intersecting with the liquid cooling spray pipe 5, and the phase change flow channels 16 are communicated with the main spray holes 6 below, so that the cooling liquid in the liquid cooling spray pipe 5 can enter the phase change flow channels 16 and finally be discharged from the liquid outlet pipe 3.

[0074] Optionally, in order to ensure that the bubbles generated by the nucleate boiling of the cooling liquid in the phase change flow channels 16 are discharged, the phase change flow channels 16 need to be located above the flow-through gap 8 along the direction of gravity, and there is an air passage gap 18 between the top of the heat conduction sheet 17 and the inner wall of the accommodating cavity, the air passage gap 18 is communicated with the liquid cooling flow channel 9, and the flow-through cross-sectional area of the air passage gap 18 is smaller than that of the liquid cooling flow channel 9, so as to ensure that the air passage gap 18 only meets the need of gas passing through, so that most of the cooling liquid can still flow along the liquid cooling flow channel 9.

[0075] With the above arrangement, when the cooling liquid is delivered to the liquid-cooled nozzle 5 by the secondary liquid inlet pipe 4, the cooling liquid in the liquid-cooled nozzle 5 can also be injected into the phase-change flow channel 16 through the main nozzle hole 6 of the liquid-cooled nozzle 5. The cooling liquid entering the phase-change flow channel 16 will undergo nucleate boiling by contacting the inner wall of the phase-change flow channel 16, thereby quickly absorbing the heat on the heat-conducting sheet 17 and quickly reducing the temperature of the heat-conducting sheet 17 at the bonding site of the cold plate body 1 and the heat-generating device, which is conducive to improving the cooling speed at the bonding site of the cold plate body 1 and the heat-generating device, achieving rapid cooling of the heat-generating device, and avoiding damage to the heat-generating device. Subsequently, as the liquid-cooled nozzle 5 continuously injects cooling liquid into the phase-change flow channel 16, nucleate boiling can be maintained, and the bubbles generated by nucleate boiling can be directly discharged through the liquid outlet pipe 3, avoiding interference of the bubbles with the cooling liquid in the liquid-cooled flow channel 9 and the flow-through gap 8.

[0076] In one preferred embodiment of the present embodiment, referring to Figure 14 and Figure 15 , the device further comprises an exhaust pipe 19, one end of which is in communication with the phase-change flow channel 16 and the other end of which is in communication with the liquid outlet pipe 3. For example, one end of the exhaust pipe 19 is fixedly connected to the heat-conducting sheet 17 or the cold plate body 1, and the other end is fixedly connected to the liquid outlet pipe 3, which can be connected by integral molding or welding. The exhaust pipe 19 can be provided with multiple air vents for communicating with the phase-change flow channel 16, or multiple phase-change flow channels 16 can be communicated through one air vent, which can be set by those skilled in the art according to actual needs, and will not be described here. It should be understood that in this embodiment, even if the air gap 18 in the foregoing embodiment is not present, bubbles can still be discharged into the liquid outlet pipe 3 through the exhaust pipe 19.

[0077] With the above arrangement, when the heat-conducting sheet 17 is arranged in the containment cavity to form a series of liquid-cooled flow channels 9, the heat-conducting sheet 17 can be located at any position in the containment cavity, and the communication between the phase-change flow channel 16 and the liquid outlet pipe 3 can be achieved by installing an additional exhaust pipe 19, which not only reduces the difficulty of arranging the heat-conducting sheet 17, but also prevents the influence of bubbles generated in the phase-change flow channel 16 on the liquid-cooled flow channel 9. The bubbles in the phase-change flow channel 16 can be directly discharged into the liquid outlet pipe through the exhaust pipe 19, which can effectively prevent the bubbles from interfering with and blocking the flow of cooling liquid in the liquid-cooled flow channel 9.

[0078] The liquid cooling heat dissipation device for a server described in the embodiment is characterized in that: the liquid cooling flow channels 9 are connected in series, and the phase change flow channels 16 are arranged on at least part of the heat conduction sheets 17; a part of the main spray holes 6 correspond to the phase change flow channels 16, and the other part of the main spray holes 6 correspond to the liquid cooling flow channels 9; one end of the phase change flow channels 16 is communicated with the corresponding main spray holes 6, and the other end of the phase change flow channels 16 is communicated with the liquid outlet pipe 3; and the cooling liquid sprayed from the main spray holes 6 of the liquid cooling spray pipe 5 can enter the phase change flow channels 16 and contact the inner wall of the phase change flow channels 16 to cause nucleate boiling, thereby quickly absorbing the heat on the heat conduction sheets 17, which is conducive to improving the cooling speed of the liquid cooling heat dissipation device for the heat generating equipment, thereby avoiding damage to the heat generating equipment.

[0079] Embodiment four

[0080] Figure 16 The structure diagram of the liquid cooling heat dissipation device for a server described in Embodiment Four of the application. The embodiment is an optimization based on Embodiment One described above. Referring to Figures 16 to 18 , the specific optimization is that: the liquid cooling flow channels 9 are connected in parallel, the phase change flow channels 16 are arranged on at least part of the heat conduction sheets 17, a part of the main spray holes 6 correspond to the phase change flow channels 16, and the other part of the main spray holes 6 correspond to the liquid cooling flow channels 9; one end of the phase change flow channels 16 is communicated with the corresponding main spray holes 6, and the other end of the phase change flow channels 16 is communicated with the liquid outlet pipe 3.

[0081] Specifically, the heat conduction sheets 17 are arranged in the containing cavity to form the liquid cooling flow channels 9 connected in parallel, that is, each liquid cooling flow channel 9 has one end communicated with the main liquid inlet pipe 2 and the other end communicated with the liquid outlet pipe 3. The phase change flow channels 16 can be arranged on part or all of the heat conduction sheets 17 that intersect with the liquid cooling spray pipe 5. It should be noted that the positions of the liquid outlet pipe 3 corresponding to the liquid cooling flow channels 9 and the phase change flow channels 16 can be respectively provided with openings 20 to realize the communication between the liquid cooling flow channels 9 and the liquid outlet pipe 3 and between the phase change flow channels 16 and the liquid outlet pipe 3. It should be understood that the person skilled in the art can also adjust the arrangement mode of the openings 20 according to actual needs, as long as the liquid cooling flow channels 9 and the phase change flow channels 16 can be communicated with the liquid outlet pipe 3, which will not be described here.

[0082] Correspondingly, when the heat conduction sheets 17 are arranged in the containing cavity to form the liquid cooling flow channels 9 connected in parallel, the heat conduction sheets 17 are also arranged at intervals, so that the bubbles discharged from the phase change flow channels 16 of each heat conduction sheet 17 are not easy to converge, thereby ensuring that the bubbles can be quickly discharged from the cold plate body 1 through the liquid outlet pipe 3 in a dispersed state, avoiding the bubbles from blocking part of the liquid cooling flow channels 9 due to aggregation, and being conducive to ensuring the stability of the flow of the cooling liquid in each liquid cooling flow channel 9.

[0083] With the above arrangement, when the cooling liquid is transported to the liquid-cooled nozzle 5 by the secondary liquid inlet pipe 4, the cooling liquid in the liquid-cooled nozzle 5 can also be injected into the phase-change flow channel 16 through the main nozzle hole 6 of the liquid-cooled nozzle 5. The cooling liquid entering the phase-change flow channel 16 will undergo nucleate boiling by contacting the inner wall of the phase-change flow channel 16, thereby quickly absorbing the heat on the heat-conducting sheet 17 and quickly reducing the temperature of the heat-conducting sheet 17 at the bonding site of the cold plate body 1 and the heat-generating device, which is conducive to improving the cooling speed at the bonding site of the cold plate body 1 and the heat-generating device, achieving rapid cooling of the heat-generating device, and avoiding damage to the heat-generating device. Subsequently, as the liquid-cooled nozzle 5 continuously injects cooling liquid into the phase-change flow channel 16, nucleate boiling can be maintained, and the bubbles generated by nucleate boiling can be directly discharged through the liquid outlet pipe 3, which can effectively avoid the interference of bubbles on the cooling liquid in the liquid-cooled flow channel 9 and the flow-through gap 8.

[0084] In one preferred embodiment of the present embodiment, referring to Figure 18 and Figure 19 , one end of the phase-change flow channel 16 communicates with the corresponding main nozzle hole 6, and the other end communicates with the liquid outlet pipe 3 through the liquid outlet section 13 of the liquid-cooled flow channel 9.

[0085] With the above arrangement, when the heat-conducting sheet 17 is arranged in the containing cavity to form parallel liquid-cooled flow channels 9, the heat-conducting sheet 17 can be completely located in the containing cavity, and part of the space in the containing cavity serves as the liquid outlet section 13 of the liquid-cooled flow channel 9 and communicates with the liquid outlet pipe 3. At this time, only the liquid outlet pipe 3 needs to be fixedly connected to the cold plate body 1, so that the connection area of the liquid outlet pipe 3 and the cold plate body 1 is smaller, which is convenient for processing and assembly, and is conducive to reducing the probability of leakage of the cooling liquid. In addition, by connecting the liquid outlet pipe 3 and the phase-change flow channel 16 through the liquid outlet section 13, the bubbles discharged from the phase-change flow channel 16 can quickly enter the liquid outlet pipe 3 and finally be discharged from the cold plate body 1 through the liquid outlet pipe 3, which is conducive to reducing the influence of bubbles on the main cooling areas such as the liquid inlet section 11 and the straight section 12 of the liquid-cooled flow channel 9, and ensuring the smoothness of the flow of the cooling liquid in the liquid-cooled flow channel 9.

[0086] The liquid cooling heat dissipation device for a server is characterized in that: the liquid cooling flow channels 9 are connected in parallel, phase change flow channels 16 are arranged on at least part of the heat conduction sheets 17, a part of the main spray holes 6 correspond to the phase change flow channels 16, and the other part of the main spray holes 6 correspond to the liquid cooling flow channels 9, one end of the phase change flow channels 16 is communicated with the corresponding main spray holes 6, and the other end of the phase change flow channels 16 is communicated with the liquid outlet pipe 3, so that the cooling liquid sprayed from the main spray holes 6 of the liquid cooling spray pipe 5 can enter the phase change flow channels 16 and contact the inner wall of the phase change flow channels 16 to cause nucleate boiling, thereby quickly absorbing the heat on the heat conduction sheets 17, which is beneficial to improve the cooling speed of the liquid cooling heat dissipation device on the heat generating equipment, thereby avoiding damage to the heat generating equipment. At the same time, the above arrangement also makes the bubbles discharged from the phase change flow channels 16 of each heat conduction sheet 17 not easy to converge, thereby ensuring that the bubbles can be quickly discharged from the cold plate body 1 through the liquid outlet pipe 3 in a dispersed state, and further improving the stability and reliability of the liquid cooling heat dissipation device during continuous operation.

[0087] It should be noted that the above are only the preferred embodiments of the present application and the principles of the technology applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, readjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A liquid cooling heat dissipation device for servers, characterized in that: The device includes a cold plate body (1), a main liquid inlet pipe (2), a secondary liquid inlet pipe (4), and a liquid outlet pipe (3); the cold plate body (1) is provided with a liquid cooling channel (9), one end of which is connected to the main liquid inlet pipe (2), and the other end is connected to the liquid outlet pipe (3); the cold plate body (1) is also provided with a liquid cooling nozzle (5), one end of which is connected to the secondary liquid inlet pipe (4), and the other end extends to the point where the cold plate body (1) is in contact with the heating device, and the liquid cooling nozzle (5) is located outside the device. There is a liquid passage gap (10) between the wall and the inner wall of the liquid cooling channel (9). The liquid passage gap (10) is connected to the liquid cooling channel (9). The liquid cooling nozzle (5) is provided with a main nozzle (6). At least part of the main nozzle (6) is obliquely arranged towards the liquid outlet pipe (3), and one end is connected to the liquid cooling nozzle (5) and the other end is connected to the liquid passage gap (10), so that the liquid flow ejected from the main nozzle (6) can flow to the liquid outlet pipe (3) through the liquid passage gap (10) and the liquid cooling channel (9). The device includes a heat-conducting plate (17), at least a portion of which has a receiving groove (14) for accommodating the liquid-cooled nozzle (5), and the cold plate body (1) has a receiving cavity for accommodating the heat-conducting plate (17), which divides the receiving cavity into the liquid-cooled flow channel (9). The liquid cooling channels (9) are connected in series or in parallel. At least a portion of the heat-conducting plates (17) are provided with phase change channels (16). A portion of the main nozzle (6) is provided corresponding to the phase change channel (16), and another portion is provided corresponding to the liquid cooling channel (9). One end of the phase change channel (16) is connected to the corresponding main nozzle (6), and the other end is connected to the liquid outlet pipe (3). At least two liquid-cooled nozzles (5) are spaced apart, and there is a flow gap (8) between two adjacent liquid-cooled nozzles (5). The flow gap (8) is connected to the liquid-cooled channel (9), and the flow gap (8) and the liquid-cooled channel (9) are in a grid pattern. Along the direction of gravity, the phase change channel (16) is located above the flow gap (8). There is a ventilation gap (18) between the heat-conducting plate (17) and the inner wall of the receiving cavity. The ventilation gap (18) is connected to the liquid-cooled channel (9).

2. The liquid cooling heat dissipation device for servers according to claim 1, characterized in that: The liquid-cooled nozzle (5) is provided with a side spray hole (7) at the position corresponding to the flow gap (8). One end of the side spray hole (7) is connected to the liquid-cooled nozzle (5), and the other end is set obliquely towards the secondary liquid inlet pipe (4) so ​​that the liquid flow sprayed from the side spray hole (7) can flow towards the secondary liquid inlet pipe (4) through the flow gap (8) connected to it.

3. The liquid cooling heat dissipation device for servers according to claim 1, characterized in that: The device also includes an exhaust pipe (19), one end of which is connected to the phase change channel (16) and the other end of which is connected to the liquid outlet pipe (3).

4. The liquid cooling heat dissipation device for servers according to claim 1, characterized in that: The liquid cooling channel (9) includes a straight section (12), an inlet section (11), and an outlet section (13). Along the length of the liquid cooling channel (9), the inlet section (11) is located inside the cold plate body (1) near the main inlet pipe (2), and the outlet section (13) is located inside the cold plate body (1) near the outlet pipe (3). The straight section (12) is located between the inlet section (11) and the outlet section (13). The straight section (12), the main inlet pipe (2), and the outlet pipe (3) are arranged parallel to each other. The length direction of the liquid cooling nozzle (5) is perpendicular to the length direction of the straight section (12).

5. A liquid cooling heat dissipation device for servers according to claim 1, characterized in that: The liquid-cooled nozzle (5) is provided with a flow guide (15), and the flow guide (15) is provided with an arc surface or inclined surface for guiding the flow of liquid.

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