Automatic tin spraying device for circuit board

Abstract

The invention relates to the technical field of circuit board tin spraying, and discloses a circuit board automatic tin spraying device which comprises a supporting base, a first conveying belt and a second conveying belt, a first heating pipe is installed on the inner wall of a first installation groove, and a second heating pipe is installed on the inner wall of a second installation groove. A plurality of air outlet grooves are formed in the upper side and the lower side of the inner wall of the drying groove at equal intervals, a circuit board subjected to tin spraying is rotated to be in a horizontal state through the clamping structures and then is continuously conveyed in the limiting sliding grooves to enter the drying groove, a first heating pipe and a second heating pipe are started, and then a fan is started to enable the circuit board to continuously discharge air; the hot air is blown to the two sides of the circuit board, so that the circuit board is continuously blown and covered by the hot air in the transfer process in the drying groove to achieve rapid drying, the problem that tin surface drying cannot be conducted in the first time after tin spraying of the circuit board is conducted is solved, meanwhile, the two faces of the circuit board can be continuously dried, and the circuit board drying efficiency is improved. And the processing quality and the processing efficiency of the circuit board are improved.

Description

Technical Field

[0001] This invention belongs to the technical field of circuit board soldering, and specifically relates to an automatic circuit board soldering device. Background Technology

[0002] In the electronics manufacturing industry, tin plating plays a crucial role as a key surface treatment process for printed circuit boards (PCBs). It is commonly used in multi-layer, high-precision PCB manufacturing processes and is widely applied in fields with extremely high performance and reliability requirements, such as communication equipment, computers, medical devices, and aerospace products. Tin plating not only significantly improves the oxidation resistance of PCBs, effectively extending their lifespan, but also greatly enhances their stability during operation, ensuring stable operation of electronic devices in complex environments. Therefore, tin plating has become an indispensable and critical step in modern PCB manufacturing processes. With the rapid development of modern technology, the equipment used for tin plating of circuit boards has become increasingly diverse, greatly improving the efficiency and convenience of circuit board processing. However, the existing tin plating equipment for circuit boards still has many shortcomings that need to be addressed in practical applications. 1. During the tin plating process on circuit boards, to prevent the molten solder from scratching and dripping during later stacking or transport, the solder-coated surface must be dried immediately after plating. However, most tin plating equipment currently lacks a drying function. Even with some equipment that does have a drying function, workers still need to manually transfer the tin-plated circuit boards to the drying area. During this process, workers inevitably come into contact with the freshly plating circuit boards, easily causing scratches on the solder surface. This not only significantly reduces the processing quality of the circuit boards but also severely impacts the overall processing efficiency, increasing production and time costs. 2. During the PCB soldering process, some devices are equipped with a rotation function for the PCB, enabling double-sided soldering in a single operation and effectively improving efficiency. However, in actual soldering, the PCB is usually automatically transferred to the soldering area, but ordinary soldering devices lack positioning and centering capabilities. This leads to PCB misalignment during clamping and rotation, and more seriously, insufficient clamping can result in PCB detachment and incomplete soldering during rotation. These problems not only reduce the quality of the soldering but can also damage the equipment, affecting production continuity and stability.

[0003] Therefore, it is necessary to invent an automatic tin-spraying device for circuit boards to solve the above problems. Summary of the Invention

[0004] To address the aforementioned problems, the present invention provides an automatic tin-plating device for circuit boards, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic tin-spraying device for circuit boards, comprising a support base, a first conveyor belt and a second conveyor belt, wherein a continuous drying mechanism and a rotary positioning tin-spraying mechanism are respectively installed at the middle position of the top of the support base, wherein the first conveyor belt is installed at one end of the top of the support base and the second conveyor belt is installed at the other end of the top of the support base. The continuous drying mechanism includes limiting grooves located at the middle of both sides of the outer wall of the support base. A drying groove is formed at one end of the top of the support base at the outer edge of the first conveyor belt. A first mounting groove is formed above the drying groove on the inner wall of the support base, and a second mounting groove is formed below the drying groove on the inner wall of the support base. A first heating tube is installed on the inner wall of the first mounting groove, and a second heating tube is installed on the inner wall of the second mounting groove. Multiple air outlet grooves are formed at equal intervals on the upper and lower sides of the inner wall of the drying groove. The inner walls of the first and second mounting grooves are respectively connected to the inner walls of the multiple air outlet grooves. Multiple connecting grooves are formed at one end of the top and one end of the front of the support base. The inner walls of the first and second mounting grooves are respectively connected to the inner walls of the multiple connecting grooves. A fan is installed on the inner wall of each connecting groove. Preferably, a liquid storage tank is provided at the lower edge of one end of the inner wall of the support base, and a liquid inlet tank is installed on one side of the outer wall of the support base, with the inner wall of the liquid inlet tank communicating with the inner wall of the liquid storage tank. Multiple nozzles are fixed at equal intervals at the outer edge of the second conveyor belt on the top of the support base, and the inner wall of each nozzle is communicating with the inner wall of the liquid storage tank.

[0006] Preferably, the rotary positioning tin spraying mechanism includes sliders slidably connected in the inner walls of two limiting slide grooves, one end of each slider is fixedly provided with a mounting bracket, and a motor is installed on the inner wall of one of the mounting brackets.

[0007] Preferably, a turntable is rotatably connected to one side of each of the two mounting brackets, one end of one of the turntables passes through the inner wall of one of the mounting brackets and is fixedly connected to the output end of the motor, and a first electric push rod is fixedly provided on one side of each of the two turntables.

[0008] Preferably, each of the output ends of the two first electric push rods is fixedly provided with a pad, and each of the two pads is connected to a connecting shaft through one end. Each of the four connecting shafts is fixedly provided with two clamping plates, and each of the four connecting shafts is fitted with a spring on its outer wall. The two ends of the four springs are respectively fixedly connected to one side of the two pads and one side of the two clamping plates.

[0009] Preferably, the top two sides of the support base are fixedly provided with limiting frames above one end of the second conveyor belt, and the inner walls of one end of the two limiting frames are rotatably connected with positioning rollers.

[0010] Preferably, a second electric push rod is installed on both sides of the top end of the support base, and the output ends of the two second electric push rods pass through the inner walls of the two limiting slide grooves and are fixedly connected to one side of the two sliders. A through groove is opened on one side of the bottom of the support base, and a protective cover is hinged on one side of the top of the support base.

[0011] Preferably, a control panel is installed on one side of the support base, and the first conveyor belt, the second conveyor belt, the first heating tube, the second heating tube, the first electric push rod, the motor, and the second electric push rod are all electrically connected to an external power supply through the control panel.

[0012] Preferably, it also includes a feeding platform for feeding materials and a transfer platform for transferring circuit boards. A first robotic arm and a second robotic arm are provided between the feeding platform and the transfer platform. The top of the first robotic arm and the second robotic arm are provided with grippers. The grippers include a first gripper and a second gripper. The first gripper and the second gripper are provided with corresponding V-shaped clamping grooves.

[0013] The technical effects and advantages of this invention are as follows: This invention employs a continuous drying mechanism. A clamping structure rotates the tin-plated circuit board to a horizontal position, then continuously transfers it through a limiting slide into a drying tank. During this process, the first and second heating tubes are activated, and the fans in the side and top connecting slots of the support base continuously blow air. The air heated by the first and second heating tubes in the first and second mounting slots enters and exits through the air outlet slots onto the upper and lower sides of the drying tank wall. This ensures that the hot air is continuously blown onto both sides of the circuit board, allowing it to be continuously covered and dried rapidly during transfer within the drying tank. This design solves the problem of the circuit board not being able to dry the tin surface immediately after tin plating. Furthermore, this design ensures continuous drying on both sides of the circuit board, guaranteeing a thoroughly dried tin surface after transfer, preventing scratches and improving the processing quality and efficiency of the circuit board. This invention employs a rotary positioning tin-spraying mechanism. During tin spraying, a second conveyor belt transfers the circuit board, allowing one end to move along the inner side of two limiting frames. Both sides then contact the outer wall of a positioning roller at one end of the limiting frame, causing the positioning roller to rotate and guide the circuit board. Guided by the positioning roller and through positioning transfer, the circuit board is centered. Then, the first electric push rod is activated to extend the clamping plate, allowing it to smoothly clamp the circuit board in the center and rotate to achieve double-sided tin spraying. This ensures the circuit board is centered during tin spraying, allowing the molten solder to cover the outer surface of the circuit board. It also prevents uneven tin spraying caused by skewed spraying, improving the stability of the tin spraying device and the tin spraying quality of the circuit board.

[0014] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the invention used in conjunction with a robotic arm, a feeding platform, and a conveyor. Figure 2 This is a schematic diagram of the top of the support base of the present invention; Figure 3 This is a schematic diagram of the continuous drying mechanism of the present invention; Figure 4 This is a schematic diagram of the front of the slider of the present invention; Figure 5 This is a schematic diagram of the connection between the clamping plate and the pad of the present invention; Figure 6 This is a schematic diagram of the interior of the support base of the present invention; Figure 7 This is a schematic diagram of the entire invention; Figure 8 This is a schematic diagram of the gripper of the present invention.

[0017] In the diagram: 1. Support base; 2. First conveyor belt; 3. Second conveyor belt; 4. Continuous drying mechanism; 401. Limiting slide; 402. Drying tank; 403. First mounting slot; 404. Second mounting slot; 405. First heating tube; 406. Second heating tube; 407. Air outlet slot; 408. Connecting slot; 409. Fan; 5. Liquid storage tank; 6. Liquid inlet tank; 7. Nozzle; 8. Rotary positioning tin spraying mechanism; 801. Slider; 80 2. Mounting bracket; 803. Motor; 804. Turntable; 805. First electric push rod; 806. Pad; 807. Connecting shaft; 808. Clamping plate; 809. Spring; 810. Limiting bracket; 811. Positioning roller; 9. Second electric push rod; 10. Through slot; 11. Protective cover; 12. Unloading platform; 13. Second robot arm; 14. First robot arm; 15. Transfer table; 27. First gripper; 28. Second gripper; 29. ​​V-shaped clamping groove. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] This invention provides, for example Figure 1-7 An automatic tin-spraying device for circuit boards is shown, comprising a support base 1, a first conveyor belt 2 and a second conveyor belt 3. The device is characterized in that a continuous drying mechanism 4 and a rotary positioning tin-spraying mechanism 8 are respectively installed at the middle position of the top of the support base 1, wherein the first conveyor belt 2 is installed at one end of the top of the support base 1 and the second conveyor belt 3 is installed at the other end of the top of the support base 1. The continuous drying mechanism 4 includes a limiting groove 401 located at the middle of both sides of the outer wall of the support base 1. A drying groove 402 is formed at one end of the top of the support base 1 at the outer edge of the first conveyor belt 2. A first mounting groove 403 is formed on the inner wall of the support base 1 above the drying groove 402, and a second mounting groove 404 is formed on the inner wall of the support base 1 below the drying groove 402. A first heating tube 405 is installed on the inner wall of the first mounting groove 403, and a second heating tube 405 is installed on the inner wall of the second mounting groove 404. 06. Multiple air outlet slots 407 are equally spaced on the upper and lower sides of the inner wall of the drying tank 402. The inner walls of the first mounting slot 403 and the second mounting slot 404 are respectively connected to the inner walls of the multiple air outlet slots 407. Multiple connecting slots 408 are provided at one end of the top and one end of the front of the support base 1. The inner walls of the first mounting slot 403 and the second mounting slot 404 are respectively connected to the inner walls of the multiple connecting slots 408. A fan 409 is installed on the inner wall of each connecting slot 408. In use, the circuit board to be soldered is placed on the second conveyor belt 3 at one end of the top of the support base 1 for transfer. During the transfer, after being centered and soldered by the rotary positioning soldering mechanism 8, it is rotated to a horizontal state by the clamping structure on the mechanism and then continuously transferred in the limiting slide 401. The soldered circuit board is then carried into the drying tank 402 at one end of the support base 1. The inner walls of both ends of the drying tank 402 are connected to the inner walls of the two limiting slides 401, so that the circuit board is clamped and continuously transferred within the drying tank 402 through the limiting slides 401. During this process, the first heating tube 405 and the second heating tube 406 in the first mounting slot 403 and the second mounting slot 404 are activated. Then, the fans 409 in the side and top connecting slots 408 of the support base 1 are activated to continuously blow air, and the first mounting slot 405 and the second heating tube 406 in the second mounting slot 404 are activated. The air heated by the first heating tube 405 and the second heating tube 406 in the mounting slot 403 and the second mounting slot 404 enters and exits through the air outlet 407 into the upper and lower sides of the inner wall of the drying tank 402. The hot air blows onto both sides of the circuit board, so that it is continuously covered by hot air during the transfer in the drying tank 402, thereby achieving rapid drying. When the circuit board is transferred out of the drying tank 402, it is located at one end of the top of the first conveyor belt 2. The clamp on the circuit board is released, allowing it to fall naturally onto the first conveyor belt 2 and be transferred out for the next processing step. This design solves the problem that the solder surface of the circuit board cannot be dried immediately after soldering. At the same time, this design allows both sides of the circuit board to be continuously dried, so that the solder surface is thoroughly dried after being transferred out, making it less prone to scratches and improving the processing quality and efficiency of the circuit board. Furthermore, a liquid storage tank 5 is provided at the lower edge of one end of the inner wall of the support base 1, and a liquid inlet tank 6 is installed on one side of the outer wall of the support base 1. The inner wall of the liquid inlet tank 6 is connected to the inner wall of the liquid storage tank 5. Multiple nozzles 7 are fixed at equal intervals at the outer edge of the second conveyor belt 3 on the top of the support base 1. The inner wall of each nozzle 7 is connected to the inner wall of the liquid storage tank 5. After the circuit board is clamped by the rotary positioning solder spraying mechanism 8, the solder surface is sprayed through the nozzles 7. The nozzles 7 are connected to the liquid storage tank 5 so that the stored solder liquid is fully sprayed out through the nozzles 7. The solder liquid can also be replenished through the liquid inlet tank 6 later. Furthermore, the rotary positioning tin spraying mechanism 8 includes sliders 801 that are slidably connected to the inner walls of two limiting slide grooves 401. One end of each slider 801 is fixedly provided with a mounting bracket 802, and a motor 803 is installed on the inner wall of one of the mounting brackets 802.

[0020] A turntable 804 is rotatably connected to one side of each of the two mounting brackets 802. One end of one of the turntables 804 passes through the inner wall of one of the mounting brackets 802 and is fixedly connected to the output end of the motor 803. A first electric push rod 805 is fixedly provided on one side of each of the two turntables 804, and the first electric push rod 805 drives the turntables 804 to rotate through the motor 803, thereby rotating together.

[0021] Each of the two first electric push rods 805 has a pad 806 fixedly installed at its output end. Each of the two pads 806 has a connecting shaft 807 inserted through both ends on one side. Each of the four connecting shafts 807 has a clamping plate 808 fixedly installed at one end. Each of the four connecting shafts 807 has a spring 809 sleeved on its outer wall. The two ends of the four springs 809 are fixedly connected to one side of the two pads 806 and one side of the two clamping plates 808, respectively. When the first electric push rod 805 is driven to rotate, it extends and retracts to clamp the two sides of the circuit board, and then drives it to rotate together. During the process of clamping the circuit board, the clamping plate 808 presses against the two sides of the circuit board. During the pressing process, the spring 809 is compressed, causing the connecting shaft 807 to insert through one side of the pad 806. This gives the clamping plate 808 a certain buffering performance when clamping the circuit board, preventing excessive compression from damaging the circuit board.

[0022] The support base 1 has two fixed limit frames 810 on its top sides above one end of the second conveyor belt 3. The inner walls of one end of each limit frame 810 are rotatably connected to positioning rollers 811. During the soldering process, the second conveyor belt 3 transmits the circuit board, so that one end of the circuit board is transmitted along the inner side of the two limit frames 810 and both sides of the circuit board contact the outer wall of the positioning rollers 811 at one end of the limit frame 810. This causes the positioning rollers 811 to rotate and guide the circuit board. At this time, the circuit board is centered after being guided and positioned by the positioning rollers 811. Then, the first electric push rod 805 is activated and the telescopic clamp 808 is activated to clamp the circuit board in the center and rotate it to achieve double-sided soldering. This ensures that the circuit board is centered during soldering, so that the solder liquid can cover the outer surface of the circuit board. This prevents the problem of uneven soldering caused by skewed soldering and improves the soldering quality of the circuit board. Furthermore, two second electric push rods 9 are installed on both sides of the top end of the support base 1, and the output ends of the two second electric push rods 9 pass through the inner walls of the two limiting slide grooves 401 and are fixedly connected to one side of the two sliders 801. A through groove 10 is opened on one side of the bottom of the support base 1, and a protective cover 11 is hinged on one side of the top of the support base 1. During the soldering and drying process of the circuit board, the second electric push rods 9 are activated to push the sliders 801 to move continuously in the limiting slide grooves 401, thereby enabling the soldering and drying to proceed continuously and improving processing efficiency. During the soldering process, the protective cover 11 is covered to prevent the solder liquid from splashing. Furthermore, as per the instruction manual... Figure 7 The diagram shows the design scheme working continuously with a robotic arm, a feeding platform, and a conveyor. Circuit boards are stacked on the conveyor 15, picked up by the first robotic arm 13, and placed on the second conveyor belt 3 at one end of the support base 1 for transfer to the middle area for soldering. After soldering, the second robotic arm 14 picks them up again and places them on the feeding platform 12. The entire operation process, together with the support base 1, forms a complete and smooth production line, improving work efficiency.

[0023] Furthermore, as per the instruction manual... Figure 8 As shown, the upper ends of the first robotic arm 14 and the second robotic arm 13 are both equipped with a first gripper 27 and a second gripper 28. The first gripper 27 and the second gripper 28 are both provided with corresponding V-shaped clamping grooves 29, which play a role in correcting the transition when clamping the circuit board and preventing damage to the circuit board.

[0024] Furthermore, the feeding platform 12 is an air-floating bed. The feeding platform 12 is inclined downwards from back to front. A baffle plate is provided on the top of the rear side of the feeding platform 12. A cylinder is installed on the rear side of the feeding platform 12 to drive the baffle plate to move up and down. A middle partition plate extending from front to back is provided in the middle of the top of the rear side of the feeding platform 12. A uniform pushing cylinder is provided on the rear side of the feeding platform 12. The second robot arm 13 transports the circuit board onto the feeding platform 12. The circuit board moves forward automatically under the action of gravity and the air-floating bed. The baffle plate can block the circuit board. The cylinder controls the baffle plate to move up and down to allow the circuit board to flow forward, so as to control the discharge time and sequence of the circuit board, which facilitates the unloading of the circuit board. The pushing cylinder pushes the circuit board to facilitate neat unloading. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automatic tin plating device for circuit boards, comprising a support base (1), a first conveyor belt (2), and a second conveyor belt (3), characterized in that: A continuous drying mechanism (4) and a rotary positioning tin spraying mechanism (8) are respectively installed at the middle position of the top of the support base (1). The first conveyor belt (2) is installed at one end of the top of the support base (1), and the second conveyor belt (3) is installed at the other end of the top of the support base (1). The continuous drying mechanism (4) includes a limiting slide groove (401) located at the middle of both sides of the outer wall of the support base (1). A drying groove (402) is provided at one end of the top of the support base (1) at the outer edge of the first conveyor belt (2). A first mounting groove (403) is provided on the inner wall of the support base (1) above the drying groove (402). A second mounting groove (404) is provided on the inner wall of the support base (1) below the drying groove (402). A first heating tube (405) is installed on the inner wall of the first mounting groove (403), and a second heating tube (405) is installed on the inner wall of the second mounting groove (404). Two heating tubes (406), the drying tank (402) has multiple air outlet slots (407) evenly spaced on the upper and lower sides of the inner wall, and the inner wall of the first mounting slot (403) and the inner wall of the second mounting slot (404) are respectively connected to the inner walls of the multiple air outlet slots (407). The support base (1) has multiple connecting slots (408) at one end of the top and one end of the front, and the inner wall of the first mounting slot (403) and the inner wall of the second mounting slot (404) are respectively connected to the inner walls of the multiple connecting slots (408). Each connecting slot (408) has a fan (409) installed on its inner wall.

2. The automatic tin-plating device for circuit boards according to claim 1, characterized in that: A liquid storage tank (5) is provided at the lower edge of one end of the inner wall of the support base (1). A liquid inlet tank (6) is installed on one side of the outer wall of the support base (1), and the inner wall of the liquid inlet tank (6) is connected to the inner wall of the liquid storage tank (5). Multiple nozzles (7) are fixed at equal distances at the top of the support base (1) at the outer edge of the second conveyor belt (3), and the inner wall of each nozzle (7) is connected to the inner wall of the liquid storage tank (5).

3. The automatic soldering device for circuit boards according to claim 1, characterized in that: The rotary positioning tin spraying mechanism (8) includes sliders (801) that are slidably connected in the inner walls of two limiting slides (401). One end of each slider (801) is fixedly provided with a mounting bracket (802), and a motor (803) is installed on the inner wall of one of the mounting brackets (802).

4. The automatic tin-plating device for circuit boards according to claim 3, characterized in that: A turntable (804) is rotatably connected to one side of each of the two mounting brackets (802). One end of one of the turntables (804) passes through the inner wall of one of the mounting brackets (802) and is fixedly connected to the output end of the motor (803). A first electric push rod (805) is fixedly provided on one side of each of the two turntables (804).

5. The automatic tin-spraying device for circuit boards according to claim 4, characterized in that: The output ends of the two first electric push rods (805) are each fixedly provided with a pad (806). The two ends of one side of the two pads (806) are each connected with a connecting shaft (807). One end of the four connecting shafts (807) is fixedly provided with two clamping plates (808). The outer wall of the four connecting shafts (807) is fitted with a spring (809). The two ends of the four springs (809) are respectively fixedly connected to one side of the two pads (806) and one side of the two clamping plates (808).

6. The automatic soldering device for circuit boards according to claim 1, characterized in that: The support base (1) has two fixed limit frames (810) on both sides above one end of the second conveyor belt (3), and the inner walls of one end of the two limit frames (810) are rotatably connected with positioning rollers (811).

7. The automatic tin-plating device for circuit boards according to claim 1, characterized in that: The support base (1) has two second electric push rods (9) installed on both sides of the top end. The output ends of the two second electric push rods (9) pass through the inner walls of the two limiting slide grooves (401) and are fixedly connected to one side of the two sliders (801). A through groove (10) is opened on one side of the bottom of the support base (1). A protective cover (11) is hinged on one side of the top of the support base (1).

8. The automatic tin-plating device for circuit boards according to claim 7, characterized in that: A control panel is installed on one side of the support base (1), and the first conveyor belt (2), the second conveyor belt (3), the first heating tube (405), the second heating tube (406), the first electric push rod (805), the motor (803) and the second electric push rod (9) are all electrically connected to an external power supply through the control panel.

9. The automatic soldering device for circuit boards according to claim 1, characterized in that: It also includes a feeding platform (12) for feeding materials and a transfer platform (15) for transferring circuit boards. A first robotic arm (14) and a second robotic arm (13) are provided between the feeding platform (12) and the transfer platform (15). The top of the first robotic arm (14) and the second robotic arm (13) are provided with grippers. The grippers include a first gripper (27) and a second gripper (28). The first gripper (27) and the second gripper (28) are each provided with a corresponding V-shaped gripping groove (29).

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