A conveying and supporting mechanism of a loadlock type ultra-high vacuum evaporation machine

Abstract

The application discloses a kind of Loadlock type ultra-high vacuum evaporation machine's conveying support mechanism, it is related to evaporation machine wafer conveying technology, including installation in the upper portion of evaporation machine inside, and the upper portion left side of bearing platform is provided with lifting cylinder;The lower portion of the bearing platform is provided with docking mechanism, and docking mechanism contains bottom support ring;Wherein, bottom support ring is used to contact the bottom end of wafer transfer disc;The right side of the bearing platform is provided with conveying mechanism, and conveying mechanism contains conveying fork rod.The Loadlock type ultra-high vacuum evaporation machine's conveying support mechanism, when wafer body is conveyed by conveying fork rod, dust and debris are cleaned through the partition vertical plate inside evaporation machine, prevent residual influence evaporation effect, and through bottom support ring and cooling pressure disc are accurately temperature-controlled when coating low melting point material, so that material is not overheated and fused to produce hang flow phenomenon.

Description

Technical Field

[0001] This invention relates to the field of wafer transport technology for vapor deposition machines, specifically a transport and support mechanism for a Loadlock type ultra-high vacuum vapor deposition machine. Background Technology

[0002] A vacuum evaporation machine is a machine that uses vacuum evaporation technology to manufacture screens. It is mainly used to evaporate or sublimate materials in a vacuum environment to form a thin film on the surface of a substrate. This technology is widely used in semiconductor devices, optical components, MEMS devices and other fields to prepare metal thin films, electrode layers and optical reflective films. It is a key piece of equipment in semiconductor manufacturing for depositing thin films on the surface of wafers. The metal or dielectric layer formed by the vacuum evaporation process directly affects the conductivity, insulation and other properties of the chip. The wafer is intermittently fed and unloaded through a conveyor assembly matched with the evaporation machine.

[0003] The utility model disclosed in CN223193774U is a wafer carrier, a wafer transport device, and a wafer transport system. The wafer carrier is also equipped with a placement position verification position, which can assist in the alignment between the carrier body and the electrostatic chuck. With the stop structure restricting the relative position between the carrier body and the wafer, the precise alignment between the carrier body and the electrostatic chuck can achieve precise positioning between the wafer and the electrostatic chuck. This is more conducive to the electrostatic chuck applying a uniform adsorption force to the wafer, resulting in better adsorption effect and the wafer is less likely to be damaged due to excessive local force.

[0004] The utility model disclosed in CN221573890U is a wafer transport device and a wafer processing equipment. The first support part is located in the sampling chamber and can transport the material tray to the conversion position and the process chamber. The second drive component is provided with a second support part, which is located in the sampling chamber and the conversion position, so as to transport one of the material loading positions of the material tray to the loading position. The process of vacuuming the sampling chamber and the wafer processing in the process chamber can be performed synchronously, thereby reducing waiting time and improving work efficiency.

[0005] However, the wafer transport support mechanism disclosed above for evaporation machines still has the following problems in actual use: the wafer is transported to the evaporation machine before vacuum by the transport mechanism, but some wafers are prone to dust and fragments in the previous processing steps, and move into the evaporation machine along with the transport mechanism during the processing, thus affecting the forming and adhesion of the material on the wafer surface.

[0006] Therefore, we propose a loadlock-type ultra-high vacuum evaporation machine conveying and supporting mechanism to solve the problems mentioned above. Summary of the Invention

[0007] The purpose of this invention is to provide a conveying and supporting mechanism for a Loadlock type ultra-high vacuum evaporation machine. This addresses the problem that existing evaporation machines transport wafers to the vacuum stage via a conveying mechanism, but some wafers are prone to having dust and debris particles attached to them during the preceding processing steps. These particles then move along with the conveying mechanism into the evaporation machine during processing, thus affecting the material's formation and adhesion on the wafer surface.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a conveying and supporting mechanism for a Loadlock type ultra-high vacuum evaporation coating machine, comprising a support platform installed above the interior of the evaporation coating machine, wherein a cooling circulation pipe is fixedly installed in the upper middle part of the support platform, and a lifting cylinder is provided on the upper left side of the support platform.

[0009] A docking mechanism is provided below the bearing platform, and the docking mechanism includes a bottom support ring, and the side of the bottom support ring is fixedly connected to the bottom end of the lifting slide bar.

[0010] The bottom support ring is used to contact the bottom of the wafer transfer disk, and the wafer body is placed inside the wafer transfer disk;

[0011] The right side of the carrier platform is provided with a conveying mechanism, which includes a conveying fork. The left end of the conveying fork has an arc-shaped fork structure that supports the outside of the wafer transfer disk for conveying.

[0012] Preferably, the docking mechanism includes a cooling pressure plate, which is fixedly installed at the bottom end of the cooling circulation pipe. The cooling pressure plate has a cooling flow channel inside, and the cooling flow channel has a spiral structure that is connected to the cooling circulation pipe.

[0013] Preferably, the docking mechanism includes a bottom support ring located below the cooling pressure plate and distributed vertically coaxially. The top end of the lifting slide rod on the outer side of the bottom support ring is slidably installed inside the lifting cylinder. The lifting slide rod and the bottom support ring are raised and lowered by an external oil pump connected to the lifting cylinder.

[0014] Preferably, the outer diameter of the wafer transfer disk included in the docking mechanism is larger than the inner diameter of the bottom support ring, so that the bottom support ring moves upward to contact the wafer transfer disk and drives the wafer transfer disk to rise from the internal wafer body, thereby achieving disengagement from the conveying fork.

[0015] Preferably, the conveying mechanism includes a dividing vertical plate, which is fixedly installed below the right end of the bearing platform. The dividing vertical plate has a transmission window inside, and a sealing partition is slidably installed inside the transmission window. The sealing partition and the upper and lower sides of the transmission window are both inclined and fit together.

[0016] Preferably, the conveying mechanism includes a transmission slide plate, which is located on the lower left side of the dividing vertical plate. The transmission slide plate is slidably connected to the sealing partition through elastic telescopic rods at the four internal corners, and the outer end of the transmission slide plate is threadedly connected to the lower end of the lifting screw.

[0017] Preferably, the conveying mechanism includes a lifting screw that is rotatably mounted on the left side of the partition vertical plate via a bearing, and the upper end of the lifting screw is provided with a spiral guide groove. The lifting screw is spirally connected to the right end of the lifting bracket via the spiral guide groove, and the left end of the lifting bracket is fixedly connected to the upper end of the lifting slide rod, so that the lifting bracket slides on the upper end of the lifting screw and the lifting screw is rotated by the spiral guide groove.

[0018] Preferably, the conveying mechanism includes a spraying rotating rod, which is rotatably mounted above the right-side transmission window of the partition vertical plate via a torsion spring. Furthermore, the front and rear sides of the partition vertical plate are rotatably provided with transmission shafts via bearings, and the transmission shafts are respectively meshed with the lifting screw and the outside of the transmission shafts via bevel gear sets at their outer ends.

[0019] The conveying mechanism includes spray dust removal nozzles that are fixedly installed at equal intervals at the bottom of the spraying rotating rod. The spray dust removal nozzles are connected to the conveying hose provided at the upper end of the spraying rotating rod. The lower end of the conveying hose is connected to the inner side of the bottom of the spraying tank. The spraying tank is fixedly installed on the front and rear sides of the lower part of the partition vertical plate. At the same time, a one-way air inlet valve is provided at the inner end of the spraying tank.

[0020] Preferably, the conveying mechanism includes a transmission roller with bearings rotatably disposed on the front and rear sides inside the transmission window, and a transmission gear is fixedly installed at the bottom end of the transmission roller, and a transmission rack is meshed with the left side of the transmission gear, and the transmission rack is slidably installed on the front and rear sides inside the partition vertical plate, while a sealing plug rod is fixedly installed at the lower end of the transmission rack.

[0021] Preferably, the sealing plug rod of the conveying mechanism is slidably installed inside the spray tank at one end away from the transmission rack, and a sealing cover is fixedly installed at the outer end of the spray tank for cleaning particulate dust and debris when the conveying fork drives the wafer body through the separator plate.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows: The conveying and supporting mechanism of this Loadlock type ultra-high vacuum evaporation machine, when the wafer body is conveyed by the conveying fork, passes through the internal partition vertical plates of the evaporation machine to clean dust and debris, preventing residue from affecting the evaporation effect. Furthermore, through the bottom support ring and cooling pressure plate, precise temperature control is achieved when coating low-melting-point materials, preventing the material from overheating and melting, thus avoiding dripping. The specific details are as follows:

[0023] 1. The wafer body is transferred via a wafer transfer tray and transported by a conveyor fork. The lifting cylinder above the carrying platform drives the lifting bracket and lifting slide to move, and then drives the bottom support ring away from the cooling pressure plate and down to load the wafer body.

[0024] Furthermore, the descending lifting bracket drives the lifting screw to rotate via the spiral guide groove. The lifting screw drives the threaded transmission slide plate to slide downwards, and at the same time connects with the sealing partition plate connected to the rotating slide plate via the elastic telescopic rod. After being squeezed, they descend synchronously to open the transmission window opened in the partition vertical plate so that the wafer body can enter the evaporation machine from the transition cavity.

[0025] 2. After the conveyor fork pulls the wafer body into the conveyor window, its side contacts the drive roller, which drives the drive gear to rotate. The meshing drive rack drives the sealing plug rod to move inside the spray tank, thereby compressing the air between the spray tank and the sealing cover so that it can be sprayed out through the through-connected elastic hose and the spray dust removal nozzle to clean the moving wafer body.

[0026] Furthermore, the lifting screw drives the transmission shaft to rotate, and the bevel gear group drives the spraying rod to rotate. Then, the spraying rod drives the spraying dust removal nozzle below to flip, thereby cooperating with the moving wafer body to achieve a larger area of ​​cleaning and dust removal.

[0027] 3. The conveyor fork moves the wafer transfer tray and wafer body between the cooling pressure plate and the bottom support ring. Then, the bottom support ring rises and contacts the wafer transfer tray, causing it to rise again and disengage from the conveyor fork. This allows the conveyor fork to move to the right and reset. The bottom support ring then moves the wafer transfer tray and wafer body to the bottom of the cooling pressure plate to ensure precise temperature control when coating low-melting-point materials, preventing the material from overheating and melting, thus avoiding dripping. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0029] Figure 2 This is a schematic diagram showing the initial positions of the wafer transfer disk and the wafer body in this invention;

[0030] Figure 3 This is a schematic diagram of the structure after the bottom support ring of the present invention has descended;

[0031] Figure 4 For the present invention Figure 3 Enlarged structural diagram at point A in the middle;

[0032] Figure 5 This is a schematic diagram of the structure of the cooling channel in this invention;

[0033] Figure 6 This is a schematic diagram of the planar structure for installing the support platform of the present invention;

[0034] Figure 7 This is a three-dimensional structural schematic diagram of the conveying fork of the present invention;

[0035] Figure 8 For the present invention Figure 7 Enlarged structural diagram at point B;

[0036] Figure 9 This is a schematic diagram of the structure for mounting the transmission slide plate of the present invention;

[0037] Figure 10 This is a three-dimensional structural schematic diagram of the sealing partition of the present invention;

[0038] Figure 11 For the present invention Figure 10 Enlarged structural diagram at point C;

[0039] Figure 12 This is a structural schematic diagram of the cross-section of the spray tank body of the present invention.

[0040] In the diagram: 1. Support platform; 2. Cooling circulation pipe; 3. Lifting cylinder; 4. Bottom support ring; 5. Lifting slide bar; 6. Wafer transfer tray; 7. Cooling pressure plate; 8. Cooling channel; 9. Separating vertical plate; 10. Transfer window; 11. Sealing partition; 12. Transmission slide plate; 13. Elastic telescopic rod; 14. Lifting screw; 15. Spiral guide groove; 16. Lifting bracket; 17. Spraying rotating rod; 18. Transmission shaft; 19. Bevel gear set; 20. Spraying dust removal nozzle; 21. Conveying hose; 22. Spraying tank; 23. One-way air inlet valve; 24. Transmission roller; 25. Transmission gear; 26. Transmission rack; 27. Sealing plug rod; 28. Sealing cover; 29. ​​Wafer body; 30. Conveying fork. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Please see Figures 1-12 The present invention provides the following technical solution:

[0043] Example 1: In order to solve the problems existing in the transport of wafers in the current vapor deposition machine, this example discloses the following technical solution: a transport support mechanism for a Loadlock type ultra-high vacuum vapor deposition machine, including a support platform 1 installed on the upper part of the vapor deposition machine, a transport mechanism is provided on the right side of the support platform 1, and the transport mechanism includes a transport fork 30, and the left end of the transport fork 30 is in the form of an arc-shaped fork structure to support the outside of the wafer transfer tray 6 for transport.

[0044] A lifting cylinder 3 is provided on the upper left side of the support platform 1, and a docking mechanism is provided below the support platform 1. The docking mechanism includes a bottom support ring 4, and the side of the bottom support ring 4 is fixedly connected to the bottom end of the lifting slide rod 5. The bottom support ring 4 is used to contact the bottom end of the wafer transfer tray 6, and the wafer body 29 is placed inside the wafer transfer tray 6. The bottom support ring 4 included in the docking mechanism is located below the cooling pressure plate 7 and is distributed vertically and coaxially. The top end of the lifting slide rod 5 on the outer side of the bottom support ring 4 is slidably installed inside the lifting cylinder 3. The lifting slide rod 5 and the bottom support ring 4 are driven to rise and fall by an external oil pump connected to the lifting cylinder 3.

[0045] like Figures 3-4 As shown, the conveying fork 30 on the right side of the carrying platform 1 is connected to the telescopic hydraulic cylinder. At the same time, the conveying fork 30 is inserted into the wafer transfer tray 6 through the open end on the left side, while the wafer body 29 is placed inside the wafer transfer tray 6 so that it can be moved and conveyed from right to left by the conveying fork 30 and simultaneously approach the bottom of the carrying platform 1 inside the vapor deposition machine.

[0046] Furthermore, the lifting cylinder 3 installed on the left side of the top surface of the bearing platform 1 operates, and its lower telescopic part drives the lifting bracket 16 and the left lifting slide 5 to move downward synchronously. The middle part of the lifting slide 5 passes through the side of the cooling pressure plate 7 to achieve positioning, and drives the bottom support ring 4 fixedly connected to the bottom to descend, thereby loading the wafer body 29 conveyed by the conveying fork 30.

[0047] Example 2: To solve the problems existing in the wafer transport of the current vapor deposition machine, this example discloses the following technical solution: The transport mechanism includes a dividing vertical plate 9, which is fixedly installed on the lower right side of the support platform 1. The dividing vertical plate 9 has a transport window 10 inside, and a sealing partition 11 is slidably installed inside the transport window 10. The sealing partition 11 and the upper and lower sides of the transport window 10 are inclined and fit together. The transport mechanism includes a transmission slide plate 12, which is located on the lower left side of the dividing vertical plate 9. The transmission slide plate 12 is slidably connected to the sealing partition 11 through elastic telescopic rods 13 at the four corners inside. The outer end of the transmission slide plate 12 is threaded through and connected to the lower end of the lifting screw 14.

[0048] The conveying mechanism includes a lifting screw 14 which is rotatably mounted on the left side of the partition vertical plate 9 via a bearing. The upper end of the lifting screw 14 is provided with a spiral guide groove 15, and the lifting screw 14 is spirally connected to the right end of the lifting bracket 16 through the spiral guide groove 15. The left end of the lifting bracket 16 is fixedly connected to the upper end of the lifting slide bar 5, so that the lifting bracket 16 slides on the upper end of the lifting screw 14 and the lifting screw 14 is driven to rotate by the spiral guide groove 15.

[0049] like Figure 9 As shown, during the descent of the lifting support 16 below the support platform 1, its right end is spirally connected to the outer wall of the spiral guide groove 15 opened at the upper end of the lifting screw 14, thereby driving the lifting screw 14 to rotate during descent. The transmission slide plate 12, which is threadedly connected to the lifting screw 14, is limited by the partition vertical plate 9, so that the lifting screw 14 drives the transmission slide plate 12 and the sealing partition plate 11 on its right side to move downward synchronously. The sealing partition plate 11 and the transmission window 10 are connected by an inclined surface, thereby squeezing the sealing partition plate 11 to move to the left and compressing the elastic telescopic rod 13 during descent, so that the sealing partition plate 11 approaches the transmission slide plate 12 and descends downward, so as to open the transmission window 10 and transport the wafer body 29.

[0050] Example 3: To solve the problems existing in the wafer transport of the existing vapor deposition machine, this example discloses the following technical solution: The transport mechanism includes a spraying rotating rod 17, which is rotatably mounted above the right-side transport window 10 of the partition vertical plate 9 via a torsion spring. The partition vertical plate 9 has a transmission shaft 18 rotatably mounted on both its front and rear sides via bearings. The transmission shaft 18 is connected to the lifting screw 14 and the outside of the transmission shaft 18 via a bevel gear set 19 at its outer end. The transport mechanism includes spraying dust removal nozzles 20 fixedly mounted at equal intervals at the bottom of the spraying rotating rod 17. The spraying dust removal nozzles 20 are connected to the transport hose 21 at the upper end of the spraying rotating rod 17. The lower end of the transport hose 21 is connected to the inner bottom of the spraying tank 22. The spraying tank 22 is fixedly mounted on the front and rear sides of the lower part of the partition vertical plate 9. A one-way air inlet valve 23 is provided at the inner end of the spraying tank 22.

[0051] The conveying mechanism includes a transmission roller 24 with bearings rotatably mounted on both the front and rear sides inside the transmission window 10. A transmission gear 25 is fixedly installed at the bottom end of the transmission roller 24, and a transmission rack 26 is meshed with the left side of the transmission gear 25. The transmission rack 26 is slidably mounted on both the front and rear sides inside the partition vertical plate 9. A sealing plug rod 27 is fixedly installed at the lower end of the transmission rack 26. The end of the sealing plug rod 27 in the conveying mechanism that is away from the transmission rack 26 is slidably mounted inside the spray tank 22, and a sealing cover 28 is fixedly installed at the outer end of the spray tank 22. This is used to clean particulate dust and debris when the conveying fork 30 drives the wafer body 29 through the partition vertical plate 9.

[0052] like Figure 8 , Figures 10-12 As shown, after the transfer window 10 inside the partition vertical plate 9 is opened, the transfer fork 30 moves into the transfer window 10 and then fits against the front and rear transmission rollers 24, driving the transmission rollers 24 and the transmission gear 25 at the bottom to rotate. This causes the transmission gear 25 to drive the meshing transmission rack 26 and the sealing plug rod 27 to move outward. The other end of the sealing plug rod 27 moves inside the spray tank 22 and changes the distance between it and the sealing cover 28, compressing and conveying the air between the sealing plug rod 27 and the sealing cover 28. The through-connected transfer hose 21 then delivers the air to the through-connected spray dust removal nozzle 20 and sprays it outward, thereby removing dust from the wafer body 29 carried by the transfer fork 30 when it moves, thus preventing the adhering dust and debris from affecting the subsequent evaporation effect.

[0053] Furthermore, the lifting screw 14 on the left side of the dividing vertical plate 9 drives the meshing transmission shaft 18 to rotate through the bevel gear group 19. The transmission shaft 18, through the bevel gear group 19 at the other end, drives the meshing spraying rod 17 to rotate. In turn, the spraying rod 17 drives the bottom spraying dust removal nozzle 20 to rotate, which, together with the moving wafer body 29, cleans the dust attached to its surface, while also expanding the cleaning range.

[0054] A cooling circulation pipe 2 is fixedly installed in the upper middle part of the support platform 1; the docking mechanism includes a cooling pressure plate 7, which is fixedly installed at the bottom end of the cooling circulation pipe 2, and a cooling flow channel 8 is opened inside the cooling pressure plate 7, and the cooling flow channel 8 is spirally connected to the cooling circulation pipe 2; the outer diameter of the wafer transfer disk 6 included in the docking mechanism is larger than the inner diameter of the bottom support ring 4, so that the bottom support ring 4 moves upward to contact the wafer transfer disk 6, and drives the wafer transfer disk 6 and the internal wafer body 29 to rise, so as to achieve disengagement from the conveying fork 30.

[0055] like Figure 1 , Figure 3 , Figure 6As shown, after dust removal, the wafer transfer tray 6 and wafer body 29 conveyed by the conveyor fork 30 pass through the partition vertical plate 9 and move to the space between the bottom support ring 4 and the cooling pressure plate 7 below the support platform 1. Then, the lifting cylinder 3 installed above the support platform 1 drives the lifting slide 5 at the bottom and the bottom support ring 4 to move upward slightly, so that the bottom support ring 4 fits against the bottom end of the wafer transfer tray 6, and the wafer transfer tray 6 and the conveyor fork 30 are separated from each other, without causing the transmission slide plate 12 inside the partition vertical plate 9 and the telescopic part at the right end of the conveyor fork 30 to obstruct each other.

[0056] Furthermore, the conveyor fork 30 moves to the right to the outside of the partition vertical plate 9, and drives the conveyor window 10 to be closed by the sealing partition 11. Then, the vacuum is extracted inside the vapor deposition machine, and the bottom support ring 4 continues to move upward, driving the upper wafer transfer plate 6 and the wafer body 29 to rise and adhere to the bottom surface of the cooling pressure plate 7, thereby realizing the vapor deposition operation of the wafer body 29. After vapor deposition, the cooling medium is transported through the cooling circulation pipe 2 and circulated through the internal cooling channel 8 of the through-connected cooling pressure plate 7, so as to achieve precise temperature control when the low melting point wafer body 29 is vapor deposited, so that the low melting point wafer body 29 does not overheat and melt, resulting in dripping.

[0057] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A conveying support mechanism of a loadlock type ultra-high vacuum evaporation machine, comprising a bearing platform (1) installed above the inside of the evaporation machine, and a cooling circulation pipe (2) is fixedly installed at the upper middle part of the bearing platform (1), and a lifting oil cylinder (3) is arranged at the upper left side of the bearing platform (1); characterized in that Further comprising: A docking mechanism is arranged below the bearing platform (1), and the docking mechanism comprises a bottom supporting ring (4), and the side edge of the bottom supporting ring (4) is fixedly connected to the bottom end of a lifting slide rod (5); The bottom supporting ring (4) is used to contact the bottom end of a wafer transfer disc (6), and a wafer body (29) is placed inside the wafer transfer disc (6); A conveying mechanism is arranged at the right side of the bearing platform (1), and the conveying mechanism comprises a conveying fork rod (30), and the left end of the conveying fork rod (30) is in a circular arc fork structure and is lifted outside the wafer transfer disc (6) for conveying; The docking mechanism comprises a cooling pressure disc (7), the cooling pressure disc (7) is fixedly installed at the bottom end of the cooling circulation pipe (2), a cooling flow channel (8) is formed in the inside of the cooling pressure disc (7), and the cooling flow channel (8) is in a spiral structure and is connected through between the cooling circulation pipe (2); The conveying mechanism comprises a separation vertical plate (9), the separation vertical plate (9) is fixedly installed below the right end of the bearing platform (1), a transmission window (10) is formed in the inside of the separation vertical plate (9), a sealing partition plate (11) is slidingly installed in the inside of the transmission window (10), and the sealing partition plate (11) and the transmission window (10) are in a bevel structure and are mutually adhered on the upper and lower sides; A lifting lead screw (14) of the conveying mechanism is rotatably installed at the left side of the separation vertical plate (9), a spiral guide groove (15) is formed at the upper end of the lifting lead screw (14), the lifting lead screw (14) is screw-connected with the right end of a lifting support (16) through the spiral guide groove (15), and the left end of the lifting support (16) is fixedly connected to the upper end of the lifting slide rod (5), so that the lifting support (16) slides at the upper end of the lifting lead screw (14) and drives the lifting lead screw (14) to rotate through the spiral guide groove (15); The conveying mechanism comprises transmission rotating rollers (24) rotatably arranged inside the transmission window (10) at the front and back sides, a transmission gear (25) is fixedly installed at the bottom end of the transmission rotating rollers (24), a transmission rack (26) is meshingly connected at the left side of the transmission gear (25), and the transmission rack (26) is slidingly installed at the inside of the separation vertical plate (9) at the front and back sides, and a sealing plug rod (27) is fixedly arranged at the lower end of the transmission rack (26); The sealing plug rod (27) of the conveying mechanism is slidingly installed at the inside of a spraying tank body (22) away from the transmission rack (26), and a sealing cover body (28) is fixedly installed at the outer end of the spraying tank body (22), so as to clean the particle dust and fragments when the wafer body (29) is driven by the conveying fork rod (30) to pass through the separation vertical plate (9).

2. The transfer support mechanism of a Loadlock type ultrahigh vacuum deposition machine according to claim 1, wherein: The docking mechanism comprises a bottom supporting carrier ring (4) located below the cooling pressure plate (7) and arranged in vertical coaxial distribution, and the top end of the outer lifting slide rod (5) of the bottom supporting carrier ring (4) is slidingly installed in the inner part of the lifting oil cylinder (3), and the lifting slide rod (5) and the bottom supporting carrier ring (4) are lifted by the lifting oil cylinder (3) connected with an oil pump.

3. The transfer support mechanism of a Loadlock type ultrahigh vacuum deposition machine according to claim 2, wherein: The wafer transfer plate (6) of the docking mechanism has an outer diameter greater than the inner diameter of the bottom supporting carrier ring (4), so that the bottom supporting carrier ring (4) moves upward to contact the wafer transfer plate (6) and drives the wafer transfer plate (6) and the wafer body (29) inside to rise, so as to realize the disengagement from the conveying fork rod (30).

4. The transfer support mechanism of a Loadlock type ultrahigh vacuum deposition machine according to claim 3, wherein: The conveying mechanism comprises a transmission slide plate (12) arranged below the left side of the partition vertical plate (9), and the transmission slide plate (12) is slidingly connected between the elastic expansion rod (13) and the sealing partition plate (11) through the four corners inside, and the outer end of the transmission slide plate (12) is screwed through and connected to the lower end of the lifting lead screw (14).

5. The transfer support mechanism of a Loadlock type ultrahigh vacuum deposition machine according to claim 1, wherein: The conveying mechanism comprises a spraying and conveying rotary rod (17) which is rotatably installed above the transmission opening window (10) on the right side of the partition vertical plate (9) through a torsion spring, and the partition vertical plate (9) is rotatably provided with a transmission shaft (18) through bearings on the front and back sides inside, and the transmission shaft (18) is engaged with the outer part of the lifting lead screw (14) and the transmission shaft (18) through the outer end bevel gear set (19); The conveying mechanism comprises a spraying and dust removal nozzle (20) fixedly installed at the bottom end of the spraying and conveying rotary rod (17), and the spraying and dust removal nozzle (20) is connected through the conveying hose (21) arranged at the upper end of the spraying and conveying rotary rod (17), and the lower end of the conveying hose (21) is connected through the bottom end inside of the spraying tank (22), and the spraying tank (22) is fixedly installed on the front and back sides inside below the partition vertical plate (9), and the inner end of the spraying tank (22) is provided with a one-way air inlet valve (23).

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