Chip loss test method and chip loss test apparatus
By testing the coupling of fiber arrays with silicon photonic chips and calculating losses using calibration data, the problem of inaccurate silicon photonic chip loss measurement in traditional methods is solved. This achieves efficient and accurate chip quality assessment, simplifies testing equipment, reduces costs, and adapts to large-scale production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XPHOR LTD
- Filing Date
- 2025-12-31
- Publication Date
- 2026-04-28
AI Technical Summary
Traditional chip testing methods are difficult to accurately measure the loss of each channel of silicon photonics chips, resulting in inaccurate judgment of chip quality, affecting the performance of optical communication systems. In addition, the testing equipment is complex and costly, making it difficult to meet the needs of large-scale production.
By coupling the test fiber array to the transmission waveguide of the chip under test, and using calibration data to calculate the loss of each channel, a simple chip loss testing device, including a test fiber array, a laser, and an optical power testing device, can be used to achieve accurate loss measurement.
It enables precise measurement of the loss of each channel in silicon photonics chips, improves the accuracy of quality judgment, simplifies testing equipment, increases testing efficiency, reduces costs, and adapts to the needs of large-scale production.
Smart Images
Figure CN121431027B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip testing technology, and more specifically, to a chip loss testing method and a chip loss testing apparatus. Background Technology
[0002] In the production and testing phase of silicon photonics chips, accurately assessing the loss characteristics of each channel and the differences between channels is a crucial prerequisite for ensuring the quality of subsequent optical module packaging and improving the overall performance of optical communication systems. Traditional chip testing methods struggle to measure the link loss of each channel, leading to significant errors in the estimation of channel losses for silicon photonics chips. This fails to accurately reflect the actual performance of each channel, making it difficult to reliably assess the differences between channels, which greatly affects the accuracy of chip quality assessment. Summary of the Invention
[0003] The purpose of this application is to provide a chip loss testing method and a chip loss testing device, which can more accurately measure the loss of each channel of the chip.
[0004] In a first aspect, this application provides a chip loss testing method, comprising: coupling a first optical fiber in a test optical fiber array to an input waveguide of a chip under test; coupling a second optical fiber in the test optical fiber array to an output waveguide of the chip under test, wherein the number of the second optical fibers is not less than the number of output waveguides of the chip under test; testing a test data set obtained by inputting a first laser through the first optical fiber, passing through the input waveguide and the output waveguide of the chip under test, and outputting from the second optical fiber, wherein the number of test data in the test data set is the same as the number of output waveguides of the chip under test; calculating the loss data of each channel of the chip under test based on the test data set and calibration data matched by the test optical fiber array, wherein the input waveguide of the chip under test and any one of the output waveguides of the chip under test form a channel.
[0005] In the above implementation method, a calibrated test fiber array can be used to couple the fiber of the test fiber array with the transmission waveguide of the chip under test, thereby simulating the state when the array fiber is coupled to the chip. This allows for the measurement of the loss of the chip under test, which can accurately reflect the actual performance of each channel of the chip under test, thereby enabling reliable evaluation of the differences between channels and improving the accuracy of the quality judgment of the chip under test.
[0006] In an optional implementation, the calibration data for the test fiber array matching is determined by testing the calibration data for the test fiber array matching while the fiber of the calibration fiber array is coupled to the second fiber of the test fiber array.
[0007] In the above implementation method, the relevant data of the test fiber array can be calibrated in advance, thereby reducing the actions and calculations required for testing the chip under test and improving the testing efficiency of the chip under test.
[0008] In an optional embodiment, the calibration data for the test fiber array matching includes a first photocurrent of the first fiber of the test fiber array, a second photocurrent of the third fiber of the calibration fiber array, and output data of each second fiber of the test fiber array; the step of testing the calibration data for the test fiber array matching when the fiber of the calibration fiber array is coupled to the second fiber of the test fiber array includes: inputting the first laser through the first fiber and measuring the first photocurrent of the first fiber; inputting the second laser through the third fiber of the calibration fiber array and measuring the second photocurrent of the third fiber; and coupling the third fiber of the calibration fiber array to each second fiber of the test fiber array to measure the output data of each second fiber.
[0009] In the above implementation, the first and second photocurrents can be used to calculate the input optical power achieved through the test fiber array. Based on the output data of the second fiber, the loss caused by the fiber array can be determined. Based on these calibration data, the calculations performed on the chip under test based on the test fiber array can characterize only the loss of the chip under test, thereby making the measured loss more accurate.
[0010] In an optional embodiment, the step of coupling the third fiber of the calibration fiber array to each of the second fibers of the test fiber array to measure the output data of each of the second fibers includes: sequentially coupling the third fiber of the calibration fiber array to each of the second fibers of the test fiber array; inputting the second laser through the third fiber of the calibration fiber array, outputting it through the second fiber, and measuring the output data of the second fiber.
[0011] In the above implementation, a calibration fiber array is introduced. Based on this calibration fiber array, the characteristics of the test fiber array can be presented more scientifically. Thus, based on the more accurate calibration of the test fiber array, the testing of the chip under test based on the test fiber array can also be more accurate.
[0012] In an optional implementation, the step of calculating the loss data of each channel of the chip under test based on the test data set and the calibration data matched by the test fiber array includes: determining the input optical power based on the calibration data matched by the test fiber array; and determining the loss data of each channel of the chip under test based on the input optical power and the test data set.
[0013] In an optional implementation, the calibration data for the test fiber array matching includes the output optical power of each second fiber of the test fiber array; determining the loss data of each channel of the chip under test based on the input optical power and the test data set includes: determining the loss data of each channel of the chip under test based on the input optical power, the output optical power of each second fiber of the test fiber array, and the test data set.
[0014] In an optional implementation, the calibration data for matching the test fiber array includes a first photocurrent of the first fiber of the test fiber array and a second photocurrent of the third fiber of the calibration fiber array; determining the input optical power based on the calibration data for matching the test fiber array includes: calculating the input optical power based on the first photocurrent of the first fiber of the test fiber array, the second photocurrent of the third fiber of the calibration fiber array, and the responsivity of the device testing the first photocurrent and the second photocurrent, wherein the responsivity of the device testing the first photocurrent and the second photocurrent is a preset known quantity.
[0015] In an optional implementation, the formula used to calculate the loss of each channel of the chip under test includes: - ;in, Indicates the first photocurrent; Indicates the second photocurrent; This represents the loss of the nth channel of the chip under test; This represents the output data of the nth second fiber of the test fiber array; R represents the test data of the nth output waveguide of the chip under test; R represents the responsivity of the device testing the output of the first fiber of the test fiber array.
[0016] In the above implementation method, based on the above formula, the influence of the responsivity of the device testing the fiber array and the output of the first fiber of the test fiber array is included in the loss calculation process, which can make the determined loss more accurate.
[0017] Secondly, this application provides a chip loss testing device, comprising: a test fiber array, the test fiber array including at least a first fiber and one or more second fibers, the first fiber being used for coupling with the input waveguide of the chip under test, and each of the second fibers being coupled one-to-one with the output waveguide of the chip under test; a first laser connected to the first fiber for outputting laser light; and a first optical power testing device for acquiring the output data of the second fibers, the output data of the second fibers being used to determine the loss data of the chip under test.
[0018] In an optional implementation, the method further includes: calibrating an optical fiber array for optical fiber coupling of the test optical fiber array and measuring calibration data matching the test optical fiber array.
[0019] In an optional embodiment, the calibration fiber array includes a third fiber for sequentially connecting with a second fiber of the test fiber array to test calibration data matching the test fiber array.
[0020] In an optional embodiment, the device further includes: a second optical power testing device and a voltage source; the second optical power testing device is used to couple with the first optical fiber of the test optical fiber array to measure the output of the first optical fiber; the voltage source is connected to the second optical power testing device to determine the photocurrent output by the first optical fiber. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram illustrating the interaction between a chip loss testing device and a chip under test, as provided in an embodiment of this application.
[0023] Figure 2 A schematic diagram of the equipment used for calibration data matching the calibration test fiber array provided in the embodiments of this application;
[0024] Figure 3 Another schematic diagram of the device used for calibration data of calibration test fiber array matching provided in the embodiments of this application;
[0025] Figure 4 A schematic diagram of the device used for output data of the third fiber of the calibration fiber array provided in the embodiments of this application;
[0026] Figure 5 A flowchart of the chip loss testing method provided in the embodiments of this application;
[0027] Figure 6 This is a partial flowchart of the chip loss testing method provided in an embodiment of this application.
[0028] Icons: 110 - Test fiber array; 111 - First fiber; 112 - Second fiber; 120 - First laser; 130 - First optical power test device; 140 - Calibration fiber array; 141 - Third fiber; 150 - Second optical power test device; 160 - Voltage source; 170 - Second laser; 210 - Chip under test; 211 - Input waveguide; 212 - Output waveguide. Detailed Implementation
[0029] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.
[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0031] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, the terms "first," "second," "third," "fourth," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. The term "comprising" will be used in the embodiments of this application to indicate the presence of a feature subsequently stated, but does not preclude the addition of other features.
[0032] In the production and testing phase of silicon photonics chips, accurately assessing the loss status of each channel and the differences between channels is a crucial prerequisite for ensuring the quality of subsequent optical module packaging and improving the overall performance of optical communication systems.
[0033] However, current testing and distribution methods for silicon photonic chips struggle to accurately measure the link loss of each channel when the chip is coupled to the array fiber. This leads to significant errors in the calculated channel losses, failing to accurately reflect the actual performance of each channel and consequently hindering reliable assessment of channel differences. This severely impacts the accuracy of chip quality assessment, potentially causing defective chips to enter the subsequent packaging stage, increasing the cost and risk of optical module production. Furthermore, testing silicon photonic chips requires multiple high-precision displacement stages for complex adjustments and calibrations. This not only increases the cost of testing equipment but also makes the testing process cumbersome and inefficient, hindering the rapid screening of large numbers of chips. This makes it difficult to meet the speed and efficiency requirements of large-scale silicon photonic chip production and to provide timely, accurate, and reliable data support for subsequent optical module packaging.
[0034] Based on the above research, this application provides a chip loss testing method and a chip loss testing device, which can test the loss of each channel of the chip under test by coupling the test fiber array with the transmission waveguide of the chip under test. This not only achieves accurate testing, but also simplifies the equipment required for testing.
[0035] like Figure 1 The diagram shown illustrates the interaction between a chip loss testing device and a chip under test, as provided in this embodiment. In this embodiment, the chip loss testing device includes a test fiber array 110, a first laser 120, and a first optical power testing device 130.
[0036] In this embodiment, the test fiber array 110 includes multiple optical fibers. Specifically, the test fiber array 110 includes at least a first optical fiber 111 and a second optical fiber 112.
[0037] The first fiber 111 of the test fiber array 110 can be coupled to the input waveguide 211 of the chip under test 210; the second fiber 112 of the test fiber array 110 can be coupled one-to-one to the output waveguide 212 of the chip under test 210.
[0038] Optionally, grating coupling can be used to couple the first fiber 111 of the test fiber array 110 to the input waveguide 211 of the chip under test 210. Alternatively, edge coupling can also be used to couple the first fiber 111 of the test fiber array 110 to the input waveguide 211 of the chip under test 210.
[0039] Optionally, grating coupling can be used to achieve one-to-one coupling between the second fiber 112 of the test fiber array 110 and the output waveguide 212 of the chip under test 210. Alternatively, edge coupling can also be used to achieve one-to-one coupling between the second fiber 112 of the test fiber array 110 and the output waveguide 212 of the chip under test 210.
[0040] The chip under test 210 can be a silicon photonics chip. The loop formed by the input waveguide 211 and any one of the output waveguides 212 of the silicon photonics chip can serve as a channel. Figure 1 The example shown illustrates that the chip under test 210 includes one input waveguide 211 and four output waveguides 212. In this example, the chip under test 210 can form four channels. Figure 1 The chip shown can be a DR4 silicon photonics chip.
[0041] In this embodiment, the number of second optical fibers 112 in the test fiber array 110 is not less than the number of output waveguides 212 of the chip under test 210. The number of second optical fibers 112 in the test fiber array 110 can be equal to the number of output waveguides 212 of the chip under test 210. Figure 1 In the example shown, the number of second optical fibers 112 in the test fiber array 110 and the number of output waveguides 212 in the chip under test 210 are both four. Of course, the number of output waveguides 212 may vary depending on the actual chip under test 210; for example, the number of output waveguides 212 in the chip under test 210 may also be eight.
[0042] The first laser 120 is connected to the first optical fiber 111. The first laser 120 can output laser light and transmit it to the first optical fiber 111.
[0043] The first optical power testing device 130 can be connected to each of the second optical fibers 112 of the test fiber array 110, and the first optical power testing device 130 can obtain the output data of each of the second optical fibers 112.
[0044] The output data of the second optical fiber 112 is used to determine the loss data of the chip under test 210.
[0045] The output data of the second optical fiber 112 may include the maximum optical power obtained after connecting to the chip under test 210.
[0046] The first fiber 111 of the test fiber array 110 is coupled to the input waveguide 211 of the chip under test 210, and each of the second fibers 112 of the test fiber array 110 is coupled to the output waveguide 212 of the chip under test 210. The bias voltage on the Mach-Zehnder modulator (MZM) of each channel of the chip under test 210 is adjusted so that the first optical power testing device 130 measures the maximum optical power of each of the second fibers 112 of the test fiber array 110.
[0047] The first optical power testing device 130 can be any device capable of measuring optical power.
[0048] In this embodiment, in order to accurately test the loss data of the chip under test 210, the relevant data of the test fiber array 110 can be calibrated in advance. Based on this, the chip loss testing device may also include the test fiber array 110 for auxiliary calibration.
[0049] The calibration fiber array 140 is used to couple the fiber of the test fiber array 110 and measure the calibration data of the test fiber array 110.
[0050] The calibration fiber array 140 includes a third fiber 141, which is sequentially connected to the second fiber 112 of the test fiber array 110 to test the calibration data of the test fiber array 110. Figure 2 As shown in the figure, a schematic diagram of the equipment used to calibrate the test fiber array 110 is presented. Figure 2 The diagram shows a test fiber array 110, a calibration fiber array 140, a second laser 170 connected to a third fiber 141 in the calibration fiber array 140, and a first optical power testing device 130 for connection to a second fiber 112 in the test fiber array 110.
[0051] The calibration data for the test fiber array 110 may include the output optical power of each second fiber 112 of the test fiber array 110.
[0052] For example, the second laser 170 is connected to the third fiber 141 in the calibration fiber array 140, and the first second fiber 112 in the test fiber array 110 is coupled to the third fiber 141 in the calibration fiber array 140. The output optical power P1 of the first second fiber 112 of the chip under test 210 is measured by the first optical power testing device 130. Using the same method, the output optical power P1 of the other second fibers 112 of the chip under test 210 can be measured sequentially. i The value of i is no greater than the number of second optical fibers 112.
[0053] Optionally, to improve the efficiency of chip loss testing and to provide a scenario for chip loss testing, multiple test fiber arrays 110 can be pre-calibrated. The number of second fibers included in each test fiber array 110 can be different. For example, besides... Figure 1 The test fiber array 110 shown, which includes four second optical fibers, can also be pre-calibrated to include eight second optical fibers. For example, when testing a DR4 silicon photonic chip, the test fiber array 110 with four second optical fibers can be used; when testing a DR8 silicon photonic chip, the test fiber array 110 with eight second optical fibers can be used.
[0054] By pre-calibrating the test fiber array, more accurate and simpler testing of silicon photonic chips can be achieved.
[0055] In this embodiment, the chip loss testing device may further include: a second optical power testing device 150 and a voltage source 160.
[0056] The second optical power testing device 150 is used to couple with the first optical fiber 111 of the test optical fiber array 110 to measure the output of the first optical fiber 111.
[0057] The second optical power testing device 150 can be any device capable of measuring optical power.
[0058] The voltage source 160 is connected to the second optical power testing device 150 to determine the photocurrent output by the first optical fiber 111.
[0059] The calibration data of the test fiber array 110 may include the first photocurrent output by the first fiber 111 of the test fiber array 110.
[0060] like Figure 3 , Figure 3 The diagram shows a schematic of the equipment used to calibrate the test fiber array 110. The diagram shows the test fiber array 110, a first laser 120 connected to a first fiber 111 of the test fiber array 110, a second optical power test device 150 coupled to the first fiber 111, and a voltage source 160 connected to the second optical power test device 150.
[0061] After the first laser 120 is working, a laser signal can be input to the first optical fiber 111. In this case, the second optical power testing device 150 can measure the signal output by the first optical fiber 111, and the voltage source 160 can further determine the first photocurrent output by the first optical fiber 111 of the test fiber array 110.
[0062] In this embodiment, as Figure 4 As shown, Figure 4 The diagram shows a schematic of the equipment used to calibrate the output data of the third fiber 141 of the calibration fiber array 140. The diagram shows the calibration fiber array 140, a second laser 170 connected to the third fiber 141 of the calibration fiber array 140, a second optical power test device 150 coupled to the third fiber 141, and a voltage source 160 connected to the second optical power test device 150.
[0063] After the second laser 170 is working, a laser signal can be input to the third optical fiber 141. In this case, the second optical power testing device 150 can measure the signal output by the third optical fiber 141, and the voltage source 160 can further determine the second photocurrent output by the third optical fiber 141 of the test fiber array 110.
[0064] The chip loss testing device provided based on the above implementation method can detect the loss of the chip under test 210 without the need for multiple high-precision displacement stages to perform complex adjustment and calibration operations.
[0065] Please see Figure 5 , Figure 5 This application also provides a flowchart of a chip loss testing method. The chip loss testing method provided in this application can be applied to a chip loss testing device, which can execute each step of the chip loss testing method. The following will describe... Figure 5 The specific process shown will be explained in detail.
[0066] Step 310: Couple the first fiber in the test fiber array to the input waveguide of the chip under test.
[0067] Coupled with the first fiber in the test fiber array to the input waveguide of the chip under test, it can be represented as guiding the first fiber into the input waveguide of the chip under test.
[0068] Optionally, step 310 can achieve coupling between the first optical fiber in the test fiber array and the input waveguide of the chip under test through grating coupling.
[0069] Step 320: Couple the second optical fiber in the test fiber array to the output waveguide of the chip under test.
[0070] The number of second optical fibers is not less than the number of output waveguides of the chip under test. Alternatively, the number of second optical fibers can be equal to the number of output waveguides of the chip under test.
[0071] Couple the second fiber in the test fiber array to the output waveguide of the chip under test (DUT) can mean either guiding the second fiber into the output waveguide of the DUT, or guiding the output waveguide of the DUT into the second fiber.
[0072] Optionally, step 320 can achieve coupling between the second optical fiber in the test fiber array and the output waveguide of the chip under test through grating coupling.
[0073] In this embodiment, steps 310 and 320 described above can be pre-coupling actions during the loss testing of the chip under test. After completing steps 310 and 320, the test fiber array can then perform loss testing on the chip under test.
[0074] Step 330: The test data set is obtained by inputting the first laser into the first optical fiber, passing through the input waveguide and output waveguide of the chip under test, and outputting through the second optical fiber.
[0075] The number of test data in the test data set is the same as the number of output waveguides of the chip under test.
[0076] In this embodiment, after completing steps 310 and 320, the first laser can start emitting a laser signal. The laser signal can be input into the first optical fiber, pass through the input waveguide of the chip under test, the output waveguide of the chip under test, and the second optical fiber in sequence, and finally be output from the second optical fiber.
[0077] In this embodiment, during the execution of step 330, the bias voltage on the Mach-Zehnder modulator (MZM) of each channel of the chip under test can be adjusted, and the second optical fiber outputs the maximum optical power, so that the first optical power testing device can also measure the maximum optical power of each second optical fiber of the test fiber array.
[0078] The maximum optical power of the second optical fiber can be used as the test data set output from the second optical fiber. This test data set can then be used to calculate the loss of the chip under test.
[0079] Step 340: Calculate the loss data for each channel of the chip under test based on the test data set and the calibration data of the test fiber array matching.
[0080] In this configuration, the input waveguide of the chip under test (DUT) and any one of the output waveguides of the DUT form a channel.
[0081] The calibration data for testing fiber array matching can include calibration data for calibrating the test fiber array, or calibration data for calibrating the calibration fiber array used to calibrate the test fiber array.
[0082] To more intuitively present the actual performance of the chip under test, the loss difference between channels can also be calculated based on the loss data of each channel.
[0083] For example, the difference in loss data for each channel can be calculated to characterize the loss differences between channels.
[0084] Alternatively, the performance of the chip under test can be analyzed directly using the loss data of each channel, or the performance of the chip under test can be analyzed based on the loss differences between the channels.
[0085] The above method uses only one test fiber array to measure the loss of the chip under test, and the chip loss can be measured more simply and accurately based on this test fiber array. From the perspective of the equipment required for testing, it achieves simplicity in testing equipment, and from the perspective of the calculation logic required for testing, it is also relatively simple.
[0086] In this embodiment, step 340 may include steps 341 and 342.
[0087] Step 341: Determine the input optical power based on the calibration data of the test fiber array matching.
[0088] Step 342: Based on the input optical power and the test data set, determine the loss data of each channel of the chip under test.
[0089] For example, calibration data for testing fiber array matching may include the output optical power of each second fiber in the test fiber array.
[0090] For example, the output optical power of each second fiber of the test fiber array can be used to represent the loss that the test fiber array itself may cause.
[0091] Step 342 above may include: determining the loss data of each channel of the chip under test based on the input optical power, the output optical power of each second fiber of the test fiber array, and the test data set.
[0092] For example, the calibration data for testing fiber array matching includes a first photocurrent of the first fiber of the test fiber array and a second photocurrent of the third fiber of the calibration fiber array.
[0093] Step 341 above may include: calculating the input optical power based on the first photocurrent of the first fiber of the test fiber array, the second photocurrent of the third fiber of the calibration fiber array, and the responsivity of the device testing the first and second photocurrents.
[0094] In this embodiment, the responsivity of the device used to test the first photocurrent and the second photocurrent is a preset known quantity. The first photocurrent and the second photocurrent can be obtained by the second optical power testing device 150.
[0095] Optionally, the formulas used to calculate the loss of each channel of the chip under test include:
[0096] ;
[0097] in, Indicates the first photocurrent; Indicates the second photocurrent; This represents the loss of the nth channel of the chip under test; This represents the output data of the nth second fiber in the test fiber array; This represents the test data for the nth output waveguide of the chip under test; R represents the responsivity of the device testing the output of the first fiber of the test fiber array. In other words, R can be understood as representing the responsivity of the second optical power testing device.
[0098] Based on the above calculation formula, the input optical power of the test fiber array, the responsivity of the second optical power test device, and the influence of the output optical power of each second fiber of the test fiber array are all included in the loss calculation process, so that the calculated loss values of each channel of the chip under test can more accurately represent the loss of the chip under test.
[0099] To more accurately measure the loss of the chip under test, the test fiber array can be calibrated before measuring the chip under test.
[0100] In one optional implementation, the calibration data for testing fiber array matching is determined by testing the calibration data for testing fiber array matching while the fiber of the calibration fiber array is coupled to the second fiber of the test fiber array.
[0101] In this embodiment, the calibration data may include the first photocurrent of the first fiber of the test fiber array, the second photocurrent of the third fiber of the calibration fiber array, and the output data of each second fiber of the test fiber array.
[0102] like Figure 6 As shown, in the case where the optical fiber of the calibration optical fiber array is coupled to the second optical fiber of the test optical fiber array, the calibration data for the matching of the test optical fiber array may include the following steps 410 to 430.
[0103] Step 410: The first laser is input through the first optical fiber, and the first photocurrent of the first optical fiber is measured.
[0104] Optionally, step 410 can be implemented in the same way as... Figure 3 This is achieved through illustrations and related descriptions. For details on the implementation of step 410, please refer to the foregoing embodiments. Figure 3 The illustrations and related information will not be repeated here.
[0105] Step 420: The second laser is input through the third fiber of the calibration fiber array, and the second photocurrent of the third fiber is measured.
[0106] Optionally, step 420 can be implemented in the same way as... Figure 4 This is achieved through illustrations and related descriptions. For details on the implementation of step 420, please refer to the foregoing embodiments. Figure 4 The illustrations and related information will not be repeated here.
[0107] Step 430: Couple the third fiber of the calibration fiber array with each of the second fibers of the test fiber array to measure the output data of each second fiber.
[0108] Optionally, step 430 above may include steps 431 and 432.
[0109] Step 431: The third fiber of the calibration fiber array is sequentially coupled to each of the second fibers of the test fiber array.
[0110] Step 432: The second laser is input through the third fiber of the calibration fiber array and output through the second fiber, and the output data of the second fiber is measured.
[0111] Optionally, the specific implementation of step 430 can be the same as... Figure 2 The diagram shown and Figure 2 The relevant content is introduced in this way. For the specific implementation of step 430, please refer to the foregoing embodiments. Figure 2 The diagram shown and Figure 2 The relevant details will not be repeated here.
[0112] The aforementioned silicon photonics chip-level fiber array test link calibration method can accurately measure the link loss of each channel when the array fiber couples to the chip, thereby accurately calculating the loss of each channel of the silicon photonics chip and evaluating the differences between channels. Furthermore, the chip loss testing method provided in this application embodiment only requires a single fiber array to perform the test, which can screen chips faster and more accurately, providing data support for subsequent optical module packaging.
[0113] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0114] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A chip loss testing method, characterized in that, include: The first fiber in the test fiber array is coupled to the input waveguide of the chip under test; The second optical fiber in the test optical fiber array is coupled to the output waveguide of the chip under test, wherein the number of the second optical fiber is not less than the number of the output waveguide of the chip under test; The test data set is obtained by inputting the first laser into the first optical fiber, passing through the input waveguide and the output waveguide of the chip under test, and outputting from the second optical fiber. The number of test data in the test data set is the same as the number of output waveguides of the chip under test. The input optical power is calculated based on the first photocurrent of the first fiber of the test fiber array, the second photocurrent of the third fiber of the calibration fiber array, and the responsivity of the device that tests the first and second photocurrents, wherein the responsivity of the device that tests the first and second photocurrents is a preset known quantity. Based on the input optical power and the test data set, the loss data of each channel of the chip under test is determined, wherein the input waveguide of the chip under test and any one of the output waveguides of the chip under test form a channel.
2. The method according to claim 1, characterized in that, The calibration data for the test fiber array matching is determined in the following way: With the fiber of the calibration fiber array coupled to the second fiber of the test fiber array, the calibration data of the test fiber array is tested.
3. The method according to claim 2, characterized in that, The calibration data for the test fiber array matching includes the first photocurrent of the first fiber of the test fiber array, the second photocurrent of the third fiber of the calibration fiber array, and the output data of each second fiber of the test fiber array. The step of testing the calibration data of the test fiber array when the fiber of the calibration fiber array is coupled to the second fiber of the test fiber array includes: The laser is input through the first optical fiber, and the first photocurrent of the first optical fiber is measured. The second laser is input through the third fiber of the calibration fiber array, and the second photocurrent of the third fiber is measured. The third fiber of the calibration fiber array is coupled to each of the second fibers of the test fiber array to measure the output data of each of the second fibers.
4. The method according to claim 3, characterized in that, The step of coupling the third fiber of the calibration fiber array to each of the second fibers of the test fiber array to measure the output data of each of the second fibers includes: The third fiber of the calibration fiber array is sequentially coupled to each of the second fibers of the test fiber array; The laser is input through the third fiber of the calibration fiber array and output through the second fiber, and the output data of the second fiber is measured.
5. The method according to claim 1, characterized in that, The calibration data for the test fiber array matching includes the output optical power of each second fiber of the test fiber array; The loss data for each channel of the chip under test is determined based on the input optical power and the test data set, including: Based on the input optical power, the output optical power of each second fiber in the test fiber array, and the test data set, the loss data of each channel of the chip under test is determined.
6. The method according to claim 5, characterized in that, The formulas used to calculate the loss of each channel of the chip under test include: ； in, Indicates the first photocurrent; Indicates the second photocurrent; This represents the loss of the nth channel of the chip under test; This represents the output data of the nth second fiber of the test fiber array; R represents the test data of the nth output waveguide of the chip under test; R represents the responsivity of the device testing the output of the first fiber of the test fiber array.
7. A chip loss testing device, characterized in that, include: A test fiber array, comprising at least a first fiber and one or more second fibers, wherein the first fiber is used for coupling with the input waveguide of the chip under test, and each of the second fibers is coupled one-to-one with the output waveguide of the chip under test; A first laser connected to the first optical fiber is used to output laser light; A first optical power testing device for collecting the output data of the second optical fiber, wherein the output data of the second optical fiber is used to determine the loss data of the chip under test; A calibration fiber array is used to couple the test fiber array to obtain calibration data matching the test fiber array. The calibration fiber array includes a third fiber, which is used to sequentially couple with the second fiber of the test fiber array to test the calibration data matching the test fiber array. The chip loss testing device is used to perform the chip loss testing method according to any one of claims 1-6.
8. The chip loss testing apparatus according to claim 7, characterized in that, Also includes: Second optical power testing equipment and voltage source; The second optical power testing device is used to couple with the first optical fiber of the test optical fiber array to measure the output of the first optical fiber; The voltage source is connected to the second optical power testing device to determine the photocurrent output by the first optical fiber.
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Testing device
CN217467263U