Circuit board and energy storage device

Abstract

The embodiment of the application relates to the electric power electronic technical field, discloses a kind of circuit board and energy storage equipment.The circuit board includes power board, drive component, isolated optocoupler and power switch tube, power board is provided with power circuit and first drive circuit electrically connected with each other;Drive component is connected with power board at one end, and drive component includes drive board, and drive board is provided with second drive circuit;Isolated optocoupler is arranged in drive board;Power switch tube is arranged in drive board, and second drive circuit, isolated optocoupler, first drive circuit and power switch tube jointly constitute drive circuit, and drive circuit is configured to drive power circuit, wherein, second drive circuit at least partially located in the side of power switch tube away from power board.By the above mode, the interference of high-voltage power circuit to second drive circuit can be reduced by the embodiment of the application.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of power electronics, and particularly relate to a circuit board and an energy storage device. BACKGROUND

[0002] With the popularity of portable electronic devices and the increase in outdoor activities, the demand for portable energy storage devices is growing. Such energy storage devices usually use lithium ion batteries as energy storage units and convert direct current from the battery into alternating current through an inverter circuit for output.

[0003] The inverter circuit is composed of a high-voltage power circuit and a low-voltage second drive circuit. The power circuit is used to handle high voltage and large current, so that the current in the battery can be safely used by the electrical equipment. The second drive circuit is used to drive the power switch tube in the power circuit to work, thereby controlling the on-off of the power circuit.

[0004] In related technologies, the power circuit and the low-voltage drive circuit are usually integrated on one circuit board, resulting in a short electrical distance and creepage distance between the power circuit and the low-voltage drive circuit. The strong electric field and magnetic field generated by the power circuit when operating under high load can easily interfere with the sensitive control signals of the low-voltage drive circuit through the shortened physical path, causing signal distortion, false triggering, or system instability. At the same time, the reduction of the electrical distance and the creepage distance can significantly increase the risk of insulation failure, which may cause abnormal device function or potential safety hazards, severely restricting the reliability and service life of the portable energy storage device. SUMMARY

[0005] Embodiments of the present application provide a circuit board and an energy storage device, which can increase the distance between the second drive circuit and the power circuit and reduce the interference of the high-voltage power circuit on the second drive circuit.

[0006] One technical solution adopted by embodiments of the present application is to provide a circuit board, which includes a power board, a drive assembly, an isolation optocoupler, and a power switch tube. The power board is provided with a power circuit and a first drive circuit, and the first drive circuit is electrically connected to the power circuit. One end of the drive assembly is connected to the power board, and the drive assembly includes a drive board provided with a second drive circuit. The isolation optocoupler is arranged on the drive board, the input end of the isolation optocoupler is electrically connected to the second drive circuit, and the output end of the isolation optocoupler is electrically connected to the first drive circuit. The power switch tube is arranged on the drive board, and the power switch tube is electrically connected to the first drive circuit. The second drive circuit, the isolation optocoupler, the first drive circuit, and the power switch tube jointly form a drive loop configured to drive the power switch tube. The second drive circuit is at least partially located on the side of the power switch tube away from the power board.

[0007] In some embodiments, the driving board is provided with a mounting groove, the power switch tube is at least partially accommodated in the mounting groove, in a first direction, the power switch tube and a first side wall of the mounting groove are spaced apart from each other, and the second driving circuit is at least partially located on a side of the first side wall away from the power switch tube, wherein the first side wall is a side wall of the mounting groove farthest from the power plate, and the first direction is parallel to the arrangement direction of the power plate and the driving board.

[0008] In some embodiments, the driving assembly further comprises a heat dissipation member, the heat dissipation member is provided with a first surface, the heat dissipation member is connected with the power plate, the driving board is arranged on the first surface, the first surface is at least partially exposed to the mounting groove, and the power switch tube abuts against the part of the first surface exposed to the mounting groove.

[0009] In some embodiments, the driving assembly comprises a heat-conducting insulation plate, the heat-conducting insulation plate is arranged between the driving board and the first surface, and the power switch tube abuts against one end of the heat-conducting insulation plate away from the first surface.

[0010] In some embodiments, the heat dissipation member comprises a heat dissipation body and a mounting pin, the first surface is arranged on the heat dissipation body, one end of the mounting pin is connected with the heat dissipation body, the mounting pin is connected with the power plate, and in a first direction, the heat dissipation body and the power plate are spaced apart from each other, and the first direction is parallel to the arrangement direction of the power plate and the driving board.

[0011] In some embodiments, the power plate is provided with a grounding via, the mounting pin is at least partially inserted into the grounding via, and the mounting pin is electrically connected with a grounding end of the power plate.

[0012] In some embodiments, the driving board is perpendicular to the power plate.

[0013] In some embodiments, the number of the isolation optical couplings and the number of the power switch tubes are both plural, each isolation optical coupling and each power switch tube are arranged on the driving board, the input end of each isolation optical coupling is electrically connected with the second driving circuit, the output end of one isolation optical coupling is electrically connected with one power switch tube through the first driving circuit, and the second driving circuit, the isolation optical couplings, the power switch tubes and the first driving circuit jointly constitute a driving loop.

[0014] In some embodiments, the circuit board further comprises a fastener, the fastener is arranged through the power switch tube, and the fastener is fixed with the heat dissipation member.

[0015] To solve the above technical problems, another technical scheme adopted by the embodiments of the present application is to provide a kind of energy storage equipment, including shell, battery and above-mentioned circuit board, battery and circuit board are all accommodated in shell, and battery is electrically connected with circuit board.

[0016] The beneficial effects of the embodiments of the present application are as follows: different from the prior art, in the embodiments of the present application, first, by arranging the power circuit and the first driving circuit on the power board and arranging the second driving circuit on the driving board, the power board on the high-voltage side and the driving assembly on the low-voltage side are separated, and the isolation optocoupler is introduced to realize electrical isolation, effectively increase the electrical distance and the creepage distance between the high-voltage power circuit and the low-voltage driving circuit, and realize strengthened insulation. Second, the partial driving circuit composed of the second driving circuit, the isolation optocoupler and the power switch tube can be integrally arranged on the driving assembly, so that the driving assembly can be installed on different power boards, when the second driving circuit is damaged or abnormal, the driving assembly can be directly replaced, without the need to repair or replace the entire circuit board; at the same time, for the needs of different customers, only the power circuit of the power board needs to be developed and designed, which is beneficial to reduce the cost. Third, the second driving circuit is at least partially located on the side of the power switch tube away from the power board, which optimizes the physical position of the second driving circuit, makes it away from the high-voltage power board, and further reduces the interference of the electric field or magnetic field generated by the high-voltage power circuit on the low-voltage driving circuit. Fourth, by arranging the second driving circuit on the driving board, the power circuit can be more flexible when copper wiring is laid on the power board, without the need to bypass the second driving circuit, which is beneficial to shorten the current transmission distance and reduce the line impedance and power consumption. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the specific embodiments or prior art description will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual proportion.

[0018] Figure 1 is a structural schematic diagram of a circuit board provided in the embodiments of the present application;

[0019] Figure 2 is a structural schematic diagram of a circuit board provided in the embodiments of the present application after hiding the power board;

[0020] Figure 3 is Figure 2 is an enlarged view of the area shown in A of

[0021] Figure 4 is an exploded structural schematic diagram of a circuit board provided in the embodiments of the present application after hiding the power board;

[0022] Figure 5 is a connection relationship schematic diagram between a circuit board and a battery provided in the embodiments of the present application.

[0023] REFERENCE NUMERALS

[0024] 100, circuit board; 20, driving assembly;

[0025] 1, power board; 12, ground via;

[0026] 2, driving board; 21, second driving circuit; 22, mounting groove; 221, first side wall; 222, bottom wall; 23, row pin;

[0027] 3, isolation optocoupler; 31, input end; 32, output end;

[0028] 4, power switch tube;

[0029] 5, heat dissipation member; 51, heat dissipation body; 511, first surface; 512, heat dissipation fin; 52, mounting pin;

[0030] 6, heat-conducting insulation board; 7, fastener; 8, screw member; 9, insulation particle;

[0031] X, first direction. DETAILED DESCRIPTION

[0032] For the purpose of facilitating the understanding of the present application, the present application will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element or one or more intervening elements can be present therebetween. When an element is described as being "connected to" another element, it can be directly connected to the other element or one or more intervening elements can be present therebetween. The terms "upper", "lower", "inner", "outer", "vertical", "horizontal", and the like as used in the present specification indicate the orientation or positional relationship shown in the drawings, and are merely used for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and the like are merely used for the purpose of description and cannot be understood as indicating or implying relative importance.

[0033] Unless otherwise defined, all technical and scientific terms used in the present specification have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the present specification includes any and all combinations of one or more related listed items.

[0034] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0035] Please refer to Figure 1 andFigure 2 The circuit board 100 comprises a power board 1, a driving assembly 20, an isolation optocoupler 3 and a power switch tube 4. The power board 1 is provided with a power circuit (not shown in the figure) and a first driving circuit (not shown in the figure). The power circuit is used to process high voltage and large current, and convert the current in the battery into electrical energy that can be safely used by the electrical equipment. One end of the driving assembly 20 is connected to the power board 1, and the driving assembly 20 comprises a driving board 2 provided with a second driving circuit 21 for generating a control signal. The isolation optocoupler 3 is arranged on the driving board 2, the input end 31 of the isolation optocoupler 3 is electrically connected to the second driving circuit 21, and the output end 32 of the isolation optocoupler 3 is electrically connected to the first driving circuit. The isolation optocoupler 3 realizes electrical isolation between the second driving circuit 21 and the power circuit through photoelectric conversion, and blocks the interference and surge risk that may occur in the high-voltage side power circuit. The power switch tube 4 is arranged on the driving board 2, the power switch tube 4 is electrically connected to the first driving circuit, and the power switch tube 4 is configured to control the conduction or disconnection of the power switch tube. The power switch tube 4 can be a MOSFET or an IGBT. The second driving circuit 21, the isolation optocoupler 3, the first driving circuit and the power switch tube 4 are electrically connected in sequence, thereby jointly forming a driving loop (not labeled), which is used to drive the conduction or disconnection of the power circuit, thereby controlling the operation of the power circuit. Among them, the second driving circuit 21 is at least partially located on the side of the power switch tube 4 away from the power board 1.

[0036] In the embodiments of the present application, in the first aspect, by arranging the power circuit and the first driving circuit on the power board 1, and arranging the second driving circuit 21 on the driving board 2, the power board on the high-voltage side and the driving assembly on the low-voltage side are separated, and the isolation optocoupler 3 is introduced to realize electrical isolation, thereby effectively increasing the electrical distance and the creepage distance between the high-voltage power circuit and the low-voltage driving circuit, and realizing strengthened insulation. In the second aspect, part of the driving loop composed of the second driving circuit 21, the isolation optocoupler 3 and the power switch tube 4 can be integrated on the driving assembly 20, so that the driving assembly 20 can be installed on different power boards 1, and when the second driving circuit 21 is damaged or abnormal, the driving assembly 20 can be directly replaced, without the need to repair or replace the entire circuit board; at the same time, for the needs of different customers, only the power circuit of the power board 1 needs to be developed and designed, which is conducive to reducing the cost. In the third aspect, the second driving circuit 21 is at least partially located on the side of the power switch tube 4 away from the power board 1, which optimizes the physical position of the second driving circuit, so that it is far away from the high-voltage power board, and further reduces the interference of the electric field or magnetic field generated by the high-voltage power circuit on the low-voltage driving circuit. In the fourth aspect, by arranging the second driving circuit 21 on the driving board 2, the power circuit can be more flexible when copper wiring is laid on the power board 1, without the need to bypass the second driving circuit 21, which is conducive to shortening the current transmission distance and reducing the line impedance and power consumption.

[0037] In some embodiments, the power board 1 is a multi-layer printed circuit board, on which conductive lines and pads are formed by etching, drilling and plating processes, etc. for setting the inverter circuit. The power circuit includes the inverter circuit, which realizes the conversion between direct current and alternating current by turning on and off the power switch tube 4.

[0038] In some embodiments, the drive board 2 is a separate printed circuit board, on which the second drive circuit 21 is carried. The second drive circuit 21 includes a control chip and peripheral circuits, and is used to generate control signals.

[0039] In some embodiments, the isolation optocoupler 3 is an optocoupler, the input end 31 of which is located at the end of the isolation optocoupler 3 away from the power board 1, and is used to receive low-voltage control signals of the second drive circuit 21; the output end 32 of which is located at the end of the isolation optocoupler 3 close to the power board 1, and is used to output high-voltage side drive signals. The input end 31 and the output end 32 of the isolation optocoupler 3 maintain a reinforced insulation distance therebetween, so as to realize the electrical isolation between the high-voltage side and the low-voltage side.

[0040] In some embodiments, the drive board 2 is provided with a row of pins 23, one end of which is electrically connected with the output end 32 of the isolation optocoupler 3, and the other end of which is electrically connected with the first drive circuit, so that the isolation optocoupler 3 can be electrically connected with the power switch tube 4 in sequence through the row of pins 23 and the first drive circuit, thereby controlling the turning on or off of the power switch tube 4.

[0041] In some embodiments, the drive board 2 is a multi-layer printed circuit board, on which an inner copper foil layer is further provided, which is electrically connected with the ground end to form a complete ground plane. The wiring of the second drive circuit 21 is located on the top layer of the drive board 2, and the inner copper foil layer is located below the wiring of the second drive circuit 21 to form a shielding layer. Through the shielding effect of the inner copper foil layer, the electromagnetic field generated by the high-voltage power loop can be reduced from propagating to the second drive circuit 21, which is conducive to improving the anti-interference capability of the second drive circuit 21.

[0042] In some embodiments, the pins of the power switch tube 4 are electrically connected with the first drive circuit and the power circuit in the power board 1 after penetrating through the power board 1. At least part of the components and wiring in the second drive circuit 21 are arranged at the end of the drive board 2 away from the power board 1.

[0043] It is worth noting that in the related art, the creepage distance between the second drive circuit 21 and the power switch tube 4 is short, and insulation failure, electric leakage and even short circuit may easily occur.

[0044] To at least partially solve the above problems, in some embodiments, please refer to Figure 2 and Figure 3The driving board 2 is provided with a mounting groove 22, and the power switch tube 4 is at least partially accommodated in the mounting groove 22. In the first direction X, the power switch tube 4 is spaced apart from a first side wall 221 of the mounting groove 22, and the second driving circuit 21 is at least partially located on a side of the first side wall 221 away from the power switch tube 4. The first side wall 221 is a side wall of the mounting groove 22 farthest away from the power board 1, and the first direction X is parallel to the arrangement direction of the power board 1 and the driving board 2.

[0045] Specifically, referring to Figure 3 and Figure 4 , the driving board 2 is provided with a mounting groove 22 formed by die forming or milling processing, and the mounting groove 22 provides a fixed accommodation space for the power switch tube 4. The body part of the power switch tube 4 is completely embedded in the mounting groove 22, and the mounting groove 22 further has a bottom wall 222 opposite to the first side wall 221, and the pins of the power switch tube 4 are led out from the side of the bottom wall 222 of the mounting groove 22.

[0046] By providing the mounting groove 22, a fixed accommodation space is provided for the power switch tube 4, which facilitates component integration and reduces assembly errors. In addition, the power switch tube 4 is spaced apart from the first side wall 221, which further increases the creepage distance between the power switch tube 4 and the second driving circuit 21. The creepage distance refers to the shortest path between two conductive parts or between a conductive part and a device interface measured along an insulating surface. Increasing the creepage distance is beneficial to improving the electrical insulation performance and meeting the safety requirements of enhanced insulation. Since the power switch tube 4 is spaced apart from the first side wall 221, the creepage distance needs to pass through the first side wall 221, thereby increasing the creepage distance between the power switch tube 4 and the second driving circuit 21. By increasing the creepage distance, the risk of leakage and short circuit along the insulating surface can be reduced, which is beneficial to enhancing the insulation effect between the power switch tube 4 and the second driving circuit 21 and improving the safety and reliability of the system in a high-voltage working environment.

[0047] To further enhance the insulation effect, in an embodiment, an insulating material such as insulating glue or an insulating gasket is filled between the mounting groove 22 and the power switch tube 4.

[0048] In some embodiments, referring to Figure 1 and Figure 2The driving assembly 20 further comprises a heat dissipation member 5 provided with a first surface 511, the heat dissipation member 5 is connected with the power board 1, and the driving board 2 is arranged on the first surface 511. The heat dissipation member 5 can be a heat sink or a heat dissipation fin. The mounting groove 22 penetrates through the driving board 2, and the first surface 511 of the heat dissipation member 5 is at least partially exposed to the mounting groove 22, and the power switch tube 4 is abutted to the part of the first surface 511 exposed to the mounting groove 22. By arranging the heat dissipation member 5, the heat generated by the power switch tube 4 during operation can be dissipated in time, the working temperature of the power switch tube 4 is reduced, and the working stability and service life of the power switch tube 4 are improved. Arranging the driving board 2 on the first surface 511 of the heat dissipation member 5 is conducive to forming a compact modular structure, facilitating pre-assembling the driving board 2 and the heat dissipation member 5 into an independent unit, simplifying the subsequent assembly process, and improving the production efficiency.

[0049] In some embodiments, the heat dissipation member 5, the driving board 2, the isolation optocoupler 3 and the power switch tube 4 are pre-assembled into an independent modular unit. The module can be used as a standard plug-in device, directly inserted into the power board 1 through the pin 23 and the pin of the power switch tube 4, and welded by using the wave soldering process, so as to realize the electrical connection between the pin 23 and the power switch tube 4 and the power board 1, which is conducive to simplifying the general assembly process, improving the production efficiency and assembly consistency. If the driving part fails, the module can be replaced alone without replacing the entire power board 1, which is conducive to reducing the maintenance cost and complexity.

[0050] In some embodiments, referring to Figure 4 The driving assembly 20 comprises a heat-conducting insulating plate 6 arranged between the driving board 2 and the first surface 511. The heat-conducting insulating plate 6 can be a heat-conducting silica gel sheet or a heat-conducting ceramic sheet. The heat-conducting insulating plate 6 is at least partially exposed to the mounting groove 22, and the power switch tube 4 is abutted to one end of the heat-conducting insulating plate 6 away from the first surface 511. By arranging the heat-conducting insulating plate 6, on the one hand, electrical isolation can be provided between the driving board 2 and the heat dissipation member 5, meeting the safety requirement of strengthening insulation, and reducing the risk of electric leakage between the high-voltage side and the low-voltage side, improving the electrical safety of the system. On the other hand, the heat-conducting insulating plate 6 has a certain heat-conducting property, which can transfer the heat on the driving board 2 to the heat dissipation member 5, thereby improving the heat dissipation effect, reducing the working temperature of the driving board 2, and improving the working stability of the second driving circuit 21.

[0051] In some embodiments, the heat-conducting insulating plate 6 is in a sheet shape as a whole, and the material of the heat-conducting insulating plate 6 has good heat-conducting property and electrical insulation property.

[0052] It is worth noting that in the related art, the heat dissipation member 5 is usually directly attached to the surface of the power board, occupying the surface area of the power board and limiting the wiring space of the power board.

[0053] To at least partially solve the above problems, in some embodiments, referring to Figure 1 and Figure 2 The heat dissipation member 5 includes a heat dissipation body 51 and a mounting pin 52. The first surface 511 is arranged on the heat dissipation body 51. One end of the mounting pin 52 is connected with the heat dissipation body 51, and the mounting pin 52 is connected with the power plate 1. In the first direction X, the heat dissipation body 51 and the power plate 1 are spaced apart from each other, and the first direction X is parallel to the arrangement direction of the power plate 1 and the drive plate 2. The mounting pin 52 is in a columnar shape as a whole, and is used for fixing the heat dissipation body 51 to the power plate 1. In this embodiment, by arranging the mounting pin 52 and fixing the heat dissipation member 5 to the power plate 1 through the mounting pin 52, the heat dissipation body 51 and the power plate 1 can be spaced apart from each other in the first direction X, which is beneficial to reduce the area of the surface of the power plate 1 occupied by the heat dissipation member 5 and increase the area of the power plate 1 used for copper wiring. At the same time, more sufficient wiring space can be provided for the power circuit, which is beneficial to optimize the path of high-voltage and large-current wiring, make it more direct and short, further reduce the line impedance, and improve the current transmission efficiency. In addition, the larger copper area can also form a better ground plane, which is beneficial to enhance the anti-electromagnetic interference capability of the system and improve the signal integrity.

[0054] In some embodiments, the material of the heat dissipation member 5 is a heat-conducting metal material such as aluminum or copper. The heat dissipation body 51 is provided with heat dissipation fins 512 for increasing the heat dissipation area.

[0055] In some embodiments, the mounting pin 52 is formed with a stepped structure (not shown in the figure), the upper part of the stepped structure has a smaller outer diameter, the lower part has a larger outer diameter, and the stepped surface abuts against the surface of the power plate 1 to limit and support the heat dissipation body 51, so that the heat dissipation body 51 and the power plate 1 maintain a certain interval to meet the electrical clearance and creepage distance requirements of the safety regulations.

[0056] In some embodiments, referring to Figure 1 In the first direction X, at least one of the drive plate 2 and the heat-conducting insulating plate 6 protrudes from the end of the heat dissipation body 51 close to the power plate 1. Due to the spaced design of the heat dissipation body 51 and the power plate 1, the creepage distance between the heat dissipation body 51 and the output pin 23 of the second drive circuit 21 on the drive plate 2 needs to pass along the surface of the heat-conducting insulating plate 6 and the drive plate 2, which is beneficial to increase the creepage distance between the heat dissipation body 51 and the output pin 23, thereby further enhancing the insulation effect, reducing the risk of interference of the high-voltage power circuit on the low-voltage drive circuit, and improving the safety and reliability of the entire circuit board.

[0057] In some embodiments, referring to Figure 1 and Figure 2The number of installation pins 52 is multiple, the power board 1 is provided with multiple grounding vias 12, one installation pin 52 is inserted into one grounding via 12, and each installation pin 52 is electrically connected with the grounding end of the power board 1. By arranging multiple installation pins 52, the installation stability between the heat dissipation piece 5 and the power board 1 can be improved, the multiple installation pins 52 are distributed at different positions of the heat dissipation body 51, and more balanced supporting force and fixing force can be provided, which is beneficial to reducing the risk of inclination or loosening of the heat dissipation piece 5 in a vibration or impact environment.

[0058] In some embodiments, the hole wall of the grounding via 12 is plated with a conductive layer, and the conductive layer is electrically connected with the grounding copper foil of the power board 1. After the installation pin 52 is electrically connected with the grounding end by welding or pressure connection, the installation pin 52 and the heat dissipation body 51 are both at the grounding potential. In addition, grounding of the heat dissipation piece 5 can also provide an electrostatic discharge path, which is beneficial to preventing damage to the second drive circuit 21 caused by accumulation of static electricity.

[0059] In some embodiments, the drive board 2 is perpendicular to the power board 1. Specifically, the pins of the drive board 2 and the integrated power switch tube 4 are directly electrically and mechanically connected to the power board by welding or insertion, forming a vertical arrangement of the drive board 2 and the power board 1.

[0060] The vertical distribution of the drive board 2 and the power board 1 forms a three-dimensional layout structure, which is beneficial to saving plane space and improving the power density of the whole machine. Through the three-dimensional layout, more functional modules and circuit components can be accommodated in a limited space, which is beneficial to improving the integration of the product. At the same time, the vertical layout makes the drive board 2 away from the high-voltage power circuit on the power board 1, which is beneficial to reducing electromagnetic coupling and improving the anti-interference performance of the system.

[0061] It is worth noting that due to the existence of manufacturing errors and installation errors, in the present application, when the included angle between component A and component B is between 85° and 95°, component A and component B are perpendicular to each other.

[0062] In some embodiments, the board surface of the drive board 2 forms a 90-degree angle with the board surface of the power board 1. The drive board 2 is above or beside the power board 1, and the increase in physical distance is beneficial to reducing the influence of high-voltage side switching noise and electromagnetic field on the second drive circuit 21. In addition, the vertical layout also facilitates the flow of cooling air flow and does not block the heat dissipation channel, which is beneficial to improving the heat dissipation effect of the whole machine.

[0063] In some embodiments, the number of the isolation optocouplers 3 and the number of the power switch tubes 4 are both plural. Each of the isolation optocouplers 3 and each of the power switch tubes 4 are arranged on the driving board 2, and the input end 31 of each of the isolation optocouplers 3 is electrically connected with the second driving circuit 21. The output end 32 of one of the isolation optocouplers 3 is electrically connected with one of the power switch tubes 4 through the first driving circuit. The second driving circuit 21, each of the isolation optocouplers 3, each of the power switch tubes 4 and the first driving circuit together constitute the above-mentioned driving circuit, and each of the power switch tubes 4 is used for controlling the conduction or the disconnection of the power switch tube. By arranging the plural isolation optocouplers 3 and the plural power switch tubes 4, the independent control of the plural switching devices in the power circuit can be realized, which is beneficial to the construction of complex circuit topologies such as full-bridge and half-bridge. Each of the isolation optocouplers 3 corresponds to driving one of the power switch tubes 4, and the input end 31 of each of the isolation optocouplers 3 is controlled by the second driving circuit 21 respectively, so as to realize the accurate control of each of the power switch tubes 4. The plural power switch tubes 4 work cooperatively, the conversion between direct current and alternating current can be realized, the power supply demand of different loads can be met, and the power level and the application range of the inverter can be improved.

[0064] In some embodiments, the plural isolation optocouplers 3 are arranged at intervals on the driving board 2, and each of the isolation optocouplers 3 corresponds to one of the power switch tubes 4. The plural power switch tubes 4 are installed at equal intervals on the driving board 2. Each of the isolation optocouplers 3 is controlled by the second driving circuit 21 respectively, and different phase or timing pulse signals are sent to each of the isolation optocouplers 3. Each of the power switch tubes 4 is turned on and off alternately according to the predetermined switching timing, so as to generate a sine wave or a square wave output.

[0065] In some embodiments, the driving board 2 is provided with plural mounting grooves 22, one of the power switch tubes 4 is arranged in one of the mounting grooves 22, and in the first direction X, each of the power switch tubes 4 is spaced apart from the first side wall 221 of the corresponding mounting groove 22. By arranging one mounting groove 22 for each of the power switch tubes 4, the creepage distance between each of the power switch tubes 4 and the second driving circuit 21 is increased. Each of the mounting grooves 22 provides an independent insulation space for the corresponding power switch tube 4, and each of the power switch tubes 4 is spaced apart from the first side wall 221 of the corresponding mounting groove 22, which is beneficial to meeting the safety requirement of strengthening insulation when the plural power switch tubes 4 work simultaneously. By increasing the creepage distance, the risk of electric leakage or breakdown between the high-voltage part of each of the power switch tubes 4 and the second driving circuit 21 can be reduced, which is beneficial to improving the safety and reliability of the system in high-power operation.

[0066] In some embodiments, a plurality of mounting slots 22 are arranged on the drive plate 2 at intervals, and each mounting slot 22 corresponds to accommodate one power switch tube 4. The structure and size of each mounting slot 22 are the same, and each power switch tube 4 is arranged in the corresponding mounting slot 22 to form an independent creepage path. A certain isolation is also provided between each mounting slot 22, which is conducive to reducing the electromagnetic coupling and mutual interference between different power switch tubes 4.

[0067] In some embodiments, referring to Figure 2 , the circuit board 100 further comprises a fastener 7, which is threaded through the power switch tube 4 and fixed with the heat sink 5. The fastener 7 can be a screw or a bolt. The fastener 7 is screwed and fixed with the threaded hole on the heat sink 5 after passing through the mounting hole of the power switch tube 4 and the drive plate 2. In this embodiment, by arranging the fastener 7, the power switch tube 4 can be firmly fixed on the heat sink 5, which is conducive to improving the installation stability of the power switch tube 4 and reducing the risk of loosening or falling in a vibrating or impacting environment. At the same time, the pressing force of the fastener 7 can improve the heat conduction between the power switch tube 4 and the heat sink 5, which is conducive to improving the heat dissipation effect.

[0068] It is worth noting that the fastener 7 is usually a metal part, and if it is directly in contact with the power switch tube 4, it may cause an electrical short circuit between the power switch tube 4 and the drive plate 2.

[0069] To at least partially solve the above problems, in some embodiments, referring to Figure 4 , the circuit board 100 further comprises an insulating particle 9, which is arranged on the power switch tube 4, and the fastener 7 is fixed on the heat sink 5 after passing through the insulating particle 9. The insulating particle 9 can be an insulating sleeve or an insulating washer, and the material of the insulating particle 9 can be an insulating material such as plastic or ceramic. The insulating particle 9 is arranged in the through hole of the power switch tube 4, and the fastener 7 passes through the insulating particle 9, so that the fastener 7 and the metal part of the power switch tube 4 are isolated from each other. In this embodiment, by arranging the insulating particle 9 to isolate the power switch tube 4 and the fastener 7, it is conducive to reducing the risk of electrical connection between the high-voltage part of the power switch tube 4 and the fastener 7.

[0070] In some embodiments, the circuit board 100 further comprises a plurality of threaded fasteners 8, each of which is threaded through the driving plate 2 and fastened to the heat dissipation body 51. The threaded fasteners 8 can be screws. After being threaded through the driving plate 2, the threaded fasteners 8 are fastened to threaded holes on the heat dissipation body 51. In this embodiment, by arranging the plurality of threaded fasteners 8, the driving plate 2 can be firmly fixed on the heat dissipation body 51, which is conducive to forming a stable modular structure. The plurality of threaded fasteners 8 are distributed at different positions of the driving plate 2, which can provide uniform pressing force and is conducive to reducing the risk of warping or deformation of the driving plate 2 during use. At the same time, the threaded fastening method is convenient for disassembly and maintenance. When the driving plate 2 fails, the driving plate 2 can be removed by unscrewing the threaded fasteners 8 for repair or replacement, which is conducive to reducing maintenance cost and complexity.

[0071] In the embodiments of the present application, in the first aspect, by arranging the power circuit and the first driving circuit on the power plate 1 and arranging the second driving circuit 21 on the driving plate 2, the power plate on the high-voltage side and the driving assembly on the low-voltage side are separated, and the isolation optocoupler 3 is introduced to achieve electrical isolation, which effectively increases the electrical distance and the creepage distance between the high-voltage power circuit and the low-voltage driving circuit, and realizes strengthened insulation. In the second aspect, the partial driving circuit composed of the second driving circuit 21, the isolation optocoupler 3 and the power switch tube 4 can be integrally arranged on the driving assembly 20, so that the driving assembly 20 can be installed on different power plates 1. When the second driving circuit 21 fails or abnormally, the driving assembly 20 can be directly replaced, without the need to repair or replace the entire circuit board; at the same time, for the needs of different customers, only the power circuit of the power plate 1 needs to be developed and designed, which is conducive to reducing the cost. In the third aspect, the second driving circuit 21 is at least partially located on the side of the power switch tube 4 away from the power plate 1, which optimizes the physical position of the second driving circuit and makes it away from the high-voltage power plate, further reducing the interference of the electric field or magnetic field generated by the high-voltage power circuit on the low-voltage driving circuit. In the fourth aspect, by arranging the second driving circuit 21 on the driving plate 2, the power circuit can be more flexible when copper wiring is laid on the power plate 1, without the need to bypass the second driving circuit 21, which is conducive to shortening the current transmission distance and reducing the line impedance and power consumption.

[0072] The present application further provides an energy storage device 1000, please refer to Figure 5 The energy storage device comprises a shell (not shown in the figure), a battery 200 and the above-mentioned circuit board 100. The battery 200 and the circuit board 100 are accommodated in the shell, and the battery 200 is electrically connected with the circuit board 100. For the specific structure and function of the circuit board 100, please refer to the above-mentioned embodiments, which will not be repeated here.

[0073] In some embodiments, the energy storage device 1000 can be a portable energy storage power supply for powering various electrical devices. The battery is a lithium ion battery pack, and the power board 1 of the circuit board 100 is electrically connected to the battery 200 through wires to receive direct current from the battery. The power circuit converts the direct current into alternating current and outputs the alternating current to the load.

[0074] The above merely illustrates the embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process conversion using the content of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A circuit board, characterized in that, include: The power board is equipped with a power circuit and a first drive circuit. A driving component, one end of which is connected to the power board, the driving component including a driving board, the driving board being provided with a second driving circuit; An isolation optocoupler is disposed on the driver board. The input terminal of the isolation optocoupler is electrically connected to the second driver circuit, and the output terminal of the isolation optocoupler is electrically connected to the first driver circuit. A power switch is disposed in the driving assembly. The power switch is electrically connected to the first driving circuit. The second driving circuit, the isolation optocoupler, the first driving circuit, and the power switch together form a driving loop. The driving loop is configured to drive the power switch. The second driving circuit is at least partially located on the side of the power switch away from the power board. The drive board is provided with a mounting slot, and the power switch is at least partially housed in the mounting slot. In a first direction, the power switch and the first sidewall of the mounting slot are spaced apart from each other. The second drive circuit is at least partially located on the side of the first sidewall away from the power switch. The first sidewall is the sidewall of the mounting slot that is furthest from the power board. The first direction is parallel to the arrangement direction of the power board and the drive board.

2. The circuit board according to claim 1, characterized in that, The drive assembly further includes a heat sink, which has a first surface. The heat sink is connected to the power board, and the drive board is disposed on the first surface. The first surface is at least partially exposed to the mounting groove, and the power switch tube abuts against the portion of the first surface exposed to the mounting groove.

3. The circuit board according to claim 2, characterized in that, The drive assembly includes a thermally conductive insulating plate disposed between the drive plate and the first surface, and the power switch abuts against the end of the thermally conductive insulating plate opposite to the first surface.

4. The circuit board according to claim 2, characterized in that, The heat sink includes a heat sink body and mounting pins. The first surface is disposed on the heat sink body. One end of the mounting pin is connected to the heat sink body and the mounting pin is connected to the power board. In a first direction, the heat sink body and the power board are spaced apart from each other. The first direction is parallel to the arrangement direction of the power board and the drive board.

5. The circuit board according to claim 4, characterized in that, The power board is provided with a grounding via, and the mounting pin is at least partially inserted into the grounding via, and the mounting pin is electrically connected to the grounding terminal of the power board.

6. The circuit board according to any one of claims 1-5, characterized in that, The drive board is perpendicular to the power board.

7. The circuit board according to claim 1, characterized in that, The number of isolation optocouplers and power switches are both multiple. Each isolation optocoupler and each power switch is disposed on the driver board. The input terminal of each isolation optocoupler is electrically connected to the second driver circuit. The output terminal of each isolation optocoupler is electrically connected to a power switch through the first driver circuit. The second driver circuit, each isolation optocoupler, each power switch, and the first driver circuit together form the driver circuit.

8. The circuit board according to claim 2, characterized in that, The circuit board also includes fasteners that pass through the power switching transistor and are fixed to the heat sink.

9. An energy storage device, characterized in that, The device includes a housing, a battery, and a circuit board as described in any one of claims 1-8, wherein the battery and the circuit board are both housed in the housing, and the battery is electrically connected to the circuit board.

Images