Display module and manufacturing method thereof

Abstract

A display module and a method of manufacturing the same are disclosed. The display module may include: a substrate including a plurality of electrode pads; a first non-conductive adhesive member formed on a surface of the substrate and having a first curing temperature; a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature; and a plurality of light emitting elements bonded to the plurality of electrode pads. The electrodes of the plurality of light emitting elements may be sequentially bonded onto the plurality of electrode pads, respectively, by sequentially passing through the second non-conductive adhesive member and the first non-conductive adhesive member. The second curing temperature may be higher than the first curing temperature.

Description

Technical Field

[0001] This disclosure relates to a display module and a method of manufacturing the same, the display module including a substrate on which a plurality of non-conductive adhesive members are formed. Background Technology

[0002] With the increasing trend towards higher brightness, higher resolution, and larger sizes in display devices installed on various electronic devices, the demand for high efficiency and low power consumption has been growing recently. Therefore, a technology has been developed in which light-emitting diodes (LEDs) emitting red (R), green (G), and blue (B) light are directly mounted on a substrate to form a display panel.

[0003] LEDs are widely used not only as light sources for lighting equipment but also for various display devices in a wide range of electronic products such as televisions (TVs), mobile phones, personal computers (PCs), laptops, and personal digital assistants (PDAs). In particular, micro-LEDs with dimensions of 100 μm or smaller have recently been developed. Compared to traditional LEDs, micro-LEDs exhibit faster response times, lower power consumption, and higher brightness, and are therefore considered as the light-emitting elements for next-generation displays. Furthermore, ongoing research is underway to improve the manufacturing yield of such display devices. Summary of the Invention

[0004] Technical solution

[0005] Embodiments of this disclosure may provide a display module, comprising: a substrate including a plurality of electrode pads; a first non-conductive adhesive member formed on the surface of the substrate and having a first curing temperature; a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature; and a plurality of light-emitting elements bonded to the plurality of electrode pads. The electrodes of the plurality of light-emitting elements can be sequentially bonded to the plurality of electrode pads by passing sequentially through the second non-conductive adhesive member and the first non-conductive adhesive member. The second curing temperature may be higher than the first curing temperature.

[0006] Alternatively, embodiments may provide a method for bonding multiple light-emitting elements to a substrate of a display module. This method may include: forming a first non-conductive adhesive member having a first curing temperature on a substrate including multiple electrode pads; forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member; aligning multiple electrodes of the light-emitting elements on the multiple electrode pads; applying heat and pressure to the multiple electrodes of the light-emitting elements such that the multiple electrodes of the light-emitting elements pass through the second non-conductive adhesive member within a first temperature range; applying heat and pressure to the multiple electrodes of the light-emitting elements such that the multiple electrodes of the light-emitting elements are inserted into the first non-conductive adhesive member and contact the multiple electrode pads within a second temperature range; and after the multiple electrodes of the light-emitting elements have passed through the second non-conductive adhesive member, applying heat and pressure to the multiple electrodes of the light-emitting elements such that the multiple electrodes of the light-emitting elements are bonded to the multiple electrode pads within the second non-conductive adhesive member. The second curing temperature may be higher than the first curing temperature. Attached Figure Description

[0007] Figure 1 This is a simplified front view of a display module according to an embodiment of the present disclosure;

[0008] Figure 2 This is a block diagram that briefly illustrates a display module according to an embodiment of the present disclosure;

[0009] Figure 3 This is a cross-sectional view showing a portion of a display module including a light-emitting element and a substrate bonded thereto, according to an embodiment of the present disclosure;

[0010] Figure 4 This is a cross-sectional view showing a portion of a display module according to an embodiment of the present disclosure, including a substrate on which a non-conductive adhesive member containing conductive particles is formed.

[0011] Figure 5 This is a cross-sectional view showing a portion of a display module according to an embodiment of the present disclosure, including a substrate having a non-conductive adhesive member containing conductive particles and a black non-conductive adhesive member formed thereon.

[0012] Figure 6 The process of manufacturing a display module by bonding a plurality of light-emitting elements to a substrate having a plurality of non-conductive adhesive members formed thereon, according to an embodiment of the present disclosure, is illustrated.

[0013] Figure 7 An example of a substrate having three non-conductive adhesive members formed thereon, according to an embodiment of the present disclosure, is shown; and

[0014] Figure 8 An example of a substrate having three non-conductive adhesive members formed thereon, according to an embodiment of the present disclosure, is shown. Detailed Implementation

[0015] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily implement the present disclosure. However, the present disclosure can be implemented in various different forms and is not limited to the embodiments described herein. Furthermore, for clarity of description, parts irrelevant to the description have been omitted from the drawings, and similar reference numerals are assigned to similar parts throughout the specification.

[0016] In view of the functions mentioned in this disclosure, the terminology used herein is described as currently used general terms, but various other terms may be used to refer to the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Therefore, the terminology used in this disclosure should not be interpreted based solely on the name of the term, but rather on its meaning and the overall content of this disclosure.

[0017] In addition, terms such as "first" and "second" can be used to describe various components, but components should not be limited by these terms. These terms are used to distinguish one component from another.

[0018] Throughout this specification, when it is mentioned that one part is "connected" to another part, this includes not only "direct connection" but also "electrical connection" in which other components are inserted. Furthermore, when it is mentioned that a part "comprises" a component, this does not mean that it excludes other components, but rather that it may further include other components, unless otherwise stated.

[0019] Phrases such as “in an embodiment” mentioned in various parts of this disclosure do not necessarily refer to the same embodiment.

[0020] Embodiments of this disclosure can be represented by functional block configurations and various processing steps. Some or all of these functional blocks can be implemented as various hardware and / or software components performing specific functions. For example, the functional blocks of this disclosure can be implemented by one or more microprocessors, or by circuit configurations designed for specific functions. Additionally, for example, the functional blocks of this disclosure can be implemented as various programming or scripting languages. Functional blocks can also be implemented as algorithms that execute on one or more processors. Furthermore, this disclosure can utilize existing technologies for electronic environment configuration, signal processing, and / or data processing. Terms such as “mechanism,” “element,” “component,” and “configuration” are used extensively herein and are not limited to mechanical or physical configurations.

[0021] Furthermore, the connecting lines or connecting components shown in the accompanying drawings are provided only as examples of functional connections and / or physical or electrical connections. In actual devices, connections between components can be achieved through various alternative or additional functional, physical, or electrical connections.

[0022] This disclosure will be described in detail below with reference to the accompanying drawings.

[0023] Figure 1 This is a simplified front view of a display module according to an embodiment of the present disclosure, and Figure 2 This is a block diagram that briefly illustrates a display module according to an embodiment of the present disclosure.

[0024] refer to Figure 1 and Figure 2 According to an embodiment of the present disclosure, the display module 10 may include: a substrate 20 on which a plurality of pixel driving circuits 30 are formed; a plurality of pixels 100 disposed on the front surface of the substrate 20; and a panel driving unit 40 configured to generate control signals and provide the generated control signals to the plurality of pixel driving circuits 30.

[0025] In this disclosure, a pixel 100 may include multiple sub-pixels. A sub-pixel may include a light source and a color conversion layer and a color filter corresponding to each light source. In this document, the light source is an inorganic self-emissive diode, and may be, for example, a vertical-cavity surface-emitting laser (VCSEL) diode or a micro-light-emitting diode (micro-LED) with a size of 100 μm or smaller (preferably 30 μm or smaller). VCSEL diodes and micro-LEDs may emit light in the blue band (450 nm to 490 nm) or the ultraviolet band (360 nm to 410 nm). Reference will be made below. Figure 3 Describe the structure of pixel 100 in detail.

[0026] The substrate 20 can be a support base for attaching multiple electronic components (e.g., light-emitting elements of a display) in an arranged manner. For example, the substrate 20 can be formed of any of glass, sapphire, synthetic resin, or ceramic materials. For example, the substrate 20 can be a thin-film transistor (TFT) substrate. In this case, the substrate 20 may include a glass substrate 21, a TFT layer 23 including TFT circuitry on the front surface of the glass substrate 21, and a plurality of side wirings 25 electrically coupling the TFT circuitry of the TFT layer 23 to circuitry (not shown) disposed on the rear surface of the substrate 20. According to embodiments, the substrate 20 can be formed of a rigid or flexible material.

[0027] The display module 10 can be formed using a synthetic resin-based substrate instead of a glass substrate 21. The synthetic resin-based substrate can be formed of, for example, polyimide (PI), polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), or polycarbonate (PC). The synthetic resin-based substrate can have a level of hardness that is either flexible or rigid.

[0028] Although not shown in the accompanying drawings, when a synthetic resin-based substrate is used instead of a glass substrate 21 to form the display module 10, through-holes can be formed in the active region 20a, which will be described later, and wiring can be formed in the through-holes. In this case, the front and rear surfaces of the substrate 20 can be electrically coupled to each other through the wiring formed in the through-holes, and the aforementioned plurality of side wirings 25 can be omitted from the substrate 20. Additionally, the region in which the plurality of side wirings 25a are formed (the passive region 20b, which will be described later) can be omitted from the substrate 20. When the passive region 20b is omitted from the substrate 20 as described above, the active region 20a, which will be described later, can be enlarged.

[0029] In addition, the display module 10 of this disclosure can be formed using a ceramic substrate instead of a glass substrate 21.

[0030] The substrate 20 may include an active region 20a and a passive region 20b. An image can be displayed on the front surface of the substrate 20 on the active region 20a, while an image cannot be displayed on the passive region 20b. The active region 20a may be divided into multiple pixel regions 24, each having a plurality of pixels arranged thereon. The multiple pixel regions 24 may be divided in various forms, and for example, in a matrix format. One pixel region 24 may include one pixel 100 (see...). Figure 3 The passive region 20b can be included in the edge region of the glass substrate, and a plurality of connection pads 28a arranged at regular intervals along the edge region can be formed thereon. The plurality of connection pads 28a can be electrically coupled to the pixel driving circuit 30 respectively via wiring 28b.

[0031] The number of connection pads 28a formed on the passive region 20b can vary depending on the number of pixels implemented on the substrate, and can also vary depending on the driving scheme of the TFT circuitry arranged on the active region 20a. For example, an active matrix (AM) driving scheme that drives each pixel individually may require more wiring and connection pads than a passive matrix (PM) driving scheme in which the TFT circuitry arranged on the active region 20a drives multiple pixels via horizontal and vertical lines.

[0032] In order to control multiple pixels 100, the TFT layer 23 may include multiple horizontally arranged data signal lines, multiple vertically arranged gate signal lines, and multiple pixel driving circuits 30 electrically coupled to each line.

[0033] TFT layer 23 may include, for example, multiple electrode pads 22a and 22b (see...) Figure 3Multiple electrode pads 22a and 22b can be arranged in a predetermined number on each pixel region. For example, when a pixel region includes three sub-pixels (e.g., first micro-LED 50R, second micro-LED 50g, third micro-LED 50b, see reference 1),... Figure 3 And each sub-pixel includes, for example, two electrodes 51a and 51b (see reference). Figure 3 When ), six electrode pads 22a to 22f can be arranged on a pixel area. Micro LEDs 50R, 50G, and 50B can have a flip-chip structure in which an anode electrode and a cathode electrode are formed on the same first surface and a light-emitting surface is formed on a second surface opposite to the first surface.

[0034] The TFTs constituting the TFT layer (or backplane) are not limited to a specific structure or type. For example, the TFTs referenced in this disclosure can be implemented not only as low-temperature polycrystalline silicon (LTPS) TFTs, but also as oxide TFTs, Si TFTs (such as polycrystalline silicon or a-silicon), organic TFTs, graphene TFTs, etc. In Si wafer CMOS processes, only P-type or N-type MOSFETs can be formed and applied.

[0035] The panel driving unit 40 can be directly coupled to the substrate via chip-on-glass (COG) or chip-on-plastic (COP) bonding, or indirectly coupled to the substrate 20 via a separate flexible printed circuit board (FPCB) via film-on-glass (FOG) bonding. The panel driving unit 40 can drive multiple pixel driving circuits 30 to control the light emission of multiple micro-LEDs electrically coupled to the multiple pixel driving circuits 30 respectively.

[0036] The panel driving unit 40 can control multiple pixel driving circuits 30 row by row through the first driving unit 41 and the second driving unit 42. For example, the first driving unit 41 can generate control signals to sequentially control multiple horizontal lines formed on the TFT substrate 20 one line per video frame, and can send the generated control signals to the pixel driving circuits 30 respectively coupled to the corresponding rows. The second driving unit 42 can generate control signals to sequentially control multiple vertical lines formed on the TFT substrate 20 one line per video frame, and can send the generated control signals to the pixel driving circuits 30 respectively coupled to the corresponding rows.

[0037] In this disclosure, the display module can be a display panel with miniature light-emitting diodes, which are self-emissive elements used to display images. For example, the display module can be a display panel formed of multiple inorganic LEDs, each having a size of 100 micrometers or smaller, and can provide improved contrast, response time, and energy efficiency compared to liquid crystal display (LCD) panels that require backlighting.

[0038] In this disclosure, the display module can be used as a single unit by being installed in wearable devices, portable devices, handheld devices, and various electronic products or automotive electronic devices that require a display. The display module can also be used in display devices, such as personal computer (PC) monitors, high-resolution televisions (TVs), signage (or digital signage), and electronic displays, through various matrix assembly arrangements.

[0039] Figure 3 This is a cross-sectional view showing a portion of a display module including a light-emitting element and a substrate to which it is joined, according to an embodiment of the present disclosure.

[0040] According to an embodiment, multiple pixel regions 24 (see Figure 1 The pixels 100 can be arranged in a grid on the substrate 20 of the display module 10. A pixel 100 can be disposed in each of the pixel regions 24. Pixel 100 may include at least three sub-pixels (e.g., micro-LEDs) that emit light of different colors.

[0041] refer to Figure 3 According to an embodiment, pixel 100 may include a plurality of light-emitting elements 50R, 50G, and 50B. For example, the plurality of light-emitting elements 50R, 50G, and 50B may include a first micro-LED 50R that emits light in the red band, a second micro-LED 50G that emits light in the green band, and a third micro-LED 50B that emits light in the blue band.

[0042] According to an embodiment, multiple light-emitting elements 50R, 50G, and 50B can be electrically and physically coupled to the substrate 20 via solder bumps 75 formed at one end of each of the electrodes 51a to 51b. For example, a first micro-LED 50R, a second micro-LED 50g, and a third micro-LED 50b can be electrically and physically coupled to the TFT substrate via solder bumps 75. For example, solder bumps 75 can electrically and physically couple the first micro-LED 50R, the second micro-LED 50g, and the third micro-LED 50b to the substrate 20. For example, the electrodes 51a and 51b of the first micro-LED 50R can be electrically and physically coupled to the corresponding electrode pads 22a and 22b of the substrate 20 via solder bumps 75. In this case, the electrode pads 22a and 22b of the substrate 20 can be arranged on the surface of the substrate 20 in a protruding or recessed shape. Similarly, the electrodes 51c, 51d, 51e, and 51f of the second micro-LED 50G and the third micro-LED 50B can be electrically and physically coupled to the corresponding electrode pads 22c, 22d, 22e, and 22f of the substrate 20 via solder bumps 75.

[0043] According to an embodiment, solder bumps 75 may be disposed between electrodes 51a, 51b, 51c, 51d, 51e, and 51f of the light-emitting elements 50R, 50G, and 50B and electrode pads 22a, 22b, 22c, 22d, 22e, and 22f of the substrate 20. For example, solder bumps 75 may also comprise a plurality of conductive particles. The conductive particles may be melted by heat (e.g., exceeding 150°C) applied during a thermoforming process performed after transferring the plurality of microLEDs onto the substrate 20, thereby forming a metallic compound together with the electrodes 51a, 51b, 51c, 51d, 51e, and 51f and the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f of the substrate 20. In this case, for example, the conductive particles may be materials capable of forming metallic compounds with the chip electrodes and substrate electrode pads at temperatures of about 150°C or lower, but this disclosure is not limited thereto. For example, the conductive particles may include at least one material selected from In, Sn, Bi, Cu, Ag, Au, Zn, Pd, Pb and Ni.

[0044] According to embodiments, electrodes 51a, 51b, 51c, 51d, 51e, and 51f may include a fill layer and a barrier layer stacked thereon. The fill layer can reduce the contact resistance between the p-type semiconductor layer (or n-type semiconductor layer) of the microLED and the barrier layer, and can improve the adhesion between the p-type semiconductor layer (or n-type semiconductor layer) and the barrier layer. For example, the fill layer may be formed of at least one material selected from Au, Cu, Ni, and Al, but this disclosure is not limited thereto. For example, the barrier layer may be formed of at least one material selected from Au, Ni, Ti, Cr, Pd, TiN, Ta, TiW, TaN, AlSiTiN, NiTi, TiBN, ZrBN, TiAlN, and TiBi, but this disclosure is not limited thereto.

[0045] According to an embodiment, the electrode pads 22a, 22b, 22c, 22d, 22e and 22f of the substrate 20 may be formed of at least one material selected from Au, Cu, Ag, Ni, Ni / Au, Au / Ni, Ni / Cu and Cu / Ni, but this disclosure is not limited thereto.

[0046] According to the embodiment, the first micro LED 50R, the second micro LED 50g, and the third micro LED 50b can be physically fixed to the substrate 20 not only by solder bumps 75, but also by a plurality of cured non-conductive adhesive components 91 and 92.

[0047] According to an embodiment, a plurality of non-conductive adhesive members 91, 92 may be formed on the substrate 20 before transferring the plurality of microLEDs onto the substrate 20. For example, the plurality of non-conductive adhesive members 91 and 92 may be formed over the entire area of ​​the front surface of the substrate 20. The plurality of non-conductive adhesive members 91 and 92 may be formed as a multilayer on the substrate 20. The plurality of non-conductive adhesive members 91 and 92 may also include flux to facilitate bonding between electrodes 51a, 51b, 51c, 51d, 51e, and 51f and electrode pads 22a, 22b, 22c, 22d, 22e, and 22f via conductive particles.

[0048] According to an embodiment, the plurality of non-conductive adhesive members 91 and 92 may include a first non-conductive adhesive member 91 and a second non-conductive adhesive member 92. In this case, the first non-conductive adhesive member 91 may cover the electrode pads 22a and 22b and the solder bumps 75 formed on the substrate electrode pads. In addition, the second non-conductive adhesive member 92 may be formed on the first non-conductive adhesive member 91.

[0049] According to an embodiment, the first non-conductive adhesive member 91 and the second non-conductive adhesive member 92 may be non-conductive films. The first non-conductive adhesive member 91 may be formed on the substrate 20 by a lamination process, and the second non-conductive adhesive member 92 may be formed on the first non-conductive adhesive member 91 by a lamination process. According to an embodiment, the first non-conductive adhesive member 91 and the second non-conductive adhesive member 92 may be transparent non-conductive films.

[0050] According to an embodiment, the first non-conductive adhesive component 91 may be formed of a material that cures at a first curing temperature or higher, and the second non-conductive adhesive component 92 may be formed of a material that cures at a second curing temperature or higher. The second curing temperature may be higher than the first curing temperature. The curing temperature may be the temperature at which the material effectively begins to cure. For example, by changing the type and content of the components of the first non-conductive adhesive component 91 and the second non-conductive adhesive component 92, the first non-conductive adhesive component 91 and the second non-conductive adhesive component 92 may have different curing temperatures, viscosities, and glass transition temperatures (Tg). For example, the first non-conductive adhesive component 91 and the second non-conductive adhesive component 92 may have different curing temperatures, viscosities, and glass transition temperatures (Tg) by including at least one of additives, curing agents, fluxes, or epoxy resins of different types and contents.

[0051] According to an embodiment, the second non-conductive adhesive member 92 may be formed of a material having a higher viscosity than the first non-conductive adhesive member 91.

[0052] According to an embodiment, the light-emitting elements 50R, 50G, and 50B transferred onto the substrate 20 can contact the uppermost second non-conductive adhesive member 92 corresponding to the plurality of non-conductive adhesive members 91 and 92. For example, the plurality of micro-LEDs 50R, 50G, and 50B can be in contact with the second non-conductive adhesive member 92. In this state, when the plurality of micro-LEDs 50R, 50G, and 50B are hot-pressed toward the substrate 20, the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of the micro-LEDs 50R, 50G, and 50B can be inserted into and pass through the second non-conductive adhesive member 92.

[0053] Subsequently, electrodes 51a, 51b, 51c, 51d, 51e, and 51f of multiple micro LEDs 50R, 50G, and 50B can be inserted into the first non-conductive adhesive member 91 and bonded to electrode pads 22a, 22b, 22c, 22d, 22e, and 22f in the first non-conductive adhesive member 91.

[0054] According to the embodiment, when the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of multiple micro-LEDs 50R, 50G, and 50B are inserted into the second non-conductive adhesive member 92 and the first non-conductive adhesive member 91 and come into contact with the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f, since the viscosity of the second non-conductive adhesive member 92 is higher than that of the first non-conductive adhesive member 91, the film shape of the first non-conductive adhesive member 91 can be maintained during the high-temperature and high-pressure bonding process, thereby improving the flatness of the appearance of the display module 10.

[0055] According to an embodiment, the first non-conductive adhesive member 91 and the second non-conductive adhesive member 92 can be cured by heating. Therefore, multiple micro LEDs can be firmly fixed to the substrate 20 by the cured first non-conductive adhesive member 91 and the second non-conductive adhesive member 92 while being inserted into them.

[0056] Figure 4 This is a cross-sectional view showing a portion of a display module according to an embodiment of the present disclosure, including a substrate on which a non-conductive adhesive member containing conductive particles is formed.

[0057] refer to Figure 4The first non-conductive adhesive member 91 according to an embodiment may include a plurality of conductive particles 60. The plurality of conductive particles 60 may be conductive powders and may include at least one conductive material selected from, for example, Sn, Cu, Ni, In, Ag, Au, C, Co, Fe, Cr, Mo, Ti, Bi, Pd, Pb, and Ge. The density of the plurality of conductive particles 60 in the first non-conductive adhesive member 91 may be less than or equal to a predetermined value. Therefore, the first non-conductive adhesive member 91 can maintain its non-conductive properties.

[0058] According to an embodiment, a first non-conductive adhesive member 91 comprising a plurality of conductive particles 60 may be formed on the lowest layer of the plurality of non-conductive adhesive members 91 and 92. Therefore, the conductive particles 60 can be melted by heat (e.g., exceeding 150°C) applied during the thermo-press bonding process, thereby forming a metallic compound together with the electrodes 51a, 51b, 51c, 51d, 51e, and 51f and the substrate electrode pads 22a, 22b, 22c, 22d, 22e, and 22f.

[0059] According to an embodiment, the first non-conductive adhesive member 91 and the second non-conductive adhesive member 92 may be transparent non-conductive films.

[0060] Despite Figure 4 The description indicates that a plurality of conductive particles 60 are included in a first non-conductive adhesive member 91, but this disclosure is not limited thereto. A plurality of conductive particles 60 may also be included in another non-conductive adhesive member.

[0061] Figure 5 This is a cross-sectional view illustrating a portion of a display module according to an embodiment of the present disclosure, comprising a substrate having a non-conductive adhesive member containing conductive particles and a black non-conductive adhesive member formed thereon.

[0062] refer to Figure 5 The second non-conductive adhesive member 92 according to the embodiment may be black. For example, the second non-conductive adhesive member 92 may be a black non-conductive film. The black second non-conductive adhesive member 92 may be formed on the uppermost layer of a plurality of non-conductive adhesive members 91 and 92, but this disclosure is not limited thereto.

[0063] When multiple micro-LEDs 50R, 50G, and 50B are bonded to a substrate 20 on which a black second non-conductive adhesive member 92 is formed, the optical characteristics of the display module 10 can be improved. Alternatively, for example, by allowing only some of the multiple non-conductive adhesive members 91 and 92 to be black, the optical characteristics of the display module 10 can be improved while maintaining surface roughness.

[0064] refer to Figure 5According to an embodiment, the first non-conductive adhesive member 91 may include a plurality of conductive particles 60. The plurality of conductive particles 60 may be conductive powders and may include at least one conductive material selected from, for example, Sn, Cu, Ni, In, Ag, Au, C, Co, Fe, Cr, and Mo. The density of the plurality of conductive particles 60 in the first non-conductive adhesive member 91 may be less than or equal to a predetermined value. Therefore, the first non-conductive adhesive member 91 can maintain its non-conductive properties. The first non-conductive adhesive member 91 including the plurality of conductive particles 60 may be formed on the lowest layer of the plurality of non-conductive adhesive members 91 and 92.

[0065] Despite Figure 5 The second non-conductive adhesive member 92 is described as being black, but this disclosure is not limited thereto. For example, the first non-conductive adhesive member 91, which includes a plurality of conductive particles 60, may also be black.

[0066] Despite Figure 5 The description states that the second non-conductive adhesive member 92 is black and the first non-conductive adhesive member 91 includes a plurality of conductive particles 60, but this disclosure is not limited thereto. For example, the second non-conductive adhesive member 92 may be black, and the first non-conductive adhesive member 91 may not include the plurality of conductive particles 60.

[0067] Figure 6 The present disclosure illustrates a process for manufacturing a display module by bonding a plurality of light-emitting elements to a substrate on which a plurality of non-conductive adhesive members are formed, according to an embodiment of the present disclosure.

[0068] Figure 6 The manufacturing process of the display module 10 can be used to manufacture Figures 1 to 5 The display module 10.

[0069] refer to Figure 6 Referring to reference numeral 1 in the accompanying drawings, a plurality of non-conductive adhesive members 91 and 92 may be formed on the substrate 20. For example, a first non-conductive adhesive member 91 may be formed on the substrate 20, and a second non-conductive adhesive member 92 may be formed on the first non-conductive adhesive member 91. For example, the first non-conductive adhesive member 91 may be a non-conductive film having a first curing temperature, and the second non-conductive adhesive member 92 may be a non-conductive film having a second curing temperature. The second viscosity of the second non-conductive adhesive member 92 may be higher than the first viscosity of the first non-conductive adhesive member 91, and the second curing temperature may be higher than the first curing temperature. Furthermore, for example, the plurality of non-conductive adhesive members 91 and 92 may have a thickness of 1 μm to 10 μm and may have thermosetting and / or UV-curable properties.

[0070] According to an embodiment, the first non-conductive adhesive member 91 can be attached to the substrate 20 by a lamination process, and the second non-conductive adhesive member 92 can be attached to the first non-conductive adhesive member 91 by a lamination process.

[0071] refer to Figure 6 As shown in Figure 2, multiple light-emitting elements 50R, 50G, and 50B can be aligned on the substrate 20. For example, multiple micro-LEDs 50R, 50G, and 50B can be aligned on the substrate 20 such that the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of the multiple micro-LEDs 50R, 50G, and 50B are opposite to the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f on the substrate 20. The multiple micro-LEDs 50R, 50G, and 50B aligned on the substrate 20 can contact the second non-conductive adhesive member 92.

[0072] refer to Figure 6 As indicated by reference numeral 3 in the attached figure, multiple light-emitting elements 50R, 50G, and 50B can be inserted into the second non-conductive adhesive component 92 using a high-temperature, high-pressure bonding process. For example, the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of the multiple micro-LEDs 50R, 50G, and 50B can move within the second non-conductive adhesive component 92 and be opposite to the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f on the substrate 20.

[0073] According to an embodiment, within a first temperature range, the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of a plurality of microLEDs 50R, 50G, and 50B can move within the second non-conductive adhesive member 92 toward the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f. In this case, the first temperature range can be lower than the second curing temperature of the second non-conductive adhesive member 92. For example, heat higher than the first and second curing temperatures can be applied to the substrate 20 and / or the plurality of non-conductive adhesive members 91, 92. Within the first temperature range before the temperature of the second non-conductive adhesive member 92 reaches the second curing temperature due to the applied heat, the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of the plurality of microLEDs 50R, 50G, and 50B can move within the second non-conductive adhesive member 92 toward the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f.

[0074] refer to Figure 6Reference numeral 4 indicates that multiple light-emitting elements 50R, 50G, and 50B, which pass through the second non-conductive adhesive member 92 via a high-temperature, high-pressure bonding process, can be inserted into the first non-conductive adhesive member 91. For example, the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of the multiple micro-LEDs 50R, 50G, and 50B can be moved within the first non-conductive attachment member 91 toward the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f on the substrate 20.

[0075] According to an embodiment, within a second temperature range, the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of the plurality of micro-LEDs 50R, 50G, and 50B can move within the first non-conductive adhesive member 91 toward the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f. In this case, the second temperature range can be lower than the first curing temperature of the first non-conductive adhesive member 91. For example, heat above the first curing temperature and the second curing temperature can be applied to the substrate 20 and / or multiple non-conductive adhesive members 91, 92. Within a second temperature range before the temperature of the first non-conductive adhesive member 91 reaches the first curing temperature due to the applied heat, the electrodes 51a, 51b, 51c, 51d, 51e, 51f of multiple micro LEDs 50R, 50G, 50B can contact the solder bumps on the electrode pads 22a, 22b, 22c, 22d, 22e, 22f or electrode pads 22a, 22b, 22c, 22d, 22e, 22f within the second non-conductive adhesive member 92.

[0076] According to an embodiment, the second curing temperature of the second non-conductive adhesive member 92 can be higher than the first curing temperature of the first non-conductive adhesive member 91, and the second viscosity of the second non-conductive adhesive member 92 can be higher than the first viscosity of the first non-conductive adhesive member 91. Therefore, even if the first viscosity of the first non-conductive adhesive member 91 is low, due to the high second viscosity of the second non-conductive adhesive member 92, the second non-conductive adhesive member 92 can maintain its shape while the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of the plurality of micro-LEDs 50R, 50G, and 50B move within the second non-conductive adhesive member 92 and the first non-conductive adhesive member 91. Therefore, during the high-temperature and high-pressure bonding process, the film shape of the first non-conductive adhesive member 91 can be maintained, and the flatness of the appearance of the display module 10 can be improved. In addition, by using a film with this structure, multiple micro LEDs 50R, 50G, and 50B can be precisely bonded to the desired positions of electrode pads 22a, 22b, 22c, 22d, 22e, and 22f without rotating or moving.

[0077] Subsequently, electrodes 51a, 51b, 51c, 51d, 51e, and 51f of multiple microLEDs 50R, 50G, and 50B can be bonded to electrode pads 22a, 22b, 22c, 22d, 22e, and 22f of substrate 20. For example, solder bumps and / or conductive particles included in the second non-conductive bonding member 92 can be melted by heating, thereby forming a metal compound together with electrodes 51a, 51b, 51c, 51d, 51e, and 51f of multiple microLEDs 50R, 50G, and 50B and electrode pads 22a, 22b, 22c, 22d, 22e, and 22f of substrate 20.

[0078] Subsequently, by applying heat to the substrate 20 and / or the plurality of non-conductive adhesive members 91 and 92, the first non-conductive adhesive member 91 can be cured at a first curing temperature, and the second non-conductive adhesive member 92 can be cured at a second curing temperature.

[0079] For example, while the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of multiple micro-LEDs 50R, 50G, and 50B are in contact with the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f of the substrate 20, or with the solder bumps formed on the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f, the first non-conductive adhesive component 91 can be cured at a temperature above the first curing temperature.

[0080] For example, while the electrodes 51a, 51b, 51c, 51d, 51e, and 51f of multiple micro-LEDs 50R, 50G, and 50B are in contact with the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f of the substrate 20, or with the solder bumps formed on the electrode pads 22a, 22b, 22c, 22d, 22e, and 22f, the second non-conductive adhesive component 92 can be cured at a temperature above the second curing temperature.

[0081] Therefore, multiple micro LEDs 50R, 50G, and 50B can be firmly fixed to the substrate 20 by the cured first non-conductive adhesive member 91 and second non-conductive adhesive member 92 while being inserted into the first non-conductive adhesive member 91 and the second non-conductive adhesive member 92.

[0082] In addition, for the bonding process, a first non-conductive adhesive component 91 and a second non-conductive adhesive component 92 with different curing temperatures, viscosities and glass transition temperatures can be laminated, thereby preventing the first non-conductive adhesive component 91 and / or the second non-conductive adhesive component 92 from being pre-cured during the bonding process, and preventing the first non-conductive adhesive component 91 or the second non-conductive adhesive component 92 from curing when the electrodes 51a, 51b, 51c, 51d, 51e and 51f of the multiple light-emitting devices 50R, 50G and 50B are not bonded to the electrode pads 22a, 22b, 22c, 22d, 22e and 22f of the substrate 20.

[0083] Figure 7 An example of a substrate having three non-conductive adhesive members formed thereon, according to an embodiment of the present disclosure, is shown.

[0084] refer to Figure 7 According to an embodiment, a first non-conductive adhesive member 91, a second non-conductive adhesive member 92, and a third non-conductive adhesive member 93 may be formed on the substrate 20. The third non-conductive adhesive member 93 may be formed between the first non-conductive adhesive member 91 and the second non-conductive adhesive member 92.

[0085] According to an embodiment, the first non-conductive adhesive member 91, the second non-conductive adhesive member 92, and the third non-conductive adhesive member 92 may be non-conductive films. The first non-conductive adhesive member 91 may be formed on the substrate 20 by a lamination process. The third non-conductive adhesive member 93 may be formed on the first non-conductive adhesive member 91 by a lamination process. The second non-conductive adhesive member 92 may be formed on the third conductive adhesive member 93 by a lamination process.

[0086] According to an embodiment, the first non-conductive adhesive component 91 may be formed of a material that cures at a first curing temperature or higher. The second non-conductive adhesive component 92 may be formed of a material that cures at a second curing temperature or higher. The third non-conductive adhesive component 93 may be formed of a material that cures at a third curing temperature or higher. The second curing temperature may be higher than the first and third curing temperatures. For example, the first non-conductive adhesive component 91, the second non-conductive adhesive component 92, and the third non-conductive adhesive component 93 may have different curing temperatures, viscosities, and glass transition temperatures (Tg) by changing the type and content of the components of the first non-conductive adhesive component 91, the second non-conductive adhesive component 92, and the third non-conductive adhesive component 93. For example, the first non-conductive adhesive component 91, the second non-conductive adhesive component 92, and the third non-conductive adhesive component 93 may have different curing temperatures, viscosities, and glass transition temperatures (Tg) by including at least one of additives, curing agents, fluxes, or epoxy resins of different types and contents.

[0087] According to an embodiment, the second non-conductive adhesive member 92 may be formed of a material having a viscosity higher than that of the first non-conductive adhesive member 91 and the third non-conductive adhesive member 92.

[0088] According to the embodiments, the first non-conductive adhesive member 91 and the third non-conductive adhesive member 92 may be transparent non-conductive films, but this disclosure is not limited thereto.

[0089] Figure 8 An example of a substrate having three non-conductive adhesive members formed thereon, according to an embodiment of the present disclosure, is shown.

[0090] refer to Figure 8 According to an embodiment, at least one of the first non-conductive adhesive member 91, the second non-conductive adhesive member 92, and the third non-conductive adhesive member 93 may be black. For example, among the first non-conductive adhesive member 91, the second non-conductive adhesive member 92, and the third non-conductive adhesive member 93, the second non-conductive adhesive member 92, which forms the uppermost layer, may be black.

[0091] According to an embodiment, at least one of the first non-conductive adhesive member 91, the second non-conductive adhesive member 92, and the third non-conductive adhesive member 93 may include a plurality of conductive particles. For example, in the first non-conductive adhesive member 91, the second non-conductive adhesive member 92, and the third non-conductive adhesive member 93, the first non-conductive adhesive member 91 forming the uppermost layer may include a plurality of conductive particles.

[0092] The plurality of conductive particles may be conductive powders and may include at least one conductive material selected from Sn, Cu, Ni, In, Ag, Au, C, Co, Fe, Cr, and Mo. The density of the plurality of conductive particles in the first non-conductive adhesive member 91 may be less than or equal to a predetermined value. Therefore, the first non-conductive adhesive member 91 can maintain its non-conductive properties.

[0093] Despite Figure 7 and Figure 8 The description includes three non-conductive adhesive members 91, 92, and 93 formed on the substrate 20, but this disclosure is not limited thereto. Furthermore, although in Figure 8 The description states that when the second conductive member 92 is black, the first conductive member 91 includes a plurality of conductive particles, but this disclosure is not limited thereto.

[0094] For example, four or more non-conductive adhesive components can be formed on the substrate 20. In this case, at least one of the non-conductive adhesive components may be black, and at least one of the non-conductive adhesive components may include conductive particles. Preferably, the topmost non-conductive adhesive component may be black, and the remaining non-conductive adhesive components may be transparent. Preferably, the bottommost non-conductive adhesive component may include conductive particles. Furthermore, preferably, the topmost non-conductive adhesive component may have the highest curing temperature and the highest viscosity, and the curing temperature and viscosity of the remaining non-conductive adhesive components may be set differently depending on the bonding process.

[0095] Embodiments of this disclosure may provide a display module, comprising: a substrate including a plurality of electrode pads; a first non-conductive adhesive member formed on the surface of the substrate and having a first curing temperature; a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature; and a plurality of light-emitting elements bonded to the plurality of electrode pads. The electrodes of the plurality of light-emitting elements can be sequentially bonded to the plurality of electrode pads by passing sequentially through the second non-conductive adhesive member and the first non-conductive adhesive member. The second curing temperature may be higher than the first curing temperature.

[0096] In addition, the first non-conductive adhesive member and the second non-conductive adhesive member can be formed as multiple layers on the surface of the substrate.

[0097] Furthermore, the first non-conductive adhesive component may have a first viscosity. The second non-conductive adhesive component may have a second viscosity. The second viscosity may be higher than the first viscosity.

[0098] Alternatively, the second non-conductive adhesive component can be a black non-conductive film.

[0099] Alternatively, the first non-conductive adhesive component may be a non-conductive film comprising conductive particles.

[0100] Additionally, the display module may include a third non-conductive adhesive member formed between the first non-conductive adhesive member and the second non-conductive adhesive member.

[0101] In addition, the third curing temperature of the third non-conductive adhesive component can be lower than the second curing temperature of the second non-conductive adhesive component.

[0102] In addition, the electrodes of multiple light-emitting elements can be sequentially bonded to multiple electrode pads by passing through the second non-conductive adhesive member, the third non-conductive adhesive member, and the first non-conductive adhesive member.

[0103] In addition, the third viscosity of the third non-conductive adhesive component can be lower than the second viscosity of the second non-conductive adhesive component.

[0104] Additionally, at least one of the second and third non-conductive adhesive components may be a black non-conductive film. The first non-conductive adhesive component may be a non-conductive film comprising conductive particles.

[0105] Embodiments of this disclosure provide a method for bonding multiple light-emitting elements to a substrate of a display module. The method may include: forming a first non-conductive adhesive member having a first curing temperature on a substrate including multiple electrode pads; forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member; aligning multiple electrodes of the light-emitting elements on the multiple electrode pads; applying heat and pressure to the multiple electrodes of the light-emitting elements such that the multiple electrodes of the light-emitting elements pass through the second non-conductive adhesive member within a first temperature range; applying heat and pressure to the multiple electrodes of the light-emitting elements such that the multiple electrodes of the light-emitting elements are inserted into the first non-conductive adhesive member and contact the multiple electrode pads within a second temperature range; and after the multiple electrodes of the light-emitting elements have passed through the second non-conductive adhesive member, applying heat and pressure to the multiple electrodes of the light-emitting elements such that the multiple electrodes of the light-emitting elements are bonded to the multiple electrode pads within the second non-conductive adhesive member. The second curing temperature may be higher than the first curing temperature.

[0106] In addition, the second viscosity of the second non-conductive adhesive component can be higher than the first viscosity of the first non-conductive adhesive component.

[0107] Additionally, forming the first non-conductive adhesive component may include attaching a first non-conductive film having a first curing temperature to the substrate via a lamination process. Forming the second non-conductive adhesive component may include attaching a second non-conductive film having a second curing temperature to the first non-conductive film via a lamination process.

[0108] Additionally, heat and pressure can be applied to multiple electrodes of the light-emitting element, causing the multiple electrodes of the light-emitting element to pass through the second non-conductive adhesive member within a first temperature range below the first curing temperature and the second curing temperature.

[0109] In addition, heat and pressure can be applied to multiple electrodes of the light-emitting element, so that the multiple electrodes of the light-emitting element are in contact with multiple electrode pads in the first non-conductive adhesive component within a second temperature range lower than the first curing temperature and the second curing temperature.

[0110] Additionally, the method may further include: curing a first non-conductive adhesive component at a temperature higher than a first curing temperature while multiple electrodes of the light-emitting element are in contact with multiple electrode pads.

[0111] Additionally, the method may further include: curing a second non-conductive adhesive component at a temperature higher than the second curing temperature while multiple electrodes of the light-emitting element are in contact with multiple electrode pads.

[0112] Alternatively, the second non-conductive adhesive component can be a black non-conductive film.

[0113] The first non-conductive adhesive component may be a non-conductive film containing conductive particles.

[0114] Additionally, forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member may include: forming a third non-conductive adhesive member having a third curing temperature on the first non-conductive adhesive member; and forming a second non-conductive adhesive member on the third non-conductive adhesive member.

[0115] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer equipment, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0116] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. Regarding the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It should be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to an item may include one or more things. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items listed together in the corresponding phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used simply to distinguish the respective component from another component and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0117] As used in conjunction with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or its smallest unit or part. For example, according to an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0118] The various embodiments described herein can be implemented as software (e.g., a program) including one or more instructions stored in a machine-readable storage medium (e.g., internal or external memory). For example, a processor of a machine (e.g., an electronic device) can invoke at least one of the one or more instructions stored in the storage medium and execute it with or without one or more other components under the control of the processor. This allows the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between cases where data is stored semi-permanently in the storage medium and cases where data is temporarily stored in the storage medium.

[0119] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be arranged separately in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as the corresponding components in the multiple components before integration. According to various embodiments, operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

Claims

1. A display module comprising: a substrate including a plurality of electrode pads; a first non-conductive adhesive member formed on a surface of the substrate and having a first curing temperature; a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature; and a plurality of light emitting elements bonded to the plurality of electrode pads; wherein the electrodes of the plurality of light emitting elements are bonded to the plurality of electrode pads by sequentially passing through the second non-conductive adhesive member and the first non-conductive adhesive member, respectively, and the second curing temperature is higher than the first curing temperature. The first non-conductive adhesive member and the second non-conductive adhesive member are formed as a plurality of layers on the surface of the substrate.

2. The display module of claim 1, wherein, 3. The display module of claim 1, the first non-conductive adhesive member has a first viscosity, and the second non-conductive adhesive member has a second viscosity, and wherein wherein the second viscosity is higher than the first viscosity. The second non-conductive adhesive member is a black non-conductive film.

4. The display module of claim 1, wherein, The first non-conductive adhesive member is a non-conductive film including conductive particles.

5. The display module of claim 1, wherein, 6. The display module of claim 1, further comprising: a third non-conductive adhesive member formed between the first non-conductive adhesive member and the second non-conductive adhesive member. The third curing temperature of the third non-conductive adhesive member is lower than the second curing temperature of the second non-conductive adhesive member.

7. The display module of claim 6, wherein, The electrodes of the plurality of light emitting elements are bonded to the plurality of electrode pads by sequentially passing through the second non-conductive adhesive member, the third non-conductive adhesive member, and the first non-conductive adhesive member, respectively.

8. The display module of claim 7, wherein, The third viscosity of the third non-conductive adhesive member is lower than the second viscosity of the second non-conductive adhesive member.

9. The display module of claim 6, wherein, 10. The display module of claim 6, at least one of the second non-conductive adhesive member and the third non-conductive adhesive member is a black non-conductive film, and wherein wherein the first non-conductive adhesive member is a non-conductive film including conductive particles.

11. A method of bonding a plurality of light emitting elements on a substrate of a display module, the method comprising: forming a first non-conductive adhesive member having a first curing temperature on a substrate including a plurality of electrode pads; forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member; aligning a plurality of electrodes of a light emitting element on the plurality of electrode pads; applying heat and pressure to the plurality of electrodes of the light emitting element such that the plurality of electrodes of the light emitting element pass through the second non-conductive adhesive member within a first temperature range; applying heat and pressure to the plurality of electrodes of the light emitting element such that the plurality of electrodes of the light emitting element are inserted into the first non-conductive adhesive member and in contact with the plurality of electrode pads within a second temperature range; and applying heat and pressure to the plurality of electrodes of the light emitting element after the plurality of electrodes of the light emitting element have passed through the second non-conductive adhesive member such that the plurality of electrodes of the light emitting element are bonded to the plurality of electrode pads within the second non-conductive adhesive member, wherein the second curing temperature is higher than the first curing temperature. A second viscosity of the second non-conductive adhesive member is higher than a first viscosity of the first non-conductive adhesive member.

12. The method of claim 11, wherein, 13. The method of claim 11, forming the first non-conductive adhesive member includes attaching a first non-conductive film having the first curing temperature on the substrate by a lamination process, and wherein, ​ wherein forming the second non-conductive adhesive member includes attaching a second non-conductive film having a second curing temperature to the first non-conductive film by a lamination process.

14. The method of claim 11, wherein, applying heat and pressure to the plurality of electrodes of the light emitting element such that the plurality of electrodes of the light emitting element pass through the second non-conductive adhesive member within a first temperature range that is lower than the first and second curing temperatures.

15. The method of claim 11, wherein, applying heat and pressure to the plurality of electrodes of the light emitting element such that the plurality of electrodes of the light emitting element make contact with the plurality of electrode pads in the first non-conductive adhesive member within a second temperature range that is lower than the first and second curing temperatures.

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