Golden finger lead blind drilling process of printed circuit board

Abstract

The invention relates to a gold finger wire blind drilling process of a printed circuit board. The process comprises the following steps of gold finger and wire pattern design, jig positioning design, offset inspection design, printed circuit board manufacturing, wet film filling, jig positioning hole manufacturing, plate positioning and fixing, blind drilling, film removing and cleaning. The printed circuit board obtained through the process has the burr-free effect, blind drilling deviation of a broken hole can be prevented by adopting the process, and the risk that in the prior art, due to the fact that golden finger color difference exists, front-end nickel and gold layers are suspended and prone to falling off, the golden fingers are short-circuited abnormally after being inserted and pulled is effectively avoided.

Description

Technical Field

[0001] This invention belongs to the field of printed circuit board manufacturing technology, and specifically discloses a blind drilling process for gold finger wires of printed circuit boards. Background Technology

[0002] With the rapid improvement of computer hardware performance, such as high-performance graphics cards, large-capacity storage devices, and high-speed network adapters, the demand for data transmission bandwidth has increased dramatically.

[0003] In the realm of graphics cards: Graphics cards are the core hardware in computers responsible for graphics rendering, image output, and parallel computing. Their technological development is deeply intertwined with the evolution of computer graphics, display requirements, and parallel computing applications. From initially being able to handle only simple pixel rendering to now supporting complex scenarios such as 4K / 8K gaming, AI training, and film and television special effects, graphics card technology has become a key driving force for the development of digital vision and high-performance computing.

[0004] In the field of storage devices: core storage media that have developed alongside the explosive growth in storage demand for digital devices. Their technological evolution revolves around four core objectives: "high density, high speed, high reliability, and low power consumption," which involve technological breakthroughs in multiple fields such as storage chip architecture, materials science, and interface protocols.

[0005] In the field of high-speed network adapters: With the rapid development of information technology, especially the Internet and multimedia technologies, network data traffic is increasing rapidly. Existing low-speed network adapters can no longer meet communication requirements, creating an urgent need for higher-speed, higher-performance network adapters. For example, in data centers, cloud computing, and the Internet of Things (IoT), network adapters are required to support high-speed, stable data transmission to meet the real-time processing and forwarding needs of large amounts of data.

[0006] As a key structure on the edge of a printed circuit board used for external connections, the performance of gold fingers directly determines the reliability, conductivity, and environmental resistance of the equipment. Blind drilling of gold finger conductors, as one of the core technologies in gold finger manufacturing, has huge market demand and promising development prospects.

[0007] In the design of blind-drilled gold finger conductors for printed circuit boards, burrs and deviations are easily generated during the processing of the blind-drilled gold finger conductors. Furthermore, the reverse etching process is prone to producing color differences in the gold fingers and gaps between the nickel and gold layers at the front end, which can easily lead to detachment and cause short circuits or other abnormalities after insertion and removal. Summary of the Invention

[0008] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a blind drilling process for gold finger conductors of printed circuit boards.

[0009] According to the technical solution provided by the present invention, the blind drilling process for the gold finger conductors of the printed circuit board includes the following steps: Step 1, Gold finger and wire design: According to the user's requirements, first design the corresponding gold finger pattern on the outer layer of the printed circuit board and design the gold finger wire pattern in the gold finger area, so that the gold finger wire corresponding to the gold finger pattern electrically connects all the gold fingers corresponding to the gold finger pattern together. Then design the manufacturing process of gold finger and gold finger wire. Step 2, Fixture positioning design: Design fixture positioning hole targets at the corners of the outer layer of the printed circuit board; Step 3, Offset Inspection Design: An offset inspection area is preset in the waste area of ​​the outer layer pattern of the printed circuit board. This offset inspection area is used to monitor the offset of the test hole relative to the conductor pattern during blind drilling. Step 4: Printed Circuit Board Fabrication: Fabricate the printed circuit board according to the design requirements of Steps 1, 2, and 3. Step 5, Wet film filling: Wet film is filled around the gold finger conductors and the pre-set blind drill hole area of ​​the printed circuit board to prevent burrs from being generated during blind drilling. By baking, the wet film hardens to form a dry film and adheres firmly to the printed circuit board, preventing burrs from being suspended in the air and unable to be cut off when the blind drill breaks the hole. Step 6: Fixture positioning hole fabrication: Machine fixture positioning holes at the target location of the fixture positioning hole on the printed circuit board to ensure that the printed circuit board is fixed during blind drilling. Step 7: Positioning and fixing the board: Position and fix the printed circuit board on the blind drilling machine table through the positioning holes of the fixture; Step 8, Blind Drilling: Using a blind drill, first drill test holes in the waste area of ​​the printed circuit board. Compare the offset of the test hole relative to the wire pattern. If the offset of the test hole relative to the wire pattern is within the specified range, then use the blind drill to drill a break hole. The break hole breaks the gold finger wire between adjacent gold fingers. Step 9, Film Removal and Cleaning: After blind drilling is completed, remove the dry film and clean away the dust generated during blind drilling of the printed circuit board.

[0010] As a preferred option: In step five, bake at 140-160℃ for 20-60 minutes to harden the wet film and form a dry film.

[0011] As a preferred option: In step six, an X-Ray drilling machine is used to machine fixture positioning holes at the fixture positioning hole target on the printed circuit board.

[0012] The printed circuit board obtained by the process of the present invention has a burr-free effect. The process of the present invention can prevent the blind drilling of the disconnect hole from being off-center. The process of the present invention effectively avoids the risks of gold finger color difference and the front nickel and gold layer being suspended and easily falling off, which may cause short circuit abnormalities of gold fingers after insertion and removal in the prior art. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0014] Example 1 A blind drilling process for gold finger conductors on a printed circuit board, the process comprising the following steps: Step 1, Gold finger and wire design: According to the user's requirements, first design the corresponding gold finger pattern on the outer layer of the printed circuit board and design the gold finger wire pattern in the gold finger area, so that the gold finger wire corresponding to the gold finger pattern electrically connects all the gold fingers corresponding to the gold finger pattern together. Then design the manufacturing process of gold finger and gold finger wire. Step 2, Fixture positioning design: Design fixture positioning hole targets at the corners of the outer layer of the printed circuit board; Step 3, Offset Inspection Design: An offset inspection area is preset in the waste area of ​​the outer layer pattern of the printed circuit board. This offset inspection area is used to monitor the offset of the test hole relative to the conductor pattern during blind drilling. Step 4: Printed Circuit Board Fabrication: Fabricate the printed circuit board according to the design requirements of Steps 1, 2, and 3. Step 5, wet film filling: Fill the area around the gold finger conductors and the pre-set blind drill hole area of ​​the printed circuit board with wet film, and bake at 140℃ for 60 minutes to harden the wet film into a dry film and firmly adhere it to the printed circuit board, so as to prevent burrs from being suspended and unable to be cut off when blind drilling breaks the hole. Step 6: Fixture positioning hole fabrication: Use an X-Ray drilling machine to machine fixture positioning holes at the target location on the printed circuit board to ensure the printed circuit board is fixed during blind drilling. Step 7: Positioning and fixing the board: Position and fix the printed circuit board on the blind drilling machine table through the positioning holes of the fixture; Step 8, Blind Drilling: Using a blind drill, first drill test holes in the waste area of ​​the printed circuit board. Compare the offset of the test hole relative to the wire pattern. If the offset of the test hole relative to the wire pattern is within the specified range, then use the blind drill to drill a break hole. The break hole breaks the gold finger wire between adjacent gold fingers. Step 9, Film Removal and Cleaning: After blind drilling is completed, remove the dry film and clean away the dust generated during blind drilling of the printed circuit board.

[0015] Example 2 A blind drilling process for gold finger conductors on a printed circuit board, the process comprising the following steps: Step 1, Gold finger and wire design: According to the user's requirements, first design the corresponding gold finger pattern on the outer layer of the printed circuit board and design the gold finger wire pattern in the gold finger area, so that the gold finger wire corresponding to the gold finger pattern electrically connects all the gold fingers corresponding to the gold finger pattern together. Then design the manufacturing process of gold finger and gold finger wire. Step 2, Fixture positioning design: Design fixture positioning hole targets at the corners of the outer layer of the printed circuit board; Step 3, Offset Inspection Design: An offset inspection area is preset in the waste area of ​​the outer layer pattern of the printed circuit board. This offset inspection area is used to monitor the offset of the test hole relative to the conductor pattern during blind drilling. Step 4: Printed Circuit Board Fabrication: Fabricate the printed circuit board according to the design requirements of Steps 1, 2, and 3. Step 5, wet film filling: Fill the area around the gold finger conductors and the pre-set blind drill hole area of ​​the printed circuit board with wet film, and bake at 150℃ for 30 minutes to harden the wet film into a dry film and firmly adhere it to the printed circuit board, so as to prevent burrs from being suspended and unable to be cut off when blind drilling breaks the hole. Step 6: Fixture positioning hole fabrication: Use an X-Ray drilling machine to machine fixture positioning holes at the target location on the printed circuit board to ensure the printed circuit board is fixed during blind drilling. Step 7: Positioning and fixing the board: Position and fix the printed circuit board on the blind drilling machine table through the positioning holes of the fixture; Step 8, Blind Drilling: Using a blind drill, first drill test holes in the waste area of ​​the printed circuit board. Compare the offset of the test hole relative to the wire pattern. If the offset of the test hole relative to the wire pattern is within the specified range, then use the blind drill to drill a break hole. The break hole breaks the gold finger wire between adjacent gold fingers. Step 9, Film Removal and Cleaning: After blind drilling is completed, remove the dry film and clean away the dust generated during blind drilling of the printed circuit board.

[0016] Example 3 A blind drilling process for gold finger conductors on a printed circuit board, the process comprising the following steps: Step 1, Gold finger and wire design: According to the user's requirements, first design the corresponding gold finger pattern on the outer layer of the printed circuit board and design the gold finger wire pattern in the gold finger area, so that the gold finger wire corresponding to the gold finger pattern electrically connects all the gold fingers corresponding to the gold finger pattern together. Then design the manufacturing process of gold finger and gold finger wire. Step 2, Fixture positioning design: Design fixture positioning hole targets at the corners of the outer layer of the printed circuit board; Step 3, Offset Inspection Design: An offset inspection area is preset in the waste area of ​​the outer layer pattern of the printed circuit board. This offset inspection area is used to monitor the offset of the test hole relative to the conductor pattern during blind drilling. Step 4: Printed Circuit Board Fabrication: Fabricate the printed circuit board according to the design requirements of Steps 1, 2, and 3. Step 5, wet film filling: Fill the area around the gold finger conductors and the pre-set blind drill hole area of ​​the printed circuit board with wet film, bake at 160℃ for 20 minutes to harden the wet film into a dry film and firmly adhere it to the printed circuit board, so as to prevent burrs from being suspended and unable to be cut off when blind drilling the hole. Step 6: Fixture positioning hole fabrication: Use an X-Ray drilling machine to machine fixture positioning holes at the target location on the printed circuit board to ensure the printed circuit board is fixed during blind drilling. Step 7: Positioning and fixing the board: Position and fix the printed circuit board on the blind drilling machine table through the positioning holes of the fixture; Step 8, Blind Drilling: Using a blind drill, first drill test holes in the waste area of ​​the printed circuit board. Compare the offset of the test hole relative to the wire pattern. If the offset of the test hole relative to the wire pattern is within the specified range, then use the blind drill to drill a break hole. The break hole breaks the gold finger wire between adjacent gold fingers. Step 9, Film Removal and Cleaning: After blind drilling is completed, remove the dry film and clean away the dust generated during blind drilling of the printed circuit board.

[0017] In this invention, the fixture positioning hole is a through hole, while the test hole and the disconnection hole are both blind holes.

[0018] The process of this invention involves designing fixture positioning hole targets at the corners of the outer layer pattern of the printed circuit board, and using an X-Ray drilling machine to process fixture positioning holes at the fixture positioning hole targets of the printed circuit board. The printed circuit board is positioned and fixed on the blind drilling machine table through the fixture positioning holes, so that the outer layer pattern can be more accurately aligned when the blind drilling breaks the hole.

[0019] The process of this invention involves filling a wet film around the gold finger conductor and the pre-set blind drill hole area, and then baking it to harden the wet film into a dry film that firmly adheres to the printed circuit board. This prevents burrs from being suspended in the air and unable to be cut off when the blind drill breaks the hole, so that the printed circuit board after blind drilling achieves a burr-free effect.

[0020] The process of this invention involves first blindly drilling test holes in the waste area of ​​the printed circuit board, comparing the offset of the test holes relative to the conductor pattern, and then blindly drilling disconnect holes using a blind drill machine, which can prevent the disconnect holes from being drilled off-center.

[0021] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A blind drilling process for gold finger conductors on a printed circuit board, characterized in that... The process includes the following steps: Step 1, Gold finger and wire design: According to the user's requirements, first design the corresponding gold finger pattern on the outer layer of the printed circuit board and design the gold finger wire pattern in the gold finger area, so that the gold finger wire corresponding to the gold finger pattern electrically connects all the gold fingers corresponding to the gold finger pattern together. Then design the manufacturing process of gold finger and gold finger wire. Step 2, Fixture positioning design: Design fixture positioning hole targets at the corners of the outer layer of the printed circuit board; Step 3, Offset Inspection Design: An offset inspection area is preset in the waste area of ​​the outer layer pattern of the printed circuit board. This offset inspection area is used to monitor the offset of the test hole relative to the conductor pattern during blind drilling. Step 4: Printed Circuit Board Fabrication: Fabricate the printed circuit board according to the design requirements of Steps 1, 2, and 3. Step 5, Wet film filling: Wet film is filled around the gold finger conductors and the pre-set blind drill hole area of ​​the printed circuit board to prevent burrs from being generated during blind drilling. By baking, the wet film hardens to form a dry film and adheres firmly to the printed circuit board, preventing burrs from being suspended in the air and unable to be cut off when the blind drill breaks the hole. Step 6: Fixture positioning hole fabrication: Machine fixture positioning holes at the target location of the fixture positioning hole on the printed circuit board to ensure that the printed circuit board is fixed during blind drilling. Step 7: Positioning and fixing the board: Position and fix the printed circuit board on the blind drilling machine table through the positioning holes of the fixture; Step 8, Blind Drilling: Using a blind drill, first drill test holes in the waste area of ​​the printed circuit board. Compare the offset of the test hole relative to the wire pattern. If the offset of the test hole relative to the wire pattern is within the specified range, then use the blind drill to drill a break hole. The break hole breaks the gold finger wire between adjacent gold fingers. Step 9, Film Removal and Cleaning: After blind drilling is completed, remove the dry film and clean away the dust generated during blind drilling of the printed circuit board.

2. The blind drilling process for gold finger conductors of printed circuit boards as described in claim 1, characterized in that: In step five, bake at 140-160℃ for 20-60 minutes to harden the wet film and form a dry film.

3. The blind drilling process for gold finger conductors of printed circuit boards as described in claim 1, characterized in that: In step six, an X-Ray drilling machine is used to machine fixture positioning holes at the fixture positioning hole target on the printed circuit board.