Wafer carrying device and carrying method thereof

Abstract

The invention discloses a wafer carrying device and a carrying method thereof, and relates to the technical field of semiconductors. The wafer carrying device comprises a rack, a transfer chamber, a dispatching chamber, a carrying manipulator and a process chamber. The transfer chamber, the dispatching chamber and the process chamber are all installed on the rack, the transfer chamber and the process chamber are jointly arranged outside the dispatching chamber in a surrounding mode and both communicate with the dispatching chamber, and the carrying mechanical arm is installed in the dispatching chamber; the carrying manipulator comprises a driving mechanism, a linkage arm, a first driving piece and a rotating arm, the driving mechanism is connected with the linkage arm, the first driving piece is installed on the linkage arm and connected with the rotating arm, the rotating arm comprises a first arm section and a second arm section, the first arm section is used for taking the to-be-processed wafer out of the transfer chamber or sending the to-be-processed wafer to the process chamber, and the second arm section is used for taking the to-be-processed wafer out of the process chamber; and the second arm section is used for taking the product wafer out of the process chamber or conveying the product wafer to the transfer chamber. The wafer carrying device provided by the invention can realize the blanking of the product wafer and the feeding of the to-be-processed wafer at one time, shortens the wafer conveying period, improves the wafer conveying efficiency, and improves the semiconductor production efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a wafer handling device and a handling method thereof. Background Technology

[0002] Currently, during the wafer deposition process using semiconductor equipment, robotic arms are needed to handle the wafers and automate their transfer. After the wafer is processed in the process room, the robotic arm first removes the processed wafer from the process room and sends it to the transfer room, then removes a new wafer from the transfer room and sends it to the process room for processing. This means that after each wafer processing cycle, the robotic arm needs to travel back and forth between the process room and the transfer room twice, resulting in a long transfer cycle and low transfer efficiency, directly impacting semiconductor production efficiency.

[0003] Therefore, designing and manufacturing a wafer handling device and method with short transfer cycle and high transfer efficiency is particularly important in semiconductor production. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer handling device that can realize the unloading of product wafers and the loading of wafers to be processed in one go, shorten the wafer transfer cycle, improve wafer transfer efficiency, and improve semiconductor production efficiency.

[0005] Another objective of this invention is to provide a wafer handling method for a wafer handling device, which can realize the unloading of product wafers and the loading of wafers to be processed in one go, shorten the wafer transfer cycle, improve wafer transfer efficiency, and improve semiconductor production efficiency.

[0006] The present invention is achieved by the following technical solution.

[0007] A wafer handling device includes a rack, a transfer room, a scheduling room, a handling robot, and a process room. The transfer room, scheduling room, and process room are all installed on the rack. The transfer room and process room are jointly enclosed outside the scheduling room and are all connected to the scheduling room. The handling robot is installed inside the scheduling room. The process room is provided with a carrier for carrying wafers to be processed. The process room is used to process the wafers to be processed placed on the carrier into product wafers. The transfer room is provided with a loading rack for loading wafers to be processed and / or product wafers. The handling robot includes a drive mechanism, a linkage arm, a first drive component, and a rotating arm. The drive mechanism is connected to the linkage arm and is used to drive the linkage arm to rotate or extend. The first drive component is installed on the linkage arm and connected to the rotating arm. The first drive component is used to drive the rotating arm to rotate. The rotating arm includes a first arm segment and a second arm segment. The first arm segment is used to remove the wafer to be processed from the transfer chamber or send it to the process chamber. The second arm segment is used to remove the product wafer from the process chamber or send it to the transfer chamber.

[0008] Optionally, the rotating arm further includes a connecting section, the first arm section is connected to the second arm section through the connecting section, the first arm section, the connecting section and the second arm section are arranged sequentially along the length direction of the rotating arm, the connecting section is provided with a rotating shaft, and the first driving member is connected to the rotating shaft.

[0009] Optionally, there are two of each of the first drive unit, rotating arm, carrier seat, and loading frame. The linkage arm includes a forearm, a connecting arm, and another forearm connected in sequence. The two forearms are arranged opposite to each other at both ends of the connecting arm. Each first drive unit is installed at the free end of a forearm and connected to a rotating arm. The two carrier seats are spaced apart, and the two loading frames are spaced apart.

[0010] Optionally, the drive mechanism includes two drive components, each including a second drive member, a rear arm, and a middle arm. The second drive member is connected to the rear arm, the rear arm is hinged to the middle arm, one end of the connecting arm is hinged to one middle arm, and the other end is hinged to another middle arm. The two second drive members are arranged overlappingly and rotate synchronously at the same speed. The two forearms can rotate synchronously when the two second drive members rotate in the same direction, and the two forearms can also extend and retract synchronously when the two second drive members rotate in opposite directions.

[0011] Optionally, the handling robot also includes a third drive unit and a lifting frame. The third drive unit is connected to the lifting frame and is used to drive the lifting frame to rise or fall. The drive mechanism is mounted on the lifting frame.

[0012] Optionally, the loading rack includes multiple loading compartments, which are arranged in an overlapping manner. Each loading compartment is provided with a support surface for supporting the wafer to be processed or the product wafer. The support surface is provided with a clearance groove for the first arm segment or the second arm segment to extend into.

[0013] Optionally, the wafer handling device further includes a fourth drive unit and a lifting column. The fourth drive unit is mounted on the rack, one end of the lifting column is connected to the fourth drive unit, and the other end extends into the transfer chamber and is connected to the loading rack. The fourth drive unit is used to drive the loading rack to rise or fall via the lifting column.

[0014] Optionally, the dispatch room is rectangular in shape, and there are three process rooms. The transfer room and the three process rooms are arranged one-to-one on the four sides of the dispatch room.

[0015] Optionally, the control room includes a storage compartment, a cover plate, and a flip-top mechanism. The cover plate is placed on the storage compartment, and a handling robot is installed inside the storage compartment. The flip-top mechanism includes a base, a handle, a reducer, a worm gear, a worm wheel, and a flip-top arm. The base is connected to the storage compartment. The worm gear and the worm wheel are rotatably installed inside the base, and the worm gear and the worm wheel cooperate with each other. The handle is connected to the worm gear through the reducer. One end of the flip-top arm is connected to the worm wheel, and the other end is hinged to the cover plate.

[0016] Optionally, the bottom of the transfer chamber is provided with multiple leveling supports arranged in a rectangular array. Each leveling support includes a first base, an adjusting screw, a locking nut, a buffer washer, a sliding self-aligning bearing, and a second base. The first base is connected to the transfer chamber, and the second base is connected to the frame. One end of the adjusting screw is connected to the first base, and the other end is connected to the second base through the sliding self-aligning bearing. The locking nut is sleeved on the adjusting screw and threadedly engages with it, and abuts against the first base. The adjusting screw is provided with a wrench portion, and the buffer washer is sleeved on the adjusting screw and positioned between the wrench portion and the sliding self-aligning bearing.

[0017] A wafer handling method for a wafer handling apparatus, applied to the aforementioned wafer handling apparatus, the wafer handling method comprising: The first arm of the handling robot removes the first set of wafers to be processed from the loading rack and sends them to the carrier. The first set of wafers to be processed is processed into the first set of product wafers by using the process chamber and the first arm of the handling robot to remove the second set of wafers to be processed from the loading rack. The first set of product wafers is removed from the carrier using the second arm of the handling robot, and then the second set of wafers to be processed is sent to the carrier using the first arm of the handling robot. The second set of wafers to be processed is processed into the second set of product wafers by using the process chamber and placing them on the carrier. At the same time, the second arm of the handling robot is used to send the first set of product wafers to the loading rack. Then, the first arm of the handling robot is used to remove the third set of wafers to be processed from the loading rack.

[0018] The wafer handling device and method provided by this invention have the following beneficial effects: The wafer handling device provided by this invention includes a transfer chamber, a scheduling chamber, and a process chamber all mounted on a rack. The transfer chamber and the process chamber are jointly located outside the scheduling chamber and are both connected to it. A handling robot is mounted inside the scheduling chamber. The process chamber is equipped with a support for holding wafers to be processed. The process chamber is used to process the wafers to be processed placed on the support into product wafers. The transfer chamber is equipped with a loading rack for loading wafers to be processed and / or product wafers. The handling robot includes a drive mechanism, a linkage arm, a first drive component, and a rotating arm. The drive mechanism is connected to the linkage arm and is used to drive the linkage arm to rotate or extend. The first drive component is mounted on the linkage arm and connected to the rotating arm. The first drive component is used to drive the rotating arm to rotate. The rotating arm includes a first arm segment and a second arm segment. The first arm segment is used to remove the wafers to be processed from the transfer chamber or send them to the process chamber. The second arm segment is used to remove the product wafers from the process chamber or send them to the transfer chamber. Compared with the prior art, the wafer handling device provided by the present invention adopts a linkage arm connected to the drive mechanism and a first drive component installed on the linkage arm and connected to the rotating arm, so it can realize the unloading of product wafers and the loading of wafers to be processed in one go, shorten the wafer transfer cycle, improve wafer transfer efficiency, and improve semiconductor production efficiency.

[0019] The wafer handling method provided by this invention, applied to a wafer handling device, can realize the unloading of product wafers and the loading of wafers to be processed in one go, shortening the wafer transfer cycle, improving wafer transfer efficiency, and improving semiconductor production efficiency. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the wafer handling device provided in an embodiment of the present invention from one perspective; Figure 2 This is a schematic diagram of the wafer handling device provided in an embodiment of the present invention from another perspective; Figure 3 This is a schematic diagram of the structure of the handling robot in the wafer handling device provided in an embodiment of the present invention from one perspective; Figure 4 A schematic diagram of the structure of the rotating arm of the handling robot in the wafer handling device provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the handling robot in the wafer handling device provided in an embodiment of the present invention from another perspective; Figure 6This is a schematic diagram of the structure of the fourth driving component in the wafer handling device provided in the embodiment of the present invention, which is connected to the loading frame via a lifting column; Figure 7 A schematic diagram of the flip-top mechanism of the scheduling chamber in the wafer handling device provided in an embodiment of the present invention; Figure 8 This is a cross-sectional view of the leveling support of the transfer chamber in the wafer handling device provided in an embodiment of the present invention.

[0022] Icons: 100-Wafer handling device; 110-Rack; 120-Transfer chamber; 121-Loading rack; 122-Loading compartment; 123-Support surface; 124-Allowing groove; 125-Leveling support; 1251-First seat; 1252-Adjusting screw; 1253-Locking nut; 1254-Buffer pad; 1255-Sliding self-aligning bearing; 1256-Second seat; 1257-Wrench; 130-Dispatch chamber; 131-Compartment; 1311-Opening; 132-Cover plate; 133-Flip-cover mechanism; 1331-Base; 1332-Handle; 1333-Reducer; 1334-Worm gear; 1335- Worm gear; 1336-Flip arm; 140-Handling robot; 141-Drive mechanism; 1411-Drive assembly; 1412-Second drive component; 1413-Rear arm; 1414-Middle arm; 142-Linked arm; 1421-Forearm; 1422-Connecting arm; 143-First drive component; 144-Rotating arm; 1441-First arm segment; 1442-Second arm segment; 1443-Connecting segment; 1444-Rotating shaft; 145-Third drive component; 146-Lifting frame; 150-Process chamber; 151-Bearing seat; 160-Fourth drive component; 170-Lifting column; 180-Atmospheric robot; 190-Wafer box. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] In the description of this invention, it should be noted that the terms "inner," "outer," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," "installed," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, features in the following embodiments can be combined with each other.

[0029] Please refer to the reference. Figure 1 and Figure 2 This invention provides a wafer handling device 100 for handling wafers to facilitate semiconductor production. It can simultaneously unload product wafers and load wafers to be processed, shortening the wafer transfer cycle, improving transfer efficiency, and increasing semiconductor production efficiency.

[0030] The wafer handling device 100 includes a rack 110, a transfer chamber 120, a dispatching chamber 130, a handling robot 140, and a process chamber 150. The transfer chamber 120, dispatching chamber 130, and process chamber 150 are all mounted on the rack 110, which is used to secure the transfer chamber 120, dispatching chamber 130, and process chamber 150. The transfer chamber 120 and process chamber 150 are both located outside the dispatching chamber 130 and are connected to the dispatching chamber 130. A handling robot 140 is installed in the dispatch room 130. A carrier 151 for holding wafers to be processed is provided in the process room 150. The process room 150 is used to process the wafers placed on the carrier 151 into product wafers. A loading rack 121 for loading wafers to be processed and / or product wafers is provided in the transfer room 120. The transfer room 120 is used to transfer wafers to be processed and / or product wafers, and also to cool the product wafers. Specifically, during the operation of the wafer handling device 100, the handling robot 140 can transfer wafers to be processed in the transfer room 120 to the process room 150 to realize the wafer loading function. The handling robot 140 can also transfer the processed product wafers in the process room 150 to the transfer room 120 to realize the product unloading function.

[0031] Please refer to the reference. Figure 3 and Figure 4 The handling robot 140 includes a drive mechanism 141, a linkage arm 142, a first drive member 143, and a rotating arm 144. The drive mechanism 141 is connected to the linkage arm 142 and is used to drive the linkage arm 142 to rotate or extend. The first drive member 143 is mounted on the linkage arm 142 and connected to the rotating arm 144. The first drive member 143 is used to drive the rotating arm 144 to rotate. The rotating arm 144 includes a first arm segment 1441 and a second arm segment 1442. The first arm segment 1441 is used to remove the wafer to be processed from the transfer chamber 120 or send it to the process chamber 150. The second arm segment 1442 is used to remove the product wafer from the process chamber 150 or send it to the transfer chamber 120. During the operation of the handling robot 140, on the one hand, the drive mechanism 141 drives the linkage arm 142 to rotate or extend and retract, so as to adjust the position of the rotating arm 144, so that the rotating arm 144 can extend into or retract from the transfer chamber 120, or extend into or retract from the process chamber 150. On the other hand, the first drive component 143 drives the rotating arm 144 to rotate, so as to selectively control the first arm segment 1441 or the second arm segment 1442 to perform loading and unloading operations.

[0032] Specifically, the rotating arm 144 can simultaneously carry two wafers, one of which is a wafer to be processed, carried on the first arm segment 1441, and the other is a product wafer, carried on the second arm segment 1442. In this way, the wafer to be processed can be loaded immediately after the product wafer is unloaded in the process chamber 150, realizing the unloading of the product wafer and the loading of the wafer to be processed in one go, shortening the wafer transfer cycle, improving wafer transfer efficiency, and improving semiconductor production efficiency.

[0033] Optionally, the rotating arm 144 further includes a connecting section 1443. The first arm section 1441 is connected to the second arm section 1442 via the connecting section 1443, and the first arm section 1441, the connecting section 1443, and the second arm section 1442 are arranged sequentially along the length of the rotating arm 144. Specifically, the connecting section 1443 is provided with a rotating shaft 1444, and a first driving member 143 is connected to the rotating shaft 1444. The first driving member 143 is used to drive the connecting section 1443 to rotate via the rotating shaft 1444, thereby simultaneously driving the first arm section 1441 and the second arm section 1442 to rotate. The first arm section 1441 and the second arm section 1442 are symmetrically arranged with the rotating shaft 1444 as the center. After the first driving member 143 drives the rotating shaft 1444 to rotate 180 degrees, the positions of the first arm section 1441 and the second arm section 1442 are interchanged. In this embodiment, the first arm section 1441, the connecting section 1443, and the second arm section 1442 are integrally formed to improve the connection strength.

[0034] In this embodiment, there are two of each of the first driving member 143, rotating arm 144, carrier 151, and loading rack 121, so as to simultaneously load and unload two wafers, further improving wafer transfer efficiency and semiconductor production efficiency. Specifically, the linkage arm 142 includes a front arm 1421, a connecting arm 1422, and another front arm 1421 connected in sequence. The two front arms 1421 are disposed opposite to each other at both ends of the connecting arm 1422 and are both connected to the connecting arm 1422. The front arm 1421, the connecting arm 1422, and the other front arm 1421 together form a U-shape. Each first driving member 143 is installed at the free end of one front arm 1421 (the end away from the connecting arm 1422) and connected to a rotating arm 144. Each first driving member 143 is used to drive one rotating arm 144 to rotate.

[0035] Furthermore, two carrier seats 151 are spaced apart, and two loading racks 121 are spaced apart. The distance between the two carrier seats 151 is the same as the distance between the two loading racks 121, and matches the length of the connecting arm 1422, so that the handling robot 140 can simultaneously load and unload two wafers.

[0036] Optionally, the drive mechanism 141 includes two drive components 1411. Each drive component 1411 includes a second drive member 1412, a rear arm 1413, and a middle arm 1414. The second drive member 1412 is connected to the rear arm 1413, and the rear arm 1413 is hinged to the middle arm 1414. One end of the connecting arm 1422 is hinged to one middle arm 1414, and the other end is hinged to the other middle arm 1414. The second drive member 1412 can drive the rear arm 1413 to rotate, thereby driving the linkage arm 142 to move through the middle arm 1414. Specifically, the two second drive members 1412 are stacked and rotate synchronously at the same speed. Each second drive member 1412 can drive a rear arm 1413 to rotate. During this process, due to the limiting effect of the linkage arm 142, the two forearms 1421 move in unison. The two forearms 1421 can rotate synchronously when the two second drive members 1412 rotate in the same direction, and the two forearms 1421 can also extend and retract synchronously when the two second drive members 1412 rotate in opposite directions. The transmission structure is simple and efficient, and saves space.

[0037] Please refer to Figure 5 Optionally, the handling robot 140 also includes a third drive unit 145 and a lifting frame 146. The third drive unit 145 is connected to the lifting frame 146 and is used to drive the lifting frame 146 to rise or fall. The drive mechanism 141 is mounted on the lifting frame 146. The third drive unit 145 can drive the rotating arm 144 to rise or fall sequentially through the lifting frame 146, the drive mechanism 141, the linkage arm 142, and the first drive unit 143, so as to facilitate the picking and placing of wafers.

[0038] Please refer to Figure 6 Optionally, the loading rack 121 includes multiple loading compartments 122. The multiple loading compartments 122 are arranged in an overlapping manner, and each loading compartment 122 is used to hold one wafer (wafer to be processed or product wafer). The multiple loading compartments 122 work together to facilitate the simultaneous storage of multiple wafers, further improving wafer transfer efficiency and semiconductor production efficiency.

[0039] Specifically, the loading compartment 122 is provided with a support surface 123, which is used to support the wafer to be processed or the product wafer. The support surface 123 is provided with a clearance groove 124, which is used for the first arm segment 1441 or the second arm segment 1442 to extend into. During the process of placing the product wafer onto the support surface 123 using the second arm segment 1442, the linkage arm 142 is first moved by rotating (rotating in the same direction and / or in opposite directions) through two second driving members 1412, and the rotating arm 144 is rotated by the first driving member 143, so that the second arm segment 1442 carries the product wafer into the transfer chamber 120 and moves it above the clearance slot 124; then the lifting frame 146 is lowered by the third driving member 145, so that the second arm segment 1442 descends and sinks into the clearance slot 124. During this process, the product wafer is supported on the support surface 123 by the limiting effect of the support surface 123, while the second arm segment 1442 continues to descend, so that the second arm segment 1442 separates from the product wafer; then the linkage arm 142 is moved by rotating (rotating in the same direction and / or in opposite directions) through two second driving members 1412, so that the second arm segment 1442 retracts out of the clearance slot 124 and exits the transfer chamber 120.

[0040] Similarly, during the process of removing the wafer to be processed from the support surface 123 using the first arm segment 1441, the linkage arm 142 is first driven to move by the rotation of the two second drive members 1412 (rotating in the same direction and / or in opposite directions), and the rotating arm 144 is driven to rotate by the first drive member 143, so that the first arm segment 1441 enters the transfer chamber 120 and extends into the clearance slot 124; then the lifting frame 146 is driven to rise by the third drive member 145, so that the first arm segment 1441 rises away from the clearance slot 124 and is higher than the support surface 123. During this process, the wafer to be processed is lifted by the first arm segment 1441 and rises together with the first arm segment 1441, so that the wafer to be processed is separated from the support surface 123; then the linkage arm 142 is driven to move by the rotation of the two second drive members 1412 (rotating in the same direction and / or in opposite directions), so that the first arm segment 1441 exits the transfer chamber 120.

[0041] Optionally, the wafer handling device 100 further includes a fourth drive unit 160 and a lifting column 170. The fourth drive unit 160 is mounted on the rack 110. One end of the lifting column 170 is connected to the fourth drive unit 160, and the other end extends into the transfer chamber 120 and is connected to the loading rack 121. The fourth drive unit 160 is used to drive the loading rack 121 to rise or fall via the lifting column 170, so as to adjust the height position of multiple loading compartments 122, which facilitates the removal of different wafers to be processed from the loading compartments 122 and facilitates the storage of different product wafers in the loading compartments 122.

[0042] Please refer to the reference. Figure 1 , Figure 2 , Figure 7 and Figure 8 In this embodiment, the scheduling chamber 130 is rectangular, and there are three process chambers 150. The transfer chamber 120 and the three process chambers 150 are arranged correspondingly on the four sides of the scheduling chamber 130 to achieve a reasonable layout of the scheduling chamber 130, transfer chamber 120, and three process chambers 150, reduce the space occupied, improve the structural compactness of the wafer handling device 100, and improve the wafer transfer efficiency, thereby improving the semiconductor production efficiency. However, it is not limited to this. In other embodiments, the scheduling chamber 130 may also be triangular or pentagonal, and the number of process chambers 150 may be two or four. There is no specific limitation on the shape of the scheduling chamber 130 or the number of process chambers 150.

[0043] The control room 130 includes a housing 131, a cover 132, and a flip-top mechanism 133. The cover 132 covers the housing 131, and the handling robot 140 is housed inside the housing 131. The cover 132 and the housing 131 together form a sealed cavity to ensure that the handling robot 140 operates in a vacuum environment. The flip-top mechanism 133 is installed on the housing 131 and connected to the cover 132. The flip-top mechanism 133 is used to rotate the cover 132 upwards and open the housing 131, facilitating maintenance and cleaning of the handling robot 140. Specifically, the storage chamber 131 is rectangular in shape, and the transfer chamber 120 and three process chambers 150 are respectively located on the four side walls of the storage chamber 131. Each side wall of the storage chamber 131 has two openings 1311 for the handling robot 140 to pass through, so that the handling robot 140 can extend into the transfer chamber 120 or any of the process chambers 150, thereby facilitating the unloading of product wafers and the loading of wafers to be processed.

[0044] Furthermore, the flip-top mechanism 133 includes a base 1331, a handle 1332, a reducer 1333, a worm gear 1334, a worm wheel 1335, and a flip-top arm 1336. The base 1331 is connected to the compartment 131. Both the worm gear 1334 and the worm wheel 1335 are rotatably mounted within the base 1331, and the worm gear 1334 and the worm wheel 1335 cooperate. The handle 1332 is connected to the worm gear 1334 through the reducer 1333. One end of the flip-top arm 1336 is connected to the worm wheel 1335, and the other end is hinged to the cover plate 132. Specifically, during the flip-top operation of the flip-top mechanism 133, the operator manually turns the handle 1332 to drive the worm gear 1334 to rotate through the reducer 1333. This, in turn, drives the flip-top arm 1336 to rotate through the cooperation of the worm gear 1334 and the worm wheel 1335, thereby causing the cover plate 132 to rotate upward and open the compartment 131.

[0045] Optionally, the bottom of the transfer chamber 120 is provided with multiple leveling supports 125. The multiple leveling supports 125 are arranged in a rectangular array, and the multiple leveling supports 125 work together to achieve the stable leveling function of the transfer chamber 120 and ensure the levelness of the transfer chamber 120.

[0046] Furthermore, the leveling support 125 includes a first base 1251, an adjusting screw 1252, a locking nut 1253, a buffer pad 1254, a sliding self-aligning bearing 1255, and a second base 1256. The first base 1251 is connected to the transfer chamber 120, and the second base 1256 is connected to the frame 110. One end of the adjusting screw 1252 is connected to the first base 1251, and the other end is connected to the second base 1256 through the sliding self-aligning bearing 1255. The locking nut 1253 is sleeved on the adjusting screw 1252 and threadedly engaged with it, and abuts against the first base 1251. The adjusting screw 1252 is provided with a wrench portion 1257, and the buffer pad 1254 is sleeved on the adjusting screw 1252 and positioned between the wrench portion 1257 and the sliding self-aligning bearing 1255. Specifically, during the leveling process of the leveling support 125, the staff adjusts the height of each position at the bottom of the transfer chamber 120 by turning the locking nuts 1253 of each leveling support 125, so that the bottom of the transfer chamber 120 is on the horizontal plane, thus realizing the leveling function.

[0047] Optionally, the wafer handling device 100 also includes an atmospheric robot 180 and a wafer cassette 190. Both the atmospheric robot 180 and the wafer cassette 190 are mounted on the rack 110. The wafer cassette 190 is used to hold wafers to be processed, and the atmospheric robot 180 is located in the atmospheric environment. The atmospheric robot 180 is used to deliver the wafers to be processed in the wafer cassette 190 to the loading rack 121 in the transfer room 120.

[0048] Furthermore, under normal circumstances, the transfer chamber 120, the scheduling chamber 130, and multiple process chambers 150 are all in a vacuum environment. After the last wafer to be processed on the loading rack 121 in the transfer chamber 120 is removed by the handling robot 140, the opening 1311 between the scheduling chamber 130 and the transfer chamber 120 is closed, and the vacuum in the transfer chamber 120 is broken. Then, the atmospheric robot 180 unloads the product wafers from the loading rack 121 into the wafer cassette 190, and loads the wafers to be processed from the wafer cassette 190 back onto the loading rack 121. Once the product wafers in the loading rack 121 are unloaded and the wafers to be processed are full, the transfer chamber 120 is evacuated again. In this way, unloading the previous batch of product wafers and preparing the next batch of wafers during the processing of the last wafer of the previous batch, as well as breaking and evacuating the vacuum in the transfer chamber 120, can significantly shorten the processing cycle and improve semiconductor production efficiency.

[0049] In this embodiment, the first driving member 143 and the second driving member 1412 are both drive motors, and the third driving member 145 and the fourth driving member 160 are both electric cylinders. However, this is not the only embodiment. In other embodiments, the first driving member 143 and the second driving member 1412 can both be hydraulic motors or both be pneumatic motors; the third driving member 145 and the fourth driving member 160 can both be hydraulic cylinders or both be pneumatic cylinders; the types of the first driving member 143, the second driving member 1412, the third driving member 145, and the fourth driving member 160 are not specifically limited.

[0050] This invention also provides a wafer handling method for a wafer handling device, applied to the aforementioned wafer handling device 100. The wafer handling method includes the following steps: Step S110: The first arm segment 1441 of the handling robot 140 is used to take the first group of wafers to be processed out of the loading rack 121 and send them to the carrier 151.

[0051] It should be noted that in step S110, the rotating arm 144 of the handling robot 140 is first controlled to extend into the transfer chamber 120, and the first arm segment 1441 is used to take out the first group of wafers to be processed from the loading rack 121. During this process, since there are two rotating arms 144, the two wafers to be processed in the first group can be taken out at the same time. Then, the rotating arm 144 of the handling robot 140 is controlled to extend into the process chamber 150, and the first arm segment 1441 is used to place the first group of wafers to be processed on the carrier 151 to realize the loading of the first group of wafers to be processed.

[0052] Step S120: The first set of wafers to be processed is processed into the first set of product wafers by using the process chamber 150 and the first arm segment 1441 of the handling robot 140 is used to take the second set of wafers to be processed out of the loading rack 121.

[0053] It should be noted that in step S120, the deposition function of the process chamber 150 is activated to deposit the first group of wafers to be processed placed on the carrier 151. After a preset time, the deposition is completed to form the first group of product wafers. While the process chamber 150 is depositing the first group of wafers to be processed, the rotating arm 144 of the handling robot 140 is controlled to extend into the transfer chamber 120, and the first arm segment 1441 is used to take out the second group of wafers to be processed from the loading rack 121 for standby.

[0054] Step S130: The first group of product wafers is removed from the carrier 151 by the second arm segment 1442 of the handling robot 140, and then the second group of wafers to be processed is sent to the carrier 151 by the first arm segment 1441 of the handling robot 140.

[0055] It should be noted that in step S130, firstly, the rotating arm 144 of the handling robot 140 is controlled to extend into the process chamber 150 (the second group of wafers to be processed enters the process chamber 150 along with the first arm segment 1441), and the second arm segment 1442 is used to remove the first group of product wafers deposited on the carrier 151 to realize the unloading of the first group of product wafers; then the rotating arm 144 is controlled to rotate 180 degrees, and the first arm segment 1441 is used to place the second group of wafers to be processed on the carrier 151 to realize the loading of the second group of wafers to be processed.

[0056] Step S140: The second set of wafers to be processed is processed into the second set of product wafers placed on the carrier 151 using the process chamber 150; at the same time, the first set of product wafers is sent to the loading rack 121 using the second arm segment 1442 of the handling robot 140, and then the third set of wafers to be processed is taken out of the loading rack 121 using the first arm segment 1441 of the handling robot 140.

[0057] It should be noted that in step S140, the deposition function of the process chamber 150 is activated to deposit the second set of wafers to be processed placed on the carrier 151. After a preset time, the deposition is completed to form the second set of product wafers. While the process chamber 150 is depositing the second set of wafers to be processed, the rotating arm 144 of the handling robot 140 is controlled to extend into the transfer chamber 120. On the one hand, the second arm segment 1442 is used to send the first set of product wafers to the loading rack 121, and on the other hand, the first arm segment 1441 is used to take out the third set of wafers to be processed from the loading rack 121 for standby.

[0058] Furthermore, after step S140, steps S130 and S140 are repeated cyclically to sequentially achieve the deposition function of multiple sets of wafers to be processed, resulting in high wafer transfer efficiency, high deposition efficiency, and high semiconductor production efficiency.

[0059] The wafer handling device 100 provided in this embodiment of the invention comprises a transfer chamber 120, a scheduling chamber 130, and a process chamber 150, all mounted on a rack 110. The transfer chamber 120 and the process chamber 150 are jointly located outside the scheduling chamber 130 and are both connected to the scheduling chamber 130. A handling robot 140 is installed inside the scheduling chamber 130. The process chamber 150 is provided with a carrier 151 for carrying wafers to be processed. The process chamber 150 is used to process the wafers to be processed placed on the carrier 151 into product wafers. The transfer chamber 120 is provided with a loading rack 121 for loading wafers to be processed and / or product wafers. The handling robot 140 includes a drive mechanism. 141, linkage arm 142, first drive member 143, and rotating arm 144. Drive mechanism 141 is connected to linkage arm 142 and is used to drive linkage arm 142 to rotate or extend. First drive member 143 is installed on linkage arm 142 and connected to rotating arm 144. First drive member 143 is used to drive rotating arm 144 to rotate. Rotating arm 144 includes first arm segment 1441 and second arm segment 1442. First arm segment 1441 is used to remove wafers to be processed from transfer chamber 120 or send them to process chamber 150. Second arm segment 1442 is used to remove product wafers from process chamber 150 or send them to transfer chamber 120. Compared with the prior art, the wafer handling device 100 provided by the present invention, due to the use of a linkage arm 142 connected to the drive mechanism 141 and a first drive member 143 installed on the linkage arm 142 and connected to the rotating arm 144, can realize the unloading of product wafers and the loading of wafers to be processed in one go, shortening the wafer transfer cycle, improving wafer transfer efficiency, and improving semiconductor production efficiency. This makes the wafer handling method of the device simple and the wafer transfer efficiency high.

[0060] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A wafer handling device, characterized in that, The system includes a rack, a transfer room, a scheduling room, a handling robot, and a process room. The transfer room, the scheduling room, and the process room are all installed on the rack. The transfer room and the process room are jointly located outside the scheduling room and are all connected to the scheduling room. The handling robot is installed inside the scheduling room. The process room is equipped with a carrier for carrying wafers to be processed. The process room is used to process the wafers to be processed placed on the carrier into product wafers. The transfer room is equipped with a loading rack for loading wafers to be processed and / or product wafers. The handling robot includes a drive mechanism, a linkage arm, a first drive component, and a rotating arm. The drive mechanism is connected to the linkage arm and is used to drive the linkage arm to rotate or extend. The first drive component is installed on the linkage arm and connected to the rotating arm. The first drive component is used to drive the rotating arm to rotate. The rotating arm includes a first arm segment and a second arm segment. The first arm segment is used to remove the wafer to be processed from the transfer chamber or send it to the process chamber. The second arm segment is used to remove the product wafer from the process chamber or send it to the transfer chamber.

2. The wafer handling device according to claim 1, characterized in that, The rotating arm further includes a connecting section, the first arm segment is connected to the second arm segment through the connecting section, the first arm segment, the connecting section and the second arm segment are arranged sequentially along the length direction of the rotating arm, the connecting section is provided with a rotating shaft, and the first driving member is connected to the rotating shaft.

3. The wafer handling device according to claim 1, characterized in that, The number of the first driving member, the rotating arm, the bearing seat, and the loading frame are all two. The linkage arm includes a forearm, a connecting arm, and another forearm connected in sequence. The two forearms are arranged opposite to each other at both ends of the connecting arm. Each first driving member is installed at the free end of one forearm and connected to one rotating arm. The two bearing seats are spaced apart, and the two loading frames are spaced apart.

4. The wafer handling device according to claim 3, characterized in that, The driving mechanism includes two driving components, each including a second driving member, a rear arm, and a middle arm. The second driving member is connected to the rear arm, and the rear arm is hinged to the middle arm. One end of the connecting arm is hinged to one of the middle arms, and the other end is hinged to the other middle arm. The two second driving members are overlapped and rotate synchronously at the same speed. The two forearms can rotate synchronously when the two second driving members rotate in the same direction, and the two forearms can also extend and retract synchronously when the two second driving members rotate in opposite directions.

5. The wafer handling device according to claim 1, characterized in that, The handling robot also includes a third drive unit and a lifting frame. The third drive unit is connected to the lifting frame and is used to drive the lifting frame to rise or fall. The drive mechanism is installed on the lifting frame.

6. The wafer handling apparatus according to claim 1, characterized in that, The loading rack includes multiple loading compartments, which are arranged in an overlapping manner. Each loading compartment has a support surface for supporting the wafer to be processed or the product wafer. The support surface has a clearance groove for the first arm segment or the second arm segment to extend into.

7. The wafer handling apparatus according to claim 1, characterized in that, The wafer handling device further includes a fourth drive unit and a lifting column. The fourth drive unit is mounted on the rack. One end of the lifting column is connected to the fourth drive unit, and the other end extends into the transfer chamber and is connected to the loading rack. The fourth drive unit is used to drive the loading rack to rise or fall via the lifting column.

8. The wafer handling apparatus according to claim 1, characterized in that, The dispatch room is rectangular in shape, and there are three process rooms. The transfer room and the three process rooms are arranged one-to-one on the four sides of the dispatch room.

9. The wafer handling apparatus according to claim 1, characterized in that, The dispatching room includes a hopper, a cover, and a flip-top mechanism. The cover is placed on the hopper, and the handling robot is installed inside the hopper. The flip-top mechanism includes a base, a handle, a reducer, a worm gear, a worm wheel, and a flip-top arm. The base is connected to the hopper. The worm gear and the worm wheel are rotatably mounted in the base, and the worm gear and the worm wheel cooperate with each other. The handle is connected to the worm gear through the reducer. One end of the flip-top arm is connected to the worm wheel, and the other end is hinged to the cover.

10. The wafer handling apparatus according to claim 1, characterized in that, The bottom of the transfer chamber is provided with multiple leveling supports arranged in a rectangular array. Each leveling support includes a first base, an adjusting screw, a locking nut, a buffer washer, a sliding self-aligning bearing, and a second base. The first base is connected to the transfer chamber, and the second base is connected to the frame. One end of the adjusting screw is connected to the first base, and the other end is connected to the second base through the sliding self-aligning bearing. The locking nut is sleeved on the adjusting screw and threadedly engages with it, abutting against the first base. The adjusting screw is provided with a wrench portion, and the buffer washer is sleeved on the adjusting screw and positioned between the wrench portion and the sliding self-aligning bearing.

11. A wafer handling method for a wafer handling device, characterized in that, The wafer handling apparatus as described in any one of claims 1-10, wherein the wafer handling method of the wafer handling apparatus comprises: The first arm of the handling robot is used to remove the first group of wafers to be processed from the loading rack and send them to the carrier. The first set of wafers to be processed, placed on the carrier, is processed into the first set of product wafers using the process chamber, while the second set of wafers to be processed is removed from the loading rack using the first arm of the handling robot. The first group of product wafers is removed from the carrier using the second arm of the handling robot, and then the second group of wafers to be processed is sent to the carrier using the first arm of the handling robot. The second set of wafers to be processed, placed on the carrier, is processed into a second set of product wafers using the process chamber; at the same time, the second arm of the handling robot is used to send the first set of product wafers to the loading rack, and then the first arm of the handling robot is used to remove the third set of wafers to be processed from the loading rack.

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