Electronic device including a conductive connector

Abstract

An electronic device according to an embodiment may include: a housing including a main body and a cover plate; a substrate disposed on the main body; a camera flange disposed on the substrate; a cover frame covering the camera flange; a plurality of lens structures including an outer lens structure connected to the cover frame and an inner lens structure connected to the camera flange; and a first conductive connector disposed between the cover frame and the camera flange.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an electronic device. More particularly, the present disclosure relates to an electronic device including a conductive connector. BACKGROUND

[0002] An optical module, which can be referred to as a flash or strobe, can include a light emitting element, such as a light emitting diode (LED), configured to illuminate a space outside the light emitting element. Electronic devices including one or more camera modules and optical modules are being developed to support various capture environments or conditions.

[0003] The size of an image sensor must be large to obtain a high resolution or high definition photo. When the size of the image sensor increases, the size of the image increases, and thus it is necessary to secure a relatively long focal length of the lens. The long focal length of the lens means an increase in the length of the camera lens barrel. When the length of the camera lens barrel increases, the size of the camera module increases.

[0004] There is a technology for maintaining the size of a terminal compact by partially protruding only a camera while maintaining the thickness of the terminal. A portion of the lens exposed to the outside can have sufficient rigidity, including a metal material. Around the lens, a cover frame for protecting the lens can be provided.

[0005] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the present disclosure. SUMMARY

[0006] According to an aspect of the present disclosure, an electronic device is provided. The electronic device includes a housing including a main body and a cover plate connected to the main body, a substrate disposed on the main body, a camera flange disposed on the substrate, a cover frame configured to cover the camera flange, a plurality of lens structures including an outer lens structure connected to the cover frame and an inner lens structure connected to the camera flange, and a first conductive connector disposed between the cover frame and the camera flange to be provided in a state of being compressed by the cover frame and the camera flange and to electrically connect the cover frame to the camera flange.

[0007] According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes a housing including a main body and a cover plate connected to the main body, a substrate disposed on the main body, a camera flange disposed on the substrate, a cover frame configured to cover the camera flange, a plurality of lens structures including an outer lens structure connected to the cover frame and an inner lens structure connected to the camera flange, and a first conductive connector disposed between the cover frame and the camera flange and provided in a state of being compressed by the cover frame and the camera flange, wherein electrostatic discharge is capable of being generated along the cover frame, the first conductive connector, the camera flange, and the substrate.

[0008] According to another aspect of the disclosure, an electronic device is provided. The electronic device includes a housing including a main body and a cover plate connected to the main body, a substrate disposed on the main body, a camera flange disposed on the substrate, a cover frame configured to cover the camera flange, a plurality of lens structures including an outer lens structure connected to the cover frame and an inner lens structure connected to the camera flange, and a first conductive connector disposed between the cover frame and the camera flange and provided in a state of being compressed by the cover frame and the camera flange, wherein electrostatic discharge is capable of being generated along the cover frame, the first conductive connector, the camera flange, and the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0009] The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0010] Figure 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment of the disclosure;

[0011] Figure 2 is a block diagram illustrating a camera module according to an embodiment of the disclosure;

[0012] Figure 3a is a diagram illustrating an electronic device in an unfolded state according to an embodiment of the disclosure;

[0013] Figure 3b is a diagram illustrating an electronic device in a folded state according to an embodiment of the disclosure;

[0014] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the disclosure;

[0015] Figure 5 is a cross-sectional view of an electronic device according to an embodiment of the disclosure;

[0016] Figure 6 is a plan view schematically illustrating a camera flange, a lens structure, and a conductive connector of an electronic device according to an embodiment of the disclosure;

[0017] Figure 7 is a cross-sectional view of an electronic device according to an embodiment of the disclosure;

[0018] Figure 8 is a plan view schematically illustrating a camera flange, a lens structure, and a conductive connector of an electronic device according to an embodiment of the disclosure;

[0019] Figure 9 is a plan view schematically illustrating a camera flange, a lens structure, and a conductive connector of an electronic device according to an embodiment of the disclosure; and

[0020] Figure 10 FIG. 1 is a plan view schematically illustrating a camera flange, a lens structure, and a conductive connector of an electronic device according to an embodiment of the disclosure. DETAILED DESCRIPTION

[0021] Figure 1 FIG. 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment of the disclosure.

[0022] Referring to Figure 1 The electronic device 101 in the network environment 100 can communicate with an external electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or an external electronic device 104 and a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment of the disclosure, the electronic device 101 can communicate with the external electronic device 104 via the server 108. According to an embodiment of the disclosure, the electronic device 101 can include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, and a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a motor 187, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In an embodiment of the disclosure, at least one of the components (e.g., the connection terminal 178) can be omitted from the electronic device 101, or one or more other components can be added in the electronic device 101. In an embodiment of the disclosure, some of the components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) can be configured as a single component (e.g., the display module 160).

[0023] The processor 120 can execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 connected to the processor 120 and can perform various data processing or computation. According to an embodiment of the disclosure, as at least a part of the data processing or computation, the processor 120 can store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store resultant data in the non-volatile memory 134. According to an embodiment of the disclosure, the processor 120 can include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or a subsidiary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the subsidiary processor 123, the subsidiary processor 123 can be adapted to consume less power than the main processor 121, or to be specific to a specified function. The subsidiary processor 123 can be implemented as a part of the main processor 121, or be implemented separately from the main processor 121.

[0024] The auxiliary processor 123 can control at least some of functions or status associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), instead of the main processor 121, when the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121, when the main processor 121 is in an active state (e.g., executing an application). According to an embodiment of the disclosure, the auxiliary processor 123 (e.g., an ISP or a CP) can be implemented as a part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment of the disclosure, the auxiliary processor 123 (e.g., an NPU) can include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model can be generated through machine learning. The machine learning can be performed by, for example, the electronic device 101 performing artificial intelligence, or via a separate server (e.g., the server 108). The learning algorithm can include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence (AI) model can include multiple artificial neural network layers. The artificial neural network can include, for example, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), and a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more thereof, but is not limited thereto. The AI model can additionally or alternatively include a software structure other than the hardware structure.

[0025] The memory 130 can store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data can include, for example, software (e.g., the program 140) and input data or output data about a command related thereto. The memory 130 can include the volatile memory 132 or the non-volatile memory 134.

[0026] The program 140 can be stored in the memory 130 as software, and can include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0027] The input module 150 can receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101 from the outside (e.g., a user) of the electronic device 101. The input module 150 can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing record, and the receiver can be used for receiving an incoming call. According to an embodiment of the disclosure, the receiver can be implemented as part of the speaker, or can be implemented separately from the speaker.

[0029] The display module 160 can visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 can include, for example, a control circuit for controlling a display, a hologram device or a projector, and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an embodiment of the disclosure, the display module 160 can include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force of a touch.

[0030] The audio module 170 can convert a sound into an electrical signal, and vice versa. According to an embodiment of the disclosure, the audio module 170 can obtain sound through the input module 150, or output sound through the sound output module 155 or an external electronic device (e.g., an external electronic device 102 such as a speaker or a headphone) directly or wirelessly connected to the electronic device 101.

[0031] The sensor module 176 can detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and generate an electrical signal or data value corresponding to the detected state. According to an embodiment of the disclosure, the sensor module 176 can include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface 177 can support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the external electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment of the disclosure, the interface 177 can include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0033] The connection terminal 178 can include a connector via which the electronic device 101 can be physically connected with the external electronic device (e.g., the external electronic device 102). According to an embodiment of the disclosure, the connection terminal 178 can include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The haptic module 179 can convert electrical signal into a mechanical stimulus (e.g., vibration or movement) or electrical stimulus that can be recognized by users through their tactile sensation or kinesthetic sensation. According to an embodiment of the present disclosure, the haptic module 179 can include, for example, a motor, a piezoelectric element, or an electrical stimuluser.

[0035] The camera module 180 can capture still images and moving images. According to an embodiment of the present disclosure, the camera module 180 can include one or more lenses, image sensors, ISPs, and flashes.

[0036] The power management module 188 can manage power supplied to the electronic device 101. According to an embodiment of the present disclosure, the power management module 188 can be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

[0037] The battery 189 can supply power to at least one component of the electronic device 101. According to an embodiment of the present disclosure, the battery 189 can include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0038] The communication module 190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the external electronic device 102, the external electronic device 104, or a server 108) and performing communication between the electronic devices 101 and the external electronic device 104 via the established communication channel. The communication module 190 can include one or more CPs that can operate independently of the processor 120 (e.g., an AP) and support direct (e.g., wired) communication or wireless communication. According to an embodiment of the present disclosure, the communication module 190 can include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with the external electronic device (e.g., the external electronic device 104) via the first network 198 (e.g., a short-range communication network, such as Bluetooth™). These various types of communication modules can be implemented as a single component (e.g., a single chip), or can be implemented as separate components (e.g., separate chips) from each other. The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the SIM 196.

[0039] The wireless communication module 192 can support a 5G network after a 4th generation (4G) network, and next-generation communication technologies, such as new radio (NR) access technology. The NR access technology can support enhanced mobile broadband (eMBB), massive machine-type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 can support a high frequency band (e.g., a millimeter wave (mmWave) band) to achieve, for example, a high data transmission rate. The wireless communication module 192 can support various technologies for securing performance on high frequency bands, such as beamforming, massive multiple-input multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., the external electronic device 104), or a network system (e.g., the second network 199). According to an embodiment of the disclosure, the wireless communication module 192 can support a peak data rate of eMBB (e.g., 20 Gbps or more) for implementation, a loss coverage (e.g., 164 dB or less) for implementation of mMTC, or a U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or 1 ms or less for round trip) for implementation of URLLC.

[0040] The antenna module 197 can transmit or receive a signal or power to or from the outside (e.g., an external electronic device) of the electronic device 101. According to an embodiment of the disclosure, the antenna module 197 can include an antenna including a radiating element including a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment of the disclosure, the antenna module 197 can include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna appropriate for a communication scheme used in a communication network, such as the first network 198 or the second network 199, can be selected from the plurality of antennas by, for example, the communication module 190. Signals or power can be transmitted or received between the communication module 190 and the external electronic device via the at least one selected antenna. According to an embodiment of the disclosure, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element can be additionally formed as part of the antenna module 197.

[0041] According to an embodiment of the disclosure, the antenna module 197 can form a millimeter wave antenna module. According to an embodiment of the disclosure, the millimeter wave antenna module can include a PCB, an RFIC on or adjacent to a first surface (e.g., a bottom surface) of the PCB and capable of supporting a designated high frequency band (e.g., a millimeter wave frequency band), and a plurality of antennas (e.g., array antennas) arranged on or adjacent to a second surface (e.g., a top surface or a side surface) of the PCB and capable of transmitting or receiving a signal of the designated high frequency band.

[0042] At least some of the above-described components can be coupled with each other and exchange signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

[0043] According to an embodiment of the disclosure, commands or data can be transmitted or received between the electronic device 101 and an external electronic device (e.g., the external electronic devices 102 or 104) via the server 108 connected with the second network 199. Each of the external electronic devices (e.g., the external electronic devices 102 or 104) can be a device of a same type as or different from the electronic device 101. According to an embodiment of the disclosure, all or some of the operations to be executed by the electronic device 101 can be executed by one or more external electronic devices (e.g., the external electronic devices 102 and 104 and the server 108). For example, if the electronic device 101 needs to perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, can request one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request can execute at least part of the function or the service, or an additional function or an additional service related to the request, and can transmit a result of the execution to the electronic device 101. The electronic device 101 can provide the result, with or without further processing of the result, as at least part of a response to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used, for example. The electronic device 101 can use, for example, distributed computing or MEC to provide a super-low latency service. In an embodiment of the disclosure, the external electronic devices (e.g., the external electronic device 104) can include an Internet of Things (IoT) device. The server 108 can be an intelligent server using machine learning and / or a neural network. According to an embodiment of the disclosure, the external electronic device (e.g., the external electronic device 104) or the server 108 can be included in the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart home, smart city, smart car, or health care) based on 5G communication technology or IoT-related technology.

[0044] The electronic device according to an embodiment can be one of various types of electronic devices. The electronic devices can include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.

[0045] It should be understood that various embodiments of the present disclosure and terms used therein are not intended to limit the technical features set forth herein to particular embodiments, and include various changes, equivalents or replacements for the corresponding embodiments. Descriptions of components in the drawings are only intended to explain example embodiments and are not intended to limit the technical features set forth herein. As used herein, each of "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "A, B, or C" can include all possible combinations of the items listed therein. Terms such as "first" and "second" can be used to describe various components, but the components are not limited to the above terms. The terms are only used to distinguish one component from another. The use of "primarily", "secondarily", and the like can be understood as used in the context of distinguishing one component from another. The terms "primarily" and "secondarily" do not necessarily have the limited meaning of high and low, respectively. It will be understood that if an element (for example, a first element) is referred to as "including" or "including" another element (for example, a second element), it means that the former can include the latter, and does not exclude the presence of other elements (for example, a third element) or additional elements (for example, a fourth element).

[0046] As used in connection with various embodiments of the present disclosure, the term "module" can include a unit implemented in hardware, software, or firmware, and can interchangeably be used with other terms such as "logic", "logic block", "part", or "circuitry". The module can be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment of the present disclosure, the module can be implemented in a form of an application-specific integrated circuit (ASIC).

[0047] The embodiments set forth herein can be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) can invoke at least one of the one or more instructions stored in the storage medium, and execute it. This allows the machine to be operated to perform at least one function according to the invoked instruction. The one or more instructions can include a code generated by a compiler or a code executable by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate a case where data is semi-permanently stored in the storage medium from a case where data is temporarily stored in the storage medium.

[0048] According to an embodiment of the disclosure, the method according to various embodiments of the disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)) or be distributed online via an application store (e.g., Play Store™). If distributed online, at least part of the computer program product can be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a manufacturer's server, an application store's server, or a relay server.

[0049] According to an embodiment of the disclosure, each of the above-described components (e.g., a module or a program) can include a single entity or multiple entities, and some of the multiple entities can be individually arranged in different components. According to an embodiment of the disclosure, one or more of the above-described components can be omitted, or one or more other components can be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) can be integrated into a single component. In this case, according to an embodiment of the disclosure, the integrated component can still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by the corresponding components before the integration. According to an embodiment of the disclosure, operations performed by the module, the program, or another component can be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more operations can be executed in different orders or omitted, or one or more other operations can be added.

[0050] Figure 2 is a block diagram illustrating a camera module according to an embodiment of the disclosure.

[0051] Referring to Figure 2 The camera module 180 can include a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (e.g., a buffer memory), or an ISP 260. The lens assembly 210 can collect light emitted from an object as a target whose image is to be captured. The lens assembly 210 can include one or more lenses. According to an embodiment of the disclosure, the camera module 180 can include a plurality of lens assemblies 210. In this case, the camera module 180 can constitute, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 can have the same lens characteristics (e.g., angle of view, focal length, auto focus, f number, or optical zoom), or at least one of the plurality of lens assemblies 210 can have one or more lens characteristics different from the lens characteristics of the other lens assemblies. The lens assembly 210 can include, for example, a wide-angle lens or a telephoto lens.

[0052] The flash 220 can emit light for enhancing light emitted or reflected from an object. According to an embodiment of the disclosure, the flash 220 can include one or more light emitting diodes (LEDs) (e.g., red-green-blue (RGB) LEDs, white LEDs, infrared (IR) LEDs, or ultraviolet (UV) LEDs) or a xenon lamp. The image sensor 230 can obtain an image corresponding to an object by converting light emitted or reflected from the object and transmitted through the lens assembly 210 into an electrical signal. According to an embodiment of the disclosure, the image sensor 230 can include, for example, one image sensor selected from among image sensors having different attributes (e.g., an RGB sensor, a black-and-white (BW) sensor, an IR sensor, or a UV sensor), a plurality of image sensors having the same attribute, or a plurality of image sensors having different attributes. Each image sensor included in the image sensor 230 can be implemented using, for example, a charge-coupled device (CCD) sensor or a complementary metal-oxide semiconductor (CMOS) sensor.

[0053] In response to movement of the camera module 180 or the electronic device 101 including the camera module 180, the image stabilizer 240 can move at least one lens included in the lens assembly 210 or the image sensor 230 in a certain direction, or control an operational characteristic of the image sensor 230 (e.g., adjust a readout timing). This can compensate for at least a portion of a negative effect of the movement on an image to be captured. According to an embodiment of the disclosure, the image stabilizer 240 can detect such movement of the camera module 180 or the electronic device 101 using a gyro sensor (not shown) or an acceleration sensor (not shown) arranged inside or outside the camera module 180. According to an embodiment of the disclosure, the image stabilizer 240 can be implemented as, for example, an optical image stabilizer. The memory 250 can temporarily store at least a portion of an image obtained through the image sensor 230 for a subsequent image processing operation. For example, when an image acquisition is delayed by a shutter or a plurality of images are obtained at a high speed, an original image (e.g., a Bayer pattern image or a high-resolution image) obtained can be stored in the memory 250, and a duplicate image (e.g., a low-resolution image) corresponding to the original image can be previewed through the display module 160. Subsequently, when a specified condition (e.g., a user input or a system command) is satisfied, at least a portion of the original image stored in the memory 250 can be obtained and processed through, for example, the ISP 260. According to an embodiment of the disclosure, the memory 250 can be configured as at least a portion of the memory 130, or as a separate memory operating independently of the memory 130.

[0054] The ISP 260 can perform one or more image processing operations on an image obtained through the image sensor 230 or an image stored in the memory 250. The one or more image processing operations can include, for example, depth map generation, three-dimensional (3D) modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the ISP 260 can control at least one component (e.g., the image sensor 230) included in the camera module 180. For example, the ISP 260 can control an exposure time, a readout timing, etc. An image processed by the ISP 260 can be stored again in the memory 250 for further processing, or provided to an external component (e.g., the memory 130, the display module 160, the external electronic device 102, the external electronic device 104, or the server 108) of the camera module 180. According to an embodiment of the disclosure, the ISP 260 can be configured as at least a part of the processor 120, or as a separate processor operating independently of the processor 120. When the ISP 260 is configured as a processor separate from the processor 120, at least one image processed by the ISP 260 can be displayed as is without change, or displayed through the display module 160 after the processor 120 performs additional image processing.

[0055] According to an embodiment of the disclosure, the electronic device 101 can include a plurality of camera modules 180 having different characteristics or functions. In this case, for example, at least one of the plurality of camera modules 180 can be a wide-angle camera, and at least another of the plurality of camera modules 180 can be a telephoto camera. Similarly, at least one of the plurality of camera modules 180 can be a front camera, and at least another of the plurality of camera modules 180 can be a rear camera.

[0056] Figure 3a FIG. 1 is a diagram illustrating an electronic device according to an embodiment of the disclosure. Figure 3b FIG. 2 is a diagram illustrating an electronic device according to an embodiment of the disclosure. Figure 4 FIG. 3 is a diagram illustrating an electronic device according to an embodiment of the disclosure.

[0057] Referring to FIGS. 1, 2, and 3, Figure 3a Figure 3b and Figure 4 The foldable electronic device 301 can include a hinge structure (e.g., a hinge structure 310) that is configured to allow the foldable electronic device 301 to be folded or unfolded. Figure 4 ​The first housing 310 and the second housing 320 rotatably coupled to each other to be folded with respect to each other, a hinge cover 365 covering a foldable portion of the first housing 310 and the second housing 320, and a display 361 (e.g., a flexible display or a foldable display) disposed in a space formed by the first housing 310 and the second housing 320. In the disclosure, a surface on which the display 361 is disposed can be defined as a front surface of the foldable electronic device 301, and a surface opposite to the front surface of the foldable electronic device 301 can be defined as a rear surface of the foldable electronic device 301. In addition, a surface surrounding a space between the front surface and the rear surface of the foldable electronic device 301 can be defined as a side surface of the foldable electronic device 301.

[0058] In an embodiment of the disclosure, the first housing 310 and the second housing 320 can include the first housing 310, the second housing 320, the first rear cover 340, and the second rear cover 350. The first housing 310 and the second housing 320 of the foldable electronic device 301 are not limited to Figure 3a and Figure 3b the shapes or combinations of the components shown in FIGS. 1A to 1C and / or in combination, and can be implemented in other shapes or by another combination and / or in combination of the components.

[0059] In an embodiment of the disclosure, the first housing 310 and the second housing 320 can be disposed on both sides with respect to the folding axis A, and can be disposed substantially symmetrically with respect to the folding axis A. In an embodiment of the disclosure, an angle or a distance between the first housing 310 and the second housing 320 can vary depending on whether the foldable electronic device 301 is in an unfolded state, a folded state, or an intermediate state. In an embodiment of the disclosure, the first housing 310 and the second housing 320 can have a substantially symmetrical shape.

[0060] In an embodiment of the disclosure, the first housing 310 can be connected to a hinge structure (e.g., a hinge structure 334) in an unfolded state of the foldable electronic device 301. Figure 4of the first housing 310 and the second housing 320 can be connected to the hinge structure (e.g., the hinge structure 334) of the foldable electronic device 301). The first housing 310 can include a first surface 311 facing a front surface of the foldable electronic device 301, a second surface 312 facing in a direction opposite to the first surface 311, and a first side portion 313 surrounding at least a portion of a space between the first surface 311 and the second surface 312. The first side portion 313 can include a first side surface 313a arranged substantially in parallel with the folding axis A, a second side surface 313b extending from one end of the first side surface 313a in a direction substantially perpendicular to the folding axis A, and a third side surface 313c extending from the other end of the first side surface 313a in a direction substantially perpendicular to the folding axis A and substantially in parallel with the second side surface 313b. The second housing 320 can be connected to the hinge structure (e.g., the hinge structure 334) of the foldable electronic device 301 in the unfolded state of the foldable electronic device 301. Figure 4 of the first housing 310 and the second housing 320 can be connected to the hinge structure (e.g., the hinge structure 334) of the foldable electronic device 301). The first housing 310 can include a first surface 311 facing a front surface of the foldable electronic device 301, a second surface 312 facing in a direction opposite to the first surface 311, and a first side portion 313 surrounding at least a portion of a space between the first surface 311 and the second surface 312. The first side portion 313 can include a first side surface 313a arranged substantially in parallel with the folding axis A, a second side surface 313b extending from one end of the first side surface 313a in a direction substantially perpendicular to the folding axis A, and a third side surface 313c extending from the other end of the first side surface 313a in a direction substantially perpendicular to the folding axis A and substantially in parallel with the second side surface 313b. The second housing 320 can be connected to the hinge structure (e.g., the hinge structure 334) of the foldable electronic device 301 in the unfolded state of the foldable electronic device 301.

[0061] In an embodiment of the disclosure, the foldable electronic device 301 can include at least one sound output module (e.g., the sound output module 155) arranged on the fifth side surface 323b and / or the sixth side surface 323c of the second housing 320. Figure 1

[0062] In an embodiment of the disclosure, the foldable electronic device 301 can include a recessed-shaped accommodation portion 302 that accommodates the display 361 by a structural combination of the first housing 310 and the second housing 320. The accommodation portion 302 can have substantially the same size as the display 361.

[0063] In an embodiment of the disclosure, at least a portion of the first housing 310 and the second housing 320 can be formed of a metal material or a non-metal material having a predetermined magnitude of rigidity suitable for supporting the display 361.

[0064] ​In an embodiment of the disclosure, the foldable electronic device 301 can include at least one component disposed to be exposed on a front surface of the foldable electronic device 301 to perform various functions. For example, the at least one component can include at least one of a front camera module, a receiver, a proximity sensor, an illuminance sensor, an iris recognition sensor, an ultrasonic sensor, or an indicator.

[0065] In an embodiment of the disclosure, the first back cover 340 can be disposed on the second surface 312 of the first housing 310 and can have a substantially rectangular periphery. At least a portion of the periphery of the first back cover 340 can be surrounded by the first housing 310. The second back cover 350 can be disposed on the fourth surface 322 of the second housing 320 and can have a substantially rectangular periphery. At least a portion of the periphery of the second back cover 350 can be surrounded by the second housing 320.

[0066] In an embodiment of the disclosure, the first back cover 340 and the second back cover 350 can have shapes that are substantially symmetrical with respect to the folding axis A. In an embodiment of the disclosure, the first back cover 340 and the second back cover 350 can have different shapes. In an embodiment of the disclosure, the first housing 310 and the first back cover 340 can be integrally formed, and the second housing 320 and the second back cover 350 can be integrally formed.

[0067] In an embodiment of the disclosure, the first housing 310, the second housing 320, the first back cover 340, and the second back cover 350 can provide a space in which various components (e.g., a PCB 180 of FIG. 1A, Figure 1 an antenna module 197 of FIG. 1A, Figure 1 a sensor module 176 of FIG. 1A, or Figure 1 a battery 189 of FIG. 1A) of the foldable electronic device 301 can be disposed, through a structure in which the first housing 310, the second housing 320, the first back cover 340, and the second back cover 350 are combined with each other. In an embodiment of the disclosure, at least one component can be visually exposed on a rear surface of the foldable electronic device 301. For example, the at least one component can be visually exposed through the first rear area 341 of the first back cover 340. Here, the at least one component can include a proximity sensor, a rear camera module, and / or a flash.

[0068] In an embodiment of the disclosure, the display 361 can be disposed in the accommodation portion 302 formed by the first housing 310 and the second housing 320. For example, the display 361 can be disposed to occupy substantially most of the front surface of the foldable electronic device 301. The front surface of the foldable electronic device 301 can include an area on which the display 361 is disposed and a partial area (e.g., a peripheral area) of the first housing 310 and a partial area (e.g., a peripheral area) of the second housing 320 adjacent to the display 361. The rear surface of the foldable electronic device 301 can include the first rear cover 340, a partial area (e.g., a peripheral area) of the first housing 310 adjacent to the first rear cover 340, the second rear cover 350, and a partial area (e.g., a peripheral area) of the second housing 320 adjacent to the second rear cover 350. In an embodiment of the disclosure, the display 361 can be a display in which at least one area is deformable to be flat or curved. In an embodiment of the disclosure, the display 361 can include a flexible area 361c, a first area 361a on a first side (e.g., a right side) of the flexible area 361c, and a second area 361b on a second side (e.g., a left side) of the flexible area 361c. The first area 361a can be located on the first surface 311 of the first housing 310, and the second area 361b can be located on the third surface 321 of the second housing 320. However, the area division of the display 361 is merely an example, and the display 361 can be divided into a plurality of areas depending on the structure or function of the display 361. For example, as Figure 3a indicated, the display 361 can be divided into areas based on the folding axis A or the flexible area 361c extending in parallel with the Y-axis, or can be divided into areas based on another flexible area (e.g., a flexible area extending in parallel with the X-axis) or another folding axis (e.g., a folding axis parallel to the X-axis). The area division of the display 361 as described above is merely based on the physical division of the first housing 310 and the second housing 320 and the hinge structure (e.g., Figure 4 the hinge structure 334), and the display 361 can display substantially one screen through the first housing 310 and the second housing 320 and the hinge structure (e.g., Figure 4 the hinge structure 334). In an embodiment of the disclosure, the first area 361a and the second area 361b can have a substantially symmetrical shape with respect to the flexible area 361c.

[0069] In an embodiment of the disclosure, the hinge cover 365 can be disposed between the first housing 310 and the second housing 320 and can be configured to cover the hinge structure (e.g., Figure 4The hinge structure 334). The hinge cover 365 can be hidden or exposed to the outside by at least a portion of the first housing 310 and the second housing 320, depending on the operating state of the foldable electronic device 301. For example, when the foldable electronic device 301 is in such a state as Figure 3a In the unfolded state shown, the hinge cover 365 can be hidden by the first housing 310 and the second housing 320 and is not exposed to the outside, and when the foldable electronic device 301 is in such a state as Figure 3b In the folded state shown, the hinge cover 365 may be exposed to the outside between the first housing 310 and the second housing 320. Furthermore, when the foldable electronic device 301 is in an intermediate state where the first housing 310 and the second housing 320 form an angle with each other, at least a portion of the hinge cover 365 may be exposed to the outside between the first housing 310 and the second housing 320. In this case, the area of ​​the hinge cover 365 exposed to the outside may be smaller than the area of ​​the hinge cover 365 exposed when the foldable electronic device 301 is in the folded state. In embodiments of this disclosure, the hinge cover 365 may have a curved surface.

[0070] Describes the operation of the foldable electronic device 301 when the foldable electronic device 301 is in an unfolded state (e.g., Figure 3a When the foldable electronic device 301 is in the unfolded state, the first housing 310 and the second housing 320 can form a first angle (e.g., about 180 degrees) with each other, and the first region 361a and the second region 361b of the display 361 can be oriented in substantially the same direction. The flexible region 361c of the display 361 can be on a plane substantially the same as the first region 361a and the second region 361b. In embodiments of this disclosure, when the foldable electronic device 301 is in the unfolded state, the first housing 310 can rotate relative to the second housing 320 at a second angle (e.g., about 360 degrees), whereby the first housing 310 and the second housing 320 can be folded in the opposite direction, such that the second surface 312 and the fourth surface 322 can face each other. Furthermore, when the foldable electronic device 301 is in the folded state (e.g., ...), Figure 3bWhen the foldable electronic device 301 is in its folded state, the first housing 310 and the second housing 320 can face each other. The first housing 310 and the second housing 320 can form an angle of approximately 0 degrees to approximately 10 degrees, and the first region 361a and the second region 361b of the display 361 can face each other. At least a portion of the flexible region 361c of the display 361 can be deformed into a curved surface. Furthermore, when the foldable electronic device 301 is in its intermediate state, the first housing 310 and the second housing 320 can form a predetermined angle with each other. The angle formed by the first region 361a and the second region 361b of the display 361 (e.g., a third angle, approximately 90 degrees) can be greater than the angle when the foldable electronic device 301 is in its folded state and can be less than the angle when the foldable electronic device 301 is in its unfolded state. At least a portion of the flexible region 361c of the display 361 can be deformed into a curved surface. In this case, the curvature of the curved surface of the flexible region 361c can be less than the curvature when the foldable electronic device 301 is in its folded state.

[0071] Furthermore, the various embodiments of the electronic devices described herein are not limited to those described herein. Figure 3a and Figure 3b The shape factor of the foldable electronic device 301 described can also be applied to electronic devices with various shape factors.

[0072] Reference Figure 4 The foldable electronic device 301 may include a display module 360 ​​(e.g., Figure 1 The display module 160), hinge assembly 330, substrate 370, and first housing 310 (e.g., Figure 3a and Figure 3b First housing 310), second housing 320 (e.g., Figure 3a and Figure 3b The second housing 320), the first rear cover 340 (e.g., Figure 3a and Figure 3b First rear cover 340) and second rear cover 350 (e.g., Figure 3a and Figure 3b The second rear cover (350).

[0073] Display module 360 ​​may include display 361 (e.g., ...). Figure 3a and Figure 3b The display 361 and at least one layer or plate on which the display 361 is situated. In embodiments of this disclosure, the plate may be arranged between the display 361 and the hinge assembly 330. The display 361 may be arranged on at least a portion of a surface (e.g., the top surface) of the plate. The plate may be formed in a shape corresponding to the display 361.

[0074] The hinge assembly 330 can include a first bracket 331, a second bracket 332, a hinge structure 334 disposed between the first bracket 331 and the second bracket 332, a hinge cover 365 covering the hinge structure 334 when the hinge structure 334 is viewed from the outside, and a PCB 333 that traverses the first bracket 331 and the second bracket 332. In an embodiment of the disclosure, the PCB 333 can be a flexible printed circuit board (FPCB).

[0075] In an embodiment of the disclosure, the hinge assembly 330 can be disposed between the plate and the substrate 370. For example, the first bracket 331 can be disposed between the first area 361a of the display 361 and the first substrate 371. The second bracket 332 can be disposed between the second area 361b of the display 361 and the second substrate 372.

[0076] In an embodiment of the disclosure, at least a portion of the hinge structure 334 and the PCB 333 can be disposed inside the hinge assembly 330. The PCB 333 can be disposed in a direction (e.g., an X-axis direction) that traverses the first bracket 331 and the second bracket 332. The PCB 333 can be disposed in a direction (e.g., an X-axis direction) that is perpendicular to a folding axis (e.g., a Y-axis or a folding axis A of FIG. 3A) of the flexible area 361c of the foldable electronic device 301.

[0077] The substrate 370 can include a first substrate 371 disposed on the first bracket 331 and a second substrate 372 disposed on the second bracket 332. The first substrate 371 and the second substrate 372 can be disposed in a space formed by the hinge assembly 330, the first housing 310, the second housing 320, the first rear cover 340, and the second rear cover 350. Components for implementing various functions of the foldable electronic device 301 can be mounted on the first substrate 371 and the second substrate 372.

[0078] The first housing 310 and the second housing 320 can be assembled together to be coupled to both sides of the hinge assembly 330 in a state in which the display module 360 is coupled to the hinge assembly 330. The first housing 310 and the second housing 320 can be coupled to the hinge assembly 330 by sliding from both sides of the hinge assembly 330.

[0079] In an embodiment of the disclosure, the first housing 310 can include a first rotation support surface 314, and the second housing 320 can include a second rotation support surface 324 corresponding to the first rotation support surface 314. The first rotation support surface 314 and the second rotation support surface 324 can include curved surfaces corresponding to curved surfaces included in the hinge cover 365.

[0080] In an embodiment of the disclosure, when the foldable electronic device 301 is in a unfolded state (e.g., the foldable electronic device 301 of FIG. 1A), the first rotation support surface 314 and the second rotation support surface 324 can cover the hinge cover 365 so that the hinge cover 365 can not be exposed through the rear surface of the foldable electronic device 301 or can be minimally exposed. Further, when the foldable electronic device 301 is in a folded state (e.g., the foldable electronic device 301 of FIG. 1B), the first rotation support surface 314 and the second rotation support surface 324 can rotate along the curved surface included in the hinge cover 365 so that the hinge cover 365 can be maximally exposed through the rear surface of the foldable electronic device 301. Figure 3a Figure 3b

[0081] Figure 5 is a plan view schematically illustrating a camera flange, a lens structure, and a conductive connector of an electronic device according to an embodiment of the disclosure. Figure 6

[0082] Referring to Figure 5 and Figure 6 In an embodiment of the disclosure, the electronic device 401 (e.g., the electronic device 101 of FIG. 1A) can include a housing 410, a substrate 430, a camera flange 440, a cover frame 450, a plurality of lens structures 460a and 460b, an image sensor 470, a PCB 480, a first conductive connector 491, a second conductive connector 492, and a plurality of adhesive members 499a and 499b. Figure 1

[0083] In an embodiment of the disclosure, the housing 410 can have a hollow portion therein. The housing 410 can include a main body 411, a side frame 412, and a cover plate 413.

[0084] In an embodiment of the disclosure, the main body 411 can support a plurality of components therein. For example, the main body 411 can support a processor (e.g., the processor 120 of FIG. 1A), a memory (e.g., the memory 130 of FIG. 1A), an input module (e.g., the input module 150 of FIG. 1A), a sound output module (e.g., the sound output module 155 of FIG. 1A), a display module (e.g., the display module 160 of FIG. 1A), an audio module (e.g., the audio module 170 of FIG. 1A), a sensor module (e.g., the sensor module 176 of FIG. 1A), an interface (e.g., the interface 177 of FIG. 1A), a connecting terminal (e.g., the connecting terminal 128 of FIG. 1A), and the like. Figure 1 Figure 1 Figure 1 Figure 1 Figure 1 Figure 1 Figure 1 Figure 1 Figure 1 ​​​​​​​​​​​​a connection terminal 178), a haptic module (for example, Figure 1 a haptic module 179), a camera module (for example, Figure 1 a camera module 180), a power management module (for example, Figure 1 a power management module 188), a battery (for example, Figure 1 a battery 189), a communication module (for example, Figure 1 a communication module 190), a SIM (for example, Figure 1 a SIM 196), or an antenna module (for example, Figure 1 an antenna module 197).

[0085] In an embodiment of the disclosure, the side frame 412 can be connected to the body 411. For example, the side frame 412 can surround the body 411. For example, the side frame 412 can be disposed on a side surface of the body 411 in the +y direction, a side surface in the -y direction, a side surface in the +x direction, and / or a side surface in the -x direction. It should be noted that the side frame 412 is described as a component separate from the body 411, but is not limited thereto. For example, the side frame 412 can be integrally formed with the body 411. The side frame 412 can have, for example, a ring shape.

[0086] In an embodiment of the disclosure, the cover plate 413 can be connected to the body 411. For example, the cover plate 413 can cover a hollow portion in the housing 410.

[0087] In an embodiment of the disclosure, the substrate 430 can be disposed on the body 411. The substrate 430 can include a metal material. The substrate 430 can have a flat plate shape.

[0088] In an embodiment of the disclosure, the camera flange 440 can be disposed on the substrate 430. The camera flange 440 can protect a lens structure. The camera flange 440 can include a metal material. The camera flange 440 can include a flange base 441, a flange body 442, and a flange head 443. The flange base 441 can be connected to the substrate 430. The flange body 442 can extend from the flange base 441. For example, the flange body 442 can extend in the z-axis direction. The flange head 443 can protrude from an inner wall of the flange body 442. The flange head 443 can be provided with a structure in which the lens structure is caught.

[0089] In an embodiment of the disclosure, the cover frame 450 can cover the camera flange 440. The cover frame 450 can protect the camera flange 440. The cover frame 450 can overlap the camera flange 440 in the z-axis direction. An edge portion of the cover frame 450 can overlap the cover plate 413 in the z-axis direction. The cover frame 450 and the camera flange 440 can be connected to each other by a first conductive connector 491. The edge portion of the cover frame 450 and the cover plate 413 can be connected to each other by a first adhesive member 499a. A portion of the cover frame 450 can be provided inside the housing 410, and a portion of the cover frame 450 can protrude to the outside of the housing 410.

[0090] In an embodiment of the disclosure, the plurality of lens structures 460a and 460b can include an outer lens structure 460a and an inner lens structure 460b. The plurality of lens structures 460a and 460b can include a lens and a lens barrel for supporting the lens. The outer lens structure 460a and the inner lens structure 460b can be stacked in the z-axis direction. The outer lens structure 460a can include glass G to prevent or reduce moisture and / or foreign substances from flowing in from the outside. Each of the plurality of lens structures 460a and 460b can have an optical axis. The plurality of lens structures 460a and 460b can be aligned along the optical axis. For example, the optical axis can be parallel to the z-axis.

[0091] In an embodiment of the disclosure, the image sensor 470 can be connected to the inner lens structure 460b. The image sensor 470 can convert light incident through the plurality of lens structures 460a and 460b into an electrical signal. The image sensor 470 can be electrically connected to the PCB 480. The image sensor 470 can be positioned to be substantially aligned with the optical axis of the plurality of lens structures 460a and 460b.

[0092] In an embodiment of the disclosure, the PCB 480 can include various circuit elements for driving the camera module. For example, the PCB 480 can be electrically connected to the image sensor 470. The electronic device 401 can further include a connection path 498 for electrically connecting the PCB 480 to the image sensor 470. For example, the connection path 498 can be a path through which a signal is transmitted to the electronic device 401 and / or a path through which power is transmitted to the electronic device 401. The connection path 498 can be formed. However, the connection path 498 illustrated in the drawing is merely an example, and the number, position, and / or shape of the connection path 498 are not limited thereto.

[0093] In an embodiment of the disclosure, the first conductive connector 491 can be disposed between the cover frame 450 and the camera flange 440. The first conductive connector 491 can be provided in a state of being compressed by the cover frame 450 and the camera flange 440. The first conductive connector 491 can electrically connect the cover frame 450 to the camera flange 440.

[0094] In an embodiment of the disclosure, the first conductive connector 491 can block the inflow of moisture and / or foreign matter into a space between the cover frame 450 and the camera flange 440. The first conductive connector 491 can electrically connect the cover frame 450 to the camera flange 440 while blocking the inflow of moisture and / or foreign matter.

[0095] In an embodiment of the disclosure, the first conductive connector 491 can implement a discharge path E extending from the cover frame 450 to the substrate 430. Specifically, the discharge path E can include the cover frame 450, the first conductive connector 491, the camera flange 440, the second conductive connector 492, and the substrate 430. For example, the second conductive connector 492 can be omitted from the discharge path E. For example, the discharge path E can include the cover frame 450, the first conductive connector 491, the camera flange 440, and the substrate 430. According to this structure, when static electricity is discharged, the discharge path E does not pass through the PCB 480, and thus it is possible to reduce or eliminate the influence of static electricity discharge on the wiring provided on the PCB 480. It is possible to improve the stability of the wiring provided on the PCB 480.

[0096] In an embodiment of the disclosure, the first conductive connector 491 can have elasticity. One end of the first conductive connector 491 can be supported by the camera flange 440, and the other end of the first conductive connector 491 can be supported by the cover frame 450.

[0097] In an embodiment of the disclosure, the first conductive connector 491 can include a conductive sponge. The first conductive connector 491 can include a metal material. The first conductive connector 491 can include a sponge or a foam. The first conductive connector 491 can allow air to pass through, but can block the movement of most of moisture and / or foreign matter. The first conductive connector 491 can enclose a space between the substrate 430 and the camera flange 440.

[0098] In an embodiment of the disclosure, the first conductive connector 491 can surround at least a portion of the inner lens structure 460b. For example, the first conductive connector 491 can have a ring shape. The first conductive connector 491 can be provided in the form of surrounding the optical axis.

[0099] In an embodiment of the disclosure, the second conductive connector 492 can be disposed between the substrate 430 and the camera flange 440. The second conductive connector 492 can be attached to each of the substrate 430 and the camera flange 440.

[0100] In embodiments of this disclosure, the plurality of adhesive members 499a and 499b may include a first adhesive member 499a and a second adhesive member 499b. The first adhesive member 499a may connect the cover plate 413 to the cover frame 450. The second adhesive member 499b may connect the cover plate 413 to the body 411.

[0101] Figure 7 This is a cross-sectional view illustrating an electronic device according to an embodiment of the present disclosure, and Figure 8 This is a schematic plan view illustrating the camera flange, lens structure, and conductive connector of an electronic device according to an embodiment of the present disclosure.

[0102] Reference Figure 7 and Figure 8 In embodiments of this disclosure, electronic device 501 (e.g., Figure 1 The electronic device 101 may include a housing 510, a substrate 530, a camera flange 540, a cover frame 550, multiple lens structures 560a, 560b, 560c and 560d, an image sensor 570, a PCB 580, a 1-1 conductive connector 591, a second conductive connector 592, and multiple adhesive members 599a and 599b.

[0103] In embodiments of this disclosure, the housing 510 may have a hollow portion therein. The housing 510 may include a body 511, a side frame 512, and a cover plate 513.

[0104] In embodiments of this disclosure, the body 511 may support multiple components therein. For example, the body 511 may support a processor (e.g., Figure 1 The processor 120), memory (e.g., Figure 1 The memory 130), input module (e.g., Figure 1 Input module 150), sound output module (e.g., Figure 1 The sound output module 155), and the display module (e.g., Figure 1 The display module 160), audio module (e.g., Figure 1 The audio module 170), sensor module (e.g., Figure 1 Sensor module 176), interface (e.g., Figure 1 Interface 177), connection terminals (e.g., Figure 1 Connection terminal 178), haptic module (e.g., Figure 1 The haptic module 179), and the camera module (e.g., Figure 1 Camera module 180), power management module (e.g., Figure 1 Power management module 188), battery (e.g., Figure 1 Battery 189), communication module (e.g.,Figure 1 communication module 190), a SIM (e.g., a SIM 196), or an antenna module (e.g., an antenna module 197). Figure 1 Figure 1

[0105] In an embodiment of the disclosure, the side frame 512 can be connected to the body 511. For example, the side frame 512 can surround the body 511. For example, the side frame 512 can be disposed on a side surface of the body 511 in the +y direction, a side surface of the body 511 in the -y direction, a side surface of the body 511 in the +x direction, and / or a side surface of the body 511 in the -x direction. It should be noted that the side frame 512 is described as a component separate from the body 511, but is not limited thereto. For example, the side frame 512 can be integrally formed with the body 511. The side frame 512 can have, for example, a ring shape.

[0106] In an embodiment of the disclosure, the cover plate 513 can be connected to the body 511. For example, the cover plate 513 can cover a hollow portion in the housing 510.

[0107] In an embodiment of the disclosure, the substrate 530 can be disposed on the body 511. The substrate 530 can include a metal material. The substrate 530 can have a flat plate shape.

[0108] In an embodiment of the disclosure, the camera flange 540 can be disposed on the substrate 530. The camera flange 540 can protect a lens structure. The camera flange 540 can include a metal material. The camera flange 540 can include a flange base 541, a flange body 542, and a flange head 543. The flange base 541 can be connected to the substrate 530. The flange body 542 can extend from the flange base 541. For example, the flange body 542 can extend in the z-axis direction. The flange head 543 can protrude from an inner wall of the flange body 542. The flange head 543 can be provided with a structure in which the lens structure is caught.

[0109] In an embodiment of the disclosure, the cover frame 550 can cover the camera flange 540. The cover frame 550 can protect the camera flange 540. The cover frame 550 can overlap the camera flange 540 in the z-axis direction. An edge portion of the cover frame 550 can overlap the cover plate 513 in the z-axis direction. The cover frame 550 and the camera flange 540 can be connected to each other by a 1-1 conductive connector 591. An edge portion of the cover frame 550 and the cover plate 513 can be connected to each other by a first adhesive member 599a. A portion of the cover frame 550 can be provided inside the housing 510, and a portion of the cover frame 550 can protrude to the outside of the housing 510.

[0110] ​​In an embodiment of the disclosure, the plurality of lens structures 560a, 560b, 560c, and 560d can include an outer lens structure 560a and a plurality of inner lens structures 560b, 560c, and 560d. It should be noted that the outer lens structure 560a can also be provided as a plurality. The outer lens structure 560a and the inner lens structure 560b can be stacked in the z-axis direction. The outer lens structure 560a can include glass G to prevent or reduce the inflow of moisture and / or foreign substances from the outside. Each of the plurality of lens structures 560a and 560b can have an optical axis. The plurality of lens structures 560a and 560b can be aligned along the optical axis. For example, the optical axis can be parallel to the z-axis.

[0111] In an embodiment of the disclosure, the plurality of inner lens structures 560b, 560c, and 560d can be spaced apart from each other in the y-axis direction. A connector can be provided around each of the plurality of inner lens structures 560b, 560c, and 560d to prevent the inflow of foreign substances. The connector can be, for example, a sponge.

[0112] In an embodiment of the disclosure, the image sensor 570 can be connected to the inner lens structure 560b. The image sensor 570 can convert light incident through the plurality of lens structures 560a and 560b into an electrical signal. The image sensor 570 can be electrically connected to the PCB 580. The image sensor 570 can be positioned to be substantially aligned with the optical axis of the plurality of lens structures 560a and 560b.

[0113] In an embodiment of the disclosure, the PCB 580 can include various circuit elements for driving the camera module. For example, the PCB 580 can be electrically connected to the image sensor 570. The electronic device 501 can further include a connection path 598 for electrically connecting the PCB 580 to the image sensor 570. For example, the connection path 598 can be a path through which a signal is transmitted to the electronic device 501 and / or a path through which power is transmitted to the electronic device 501. At least one connection path 598 can be formed. However, the connection path 598 illustrated in the drawing is merely an example, and the number, position, and / or shape of the connection path 598 are not limited thereto.

[0114] In an embodiment of the disclosure, the first conductive connectors 591 and 593 can be provided as a plurality. The plurality of first conductive connectors 591 and 593 can include a 1-1 conductive connector 591 and a 1-2 conductive connector 593. The 1-1 conductive connector 591 and the 1-2 conductive connector 593 can be provided at positions spaced apart from each other in a direction perpendicular to the optical axis.

[0115] In an embodiment of the disclosure, the 1-1 conductive connector 591 can be disposed between the cover frame 550 and the camera flange 540. The 1-1 conductive connector 591 can be provided in a state of being compressed by the cover frame 550 and the camera flange 540. The 1-1 conductive connector 591 can electrically connect the cover frame 550 to the camera flange 540.

[0116] In an embodiment of the disclosure, the 1-1 conductive connector 591 can block the inflow of moisture and / or foreign substances into a space between the cover frame 550 and the camera flange 540. The 1-1 conductive connector 591 can electrically connect the cover frame 550 to the camera flange 540 while blocking the inflow of moisture and / or foreign substances.

[0117] In an embodiment of the disclosure, the 1-1 conductive connector 591 can implement a discharge path E extending from the cover frame 550 to the substrate 530. Specifically, the discharge path E can include the cover frame 550, the 1-1 conductive connector 591, the camera flange 540, the second conductive connector 592, and the substrate 530. For example, the second conductive connector 592 can be omitted from the discharge path E. For example, the discharge path E can include the cover frame 550, the 1-1 conductive connector 591, the camera flange 540, and the substrate 530. According to this structure, when electrostatic discharge occurs, the discharge path E does not pass through the PCB 580, and thus it is possible to reduce or eliminate the influence of the electrostatic discharge on the wiring provided on the PCB 580. It is possible to improve the stability of the wiring provided on the PCB 580.

[0118] In an embodiment of the disclosure, the 1-1 conductive connector 591 can have elasticity. One end of the 1-1 conductive connector 591 can be supported by the camera flange 540, and the other end of the 1-1 conductive connector 591 can be supported by the cover frame 550.

[0119] In an embodiment of the disclosure, the 1-1 conductive connector 591 can include a conductive sponge. The 1-1 conductive connector 591 can include a metal material. The 1-1 conductive connector 591 can allow air to pass through, but can block the movement of most of moisture and / or foreign substances. The 1-1 conductive connector 591 can enclose a space between the substrate 530 and the camera flange 540.

[0120] In an embodiment of the disclosure, the 1-1 conductive connector 591 can surround at least a portion of the inner lens structure 560b. For example, the 1-1 conductive connector 591 can have a ring shape. The 1-1 conductive connector 591 can be provided in a form of surrounding an optical axis.

[0121] In an embodiment of the disclosure, the 1-2 conductive connector 593 can be disposed between the cover frame 550 and the camera flange 540. The 1-2 conductive connector 593 can be provided in a state of being compressed between the cover frame 550 and the camera flange 540. The 1-2 conductive connector 593 can have a columnar shape. For example, the 1-2 conductive connector 593 can have a cylindrical shape or a rectangular column shape. It should be noted that the shape of the 1-2 conductive connector 593 is not limited thereto.

[0122] In an embodiment of the disclosure, the 1-2 conductive connector 593 can implement a discharge path E extending from the cover frame 550 to the substrate 530. Specifically, the discharge path E can include the cover frame 550, the 1-2 conductive connector 593, the camera flange 540, the second conductive connector 592, and the substrate 530. For example, the second conductive connector 592 can be omitted from the discharge path E. For example, the discharge path E can include the cover frame 550, the 1-2 conductive connector 593, the camera flange 540, and the substrate 530. According to this structure, when static electricity is discharged, the discharge path E does not pass through the PCB 580, so that the influence of the static electricity discharge on the wiring provided on the PCB 580 can be reduced or eliminated. The stability of the wiring provided on the PCB 580 can be improved.

[0123] In an embodiment of the disclosure, the second conductive connector 592 can be disposed between the substrate 530 and the camera flange 540. The second conductive connector 592 can be attached to each of the substrate 530 and the camera flange 540.

[0124] In an embodiment of the disclosure, the plurality of adhesive members 599a and 599b can include a first adhesive member 599a and a second adhesive member 599b. The first adhesive member 599a can connect the cover plate 513 to the cover frame 550. The second adhesive member 599b can connect the cover plate 513 to the main body 511.

[0125] Figure 9 FIG. 1 is a perspective view schematically illustrating an electronic device according to an embodiment of the disclosure.

[0126] Referring to Figure 9 In an embodiment of the disclosure, the electronic device 601 (e.g., the electronic device 101 of FIG. 1) can include a housing 610, a camera flange 640, a plurality of inner lens structures 660b, 660c, and 660d, and a first conductive connector 691. Figure 1

[0127] ​In an embodiment of the disclosure, the plurality of inner lens structures 660b, 660c, and 660d can be spaced apart from each other. The plurality of inner lens structures 660b, 660c, and 660d can include a first inner lens structure 660b, a second inner lens structure 660c, and a third inner lens structure 660d.

[0128] In an embodiment of the disclosure, the first conductive connector 691 can be provided as a plurality. For example, the first conductive connector 691 can include a 1-1 conductive connector 6911 surrounding the first inner lens structure 660b, a 1-2 conductive connector 6913 surrounding the second inner lens structure 660c, a 1-3 conductive connector 6915 surrounding the third inner lens structure 660d, a first connection connector 6912 connecting the 1-1 conductive connector 6911 to the 1-2 conductive connector 6913, and a second connection connector 6914 connecting the 1-2 conductive connector 6913 to the 1-3 conductive connector 6915.

[0129] Figure 10 is a plan view schematically showing a camera flange, a lens structure, and a conductive connector of an electronic device according to an embodiment of the disclosure.

[0130] Referring to Figure 10 In an embodiment of the disclosure, the electronic device 701 (for example, Figure 1 The electronic device 101) can include a housing 710, a camera flange 740, a plurality of inner lens structures 760b, 760c, and 760d, first conductive connectors 792, 793, and 794, and adhesive sponges 797a and 797b. The adhesive sponges 797a and 797b can include a non-conductive material.

[0131] In an embodiment of the disclosure, the plurality of inner lens structures 760b, 760c, and 760d can be spaced apart from each other. The plurality of inner lens structures 760b, 760c, and 760d can include a first inner lens structure 760b, a second inner lens structure 760c, and a third inner lens structure 760d.

[0132] In an embodiment of the disclosure, the first conductive connectors 792, 793, and 794 can be provided as a plurality. For example, the first conductive connectors 792, 793, and 794 can include a 1-1 conductive connector 792 surrounding the third inner lens structure 760d, and a 1-2 conductive connector 793 and a 1-3 conductive connector 794 provided around the first inner lens structure 760b. The 1-1 conductive connector 792, the 1-2 conductive connector 793, and the 1-3 conductive connector 794 can be provided at positions spaced apart from each other.

[0133] According to an embodiment of the disclosure, an electronic device can include a main body 411, a housing 410 including a cover plate 413 connected to the main body 411, a substrate 430 disposed on the main body 411, a camera flange 440 disposed on the substrate 430, a cover frame 450 covering the camera flange 440, a plurality of lens structures 460a and 460b including an outer lens structure 460a connected to the cover frame 450 and an inner lens structure 460b connected to the camera flange 440, and a first conductive connector 491 disposed between the cover frame 450 and the camera flange 440, provided in a state of being compressed by the cover frame 450 and the camera flange 440, and electrically connecting the cover frame 450 to the camera flange 440.

[0134] In an embodiment of the disclosure, electrostatic discharge can occur along the cover frame 450, the first conductive connector 491, the camera flange 440, and the substrate 430.

[0135] In an embodiment of the disclosure, the first conductive connector 491 can have elasticity.

[0136] In an embodiment of the disclosure, the first conductive connector 491 can include a conductive sponge.

[0137] In an embodiment of the disclosure, the first conductive connector 491 can surround at least a portion of the inner lens structure 460b.

[0138] In an embodiment of the disclosure, the first conductive connector 491 can have a ring shape.

[0139] In an embodiment of the disclosure, the first conductive connector 491 can enclose a space between the camera flange 440 and the cover frame 450.

[0140] In an embodiment of the disclosure, the electronic device can further include a second conductive connector 492 disposed between the substrate 430 and the camera flange 440.

[0141] In an embodiment of the disclosure, the first conductive connector 491 and the second conductive connector 492 can include the same material.

[0142] In an embodiment of the disclosure, the electronic device can further include a PCB 480 disposed inside the housing 410 and provided not to be electrically connected to the camera flange 440.

[0143] In an embodiment of the disclosure, the PCB 480 can be disposed inside the housing 410 and can be spaced apart from the camera flange 440.

[0144] In an embodiment of the disclosure, the first conductive connector 591 can be provided in a plurality.

[0145] In an embodiment of the disclosure, the inner lens structure 560b, 560c, and 560d can be provided as a plurality, and the camera flange 540 can surround each of the plurality of inner lens structures 560b, 560c, and 560d.

[0146] In an embodiment of the disclosure, the first conductive connectors 591 and 593 can be provided as a plurality, and the plurality of first conductive connectors 591 and 593 can include: a 1-1 conductive connector 591 surrounding any one of the plurality of inner lens structures 560b, 560c, and 560d; and a 1-2 conductive connector 593 provided at a position spaced apart from the 1-1 conductive connector 591.

[0147] In an embodiment of the disclosure, the plurality of first conductive connectors 591 and 593 and 691 can further include connection connectors 6912 and 6914 connecting the 1-1 conductive connector 591 to the 1-2 conductive connector 593.

[0148] According to an embodiment of the disclosure, an electronic device can include: a main body 411; a housing 410 including a cover plate 413 connected to the main body 411; a substrate 430 arranged on the main body 411; a camera flange 440 arranged on the substrate 430; a cover frame 450 covering the camera flange 440; a plurality of lens structures 460a and 460b including an outer lens structure 460a connected to the cover frame 450 and an inner lens structure 460b connected to the camera flange 440; and a first conductive connector 491 arranged between the cover frame 450 and the camera flange 440 and provided in a state of being compressed by the cover frame 450 and the camera flange 440, wherein electrostatic discharge can occur along the cover frame 450, the first conductive connector 491, the camera flange 440, and the substrate 430.

[0149] In an embodiment of the disclosure, the first conductive connector 491 can include a conductive sponge.

[0150] In an embodiment of the disclosure, the first conductive connector 491 can have a ring shape.

[0151] In an embodiment of the disclosure, the electronic device can further include: a PCB 480 arranged inside the housing 410 and provided not to be electrically connected to the camera flange 440.

[0152] According to an embodiment of the disclosure, an electronic device can include a main body 411, a housing 410 including a cover plate 413 connected to the main body 411, a substrate 430 disposed on the main body 411, a camera flange 440 disposed on the substrate 430, a cover frame 450 covering the camera flange 440, a plurality of lens structures 460a and 460b including an outer lens structure 460a connected to the cover frame 450 and an inner lens structure 460b connected to the camera flange 440, and a first conductive connector 491 disposed between the cover frame 450 and the camera flange 440, having elasticity to be provided in a state of being compressed by the cover frame 450 and the camera flange 440, electrically connecting the cover frame 450 to the camera flange 440, and having a ring shape, wherein electrostatic discharge can occur along the cover frame 450, the first conductive connector 491, the camera flange 440, and the substrate 430.

[0153] Effects of the electronic device according to the embodiment are not limited to the above-mentioned effects, and other unmentioned effects can be clearly understood from the following description by those skilled in the art.

[0154] It should be understood that various embodiments of the disclosure according to the claims and the description herein can be implemented in hardware, software, or a combination of hardware and software.

Claims

1. An electronic device, comprising: The housing (410) includes a body (411) and a cover plate (413) connected to the body (411). A substrate (430) is disposed on a body (411); A camera flange (440) is arranged on a substrate (430); The cover frame (450) is configured to cover the camera flange (440); Multiple lens structures (460a, 460b; 560a, 560b, 560c, 560d; 660b, 660c, 660d; 760b, 760c, 760d), including outer lens structures (460a and 560a) connected to the cover frame (450) and inner lens structures (460b; 560b, 560c, 560d; 660b, 660c, 660d) connected to the camera flange (440); and The first conductive connector (491; 591, 593; 691; 792, 793, 794) is arranged between the cover frame (450) and the camera flange (440) and electrically connects the cover frame (450) to the camera flange (440).

2. The electronic device according to claim 1, wherein, Electrostatic discharge can be generated along the cover frame (450), the first conductive connectors (491; 591, 593; 691; 792, 793, 794), the camera flange (440), and the substrate (430).

3. The electronic device according to claim 1 or 2, wherein, The first conductive connector (491; 591, 593; 691; 792, 793, 794) is flexible and is provided in a compressed state by the cover frame (450) and the camera flange (440).

4. The electronic device according to any one of claims 1 to 3, wherein, The first conductive connector (491; 591, 593; 691; 792, 793, 794) includes conductive foam.

5. The electronic device according to any one of claims 1 to 4, wherein, The first conductive connector (491; 591, 593; 691; 792, 793, 794) surrounds at least a portion of the inner lens structure (460b; 560b, 560c, 560d; 660b, 660c, 660d).

6. The electronic device according to any one of claims 1 to 5, wherein, The first conductive connector (491; 591, 593; 691; 792, 793, 794) has a ring shape.

7. The electronic device according to any one of claims 1 to 6, wherein, The first conductive connector (491; 591, 593; 691; 792, 793, 794) encloses the space between the camera flange (440) and the cover frame (450).

8. The electronic device according to any one of claims 1 to 7, further comprising: The second conductive connector (492; 592) is arranged between the substrate (430) and the camera flange (440).

9. The electronic device according to any one of claims 1 to 8, wherein, The first conductive connector (491; 591, 593; 691; 792, 793, 794) and the second conductive connector (492; 592) are made of the same material.

10. The electronic device according to any one of claims 1 to 9, further comprising: A printed circuit board (PCB) (480) is arranged inside the housing (410) and is provided to be non-electrically connected to the camera flange (440).

11. The electronic device according to any one of claims 1 to 10, wherein, The PCB (480) is arranged inside the housing (410) and spaced apart from the camera flange (440).

12. The electronic device according to any one of claims 1 to 11, wherein, The first conductive connectors (491; 591, 593; 691; 792, 793, 794) are provided in multiples.

13. The electronic device according to any one of claims 1 to 12, wherein, Multiple internal lens structures (560b, 560c, 560d) are provided, and The camera flange (540) surrounds each of the multiple inner lens structures (560b, 560c, 560d).

14. The electronic device according to any one of claims 1 to 13, wherein, Multiple first conductive connectors (591, 593; 691) are provided. Multiple first conductive connectors (591, 593; 691) include: 1-1 conductive connector (591), surrounding one of multiple inner lens structures (560b, 560c, 560d); and The 1-2 conductive connector (593) is provided at a position spaced apart from the 1-1 conductive connector (591).

15. The electronic device according to any one of claims 1 to 14, wherein, The plurality of first conductive connectors (591, 593; 691) also include: connecting connectors (6912, 6914) for connecting 1-1 conductive connector (591) to 1-2 conductive connector (593).

Images