A double-sided soldering device and method based on dithering

Abstract

This invention discloses a vibration-based double-sided soldering device and method, including a worktable, a support fixed to the worktable, a lifter that can slide along the support, a lifting shaft connected to the output end of the lifter, a controller for controlling the movement of the lifting shaft, a fixture mounted on the worktable, and a circuit board inside the fixture. It also includes: an operating part one, mounted on the lower end of the lifting shaft; and an operating part two, located outside the operating part one and slidably mounted thereto. The operating part two is equipped with a soldering iron for soldering and an automatic solder feeding end containing solder. Compared with the prior art, the advantage of this invention is that by controlling the soldering iron to vibrate up and down in the controller, the molten solder penetrates into the openings of the circuit board under pressure and capillary action, achieving solder filling at both ends of the openings on the circuit board, completing double-sided soldering, enhancing the mechanical strength and current flow capacity of the circuit board, and avoiding the problem of weak solder joints caused by traditional single-sided soldering.

Description

Technical Field

[0001] This invention relates to the field of soldering technology, and more particularly to a vibration-based double-sided soldering device and soldering method. Background Technology

[0002] Soldering equipment mainly consists of a soldering iron and solder wire. It's a crucial device for soldering circuit boards and electronic components within electronic products. Currently, most circuit boards are manufactured by laminating multiple single-layer or double-layer boards together. After lamination, through-holes or blind holes are drilled into the board using precision drills or lasers. Then, a complex chemical copper plating process deposits a layer of copper on the inner walls of the holes, connecting the circuits of different layers. Through-holes on circuit boards are typically sealed using a through-hole plugging process to improve the board's mechanical strength and current flow capacity. Furthermore, soldering generally only allows for single-sided soldering, which can easily lead to solder joint detachment.

[0003] The publication number CN112658425A, entitled "A Soldering Device and Soldering Method for Electronic Product Processing," proposes a method for welding handheld soldering irons and solder bars. However, this method is inefficient and the soldering process is inherently dangerous. During the contact between the soldering iron and the circuit board and electronic components, the bottom of the soldering iron can easily damage the circuit board.

[0004] The aforementioned existing soldering device can perform soldering on different positions of a fixed circuit board through a controller, and the soldering position is accurate. However, when soldering through holes on the circuit board, the soldering device has difficulty driving the solder to fill the through holes. First, the soldering iron can easily block the through holes that need to be filled, making it difficult for the solder to flow into the through holes. Second, when the soldering iron tip or solder comes into contact with the solder joint, the heat is quickly absorbed by the circuit board substrate, causing the temperature at the bottom and inside of the through hole to not reach the melting temperature of the solder. The solder solidifies at the top and cannot flow down. Summary of the Invention

[0005] In view of the problems mentioned above, the technical problem to be solved by the present invention is to provide a double-sided soldering device and soldering method based on vibration.

[0006] The technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows: a double-sided soldering device based on vibration, including a worktable, a bracket fixed to the worktable, a lifter that can slide along the bracket, a lifting shaft connected to the output end of the lifter, a controller for controlling the movement of the lifting shaft, a fixture set on the worktable, and a circuit board inside the fixture, and further including: Operating unit one is installed at the lower end of the lifting shaft; Operation section 2 is located outside of operation section 1 and is slidably disposed with operation section 1. Operation section 2 is provided with a soldering iron for soldering and an automatic solder feeding end, and the automatic solder feeding end contains solder. The upper elastic part is installed between the first operating part and the second operating part. When the controller controls the soldering iron to contact the circuit board downwards, it plays a buffering role. The circuit board has a through-hole. The controller controls the soldering iron to shake up and down to drive the solder to penetrate into the through-hole, so as to achieve double-sided soldering.

[0007] A further preferred embodiment of the present invention is: the operating part one includes a connecting block one clamped with the lifting shaft, a handle installed on the outside of the connecting block one, and a connecting block two fixed to the handle, the connecting block two having a through groove; The second operating unit includes a slider that is slidably installed in the slide groove and a third connecting block that is fixed to the slider. The third connecting block is used to hold the soldering iron.

[0008] A further preferred embodiment of the present invention is as follows: the upper elastic part includes a support end one fixed to the side of the connecting block, a support end two fixed to the side of the slider, a shaft passing through the support end one and the support end two and abutting the support end one and the support end two at both ends respectively, and a reset spring sleeved on the shaft. When the controller controls the soldering iron to move downward and the lower end of the soldering iron abuts against the circuit board, the reset spring is compressed.

[0009] A further preferred embodiment of the present invention is: the lower end of the slider is provided with an adjustment part for adjusting the position of the automatic solder feeding end. The adjustment part includes an annular mounting bracket fixed to the lower end of the slider, a mounting block one that can be fixed to different positions of the annular mounting bracket by bolts, a lifting adjustment rod that passes through the mounting block one and is clamped by the mounting block one, a mounting block two disposed at the lower end of the mounting block, and a cylindrical shaft one and a cylindrical shaft two that both extend into the mounting block two. Mounting block 2 has two sets of bolts extending into it and abutting against cylinder shaft 1 and cylinder shaft 2 respectively. The lifting adjustment rod extends downward into cylinder shaft 1, and the automatic solder feeding end passes through cylinder shaft 2. The outward-facing ends of cylinder shaft 1 and cylinder shaft 2 are each equipped with bolts, which are used to abut against the lifting adjustment rod and the automatic solder feeding end respectively.

[0010] A further preferred embodiment of the present invention is: the lower end of the soldering iron has a soldering iron head, the soldering iron head includes a soldering iron shaft installed at the lower end of the soldering iron for heating, the end of the soldering iron shaft used for soldering is a rectangular end, and the rectangular end can press against the opening of the circuit board when it moves downward.

[0011] A further preferred embodiment of the present invention is: an outer sleeve is provided on the outside of the soldering iron shaft, the lower end of the outer sleeve has a rectangular frame that mates with the rectangular end, and a slot communicating with the rectangular frame is provided on the side of the outer sleeve near the lower end, the slot being used for solder to extend into it; The soldering iron has a lower elastic part between it and the outer casing for supporting the outer casing. When the lower elastic part is in the reset state, the rectangular end is retracted into the rectangular frame, and a cavity is formed between the rectangular end and the rectangular frame. When the lower elastic part is in the compressed state, the rectangular end and the lower end of the rectangular frame are flush.

[0012] A further preferred embodiment of the present invention is as follows: the lower elastic part includes a limiting shaft fixed to the lower end of the soldering iron and a spring body sleeved on the limiting shaft, the upper end of the outer sleeve has an extension piece extending outward, the limiting shaft passes through the extension piece, and the lower end of the spring body is fixed to the extension piece.

[0013] A further preferred embodiment of the present invention is: the rectangular end is fitted to the inner wall of the rectangular frame, and the bottom corners of the rectangular end and the bottom corners of the inner side of the rectangular frame are both right angles.

[0014] A further preferred embodiment of the present invention is that the spring body is a high-temperature alloy spring.

[0015] A dithering-based double-sided soldering method includes the following steps: Step 1: The controller controls the lifting device to slide on the bracket, controls the clamp to slide on the worktable, and controls the lifting shaft to move up and down, so that the lower end of the soldering iron corresponds to the position of the circuit board opening; Step 2: After the controller moves the lower end of the soldering iron downwards and comes into contact with the circuit board, the upper elastic part is compressed, so that the lower end of the soldering iron is evenly attached to the circuit board, preheating the circuit board for 2-5 seconds, while preventing rigid impact and excessive pressure. Step 3: The controller then controls the soldering iron to vibrate up and down, causing the lower end of the soldering iron to separate and re-attach to the circuit board multiple times, and the upper elastic part to reset and compress multiple times. At the same time, the automatic solder feeding end transmits solder to the soldering position on the circuit board, and the molten solder penetrates into the circuit board opening under pressure and capillary action, so that both ends of the opening are soldered, achieving double-sided soldering.

[0016] Compared with the prior art, the advantages of the present invention are as follows: 1. By controlling the soldering iron to vibrate up and down through the controller, the molten solder penetrates into the openings of the circuit board under pressure and capillary action, so that both ends of the openings on the circuit board are filled with solder, thus completing double-sided soldering. This enhances the mechanical strength and current flow capacity of the circuit board, and also avoids the problem of weak solder joints caused by traditional single-sided soldering.

[0017] 2. The upper elastic part is compressed when the soldering iron is pressed downwards, avoiding rigid impact and ensuring that the soldering iron head is in close contact with the circuit board and is compressed. This effectively prevents the circuit board from being damaged due to overpressure, extends the life of the circuit board, and improves the safety of the soldering process. At the same time, the soldering iron is repeatedly compressed against the circuit board during the downward movement of the up and down direction, reducing the damage to the circuit board due to overpressure and ensuring that the solder fills the circuit board opening.

[0018] 3. Through the lower elastic part, the soldering iron is shaken up and down, filling the cavity formed by the outer jacket and the rectangular end with molten solder. The cavity opens and closes periodically with the shaking. During the opening and closing process, the molten solder inside is pushed out, making it easier to push the molten solder into the circuit board opening. Attached Figure Description

[0019] The present invention will be further described in detail below with reference to the accompanying drawings and preferred embodiments. However, those skilled in the art will understand that these drawings are drawn only for the purpose of explaining the preferred embodiments and therefore should not be regarded as a limitation on the scope of the present invention. In addition, unless specifically indicated, the drawings are only schematic representations of the composition or structure of the described objects and may contain exaggerated displays, and the drawings are not necessarily drawn to scale.

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 For the present invention Figure 1 A magnified schematic diagram of the structure of part A in the diagram; Figure 3 This is a schematic diagram of the structure of the first operating part, the second operating part, and the upper elastic part of the present invention; Figure 4 This is a schematic diagram of the separate structure of operation part one and operation part two of the present invention; Figure 5 This is a schematic diagram of the structure of the second operating part and the adjustment part of the present invention; Figure 6 This is a schematic diagram of the adjustment part of the present invention; Figure 7 This is a schematic diagram of the soldering iron head structure of the present invention; Figure 8 This is a schematic diagram of the half-section structure of the outer casing of the present invention; Figure 9 This is a schematic diagram of the structure of the outer jacket and circuit board after the present invention is compressed.

[0021] In the diagram: 1. Workbench; 2. Support; 3. Controller; 4. Lifter; 5. Lifting shaft; 6. Operating section one; 61. Connecting block one; 62. Handle; 63. Connecting block two; 64. Slide; 7. Operating section two; 71. Slider; 72. Connecting block three; 8. Upper elastic part; 81. Support end one; 82. Support end two; 83. Shaft; 84. Return spring; 9. Soldering iron; 91. Soldering iron head; 911. Soldering iron shaft; 912. Rectangular 913. End; 914. Outer jacket; 915. Rectangular frame; 916. Slot; 917. Extension piece; 10. Automatic solder feeding end; 101. Solder; 11. Adjustment part; 111. Circular mounting bracket; 112. Mounting block one; 113. Lifting adjustment rod; 114. Mounting block two; 115. Cylindrical shaft one; 116. Cylindrical shaft two; 12. Lower elastic part; 121. Limiting shaft; 122. Spring body; 13. Clamp; 14. Circuit board; 141. Through port. Detailed Implementation

[0022] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Those skilled in the art will appreciate that these descriptions are merely descriptive and exemplary and should not be construed as limiting the scope of protection of the present invention.

[0023] It should be noted that similar labels in the following figures indicate similar items; therefore, once an item is defined in one figure, it may not be further defined and explained in subsequent figures. Example

[0024] This embodiment mainly describes a vibration-based double-sided soldering device. Please refer to [link / reference]. Figures 1-9 The details are as follows: Existing soldering equipment is used for batch soldering of circuit boards 14. However, current soldering methods generally only allow for single-sided soldering and are prone to solder joint detachment. Furthermore, the vias 141 on circuit boards 14 are typically sealed using a through-hole blocking process to improve the mechanical strength and current flow capacity of the circuit board 14. Soldering to seal the vias 141 on circuit boards 14 can also improve the mechanical strength and current flow capacity of the circuit board 14. Based on this, a vibration-based double-sided soldering device is proposed, including a worktable 1, a support 2 fixed to the worktable 1, a lifter 4 that slides along the support 2, a lifting shaft 5 connected to the output end of the lifter 4, a controller 3 for controlling the movement of the lifting shaft 5, a fixture 13 mounted on the worktable 1, and circuit boards 14 within the fixture 13. The device also includes: Operating unit 6 is installed at the lower end of lifting shaft 5; Operation section 2 7 is located outside of operation section 1 6 and is slidably disposed with operation section 1 6. Operation section 2 7 is provided with a soldering iron 9 for soldering and an automatic solder feeding end 10. The automatic solder feeding end 10 contains solder 101. The upper elastic part 8 is installed between the first operating part 6 and the second operating part 7. When the controller 3 controls the soldering iron 9 to contact the circuit board 14 downwards, it plays a buffering role. The circuit board 14 has a through-hole 141. The controller 3 controls the soldering iron 9 to vibrate up and down to drive the solder 101 to penetrate into the through-hole 141, thereby achieving double-sided soldering.

[0025] Specifically, the workbench 1, support 2, lifting device 4, lifting shaft 5, and controller 3 are all existing technologies. Operating section 1 6 and operating section 2 7 are used to limit the soldering iron 9, allowing it to move with the lifting shaft 5. The automatic solder feeding end 10 transmits solder 101, ensuring it melts at the lower end of the soldering iron 9 for easy soldering. An upper elastic section 8 is provided between operating section 1 6 and operating section 2 7, buffering the soldering iron 9 when it contacts and presses against the circuit board 14, preventing damage and ensuring close contact between the lower end of the soldering iron 9 and the circuit board 14 for preheating. The controller 3 controls the vertical vibration of the soldering iron 9, allowing its lower end to contact, separate from, and then re-contact the circuit board 14, pushing the molten solder 101 into the opening 141 for double-sided soldering, increasing the mechanical strength and current flow capacity of the circuit board 14. It should be noted that when the soldering iron 9 is shaken up and down and pressed against the circuit board 14, the upper elastic part 8 is compressed, ensuring that the lower end of the soldering iron 9 is in close contact with the circuit board 14, which plays a buffering role and also prevents the circuit board 14 from being squeezed and damaged.

[0026] like Figures 3-4 As shown, the operating part 6 includes a connecting block 61 clamped to the lifting shaft 5, a handle 62 mounted on the outside of the connecting block 61, and a connecting block 63 fixed to the handle 62. The connecting block 63 has a through groove 64. The second operating unit 7 includes a slider 71 that is slidably installed in the slide groove 64 and a connecting block 72 that is fixed to the slider 71. The connecting block 72 is used to clamp the soldering iron 9.

[0027] Specifically, the first operating unit 6 is used to connect to the lifting shaft 5 and can be manually controlled by the handle 62, while the second operating unit 7 fixes the soldering iron 9 and slides with the first operating unit 6.

[0028] like Figures 4-5As shown, the upper elastic part 8 includes a support end 81 fixed to the side of the connecting block 63, a support end 82 fixed to the side of the slider 71, a shaft 83 passing through the support end 81 and the support end 82 and abutting against the support end 81 and the support end 82 at both ends respectively, and a return spring 84 sleeved on the shaft 83. When the controller 3 controls the soldering iron 9 to move downwards, the lower end of the soldering iron 9 abuts against the circuit board 14, and the return spring 84 is compressed.

[0029] Specifically, the upper elastic part 8 is used to support the sliding operation part 1 6 and operation part 2 7. When the operation part 2 7 is squeezed, the return spring 84 can be compressed, so that the soldering iron 9 moves downward and the lower end fits and squeezes against the circuit board 14 without causing damage to the circuit board 14.

[0030] like Figures 5-6 As shown, the lower end of the slider 71 is provided with an adjustment part 11 for adjusting the position of the automatic solder feeding end 10. The adjustment part 11 includes an annular mounting bracket 111 fixed to the lower end of the slider 71, a mounting block 112 that can be fixed to different positions of the annular mounting bracket 111 by bolts, a lifting adjustment rod 113 that passes through the mounting block 112 and is clamped by the mounting block 112, a mounting block 2 114 provided at the lower end of the mounting block 112, and a cylindrical shaft 115 and a cylindrical shaft 2 116 that both extend into the mounting block 2 114. Mounting block 2 114 has two sets of bolts extending into it and abutting against cylinder shaft 1 115 and cylinder shaft 2 116 respectively. Lifting adjustment rod 113 extends downward into cylinder shaft 1 115. Automatic solder feeding end 10 passes through cylinder shaft 2 116. The outward-facing ends of cylinder shaft 1 115 and cylinder shaft 2 116 are each equipped with bolts, which are used to abut against lifting adjustment rod 113 and automatic solder feeding end 10 respectively.

[0031] Specifically, mounting block 112 can be set at different positions on the annular mounting bracket 111 so that the automatic solder feeding end 10 points in different directions. The lifting adjustment rod 113 can adjust the longitudinal extension position along mounting block 112. By adjusting the two bolts on mounting block 214, the cylinder shaft 115 and cylinder shaft 216 can be rotated to adjust the automatic solder feeding end 10 to different inclinations so that the solder 101 can be fed into the slot 915 of the outer jacket 913.

[0032] like Figures 5-9 As shown, the lower end of the soldering iron 9 has a soldering iron head 91, which includes a soldering iron shaft 911 installed at the lower end of the soldering iron 9 for heating. The end of the soldering iron shaft 911 used for soldering is a rectangular end 912. The rectangular end 912 can press against the opening 141 of the circuit board 14 when it moves downward.

[0033] Specifically, the soldering iron head 91 is the part of the soldering iron 9 that is heated, and the rectangular end 912 is the end of the soldering iron shaft 911. The rectangular end 912 can cover the upper end of the opening 141 of the circuit board 14. Even if the opening 141 of the circuit board 14 is longer, the rectangular end 912 can be controlled by the controller 3 to move along the extension direction of the opening 141 of the circuit board 14, and can vibrate while moving, so that the solder 101 fills the opening 141 of the circuit board 14.

[0034] like Figures 5-9 As shown, the outer side of the soldering iron spindle 911 is fitted with an outer sleeve 913. The lower end of the outer sleeve 913 has a rectangular frame 914 that mates with the rectangular end 912. The side of the outer sleeve 913 near the lower end has a slot 915 that communicates with the rectangular frame 914. The slot 915 is used for solder 101 to extend into it. The soldering iron 9 and the outer casing 913 have a lower elastic part 12 for supporting the outer casing 913. When the lower elastic part 12 is in the reset state, the rectangular end 912 is retracted into the rectangular frame 914, and a cavity is formed between the rectangular end 912 and the rectangular frame 914. When the lower elastic part 12 is in the squeezed state, the lower ends of the rectangular end 912 and the rectangular frame 914 are flush.

[0035] Specifically, the outer sleeve 913 is made of metal and fits into the soldering iron spindle 911, allowing the heat from the soldering iron spindle 911 to be transferred to the outer sleeve 913. The outer sleeve 913 can also melt the solder 101. Figure 8 As shown, rectangular end 912 is located within rectangular frame 914 and is in a state of not being compressed, as... Figure 9 The diagram shows the compressed state, with the rectangular end 912 flush with the rectangular frame 914. This corresponds to the two states of the upper elastic part 8: reset and compression. During the shaking of the soldering iron 9, the cavity formed between the rectangular end 912 and the rectangular frame 914 is squeezed, causing the solder 101 molten in the cavity to be squeezed downwards. This makes it easier for the molten solder 101 to penetrate downwards into the circuit board 14 through-hole 141, thus achieving double-sided soldering.

[0036] like Figure 7 As shown, the lower elastic part 12 includes a limiting shaft 121 fixed to the lower end of the soldering iron 9 and a spring body 122 sleeved on the limiting shaft 121. The upper end of the outer sleeve 913 has an extension piece 916 extending outward, the limiting shaft 121 passes through the extension piece 916, and the lower end of the spring body 122 is fixed to the extension piece 916.

[0037] Specifically, the lower elastic part 12 is used to control the formation and disappearance of the cavity between the rectangular end 912 and the rectangular frame 914. When the rectangular end 912, the rectangular frame 914 and the circuit board 14 are pressed together, the spring body 122 is compressed.

[0038] like Figures 8-9As shown, the rectangular end 912 is attached to the inner wall of the rectangular frame 914, and the bottom corners of the rectangular end 912 and the inner corners of the rectangular frame 914 are both right angles.

[0039] Specifically, when the rectangular end 912 coincides with the lower end of the rectangular frame 914, the solder 101 molten in the cavity can be squeezed out as much as possible, and it is not easy to leave residue.

[0040] Spring body 122 is a high-temperature alloy spring, which is not easily fatigued under high temperature conditions and maintains its elasticity.

[0041] Working principle: The workbench 1, support 2, controller 3, lifting device 4 and lifting shaft 5 are all existing known technologies of soldering equipment. The controller 3 can control the clamp 13 located on the workbench 1 to move along the workbench 1. The lifting device 4 is controlled by the controller 3 to move along the support 2. The lifting shaft 5 is controlled to move up and down. The soldering iron 9 also moves with it and can solder the corresponding port 141 of the circuit board 14.

[0042] Specifically, the controller 3 first controls the soldering iron 9 to move downwards, so that the lower end of the soldering head 91 contacts the upper end of the port 141 of the circuit board 14. After preheating for a few seconds, the controller 3 controls the soldering iron 9 to shake up and down. At the same time, the controller drives the automatic solder feeding end 10 to transfer the solder 101. The automatic solder feeding end 10 is also controlled by the controller 3, so that it contacts the soldering head 91 and melts. The molten solder 101 will adhere to the circuit board 14, and during the up and down shaking of the soldering head 91, it will move into the port 141 through pressure and capillary action, filling the port 141. Thus, in the case of single-sided soldering, both ends are soldered. It should be noted that when the soldering head 91 presses downward against the circuit board 14, in order to ensure close contact between the soldering head 91 and the circuit board 14 without damaging the circuit board 14, the resistance at the lower end of the soldering head 91 is transmitted to the support end 82 and moves upward, causing the return spring 84 to be compressed, thus achieving a buffering effect. During the up-and-down shaking of the soldering iron 9, the return spring 84 is also in a state of reset and compression, ensuring that the lower end of the soldering head 91 is in close contact with the circuit board 14 during the shaking process.

[0043] In addition, a lower elastic part 12 is provided, which is used to control the stretching and contracting movement of the outer jacket 913, such as... Figure 9 The lower end of the rectangular end 912 is flush with the lower end of the outer sleeve 913, and the spring body 122 in the lower elastic part 12 is compressed, which can preheat the circuit board 14. Furthermore, during the up-and-down shaking of the soldering head 91, the upward-moving rectangular end 912 and the lower end of the outer sleeve 913 are not compressed, as... Figure 8As shown, there is a cavity between the rectangular end 912 and the outer jacket 913, and the solder 101 extends into the cavity and contacts the inner wall of the outer jacket 913, causing the solder 101 to melt in this cavity. As it moves downwards... Figure 9 As shown, the lower end of the rectangular end 912 is flush with the lower end of the outer sleeve 913, pushing the molten solder 101 located in the cavity downwards. This allows the solder 101 to be relatively squeezed into the opening 141 of the circuit board 14, making it easier to fill the opening 141. It should also be noted that the molten solder 101 located in the cavity between the rectangular end 912 and the outer sleeve 913 is held in place by surface tension and will not drip directly. Furthermore, during the movement of the solder 101, there will be... Figure 9 During the process, the solder 101 directly contacts the side of the rectangular end 912 near the lower end. At this time, the rectangular end 912 and the outer jacket 913 are both pressed against the circuit board 14, so that the molten solder 101 directly contacts the circuit board 14 and adheres to the circuit board 14, increasing the soldering area and making it less likely for the solder 101 to fall off.

[0044] Another soldering method exists. After preheating the circuit board 14 as described above, the outer sleeve 913 contacts the circuit board 14 without causing pressure. Then, the automatic solder feeding end 10 feeds solder 101, causing it to melt directly into the cavity between the rectangular end 912 and the outer sleeve 913. The soldering iron head 91 is then pushed downwards, making the rectangular end 912 flush with the outer sleeve 913, thus pushing the molten solder 101 and filling the opening 141 of the circuit board 14. It should also be noted that when the rectangular end 912 is flush with the outer sleeve 913, the upper elastic part 8 provides cushioning, achieving double-sided soldering. It should be noted that the movement of the soldering iron 9 and the transfer of solder 101 by the automatic solder feeding end 10 are both controlled by the controller 3, which are common existing technologies. Example

[0045] A dithering-based double-sided soldering method includes the following steps: Step 1: The controller 3 controls the lifting device 4 to slide on the support 2, controls the clamp 13 to slide on the worktable 1, and controls the lifting shaft 5 to move up and down, so that the lower end of the soldering iron 9 corresponds to the position of the through port 141 of the circuit board 14. Step 2: After the controller 3 controls the lower end of the soldering iron 9 to move downward and abut against the circuit board 14, the upper elastic part 8 is compressed, so that the lower end of the soldering iron 9 is evenly attached to the circuit board 14, preheating the circuit board 14 for 2-5 seconds, while preventing rigid impact and excessive pressure. Step 3: The controller 3 then controls the soldering iron 9 to vibrate up and down, causing the lower end of the soldering iron 9 to separate and re-attach with the circuit board 14 multiple times, causing the upper elastic part 8 to reset and compress multiple times. At the same time, the automatic solder feeding end 10 transmits the solder 101 to the soldering position of the circuit board 14, and the molten solder 101 penetrates into the through-hole 141 of the circuit board 14 under pressure and capillary action, so that both ends of the through-hole 141 are soldered, achieving double-sided soldering.

[0046] In the description of this invention, it should be noted that the terms "upper," "lower," "front," "rear," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed when in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0047] The above provides a detailed description of the vibration-based double-sided soldering device and soldering method provided by the present invention. Specific examples have been used to illustrate the principle and implementation of the present invention. The above description of the embodiments is only for the purpose of helping to understand the present invention and its core ideas. It should be noted that for those skilled in the art, several improvements and modifications can be made to the present invention without departing from the principle of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A vibration-based double-sided soldering device, comprising a worktable, a support fixed to the worktable, a lifter slidable along the support, a lifting shaft connected to the output end of the lifter, a controller for controlling the movement of the lifting shaft, a fixture mounted on the worktable, and a circuit board within the fixture, characterized in that, Also includes: Operating unit one is installed at the lower end of the lifting shaft; Operation section 2 is located outside of operation section 1 and is slidably disposed with operation section 1. Operation section 2 is provided with a soldering iron for soldering and an automatic solder feeding end, and the automatic solder feeding end contains solder. The upper elastic part is installed between the first operating part and the second operating part. When the controller controls the soldering iron to contact the circuit board downwards, it plays a buffering role. The circuit board has a through-hole. The controller controls the soldering iron to shake up and down to drive the solder to penetrate into the through-hole, so as to achieve double-sided soldering. The operating unit includes a first connecting block clamped to the lifting shaft, a handle mounted on the outside of the first connecting block, and a second connecting block fixed to the handle. The second connecting block has a through groove. The second operating unit includes a slider that is slidably installed in the slide groove and a third connecting block that is fixed to the slider. The third connecting block is used to hold the soldering iron. The upper elastic part includes a support end one fixed to the side of the connecting block, a support end two fixed to the side of the slider, a shaft that passes through the support end one and the support end two and abuts against the support end one and the support end two at both ends respectively, and a return spring sleeved on the shaft. When the controller controls the soldering iron to move downward and the lower end of the soldering iron abuts against the circuit board, the return spring is compressed. The lower end of the soldering iron has a soldering iron head, which includes a soldering iron shaft installed at the lower end of the soldering iron for heating. The end of the soldering iron shaft used for soldering is a rectangular end, and the rectangular end can press against the opening of the circuit board when it moves downward. The soldering iron spindle is fitted with an outer sleeve, and the lower end of the outer sleeve has a rectangular frame that matches the rectangular end. The side of the outer sleeve near the lower end has a slot that communicates with the rectangular frame, and the slot is used for solder to extend into it. The soldering iron has a lower elastic part between it and the outer casing for supporting the outer casing. When the lower elastic part is in the reset state, the rectangular end is retracted into the rectangular frame, and a cavity is formed between the rectangular end and the rectangular frame. When the lower elastic part is in the compressed state, the rectangular end and the lower end of the rectangular frame are flush.

2. The dual-sided soldering device based on dithering according to claim 1, characterized in that, The lower end of the slider is provided with an adjustment part for adjusting the position of the automatic solder feeding end. The adjustment part includes an annular mounting bracket fixed to the lower end of the slider, a mounting block 1 that can be fixed to different positions of the annular mounting bracket by bolts, a lifting adjustment rod that passes through the mounting block 1 and is clamped by the mounting block 1, a mounting block 2 set at the lower end of the mounting block, and a cylindrical shaft 1 and a cylindrical shaft 2 that both extend into the mounting block 2. Mounting block 2 has two sets of bolts extending into it and abutting against cylinder shaft 1 and cylinder shaft 2 respectively. The lifting adjustment rod extends downward into cylinder shaft 1, and the automatic solder feeding end passes through cylinder shaft 2. The outward-facing ends of cylinder shaft 1 and cylinder shaft 2 are each equipped with bolts, which are used to abut against the lifting adjustment rod and the automatic solder feeding end respectively.

3. The dual-sided soldering device based on dithering according to claim 1, characterized in that, The lower elastic part includes a limiting shaft fixed to the lower end of the soldering iron and a spring body sleeved on the limiting shaft. The upper end of the outer sleeve has an extension piece extending outward, the limiting shaft passes through the extension piece, and the lower end of the spring body is fixed to the extension piece.

4. The dual-sided soldering device based on dithering according to claim 1, characterized in that, The rectangular end fits against the inner wall of the rectangular frame, and the bottom corners of the rectangular end and the bottom corners of the inner side of the rectangular frame are all right angles.

5. The dual-sided soldering device based on dithering according to claim 3, characterized in that, The spring body is a high-temperature alloy spring.

6. A method for double-sided soldering based on vibration, characterized in that, The dithering-based double-sided soldering apparatus according to any one of claims 1-5 includes the following steps: Step 1: The controller controls the lifting device to slide on the bracket, controls the clamp to slide on the worktable, and controls the lifting shaft to move up and down, so that the lower end of the soldering iron corresponds to the position of the circuit board opening; Step 2: After the controller moves the lower end of the soldering iron downwards and comes into contact with the circuit board, the upper elastic part is compressed, so that the lower end of the soldering iron is evenly attached to the circuit board, preheating the circuit board for 2-5 seconds, while preventing rigid impact and excessive pressure. Step 3: The controller then controls the soldering iron to vibrate up and down, causing the lower end of the soldering iron to separate and re-attach to the circuit board multiple times, and the upper elastic part to reset and compress multiple times. At the same time, the automatic solder feeding end transmits solder to the soldering position on the circuit board, and the molten solder penetrates into the circuit board opening under pressure and capillary action, so that both ends of the opening are soldered, achieving double-sided soldering.

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