Laser drilling process method
By employing methods such as system self-testing, copper pad fixing, and clamping, combined with laser displacement sensors and deep learning correction, the problems of drilling deviation and uneven heat dissipation in PCB laser drilling have been solved, achieving high-precision and uniform heat dissipation laser drilling results.
Patent Information
- Application Number
- CN202511970027.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-24
- Publication Date
- 2026-02-06
AI Technical Summary
During laser drilling on a PCB surface, the PCB is prone to warping, which can cause the drilling holes to deviate. Furthermore, the movement of the board affects accuracy and causes uneven heat dissipation, thus reducing the quality of the finished product.
Through system self-testing and accuracy correction, copper pad fixing, clamp clamping, double-sided surround drilling and visual inspection, combined with laser displacement sensor, air flotation adjustment and deep learning correction, precise drilling and uniform heat dissipation are achieved.
It improves the positional accuracy of laser drilling, reduces drilling deviation, ensures the flatness and heat dissipation uniformity of the PCB board, and extends the equipment life.
Smart Images
Figure CN121467973A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of laser drilling technology, and more particularly to a laser drilling process. Background Technology
[0002] Laser drilling technology boasts advantages such as high speed, high efficiency, good economic benefits, and wide application, making it widely used in industrial production. Application areas include clothing, footwear, handicrafts and gifts, machinery and equipment, and parts manufacturing. Lasers can perform drilling and cutting operations on textiles, leather goods, paper products, metal products, and plastic products, playing a particularly crucial role in PCB processing. However, during laser drilling on PCB surfaces, PCB warping can cause the drilling direction to deviate from the PCB surface, resulting in drill deviation. Furthermore, the PCB can easily move during laser drilling, reducing drilling accuracy. Additionally, traditional drilling methods can lead to uneven heat dissipation on the PCB, thus affecting the quality of the finished product.
[0003] Therefore, we propose a laser drilling process to solve the existing problems. Summary of the Invention
[0004] The purpose of this invention is to provide a laser drilling process to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a laser drilling process, comprising the following steps:
[0006] S1: When the laser drilling equipment starts up, it performs a full system self-check, corrects the right angle gauge and step gauge, the flatness of the processing table, and the accuracy of the CCD camera and scanning mirror, and adds lubricating oil to the screw and guide rail surfaces;
[0007] S2: Place the copper pad on the processing table, with the drilled holes of the copper pad coinciding with the suction holes of the processing table, and place the PCB board on the copper pad.
[0008] S3: Adjust the precision of the clamping device to synchronize the position of the clamping device with the PCB board, and use the clamping device to clamp the PCB board.
[0009] S4: Drill holes around the PCB board from the outside in on both sides. After completing the drilling on both sides of the PCB board, visually inspect the holes to determine if there is any drilling deviation.
[0010] Furthermore, in S4, the steps for drilling holes around the perimeter include:
[0011] A1: Drill holes on the outermost contour of the target hole location set on the front of the PCB;
[0012] A2: After punching the outermost contour of the target punching position set, continue punching the second outermost contour of the target punching position set, and so on, until all the positions on the front of the PCB corresponding to the target punching position set are punched.
[0013] A3: Drill holes on the outermost contour of the target hole location set on the reverse side of the PCB;
[0014] A4: After punching the outermost contour of the target punching location set, continue punching the next outermost contour of the target punching location set, and so on, until all the locations on the reverse side of the PCB corresponding to the target punching location set are punched.
[0015] Furthermore, in A1 or A2, the target drilling location set corresponds to drilling one hole at all locations on the front side of the PCB.
[0016] Furthermore, in A3 or A4, the target drilling location set corresponds to all locations on the reverse side of the PCB, and holes are drilled twice.
[0017] Furthermore, the depth of each hole is half the thickness of the PCB.
[0018] Furthermore, in S4, it is determined whether the hole is circular and whether the inner wall is annular in the hole image; if the hole is circular and the inner wall is annular, it is considered that no drilling deviation has occurred; if the hole is not circular or the inner wall is not annular, it is considered that drilling deviation has occurred.
[0019] Furthermore, the perpendicularity deviation of the right angle gauge and the spacing error of the step gauge are monitored in real time by a laser displacement sensor, and the servo motor is driven to adjust their mechanical position.
[0020] Furthermore, the adaptive leveling device for the processing table integrates a pressure sensor array and an air-float adjustment mechanism, and combines the flatness data measured by a laser interferometer to achieve micron-level dynamic balance of the table.
[0021] Furthermore, a deep learning-based image segmentation algorithm is used to extract feature points of the calibration board, and distortion correction parameters are generated through polynomial fitting to achieve nonlinear distortion correction of the CCD camera.
[0022] Furthermore, a high-resolution photoelectric encoder and a PID feedback controller are used to compensate for the angular deviation of the scanning mirror in real time.
[0023] Compared with the prior art, the beneficial effects of the present invention are:
[0024] 1. This invention corrects the accuracy of right-angle gauges and step gauges, the flatness of the machining table, and the precision of the CCD camera and scanning mirror. By using internal parameter compensation, it improves the positional accuracy of laser drilling. Adding lubricating oil to the screw and guide rail surfaces not only reduces friction and wear, thus extending the service life of the equipment, but also reduces oxidation and corrosion, preventing the guide rail and screw from rusting. The lubricating oil can also absorb and dissipate the heat generated by the screw and guide rail during operation, helping to lower the temperature and aiding in heat dissipation.
[0025] 2. In this invention, a copper pad is placed on the processing table, and the drilled holes of the copper pad coincide with the suction holes of the processing table, so that the PCB board is subjected to stronger suction when placed on the copper pad, making the PCB board less likely to move. This not only ensures the flatness of the drilling, but also ensures the accuracy of the drilling.
[0026] 3. This invention adjusts the precision of the clamping device to synchronize its position with the PCB board, and uses the clamping device to clamp the PCB board tightly, ensuring that the PCB board does not move easily even when the suction force of the table decreases, thereby ensuring the drilling accuracy.
[0027] 4. Drill holes around the PCB board from the outside in on both sides. Double-sided drilling is used to prevent drilling deviation and overlapping holes improves accuracy. The outside-in-the-in drilling method prevents PCB warping and ensures uniform heat dissipation on the PCB board. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of the operation steps of a laser drilling process according to the present invention. Detailed Implementation
[0029] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0030] Example 1
[0031] like Figure 1 As shown, a laser drilling process includes the following steps:
[0032] S1: When the laser drilling equipment starts up, it performs a full system self-check, corrects the right angle gauge and step gauge, the flatness of the processing table, and the accuracy of the CCD camera and scanning mirror, and adds lubricating oil to the screw and guide rail surfaces;
[0033] S2: Place the copper pad on the processing table, with the drilled holes of the copper pad coinciding with the suction holes of the processing table, and place the PCB board on the copper pad.
[0034] S3: Adjust the precision of the clamping device to synchronize the position of the clamping device with the PCB board, and use the clamping device to clamp the PCB board.
[0035] S4: Drill holes around the PCB board from the outside in on both sides. After completing the drilling on both sides of the PCB board, visually inspect the holes to determine if there is any drilling deviation.
[0036] The working principle of the laser drilling process based on Embodiment 1 is as follows:
[0037] The perpendicularity deviation of the right-angle gauge and the spacing error of the step gauge are monitored in real time using laser displacement sensors, and a servo motor is driven to adjust their mechanical positions. Two sets of laser displacement sensors, positioned along the orthogonal axis of the right-angle gauge, detect axial offset at a sampling frequency of 10kHz. An embedded processor calculates a compensation vector based on the offset and drives a linear motor to perform micron-level position correction. The calibration accuracy of the right-angle gauge is ±5μm, and the calibration accuracy of the step gauge is ±2μm.
[0038] The adaptive leveling device for the machining table integrates a pressure sensor array and an air-float adjustment mechanism. Combined with flatness data measured by a laser interferometer, it achieves micron-level dynamic balance of the table. Specifically, during the equipment preheating phase, a full-table scan is initiated to generate a three-dimensional height distribution heat map; based on the material's thermal expansion coefficient, deformation trends are predicted, and compensation parameters are pre-loaded onto the air-float adjustment mechanism. The flatness correction accuracy of the machining table is ±40μm.
[0039] A deep learning-based image segmentation algorithm is used to extract feature points from the calibration board, and distortion correction parameters are generated through polynomial fitting to achieve nonlinear distortion correction of the CCD camera. A dual-band (visible and near-infrared) composite calibration board is used for adaptive focal length calibration under various conditions; a real-time image enhancement unit based on a convolutional neural network eliminates the impact of ambient light fluctuations on positioning accuracy.
[0040] A high-resolution photoelectric encoder and a PID feedback controller are used to compensate for the angular deviation of the scanning mirror in real time. Specifically, a four-quadrant photodetector captures the position of the laser spot reflected from the mirror; a fuzzy control algorithm dynamically adjusts the PID parameters to achieve an angle control accuracy of ±0.001°. Furthermore, the correction accuracy of the scanning mirror is ±10μm.
[0041] Adding lubricating oil to the surfaces of the screw and guide rail not only reduces friction and wear, thus extending the service life of the equipment, but also reduces oxidation and corrosion, preventing the guide rail and screw from rusting. The lubricating oil can also absorb and dissipate the heat generated by the screw and guide rail during operation, helping to lower the temperature and aiding in heat dissipation.
[0042] In S2, the drill holes of the copper pad coincide with the suction holes of the processing table, making the suction force on the PCB board placed on the copper pad stronger, so that the PCB board is not easy to move. This not only ensures the flatness of the drilling, but also ensures the accuracy of the drilling.
[0043] In S3, when the drilled hole is completed, the suction force of the table decreases, requiring a clamping device to hold the PCB board in place so that it is not easily moved during processing, thereby ensuring drilling accuracy.
[0044] The operating steps for S4 include:
[0045] A1: Drill holes on the outermost contour of the target hole location set on the front of the PCB;
[0046] A2: After punching the outermost contour of the target punching position set, continue punching the second outermost contour of the target punching position set, and so on, until all the positions on the front of the PCB corresponding to the target punching position set are punched.
[0047] A3: Drill holes on the outermost contour of the target hole location set on the reverse side of the PCB;
[0048] A4: After punching the outermost contour of the target punching location set, continue punching the next outermost contour of the target punching location set, and so on, until all the locations on the reverse side of the PCB corresponding to the target punching location set are punched.
[0049] In A1 or A2, the target drilling location set corresponds to drilling one hole at all locations on the front of the PCB.
[0050] In A3 or A4, the target drilling location set corresponds to drilling one hole at each location on the front of the PCB.
[0051] The depth of each hole is half the thickness of the PCB.
[0052] Double-sided drilling is used to prevent drilling deviation, and overlapping drilling improves accuracy. The outward-to-inward circular drilling method prevents PCB warping and ensures uniform heat dissipation on the PCB.
[0053] The above specific embodiments are merely several preferred embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.
Claims
1. A laser drilling process, characterized in that the steps include... include: S1: When the laser drilling equipment starts up, it performs a full system self-check, corrects the right angle gauge and step gauge, the flatness of the processing table, and the accuracy of the CCD camera and scanning mirror, and adds lubricating oil to the screw and guide rail surfaces; S2: Place the copper pad on the processing table, with the drilled holes of the copper pad coinciding with the suction holes of the processing table, and place the PCB board on the copper pad. S3: Adjust the precision of the clamping device to synchronize the position of the clamping device with the PCB board, and use the clamping device to clamp the PCB board. S4: Drill holes around the PCB board from the outside in on both sides. After completing the drilling on both sides of the PCB board, visually inspect the holes to determine if there is any drilling deviation.
2. The laser drilling process according to claim 1, characterized in that, In S4, the steps for drilling holes around the perimeter include: A1: Drill holes on the outermost contour of the target hole location set on the front of the PCB; A2: After punching the outermost contour of the target punching position set, continue punching the second outermost contour of the target punching position set, and so on, until all the positions on the front of the PCB corresponding to the target punching position set are punched. A3: Drill holes on the outermost contour of the target hole location set on the reverse side of the PCB; A4: After punching the outermost contour of the target punching location set, continue punching the next outermost contour of the target punching location set, and so on, until all the locations on the reverse side of the PCB corresponding to the target punching location set are punched.
3. The laser drilling process according to claim 2, characterized in that: In A1 or A2, the target drilling location set corresponds to drilling one hole at all locations on the front of the PCB.
4. The laser drilling process according to claim 2, characterized in that: In A3 or A4, the target drilling location set corresponds to drilling two holes at all locations on the reverse side of the PCB.
5. A laser drilling process according to claim 3 or 4, characterized in that: The depth of each hole is half the thickness of the PCB.
6. The laser drilling process according to claim 1, characterized in that: In S4, the hole image is used to determine whether the hole is circular and whether the inner wall is annular. If the hole is circular and the inner wall is annular, it is considered that no drilling deviation has occurred. If the hole is not circular or the inner wall is not annular, it is considered that drilling deviation has occurred.
7. The laser drilling process according to claim 1, characterized in that: The perpendicularity deviation of the right angle gauge and the spacing error of the step gauge are monitored in real time by a laser displacement sensor, and the servo motor is driven to adjust their mechanical position.
8. The laser drilling process according to claim 1, characterized in that: The adaptive leveling device for the machining table integrates a pressure sensor array and an air-float adjustment mechanism, and combines the flatness data measured by a laser interferometer to achieve micron-level dynamic balance of the table.
9. The laser drilling process according to claim 1, characterized in that: A deep learning-based image segmentation algorithm is used to extract feature points of the calibration board, and distortion correction parameters are generated through polynomial fitting to achieve nonlinear distortion correction of the CCD camera.
10. The laser drilling process according to claim 1, characterized in that: A high-resolution photoelectric encoder and a PID feedback controller are used to compensate for the angular deviation of the scanning mirror in real time.