Diamond composite material capable of precisely regulating and controlling porosity in wide range and preparation method of diamond composite material

Abstract

The invention relates to the technical field of superhard abrasives, in particular to a diamond composite material capable of precisely regulating and controlling porosity in a wide range and a preparation method of the diamond composite material. The diamond composite material capable of precisely regulating and controlling the porosity in the wide range is prepared from the following components in percentage by mass: 30%-70% of a metal matrix, 25%-60% of diamond abrasive particles and 5%-10% of a binder, and the metal matrix is prepared from the following components in atomic percent: 15%-85% of Cu powder and 85%-15% of Ti powder. The diamond composite material disclosed by the invention has excellent diamond abrasive particle holding capacity in grinding machining, and the porosity of the diamond composite material can be precisely and widely regulated and controlled according to different types of machining objects, so that the machining efficiency and the precision are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of superhard abrasive technology, specifically to a diamond composite material with precisely adjustable porosity over a wide range and its preparation method; more specifically, it relates to a diamond composite material with precisely adjustable porosity over a wide range, a preparation method of the diamond composite material with precisely adjustable porosity over a wide range, a method for controlling the porosity of the diamond composite material, and their applications. Background Technology

[0002] Grinding, as a crucial technology in modern machining, is widely used in precision and even ultra-precision machining in industrial manufacturing and daily life, supporting the rapid development of today's strategic emerging industries. With the rapid development of modern machining technology, the requirements for the machining performance of grinding tools have also increased due to the diversification of machining objects, becoming increasingly diversified, precise, intelligent, and environmentally friendly. Existing grinding tools made from traditional abrasives such as alumina and silicon carbide can no longer meet the demands for higher-end and more precise machining. Therefore, the research and development of novel superhard composite materials has become a future trend.

[0003] Current diamond composite materials mainly use physical methods such as electroplating to bond diamond particles together, resulting in low bonding strength. During processing, the diamond particles cannot be firmly held, causing a large number of diamond particles that have not yet performed their intended grinding function to fall off, which greatly reduces the working efficiency of diamond composite materials and causes certain losses.

[0004] Furthermore, existing diamond superhard abrasives lack effective porosity control methods. For diamond composite materials used in grinding, appropriate porosity is crucial. This is because grinding processes generate a certain amount of grinding debris. If the composite material lacks pores, the large amount of debris cannot escape and will accumulate on the workpiece surface as processing continues, severely impacting the quality of the workpiece and significantly reducing processing efficiency. Therefore, appropriate porosity is essential.

[0005] In view of this, the present invention is hereby proposed. Summary of the Invention

[0006] The primary objective of this invention is to provide a diamond composite material with precisely adjustable porosity over a wide range. This diamond composite material exhibits excellent diamond abrasive retention capability during grinding, and its porosity can be precisely adjusted over a wide range for different types of workpieces, thereby significantly improving processing efficiency and precision.

[0007] The second objective of this invention is to provide a method for preparing a diamond composite material with precisely adjustable porosity over a wide range.

[0008] The third objective of this invention is to provide a method for controlling the porosity of diamond composite materials.

[0009] The fourth objective of this invention is to provide a diamond composite material with precisely adjustable porosity over a wide range, or a diamond composite material prepared by a method for precisely adjustable porosity over a wide range, or a method for adjusting the porosity of a diamond composite material, for application in the field of machining.

[0010] In order to achieve the above-mentioned objectives of the present invention, the following technical solution is adopted: The present invention first provides a diamond composite material with precise wide-range controllable porosity, which is made of the following components by mass percentage: 30%~70% metal matrix, 25%~60% diamond abrasive particles and 5%~10% binder; wherein, the metal matrix is ​​made of the following components by atomic percentage: 15%~85% Cu powder and 85%~15% Ti powder.

[0011] Furthermore, the median particle size of the Cu powder and / or the Ti powder is 40 μm to 100 μm.

[0012] Furthermore, the median particle size of the diamond abrasive grains is 50μm~200μm.

[0013] Furthermore, the adhesive comprises an acrylic emulsion.

[0014] The present invention further provides a method for preparing the above-mentioned diamond composite material with precise wide-range porosity control, comprising the following steps: mixing diamond abrasive particles, Cu powder, Ti powder and binder, drying and sieving to obtain a mixed material; the mixed material is cold-pressed and then sintered to obtain the diamond composite material with precise wide-range porosity control.

[0015] Furthermore, the pressure of the cold pressing is 35MPa~1000MPa.

[0016] Furthermore, the holding time for the cold pressing is 5 min to 20 min.

[0017] Furthermore, the sintering temperature is 900℃~1100℃.

[0018] Furthermore, the holding time for sintering is 10 min to 60 min.

[0019] Furthermore, the vacuum degree of the sintering is 1×10⁻⁶. -3 Pa ~ 1×10 -5 Pa.

[0020] The present invention provides a method for controlling the porosity of diamond composite materials, comprising the following steps: cold pressing and sintering a mixture containing diamond abrasive particles, Cu powder, Ti powder and binder, and controlling the porosity of the obtained diamond composite material by controlling the ratio of Cu powder and Ti powder, the amount of diamond abrasive particles added, the pressure of cold pressing, the sintering temperature and the sintering holding time.

[0021] Furthermore, the atomic ratio of the Cu powder to the Ti powder is 15~85:85~15.

[0022] Furthermore, the mass of the diamond abrasive grains accounts for 25% to 60% of the mass of the mixed material.

[0023] Furthermore, the pressure of the cold pressing is 35MPa~1000MPa.

[0024] Furthermore, the sintering temperature is 900℃~1100℃.

[0025] Furthermore, the holding time for sintering is 10 min to 60 min.

[0026] Furthermore, the porosity of the diamond composite material is 20% to 60%.

[0027] The present invention also provides the application of the above-mentioned diamond composite material with precisely wide-range porosity control, or the diamond composite material prepared according to the above-mentioned method for preparing diamond composite material with precisely wide-range porosity control, or the above-mentioned method for controlling the porosity of diamond composite material in the field of machining.

[0028] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The diamond composite material provided by the present invention has a high-strength metallurgical bond, and the metal matrix has a strong holding ability for diamond abrasive grains, which enables it to exert a more complete grinding effect during processing. At the same time, the porosity of the diamond composite material can be precisely controlled according to different processing objects, effectively providing chip space during processing and improving surface processing accuracy and efficiency.

[0029] (2) The diamond composite material provided by the present invention has high thermal conductivity, which can quickly dissipate heat during processing, reduce the surface temperature of the workpiece, and improve grinding efficiency.

[0030] (3) The diamond composite material preparation method provided by the present invention can precisely and wide-range control the porosity of the diamond composite material by controlling the pressure of cold pressing, the temperature of sintering and the holding time of sintering, and improve the grinding performance of the diamond composite material.

[0031] (4) The porosity control method of the diamond composite material provided by the present invention can precisely and widely control the porosity of the diamond composite material by controlling the ratio of Cu powder and Ti powder, the amount of diamond abrasive added, the pressure of cold pressing, the sintering temperature and the sintering holding time, thereby expanding the controllable variation range of porosity to 20%~60%, so as to meet the needs of various processed workpieces and obtain diamond composite materials with better performance according to different needs. Detailed Implementation

[0032] The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments. However, those skilled in the art will understand that the embodiments described below are some embodiments of the present invention, but not all embodiments, and are only used to illustrate the present invention, and should not be regarded as limiting the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.

[0033] Unless otherwise specified, in this invention, terms such as "first aspect," "second aspect," "third aspect," and "fourth aspect" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or quantity, nor should they be construed as implicitly indicating the importance or quantity of the indicated technical features. Moreover, terms such as "first," "second," "third," and "fourth" serve only as a non-exhaustive enumeration and should be understood not to constitute a closed limitation on quantity.

[0034] Unless otherwise specified, the terms "comprising" and "including" as used in this invention can be open-ended or closed-ended. For example, "comprising" and "including" can mean that other components not listed may also be included, or that only the listed components may be included.

[0035] Unless otherwise specified, in this invention, "one or more" or "at least one" refers to any one, any two, or any two or more of the listed items. "Several" refers to any two or more.

[0036] In a first aspect, the present invention provides a diamond composite material with precisely controllable porosity over a wide range, comprising the following components by mass percentage: 30% to 70% (e.g., 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, or 70%) of a metal matrix, 25% to 60% (e.g., 25%, 30%, 35%, 40%, 45%, 50%, 55%, or 60%) of diamond abrasive grains, and 5% to 10% (e.g., 5%, 6%, 7%, 8%, 9%, or 10%) of a binder. It is understood that the sum of the mass percentages of the metal matrix, diamond abrasive grains, and binder is 100%.

[0037] The metal matrix is ​​composed of the following components by atomic percentage: 15% to 85% Cu powder (e.g., 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, or 85%) and 85% to 15% Ti powder (e.g., 85%, 80%, 75%, 70%, 65%, 60%, 55%, 50%, 45%, 40%, 35%, 30%, 25%, 20%, or 15%). It is understood that the sum of the atomic percentages of Cu powder and Ti powder is 100%.

[0038] The diamond composite material provided by this invention has a high-strength metallurgical bond, and the metal matrix has a strong ability to hold diamond abrasive grains, allowing them to exert a more complete grinding effect during processing. At the same time, the porosity of the diamond composite material can be precisely controlled according to different processing objects, effectively providing chip space during processing and improving surface processing accuracy and efficiency.

[0039] Specifically, the porosity of diamond composite materials can be controlled by adjusting the chemical composition of the composite material, such as the ratio of Cu powder to Ti powder and the amount of diamond abrasive added.

[0040] Furthermore, the diamond composite material provided by this invention has high thermal conductivity, which can quickly dissipate heat during processing, reduce the surface temperature of the workpiece, and improve grinding efficiency.

[0041] In some specific embodiments, the median particle size of the Cu powder and / or the Ti powder is 40μm to 100μm, including but not limited to the point value of any one of 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, and 100μm or the range between any two.

[0042] In some specific embodiments, the median particle size of the diamond abrasive grains is 50μm to 200μm, including but not limited to the point value of any one of 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, 120μm, 130μm, 150μm, 180μm, and 200μm, or the range between any two.

[0043] In some specific embodiments, the adhesive includes an acrylic emulsion.

[0044] Secondly, the present invention provides a method for preparing the above-mentioned diamond composite material with precisely wide-range controllable porosity, comprising the following steps: After the diamond abrasive grains, Cu powder, Ti powder and binder are mixed evenly, they are dried and sieved in sequence to obtain a mixed material.

[0045] The mixed material is cold-pressed, sintered, and cooled to obtain the diamond composite material with precisely adjustable porosity over a wide range.

[0046] This preparation method has the advantages of simple operation, short process, and precise wide-range control of the porosity of diamond composite materials.

[0047] In some specific embodiments, the cold pressing pressure is 35MPa~1000MPa, including but not limited to any one of 35MPa, 40MPa, 50MPa, 100MPa, 200MPa, 300MPa, 500MPa, 600MPa, 800MPa, and 1000MPa, or a range between any two.

[0048] In some specific embodiments, the holding time for cold pressing is 5 min to 20 min, including but not limited to any one of 5 min, 6 min, 8 min, 10 min, 12 min, 13 min, 15 min, 16 min, 18 min, and 20 min, or any range between two of them.

[0049] In some specific embodiments, the sintering temperature is 900℃~1100℃, including but not limited to any one of 900℃, 950℃, 1000℃, 1050℃, and 1100℃, or any range between two of them.

[0050] In some specific embodiments, the sintering holding time is 10 min to 60 min, including but not limited to any one of 10 min, 20 min, 30 min, 40 min, 50 min, and 60 min, or any range between two of them.

[0051] The method for preparing diamond composite materials provided by the present invention can precisely and broadly control the porosity of the prepared diamond composite materials by controlling the pressure of cold pressing, the temperature of sintering and the holding time of sintering.

[0052] In some specific embodiments, the vacuum degree of the sintering is 1×10⁻⁶. -3 Pa ~ 1×10 -5 Pa, including but not limited to 1×10 -3 Pa, 1×10 -4 Pa, 1×10 -5 The point value of any one of Pa or the range value between any two.

[0053] In some specific embodiments, the sintering heating rate is 5℃ / min to 15℃ / min, including but not limited to any one of 5℃ / min, 6℃ / min, 8℃ / min, 10℃ / min, 13℃ / min, and 15℃ / min, or any range between two of them.

[0054] In some specific embodiments, the step of mixing diamond abrasive grains, Cu powder, Ti powder and binder specifically includes: mixing diamond abrasive grains, Cu powder and Ti powder evenly according to the component ratio, mixing time is 3h~10h, and then adding binder (such as acrylic emulsion) and stirring evenly, stirring time is 0.2h~1h.

[0055] In some specific embodiments, the drying method includes baking, the drying temperature is 60℃~80℃, and the drying time is 0.5h~2h.

[0056] In some specific implementations, the sieving is carried out using a sieve with a mesh size of 300 to 350, and the sieving is performed 1 to 4 times.

[0057] Thirdly, the present invention provides a method for controlling the porosity of diamond composite materials, comprising the following steps: A mixture containing diamond abrasive grains, Cu powder, Ti powder, and a binder is cold-pressed and sintered. The porosity of the resulting diamond composite material is controlled by adjusting the ratio of Cu powder to Ti powder, the amount of diamond abrasive grains added, the pressure of cold pressing, the sintering temperature, and the holding time during sintering.

[0058] The porosity control method of the diamond composite material provided by this invention can precisely and broadly control the porosity of the prepared diamond composite material by controlling the ratio of Cu powder and Ti powder, the amount of diamond abrasive added, the pressure of cold pressing, the sintering temperature and the sintering holding time, thereby expanding the controllable variation range of porosity to 20%~60%, thus meeting more requirements of various processed workpieces and obtaining diamond composite materials with better performance according to different requirements.

[0059] In some specific embodiments, the atomic ratio of the Cu powder to the Ti powder is 15~85:85~15, for example 15:85, 20:80, 30:70, 40:60, 50:50, 60:40, 70:30, 80:20 or 85:15.

[0060] In some specific embodiments, the mass of the diamond abrasive grains accounts for 25% to 60% of the mass of the mixed material, for example, 25%, 30%, 35%, 40%, 45%, 50%, 55% or 60%.

[0061] In some specific embodiments, the cold pressing pressure is 35MPa~1000MPa, including but not limited to any one of 35MPa, 40MPa, 50MPa, 100MPa, 200MPa, 300MPa, 500MPa, 600MPa, 800MPa, and 1000MPa, or a range between any two.

[0062] In some specific embodiments, the sintering temperature is 900℃~1100℃, including but not limited to any one of 900℃, 950℃, 1000℃, 1050℃, and 1100℃, or any range between two of them.

[0063] In some specific embodiments, the sintering holding time is 10 min to 60 min, including but not limited to any one of 10 min, 20 min, 30 min, 40 min, 50 min, and 60 min, or any range between two of them.

[0064] In some specific embodiments, by controlling the above parameters, the porosity of the diamond composite material can be controlled to be 20% to 60%, including but not limited to any one of 25%, 30%, 35%, 40%, 45%, 50%, 55%, and 60%, or any range between two of them.

[0065] Fourthly, the present invention provides the application of the diamond composite material with precisely wide-range porosity control, or the diamond composite material prepared according to the preparation method of the diamond composite material with precisely wide-range porosity control, or the method for controlling the porosity of the diamond composite material, in the field of machining.

[0066] The diamond composite material with precisely wide-range porosity control and its preparation method provided by this invention, as well as the method for controlling the porosity of diamond composite material, can be widely used in the field of machining, such as precision and even ultra-precision machining, and can improve machining efficiency and accuracy, with broad application prospects.

[0067] The embodiments of the present invention will be described in detail below with reference to examples. However, those skilled in the art will understand that the following examples are for illustrative purposes only and should not be considered as limiting the scope of the invention. Unless otherwise specified in the examples, conventional conditions or conditions recommended by the manufacturer are followed. Reagents or instruments whose manufacturers are not specified are all commercially available conventional products.

[0068] Example 1 The diamond composite material with precisely controllable porosity provided in this embodiment is made of the following components by mass percentage: 50% metal matrix, 45% diamond abrasive grains, and 5% binder. The metal matrix is ​​made of the following components by atomic percentage: 50% Cu powder and 50% Ti powder. The median particle size of both Cu and Ti powders is 50 μm, and the median particle size of the diamond abrasive grains is 50 μm. The binder is an acrylic emulsion.

[0069] The method for preparing diamond composite materials with precisely adjustable porosity over a wide range provided in this embodiment includes the following steps: Diamond abrasive, Cu powder, and Ti powder are mixed evenly according to the above component ratio for 5 hours to obtain mixture 1. The binder is added to mixture 1 and stirred evenly for 0.5 hours to obtain mixture 2. Mixture 2 is placed in a drying oven and heated to 65°C, and dried until its mass is reduced to 90% of that of mixture 2 for 1 hour to obtain mixture 3. Mixture 3 is sieved evenly through a 325 mesh sieve three times to obtain the mixed material.

[0070] The above-mentioned mixed materials are evenly placed into a custom mold for cold pressing. The cold pressing pressure is 50 MPa and the holding time is 5 min. Then, the material is demolded to obtain a green composite material blank.

[0071] The above-mentioned composite material green body was placed in a vacuum high-temperature sintering furnace for active brazing. The heating rate was 10℃ / min, from room temperature (25℃) to 1100℃, and the holding time was 30min. The vacuum degree of the vacuum high-temperature sintering furnace was 1×10⁻⁶. -5 Pa. After the active brazing process is completed, the material is cooled to room temperature in the furnace and removed to obtain a diamond composite material with a porosity of 55%.

[0072] Example 2 The diamond composite material with precisely controllable porosity provided in this embodiment is made of the following components by mass percentage: 55% metal matrix, 37% diamond abrasive grains, and 8% binder. The metal matrix is ​​made of the following components by atomic percentage: 35% Cu powder and 65% Ti powder. The median particle size of both Cu and Ti powders is 60 μm, and the median particle size of the diamond abrasive grains is 75 μm. The binder is an acrylic emulsion.

[0073] The method for preparing diamond composite materials with precisely adjustable porosity over a wide range provided in this embodiment includes the following steps: Diamond abrasive grains, Cu powder, and Ti powder are mixed evenly according to the above component ratio for 5 hours to obtain mixture 1. The binder is added to mixture 1 and stirred evenly for 0.5 hours to obtain mixture 2. Mixture 2 is placed in a drying oven and heated to 65°C, and dried until its mass is reduced to 92% of that of mixture 2 for 1 hour to obtain mixture 3. Mixture 3 is sieved evenly through a 325 mesh sieve three times to obtain the mixed material.

[0074] The above-mentioned mixed materials are evenly placed into a custom mold for cold pressing. The cold pressing pressure is 200MPa and the holding time is 5min. Then, the material is demolded to obtain a green composite material.

[0075] The above-mentioned composite material green body was placed in a vacuum high-temperature sintering furnace for active brazing. The heating rate was 10℃ / min, from room temperature (25℃) to 1100℃, and the holding time was 30min. The vacuum degree of the vacuum high-temperature sintering furnace was 1×10⁻⁶. -5 Pa. After the active brazing process is completed, the material is cooled to room temperature in the furnace and removed to obtain a diamond composite material with a porosity of 37%.

[0076] Example 3 The diamond composite material with precisely controllable porosity provided in this embodiment is made of the following components by mass percentage: 40% metal matrix, 50% diamond abrasive grains, and 10% binder. The metal matrix is ​​made of the following components by atomic percentage: 70% Cu powder and 30% Ti powder. The median particle size of both Cu and Ti powders is 55 μm, and the median particle size of the diamond abrasive grains is 65 μm. The binder is an acrylic emulsion.

[0077] The method for preparing diamond composite materials with precisely adjustable porosity over a wide range provided in this embodiment includes the following steps: Diamond abrasive grains, Cu powder, and Ti powder are mixed evenly according to the above component ratio for 5 hours to obtain mixture 1. The binder is added to mixture 1 and stirred evenly for 0.5 hours to obtain mixture 2. Mixture 2 is placed in a drying oven and heated to 65°C, and dried until its mass is reduced to 95% of that of mixture 2 for 1 hour to obtain mixture 3. Mixture 3 is sieved evenly through a 325 mesh sieve three times to obtain the mixed material.

[0078] The above-mentioned mixed materials are evenly placed into a custom mold for cold pressing. The cold pressing pressure is 600MPa and the holding time is 5min. Then, the material is demolded to obtain a green composite material.

[0079] The above-mentioned composite material green body was placed in a vacuum high-temperature sintering furnace for active brazing. The heating rate was 10℃ / min, from room temperature (25℃) to 1100℃, and the holding time was 30min. The vacuum degree of the vacuum high-temperature sintering furnace was 1×10⁻⁶. -5 Pa. After the active brazing process is completed, the material is cooled to room temperature in the furnace and removed to obtain a diamond composite material with a porosity of 23%.

[0080] Example 4 The diamond composite material with precisely wide-range porosity control provided in this embodiment is made of the following components by mass percentage: 70% metal matrix, 25% diamond abrasive grains, and 5% binder. The composition of the metal matrix, the median particle size of the Cu powder, Ti powder, and diamond abrasive grains, and the type of binder are the same as in Example 1.

[0081] The preparation method of the diamond composite material with precise wide-range porosity control provided in this embodiment is basically the same as that in Example 1, except that the raw materials are mixed according to the above component ratio.

[0082] Example 5 The diamond composite material with precisely wide-range porosity control provided in this embodiment is made of the following components by mass percentage: 35% metal matrix, 60% diamond abrasive grains, and 5% binder. The composition of the metal matrix, the median particle size of the Cu powder, Ti powder, and diamond abrasive grains, and the type of binder are the same as in Example 1.

[0083] The preparation method of the diamond composite material with precise wide-range porosity control provided in this embodiment is basically the same as that in Example 1, except that the raw materials are mixed according to the above component ratio.

[0084] Example 6 The diamond composite material with precisely controllable porosity provided in this embodiment is made of the following components by mass percentage: 50% metal matrix, 45% diamond abrasive grains, and 5% binder (i.e., the same as in Example 1). The metal matrix is ​​made of the following components by atomic percentage: 15% Cu powder and 85% Ti powder. The median particle size of the Cu powder, Ti powder, and diamond abrasive grains, as well as the type of binder, are the same as in Example 1.

[0085] The preparation method of the diamond composite material with precise wide-range porosity control provided in this embodiment is basically the same as that in Example 1, except that the raw materials are mixed according to the above component ratio.

[0086] Example 7 The diamond composite material with precisely controllable porosity provided in this embodiment is made of the following components by mass percentage: 50% metal matrix, 45% diamond abrasive grains, and 5% binder (i.e., the same as in Example 1). The metal matrix is ​​made of the following components by atomic percentage: 85% Cu powder and 15% Ti powder. The median particle size of the Cu powder, Ti powder, and diamond abrasive grains, as well as the type of binder, are the same as in Example 1.

[0087] The preparation method of the diamond composite material with precise wide-range porosity control provided in this embodiment is basically the same as that in Example 1, except that the raw materials are mixed according to the above component ratio.

[0088] Example 8 The ratio, type, and particle size of the raw materials for preparing the diamond composite material with precisely adjustable porosity over a wide range provided in this embodiment are the same as in Example 1.

[0089] The preparation method of the diamond composite material with precise wide-range porosity control provided in this embodiment is basically the same as that in Example 1, except that the pressure of cold pressing is replaced with 900 MPa.

[0090] Example 9 The ratio, type, and particle size of the raw materials for preparing the diamond composite material with precisely adjustable porosity over a wide range provided in this embodiment are the same as in Example 1.

[0091] The preparation method of the diamond composite material with precise wide-range porosity control provided in this embodiment is basically the same as that in Example 1, except that the sintering temperature is replaced with 900℃.

[0092] Example 10 The ratio, type, and particle size of the raw materials for preparing the diamond composite material with precisely adjustable porosity over a wide range provided in this embodiment are the same as in Example 1.

[0093] The preparation method of the diamond composite material with precise wide-range porosity control provided in this embodiment is basically the same as that in Example 1, except that the sintering holding time is replaced with 10 min.

[0094] Example 11 The ratio, type, and particle size of the raw materials for preparing the diamond composite material with precisely adjustable porosity over a wide range provided in this embodiment are the same as in Example 1.

[0095] The preparation method of the diamond composite material with precise wide-range porosity control provided in this embodiment is basically the same as that in Example 1, except that the pressure of cold pressing is replaced with 1500MPa.

[0096] Example 12 The ratio, type, and particle size of the raw materials for preparing the diamond composite material with precisely adjustable porosity over a wide range provided in this embodiment are the same as in Example 1.

[0097] The preparation method of the diamond composite material with precise wide-range porosity control provided in this embodiment is basically the same as that in Example 1, except that the sintering temperature is replaced with 700℃.

[0098] Comparative Example 1 The diamond composite material with precisely wide-range porosity control provided in this comparative example is made of the following components by mass percentage: 25% metal matrix, 70% diamond abrasive grains, and 5% binder. The composition of the metal matrix, the median particle size of the Cu powder, Ti powder, and diamond abrasive grains, and the type of binder are the same as in Example 1.

[0099] The preparation method of the diamond composite material with precisely wide-range controllable porosity provided in this comparative example is basically the same as that in Example 1, except that the raw materials are mixed according to the above component ratio.

[0100] Comparative Example 2 The diamond composite material with precisely controllable porosity provided in this comparative example is made from the following components by mass percentage: 50% metal matrix, 45% diamond abrasive grains, and 5% binder (i.e., the same as Comparative Example 1). The metal matrix is ​​made from the following components by atomic percentage: 90% Cu powder and 10% Ti powder. The median particle size of the Cu powder, Ti powder, and diamond abrasive grains, as well as the type of binder, are the same as in Example 1.

[0101] The preparation method of the diamond composite material with precisely wide-range controllable porosity provided in this comparative example is basically the same as that in Example 1, except that the raw materials are mixed according to the above component ratio.

[0102] The porosity of the diamond composite materials prepared in the above embodiments and comparative examples is shown in Table 1.

[0103] Table 1. Porosity results of various diamond composite materials

[0104] As shown in Table 1, the present invention can precisely and broadly control the porosity of the prepared diamond composite material, expanding the controllable variation range of porosity to 20%~60%. Therefore, the porosity of the diamond composite material can be finely controlled according to different processing objects, effectively providing chip space during processing and improving surface processing accuracy and efficiency.

[0105] Among them, the diamond composite materials prepared in Examples 1 to 10 have suitable porosity.

[0106] In Example 11, due to excessively high cold pressing pressure, the porosity tended to a minimum and essentially stopped changing, resulting in a decrease in the grinding performance of the composite material. In Example 12, due to excessively low sintering temperature, although the porosity was in the range of 20% to 60%, the interfacial bonding was extremely poor. The diamond particles could not play their role as a reinforcing phase during grinding and detached as a whole, resulting in extremely poor wear performance.

[0107] The excessive abrasive content in Comparative Example 1 resulted in excessive porosity, which greatly reduced the wear resistance of the composite material.

[0108] In Comparative Example 2, the Cu content was too high. Although the porosity was in the range of 20%-60%, the high Cu content greatly reduced the strength of the metal matrix. In addition, the low Ti content also resulted in poor bonding at the interface, which greatly reduced the wear resistance of the composite material.

[0109] In summary, the porosity can be adjusted within a wide range of 20%-60% by controlling the component ratio and preparation parameters, depending on the application conditions.

[0110] Experimental Example Tribological wear tests were conducted on the diamond composite materials prepared in each of the above embodiments and comparative examples. The wear resistance was evaluated by statistically analyzing the mass loss value of the composite material samples after the tribological wear test; the greater the mass loss, the worse the wear resistance. The test results are shown in Table 2.

[0111] Table 2. Tribological and wear test results of various diamond composite materials

[0112] As shown in Table 2, the diamond composite materials prepared in Examples 1-10 possess high-strength metallurgical bonding, and the metal matrix has a strong holding capacity for the diamond abrasive grains, allowing them to exert a more complete grinding effect during processing. Furthermore, the diamond composite materials prepared in Examples 1-10 have high thermal conductivity, enabling rapid heat dissipation during processing, reducing the workpiece surface temperature, and improving grinding efficiency. However, the preparation parameters in Examples 11-12 were unsuitable, resulting in a slight decrease in the wear resistance of the diamond composite materials.

[0113] In contrast, the wear resistance of diamond composite materials in Comparative Examples 1 and 2 was significantly reduced due to unsuitable material composition and porosity.

[0114] Although the present invention has been illustrated and described with specific embodiments, it should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; those skilled in the art should understand that modifications can be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein, without departing from the spirit and scope of the present invention; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention; therefore, this means that all such substitutions and modifications that fall within the scope of the present invention are included in the appended claims.

Claims

1. A diamond composite material with precisely adjustable porosity over a wide range, characterized in that, It is made of the following components by weight percentage: 30%~70% metal matrix, 25%~60% diamond abrasive grains and 5%~10% binder; The metal matrix is ​​made of the following components in atomic percentage: 15%~85% Cu powder and 85%~15% Ti powder.

2. The diamond composite material with precisely adjustable porosity over a wide range according to claim 1, characterized in that, The median particle size of the Cu powder and / or the Ti powder is 40 μm to 100 μm.

3. The diamond composite material with precisely adjustable porosity over a wide range according to claim 1, characterized in that, The median particle size of the diamond abrasive grains is 50μm~200μm.

4. The diamond composite material with precisely adjustable porosity over a wide range according to claim 1, characterized in that, The adhesive comprises an acrylic emulsion.

5. The method for preparing the diamond composite material with precisely adjustable porosity over a wide range as described in any one of claims 1 to 4, characterized in that, Includes the following steps: Diamond abrasive grains, Cu powder, Ti powder and binder are mixed, dried and sieved to obtain a mixed material; The mixed material is cold-pressed and then sintered to obtain the diamond composite material with precisely controllable porosity over a wide range.

6. The method for preparing diamond composite material with precisely adjustable porosity over a wide range according to claim 5, characterized in that, The pressure for cold pressing is 35MPa~1000MPa, and the holding time for cold pressing is 5min~20min.

7. The method for preparing diamond composite material with precisely adjustable porosity over a wide range according to claim 5, characterized in that, The sintering temperature is 900℃~1100℃, the sintering holding time is 10min~60min, and the sintering vacuum degree is 1×10⁻⁶. -3 Pa ~ 1×10 -5 Pa.

8. A method for controlling the porosity of diamond composite materials, characterized in that, Includes the following steps: A mixture containing diamond abrasive grains, Cu powder, Ti powder, and a binder is cold-pressed and sintered. The porosity of the resulting diamond composite material is controlled by adjusting the ratio of Cu powder to Ti powder, the amount of diamond abrasive grains added, the pressure of cold pressing, the sintering temperature, and the holding time during sintering.

9. The method for controlling the porosity of diamond composite materials according to claim 8, characterized in that, The atomic ratio of Cu powder to Ti powder is 15~85:85~15, the mass of diamond abrasive particles accounts for 25%~60% of the mass of the mixed material, the cold pressing pressure is 35MPa~1000MPa, the sintering temperature is 900℃~1100℃, the sintering holding time is 10min~60min, and the porosity of the diamond composite material is 20%~60%.

10. The application of the diamond composite material with precisely wide-range porosity control as described in any one of claims 1 to 4, or the diamond composite material prepared by the method for preparing the diamond composite material with precisely wide-range porosity control as described in any one of claims 5 to 7, or the method for controlling the porosity of the diamond composite material as described in any one of claims 8 to 9, in the field of machining.

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