Air extractor and semiconductor processing equipment

Abstract

The invention provides an air extractor and semiconductor processing equipment. The air extractor comprises a travel switch, a bypass and a controller. The travel switch is arranged at the position of a cavity cover of the process cavity and used for obtaining a first signal indicating opening of the cavity cover when the cavity cover is opened. One end of the bypass is connected between the process chamber and a hot trap, and the other end of the bypass is connected between the hot trap and a sucking pump. A first valve used for opening or closing the bypass is arranged in the bypass. And the controller is configured to open the first valve in response to the received first signal, so that tail gas generated in the process chamber and the hot trap is pumped out by the sucking pump through the bypass. The device can be used for weakening upward return of gas carried by rising of hot airflow in a front-end pipeline and a hot trap in the open cavity maintenance stage, so that the influence of odor diffusion on the environment is prevented, and the health hazard risk brought to machine maintenance personnel under specific conditions is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device processing, and more particularly to a vacuum device and a semiconductor processing equipment. Background Technology

[0002] In current semiconductor thin film deposition processes, especially in Thermal ALD (Thermal Atomic Layer Deposition), the large volume of process gases leads to the gradual deposition of numerous large particles and byproducts within the foreline and hot trap. During open-cavity maintenance, to prevent further byproduct formation due to insufficient cooling of the foreline or hot trap, the cavity cover must be opened while the cavity remains heated, resulting in significant internal heat. During preventive maintenance (PM), the hot exhaust gases from the cavity walls, foreline walls, and hot trap rise and diffuse into the air, impacting the environment and posing a health hazard to maintenance personnel.

[0003] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for an improved air extraction device to reduce the upward return of gas accompanying the rising hot air flow in the front pipeline and heat trap during the open cavity maintenance stage, prevent the spread of odors and affect the environment, and reduce the risk of health hazards to machine maintenance personnel under certain conditions. Summary of the Invention

[0004] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0005] To overcome the aforementioned deficiencies in the prior art, the present invention provides an air extraction device and a semiconductor processing equipment. By setting a bypass that bypasses the heat trap, the hot airflow in the pipes and heat trap is extracted downwards during the opening maintenance stage. This is used to reduce the upward return of gas carried by the rising hot airflow in the front pipes and heat trap during the opening maintenance stage, prevent the diffusion of odors from affecting the environment, and reduce the health hazards to machine maintenance personnel under specific conditions.

[0006] Specifically, the exhaust device provided according to the first aspect of the present invention includes a limit switch, a bypass, and a controller. The limit switch is located at the cover of the process chamber and is used to acquire a first signal indicating that the cover is open when the cover is open. One end of the bypass is connected between the process chamber and a heat sink, and the other end is connected between the heat sink and an exhaust pump. The bypass is provided with a first valve for opening or closing the bypass. The controller is configured to: in response to receiving the first signal, open the first valve, so that the exhaust gas generated in the process chamber and the heat sink is extracted by the exhaust pump via the bypass.

[0007] Furthermore, in some embodiments of the present invention, the first valve includes an angle valve and a solenoid valve. The angle valve is connected to an air pipe and the solenoid valve via an air connector. The controller is further configured to: in response to receiving the first signal, open the solenoid valve to open the air pipe via the solenoid valve, and then open the angle valve via the air connector.

[0008] Furthermore, in some embodiments of the present invention, a second valve is also provided in the bypass. The second valve adjusts the vacuum pumping force within the bypass by changing its opening degree.

[0009] Furthermore, in some embodiments of the present invention, the second valve includes a hand valve. The hand valve is provided with an adjusting knob for rotating to adjust the opening degree of the hand valve, thereby adjusting the vacuum pumping force in the bypass.

[0010] Furthermore, in some embodiments of the present invention, a gas flow meter is provided on the bypass for acquiring the gas flow rate in the bypass. The controller is further configured to: determine a target opening degree of the second valve based on the gas flow rate; and, based on the target opening degree, rotate an adjusting knob of the second valve to adjust the vacuum pumping force in the bypass.

[0011] Furthermore, in some embodiments of the present invention, the evacuation device further includes a third valve disposed between the heat trap and the evacuation pump, for isolating the process chamber from the evacuation pump after evacuation is completed, so as to prevent the gas in the evacuation pump from backflowing and contaminating the process chamber.

[0012] Furthermore, in some embodiments of the present invention, an electrical interlock is provided between the limit switch, the first valve, and the third valve. The controller is also configured to open the third valve only in response to receiving the first signal and a second signal indicating that the first valve is closed.

[0013] Furthermore, in some embodiments of the present invention, the extraction device further includes the heat trap, the extraction pump, and the waste gas treatment device. The heat trap is connected to the process chamber and is used to capture byproducts in the exhaust gas generated during semiconductor processing in the process chamber. The extraction pump is connected to the heat trap and is used to extract the exhaust gas. The waste gas treatment device is connected to the extraction pump and is used to treat the exhaust gas extracted by the extraction pump.

[0014] Furthermore, the semiconductor processing apparatus provided according to the first aspect of the present invention includes at least one process chamber and the aforementioned vacuum device provided in the first aspect of the present invention. The top of each process chamber is provided with a chamber cover for sealing each process chamber to perform semiconductor processing within it. The vacuum device is used to extract exhaust gases generated during the semiconductor processing in the process chamber.

[0015] Furthermore, in some embodiments of the present invention, the semiconductor processing equipment includes a first process chamber and a second process chamber. A first limit switch is provided on the cover of the first process chamber. A second limit switch is provided on the cover of the second process chamber. An electrical interlock is provided between the first limit switch and the second limit switch, for obtaining a first signal indicating that the cover is open after both the first and second limit switches are simultaneously triggered. Attached Figure Description

[0016] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0017] Figure 1 A simplified structural schematic diagram of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown.

[0018] Figure 2 A schematic diagram of gas flow in the closed state of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown.

[0019] Figure 3 A schematic diagram of gas flow direction in the open cavity state of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown.

[0020] Figure 4 A simplified structural schematic diagram of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown.

[0021] Figure 5 A schematic diagram of the structure of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown.

[0022] Figure 6 A schematic diagram of gas flow in the closed state of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown.

[0023] Figure 7 A schematic diagram of gas flow direction in the open cavity state of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown.

[0024] Figure 8 A schematic diagram of the structure of a first valve provided according to some embodiments of the present invention is shown.

[0025] Figure 9 A schematic flowchart of an air extraction method according to some embodiments of the present invention is shown. Detailed Implementation

[0026] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0029] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0030] As mentioned above, during open-chamber maintenance, the chamber cover must be opened while the system is still heated because the pre-pipeline or heat sink cannot be cooled to prevent the generation of more byproducts. During preventive maintenance (PM), the hot exhaust gases from the chamber walls, pre-pipeline walls, and heat sink rise and diffuse into the air, affecting the environment and causing harm to maintenance personnel.

[0031] To overcome the aforementioned deficiencies in the prior art, the present invention provides an air extraction device and a semiconductor processing equipment. By setting a bypass that bypasses the heat trap, the hot airflow in the pipes and heat trap is extracted downwards during the opening maintenance stage. This is used to reduce the upward return of gas carried by the rising hot airflow in the front pipes and heat trap during the opening maintenance stage, prevent the diffusion of odors from affecting the environment, and reduce the health hazards to machine maintenance personnel under specific conditions.

[0032] In some non-limiting embodiments, the air extraction device provided in the first aspect of the present invention can be configured in the semiconductor processing equipment provided in the second aspect of the present invention.

[0033] Please refer to the reference for details. Figures 1-3 . Figure 1 A simplified structural schematic diagram of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown. Figure 2 A schematic diagram of gas flow in the closed state of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown. Figure 3 A schematic diagram of gas flow direction in the open cavity state of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown.

[0034] exist Figure 1 In the illustrated embodiment, the semiconductor processing apparatus provided by the second aspect of the present invention includes at least one process chamber 10 and the aforementioned vacuum device provided by the first aspect of the present invention. Here, the top of the process chamber 10 is provided with a chamber cover 11 for sealing each process chamber 10 to perform semiconductor processing within it. The vacuum device is used to extract the exhaust gases generated during the semiconductor processing in the process chamber 10.

[0035] Furthermore, in Figure 1In the illustrated embodiment, the chamber cover 11 of the aforementioned process chamber 10 is equipped with a first limit switch 12 and a second limit switch 13. An electrical interlock is provided between the first limit switch 12 and the second limit switch 13 to obtain a first signal indicating that the chamber cover 11 is open after both the first limit switch 12 and the second limit switch 13 are triggered simultaneously. Here, the contacts of the first limit switch 12 and the second limit switch 13 are connected in series in the control circuit; the circuit will only conduct if they are triggered simultaneously. For example, in determining whether the chamber cover is open or closed, the next action is only executed after both the first limit switch 12 and the second limit switch 13 are triggered, i.e., a "position signal" is detected, thus avoiding accidental triggering of a single switch.

[0036] like Figure 2 As shown, during vacuuming, the gas inside the semiconductor processing equipment flows downwards from the main path between the process chamber 10 and the vacuum pump 22. Figure 3 As shown, during open-cavity maintenance, the gas inside the semiconductor processing equipment is drawn out through a bypass from the process chamber 10 to the vacuum pump 22. Specifically, the gas in the heat trap 21 first flows upward, then passes through the first valve and the second valve 25 in the bypass and is drawn downward by the vacuum pump 22. The gas in the process chamber 10 flows downward directly through the first valve and the second valve 25 in the bypass and is drawn downward by the vacuum pump 22.

[0037] Furthermore, when evacuating the cavity after closing it, using a larger pre-line pipe (e.g., ISO100 pipe) allows for rapid evacuation of the cavity, resulting in a larger airflow and shorter process time. During maintenance with the cavity open, a thinner pipe is typically used for side-bypass suction. This thinner pipe allows for easy adjustment of the suction force via manual valves, providing flexibility and suitability for localized fine-tuning without affecting the main pipeline operation.

[0038] In addition, please refer to the reference. Figure 4 and Figure 5 . Figure 4 A simplified structural schematic diagram of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown. Figure 5 A schematic diagram of the structure of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown.

[0039] exist Figure 4 and Figure 5In the illustrated embodiment, the semiconductor processing apparatus provided by the second aspect of the present invention includes a first process chamber 14 and a second process chamber 15. Here, a first limit switch 12 is provided on the cover 11 of the first process chamber 14. A second limit switch 13 is provided on the cover 12 of the second process chamber 15. An electrical interlock is provided between the first limit switch 12 and the second limit switch 13 to obtain a first signal indicating that the cover 11 is open after both the first limit switch 12 and the second limit switch 13 are triggered simultaneously. Here, the contacts of the first limit switch 12 and the second limit switch 13 are connected in series in the control circuit, and the circuit will only be connected if they are triggered simultaneously. For example, in the process of determining whether the cover is open or closed, the next action is only executed when both the first limit switch 12 and the second limit switch 13 are triggered, i.e., a "position signal" is detected, thus avoiding accidental triggering of a single switch.

[0040] Please refer to further information. Figure 6 and Figure 7 . Figure 6 A schematic diagram of gas flow in the closed state of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown. Figure 7 A schematic diagram of gas flow direction in the open cavity state of a semiconductor processing apparatus provided according to some embodiments of the present invention is shown.

[0041] like Figure 6 As shown, during vacuuming, the gas inside the semiconductor processing equipment flows downwards from the main path between the process chamber 10 and the vacuum pump 22. Figure 7 As shown, during open-cavity maintenance, the gas inside the semiconductor processing equipment is drawn out through a bypass from the process chamber 10 to the vacuum pump 22. Specifically, the gas in the heat trap 21 first flows upward, then passes through the first valve and the second valve 25 in the bypass and is drawn downward by the vacuum pump 22. The gas in the process chamber 10 flows downward directly through the first valve and the second valve 25 in the bypass and is drawn downward by the vacuum pump 22.

[0042] Furthermore, when evacuating the cavity after closing it, using a larger pre-line pipe (e.g., ISO100 pipe) allows for rapid evacuation of the cavity, resulting in a larger airflow and shorter process time. During maintenance with the cavity open, a thinner pipe is typically used for side-bypass suction. This thinner pipe allows for easy adjustment of the suction force via manual valves, providing flexibility and suitability for localized fine-tuning without affecting the main pipeline operation.

[0043] Furthermore, in Figure 1 , Figure 4 and Figure 5In the illustrated embodiment, the air extraction device provided by the first aspect of the present invention includes limit switches 12-13, a bypass, and a controller. Here, limit switches 12-13 are located at the chamber cover 11 of the process chamber 10, and are used to acquire a first signal indicating that the chamber cover 11 is open when the chamber cover 11 is opened. One end of the bypass is connected between the process chamber 10 and a heat sink 21, and the other end is connected between the heat sink 21 and an air extraction pump 22. Here, the bypass is provided with a first valve for opening or closing the bypass.

[0044] Please refer to further details. Figure 5 and Figure 8 . Figure 8 A schematic diagram of the structure of a first valve provided according to some embodiments of the present invention is shown.

[0045] exist Figure 5 and Figure 8 In the illustrated embodiment, the first valve includes an angle valve 23 and a solenoid valve 24. Here, the angle valve 23 is a right-angled shape, suitable for use in bypass venting.

[0046] like Figure 8 As shown, angle valve 23 is connected to air pipe 42 and solenoid valve 24 via air connector 41. Here, in response to receiving a first signal indicating chamber opening, the controller can open solenoid valve 24. Solenoid valve 24 controls the opening of air pipe 42, thereby opening angle valve 23 pneumatically.

[0047] In addition, Figure 1 , Figure 4 and Figure 5 In the illustrated embodiment, a second valve 25 is also provided in the bypass. Here, the second valve 25 adjusts the vacuum pumping force in the bypass by changing its opening degree.

[0048] Furthermore, in some embodiments, the second valve 25 described above includes a manual valve. Here, the manual valve is provided with an adjustment knob for rotating to adjust the opening of the manual valve, thereby adjusting the vacuum pumping force in the bypass.

[0049] Furthermore, in some preferred embodiments, a gas flow meter is provided on the bypass to obtain the gas flow rate in the bypass. The controller can determine the target opening degree of the second valve 25 based on the obtained gas flow rate, and adjust the adjustment knob of the second valve 25 according to the target opening degree to adjust the vacuum pumping force in the bypass.

[0050] In addition, Figure 1 , Figure 4 and Figure 5In the embodiment shown, the above-mentioned air extraction device provided by the first aspect of the present invention further includes a third valve 16, which is disposed between the heat trap 21 and the air extraction pump 22, for isolating the process chamber 10 and the air extraction pump 22 after the air extraction is completed, so as to prevent the backflow of gas in the air extraction pump 22 from contaminating the process chamber 10.

[0051] Furthermore, in some embodiments, the third valve 26 is a gate valve or a slide valve.

[0052] Furthermore, in some preferred embodiments, an electrical interlock is provided between the aforementioned limit switches 12-13, the first valve, and the third valve 26. Here, the controller opens the third valve 26 only in response to receiving a first signal and a second signal indicating that the first valve is closed, thereby triggering the opening of the third valve 26 after determining that the chamber cover 11 is open and the first valve is closed (bypass).

[0053] Similarly, the pumping device can also respond to the receipt of a first signal and a third signal indicating that the third valve 26 is closed, so that the controller opens the first valve to open the side pump after determining that the chamber cover 11 is open and the third valve is closed.

[0054] In this way, the air extraction device can ensure the safety of the working sequence of electrical components by controlling the interlocks between them.

[0055] In addition, Figure 1 , Figure 4 and Figure 5 In the illustrated embodiment, the exhaust device provided by the first aspect of the present invention further includes a heat trap 21, an exhaust pump 22, and a scrubber 27. Here, the heat trap 21 is connected to the process chamber 10 and is used to capture byproducts in the exhaust gas generated during the semiconductor processing in the process chamber 10. The exhaust pump 22 is connected to the heat trap 21 and is used to extract the exhaust gas. The scrubber 27 is connected to the exhaust pump 22 and is used to treat the exhaust gas extracted by the exhaust pump 22.

[0056] Please refer to Figure 9 . Figure 9 A schematic flowchart of an air extraction method according to some embodiments of the present invention is shown.

[0057] like Figure 9 As shown, when performing cavity maintenance, the controller of the air extraction device provided in the first aspect of the present invention can first close the third valve 26.

[0058] Afterwards, the technicians opened the chamber cover 11 of the process chamber 10. The evacuation device can obtain a first signal indicating that the chamber cover 11 is open via limit switches 12-13.

[0059] Subsequently, in response to receiving the first signal, the controller can open the first valve to allow the exhaust gas generated in the process chamber 10 and the heat sink 21 to be extracted by the air pump 22 via a bypass.

[0060] Specifically, in response to receiving the first signal, the controller can open the solenoid valve 24 to open the air pipe 42 via the solenoid valve 24, and then open the angle valve 23 via the air connector 41.

[0061] Furthermore, in some preferred embodiments, the pumping device can also obtain the gas flow rate in the bypass via a gas flow meter. Then, the controller can determine the target opening degree of the second valve 25 based on the gas flow rate, and adjust the regulating knob of the second valve 25 according to the target opening degree to regulate the vacuum pumping force in the bypass.

[0062] After that, technicians can perform internal maintenance on the process chamber 10.

[0063] In summary, the above-mentioned air extraction device and semiconductor processing equipment provided by the present invention can both draw the hot air flow in the pipeline and the heat trap downward through the bypass during the cavity opening maintenance stage by setting a bypass. This is used to reduce the upward return of the gas carried by the rising hot air flow in the pipeline and the heat trap at the front end of the cavity opening maintenance stage, prevent the odor from spreading and affecting the environment, and reduce the risk of health hazards to machine maintenance personnel under certain conditions.

[0064] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0065] Those skilled in the art will understand that information, signals, and data can be represented using any of a variety of different techniques and skills. For example, the data, instructions, commands, information, signals, bits, symbols, and chips described throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.

[0066] Although the controller described in the above embodiments can be implemented through a combination of software and hardware, it is understood that the controller can also be implemented in software or hardware. For hardware implementation, the controller can be implemented using one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection of combinations of the above devices. For software implementation, the controller can be implemented using independent software modules such as procedures and functions running on a general-purpose chip, each module performing one or more functions and operations described herein.

[0067] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vacuum device, characterized in that, include: A limit switch is located at the cover of the process chamber and is used to acquire a first signal indicating that the cover is open when the cover is opened. A bypass, one end of which is connected between the process chamber and a heat sink, and the other end of which is connected between the heat sink and a vacuum pump, wherein the bypass is provided with a first valve for opening or closing the bypass; as well as The controller is configured to: in response to receiving the first signal, open the first valve to allow exhaust gas generated in the process chamber and the heat trap to be extracted by the vacuum pump via the bypass.

2. The air extraction device as described in claim 1, characterized in that, The first valve includes an angle valve and a solenoid valve, wherein the angle valve is connected to an air pipe and the solenoid valve via an air connector, and the controller is further configured to: in response to receiving the first signal, open the solenoid valve to open the air pipe via the solenoid valve, and then open the angle valve via the air connector.

3. The air extraction device as described in claim 1, characterized in that, The bypass is also equipped with a second valve, which adjusts the vacuum pumping force in the bypass by changing its opening degree.

4. The air extraction device as described in claim 3, characterized in that, The second valve includes a hand valve, wherein the hand valve is provided with an adjustment knob for rotating to adjust the opening of the hand valve in order to adjust the vacuum pumping force in the bypass.

5. The air extraction device as described in claim 3, characterized in that, A gas flow meter is provided on the bypass to obtain the gas flow rate in the bypass. The controller is further configured to: determine the target opening degree of the second valve based on the gas flow rate; and rotate the adjustment knob of the second valve to adjust the vacuum pumping force in the bypass based on the target opening degree.

6. The air extraction device as described in claim 1, characterized in that, Also includes: A third valve is located between the heat trap and the vacuum pump to isolate the process chamber from the vacuum pump after the vacuuming is completed, so as to prevent the backflow of gas from the vacuum pump from contaminating the process chamber.

7. The air extraction device as described in claim 6, characterized in that, An electrical interlock is provided between the limit switch, the first valve, and the third valve. The controller is further configured to open the third valve only in response to receiving the first signal and a second signal indicating that the first valve is closed.

8. The air extraction device as described in claim 1, characterized in that, Also includes: The heat trap is connected to the process chamber and is used to capture byproducts in the exhaust gas generated during the semiconductor processing in the process chamber. The air pump is connected to the heat sink and is used to extract the exhaust gas. as well as An exhaust gas treatment device is connected to the exhaust pump and is used to treat the exhaust gas extracted by the exhaust pump.

9. A semiconductor processing apparatus, characterized in that, include: At least one process chamber has a top cover for sealing each of the process chambers to perform semiconductor processing within them; as well as The extraction device as described in any one of claims 1 to 8 is used to extract the exhaust gas generated during the semiconductor processing in the process chamber.

10. The semiconductor processing equipment as described in claim 9, characterized in that, The semiconductor processing equipment includes a first process chamber and a second process chamber. The first process chamber has a first limit switch on its cover, and the second process chamber has a second limit switch on its cover. An electrical interlock is provided between the first limit switch and the second limit switch to obtain a first signal indicating that the cover should be opened when both the first limit switch and the second limit switch are triggered simultaneously.

Images