Multi-temperature-zone semiconductor incubator control method and device, medium and product

Abstract

The invention provides a multi-temperature-zone semiconductor incubator control method and device, a medium and a product, and relates to the technical field of temperature control. The method comprises the following steps: firstly, acquiring battery test requirements, and determining required temperature zone numbers and parameters; and determining an adjacent temperature zone of the target temperature zone in combination with the temperature zone number and a preset topological structure. And starting a target temperature zone temperature control system according to the parameters, and simultaneously collecting the temperatures of the target and adjacent temperature zones in real time. And inputting the temperature data of the adjacent temperature zones into the thermodynamic coupling model subjected to experimental training to obtain the instantaneous heat influence of the temperature data on the target temperature zone, and finally driving the semiconductor chilling plate group sharing the boundary according to the instantaneous heat influence to generate a reverse isometric compensation heat flow so as to counteract the heat influence. By implementing the method, when each temperature zone operates independently, the temperature control of the temperature zone is not interfered by the state change of the adjacent temperature zone, so that the accuracy and stability of independent temperature control of each temperature zone are improved.

Description

Technical Field

[0001] This application relates to the field of temperature control technology, and in particular to a method, apparatus, medium and product for controlling a multi-temperature zone semiconductor temperature chamber. Background Technology

[0002] Modern battery technology, especially the research and application of lithium-ion batteries, exhibits a high degree of sensitivity to operating temperature in terms of performance, safety, and lifespan. Therefore, in key stages such as battery material selection, cell performance evaluation, and module aging and safety verification, conducting tests under precise and stable temperature conditions is fundamental to obtaining reliable and reproducible experimental data.

[0003] Traditional methods often involve several chambers with a fixed number of temperature zones to create different temperature environments, with each zone very close together. These chambers typically employ an integrated structural design, with internal temperature zones separated by physical partitions, and each zone equipped with an independent cooling / heating system. The partition materials are mostly passive insulation materials such as polyurethane foam or fiberglass, relying on their low thermal conductivity to slow down heat exchange between temperature zones.

[0004] However, when a large temperature difference needs to be set between adjacent temperature zones, temperature changes in one zone will affect adjacent zones through conduction and convection. Furthermore, even when only some temperature zones are operating, the entire system still requires high energy consumption, lacking intelligent energy management strategies and resulting in energy waste. Therefore, traditional methods struggle to achieve precise temperature control for high-precision experiments such as battery material performance evaluation while saving energy. Summary of the Invention

[0005] This application provides a method, apparatus, medium, and product for controlling a multi-temperature zone semiconductor oven, which is used to actively eliminate thermodynamic crosstalk between independent temperature zones in multi-temperature zone parallel testing applications, so as to ensure that each temperature zone can achieve accurate, stable, and non-interfering independent temperature control.

[0006] In a first aspect, this application provides a multi-temperature zone semiconductor chamber control method, applied to the control unit of a multi-temperature zone semiconductor chamber. The multi-temperature zone semiconductor chamber includes multiple independent temperature zone components. Each independent temperature zone component has a semiconductor cooling chip assembly, a temperature sensor, a high-efficiency heat insulation structure, and a composite heat dissipation module distributed on its internal sidewall. The method includes: acquiring battery test requirement information, including the temperature zone number and test parameter requirements of the independent temperature zone required for testing; combining the temperature zone number and a preset temperature zone topology, determining all physically adjacent temperature zones directly adjacent to the target independent temperature zone from the multi-temperature zone semiconductor chamber; and activating the temperature control system of the independent temperature zone required for testing according to the test parameter requirements. The system collects real-time temperature data of the target independent temperature zone and all adjacent temperature zones using temperature sensors. The real-time temperature data of the adjacent temperature zones are input into a preset thermodynamic coupling model to obtain the instantaneous thermal impact that each adjacent temperature zone will have on the target independent temperature zone. This thermodynamic coupling model is obtained by machine learning from experimental training data, which uses the temperature difference and structural parameters of different temperature zone combinations as input samples and the actual measured heat transfer rate as the output label. Based on the instantaneous thermal impact, the system independently drives the semiconductor cooling chip arrays deployed on the shared boundary between the target independent temperature zone and each adjacent temperature zone, so that the semiconductor cooling chip arrays actively generate a compensating heat flow on the boundary that is equal in magnitude and opposite in direction to the instantaneous thermal impact.

[0007] By employing the aforementioned technical solution and acquiring real-time temperature data of the target temperature zone and all adjacent temperature zones, the boundary conditions for heat transfer are accurately determined. Subsequently, using a thermodynamic coupling model trained by machine learning, the instantaneous thermal impact of adjacent temperature zones on the target temperature zone can be accurately predicted based on this real-time data. Most importantly, this method does not passively isolate the target zone but independently drives the semiconductor cooling arrays at the boundary to actively generate a compensating heat flow of equal magnitude and opposite direction, dynamically canceling out the thermal impact before it actually occurs. This is equivalent to constructing an active "thermal barrier" between temperature zones, ensuring the independence and accuracy of temperature control in each zone, and greatly improving the reliability and stability of battery test results under complex multi-tasking conditions.

[0008] In conjunction with some embodiments of the first aspect, in some embodiments, the multi-temperature zone semiconductor chamber further includes a temperature-adjustable touchscreen and a chamber backplate. The chamber backplate integrates a power bus and a communication bus, and has multiple standardized slots. Each independent temperature zone component is equipped with a slot-type connector at the rear that precisely matches the slot on the backplate. When the independent temperature zone component is pushed into the slide rail of the chamber backplate, the rear connector automatically inserts into the slot on the chamber backplate to complete the physical connection. Before the step of obtaining battery test requirement information, the chamber further includes: when the user sends a query command to add a temperature zone through the temperature-adjustable touchscreen, a device status query command is sent to all preset physical slot addresses in the chamber backplate through the communication bus; if a response is received, the independent temperature zone component corresponding to the address is marked as online, and the corresponding temperature zone number is recorded; if no response is received within a set time, the corresponding address is determined to be in an idle state; the current temperature zone topology is determined based on the online status and the temperature zone number.

[0009] By adopting the above technical solution, modular, intelligent management, and flexible expansion of the multi-temperature zone semiconductor chamber are achieved. By designing independent temperature zone components as pluggable modules with standardized connectors, and combining them with a bus system on the backplane, users can add or remove temperature zones as needed, much like a server blade, greatly improving the configurability and maintainability of the equipment. Furthermore, the system automatically polls and identifies online temperature zones via the communication bus, constructing the current physical topology in real time. This automated process not only eliminates tedious manual configuration and ensures the accuracy of topology information, but also provides accurate and dynamically updated "neighbor relationship" data for the algorithm that eliminates thermodynamic crosstalk in the first aspect. This enhances the flexibility, scalability, and intelligence of the entire system, enabling the equipment to quickly adapt to different test scales and layout requirements.

[0010] In conjunction with some embodiments of the first aspect, in some embodiments, the step of starting the temperature control system for the independent temperature zone required for the test according to the test parameter requirements specifically includes: determining the target temperature zone operating set according to the independent temperature zone required for the test; subtracting the target temperature zone operating set from the multi-temperature zone semiconductor oven to obtain the target temperature zone rest set; starting operation according to the test parameter requirements of each temperature zone in the target temperature zone operating set, while controlling the temperature zones in the target temperature zone rest set to be in a powered-off state.

[0011] By adopting the above technical solution, and clearly dividing all temperature zones into target temperature zone operating sets and target temperature zone rest sets, the system can precisely activate only the temperature control system of the required temperature zones according to actual testing needs, while completely shutting down all temperature zones that do not require operation. This "on-demand power supply" strategy avoids the huge energy waste caused by traditional temperature chambers that require the entire system to be kept in standby or running even when some parts are idle. This directly reduces the overall power consumption and operating costs of the equipment, while reducing the ineffective operating losses of idle temperature zone components, extending their service life, and making the entire testing process more economical, efficient, and environmentally friendly.

[0012] In conjunction with some embodiments of the first aspect, in some embodiments, each independent temperature zone component is provided with a channel interface, a pull-out handle, an auxiliary interface, and a battery clamp plate. The auxiliary interface includes an auxiliary voltage interface. The battery clamp plate is used to clamp the battery under test and summarize the parameters of the battery under test to the channel interface. Before the step of starting the temperature control system of the required independent temperature zone according to the test parameter requirements, the method further includes: actively monitoring the voltage signal of the independent temperature zone connected to the battery clamp plate within the target temperature zone operating set through the channel interface or the auxiliary voltage interface; determining whether there is a battery under test in the corresponding independent temperature zone based on whether the voltage signal is within a preset effective voltage range; if it is determined to be in the in-situ state, authorizing the start of the temperature control system; if it is determined to be out of the in-situ state, locking and prohibiting the start of the temperature control system of the corresponding independent temperature zone, and generating a warning command according to the corresponding temperature zone number. The warning command is used to trigger the display terminal to display the temperature zone number and the battery no-load prompt information.

[0013] By adopting the above technical solution, the voltage signal on the battery clamp plate is actively monitored before the temperature control system is started to determine whether the battery is actually in place, effectively preventing no-load operation in the temperature zone due to operator negligence. Such no-load operation is not only a serious waste of energy, but may also damage the equipment itself under extreme temperature change testing. When no-load is detected, the system will immediately lock the temperature control function of the corresponding temperature zone and issue a clear warning, thereby guiding the operator to correct the situation in time, ensuring the effective execution of each test task, avoiding the waste of time and resources caused by invalid tests, and ensuring the accuracy of test data and the safe operation of the equipment.

[0014] In conjunction with some embodiments of the first aspect, in some embodiments, each independent temperature zone component is provided with an observation window on its door. The observation window includes a double-glazed structure and an electrothermal anti-condensation film. The double-glazed structure consists of an inner tempered glass layer in contact with the internal environment of the chamber and an outer tempered glass layer in contact with the external environment. A dry, inert gas is filled in the sealed cavity formed between the inner and outer tempered glass layers to create an insulation layer, reducing heat exchange between the inside and outside through the observation window. The electrothermal anti-condensation film is integrated into the surface or interlayer of the double-glazed structure and is electrically connected to the control unit. The control unit determines a condensation risk threshold based on real-time monitored environmental data inside and outside the chamber. It determines the target operating temperature for each independent temperature zone according to the test parameter requirements. When the target operating temperature is lower than the condensation risk threshold, the electrothermal anti-condensation film is automatically activated for compensatory micro-heating, ensuring that the outer surface temperature of the outer tempered glass layer is always maintained above the dew point temperature of the current environment.

[0015] By adopting the above technical solution, double-glazed windows combined with inert gas filling first construct a highly efficient passive heat insulation barrier. More importantly, the control unit can intelligently judge the risk of condensation based on internal and external environmental data, and only activate the electrothermal anti-condensation film for active, compensatory micro-heating when necessary. This intelligent control method can precisely maintain the surface temperature of the observation window above the environmental dew point, completely eliminating condensation or frost formation on the window and ensuring real-time, high-definition observation during testing, while avoiding unnecessary energy consumption from continuous heating.

[0016] In conjunction with some embodiments of the first aspect, in some embodiments, each independent temperature zone component is provided with a perforated flow equalization plate structure air duct system connected to the composite heat dissipation module. Each perforated flow equalization plate structure is equipped with an independently controllable electrically adjustable baffle. An intelligent fan speed control device is installed at the air inlet end of the air duct system. After the step of inputting the real-time temperature data of adjacent temperature zones into a preset thermodynamic coupling model, the method further includes: real-time acquisition of temperature distribution data at multiple preset detection points within the target independent temperature zone; calculation of the temperature uniformity index within the target independent temperature zone based on the temperature distribution data, and comparison of the temperature uniformity index with a preset uniformity threshold; when the temperature uniformity index deviates from the preset uniformity threshold, the following compensation steps are performed: A three-dimensional temperature field model of the temperature zone cavity is generated based on the temperature distribution data. Based on this model, the temperature gradient vector between each preset detection point is calculated. Combining this temperature gradient vector with a preset airflow optimization model, an airflow optimization scheme is determined. This model is obtained through machine learning training on multiple experimental training data sets. The training data includes different temperature gradient vectors as input, and combinations of fan speed parameters and orifice opening parameters to achieve standard temperature uniformity as output labels. The airflow optimization scheme includes fan speed adjustment parameters and the airflow distribution ratio of each orifice in the multi-hole flow equalizer. The operating parameters of the duct system are adjusted according to this airflow optimization scheme.

[0017] By adopting the above technical solution, temperature control within the temperature zone is elevated from simple average value control to refined, proactive management of three-dimensional temperature field uniformity. By acquiring multi-point temperature data in real time and calculating the uniformity index, the system can quantify and monitor the temperature distribution within the temperature zone. If poor uniformity is detected, the system does not employ a fixed airflow pattern but dynamically generates a three-dimensional temperature field model and uses an advanced machine learning airflow optimization model to calculate the optimal airflow organization scheme. This closed-loop feedback adjustment mechanism based on real-time data and intelligent models allows the system to selectively adjust fan speed and the opening of the perforated flow distribution plate, precisely reshaping the airflow within the cavity, thereby proactively eliminating localized overheating or undercooling points and achieving a higher level of temperature uniformity.

[0018] In conjunction with some embodiments of the first aspect, in some embodiments, the step of adjusting the operating parameters of the air duct system according to the airflow optimization scheme specifically includes: adjusting the operating parameters of the intelligent fan speed control device according to the fan speed adjustment parameters, and simultaneously adjusting the electric baffle group set in the porous flow equalization plate structure by combining the airflow distribution ratio to dynamically adjust the effective cross-sectional area of ​​each through hole; and simultaneously activating the auxiliary heating film components distributed at the four corners of the target independent temperature zone, wherein the heating power of the auxiliary heating film components is adaptively adjusted according to the corner temperature trough value detected in the three-dimensional temperature field model.

[0019] By adopting the above technical solution, macroscopic airflow adjustment of the intelligent fan and electric baffle based on the airflow optimization scheme addresses the main temperature gradient. Simultaneously, auxiliary heating film components in the corners are activated to precisely target heat compensation in dead-angle areas that are difficult to cover by traditional air ducts. This synergistic effect can more quickly and thoroughly eliminate non-uniformity within the temperature field, particularly solving the problem of low temperatures in corner areas caused by structural factors. This collaborative control strategy enables a highly uniform temperature field to be rapidly reached and stably maintained within the target independent temperature zone. This is crucial for demanding battery performance and lifespan evaluation tests, greatly improving the accuracy and repeatability of test results.

[0020] In a second aspect, this application provides a control unit for a multi-temperature zone semiconductor oven, the control unit of which includes: one or more processors and a memory; the memory is coupled to the one or more processors, the memory is used to store computer program code, the computer program code including computer instructions, and the one or more processors call the computer instructions to cause the control unit of the multi-temperature zone semiconductor oven to perform the method described in the first aspect and any possible implementation thereof.

[0021] Thirdly, this application provides a computer-readable storage medium including instructions that, when executed on a control unit of a multi-temperature zone semiconductor oven, cause the control unit of the multi-temperature zone semiconductor oven to perform the method described in the first aspect and any possible implementation thereof.

[0022] Fourthly, this application provides a computer program product that, when run on the control unit of a multi-temperature zone semiconductor oven, causes the control unit of the multi-temperature zone semiconductor oven to perform the method described in the first aspect and any possible implementation thereof.

[0023] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages: 1. By employing a collaborative control technology based on machine learning model prediction and active heat flow compensation, the technical problem of low temperature control accuracy and poor stability of the target temperature zone caused by thermodynamic crosstalk between temperature zones during independent operation of multiple temperature zones in the existing technology is effectively solved. This achieves the technical effect of dynamically constructing an "active thermal barrier" on the shared boundary of temperature zones. By proactively offsetting the instantaneous thermal effects of adjacent temperature zones, the high degree of independence and accuracy of temperature control in each temperature zone is ensured, significantly improving the reliability and stability of battery test results under complex multi-tasking conditions.

[0024] 2. By adopting standardized, pluggable temperature zone modules combined with bus communication, and supplemented by automated device addressing and topology identification technologies, the system effectively solves the technical problems of traditional multi-temperature zone equipment, such as fixed configuration, poor scalability, and the need for cumbersome manual configuration after temperature zone layout changes, which can easily lead to system errors. This enables flexible expansion of the temperature chamber and "plug-and-play" technology. The system can automatically identify and construct a precise physical topology, greatly improving the configurability, maintainability, and intelligence level of the equipment, and providing the necessary data foundation for accurate compensation of thermodynamic crosstalk between temperature zones.

[0025] 3. By combining passive insulation with active electric heating, and using precise control technology where the control unit intelligently judges the risk of condensation based on internal and external environmental data and activates the heating film as needed, the technical problem of condensation or frost easily forming on the observation window of the existing low-temperature test chamber when there is a large temperature difference between the inside and outside, affecting real-time observation, and continuous heating causing unnecessary energy waste, is effectively solved. This achieves the technical effect that the observation window can maintain a clear and transparent appearance under any working condition, ensuring uninterrupted visual monitoring capabilities during the test process. At the same time, it achieves a highly efficient anti-condensation function with minimal energy consumption, taking into account both observation reliability and energy conservation and environmental protection. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the multi-temperature zone semiconductor oven and the independent temperature zone in the embodiments of this application; Figure 2 This is a flowchart illustrating a multi-temperature zone semiconductor chamber control method in an embodiment of this application. Figure 3 This is a schematic diagram illustrating the connection process of the temperature zone component being inserted into the backplate; Figure 4 This is a schematic diagram of the physical device structure of the control unit of the multi-temperature zone semiconductor incubator in the embodiments of this application. Detailed Implementation

[0027] The terminology used in the following embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to include the plural expressions as well, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this application refers to and includes any or all possible combinations of one or more of the listed items.

[0028] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0029] For ease of understanding, the structure of the multi-temperature zone semiconductor oven used in the method provided in this embodiment is described below. Please refer to [link / reference]. Figure 1 This is a schematic diagram of the structure of the multi-temperature zone semiconductor oven and the independent temperature zone in the embodiments of this application.

[0030] Figure 1 Figure (a) shows the overall structure of the multi-temperature zone semiconductor incubator. This incubator adopts a vertical cabinet design, with the upper part serving as the main control and display area, integrating a temperature-adjustable touchscreen for user parameter setting, status monitoring, and system operation. The main body of the cabinet consists of multiple standardized, independently controllable temperature zones arranged in a matrix (4 rows and 2 columns as shown in the figure). This modular design allows each temperature zone to function like a drawer, enabling independent installation and removal of battery samples, greatly improving the efficiency and flexibility of parallel testing.

[0031] Within each independent temperature zone, thermoelectric cooling modules and temperature sensors are evenly distributed on the inner sidewalls. The thermoelectric cooling modules serve a dual function: firstly, they adjust the temperature of the zone according to test parameters to meet the environmental requirements of battery testing; secondly, driven by the control unit, they actively generate compensating heat flow at the shared boundary with adjacent temperature zones to offset the instantaneous thermal effects of adjacent zones. The temperature sensors collect real-time temperature data from the zone and adjacent zones, transmitting the data to the control unit to provide accurate data input for the thermodynamic coupling model to calculate the instantaneous thermal effects. A composite heat dissipation module is installed at the rear of each temperature zone. This module is directly connected to the porous flow equalization plate structure air duct system within the zone, forming the core of heat dissipation and airflow circulation within the zone. The air inlet of the air duct system is equipped with an intelligent fan speed control device, and the porous flow equalization plate is equipped with independently controllable electrically adjustable baffles. By adjusting the fan speed and baffle opening, the airflow speed and direction within the air duct can be flexibly changed, optimizing the temperature distribution within the temperature zone.

[0032] The control unit of the multi-temperature zone semiconductor oven can be set in the area corresponding to the temperature control touch screen. This control unit is used to coordinate and schedule the operation of various components of the multi-temperature zone semiconductor oven, receive and process various data and instructions, and realize the core calculation of precise temperature control of the oven.

[0033] Figure 1Figure (b) shows a schematic diagram of the internal structure of a single independent temperature zone in a multi-temperature zone semiconductor oven. Each independent temperature zone module mainly consists of a front panel and an internal test chamber. The front panel has a pull-out handle for easy insertion or removal of the entire module from the cabinet. The panel also integrates an auxiliary temperature and voltage interface for connecting to the battery under test, i.e., an auxiliary temperature interface or auxiliary voltage interface. This is a data acquisition interface specifically for directly monitoring the battery's status. Users can connect additional temperature sensors (such as thermocouples) to be attached to the battery surface, and voltage probes to the positive and negative terminals of the battery through this interface. This allows for real-time and accurate acquisition of the core temperature and terminal voltage data of the battery during charging and discharging, which is crucial for battery performance evaluation, health status analysis, and safety monitoring. It also includes a channel interface for connecting to the back panel of the oven system for power supply and data communication. Inside the module, there is a battery clamping plate for securely mounting the battery under test (the cylindrical battery shown in the figure), ensuring that the battery is fixed in position during testing and forms good heat exchange with the temperature-controlled environment within the temperature zone.

[0034] The method in this application will be described in detail below with reference to the above structure. Please refer to [link / reference]. Figure 2 This is a flowchart illustrating a multi-temperature zone semiconductor chamber control method in an embodiment of this application.

[0035] S201. Obtain battery test requirement information, which includes the temperature zone number and test parameter requirements for the independent temperature zone required for testing. Among them, the battery test requirement information represents the set of conditions and instructions required to complete a specific battery test task, which serves as the basis for the control unit to execute subsequent operations; the temperature zone number of the independent temperature zone required for testing refers to the unique identifier of each independent temperature zone in a multi-temperature zone semiconductor oven designated for the current battery test, with each temperature zone number corresponding to a specific independent temperature zone component, for example, temperature zone number "W01" may correspond to the first independent temperature zone in the oven; the test parameter requirements refer to the various technical indicators set for the independent temperature zone required for testing in order to achieve the battery test objectives, including target temperature, temperature holding time, temperature change rate, etc., for example, the test parameter requirements may be "maintain the temperature at 25°C in temperature zone W02 for 2 hours".

[0036] Before conducting battery testing, when a user needs to test a battery using a multi-zone semiconductor temperature chamber, the control unit must first obtain relevant test requirement information. The control unit needs to receive battery test requirement information from the user or upper-level system through a specific method. This information may come from various sources. For example, the user may manually input it via the temperature control touchscreen on the temperature chamber. During input, the user needs to clearly specify which independent temperature zones will be used in this test, i.e., the corresponding temperature zone number, and set detailed test parameter requirements for each temperature zone, such as the target temperature value to be achieved, the duration to be maintained at that temperature, and the rate at which the temperature rises or falls from the initial state to the target temperature. Alternatively, a pre-set battery test plan may be sent to the control unit of the temperature chamber via an external computer system or test management platform. In this case, the test requirement information will be transmitted via a communication bus, which also includes the required temperature zone number and specific test parameter requirements. After receiving this information, the control unit needs to parse and verify it to ensure the completeness and accuracy of the information.

[0037] For example, the control unit verifies whether the specified temperature zone number exists in the current temperature zone topology of the chamber to avoid situations where the temperature zone number is missing; it also checks whether the test parameters are within the performance range of the chamber, such as whether the target temperature is between the minimum and maximum temperatures achievable by the chamber, and whether the temperature change rate is within the adjustable range of the chamber. If incomplete or non-compliant information is found, the control unit will notify the user via the display or other feedback methods, requiring the user to re-enter or modify the test requirements until valid battery test requirements are obtained. Only after obtaining accurate and valid battery test requirements can the control unit continue to execute subsequent steps to ensure that the battery test is performed as expected.

[0038] In some embodiments, before obtaining battery test requirement information in step S201, the hardware connection architecture of the multi-temperature zone semiconductor oven can be determined in advance, providing structural support for the flexible expansion and stable operation of the temperature zones. Its application scenarios cover component assembly before the oven leaves the factory, the addition of temperature zones during user use (such as expanding from 2 temperature zones to 4 temperature zones), and the maintenance and replacement of old temperature zone components. From a practical application perspective, during the installation of the temperature zone components, staff or users must first confirm that the target slot on the back panel of the incubator is free (without other components occupying it). Then, align the rear of the independent temperature zone component with the slide rails on both sides of the corresponding slot on the back panel of the incubator. The groove design of the slide rails restricts the direction of component insertion, preventing damage to the connector due to angular deviation. Next, slowly push the component along the slide rail. At this time, the slotted connector at the rear of the component will gradually approach the slot as it is pushed in. Since the size and contact layout of the connector and the slot are perfectly matched, and the slot has a positioning structure (such as a protrusion corresponding to the connector groove), it can ensure that the connector is accurately aligned with the slot. When the component is pushed to the limit position (usually indicated by a "click" sound), the slotted connector will be fully inserted into the slot of the back panel of the incubator. At this time, the power contacts of the connector are in close contact with the power bus contacts in the slot, realizing the connection of the power supply path. At the same time, the communication contacts are connected with the communication bus contacts in the slot, completing the signal transmission path, that is, realizing a complete physical connection.

[0039] Optional, for reference Figure 3 The diagram shows the connection process of the temperature zone component being inserted into the backplate. Figure 3 The system features standardized slots: Multiple identical standardized slots are distributed on the back panel of the temperature chamber. Each slot contains the following key components: Socket contact array: Neatly arranged metal contact bases for receiving pins from the temperature zone component connectors to achieve electrical connection; Power bus interface: Internally connected to the back panel power bus to provide stable power to the temperature zone components; Communication bus interface: Internally connected to the back panel communication bus to enable data exchange between the control unit and the temperature zone components; Guide rail groove: Precision grooves located at the bottom of the slots, corresponding to the guide rails of the temperature zone components to ensure precise alignment during insertion.

[0040] When the independent temperature zone component is pushed into the backplane, the pins on the slotted connector at the rear of the temperature zone component are precisely inserted into the contact seat of the backplane slot. At the same time, the slide rail at the bottom of the connector slides along the slide rail groove in the slot, ensuring that the entire connection process is stable and reliable, and completing the physical and electrical connection.

[0041] After the physical connection is completed, the independent temperature zone component can obtain power from the system. Its internal control module will initiate a self-test (such as checking whether the temperature sensor and thermoelectric cooler are normal) and send a "connected" status signal to the temperature chamber control unit via the communication bus. After receiving the signal, the control unit will mark the component as "to be activated". After the user completes the test parameter settings through the temperature adjustment touch screen, the temperature control function of that temperature zone can be activated. In addition, this physical connection design also has convenient maintenance. When an independent temperature zone component malfunctions (such as a damaged thermoelectric cooler), the user can directly pull the component out along the slide rail. The slot-type connector will automatically separate from the slot. There is no need to disassemble other structures of the temperature chamber. After replacing the new component, simply push it back in to restore the connection, greatly reducing maintenance costs.

[0042] S202. Combining the temperature zone number and the preset temperature zone topology, determine all adjacent temperature zones that are physically directly adjacent to the target independent temperature zone from the multi-temperature zone semiconductor oven. Among them, the preset temperature zone topology refers to the structured information stored in the control unit in advance, which describes the physical positional relationship between each independent temperature zone in the multi-temperature zone semiconductor oven, indicating the adjacency of each temperature zone with other temperature zones, such as which temperature zones are to the left, right, above or below a certain temperature zone; the target independent temperature zone refers to the independent temperature zone that needs to be tested and controlled, determined according to the temperature zone number of the independent temperature zone required for testing; the physically directly adjacent temperature zones refer to independent temperature zones that are closely connected to the target independent temperature zone in spatial location, share one or part of the boundary, and are not separated by other temperature zones.

[0043] After obtaining the battery testing requirements, before activating the temperature control system for the target independent temperature zone, the adjacent temperature zones are determined by querying a preset temperature zone topology, based on the known target independent temperature zone. First, the control unit identifies the current target independent temperature zone based on the obtained temperature zone number. Then, the control unit calls the internally stored preset temperature zone topology, which may exist in the form of a data table, graphical model, or array, recording the adjacency relationships between each temperature zone number and other temperature zones. For example, in a data table, each row corresponds to one temperature zone number, and each column corresponds to another temperature zone number; the value "1" in the table indicates that two temperature zones are directly adjacent, and "0" indicates that they are not adjacent. The control unit searches the temperature zone topology for all temperature zone numbers marked "1" based on the target independent temperature zone's temperature zone number. The independent temperature zones corresponding to these temperature zone numbers are the physically directly adjacent temperature zones to the target independent temperature zone. During the process of determining adjacent temperature zones, the control unit needs to ensure the accuracy of the query to avoid omissions or misidentification of adjacent temperature zones.

[0044] If the temperature zone topology is dynamically updated (e.g., when temperature zone components are added or removed from the chamber), the control unit also needs to confirm that the currently used temperature zone topology is up-to-date to ensure that the determined adjacent temperature zones conform to the actual physical layout. Specifically, when a user needs to add temperature zones to meet more battery testing requirements, the user can first push the newly added independent temperature zone component into the backplate as shown in the front. Figure 3 After confirming the physical and electrical connections, the physical addition is complete. Then, by performing corresponding operations on the temperature control touchscreen, a query command to add a temperature zone is issued. Upon receiving this query command, the control unit sends a device status query command to all preset physical slot addresses on the back panel of the temperature chamber via the internal communication bus. These preset physical slot addresses are determined during the design and manufacturing of the temperature chamber, and each address corresponds to a possible location on the back panel where an independent temperature zone component can be installed. The communication bus acts like an information superhighway, accurately transmitting the control unit's query command to the address corresponding to each physical slot. For example, assuming there are 8 preset physical slots on the back panel of the temperature chamber, with addresses 01 to 08, the control unit will sequentially send query commands to these 8 addresses, inquiring whether an independent temperature zone component is connected at each address and whether the component is functioning correctly. Then, the control unit waits for responses from each physical slot address. During this process, the control unit sets a waiting time, which is usually determined based on the temperature chamber's communication protocol and the component's response speed, for example, set to 1 second. If the control unit receives a response from a physical slot address within the set time, it indicates that the independent temperature zone component connected to that address can communicate normally with the control unit. The control unit will mark the independent temperature zone component corresponding to that address as online and record the temperature zone number corresponding to that component. Conversely, if the control unit does not receive a response from a physical slot address within the set time, there are two possibilities: first, no independent temperature zone component is installed at that slot; second, although the component is installed, it is faulty, not powered, or there is a problem with the communication line, preventing it from responding to the query command normally. In either case, the control unit will determine the corresponding address as idle, meaning that the slot cannot currently provide effective temperature zone functionality.

[0045] Finally, the control unit determines the current temperature zone topology based on the online status of all physical slot addresses and the recorded temperature zone numbers. The temperature zone topology includes not only which temperature zones are online, but also the physical arrangement of these online temperature zones within the chamber and their adjacency relationships.

[0046] Optionally, the control unit uses the temperature zone number of the target independent temperature zone as an index to search in a preset temperature zone topology structure that exists in the form of an adjacency matrix. The rows and columns of the adjacency matrix are temperature zone numbers. When the element value of a certain row and column in the matrix is ​​a preset adjacent identifier, the corresponding column temperature zone number is the adjacent temperature zone of the target independent temperature zone in that row. The control unit traverses all columns of that row, collects all temperature zone numbers that meet the conditions, and determines them as adjacent temperature zones.

[0047] It should be noted that the temperature zone topology refers to static layout information that only reflects the physical location and connection relationship of each independent temperature zone, and does not include dynamic information such as whether the temperature zone is in operation. For example, if temperature zones W01 and W02 are physically adjacent, this relationship will be fixedly recorded in the topology, regardless of whether they participate in the test. Temperature zones participating in the test are those that are included in the target temperature zone operation set according to the test requirements and need to start the temperature control system. Temperature zones not participating in the test are those that belong to the target temperature zone rest set and are in a shutdown state. Even if they are physically adjacent to the target independent temperature zone, they will not actively start the temperature control system.

[0048] In step S202, the control unit first determines all temperature zones directly adjacent to the target independent temperature zone based on a preset temperature zone topology (which only reflects physical adjacency). This process does not screen whether a temperature zone participates in the test. For example, if the target independent temperature zone is W03, the topology shows that its adjacent temperature zones are W02, W04, and W05. Regardless of whether W02, W04, and W05 are within the scope of this test, they will be initially determined as adjacent temperature zones. However, in the subsequent thermal impact assessment, the control unit will further distinguish whether these adjacent temperature zones belong to the target temperature zone operating set: For adjacent temperature zones participating in the test (such as W02 and W04 in operation), due to their internal active temperature control process, the temperature fluctuation may be large, which will continuously generate dynamic thermal impact on the target temperature zone. Therefore, it is necessary to calculate and compensate for their instantaneous thermal impact in real time through a thermodynamic coupling model; For adjacent temperature zones not participating in the test (such as W05 in shutdown state), their internal temperature will gradually approach the ambient temperature or the initial state, and the heat transfer is relatively stable and the intensity is low. The control unit can evaluate their thermal impact by simplifying the algorithm, or reduce the compensation frequency when their temperature is small compared with the target temperature zone.

[0049] This approach ensures the accuracy of physical adjacency determination and achieves reasonable allocation of compensation resources by dynamically differentiating operating states. It avoids unnecessary high-frequency compensation for adjacent temperature zones in the shutdown state while ensuring precise control of adjacent temperature zones in the operating state.

[0050] S203. Start the temperature control system of the independent temperature zone required for the test according to the test parameter requirements, and at the same time collect the real-time temperature data of the target independent temperature zone and all adjacent temperature zones through the temperature sensor. The independent temperature zone required for testing refers to the specific temperature zone selected for testing according to the test requirements, and its temperature zone number is clearly specified in the test requirements information; the temperature control system refers to the combination of a series of devices in each independent temperature zone component for adjusting and maintaining the internal temperature, including semiconductor cooling chip group, heat dissipation module, air duct system, etc., which can control the internal temperature of the temperature zone according to the set parameters.

[0051] After identifying the target independent temperature zone and its adjacent temperature zones, the temperature control system for the target temperature zone needs to be activated to meet the test parameter requirements, while simultaneously monitoring the temperature of the target temperature zone and all adjacent temperature zones in real time. Specifically, first, the temperature control system for the independent temperature zone required for the test is activated. The control unit first analyzes the test parameter requirements, clarifying the specific control indicators for each target independent temperature zone, such as "temperature zone W01 needs to rise from room temperature to 60°C within 30 minutes and maintain this temperature for 2 hours." Subsequently, the control unit sends a start command to the temperature control system of the corresponding temperature zone, which includes parameters such as the target temperature, time point, and adjustment rate. Upon receiving the command, the temperature control system activates the semiconductor cooling chip group (adjusting the working mode according to the heating or cooling requirements), activates the composite heat dissipation module (ensuring timely heat transfer), and initializes the air duct system (ensuring uniform temperature within the temperature zone). For temperature zones not included in the required test (i.e., the target temperature zone rest set), the control unit sends a shutdown command, placing them in a power-off or low-power state to reduce unnecessary energy consumption and thermal interference.

[0052] Simultaneously, the control unit activates the temperature acquisition mechanism. Multiple temperature sensors distributed within the target independent temperature zone (typically spatially evenly distributed, such as at the four corners and the center) begin operating, continuously monitoring temperature changes within the zone. At the same time, temperature sensors in all temperature zones physically adjacent to the target zone (regardless of whether they are participating in the test) are also activated, acquiring their internal temperatures in real time. The raw signals acquired by these sensors are transmitted to the control unit, where they undergo analog-to-digital conversion and filtering to generate real-time temperature data suitable for subsequent calculations. The control unit stores this data in a temporary database, marking the corresponding temperature zone number and acquisition time for traceability and analysis.

[0053] For adjacent temperature zones participating in the test, their temperatures may dynamically change with the test process, significantly impacting the target temperature zone. For adjacent temperature zones not participating in the test, even when powered off, temperature fluctuations may still occur due to changes in ambient temperature or thermal radiation from the target temperature zone, thus causing static thermal interference. Therefore, when acquiring temperature data, the temperature sensors and thermoelectric cooler arrays of adjacent temperature zones can be activated. If the adjacent temperature zone is not part of the zone to be tested, other components are not activated; only the temperature measurement components are activated, thus saving energy and reducing power consumption.

[0054] In some embodiments, prior to this step, to avoid energy waste or equipment damage caused by the temperature zone activating temperature control without a battery or with an abnormal battery installation, the control unit first determines the numbers of all independent temperature zones in the target temperature zone operating set (such as W01, W03), and then selects to start voltage monitoring via either the channel interface or the auxiliary voltage interface for each temperature zone. If the channel interface is in normal communication mode (which can be verified by sending a test signal in advance), the voltage signal is preferentially acquired via the channel interface, as the channel interface can acquire multiple battery parameters simultaneously, resulting in more comprehensive monitoring. If there is a communication failure in the channel interface (such as a loose interface or a broken line), the monitoring is automatically switched to the auxiliary voltage interface to ensure uninterrupted monitoring.

[0055] The control unit compares the average value of the collected voltage signal with the preset effective voltage range and determines the appropriate state in two ways: First, if the average voltage signal is within the effective voltage range, it indicates that the battery under test is correctly installed on the battery holder plate and the battery can output voltage normally, thus determining that the temperature zone is in place. In this case, the control unit generates a "temperature control system start authorization command" and sends it to the temperature control system of the corresponding temperature zone, authorizing it to start operation according to the test parameters. Simultaneously, the status of the temperature zone is updated on the display to "Battery in place, temperature control to start," for user confirmation. Second, if the average voltage signal is below the lower limit of the effective voltage range, it may be due to the absence of a battery or other reasons; if the average voltage signal is above the upper limit of the effective voltage range, the temperature zone is determined to be out of place. For a temperature zone determined to be out of position, the control unit will immediately execute dual control: first, lock the temperature control system by sending a "prohibit start command" to the temperature control system of that temperature zone; second, generate a warning command, which will include the specific temperature zone number (such as W01) and the cause of the fault (battery no load / abnormal installation). The control unit sends the warning command to the display terminal (temperature adjustment touch screen) through the communication bus. After receiving the command, the display terminal will display the alarm information in the form of a pop-up window or highlighted text, and may also be accompanied by a buzzer sound (if the temperature chamber is equipped) to ensure that the user can notice it in time.

[0056] S204. Input the real-time temperature data of adjacent temperature zones into a preset thermodynamic coupling model to predict the instantaneous thermal effect of each adjacent temperature zone on the target independent temperature zone. The thermodynamic coupling model is obtained in advance by machine learning based on experimental training data. The experimental training data uses the temperature difference and structural parameters of different temperature zone combinations as input samples and the actual measured heat transfer rate as output labels. Among them, the real-time temperature data of adjacent temperature zones refers to the actual temperature value of adjacent temperature zones at the current moment, collected by temperature sensors, including adjacent temperature zones that participated in the test and those that did not; the preset thermodynamic coupling model is a mathematical model trained by machine learning, used to quantify the heat transfer relationship between adjacent temperature zones and the target temperature zone; the instantaneous thermal effect refers to the rate (in watts) of heat transferred from adjacent temperature zones to the target temperature zone due to temperature differences at the current moment, including magnitude and direction (direction of heat transfer); structural parameters refer to parameters describing the physical characteristics of the temperature zones, such as shared boundary area (m²), thermal conductivity of insulation materials (W / (m·K)), power density of semiconductor cooling modules, etc.; the actual measured heat transfer rate refers to the rate (W) of heat transferred from adjacent temperature zones to the target temperature zone, directly measured by equipment such as heat flow meters in the experiment.

[0057] After real-time acquisition of temperature data for the target temperature zone and adjacent temperature zones, the model can predict the instantaneous thermal interference of adjacent temperature zones on the target temperature zone, providing a precise basis for subsequent compensation control. First, the control unit preprocesses the input data. It extracts real-time temperature data for all adjacent temperature zones from the real-time database and combines this data with the real-time temperature data of the target independent temperature zone to calculate the temperature difference between each adjacent temperature zone and the target temperature zone (ΔT = adjacent temperature zone temperature - target temperature zone temperature). Simultaneously, it calls a pre-set structural parameter database to obtain the structural parameters (including the area of ​​shared boundaries, insulation layer thickness, insulation material, etc.) between the target temperature zone and each adjacent temperature zone. This data is converted into a model-recognizable format (such as standardized values) to ensure input consistency.

[0058] Subsequently, the preprocessed temperature difference and structural parameters are input into a thermodynamic coupling model, which is trained using machine learning algorithms (such as artificial neural networks and random forest regression). During model training, multiple experiments are designed, covering different temperature zone combinations (e.g., W01 adjacent to W02, W02 adjacent to W03), different temperature difference ranges (e.g., -50℃ to +50℃), and different structural parameter configurations (e.g., changing insulation materials with different thermal conductivity). For each experiment, the actual heat transfer rate from adjacent temperature zones to the target temperature zone is measured, and the temperature difference and structural parameters are used as input samples, with the heat transfer rate as the output label, to construct a training dataset. Through iterative training, the model learns the nonlinear mapping relationship between input and output, ultimately achieving high prediction accuracy (e.g., error less than 5%). The trained model is then embedded in the control unit for use as a preset model.

[0059] After the model runs, it outputs the instantaneous thermal effect of each adjacent temperature zone on the target independent temperature zone. This result not only includes the magnitude of the heat transfer rate but also implies the transfer direction: when ΔT is positive (the temperature of the adjacent temperature zone is higher than that of the target temperature zone), the instantaneous thermal effect is positive, indicating that heat is transferred from the adjacent temperature zone to the target temperature zone; when ΔT is negative (the temperature of the adjacent temperature zone is lower than that of the target temperature zone), the instantaneous thermal effect is negative, indicating that heat is transferred from the target temperature zone to the adjacent temperature zone.

[0060] It is important to note that the model can effectively predict the thermal impact of adjacent temperature zones, both those involved in and those not involved in the test. For adjacent temperature zones involved in the test, whose temperatures change dynamically with the test process, the model updates its thermal impact predictions in real time based on the real-time temperature difference. For adjacent temperature zones not involved in the test, although their temperatures change more slowly, the model can still predict their stable heat transfer rates based on the static temperature difference and structural parameters. This differentiated approach ensures that adjacent temperature zones are included in the thermal impact assessment regardless of whether they are operational, thus providing comprehensive support for subsequent accurate compensation.

[0061] S205. Based on the instantaneous thermal effect, the semiconductor cooling chip array deployed on the shared boundary between the target independent temperature zone and each adjacent temperature zone is independently driven, so that the semiconductor cooling chip array actively generates a compensating heat flow on the boundary that is equal in magnitude and opposite in direction to the instantaneous thermal effect.

[0062] In this context, instantaneous thermal effect refers to the rate (W) of heat transfer from adjacent temperature zones to the target independent temperature zone, with positive and negative values ​​indicating the direction of heat transfer; independent drive means that the control unit controls the semiconductor refrigeration chip group corresponding to each adjacent temperature zone separately without interference; shared boundary refers to the physical connection surface between the target temperature zone and adjacent temperature zones, which is the main path of heat transfer; semiconductor refrigeration chip group is a device composed of multiple semiconductor refrigeration chips connected in series or parallel, installed on the shared boundary, and achieves cooling or heating through direct current, with the direction and magnitude of its heat flow adjustable by the current.

[0063] After obtaining the instantaneous thermal impact of each adjacent temperature zone on the target temperature zone, the natural heat transfer of adjacent temperature zones is offset by actively regulating the heat flow of the shared boundary, ensuring that the net heat flow of the target temperature zone is zero (or maintained within the allowable range), thereby stabilizing the temperature.

[0064] First, the control unit processes the instantaneous thermal impact of each adjacent temperature zone individually. Since the magnitude and direction of the thermal impact may differ between adjacent temperature zones (e.g., zone A transfers 50W of heat to the target temperature zone, while zone B absorbs 30W of heat from the target temperature zone), control parameters need to be calculated individually for each thermoelectric cooler module sharing a boundary. For each adjacent temperature zone, the control unit determines the operating mode and power of the thermoelectric cooler module based on the magnitude and direction of the instantaneous thermal impact: when the instantaneous thermal impact is positive (heat transfer from the adjacent temperature zone to the target temperature zone), the thermoelectric cooler module needs to operate in "cooling mode" to generate reverse compensating heat flow: the cooler on the target temperature zone side absorbs heat to remove excess heat, while the cooler on the adjacent temperature zone side releases heat to dissipate heat to the adjacent temperature zone. At this time, the control unit calculates the required cooling power (equal to the magnitude of the instantaneous thermal impact) and determines the operating current based on the performance parameters of the thermoelectric cooler module (such as the voltage-current-cooling capacity curve), sending a control signal to the drive circuit.

[0065] When the instantaneous thermal effect is negative (the target temperature zone dissipates heat to the adjacent temperature zone), the thermoelectric cooler module needs to operate in "heating mode": by changing the direction of the current, the cooler on the target temperature zone side releases heat to replenish the lost heat, while the cooler on the adjacent temperature zone side absorbs heat from the adjacent temperature zone. At this time, the control unit calculates the required heating power (equal to the absolute value of the instantaneous thermal effect) and adjusts the operating current to achieve this power.

[0066] Furthermore, the control unit coordinates with the composite heat dissipation module: when the thermoelectric cooler is operating in cooling mode, it increases the fan speed to enhance heat dissipation efficiency; when operating in heating mode, it reduces the fan speed to minimize heat loss. This coordinated control ensures that the thermoelectric cooler always operates at high efficiency, preventing performance degradation due to insufficient heat dissipation.

[0067] In the above embodiment, the control direction is clearly defined by accurately acquiring battery testing requirements. Combined with temperature zone topology, adjacent areas of the target temperature zone are locked. Real-time temperatures of the target and adjacent temperature zones are simultaneously collected to capture the heat transfer source. Then, a thermodynamic coupling model trained by machine learning is used to quantify the instantaneous thermal impact of adjacent temperature zones. Finally, the shared boundary semiconductor cooling array is driven to generate a reverse, equal-sized compensating heat flow to counteract thermal interference. This end-to-end control mechanism effectively solves problems such as target temperature deviation and mutual interference in the testing environment caused by passive heat exchange between adjacent temperature zones in traditional multi-temperature chambers. It achieves active heat insulation and precise temperature control for each independent temperature zone, ensuring the stability of the battery testing temperature zone and improving the accuracy of test results.

[0068] In some embodiments, during the entire battery testing process, especially when there is a large difference between the internal temperature of the chamber and the external ambient temperature, the heat loss of the observation window can be reduced by the double-layer hollow glass structure to ensure the temperature inside the temperature zone is stable (avoiding frequent start-stop of the temperature control system due to heat dissipation from the observation window). The electrothermal anti-condensation film can also be used to prevent condensation on the observation window, ensuring that the user can clearly observe the battery status inside the temperature zone (condensation will obstruct the view and make it impossible to detect battery abnormalities in time). Independent temperature zones can have structural components for opening and closing, typically connected to the temperature zone enclosure by hinges, and have sealing performance (such as with silicone sealing rings) to isolate heat exchange between the inside and outside of the temperature zone, while allowing users to place and remove batteries under test. The enclosure door can have an observation window for users to directly observe the battery testing status inside the temperature zone (such as whether the battery is bulging or leaking liquid), which needs to balance heat insulation and visibility. The observation window has a core heat insulation component, a double-layer hollow glass structure, consisting of two layers of tempered glass and a sealed cavity in between. The inner layer of tempered glass is the layer closest to the inside of the temperature zone in the double-layer hollow glass structure, and it needs to withstand the high and low temperature environment inside the temperature zone. The outer layer of tempered glass is the layer closest to the external environment of the temperature zone, mainly for protection and light transmission, and it is also made of tempered glass. The sealed cavity is an empty area formed by sealing the inner and outer tempered glass with sealant, and it must ensure that there is no air leakage. The hollow region can be filled with a dry inert gas (such as argon or krypton) that has a much lower thermal conductivity than air (for example, the thermal conductivity of argon is about 1 / 3 that of air). This further reduces heat convection and radiation within the cavity. Simultaneously, the inert gas is chemically stable, preventing oxidation of the glass surface. An electrothermal anti-condensation film can be installed on the inner surface of the outer tempered glass (near the cavity). This is a transparent film with electrical heating function, maintaining transparency during heating and not affecting observation.

[0069] The electrothermal anti-condensation membrane can be installed on the inner or outer surface of a double-glazed structure, or in the interlayer between the two layers of glass. It is electrically connected to the control unit of the temperature chamber via wires, allowing the control unit to power and control it. The control unit needs to monitor environmental data inside and outside the temperature chamber in real time. This is typically achieved by installing temperature and humidity sensors inside and outside the temperature chamber, respectively. The internal sensor collects real-time temperature and humidity data inside the temperature chamber, while the external sensor collects real-time temperature and humidity data of the surrounding environment. Based on this real-time data and the dew point temperature calculation formula, the control unit calculates the dew point temperature for the current environment and sets it as the condensation risk threshold. This threshold is a key indicator for determining whether condensation will occur at the observation window. Simultaneously, based on the test parameters required in the battery test requirements, the control unit specifies the target operating temperature that each independent temperature zone needs to reach during the test. This temperature is pre-set according to different battery test items (such as high and low temperature cycling tests, storage tests, etc.).

[0070] Finally, the control unit compares the target operating temperature of each independent temperature zone with the condensation risk threshold. When the target operating temperature is lower than the condensation risk threshold, it indicates that the outer surface temperature of the tempered glass of the observation window may be lower than the dew point temperature, posing a risk of condensation. To prevent condensation from affecting the observation effect and the normal operation of the chamber, the control unit automatically sends a control signal to the electrothermal anti-condensation film to activate it. The electrothermal anti-condensation film generates heat during operation, which is transferred to the outer tempered glass through heat conduction, providing compensatory micro-heating. This ensures that the outer surface temperature of the outer tempered glass remains above the current ambient dew point temperature, effectively preventing water vapor from condensing on the glass surface, maintaining the clarity of the observation window, and allowing operators to easily observe the battery testing status inside the chamber. Even when the temperature inside the chamber is low and the external humidity is high, this method ensures that condensation does not occur on the observation window, guaranteeing the smooth progress of the test.

[0071] In some embodiments, during battery testing, the multi-temperature zone semiconductor chamber can adjust and optimize the internal temperature when uneven temperatures occur within the target independent temperature zones. Specifically, the structure involves: First, the airflow system within each independent temperature zone component is connected to a composite heat dissipation module. This connection allows heat from within the temperature zone to be carried into the composite heat dissipation module via airflow, and then the module dissipates the heat to the outside of the chamber, thereby achieving cooling or temperature maintenance within the temperature zone. The composite heat dissipation module typically combines multiple heat dissipation technologies and can operate efficiently according to different heat dissipation needs. For example, when rapid heat dissipation is required, both air cooling and finned heat dissipation can be activated simultaneously to improve heat dissipation efficiency. Second, the porous flow equalization plate structure in the airflow system is crucial for ensuring uniform airflow distribution. This structure has multiple through-holes. When airflow enters the temperature zone from the airflow duct, it first passes through the porous flow equalization plate. The distribution and size of the through-holes are designed to ensure that the airflow is evenly distributed to all corners of the temperature zone, avoiding localized excessively strong or weak airflow, thus helping to maintain the uniformity of the internal temperature of the temperature zone. For example, in some designs, the perforations of the porous flow equalizer are arranged according to the shape and size of the temperature zone. The density or size of the perforations near the edge of the temperature zone may differ from that in the center to compensate for potential airflow losses in the edge areas. Each porous flow equalizer structure is equipped with an independently controllable electrically adjustable baffle, further enhancing the flexibility and precision of airflow regulation. The electrically adjustable baffle is electrically connected to the control unit, which can individually control the opening degree of each baffle (e.g., fully open, partially open, or closed) according to the temperature distribution within the temperature zone. When the temperature in a certain area of ​​the temperature zone is high, the control unit can control the electrically adjustable baffle of the corresponding perforation to increase its opening, allowing more airflow through that area and accelerating heat dissipation; conversely, when the temperature in a certain area is low, the opening degree of the corresponding baffle can be decreased to reduce the airflow and reduce heat loss. This independent control method makes airflow regulation more precise and can specifically address the problem of uneven temperature within the temperature zone. In addition, an intelligent fan speed control device installed at the air inlet of the duct system is used to control the total airflow entering the duct system. The intelligent fan speed control device can receive control signals from the control unit and adjust the fan speed according to the heat dissipation requirements of the temperature zone.

[0072] The specific adjustment method is as follows: First, real-time temperature distribution data is collected from multiple preset detection points within the target independent temperature zone. These preset detection points are typically distributed in various corners, the center, and near the battery under test within the temperature zone. Temperature sensors located at these positions provide comprehensive and timely temperature information for different areas within the zone. Next, the temperature uniformity index within the target independent temperature zone is calculated based on the collected temperature distribution data. This can be achieved by first calculating the average temperature of all detection points, then calculating the deviation of each detection point's temperature from the average, and finally combining these deviations using a specific formula (such as standard deviation or variance) to obtain the temperature uniformity index. Then, the calculated temperature uniformity index is compared with a preset uniformity threshold. This threshold is determined based on different battery testing requirements and standards. For example, in some high-precision battery tests, the threshold may be set lower to require more uniform temperature.

[0073] When the temperature uniformity index deviates from the preset uniformity threshold, it indicates that the temperature non-uniformity within the target independent temperature zone exceeds the acceptable range, necessitating a compensation step. First, a three-dimensional temperature field model of the temperature zone cavity is generated based on temperature distribution data. This process typically requires computer software, using temperature data from various preset detection points as known points, and employing interpolation and other methods to calculate the temperature at other locations within the temperature zone. This constructs a model that visually displays the temperature distribution within the temperature zone in three-dimensional space, allowing operators to clearly see where the temperature is high, where it is low, and the trend of temperature changes. Based on the constructed three-dimensional temperature field model, the temperature gradient vector between each preset detection point is calculated. The magnitude of the temperature gradient vector represents the rate of temperature change, while its direction points towards the direction of the fastest temperature increase. By calculating these vectors, the specific details and trends of temperature differences within the temperature zone can be clearly identified, providing a basis for subsequent airflow optimization.

[0074] Then, by combining the temperature gradient vector and a pre-defined airflow optimization model, an airflow optimization scheme is determined. The airflow optimization model is trained beforehand using machine learning on a large amount of experimental training data. During training, different temperature gradient vectors are used as input samples, and combinations of fan speed parameters and orifice opening parameters that achieve standard temperature uniformity are used as output labels. Through continuous training and optimization, the model can accurately output the corresponding optimization parameters based on the input temperature gradient vector. Therefore, when the current temperature gradient vector is input, the airflow optimization model outputs an airflow optimization scheme that includes fan speed adjustment parameters and the airflow distribution ratio of each orifice in the perforated flow equalizer.

[0075] Finally, the operating parameters of the air duct system are adjusted according to the airflow optimization scheme. Specifically, the operating speed of the intelligent fan speed control device is changed according to the fan speed adjustment parameters. Simultaneously, the electrically adjustable baffles in the porous flow equalizer structure are adjusted according to the airflow distribution ratio to change the effective cross-sectional area of ​​each through-hole, thereby adjusting the airflow through each through-hole. Through this adjustment, the airflow distribution within the temperature zone can be altered, allowing higher-temperature areas to receive more cooling or less heating, and lower-temperature areas to receive more heating or less cooling. This gradually improves the temperature uniformity within the temperature zone, bringing the temperature uniformity index back to the preset uniformity threshold range, ensuring that battery testing is conducted in a stable and uniform temperature environment.

[0076] The control unit of the multi-temperature zone semiconductor oven in the embodiments of this invention is described below from the perspective of hardware processing. Please refer to [link / reference]. Figure 4 This is a schematic diagram of the physical device structure of the control unit of the multi-temperature zone semiconductor incubator in the embodiments of this application.

[0077] It should be noted that, Figure 4 The structure of the control unit of the multi-temperature zone semiconductor oven shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of the present invention.

[0078] like Figure 4 As shown, the control unit of the multi-zone semiconductor oven includes a central processing unit (CPU) 401, which can perform various appropriate actions and processes according to a program stored in read-only memory (ROM) 402 or a program loaded from storage section 408 into random access memory (RAM) 403, such as performing the methods described in the above embodiments. The RAM 403 also stores various programs and data required for system operation. The CPU 401, ROM 402, and RAM 403 are interconnected via a bus 404. An input / output (I / O) interface 405 is also connected to the bus 404.

[0079] The following components are connected to I / O interface 405: input section 406 including audio input devices, push-button switches, etc.; output section 407 including a liquid crystal display (LCD) and audio output devices, indicator lights, etc.; storage section 408 including a hard disk, etc.; and communication section 409 including a network interface card such as a LAN (Local Area Network) card, modem, etc. Communication section 409 performs communication processing via a network such as the Internet. Drive 410 is also connected to I / O interface 405 as needed. Removable media 411, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., are installed on drive 410 as needed so that computer programs read from them can be installed into storage section 408 as needed.

[0080] In particular, according to embodiments of the present invention, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of the present invention include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing computer programs for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via communication section 409, and / or installed from removable medium 411. When the computer program is executed by central processing unit (CPU) 401, it performs the various functions defined in the present invention.

[0081] It should be noted that specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), flash memory, optical fiber, portable compact disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this invention, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0082] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. Each block in a flowchart or block diagram may represent a module, program segment, or portion of code, which contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those shown in the drawings.

[0083] Specifically, the control unit of the multi-temperature zone semiconductor chamber in this embodiment includes a processor and a memory. The memory stores a computer program. When the computer program is executed by the processor, it implements the multi-temperature zone semiconductor chamber control method provided in the above embodiment.

[0084] In another aspect, the present invention also provides a computer-readable storage medium, which may be included in the control unit of the multi-temperature zone semiconductor oven described in the above embodiments; or it may exist independently and not assembled into the control unit of the multi-temperature zone semiconductor oven. The storage medium carries one or more computer programs, which, when executed by a processor of a control unit of the multi-temperature zone semiconductor oven, cause the control unit of the multi-temperature zone semiconductor oven to implement the multi-temperature zone semiconductor oven control method provided in the above embodiments.

[0085] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0086] As used in the above embodiments, depending on the context, the term "when..." can be interpreted as meaning "if...", "after...", "in response to determining...", or "in response to detecting...". Similarly, depending on the context, the phrase "when determining..." or "if (the stated condition or event) is interpreted as meaning "if determining...", "in response to determining...", "when (the stated condition or event) is detected", or "in response to detecting (the stated condition or event)".

[0087] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A control method for a multi-temperature zone semiconductor oven, applied to the control unit of a multi-temperature zone semiconductor oven, characterized in that, The multi-temperature zone semiconductor chamber includes multiple independent temperature zone components. Each independent temperature zone component has a semiconductor cooling chip assembly, a temperature sensor, a high-efficiency heat insulation structure, and a composite heat dissipation module distributed on its internal sidewall. The method includes: Obtain battery test requirement information, which includes the temperature zone number and test parameter requirements for the independent temperature zone required for testing; Based on the temperature zone number and the preset temperature zone topology, all adjacent temperature zones that are physically directly adjacent to the target independent temperature zone are determined from the multi-temperature zone semiconductor oven. Start the temperature control system of the independent temperature zone required for the test according to the test parameter requirements, and at the same time collect the real-time temperature data of the target independent temperature zone and all adjacent temperature zones through the temperature sensor. Real-time temperature data of adjacent temperature zones are input into a preset thermodynamic coupling model to predict the instantaneous thermal effect of each adjacent temperature zone on the target independent temperature zone. The thermodynamic coupling model is obtained in advance by machine learning based on experimental training data. The experimental training data uses the temperature difference and structural parameters of different temperature zone combinations as input samples and the actual measured heat transfer rate as output labels. The semiconductor cooling chip array, which is independently driven on the boundary between the target independent temperature zone and each adjacent temperature zone, according to the instantaneous thermal effect, so that the semiconductor cooling chip array actively generates a compensating heat flow on the boundary that is equal in magnitude and opposite in direction to the instantaneous thermal effect.

2. The method according to claim 1, characterized in that, The multi-temperature zone semiconductor oven also includes a temperature-adjustable touchscreen and an oven backplate. The oven backplate integrates a power bus and a communication bus, and has multiple standardized slots. Each independent temperature zone component is equipped with a slot-type connector at the rear that precisely matches the slot on the backplate. When the independent temperature zone component is pushed into the slide rail of the oven backplate, the rear connector automatically inserts into the slot on the oven backplate to complete the physical connection. Before the step of obtaining battery test requirement information, the following steps are also included: When a user sends a query command to increase the temperature zone via the temperature control touch screen, the device status query command is sent to all preset physical slot addresses in the back panel of the temperature chamber via the communication bus. If a response is received, the independent temperature zone component corresponding to the address is marked as online, and the corresponding temperature zone number is recorded; If no response is received within the set time, the corresponding address is determined to be in an idle state. The current temperature zone topology is determined based on the online status and temperature zone number.

3. The method according to claim 1, characterized in that, The steps for starting the temperature control system for the required independent temperature zone according to the test parameters specifically include: Determine the target temperature zone operating set based on the independent temperature zones required for testing; The target temperature zone rest set is obtained by subtracting the target temperature zone operating set from the multi-temperature zone semiconductor oven; Start operation according to the test parameter requirements of each temperature zone in the target temperature zone operation set, and at the same time control the temperature zones in the target temperature zone rest set to be in a shutdown state.

4. The method according to claim 1 or 3, characterized in that, Each of the independent temperature zone components is provided with a channel interface, a pull-out handle, an auxiliary interface, and a battery clamp plate. The auxiliary interface includes an auxiliary voltage interface. The battery clamp plate is used to hold the battery under test and summarize the parameters of the battery under test to the channel interface. Before the step of starting the temperature control system of the required independent temperature zone according to the test parameter requirements, the method further includes: The voltage signal of the independent temperature zone connected to the battery clamp plate within the target temperature zone operating set is actively monitored through the channel interface or the auxiliary voltage interface. The presence of a battery under test in the corresponding independent temperature zone is determined based on whether the voltage signal is within a preset effective voltage range. If the system is determined to be in place, the temperature control system is authorized to start. If the system is determined to be out of service, the temperature control system for the corresponding independent temperature zone will be locked and prevented from starting. At the same time, a warning command will be generated based on the corresponding temperature zone number. The warning command will be used to trigger the display terminal to show the temperature zone number and a prompt that the battery is not in service.

5. The method according to claim 1, characterized in that, Each of the independent temperature zone components has an observation window on its door, which includes a double-glazed structure and an electrothermal anti-condensation film. The double-glazed structure consists of an inner tempered glass layer that is in contact with the internal environment of the enclosure and an outer tempered glass layer that is in contact with the external environment. The sealed cavity formed between the inner and outer tempered glass layers is filled with dry inert gas to form an insulation layer, thereby reducing the heat exchange between the inside and outside through the observation window. The electrothermal anti-condensation film is integrated into the surface or interlayer of the double-layer hollow glass structure and is electrically connected to the control unit. The control unit determines the condensation risk threshold based on real-time monitored environmental data inside and outside the incubator; Determine the target operating temperature for each independent temperature zone based on the aforementioned test parameter requirements; When the target operating temperature is lower than the condensation risk threshold, the electrothermal anti-condensation film is automatically activated to perform compensatory micro-heating, so that the outer surface temperature of the outer tempered glass is always maintained above the dew point temperature of the current environment.

6. The method according to claim 1, characterized in that, Each of the independent temperature zone components is internally equipped with a perforated flow equalization plate structure air duct system connected to the composite heat dissipation module. Each perforated flow equalization plate structure is configured with an independently controllable electrically adjustable baffle. The air inlet end of the air duct system is equipped with an intelligent fan speed control device. After the step of inputting the real-time temperature data of adjacent temperature zones into the preset thermodynamic coupling model, the method further includes: Real-time acquisition of temperature distribution data at multiple preset detection points within the target independent temperature zone; The temperature uniformity index within the target independent temperature zone is calculated based on the temperature distribution data, and the temperature uniformity index is compared with a preset uniformity threshold. When the temperature uniformity index deviates from the preset uniformity threshold, the following compensation steps are performed: a three-dimensional temperature field model of the temperature zone cavity is generated based on the temperature distribution data; Based on the three-dimensional temperature field model, the temperature gradient vector between each preset detection point is calculated; Combining the temperature gradient vector and the preset airflow optimization model, an airflow optimization scheme is determined. The airflow optimization model is obtained by machine learning training on multiple experimental training data. The experimental training data includes different temperature gradient vectors as input, and fan speed parameters and through-hole opening parameters that make the temperature uniformity reach the standard as output labels. The airflow optimization scheme includes fan speed adjustment parameters and airflow distribution ratio of each through-hole of the multi-hole flow equalizer. The operating parameters of the air duct system are adjusted according to the airflow optimization scheme.

7. The method according to claim 6, characterized in that, The step of adjusting the operating parameters of the air duct system according to the airflow optimization scheme specifically includes: The operating parameters of the intelligent fan speed control device are adjusted according to the fan speed adjustment parameters. At the same time, the effective cross-sectional area of ​​each through hole is dynamically adjusted by combining the air flow distribution ratio with the electric baffle group set in the porous flow equalization plate structure. The auxiliary heating film components distributed at the four corners of the target independent temperature zone are activated simultaneously, and the heating power of the auxiliary heating film components is adaptively adjusted according to the temperature trough value of the corner area detected in the three-dimensional temperature field model.

8. A control unit for a multi-temperature zone semiconductor incubator, characterized in that, The control unit of the multi-temperature zone semiconductor oven includes: one or more processors and a memory; the memory is coupled to the one or more processors, the memory is used to store computer program code, the computer program code including computer instructions, and the one or more processors call the computer instructions to cause the control unit of the multi-temperature zone semiconductor oven to perform the method as described in any one of claims 1-7.

9. A computer-readable storage medium comprising instructions, characterized in that, When the instruction is executed on the control unit of the multi-temperature zone semiconductor oven, the control unit of the multi-temperature zone semiconductor oven performs the method as described in any one of claims 1-7.

10. A computer program product, characterized in that, When the computer program product is run on the control unit of the multi-zone semiconductor oven, the control unit of the multi-zone semiconductor oven performs the method as described in any one of claims 1-7.

Images