Server device

Abstract

The invention relates to a server device. The server device comprises a machine shell, a supporting frame, a mainboard, an expansion assembly, a liquid cooling assembly and a bus assembly. The machine shell comprises a bottom plate, two side plates and a top plate. The bottom plate and the top plate are connected to the two side plates. A containing space is defined by the bottom plate, the two side plates and the top plate together. The supporting frame is located in the containing space and fixed to the two side plates. The supporting frame is provided with a supporting face dividing the containing space into a lower layer subspace and an upper layer subspace. The mainboard is located in the lower subspace and provided with a heat source. The expansion component is located in the upper subspace. The liquid cooling assembly comprises a water segregator, a cold plate and a first flow pipe. The water segregator is located in the upper layer subspace. The cold plate is thermally coupled to the heat source and communicates with the water segregator through a first flow pipe. The expansion assembly is communicated with the water segregator. The bus assembly is located in the upper layer subspace and electrically connected to the mainboard and the expansion assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of computer equipment, in particular to a server device. BACKGROUND

[0002] In the modern society, most enterprises will use servers to assist in processing business, such as storing programs, files and data, etc., in order to improve the efficiency of work.

[0003] Generally, a plurality of electronic components, such as expansion components, liquid cooling components and bus components, are provided in the server. The server can operate through the electrical connection between these electronic components. However, the current configuration of these electronic components in the server is too complex, which causes inconvenience in assembly. Therefore, how to simplify the configuration in the server to improve the assembly convenience of the server is one of the problems to be solved by the researchers. SUMMARY

[0004] The present application provides a server device to simplify the configuration in the server, thereby improving the operation efficiency and assembly convenience of the server.

[0005] The present application provides a server device, comprising:

[0006] A housing comprising a bottom plate, two side plates and a top plate, the bottom plate and the top plate are respectively connected to the opposite sides of the two side plates, and the bottom plate, the two side plates and the top plate collectively surround a containing space;

[0007] A support frame located in the containing space and fixed to the two side plates, the support frame has a support surface facing the top plate, the extension surface of the support surface divides the containing space into a lower sub-space and an upper sub-space, and the lower sub-space is closer to the bottom plate than the upper sub-space;

[0008] A mainboard located in the lower sub-space and having a plurality of heat sources;

[0009] A plurality of expansion components, at least part of the plurality of expansion components are located in the upper sub-space;

[0010] A liquid cooling component comprising a water distributor, a plurality of cold plates and a plurality of first flow tubes, the water distributor is located in the upper sub-space, the plurality of cold plates are respectively thermally coupled to the plurality of heat sources and are in fluid communication with the water distributor through the plurality of first flow tubes, and the plurality of expansion components are in fluid communication with the water distributor;

[0011] And a bus component, at least part of which is located in the upper sub-space and is electrically connected to the mainboard and the plurality of expansion components.

[0012] In one of the embodiments, at least another portion of the plurality of the expansion components is located in the lower sub-space, and the liquid cooling assembly further comprises a plurality of second flow tubes, and the plurality of the expansion components are in fluid communication with the water distributor through the plurality of the second flow tubes, respectively.

[0013] In one of the embodiments, the server device further comprises a backplane, and the backplane is located in the upper sub-space, and the bus assembly is electrically connected to the motherboard through the backplane.

[0014] In one of the embodiments, the server device further comprises a power supply assembly, and the power supply assembly is located in the upper sub-space and electrically connected to the bus assembly.

[0015] In one of the embodiments, the server device further comprises a hard disk assembly, and the hard disk assembly is located in the lower sub-space and electrically connected to the bus assembly.

[0016] In one of the embodiments, the server device further comprises a data processing assembly, and the data processing assembly is located in the lower sub-space and electrically connected to the bus assembly.

[0017] In one of the embodiments, the server device further comprises an input / output assembly, and the input / output assembly is located in the lower sub-space and electrically connected to the bus assembly.

[0018] In one of the embodiments, the server device further comprises a fan assembly, and the fan assembly is located in the lower sub-space and electrically connected to the bus assembly.

[0019] In one of the embodiments, the height of the casing is 8U.

[0020] In one of the embodiments, the height of the lower sub-space and the height of the upper sub-space are each 4U.

[0021] The server device described above, since the heat dissipation path of the liquid cooling assembly and the power transmission path of the bus assembly span the lower sub-space and the upper sub-space in the casing, and are connected to the electronic components located in the lower sub-space and the upper sub-space, respectively, it is not necessary to additionally install other heat dissipation elements or power transmission elements in the casing to perform complex assembly procedures with the electronic components. In this way, the configuration of the server device can be simplified, and the assembly convenience of the electronic components of the server device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A perspective view of the server device according to the first embodiment of the present application.

[0023] Figure 2 for Figure 1 A front view diagram of the server device.

[0024] Figure 3 for Figure 1 Rear view of the server unit.

[0025] Figure 4 for Figure 1 A cross-sectional view of the server device.

[0026] Figure 5 for Figure 1 Another cross-sectional view of the server device.

[0027] Figure 6 for Figure 1 The top view of the server unit is omitted.

[0028] Figure 7 for Figure 1 A three-dimensional schematic diagram of the server device's expansion components, liquid cooling components, and motherboard.

[0029] Figure 8 for Figure 1 Another three-dimensional schematic diagram of the server device's expansion components, liquid cooling components, and motherboard.

[0030] Figure 9 for Figure 1 A three-dimensional schematic diagram of the server device's expansion components, bus components, adapter boards, and motherboard.

[0031] Figure 10 This is a perspective view of the expansion components, liquid cooling components, and motherboard of the server device according to the second embodiment of the present invention.

[0032] Icon labels:

[0033] 10, 10A, Server unit; 11, Chassis; 111, Base plate; 112, Side plate; 113, Top plate; 12, Support frame; 121, Support surface; 13, Motherboard; 131, Heat source; 14, 14A, Expansion components; 15, 15A, Liquid cooling components; 151, Water distributor; 152, Cold plate; 153, First flow tube; 154A, Second flow tube; 16, Bus components; 17, Adapter board; 18, Power supply components; 19, Hard disk components; 110, Data processing components; 120, Input / output components; 130, Fan components; H1~H3, Height; S, Accommodation space; S1, Lower subspace; S2, Upper subspace. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0040] Please see Figures 1 to 4 . Figure 1 This is a perspective view of the server device according to the first embodiment of the present invention. Figure 2 for Figure 1 A front view diagram of the server device. Figure 3 for Figure 1 Rear view of the server unit. Figure 4 for Figure 1 A cross-sectional view of the server device.

[0041] The server device 10 in this embodiment is, for example, an artificial intelligence server, and is used for large-scale training, speech recognition, image classification, or machine translation. The server device 10 includes a chassis 11, a support frame 12, a motherboard 13, multiple expansion components 14, a liquid cooling component 15, a bus component 16, and an adapter board 17. The height H1 of the chassis 11 is, for example, 8U. The chassis 11 includes a bottom plate 111, two side plates 112, and a top plate 113. The bottom plate 111 and the top plate 113 are respectively connected to opposite sides of the two side plates 112. The bottom plate 111, the two side plates 112, and the top plate 113 together surround an accommodating space S.

[0042] Please refer to the following: Figure 5 and Figure 6 . Figure 5 for Figure 1 Another cross-sectional view of the server device. Figure 6 for Figure 1 The top view of the server unit is omitted.

[0043] A support frame 12 is located in the accommodating space S and is fixed to two side plates 112. The support frame 12 has a support surface 121 facing the top plate 113. The extended surface of the support surface 121 divides the accommodating space S into a lower subspace S1 and an upper subspace S2, thus creating a double-layer structure within the housing 11. The lower subspace S1 is closer to the bottom plate 111 than the upper subspace S2. That is, the upper subspace S2 and the lower subspace S1 are arranged sequentially along the direction of gravity. The height H2 of the lower subspace S1 and the height H3 of the upper subspace S2 are, for example, 4U each. The motherboard 13 is located in the lower subspace S1 and has multiple heat sources 131. These heat sources 131 are, for example, a central processing unit (CPU), but are not limited thereto. These expansion components 14 are, for example, located in the upper subspace S2.

[0044] Please refer to the following: Figure 7 and Figure 8 . Figure 7 for Figure 1 A three-dimensional schematic diagram of the server device's expansion components, liquid cooling components, and motherboard. Figure 8 for Figure 1 Another three-dimensional schematic diagram of the server device's expansion components, liquid cooling components, and motherboard.

[0045] The liquid cooling assembly 15 includes a water distributor 151, multiple cold plates 152, and multiple first flow tubes 153. The water distributor 151 is located in the upper subspace S2. The cold plates 152 are thermally coupled to the heat sources 131 located in the lower subspace S1 and are in fluid communication with the water distributor 151 through the first flow tubes 153, allowing the liquid cooling assembly 15 to dissipate heat from the heat sources 131. Furthermore, the expansion components 14 located in the upper subspace S2 are in fluid communication with the water distributor 151, allowing the liquid cooling assembly 15 to dissipate heat from the expansion components 14. In summary, the heat dissipation path of the liquid cooling assembly 15 spans both the lower subspace S1 and the upper subspace S2, enabling the liquid cooling assembly 15 to dissipate heat from both the heat sources 131 and the expansion components 14.

[0046] Please refer to the following: Figure 9 . Figure 9 for Figure 1This is a perspective view of the server device's expansion components, bus components, adapter board, and motherboard. The bus component 16 is at least partially located in the upper subspace S2, and the adapter board 17 is also located in the upper subspace S2. The bus component 16 is electrically connected to the expansion components 14 located in the upper subspace S2, and electrically connected to the motherboard 13 located in the lower subspace S1 via the adapter board 17. In summary, the power transmission path of the bus component 16 spans both the lower subspace S1 and the upper subspace S2, allowing the bus component 16 to transmit power to both the expansion components 14 and the motherboard 13. The bus component 16, for example, can handle a power consumption of 30 kilowatts (kW).

[0047] In this embodiment, as Figure 3 and Figure 6 As shown, the server device 10 may further include a power supply component 18. The power supply component 18 is located in the upper subspace S2 and is electrically connected to the bus component 16. The power supply component 18 supplies power to the various electronic components within the server device 10. The power supply component 18 has a backup power system, thus improving the reliability of the server device 10's operation.

[0048] In this embodiment, as Figure 2 and Figure 5 As shown, the server device 10 may also include a hard disk assembly 19. The hard disk assembly 19 is located in the lower subspace S1 and is electrically connected to the bus assembly 16. The hard disk assembly 19 is, for example, in the form of a U.2 solid-state drive and is used for storing data.

[0049] In this embodiment, as Figure 2 and Figure 5 As shown, the server device 10 may further include a data processing component 110. The data processing component 110 is located in the lower subspace S1 and is electrically connected to the bus component 16. The data processing component 110 is used to offload the computing load of the central processing unit and to perform data transmission, compression, storage, encryption and analysis.

[0050] In this embodiment, as Figure 2 and Figure 5 As shown, the server device 10 may further include an output / input component 120. The output / input component 120 is located in the lower subspace S1 and is electrically connected to the bus component 16. The output / input component 120 is used to transmit signals between electronic components within the server device 10 and external electronic devices.

[0051] In this embodiment, as Figure 3 and Figure 5As shown, the server device 10 may also include a fan assembly 130. The fan assembly 130 is located in the lower subspace S1 and is electrically connected to the bus assembly 16. The fan assembly 130 is used to generate airflow to dissipate heat from the various electronic components within the server device 10. The fan (not shown) of the fan assembly 130 may be, for example, an 8056 fan.

[0052] In this embodiment, the expansion component 14, power supply component 18, hard disk component 19, data processing component 110, output / input component 120 and fan component 130 are installed in the lower subspace S1 and the upper subspace S2, for example, by quick-release components or screws or other assembly structures, but are not limited thereto.

[0053] In this embodiment, since the heat dissipation path of the liquid cooling component 15 and the power transmission path of the bus component 16 span the lower subspace S1 and the upper subspace S2 within the chassis 11, and are connected to the electronic components located in the lower subspace S1 and the upper subspace S2 respectively, there is no need to install additional heat dissipation components or power transmission components within the chassis 11 for complex assembly procedures with these electronic components. This simplifies the configuration of the server device 10 and improves the ease of assembly of the various electronic components of the server device 10.

[0054] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals representing the same or similar components, and descriptions of identical technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0055] Please see Figure 10 . Figure 10 This is a perspective view of the expansion component, liquid cooling component, and motherboard of the server device according to the second embodiment of the present invention. The difference between the server device 10 of this embodiment and the server device 10A of the first embodiment lies only in the connection structure of the expansion component and the liquid cooling component.

[0056] In detail, in the server device 10A of this embodiment, depending on usage requirements, at least some of these expansion components 14A may be located in the upper subspace S2, and at least another portion of these expansion components 14A may be located in the lower subspace S1. Furthermore, the liquid cooling assembly 15A also includes a plurality of second flow pipes 154A. These expansion components 14A are fluidly connected to the water distributor 151 through these second flow pipes 154A, so that the liquid cooling assembly 15A can dissipate heat from these expansion components 14A located in the lower subspace S1 and the upper subspace S2 respectively.

[0057] According to the server device of the above embodiment, since the heat dissipation path of the liquid cooling component and the power transmission path of the bus component span the lower and upper subspaces within the chassis and are connected to the electronic components located in the lower and upper subspaces respectively, there is no need to install additional heat dissipation or power transmission components within the chassis for complex assembly procedures with these electronic components. This simplifies the configuration of the server device and improves the ease of assembly of the various electronic components.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A server device, characterized in that, include: The housing includes a bottom plate, two side plates and a top plate. The bottom plate and the top plate are respectively connected to opposite sides of the two side plates, and the bottom plate, the two side plates and the top plate together surround an accommodating space. A support frame, located in the accommodating space and fixed to the two side plates, has a support surface facing the top plate, and the extended surface of the support surface divides the accommodating space into a lower subspace and an upper subspace, with the lower subspace being closer to the bottom plate than the upper subspace. The motherboard, located in the lower subspace, has multiple heat sources; Multiple augmentation components, at least some of which are located in the upper subspace; The liquid cooling assembly includes a water distributor, multiple cold plates, and multiple first flow tubes. The water distributor is located in the upper subspace. The multiple cold plates are thermally coupled to multiple heat sources and are in fluid communication with the water distributor through multiple first flow tubes. The multiple expansion components are in fluid communication with the water distributor. as well as The bus component, at least partially located in the upper subspace, is electrically connected to the motherboard and the plurality of expansion components.

2. The server device according to claim 1, characterized in that: At least another portion of the plurality of said expansion components are located in the lower subspace, and the liquid cooling assembly further includes a plurality of second flow tubes, the plurality of said expansion components being fluidly connected to the water distributor through the plurality of second flow tubes.

3. The server device according to claim 1, characterized in that: The server device further includes an adapter board located in the upper subspace, through which the bus component is electrically connected to the motherboard.

4. The server device according to claim 1, characterized in that: The server device also includes a power supply component, which is located in the upper subspace and electrically connected to the bus component.

5. The server device according to claim 1, characterized in that: The server device further includes a hard disk assembly located in the lower subspace and electrically connected to the bus assembly.

6. The server apparatus according to claim 1, characterized in that: The server device further includes a data processing component located in the lower subspace and electrically connected to the bus component.

7. The server apparatus according to claim 1, characterized in that: The server device further includes an output / input component located in the lower subspace and electrically connected to the bus component.

8. The server apparatus according to claim 1, characterized in that: The server device further includes a fan assembly located in the lower subspace and electrically connected to the bus assembly.

9. The server apparatus according to claim 1, characterized in that: The height of the casing is 8U.

10. The server apparatus according to claim 9, characterized in that: The height of the lower subspace and the height of the upper subspace are both 4U.

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