Display module and electronic equipment

Abstract

The embodiment of the invention provides a display module and electronic equipment comprising the display module. Relates to the technical field of display. The electronic device can be thinned. The electronic equipment comprises a display module and a rotating shaft mechanism, wherein the rotating shaft mechanism is arranged on one side, far away from a display surface, of the display module; the rotating shaft mechanism comprises a first door plate, a second door plate and a driving device, and the driving device can drive the first door plate and the second door plate to move oppositely or oppositely and drive the display module to be switched between a flattened state and a closed state; the display module moves from a flattened state to a closed state, the movement of the first door plate is rotation along a first axis, and the movement of the second door plate comprises movement and rotation along a second axis; the first axis and the second axis are both parallel to the bending line. The thickness of the whole machine in the folded state is reduced by changing the motion trail of the first door plate.

Description

[0001] This application is a divisional application. The original application has the application number 202310802775.X and the original application date is June 30, 2023. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and more particularly to a display module and an electronic device comprising the display module. Background Technology

[0003] With the development of human-computer interaction technology, display has become an important element of human-computer interaction. As a result, foldable screen electronic devices have emerged, such as foldable phones.

[0004] As user experience improves, the requirements for foldable electronic devices are becoming increasingly stringent. For example, the non-bending parts need to have high rigidity, the bending parts need to have superior bendability, and the electronic devices need to be thinner.

[0005] When electronic devices are closed, their overall thickness is a major concern for users. While some existing technologies can reduce the thickness of the display module and the casing, the reduction is minimal. Therefore, how to reduce the thickness of foldable electronic devices when closed remains a challenge. Summary of the Invention

[0006] This application provides a display module and an electronic device including the display module, such as a foldable electronic device. The aim is to reduce the thickness of the foldable electronic device in its closed state.

[0007] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0008] In a first aspect, this application provides an electronic device, which may be a foldable electronic device.

[0009] The electronic device includes a display module and a hinge mechanism. The hinge mechanism is located on the side of the display module away from the display surface. The hinge mechanism includes a first door panel, a second door panel, and a driving device. Both the first and second door panels are connected to the driving device, which can drive the first and second door panels to move towards or away from each other, so that the display module switches between a flattened state and a closed state. The display module moves from the flattened state to the closed state. The movement of the first door panel is a rotation along a first axis, and the movement of the second door panel includes both movement and rotation along a second axis. Both the first and second axes are parallel to the bend line.

[0010] In the electronic device involved in this application, the movement of the first door panel is rotation. For example, when the display module is in a closed state, the first door panel can be perpendicular to the middle door panel. The movement of the second door panel includes both rotation and movement. For example, when the display module is in a closed state, the second door panel can be tilted relative to the middle door panel. Compared to the first and second door panels both incorporating rotation and movement, the overall thickness of the device in the folded state can be reduced, and the reduction in thickness is significant.

[0011] In one possible implementation, the second door panel has a first end and a second end opposite to each other; when the display module is in a flattened state, the first door panel and the second door panel are located in a first plane, and the first end of the second door panel is closer to the first door panel than the second end; when the display module is in a closed state, the first door panel is perpendicular to the first plane, and the second end of the second door panel is closer to the first door panel than the first end.

[0012] In one possible implementation, the drive device includes a first gear structure and a second gear structure, the first gear structure meshing with the second gear structure; the first gear structure is connected to a first door panel, and the second gear structure is connected to a second door panel; the transmission ratio between the first gear structure and the second gear structure is less than 1.

[0013] In this application example, a gear meshing transmission mechanism is used to realize the rotation of the first door panel and the second door panel. The transmission ratio between the first gear structure and the second gear structure is less than 1, which can realize that the rotation speed of the first door panel is less than the rotation speed of the second door panel. In the same rotation time, the rotation angle of the first door panel is less than the rotation angle of the second door panel, so that when the first door panel is perpendicular to the middle door panel, the second door panel is tilted relative to the middle door panel.

[0014] In one possible implementation, the first gear structure includes: a first rocker arm and a first gear; one end of the first rocker arm is fixedly connected to the first gear, and the other end is fixedly connected to the first door panel; the second gear structure includes: a second rocker arm, a second gear, and a third gear; one end of the first rocker arm is fixedly connected to the second gear, and the other end is slidably connected to the second door panel; the second gear meshes with the third gear, and the third gear meshes with the first gear; the diameter of the first gear is larger than the diameter of the second gear.

[0015] When the diameter of the first gear is greater than the diameter of the second gear, the rotational speed of the first door panel can be made less than the rotational speed of the second door panel.

[0016] In one possible implementation, the drive unit further includes a sliding structure; the second door panel is slidably connected to the second rocker arm via the sliding structure; the sliding structure includes a groove and a slide rail disposed within the groove, one of which is disposed on the second door panel and the other on the second rocker arm.

[0017] This sliding structure allows the second door panel to move while rotating.

[0018] In one possible implementation, the pivot mechanism further includes a middle door panel, with the first door panel and the second door panel positioned opposite each other on both sides of the middle door panel; when the display module is in a flattened state, the first door panel, the middle door panel, and the second door panel are located in the same plane; when the display module is in a closed state, the first door panel is perpendicular to the middle door panel.

[0019] In one possible implementation, the display module includes a display screen and a support plate disposed on the side of the display screen away from the display surface; a first door panel and a second door panel are disposed on the side of the support plate away from the display screen; and a first perforated structure is provided in the area of ​​the support plate opposite to the second door panel.

[0020] To accommodate the rotation and movement of the second door panel, a first hollow structure is provided in the area of ​​the support plate opposite to the second door panel to ensure that the display module has high bendability.

[0021] In one feasible approach, the area where the support plate is opposite to the first door panel is not provided with a perforated structure.

[0022] In this implementation structure, since the movement of the first door panel is a rotational movement, a hollow structure may not be provided at the position of the support plate corresponding to the first door panel.

[0023] In one feasible approach, a second perforated structure is provided in the area of ​​the support plate opposite to the first door panel; the density of the first perforated structure is greater than the density of the second perforated structure.

[0024] In other structures, a second hollow structure can be provided at the position of the support plate corresponding to the first door panel, and the density of the second hollow structure is less than that of the first hollow structure, so that the second door panel has better bendability than the first door panel, and realizes a composite motion of rotation and movement.

[0025] In one possible implementation, the pivot mechanism further includes a middle door panel, with a first door panel and a second door panel positioned opposite each other on both sides of the middle door panel; a third hollow structure is provided in the area of ​​the support plate opposite the middle door panel; the density of the third hollow structure is greater than the density of the first hollow structure.

[0026] In one possible implementation, the first hollow structure includes: a plurality of slots parallel to the second axis; the plurality of slots includes a first group of slots and a second group of slots, the first group of slots and the second group of slots being arranged in a direction parallel to the second axis; the plurality of slots in the first group of slots and the plurality of slots in the second group of slots are arranged alternately along the direction of the second axis.

[0027] By using multiple slots arranged alternately, the bendability of the display module corresponding to the second door panel can be further improved.

[0028] In one possible implementation, the display module further includes a cover plate disposed on one side of the display surface of the screen. The cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area, and a second bending area. The first bending area connects the first non-bending area and the second non-bending area, and the second bending area connects the second non-bending area and the third non-bending area. Both the first bending area and the second bending area can be bent along a bending line to switch between a flattened state and a closed state. The position of the pivot mechanism corresponds to the first bending area. The thickness of the first non-bending area is not equal to the thickness of the second non-bending area.

[0029] Because the thickness of the first non-bending region in the cover plate is not equal to the thickness of the second non-bending region, the cover plate is designed with an unequal thickness structure. For example, in some scenarios, in order to improve the rigidity of the first non-bending region exposed in the closed state (where the screen can be displayed to the user), the thickness of the first non-bending region is increased. However, due to the unequal thickness design of the cover plate, the bending performance of the first bending region is basically not affected by the increase in the thickness of the first non-bending region.

[0030] The display module provided in this application not only has high rigidity in the non-bending area, but also has excellent bendability in the bending area.

[0031] In one possible implementation, the thickness of the first non-bending region is greater than the thickness of the second non-bending region.

[0032] This results in the thickness of the first non-bent region corresponding to the first non-bent portion in the cover plate being greater than the thickness of the second non-bent region corresponding to the second non-bent portion. That is, in the cover plate structure, the first non-bent region is a thick region, the second non-bent region is a thin region, and the first bending region connecting the first and second non-bent regions is a thin-thickness transition zone.

[0033] In one possible implementation, the cover plate includes a substrate and a first buffer layer, the first buffer layer being closer to the display screen than the substrate; the thickness of the substrate located in the first non-bending region is greater than the thickness of the substrate located in the second non-bending region, and / or; the thickness of the first buffer layer located in the first non-bending region is greater than the thickness of the first buffer layer located in the second non-bending region.

[0034] In some implementations, at least one of the substrate or buffer layer in the cover plate can be designed as a structure with unequal thickness.

[0035] In one feasible manner, the thickness of the first buffer layer located in the first bending region gradually decreases from the first non-bending region to the second non-bending region.

[0036] In one possible implementation, the cover plate includes a second buffer layer, which includes a first portion and a second portion; the first portion of the second buffer layer is located in a first non-bending region, the second portion of the second buffer layer is located in a first bending region, and the elastic modulus of the first portion of the second buffer layer is greater than the elastic modulus of the second portion of the second buffer layer.

[0037] To further improve the bendability of the bending area, the second buffer layer can be designed with a structure having unequal elastic moduli.

[0038] Secondly, this application provides a hinge mechanism for use in a foldable electronic device. The hinge mechanism is disposed on the side of the display module of the electronic device away from the display surface. The hinge mechanism includes a first door panel, a second door panel, and a driving device. Both the first door panel and the second door panel are connected to the driving device. The driving device can drive the first door panel and the second door panel to move towards or away from each other, so that the display module switches between a flattened state and a closed state along the bending line. The display module moves from the flattened state to the closed state. The movement of the first door panel is a rotation along a first axis, and the movement of the second door panel includes movement and rotation along a second axis. Both the first axis and the second axis are parallel to the bending line.

[0039] In the pivot mechanism of this application, the movement of the first door panel is rotation. For example, when the display module is in the closed state, the first door panel can be perpendicular to the middle door panel. The movement of the second door panel includes rotation and movement. For example, when the display module is in the closed state, the second door panel can be tilted relative to the middle door panel. Compared to the first door panel and the second door panel both including rotation and movement, the overall thickness of the device in the folded state can be reduced.

[0040] In one possible implementation, the second door panel has a first end and a second end opposite to each other; when the display module is in a flattened state, the first door panel and the second door panel are located in a first plane, and the first end of the second door panel is closer to the first door panel than the second end; when the display module is in a closed state, the first door panel is perpendicular to the first plane, and the second end of the second door panel is closer to the first door panel than the first end.

[0041] In one possible implementation, the drive device includes a first gear structure and a second gear structure, the first gear structure meshing with the second gear structure; the first gear structure is connected to a first door panel, and the second gear structure is connected to a second door panel; the transmission ratio between the first gear structure and the second gear structure is less than 1.

[0042] In this application example, a gear meshing transmission mechanism is used to realize the rotation of the first door panel and the second door panel. Furthermore, the transmission ratio between the first gear structure and the second gear structure is less than 1, which can make the rotation speed of the first door panel less than the rotation speed of the second door panel.

[0043] In one possible implementation, the first gear structure includes: a first rocker arm and a first gear; one end of the first rocker arm is fixedly connected to the first gear, and the other end is fixedly connected to the first door panel; the second gear structure includes: a second rocker arm, a second gear, and a third gear; one end of the first rocker arm is fixedly connected to the second gear, and the other end is slidably connected to the second door panel; the second gear meshes with the third gear, and the third gear meshes with the first gear; the diameter of the first gear is larger than the diameter of the second gear.

[0044] When the diameter of the first gear is greater than the diameter of the second gear, the rotational speed of the first door panel can be made less than the rotational speed of the second door panel.

[0045] In one possible implementation, the drive unit further includes a sliding structure; the second door panel is slidably connected to the second rocker arm via the sliding structure; the sliding structure includes a groove and a slide rail disposed within the groove, one of which is disposed on the second door panel and the other on the second rocker arm.

[0046] This sliding structure allows the second door panel to move while rotating.

[0047] In one possible implementation, the pivot mechanism further includes a middle door panel, with the first door panel and the second door panel positioned opposite each other on both sides of the middle door panel; the display module is in a flattened state, with the first door panel, the middle door panel, and the second door panel located in the same plane.

[0048] Thirdly, this application provides a display module, which includes a display screen, the display screen including a display area, an edge bending area located at the outer edge of the display area, and a lower frame area connected to the edge bending area, the lower frame area being located on the side of the display area away from the display surface; the display module further includes a base film and an adhesive layer, the base film and the adhesive layer being disposed outside the edge bending area, the base film being connected to the edge bending area through the adhesive layer, or; the display module further includes a reinforcement layer, the reinforcement layer being disposed outside the edge bending area, the reinforcement layer including a printed layer; the outside of the edge bending area is the side of the edge bending area away from the center of the arc-shaped structure.

[0049] In the display module involved in this application, the reinforcement layer disposed on one side of the edge bending area of ​​the display screen includes a base film, and the base film is bonded to the edge bending area by an adhesive layer. That is, this application adopts a bonding process, which, compared with the dispensing coating process, makes it easy to control the thickness of the adhesive layer and achieve a narrow bezel. Alternatively, the reinforcement layer can be made using printing technology, such as inkjet printing technology, which can produce a thinner reinforcement layer to compress the bezel size and achieve a narrow bezel.

[0050] In one feasible approach, the thickness of the reinforcing layer is 1µm-30µm.

[0051] In one possible implementation, the display module further includes a reinforcement layer disposed inside the edge bending region; the inside of the edge bending region is the side of the edge bending region closest to the center of the arc-shaped structure.

[0052] By combining reinforcement and strengthening layers, the strength of the edge bending area can be further improved.

[0053] In one feasible manner, when the display module includes a base film and an adhesive layer, the elastic modulus of the reinforcing layer is less than the elastic modulus of the base film; when the display module includes a reinforcement layer, the elastic modulus of the reinforcing layer is less than the elastic modulus of the reinforcement layer.

[0054] This can prevent the reinforcement layer from affecting the bendability of the edge bending area.

[0055] In one feasible approach, the reinforcing layer is made of at least one of polyurethane, acrylate, silicone, or epoxy resin.

[0056] In one possible implementation, the display module further includes a buffer layer disposed on the side of the base film away from the edge bending region, the buffer layer having an elastic modulus less than that of the base film; or, the buffer layer is disposed on the side of the reinforcing layer away from the edge bending region, the buffer layer having an elastic modulus less than that of the reinforcing layer.

[0057] Using a buffer layer with a low elastic modulus can also ensure the bendability of the edge bending area.

[0058] In one possible implementation, the material of the buffer layer includes at least one of polyurethane, acrylate, or silicone.

[0059] Fourthly, this application provides an electronic device, which includes a display module and a housing. The housing includes a frame disposed on the edge of the display module, and a first filling layer is disposed at the position where the frame is in contact with the display surface of the display module. The frame and the first filling layer are integrally formed.

[0060] In the electronic device provided in this application, since the first filling layer used to fill the space between the frame and the display module is an integrally formed structural component with the frame, there is no fitting tolerance between the frame and the first filling layer in the assembly process compared to assembling the first filling layer separately. In the design, there is no need to reserve fitting tolerance, so the size of the frame can be compressed, and the electronic device can be made thinner and lighter.

[0061] In one feasible approach, the border and the first filler layer are integrally molded injection-molded structural components.

[0062] For example, an integrated frame and first filler layer can be produced using injection molding.

[0063] In one possible implementation, a second filling layer is provided at a position opposite to the side of the display module, and the elastic modulus of the second filling layer is less than that of the frame.

[0064] When using electronic devices, the amount of movement of the display module also needs to be considered. Therefore, there is a clearance between the side of the display module and the frame. In this application example, a second filling layer with a small elastic modulus is set on the frame at a position opposite to the side of the display module. In this way, the second filling layer plays a buffering role, thereby compressing the clearance size between the display module and the frame, so as to compress the overall size of the device.

[0065] In one feasible approach, the second filler layer and the frame are integrally molded, which simplifies the assembly process.

[0066] In one feasible approach, the border and the second filler layer are integrally molded injection-molded structural components.

[0067] Fifthly, this application provides a display module, which includes a display screen, a support plate, and an electromagnetic induction structure. The electromagnetic induction structure is disposed on the support plate, and the support plate carrying the electromagnetic induction structure is disposed on one side of the back of the display screen. The electromagnetic induction structure is closer to the display screen than the support plate. The electromagnetic induction structure includes: a stacked first sensing electrode layer and a second sensing electrode layer, and a first insulating layer. The stacking direction of the first and second sensing electrode layers is consistent with the stacking direction of the display screen and the display cover plate. The first insulating layer is stacked between the first and second sensing electrode layers. In the display module disclosed in this application, the electromagnetic induction structure is directly formed on the support plate. Compared to examples that use adhesive layers to bond the electromagnetic induction structure to the support plate, the adhesive layer can be omitted, reducing the thickness of the display module and improving its bendability. Furthermore, because the electromagnetic induction structure is formed directly on the support plate, its thickness can be reduced from 80μm to 107μm to approximately 5μm. This significantly reduces the overall thickness of the display module, improving its bendability.

[0068] In one possible implementation, the support plate is made of an insulating material; a first sensing electrode layer is disposed on the surface of the support plate; the electromagnetic induction structure further includes a planarization layer disposed on the side of the second sensing electrode layer away from the first insulating layer and covering the second sensing electrode layer; the planarization layer is disposed on the back side of the display screen by an adhesive layer.

[0069] When the support plate is made of insulating material, the first sensing electrode layer is directly stacked on the support plate.

[0070] In one possible implementation, the support plate is made of a conductive material; the electromagnetic induction structure further includes: a second insulating layer and a planarization layer; the second insulating layer is disposed on the surface of the support plate, and the first sensing electrode layer is disposed on the side of the second insulating layer away from the support plate; the planarization layer is disposed on the side of the second sensing electrode layer away from the insulating layer and covers the second sensing electrode layer; the planarization layer is disposed on the back side of the display screen by an adhesive layer.

[0071] In this embodiment, since the support plate is made of conductive material, an insulating layer is provided between the support plate and the first sensing electrode layer to avoid the support plate affecting the sensing electrode.

[0072] In one possible implementation, the display module also includes a back protective layer disposed on the back side of the display screen; the planarization layer is connected to the back protective layer via an adhesive layer.

[0073] Sixthly, this application provides a display module, which includes a display screen, an electromagnetic induction structure, and a support plate. The electromagnetic induction structure is disposed on one side of the back of the display screen, and the support plate is disposed on the side of the electromagnetic induction structure away from the display screen. The electromagnetic induction structure includes: a substrate, a first induction electrode layer, a second induction electrode layer, a first planarization layer, and a second planarization layer. The first induction electrode layer is disposed on one side of the substrate, and the second induction electrode layer is disposed on the other side of the substrate. The first planarization layer covers the first induction electrode layer and is disposed on one side of the support plate through a first adhesive layer. The second planarization layer covers the second induction electrode layer and is connected to the back of the display screen through a second adhesive layer.

[0074] In the display module disclosed in this application, an electromagnetic induction structure is disposed on the back side of the display screen, and the electromagnetic induction structure includes a substrate and induction electrode layers located on opposite sides of the substrate. In this way, compared with existing display modules that include a back protective layer (disposed on the back side of the display screen), this application can omit the back protective layer, thereby reducing the overall thickness of the display module and improving the bendability of the display module.

[0075] In one possible implementation, the substrate material includes at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0076] In a seventh aspect, this application also provides an electronic device, including a housing and a display module as described in any of the above implementations, wherein the display module is disposed on the housing.

[0077] The electronic device provided in this application includes the above-mentioned display module. Therefore, the electronic device provided in this application and the display module of the above-mentioned technical solution can solve the same technical problem and achieve the same expected effect. Attached Figure Description

[0078] FIG. 1 This is a structural diagram of a foldable electronic device; FIG. 2 This is a structural diagram of another type of foldable electronic device; FIG. 3 This is a structural diagram of a display module; FIG. 4A This application provides a schematic diagram of the remote movement trajectory of a door panel in a rotating shaft mechanism. FIG. 4B This is a schematic diagram of a rotating mechanism in which the door panel is flattened, according to an embodiment of this application. FIG. 5 This is a schematic diagram of the remote movement trajectory of a door panel in a rotating shaft mechanism. FIG. 6A and FIG. 6B A structural diagram of the driving device provided in the embodiments of this application; FIG. 7 A structural diagram illustrating the connection relationship between a second door panel and a second rocker arm, provided in an embodiment of this application; FIG. 8 A structural diagram of a support plate provided in an embodiment of this application; FIG. 9 A structural diagram of a hollow structure in a support plate provided in an embodiment of this application; FIG. 10 A structural diagram of a support plate provided in an embodiment of this application; FIG. 11A structural diagram of a support plate provided in an embodiment of this application; FIG. 12 This is a structural diagram of a display module when the display screen is unfolded. FIG. 13 This is a structural diagram of a display module when the display screen is bent. FIG. 14 This is a structural diagram of a display module when the display screen is bent. FIG. 15 A structural diagram of a display module and an enhancement layer provided in an embodiment of this application; FIG. 16 A structural diagram of an enhancement layer provided in an embodiment of this application; FIG. 17 A structural diagram of a display module provided in an embodiment of this application; FIG. 18 A structural diagram of a display module and an enhancement layer provided in an embodiment of this application; FIG. 19 A structural diagram of a display module provided in an embodiment of this application; FIG. 20 A structural diagram of a display module provided in an embodiment of this application; FIG. 21 A structural diagram of a display module provided in an embodiment of this application; FIG. 22 A structural diagram of a display module provided in an embodiment of this application; FIG. 23 A structural diagram of a display module provided in an embodiment of this application; FIG. 24 This is a schematic diagram illustrating the connection relationship between a display module and its housing. FIG. 25 This is a schematic diagram illustrating the connection relationship between a display module and a housing, provided in an embodiment of this application. FIG. 26 This is a schematic diagram illustrating the connection relationship between a display module and a housing, provided in an embodiment of this application. FIG. 27 A structural diagram of a shell provided in an embodiment of this application; FIG. 28 This is a structural diagram of a display module that includes an electromagnetic induction structure. FIG. 29 A structural diagram of a display module including an electromagnetic induction structure is provided in an embodiment of this application; FIG. 30 A structural diagram of an electromagnetic induction structure provided in an embodiment of this application; FIG. 31 A structural diagram of an electromagnetic induction structure provided in an embodiment of this application; FIG. 32 A structural diagram of a display module including an electromagnetic induction structure is provided in an embodiment of this application; FIG. 33 A structural diagram of an electromagnetic induction structure provided in an embodiment of this application; FIG. 34 A structural diagram of an induction electrode for an electromagnetic induction structure provided in an embodiment of this application; FIG. 35 A structural diagram of an induction electrode for an electromagnetic induction structure provided in an embodiment of this application; FIG. 36 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 37 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 38 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 39 A structural diagram of a multi-fold display module in a folded state, provided in an embodiment of this application; FIG. 40 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 41 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 42 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 43 A structural diagram of a multi-fold display module provided in an embodiment of this application; FIG. 44 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application. FIG. 45 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application. FIG. 46 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application. FIG. 47 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application. FIG. 48 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application. FIG. 49This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application. FIG. 50 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 51 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application. FIG. 52 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application. FIG. 53 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application. FIG. 54 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 55 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 56 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 57 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application; FIG. 58 This is a structural diagram of a multi-fold display module in a flattened state, provided as an embodiment of this application. Detailed Implementation

[0079] The specific embodiments involved in this application are described in detail below with reference to the accompanying drawings.

[0080] This application provides an electronic device, which may be a foldable electronic device.

[0081] The electronic device may include mobile phones, tablets, smart wearable products (e.g., smartwatches, smart bracelets), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, and other electronic products with display functions. This application does not impose any special limitations on the specific form of the aforementioned electronic devices with display functions.

[0082] For ease of explanation, the following uses a mobile phone as an example to illustrate the structure of this electronic device.

[0083] FIG. 1A structural diagram of a foldable screen phone is shown, and the example foldable screen phone is a three-screen foldable phone. The three-screen foldable phone may include a first housing 100a, a second housing 100b, and a third housing 100c, as well as a display module 11. The display module 11 may continuously cover the first housing 100a, the second housing 100b, and the third housing 100c. The foldable screen phone may also include a first hinge mechanism and a second hinge mechanism.

[0084] The first housing 100a and the second housing 100b are disposed on both sides of the first rotating shaft mechanism and are respectively connected to the first rotating shaft mechanism. The first rotating shaft mechanism can move so that the first housing 100a and the second housing 100b are folded or unfolded relative to each other, thereby realizing the flattening and closing of the display module 11 disposed on the first housing 100a and the second housing 100b.

[0085] The second housing 100b and the third housing 100c are disposed on both sides of the second rotating shaft mechanism and are respectively connected to the second rotating shaft mechanism. The second rotating shaft mechanism can move so that the second housing 100b and the third housing 100c are folded or unfolded relative to each other, thereby realizing the flattening and closing of the display module 11 disposed on the second housing 100b and the third housing 100c.

[0086] FIG. 2 The diagram shows the structure of a dual-screen foldable phone, which includes a first housing 100a, a second housing 100b, a display module 11, and a hinge mechanism. The display module 11 can continuously cover the first housing 100a and the second housing 100b. The first housing 100a and the second housing 100b are located on both sides of the hinge mechanism and are respectively connected to the hinge mechanism. Under the action of the hinge mechanism, the display module 11 can also be flattened and closed.

[0087] Foldable electronic devices can be unfolded into a flat state, folded into a closed state, or exist in an intermediate state between the two. Foldable electronic devices have at least two states: a flat state and a closed state. In some cases, a third state, an intermediate state between the flat and closed states, may be further included. The intermediate state is not unique; it can be any one or more states between the flat and closed states of the electronic device.

[0088] The above FIG. 1 and FIG. 2 The examples illustrate three-screen and dual-screen foldable electronic devices. The foldable electronic devices described in this application can also be devices with more screens, such as four-screen foldable, five-screen foldable, and other similar devices.

[0089] The demand for thinner electronic devices is becoming increasingly apparent. Several feasible structures are described below, such as reducing bezel size and display module size, to achieve a thinner and lighter overall device. Specific embodiments are shown below.

[0090] In some examples, such as FIG. 3 The display module 11 may include a bracket 111, a display panel 112, and a cover plate 110.

[0091] The support plate 111 and the cover plate 110 are disposed on opposite sides of the display screen 112. The support plate 111 is located on the back side of the display screen 112 and serves as a support structure to support the display screen 112. The cover plate 110 is located on the display surface side of the display screen 112 and is used to protect the display screen 112 and reduce the probability of the display screen 112 being damaged.

[0092] Continue reading FIG. 3 The cover plate 110 may include a display cover plate 113 and a protective layer 114. The display cover plate 113 is disposed on one side of the display surface of the display screen 112, and the protective layer 114 is disposed on the side of the display cover plate 113 away from the display screen 112. Both the display cover plate 113 and the protective layer 114 are light-transmitting. Light transmitted from the display surface of the display screen 112 can pass through the display cover plate 113 and the protective layer 114 and be received by the user.

[0093] In some usage scenarios, when the protective layer 114 is damaged or falls off, the display cover 113 can still protect the display screen 112.

[0094] In this embodiment, the display panel 112 can be a flexible display, and the cover plate 110 can be a flexible structure to meet the folding requirements.

[0095] In the aforementioned foldable electronic devices such as mobile phones, the display screen 112 can be used to display information and provide an interactive interface for the user. In various embodiments of this application, the display screen 112 may be, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MOLED) display screen, a quantum dot light-emitting diode (QLED) display screen, etc.

[0096] The display surface of the display screen 112 in this application embodiment is the side of the display screen 112 used to display images to the user, while the back side of the display screen 112 refers to the side opposite to the display surface of the display screen 112.

[0097] FIG. 3 The image shows that in order to enhance the protection and support strength of the display screen 112, a support plate 111 is provided on one side of the back of the display screen 112. The display screen 112 is to be placed in a folded electronic device. Correspondingly, the support plate 111 also includes a bending area and a non-bending area connected to the bending area.

[0098] like FIG. 4A A pivot mechanism is provided on the side of the support plate 111 away from the display screen 112. The pivot mechanism enables the display module containing the display screen 112 and the support plate 111 to be flattened and closed.

[0099] FIG. 4A The positional relationship between the various door panels of the pivot mechanism and the support plate 111 is shown. In some examples, the pivot mechanism includes a first door panel 202 and a second door panel 203, and the module 11 is shown disposed on one side of the first door panel 202 and the second door panel 203.

[0100] In other examples, such as FIG. 4A The pivot mechanism may also include a middle door panel 201. The first door panel 202 and the second door panel 203 are arranged on opposite sides of the middle door panel 201, and the first door panel 202, the middle door panel 201 and the second door panel 203 support the display module 11.

[0101] To ensure that the overall thickness of the electronic device is small when it is folded.

[0102] In the example provided in this application, the motion trajectories of the first door plate 202 and the second door plate 203 in the rotating shaft mechanism can be... FIG. 4A and FIG. 4B The displayed trajectory path can compress the overall thickness of the device in its folded state.

[0103] exist FIG. 4A and FIG. 4B In the process, the first door panel 202 rotates along the first axis. When the display module is in the closed state, the first door panel 202 moves as follows: FIG. 4A The plane shown is perpendicular to the first plane. This first plane can be the plane where the first door panel 202 and the second door panel 203 are located when the display module is unfolded.

[0104] like FIG. 4A and FIG. 4B The movement of the second door panel 203 includes rotation and movement. For example, in FIG. 4B In the middle, the second door panel 203 can rotate along the second axis, which is parallel to the first axis and parallel to the bending line of the display module.

[0105] In some examples, the second door panel 203 can move in a direction parallel to its own surface.

[0106] In some examples given in this application, when the display module is in a flattened state, the first door panel 202 and the second door panel 203 can be completely in the same plane. In other examples, when the display module is in a flattened state, the first door panel 202 and the second door panel 203 may have a relatively small included angle, such as an angle less than or equal to 2°, which can be regarded as the first door panel and the second door panel being in the same plane.

[0107] like FIG. 4A The second door panel 203 has a first end and a second end opposite to each other. In the flattened state, the first end is closer to the first door panel 202 than the second end. When the display module is in... FIG. 4A In the closed state shown (as indicated by the dashed line), the second end is closer to the first door panel 202 than the first end, and the distance between the first end and the first door panel 202 is greater than the distance between the second end and the first door panel 202.

[0108] When the first door panel 202 and the second door panel 203 are in accordance with FIG. 4A and FIG. 4B When the movement shown is in the indicated motion mode, and the display module is in the closed state, it will display... FIG. 4AThe shape shown can be: the motion trajectory of the part of the display module opposite to the first door panel 202 is a baseball bat trajectory, and the motion trajectory of the part of the display module opposite to the second door panel 203 is a water droplet trajectory.

[0109] In some examples, such as FIG. 5 As shown, the movement trajectories of the first door panel 202 and the second door panel 203 are basically similar, including rotation around their axes and movement. FIG. 5 The display module, which includes a support plate 111 and a display screen 112, can form a nearly symmetrical teardrop shape in the bending area.

[0110] The embodiments shown in this application FIG. 4A and FIG. 4B ,and FIG. 5 In contrast, due to FIG. 4A and FIG. 4B The embodiments of this application change the movement mode of the first door panel 202, thereby reducing the overall thickness of the folded device while achieving the bending of the display module.

[0111] In this application example, the first door panel 202 and the second door panel 203 move toward each other or away from each other under the drive of the driving device, so that the display module switches between a flattened state and a closed state.

[0112] This application provides a feasible driving device that can achieve... FIG. 4A As shown, in the closed state, the first door panel 202 is perpendicular to the first plane, and the second door panel 203 is inclined relative to the first plane.

[0113] like FIG. 6A and FIG. 6B As shown, FIG. 6A and FIG. 6B This is a simplified structural diagram of the driving device provided in the embodiments of this application. FIG. 6A The example hinge mechanism includes a first door panel 202 and a second door panel 203. FIG. 6B The example hinge mechanism includes a first door panel 202, a middle door panel 201, and a second door panel 203.

[0114] FIG. 6A and FIG. 6B The drive device shown includes a first gear structure 30 and a second gear structure 40, which mesh with each other. The first gear structure 30 is connected to the first door panel 202, and the second gear structure 40 is connected to the second door panel 203. The transmission ratio n between the first gear structure and the second gear structure is less than 1.

[0115] The transmission ratio n between the first gear structure and the second gear structure is less than 1. When the rotation time is the same, the rotation angle of the first door panel 202 is less than the rotation angle of the second door panel 203, which can achieve the following: FIG. 4A When perpendicular to the first plane, the second door panel 203 is inclined to the first plane. For example, the transmission ratio n can be from 0.5 to 0.8; in this example, the transmission ratio n is equal to 0.6.

[0116] In some examples, such as FIG. 6A and FIG. 6B The first gear structure 30 includes a first rocker arm 301 and a first gear 302. One end of the first rocker arm 301 is fixedly connected to the first gear 302, and the other end is fixedly connected to the first door panel 202.

[0117] In some configurations, the first rocker arm 301 and the first gear 302 can be integrally formed.

[0118] The first gear 302 can be a complete circular gear structure, with meshing teeth arranged circumferentially; or, the first gear 302 can be like... FIG. 6A and FIG. 6B As shown, a portion of the outer wall surface has meshing teeth to meet rotational requirements.

[0119] In some examples, the second gear structure 40 includes: a second rocker arm 401, a second gear 402 and a third gear 403; one end of the second rocker arm 401 is fixedly connected to the second gear 402, and the other end is slidably connected to the second door panel 203; the second gear 402 meshes with the third gear 403, and the third gear 403 meshes with the first gear 302.

[0120] In some configurations, the second rocker arm 401 and the second gear 402 can be integrally formed.

[0121] The second gear 402 can also be a complete circular gear structure; or, the first gear 302 can be as follows: FIG. 6A As shown, a portion of the outer wall surface has meshing teeth to meet rotational requirements.

[0122] The diameter of the first gear 302 is larger than the diameter of the second gear 402. In some examples of this application, the diameter of the first gear 302 or the second gear 402 can be the pitch circle diameter of the gear.

[0123] Since the diameter of the first gear 302 is larger than the diameter of the second gear 402, based on the inverse relationship between the transmission ratio and the pitch circle diameter, and the direct relationship between the transmission ratio and the rotational speed, it can be determined that when the rotation time is the same, the rotation angle of the first door panel 202 is smaller than the rotation angle of the second door panel 203, thus enabling the first door panel 202 to achieve the following: FIG. 4AWhen the second door panel 203 is perpendicular to the first plane, it is inclined to the first plane.

[0124] like FIG. 6B During the process of the drive device moving the first door panel 202 and the second door panel 203, the middle door panel 201 can remain stationary. When the display module is in a closed state, the bent part of the display module is set in the space enclosed by the first door panel 202, the middle door panel 201 and the second door panel 203.

[0125] like FIG. 6B In other examples, as the driving device moves the first door panel 202 and the second door panel 203, the middle door panel 201 can move away from the display module to make room for the bent display module. The device that moves the middle door panel 201 away from the display module can be a telescopic device, such as a telescopic spring or a telescopic cylinder.

[0126] In this example application, the second door panel 203 can rotate and slide. For example... FIG. 7 , FIG. 7 This application discloses a sliding structure in which the second door panel 203 is slidably connected to the second rocker arm 401. The sliding structure includes a groove 501 and a rail 502. One of the groove 501 and the rail 502 is disposed on the second door panel 203, and the other is disposed on the second rocker arm 401. For example, in FIG. 7 In the middle, the slide groove 501 is set on the second door panel 203, and the slide rail 502 is set on the second rocker arm 401.

[0127] In this embodiment of the application, in order to adapt FIG. 4A and FIG. 4B The trajectory shapes of the first door panel 202 and the second door panel 203 are shown. FIG. 8 This is a partial structural diagram of a support plate 111 provided in an embodiment of this application. A hollow structure 111A is provided at the position of the support plate 111 opposite to the middle door panel 201 (inner R area of ​​the bend), and a hollow structure 111B is provided at the position of the support plate 111 opposite to the second door panel 203 (outer R area of ​​the first bend).

[0128] In some embodiments of this application, the position of the support plate 111 relative to the middle door panel 201 can be: the area where the orthographic projection of the middle door panel 201 is located on the support plate 111 when the display module is in a flattened state, or it can include the area where the orthographic projection is located and some areas outside that area.

[0129] See FIG. 8 The support plate 111, at the position opposite to the first door panel 202, may not have a perforated structure. This type of support plate 111 is applied to... FIG. 4Aand FIG. 4B In the structure shown, the first door panel 202 undergoes rotational motion, while the second door panel 203 undergoes a combined rotational and translational motion. The display module containing the support plate 111 can match this motion trajectory and display... FIG. 4A The shape shown.

[0130] like FIG. 8 The structure of the support plate 111 shown not only ensures the bendability of the inner bending radius, the first outer bending radius, and the second outer bending radius, but also gives the second outer bending radius sufficient flattening stiffness.

[0131] The hollow structure 111B has a variety of structures. FIG. 9 An exemplary hollow structure 111B is provided, comprising multiple slots, each slot extending parallel to the bending line L (which is parallel to the aforementioned first and second axes). The multiple slots can be divided into a first group of slots and a second group of slots adjacent to the first group. The first and second groups of slots are arranged along a direction perpendicular to the bending line L, and both groups contain multiple slots. The multiple slots in the first group and the multiple slots in the second group are arranged alternately. This ensures that the outer R region of the bend not only has sufficient bending performance but also guarantees its flattening stiffness.

[0132] like FIG. 8 As shown, the density of the hollow structure 111A in the inner R region of the bend is greater than the density of the hollow structure 111B in the outer R region of the second bend.

[0133] In some embodiments of this application, the density of the hollow structure can be the ratio of the area occupied by the hollow structure per unit area of ​​the support plate 111. For example, the hollow structure includes multiple slots, and in the inner R region of the bend, the distance between two adjacent slots is smaller than the distance between two adjacent slots in the outer R region of the second bend.

[0134] FIG. 10 It shows FIG. 8 A cross-sectional view. The hollow structure 111A located in the inner R region of the bend penetrates the support plate 111, while the hollow structure 111B located in the outer R region of the second bend does not penetrate the support plate 111. For example, in... FIG. 10 In the middle, the support plate 111 has a first surface and a second surface, the hollow structure 111A extends from the first surface to the second surface, the hollow structure 111B is recessed from the first surface toward the second surface, and there is a gap between the bottom surface of the hollow structure 111B and the second surface.

[0135] In some examples, to improve the bendability of the outer R-zone of the second bend, the first face is closer to the second face. FIG. 4A The center of the arc-shaped structure shown.

[0136] To adapt FIG. 4A The movement trajectories of the first door panel 202 and the second door panel 203. FIG. 11 This application provides another structure for the support plate 111. A hollow structure 111A is provided in the inner R region of the bend, a hollow structure 111B is provided in the outer R region of the second bend, and a hollow structure 111C is provided in the outer R region of the first bend opposite to the first door panel 202. The density of the hollow structure 111C is less than that of the hollow structure 111B, and the hollow structures 111C and 111B are asymmetrically arranged on both sides of the hollow structure 111A.

[0137] In some embodiments of this application, the density of the hollow structure can be the ratio of the area occupied by the hollow structure per unit area of ​​the support plate 111. For example, the hollow structure includes multiple slots, and in the outer R region of the first bend, the distance between two adjacent slots is greater than the distance between two adjacent slots in the outer R region of the second bend.

[0138] In the display module, the display driver integrated circuit (DDIC) and the touch panel integrated circuit (TPIC) are important components of the display touch imaging system. They integrate components such as resistors, regulators, and power transistors, and are responsible for driving the display panel and controlling the drive current.

[0139] FIG. 12 and FIG. 13 One type of package structure for the display driver chip DDIC is shown, and FIG. 13 It is along FIG. 12 The cross-sectional view of the MM direction, this type of packaging structure can be called chip on panel (COP) package.

[0140] like FIG. 12 and FIG. 13 The edge portion of the display screen 112 is bent so that the display screen 112 forms a display area AA and a lower border area CC, as well as an edge bending area BB connecting the display area AA and the lower border area CC.

[0141] FIG. 12 and FIG. 13 The display area AA includes the bent portion and the non-bent portion connected to the bent portion. Both the bent portion and the non-bent portion connected to the bent portion serve as the display area, used to show the image to the user. FIG. 12 and FIG. 13 The edge bend area BB and the bottom border area CC can both be considered as non-display areas.

[0142] The display driver chip 13 is located on the lower bezel area CC, while other electronic components 14, such as touch chip (TPIC), capacitors, resistors, etc., are integrated on the circuit board 12 which is electrically connected to the main circuit board, for example, on a flexible printed circuit (FPC). The circuit board 12 is connected to the lower bezel area CC through an electrical connection structure 16 to realize signal interconnection between the electronic components 14 on the circuit board 12 and the display driver chip 13.

[0143] FIG. 13 When the edge bending area BB of the display screen 112 is bent, the bending radius R gradually decreases (for example, the bending radius R is close to 0.2mm), which increases the stress on the wiring of the display screen 112. Under external impact, it is easy to cause defects such as wiring cracks and breaks.

[0144] To reduce bending stress and increase the strength of the BB portion at the edge bending area, this is intended to prevent cracking during bending, module loading, or overall machine stress. In some examples, such as... FIG. 14 Adhesive layer 15 can be applied by dispensing a piezoelectric ceramic spray valve onto the surface of the edge bending area BB of the display screen 112, the display area AA, and the surface of the lower bezel area CC near the edge bending area BB to form an adhesive layer, thereby adjusting the metal trace layer of the display screen 112 to a stress-neutral layer. In other words, the adhesive layer 15 is used to improve stress distribution and enhance the strength of the edge bending area BB to protect the display module from damage.

[0145] When applying adhesive, a relatively thick adhesive layer of 15 is generally used, for example, see... FIG. 14 The thickness E of adhesive layer 15 reaches approximately 90μm to ensure protective effectiveness, which increases the bezel size of foldable electronic devices. Due to limitations in the dispensing process, there will be significant process tolerances; for example, the tolerance for the thickness E of adhesive layer 15 is ±(20μm-30μm), resulting in uneven thickness of adhesive layer 15. FIG. 14 As shown, the adhesive layer 15 on the side of the display area AA is thicker, while the adhesive layer 15 on the side of the lower bezel area CC is thinner. In order to achieve the protective effect, a thicker adhesive layer 15 is required, which will further increase the bezel size.

[0146] To address the issue of the thick adhesive layer 15 in the above example, which leads to an increased border size, this application provides several embodiments that, while ensuring the strength of the edge bending area BB and achieving the desired protective effect, also allow for a thinner adhesive layer and a narrower border. The achievable structures are described below.

[0147] FIG. 15This is a structural diagram of a display screen 112 in a bent state, as provided in an embodiment of this application. The display screen 112 includes a display area AA, a lower border area CC, and an edge bending area BB connecting the display area AA and the lower border area CC.

[0148] A reinforcement layer 1 is provided on one side of the display surface in the edge bending area BB. For example... FIG. 16 As shown, FIG. 16 This is a structural diagram of the reinforcing layer 1 given in the embodiment of this application. The reinforcing layer 1 includes a base film 110A and an adhesive layer 110B. The base film 110A is bonded to the outside of the edge bending region BB through the adhesive layer 110B. The reinforcing layer 1 can be disposed on the side of the edge bending region BB away from the arc center.

[0149] compared to FIG. 14 , FIG. 15 and FIG. 16 A base film 110A of uniform thickness is attached to one side of the display surface of the edge bending area BB through a bonding process to protect the edge bending area BB.

[0150] FIG. 15 and FIG. 16 As shown in the example, due to the use of a bonding process, the thickness of the reinforcing layer 1 can be effectively controlled while ensuring the strength of the edge bending area BB. This control over the thickness of the edge bending area of ​​the display module allows for the achievement of a narrow bezel.

[0151] In some examples, the elastic modulus of the base film 110A in the reinforcing layer 1 can be 1 GPa-15 GPa. For example, it can be 5 GPa, 6 GPa, 8 GPa, etc.

[0152] The base film 110A can be made of a variety of materials. For example, it can be made of at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0153] In some other examples, the elastic modulus of the adhesive layer 110B in the reinforcing layer 1 may be less than that of the base film 110A. For example, the elastic modulus of the adhesive layer 110B may be 150 MPa - 2 GPa.

[0154] The adhesive layer 110B can be made from a variety of materials. For example, pressure-sensitive adhesives and curing adhesives can be selected.

[0155] The elongation at break of adhesive layer 110B is ≥100%, and the bond strength is ≥5MPa.

[0156] In preparation FIG. 16 When the reinforcing layer 1 is shown, the adhesive layer 110B can be processed onto the base film 110A by means of scraping, roller coating, slot coating, etc.

[0157] The thickness of reinforcing layer 1 can be 10um-90um, for example, 20um-60um. The thickness of base film 110A can be selected from 3um to 50um, for example, 5um to 25um. The thickness of adhesive layer 110B can be selected from 7-87um, for example, 15-55um.

[0158] In feasible process technologies, FIG. 16 The reinforcing layer 1 shown can be pre-applied and then pressed together. For example, it can be pre-pressed onto the surface of the edge bending area BB using a low-pressure head, and then attached using a higher-pressure head (which can be matched with a certain temperature) or a pressurized chamber (which can be matched with a certain temperature).

[0159] When using high-pressure pressing, curing can be performed at a specific temperature using this pressure. For example, curing methods can include UV curing, heat curing, and moisture curing. Alternatively, after high-pressure pressing, the reinforcing layer 1 can be cured by irradiating the area with UV light (the wavelength of the UV light can be 365nm, 395nm, or 405nm, etc.) to achieve cross-linking between the adhesive layer 110B and the display screen, thus meeting the set requirements for curing rate, modulus, and adhesive strength.

[0160] FIG. 17 The example is to FIG. 15 The diagram illustrates the structure of a display screen 112, including the enhancement layer 1, when used in a display module. (See diagram for example.) FIG. 17 In this display module, a functional layer 120 (e.g., a polarizer) and a display cover plate 113 are provided on one side of the display area AA of the display screen 112. The display cover plate 113 is provided on one side of the functional layer 120 by optically transparent adhesive OCA124.

[0161] FIG. 18 This is a structural diagram of another display screen 112 in a bent state, as provided in an embodiment of this application. While ensuring the strength of the edge bending area BB and meeting the protection requirements, a thinner adhesive layer can be achieved, resulting in a narrow bezel.

[0162] exist FIG. 18 In the display screen 12, an enhancement layer 1 is provided on one side of the display surface in the edge bending area BB. For example, the enhancement layer 1 can be produced by printing technology, such as inkjet printing (IJP).

[0163] FIG. 18 The reinforcing layer 1 is made of a material with a relatively high elastic modulus, such as 1 GPa to 15 GPa. For example, the elastic modulus can be greater than or equal to 10 GPa.

[0164] FIG. 18 The reinforcing layer 1 has an elongation at break of ≥20% and an adhesive strength of ≥5MPa.

[0165] When a material with a high elastic modulus is selected and the reinforcing layer 1 is fabricated using the inkjet printing (IJP) method, the thickness of the reinforcing layer 1 can range from 1µm to 30µm. For example, it can be 3µm to 20µm. This significantly reduces the thickness of the reinforcing layer 1, further narrowing the border size.

[0166] FIG. 18 The reinforcing layer 1 in the example can be made of materials such as polyurethane, acrylate, silicone, or epoxy resin.

[0167] In preparation FIG. 18 As shown in the diagram, high-modulus IJP material can be printed using inkjet printing equipment. Then, a curing method (UV curing, heat curing, moisture curing, etc.) can be used to cure the inkjet-printed material. If UV curing is used, the inkjet-printed material can be irradiated with UV light (the wavelength of UV light can be 365nm, 395nm, or 405nm, etc.) to cure it, causing the colloid to cross-link and achieving the set requirements for curing rate, modulus, adhesive strength, and other properties.

[0168] FIG. 19 The example is to FIG. 18 The diagram illustrates the structure of a display screen 112, including the enhancement layer 1, when used in a display module. (See diagram for example.) FIG. 19 In this display module, a functional layer 120 (e.g., a polarizer) and a display cover plate 113 are provided on one side of the display area AA of the display screen 112. The display cover plate 113 is provided on one side of the functional layer 120 by optically transparent adhesive OCA 124. After the edge bending area BB is bent, some film structures are stacked in the area between the display area AA and the lower bezel area CC. For example, the stacked film structures include a support plate 111 and a screen support layer 123. The screen support layer 123 is connected to the display area AA of the display screen 112 through a filling layer 121, and the support plate 111 is connected to the lower bezel area CC of the display screen 112 through a filling layer 122.

[0169] FIG. 20 This is a structural diagram of a display module in a bent state, as provided in an embodiment of this application. While ensuring the strength of the BB (base plate) in the edge bending area and meeting the protection requirements, it also allows for a thinner adhesive layer and a narrower bezel.

[0170] FIG. 20 In the display module 112 shown, not only is an enhancement layer 1 provided on the display surface side of the edge bending area BB, but a reinforcement layer 17 is also provided on the back side of the edge bending area BB.

[0171] exist FIG. 20 In the middle, the reinforcing layer 1 includes a base film 110A and an adhesive layer 110B stacked together. The base film 110A is bonded to the display surface side of the edge bending area BB through the adhesive layer 110B.

[0172] The materials, elastic modulus, and preparation methods that can be selected for the base film 110A and the adhesive layer 110B can be referred to the above. FIG. 15 and FIG. 16 The example shown will not be repeated here.

[0173] FIG. 20 The elastic modulus of the material selected for the reinforcing layer 17 is less than that of the base film 110A. For example, the elastic modulus of the material selected for the reinforcing layer 17 is ≥5MPa. In addition, the elongation at break of the reinforcing layer 17 is ≥100%, and the bond strength is ≥1MPa.

[0174] In this embodiment, by providing a reinforcing layer 17 on the side of the edge bending area BB near the center of the arc structure, the impact resistance of the display module can be improved.

[0175] By combining the reinforcing layer 1 and the strengthening layer 17, the strength of the edge bending area BB can be further improved. Using the strengthening layer 17, which has a low modulus of elasticity, the bendability of the edge bending area BB is essentially unaffected. The strengthening layer 17 is positioned on the side of the display screen 112 near the center of the curved structure, and it does not increase the thickness of the edge bending area BB of the display module, nor does it increase the bezel size.

[0176] The reinforcing layer 17 involved in this application embodiment can be made of materials such as polyurethane, acrylate, silicone resin or epoxy resin.

[0177] In preparation FIG. 20 When the structure shown is used, the above can be adopted. FIG. 16 In the structure shown, how are the base film 110A and the adhesive layer 110B set on one side of the display surface in the edge bending area BB of the display screen 112? FIG. 20 The reinforcement layer 1 is shown.

[0178] Adhesive can be applied to the back side of the edge bending area BB to form the reinforcing layer 17. The amount of adhesive used to form the reinforcing layer 11 can be precisely calculated through the inner arc space, and the amount and filling state of the adhesive can be adjusted. UV delayed curing, UV pre-curing, and moisture-curing methods can be used to cross-link the adhesive and achieve the set requirements for curing rate, modulus, and adhesive strength.

[0179] FIG. 21 This is another structural diagram of a display module in a bent state, as provided in an embodiment of this application. (And the above...) FIG. 20Similarly, while ensuring the strength of the BB layer in the edge bending area and meeting the protection requirements, a thinner adhesive layer can also be achieved to realize a narrow bezel.

[0180] FIG. 21 The structure shown and FIG. 20 The difference in the structure shown is that: FIG. 20 In the display 112, on one side of the display surface in the edge bending area BB, is a reinforcement layer 1 comprising a base film 110A and an adhesive layer 110B. FIG. 21 In the middle, the reinforcing layer 1 is made of a material with a large elastic modulus and is prepared by inkjet printing IJP method.

[0181] FIG. 21 The structure shown and FIG. 20 The structure shown is the same in that: not only is an enhancement layer 1 provided on the display side of the edge bending area BB of the display screen 112, but a reinforcement layer 17 is also provided on the back side of the edge bending area BB.

[0182] FIG. 22 This is a structural diagram of another display module in a bent state, as provided in an embodiment of this application. This embodiment can also achieve a thinner adhesive layer and a narrower bezel.

[0183] like FIG. 22 A reinforcement layer 1 is provided on one side of the display surface in the edge bending area BB of the display screen 112. The reinforcement layer 1 is made of a material with a high elastic modulus and is produced by inkjet printing IJP method. In addition, a buffer layer 18 is provided on the side of the reinforcement layer 1 away from the display screen 112.

[0184] The elastic modulus of the buffer layer 18 is less than that of the base film 110A. For example, the elastic modulus of the base film 110A is 1 GPa-15 GPa; the elastic modulus of the buffer layer 18 is 100 MPa-1000 MPa. In addition, the elongation at break of the buffer layer 18 is ≥100%, and the adhesive strength is ≥5 MPa.

[0185] The thickness of the reinforcing layer 1 can be 1µm-30µm. For example, it can be 3µm-20µm.

[0186] The thickness of the buffer layer 18 can be 1um-50um. For example, it can be 5um-30um.

[0187] In this embodiment, since the reinforcing layer 1 prepared by the inkjet printing IJP method is relatively thin, adding the buffer layer 18 will not widen the border size. Furthermore, the buffer layer 18 and the reinforcing layer 1 prepared by the inkjet printing IJP method can further enhance the strength of the edge bending region BB. The use of the buffer layer 18 with a low elastic modulus can also ensure the bendability of the edge bending region BB.

[0188] The buffer layer 18 can be made of a variety of materials. For example, it can be polyurethane, acrylate, or silicone.

[0189] FIG. 23 This is a structural diagram of another display module in a bent state, as provided in an embodiment of this application. This embodiment can also achieve a thinner adhesive layer and a narrow bezel.

[0190] FIG. 23 The structure shown and FIG. 22 The structure shown is the same as that shown in that: on one side of the display surface of the edge bending area BB of the display screen 112, there is an enhancement layer 1 and a buffer layer 18. The enhancement layer 1 is closer to the display screen 112 than the buffer layer 18.

[0191] FIG. 23 The structure shown and FIG. 22 The structural differences shown include: FIG. 22 In this process, reinforcement layer 1 is fabricated using the inkjet printing IJP method. And... FIG. 23 In the middle, the reinforcing layer 1 includes a base film 110A and an adhesive layer 110B, that is, the adhesive layer 110B, the base film 110A and the buffer layer 18 are stacked sequentially along the direction away from the display screen 112.

[0192] In the feasible process, after the reinforcement layer 1 is formed on the display surface side of the edge bending area BB of the display screen 112, a buffer layer can be formed by dispensing or inkjet printing. The buffer layer can be cured by UV curing, which involves irradiating the adhesive film with UV light (the wavelength of the UV light can be 365nm, 395nm, or 405nm, etc.) to crosslink the adhesive and achieve the set requirements for curing rate, modulus, bonding strength, and other characteristics.

[0193] In preparation FIG. 17 to FIG. 23 When assembling the display module as shown, a functional layer 120 can be first set on one side of the display surface of the display screen 112, for example, a polarizer can be set; then an enhancement layer 1 or a reinforcement layer 17 can be set on the edge bending area BB of the display screen 112; then the display screen 112 can be cut; then a display driver chip DDIC and a touch chip TPIC, as well as a connecting circuit board 12, can be set on the lower bezel area CC of the display screen 112; then other film layer structures can be stacked.

[0194] In foldable electronic devices, such as FIG. 24 As shown, a foam adhesive 20 is provided between the frame 102 (also known as the small A-shell) of the folded housing 100 and the display module 11. The foam adhesive 20 can prevent external moisture from entering the housing 100 and corroding some electronic devices or other structural components inside the housing 100.

[0195] In some examples, foam adhesive 20 is bonded between the frame 102 and the display module 11 via an adhesive. Consideration should be given to the assembly tolerances of the foam adhesive 20, the clearance between the display module 11 and other structural components, and the misalignment of the display module 11 when bent.

[0196] like FIG. 24 As shown, at least the following factors exist: the adhesion tolerance d of the foam adhesive 20 on the frame 102, the distance a between the outer end face of the display module 11 and the frame 102, and the effective overlap width c between the foam adhesive 20 and the display module 11. In some electronic devices, such as mobile phones, a1=1.1mm, c1=0.45mm, d1=0.25mm, so a1+c1+d1=1.8mm, which will make the frame width of the electronic device (e.g., FIG. 24 The S-axis dimension is relatively wide, which reduces the screen-to-body ratio and affects the overall aesthetics of the device.

[0197] To compress the width of the border, embodiments of this application provide some feasible structures, as follows: like FIG. 25 As shown, FIG. 25 This describes the positional relationship between the frame 102, the middle frame 101, the display module 11, and the first filling layer 601 as shown in the embodiments of this application. The frame 102 and the first filling layer 601 are integrally formed structures. For example, the integrally formed frame 102 and the first filling layer 601 can be manufactured by an injection molding process, such as a two-color injection molding process.

[0198] like FIG. 25 A first filling layer 601 is provided at the position where the frame 102 of the housing 100 is attached to the display surface of the display module 11. The first filling layer 601 and the frame 102 are integrally formed structural components.

[0199] In some examples, a first filling layer 601 is provided at the position where the frame 102 of the housing 100 is attached to the display surface of the display module 11. This can be: the frame 102 of the housing 100 has a first surface facing the display surface of the display module 11, and a first filling layer 601 protruding from the first surface is provided at the position of the first surface opposite to the display module 1111.

[0200] For example, the material of the first filler layer 601 can be at least one of silicone or thermoplastic polyurethane (TPU). The material of the frame 102 can be plastic or the like.

[0201] During assembly, since the frame 102 and the first filling layer 601 are integrally formed structures, there will be no issues such as... FIG. 24The fit tolerance d between the frame 102 and the foam adhesive 20 shown is not required during the design process, and the width dimension S of the frame can be compressed.

[0202] To further compress the width S of the border 102, the side S1 of the first fill layer 601 away from the outer edge of the electronic device is flush with the side S2 of the border 102 away from the outer edge of the electronic device. This reduces the width of the border.

[0203] In some embodiments of this application, the fact that side S1 and side S2 are flush can mean that side S1 and side S2 are located on the same plane.

[0204] like FIG. 26 There is a clearance between the display module 11 and the frame 102. When the foldable electronic device is folded, it has a certain amount of movement and rubbing, so that there is a distance a1 between the outer end face of the display module 11 and the frame 102. In order to avoid the display module hitting the middle frame 102 during use, the distance a1 is also relatively large, which is also the main factor leading to the large frame width.

[0205] To reduce the impact of this factor on the border width, such as FIG. 26 , FIG. 26 This illustrates the positional relationship between the frame 102, the middle frame 101, the display module 11, and the first filling layer 601 as shown in this embodiment. The frame 102 has a second filling layer 602 at a position opposite to the side of the display module 11, and the elastic modulus of the second filling layer 602 is less than the elastic modulus of the frame 102.

[0206] The side of the display module 11 in this application example is the side of the display module 11 opposite to the side of the electronic device.

[0207] When display module 11 along FIG. 26 When the device moves in the Q direction, it may collide with the second filler layer 602, which has a smaller elastic modulus. Since the second filler layer 602 has a smaller elastic modulus than the frame 102, it can cushion the display module 11 and reduce the chance of damage to the display module 11.

[0208] It can be reduced FIG. 26 The spacing between the outer end face of the display module 11 and the frame 102 can further compress the width dimension S of the frame.

[0209] The second filler layer 602 and the frame 102 can be a single-piece molded structure. In some optional processes, insert molding (such as two-color injection molding) can be used to produce the single-piece second filler layer 602 and frame 102, which can simplify the assembly process.

[0210] For example, the material of the second filler layer 602 may be selected from at least one of silicone and thermoplastic polyurethanes (TPU).

[0211] See FIG. 24 When a border 102 structure including a first filling layer 601 and a second filling layer 602 is adopted, compared with the above... FIG. 24 The effective overlap width b2 between the first filler layer 202 and the display module 11, and FIG. 26 The effective overlap width c1 between the medium foam adhesive 20 and the display module 11 is 0.45mm. FIG. 26 In the middle, the distance a2 between the outer end face of the first filling layer 601 and the frame 102 is 0.85. FIG. 22 The dimension a2+b2=1.3mm is compared to FIG. 27 The width of one side of the frame 102 can be compressed by 0.3mm to 0.5mm.

[0212] like FIG. 26 When all four sides of the frame 102 adopt the above-mentioned FIG. 28 With the structure shown, the dimensions along the X direction (such as the width of the electronic device) can be compressed by 0.6mm to 1mm, and similarly, the dimensions along the Y direction (such as the length of the electronic device) can also be compressed by 0.6mm to 1mm. This will significantly increase the screen-to-body ratio, enhance the product's sophistication, and improve the user experience.

[0213] Foldable electronic devices are being used in a wider range of scenarios. For example, devices with larger displays are being used in business office work, and the demand for styluses is becoming increasingly strong.

[0214] In some examples, the electromagnetic induction structure can be attached to the display module of the display electronic device. When the electromagnetic pen touches the surface of the display module, the electromagnetic pen emits an electromagnetic signal. The electromagnetic induction structure in the display module senses the electromagnetic signal emitted by the electromagnetic pen and can obtain the position of the electromagnetic pen based on the sensed signal, thereby obtaining the content input by the user through electromagnetic input.

[0215] like FIG. 28 As shown, FIG. 28This diagram illustrates the structure of the display module. The display module 11 includes a display panel 112, a display cover 113, and a back protective layer 116. The display cover 113 is disposed on one side of the display surface of the display panel 112 and is translucent. Light transmitted from the display surface of the display panel 112 can pass through the display cover 113 and be received by the user. The back protective layer 116 is disposed on the back side of the display panel 112 and serves to support and protect the display panel 112. Both the display cover 113 and the back protective layer 116 are connected to the display panel 112 via adhesive layers, forming the core layer structure of the display module.

[0216] FIG. 28 During the fabrication of the display module shown, an independent, plate-shaped electromagnetic induction structure 125 is disposed between the support plate 111 and the back protective layer 116, and is connected to the back protective layer 116 via an adhesive layer 1, and to the support plate 111 via an adhesive layer 2.

[0217] FIG. 29 In the structure shown, the thickness of the electromagnetic induction structure 125 is approximately 80 μm to 107 μm, while the thicknesses of adhesive layer 1 and adhesive layer 2 are 25 μm to 30 μm, respectively. This results in a relatively large overall thickness of the display module, which can reduce the bendability of the display module.

[0218] In order to reduce the thickness of the display module and improve its bendability, embodiments of this application provide some display module structures that include electromagnetic induction structures, as detailed below.

[0219] FIG. 29 This is a schematic diagram of the structure of a display module 11 according to an embodiment of this application. The display module 11 in this example includes a display screen 112, a display cover plate 113, a back protective layer 116, a support plate 111, and an electromagnetic induction structure 125.

[0220] exist FIG. 30 In the middle, the electromagnetic induction structure 125 is disposed on the support plate 111, and the support plate 111 is used as the carrier of the electromagnetic induction structure 125.

[0221] FIG. 31 and FIG. 30 These are two different implementation structures of the electromagnetic induction structure 125 given in the embodiments of this application.

[0222] exist FIG. 30 In this case, when the support plate 111 is made of a conductive material, such as metal, the electromagnetic induction structure 125 includes a first induction electrode layer 1251, a second induction electrode layer 1252, a first insulating layer 1253, and a second insulating layer 1254.

[0223] The first sensing electrode layer 1251 and the second sensing electrode layer 1252 are stacked on one side of the support plate 111. Since the support plate 111 is made of a conductive material, a first insulating layer 1253 is provided between the first sensing electrode layer 1251 and the support plate 111. The first insulating layer 1253 electrically isolates the sensing electrode from the conductive support plate 111, ensuring the working performance of the sensing electrode.

[0224] A first sensing electrode layer 1251 is disposed on the side of the first insulating layer 1253 away from the support plate 111, and is located on the surface of the first insulating layer 1253 away from the support plate 111. A second sensing electrode layer 1252 is stacked on top of the first sensing electrode layer 1252, and the first sensing electrode layer 1251 and the second sensing electrode layer 1252 are electrically isolated from each other by a second insulating layer 1254. The first sensing electrode layer 1251 is covered by the second insulating layer 1254, and the second sensing electrode layer 1252 is disposed on the surface of the second insulating layer 1254.

[0225] like FIG. 30 The electromagnetic induction structure 125 also includes a planarization layer 1255, which covers the second sensing electrode layer 1252. The planarization layer 1255 not only protects the second sensing electrode 1252, but also improves surface flatness and reduces the phenomenon of imprinting on the display module.

[0226] Will FIG. 29 The structure shown is applied in FIG. 29 In the case of the display module 11 shown, in this implementation structure, the support plate 111 carrying the electromagnetic induction structure 125 is connected to other structures of the display module 11 via the adhesive layer 1. For example, a back protective layer 116 is provided on one side of the back of the display screen 112, and the planarization layer 1255 is bonded to the back protective layer 116 via the adhesive layer 1.

[0227] FIG. 30 and FIG. 28 The display module shown is the same as the one mentioned above. FIG. 29 Compared to the displayed display module, the adhesive layer 2, with a thickness of 25μm to 30μm, is omitted. This reduces the overall thickness of the display module.

[0228] Since the electromagnetic induction structure 125 is directly mounted on the support plate 111, the thickness of the electromagnetic induction structure 125 is reduced from... FIG. 29 The thickness of the display module has been reduced from 80μm to 107μm, and further compressed to around 5μm. This significantly reduces the overall thickness of the display module and improves its bendability.

[0229] In feasible process technologies, the following methods can be used to prepare... FIG. 30 and FIG. 31 The display module on display.

[0230] Step 1: Set a first insulating layer 1253 on one side of the support plate 111.

[0231] Step 2: Deposit a first sensing electrode layer 1251 on the side of the first insulating layer 1253 away from the support plate 111. For example, the patterned first sensing electrode layer 1251 can be fabricated by coating etching or printing.

[0232] Step 3: Set a second insulating layer 1254 so that the second insulating layer 1254 covers the first sensing electrode layer 1251.

[0233] Step 4: On the side of the second insulating layer 1254 away from the first sensing electrode layer 1251, a second sensing electrode layer 1252 is formed. For example, a patterned second sensing electrode layer 1252 can be formed by coating etching or printing.

[0234] Step 5: Set a planarization layer 1255 so that the second sensing electrode layer 1252 is covered by the planarization layer 1255.

[0235] Step 6: A stacked display screen 112, display cover 113, and back protective layer 116 are formed.

[0236] Step 7: Connect the support plate 111 carrying the electromagnetic induction structure 125 to the multilayer film structure obtained in step 6. For example, use adhesive layer 1 to bond the back protective layer 116 to the planarization layer 1255.

[0237] like FIG. 31 As shown, FIG. 31 This is another implementation structure of the electromagnetic induction structure given in the embodiments of this application. In this example, the support plate 111 is made of an insulating material, such as carbon fiber.

[0238] Since the support plate 111 in this example is made of insulating material, the electromagnetic induction structure 125 includes a first induction electrode layer 1251, a second induction electrode layer 1252, a second insulating layer 1254, and a planarization layer 1255.

[0239] A first sensing electrode layer 1251 is disposed on the surface of the support plate 111, and a second sensing electrode layer 1252 is stacked on the side of the first sensing electrode layer 1252 away from the support plate 111. The first sensing electrode layer 1251 and the second sensing electrode layer 1252 are electrically isolated from each other by a second insulating layer 1254. The first sensing electrode layer 1251 is covered by the second insulating layer 1254, and the second sensing electrode layer 1252 is disposed on the surface of the second insulating layer 1254.

[0240] Will FIG. 29 The structure shown is applied inFIG. 30 When the display module 11 is shown, in this implementation structure, the support plate 111 carrying the electromagnetic induction structure 125 is connected to other structures of the display module 11 via the adhesive layer 1. For example, a back protective layer 116 is provided on one side of the back of the display screen 112, and the planarization layer 1255 is bonded to the back protective layer 116 via the adhesive layer 1.

[0241] like FIG. 31 and FIG. 28 , with the above FIG. 29 Compared to the displayed display module, the adhesive layer 2, with a thickness of 25μm to 30μm, is omitted. This reduces the overall thickness of the display module.

[0242] Since the electromagnetic induction structure 125 is directly mounted on the support plate 111, an insulating layer is omitted, and the thickness of the electromagnetic induction structure 125 is reduced from... FIG. 29 The thickness of the display module has been reduced from 80μm to 107μm, and further compressed to below 5μm. This significantly reduces the overall thickness of the display module and improves its bendability.

[0243] In feasible process technologies, the following methods can be used to prepare... FIG. 31 and FIG. 32 The display module on display.

[0244] Step 1: Form a first sensing electrode layer 1251 on one side of the support plate 111. For example, the patterned first sensing electrode layer 1251 can be formed by coating etching or printing.

[0245] Step 2: Set a second insulating layer 1254 so that the second insulating layer 1254 covers the first sensing electrode layer 1251.

[0246] Step 3: On the side of the second insulating layer 1254 away from the first sensing electrode layer 1251, a second sensing electrode layer 1252 is formed. For example, a patterned second sensing electrode layer 1252 can be formed by coating etching or printing.

[0247] Step 4: Set a planarization layer 1255 so that the second sensing electrode layer 1252 is covered by the planarization layer 1255.

[0248] Step 5: A stacked display screen 112, display cover 113, and back protective layer 116 are formed.

[0249] Step 6: Connect the support plate 111 carrying the electromagnetic induction structure 125 to the multilayer film structure obtained in step 5. For example, use adhesive layer 1 to bond the back protective layer 116 to the planarization layer 1255.

[0250] To reduce the thickness of the display module and improve its bendability, FIG. 32 This is another structure that can be achieved by the display module as given in the embodiments of this application.

[0251] like FIG. 33 The display module includes a display screen 112 and a display cover 113. The display cover 113 is disposed on one side of the display surface of the display screen 112.

[0252] The display module also includes an electromagnetic induction structure 125, which is disposed on one side of the support plate 111 via an adhesive layer 2 and connected to the display screen 112 via an adhesive layer 3.

[0253] FIG. 32 The demonstration shows what can be applied to FIG. 33 The diagram shows the structure of the electromagnetic induction structure 125. The electromagnetic induction structure 125 includes: a first induction electrode layer 1251, a second induction electrode layer 1252, a substrate 1256, a first planarization layer 1257, and a second planarization layer 1258.

[0254] The first sensing electrode layer 1251 and the second sensing electrode layer 1252 are disposed on opposite sides of the substrate 1256. The first planarization layer 1257 is located on one side of the substrate 1256 and covers the first sensing electrode layer 1251. The second planarization layer 1258 is located on the other side of the substrate 1256 and covers the second sensing electrode layer 1252.

[0255] In some examples, substrate 1256 may be selected from at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0256] Will FIG. 32 The structure shown is applied in FIG. 33 The display module shown is in this configuration. In this structure, the first planarization layer 1257 is connected to the support plate 111 via the adhesive layer 2, and the second planarization layer 1258 is connected to the display screen 112 via the adhesive layer 3.

[0257] like FIG. 32 and FIG. 28 , with the above FIG. 28 Compared to the displayed display module, the back protective layer 116 is omitted because the substrate 1256 in the electromagnetic induction structure 125 has sufficient strength to support and protect the display screen 112. Furthermore, the thickness of the electromagnetic induction structure 125 in this example is 40μm to 60μm, for example, it could be 50μm. Compared to... FIG. 32 The electromagnetic induction structure with a thickness of 80μm to 107μm in the embodiment of this application FIG. 33 and FIG. 28 The display module shown can significantly reduce its thickness, thereby improving its bendability.

[0258] compared to FIG. 32 Furthermore, the adhesive layer 1 can be omitted, which can further reduce the thickness and optimize bending performance.

[0259] In feasible process technologies, the following methods can be used to prepare... FIG. 33 and FIG. 34 The display module on display.

[0260] Step 1: A first sensing electrode layer 1251 and a first planarization layer 1257 are disposed on one side of the substrate 1256, the first planarization layer 1257 covering the first sensing electrode layer 1251; and a second sensing electrode layer 1252 and a second planarization layer 1258 are disposed on the other side of the substrate 1256, the second planarization layer 1258 covering the second sensing electrode layer 1252.

[0261] Step 2: Use adhesive layer 3 to bond the second flat layer 1258 to the display screen 112, and a display cover plate 113 can be provided on one side of the display surface of the display screen 112.

[0262] Step 3: Adhesive layer 2 is used to bond the first planarization layer 1257 to the support plate 111. In the above embodiments, the first electromagnetic induction layer 1251 can be an electrode layer that senses a first direction, such as an electrode layer that senses the X direction, and the second electromagnetic induction layer 1252 can be an electrode layer that senses a second direction, such as an electrode layer that senses the Y direction perpendicular to the X direction.

[0263] like FIG. 35 and FIG. 34 , FIG. 35 The diagram shown is a structural diagram of the first sensing electrode layer 1251. FIG. 36 The diagram shows the structure of the second sensing electrode layer 1252. The electrodes in the first sensing electrode layer 1251 can extend along the X direction, and two adjacent electrodes are connected to form a current loop; the electrodes in the second sensing electrode layer 1252 can extend along the Y direction, and two adjacent electrodes are connected to form a current loop as well.

[0264] Among the selectable materials, the electrodes in the first sensing electrode layer 1251 or the electrodes in the second sensing electrode layer 1252 can be selected from, but are not limited to, at least one of copper, aluminum, iron, tungsten, gold, and silver, or alloy materials.

[0265] The planarization layer can be made of insulating materials, such as organic insulating materials.

[0266] The aforementioned foldable electronic devices demonstrate how to reduce the overall size of the device. To further improve product performance, it is also necessary to enhance the impact resistance and resistance to external damage in non-bending areas, and improve the bendability of bending areas.

[0267] This application provides some display module embodiments that can not only improve the stiffness of the exposed non-bending areas, but also without weakening the bendability of the bending areas.

[0268] FIG. 36 This is a structural diagram of a display module according to an embodiment of this application. The display screen 112 in the display module 11 includes: a first non-bent portion, a second non-bent portion, a third non-bent portion, a first bent portion, and a second bent portion; the first bent portion connects the first non-bent portion and the second non-bent portion, and the second bent portion connects the second non-bent portion and the third non-bent portion.

[0269] The cover plate 110 in the display module 11 includes a first non-bending region, a second non-bending region, and a third non-bending region, a first bending region connecting the first non-bending region and the second non-bending region, and a second bending region connecting the second non-bending region and the third non-bending region.

[0270] The first non-bent portion of the display screen 112 corresponds to the first non-bent area of ​​the cover plate 110, the first bent portion of the display screen 112 corresponds to the first bent area of ​​the cover plate 110, the second non-bent portion of the display screen 112 corresponds to the second non-bent area of ​​the cover plate 110, the second bent portion of the display screen 112 corresponds to the second bent area of ​​the cover plate 110, and the third non-bent portion of the display screen 112 corresponds to the third non-bent area of ​​the cover plate 110.

[0271] The first bending area, the first bending portion, the second bending area, and the second bending portion can all be bent along the bending line to switch between a flattened state and a closed state.

[0272] FIG. 36 Taking a three-screen folding screen as an example, in other examples, it is possible to... FIG. 36 Based on the structure shown, more bending and non-bending areas can be added to form electronic devices such as four-screen folding and five-screen folding.

[0273] like FIG. 37 The thickness of the first non-bending area of ​​the cover plate 110 is d1, and the thickness of the second non-bending area is d2. The thicknesses d1 and d2 are not equal; for example, the thickness d1 can be greater than the thickness d2.

[0274] FIG. 36 This is a structural diagram of another display module provided in an embodiment of this application. And the above... FIG. 38Similarly, the thickness of the first non-bending area of ​​the cover plate 110 is d1, and the thickness of the second non-bending area is d2. The thicknesses d1 and d2 are not equal, with d1 being greater than d2.

[0275] FIG. 36 This is a structural diagram of another display module provided in an embodiment of this application. And the above... FIG. 37 and FIG. 36 Similarly, in cover plate 110, the thickness d1 of the first non-bending region is not equal to the thickness d2 of the second non-bending region, with thickness d1 being greater than thickness d2.

[0276] The thickness dimensions mentioned in the embodiments of this application refer to: such as FIG. 36 The dimensions along the stacking direction (P direction) of multiple film layers.

[0277] FIG. 37 , FIG. 38 and FIG. 36 to FIG. 38 In the three different examples of the module 11 shown, the thickness d4 of the first bent region of the cover plate 110 is not constant, but gradually decreases along the direction away from the first non-bent region, which can be from the first non-bent region to the second non-bent region, so that the thickness d2 is less than the thickness d1.

[0278] like FIG. 36 In the cover plate 110, the first non-bending area is a thick area, the second non-bending area is a thin area, and the first bending area connecting the first non-bending area and the second non-bending area is a thin-thickness transition area.

[0279] FIG. 37 , FIG. 38 and FIG. 36 The differences between the three different examples of module 11 shown include: FIG. 36 In the cover plate 110, the thickness of the second bending region is d5, the thickness of the third non-bending region is d3, and the thicknesses d2, d5, and d3 are equal. The first non-bending region is a thick region, the first bending region is a thickness transition region, and the second non-bending region, the second bending region, and the third non-bending region are thin regions of equal thickness.

[0280] and the above FIG. 37 compared to, FIG. 37 In the example shown, not only is the thickness d4 of the first bent region not a constant value, but the thickness d2 of the second non-bent region is also not a constant value. In some examples, the thickness of the first bent region and the second non-bent region of the cover plate 110 gradually decreases along the direction away from the first non-bent region, which can mask the visual effect of uneven thickness of the entire display module.

[0281] exist FIG. 37In the case of the cover plate 110, the thickness of the second bent area and the third non-bent area are equal. That is, the thickness d5 is equal to the thickness d3.

[0282] exist FIG. 36 In the diagram, the first non-bending region is the thickest region, the first bending region and the second non-bending region are the transitional regions between thick and thin regions, and the second bending region and the third non-bending region are thin regions of equal thickness.

[0283] and the above FIG. 37 and FIG. 38 In comparison, FIG. 39 In this design, not only are the thicknesses of the first bent area and the second non-bent area of ​​the cover plate 110 not constant, but the thicknesses of the second bent area and the third non-bent area of ​​the cover plate 110 are also not constant. Along the direction away from the first non-bent area, the thicknesses of the first bent area, the second non-bent area, the second bent area, and the third non-bent area of ​​the cover plate 110 gradually decrease. This further masks the visual effect of uneven thickness across the entire display module.

[0284] FIG. 36 It is FIG. 36 to FIG. 38 The present application provides a structural diagram of the display module 11 after bending. The thickness of the exposed (visible to the user when folded) first non-bending area is greater than the thickness of the non-exposed (invisible to the user when folded) second non-bending area. The first bending area connected to the exposed first non-bending area is designed with an unequal thickness structure. Even if the thickness of the first non-bending area is increased to improve its rigidity and strength, it will not affect the bendability of the bending area. Nor will it increase the thickness of other areas, so the overall thickness will not be significantly increased when the device is in a folded state.

[0285] In some examples, the above FIG. 39 The example's folded area can form an inward fold, or it can form an outward fold. For example, FIG. 40 As shown in the folded configuration, the first folded area forms an outward folded area, and the second folded area forms an inward folded area. The first non-folded area is exposed and visible to the user, while the second and third non-folded areas are opposite and not visible to the user.

[0286] like FIG. 40 , FIG. 40 This is a structural diagram of a display module according to an embodiment of this application. The thickness of the display cover plate 113 located in the first non-bending region is greater than the thickness located in the second non-bending region. Along the direction away from the first non-bending region, the thickness of the display cover plate 113 located in the first bending region gradually decreases.

[0287] exist FIG. 40 In this process, the thickness of the protective layer 114 is equal in all bending areas and in all non-bending areas.

[0288] FIG. 41 This is a structural diagram of another display module provided in the embodiments of this application. In this structure, the thickness of the protective layer 114 located in the first non-bending region is greater than the thickness located in the second non-bending region, and the thickness of the protective layer 114 located in the first bending region gradually decreases along the direction away from the first non-bending region.

[0289] exist FIG. 42 In the middle, it is shown that the thickness of the cover plate 113 is equal in each bending area and each non-bending area.

[0290] FIG. 41 This is a structural diagram of another display module provided in an embodiment of this application. And the above... FIG. 43 In contrast, in this structure, along the direction away from the first non-bending region, the thickness of the first bending region and the thickness of the second non-bending region in the protective layer 114 gradually decrease, thus widening the thickness transition area of ​​the protective layer 114.

[0291] FIG. 41 This is a structural diagram of another display module provided in an embodiment of this application. (And the above...) FIG. 42 and FIG. 41 to FIG. 43 In contrast, in this example, in the protective layer 114, the thicknesses of the first bent region, the second non-bent region, the third non-bent region, and the third non-bent region gradually decrease along the direction away from the first non-bent region. This further widens the thickness transition area of ​​the protective layer 114.

[0292] The above FIG. 41 to FIG. 43 In this example, the protective layer 114 is designed with an uneven thickness structure. In other examples, the uneven thickness transition zone can be set in other film layer structures, for example, in the display cover plate 113. FIG. 44 The structure shown.

[0293] Some examples provided in this application, such as FIG. 44 The display cover 113 or protective layer 114 may include: substrate 11D and buffer layer 11B.

[0294] The substrate 11D and the buffer layer 11B can be connected by an adhesive layer 11C, and an adhesive layer 11A connects these stacked film structures to other layer structures. In some examples, when FIG. 44 When the protective layer 114 is shown, the structure including the substrate 11D, the adhesive layer 11C and the buffer layer 11B can be connected to the display cover plate 113 using the adhesive layer 11A.

[0295] Among the available materials, the substrate 11D can be selected from at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0296] In some examples, the buffer layer 11B is an elastomer film material, and the elastic modulus of the buffer layer 11B is less than that of the substrate 11D. The buffer layer 11B can be selected from at least one of the following elastomer film materials: thermoplastic polyurethane elastomer (TPU), thermoplastic polyamide elastomer (TPAE), etc.

[0297] The adhesive layers 11A and 11C can be selected from at least one of the following: optically clear adhesive (OCA), optically clear resin (OCR), acrylic resin, epoxy resin, etc.

[0298] See FIG. 44 In this embodiment, the buffer layer 11B located in the first bending region is designed with an unequal thickness structure. Along the direction away from the first non-bending region, the thickness of the buffer layer 11B located in the first bending region gradually decreases, making the protective layer 114 or the display cover plate 113 located in the first bending region a transition zone of thickness.

[0299] exist FIG. 45 In this process, the thickness of substrate 11D can be from 25 μm to 75 μm. The thicknesses of adhesive layer 11A and adhesive layer 11C can be from 25 μm to 50 μm.

[0300] The thickness of the buffer layer 11B located in the first non-bending region is 75 μm to 150 μm, and the thickness of the buffer layer 11B located in the second non-bending region, the second bending region, and the third non-bending region is 25 μm to 75 μm.

[0301] FIG. 46 This is a structural diagram of another display cover plate 113 or protective layer 114 provided in an embodiment of this application. In this example, the substrate 11D located in the first bending region is designed with an uneven thickness structure. Along the direction away from the first non-bending region, the thickness of the substrate 11D located in the first bending region gradually decreases, making the protective layer 114 or display cover plate 113 located in the first bending region a thickness transition zone.

[0302] FIG. 44 This is a structural diagram of another display cover 113 or protective layer 114 provided in an embodiment of this application. (The above...) FIG. 47In contrast, not only is the buffer layer 11B located in the first bending region designed with an uneven thickness structure, but the buffer layer 11B located in the second non-bending region is also designed with an uneven thickness structure. This is to reduce the visual effect of uneven thickness of the entire display module.

[0303] FIG. 47 This application provides a structural diagram of another display cover plate 113 or protective layer 114. In some examples, the thickness of the buffer layer 11B is relatively large, for example, reaching 100 μm. Due to the thickness of the buffer layer, the strain generated on the upper and lower surfaces of the film material when the display module is bent is more likely to enter the plastic deformation stage.

[0304] When the display module is bent, it enters a plastic deformation stage to reduce the strain generated on the upper and lower surfaces of the display module, thereby improving its bendability. In some examples, such as... FIG. 47 The buffer layer 11B includes a first buffer layer 11B1 and a second buffer layer 11B2. The first buffer layer 11B has a uniform thickness, while the second buffer layer 11B2, located in the first bending region, is designed with a non-uniform thickness. The non-uniformly thick second buffer layer 11B2 is located further away from the display screen than the uniformly thick first buffer layer 11B1, meaning it is closer to the interface visible to the user. In other examples, the uniformly thick first buffer layer 11B1 may also be closer to the interface visible to the user than the non-uniformly thick second buffer layer 11B2.

[0305] See FIG. 48 The first buffer layer 11B1 is connected to the second buffer layer 11B2 through the adhesive layer 11E, and the second buffer layer 11B2 is connected to the substrate 11D through the adhesive layer 11C.

[0306] FIG. 48 This is a structural diagram of another display cover plate 113 or protective layer 114 provided in the embodiments of this application. In some optional processes, a coating process can be used to bond the buffer layer 11B to the substrate 11D. The adhesive layer used to connect the buffer layer 11B and the substrate 11D can be removed, reducing the overall thickness of the display module without weakening the rigidity of the non-bending area or the bendability of the bending area.

[0307] FIG. 48 The material of the buffer layer 11B in the example can be at least one of the following: thermoplastic polyurethane elastomer, silicone gel, and shear thickening material.

[0308] See FIG. 49 In this example, the buffer layer 11B located in the first bending region is designed as a structure with unequal thickness, while the thickness of each region of the substrate 11D is equal.

[0309] FIG. 49This is a structural diagram of another display cover plate 113 or protective layer 114 provided in the embodiments of this application. In some optional processes, a coating process can also be used to bond the buffer layer 11B to the substrate 11D. In this example, the buffer layer 11B can be made of an adhesive material, such as optically transparent adhesive (OCA). This buffer layer 11B is not only an elastomer film material, but also has a connecting function, eliminating the need for an adhesive layer 11A. This can further reduce the thickness of the display module.

[0310] See FIG. 50 In this example, the buffer layer 11B located in the first bending region is designed as a structure with unequal thickness, while the thickness of each region of the substrate 11D is equal.

[0311] To improve the stiffness of the exposed non-bending regions without compromising the bendability of the bending regions, embodiments of this application also provide some feasible structures, as follows: FIG. 50 This is a structural diagram of a display module according to an embodiment of this application. In the cover plate 110 of the display module 11, the elastic modulus of the first non-bending region is greater than that of the first bending region. The cover plate 110 includes a hard region with a larger elastic modulus and a soft region with a smaller elastic modulus.

[0312] In some examples, when the cover plate 110 includes a display cover or a protective layer, hard and soft areas can be provided in at least one of the display cover and the protective layer. For example, FIG. 51 This is a structural diagram of a display cover plate 113 or protective layer 114 provided in an embodiment of this application. It includes a substrate 11D and a buffer layer 11B, which are connected by an adhesive layer 11C.

[0313] like FIG. 51 The buffer layer 11B includes a hard region 11B01 (also called the first part) and a soft region 11B02 (also called the second part). The elastic modulus of the hard region 11B01 is greater than that of the soft region 11B02. The hard region 11B01 is located in the first non-bending region, and the soft region 11B02 may be located in at least one of the first bending region and the second bending region.

[0314] exist FIG. 51 In this structure, the hard region 11B01 and the soft region 11B02 are a single, interconnected structure. In some optional process steps, a buffer layer material can be coated onto the substrate first, and then cured in sections by UV (ultraviolet light) to obtain buffer materials with different hardnesses. In other optional process steps, the buffer layer material can be heated in sections to obtain portions with different elastic moduli, thus creating hard and soft regions.

[0315] The buffer layer 11B is divided into a hard region 11B01 and a soft region 11B02 with different elastic moduli. The hard region 11B01 is located in the first non-bending region, which can improve the stiffness of the first non-bending region. The soft region 11B02 with a smaller elastic modulus is located in the bending region to ensure that the bending region has better bendability.

[0316] exist FIG. 52 In the middle, the elastic modulus of the buffer layer 11B (which can be called the third part) located in the second non-bending region and the third non-bending region can be less than the elastic modulus of the hard region 11B01 and greater than the elastic modulus of the soft region 11B02.

[0317] In some examples, in order to improve the stiffness of the second and third non-bending regions, the elastic modulus of the buffer layer 11B located in the second and third non-bending regions can be equal to the elastic modulus of the hard region 11B01.

[0318] When the elastic modulus of the buffer layer 11B located in the second and third non-bending regions is less than the elastic modulus of the hard region 11B01 but greater than the elastic modulus of the soft region 11B02, a buffer material can be coated first, at which point its modulus is lower. Then, it can be cross-linked by local UV curing or heating. By controlling the UV energy or heating temperature, a portion with a lower modulus and a portion with a higher modulus can be obtained.

[0319] FIG. 52 This is a structural diagram of another display cover plate 113 or protective layer 114 provided in the embodiments of this application. It includes a substrate 11D and a buffer layer 11B, which are connected by an adhesive layer 11C.

[0320] In this example, the buffer layer 11B includes a hard portion 11B11 with a higher elastic modulus and a soft portion 11B12 with a lower elastic modulus, which are joined together. The hard portion 11B11 is located in a first non-bending region, and the soft portion 11B12 is located in at least one of the first bending region and the second bending region.

[0321] In some examples, such as FIG. 52 The hard part 11B11 and the soft part 11B12 can be joined together using an adhesive layer 11B13. For example, when an adhesive layer 11C is applied to one side of the buffer layer 11B, the adhesive can overflow into the gap between the hard part and the soft part, thereby bonding the hard part and the soft part together.

[0322] See FIG. 52In order to improve the stiffness of the second and third non-bending regions, the elastic modulus of the buffer layer 11B located in the second and third non-bending regions can be equal to the elastic modulus of the hard part.

[0323] In other examples, the elastic modulus of the buffer layer 11B located in the second and third non-bending regions can be less than the elastic modulus of the hard portion and greater than the elastic modulus of the soft portion.

[0324] exist FIG. 53 In the example, the rigid portion 11B11 can be made of at least one of the following materials: polyethylene terephthalate (PET), transparent polyimide (CPI), etc. The soft portion 11B12 can be made of at least one of the following materials: thermoplastic polyurethane elastomer (TPU), thermoplastic polyamide elastomer (TPAE), etc.

[0325] FIG. 54 This is a structural diagram of another display cover 113 or protective layer 114 provided in an embodiment of this application. The buffer layer 11B includes a first buffer layer 11B1 and a second buffer layer 11B2. The first buffer layer 11B1 includes a hard region 11B01 with a larger elastic modulus and a soft region 11B02 with a smaller elastic modulus. In the second buffer layer 11B2, the portion located in the first bending region has a unequal thickness structure. This embodiment combines the unequal thickness design and unequal elastic modulus design of the buffer layer.

[0326] When the display module is in a folded state and the first non-bent area is exposed, the first bending area connecting the first and second non-bent areas needs to have sufficient resistance to external impacts. For example, when a folded electronic device is dropped, the first bending area may be damaged by the impact of the hinge mechanism on one side and the ground.

[0327] This application provides some novel display modules 11, such as... FIG. 55 A buffer pad 127 is provided on the side of the support plate 111 away from the display screen 112. The buffer pad 127 is located on the support plate 111 at a position opposite to the first bending area.

[0328] In some examples, in order to improve the bendability of the support plate 111, a hollow structure 111a (which can be called a bamboo book) is provided in the part opposite to the first bending area, and a buffer pad 127 is provided at the position opposite to the hollow structure 111a.

[0329] The cushioning pad 127 can be a single membrane structure or a multi-layer membrane structure.

[0330] For example, the cushioning pad 127 can be selected from at least one of the following materials: stainless steel (SUS), thermoplastic polyurethane elastomer (TPU elastomer), porous foam material, PET film material, etc.

[0331] FIG. 56 This is a structural diagram of another display module provided in an embodiment of this application. In this embodiment, the buffer pad 127 is disposed within the support plate 111. For example, a groove can be formed in the support plate 111, and the buffer pad 127 can be disposed within the groove, which is located at a position opposite to the first bending area.

[0332] FIG. 54 to FIG. 56 This is a structural diagram of another display module provided in an embodiment of this application. In this embodiment, the buffer pad 127 is disposed on the rotating shaft mechanism 200 located on one side of the display module.

[0333] like FIG. 57 Because it includes a buffer pad 127, when the first bending area is subjected to an external impact, the buffer pad 127 can reduce the degree of damage to the display module.

[0334] FIG. 58 This is a structural diagram of another display module provided in an embodiment of this application. In this structure, not only is the display cover plate 113 located in the first bending area designed with an unequal thickness, but a buffer pad 127 is also provided on the side of the support plate 111 away from the display screen 112. This not only improves the rigidity of the exposed non-bending parts, but also does not weaken the bendability of the bending parts, and can also reduce the degree of damage to the bending parts of the display module, thereby improving the performance of the display module.

[0335] In other examples, the various regions of the protective layer 114 can be designed as structures of unequal thickness.

[0336] like FIG. 4A As shown, the cover plate (e.g., display cover, protective layer) located on one side of the display surface of the display screen 112 is designed with a structure of unequal elastic modulus. Furthermore, a buffer pad 127 is disposed on the support plate 111 at a position opposite to the first bending area. This not only optimizes the bendability of the bent portion of the display module but also improves the impact and compression resistance of the bent portion.

[0337] The embodiment of this application shows that the cover plate 110 is designed as a structure with unequal thickness or unequal modulus, which can be applied to the overall thinning solution involved in any of the above embodiments.

[0338] In some examples, the hinge mechanism in foldable electronic devices employs... FIG. 4B and FIG. 25 As shown in the diagram, the cover plate in the display module of this electronic device can have an unequal thickness structure or an unequal modulus structure.

[0339] In other examples, the edge bending area of ​​the display module in the folded electronic device has a reinforcing layer, or a strengthening layer, or a buffer layer, and the cover plate in the display module of the electronic device may have an unequal thickness structure or an unequal modulus structure.

[0340] In other examples, when the cover plate of the display module in an electronic device can adopt a structure with unequal thickness or unequal modulus, the above-mentioned... FIG. 26 and ​ The structure shown.

[0341] In some examples, when the cover plate in the display module of an electronic device can adopt a structure with unequal thickness or unequal modulus, the electromagnetic induction structure 125 in the display module can adopt the above example.

[0342] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0343] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: The display screen includes a display area, an edge bending area located at the outer edge of the display area, and a lower border area connected to the edge bending area, wherein the lower border area is located on the side of the display area away from the display surface; The display module further includes a base film and an adhesive layer, the base film and the adhesive layer being disposed on the outside of the edge bending area, the base film being connected to the edge bending area through the adhesive layer, or; The display module further includes a reinforcement layer disposed on the outside of the edge bending area, and the reinforcement layer includes a printed layer. The outer side of the edge bending region is the side of the edge bending region that is away from the center of the arc-shaped structure.

2. The display module according to claim 1, characterized in that, The display module also includes: A reinforcing layer is disposed on the inner side of the edge bending area; The inner side of the edge bending region is the side of the edge bending region closest to the center of the arc-shaped structure.

3. The display module according to claim 2, characterized in that, When the display module includes the base film and the adhesive layer, the elastic modulus of the reinforcing layer is less than the elastic modulus of the base film; or, When the display module includes the reinforcing layer, the elastic modulus of the reinforcing layer is less than that of the reinforcing layer.

4. The display module according to any one of claims 1-3, characterized in that, The display module also includes: A buffer layer is disposed on the side of the base film away from the edge bending region, and the elastic modulus of the buffer layer is less than the elastic modulus of the base film; or, The buffer layer is disposed on the side of the reinforcing layer away from the edge bending region, and the elastic modulus of the buffer layer is less than that of the reinforcing layer.

5. The display module according to any one of claims 1-4, characterized in that, The display area includes a first non-bent portion, a second non-bent portion, a third non-bent portion, a first bent portion, and a second bent portion. The first bent portion connects the first non-bent portion and the second non-bent portion, and the second bent portion connects the second non-bent portion and the third non-bent portion. Both the first bent portion and the second bent portion can be bent along a bend line to switch between a flattened state and a closed state. The display module also includes: A cover plate, wherein the cover plate is disposed on one side of the display surface of the display screen; The cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area, and a second bending area. The first bending area connects the first non-bending area and the second non-bending area, and the second bending area connects the second non-bending area and the third non-bending area. The first non-bending area corresponds to the first non-bending portion, the second non-bending area corresponds to the second non-bending portion, the third non-bending area corresponds to the third non-bending portion, the first bending area corresponds to the first bending portion, and the second bending area corresponds to the second bending portion; The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

6. The display module according to claim 5, characterized in that, The thickness of the first non-bending region is greater than the thickness of the second non-bending region.

7. The display module according to claim 6, characterized in that, The cover plate includes: A substrate and a first buffer layer, wherein the first buffer layer is closer to the display screen than the substrate; The thickness of the substrate located in the first non-bending region is greater than the thickness of the substrate located in the second non-bending region, and / or; The thickness of the first buffer layer located in the first non-bending region is greater than the thickness of the first buffer layer located in the second non-bending region.

8. The display module according to claim 7, characterized in that, From the first non-bending region to the second non-bending region, the thickness of the first buffer layer located in the first bending region gradually decreases.

9. The display module according to claim 7 or 8, characterized in that, The cover plate includes: The second buffer layer includes a first part and a second part; The first part of the second buffer layer is located in the first non-bending region, and the second part of the second buffer layer is located in the first bending region. The elastic modulus of the first part of the second buffer layer is greater than that of the second part of the second buffer layer.

10. An electronic device, characterized in that, include: case; The display module as described in any one of claims 1 to 9; The display module is mounted on the housing.

11. An electronic device, characterized in that, include: Display module; The housing includes a frame disposed at the edge of the display module, and a first filling layer is disposed at the position where the frame is in contact with the display surface of the display module; The border and the first filling layer are integrally formed.

12. The electronic device according to claim 11, characterized in that, The frame and the first filling layer are integrally molded injection-molded structural parts.

13. The electronic device according to claim 11 or 12, characterized in that, A second filling layer is provided at the position where the frame is opposite to the side of the display module. The elastic modulus of the second filling layer is less than that of the frame.

14. The electronic device according to claim 13, characterized in that, The second filling layer and the frame are integrally formed.

15. The electronic device according to any one of claims 11-14, characterized in that, The display module includes: Display screen; A cover plate is disposed on one side of the display surface of the display screen. The cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area, and a second bending area. The first bending area connects the first non-bending area and the second non-bending area, and the second bending area connects the second non-bending area and the third non-bending area. Both the first bending area and the second bending area can be bent along the bending line to switch between a flattened state and a closed state. The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

16. The electronic device according to claim 15, characterized in that, The thickness of the first non-bending region is greater than the thickness of the second non-bending region.

17. The electronic device according to claim 16, characterized in that, The cover plate includes: A substrate and a first buffer layer, wherein the first buffer layer is closer to the display screen than the substrate; The thickness of the substrate located in the first non-bending region is greater than the thickness of the substrate located in the second non-bending region, and / or; The thickness of the first buffer layer located in the first non-bending region is greater than the thickness of the first buffer layer located in the second non-bending region.

18. The electronic device according to claim 17, characterized in that, From the first non-bending region to the second non-bending region, the thickness of the first buffer layer located in the first bending region gradually decreases.

19. The electronic device according to claim 17 or 18, characterized in that, The cover plate includes: The second buffer layer includes a first part and a second part; The first part of the second buffer layer is located in the first non-bending region, and the second part of the second buffer layer is located in the first bending region. The elastic modulus of the first part of the second buffer layer is greater than that of the second part of the second buffer layer.

Images