Filter device, manufacturing method thereof and circuit board assembly

Abstract

The invention relates to a filter device, a manufacturing method thereof and a circuit board assembly. The filter device includes: a package; the inner electrode layer is arranged in the packaging body, and the inner electrode layer comprises a grounding layer; a metal connection part; the bonding pad assembly is arranged on the bottom surface of the packaging body, the bonding pad assembly comprises at least one first bonding pad and at least one second bonding pad, one of the first bonding pad and the second bonding pad is electrically connected with the grounding layer, and the other one of the first bonding pad and the second bonding pad is a non-connection bonding pad; wherein at least part of the first bonding pads are connected with the second bonding pads through the metal connecting parts, and the number of the second bonding pads connected to the same first bonding pad through the metal connecting parts is one or more. According to the filter device, the manufacturing method thereof and the circuit board assembly, the mechanical strength and the adhesive force of the welding position can be improved, welding is firm, and the reliability of long-term use is high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic components, and in particular to a filter device, a manufacturing method thereof, and a circuit board assembly. BACKGROUND

[0002] In high-reliability application scenarios such as vehicle-mounted electronics and communication base stations, the demand for small-sized and high-density packaged electronic components continues to grow. In such harsh environments, the long-term reliability of products (such as resistance to mechanical stress and thermal cycling ability) and manufacturing yield have become core market competitiveness indicators. Currently, traditional surface pad packaged electronic components are increasingly trending towards miniaturization. However, the trend of miniaturization of components can also lead to insufficient adhesion of solder joints and surface pads, and under the action of stress such as temperature cycling, mechanical vibration or impact, solder joints are prone to fatigue cracking or soldering, directly damaging the soldering reliability of electronic components for long-term use. SUMMARY

[0003] The purpose of the present application is to provide a filter device, a manufacturing method thereof, and a circuit board assembly, which can improve the mechanical strength and adhesion of the soldering position, making the soldering more secure and having higher long-term use reliability.

[0004] To achieve the above-mentioned purpose, in a first aspect, the present application provides a filter device, comprising: a package body; an inner electrode layer arranged in the package body, the inner electrode layer comprising a ground layer; a metal connecting portion; and a pad assembly arranged on the bottom surface of the package body, the pad assembly comprising at least one first pad and at least one second pad, one of the first pad and the second pad being electrically connected to the ground layer, and the other being a non-connected pad; wherein at least part of the first pads are connected to the second pads through the metal connecting portion, and the number of second pads connected to the same first pad through the metal connecting portion is one or more.

[0005] As an optional implementation, the metal connecting portion comprises at least one first metal branch, and each first pad and a corresponding second pad are connected by a first metal branch.

[0006] As an optional implementation, the same first pad is connected to multiple second pads through multiple first metal branches; the multiple second pads and the first pad are arranged in a row along a first direction, and the multiple first metal branches extend along the first direction; or the same first pad is connected to one second pad through one first metal branch, and the second pad is located on one side of the first pad along the first direction, and the first metal branch extends along the first direction.

[0007] As an optional implementation, the metal connection part includes a second metal branch, the first pads are connected with the ground layer, and at least some of the first pads adjacent to each other are connected with each other through the second metal branch.

[0008] As an optional implementation, at least some of the first pads connected with each other through the second metal branch are connected with the second pads through the first metal branch.

[0009] As an optional implementation, the second metal branch extends along a second direction, wherein the second direction and the first direction are coplanar; an included angle a between adjacent edges of the first metal branch and the second metal branch connected with the same first pad satisfies: 70°≤a≤110°; and / or The second pad connected with the first pad through the first metal branch is defined as a second target pad, and the pads other than the second target pad are defined as second candidate pads; when the same first pad is connected with one second target pad through one first metal branch, the second target pad is located on one side of the first pad along the first direction, and one second candidate pad is located on the other side of the first pad along the first direction.

[0010] As an optional implementation, when the same first pad is connected with two adjacent second pads through two first metal branches, the first pad is located between the two adjacent second pads.

[0011] As an optional implementation, the width dimension W1 of the first metal branch along the second direction and the maximum distance L1 between the two opposite side edges of the two adjacent second pads along the first direction respectively satisfy the following conditions: 50 microns≤W1≤300 microns, 100 microns≤L1≤1000 microns; Wherein, the second direction is the extension direction of the second metal branch.

[0012] As an optional implementation, the first pads, the second pads, and the metal connection part connected between the first pads and the second pads are integrally formed; and / or The first pads are connected with the ground layer, and the second pads are non-connected pads; the pad assembly further includes a first via metal, two ends of the first via metal are respectively connected with the first pad and the ground layer of the inner electrode layer; and / or the pad assembly further includes a second via metal, one end of the second via metal is connected with the second pad, and the other end of the second via metal extends into the package and is provided in a suspended manner; and / or The inner electrode layer further includes an input end and an output end, and the pad assembly further includes a third pad, one third pad is connected with the input end and the output end respectively, and the minimum distance between the outer contour edge of the third pad and the outer contour edge of the metal connection part is greater than 70 microns.

[0013] In a second aspect, the application further provides a manufacturing method of a filter device, the manufacturing method of the filter device being used to manufacture the filter device as described above, the inner electrode layer further comprising an input end and an output end, and the pad assembly further comprising a third pad, and the input end and the output end being respectively connected with one third pad; The method comprises: providing a plurality of medium layers; forming the pad assembly on one of the medium layers by screen printing, wherein the screen comprises a plurality of hollow structures, and the metal paste is printed onto the medium layer through the hollow structures; sequentially printing the inner electrode layer on the remaining medium layers; stacking the plurality of medium layers on which the printing is completed on each other and sintering to form the filter device.

[0014] As an optional implementation, the metal connecting part comprises a first metal branch and a second metal branch, the same first pad is connected with two second pads through two first metal branches, the two second pads are located on two sides of the first pad along the first direction, and the two second pads, the first pad and the first metal branch connected between the second pad and the first pad are defined as a first structure; the first pads adjacent to each other are connected with each other through the second metal branch, and the third pad is respectively arranged on two sides of the second metal branch along the first direction; In the step of forming the pad assembly on one of the medium layers by screen printing: the thickness of the hollow structure used to form the first structure is less than the thickness of the hollow structure used to form the remaining components in the pad assembly; and / or The step of forming the pad assembly on one of the medium layers by screen printing specifically comprises: placing the screen on the surface of the medium layer, moving the squeegee on the surface of the screen to fill the metal paste into the hollow structure of the screen, wherein the squeegee applies a pressure of 0.05-0.20 MPa to the screen, the moving speed of the squeegee is 20-100 mm / sec; and separating the screen from the surface of the medium layer.

[0015] In a third aspect, the application further provides a circuit board assembly comprising a circuit board and the filter device as described above, the circuit board comprising a ground layer and a connecting pad, and the connecting pad and the ground layer being electrically connected; The filter device is arranged on the circuit board, and the first pad of the filter device, the second pad connected with the first pad through the metal connecting part and the connecting pad are welded and connected.

[0016] Compared with the prior art, the application has the following beneficial effects: In the present application, the filter device includes a package body and a pad assembly, an inner electrode layer is arranged in the package body and includes a ground layer, the pad assembly is arranged on the bottom surface of the package body, and one of the first pad and the second pad of the pad assembly is electrically connected with the ground layer. In this way, the ground layer arranged in the package body can be led out to the first pad or the second pad on the bottom surface of the package body. When the filter device is applied to an electronic device, as long as the first pad or the second pad is welded to a connection pad of a circuit board to be connected, the connection pad is electrically connected with the ground layer of the circuit board, and the ground layer of the inner electrode layer in the filter device can be electrically connected with the ground layer of the circuit board.

[0017] Further, the pad assembly includes at least one first pad and at least one second pad, one of the first pad and the second pad is electrically connected with the ground layer, and the other is a non-connected pad. At least part of the first pads are connected with the second pads through metal connecting parts, and the number of the second pads connected with the same first pad through the metal connecting parts is one or more. In this way, when the first pad is connected with the ground layer and the second pad is a non-connected pad, at least part of the first pads and the second pads are connected through the metal connecting parts to form a whole, and the non-functional second pads are converted into extended pads of the first pads, which is equivalent to expanding the area of the first pad and increasing the welding area of the first pad, so as to improve the mechanical strength and adhesion of the welding position, and make the welding more firm, which can also improve the reliability of the electronic device. On the other hand, the non-functional second pads are converted into extended electrodes of the first pads, so that the first pads and the second pads form a parallel low-impedance ground path, which can reduce the crowding effect of the current and reduce the parasitic inductance to improve the radio frequency efficiency. The effect is similar when the second pad is connected with the ground layer and the first pad is a non-connected pad, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 is a structural schematic diagram of a filter device provided by an embodiment of the present application; Figure 2 is a top view structural schematic diagram of a filter device provided by an embodiment of the present application; Figure 3 is a top view structural schematic diagram of another structure of a filter device provided by an embodiment of the present application; Figure 4is a top view structural schematic diagram of still another structure of the filter device provided in the embodiments of the present application; Figure 5 is a top view structural schematic diagram of still another structure of the filter device provided in the embodiments of the present application; Figure 6 is a flow schematic diagram of a manufacturing method of the filter device provided in the embodiments of the present application.

[0020] Legend of reference signs: 100, filter device; 10, package; 20, inner electrode layer; 30, metal connecting part; 31, first metal branch; 32, second metal branch; 50, pad assembly; 501, first via metal; 502, second via metal; 503, third via metal; 51, first pad; 52, second pad; 521, second target pad; 522, second candidate pad; 53, third pad; F, first direction; S, second direction. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated.

[0022] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0023] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned part of the terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. Those of ordinary skill in the art can understand the specific meaning of these terms in the present application according to the specific situation.

[0024] In addition, the terms "mount", "set", "provided with", "connected", "linked" should be broadly understood. For example, it can be fixed connection, detachable connection, or integral structure; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0025] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific type and structure may be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0026] In high-reliability application scenarios such as vehicle electronics and communication base stations, the demand for miniaturized, high-density packaged electronic components continues to grow. In such harsh environments, the long-term reliability of products (such as resistance to mechanical stress, resistance to thermal cycling, etc.) and manufacturing yield have become core market competitiveness indicators.

[0027] Currently, there is a trend of miniaturization in traditional surface pad packaged electronic components. Due to limited packaging substrate design space and wiring rules, the effective pad area available for welding inside the package is continuously decreasing, and even being compressed to the limit. The reduction of pad area will weaken the mechanical strength and adhesion of the solder joint, resulting in less secure welding. Under the action of stress such as temperature cycling, mechanical vibration or impact, the solder joint is prone to fatigue cracking or soldering, directly damaging the long-term welding reliability of electronic components.

[0028] Therefore, the present application provides a filter device and a manufacturing method thereof, and a circuit board assembly. At least part of the first pads of the filter device are connected to the second pads through the metal connecting part, and the number of second pads connected to the same first pad through the metal connecting part is one or more. By connecting at least part of the first pads and the second pads through the metal connecting part to form a whole, the first pads are connected to the ground layer, and the second pads are non-connected pads. When taking the second pads as an example, the non-functional second pads are converted into extended pads of the first pads, which is equivalent to expanding the area of the first pads, increasing the welding area of the first pads, thereby improving the mechanical strength and adhesion of the welding position, making the welding more secure, which can also improve the reliability of the electronic device. In addition, the first pads and the second pads connected by the metal connecting part can also form a parallel low-impedance grounding path, which can reduce the crowding effect of the current and reduce the parasitic inductance to improve the radio frequency efficiency.

[0029] The scheme of the present application will be described in detail below with reference to the drawings.

[0030] Figure 1 is a structural schematic diagram of a filter device 100 provided by an embodiment of the present application. In Figure 1 In the example, the filter device 100 before the metal connecting part 30 is also shown above the drawing plane for convenience of illustration.

[0031] Please refer to Figure 1 The present application provides a filter device 100, which comprises a package 10, an inner electrode layer 20, a metal connecting part 30 and a pad assembly 50.

[0032] The inner electrode layer 20 is arranged in the package 10, and the inner electrode layer 20 comprises a ground layer (not shown). The pad assembly 50 is arranged on the bottom surface of the package 10, and the pad assembly 50 comprises at least one first pad 51 and at least one second pad 52, one of the first pad 51 and the second pad 52 is electrically connected to the ground layer, and the other is a non-connected pad. At least part of the first pad 51 is connected to the second pad 52 through the metal connecting part 30, and the number of the second pads 52 connected to the same first pad 51 through the metal connecting part 30 is one or more.

[0033] In the present application, the filter device 100 comprises the package 10 and the pad assembly 50, the inner electrode layer 20 is arranged in the package 10 and comprises a ground layer, the pad assembly 50 is arranged on the bottom surface of the package 10, and one of the first pad 51 and the second pad 52 of the pad assembly 50 is electrically connected to the ground layer. In this way, the ground layer arranged in the package 10 can be led out to the first pad 51 or the second pad 52 on the bottom surface of the package 10. When the filter device 100 is applied to an electronic device, as long as the first pad 51 or the second pad 52 is welded to the connecting pad of the circuit board to be connected, and the connecting pad is electrically connected to the ground layer of the circuit board, the ground layer of the inner electrode layer 20 in the filter device 100 can be electrically connected to the ground layer of the circuit board.

[0034] Further, the pad assembly 50 comprises at least one first pad 51 and at least one second pad 52, one of the first pad 51 and the second pad 52 is electrically connected with the ground layer, and the other is a non-connected pad. At least part of the first pad 51 is connected with the second pad 52 through the metal connecting part 30, and the number of the second pads 52 connected with the same first pad 51 through the metal connecting part 30 is one or more. When the first pad 51 is connected with the ground layer and the second pad 52 is a non-connected pad, for example, at least part of the first pad 51 and the second pad 52 are connected through the metal connecting part 30 to form a whole, and the non-functional second pad 52 is converted into an extended pad of the first pad 51, which is equivalent to expanding the area of the first pad 51 and increasing the welding area of the first pad 51, thereby improving the mechanical strength and adhesion of the welding position, making the welding more firm, which can also improve the reliability of the filter device welding. On the other hand, the non-functional second pad 52 is converted into an extended electrode of the first pad 51, so that the first pad 51 and the second pad 52 form a parallel low-impedance ground path, which can reduce the crowding effect of the current and reduce the parasitic inductance to improve the radio frequency efficiency. The effect of the case where the second pad 52 is connected with the ground layer and the first pad 51 is a non-connected pad is similar to the above, which will not be repeated here.

[0035] In the following description of the present application, the first pad 51 is connected with the ground layer and the second pad 52 is a non-connected pad, and the case where the second pad 52 is connected with the ground layer and the first pad 51 is a non-connected pad is similar to the above, which will not be repeated here.

[0036] The filter device 100 may, for example, be a filter based on the LTCC technology. Of course, the filter device 100 can also be other types of filter devices, and the case where the filter device 100 is other types is similar to this, which will not be repeated here.

[0037] The package 10 can be made of an insulating material, such as ceramic. The number of inner electrode layers 20 can be multiple, and multiple stacked inner electrode layers 20 can form multiple passive components (such as capacitors, resistors, filters, impedance converters, couplers, etc.) to form a filter circuit. The inner electrode layer 20 can include a ground plane, an input terminal, and an output terminal. Additionally, the pad assembly 50 can also include a third pad 53, and the input and output terminals of the inner electrode layer 20 can each be connected to a third pad 53 to bring the input and output terminals of the inner electrode layer 20 outside the package 10. The ground plane of the inner electrode layer 20 can be electrically connected to a first pad 51 or a second pad 52 to bring the ground plane of the inner electrode layer 20 outside the package 10. The connection between the input terminal, the output terminal, and the third pad 53, and the connection between the ground plane and the first pad 51 or the second pad 52, can be, for example, through vias provided within the package 10.

[0038] In a specific implementation, taking the first pad 51 connected to the ground layer and the second pad 52 being a non-connected pad as an example, the pad assembly 50 may include a first via metal 501, with both ends of the first via metal 501 connected to the first pad 51 and the ground layer of the inner electrode layer 20, respectively. Further, the pad assembly 50 may also include a second via metal 502, with one end connected to the second pad 52 and the other end extending into the package 10 and suspended. The pad assembly 50 may also include a third via metal 503, with both ends of the third via metal 503 connected to the third pad 53 and the corresponding input or output terminal, respectively.

[0039] The pad assembly 50 is disposed on the bottom surface of the package 10, meaning that at least part of the first pad 51, second pad 52, and third pad 53 are exposed outside the package 10 to facilitate soldering with connection pads on the circuit board to be connected. The number of the first pad 51, second pad 52, and third pad 53 included in the pad assembly 50 can be set as needed. In this application, an example is given where the number of the first pad 51, second pad 52, and third pad 53 is two. The same applies to other cases where the number of pads is different, and will not be described in detail here.

[0040] Non-Connecting Pads (NC pads) are idle pads in the filter device 100 that are not electrically connected before being connected to the metal connection part 30. They are used for mechanical fixation or heat dissipation and do not participate in electrical connection. After being connected to the metal connection part 30, they form extension pads to the first pad 51.

[0041] In addition, the at least partial first pads 51 are connected with the second pads 52 through the metal connecting part 30, which means that as long as one of the first pads 51 is connected with one of the second pads 52 through the metal connecting part 30, all of the first pads 51 can be connected with the second pads 52 through the metal connecting part 30. In a specific implementation, only one of the first pads 51 can be connected with one of the second pads 52 through the metal connecting part 30, or each of the partial first pads 51 can be connected with one of the second pads 52 through the metal connecting part 30, or each of the first pads 51 can be connected with one of the second pads 52 through the metal connecting part 30. Further, the number of the second pads 52 connected with the same first pad 51 through the metal connecting part 30 can be one or more.

[0042] In some embodiments, the first pads 51, the second pads 52 and the metal connecting part 30 connected between the first pads 51 and the second pads 52 are integrally formed. For example, the first pads 51, the metal connecting part 30 and the second pads 52 can be integrally printed on the surface of the package 10, so that the first pads 51, the metal connecting part 30 and the second pads 52 are formed as a whole to have better mechanical connection strength. In other embodiments, the first pads 51, the metal connecting part 30 and the second pads 52 can be formed separately. For example, when the first pads 51 and the second pads 52 are already formed in a filter device, the first pads 51 and the second pads 52 can be connected as a whole by forming the metal connecting part 30 between the first pads 51 and the second pads 52. It can be understood that, since the first pads 51 are expanded by the metal connecting part 30 and the second pads 52, the first pads 51, the metal connecting part 30 and the second pads 52 are simultaneously contacted with the solder and soldered to the same connecting pad of the circuit board to be connected in the soldering process, so that the soldering area of the first pads 51 is increased.

[0043] In the present application, the metal connecting part 30 can be a metal layer formed on the surface of the package 10, and the outer contour shape of the metal connecting part 30 can be set according to actual needs, for example, a strip-shaped or other outer contour shape pattern, etc. It can be understood that, in order to save metal paste, the metal connecting part 30 can be set as a strip-shaped metal layer.

[0044] In some embodiments, the metal connecting part 30 can include at least one first metal branch 31, and each of the first pads 51 and the corresponding one of the second pads 52 is connected with one of the first metal branches 31. In this way, when the number of the second pads 52 connected with the first pads 51 is more than one, one of the first metal branches 31 is connected between each of the corresponding first pads 51 and the second pads 52, so that the consumption of the metal paste of the metal connecting part 30 can be reduced as much as possible.

[0045] Figure 2 is a top view structural schematic diagram of the filter device 100 provided by an embodiment of the present application. Figure 3 is a top view structural schematic diagram of another structure of the filter device 100 provided by an embodiment of the present application. Figure 4 and Figure 5 is a top view structural schematic diagram of still another structure of the filter device 100 provided by an embodiment of the present application.

[0046] Please refer to Figure 1 and Figure 2 In some embodiments, one first pad 51 is connected to multiple second pads 52 through multiple first metal branches 31, the multiple second pads 52 are arranged in a row along the first direction F with the first pad 51, and the multiple first metal branches 31 extend along the first direction F. In this way, the mechanical strength of the whole of the first pad 51, the first metal branch 31 and the second pad 52 can be improved, and the first pad 51, the first metal branch 31 and the second pad 52 can be integrally printed and formed in combination with the extension of the multiple first metal branches 31 along the first direction F. Figure 2 In the embodiment, one first pad 51 is arranged between two adjacent second pads 52, and the arrangement of the first pad 51 and the second pad 52 along the first direction F can be various, for example, for three pads adjacent along the first direction F, one second pad 52 can also be arranged between two adjacent first pads 51. For the pads adjacent along the first direction F, the first pad 51 and the second pad 52 can be alternately arranged, or a plurality of first pads 51 can be continuously arranged first, and then a plurality of second pads 52 can be arranged. As long as one first pad 51 is connected to multiple second pads 52 through multiple first metal branches 31.

[0047] Alternatively, one first pad 51 can be connected to one second pad 52 through one first metal branch 31 in combination with Figure 3 and Figure 4 , the second pad 52 is located on one side of the first pad 51 along the first direction F, and the first metal branch 31 extends along the first direction F. In this way, one first pad 51 and one second pad 52 are connected through the first metal branch 31, and the first pad 51 and the second pad 52 are connected as a whole through the first metal branch 31 to increase the welding area. The mechanical strength of the welding point can be increased, the consumption of metal paste can be reduced, and the cost can be reduced. It should be noted that Figure 3 and Figure 4 The arrangement positions of the pads shown in the figures are symmetrically arranged.

[0048] Please continue to refer to Figure 2 ,Figure 3 and Figure 5 In some embodiments, the metal connection part 30 further comprises a second metal branch 32, when the first pads 51 are connected with the ground layer, at least some of the first pads 51 adjacent to each other are connected with each other through the second metal branch 32. In this way, two first pads 51 are connected as a whole through the second metal branch 32, the area of the two first pads 51 is expanded through the second metal branch 32, the welding area of the first pad 51 is increased, thereby the mechanical strength and adhesion of the welding position can be improved, the welding is more firm, and the welding reliability during long-term use can also be improved.

[0049] On the other hand, by electrically connecting two adjacent first pads 51 through the second metal branch 32, the reflow current in the inner electrode layer 20 can be grounded through the nearest first pad 51, the reflow path is shortened, and the high-frequency parasitic inductance in the filter device 100 can also be reduced.

[0050] It can be understood that among the first pads 51 connected with each other, as shown in Figure 2 , Figure 3 , some of the first pads 51 are connected with the second pads 52. As shown in Figure 5 , among the first pads 51 connected with each other, all the first pads 51 are not connected with the second pads 52.

[0051] In detail, please refer to Figure 2 and Figure 3 , among the first pads 51 connected with each other through the second metal branch 32, at least some of the first pads 51 are connected with the second pads 52 through the first metal branch 31. Two adjacent first pads 51 are connected as a whole through the second metal branch 32, one of the first pads 51 is also connected as a whole with the second pad 52 through the first metal branch 31, the two first pads 51 connected through the second metal branch 32 form a whole in the second direction S, the first pad 51 and the second pad 52 connected through the first metal branch 31 form a whole in the first direction F, the two wholes share one first pad 51, the second direction S and the first direction F are coplanar and have an included angle, in this way, the area of the shared first pad 51 is expanded in the two directions with the included angle, compared with the case that each first pad 51 and the second pad 52 are located in the same row, the effect of resisting external stress is better.

[0052] Further, when the same first pad 51 is connected to two adjacent second pads 52 through two first metal branches 31, the first pad 51 is located between the two adjacent second pads 52. In this way, the first pad 51 and the second pad 52 connected through the first metal branch 31 and the first pad 51 connected to each other through the second metal branch 32 can form a topology with an outer contour substantially in the shape of the English letter "T". At this time, the two third pads 53 can be located on both sides of the first pad 51 not connected to the second pad 52 along the first direction F. At this time, the first pad 51, the second pad 52, and the third pad 53 are arranged in an array.

[0053] In some embodiments, the second metal branch 32 extends along the second direction S, and the included angle a between the adjacent edges of the first metal branch 31 and the second metal branch 32 connected to the same first pad 51 satisfies: 70°≤a≤110°. When the included angle a is greater than 110°, in order to ensure that the first metal branch 31 and the second metal branch 32 have a large enough spacing with the third pad 53, the size of the package 10 will be set to be larger. When the included angle a is less than 70°, the effect of increasing the soldering area cannot be achieved. When the included angle a satisfies: 70°≤a≤110°, the soldering area can be effectively increased, and the size of the filter device 100 will not be increased.

[0054] Further, the width dimension W1 of the first metal branch 31 along the second direction S and the maximum spacing L1 between the two opposite side edges of the two adjacent second pads 52 along the first direction F respectively satisfy the following conditions: 50 microns≤W1≤300 microns, 100 microns≤L1≤1000 microns. Generally, the width dimension W1 of the first metal branch 31 along the second direction S is smaller than the width dimension of the first pad 51 along the second direction S. When the width dimension W1 satisfies: 50 microns≤W1≤300 microns, and the maximum spacing L1 satisfies: 100 microns≤L1≤1000 microns, the soldering area of the pad can be increased while the first metal branch 31 has a sufficient spacing with the third pad 53, and the size of the package 10 along the first direction F and the second direction S will not be increased.

[0055] In Figure 2In the example shown in FIG. 1, the sum W2 of the dimensions of the second metal branch 32 along the second direction S and the first pad 51 not connected to the second pad 52 satisfies: 50 microns ≤ W2 ≤ 500 microns. Such an arrangement can increase the soldering area of the first pad 51 without increasing the size of the package 10 along the first direction F. The dimension L2 of the first pad 51 not connected to the second pad 52 along the first direction F satisfies: 50 microns ≤ L2 ≤ 500 microns. Such an arrangement can increase the soldering area of the first pad 51 while maintaining sufficient spacing between the second metal branch 32 and the third pad 53.

[0056] In addition, the minimum spacing between the outer contour edge of the third pad 53 and the outer contour edge of the metal connection 30 needs to be greater than 70 microns to ensure a sufficient safety distance.

[0057] Please refer to Figure 3 and Figure 4 In addition to the "T" topology shown in Figure 2 , the first pad 51 and the second pad 52 can also form an "L" topology. In some embodiments, the second pad 52 connected to the first pad 51 by the first metal branch 31 is defined as a second target pad 521, and the pads of the second pad 52 other than the second target pad 521 are defined as second candidate pads 522. When one first pad 51 is connected to one second target pad 521 by one first metal branch 31, the second target pad 521 is located on one side of the first pad 51 along the first direction F, and one second candidate pad 522 is located on the other side of the first pad 51 along the first direction F. In other words, the second candidate pad 522, the first pad 51, and the second target pad 521 are sequentially arranged and spaced apart along the first direction F, the first pad 51 and the second target pad 521 are connected by the first metal branch 31, and the first pad 51 and the adjacent another first pad 51 are connected by the second metal branch 32, thereby forming a topology in the shape of the letter "L". In Figure 3 , the second candidate pad is shown on the right side of the drawing, and in Figure 4 , the second candidate pad is shown on the left side of the drawing. At this time, the two third pads 53 can be located on both sides of the first pad 51 not connected to the second pad along the first direction F. At this time, the first pad 51, the second pad 52, and the third pad 53 are arranged in an array.

[0058] Please continue to refer to Figure 5In another possible implementation, although some of the first pads 51 can be connected by the second metal branch 32, all of the first pads 51 connected to each other by the first metal branch 31 are not connected to the second pads 52. In this way, the effect of reducing the high-frequency parasitic inductance and increasing the pad welding area can also be achieved. For example, the number of the first pads 51 is three, the three first pads 51 are arranged in sequence and at intervals along the second direction S, and the first pad 51 located at the upper side of the drawing is connected to the second pad 52 by the second metal branch 32. Figure 5 The two first pads 51 located at the upper side of the drawing are connected by the second metal branch 32, and the first pad 51 located at the lower side of the drawing is connected to the second pad 52 by the first metal branch 31. Figure 5 The first pad 51 located at the lower side of the drawing is connected to the two second pads 52 by the two first metal branches 31. Figure 5 The two first pads 51 located at the upper side of the drawing are connected by the second metal branch 32, and the first pad 51 located at the lower side of the drawing is connected to the second pad 52 by the first metal branch 31. Figure 5 The two first pads 51 located at the upper side of the drawing are connected by the second metal branch 32, and the first pad 51 located at the lower side of the drawing is connected to the second pad 52 by the first metal branch 31.

[0059] Figure 6 is a flowchart of a manufacturing method of a filter device provided by the embodiments of the present application.

[0060] Please refer to Figure 1 and Figure 6 , in a second aspect, the present application also provides a manufacturing method of a filter device, the manufacturing method of the filter device is used for manufacturing the filter device 100 as described above, the inner electrode layer 20 further comprises an input end and an output end, and the pad assembly 50 further comprises a third pad 53, and the input end and the output end are respectively connected to one third pad 53. The manufacturing method of the filter device comprises: S10, providing a plurality of medium layers; S20, printing a pad assembly on one of the medium layers by a screen, wherein the screen comprises a plurality of hollow structures, and metal paste is printed to the medium layer through the hollow structures; S30, sequentially printing the inner electrode layer on the remaining medium layers; S40, stacking and sintering the plurality of printed medium layers to form the filter device.

[0061] Here, the medium layer may, for example, be a medium layer formed by flow casting a ceramic green tape on a PET film and then cutting into blocks.

[0062] It can be understood that the manufacturing method of the filter device of the present application is used to manufacture the filter device 100 described above, which can bring the same or similar beneficial effects as the filter device 100, and the specific description can be referred to the description of the foregoing embodiments, which will not be repeated here.

[0063] In some embodiments, the metal connecting part 30 includes a first metal branch 31 and a second metal branch 32, the same first pad 51 is connected to two second pads 52 through two first metal branches 31, and the two second pads 52 are located on both sides of the first pad 51 along the first direction F, and the two second pads 52, the first pad 51 and the first metal branch 31 connected between the second pad 52 and the first pad 51 are defined as a first structure. Preferably, the first metal branch 31 connected between the first pad 51 and the second pad 52 can also extend along the first direction F.

[0064] The first pads 51 adjacent to each other are connected to each other through the second metal branch 32, and the third pads 53 are respectively arranged on both sides of the second metal branch 32 along the first direction F. Here, taking the number of adjacent first pads 51 as two and the second metal branch 32 between the two first pads 51 being perpendicular to the first direction F as an example, in fact, the number of first pads 51 can also be more, and the angle between the second metal branch 32 and the first direction F can also be other, and the above other conditions are similar to this, which will not be repeated here. In this way, the second metal branch 32 and the first structure form a shape of the English letter "T".

[0065] In the step of forming the pad assembly 50 by printing on one of the medium layers through the screen: The thickness of the hollow structure for forming the first structure is smaller than the thickness of the hollow structure for forming the remaining parts in the pad assembly 50. Since the printing area of the first structure is larger, if the thickness of the screen for this part is the same as that of other parts, it is possible that the ink amount of the metal paste of this part will be larger, and after the screen is removed, the metal paste of the first structure may spread to the surrounding, and the third pad 53 may be bridged, and the electrode burr may be generated at the edge of the first structure, which affects the appearance yield. By the thickness of the hollow structure for forming the first structure being smaller than the thickness of the hollow structure for forming the remaining parts in the pad assembly 50, the ink amount of the metal paste for forming the first structure can be reduced, and the above situation can be avoided. In addition, the screen used in this step can be an electroformed stepped steel screen.

[0066] As an optional embodiment, the step of forming the pad assembly 50 by printing on one of the medium layers through the screen specifically includes: The screen is placed on the surface of the medium layer, and a squeegee is moved on the surface of the screen to fill the metal paste into the hollow structure of the screen, wherein the squeegee applies a pressure of 0.05-0.20 MPa to the screen, and the moving speed of the squeegee is 20-100 mm / sec. The screen is separated from the surface of the medium layer. In this way, by accurately controlling the pressure and speed of the squeegee during printing, the combination of "low speed + appropriate pressure" can ensure that the metal paste is uniformly filled into each part of the hollow structure, so that the metal pattern formed by printing is relatively complete.

[0067] The application further discloses a circuit board assembly, which comprises a circuit board and the filter device 100 as described above, and the circuit board comprises a ground layer and a connecting pad, and the connecting pad is electrically connected with the ground layer. The filter device 100 is arranged on the circuit board, and the first pad 51 of the filter device 100 and the second pad 52 connected with the first pad 51 through the metal connecting part 30 are welded with the connecting pad.

[0068] It can be understood that the circuit board assembly with the filter device 100 as described above can bring the same or similar beneficial effects as the filter device 100, and specific descriptions can be referred to the descriptions of the foregoing embodiments, which will not be described here.

[0069] The application further discloses an electronic device, which comprises the circuit board assembly as described above or the filter device 100 as described above. It can be understood that the electronic device with the filter device 100 or the circuit board assembly as described above can bring the same or similar beneficial effects as the filter device 100, and specific descriptions can be referred to the descriptions of the foregoing embodiments, which will not be described here.

[0070] The technical features of the foregoing embodiments can be combined in any manner, and for the purpose of concise description, all possible combinations of the technical features in the foregoing embodiments are not described, however, as long as the combinations of the technical features do not exist contradictions, it should be considered that the combinations are within the scope of the present application.

[0071] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A filter device, characterized by The package includes: a package body; an inner electrode layer disposed in the package body, the inner electrode layer including a ground layer; a metal connecting portion; and a pad assembly disposed on a bottom surface of the package body, the pad assembly including at least one first pad and at least one second pad, one of the first pad and the second pad being electrically connected to the ground layer, and the other being a non-connected pad; wherein at least some of the first pads are connected to the second pads through the metal connecting portion, and the number of the second pads connected to the same first pad through the metal connecting portion is one or more. The metal connecting portion includes at least one first metal branch, and each first metal branch is connected between each first pad and a corresponding second pad.

2. The filter device of claim 1, wherein, The same first pad is connected to multiple second pads through multiple first metal branches.

3. The filter device of claim 2, wherein, The multiple second pads and the first pads are arranged in a row along a first direction, and the multiple first metal branches extend along the first direction. Alternatively, The same first pad is connected to one second pad through one first metal branch, and the second pad is located on one side of the first pad along a first direction, and the first metal branch extends along the first direction. The metal connecting portion includes a second metal branch, the first pad is connected to the ground layer, and at least some of the first pads adjacent to each other are connected to each other through the second metal branch.

4. The filter device of claim 3, wherein, At least some of the first pads connected to each other through the second metal branch are connected to the second pads through the first metal branch.

5. The filter device of claim 4, wherein, The second metal branch extends along a second direction, wherein the second direction and the first direction are coplanar; the included angle α between the adjacent edges of the first metal branch and the second metal branch connected to the same first pad satisfies: 70°≤α≤110°; and / or 6. The filter device of claim 5, wherein, The second pad connected to the first pad through the first metal branch is defined as a second target pad, and the pads other than the second target pad in the second pad are defined as second candidate pads; when the same first pad is connected to one second target pad through one first metal branch, the second target pad is located on one side of the first pad along the first direction, and one second candidate pad is located on the other side of the first pad along the first direction. When the same first pad is connected to two adjacent second pads through two first metal branches, the first pad is located between the two adjacent second pads.

7. The filter device of claim 5, wherein, The width dimension W1 of the first metal branch along the second direction and the maximum distance L1 between the two opposite side edges of the two adjacent second pads along the first direction satisfy the following conditions respectively:

8. The filter device of claim 7, wherein, 50 microns≤W1≤300 microns, 100 microns≤L1≤1000 microns; wherein the second direction is the extension direction of the second metal branch. ​ 9. The filter device according to any one of claims 1-8, characterized in that, The first pad, the second pad and the metal connecting part connected between the first pad and the second pad are integrally formed; and / or The first pad is connected with the ground layer, and the second pad is a non-connected pad; the pad assembly further comprises a first via metal, two ends of the first via metal being connected with the first pad and the ground layer of the inner electrode layer respectively; and / or the pad assembly further comprises a second via metal, one end of the second via metal being connected with the second pad, and the other end of the second via metal extending into the package body and being provided in a suspended manner; and / or The inner electrode layer further comprises an input end and an output end, and the pad assembly further comprises a third pad, one of the input end and the output end being connected with one of the third pads, and the minimum distance between the outer contour edge of the third pad and the outer contour edge of the metal connecting part being greater than 70 microns.

10. A method of fabricating a filter device, characterized by, The manufacturing method of the filter is used for manufacturing the filter device as claimed in any one of claims 1-9, the inner electrode layer further comprises an input end and an output end, and the pad assembly further comprises a third pad, one of the input end and the output end being connected with one of the third pads; The method comprises: providing a plurality of medium layers; forming the pad assembly on one of the medium layers by screen printing, wherein the screen comprises a plurality of hollow structures, and metal paste is printed onto the medium layer through the hollow structures; sequentially printing inner electrode layers on the remaining medium layers; stacking the printed medium layers on each other and sintering to form the filter device.

11. The method of claim 10, wherein The metal connecting part comprises a first metal branch and a second metal branch, and the same first pad is connected with two second pads through two first metal branches, and the two second pads are located on the two sides of the first pad along a first direction, and the two second pads, the first pad and the first metal branch connected between the second pad and the first pad are defined as a first structure; the first pads adjacent to each other are connected with each other through the second metal branch, and the third pads are respectively arranged on the two sides of the second metal branch along the first direction; In the step of forming the pad assembly on one of the medium layers by screen printing, the thickness of the hollow structure for forming the first structure is less than the thickness of the hollow structure for forming the remaining components in the pad assembly; and / or The step of forming the pad assembly on one of the medium layers by screen printing specifically comprises: placing a screen on the surface of the medium layer, and moving a doctor blade on the surface of the screen to fill metal paste into the hollow structure of the screen, wherein the doctor blade applies a pressure of 0.05-0.20 MPa to the screen, and the moving speed of the doctor blade is 20-100 mm / sec; and separating the screen from the surface of the medium layer.

12. A circuit board assembly, characterized by The circuit board comprises a ground layer and a connection pad, and the connection pad and the ground layer are electrically connected. The filter device is disposed on the circuit board, and the first pad of the filter device and the second pad connected to the first pad through the metal connection portion are soldered to the connection pad.

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