Electronic device and manufacturing method thereof

Abstract

The invention provides a manufacturing method of an electronic device, which comprises the following steps of: (a) providing an electronic panel which comprises a first substrate and a plurality of electronic elements which are jointed on the first substrate; (b) detecting the electronic panel, and if the electronic panel is judged to be a defective product, performing the following steps (c) to (f); (c) the plurality of electronic elements are disconnected from the first substrate; (d) transferring the plurality of electronic components to a temporary substrate; (e) transferring the plurality of electronic components from the temporary substrate to a second substrate; and (f) bonding the plurality of electronic components to the second substrate.

Description

Technical Field

[0001] This invention relates to an electronic device and a method for manufacturing the same, and more particularly to an electronic device comprising microelectronic units and a method for manufacturing the same. Background Technology

[0002] Micro light-emitting diodes (LEDs) can be transferred to a target substrate using a mass transfer process. However, if the target substrate is found to be defective after the transfer, or if errors occur in subsequent processes leading to product defects, the target substrate, along with the LEDs mounted on it, must be scrapped. This not only increases the production cost of electronic devices but also increases carbon emissions. Therefore, how to solve these problems remains an important issue in this field. Summary of the Invention

[0003] The object of the present invention is to provide an electronic device comprising recycled light-emitting diodes and a method for manufacturing the electronic device using the recycled light-emitting diodes.

[0004] The present invention provides a method for manufacturing an electronic device, comprising the following steps: (a) providing an electronic panel, the electronic panel including a first substrate and a plurality of electronic components, wherein the plurality of electronic components are bonded to the first substrate; (b) inspecting the electronic panel, and if the electronic panel is determined to be defective, performing steps (c) to (f); (c) debonding the plurality of electronic components from the first substrate; (d) transferring the plurality of electronic components to a temporary substrate; (e) transferring the plurality of electronic components from the temporary substrate to a second substrate; and (f) bonding the plurality of electronic components to the second substrate.

[0005] The present invention also provides an electronic device comprising a substrate and a plurality of electronic components bonded to the substrate. The plurality of electronic components includes a first electronic component and a second electronic component. The first electronic component has a height H1, and the second electronic component has a height H2, wherein height H2 is greater than height H1, and heights H1 and H2 satisfy the following:

[0006] 0.05≤(H2-H1) / H2≤1.1. Attached Figure Description

[0007] Figure 1 This is a schematic flowchart of a method for manufacturing an electronic device according to the first embodiment of the present invention.

[0008] Figures 2 to 3 This is a schematic diagram of the manufacturing process of the electronic device according to the first embodiment of the present invention.

[0009] Figure 4 This is a schematic diagram of the bonding method of electronic components according to the first embodiment of the present invention.

[0010] Figure 5 This is a schematic diagram of the bonding method of electronic components in a variation of the first embodiment of the present invention.

[0011] Figure 6 This is a schematic diagram of the manufacturing process of an electronic device according to a second embodiment of the present invention.

[0012] Figure 7 This is a schematic diagram of the manufacturing process of an electronic device according to a third embodiment of the present invention.

[0013] Figure 8 This is a schematic diagram of the manufacturing process of the electronic device according to the fourth embodiment of the present invention.

[0014] Figure 9 This is a schematic diagram of the manufacturing process of the electronic device according to the fifth embodiment of the present invention.

[0015] Figure 10 This is a schematic diagram of the manufacturing process of the electronic device according to the sixth embodiment of the present invention.

[0016] Explanation of reference numerals: A1 - Distance; AD - Adhesive layer; BE, BM - Bonding components; BE1 - First bonding component; BE2 - Second bonding component; BK - Barrier structure; BP1, BP2, BP1' - Bonding pads; BS1, BS2, BS3 - Substrate; C1, C2, C3 - Optical units; CE - Conductive components; CF - Filter layer; CF1, CF2, CF3 - Filtering units; CL1, CL2 - Circuit layers; CV - Optical layer; E1, E1' - Electrodes; ED - Electronic device; EL - Electronic component; EL1 - First electronic component; EL2 - Second electronic component; EL3 - Third electronic component; EP - Electronic panel; FL - Fluid; H1, H2, HB, H3, H4, H5, Ha, Hc, HB', H1', ​​H2', H3' - Height; IL - Encapsulation layer INL - Insulating layer; LE - Light-emitting element; LE1 - First light-emitting element; LE2 - Second light-emitting element; LE3 - Third light-emitting element; LR - Laser; LS - Light-shielding layer; M100 - Manufacturing method; ME - Magnetic element; NEL - Non-recyclable electronic element; OP, OP1, OP2 - Openings; P1, P2, P3 - Parts; RS, RS1, RS2, RS3 - Grooves; S1 - Surface; S100, S102, S104, S106, S108, S110 - Steps; S2, S3, S4, S5 - Upper surface; SB1 - First substrate; SB2 - Second substrate; SB3 - Third substrate; SD, SD', SD” - Solder; SH - Baffle; TB - Detection board; TL - Dispensing tool; TSB - Temporary substrate; UF - Underfill material; Z - Direction. Detailed Implementation

[0017] The present invention can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the accompanying drawings depict only a portion of the device, and specific elements in the drawings are not drawn to scale. Furthermore, the number and dimensions of the elements in the drawings are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0018] Throughout this specification and the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same elements. This invention is not intended to distinguish between elements that have the same function but different names.

[0019] In the specification and claims of this invention, the words "containing" and "including" are open-ended terms, and therefore should be interpreted as "containing but not limited to...".

[0020] It should be understood that when an element or film is referred to as being "on" or "connected" to another element or film, it can be directly on or directly connected to the other element or film, or there may be an inserted element or film between them (indirect cases). Conversely, when an element is referred to as being "directly" on or "directly connected" to another element or film, there may be no inserted element or film between them. When an element or film is referred to as being "electrically connected" to another element or film, it can be interpreted as a direct electrical connection or a non-direct electrical connection. The electrical connection or coupling described in this invention can refer to a direct connection or an indirect connection. In the case of a direct connection, the endpoints of the two circuit components are directly connected or interconnected by a conductor segment, while in the case of an indirect connection, there may be a switch, diode, capacitor, inductor, resistor, other suitable components, or combinations of the above components between the endpoints of the two circuit components, but not limited to these.

[0021] Although the terms "first," "second," "third," etc., can be used to describe various constituent elements, the constituent elements are not limited by these terms. These terms are used only to distinguish a single constituent element from other constituent elements in the specification. The same terms may not be used in the claims, but rather replaced by "first," "second," "third," etc., according to the order of the elements declared in the claims. Therefore, in this specification, a first constituent element may be a second constituent element in a claim.

[0022] In this invention, the thickness, length and width can be measured by using an optical microscope, while the thickness or width can be measured by cross-sectional images from an electron microscope, but are not limited thereto.

[0023] Furthermore, there may be a certain degree of error between any two values ​​or directions used for comparison. The terms "approximately," "substantially," or "roughly" are generally interpreted as being within ±10% of the given value, or within ±5%, ±3%, ±2%, ±1%, or ±0.5% of the given value.

[0024] In addition, the terms "given range is from the first value to the second value" and "given range falls within the range of the first value to the second value" indicate that the given range includes the first value, the second value, and other values ​​in between.

[0025] If the first direction is perpendicular to the second direction, the angle between the first direction and the second direction can be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction can be between 0 degrees and 10 degrees.

[0026] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It is understood that these terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant art and this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this invention.

[0027] It should be understood that the technical features of several different embodiments can be replaced, reorganized, or mixed to complete other embodiments without departing from the spirit of the present invention.

[0028] The electronic device of this invention may include, but is not limited to, a display device, a sensing device, a backlight device, an antenna device, a splicing device, a virtual reality product, or other suitable electronic device. The electronic device of this invention may be bendable, flexible, or stretchable. The display device may include non-emissive display devices or emissive display devices. Non-emissive display devices include, for example, liquid crystal displays, but are not limited to. Emissive display devices include, for example, light-emitting diode displays, but are not limited to. The display device may be used, for example, in laptops, public displays, splicing displays, automotive displays, touch displays, televisions, monitors, smartphones, tablets, light source modules, lighting equipment, or, for example, electronic devices used in the aforementioned products, but are not limited to. The sensing device may include biosensors, touch sensors, fingerprint sensors, other suitable sensors, or combinations of sensors of the aforementioned types. The antenna device may include, for example, a liquid crystal antenna device, but is not limited to. The splicing device may include, for example, a display splicing device or an antenna splicing device, but is not limited to. The shape of the electronic device may be rectangular, circular, polygonal, with curved edges, or other suitable shapes. Electronic devices may include electronic units, which may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, sensors, etc. Diodes may include light-emitting diodes (LEDs) or photodiodes. LEDs may include, for example, organic light-emitting diodes (OLEDs) or in-organic light-emitting diodes (ILEDs). In-organic LEDs may include, for example, mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited thereto. Electronic devices may have peripheral systems such as drive systems, control systems, and light source systems to support display devices, antenna devices, wearable devices (e.g., augmented reality or virtual reality), automotive devices (e.g., automotive windshields), or splicing devices. The following description uses an electronic device including a display device as an example, but the invention is not limited thereto. The electronic device of the present invention may be various combinations of the above-mentioned devices, such as a combination of a display device and other devices, but is not limited thereto.

[0029] Please refer to Figures 1 to 3 , Figure 1 This is a schematic flowchart of a method for manufacturing an electronic device according to a first embodiment of the present invention. Figures 2 to 3 This is a schematic diagram illustrating the manufacturing process of the electronic device according to the first embodiment of the present invention. Specifically... Figures 1 to 3 A method for recycling electronic components and manufacturing electronic devices using the recycled electronic components is illustrated. According to this embodiment, an electronic device ED (shown as...) Figure 3The manufacturing method M100 may include the following steps:

[0030] S100: Provide an electronic panel, wherein the electronic panel includes a first substrate and a plurality of electronic components, wherein the plurality of electronic components are bonded to the first substrate;

[0031] S102: Inspect the electronic panel and determine whether the electronic panel is a defective product. If the electronic panel is found to be a defective product, proceed to steps S104 to S110.

[0032] S104: Decouple the electronic components from the first substrate;

[0033] S106: Transfer electronic components to a temporary substrate;

[0034] S108: Transferring electronic components from a temporary substrate to a second substrate; and

[0035] S110: Bonding electronic components to the second substrate.

[0036] The following details each step of the manufacturing method M100 for electronic device ED.

[0037] The manufacturing method M100 of the electronic device ED includes first performing step S100, providing an electronic panel EP. For example... Figure 2As shown in process (I), the electronic panel EP includes a first substrate SB1 and a plurality of electronic components EL, wherein the plurality of electronic components EL can be disposed on and bonded to the first substrate SB1. The first substrate SB1 may include a base BS1 and a circuit layer CL1 disposed on the base BS1. The base BS1 may include a rigid substrate or a flexible substrate. Rigid substrates include, for example, glass, quartz, sapphire, ceramic, other suitable materials or combinations thereof, while flexible substrates include, for example, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), other suitable materials or combinations thereof, but are not limited thereto. The circuit layer CL1 may include various wires, circuits, electronic units (e.g., active and / or passive components) applicable to the electronic panel EP, but is not limited thereto. For example, the circuit layer CL1 may include a driving unit, wherein the driving unit can be electrically connected to the electronic components EL disposed on the first substrate SB1 to drive the electronic components EL, but is not limited thereto. The driving unit may include, for example, a thin-film transistor (TFT) element or a micro integrated circuit (micro IC), but is not limited thereto. In this case, although not shown in the figure, the circuit layer CL1 may include elements and / or films such as semiconductor layers, gate electrodes, source electrodes, and drain electrodes to form the driving unit, but is not limited thereto. The circuit layer CL1 may also include other suitable elements and / or films, and is not limited to the elements and / or films described above. In this embodiment, the circuit layer CL1 may have a plurality of bonding pads (not shown in the figure, e.g., on the surface S1 away from the substrate BS1) on which the circuit layer CL1 is located. Figure 4 and Figure 5 The plurality of bonding pads (BP1) shown are electrically connected to drive units in circuit layer CL1, wherein electronic components EL are electrically connected to the plurality of bonding pads, thereby electrically connecting to the drive units. In other embodiments, electronic components EL may be bonded to the first substrate SB1 in other suitable ways, not limited to the methods described above.

[0038] In some embodiments, such as Figure 2As shown in process (I), the first substrate SB1 may further include an insulating layer INL disposed on the circuit layer CL1. The insulating layer INL may be disposed on the side of the circuit layer CL1 opposite to the substrate BS1. The insulating layer INL may include a plurality of openings OP, or rather, a plurality of openings OP may be defined, and electronic components EL may be disposed in the plurality of openings OP. The openings OP may expose bonding pads on the surface S1 of the circuit layer CL1, such that electronic components EL disposed in the openings OP can contact the bonding pads. The insulating layer INL may include any suitable insulating material.

[0039] The electronic component EL may include any suitable component depending on the type or purpose of the electronic panel EP. For example, in this embodiment, the electronic panel EP may include a display panel, while the electronic component EL may include a light-emitting element LE. Figure 2 As shown in process (I), the light-emitting element LE may include, but is not limited to, a first light-emitting element LE1, a second light-emitting element LE2, and a third light-emitting element LE3. The light-emitting element may include, but is not limited to, light-emitting diodes. Light-emitting diodes may include organic light-emitting diodes (OLEDs), quantum light-emitting diodes (QLEDs), inorganic light-emitting diodes (LEDs), or combinations thereof. Inorganic light-emitting diodes may include, for example, mini LEDs or micro LEDs, but are not limited to these. For example, electronic component EL may include micro LEDs, but is not limited to these. In this case, the insulating layer INL may serve as a pixel defining layer (PDL). It should be noted that electronic component EL may include any suitable semiconductor element, and is not limited to the elements described above. In some embodiments, electronic panel EP may include a sensing panel. In this case, electronic component EL may include any suitable sensing unit, such as a photodiode, but is not limited to these. In some embodiments, electronic panel EP may include a combination of a display panel and other electronic devices. It should be noted that the electronic panel EP may also include other films and / or components, and is not limited to... Figure 2 The above is the limit.

[0040] In this embodiment, the light-emitting elements LE can have the same color and the same appearance. Here, "light-emitting elements LE of the same color" can refer to light-emitting elements LE emitting light of the same color. Specifically, Figure 2The first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3 shown in process (I) can emit light of the same color, such as blue light, but are not limited thereto. The aforementioned "light-emitting elements LE with the same appearance" can refer to these light-emitting elements LE having the same shape and size. Here, "the shape of the light-emitting element LE" can refer, for example, to the shape of the light-emitting element LE in the top view direction (i.e., parallel to direction Z), or the projected shape of the light-emitting element LE on the first substrate SB1, but is not limited thereto. "The size of the light-emitting element LE" can refer to the volume, length, width, or projected area of ​​the light-emitting element LE on the first substrate SB1. In this embodiment, "light-emitting elements LE having the same appearance" can include embodiments where the projections of these light-emitting elements LE on the first substrate SB1 have the same area and shape, but is not limited thereto. It should be noted that although... Figure 2 As not shown, the electronic panel EP may include more light-emitting elements LE, which may have the same color and appearance.

[0041] After providing the electronic panel EP, step S102 can be performed to inspect the electronic panel EP and determine whether it is a defective product. Specifically, "determining whether the electronic panel EP is a defective product" in step S102 may include determining whether the first substrate SB1 in the electronic panel EP is a defective product. Specifically, the first substrate SB1 of the electronic panel EP can be checked for abnormalities by any suitable method, and if the first substrate SB1 is found to be abnormal after inspection, the electronic panel EP can be determined to be a defective product. The aforementioned "first substrate SB1 is abnormal" may include situations where the first substrate SB1 cannot operate normally or is damaged, such as a short circuit or open circuit in the circuit layer CL1 causing the electronic components EL bonded to the first substrate SB1 to malfunction, or damage to part of the film layer of the first substrate SB1, but not limited to these. In this case, since the electronic components EL bonded to the first substrate SB1 are not damaged, these electronic components EL can be recycled through the following steps of manufacturing method M100, and the recycled electronic components EL can be used as electronic components in the subsequently formed electronic device ED.

[0042] When the electronic panel EP is determined to be defective, step S104 can be performed to decouple the electronic component EL from the first substrate SB1. Specifically, as follows... Figure 2As shown in process (II), the debonding step between electronic component EL and first substrate SB1 may include breaking the first bonding member BE1 between electronic component EL and first substrate SB1. The first bonding member BE1 is located between electronic component EL and first substrate SB1, and electronic component EL can be electrically connected to first substrate SB1 through the first bonding member BE1. In this embodiment, the first bonding member BE1 may include a collection of conductive layers that electrically connect electronic component EL to first substrate SB1 (or, more specifically, circuit layer CL1 of first substrate SB1). For example, the first bonding member BE1 may include electrodes disposed on the surface of electronic component EL, bonding pads on the surface of circuit layer CL1, and / or solder located between the electrodes and bonding pads, details of which can be found in [reference needed]. Figure 4 and Figure 5 The first bonding member BE1 can be destroyed, for example, by a laser process, an etching process, or other suitable processes, depending on the bonding method between the electronic component EL and the first substrate SB1. In some embodiments, when the electronic component EL is bonded to the first substrate SB1 by laser bonding, the first bonding member BE1 between the electronic component EL and the first substrate SB1 can be destroyed by a laser process. In some embodiments, when the electronic component EL is bonded to the first substrate SB1 by eutectic bonding (e.g., copper-copper bonding), the first bonding member BE1 between the electronic component EL and the first substrate SB1 can be destroyed by an etching process. In some embodiments, the first bonding member BE1 can be destroyed by other means. In this embodiment, all the first bonding members BE1 between the electronic components EL and the first substrate SB1 can be destroyed in one process to debond all the electronic components EL on the first substrate SB1 from the first substrate SB1 at once, but this is not a limitation. In other embodiments, multiple debonding steps can be performed to debond the electronic components EL from the first substrate SB1 in batches. Figure 2 As shown in process (II), after the debonding step of electronic component EL and first substrate SB1, a portion P1 of the first bonding member BE1 may remain on electronic component EL, and a portion P2 of the first bonding member BE1 may remain on first substrate SB1. After the debonding step of electronic component EL and first substrate SB1, first substrate SB1 (and the portion P2 of the first bonding member BE1 remaining on first substrate SB1) can be scrapped.

[0043] After separating the electronic component EL from the first substrate SB1, step S106 of manufacturing method M100 can be performed to transfer the electronic component EL to the temporary substrate TSB. The electronic component EL can be transferred to the temporary substrate TSB using mass transfer techniques (e.g., fluid transfer, pick-and-place transfer, or other suitable methods). For example, in this embodiment, the electronic component EL can be transferred to the temporary substrate TSB by fluid transfer, but this is not a limitation. Figure 2 As shown in process (III), after separating the electronic component EL from the first substrate SB1, the electronic component EL can be transferred to the temporary substrate TSB via fluid FL, thereby recovering the electronic component EL in the electronic panel EP. The electronic component EL can be placed on the temporary substrate TSB with a portion P1 of the first bonding member BE1 facing upwards, i.e., the electronic component EL is located between the portion P1 of the first bonding member BE1 and the temporary substrate TSB. In other embodiments, the electronic component EL can be transferred to the temporary substrate TSB by other suitable methods (e.g., pick-and-place transfer). In the following, these electronic components EL transferred to the temporary substrate TSB may be referred to as "recovered electronic components".

[0044] In this embodiment, as Figure 2 As shown in process (III), the temporary substrate TSB may include a magnetic element ME, which can be used to define a predetermined placement position of the electronic component EL. Specifically, the electronic component EL in this embodiment may include a ferromagnetic material, and the temporary substrate TSB may include a plurality of magnetic elements ME, each used to attract the electronic component EL. Thus, the electronic component EL can be fixed to the temporary substrate TSB by the magnetic element ME. For example, during the manufacturing process of the electronic component EL, the electronic component EL can be made ferromagnetic by additionally providing a ferromagnetic material layer in the electronic component EL. The aforementioned ferromagnetic material layer may, for example, be provided on the side of the electronic component EL opposite to its electrodes, but is not limited thereto. It should be noted that... Figure 2 Process (III) only exemplarily illustrates the structure of the temporary substrate TSB including the magnetic element ME, and the placement of the magnetic element ME is not necessarily... Figure 2 The process (III) shown is for illustrative purposes only. In some embodiments, the magnetic element ME may be disposed on the side of the temporary substrate TSB opposite to the predetermined placement position of the electronic element EL, and may correspond to the predetermined placement position of the electronic element EL. In some embodiments, the magnetic element ME may be included in the temporary substrate TSB, or the magnetic element ME may be embedded in the temporary substrate TSB.

[0045] After transferring the electronic component EL to the temporary substrate TSB, the manufacturing method M100 may further include removing a portion of the first bonding member BE1 remaining on the electronic component EL. For example, as... Figure 3 As shown in process (IV), after the electronic component EL is disposed on the temporary substrate TSB with the portion P1 of the first bonding member BE1 facing upwards, the portion P1 of the first bonding member BE1 remaining on the electronic component EL can be removed, but is not limited thereto. In some embodiments, after the electronic component EL is transferred to the temporary substrate TSB, the portion P1 of the first bonding member BE1 remaining on the electronic component EL may not be removed.

[0046] After transferring the electronic component EL to the temporary substrate TSB, the manufacturing method M100 of the electronic device ED may further include forming a second bonding member BE2 on the electronic component EL. The second bonding member BE2 may, for example, include a suitable conductive adhesive and can be disposed on the electronic component EL in any suitable manner. For example, as... Figure 3 As shown in process (IV), in this embodiment, conductive adhesive can be applied to the electronic component EL using a dispensing tool TL to serve as a second bonding member BE2, but this is not a limitation. The second bonding member BE2 can be positioned corresponding to the location where the electronic component EL is subsequently bonded to the substrate of the electronic device ED (i.e., the second substrate SB2 hereinafter referred to as the second substrate), for example, the second bonding member BE2 can be positioned corresponding to the original location of the first bonding member BE1. The electronic component EL can be bonded to the substrate of the subsequently provided electronic device ED (i.e., the second substrate SB2 hereinafter referred to as the second substrate) via the second bonding member BE2. In this embodiment, since the manufacturing method M100 may include the step of removing the first bonding member BE1 residue on the electronic component EL as described above, the second bonding member BE2 can be directly disposed on the electronic component EL, but this is not a limitation. In some embodiments, the manufacturing method M100 may not include the step of removing the first bonding member BE1 residue on the electronic component EL as described above. In this case, the second bonding member BE2 can be disposed on a portion P1 of the first bonding member BE1, that is, a portion P1 of the first bonding member BE1 can be disposed between the second bonding member BE2 and the electronic component EL.

[0047] After the second bonding member BE2 is provided on the electronic component EL, step S108 can be performed to transfer the electronic component EL from the temporary substrate TSB to the second substrate SB2, and step S110 can be performed to bond the electronic component EL to the second substrate SB2. Specifically, the electronic component EL on the temporary substrate TSB can be transferred to the second substrate SB2 using mass transfer technology, and the electronic component EL is bonded to the second substrate SB2 by the second bonding member BE2 to form an electronic device ED. The structural features of the second substrate SB2 can refer to the structure of the first substrate SB1 described above. For example, the second substrate SB2 may include a substrate BS2 and a circuit layer CL2 disposed on the substrate BS2, but is not limited thereto. In this embodiment, the electronic component EL transferred from the temporary substrate TSB (or a recycled electronic component) can be used as a repair electronic component in the electronic device ED, but is not limited thereto. In this case, such as Figure 3As shown in processes (V)-1 and (V)-2, the manufacturing process of the electronic device ED may include first setting a non-recycled electronic component NEL on a second substrate SB2, and then removing the non-recycled electronic component NEL after confirming defects through an electronic component inspection step. Subsequently, an electronic component EL transferred from a temporary substrate TSB can be bonded as a repair electronic component to the second substrate SB2 to form the electronic device ED. The non-recycled electronic component NEL can be bonded to the second substrate SB2 via a bonding member BE. The material of the bonding member BE may refer to, but is not limited to, the materials of the first bonding member BE1 or the second bonding member BE2 described above. In some embodiments, the electronic components in the electronic device ED may be electronic components EL transferred from the temporary substrate TSB, that is, the electronic components in the electronic device ED may include electronic components EL transferred from the temporary substrate TSB (or recycled electronic components).

[0048] The following describes the detailed structure of the electronic components EL and the first substrate SB1 bonded by different bonding methods in the present invention in the steps of recycling the electronic components EL and bonding the recycled electronic components EL to the second substrate SB2.

[0049] Please refer to Figure 4 , Figure 4 This is a schematic diagram illustrating the bonding method of the electronic components according to the first embodiment of the present invention. Specifically, Figure 4 Several examples of structures of electronic components EL and first substrate SB1 bonded by eutectic bonding (e.g., copper-copper bonding) in the process shown in manufacturing method M100 are illustrated. Figure 4 As shown in structure (a), in this embodiment, the electronic component EL can be bonded to the first substrate SB1 via eutectic bonding. In this case, an electrode E1 can be provided on the electronic component EL, and the electronic component EL can contact the bonding pad BP1 on the first substrate SB1 through the electrode E1, thereby bonding the electronic component EL to the first substrate SB1. The electrode E1 and the bonding pad BP1 can include suitable conductive materials, such as copper, but are not limited thereto. The electrode E1 and the bonding pad BP1 can form the first bonding member BE1 described above. In this case, the electrode E1 can have a height H1, the bonding pad BP1 can have a height H2, and the height HB of the first bonding member BE1 can be the sum of the heights H1 and H2.

[0050] In some embodiments, such as Figure 4 As shown in structure (b), after debonding the electronic component EL from the first substrate SB1, the portion of the first bonding member BE1 remaining on the electronic component EL (i.e., the aforementioned portion P1) can be removed, leaving only the electronic component EL. In this case, as Figure 4As shown in structures (c) to (e), after the electronic component EL, on which the second bonding member BE2 is provided, is transferred from the temporary substrate TSB to the second substrate SB2, the second bonding member BE2 can contact the bonding pad BP2 on the second substrate SB2, thereby bonding the electronic component EL to the second substrate SB2. In this embodiment, the second bonding member BE2 can be, for example, an electrode or a layer of conductive material similar to the electrode E1, but is not limited thereto. The second bonding member BE2 and the bonding pad BP2 can form a bonding member BM, and the electronic component EL is bonded to the second substrate SB2 through the bonding member BM. The bonding member BM can have a height HB', wherein the height HB' of the bonding member BM can be the sum of the height H1' of the second bonding member BE2 and the height H2' of the bonding pad BP2. Furthermore, in this embodiment, the height H2' of the bonding pad BP2 can be, for example, the same as the height of the bonding pad BP1 (i.e., height H2), meaning that bonding pads on different substrates can, for example, have the same height, but is not limited thereto. In this case, the height HB' of the bonding member BM can vary with the height H1' of the second bonding member BE2. The height H1' of the second bonding member BE2 can be affected, for example, by the process parameters of the second bonding member BE2 (e.g., the amount of conductive adhesive applied). Specifically, in one embodiment, as... Figure 4 As shown in structure (c), the height H1' of the second connector BE2 can be the same as the height H1 of the previously formed electrode E1. In this case, the height HB' of the connector BM can be the sum of heights H1' and H2', and can be the same as the height HB of the first connector BE1. In one embodiment, as... Figure 4 As shown in structure (d), the height H1' of the second connector BE2 can be less than the height H1 of the previously formed electrode E1. In this case, the height HB' of the connector BM can be the sum of heights H1' and H2', and can be less than the height HB of the first connector BE1. In one embodiment, as... Figure 4 As shown in structure (e), the height H1' of the second connector BE2 can be greater than the height H1 of the previously formed electrode E1. In this case, the height HB' of the connector BM can be the sum of the heights H1' and H2', and can be greater than the height HB of the first connector BE1.

[0051] In some embodiments, after debonding the electronic component EL from the first substrate SB1, it is optional not to remove a portion (i.e., portion P1) of the first bonding member BE1 remaining on the electronic component EL. For example, as Figure 4 As shown in structure (f), after debonding the electronic component EL from the first substrate SB1, a portion P1 of the first bonding member BE1 may be retained, but this is not a limitation. The portion P1 may include, for example, the eutectic of the electrode E1 and the bonding pad BP1, but this is not a limitation. In this case, as... Figure 4As shown in structure (g), the second bonding member BE2 may be provided corresponding to a portion P1 of the first bonding member BE1. After the electronic component EL is bonded to the second substrate SB2, the second bonding member BE2 may contact the bonding pad BP2 on the second substrate SB2. That is, the bonding pad BP2, the second bonding member BE2, and a portion P1 of the first bonding member BE1 may be sequentially provided from one side of the second substrate SB2 to the side of the electronic component EL. The bonding pad BP2, the second bonding member BE2, and the portion P1 of the first bonding member BE1 may form the aforementioned bonding member BM. Thus, the height HB' of the bonding member BM may be the sum of the heights H3 and H2' of the portion P1 and the height H1' of the second bonding member BE2, and may be greater than the height HB of the first bonding member BE1. In some embodiments, such as Figure 4 As shown in structure (h), electronic component EL can be bonded to the second substrate SB2 by directly contacting bonding pad BP2 on the second substrate SB2 through a portion P1 of the first bonding member BE1. Bonding pad BP2 and portion P1 can form the aforementioned bonding member BM. Thus, the height HB' of bonding member BM can be the sum of height H3 and height H2'. In this case, the height HB' of bonding member BM can be greater than, less than, or equal to the height HB of the first bonding member BE1, depending on the height H3 of the portion P1 of the first bonding member BE1. It should be noted that it is possible to selectively... Figure 4 The electrode E1 shown in structure (f) is removed (i.e., the remaining portion of the first bonding member BE1 is removed), thereby obtaining... Figure 4 The structure shown in (b) is a structural representation of the structure.

[0052] Please refer to Figure 5 , Figure 5 This is a schematic diagram illustrating the bonding method of electronic components in a variation of the first embodiment of the present invention. Specifically, Figure 5 Several examples of structures for electronic components EL and first substrate SB1 bonded by laser bonding in subsequent processes are shown. For example... Figure 5 As shown in structure (a), in this embodiment, the electronic component EL can be bonded to the first substrate SB1 by laser bonding. In this case, an electrode E1 can be provided on the electronic component EL, wherein the electrode E1 can be electrically connected to the bonding pad BP1 on the first substrate SB1 via solder SD, thereby bonding the electronic component EL to the first substrate SB1. The electrode E1, solder SD, and bonding pad BP1 can include suitable conductive materials. The electrode E1, solder SD, and bonding pad BP1 can form the aforementioned first bonding member BE1. In this case, the electrode E1 can have a height H1, the bonding pad BP1 can have a height H2, the solder SD can have a height H3, and the height HB of the first bonding member BE1 can be the sum of heights H1, H2, and H3.

[0053] In some embodiments, such as Figure 5As shown in structure (b), after debonding the electronic component EL from the first substrate SB1, a portion of the first bonding member BE1 remaining on the electronic component EL (i.e., the aforementioned portion P1) can be removed, leaving only the electronic component EL. In this case, when a second bonding member BE2 is provided on the electronic component EL, the second bonding member BE2 may include an electrode E1' and / or solder SD'. Specifically, in one embodiment, as... Figure 5 As shown in structure (c), the second bonding member BE2 may include an electrode E1' and solder SD'. Electrode E1' and solder SD' may, for example, use the same material as electrode E1 and solder SD, respectively, but are not limited thereto. In this case, bonding member BM may be formed by electrode E1', solder SD', and bonding pad BP2. In structure (c), electrode E1' may have a height H1', ​​wherein height H1' may, for example, be the same as the height H1 of electrode E1; solder SD' may have a height H3', wherein height H3' may, for example, be the same as the height H3 of solder SD; bonding pad BP2 may have a height H2', wherein height H2' may be the same as the height H2 of bonding pad BP1. Thus, the height HB' of bonding member BM may be the sum of heights H1', ​​H2', and H3', and may be the same as the height HB of the first bonding member BE1. It should be noted that in some embodiments, in structure (c), the height H1' of electrode E1' may not be the same as the height H1, and / or the height H3' of solder SD' may not be the same as the height H3, while the height HB' of connector BM may be different from the height HB of first connector BE1. In one embodiment, as... Figure 5 As shown in structure (d), the second bonding member BE2 may include an electrode E1' but not solder SD', meaning that the electronic component EL is bonded to the second substrate SB2 via the electrode E1' and bonding pad BP2. In this embodiment, the height H1' of the electrode E1' in structure (d) may be, for example, the same as the height H1 of the electrode E1, and the height H2' of the bonding pad BP2 may be, for example, the same as the height H2 of the bonding pad BP1. Thus, the height HB' of the bonding member BM may be the sum of heights H1 and H2, and may be less than the height HB of the first bonding member BE1. It should be noted that in some embodiments, in structure (d), the height H1' of the electrode E1' may not be the same as the height H1.

[0054] In some embodiments, such as Figure 5 As shown in structure (e), after the electronic component EL is decoupled from the first substrate SB1, the breakage of the first bonding member BE1 can occur at the electrode E1. Thus, the portion P1 of the first bonding member BE1 remaining on the electronic component EL can be part of the electrode E1. Furthermore, in this embodiment, the portion P1 of the first bonding member BE1 remaining on the electronic component EL may not need to be removed. In this case, in one embodiment, as... Figure 5As shown in structure (d), the second bonding member BE2 may not be provided on the electronic component EL, and the electronic component EL can be bonded to the second substrate SB2 by having a portion of the electrode E1 remaining on the electronic component EL contact the bonding pad BP2. In this case, the electrode E1' shown in structure (d) in this embodiment may be a portion of the electrode E1 remaining on the electronic component EL, and the bonding member BM may be formed by the electrode E1' and the bonding pad BP2. Thus, the height H1' of the electrode E1' may be less than the height H1 of the electrode E1, the height H2' of the bonding pad BP2 may be the same as the height H2 of the bonding pad BP1, and the height HB' of the bonding member BM may be the sum of the heights H1' and H2', and may be less than the height HB of the first bonding member BE1. In one embodiment, as Figure 5 As shown in structure (f), a second bonding member BE2 can be provided on the portion of electrode E1 remaining on electronic component EL, and electronic component EL can be bonded to second substrate SB2 by contacting bonding pad BP2 with the second bonding member BE2. The second bonding member BE2 may include, for example, the solder SD' described above, but is not limited thereto. That is, bonding member BM can be formed by bonding pad BP2, solder SD', and electrode E1' arranged in sequence, wherein electrode E1' in this embodiment may be a portion of electrode E1 remaining on electronic component EL. Thus, the height H1' of electrode E1' is less than the height H1 of electrode E1. The height H3' of solder SD' may be, for example, the same as the height H3 of solder SD. The height H2' of bonding pad BP2 may be the same as the height H2 of bonding pad BP1. In this case, the height HB' of bonding member BM may be the sum of heights H1', ​​H2', and H3', and may be less than the height HB of the first bonding member BE1.

[0055] In some embodiments, such as Figure 5 As shown in structure (g), after the electronic component EL is de-bonded to the first substrate SB1, the breakage of the first bonding member BE1 can occur at the solder SD. Thus, the portion P1 of the first bonding member BE1 remaining on the electronic component EL may include the electrode E1 and a portion of the solder SD. Furthermore, in this embodiment, the portion P1 of the first bonding member BE1 remaining on the electronic component EL may not need to be removed. In this case, in one embodiment, as... Figure 5As shown in structure (h), a second bonding member BE2 can be provided on the portion of the electronic component EL where solder SD remains, and the electronic component EL can be bonded to the second substrate SB2 by contacting the bonding pad BP2 with the second bonding member BE2. The second bonding member BE2 may include, for example, solder SD', but is not limited thereto. That is, the bonding member BE2 can be formed by the bonding pad BP2, solder SD', solder SD' and electrode E1 arranged in sequence, wherein the solder SD' in this embodiment may be a portion of the solder SD remaining on the electronic component EL. Thus, the height H3' of the solder SD' is less than the height H3 of the solder SD. The height H2' of the bonding pad BP2 may be the same as the height H2 of the bonding pad BP1. The solder SD” may have a height H4. In this case, the height HB’ of the bonding member BM may be the sum of heights H1, H2’, H3’ and H4, and the height HB’ of the bonding member BM may be greater than or equal to the height HB of the first bonding member BE1, depending on the size of the height H4. It should be noted that in some embodiments, it may not be necessary to provide a second bonding member BE2 (e.g., solder SD”) on the structure shown in structure (g), and the electronic component EL may be bonded to the second substrate SB2 by contacting the bonding pad BP2 with the solder SD’. In some embodiments, the residual portion (i.e., portion P1) of the first bonding member BE1 shown in structure (g) may be completely removed to obtain the structure shown in structure (b), or the residual portion of the first bonding member BE1 shown in structure (g) may be partially removed to obtain the structure shown in structure (e).

[0056] In some embodiments, such as Figure 5 As shown in structure (i), after the electronic component EL is de-bonded to the first substrate SB1, the breakage of the first bonding member BE1 can occur at the bonding pad BP1. Thus, the portion P1 of the first bonding member BE1 remaining on the electronic component EL may include the electrode E1, solder SD, and a portion of the bonding pad BP1. Furthermore, in this embodiment, it is not necessary to remove the portion P1 of the first bonding member BE1 remaining on the electronic component EL. In this case, in one embodiment, as... Figure 5As shown in structure (j), a second bonding member BE2 can be provided on the portion of bonding pad BP1 remaining on electronic component EL, and electronic component EL can be bonded to second substrate SB2 by contacting bonding pad BP2 with the second bonding member BE2. The second bonding member BE2 may include, for example, solder SD', but is not limited thereto. That is, bonding member BM can be formed by bonding pad BP2, solder SD', bonding pad BP1', solder SD and electrode E1 arranged in sequence, wherein bonding pad BP1' in this embodiment may be a portion of bonding pad BP1 remaining on electronic component EL. Thus, the height H5 of bonding pad BP1' is less than the height H2 of bonding pad BP1. The height H2' of bonding pad BP2 may be the same as the height H2 of bonding pad BP1. Solder SD' may have a height H4. In this case, the height HB' of bonding member BM may be the sum of heights H1, H3, H5, H4 and H2', and the height HB' of bonding member BM may be greater than the height HB of the first bonding member BE1. In one embodiment, the second bonding member BE2 may not be provided on the electronic component EL, and the electronic component EL can be bonded to the second substrate SB2 by contacting the bonding pad BP2 with a portion of the bonding pad BP1 remaining on the electronic component EL. It should be noted that in some embodiments, the residual portion (i.e., portion P1) of the first bonding member BE1 shown in structure (i) may be completely or partially removed, thereby obtaining the structures shown in structure (b), structure (e), or structure (g).

[0057] According to the present invention, the electronic device ED may include at least one electronic component EL recycled from the electronic panel EP through the above-described process. After the electronic component EL is bonded to the second substrate SB2, the height of the electronic component EL may be affected by the process of the second bonding member BE2 (e.g., the amount of conductive adhesive applied) and / or whether or not the portion P1 remaining on the electronic component EL from the first bonding member BE1 is removed. Here, the height of the electronic component EL can be defined as the distance from the upper surface of the electronic component EL to the upper surface of the second substrate SB2 in the top view of the electronic device ED. In this case, there may be height differences among the electronic components in the electronic device ED (e.g., including electronic component EL and / or non-recycled electronic component NEL). In other words, in a cross-sectional view of the electronic device ED, the upper surface of the electronic component may exhibit unevenness.

[0058] Return to reference Figure 3 ,like Figure 3As shown in processes (V)-1 and (V)-2, the electronic component EL in this embodiment can serve as a repair electronic component in the electronic device ED. Thus, after bonding the electronic component EL to the second substrate SB2, the electronic device ED can include a first electronic component EL1 and a second electronic component EL2, wherein one of the first electronic component EL1 and the second electronic component EL2 is a non-recyclable electronic component NEL, and the other of the first electronic component EL1 and the second electronic component EL2 is a recycled electronic component (i.e., electronic component EL, which will not be described further below). For example, the first electronic component EL1 can be a non-recyclable electronic component NEL, and the second electronic component EL2 can be a recycled electronic component, but this is not a limitation. The first electronic component EL1 can have a height Ha, and the second electronic component EL2 can have a height Hb. The height Ha of the first electronic component EL1 can be defined as the maximum distance between the upper surface S2 of the first electronic component EL1 and the upper surface S3 of the second substrate SB2 in the top view direction of the electronic device ED. The height Hb of the second electronic component EL2 can be defined as the maximum distance between the upper surface S4 of the second electronic component EL2 and the upper surface S3 of the second substrate SB2 in the top view direction of the electronic device ED. Here, "the upper surface S3 of the second substrate SB2" can be, for example, the upper surface of the film layer furthest from the substrate BS2 in the circuit layer CL2, but is not limited thereto. In some embodiments, such as... Figure 3 As shown in process (V)-1, the height Ha of the first electronic component EL1 can be greater than the height Hb of the second electronic component EL2, that is, the height of the non-recycled electronic component NEL can be greater than the height of the recycled electronic component. In this case, the heights Ha and Hb can satisfy the following equation (1):

[0059] 0.05≤(Ha-Hb) / Ha≤1.1 (1)

[0060] Alternatively, in some embodiments, the height Hb of the second electronic component EL2 may be greater than the height Ha of the first electronic component EL1, that is, the height of the recycled electronic component may be greater than the height of the non-recycled electronic component NEL. In this case, the height Ha and the height Hb can satisfy the following equation (2):

[0061] 0.05≤(Hb-Ha) / Hb≤1.1 (2)

[0062] Specifically, in this embodiment, the ratio of the height difference between a recycled electronic component and a non-recycled electronic component NEL to the height of the higher of the two electronic components can range from 0.05 to 1.1 (i.e., 0.05 ≤ (Ha-Hb) / Ha or (Hb-Ha) / Hb ≤ 1.1), but is not limited thereto. In some embodiments, the above ratio can range from 0.1 to 1 (i.e., 0.1 ≤ (Ha-Hb) / Ha or (Hb-Ha) / Hb ≤ 1). In some embodiments, the above ratio can range from 0.15 to 0.95 (i.e., 0.15 ≤ (Ha-Hb) / Ha or (Hb-Ha) / Hb ≤ 0.95).

[0063] According to this embodiment, when the first bonding member BE1 and / or the second bonding member BE2 are bonded to the second substrate SB2 by eutectic bonding (e.g., copper-copper bonding), the ratio of the height difference between the recycled electronic component and the non-recycled electronic component NEL to the height of the higher of the two electronic components can be from 0.1 to 1.1 (i.e., 0.1 ≤ (Ha-Hb) / Ha or (Hb-Ha) / Hb ≤ 1.1), but is not limited thereto. In some embodiments, the above ratio can be from 0.15 to 1 (i.e., 0.15 ≤ (Ha-Hb) / Ha or (Hb-Ha) / Hb ≤ 1). In some embodiments, the above ratio can be from 0.2 to 0.95 (i.e., 0.2 ≤ (Ha-Hb) / Ha or (Hb-Ha) / Hb ≤ 0.95).

[0064] According to this embodiment, when the first bonding member BE1 and / or the second bonding member BE2 are bonded to the second substrate SB2 by laser bonding, the ratio of the height difference between the recycled electronic component and the non-recycled electronic component NEL to the height of the higher of the two electronic components can be from 0.05 to 0.55 (i.e., 0.05 ≤ (Ha-Hb) / Ha or (Hb-Ha) / Hb ≤ 0.55), but is not limited thereto. In some embodiments, the above ratio can be from 0.1 to 0.5 (i.e., 0.1 ≤ (Ha-Hb) / Ha or (Hb-Ha) / Hb ≤ 0.5). In some embodiments, the above ratio can be from 0.15 to 0.45 (i.e., 0.15 ≤ (Ha-Hb) / Ha or (Hb-Ha) / Hb ≤ 0.45).

[0065] Furthermore, in this embodiment, the height difference between the two non-recycled electronic components (NELs) can be smaller than the height difference between the non-recycled electronic component (NEL) and the recycled electronic component. Specifically, as follows... Figure 3As shown in process (V)-1, the electronic device ED may further include a third electronic component EL3, wherein the third electronic component EL3 may be a non-recyclable electronic component NEL. That is, the first electronic component EL1 and the third electronic component EL3 are non-recyclable electronic components NEL, while the second electronic component EL2 is a recycled electronic component. The third electronic component EL3 may have a height Hc, wherein the height Hc may be defined as the maximum distance between the upper surface S5 of the third electronic component EL3 and the upper surface S3 of the second substrate SB2 in the top view direction of the electronic device ED. According to this embodiment, the difference between height Hc and height Ha may be less than the difference between height Hc and height Hb (i.e., |Hc-Ha| < |Hc-Hb|). For example, the ratio of the height difference between two non-recyclable electronic components NEL to the height of the higher of the two non-recyclable electronic components NEL may be less than 0.05, but is not limited thereto.

[0066] It should be noted that in some embodiments, the electronic device ED may use recycled electronic components (i.e., electronic components EL) as its electronic components, that is, all electronic components in the electronic device ED may be electronic components EL. In this case, the aforementioned "first electronic component EL1" and "second electronic component EL2" may both be recycled electronic components, and the above relationship can be used to express the high degree relationship between the two recycled electronic components.

[0067] According to the present invention, after electronic components EL are bonded to a first substrate SB1 to form an electronic panel EP, if the first substrate SB1 is detected as defective, the electronic components EL can be recycled according to the above method, and the recycled electronic components EL can be placed in an electronic device ED as electronic components or repair electronic components of the electronic device ED. This reduces the likelihood of electronic components EL being scrapped along with the first substrate SB1, thereby reducing the production cost of the electronic device or reducing carbon emissions. Furthermore, as described above, after the recycled electronic components are placed in the electronic device ED, the recycled electronic components in the electronic device ED can be identified by height difference. It should be noted that in some embodiments, in addition to height difference, the recycled electronic components in the electronic device ED can also be identified by interface analysis. Specifically, after separating the electronic component EL from the first substrate SB1, setting a second bonding member BE2 on the electronic component EL, and bonding the electronic component EL to the second substrate SB2 via the second bonding member BE2, the interface properties between the electronic component EL and the bonding member (i.e., the aforementioned bonding member BM) disposed between the electronic component EL and the second substrate SB2 can be altered. Therefore, the recyclable electronic component can be identified by performing interface analysis on the interface between the electronic component EL and the bonding member BM. The aforementioned interface analysis may include, for example, metallographic analysis, grain boundary analysis, or other suitable analytical methods. Metallographic analysis can be performed using a metallographic microscope to identify the elemental composition or physical properties of the materials on both sides of the bonding surface. Grain boundary analysis can be performed using electron backscatter diffraction (EBSD) to identify the crystal phase of the materials on both sides of the bonding surface or the electron migration efficiency of the bonding surface.

[0068] Further embodiments of the present invention will be described below. For the sake of simplicity, the same film layers or elements will be referred to by the same designations in the following embodiments, and their features will not be repeated. The differences between the embodiments will be described in detail below. It should be noted that the features described in the embodiments can be applied to each other and are not limited to the structure of that embodiment.

[0069] Please refer to Figure 6 , Figure 6 This is a schematic diagram illustrating the manufacturing process of an electronic device according to a second embodiment of the present invention. In this embodiment, the electronic components EL in the electronic panel EP may include light-emitting elements LE of the same color but different appearances. For example, in Figure 6 In process (I), the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3 of the electronic panel EP can emit light of the same color but have different appearances. Specifically, as... Figure 6As shown in process (II), the first light-emitting element LE1 and the second light-emitting element LE2 may have different sizes. For example, the first light-emitting element LE1 and the second light-emitting element LE2 may have different areas in the top view (or different projected areas on the first substrate SB1). Furthermore, the first light-emitting element LE1 and the third light-emitting element LE3 may have different shapes. For example, the first light-emitting element LE1 and the third light-emitting element LE3 may have different shapes in the top view. It should be noted that the electronic panel EP may include multiple sets of first light-emitting elements LE1, second light-emitting elements LE2, and third light-emitting elements LE3, and is not limited to a single set. Figure 6 The process shown in (I) is for reference only. The characteristics of other components and films of the electronic panel EP can be found above, and will not be repeated here.

[0070] The manufacturing method of the electronic device ED in this embodiment can refer to the manufacturing method M100 described above. First, the first bonding member BE1 between the electronic component EL and the first substrate SB1 can be broken to debond the electronic component EL from the first substrate SB1. The method of breaking the first bonding member BE1 can be referred to above, and therefore will not be repeated. Next, the electronic component EL can be transferred to the temporary substrate TSB by fluid transfer. For example, as... Figure 6 As shown in process (II), electronic components EL can be transferred to a temporary substrate TSB via fluid FL. According to this embodiment, as... Figure 6 As shown in process (II), the temporary substrate TSB may include a plurality of recesses RS, each for accommodating an electronic component EL. The size of the recesses RS may be determined according to the size of the electronic component EL, such that the electronic component EL can fall into the recesses RS. Specifically, in this embodiment, the electronic component EL may have at least two sizes, and the recesses RS of the temporary substrate TSB may have at least two sizes, each for accommodating an electronic component EL of one of those two sizes. For example, as Figure 6 As shown in process (II), the temporary substrate TSB may include grooves RS1, RS2, and RS3, wherein grooves RS1, RS2, and RS3 may have different sizes and may be used to accommodate a first light-emitting element LE1, a second light-emitting element LE2, and a third light-emitting element LE3, respectively. In this case, grooves RS1, RS2, and RS3 may have shapes and sizes that match the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3, respectively. Thus, the placement positions of light-emitting elements LE with different appearances can be defined on the temporary substrate TSB. It should be noted that the electronic component EL in this embodiment can be disposed on the temporary substrate TSB by the magnetic component ME described above, and is not limited to the above method. Similarly, in Figure 2 In the illustrated embodiment, the electronic component EL can be optionally disposed on the temporary substrate TSB via a recess RS.

[0071] After transferring the electronic component EL onto the temporary substrate TSB, a second bonding member BE2 can be formed on the electronic component EL. In this embodiment, the second bonding member BE2 can be formed, for example, by laser dispensing. Specifically, as... Figure 6 As shown in process (II), a conductive element CE can be placed on one side of the electronic component EL where the second bonding member BE2 is to be mounted. The conductive element CE includes the material of the second bonding member BE2. Then, a laser LR can be applied to the portion of the conductive element CE corresponding to the predetermined mounting position of the second bonding member BE2 on the electronic component EL, causing that portion of the conductive element CE to move to the predetermined mounting position of the second bonding member BE2 on the electronic component EL, thereby completing the mounting of the second bonding member BE2. It should be noted that the second bonding member BE2 in this embodiment can also be mounted using the method described in the first embodiment. Similarly, in Figure 2 In the embodiment shown, the second bonding member BE2 can be optionally set by laser dispensing.

[0072] In this embodiment, after transferring the electronic component EL onto the temporary substrate TSB, the portion P1 remaining on the electronic component EL from the first bonding member BE1 may not need to be removed. Therefore, the portion P1 of the first bonding member BE1 can be located between the second bonding member BE2 and the electronic component EL after the second bonding member BE2 is installed. It should be noted that the portion P1 remaining on the electronic component EL from the first bonding member BE1 may also be removed before installing the second bonding member BE2, and this embodiment is not limited to this.

[0073] After the second bonding member BE2 is installed, the electronic component EL can be transferred from the temporary substrate TSB to the second substrate SB2 and bonded to the second substrate SB2 to form the electronic device ED. In this embodiment, all electronic components in the electronic device ED can be recycled electronic components (i.e., electronic component EL). In this case, such as Figure 6 As shown in process (III), the height relationship between any two of the first electronic component EL1, the second electronic component EL2, and the third electronic component EL3 can be referred to in equations (1) and (2) above, and will not be repeated here. It should be noted that the electronic component EL in this embodiment can also be used as a repair electronic component in the electronic device ED.

[0074] Please refer to Figure 7 , Figure 7 This is a schematic diagram illustrating the manufacturing process of an electronic device according to a third embodiment of the present invention. In this embodiment, the electronic components EL in the electronic panel EP may include light-emitting elements LE of different colors and similar appearances. Specifically, as... Figure 7As shown in process (I), the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3 in the electronic panel EP can emit light of different colors, such as red, green, and blue light respectively, and can be mixed to produce white light, but are not limited thereto. In this case, the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3 can each be contained in a sub-pixel, and these sub-pixels can form a pixel. Furthermore, the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3 can have the same shape and size.

[0075] In this embodiment, the electronic component EL can be debonded to the first substrate SB1 through multiple debonding processes, but this is not a limitation. Figure 7 As shown in process (I), firstly, the first bonding member BE1 between the first light-emitting element LE1 and the first substrate SB1 can be broken, allowing the first light-emitting element LE1 to be separated from the first substrate SB1. Next, the first light-emitting element LE1 can be transferred to a temporary substrate TSB by pick-and-place transfer (e.g., by mechanical clamping). Afterwards, the second light-emitting element LE2 and the third light-emitting element LE3 can be sequentially separated from the first substrate SB1 and transferred to the temporary substrate TSB using the above method. Thus, the steps of debonding the electronic component EL from the first substrate SB1 and transferring the electronic component EL to the temporary substrate TSB are completed. It should be noted that the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3 can be separated from the first substrate SB1 in any order, not limited to the above-described order. Furthermore, as... Figure 7 As shown in process (II), the temporary substrate TSB of this embodiment may include a plurality of recesses RS for accommodating the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3, but is not limited thereto. It should be noted that the disassembly and bonding method of the electronic component EL and the structure of the temporary substrate TSB in this embodiment can also refer to the content of the above embodiments.

[0076] In this embodiment, before the step of debonding the electronic component EL to the first substrate SB1, the manufacturing method M100 may further include providing a baffle SH above the first substrate SB1, such that the electronic component EL is located between the first substrate SB1 and the baffle SH. The baffle SH and the first substrate SB1 may have a distance A1, wherein the distance A1 may be less than 10 micrometers (μm) (i.e., A1 < 10 μm), but is not limited thereto. In some embodiments, the distance A1 may be less than 9 μm (i.e., A1 < 9 μm). In some embodiments, the distance A1 may be less than 8 μm (i.e., A1 < 8 μm). In some embodiments, when the first substrate SB1 does not include the insulating layer INL, the distance A1 may be defined as the minimum distance between the baffle SH and the upper surface of the circuit layer CL1 in the top view direction. In some embodiments, when the first substrate SB1 includes the insulating layer INL, the distance A1 may be defined as the minimum distance between the baffle SH and the upper surface of the insulating layer INL in the top view direction. By setting the baffle SH, the possibility of electronic component EL detaching from the first substrate SB1 and being damaged or lost after the first bonding member BE1 is broken can be reduced, thereby improving the recycling effect of electronic component EL. The step of setting the baffle SH in this embodiment can be applied to various embodiments and variations of the present invention.

[0077] After transferring the electronic component EL to the temporary substrate TSB, the second bonding member BE2 can be installed after removing any residue of the first bonding member BE1 from the electronic component EL. For example... Figure 7 As shown in process (II), in this embodiment, the second bonding member BE2 can be set by laser dispensing, but this is not a limitation. In some embodiments, the second bonding member BE2 can be set by the method described in the first embodiment above. Furthermore, after setting the second bonding member BE2, the manufacturing method M100 may also include a testing step on these electronic components EL. For example, as... Figure 7 As shown in process (III), after the second bonding member BE2 is set, the electronic components EL can be transferred to a detection board TB and bonded to the detection board TB. Then, the electronic components EL can be detected as defective by any suitable method. The detection methods for the electronic components EL described above include, for example, electroluminescence (EL) or photoluminescence (PL), but are not limited thereto. The detection steps for the electronic components EL in this embodiment can be applied to various embodiments and variations of the present invention.

[0078] After the testing step of electronic component EL, electronic component EL can be transferred from the testing board TB to the second substrate SB2 to form electronic device ED. The detailed structure of electronic device ED can be referred to in any of the above embodiments, and will not be repeated here.

[0079] Please refer to Figure 8 , Figure 8 This is a schematic diagram illustrating the manufacturing process of an electronic device according to a fourth embodiment of the present invention. In this embodiment, the electronic components EL in the electronic panel EP may include light-emitting elements LE of different colors and shapes. For example, the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3 in the electronic panel EP may emit red light, green light, and blue light respectively, and may mix to produce white light, but are not limited thereto. Furthermore, the first light-emitting element LE1 and the second light-emitting element LE2 may have different areas in the top view, and the first light-emitting element LE1 and the third light-emitting element LE3 may have different shapes in the top view, but are not limited thereto.

[0080] According to this embodiment, the first bonding member BE1 between all electronic components EL and the first substrate SB1 can be destroyed in a single step, thereby separating the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3 from the first substrate SB1. The method for destroying the first bonding member BE1 can be referred to the above embodiment. Then, these light-emitting elements LE can be transferred to a temporary substrate TSB by pick-and-place transfer. The temporary substrate TSB may include grooves RS1, RS2, and RS3, which are used to accommodate the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3, respectively. The features of grooves RS1, RS2, and RS3 can be referred to above, and will not be repeated here. Next, the second bonding member BE2 can be set on the electronic component EL using a dispensing tool TL, and the electronic component EL can be transferred to the second substrate SB2 to form the electronic device ED. In this embodiment, the portion P1 of the first bonding member BE1 remaining on the electronic component EL may not be removed. Therefore, after the second bonding member BE2 is installed, the portion P1 of the first bonding member BE1 may be located between the second bonding member BE2 and the electronic component EL, but this is not a limitation. All electronic components in the electronic device ED of this embodiment may be recycled electronic components (i.e., electronic component EL), but this is not a limitation. In some embodiments, recycled electronic components may be used as repair electronic components in the electronic device ED.

[0081] It should be noted that the manufacturing method of the electronic device ED in this embodiment is not limited to the above. In some embodiments, three breaking steps of the first bonding member BE1 may be performed to separate the first light-emitting element LE1, the second light-emitting element LE2, and the third light-emitting element LE3 from the first substrate SB1 and transfer them to the temporary substrate TSB, respectively. In some embodiments, the temporary substrate TSB may include a magnetic element ME instead of a groove RS to attract the magnetic electronic component EL. In some embodiments, the second bonding member BE2 may be disposed on the electronic component EL by laser dispensing.

[0082] Please refer to Figure 9 , Figure 9 This is a schematic diagram of the manufacturing process of an electronic device according to a fifth embodiment of the present invention. The electronic panel EP of this embodiment may further include a bottom filler material UF disposed between the electronic component EL and the first substrate SB1. Specifically, as... Figure 9 As shown in process (I), the underfill material UF can be filled into the opening OP defined by the insulating layer INL to fix the electronic component EL. The underfill material UF may not cover the electronic component EL, or in other words, the underfill material UF may not cover the upper surface of the electronic component EL. The underfill material UF may include any suitable insulating material, such as epoxy resin or acrylic resin, but is not limited thereto.

[0083] After the bottom filler material UF is applied to the electronic panel EP, if the first substrate SB1 of the electronic panel EP is found to be defective, or if the electronic panel EP becomes defective due to subsequent process errors, the electronic component EL can be decoupled from the first substrate SB1 to recover the electronic component EL, and the recovered electronic component EL can be transferred to the second substrate SB2 of the electronic device ED. In one embodiment, the bottom filler material UF may not be removed before the step of decoupling the electronic component EL from the first substrate SB1. In this case, if... Figure 9 As shown in process (II), after the first bonding member BE1 is broken, a portion P3 of the bottom filler UF can be separated from the first substrate SB1 along with the electronic component EL. Then, after the electronic component EL is transferred to the temporary substrate TSB, as... Figure 9 As shown in process (III), a portion P3 of the underfill material UF can be located on the electronic component EL. That is, the electronic component EL can have a portion P1 remaining from the first bonding member BE1 and a portion P3 of the underfill material UF. In this case, after the electronic component EL is transferred to the second substrate SB2, the portion P3 of the underfill material UF can be transferred to the second substrate SB2 along with the electronic component EL, that is, the electronic device ED can include a portion P3 of the underfill material UF. It should be noted that... Figure 9 The temporary substrate TSB shown is merely exemplary, and the structure of the temporary substrate TSB in any of the above embodiments can be referenced. Furthermore, the arrangement of the second bonding member BE2 and the method of transferring the electronic component EL to the temporary substrate TSB in this embodiment can be referenced from the content of any of the above embodiments.

[0084] In one embodiment, although not shown in the figures, the manufacturing method M100 may further include a step of removing the underfill material UF before the step of debonding the electronic component EL to the first substrate SB1. For example, in Figure 9In the structure shown in process (I), the underfill material UF can be removed first by any suitable agent (e.g., an agent that can decompose the material of the underfill material UF), and then the recycling process of the electronic component EL can be performed according to any of the above embodiments, but is not limited thereto. In some embodiments, the step of removing the underfill material UF can be performed by transferring the electronic component EL to a temporary substrate TSB (i.e., Figure 9 The process is carried out after (as shown in process (III)).

[0085] Please refer to Figure 10 , Figure 10 This is a schematic diagram of the manufacturing process of an electronic device according to a sixth embodiment of the present invention. The electronic panel EP of this embodiment may further include a third substrate SB3 and an adhesive layer AD, wherein the adhesive layer AD may include any suitable adhesive material, such as epoxy resin, but is not limited thereto. The adhesive layer AD is used to attach the third substrate SB3 to the first substrate SB1. Figure 10 As shown in structures (I) and (II), the third substrate SB3 can be disposed relative to the first substrate SB1, and the adhesive layer AD and the electronic component EL can be disposed between the first substrate SB1 and the third substrate SB3.

[0086] In one embodiment, such as Figure 10 As shown in structure (I), the third substrate SB3 may include a substrate BS3 and a light-shielding layer LS and a light-filtering layer CF disposed on the substrate BS3. The light-shielding layer LS may correspond to the insulating layer INL of the first substrate SB1. The light-filtering layer CF may correspond to the electronic component EL. The light-filtering layer CF may include a plurality of filter units, such as filter unit CF1, filter unit CF2, and filter unit CF3. Filter unit CF1, filter unit CF2, and filter unit CF3 may each correspond to the electronic component EL within an opening OP of the insulating layer INL. Specifically, the light-shielding layer LS may include a black matrix layer defining a plurality of openings OP1, and the filter units CF1, CF2, and CF3 may each be disposed within one of the openings OP1. The light-filtering layer CF may include any suitable element or film layer that allows light of a specific wavelength to pass through, such as a color filter, but is not limited thereto. In other words, the third substrate SB3 may include, for example, a color filter substrate, but is not limited thereto. In one embodiment, filter units CF1, CF2, and CF3 may transmit red, blue, and green light, respectively, but are not limited thereto. The light-shielding layer LS may include any suitable light-shielding material, such as black photoresist, black printing ink, or black resin, but is not limited thereto. The material of the substrate BS3 may refer to, but is not limited to, the material of the substrate BS1 described above.

[0087] In one embodiment, such as Figure 10 As shown in structure (II), the third substrate SB3, in addition to the aforementioned elements and film layers, may also include a barrier structure BK and an optical layer CV. The barrier structure BK may correspond to the light-shielding layer LS. The optical layer CV may correspond to the light-filtering layer CF. The optical layer CV may include a plurality of optical units, such as optical units C1, C2, and C3. Optical units C1, C2, and C3 may correspond to light-filtering units CF1, CF2, and CF3, respectively. Specifically, the barrier structure BK may define a plurality of openings OP2, and optical units C1, C2, and C3 may be respectively disposed within one of the openings OP2. The optical layer CV may include any suitable material that can change the wavelength or color of light passing through the optical layer CV, or that can change the exit angle of light. The optical layer CV may include quantum dots, fluorescent materials, phosphorescent materials, scattering particles, other suitable materials, or combinations thereof. In one embodiment, the electronic component EL can emit blue light. In this case, the optical unit C1 corresponding to the red filter unit (e.g., filter unit CF1) can convert the light passing through it into red light, the optical unit C3 corresponding to the green filter unit (e.g., filter unit CF3) can convert the light passing through it into green light, and the optical unit C2 corresponding to the blue filter unit (e.g., filter unit CF2) may include scattering particles to change the light emission angle, but is not limited thereto. The barrier structure BK may include any suitable light-shielding material. Furthermore, the third substrate SB3 may also include an encapsulation layer IL disposed between the optical layer CV and the adhesive layer AD. The encapsulation layer IL can be used to reduce the possibility of water and oxygen intrusion into the optical layer CV, thereby providing protection for the optical layer CV. Although Figure 10 The encapsulation layer IL is shown as a single layer only, and this embodiment is not limited thereto. In some embodiments, the encapsulation layer IL may include a multilayer structure, such as a structure formed by stacking multiple inorganic insulating layers or a structure formed by alternating stacking of inorganic and organic insulating layers.

[0088] The structure of the first substrate SB1 of the electronic panel EP in this embodiment can be referred to the content of the above embodiment, so it will not be described again.

[0089] According to this embodiment, after the first substrate SB1 and the third substrate SB3 are bonded together using the adhesive layer AD to form an electronic panel EP, if air bubbles appear between the first substrate SB1 and the third substrate SB3, the electronic panel EP is determined to be defective. In this case, the manufacturing method M100 described above may further include removing the adhesive layer AD to separate the first substrate SB1 and the third substrate SB3 before the step of debonding the electronic component EL from the first substrate SB1. Specifically, the first substrate SB1 and the third substrate SB3 can be separated from each other by breaking the adhesive layer AD (e.g., ...). Figure 10 The structures (I) and (II) are shown. The adhesive layer AD can be destroyed, for example, by cryogenic freezing or other suitable means. In some embodiments, after the adhesive layer AD is destroyed, the first substrate SB1 and the third substrate SB3 can be separated by applying external force. Then, the electronic component EL can be recovered from the first substrate SB1 and used as an electronic component in the electronic device ED, with reference to the method described in the above embodiments.

[0090] In summary, the present invention provides a method for recovering electronic components from a predetermined obsolescence substrate and using the recovered electronic components as electronic components in another electronic device. This can reduce the production cost of electronic devices and potentially reduce carbon emissions. Furthermore, the electronic components in the electronic device formed by the above method can be highly diverse, or the interface properties between the electronic components and their bonding components can be different.

[0091] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for manufacturing an electronic device, characterized in that, Includes the following steps: (a) An electronic panel is provided, the electronic panel including a first substrate and a plurality of electronic components, the plurality of electronic components being bonded to the first substrate; (b) Inspect the electronic panel. If the electronic panel is determined to be defective, proceed to steps (c) to (f). (c) De-attach the plurality of electronic components to the first substrate; (d) Transferring the plurality of electronic components to a temporary substrate; (e) Transferring the plurality of electronic components from the temporary substrate to a second substrate; as well as (f) Bond the plurality of electronic components to the second substrate.

2. The manufacturing method according to claim 1, characterized in that, The step of decoupling the plurality of electronic components from the first substrate includes destroying the plurality of first bonding members between the plurality of electronic components and the first substrate.

3. The manufacturing method according to claim 2, characterized in that, The destruction of the plurality of first bonding members between the plurality of electronic components and the first substrate is performed by a laser process or an etching process.

4. The manufacturing method according to claim 2, characterized in that, After transferring the plurality of electronic components to the temporary substrate, the process also includes removing a portion of the plurality of first bonding members remaining on the plurality of electronic components.

5. The manufacturing method according to claim 1, characterized in that, The plurality of electronic components are transferred to the temporary substrate by means of fluid transfer or pick-and-place transfer.

6. The manufacturing method according to claim 1, characterized in that, The plurality of electronic components include ferromagnetic materials, and the temporary substrate includes a plurality of magnetic elements, each used to adsorb the plurality of electronic components.

7. The manufacturing method according to claim 1, characterized in that, The temporary substrate includes a plurality of recesses, each for accommodating the plurality of electronic components.

8. The manufacturing method according to claim 7, characterized in that, The plurality of electronic components have at least two sizes, and the plurality of recesses of the temporary substrate have at least two sizes, each for accommodating the plurality of electronic components of at least two sizes.

9. The manufacturing method according to claim 1, characterized in that, Prior to the step of debonding the plurality of electronic components from the first substrate, a baffle is disposed above the first substrate, wherein the distance between the baffle and the first substrate is less than 10 micrometers.

10. The manufacturing method according to claim 1, characterized in that, Prior to the step of transferring the plurality of electronic components from the temporary substrate to the second substrate, the method further includes forming a plurality of second bonding members on the plurality of electronic components respectively.

11. The manufacturing method according to claim 10, characterized in that, The plurality of electronic components are bonded to the second substrate via the plurality of second bonding members.

12. The manufacturing method according to claim 1, characterized in that, The electronic panel further includes a bottom filler material disposed between the plurality of electronic components and the first substrate, and the bottom filler material is removed before the step of debonding the plurality of electronic components from the first substrate.

13. The manufacturing method according to claim 1, characterized in that, The electronic panel further includes a third substrate and an adhesive layer, the third substrate being disposed relative to the first substrate, the adhesive layer being disposed between the first substrate and the third substrate and the plurality of electronic components, and prior to the step of debonding the plurality of electronic components from the first substrate, the adhesive layer is removed to separate the first substrate and the third substrate.

14. An electronic device, characterized in that, include: One substrate; as well as A plurality of electronic components are bonded to the substrate; The plurality of electronic components includes a first electronic component and a second electronic component. The first electronic component has a height Ha, and the second electronic component has a height Hb. The height Hb is greater than the height Ha, and the height Ha and the height Hb satisfy the following: 0.05≤(Hb-Ha) / Hb≤1.

1.

15. The electronic device according to claim 14, characterized in that, The height Ha and the height Hb satisfy: 0.10≤(Hb-Ha) / Hb≤1.

1.

16. The electronic device according to claim 14, characterized in that, The height Ha and the height Hb satisfy: 0.05≤(Hb-Ha) / Hb≤0.

55.

17. The electronic device according to claim 14, characterized in that, One of the first electronic component and the second electronic component is a non-recyclable electronic component, while the other of the first electronic component and the second electronic component is a recyclable electronic component.

18. The electronic device according to claim 14, characterized in that, The first electronic component and the second electronic component are recycled electronic components.

19. The electronic device according to claim 14, characterized in that, The plurality of electronic components further includes a third electronic component having a height Hc, wherein the difference between the height Hc and the height Ha is less than the difference between the height Hc and the height Hb.

20. The electronic device according to claim 19, characterized in that, The first electronic component and the third electronic component are non-recyclable electronic components, while the second electronic component is a recycled electronic component.

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