Wafer carrying manipulator

Abstract

The invention discloses a wafer carrying manipulator, belongs to the technical field of manipulators, and aims to solve the problem that wafers are collided and damaged or fall off due to the fact that the vacuum degree is reduced when the wafers are transferred by the manipulator. The wafer carrying manipulator comprises a lifting assembly, a base is arranged on the lifting assembly in a sliding mode, and a rotating assembly is fixedly arranged on the base; a mounting assembly is fixedly arranged at the output end of the rotating assembly, an upper-layer clamping assembly and a lower-layer clamping assembly are arranged in the mounting assembly, a pushing assembly is fixedly arranged on the lower-layer clamping assembly, and a plurality of limiting assemblies are further fixedly arranged on the lower-layer clamping assembly; a pair of auxiliary bearing assemblies are symmetrically arranged on each limiting assembly in a sliding mode, and the auxiliary bearing assemblies are prevented from moving towards the two sides in the inner cavity of the limiting groove, so that the bearing range of the auxiliary bearing assemblies on the wafer is enlarged, and then the wafer can be stably placed.

Description

Technical Field

[0001] This invention relates to the field of robotic arm technology, specifically to a wafer handling robotic arm. Background Technology

[0002] With the development of the Internet of Things, smart cars, and smartphones, the demand for chips is increasing, the semiconductor industry is booming, and the requirements for chip manufacturing technology are also becoming more and more stringent. Before and after photolithography, chips need to undergo resist coating and development, which is a very important process in chip manufacturing. High-performance resist coating and development machines are crucial to chip production capacity and yield. Wafer handling robots are responsible for transferring wafers between various process units of the resist coating and development machine. It is necessary to ensure not only the operating speed of the robot, but also its accuracy and stability.

[0003] Current wafer handling robots typically use vacuum to create negative pressure on the wafer during the handling process, causing the wafer to adhere to the robot and preventing it from slipping off. However, during wafer transfer, the vacuum level may decrease, reducing the robot's effective adhesion to the wafer. This can cause the wafer to slide on the robot, resulting in wafer collision damage or the wafer falling off.

[0004] To address the above problems, a wafer handling robot is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer handling robot. By using this device, the problem of reduced vacuum during wafer transfer is solved. This reduces the effective adsorption force of the robot on the wafer, causing the wafer to slide on the robot, resulting in wafer collision damage or wafer falling.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wafer handling robot, comprising a lifting assembly for adjusting the height of the handling robot, a base for mounting components slidably disposed on the lifting assembly, a rotating assembly fixedly disposed on the base, and a mounting assembly, also for mounting components, fixedly disposed at the output end of the rotating assembly, a vacuum pressure gauge for monitoring vacuum level disposed on the side wall of the mounting assembly, an upper clamping assembly and a lower clamping assembly respectively disposed inside the mounting assembly, wafers being clamped on the upper clamping assembly and the mounting assembly being fixedly mounted inside. A limit switch mounting block is provided, and a limit switch for determining the travel position of the upper and lower clamping components is fixedly mounted on the limit switch mounting block. A wafer positioning block for positioning the wafer is fixedly provided on the lower clamping component. A vacuum chuck for adsorbing the wafer is fixedly provided on the lower clamping component. A pushing component is fixedly provided on the lower clamping component. Several limit components are also fixedly provided on the lower clamping component. A pair of auxiliary support components for expanding the support range are symmetrically slidably provided on each limit component. The pushing component is movably connected to the two auxiliary support components.

[0007] Furthermore, the lifting assembly includes a robot arm mounting base plate, with the base slidably mounted on the side wall of the robot arm mounting base plate. A lead screw module is rotatably mounted inside the robot arm mounting base plate, and the lead screw module is threadedly connected to the base. A drive motor is fixedly mounted on the bottom surface of the robot arm mounting base plate, and the output shaft of the motor passes through the bottom surface of the robot arm mounting base plate and is fixedly connected to the lead screw module. A position adjustment block is fixedly mounted on the top of the robot arm mounting base plate, and a set screw is installed in the screw hole of the position adjustment block. A wire harness housing is fixedly mounted on the side wall of the robot arm mounting base plate.

[0008] Furthermore, the rotating assembly includes a DD motor mounting plate fixedly mounted on the top surface of the base, on which a DD motor is fixedly mounted, and the output shaft of the DD motor is fixedly connected to the mounting assembly.

[0009] Furthermore, the mounting assembly includes an arm base plate fixedly mounted on the output shaft of the DD motor. A housing is provided above the arm base plate. The arm base plate and the housing are fixedly connected by end face fixing plate one and end face fixing plate two. A pair of guide rail mounting plates are symmetrically fixedly mounted on the top surface of the arm base plate. Linear guide rail one and linear guide rail two are fixedly mounted on the side wall of each guide rail mounting plate, and linear guide rail one is positioned above linear guide rail two.

[0010] Furthermore, the upper clamping assembly includes a slider mounting block 1 that is slidably mounted on two linear guide rails 2. A finger connecting block 1 is fixedly mounted on each of the two slider mounting blocks 1. A finger mounting plate is fixedly mounted on both finger connecting blocks 1. A finger 1 is fixedly mounted on the top surface of the finger mounting plate. A servo motor 1 is fixedly mounted on the top surface of the arm base plate. An idler wheel 1 and a pair of synchronous pulleys 1 are rotatably mounted on the side wall of one of the guide rail mounting plates. The two synchronous pulleys 1 are connected by a synchronous belt 1. A drag chain 1 is provided inside the mounting assembly. One end of the drag chain 1 is fixedly connected to the slider mounting block 1. The synchronous belt 1 and the slider mounting block 1 are fixedly connected by a connecting plate 1.

[0011] Furthermore, the lower clamping assembly includes two sliding mounting blocks 2 that are slidably mounted on two linear guide rails 1 respectively. Two finger connecting blocks 2 are fixedly mounted on the two sliding mounting blocks 2 respectively, and two fingers 2 are fixedly mounted on the two finger connecting blocks 2 together. A servo motor 2 is fixedly mounted on the top surface of the arm base plate. An idler wheel 2 and a pair of synchronous pulleys 2 are rotatably mounted on the side wall of another guide rail mounting plate. The two synchronous pulleys 2 are connected by a synchronous belt 2 for transmission. The synchronous belt 2 and the sliding mounting blocks 2 are fixedly connected by a connecting plate 2. A drag chain 2 is provided inside the mounting assembly. One end of the drag chain 2 is fixedly connected to the sliding mounting block 2.

[0012] Furthermore, the limiting component includes a pair of fixing blocks fixedly installed on the two side walls of the finger, and a limiting plate is fixedly installed on both fixing blocks, with a limiting groove formed on the top surface of the limiting plate.

[0013] Furthermore, the actuating component includes an electric actuator embedded and fixedly installed inside the second finger, a connecting plate fixedly installed on the output shaft of the electric actuator, and two pairs of mounting ears fixedly installed on the side wall of the connecting plate.

[0014] Furthermore, the auxiliary support assembly includes a slide seat that is slidably installed in the inner cavity of the limiting groove. A negative pressure component is fixedly installed on the top surface of the slide seat. A connecting cylinder is fixedly installed on the side wall of the slide seat. A pusher is slidably installed in the inner cavity of the connecting cylinder. A disc is fixedly installed at the end of the pusher. The outer wall of the disc facing the connecting cylinder is elastically connected to the side wall of the connecting cylinder by a spring. A pair of mounting ears are fixedly installed on the outer wall of the disc facing away from the connecting cylinder. The mounting ears are movably connected to the mounting ears by a connecting rod.

[0015] Furthermore, the negative pressure assembly includes a negative pressure suction cup that is fixedly installed on the top surface of the slide block, a slide column that is slidably installed in the inner cavity of the slide block, a piston that is fixedly installed on the side wall of the slide column near the negative pressure suction cup, and the side wall of the slide column away from the negative pressure suction cup is elastically connected to the bottom wall of the inner cavity of the slide block by a spring. A guide groove is provided on the slide column.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The auxiliary support component in this invention prevents the wafer from moving to both sides within the inner cavity of the limiting groove, thereby increasing the support range of the auxiliary support component on the wafer, which in turn enables the wafer to be placed stably on the second finger, reducing the probability of the wafer falling.

[0017] 2. In the initial state of the present invention, the negative pressure component on the auxiliary support component is not in a negative pressure state and will not generate an adsorption force on the wafer, so that the auxiliary support component can slide smoothly on the wafer and will not hinder the auxiliary support component from moving to both sides in the inner cavity of the limiting groove. At the same time, it will not push the wafer on the second finger out of place, thereby avoiding the phenomenon of wafer collision damage or falling damage.

[0018] 3. After the auxiliary support component in this invention reaches the maximum moving distance, it can also create a negative pressure environment in the space formed by the negative pressure suction cup and the wafer through the sliding column and piston, so that the negative pressure suction cup can generate an adsorption force on the wafer, thereby making the wafer firmly adsorbed on the negative pressure suction cup, preventing the wafer from falling off due to the decrease in vacuum degree of the vacuum suction cup. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the overall structure of the present invention; Figure 2 This is a front view of the overall structure of the present invention; Figure 3 This is a schematic diagram showing the installation position of the rotating component of the present invention; Figure 4 This is a schematic diagram showing the installation position of the upper clamping component of the present invention; Figure 5 This is a schematic diagram showing the installation position of the lower clamping component of the present invention; Figure 6 This is a side view of the mounting assembly, upper clamping assembly, and lower clamping assembly of the present invention; Figure 7 This is a side view of the lower clamping assembly of the present invention; Figure 8 This is a schematic diagram showing the installation position of the limiting component of the present invention; Figure 9 for Figure 8 Enlarged view of point A; Figure 10 This is a three-dimensional structural diagram of the second finger of the present invention; Figure 11 for Figure 10 Enlarged view of point B; Figure 12 for Figure 11 Enlarged view of point C; Figure 13This is a cross-sectional schematic diagram of the limiting component and the auxiliary support component of the present invention; Figure 14 for Figure 13 Enlarged view of point D.

[0020] In the diagram: 1. Lifting assembly; 11. Robotic arm mounting base plate; 12. Position adjustment block; 13. Top screw; 14. Lead screw module; 15. Motor; 16. Wiring harness housing; 2. Base; 3. Rotating assembly; 31. DD motor mounting plate; 32. DD motor; 4. Mounting assembly; 41. Arm base plate; 42. Housing; 43. End face fixing plate one; 44. End face fixing plate two; 45. Linear guide rail one; 46. Linear guide rail two; 47. Guide rail mounting plate; 5. Vacuum pressure gauge; 6. Upper clamping assembly; 61. Slider mounting block one; 62. Finger connecting block one; 63. Finger mounting plate; 64. Finger one; 65. Servo motor one; 66. Synchronous pulley one; 67. Synchronous belt one; 68. Idler pulley one; 69. Cable chain two; 610. Connecting plate one; 7. Lower clamping assembly; 71. Sliding mounting block two; 72. Hand 73. Connecting block 2; 74. Finger 2; 75. Servo motor 2; 76. Synchronous pulley 2; 77. Synchronous belt 2; 78. Idler pulley 2; 79. Cable chain 1; 8. Connecting plate 2; 9. Wafer; 10. Vacuum chuck; 11. Limiting component; 101. Fixing block; 102. Limiting plate; 103. Limiting groove; 20. Auxiliary support component; 201. Slide; 202. Connecting cylinder; 203. Pushing component; 204. 1. Disc; 205. Spring 1; 206. Mounting ear 2; 207. Negative pressure assembly; 2071. Negative pressure suction cup; 2072. Sliding column; 2073. Piston; 2074. Guide groove; 2075. Spring 2; 30. Push assembly; 301. Electric push rod; 302. Connecting plate; 303. Mounting ear 1; 304. Connecting rod; 40. Limit switch mounting block; 50. Limit switch; 60. Wafer positioning block. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] To address the issue of reduced vacuum levels during the transfer of wafer 8 by the robotic arm, which decreases the effective suction force of the robotic arm on wafer 8, causing wafer 8 to slip on the robotic arm and resulting in collision damage or falling off, the following technical solutions are proposed: Figures 1-14 As shown, the following preferred technical solutions are provided: like Figure 1As shown, a wafer handling robot includes a lifting assembly 1 for adjusting the height of the robot. A base 2 for mounting components is slidably mounted on the lifting assembly 1. A rotating assembly 3 is fixedly mounted on the base 2. A mounting assembly 4, also for mounting components, is fixedly mounted at the output end of the rotating assembly 3. A vacuum pressure gauge 5 for monitoring vacuum levels is mounted on the side wall of the mounting assembly 4. An upper clamping assembly 6 and a lower clamping assembly 7 are respectively disposed inside the mounting assembly 4. Wafers 8 are clamped on the upper clamping assembly 6 and the lower clamping assembly 7, respectively. Figure 7 As shown, a limit switch mounting block 40 is fixedly installed inside the mounting component 4, and a limit switch 50 for determining the travel position of the upper clamping component 6 and the lower clamping component 7 is fixedly installed on the limit switch mounting block 40. Figures 8-9 As shown, a wafer positioning block 60 for positioning the wafer 8 is fixedly disposed on the lower clamping assembly 7, and a vacuum chuck 9 for adsorbing the wafer 8 is fixedly disposed on the lower clamping assembly 7, such as... Figure 11 As shown, a pushing component 30 is fixedly installed on the lower clamping component 7, and several limiting components 10 are also fixedly installed on the lower clamping component 7. Each limiting component 10 is symmetrically slidably provided with a pair of auxiliary supporting components 20 to expand the supporting range. The pushing component 30 is movably connected to the two auxiliary supporting components 20 respectively.

[0023] like Figure 2 As shown, the lifting assembly 1 includes a robotic arm mounting base plate 11, a base 2 slidably mounted on the side wall of the robotic arm mounting base plate 11, a lead screw module 14 rotatably mounted inside the robotic arm mounting base plate 11, the lead screw module 14 being threadedly connected to the base 2, a drive motor 15 fixedly mounted on the bottom surface of the robotic arm mounting base plate 11, the output shaft of the motor 15 passing through the bottom surface of the robotic arm mounting base plate 11 and fixedly connected to the lead screw module 14, a position adjustment block 12 fixedly mounted on the top of the robotic arm mounting base plate 11, a set screw 13 installed in the screw hole of the position adjustment block 12, used to fasten and stop the position adjustment block 12, and a wire harness housing 16 fixedly mounted on the side wall of the robotic arm mounting base plate 11, used to protect the wire harness and prevent damage to exposed wires or electric shock to personnel.

[0024] Before handling wafer 8, motor 15 is started to drive lead screw module 14 to rotate. Since lead screw module 14 is threadedly connected to base 2, and base 2 is slidably mounted on the side wall of robot mounting base plate 11, when lead screw module 14 rotates, the threaded action causes base 2 to drive upper clamping assembly 6, lower clamping assembly 7 and other components to adjust their positions. Once the appropriate position is reached, motor 15 stops running.

[0025] like Figure 3As shown, the rotating assembly 3 includes a DD motor mounting plate 31 fixedly mounted on the top surface of the base 2. A DD motor 32 is fixedly mounted on the top surface of the DD motor mounting plate 31. The output shaft of the DD motor 32 is fixedly connected to the mounting assembly 4. After the lifting assembly 1 is adjusted to the correct position, the DD motor 32 is started to drive the mounting assembly 4 and the upper clamping assembly 6 and the lower clamping assembly 7 on the mounting assembly 4 to rotate. When the rotation reaches a suitable angle, the DD motor 32 stops rotating, so that the upper clamping assembly 6 and the lower clamping assembly 7 are positioned.

[0026] like Figure 3 As shown, the mounting assembly 4 includes an arm base plate 41 fixedly mounted on the output shaft of the DD motor 32. A housing 42 is positioned above the arm base plate 41. The arm base plate 41 and the housing 42 are fixedly connected by end face fixing plate one 43 and end face fixing plate two 44, forming a frame structure that supports and protects the internal components. Figure 5 As shown, a pair of guide rail mounting plates 47 are symmetrically fixed on the top surface of the arm base plate 41. Linear guide rail 1 45 and linear guide rail 2 46 are fixedly installed on the side wall of each guide rail mounting plate 47, and linear guide rail 1 45 is positioned above linear guide rail 2 46.

[0027] like Figure 4 As shown, the upper clamping assembly 6 includes slider mounting blocks 61 that are slidably mounted on two linear guide rails 46. Finger connecting blocks 62 are fixedly mounted on the two slider mounting blocks 61 respectively. A finger mounting plate 63 is fixedly mounted on both finger connecting blocks 62. A finger 64 is fixedly mounted on the top surface of the finger mounting plate 63. A servo motor 65 is fixedly mounted on the top surface of the arm base plate 41. An idler wheel 68 and a pair of synchronous pulleys 66 are rotatably mounted on the side wall of one of the guide rail mounting plates 47. The two synchronous pulleys 66 are connected by a synchronous belt 67. The idler wheel 68 is used to adjust the tension of the synchronous belt 67. A drag chain 78 is provided inside the mounting assembly 4. One end of the drag chain 78 is fixedly connected to the slider mounting block 61. The synchronous belt 67 is fixedly connected to the slider mounting block 61 by a connecting plate 610.

[0028] After adjusting the lifting assembly 1 and the rotating assembly 3 into place, the servo motor 65 is started to drive the synchronous pulley 66 to rotate. The synchronous pulley 66 drives another synchronous pulley 66 to rotate via the synchronous belt 67. During the rotation of the synchronous belt 67, the slider mounting block 61 can slide on the linear guide rail 46 via the connecting plate 610. During the movement of the slider mounting block 61, the finger 64 can be extended towards the wafer 8 via the finger connecting block 62 and the finger mounting plate 63 until the wafer 8 is clamped. After clamping is completed, the servo motor 65 reverses and drives the finger connecting block 62, the finger mounting plate 63 and the finger 64 via the synchronous pulley 66, the synchronous belt 67 and the connecting plate 610 to drive the slider mounting block 61 to slide in the opposite direction on the linear guide rail 46 until the finger 64 returns to its original position.

[0029] like Figure 5 As shown, the lower clamping assembly 7 includes two sliding mounting blocks 71 that are slidably mounted on two linear guide rails 45. Two finger connecting blocks 72 are fixedly mounted on the two sliding mounting blocks 71 respectively. Two fingers 73 are fixedly mounted on the two finger connecting blocks 72. A servo motor 74 is fixedly mounted on the top surface of the arm base plate 41. An idler wheel 77 and a pair of synchronous pulleys 75 are rotatably mounted on the side wall of another guide rail mounting plate 47. The two synchronous pulleys 75 are connected by a synchronous belt 76. The idler wheel 77 is used to adjust the tension of the synchronous belt 76. The synchronous belt 76 is fixedly connected to the sliding mounting blocks 71 by a connecting plate 79. A drag chain 69 is provided inside the mounting assembly 4. One end of the drag chain 69 is fixedly connected to the sliding mounting block 71.

[0030] After adjusting the lifting assembly 1 and the rotating assembly 3 into place, the servo motor 2 74 is started to drive the synchronous pulley 2 75 to rotate. The synchronous pulley 2 75 drives another synchronous pulley 2 75 to rotate through the synchronous belt 2 76. During the rotation of the synchronous belt 2 76, the sliding mounting block 2 71 can slide on the linear guide rail 1 45 through the connecting plate 2 79. During the sliding process, the sliding mounting block 2 71 can extend the finger 2 73 towards the wafer 8 through the finger connecting block 2 72 until the wafer 8 is clamped. After clamping is completed, the servo motor 2 74 rotates in the opposite direction, which can drive the sliding mounting block 2 71 to slide in the opposite direction on the linear guide rail 1 45 through the synchronous pulley 2 75, the synchronous belt 2 76 and the connecting plate 2 79 until the finger 2 73 returns to its original position.

[0031] like Figure 11 As shown, the limiting component 10 includes a pair of fixing blocks 101 fixedly installed on the side wall of the second finger 73. A limiting plate 102 is fixedly installed on both fixing blocks 101. A limiting groove 103 is formed on the top surface of the limiting plate 102.

[0032] like Figure 11 and Figures 13-14 As shown, the actuating assembly 30 includes an electric actuator 301 embedded and fixedly installed inside the finger 2 73. A connecting plate 302 is fixedly installed on the output shaft of the electric actuator 301, and two pairs of mounting ears 303 are fixedly installed on the side wall of the connecting plate 302.

[0033] like Figure 9 and Figure 12 As shown, the auxiliary support assembly 20 includes a slide 201 slidably installed in the inner cavity of the limiting groove 103. A negative pressure assembly 207 is fixedly installed on the top surface of the slide 201. A connecting cylinder 202 is fixedly installed on the side wall of the slide 201. A pusher 203 is slidably installed in the inner cavity of the connecting cylinder 202. A disc 204 is fixedly installed at the end of the pusher 203. The outer wall of the disc 204 facing the connecting cylinder 202 is elastically connected to the side wall of the connecting cylinder 202 by a spring 205. A pair of mounting ears 206 are fixedly installed on the outer wall of the disc 204 facing away from the connecting cylinder 202. The mounting ears 206 and the mounting ears 103 are movably connected by a connecting rod 304.

[0034] During the clamping of wafer 8, when the vacuum pressure gauge 5 detects a decrease in the vacuum level of the vacuum chuck 9, it indicates that the suction force of the vacuum chuck 9 on wafer 8 has decreased. During handling, wafer 8 is prone to collision damage or falling damage. To avoid this, the electric push rod 301 is extended. During the extension of the electric push rod 301, it pushes the auxiliary support assembly 20 to move to both sides within the cavity of the limiting groove 103 via the connecting plate 302, mounting ear 303, and connecting rod 304. Initially, the negative pressure component 207 on the auxiliary support assembly 20 is not in a negative pressure state because... Therefore, the negative pressure component 207 will not exert an adsorption force on the wafer 8, and the auxiliary support component 20 can slide smoothly on the wafer 8 without hindering the auxiliary support component 20 from moving to both sides in the inner cavity of the limiting groove 103. At the same time, it will not push the wafer 8 on the second finger 73 out of place, thereby avoiding the phenomenon of the wafer 8 being damaged by collision or falling. When the auxiliary support component 20 is hindered from moving to both sides in the inner cavity of the limiting groove 103, the supporting range of the auxiliary support component 20 on the wafer is increased, thereby enabling the wafer 8 to be placed stably on the second finger 73, reducing the probability of the wafer 8 falling.

[0035] To address the technical problem of the inability to restore the adsorption effect when the vacuum level decreases during wafer clamping, such as... Figures 10-14 As shown, the following preferred technical solutions are provided: like Figure 12As shown, the negative pressure assembly 207 includes a negative pressure suction cup 2071 that is fixedly installed on the top surface of the slide block 201. A slide column 2072 is slidably installed in the inner cavity of the slide block 201. A piston 2073 is fixedly installed on the side wall of the slide column 2072 near the negative pressure suction cup 2071. The side wall of the slide column 2072 away from the negative pressure suction cup 2071 is elastically connected to the bottom wall of the inner cavity of the slide block 201 by a second spring 2075. The second spring 2075 is used to achieve the reset effect of the slide column 2072. A guide groove 2074 is provided on the slide column 2072.

[0036] Specifically, when the electric actuator 301 pushes the auxiliary support assembly 20 to move laterally within the cavity of the limiting groove 103 via the connecting plate 302, mounting ear 1 303, and connecting rod 304, the spring 205, due to its large elastic force, will not be compressed when the auxiliary support assembly 20 has not reached its maximum moving distance. When the auxiliary support assembly 20 reaches its maximum moving distance, it will be blocked by the side wall of the cavity of the limiting groove 103. At this time, the electric actuator 301 continues to extend and, through the connecting plate 302, mounting ear 1 303, connecting rod 304, mounting ear 2 206, and disc 204, drives the pusher 203 to move into the cavity of the slide block 201, compressing the spring 205. Figure 14 As shown, during the movement of the pusher 203, the protrusion on the pusher 203 cooperates with the guide groove 2074 to drive the slide column 2072 and piston 2073 to move away from the negative pressure suction cup 2071. At this time, a negative pressure environment is formed in the space formed by the negative pressure suction cup 2071 and the wafer 8, so that the negative pressure suction cup 2071 can generate an adsorption force on the wafer 8, thereby making the wafer 8 firmly adsorbed on the negative pressure suction cup 2071, preventing the wafer 8 from falling off due to the decrease in vacuum degree of the vacuum suction cup 9.

[0037] After the auxiliary support assembly 20 is used, the electric actuator 301 retracts to its initial length. At the same time, it can drive all the components on the auxiliary support assembly 20 to reset through the connecting plate 302, mounting lug 303 and connecting rod 304, in preparation for the next use.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0039] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer handling robot, comprising a lifting assembly (1) for adjusting the height of the handling robot, a base (2) for mounting components slidably disposed on the lifting assembly (1), a rotating assembly (3) fixedly disposed on the base (2), a mounting assembly (4) for mounting components fixedly disposed at the output end of the rotating assembly (3), a vacuum pressure gauge (5) for monitoring vacuum level disposed on the side wall of the mounting assembly (4), an upper clamping assembly (6) and a lower clamping assembly (7) respectively disposed inside the mounting assembly (4), a wafer (8) respectively clamped on the upper clamping assembly (6) and the lower clamping assembly (7), a limit switch mounting block (40) fixedly disposed inside the mounting assembly (4), and a limit switch (50) for determining the travel position of the upper clamping assembly (6) and the lower clamping assembly (7) fixedly disposed on the limit switch mounting block (40), characterized in that: The lower clamping assembly (7) is fixedly provided with a wafer positioning block (60) for positioning the wafer (8), a vacuum chuck (9) for adsorbing the wafer (8) is fixedly provided on the lower clamping assembly (7), a pushing assembly (30) is fixedly provided on the lower clamping assembly (7), and a number of limiting assemblies (10) are also fixedly provided on the lower clamping assembly (7). Each limiting assembly (10) is symmetrically and slidably provided with a pair of auxiliary support assemblies (20) to expand the support range. The pushing assembly (30) is movably connected to the two auxiliary support assemblies (20).

2. The wafer handling robot according to claim 1, characterized in that: The lifting assembly (1) includes a robot mounting base plate (11), a base (2) which is slidably mounted on the side wall of the robot mounting base plate (11), a lead screw module (14) is rotatably mounted inside the robot mounting base plate (11), the lead screw module (14) is threadedly connected to the base (2), a drive motor (15) is fixedly mounted on the bottom surface of the robot mounting base plate (11), the output shaft of the motor (15) passes through the bottom surface of the robot mounting base plate (11) and is fixedly connected to the lead screw module (14), a position adjustment block (12) is fixedly mounted on the top of the robot mounting base plate (11), a set screw (13) is installed in the screw hole of the position adjustment block (12), and a wire harness shell (16) is fixedly mounted on the side wall of the robot mounting base plate (11).

3. The wafer handling robot according to claim 1, characterized in that: The rotating assembly (3) includes a DD motor mounting plate (31) fixedly mounted on the top surface of the base (2), a DD motor (32) fixedly mounted on the top surface of the DD motor mounting plate (31), and the output shaft of the DD motor (32) is fixedly connected to the mounting assembly (4).

4. A wafer handling robot according to claim 3, characterized in that: The mounting assembly (4) includes an arm base plate (41) fixedly mounted on the output shaft of the DD motor (32). A housing (42) is provided above the arm base plate (41). The arm base plate (41) and the housing (42) are fixedly connected by an end face fixing plate one (43) and an end face fixing plate two (44). A pair of guide rail mounting plates (47) are symmetrically fixedly mounted on the top surface of the arm base plate (41). Linear guide rail one (45) and linear guide rail two (46) are fixedly mounted on the side wall of each guide rail mounting plate (47), and linear guide rail one (45) is located above linear guide rail two (46).

5. A wafer handling robot according to claim 4, characterized in that: The upper clamping assembly (6) includes a slider mounting block (61) that is slidably mounted on two linear guide rails (46). A finger connecting block (62) is fixedly mounted on each of the two slider mounting blocks (61). A finger mounting plate (63) is fixedly mounted on both of the two finger connecting blocks (62). A finger (64) is fixedly mounted on the top surface of the finger mounting plate (63). A servo motor (65) is fixedly mounted on the top surface of the arm base plate (41). An idler wheel (68) and a pair of synchronous pulleys (66) are rotatably mounted on the side wall of one of the guide rail mounting plates (47). The two synchronous pulleys (66) are connected by a synchronous belt (67). A drag chain (78) is provided inside the mounting assembly (4). One end of the drag chain (78) is fixedly connected to the slider mounting block (61). The synchronous belt (67) is fixedly connected to the slider mounting block (61) through a connecting plate (610).

6. A wafer handling robot according to claim 4, characterized in that: The lower clamping assembly (7) includes two sliding mounting blocks (71) that are slidably mounted on two linear guide rails (45). Two finger connecting blocks (72) are fixedly mounted on the two sliding mounting blocks (71). Two fingers (73) are fixedly mounted on the two finger connecting blocks (72). A servo motor (74) is fixedly mounted on the top surface of the arm base plate (41). An idler wheel (77) and a pair of synchronous pulleys (75) are rotatably mounted on the side wall of another guide rail mounting plate (47). The two synchronous pulleys (75) are connected by a synchronous belt (76). The synchronous belt (76) and the sliding mounting block (71) are fixedly connected by a connecting plate (79). The mounting assembly (4) is equipped with a drag chain (69). One end of the drag chain (69) is fixedly connected to the sliding mounting block (71).

7. A wafer handling robot according to claim 6, characterized in that: The limiting component (10) includes a pair of fixing blocks (101) fixedly installed on the side wall of the second finger (73), and a limiting plate (102) is fixedly installed on the two fixing blocks (101), and a limiting groove (103) is opened on the top surface of the limiting plate (102).

8. A wafer handling robot according to claim 6, characterized in that: The push assembly (30) includes an electric push rod (301) embedded and fixedly installed inside the second finger (73), a connecting plate (302) fixedly installed on the output shaft of the electric push rod (301), and two pairs of mounting ears (303) fixedly installed on the side wall of the connecting plate (302).

9. A wafer handling robot according to claim 8, characterized in that: The auxiliary support assembly (20) includes a slide (201) slidably installed in the inner cavity of the limiting groove (103). A negative pressure assembly (207) is fixedly installed on the top surface of the slide (201). A connecting cylinder (202) is fixedly installed on the side wall of the slide (201). A pusher (203) is slidably installed in the inner cavity of the connecting cylinder (202). A disc (204) is fixedly installed at the end of the pusher (203). The outer wall of the disc (204) facing the connecting cylinder (202) is elastically connected to the side wall of the connecting cylinder (202) by a spring (205). A pair of mounting ears (206) are fixedly installed on the outer wall of the disc (204) facing away from the connecting cylinder (202). The mounting ears (206) and the mounting ears (303) are movably connected by a connecting rod (304).

10. A wafer handling robot according to claim 9, characterized in that: The negative pressure assembly (207) includes a negative pressure suction cup (2071) that is fixedly installed on the top surface of the slide (201). A slide column (2072) is slidably installed in the inner cavity of the slide (201). A piston (2073) is fixedly installed on the side wall of the slide column (2072) near the negative pressure suction cup (2071). The side wall of the slide column (2072) away from the negative pressure suction cup (2071) is elastically connected to the bottom wall of the inner cavity of the slide (201) by a spring (2075). A guide groove (2074) is provided on the slide column (2072).

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