Component carrier with hydrophobic protective film and method of manufacture

Abstract

There is described a component carrier (100) comprising: i) a stack (101) comprising at least one electrically conductive layer structure (104) and at least two electrically insulating layer structures (102); ii) a cavity (110) formed in the stack (101), and iii) at least one hydrophobic protective film (120) arranged on at least a portion of an inner surface of the stack (101) defining the cavity (110).

Description

Technical Field

[0001] This invention relates to a component carrier having a stack, the stack comprising at least one electrically conductive layer structure and at least two electrically insulating layer structures, wherein a cavity is formed in the stack, and wherein at least one hydrophobic protective film is disposed in the cavity. Furthermore, this invention relates to a method of manufacturing the component carrier.

[0002] Therefore, this invention relates to the technical field of component carriers such as printed circuit boards or IC substrates. Background Technology

[0003] With the increasing functionality of products equipped with component carriers containing one or more electronic components, the miniaturization of these electronic components, and the growing number of electronic components mounted on component carriers such as printed circuit boards, increasingly robust array-type components or packages with multiple electronic components are being adopted. These array-type components or packages have multiple contacts or connections with increasingly smaller spacing between them. Heat removal generated by these electronic components and the component carrier itself during operation is becoming an increasingly important issue. Furthermore, effective prevention of electromagnetic interference (EMI) is also becoming increasingly important. Simultaneously, the component carrier must be mechanically robust and electrically and magnetically reliable to operate even under harsh conditions.

[0004] In particular, forming the cavity on the circuit board can be challenging when the cavity in the circuit board needs to simultaneously meet technical purposes and functions, such as being used as a waveguide in radio frequency applications.

[0005] Figure 4 A conventional circuit board 200 with cavity 210 is shown. The bottom and sidewalls 216 of cavity 210 are metallized and formed of copper. A top cover 220 is arranged on the top of cavity 210. In addition, an inlet and an outlet are formed at the bottom of cavity 210, respectively. This design can be referred to as an "air-filled substrate integrated waveguide (AFSIW)". An illustrative description of AFSIW can be summarized as follows: electromagnetic waves (light) are irradiated through a slot into a rectangular channel (AFSIW cavity) equipped with reflectors at both the top and bottom. The light is reflected inside the AFSIW at the top and bottom, and the light exits from an opening (antenna) located at the other end. The process has extremely low loss, simply because the channel is completely sealed and equipped with reflectors; only dry air exists in the channel, so the travel of light is not disturbed.

[0006] AFSIWs are known structures particularly well-suited for low-loss HF signal transmission, with the dimensions depending on the applied frequency. AFSIWs typically include a feed port, which can be any structure located at the bottom or top of the AFSIW structure that allows HF signals to be fed into and guided out of the AFSIW. To obtain a reliable and low-loss AFSIW, proper alignment of the feed structure with the AFSIW sidewalls is often required, as misalignment leads to signal loss and thus lower-quality AFSIW products. Therefore, providing cavities for efficient and reliable component carriers, especially for waveguide applications, can be considered a challenge.

[0007] Furthermore, cavities in component carriers, such as the aforementioned AFSIW, may be susceptible to wear and tear, and particularly to corrosion (e.g., due to fluids such as water or moisture that may enter the cavity). Specifically, since at least a portion of the cavity defined by the stacked components includes a metal surface, there may be specific corrosion risks, which could significantly reduce product quality. Summary of the Invention

[0008] It may be necessary to provide cavities with efficient and reliable performance for the stacked components of the component carrier, especially for waveguide applications.

[0009] The component carrier and manufacturing method are described.

[0010] According to one aspect of the present invention, a component carrier is described, the component carrier comprising: i) A (layer) stack, comprising at least one electrically conductive layer structure and at least two electrically insulating layer structures (e.g., located at the bottom and in the cover). ii) the cavity formed in the stack; and iii) At least one hydrophobic protective film is disposed on at least a portion of the inner surface of the stack that defines the cavity (e.g., at the bottom of the cavity).

[0011] According to another aspect of the present invention, a method for manufacturing a component carrier is described, wherein the method includes: i) Provide a stack comprising at least one electrically conductive layer structure and at least two electrically insulating layer structures; ii) forming cavities in the stacked components; and iii) Covering at least a portion of the inner surface of the cavity defining the stack with at least one hydrophobic protective film, particularly by screen printing.

[0012] In the context of this document, the term "hydrophobic protective film" (or hydrophobic protective layer, or hydrophobic protective ink, or hydrophobic protective coating) can specifically refer to a thin layer (film-like structure) of material incorporating hydrophobic properties. In embodiments, the hydrophobic protective film can be disposed on the surface of an electrically conductive layer structure and / or an electrically insulating layer structure, thereby serving as a protective layer. For example, a hydrophobic protective film can be used to prevent corrosion of a metal layer because water and other fluids / liquids can be kept away from the metal layer due to its hydrophobic properties. In another example, a hydrophobic protective film can be used to protect electrically insulating materials, such as organic polymers, from decomposition (e.g., dissolution or swelling) because water and / or polar organic solvents can be kept away from the electrically insulating material due to its hydrophobic properties. In another embodiment, the hydrophobic protective film can cover openings, such as inlets leading to cavities. Therefore, the interior of the cavity can be protected from the effects of external fluids (especially liquids). Furthermore, the hydrophobic protective film can be permeable to gases, and / or electromagnetic waves, and / or sound waves, thereby simultaneously achieving both protective and technical application functions. In another embodiment, a hydrophobic protective film may be formed inside the opening, for example, as a hydrophobic protective (filling) material to fill the opening. Furthermore, the hydrophobic protective film may be electrically insulating. The hydrophobic protective film may comprise organic and / or inorganic materials.

[0013] The following section will further describe possible compounds / materials for forming such a hydrophobic protective film. In one example, a mixture of components such as toughening resin, flexibilizing hardener, base hardener, defoamer, functional filler, and crosslinking agent (polymer, organic hydrophobic protective film) can be used.

[0014] In another example, the hydrophobic protective film may include inorganic materials, such as glass (especially silicon dioxide). In this example, the hydrophobic protective film may include two main surfaces, wherein the two main surfaces have different adhesion properties (e.g., hydrophobic and hydrophilic).

[0015] In the context of this document, the term "component carrier" may specifically refer to any support structure capable of accommodating one or more components on and / or within a component carrier to provide mechanical support, and / or electrical connection, and / or thermal conduction. In other words, a component carrier can be constructed as a mechanical carrier, and / or electronic carrier, and / or thermal carrier for components. Specifically, a component carrier can be one of a printed circuit board, an organic interposer, a metal core substrate, an inorganic substrate, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid board combining different types of component carriers from the aforementioned types.

[0016] In this context, the term "component carrier" can refer to a final component carrier product or a preform of a component carrier (i.e., a component carrier in production, in other words, a semi-finished product). In the example, a preform of a component carrier can be a plate comprising multiple semi-finished component carriers manufactured together. In the final stage, this plate can be divided into multiple final component carrier products.

[0017] According to exemplary embodiments, the present invention can be based on the concept that when at least one hydrophobic protective film is disposed on at least a portion of the inner surface defining a cavity, particularly a cavity for waveguide applications, of a stack of component carriers, a cavity with efficient and reliable performance can be provided. Preferably, the cavity has an extension of at least 400 μm in the thickness direction of the stack.

[0018] A hydrophobic protective film can be formed inside the cavity on the sidewalls, bottom, or top of the cavity, thereby specifically protecting the metal surfaces within the cavity from corrosion. Preferably, the hydrophobic protective film is sufficiently stable at temperatures above 200°C, particularly at 259°C (during the manufacture of the component carrier), and the hydrophobic protective film can be applied through standard component carrier manufacturing processes (e.g., applied to the smooth copper structure of the inner and outer layers of the component carrier), and the hydrophobic protective film is suitable for economical mass production.

[0019] Further advantages of the described intracavity hydrophobic protective film may include at least one of the following: permeability to electromagnetic waves (e.g., in radar applications), particularly for waveguide applications; robust adhesion relative to metal / copper, particularly for coatings on metallized cavity walls and / or antennas; release properties after lamination; non-plating by metal / copper; adhesive properties such as crack suppression and coefficient of thermal expansion mismatch tolerance; and thermal conductivity (coating) properties. In the example, the hydrophobic protective film can be easily applied by lamination and / or (spraying) dispensing, and the hydrophobic protective film may have release layer properties (which may eliminate the need for an additional release layer). This dispensing technique is feasible. This can be done in a manner similar to painting a car, where hundreds of tiny droplets are generated (e.g., via nozzles or sprayers (microjet dispensers / microspraying)) and these droplets are applied to a specific area (e.g., the surface area of ​​the cavity).

[0020] During the manufacturing of component carriers, hydrophobic protective films can also be used as protective coatings for selective (micro)etching processes or selective metal formation processes, particularly copper—such as (electrochemical) plating or electroless plating.

[0021] The described hydrophobic protective film can be applied to various cavities in laminated components that support parts. Therefore, it can be directly implemented into existing production lines, offering high design flexibility.

[0022] Exemplary implementation According to an embodiment, at least one hydrophobic protective film comprises a toughening (and base) resin (e.g., a prepolymer). Specifically, the toughening resin is configured to have a weight percentage in the range of 30% to 80% relative to the total weight of the at least one hydrophobic protective film. The toughening resin can particularly be a resin that enhances the toughness and resistance of the coated portion. Therefore, the toughening resin can provide the advantage of inhibiting crack formation / propagation, thereby ensuring better durability and quality of the at least one hydrophobic protective film. The toughening resin can also be used as a base resin, thereby providing curing and / or tack properties; in particular, the toughening resin can be temperature stable.

[0023] Further examples of toughening / base resins may include carboxyl-terminated poly(butadiene-acrylonitrile copolymer)-EP (bisphenol A (F, A / F) diglycidyl ether (DGEBA (F, A / F))). Generally, all epoxy polymers containing non-reactive spacer blocks can be used to introduce flexibility into the formulation. Other alternatives may include all carboxyl-terminated butadiene-acrylonitrile (CTBN), modified BPA (bisphenol A), and modified BPA with EO (polyethoxy) and PO (polypropoxy). Further examples include cyclohexanediethanol diglycidyl ether resins.

[0024] According to another embodiment, at least one hydrophobic protective film includes a toughening curing agent (e.g., a polyol amine). Specifically, the toughening curing agent is configured to have a weight percentage in the range of 1% to 15% relative to the total weight of the at least one hydrophobic protective film. The toughening curing agent can be particularly understood as a compound / material that acts as a curing agent (see below) but also provides flexibility, for example, providing flexibility to the coated portion. Therefore, the toughening curing agent can provide the advantage of flexibility (for the at least one hydrophobic protective film). Furthermore, it can improve adhesion properties and / or other functions. In an example, the toughening curing agent can be configured as a polymer softening block. Non-functional spacer blocks can act as polymer softeners in the polymer chain. In another example, the toughening curing agent can provide curing functionality. For example, aliphatic compounds, polyethoxy and propoxy compounds, and polybutadiene with amine end groups are all well-suited for use as toughening curing agents. Essentially all spacer groups with amine end groups are suitable for use as toughening curing agents (e.g., siloxanes).

[0025] According to another embodiment, at least one hydrophobic protective film includes a (basic) curing agent (e.g., dicyandiamide, chain aliphatic polyamines (e.g., diethylenetriamine, dipropylenediamine), alicyclic polyamines (e.g., isophorone diamine), or aromatic amines (e.g., diaminodiphenylmethane)). Specifically, the base curing agent is configured to have a weight percentage in the range of 1% to 5% relative to the total weight of the at least one hydrophobic protective film. The curing agent can be specifically understood as a compound / material that acts as a curing agent to initiate / promote the curing / curing of materials such as resins. The curing agent can (for the at least one hydrophobic protective film) provide favorable properties related to curing, such as regulating the curing rate. The curing rate can also be positively influenced by the accelerator compound.

[0026] According to another embodiment, at least one hydrophobic protective film includes a defoamer (specifically, at least one of the following: a mineral oil defoamer, a silicone-free defoamer, or a polysiloxane). Specifically, the defoamer is configured to have a weight percentage in the range of 0.5% to 2% relative to the total weight of the at least one hydrophobic protective film. The defoamer (or antifoaming agent) can be understood in particular as a compound / material suitable for use as an antifoaming agent to reduce / eliminate foam formation. Therefore, the defoamer can (for the at least one hydrophobic protective film) provide foam bursting properties and thus support specific applications.

[0027] According to another embodiment, at least one hydrophobic protective film includes a wetting agent. Specifically, the wetting agent is configured to have a weight percentage in the range of 0.5% to 2% relative to the total weight of the at least one hydrophobic protective film.

[0028] In the example, the wetting agent may include at least one of the following: polysiloxane, fluorinated wetting agent, polyacrylate, polyalkoxylate, and polymaleate. The wetting agent can act as a surfactant and reduce the surface tension at the joint (e.g., an oil-water joint). Therefore, the wetting agent can provide the advantage of preventing shrinkage of the overall volume of the material, particularly the at least one hydrophobic protective film, and thus enhance the integrity of the material, particularly the at least one hydrophobic protective film. In the example, a fluorinated polyacrylate may be used.

[0029] According to another embodiment, at least one hydrophobic protective film includes a leveling agent. Specifically, the leveling agent is set to have a weight percentage in the range of 0.5% to 2% relative to the total weight of the at least one hydrophobic protective film.

[0030] In the example, the leveling agent may include at least one of the following: polysilane, polysiloxane, polyepoxide, or polyacrylate. The leveling agent is configured to reduce surface irregularities. Therefore, the leveling agent can provide the advantage of enhancing the chemical resistance of the material, particularly the at least one hydrophobic protective film, and thus enhancing the integrity of the material, particularly the at least one hydrophobic protective film. In the example, a silicone acrylate copolymer may be applied.

[0031] According to another embodiment, at least one hydrophobic protective film includes an emulsifier. Specifically, the emulsifier is configured to have a weight percentage in the range of 0.5% to 10% relative to the total weight of the at least one hydrophobic protective film.

[0032] In the example, the emulsifier may include at least one of the following: nitrocellulose, 2-methacryloyloxyethyl phosphorocholine-n-butyl methacrylate copolymer (PMB), and glyceryl monocitrate. An emulsifier can be understood as a substance that stabilizes an emulsion (e.g., an oil-water mixture). The emulsifier can act as a surfactant and reduce the surface tension at joints (e.g., oil-water joints). Therefore, the emulsifier can provide the advantages of emulsifying properties (for the at least one hydrophobic protective film) and thus support specific applications.

[0033] According to another embodiment, at least one hydrophobic protective film includes a functional filler (e.g., modified silica and / or nitrocellulose; aerogel, particularly silica-based aerogel; PTFE particles, particularly PTFE particles). Specifically, the functional filler is configured to have a weight percentage in the range of 10% to 40% relative to the total weight of the at least one hydrophobic protective film. The functional filler can be understood in particular as a material incorporated into another material, such as filler particles incorporated into a matrix material. Therefore, specific functional properties, such as Young's modulus, can be enhanced. Thus, the functional filler can advantageously provide specific functions. In an example, a hydrophobic protective film for covering / protecting a metal surface may include a PTFE functional filler. In another example, a hydrophobic protective film for covering an opening (and the opening is porous) may include a modified silica and / or nitrocellulose functional filler. In yet another example, the functional filler may have a monodisperse or polydisperse particle size distribution in the range of 10 nm to 10 μm. In another example, the functional filler can have a spherical or elliptical shape.

[0034] According to another embodiment, the at least one hydrophobic protective film includes a crosslinking agent (e.g., epoxidized castor oil (triglycidyl ether), epoxidized soybean oil, or stearoyl glycidyl ether). Specifically, the crosslinking agent is configured to have a weight percentage in the range of 5% to 45% relative to the total weight of the at least one hydrophobic protective film. A crosslinking agent can be understood as a compound / material suitable for initiating / promoting crosslinking (reaction), i.e., forming chemical bonds in another material. For example, a crosslinking agent can promote the formation of chemical bonds in a resin during curing. Therefore, a crosslinking agent can also be interpreted as a curing agent. By using a crosslinking agent, the at least one hydrophobic protective film can be cured / hardened in a more efficient and stable manner. In another example, siloxane glycidyl ether is used.

[0035] In the example, epoxidized soybean oil or any other epoxidized natural oil can be applied (the natural oil needs to have double bonds to be epoxidized). The modified oil can also impart hydrophobicity to the coating, which may be a desired property. In the example, all multifunctional epoxides can be used as crosslinking agents to form a three-dimensional network.

[0036] According to another embodiment, at least one hydrophobic protective membrane is (at least partially) porous, and in particular, the at least one hydrophobic protective membrane includes an open-pore structure. The formation of pores allows the at least one hydrophobic protective membrane to be permeable, at least for a specific function. Furthermore, the at least one hydrophobic protective membrane has less weight while still possessing reliable mechanical properties. In examples, the at least one hydrophobic protective membrane may include micropores, and / or mesopores, and / or macropores. In other examples, the at least one hydrophobic protective membrane may include a closed-pore structure. In a preferred embodiment, the open-pore structure may be filled with a fluid, such as a gas, particularly air.

[0037] According to another embodiment, at least one hydrophobic protective membrane is gas-permeable (particularly due to its porous structure). Therefore, gases, such as air, can flow into and out of the cavity, thereby achieving ventilation. Furthermore, this facilitates pressure exchange between the cavity and the environment, ensuring that the cavity is not damaged or deformed during at least one manufacturing process or in use. According to another embodiment, the cavity is configured to be filled with a fluid, particularly a gas, and more particularly air.

[0038] According to another embodiment, at least one hydrophobic protective film is impermeable to (at least some) liquids. This effectively prevents fluids such as water from entering the cavity and causing corrosion. In this example, the at least one hydrophobic protective film is impermeable to water.

[0039] According to another embodiment, at least one hydrophobic protective film is permeable to electromagnetic waves, particularly radio frequency (RF) waves. This provides the advantage that RF waves can enter and / or exit the cavity, thereby enabling antenna / radar functionality, especially when waveguides are used.

[0040] According to another embodiment, at least one hydrophobic protective membrane is permeable to sound waves. This provides the advantage that the cavity can be used in microphone / speaker applications.

[0041] According to another embodiment, the cavity is configured as a waveguide for radio frequency waves. Therefore, the cavity can be used for efficient waveguide applications (e.g., AFSIW, see above) due to its aforementioned advantages. The term "waveguide" can specifically refer to a structure suitable for guiding RF waves within its interior. Typically, a waveguide may include a volumetric portion, such as a cavity, for wave propagation. In the example, at least a portion of the sidewalls of the waveguide is metallized, thereby enhancing wave propagation. Therefore, the described cavity is particularly suitable for applications of such waveguides.

[0042] According to another embodiment, a hydrophobic protective film at least partially covers the connection structure used to couple radio frequency waves into the cavity. In a basic embodiment, the connection structure may be an electrically conductive layer structure. In a more advanced embodiment, the connection structure may include one or more antenna structures, specifically, the antenna structures are electrically connected to the cavity. The connection structure (specifically including metals, such as copper) can be effectively protected by the hydrophobic protective film. According to another embodiment, the at least one hydrophobic protective film covers at least a portion of the antenna structure connected to the cavity.

[0043] According to another embodiment, at least one hydrophobic protective film at least partially covers at least one metallized sidewall of the cavity. Therefore, the metal surface (particularly suitable for waveguide applications) can be effectively protected from corrosion, and its service life is increased.

[0044] According to another embodiment, at least one hydrophobic protective film (structure or material) is temperature stable at temperatures up to 200°C or higher, particularly up to 210°C or higher, and especially up to 250°C or higher. This provides the advantage that the formation / placement of the hydrophobic protective film can be achieved directly during the manufacturing process of a component carrier using high temperatures of 200°C or higher (e.g., during lamination).

[0045] According to another embodiment, at least one hydrophobic protective film at least partially covers the at least one electrically conductive layer structure to prevent corrosion. As described above, the hydrophobic protective film can be used to effectively and reliably prevent fluids (especially water, or moisture, and / or oxygen) from entering the cavity. This corrosion protection may be particularly suitable in waveguide applications (especially waveguides with metal sidewalls). Therefore, performance in high-frequency applications can also be improved.

[0046] According to another embodiment, at least one electrically conductive layer structure includes a smooth surface. Such a smooth surface may be more suitable for signal transmission (quality) than a rough surface. However, the bond between an insulating material, such as resin, and a smooth metal surface may be less stable compared to a rough surface. However, the described hydrophobic protective film can establish a stable bond with a smooth metal surface.

[0047] In this context, the term "smooth surface" can refer to a surface with a surface roughness parameter Ra less than 1 μm. Correspondingly, the term "rough surface" can refer to a surface with a surface roughness parameter Ra greater than 1 μm.

[0048] According to another embodiment, at least one hydrophobic protective membrane closes at least one inlet hole leading to the cavity, wherein the inlet hole provides a passage from the outside of the component carrier or the inner layer of the stack to the cavity. This provides the advantage that the inlet hole (which allows for greater functional flexibility of the component carrier) can be protected (from the influence of fluids) and kept stable. In an example, the hydrophobic protective membrane may cover the inlet hole (opening). Additionally or alternatively, the hydrophobic protective membrane may be (at least partially) arranged in the inlet hole, thereby serving as a plug.

[0049] According to another embodiment, at least one hydrophobic protective film includes: i) A first hydrophobic protective film covering at least a portion of the inner surface of the stacked member defining the cavity at a first side; and ii) A second hydrophobic protective film that covers at least a portion of the inner surface of the cavity defining the stacked member on the second side, particularly on the side opposite to the first side.

[0050] The first and second hydrophobic protective films may include the same physical and / or chemical properties, as well as different properties. Therefore, depending on their function, the films may be similar or different. For example, the first hydrophobic protective film may cover the sidewalls or bottom of a cavity, particularly a metal surface, and thus serve to protect the surface (corrosion prevention). In another example, the second hydrophobic protective film may cover (and / or fill) an inlet (opening) of the cavity, thereby protecting the cavity's inlet / outlet. Specifically, the second hydrophobic protective film may be porous and / or permeable to gases such as air, thus allowing ventilation but preventing liquid ingress.

[0051] According to another embodiment, at least one hydrophobic protective film has a thickness in the range of 50 nm to 50 μm, and more particularly, at least one hydrophobic protective film has a thickness in the range of 100 nm to 30 μm. This provides the advantage that such a small thickness requires very little space, thereby making the application more flexible.

[0052] According to another embodiment, at least one hydrophobic protective film has a length of at least 100 μm, and more particularly, the at least one hydrophobic protective film has a length of at least 300 μm. This provides the advantage that a certain area is covered and specifically protected from corrosion.

[0053] In another embodiment, the sidewalls of the cavity are generally vertical. Depending on the desired application (e.g., waveguide), straight sidewalls may be preferred. Straight sidewalls can also reflect the cavity's manufacturing process, as some processes (e.g., layer drilling) can actually result in tapered (non-straight) sidewalls.

[0054] In this context, the term "generally vertical" can refer to the spatial orientation of the sidewall. Therefore, a major extension of the component's load-bearing member (see...) Figure 1 The angle between the x or y extension and the sidewall is between 85° and 95°, preferably 90°.

[0055] According to another embodiment, at least one sidewall of the cavity comprises or is made of metal, particularly copper. Specifically, in the case of waveguide applications, the metal surface can improve the propagation quality of RF waves. Furthermore, RF waves are more easily transmitted / received from the metal surface. Such a metal surface can be achieved using established component carrier manufacturing techniques, thereby incorporating the formation of this metal surface into known manufacturing processes.

[0056] According to another embodiment, at least a portion of at least one sidewall lacks a hydrophobic protective film; specifically, the sidewall does not have direct contact with the hydrophobic protective film. Since the top or bottom of the cavity is more susceptible to corrosion, and / or more precisely, since the opening is formed at the top or bottom of the cavity, the sidewall is less likely to require or need the protection of a hydrophobic protective film. This applies to embodiments where the sidewall is (at least partially) not made of metal (see, for example...). Figure 5E This is particularly applicable to ( ).

[0057] According to another embodiment, metal particles, particularly sintered material, are arranged between two electrically conductive layers, especially wherein the metal (copper) particles are in direct contact with the cavity (see, for example, reference numeral 105). These particles can be used during the manufacturing process when a top structure (the cavity cover) is arranged onto the stack to enclose the cavity. The top structure can be arranged directly on the metal particles. Furthermore, the metal particles can separate the cavity from the electrically insulating material of the stack / protect the cavity from the electrical insulation material of the stack.

[0058] According to another embodiment, the stack includes at least one additional electrically insulating material, particularly a sealing paste (see, for example, reference numeral 106), preferably wherein the additional electrically insulating material has a coefficient of thermal expansion (CTE) value of less than 30 ppm / °C. This provides the advantage that the cavity is free of material from the stack, and in particular, free of electrically insulating material. Furthermore, the material can reflect the manufacturing process of the metal sidewalls forming the cavity.

[0059] According to another embodiment, the cavity includes an input section located on a first side and an output section located on a second side, which are specifically designed for high-frequency (HF) waves. The first and second sides may be located on the same side or opposite to each other. Therefore, a variety of electromagnetic wave-based applications, such as antenna or radar functions, can be implemented with high design flexibility.

[0060] According to another embodiment, the input and / or output portions are associated with and / or in direct contact with at least one hydrophobic protective film. Therefore, the hydrophobic protective film can be implemented as an effective retainer for protecting the interior of the cavity without hindering RF wave-based functionality.

[0061] According to another embodiment, the component carrier further includes another electrically insulating material (see, for example, reference numeral 108), which is particularly a release layer material, disposed outside the cavity, specifically at the same vertical height (z) as the hydrophobic protective film. This material can be used during the manufacturing process to achieve high precision, such as alignment of the hydrophobic protective film, or the material may be a residue of the hydrophobic protective film. In the example, this other electrically insulating material is located at the same vertical height as the hydrophobic protective film in the laminate.

[0062] According to another embodiment, the cavity includes a T-shaped cross-section (vertical projection, see example...). Figure 1 and Figure 2 This shape can reflect the following manufacturing steps: placing the top structure as a cover on top of the cavity, thereby leaving a material-free area at the top of the cavity sidewalls.

[0063] According to another embodiment, the stack includes at least one component (see examples below) embedded in and / or mounted on the stack. For example, the component may be directly (electrically) connected to the inlet or outlet of a cavity, thereby triggering, for example, an RF-based application.

[0064] According to another embodiment, at least one hydrophobic protective film comprises a T-shape or an L-shape, particularly wherein the cross-section of the at least one hydrophobic protective film comprises a T-shape or an L-shape, and particularly wherein the T-shape or L-shape portion of the hydrophobic protective film is configured as a feed port for a waveguide. Therefore, the width of the T-shape or L-shape portion, particularly the width of the vertical portion, can be associated with the waveguide, particularly with the frequency of the waveguide.

[0065] According to an exemplary embodiment, at least one hydrophobic protective film is configured as a hydrophobic coating mixture comprising a silane component and a hydrophobic epoxy resin component, and the hydrophobic coating mixture can be applied by a standard component carrier manufacturing process, such as a screen printing process. The silane component of the mixture may, for example, comprise 20% to 80% benzimidazole silane, and the epoxy resin component may comprise 20% to 80% an elastically modified hydrophobic epoxy resin component, which may include (but is not limited to) butyl polybutadiene modified epoxy resin. Further aspects of the hydrophobic protective film may include: high-temperature stability up to 250°C; non-shielding or interference with high-frequency electromagnetic radiation, such as above 1 GHz; and good adhesion to smooth metal / copper structures.

[0066] According to an exemplary embodiment, at least one hydrophobic protective film (dielectric corrosion protection coating) can be used in the production of component carriers to achieve selective (micro)etching and selective copper plating processes by coating copper structures that should remain smooth or do not require plating. The selective etching process can be used to protect the copper areas used for reference parts.

[0067] According to an exemplary embodiment, the viscosity of the anti-corrosion coating (hydrophobic protective coating / film) according to the present invention should be suitable for the selected printing method. Different application methods may be possible, among which screen printing may be preferred. Furthermore, the solvent may be part of the anti-corrosion composition.

[0068] In the context of this application, the term "antenna structure" can specifically refer to an arrangement of metallic conductor elements electrically connected to a receiver or transmitter, for example, via transmission lines. Thus, an antenna structure can be represented as an electrical component that converts electricity into radio waves or radio waves into electricity. Antenna structures can be used in conjunction with controllers (e.g., control chips), such as radio transmitters and / or radio receivers. During transmission, the radio transmitter can supply a radio frequency oscillating current (i.e., high-frequency alternating current) to the terminals of the antenna structure, and the antenna structure can radiate the energy from the current as electromagnetic waves (particularly radio waves). In receiving mode, the antenna structure can intercept some of the electrical power of the electromagnetic waves, thereby generating a small voltage at its terminals, which can be applied to the receiver for amplification, for example. In some embodiments, the antenna structure can be configured as a receiver antenna structure, a transmitter antenna structure, or a transceiver (i.e., transmitter and receiver) antenna structure. In embodiments, the antenna structure can be used for radar applications. For example, the antenna structure can include a dipole antenna, a folded dipole antenna, a loop antenna, a rectangular loop antenna, a patch antenna, or a coplanar antenna. The antenna structure can also include a Yagi antenna or a fractal antenna. A Yagi antenna can be a multi-beam directional antenna used in so-called millimeter-wave applications. A fractal antenna can be another type of antenna that uses a self-similar design to maximize the length of material in the total surface area. Fractal antennas can be compact and wideband, and can be used as antennas for a variety of different frequencies.

[0069] In the context of this document, the term "radar" can refer to an object detection device that uses electromagnetic waves to determine the range, angle, or velocity of one or more objects. A radar arrangement may include a transmitter that emits electromagnetic waves (e.g., within the range of radio or microwaves). The electromagnetic waves from the transmitter are reflected by the object and returned to the receiver. Therefore, an antenna structure can be used for both transmission and reception. Furthermore, a processor, such as electronic components, can be used to determine the properties of the object, such as its position and velocity, based on the received electromagnetic waves.

[0070] According to embodiments, at least one hydrophobic protective film (particularly organic) comprises a polymer, and specifically, the at least one hydrophobic protective film comprises two or more formulations, each configured to provide a specific function (e.g., toughening resin, crosslinking agent, etc.). Due to the availability of a large number of different combinations of formulations, this can offer the advantage of altering the chemical and / or physical properties of the hydrophobic protective film. This simplifies the tuning of the physical and / or chemical properties of the hydrophobic protective layer.

[0071] According to an embodiment, at least one hydrophobic protective film comprises an inorganic material and / or an inorganic layer structure, particularly glass (e.g., silicon dioxide), and more particularly wherein the hydrophobic protective film is configured as a glass (barrier) layer. This can provide the advantage of imparting additional physical properties, such as tensile strength, to the stacked components. Furthermore, the inorganic material can prevent degradation of one or more covered portions of the cavity, such as degradation due to oxidation. Additionally, the hydrophobic protective film is easy to manufacture, thereby simplifying the manufacturing process.

[0072] In the context of this application, the term "inorganic layer structure" may specifically refer to a layer structure comprising inorganic materials, such as inorganic compounds. In particular, the dielectric material of the inorganic layer structure, or even the entire inorganic layer structure, may be made solely of inorganic materials or at least substantially of inorganic materials. In another embodiment, the inorganic layer structure may include an inorganic dielectric material and an additional dielectric material. The inorganic compound may be a chemical compound without carbon-hydrogen bonds, or it may be a chemical compound that is not organic. In examples, the inorganic layer structure may include glass, such as silicon-based glass, particularly soda-lime glass, and / or borosilicate glass, and / or aluminosilicate glass, and / or lithium silicate glass, and / or alkali-free glass. In another example, the inorganic layer structure may include ceramic materials, such as aluminum nitride, and / or alumina, and / or silicon nitride, and / or boron nitride, and / or tungsten-containing ceramic materials. However, in another example, the inorganic layer structure may include semiconductor materials such as silicon, and / or germanium, and / or silicon oxide, and / or germanium oxide, and / or silicon carbide, and / or gallium nitride. In another embodiment, the inorganic layer structure may include (elemental) metals and / or metal alloys, such as copper, and / or tin, and / or bronze. In yet another embodiment, the inorganic layer structure may include inorganic materials not listed in the above examples, such as MoS2, CuGaO2, AgAlO2, LiGaTe2, AgInSe2, CuFeS2, and BeO. In the context of this document, the term "glass barrier layer" may specifically refer to a layer (structure) comprising a glass material and adapted to perform a barrier function, particularly for the migration of chemical substances.

[0073] In this context, the term "glass" can specifically refer to an amorphous and non-crystalline solid. In a preferred embodiment, the glass comprises silicates, particularly silicon dioxide (SiO2). In another embodiment, the glass comprises at least one silane and / or siloxane compound. In yet another example, the glass may include functional groups, such as hydrophilic and / or hydrophobic functional groups, particularly at the main surfaces. Since the glass layer is a (continuous or discontinuous) layer, it comprises two main surfaces that are opposite to each other. Therefore, these two main surfaces may differ in at least one physical / chemical property, particularly in terms of surface tension (surface energy).

[0074] In the context of this document, the term "adhesion property" can specifically refer to the tendency of (different) particles / surfaces to adhere together. Adhesion properties can be, for example, the hydrophilicity or hydrophobicity of a surface. Other adhesion properties can be surface tension or surface wettability. These adhesion properties may overlap with each other. Adhesion properties can be imparted by setting functional groups on a particular surface.

[0075] In the context of this document, the term "surface tension" can refer to a description of the physical interaction between the surfaces of two substances, particularly between surfaces in direct contact. Surface tension can be measured as force per unit length (N / m) or energy per unit area (J / m²). While the term "surface tension" generally refers to liquids and the term "surface energy" refers to an equivalent property of solids, in this context, these terms can be used synonymously, especially since the glass in the glass barrier layer can be considered either a liquid or a solid (chemically, glass is considered a supercooled liquid).

[0076] Surface tension (property) can be directly related to the wettability of a surface. For example, the difference in surface tension between two primary surfaces can be directly observed in different surface wettability. In an illustrative example, the first primary surface may include strong hydrophilic properties, while the second primary surface may include hydrophobic properties. In another example, both primary surfaces may include hydrophilic properties, but the hydrophilic properties differ from each other. However, in yet another example, both primary surfaces may include hydrophobic properties, but the hydrophobic properties differ from each other.

[0077] When glass (barrier layer) is used, efficient and robust adhesion to electrically conductive layer structures can be achieved. Furthermore, efficient and robust adhesion between electrically conductive layer structures and electrically insulating layer structures can also be achieved. In particular, the glass barrier layer comprises two main surfaces with different adhesion properties (e.g., surface tension, especially different wettability).

[0078] While not wishing to be confined to any particular theory, it is believed that the migration of chemicals, such as moisture or oxygen from the air, within resin materials is one of the causes of both long-term and short-term adhesion failure between metals and dielectric materials. Therefore, adhesion failure between metals and dielectric materials may originate from the migration of chemical ions such as oxygen and / or moisture, potentially leading to oxidation of the metal surface. The resulting metal oxides then undergo catalytic reactions with other substances (and ultimately with adhesion promoters).

[0079] Conventional silane or siloxane adhesion promoters used in component carriers are typically silane or siloxane monolayers deposited through chemical wet processes such as chemical impregnation or physical deposition processes such as sputtering. Therefore, they cannot serve as a barrier layer to prevent the migration of chemicals to the metal surface. Instead, these layers themselves can lead to metal corrosion and the delamination of dielectric materials from the metal surface.

[0080] The inventors have now discovered that applying a glass barrier layer can result in efficient and robust adhesion when the glass barrier layer has different physical / chemical properties (particularly in terms of adhesion performance) on its two opposing main surfaces—one optimized for the metal layer structure and the other optimized for the dielectric layer structure (or fluid / air in the cavity). In the example, the main surface in contact with the dielectric layer structure or the fluid in the cavity can be fairly hydrophobic, while the main surface in contact with the metal layer structure can be fairly hydrophilic.

[0081] According to an embodiment, at least one hydrophobic protective film includes two main surfaces, wherein the two main surfaces have different adhesion properties (see above). This can offer space-saving and / or material-saving advantages compared to a stack of two materials having corresponding adhesion properties. This simplifies the manufacturing process while ensuring a higher quality hydrophobic protective film.

[0082] According to an embodiment, one of the two main surfaces of at least one hydrophobic protective film and / or the first layer of the at least one hydrophobic protective film includes hydrophilic properties. This can provide the advantage of imparting good adhesion to polar surfaces and / or materials, such as metals, particularly copper.

[0083] According to an embodiment, the other main surface of the at least one hydrophobic protective film and / or the second layer of the at least one hydrophobic protective film comprises hydrophilic or hydrophobic properties. This can provide the advantage of imparting good adhesion to non-polar surfaces and / or materials, such as electrically insulating layer structures.

[0084] According to an embodiment, one of the two main surfaces of at least one hydrophobic protective film and / or the first layer of the at least one hydrophobic protective film includes at least one functional group for providing hydrophilic properties. Therefore, hydrophilic properties can be provided in an efficient and selective manner.

[0085] For example, this hydrophilic property can be achieved by one of the following functional groups: imine, amine, thiol, thioamide, phosphate ester, hydroxyl, thiazole, imidazole, acrylate, methacrylate, or alcohol group, particularly 3-hydroxypropyl or 2-hydroxyethyl. In the example, for the glass barrier layer, acrylate and methacrylate may be preferred silanes. The included alcohol group particularly may include 3-hydroxypropyl or 2-hydroxyethyl.

[0086] In the example, the first layer includes: silanes / siloxanes containing nitrogen groups; and / or silanes / siloxanes in a mixture of molecules having nitrogen groups, such as 3-ureidopropyltriethoxysilane or siloxane, 3-aminopropyltriethoxysilane, trimethoxysilylbenzotriazole, triallyl isocyanurate, divinylbenzimidazole, diallylamine, vinylimidazole, or cyclic aziridines or siloxanes.

[0087] According to an embodiment, the other surface of the two main surfaces of at least one hydrophobic protective film and / or the second layer of the at least one hydrophobic protective film includes at least one functional group for providing hydrophobic properties.

[0088] For example, this hydrophobic property can be achieved by one of the following functional groups: epoxy, allyl, amino, vinyl, alkyl, acid anhydride, especially maleic anhydride, furanyl, pyrroleyl, thiopheneyl, and / or cyclic unsaturated olefins, especially cyclic pentenes. In the examples, preferred functional groups may include alkyl, allyl, vinyl, and cyclic unsaturated olefins.

[0089] In another example, hydrophobic silanes / siloxanes are used, particularly hydrophobic silanes / siloxanes containing double bonds that are oxidized during plasma treatment, thereby producing hydrophilic properties. For example, the double bond of a hydrophobic allylsilane can be oxidized to a hydrophilic 3-hydroxypropyl group during the plasma treatment.

[0090] In another example, APTES (3-aminopropyl)triethoxysilane, which does not contain double bonds, will be oxidized to SiOX or polymerized into plasma without oxidation (because there are no double bonds), and thus remain hydrophobic after plasma treatment.

[0091] In another embodiment, the second layer is deposited on the first layer via a (cold) (atmospheric pressure) plasma (spraying) process. This can provide good adhesion of the second layer to the first layer.

[0092] According to another embodiment, the second layer comprises a functional silane / siloxane that forms a stable bond with the dielectric material and can be hydrophobic or hydrophilic depending on the dielectric material (the surface tension of the second layer can be selected based on the surface tension of the dielectric material). The second layer may include silane / siloxane (organic) functional groups that react with the dielectric material, such as alcohols, amines, thiols, epoxy groups or double bonds as allyl groups, and mixtures of these groups. Furthermore, functional silanes / siloxanes that can be used include epoxysilanes, epoxysiloxanes, aminosilanes, aminosiloxanes, allylsilanes, allylsiloxanes, and hexamethyldisiloxanes.

[0093] According to another embodiment, at least one hydrophobic protective film comprises silicon dioxide (SiO2), particularly comprising at least one silane and / or siloxane compound / component. This provides the advantage that established and cost-effective industrial materials can be applied directly and ultimately functionalized as needed.

[0094] In the example, such as during plasma processing, silanes / siloxanes are only partially oxidized to SiOX. The polymerized silanes / siloxanes may form SiOx-R, where R imparts functionality to the layer (hydrophilic groups such as amines and alcohols, or hydrophobic groups such as methyl groups).

[0095] According to another embodiment, at least one hydrophobic protective film includes particles (at least partially) embedded in the at least one hydrophobic protective film. In this way, specific (surface) properties can be provided.

[0096] In particular, the particles can improve integrity, which is crucial for high-frequency applications. Furthermore, the particles can also be selected to be capable of plasma etching to enable patterning and via plating during additional manufacturing steps.

[0097] According to another embodiment, the particles include at least two different shapes. Therefore, the particles can be flexibly adapted to a specific application. The shapes are not limited to these and can be, for example, rectangular, circular, or polygonal. Furthermore, the shapes can include star-shaped, triangular, spherical, shapes with pointed portions, etc.

[0098] According to another embodiment, the partially embedded particles affect the surface roughness of the at least one glass barrier layer. Therefore, the (typically smooth) surface of the glass barrier layer can be tailored to a specific roughness if desired. For example, a roughness Ra of 300 nm or less can thus be achieved.

[0099] According to another embodiment, the embedded particles include metal oxides, such as SiO2, TiC, Al2O3, fused silica, or zeolite.

[0100] In another embodiment, the embedded particles are non-porous particles. In yet another embodiment, the particles can be dry-etched using a fluorine plasma gas. Optionally, the particles can be coated to improve dispersibility and adhesion to the surrounding glass barrier layer.

[0101] In another embodiment, the embedded particles impart hydrophilic or hydrophobic properties. Depending on the material / surface of the particles, the particles may specifically provide hydrophobic or hydrophilic properties in addition to the main surface properties of the glass barrier.

[0102] According to another embodiment, the diameter of the embedded particles is in the micrometer range (1 μm to 1000 μm) and / or the nanometer range (1 nm to 1000 nm). This allows for a certain degree of design flexibility. Preferably, the particle diameter can be within the range of surface roughness, for example, below 500 nm, particularly 300 nm or lower. Furthermore, the particle diameter can be greater than 100 nm, particularly greater than 200 nm.

[0103] According to another embodiment, the material containing 10% or more particles, particularly 15% or more particles, may be provided relative to the glass barrier layer material (volume or mass).

[0104] According to another embodiment, the hydrophobic protective film material may contain 30% or less particles, particularly 15% or less particles (otherwise, in the example, the hydrophobic protective film may be an amorphous layer).

[0105] According to another embodiment, the embedded particles are at least partially embedded in a first surface / part and / or a first layer and / or at least partially embedded in a second surface / part and / or a second layer. This can provide the advantage of further improving the robust adhesion between the corresponding layer structure and the hydrophobic protective film.

[0106] In one embodiment, the component carrier is configured as one of a printed circuit board, a substrate (particularly an IC substrate), and an interposer.

[0107] In this implementation, the component carrier is formed into a plate. This facilitates a compact design, where the component carrier still provides a large base for mounting components on it. Furthermore, bare chips, particularly as examples of embedded electronic components, can be easily embedded into thin plates such as printed circuit boards due to their small thickness.

[0108] In an embodiment, the component carrier stack includes at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate containing one or more of the aforementioned electrically insulating and electrically conductive layer structures, particularly formed by applying mechanical pressure and / or heat. The stack may provide a plate-shaped component carrier that provides a large mounting surface for other components while remaining very thin and compact.

[0109] In the context of this application, the term "printed circuit board" (PCB) specifically refers to a plate-shaped component carrier formed, for example, by laminating multiple electrically conductive layer structures with multiple electrically insulating layer structures under pressure and / or by supplying heat. As preferred materials for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may include resin and / or glass fiber, i.e., so-called prepreg or FR4 material. The various electrically conductive layer structures can be connected to each other in a desired manner by forming holes through the laminate, for example, by laser drilling or mechanical drilling, and by partially or completely filling the holes with an electrically conductive material (partially copper) to form vias or any other through-hole connections. The filled holes connect the entire stack (the through-hole connections extend through multiple layers or the entire stack), or the filled holes connect at least two electrically conductive layers; these filled holes are referred to as vias. Similarly, optical interconnects can be formed through the various layers of the stack to receive electro-optical circuit boards (EOCBs). In addition to being able to embed one or more components into a printed circuit board, a printed circuit board is typically configured to house one or more components on one or both opposite surfaces of the board-shaped printed circuit board. The one or more components can be soldered to their respective main surfaces. The dielectric portions of the PCB may include resin with reinforcing fibers, such as glass fiber.

[0110] In the context of this application, the term "substrate" can specifically refer to a small component carrier. Relative to a PCB, a substrate can be a relatively small component carrier for mounting one or more components and can serve as a connection medium between one or more chips and another PCB. For example, a substrate can have approximately the same size as the component (particularly an electronic component) to be mounted on it (e.g., in the case of a chip-scale package (CSP)). In another embodiment, the substrate can be significantly larger than the specified component (e.g., in the case of a flip-chip ball grid array (FCBGA) configuration). More specifically, a substrate can be understood as a carrier for electrical connections or electrical networks and a component carrier with a relatively high density of lateral and / or vertically arranged connections, comparable to a printed circuit board (PCB). Lateral connections are, for example, conductive paths, while vertical connections can be, for example, drilled holes. These lateral and / or vertical connections are arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections between accommodated or unaccommodated components (e.g., bare wafers), particularly IC chips, and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrate". The dielectric portion of the substrate may include resin with reinforcing particles (such as reinforcing spheres, particularly glass spheres).

[0111] The substrate or interlayer may include or be composed of the following: at least one layer of glass, silicon (Si), and / or photo-imaging or dry-etchable organic material such as epoxy-based stacked material (e.g., epoxy-based stacked film), or polymer compound (which may or may not include photosensitive and / or thermosensitive molecules such as polyimide or polybenzoxazole).

[0112] In embodiments, at least one electrically insulating layer structure comprises at least one of the following: resins or polymers, such as epoxy resins, cyanate ester resins, benzocyclobutene resins, bismaleimide triazine resins, polystyrene derivatives (e.g., based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Reinforcing structures, such as those made of glass (multilayer glass) to form composite materials, may also be used, such as meshes, fibers, spheres, or other types of filler particles. The semi-cured resin combined with the reinforcing agent, such as fibers impregnated with the aforementioned resins, is called a prepreg. These prepregs are typically named according to their properties, for example, FR4 or FR5, to describe their flame-retardant characteristics. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based stacked materials (e.g., stacked films) or photoelectro-imageable dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate ester resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low-DK, lower-DK, or ultra-low-DK materials can be used as electrical insulation layer structures in component carriers.

[0113] In embodiments, at least one electrically conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten, magnesium, carbon, (particularly doped) silicon, titanium, and platinum. While copper is generally preferred, other materials or other types of coatings thereof, particularly coatings with superconducting materials or conductive polymers, are also possible, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT).

[0114] At least one additional component may be embedded in the stack and / or surface-mounted on the stack. This component and / or the at least one additional component may be selected from the following: non-electrically conductive inlays, electrically conductive inlays (e.g., metallic inlays, preferably copper or aluminum), heat transfer units (e.g., heat pipes), optical guiding elements (e.g., optical waveguides or optical conductor connectors), electronic components, or combinations thereof. The inlay may be, for example, a metal block (IMS inlay) with or without an insulating material coating, which may be embedded or surface-mounted to facilitate heat dissipation. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. This material is typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, alumina (Al₂O₃), or aluminum nitride (AlN). Other geometries with increased surface area are also frequently used to improve heat exchange capacity. In addition, components can be active electronic components (having at least one implemented pn junction), passive electronic components such as resistors, inductors or capacitors, electronic chips, storage devices (e.g., DRAM or other data memories), filters, integrated circuits (e.g., field-programmable gate arrays (FPGAs), programmable array logic (PALs), general-purpose array logic (GALs) and complex programmable logic devices (CPLDs)), signal processing components, power management components (e.g., field-effect transistors (FETs), metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor (CMOS) transistors, junction field-effect transistors (JFETs), or insulated-gate field-effect transistors). These are all based on semiconductor materials, such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), indium phosphide (InP), and / or any other suitable inorganic compound; optoelectronic interface elements; light-emitting diodes; optocouplers; voltage converters (e.g., DC / DC or AC / DC converters); cryptographic components; transmitters and / or receivers; electromechanical transducers; sensors; actuators; microelectromechanical systems (MEMS); microprocessors; capacitors; resistors; inductors; batteries; switches; cameras; antennas; logic chips; and energy harvesting units. However, other components can be embedded in component carriers. For example, magnetic elements can be used as components. Such magnetic elements can be permanent magnets (e.g., ferromagnetic, antiferromagnetic, multiferroic, or ferrimagnetic elements, such as ferrite cores) or paramagnetic elements. However, components can also be IC substrates, interposers, or other component carriers, such as those in a board-in-board configuration. Components may be surface-mounted onto a component carrier and / or embedded within the component carrier. Furthermore, other components, particularly those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, may also be used as components.

[0115] In one embodiment, the component carrier is a laminated component carrier. In this embodiment, the component carrier is a multilayered composition that is stacked and connected together by applying pressure and / or heat.

[0116] After the internal layer structure of the component carrier has been treated, one or more additional electrically insulating and / or electrically conductive layer structures (particularly through lamination) can be used to symmetrically or asymmetrically cover one main surface or two opposite main surfaces of the treated layer structure. In other words, stacking can continue until the desired number of layers is obtained.

[0117] After the stacked components of the electrical insulation layer structure and the electrical conductivity layer structure are formed, the obtained layer structure or component carrier can be surface treated.

[0118] Specifically, regarding surface treatment, an electrically insulating solder resist can be applied to one or both opposing main surfaces of a laminate or component carrier. For example, this solder resist can be formed over the entire main surface and subsequently patterned to expose one or more electrically conductive surface portions for electrically connecting the component carrier to electronic peripherals. The solder resist-covered surface portions of the component carrier, particularly copper-containing surfaces, can be effectively protected against oxidation or corrosion.

[0119] Regarding surface treatment, the surface treatment portion can also be selectively applied to the exposed electrically conductive surface portion of the component carrier. This surface treatment portion can be an electrically conductive covering material on the exposed electrically conductive layer structure (e.g., particularly including copper or copper pads, conductive traces, etc.) on the surface of the component carrier. If this exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (especially copper) may oxidize, making the component carrier less reliable. The surface treatment portion can then be formed as a joint between, for example, a surface-mounted component and the component carrier. The surface treatment portion functions to protect the exposed electrically conductive layer structure (especially copper circuitry) and, for example, to achieve a joining process with one or more components by soldering. Examples of suitable materials for the surface treatment portion are organic solderability protectant (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (especially hard gold), electroless tin, nickel-gold, nickel-palladium, etc. Nickel-free materials can also be used for the surface treatment portion, especially for high-speed applications. Examples are ISIG (Immersion Silver Gold) and EPAG (Electrochemical Palladium Autocatalytic Gold). Attached Figure Description The above-defined aspects and other aspects of the present invention will become apparent from the examples of embodiments described below, and will be explained with reference to these examples of embodiments.

[0120] Figure 1 A component carrier with a hydrophobic protective film according to an exemplary embodiment of the present invention is shown.

[0121] Figure 2 A component carrier having two hydrophobic protective films is shown according to an exemplary embodiment of the present invention.

[0122] Figure 3A and Figure 3B The component carriers according to exemplary embodiments of the present invention are shown respectively.

[0123] Figure 4 A standard circuit board is shown.

[0124] Figures 5A to 5E A first method for manufacturing a component carrier according to an exemplary embodiment of the present invention is shown.

[0125] Figures 6A to 6D A second method for manufacturing a component carrier according to an exemplary embodiment of the present invention is shown.

[0126] Figures 7A to 7D A third method for manufacturing a component carrier according to an exemplary embodiment of the present invention is shown.

[0127] Figures 8A to 8G A fourth method for manufacturing a component carrier according to an exemplary embodiment of the present invention is shown. Detailed Implementation

[0128] Figure 1 A component carrier 100 with a hydrophobic protective film 120 according to an exemplary embodiment of the present invention is shown. The component carrier 100 includes a laminate 101 having alternating electrically conductive layer structures 104 and electrically insulating layer structures 102. A cavity 110 is formed in the laminate 101, and the hydrophobic protective film 120 is disposed on the inner surface of the laminate 101 (here at the bottom) defining the cavity 110.

[0129] A hydrophobic protective film 120 partially covers the electrically conductive layer structure 104 of the stacked member 101 at the bottom of the cavity and serves as a corrosion protection portion for the metal surface. In this example, in a cross-sectional view through the component carrier 100, the hydrophobic protective film 120 includes a T-shaped structure (the lower portion is located within the opening 122, and the upper portion is located on top of the metal layer 104). The hydrophobic protective film includes (organic) polymers, particularly comprising two or more formulations, each configured to provide a specific function (e.g., toughening resin, crosslinking agent, etc.). Additionally and / or alternatively, the hydrophobic protective film includes inorganic materials, particularly glass (e.g., silica), and more particularly configured as a glass (barrier) layer.

[0130] The laminate 101 includes two core structures 103 for stabilization (e.g., (fully) cured (reinforced) resin or glass matrix). For example, a bottom core structure 103 may be provided first, and a top core structure 103 may be arranged (after lamination) as a cap on top. The electrically conductive layer structure 104 is arranged on top of the bottom core structure 103, and the electrically conductive layer structure 104 also forms the bottom of the cavity 110. The electrically conductive layer structure 104 is a discontinuous layer with multiple openings. One of the openings 122 is located at the center of the bottom of the cavity 110 (substantially in the middle in the horizontal direction (along the x-direction)) and is filled with the material of a hydrophobic protective film 120. The other openings (located outside the cavity 110) are filled with an electrically insulating material, such as prepreg, from an electrically insulating layer structure 102 arranged above the electrically conductive layer structure 104. In this example, the sidewall 116 of the cavity 110 does not have a hydrophobic protective film 120.

[0131] The vertical sidewall 116 of cavity 110 is made of metal (e.g., copper) and is directly connected to the electrically conductive layer structure 104 located at the bottom of cavity 110. Another electrically insulating material 108 is located at the junction of the electrically conductive layer structure 104, the electrically insulating layer structure 102, and the sidewall 116 (on the side facing away from cavity 110). This other electrically insulating material 108 is, for example, a release (layer) material or electrically insulating material 102. This material 108 is a residue from the manufacturing process to ensure high precision. The material 108 is arranged at the same vertical height z as the hydrophobic protective film 120. Specifically, the upper surface of this other electrically insulating material 108 is arranged coplanarly with the upper surface of the hydrophobic protective film 120.

[0132] An additional electrically conductive layer structure 104 is disposed on top of the electrically insulating layer structure 102. This additional electrically conductive layer structure 104 forms part of the sidewall 116 of the cavity 110 and includes an additional electrically insulating material 106, which is particularly a sealing paste. Preferably, the additional electrically insulating material 106 has a CTE value of less than 30 ppm / °C. The material 106 is in direct contact with the electrically insulating layer structure 102 and may have a wedge shape. The material 106 can be used to separate the sidewall 116 of the cavity 110 from the electrically insulating layer structure 102 of the stack 101, and the material 106 can be used to protect the sidewall 116 of the cavity 110 from the influence of the electrically insulating layer structure 102 of the stack 101.

[0133] Metal particles 105 are disposed between the electrically conductive layer structures 104 located on top of the cavity 110. These metal particles 105 face the cavity 110 on one side in a horizontal direction x and face the electrically insulating layer structure 102 on the other side. Due to this structure, the cavity 110 has a T-shaped form. The metal particles 105 can be manufactured by placing a top structure 140 on top in a cap-like manner and then placing the top structure 140 onto the metal particles 105 to seal the cavity 110. Furthermore, the metal particles 105 can prevent electrically insulating material from the electrically insulating layer structure 102 from entering the cavity 110 during manufacturing, for example, when high temperatures (above 100°C) are applied. Additionally, as can be... Figure 1 As can be seen, cavity 110 is at least partially defined by electrically conductive material or electrically conductive layer structure 104 at the top and bottom and at the sidewall 116.

[0134] Cavity 110 is enclosed at the top by a top structure 140, which includes an additional electrically conductive layer structure 104 on which a second core layer structure 103 is located. The outermost layers of the stack 101 at the top main surface and at the bottom main surface are discontinuous (patterned) electrically conductive layer structures 104, which are configured, for example, to establish electrical connections for the stack 101. Furthermore, an access hole 132 (through the top structure 140) may be formed at the top of cavity 110, wherein the access hole 132 connects cavity 110 (fluidly) to the outside (not shown) of the stack 101. The access hole 132 may not be in direct contact with the hydrophobic protective films 120 / 130.

[0135] Figure 2A component carrier 100 according to another exemplary embodiment of the present invention is shown, the component carrier 100 having two hydrophobic protective films 120, 130. A first hydrophobic protective film 120 is provided, which covers at least a portion of the inner surface of the cavity 110 defining the cavity of the stacked component 101 at a first side, the first side being the bottom (with). Figure 1 (Same as above), and also provided with a second hydrophobic protective film 130, which covers a portion of the inner surface of the cavity 110 defining the stacked member 101 on a second side, which is the top and opposite to the first side. Figure 1 Compared to the previous example, an inlet hole 132 (through the top structure 140) is formed at the top of cavity 110, wherein the inlet hole 132 connects cavity 110 (in fluid terms) to the outside of the stacked member 101. A second hydrophobic protective film 130 closes the inlet hole 132 relative to cavity 110, but the second hydrophobic protective film 130 is permeable to air (e.g., by including pores relative to air). The inlet hole 132 has sidewalls comprising metal, particularly copper. Alternatively, the sidewalls of the inlet hole 132 may also be non-metallic.

[0136] In this example, cavity 110 is used for radio frequency applications: electromagnetic waves (RF waves) are provided at the opening 122, which serves as an inlet (where the first hydrophobic protective film 120 is located), via a connection structure 135 (here, an electrical via connection). The RF waves then propagate through cavity 110 and exit cavity 110 through an inlet hole 132, which is covered by a second hydrophobic protective film 130 and serves as an output.

[0137] Figure 3A and Figure 3B The component carrier 100 according to an exemplary embodiment of the present invention is shown.

[0138] Figure 3AIn this example, cavity 110 is configured as a waveguide for guiding electromagnetic (radio frequency) waves. The inner wall 116, as well as the top and bottom of cavity 110, are covered with metal (e.g., copper). An input portion 122 for RF waves is formed on a first side, i.e., at the bottom of cavity 110, while an output portion 132 for RF waves is formed on the opposite second side, i.e., at the top of cavity 110. The input portion 122 is filled with a first hydrophobic protective film 120, and the (metallic) bottom of cavity 110 is covered by the first hydrophobic protective film 120. The (metallic) top of cavity 110 is covered by a second hydrophobic protective film 130, while the opening of the output portion 132 is not filled with the second hydrophobic protective film 130. Instead, a blocking material 117 (e.g., a sintering paste and / or a non-conductive, low-HF-loss organic material) can be used to fill the opening of the output portion 132. Preferably, the input section 122 and the output section 132 can be closely adjacent (less than 200 μm) to the sidewall of the cavity 116 in the horizontal direction x, but not in direct contact with the sidewall of the cavity 116.

[0139] Cavity 110 is configured here as a fluid (air) cavity with a metal-coated portion inside. Antennas, here microstrip antennas 118 and 119, are arranged (directly) on the top and bottom of component carrier 100. When the microstrip antenna 118 located at the bottom is configured to feed a signal into cavity 110, the microstrip antenna 119 located at the top is configured as an electromagnetic wave output.

[0140] Figure 3B In this example, the input portion 122 and the output portion 132 of cavity 110 are arranged on the same side of component carrier 100 (rather than opposite sides). Furthermore, an electronic component (e.g., a semiconductor chip) 180 is mounted at the input portion 122. In this way, electromagnetic waves (or associated signals) provided by the electronic component 180 can pass through the input portion 122 and be directly transmitted into cavity 110. A first hydrophobic protective film 120 covers the bottom of cavity 110, while a second hydrophobic protective film 130 covers the top of cavity 110, including the input portion 122 and the output portion 132. However, in this example, the input portion 122 and the output portion 132 are not filled with the hydrophobic protective film materials 120 and 130.

[0141] Figures 5A to 5EA first method of manufacturing a component carrier 100 according to an exemplary embodiment of the present invention is illustrated. In the exemplary embodiment, cavity 110 is manufactured using an aligned, patterned top structure 140 (e.g., AFSIW) to have a top feed port 122 and a bottom feed port 132, and cavity 110 is particularly suitable for applications above 3 GHz. Cavity 110 can be manufactured based on alignment marks from X-ray drilling, or it can be manufactured based on a reference portion, such as a reference portion located on the same conductive layer 104 near the feed antenna 118.

[0142] Figure 5A In the first step, a cavity 110 is formed in the stack 101. The (waveguide) cavity 110 is formed after the cover material is removed. In this example, (copper) metal particles (paste) 105 are arranged near the top region of the sidewall. In a specific example, the metal particles 105 may be a copper sintered paste, for example, located on top of a low CTE node dielectric blocking paste used to form the dielectric wall 106. This wall can also be used to prevent electrically insulating material—e.g., prepreg—from flowing into the cavity during pressing. Cut prepreg may be provided, and the top closure may be a combination of copper sintering in the copper sintered paste / wall region and insulating material bonded to the top copper portion.

[0143] The top structure 140, to be disposed on the top of cavity 110 (particularly disposed on the top of cavity 110 with an alignment accuracy of less than ±100 μm), includes an electrically insulating layer structure 102 sandwiched between two electrically conductive layer structures 104. Furthermore, the top structure 140 includes a second hydrophobic protective film 130 located at the bottom of the electrically conductive layer structure 104, which covers a portion of the metal surface of the electrically conductive layer structure 104 located at its central portion (in the horizontal x-direction). Additionally, as by... Figure 5A As can be seen, at least a portion of the sidewall 116 is covered by or in direct contact with the hydrophobic protective layer 120 (e.g., (organic) polymeric material and / or inorganic material).

[0144] As mentioned above, regarding Figure 3A and Figure 3B As described, an opening 122 is provided in the bottom of cavity 110, and the opening 122 is filled with the material of a first hydrophobic protective film 120. The first hydrophobic protective film 120 also covers the metal surface of the bottom of the cavity. A feed microstrip antenna 118 is arranged on the lower main surface of component carrier 100, and the feed microstrip antenna 118 is configured to feed a signal through the opening 122 and into cavity 110. The feed antenna 118 is located on the lower main surface of component carrier 100 and is closely adjacent to cavity 110.

[0145] Figure 5BThe top structure 140 is connected to the laminate 101 using a pressing and sintering process. Figure 5A In contrast, the component carrier 100 is flipped. In a specific example, after the top structure is pressed onto the bottom structure with an alignment accuracy of approximately ±100 μm, an outer alignment mark 131 is formed via an X-ray drilling process with an accuracy of less than ±30 μm. Then, a laser cutting process is applied, particularly with the support of the alignment vias 131 drilled via the X-ray drilling, to remove a portion of the top electrically conductive layer structure (copper) and a portion of the top electrically insulating layer structure (FR4 material) of the top structure 140 (e.g., by applying an etching process in the region of the feed structure). A second hydrophobic protective film 130 located inside the top structure 140 of the cavity 110 can serve as an etch-resistant material to prevent any chemicals from entering the cavity 110. The remaining insulating layer structure 102 can also serve as an etch-resistant material, for example.

[0146] Furthermore, an access hole 132 is formed in the electrically insulating layer structure 102, for example by laser cutting / drilling, specifically with an alignment accuracy of less than ±30 μm. The alignment mark 131 here is, for example, a via (drilled via X-ray) (specifically with an accuracy of less than ±20 μm). The access hole 132 extends downward through the electrically insulating layer structure 102 and the electrically conductive layer structure 104 (through hole) to (terminate) the bottom of the electrically conductive layer structure of the top structure 140. Additionally, a second hydrophobic protective layer 130 is located between the access hole 132 and the cavity 110 (along the thickness direction of the stack).

[0147] Figure 5C :and Figure 5B In contrast, component carrier 100 is flipped over again. The entry hole 132 in the top structure is filled with a filler material 117 (e.g., a sealing material such as a sealing paste, or an electrically insulating resin such as FR), which is in direct contact with a second hydrophobic protective film 130 located on one side of cavity 110. Antenna structure 119 can be provided by plating (copper) or by patterning the electrically conductive layer structure 104.

[0148] Preferably, the hydrophobic protective film 130 (e.g., a polymer) of the top structure 140 prevents any clogging material / paste 117 or copper plating chemicals from entering the cavity 110.

[0149] Figure 5D : Figure 5D It shows Figure 5CIn a variant, the metallized bottom of cavity 110 and the access hole 132 (filled with electrically conductive material 104) are electrically connected to the corresponding antenna structures 118, 119 via a (blind) via connector serving as a coupling structure 135. The coupling structure 135 includes a tapered shape, wherein the tapering direction is oriented towards cavity 110. In the case of access hole 132, another antenna structure 136 is used to guide the signal. Aligned feed lines 118, 119 / 136 located on the top and bottom of cavity 110 can be used for high-frequency applications.

[0150] Figure 5E : Figure 5E It shows Figure 5D A variant of the component carrier 100, wherein the sidewalls of the cavity 110 are electrically insulated and not made of metal. Furthermore, the bottom of the cavity 110 is only partially covered by a patterned metal layer 104. In this example, only the second hydrophobic protective film 130 is used, while the first hydrophobic protective film 120 is omitted.

[0151] Figures 6A to 6D A second method for manufacturing a component carrier according to an exemplary embodiment of the present invention is shown.

[0152] Figure 6A A hydrophobic protective film 120 is formed on a selected electrically conductive layer structure (copper layer) 104 (by screen printing, (spraying) dispensing, or plasma application). The hydrophobic protective film 120 is then (optionally) dried and cured. After the hydrophobic protective film 120 is printed as an anti-corrosion coating on the selected surface 104, it is cured, for example, by a thermal drying process. Any standard drying process can be used, such as thermal drying, infrared drying, or microwave drying. The drying temperature can be, for example, from 100°C to 200°C for 0.5 hours to 2 hours; preferably, the drying temperature is 150°C for 30 minutes.

[0153] Figure 6B A selective micro-etching process is performed to structure the metal (e.g., copper) structure 104, thereby providing a microstructured (patterned, roughened) surface 114 for good adhesion to the electrically insulating layer structure 102, such as a prepreg. The thickness of the microstructured surface 114 (in the stack thickness direction) is less than 10 μm, preferably less than 5 μm. Furthermore, the level of the exposed microstructured surface 114 in the stack thickness direction differs from the level of the junction between the electrically conductive layer structure 104 and the hydrophobic protective layer 120 in the stack thickness direction (see [reference] in selected areas where the hydrophobic protective layer 120 is formed). Figure 6A (Description).

[0154] Figure 6CA cavity 110 (through-hole) is formed in a separate electrically insulating layer structure 112. A microstructured surface 114 is disposed on top of the electrically insulating layer structure 112, such that a hydrophobic protective film 120 is located in the cavity 110 and defines the upper portion of the cavity 110. Furthermore, a [further details are provided]. Figure 6B Another structure is fabricated, having another microstructured surface 114 (which has another hydrophobic protective film 120 and is disposed on top of another electrically insulating layer structure 102). This other structure is disposed below the electrically insulating layer structure 112 such that the other hydrophobic protective film 120 is positioned within the cavity 110 and defines the lower portion of the cavity 110's interior. Finally, the stack 101 is pressed and laminated to close the cavity 110. In other words, a double attachment process (top and bottom) is performed relative to the electrically insulating layer structure 112, and the hydrophobic material 120 defines the outer surface of the cavity. In the example shown, the sidewalls of the cavity 110 are also covered with metal 116 (optional feature).

[0155] Figure 6D A component carrier 100 with a cavity 110 is provided, wherein the top and bottom of the cavity 110 are formed by a hydrophobic protective film 120, which serves as a surface anti-corrosion part of the underlying electrically conductive layer structure 104.

[0156] Figures 7A to 7D A third method for manufacturing a component carrier 100 according to an exemplary embodiment of the present invention is shown. This method is related to... Figures 6A to 6D The methods described correspond accordingly. However, the difference lies in the fact that a preformed part with a cavity has been formed in the lower component carrier structure (i.e., a cavity being manufactured but not considered the final cavity), wherein a hydrophobic protective film 120 is arranged (coated) on the bottom of the preformed cavity (while... Figures 6A to 6D In the example, the lower component carrier structure does not include the prefabricated cavity, and the hydrophobic protective film 120 is located on the main surface. After the upper component carrier structure, the electrically insulating layer structure 102 (having through holes as cavity 110), and the lower component carrier structure are stacked and then laminated together, the prefabricated cavity forms part of cavity 110. In other words, the extension of cavity 110 in the thickness direction z of the stack is greater than the total extension of the additional electrically insulating layer structure 112 in the thickness direction of the stack. The final component carrier 100 can be used, for example, in high-frequency applications such as antennas, radars, filters, frequency dividers, and high-frequency feed structures.

[0157] Figures 8A to 8G A fourth method for manufacturing a component carrier 100 according to an exemplary embodiment of the present invention is shown.

[0158] Figure 8AA hydrophobic protective film 120 is formed on the top of the electrically conductive layer structure 104, and the electrically insulating layer structure 104 surrounds the electrically insulating layer structure 102 in the thickness direction of the stack (in the xz and yz directions).

[0159] Figure 8B The electrically conductive layer structure 104 surrounding the hydrophobic protective film 120 is structured (e.g., selectively micro-etched) to obtain a structured electrically conductive layer structure 114.

[0160] Figure 8C The release layer (paste) 125 is applied to the top of the hydrophobic protective film 120. In a preferred embodiment, the extension of the release layer 125 in the main direction (x direction, y direction) may be larger than the extension of the hydrophilic protective film 120 in the main direction.

[0161] Figure 8D During further stacking of the stacked components, an additional electrical insulating layer structure 112 is formed on the structured electrical conductive layer structure 114. This additional electrical insulating layer structure 112 is not fully cured (e.g., prepreg), allowing the release layer 125 to be pressed into it. Furthermore, another electrical insulating layer structure 102 is provided on top, surrounded by another electrical conductive layer structure 104 (in the xz and yz directions) and another structured electrical conductive layer structure 114. These two electrical conductive layer structures 104, 114 include openings located above the hydrophobic protective film 120 in the vertical z-direction (the openings having at least the height of the release layer 125 in the main extension direction).

[0162] Figure 8E The aforementioned layered structures are pressed together to form a stack 101, such that the release layer 125 is at least partially embedded in the electrical insulating material 112.

[0163] Figure 8F After the stacking is completed, cavity 110 is formed by laser cutting, and then the material inside cavity 110 is removed.

[0164] Figure 8G The release layer 125 can be peeled off from the bottom of the cavity 110, and the hydrophobic protective film 120 can remain in the bottom of the cavity 110 of the final component carrier 100. As shown, a portion of the release layer 125 can remain in the cavity 110. In another example, the sidewalls of the cavity 110 are covered with metal (copper), for example, the sidewalls of the cavity 110 are covered with metal (copper) between the hydrophobic protective film 120 and the electrical insulating material 112, or when a portion of the release layer 125 is retained: the sidewalls of the cavity 110 are covered with metal between the release layer 125 and the electrical insulating material 112.

[0165] Figure Labels 100 component carriers 101 stacked components 102 Electrical Insulation Layer Structure 103 core structure 104 electrical conductivity layer structure 105 metal particles 106 Other electrical insulation materials, plugging materials 108 Another electrical insulation layer structure / material 110 cavity 112 Other electrical insulation layer structures 114 Graphical Electrical Conductive Layer Structure 116 frame, metallized sidewalls 117 packing material, plugging components 118 feed antenna band 119 Export Antenna Band 120 Hydrophobic Protective Film (First Hydrophobic Protective Film, Bottom Part) 122 bottom opening, entrance 125 release layer 130 Hydrophobic protective film (second hydrophobic protective film, top part) 131 Alignment Mark 132 Inlet, top opening, outlet 135 Feeder Structure / Connection Structure 136 Other antenna structures 140 top structure 180 electronic components RF waves 200 standard circuit boards 210 chambers 216 Standard Framework 220 standard protective layer.

Claims

1. A component carrier (100), the component carrier (100) comprising: The stack (101) includes at least one electrically conductive layer structure (104) and at least two electrically insulating layer structures (102). A cavity (110) is formed in the stack (101); as well as At least one hydrophobic protective film (120) is disposed on at least a portion of the inner surface of the stack (101) that defines the cavity (110).

2. The component carrier (100) according to claim 1. in, At least one of the hydrophobic protective films (130) is porous, and in particular, at least one of the hydrophobic protective films (130) includes an open-pore structure.

3. The component carrier (100) according to any one of the preceding claims. in, At least one of the hydrophobic protective films (120, 130) closes at least one inlet hole (122, 132) leading to the cavity (110). The access hole (132) provides a passage from the outside of the component carrier (100) to the cavity (110).

4. The component carrier (100) according to any one of the preceding claims, wherein, At least one of the hydrophobic protective films (120, 130) comprises: A first hydrophobic protective film (120) covers at least a portion of the inner surface of the stack (101) defining the cavity (110) at a first side, and A second hydrophobic protective film (130) covers at least a portion of the inner surface of the stack (101) defining the cavity (110) on a second side. In particular, the second hydrophobic protective film (130) covers at least a portion of the inner surface of the stack (101) defining the cavity (110) on a side opposite to the first side.

5. The component carrier (100) according to any one of the preceding claims. in, At least one of the hydrophobic protective films (120, 130) has a thickness in the range of 50 nm to 50 μm, and in particular, at least one of the hydrophobic protective films (120, 130) has a thickness in the range of 100 nm to 30 μm.

6. The component carrier (100) according to any one of the preceding claims. in, At least one sidewall of the cavity (110) comprises or is made of metal, and in particular, at least one sidewall of the cavity (110) comprises or is made of copper.

7. The component carrier (100) according to any one of the preceding claims. in, Metal particles (105) are arranged between two electrically conductive layers (104), and in particular, the metal particles (105) are sintered materials, and in particular, the metal particles (105) are in direct contact with the cavity (110).

8. The component carrier (100) according to any one of the preceding claims. in, The cavity (110) includes an input section (122) located on a first side and an output section (132) located on a second side, the input section (122) and / or the output section (132) being associated with the hydrophobic protective film (120, 130), and / or the input section (122) and / or the output section (132) being in direct contact with the hydrophobic protective film (120, 130).

9. The component carrier (100) according to any one of the preceding claims. in, At least one of the hydrophobic protective films (120) comprises a polymer, particularly wherein, At least one of the hydrophobic protective films (120) comprises two or more formulations, wherein each formulation is configured to provide a specific function.

10. The component carrier (100) according to claim 9. in, At least one of the hydrophobic protective films (120, 130) comprises: Toughened resin, Specifically, the toughening resin is configured to have a weight percentage in the range of 30% to 80% relative to the total weight of at least one of the hydrophobic protective films (120); and / or Crosslinking agent Specifically, the crosslinking agent is configured to have a weight percentage in the range of 5% to 45% relative to the total weight of at least one of the hydrophobic protective films (120).

11. The component carrier (100) according to any one of the preceding claims. in, At least one of the hydrophobic protective films (120) includes a toughening hardening agent. In particular, The toughening and hardening agent is configured to have a weight percentage in the range of 1% to 15% relative to the total weight of at least one of the hydrophobic protective films (120).

12. The component carrier (100) according to any one of the preceding claims. in, At least one of the hydrophobic protective films (120) includes a base hardener. In particular, The base hardener is configured to have a weight percentage in the range of 1% to 5% relative to the total weight of at least one of the hydrophobic protective films (120).

13. The component carrier (100) according to any one of the preceding claims. in, At least one of the hydrophobic protective films (120) includes an antifoaming agent, and in particular, at least one of the hydrophobic protective films (120) includes a silicone-free antifoaming agent. More specifically, the defoamer is configured to have a weight percentage in the range of 0.5% to 2% relative to the total weight of at least one of the hydrophobic protective films (120).

14. The component carrier (100) according to any one of the preceding claims. in, At least one of the hydrophobic protective films (120) includes a functional filler. In particular, The functional filler is configured to have a weight percentage in the range of 10% to 40% relative to the total weight of at least one of the hydrophobic protective films (120).

15. The component carrier (100) according to any one of claims 1 to 8. in, At least one of the hydrophobic protective films (120) comprises an inorganic material, particularly, at least one of the hydrophobic protective films (120) comprises glass, and more particularly wherein the hydrophobic protective film (120) is configured as a glass barrier layer.

16. The component carrier (100) according to claim 15. in, At least one of the hydrophobic protective films (120) comprises two main surfaces, and The two main surfaces have different adhesion properties.

17. The component carrier (100) according to claim 16. in, At least one of the two main surfaces of the hydrophobic protective film (120) and / or at least one of the first layers of the hydrophobic protective film (120) include hydrophilic properties; And / or Wherein, at least one of the two main surfaces of the hydrophobic protective film (120) and / or at least one second layer of the hydrophobic protective film (120) includes hydrophilic or hydrophobic properties.

18. The component carrier (100) according to claim 16 or 17. in, At least one of the two main surfaces of the hydrophobic protective film (120) and / or the first layer of at least one of the hydrophobic protective films (120) includes at least one functional group for providing hydrophilic properties. Specifically, one of the two main surfaces of at least one of the hydrophobic protective films (120) and / or the first layer of at least one of the hydrophobic protective films (120) comprises one of the following functional groups: imine, amine, thiol, thioamide, phosphate ester, hydroxyl, thiazole, imidazole, acrylate, methacrylate, alcohol, with the alcohol group being particularly 3-hydroxypropyl or 2-hydroxyethyl; And / or Wherein, at least one of the two main surfaces of the hydrophobic protective film (120) and / or the second layer of at least one of the hydrophobic protective films (120) includes at least one functional group for providing hydrophobic properties. Specifically, the other main surface of at least one of the two main surfaces of the hydrophobic protective film (120) and / or the second layer of at least one of the hydrophobic protective films (120) comprises one of the following functional groups: epoxy, allyl, amine, vinyl, alkyl, acid anhydride, particularly maleic anhydride, furan, pyrrole, thiophene, and / or cyclic unsaturated olefin, particularly cyclic pentene.

19. A method for manufacturing a component carrier (100), wherein, The method includes: A stack (101) is provided, the stack (101) including at least one electrically conductive layer structure (104) and at least two electrically insulating layer structures (102). A cavity (110) is formed in the stacked member (101); and, At least a portion of the inner surface of the stack (101) defining the cavity (110) is covered with at least one hydrophobic protective film (120), particularly by printing at least a portion of the inner surface of the stack (101) defining the cavity (110) with at least one hydrophobic protective film (120).

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