Environment-friendly electroplating solution and electroplating process

Abstract

The invention relates to an environment-friendly electroplating solution and an electroplating process thereof. The process comprises the following steps: a plating piece cleaning step: cleaning dust impurities on the surface layer of a plating piece; a plating piece oil removing step; the plated part is placed in oil removal liquid for oil removal treatment, and after oil removal is finished, the oil removal liquid on the surface layer of the plated part is washed away; a plating piece micro-etching step: the plating piece is placed in a micro-etching solution for micro-etching treatment, and the micro-etching solution on the surface layer of the plating piece is washed away after micro-etching is finished; and electroplating the plated part. In the electroplating process, dust impurities on the surface layer of the plated part can be cleaned through the plated part cleaning step. Oil stains on the surface layer of the plated part can be removed through the plated part oil removing step. Through the plating piece micro-etching step, oxides on the surface layer of the plating piece can be removed, and micro-etching is carried out on the surface layer of the plating piece, so that roughening treatment is carried out on the surface layer of the plating piece, and the binding force of a plating layer and the surface layer of the plating piece is increased. Through the plating piece electroplating step, the environment-friendly electroplating liquid is used for electroplating operation.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of cyanide-free electroplating, in particular to an environment-friendly electroplating solution and an electroplating process. BACKGROUND

[0002] Electroplating is a process of plating a thin layer of other metals or alloys on the surface of certain metals by electrolysis. It is a process of attaching a metal film to the surface of a metal or other material part by electrolysis, thereby preventing oxidation, improving wear resistance, electrical conductivity, reflectivity, corrosion resistance, and aesthetics. During electroplating, the plating metal or other insoluble material serves as the anode, and the workpiece to be plated serves as the cathode. The cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer. To prevent interference from other cations and to ensure uniform and firm plating, a solution containing the cations of the plating metal is used as the electrolyte to maintain the concentration of the cations of the plating metal unchanged.

[0003] However, cyanide-free electroplating refers to a new electroplating process that uses a non-cyanide electrolyte instead of a toxic cyanide electrolyte. Cyanide-free electroplating can avoid worker cyanide poisoning and environmental pollution. Traditional cyanide-free electroplating processes, such as the technical solution disclosed in the patent with the application number CN107829116B and the invention name of cyanide-free alkaline copper plating solution, have poor electroplating effects and cannot meet the high-quality electroplating requirements. SUMMARY

[0004] Therefore, it is necessary to provide an electroplating process to solve the technical problem that traditional cyanide-free electroplating processes cannot meet the high-quality electroplating requirements.

[0005] An environment-friendly electroplating solution comprises the following components by mass: copper sulfate 120 g / L to 180 g / L, sodium chloride 20 g / L to 40 g / L, ammonium sulfate 14 g / L to 24 g / L, copper pyrophosphate 14 g / L to 34 g / L, sodium pyrosulfite 18 g / L to 24 g / L, polyethyleneimine 22 g / L to 38 g / L, potassium citrate 0.005 g / L to 0.03 g / L, potassium pyrophosphate 18 g / L to 26 g / L, triethanolamine 6 g / L to 22 g / L, sodium dodecyl sulfate 12 g / L to 25 g / L, disodium hydrogen phosphate 3 g / L to 6 g / L, glycerol 8 g / L to 16 g / L, potassium sodium tartrate 6 g / L to 15 g / L, nitrilotriacetic acid 5 g / L to 10 g / L, sorbic acid 8 g / L to 16 g / L, ethylenediaminetetramethylene phosphonic acid 4 g / L to 11 g / L, complexing agent 24 g / L to 42 g / L, brightener 0.1 g / L to 0.3 g / L, wetting agent 0.5 g / L to 2 g / L, and stabilizer 1 g / L to 4 g / L.

[0006] In one embodiment, the stabilizer is hydroquinone.

[0007] In one embodiment, the wetting agent is sodium sulfonate.

[0008] In one embodiment, the brightener is a mixture of sodium dodecyl benzene sulfonate and polyvinylene diimide.

[0009] In one embodiment, the complexing agent is a mixture of .

[0010] A plating process using the environmentally friendly plating solution of any of the above embodiments for plating work, the process comprising the following steps: A plating part cleaning step: cleaning dust and impurities on the surface of the plating part; A plating part oil removal step; placing the plating part into the oil removal liquid for oil removal treatment, and rinsing off the oil removal liquid on the surface of the plating part after the oil removal is completed; A plating part micro-etching step: placing the plating part into the micro-etching liquid for micro-etching treatment, and rinsing off the micro-etching liquid on the surface of the plating part after the micro-etching is completed; A plating part plating step: placing the plating part into the environmentally friendly plating solution for plating treatment, the current density being to , and the temperature of the environmentally friendly plating solution being 50 to 60 degrees Celsius.

[0011] In one embodiment, an ultrasonic cleaning machine is used to clean the plating part.

[0012] In one embodiment, after the dust and impurities on the surface of the plating part are cleaned, the plating part is subjected to drying treatment.

[0013] In one embodiment, the micro-etching liquid comprises: hydrogen peroxide 30 to 50 mg / L, sulfuric acid 15 to 60 mg / L, potassium acetate 25 to 45 mg / L, sodium chloride 100 to 200 mg / L, benzotriazole 6 to 10 g / L, sulfonated alkali lignin 2 to 4 g / L, and tripropylene phosphite 4 to 8 g / L, and the solvent is water.

[0014] In one embodiment, the oil removal liquid comprises: citric acid 12 to 30 g / L, hexamethylene tetramine 10 to 20 g / L, sodium hydroxide 20 to 40 g / L, sodium carbonate 15 to 25 g / L, polyoxyethylene alkyl ether 5 to 10 g / L, sodium dodecyl sulfate 4 to 8 g / L, sodium butyl naphthalene sulfonate 4 to 10 g / L, triethanolamine 6 to 12 g / L, and the solvent is water.

[0015] The aforementioned environmentally friendly electroplating solution significantly reduces its environmental impact during preparation, preventing personnel from being poisoned by the solution. In the electroplating process, the cleaning step removes dust and impurities from the surface of the workpiece. The degreasing step removes oil stains from the surface. The micro-etching step removes oxides and roughens the surface, increasing the adhesion between the plating layer and the workpiece surface. Through these electroplating steps, using the environmentally friendly solution, a dense, uniform, high-quality, and durable plating layer can be efficiently formed on the surface of the workpiece. Attached Figure Description

[0016] Figure 1 This is a flowchart of the electroplating process in one embodiment. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. To make the above-mentioned objectives, features, and advantages of this invention more apparent and understandable, the specific embodiments of this invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the invention. However, the invention can be implemented in many ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below. In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.

[0018] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0019] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0020] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0021] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0022] This invention provides an environmentally friendly electroplating solution, comprising the following components in parts by weight: copper sulfate 120 g / L to 180 g / L, sodium chloride 20 g / L to 40 g / L, ammonium sulfate 14 g / L to 24 g / L, copper pyrophosphate 14 g / L to 34 g / L, sodium metabisulfite 18 g / L to 24 g / L, polyethyleneimine 22 g / L to 38 g / L, potassium citrate 0.005 g / L to 0.03 g / L, potassium pyrophosphate 18 g / L to 26 g / L, triethanolamine 6 g / L to 22 g / L, sodium dodecyl sulfate 12 g / L to 25 g / L, disodium hydrogen phosphate 3 g / L to 6 g / L, glycerol 8 g / L to 16 g / L, and potassium sodium tartrate 6 g / L. The concentrations of the following ingredients are as follows: g / L to 15 g / L, 5 g / L to 10 g / L, sorbic acid 8 g / L to 16 g / L, ethylenediaminetetramethylenephosphonic acid 4 g / L to 11 g / L, complexing agent 24 g / L to 42 g / L, brightening agent 0.1 g / L to 0.3 g / L, wetting agent 0.5 g / L to 2 g / L, and stabilizer 1 g / L to 4 g / L.

[0023] Furthermore, the environmentally friendly electroplating solution comprises the following components in parts by weight: copper sulfate 130 g / L to 170 g / L, sodium chloride 25 g / L to 35 g / L, ammonium sulfate 16 g / L to 22 g / L, copper pyrophosphate 16 g / L to 32 g / L, sodium metabisulfite 19 g / L to 23 g / L, polyethyleneimine 25 g / L to 35 g / L, potassium citrate 0.01 g / L to 0.02 g / L, potassium pyrophosphate 20 g / L to 24 g / L, triethanolamine 8 g / L to 20 g / L, sodium dodecyl sulfate 14 g / L to 22 g / L, disodium hydrogen phosphate 4 g / L to 6 g / L, glycerol 10 g / L to 14 g / L, and potassium sodium tartrate 8 g / L. The concentrations of the following ingredients are as follows: g / L to 12 g / L, 6 g / L to 9 g / L, sorbic acid 9 g / L to 15 g / L, ethylenediaminetetramethylenephosphonic acid 5 g / L to 10 g / L, complexing agent 26 g / L to 40 g / L, brightening agent 0.15 g / L to 0.25 g / L, wetting agent 0.1 g / L to 1.5 g / L, and stabilizer 2 g / L to 3 g / L.

[0024] Specifically, the environmentally friendly electroplating solution comprises the following components in parts by weight: copper sulfate 140 g / L, sodium chloride 30 g / L, ammonium sulfate 20 g / L, copper pyrophosphate 20 g / L, sodium metabisulfite 22 g / L, polyethyleneimine 32 g / L, potassium citrate 0.015 g / L, potassium pyrophosphate 22 g / L, triethanolamine 15 g / L, sodium dodecyl sulfate 16 g / L, disodium hydrogen phosphate 5 g / L, glycerol 12 g / L, potassium sodium tartrate 11 g / L, aminotriacetic acid 8 g / L, sorbic acid 12 g / L, ethylenediaminetetramethylenephosphonic acid 8 g / L, complexing agent 30 g / L, brightener 0.2 g / L, wetting agent 1 g / L, and stabilizer 2.5 g / L.

[0025] To increase the stability of the electroplating process, in one embodiment, the stabilizer is hydroquinone. Hydroquinone can improve the stability of the environmentally friendly electroplating solution, prevent the sedimentation of components in the solution, and increase the mixing uniformity of components.

[0026] To improve the electroplating effect and increase the adhesion between the plating layer and the surface of the workpiece, in one embodiment, the wetting agent is sodium sulfonate. Sodium sulfonate can reduce the surface tension of the environmentally friendly electroplating solution, improve the adhesion between the solution and the workpiece surface, and reduce bubbles on the workpiece surface. This improves the adhesion between the plating layer and the workpiece surface, thus enhancing the electroplating effect.

[0027] To improve the smoothness and gloss of the coating on the surface of the plated part, in one embodiment, the brightener is a mixture of sodium dodecyl diphenylsulfonate and polypentene diimide. The mixture of sodium dodecyl diphenylsulfonate and polypentene diimide can refine the crystal structure of the coating, thereby improving the smoothness and gloss of the coating.

[0028] To improve the adhesion between the coating and the surface of the workpiece, in one embodiment, the complexing agent is potassium sulfite and... A mixture of potassium sulfite and... The mixture improves the bonding strength between the coating and the surface of the workpiece, thus improving the electroplating effect.

[0029] Please see Figure 1 The present invention also provides an electroplating process, wherein the electroplating operation is performed using the environmentally friendly electroplating solution described in any of the above embodiments. The process includes the following steps: Step 101: Cleaning the plated parts: Remove dust and impurities from the surface of the plated parts.

[0030] Specifically, in this embodiment, an ultrasonic cleaner is used to clean the plated parts, removing dust and impurities from the surface. Further, after cleaning the dust and impurities from the surface, the plated parts are dried.

[0031] Step 102: Degreasing of the plated parts. Place the plated parts into the degreasing solution for degreasing treatment. After degreasing, rinse off the degreasing solution from the surface of the plated parts.

[0032] Specifically, the plated parts are immersed and shaken in a degreasing solution to remove oil. After degreasing, the surface of the plated parts is rinsed off with running water. After rinsing off the degreasing solution, the plated parts are dried.

[0033] Step 103: Micro-etching of plated parts: Place the plated parts into the micro-etching solution for micro-etching treatment, and rinse off the micro-etching solution on the surface of the plated parts after micro-etching is completed.

[0034] Specifically, the workpiece is immersed and shaken in a micro-etching solution for micro-etching treatment. After the micro-etching treatment is completed, the micro-etching solution on the surface of the workpiece is rinsed off with running water. After rinsing off the micro-etching solution, the workpiece is dried.

[0035] Step 104: Electroplating of the workpiece: Place the workpiece into the environmentally friendly electroplating solution for electroplating treatment, with a current density of... to The temperature of the environmentally friendly electroplating solution is 50 to 60 degrees Celsius.

[0036] To remove oxides from the surface of the plated part and roughen the surface, in one embodiment, the micro-etching solution comprises: hydrogen peroxide 30 mg / L to 50 mg / L, sulfuric acid 15 mg / L to 60 mg / L, potassium acetate 25 mg / L to 45 mg / L, sodium chloride 100 mg / L to 200 mg / L, benzotriazole 6 g / L to 10 g / L, sulfonated alkali lignin 2 g / L to 4 g / L, and tripropylene phosphite 4 g / L to 8 g / L, with water as the solvent. The micro-etching solution composed of the above components can effectively remove oxides from the surface of the plated part and roughen the surface, thereby further improving the adhesion between the plating layer and the surface of the plated part.

[0037] To remove oil stains from the surface of plated parts, in one embodiment, the degreasing solution comprises: 12 g / L to 30 g / L citric acid, 10 g / L to 20 g / L hexamethylenetetramine, 20 g / L to 40 g / L sodium hydroxide, 15 g / L to 25 g / L sodium carbonate, 5 g / L to 10 g / L polyoxyethylene alkyl ether, 4 g / L to 8 g / L sodium dodecyl sulfate, 4 g / L to 10 g / L sodium butylnaphthalene sulfonate, and 6 g / L to 12 g / L triethanolamine, with water as the solvent. The degreasing solution composed of the above components can effectively remove oil stains from the surface of plated parts.

[0038] The aforementioned environmentally friendly electroplating solution significantly reduces its environmental impact during preparation, preventing personnel from being poisoned by the solution. In the electroplating process, the cleaning step removes dust and impurities from the surface of the workpiece. The degreasing step removes oil stains from the surface. The micro-etching step removes oxides and roughens the surface, increasing the adhesion between the plating layer and the workpiece surface. Through these electroplating steps, using the environmentally friendly solution, a dense, uniform, high-quality, and durable plating layer can be efficiently formed on the surface of the workpiece.

[0039] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0040] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An environmentally friendly electroplating solution, characterized in that, The composition comprises the following components in parts by weight: copper sulfate 120 g / L to 180 g / L, sodium chloride 20 g / L to 40 g / L, ammonium sulfate 14 g / L to 24 g / L, copper pyrophosphate 14 g / L to 34 g / L, sodium metabisulfite 18 g / L to 24 g / L, polyethyleneimine 22 g / L to 38 g / L, potassium citrate 0.005 g / L to 0.03 g / L, potassium pyrophosphate 18 g / L to 26 g / L, triethanolamine 6 g / L to 22 g / L, sodium dodecyl sulfate 12 g / L to 25 g / L, disodium hydrogen phosphate 3 g / L to 6 g / L, glycerol 8 g / L to 16 g / L, potassium sodium tartrate 6 g / L to 15 g / L, nitroglycerin 5 g / L to 10 g / L, sorbic acid 8 g / L to 16 g / L, and ethylenediaminetetramethylenephosphonic acid 4 g / L. The concentrations of the following components are as follows: g / L to 11 g / L; complexing agent 24 g / L to 42 g / L; brightening agent 0.1 g / L to 0.3 g / L; wetting agent 0.5 g / L to 2 g / L; and stabilizer 1 g / L to 4 g / L.

2. The process according to claim 1, characterized in that, The stabilizer is hydroquinone.

3. The process according to claim 1, characterized in that, The wetting agent is sodium sulfonate.

4. The process according to claim 1, characterized in that, The brightener is a mixture of sodium dodecyl diphenylsulfonate and polypentene diimide.

5. The process according to claim 1, characterized in that, The complexing agent is A mixture.

6. An electroplating process, characterized in that, The electroplating process using the environmentally friendly electroplating solution described in any one of claims 1 to 5 includes the following steps: Cleaning steps for plated parts: Remove dust and impurities from the surface of the plated parts; Degreasing steps for plated parts: Place the plated parts into a degreasing solution for degreasing treatment, and rinse off the degreasing solution from the surface of the plated parts after degreasing. Micro-etching steps for plated parts: Place the plated parts into the micro-etching solution for micro-etching treatment, and rinse off the micro-etching solution from the surface of the plated parts after micro-etching is completed. Electroplating steps: Place the workpiece into the environmentally friendly electroplating solution for electroplating treatment, with a current density of... to The temperature of the environmentally friendly electroplating solution is 50 to 60 degrees Celsius.

7. The process according to claim 6, characterized in that, The plated parts are cleaned using an ultrasonic cleaning machine.

8. The process according to claim 7, characterized in that, After cleaning the dust and impurities from the surface of the plated parts, the parts are dried.

9. The process according to claim 6, characterized in that, The micro-etching solution comprises: hydrogen peroxide 30 mg / L to 50 mg / L, sulfuric acid 15 mg / L to 60 mg / L, potassium acetate 25 mg / L to 45 mg / L, sodium chloride 100 mg / L to 200 mg / L, benzotriazole 6 g / L to 10 g / L, sulfonated alkali lignin 2 g / L to 4 g / L, and tripropylene phosphite 4 g / L to 8 g / L, with water as the solvent.

10. The process according to claim 6, characterized in that, The degreasing solution comprises: citric acid 12 g / L to 30 g / L, hexamethylenetetramine 10 g / L to 20 g / L, sodium hydroxide 20 g / L to 40 g / L, sodium carbonate 15 g / L to 25 g / L, polyoxyethylene alkyl ether 5 g / L to 10 g / L, sodium dodecyl sulfate 4 g / L to 8 g / L, sodium butylnaphthalene sulfonate 4 g / L to 10 g / L, and triethanolamine 6 g / L to 12 g / L, with water as the solvent.

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