Simulation device and use method thereof

Abstract

The invention relates to a simulation device and a using method thereof, the simulation device comprises a blade shell, a DCU board card, a function integration board and a signal input and output board, and the blade shell is provided with a containing cavity for containing cooling liquid; the DCU board card is arranged in the accommodating cavity, a first dummy load is arranged on the DCU board card, and the first dummy load is used for simulating a device generating heat in the server; the function integrated board is arranged in the accommodating cavity and comprises a control module; at least part of the signal input and output board is arranged in the containing cavity, the signal input and output board is used for supplying power to the first dummy load so that the first dummy load can generate heat and generate preset heat, and the heated and gasified cooling liquid in the containing cavity can flow out of the containing cavity and flow into the containing cavity after being liquefied; the control module is used for monitoring the real-time liquid level of the cooling liquid in the containing cavity.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and in particular to a simulation device and its usage method. Background Technology

[0002] With the continuous development of technology, various industries have an increasingly strong demand for the powerful computing power of high-performance computers. However, as computing power increases, the power consumption of various components inside the server is also increasing, which in turn leads to a corresponding increase in the heat generated inside the server. Therefore, when developing high-performance servers based on higher computing power, it is necessary to verify the heat dissipation performance of the corresponding server in advance to avoid the server failing to meet the heat dissipation requirements after development and the equipment failing to operate normally. However, there is currently no such simulation device in the relevant technology. Summary of the Invention

[0003] Therefore, it is necessary to provide a simulation device and its usage method for verifying server heat dissipation performance.

[0004] A simulation device, the simulation device comprising:

[0005] The blade housing has a cavity for containing coolant;

[0006] A DCU board is disposed within the receiving cavity. The DCU board is provided with a first dummy load, which is used to simulate a device that generates heat in a server.

[0007] A functional integration board is disposed within the receiving cavity, and the functional integration board includes a control module;

[0008] A signal input / output board is at least partially disposed within the receiving cavity. The signal input / output board is used to supply power to the first dummy load so that the first dummy load heats up and generates a preset amount of heat. The coolant that is heated and vaporized in the receiving cavity can flow out of the receiving cavity and then flow back into the receiving cavity after liquefaction. The control module is used to monitor the real-time liquid level of the coolant in the receiving cavity.

[0009] The aforementioned simulation device contains coolant within the blade housing cavity, and houses both the DCU board and the functional integration board within this cavity. A first dummy load is mounted on the DCU board, simulating heat-generating components within the server. A signal input / output board powers the first dummy load, causing it to heat up and generate a preset amount of heat. During this heating process, the coolant within the cavity cools the dummy load. The coolant vaporizes upon heating, and at least a portion of the vaporized coolant flows out of the cavity to liquefy, then flows back into the cavity to participate in cooling. This achieves a gas-liquid phase change cycle, thereby removing heat through this heat exchange method. During the cooling of the dummy load, the control module of the functional integration board monitors the real-time coolant level within the cavity to determine the heat dissipation capacity of the immersion phase change liquid-cooled server development stage test device. If the coolant level within the cavity consistently submerges the dummy load, the immersion phase change liquid-cooled server under the current structure is deemed to have good heat dissipation performance, and there is no risk of burning out the dummy load. If the real-time liquid level of the coolant in the containment cavity monitored by the functional integration board is less than the preset liquid level value, it is determined that the heat dissipation performance of the immersion phase change liquid-cooled server under the front structure is poor, and there is a possibility of burning out the first dummy load.

[0010] In one embodiment, the simulation device includes a motherboard disposed within the receiving cavity, the DCU board and the functional integration board being electrically connected to the motherboard, and the motherboard being provided with a second dummy load and a third dummy load, the second dummy load being used to simulate the central processing unit of the server, and the third dummy load being used to simulate the power supply of the server.

[0011] In one embodiment, a front panel disposed outside the blade housing is further included, the front panel being electrically connected to the functional integration board;

[0012] The motherboard is equipped with a thyristor voltage regulator module. The front panel is used to provide high-voltage AC power to the second dummy load, the third dummy load, and the thyristor voltage regulator module. The high-voltage AC power supply to the second dummy load and the third dummy load is controlled by the thyristor voltage regulator module to adjust the power of the second dummy load and the third dummy load.

[0013] In one embodiment, multiple motherboards are provided, each motherboard is provided with multiple DCU boards, and each DCU board is provided with multiple first dummy loads.

[0014] In one embodiment, the DCU board is provided with four first dummy loads, and the four first dummy loads on each DCU board are connected in series in pairs to form a load component, and the two load components are connected in parallel.

[0015] In one embodiment, the functional integration board includes a sensor module, the sensor module including a liquid level sensor for measuring the liquid level of the coolant within the containment cavity; and / or,

[0016] The functional integration board includes a sensor module, which includes a first pressure sensor and a second pressure sensor. The first pressure sensor is used to detect the liquid pressure inside the receiving cavity, and the second pressure sensor is used to detect the gas pressure inside the receiving cavity; and / or...

[0017] The functional integration board includes a sensor module, which includes a first temperature sensor and a second temperature sensor. The first temperature sensor is used to detect the liquid temperature in the containment cavity, and the second temperature sensor is used to detect the gas temperature in the containment cavity.

[0018] In one embodiment, a front panel is also provided outside the blade housing. The front panel is electrically connected to the functional integration board. The front panel is provided with buttons, a screen communication output interface, a high-voltage AC power supply interface, and a reset button.

[0019] In one embodiment, the first dummy load includes a heating element and a heat sink connected together. The heating element includes a resistor and is used to carry a large instantaneous current. The heat sink is used to conduct the heat generated by the heating element.

[0020] In one embodiment, the blade housing is provided with a liquid inlet pipe and a liquid outlet pipe. The simulation device further includes a liquid inlet valve provided on the liquid inlet pipe and a liquid outlet valve provided on the liquid outlet pipe. Both the liquid inlet valve and the liquid outlet valve are electrically connected to the control module.

[0021] This application also provides a method of using the simulation device according to any one of the foregoing claims, the method of using the simulation device comprising:

[0022] The signal input / output board supplies power to the first dummy load, and the power supply voltage of the signal input / output board is adjusted to make the first dummy load heat up and generate a preset amount of heat.

[0023] The first dummy load is cooled by the coolant in the containment cavity. The coolant, after absorbing heat and vaporizing in the containment cavity, flows out of the containment cavity and then flows back into the containment cavity after liquefaction.

[0024] During the cooling of the first dummy load, the real-time liquid level of the coolant in the containment cavity is monitored by the control module of the functional integration board.

[0025] In one embodiment, during the liquid cooling of the first dummy load, the control module issues a command to replenish the coolant into the containment cavity so that the first dummy load can be completely submerged in the liquid, and a gas phase region is left in the containment cavity to facilitate the containment of some gas.

[0026] In one embodiment, if the control module detects that the real-time coolant level in the containment cavity is less than a preset level value:

[0027] The control module controls the alarm device to sound an alarm and cuts off the power to stop operation; or,

[0028] Increase the liquid inflow rate so that the first dummy load can be completely submerged in the liquid.

[0029] In one embodiment, during the cooling of the first dummy load, a first pressure sensor monitors the liquid pressure in the containment cavity and transmits the real-time liquid pressure data to the control module, and a second pressure sensor detects the gas pressure in the containment cavity and transmits the real-time gas pressure data to the control module.

[0030] If the control module detects that the liquid pressure or gas pressure in the containment cavity is greater than a preset pressure value, the control module will activate the alarm and cut off the power.

[0031] In one embodiment, during the cooling of the first dummy load, a first temperature sensor monitors the liquid temperature in the containment cavity and transmits the real-time liquid temperature data to the control module, and a second temperature sensor detects the gas temperature in the containment cavity and transmits the real-time gas temperature data to the control module.

[0032] If the control module detects that the liquid temperature or gas temperature in the containment cavity is greater than the preset temperature value, the control module will activate the alarm and cut off the power.

[0033] In one embodiment, the power of the second and third dummy loads on the motherboard is controlled by the thyristor voltage regulation module on the motherboard, so that the second and third dummy loads generate preset heat. Attached Figure Description

[0034] Figure 1 A schematic diagram of the simulation device provided in this application.

[0035] Figure 2 A flowchart illustrating the method of using the simulation device provided in this application. Detailed Implementation

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0042] This application provides a simulation device, such as Figure 1 As shown, the simulation device includes a blade housing, a DCU board, a functional integration board, and a signal input / output board. The blade housing has a cavity for containing coolant. The DCU board is disposed within the cavity and has a first dummy load, which is used to simulate a heat-generating device in a server. The functional integration board is disposed within the cavity and includes a control module. The signal input / output board is at least partially disposed within the cavity and is used to supply power to the first dummy load, causing it to heat up and generate a preset amount of heat. The coolant vaporized by the heat in the cavity can flow out of the cavity and then liquefy back into the cavity. The control module is used to monitor the real-time coolant level in the cavity.

[0043] The aforementioned simulation device contains coolant within the housing cavity of the blade casing. The DCU board and the functional integration board are also housed within this cavity. A first dummy load is mounted on the DCU board, simulating heat-generating components in the server. A signal input / output board powers the first dummy load, causing it to heat up and generate a preset amount of heat. During this heating process, the coolant within the housing cavity cools the dummy load. The coolant vaporizes upon heating, and at least a portion of the vaporized coolant flows out of the housing cavity to liquefy, then flows back into the housing cavity to participate in cooling. This achieves a gas-liquid phase change cycle, thereby removing heat through this heat exchange method. During the cooling of the first dummy load, the control module of the functional integration board monitors the real-time coolant level within the housing cavity to determine the heat dissipation capacity of the immersion phase change liquid-cooled server development stage test device. If the coolant level within the housing cavity consistently submerges the first dummy load, the immersion phase change liquid-cooled server under the current structure is deemed to have good heat dissipation performance, and there is no risk of burning out the first dummy load. If the real-time liquid level of the coolant in the containment cavity monitored by the functional integration board is less than the preset liquid level value, it is determined that the heat dissipation performance of the immersion phase change liquid-cooled server under the front structure is poor, and there is a possibility of burning out the first dummy load.

[0044] Specifically, in Figure 1 In the diagram, the red dashed box represents the blade housing, and the area outlined by the red dashed box is the receiving cavity, in which the DCU board and function integration card are located and immersed in the coolant of the receiving cavity.

[0045] Specifically, such as Figure 1 As shown, in this field, signal input / output boards are also known as IO boards.

[0046] In some embodiments, such as Figure 1 As shown, the simulation device includes a motherboard disposed within a receiving cavity. The DCU board and the functional integration board are electrically connected to the motherboard. A second dummy load and a third dummy load are disposed on the motherboard. The second dummy load simulates the central processing unit (CPU) of a server, and the third dummy load simulates the server's power supply. By configuring the motherboard, electrically connecting the DCU board and the functional integration board to the motherboard, and installing the second dummy load on the motherboard, the central processing unit of the server is simulated; and by installing the third dummy load on the motherboard, the power supply of the server is simulated.

[0047] Specifically, there are two second dummy load settings and one third dummy load setting.

[0048] In some embodiments, such as Figure 1 As shown, the simulation device also includes a front panel disposed outside the blade housing. The front panel is electrically connected to the functional integration board. The front panel is equipped with buttons, a screen communication output interface, a high-voltage AC power supply interface, and a reset button.

[0049] In some embodiments, the simulation device further includes a front panel disposed outside the blade housing, the front panel being electrically connected to the functional integration board; a SCR voltage regulator module is mounted on the main board, the front panel being used to provide high-voltage AC power to the second dummy load, the third dummy load, and the SCR voltage regulator module, and the high-voltage AC power supply to the second dummy load and the third dummy load is controlled by the SCR voltage regulator module to adjust the power of the second dummy load and the third dummy load. The main board and the functional integration board are connected, and the high-voltage AC power supply is connected to the front panel terminals, which are connected to the main board inside the simulation device via a through-wall wiring harness. The power supply to the second dummy load, the third dummy load, and the SCR voltage regulator module provides power to the simulated CPU and the simulated power supply heating dummy load, and the high-voltage AC power supply to the second dummy load and the third dummy load is controlled by the SCR voltage regulator module to adjust the power of the second dummy load and the third dummy load, thereby causing the second dummy load and the third dummy load to heat up and generate preset heat.

[0050] In some embodiments, such as Figure 1 As shown, there are multiple motherboards, each with multiple DCU boards, and each DCU board has multiple dummy loads. By setting up multiple motherboards, each with multiple DCU boards, and each DCU board with multiple dummy loads, an immersion liquid-cooled phase change server is simulated.

[0051] Specifically, such as Figure 1 As shown, the DCU board has four first dummy loads. Each DCU board has four first dummy loads connected in series in pairs to form a load group, and the two load groups are connected in parallel. The main function of the DCU board in this application is to provide high-voltage DC power to the DCU dummy loads and to provide installation conditions. Each DCU board has four first dummy loads, which are connected in series in pairs, and then the two groups are connected in parallel to the DCU board. Each simulation device contains eight DCU boards, with four DCU boards installed on each motherboard. The DCU boards and motherboard are connected via plug-in connectors, and the high-voltage DC power supply is taken from the motherboard channel.

[0052] In some embodiments, the functional integration board includes a sensor module, which includes a liquid level sensor for measuring the liquid level of the coolant in the containment cavity; and / or, the functional integration board includes a sensor module, which includes a first pressure sensor and a second pressure sensor, the first pressure sensor for detecting the liquid pressure in the containment cavity and the second pressure sensor for detecting the gas pressure in the containment cavity; and / or, the functional integration board includes a sensor module, which includes a first temperature sensor and a second temperature sensor, the first temperature sensor for detecting the liquid temperature in the containment cavity and the second temperature sensor for detecting the gas temperature in the containment cavity. By setting the liquid level sensor, the real-time liquid level of the coolant in the containment cavity is detected. The liquid level sensor is electrically connected to the control module, and the liquid level sensor transmits the detected real-time data to the control module. By setting the first pressure sensor and the second pressure sensor, the liquid pressure and gas pressure in the containment cavity are detected. Both the first pressure sensor and the second pressure sensor are electrically connected to the control module, and the first pressure sensor and the second pressure sensor transmit the detected real-time data to the control module. By setting a first temperature sensor and a second temperature sensor, the liquid temperature and gas temperature in the containment cavity are detected. The first temperature sensor and the second temperature sensor are electrically connected to the control module, and the first temperature sensor and the second temperature sensor transmit the detected real-time data to the control module.

[0053] In some embodiments, the first dummy load includes a heating element and a heat sink connected together. The heating element includes a resistor and is used to carry a large instantaneous current. The heat sink is used to conduct the heat generated by the heating element. The first dummy load consists of a heating element and a heat sink. The main body of the heating element is a resistor, which includes a special connection design to carry a large instantaneous current. The heating element includes two externally soldered connection points for power supply circuit connection. The heating element and the heat sink are connected by soldering, which can promptly conduct away the large amount of heat generated by the heating element.

[0054] Specifically, the first, second, and third dummy loads have identical structures. The first, second, and third dummy loads described in this simulation device all use the above-described configuration, with consistent structural appearance and connection methods. Adjusting the heating power is achieved by adjusting the input voltage, and is unrelated to the appearance.

[0055] In some embodiments, the blade housing is provided with a liquid inlet pipe and a liquid outlet pipe. The simulation device also includes a liquid inlet valve on the liquid inlet pipe and a liquid outlet valve on the liquid outlet pipe, both of which are electrically connected to the control module. By electrically connecting both the liquid inlet and liquid outlet valves to the control module, the control module can control the opening or closing of the liquid inlet valve, thereby regulating the liquid inlet flow. Controlling the liquid outlet valve via the control module facilitates the emptying of the liquid from the simulation device.

[0056] Furthermore, the functions of the various boards in the simulation device of this application are explained below:

[0057] The I / O board primarily powers the first dummy load on the DCU board of the entire analog device, using a dual-channel high-voltage DC power supply. It also provides low-voltage DC power to the integrated function boards. The control section includes three solenoid valve control channels, the communication section includes a CAN communication channel, and other sections include blade slot address positioning channels. The board connected to the I / O board is the motherboard board; the entire I / O board system consists of one board.

[0058] The main board's primary function is to transmit the high-voltage DC power from the signal input / output boards to the DCU board, and to transmit the relevant channel signals from the I / O board and the low-voltage DC power supply circuit to the functional integrated board. The main board itself handles two dummy loads: simulating the central processing unit (CPU) and simulating the power supply. Specifically, two second dummy loads simulate the CPU, with the same location and power as the actual CPU, and a third dummy load simulates the power supply. The power supply for these three dummy loads is taken from the high-voltage AC power supply on the front panel and is independent of the power supply for the first dummy load on the DCU board. The high-voltage AC power supply for the second and third dummy loads is controlled by a thyristor voltage regulator module, facilitating power adjustment of the second and third dummy loads. The power adjustment of the first dummy load on the DCU board adjusts the DC cabinet voltage output, thus enabling controllable dummy load power for the entire simulation device, facilitating testing under various power conditions. The thyristor voltage regulator module is installed on the main board, with power taken from the functional integrated board, and control signals controlled by the MCU on the functional integrated board. The entire device consists of two main boards, which are connected to both an I / O board and a functional integrated board. The two motherboards are interconnected to transmit control signals from the thyristor voltage regulator module.

[0059] Functional Integration Board: Primarily responsible for the overall device control and communication functions. The overall circuitry is divided into five modules: power supply module, communication module, control module, sensor module, and main controller module. The power supply module mainly refers to low-voltage DC power supply, which can be obtained from the low-voltage DC power supply channel on the main board or the front panel. This power supply section provides power to the entire board and includes multiple voltage conversion levels. The communication section mainly includes one RS-485 serial communication port, one CAN communication port, and one serial communication port. The RS-485 communication transmits the collected information to the screen via the front panel channel. The CAN communication transmits the collected information to another monitoring system. The serial communication port is used to connect to a PC to monitor and print information from the controller.

[0060] The control module includes the control of three solenoid valves: two independent inlet valves and one outlet valve, used to control the liquid level inside the device. The three solenoid valve channels are transmitted to the external solenoid valve control circuit via the main board and I / O board.

[0061] The sensor module includes two temperature gauges, two pressure gauges, and two different level gauges with varying ranges. One set of temperature and pressure gauges is used to collect the liquid temperature and pressure, while the other set is used to collect the temperature and pressure in the upper part of the device's meteorological zone. The two level gauges have ranges of 30mm and 60mm respectively, and are used to monitor the internal liquid level in real time for level control.

[0062] The control module includes a main controller, which is a microcontroller. All communication, sensor data acquisition, and control functions are controlled by commands issued from the main controller. The relevant control logic program runs on the main controller. The function integration board is connected to the main board via three terminals and to the front panel via one terminal. It should be noted that the entire simulation device comprises one function integration board.

[0063] Front panel: Its main function is to provide external interfaces, including a 485 communication interface for the display screen, a low-voltage DC power supply interface for the front function integration board, a program download interface, and high-voltage AC power supply interfaces for the CPU dummy load and the analog power supply dummy load. It also includes a program reset button, a drain button, a power indicator light, and a program running indicator light. The front panel is mounted at the front of the device and is not submerged in the coolant. It should be noted that the entire simulation device consists of only one front panel.

[0064] In summary, this application has the following beneficial effects:

[0065] The final effect of the simulation device in this application is a "fake" immersion liquid-cooled phase change server. This device can completely simulate the heating state of a real immersion phase change liquid-cooled server and can simulate heating states at different power levels. The internal heating components are immersed in a special liquid. As the heating components (first dummy load, second dummy load, and third dummy load) are heated, the liquid turns into gas after reaching its boiling point. The gas can be discharged through the top of the device, and after being discharged, it can be circulated back into liquid by an external cooling system, and then enter the device through a solenoid valve, thus realizing a gas-liquid phase change cycle to remove heat through this heat exchange method. The liquid level control inside the device is controlled by commands issued by the functional integration board, which can keep the liquid level at a stable value, ensuring that the heating components are completely immersed in the liquid. A gas vent is left at the top for gas to escape. The stability of both the liquid and gas vents is controlled by the functional integration board. The functional integration board also includes multiple alarm functions to protect the device, such as issuing an alarm and cutting off the main power supply in time when the gas pressure exceeds the limit. Low liquid level alarm: When the liquid supply is insufficient, the heat dissipation components exposed to the cold air zone will be unable to dissipate heat, which may lead to the burnout of the heat dissipation components. The program includes multiple alarm functions to protect the normal operation of the device.

[0066] The simulation device uses adjustable voltage to simulate heat dissipation at different power levels. Voltage adjustment is mainly divided into two parts. One part involves the first dummy load on the DCU board, powered by a high-voltage DC supply. The voltage value of the high-voltage DC power supply output cabinet can be adjusted, and the heat dissipation power under the current operating conditions can be determined based on the voltage and current displayed on the high-voltage DC cabinet. The other part involves the adjustment of the second dummy load (simulating the CPU) and the second dummy load (simulating power supply heat dissipation). The voltage of this part is controlled by a thyristor voltage regulator module. Voltage adjustment can be achieved by setting the PWM output duty cycle on the front screen of the device. The screen then sends the duty cycle adjustment information to the function integration board, which executes the corresponding output signal to control the thyristor voltage regulator module to output voltage according to the corresponding ratio. The voltage can be calculated by setting the duty cycle, and the current can be measured using a current clamp. Both measurements yield the current power of the CPU and the simulated power supply dummy load. Adding these two parts together gives the total power of the device.

[0067] The front panel connected screen can display sensor information collected by the function integration board, alarm information, input voltage regulation information, liquid level control input information, solenoid valve switch status, etc.

[0068] This simulation device can simulate the internal heat dissipation of an immersion phase change liquid-cooled server. It is used during the R&D phase of immersion phase change liquid-cooled servers to test the device's heat dissipation capacity, flow resistance and flow regime of liquids and gases, and information such as temperature, pressure, and liquid level fluctuations within the device. This ensures that the heat dissipation function of each component is good and the device operates normally during actual server operation. It is an essential part of the early-stage R&D of immersion servers.

[0069] The simulation device described in this application can employ different control methods to obtain relevant test conclusions based on testing requirements. For example, regarding the liquid level control method, the liquid level control within the simulation device should always maintain the heating element immersed in the cooling liquid to achieve phase change heat dissipation. If the heating element is not immersed in the liquid, the device will be damaged due to insufficient heat dissipation. Therefore, liquid level control is extremely important in this device. In the early stages of development, the heat output of the device is only a set of data, and the rate of liquid phase change vaporization cannot be calculated. Therefore, the liquid level data inside the device should be observed and recorded under the maximum heat output state of the device. The transparency of the cover should be used to observe whether the liquid level can completely "immerse" the heating element. If the liquid level is too low, adjustments need to be made by increasing the number of times the inlet valve is opened, increasing the inlet flow rate, or lowering the inlet temperature. If the liquid level is too high, the number of times the valve is opened can be reduced. Therefore, by combining the ARM valve opening and closing command signals with the feedback information from the liquid level gauge, this device can verify whether the internal liquid level can achieve a "static control" effect.

[0070] The second test primarily aims to achieve the "phase change" process. The main heat dissipation method of this device is the transformation of a low-temperature liquid into a high-temperature gas, thus carrying away heat. Therefore, a "liquid-to-gas" process must be implemented inside the device. If it were entirely liquid, it wouldn't be considered "immersion phase change heat dissipation" but rather "immersion heat dissipation." Since a "gas-liquid mixing" region exists during boiling, a flow resistance-based gas-liquid separation design should be implemented at the boiling point, and a gas-liquid separation design should be implemented at the gas outlet. However, the "gas-liquid mixing" region varies under different power levels, resulting in different effects from the corresponding gas-liquid separation components. Therefore, the power of the heating components needs to be adjusted to test the effectiveness of the gas-liquid separation components under different operating conditions. Because the heating area also affects the gas-liquid separation zone at the top of the overall device, it is also necessary to control the heating of different components and conduct zoned heating tests to observe the effect of the gas-liquid separation components. The experiment also considers that the distance of the heating point from the liquid surface also affects the gas-liquid separation. A dummy load device can be used to adjust the number of heating elements on the DCU board to simulate the effect of a decrease in the height of the heating point on the gas-liquid separation components.

[0071] The third test primarily utilizes sensors within the device. Pressure sensors are distributed in the meteorological zone to monitor and record the pressure within the blades. Temperature sensors are present in both the meteorological and liquid zones to record temperature data at corresponding locations. Analysis of the pressure data allows for adjustments to the outlet design, ensuring that the outlet resistance does not exceed a set value. Analysis of the temperature data recorded in the meteorological and liquid zones allows for adjustments to the overall CDM device's heat dissipation design, increasing or decreasing the inlet liquid temperature for better heat dissipation. All of this data can be tested over extended periods and recorded by the device's internal ARM processor, then transmitted to a screen for waveform analysis.

[0072] This application also provides a method of using the simulation device described in any of the above claims, such as... Figure 1 and Figure 2 As shown, the method of using the simulation device includes: powering the signal input / output board to the first dummy load, and adjusting the power supply voltage of the signal input / output board to make the first dummy load heat up and generate preset heat; cooling the first dummy load with coolant in the containment cavity, the coolant that has absorbed heat and vaporized in the containment cavity flows out of the containment cavity, and then flows back into the containment cavity after liquefaction; during the cooling of the first dummy load, the real-time liquid level of the coolant in the containment cavity is monitored by the control module of the functional integration board.

[0073] The simulation device described in this application simulates the internal heat dissipation of an immersion phase change liquid-cooled server. During the cooling of the first dummy load by the coolant, the control module of the functional integrated board monitors the real-time coolant level in the containment cavity to determine the heat dissipation capacity of the test device during the R&D phase of the immersion phase change liquid-cooled server. If the coolant level in the containment cavity consistently submerges the first dummy load, the immersion phase change liquid-cooled server under the current structure is deemed to have good heat dissipation performance and will not burn out the first dummy load. If the real-time coolant level in the containment cavity monitored by the functional integrated board is lower than a preset level, the immersion phase change liquid-cooled server under the current structure is deemed to have poor heat dissipation performance and may burn out the first dummy load.

[0074] In some embodiments, during the liquid-cooled first dummy load process, the control module issues a command to replenish coolant into the containment cavity so that the first dummy load can be completely immersed in the liquid, while leaving a gas phase region within the containment cavity to facilitate the containment of some gas. The method of using the simulation device of this application requires simultaneous "liquid inflow," "liquid outflow," and "gas outflow" during the liquid-cooled first dummy load process to simulate the internal heat dissipation of an immersion phase change liquid-cooled server.

[0075] In some embodiments, if the control module detects that the real-time coolant level in the containment cavity is lower than a preset level, the control module controls the alarm to sound an alarm and cuts off the power to stop operation; or, the coolant inlet is increased so that the first dummy load is completely submerged in the liquid. The real-time coolant level in the containment cavity is detected by a level sensor, and because the level sensor is electrically connected to the control module, the level sensor transmits the detected real-time data to the control module, facilitating the control module's detection and judgment of the coolant level in the containment cavity.

[0076] In some embodiments, during the cooling of the first dummy load, a first pressure sensor monitors the liquid pressure within the containment cavity and transmits the real-time liquid pressure data to the control module. A second pressure sensor detects the gas pressure within the containment cavity and transmits the real-time gas pressure data to the control module. If the control module detects that either the liquid pressure or gas pressure within the containment cavity exceeds a preset pressure value, the control module activates an alarm and cuts off the power. The first and second pressure sensors detect the liquid and gas pressures within the containment cavity, and both are electrically connected to the control module. The first and second pressure sensors transmit the detected real-time data to the control module, facilitating the control module's detection and judgment of the liquid and gas pressures within the containment cavity.

[0077] In some embodiments, during the cooling of the first dummy load, a first temperature sensor monitors the liquid temperature within the containment cavity and transmits the real-time liquid temperature data to the control module. A second temperature sensor detects the gas temperature within the containment cavity and transmits the real-time liquid temperature data to the control module. If the control module detects that either the liquid or gas temperature within the containment cavity exceeds a preset temperature value, the control module activates an alarm and cuts off the power. The first and second temperature sensors detect the liquid and gas temperatures within the containment cavity. Furthermore, the first and second temperature sensors are electrically connected to the control module, and they transmit the detected real-time data to the control module, facilitating the control module's detection and judgment of the liquid and gas temperatures within the containment cavity.

[0078] In some embodiments, the power of the second and third dummy loads on the motherboard is adjusted by a SCR voltage regulator module on the motherboard to generate a preset amount of heat. The SCR voltage regulator module is installed on the motherboard, its power supply is taken from the functional integrated board, and the control signal is controlled by the MCU on the functional integrated board.

[0079] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A simulation device, characterized in that, The simulation device includes: The blade housing has a cavity for containing coolant; A DCU board is disposed within the receiving cavity. The DCU board is provided with a first dummy load, which is used to simulate a device that generates heat in a server. A functional integration board is disposed within the receiving cavity, and the functional integration board includes a control module; A signal input / output board is at least partially disposed within the receiving cavity. The signal input / output board is used to supply power to the first dummy load so that the first dummy load heats up and generates a preset amount of heat. The coolant that is heated and vaporized in the receiving cavity can flow out of the receiving cavity and then flow back into the receiving cavity after liquefaction. The control module is used to monitor the real-time liquid level of the coolant in the receiving cavity.

2. The simulation device according to claim 1, characterized in that, The simulation device includes a motherboard disposed within the receiving cavity. The DCU board and the functional integration board are both electrically connected to the motherboard. The motherboard is provided with a second dummy load and a third dummy load. The second dummy load is used to simulate the central processing unit of the server, and the third dummy load is used to simulate the power supply of the server.

3. The simulation device according to claim 2, characterized in that, It also includes a front panel disposed outside the blade housing, the front panel being electrically connected to the functional integration board; The motherboard is equipped with a thyristor voltage regulator module. The second dummy load, the third dummy load, and the thyristor voltage regulator module on the front panel provide high-voltage AC power. The high-voltage AC power supply of the second dummy load and the third dummy load is controlled by the thyristor voltage regulator module to adjust the power of the second dummy load and the third dummy load.

4. The simulation device according to claim 2, characterized in that, The motherboard is provided in multiple ways, and each motherboard is provided with multiple DCU boards, and each DCU board is provided with multiple first dummy loads.

5. The simulation device according to claim 4, characterized in that, The DCU board is provided with four first dummy loads. The four first dummy loads on each DCU board are connected in series in pairs to form a load component, and the two load components are connected in parallel.

6. The simulation device according to claim 1, characterized in that, The functional integration board includes a sensor module, which includes a liquid level sensor for measuring the liquid level of the coolant within the accommodating cavity; and / or, The functional integration board includes a sensor module, which includes a first pressure sensor and a second pressure sensor. The first pressure sensor is used to detect the liquid pressure inside the receiving cavity, and the second pressure sensor is used to detect the gas pressure inside the receiving cavity; and / or... The functional integration board includes a sensor module, which includes a first temperature sensor and a second temperature sensor. The first temperature sensor is used to detect the liquid temperature in the containment cavity, and the second temperature sensor is used to detect the gas temperature in the containment cavity.

7. The simulation device according to claim 1, characterized in that, It also includes a front panel disposed outside the blade housing, the front panel being electrically connected to the functional integration board, and the front panel being provided with buttons, a screen communication output interface, a high-voltage AC power supply interface, and a reset button.

8. The simulation device according to claim 1, characterized in that, The first dummy load includes a heating element and a heat sink connected together. The heating element includes a resistor and is used to carry a large instantaneous current. The heat sink is used to conduct the heat generated by the heating element.

9. The simulation device according to claim 1, characterized in that, The blade housing is provided with a liquid inlet pipe and a liquid outlet pipe. The simulation device also includes a liquid inlet valve provided on the liquid inlet pipe and a liquid outlet valve provided on the liquid outlet pipe. Both the liquid inlet valve and the liquid outlet valve are electrically connected to the control module.

10. A method of using the simulation device according to any one of claims 1-9, characterized in that, The method of using the simulation device includes: The signal input / output board supplies power to the first dummy load, and the power supply voltage of the signal input / output board is adjusted to make the first dummy load heat up and generate a preset amount of heat. The first dummy load is cooled by the coolant in the containment cavity. The coolant, after absorbing heat and vaporizing in the containment cavity, flows out of the containment cavity and then flows back into the containment cavity after liquefaction. During the cooling of the first dummy load, the real-time liquid level of the coolant in the containment cavity is monitored by the control module of the functional integration board.

11. The method of using the simulation device according to claim 10, characterized in that, During the liquid cooling of the first dummy load, the control module issues a command to replenish the coolant into the containment cavity so that the first dummy load can be completely submerged in the liquid, and a gas phase region is left in the containment cavity to facilitate the containment of some gas.

12. The method of using the simulation device according to claim 10, characterized in that, If the control module detects that the real-time coolant level in the containment cavity is less than a preset level value: The control module controls the alarm device to sound an alarm and cuts off the power to stop operation; or, Increase the liquid inflow rate so that the first dummy load can be completely submerged in the liquid.

13. The method of using the simulation device according to claim 10, characterized in that, During the cooling of the first dummy load, the first pressure sensor monitors the liquid pressure in the containment cavity and transmits the real-time liquid pressure data to the control module, and the second pressure sensor detects the gas pressure in the containment cavity and transmits the real-time gas pressure data to the control module. If the control module detects that the liquid pressure or gas pressure in the containment cavity is greater than a preset pressure value, the control module will activate the alarm and cut off the power.

14. The method of using the simulation device according to claim 10, characterized in that, During the cooling of the first dummy load, the first temperature sensor monitors the liquid temperature in the containment cavity and transmits the real-time liquid temperature data to the control module, and the second temperature sensor detects the gas temperature in the containment cavity and transmits the real-time gas temperature data to the control module. If the control module detects that the liquid temperature or gas temperature in the containment cavity is greater than the preset temperature value, the control module will activate the alarm and cut off the power.

15. The method of using the simulation device according to claim 10, characterized in that, The power of the second and third dummy loads on the motherboard is controlled by the thyristor voltage regulation module on the motherboard, so that the second and third dummy loads generate preset heat.

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