Three-dimensional reconstruction system and method thereof
By using designated memory for data interaction during the measurement process, the problem of low workpiece measurement efficiency in existing technologies is solved, achieving efficient measurement without data import/export operations and improving the quality and accuracy of measurement data.
Patent Information
- Application Number
- CN202511367365.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-23
- Publication Date
- 2026-02-10
AI Technical Summary
In existing technologies, measuring workpieces is inefficient because it requires repeated data import, format conversion, and data export operations.
A 3D reconstruction system is provided that directly acquires and stores dynamic 3D reconstruction models by using designated memory for data interaction during the measurement process, avoiding data import and export operations.
It improves the efficiency and convenience of measuring workpieces, reduces cumbersome operations, and improves the quality and accuracy of measurement data.
Smart Images
Figure CN121505142A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of 3D scanning, and more particularly to 3D reconstruction systems and methods. Background Technology
[0002] With the full digitalization of product research and development and manufacturing processes, measurements are required during or after manufacturing to verify whether the workpiece conforms to design specifications. First, a dynamic 3D reconstructed model of the workpiece is acquired using scanning software. This model is then exported from the scanning software and imported into measurement software. The measurement software fits and aligns the dynamic 3D reconstructed model with the theoretical model to demonstrate whether the workpiece conforms to design specifications through measurement data. For example, if the measurement data shows that the dimensions of a hole in the workpiece conform to the design specifications, it can be determined that the workpiece meets the factory standards.
[0003] In some related technologies, to improve measurement accuracy, a dynamic 3D reconstruction model is acquired multiple times and measurements are performed repeatedly until the measurement data can accurately reflect the quality of the workpiece being measured. During this process, operators need to repeatedly import, convert formats, and export data, thus affecting the efficiency of workpiece measurement. Based on this, embodiments of this application provide a 3D reconstruction system and method to improve related technologies. Summary of the Invention
[0004] The purpose of this application is to provide a three-dimensional reconstruction system and method that effectively improves the efficiency of measuring workpieces.
[0005] The objective of this application is achieved through the following technical solution: In a first aspect, embodiments of this application provide a three-dimensional reconstruction system, the three-dimensional reconstruction system comprising: a three-dimensional reconstruction module, configured to perform three-dimensional reconstruction processing on the received three-dimensional point cloud data of the workpiece under test, and then place the obtained dynamic three-dimensional reconstruction model of the workpiece under test into a designated memory; and a measurement module, configured to retrieve the dynamic three-dimensional reconstruction model from the designated memory, and write the measurement data generated by performing measurement operations based on the dynamic three-dimensional reconstruction model into the designated memory corresponding to the dynamic three-dimensional reconstruction model.
[0006] In some embodiments, the three-dimensional reconstruction module is further configured to perform three-dimensional reconstruction processing again based on the measurement data obtained from the designated memory and the three-dimensional point cloud data of the workpiece being measured that has been re-received, and then put the new dynamic three-dimensional reconstruction model of the workpiece being measured into the designated memory. The measurement module is also used to obtain the new dynamic three-dimensional reconstruction model from the designated memory, and to perform measurement operations based on the new dynamic three-dimensional reconstruction model to generate new measurement data.
[0007] In some embodiments, the 3D reconstruction system further includes: a data interaction module for providing the designated memory to the 3D reconstruction module and the measurement module; and a data integration and processing module for providing algorithm support to the 3D reconstruction module, the measurement module, and the data interaction module to perform corresponding operations.
[0008] In some embodiments, the 3D reconstruction module is used to perform 3D reconstruction processing according to the reconstruction algorithm provided by the data integration and processing module; the measurement module is used to perform measurement operations according to the measurement algorithm provided by the data integration and processing module; the data interaction module is further used to iteratively process the measurement data generated by the previous measurement operation with the new measurement data according to the data fusion algorithm provided by the data integration and processing module.
[0009] Secondly, embodiments of this application provide a three-dimensional reconstruction method, the three-dimensional reconstruction method comprising: performing three-dimensional reconstruction processing on the received three-dimensional point cloud data of the workpiece under test, and placing the obtained dynamic three-dimensional model of the workpiece under test into a designated memory; retrieving the dynamic three-dimensional reconstruction model from the designated memory, and writing the measurement data generated by performing measurement operations based on the dynamic three-dimensional reconstruction model into the designated memory corresponding to the dynamic three-dimensional reconstruction model.
[0010] In some embodiments, the step of performing three-dimensional reconstruction processing based on the received three-dimensional point cloud data of the workpiece under test includes: receiving three-dimensional point cloud data collected by a scanning device continuously scanning the workpiece under test, and obtaining corresponding pose data; performing three-dimensional reconstruction processing based on the three-dimensional point cloud data and the corresponding pose data to obtain the dynamic three-dimensional reconstruction model.
[0011] In some embodiments, the step of performing a measurement operation based on the dynamic three-dimensional reconstruction model to generate the measurement data includes: fitting and aligning the dynamic three-dimensional reconstruction model and the theoretical model in a specified coordinate system to obtain a model alignment result; generating the measurement data based on the model alignment result; the measurement data includes the measured feature of the workpiece and at least one of the corresponding position, size, and geometric tolerance of the measured feature.
[0012] In some embodiments, the method further includes: Based on the re-received 3D point cloud data of the workpiece under test and the measurement data obtained from the designated memory, 3D reconstruction processing is performed again. The new dynamic three-dimensional reconstruction model of the workpiece obtained after the third-dimensional reconstruction process is placed into the designated memory; The new dynamic 3D reconstruction model is retrieved from the designated memory, and the new measurement data generated by performing measurement operations based on the new dynamic 3D reconstruction model is written into the designated memory corresponding to the new dynamic 3D reconstruction model. Furthermore, the measurement data generated in the previous measurement operation is iteratively processed based on the new measurement data.
[0013] In some embodiments, the feature to be measured includes at least one of a circle, a hole, a column, a shaft, and a groove; The fitting alignment method between the dynamic 3D reconstruction model and the theoretical model includes any one of the following: best fit alignment method, feature alignment method, and three-point alignment method.
[0014] Thirdly, one embodiment of this application also provides an electronic device, the electronic device including a memory and a processor, the memory storing at least one computer program, the at least one computer program being loaded and executed by the processor to implement the three-dimensional reconstruction method as described above.
[0015] Fourthly, one embodiment of this application also provides a computer-readable storage medium storing at least one computer program that, when executed by a processor, can implement the aforementioned three-dimensional reconstruction method.
[0016] Fifthly, one embodiment of this application also provides a computer program product for implementing the three-dimensional reconstruction method as described above.
[0017] This application provides a three-dimensional reconstruction system and method. By providing a designated memory for data interaction between the three-dimensional reconstruction module and the scanning module, the system eliminates the need for data import and export operations during the measurement of the workpiece, effectively improving measurement efficiency. Attached Figure Description
[0018] This application will be further described below with reference to the accompanying drawings and specific embodiments.
[0019] Figure 1 This is a scene diagram illustrating a three-dimensional reconstruction process provided in an embodiment of this application.
[0020] Figure 2 This is a schematic diagram of the structure of a three-dimensional reconstruction system provided in an embodiment of this application.
[0021] Figure 3 This is a flowchart illustrating a three-dimensional reconstruction method provided in an embodiment of this application.
[0022] Figure 4This is a structural block diagram of a controller provided in an embodiment of this application. Detailed Implementation
[0023] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0024] In the description of the embodiments of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0025] With the full digitalization of product research and development and manufacturing processes, measurements are required during or after manufacturing to verify whether the workpiece conforms to the design specifications.
[0026] See Figure 1 , Figure 1 This is a schematic diagram of a measurement process provided in an embodiment of this application.
[0027] like Figure 1 As shown, the measurement scenario may include an operator 100, scanning software 101, and measurement software 102. In this scenario, the operator 100 first scans the workpiece under test using the scanning software 101, which generates scan data. The scan data may, for example, be a dynamic 3D reconstructed model of the workpiece. Then, the operator 100 manually exports the generated scan data from the scanning software 101 and imports it into the measurement software 102. Finally, the operator 100 uses the measurement software 102, which performs measurement operations based on the scan data to generate measurement data.
[0028] During this process, when operator 100 initially scans the workpiece, the resulting dynamic 3D reconstruction model may have missing features or incomplete scanning. Therefore, in some practical applications, operator 100 will scan the workpiece multiple times to gradually refine the dynamic 3D reconstruction model and further improve the generated measurement data.
[0029] It is understandable that every time operator 100 obtains measurement data, they need to perform the operation of exporting the data from scanning software 101 and then importing it into measurement software 102. Consequently, in the process of gradually improving the generated measurement data, this tedious data export, format conversion, and data import operation will be repeated, affecting the efficiency of measuring the workpiece.
[0030] Therefore, the embodiments of this application provide a designated memory for data interaction during the measurement process, and put the dynamically reconstructed three-dimensional model obtained each time into the designated memory, so as to realize the direct acquisition of the dynamically reconstructed three-dimensional model through the designated memory when performing measurement operations, thereby improving the efficiency of measuring workpieces.
[0031] See Figure 2 , Figure 2 This application provides a 3D reconstruction system, which includes a 3D reconstruction module and a measurement module. The 3D reconstruction module performs 3D reconstruction processing on received 3D point cloud data of a workpiece under test, and then places the resulting dynamic 3D reconstruction model of the workpiece into a designated memory. The measurement module retrieves the dynamic 3D reconstruction model from the designated memory and writes measurement data generated by performing measurement operations based on the dynamic 3D reconstruction model into the designated memory, corresponding to the 3D reconstruction model.
[0032] In some embodiments, the 3D reconstruction system can be deployed in an electronic device, such as a personal computer (PC). The 3D reconstruction module can receive 3D point cloud data of the workpiece under test via a scanning device wirelessly connected to the electronic device. The scanning device can be a device used to perform 3D scanning of the workpiece under test and acquire its 3D point cloud data. Examples of scanning devices include handheld 3D scanners and tracking 3D scanners. It is understood that an operator can scan all areas of the workpiece under test using the scanning device, allowing the scanning device to send the acquired 3D point cloud data to the electronic device. Then, the 3D reconstruction module in the electronic device can perform 3D reconstruction processing based on the received 3D point cloud data to obtain a dynamic 3D reconstruction model.
[0033] Afterwards, the 3D reconstruction module can put the dynamic 3D reconstruction model into the designated memory, so that when performing subsequent measurement operations, the measurement module can directly read the dynamic 3D reconstruction model from the designated memory without the need for operators to manually import and export data. This not only improves the efficiency of measurement, but also enhances the convenience of performing measurement operations.
[0034] Furthermore, after the dynamic 3D reconstruction model is placed into the designated memory, measurement operations can be automatically triggered. The measurement module can read the dynamic 3D reconstruction model from the designated memory, perform measurement operations based on the dynamic 3D reconstruction model, and write the resulting measurement data into the designated memory. This measurement data can reveal defects such as manufacturing errors, deformation, and wear on the workpiece. Subsequently, operators can determine whether the workpiece passes inspection based on the measurement data.
[0035] Thus, by providing a designated memory for data interaction during the measurement process, this application effectively improves measurement efficiency by eliminating the need for data import and export operations during the measurement of the workpiece.
[0036] In cases where multiple measurements are performed on the workpiece under test, to improve the efficiency of the measurement, in some embodiments, the 3D reconstruction module can also be used to perform 3D reconstruction processing again based on the measurement data obtained from the designated memory and the re-received 3D point cloud data of the workpiece under test, and then put the resulting new dynamic 3D reconstruction model of the workpiece under test into the designated memory. The measurement module can also be used to obtain the new dynamic 3D reconstruction model from the designated memory and perform measurement operations based on the new dynamic 3D reconstruction model to generate new measurement data.
[0037] In some embodiments, the dynamic 3D reconstruction model initially obtained by the 3D reconstruction module may inevitably have issues such as missing features or incomplete scanning. Therefore, to improve measurement accuracy and reduce the impact of the dynamic 3D model on the measurement data, a new dynamic 3D reconstruction model can be repeatedly obtained, and the measurement module can then perform measurement operations multiple times to generate new measurement data.
[0038] Specifically, during the process of obtaining the dynamic 3D reconstruction model for the first time, the 3D reconstruction module can retrieve the measurement data generated by the previous measurement module from a designated memory, and perform 3D reconstruction processing based on this previous measurement data to obtain a new dynamic 3D reconstruction model. It can be understood that the new dynamic 3D reconstruction model can have higher quality than the previously obtained dynamic 3D reconstruction model, for example, it has more features. The 3D reconstruction module then places the new dynamic 3D reconstruction model into the designated memory.
[0039] Furthermore, the measurement module can read the new dynamic 3D model from the designated memory, perform the measurement operation again, and generate new measurement data. It can be understood that the generated new measurement data has higher quality than the previously generated measurement data, and the measurement results can better reflect the quality of the measured workpiece.
[0040] It is understandable that the measurement can be terminated when the operator determines that the measurement results represented by the newly generated measurement data meet expectations. If the operator determines that the measurement results represented by the newly generated measurement data do not meet expectations, the 3D reconstruction system can repeat the above steps until the obtained measurement data meets expectations.
[0041] In contrast to situations where data import and export operations need to be repeatedly performed, this embodiment of the application can achieve fast data retrieval based on the data interaction function provided by the specified memory, effectively improving the efficiency of measurement.
[0042] Furthermore, in some embodiments, while the measurement module is performing measurement operations and generating measurement data, the 3D reconstruction module can simultaneously perform 3D reconstruction processing to obtain a dynamic 3D reconstruction model. This allows for timely iterative processing of the previous measurement data, further improving measurement efficiency.
[0043] In some embodiments, performing 3D reconstruction processing based on measurement data and 3D point cloud data can be manifested in the following way: During the 3D reconstruction process, a positional reference is created for all the features to be measured based on their positions in the measurement data. This allows for iterative processing of the previous measurement data based on this positional reference when further measurement operations are performed according to the dynamic 3D reconstruction model. In this way, iterative processing of the previously generated measurement data using new second measurement data based on the positional reference effectively improves measurement accuracy.
[0044] In some embodiments, the 3D reconstruction system further includes: a data interaction module for providing the designated memory to the 3D reconstruction module and the measurement module; and a data integration and processing module for providing algorithmic support to the 3D reconstruction model, the measurement module, and the data interaction module to perform corresponding operations.
[0045] In some embodiments, in the three-dimensional reconstruction system of this application, the three-dimensional reconstruction module, the data interaction module, and the data integration and processing module are communicatively connected, and the measurement module, the data interaction module, and the data integration and processing module are also communicatively connected.
[0046] Based on this, the data interaction module can be a module that provides data interaction functions to the 3D reconstruction module and the measurement module. In some embodiments, the data interaction module can be a designated memory, whereby the 3D reconstruction module can store a dynamic 3D reconstruction model in the data interaction module and can read measurement data from the data interaction module; and the measurement data can be read from the dynamic 3D reconstruction model in the data interaction module and stored in the data interaction module. In other embodiments, the data interaction module can also be a transmission module between the 3D reconstruction module (or measurement module) and the designated memory, whereby the 3D reconstruction module can send the dynamic 3D reconstruction model to the data interaction module, the data interaction module can store the dynamic 3D reconstruction model in the designated memory, and the data interaction module can read measurement data from the designated memory and then send it to the 3D reconstruction module.
[0047] In addition, for example, the data integration and processing module can provide corresponding algorithms to the 3D reconstruction module to support the 3D reconstruction module in performing 3D reconstruction processing based on 3D point cloud data to obtain a dynamic 3D reconstruction model.
[0048] In some embodiments, the 3D reconstruction module is used to perform 3D reconstruction processing according to the reconstruction algorithm provided by the data integration and processing module; the measurement module is used to perform measurement operations according to the measurement algorithm provided by the data integration and processing module; the data interaction module is further used to iteratively process the measurement data generated by the previous measurement operation with the new measurement data according to the data fusion algorithm provided by the data integration and processing module.
[0049] In some embodiments, the reconstruction algorithm can refer to an algorithm that supports the 3D reconstruction module in performing 3D reconstruction processing to obtain a dynamic 3D reconstruction model. The measurement algorithm can refer to an algorithm that supports the measurement module in performing measurement operations based on the dynamic 3D reconstruction model to generate measurement data. In the above embodiments, new measurement data iterates over the previously generated measurement data. To this end, the data integration and processing module can also provide a data fusion algorithm, which the data interaction module uses to iteratively process the new measurement data over the previously generated measurement data.
[0050] See Figure 3 , Figure 3 This application provides a three-dimensional reconstruction method, which may include the following steps.
[0051] S101: Based on the received three-dimensional point cloud data of the workpiece under test, perform three-dimensional reconstruction processing, and then put the obtained dynamic three-dimensional model of the workpiece under test into the designated memory.
[0052] S102: Obtain the dynamic 3D reconstruction model from the designated memory, and write the measurement data generated by performing measurement operations based on the dynamic 3D reconstruction model into the designated memory.
[0053] In the embodiments of this application, by providing a designated memory for data interaction during the measurement process, the measurement efficiency is effectively improved by eliminating the need for data import and export operations during the measurement of the workpiece.
[0054] In some embodiments, the step of performing three-dimensional reconstruction processing based on the received three-dimensional point cloud data of the workpiece under test may include: receiving three-dimensional point cloud data collected by a scanning device continuously scanning the workpiece under test, and obtaining corresponding pose data; performing three-dimensional reconstruction processing based on the three-dimensional point cloud data and the corresponding pose data to obtain the dynamic three-dimensional reconstruction model.
[0055] In some embodiments, the step of performing a measurement operation based on the dynamic three-dimensional reconstruction model to generate the measurement data may include: fitting and aligning the dynamic three-dimensional reconstruction model and the theoretical model in a specified coordinate system to obtain a model alignment result; generating the measurement data based on the model alignment result; the measurement data may include the measured feature of the workpiece and at least one of the corresponding position, size, and geometric tolerance of the measured feature.
[0056] In some embodiments, the specified coordinate system may be an initially created world coordinate system or a coordinate system created based on the measured features of the workpiece.
[0057] In some embodiments, fitting and aligning the dynamic 3D reconstruction model and the theoretical model aims to quickly and accurately detect defects such as manufacturing errors, deformation, and wear of the workpiece by comparing the digital model (3D reconstruction model) of the actually produced workpiece with the original design drawings (theoretical model / CAD model).
[0058] In some embodiments, the fitting alignment process may include, for example, the electronic device aligning the positions and orientations of the two models in space, and determining the corresponding transformation matrix based on preset corresponding feature points (e.g., center point, corner point, special position point) to minimize the overall distance deviation between the two models and complete the fitting alignment.
[0059] Once aligned, the electronic device can calculate the normal distance from each point on the dynamic 3D reconstructed model to the surface of the theoretical model, displaying these deviation values as a visual color chromatogram. This displayed color "deviation chromatogram" intuitively shows where the measured workpiece exceeds the tolerance range; for example, red can represent positive deviations and blue can represent negative deviations. Furthermore, a detailed measurement report can be generated based on the color chromatogram, including dimensions, tolerances, cross-sectional analysis, geometric dimensions, and form and position tolerance analysis.
[0060] In response, based on the areas with larger deviations in the deviation chromatogram, operators can focus on scanning these areas during the next scan to improve the accuracy of the test results.
[0061] In some embodiments, the method may further include: performing three-dimensional reconstruction processing again based on the re-received three-dimensional point cloud data of the workpiece under test and the measurement data obtained from the designated memory; placing the new dynamic three-dimensional reconstruction model of the workpiece under test obtained after the second three-dimensional reconstruction processing into the designated memory; obtaining the new dynamic three-dimensional reconstruction model from the designated memory, and writing the new measurement data generated by performing a measurement operation based on the new dynamic three-dimensional reconstruction model into the designated memory, corresponding to the new dynamic three-dimensional reconstruction model; and iteratively processing the measurement data generated by the previous measurement operation based on the new measurement data.
[0062] In some embodiments, the feature to be measured includes at least one of a circle, hole, cylinder, shaft, and groove. The fitting alignment method between the dynamic 3D reconstruction model and the theoretical model includes any one of the best-fit alignment method, feature alignment method, and three-point alignment method.
[0063] One embodiment of this application also provides an electronic device, the electronic device including a memory and a processor, the memory storing at least one computer program, the at least one computer program being loaded and executed by the processor to implement the three-dimensional reconstruction method as described above.
[0064] One embodiment of this application also provides a computer-readable storage medium storing at least one computer program that, when executed by a processor, can implement the aforementioned three-dimensional reconstruction method.
[0065] One embodiment of this application also provides a computer program product for implementing the three-dimensional reconstruction method as described above.
[0066] See Figure 4 , Figure 4 This is a structural block diagram of a controller provided in an embodiment of this application.
[0067] This application also provides a controller, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the control method for the DC-DC converter provided in the above embodiments.
[0068] The controller may include a memory 110, a processor 120, and a communication interface 130. The memory 110, the processor 120, and the communication interface 130 are connected through internal connection paths.
[0069] The memory 110 is used to store computer programs, which in some implementations may include code for implementing the methods of the embodiments of this application.
[0070] The processor 120 executes the computer program stored in the memory 110 to control the communication interface 130 to receive input data and information, and output operation results and other data. In some implementations, when the solutions of the embodiments of this application are implemented by software or firmware, the computer program used to implement the solutions of the embodiments of this application can be stored in the processor 120 and executed by the processor 120.
[0071] The memory 110 may be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. The non-volatile memory may be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory may be random access memory (RAM). It should be noted that the memory 110 described herein is intended to include, but is not limited to, any memory of these and other suitable types. As an example, the memory 110 includes random access memory (RAM), cache memory, and read-only memory (ROM). The memory 110 stores a computer program that can be executed by processor 120, causing processor 120 to implement the steps of any of the methods described above.
[0072] The processor 120 can be a central processing unit (CPU), or it can be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor, or the processor 120 can be any conventional processor.
[0073] In implementation, each step of the above method can be completed by the integrated logic circuitry of the hardware in the processor 120 or by instructions in software form. The method disclosed in the embodiments of this application can be directly implemented by the hardware processor, or by a combination of hardware and software modules in the processor 120. The software modules can be located in mature storage media in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, or registers. This storage medium is located in the memory 110, and the processor 120 reads the information in the memory 110 and, in conjunction with its hardware, completes the steps of the above method. To avoid repetition, detailed descriptions are not provided here.
[0074] In some implementations, in addition to the hardware units described above, the controller may also include software modules, such as an operating system, a Basic Input Output System (BIOS), and application software.
[0075] An operating system is used to manage one or more of the hardware and software resources of a controller; it is the kernel and foundation of the controller. The operating system handles fundamental tasks such as managing and configuring memory, determining the priority of system resource allocation and demand, controlling input and output devices, operating the network, and managing the file system. To facilitate user operation, most operating systems provide a user interface for interaction with the system.
[0076] The BIOS is used to perform hardware initialization during the power-on boot phase and to provide runtime services for the operating system and applications. In some implementations, the BIOS can also monitor and display processor temperature and execute temperature protection strategies.
[0077] Application software, also known as an application program, can be understood as software written for a specific user application purpose, and is one of the main categories of computer software. For example, application software can be a program used to achieve purposes such as power control and temperature management.
[0078] It is understood that the specific examples in this application are only intended to help those skilled in the art better understand the implementation of this application, and are not intended to limit the scope of protection of this application.
[0079] It is understood that in the various embodiments of this application, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of this application.
[0080] It is understood that the various implementation methods described in this application can be implemented individually or in combination, and this application does not limit them.
[0081] Unless otherwise stated, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The term "one or more" as used in this application includes any and all combinations of one or more of the associated listed items. The singular forms "a," "the," and "the" as used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.
[0082] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0083] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes and beneficial effects of the embodiments described above can be referred to the corresponding processes and beneficial effects in other embodiments, and will not be repeated here.
[0084] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.
[0085] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of the technical solution in this application, depending on actual needs.
[0086] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.
[0087] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, essentially, or the part that contributes to the prior art, or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0088] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A three-dimensional reconstruction system, characterized in that, The three-dimensional reconstruction system includes: The 3D reconstruction module is used to perform 3D reconstruction processing on the received 3D point cloud data of the workpiece under test, and then put the obtained dynamic 3D reconstruction model of the workpiece under test into a specified memory. The measurement module is used to retrieve the dynamic 3D reconstruction model from the designated memory and write the measurement data generated by performing measurement operations based on the dynamic 3D reconstruction model into the designated memory.
2. The three-dimensional reconstruction system according to claim 1, characterized in that, The three-dimensional reconstruction module is further configured to perform three-dimensional reconstruction processing again based on the measurement data obtained from the designated memory and the three-dimensional point cloud data of the workpiece being measured that has been received again, and then put the new dynamic three-dimensional reconstruction model of the workpiece being measured into the designated memory. The measurement module is also used to obtain the new dynamic three-dimensional reconstruction model from the designated memory, and to perform measurement operations based on the new dynamic three-dimensional reconstruction model to generate new measurement data.
3. The three-dimensional reconstruction system according to claim 2, characterized in that, The three-dimensional reconstruction system also includes: The data interaction module is used to provide the specified memory to the 3D reconstruction module and the measurement module; The data processing module provides algorithmic support to the 3D reconstruction module, the measurement module, and the data interaction module to perform corresponding operations.
4. The three-dimensional reconstruction system according to claim 3, characterized in that, The 3D reconstruction module is used to perform 3D reconstruction processing according to the reconstruction algorithm provided by the data integration and processing module; the measurement module is used to perform measurement operations according to the measurement algorithm provided by the data integration and processing module; the data interaction module is also used to iteratively process the measurement data generated by the previous measurement operation with the new measurement data according to the data fusion algorithm provided by the data integration and processing module.
5. A three-dimensional reconstruction method, characterized in that, The three-dimensional reconstruction method includes: Based on the received 3D point cloud data of the workpiece under test, after performing 3D reconstruction processing, the resulting dynamic 3D reconstruction model of the workpiece under test is placed into the designated memory. The dynamic 3D reconstruction model is retrieved from the designated memory, and the measurement data generated by performing measurement operations based on the dynamic 3D reconstruction model is written into the designated memory corresponding to the dynamic 3D reconstruction model.
6. The method according to claim 5, characterized in that, The steps for performing 3D reconstruction based on the received 3D point cloud data of the workpiece include: It receives the three-dimensional point cloud data collected by the scanning device continuously scanning the workpiece under test, and obtains the corresponding pose data; Based on the three-dimensional point cloud data and the corresponding pose data, three-dimensional reconstruction processing is performed to obtain the dynamic three-dimensional reconstruction model.
7. The method according to claim 5, characterized in that, The steps of performing measurement operations based on the dynamic 3D reconstruction model and generating the measurement data include: The dynamic 3D reconstruction model and the theoretical model are fitted and aligned in a specified coordinate system to obtain the model alignment result. The measurement data is generated based on the model alignment result; the measurement data includes the measured feature of the workpiece and at least one of the corresponding position, size and geometric tolerance of the measured feature.
8. The method according to claim 5, characterized in that, The method further includes: Based on the re-received 3D point cloud data of the workpiece under test and the measurement data obtained from the designated memory, 3D reconstruction processing is performed again. The new dynamic three-dimensional reconstruction model of the workpiece obtained after the third-dimensional reconstruction process is placed into the designated memory; The new dynamic 3D reconstruction model is retrieved from the designated memory, and the new measurement data generated by performing measurement operations based on the new dynamic 3D reconstruction model is written into the designated memory corresponding to the new dynamic 3D reconstruction model. Furthermore, the measurement data generated in the previous measurement operation is iteratively processed based on the new measurement data.
9. The method according to claim 7, characterized in that, The feature to be measured includes at least one of the following: circle, hole, column, shaft, and groove; The fitting alignment method between the dynamic 3D reconstruction model and the theoretical model includes any one of the following: best fit alignment method, feature alignment method, and three-point alignment method.
10. An electronic device, characterized in that, The electronic device includes a memory and a processor. The memory stores at least one computer program, which is loaded and executed by the processor to implement the three-dimensional reconstruction method as described in any one of claims 5 to 9.
11. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the three-dimensional reconstruction method as described in any one of claims 5 to 9.
12. A computer program product, characterized in that, The computer program product is used to implement the three-dimensional reconstruction method as described in any one of claims 5 to 9.