Easily detachable tile radio frequency front-end architecture and assembly method

Abstract

The invention discloses an easy-to-disassemble tile radio frequency front-end framework and an assembly method. The framework comprises an advanced packaging module, a BGA solder ball, a sandwich type comprehensive feed network assembly, an antenna mounting plate fuzz button, an antenna mounting plate and an antenna. According to the sandwich type feed network assembly, a feed network daughter board and a feed network mother board are elastically connected through a supporting metal body and a double-sided elastic needle fuzz button, and radio frequency, power supply and digital control signal transmission is supported. The antenna mounting plate is in butt joint with a bonding pad at the bottom of the feed network mother board through fuzz buttons and is fastened through screws to achieve rapid disassembly and assembly. According to the method, assembly of a feed network mother board and a supporting metal body, installation of a double-sided elastic needle fuzz button, welding and testing of an advanced packaging module and a daughter board and overall fastening of the daughter board and the supporting metal body are completed step by step, and efficient assembly and quality control are achieved. Through elastic interconnection and architecture design, the maintainability, the assembly efficiency and the signal transmission reliability of the radio frequency front end are remarkably improved, and the radio frequency front end is suitable for a high-density integrated phased array system.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of radio frequency communication, and particularly relates to an easily detachable tile radio frequency front end architecture and a matching sandwich type comprehensive feed network assembly method. BACKGROUND

[0002] Based on the development of advanced packaging technology, traditional discrete devices and multi-chip devices can realize three-dimensional stacking through system-in-package to greatly reduce the device size, but high-density integration also increases the replacement cost and improves the assembly complexity, which brings great challenges to the application of tile radio frequency front end.

[0003] At present, the mainstream tile radio frequency front end mainly adopts a sandwich architecture composed of an antenna, a comprehensive feed network and a microwave component, and the connection of the microwave component and the antenna signal and the signal conversion in and out are realized through the feed network. The complex function of the comprehensive feed network leads to great difficulty in the process of multi-layer mixed wiring board and high difficulty in internal wiring design. The conventional whole board design will further cause difficulty in replacing the tile component. Therefore, optimizing the architecture of the comprehensive feed network, reducing the process complexity of the comprehensive feed network and improving the testability and maintainability have become urgent problems to be solved. SUMMARY

[0004] The application aims to provide an easily detachable tile radio frequency front end architecture and an assembly method, which are used for improving the maintainability and reliability of the tile radio frequency front end architecture.

[0005] In order to achieve the object of the application, in one aspect, the application provides an easily detachable tile radio frequency front end architecture, which comprises an advanced packaging module, a BGA solder ball, a sandwich type comprehensive feed network component, an antenna mounting plate screw, an antenna mounting plate and an antenna.

[0006] The BGA solder ball is arranged below the advanced packaging module and is used for realizing the function of the radio frequency architecture.

[0007] The BGA solder ball is arranged at the bottom of the advanced packaging module and is used for signal interconnection between the advanced packaging module and the sandwich type comprehensive feed network component.

[0008] The bottom of the sandwich type comprehensive feed network component is connected with the antenna mounting plate screw.

[0009] The antenna mounting plate screw is embedded in the top of the antenna mounting plate and is used for signal interconnection between the antenna mounting plate and the sandwich type comprehensive feed network component.

[0010] The antenna mounting plate is located below the sandwich type comprehensive feed network component and is used for realizing antenna mounting.

[0011] The antenna is mounted on the antenna mounting plate for realizing the system antenna function.

[0012] The antenna mounting plate screw is located inside the antenna mounting plate and the sandwich type integrated feed network assembly for fastening of both.

[0013] The sandwich type integrated feed network assembly includes a feed network daughter board screw, a feed network daughter board, a feed network daughter board lower pad, a support metal body daughter board threaded hole, a support metal body, a double-sided spring needle hair button, a support metal body mother board threaded hole, a support metal body antenna threaded hole, a feed network mother board top pad, a feed network mother board, a feed network mother board screw, a feed network mother board bottom pad, a feed network mother board through hole.

[0014] The feed network daughter board screw is located inside the feed network daughter board and the support metal body for fastening of both.

[0015] The feed network daughter board is located below the advanced packaging module for feeding and signal input and output of the advanced packaging module.

[0016] The feed network daughter board lower pad is located at the bottom of the feed network daughter board for signal interconnection at the bottom of the feed network daughter board.

[0017] The support metal body daughter board threaded hole is a support metal body top threaded hole for screw fastening of the feed network daughter board.

[0018] The double-sided spring needle hair button is arranged inside the support metal body for signal connection of the feed network daughter board and the feed network mother board.

[0019] The double-sided spring needle hair button is embedded in the support metal body for signal interconnection between the feed network daughter board and the feed network mother board.

[0020] The support metal body mother board threaded hole is a support metal body bottom threaded hole for screw fastening of the feed network mother board.

[0021] The support metal body antenna threaded hole is a support metal body internal threaded hole for screw fastening of the antenna mounting plate.

[0022] The feed network mother board top pad is located at the top of the feed network mother board for signal interconnection at the top of the feed network mother board.

[0023] The feed network mother board is located below the support metal body for switching and interconnection of all signals.

[0024] The feeding network motherboard screw is located between the feeding network motherboard and the supporting metal body, and is used for fastening the feeding network motherboard and the supporting metal body;

[0025] The feeding network motherboard bottom pad is located at the bottom of the feeding network motherboard, and is used for interconnection of the feeding network motherboard signal;

[0026] The feeding network motherboard through hole is a threaded hole inside the feeding network motherboard, and is used for fastening the feeding network motherboard and the antenna mounting plate.

[0027] The feeding network sub-board adopts a row feeding network sub-board or a column feeding network sub-board;

[0028] The row feeding network sub-board and the column feeding network sub-board both have the advanced packaging module arranged in the middle of the board surface in rows or columns, and the feeding network sub-board screws are uniformly distributed on both sides of the board surface.

[0029] The signal connection types of the feeding network sub-board and the feeding network motherboard include a radio frequency signal, a power signal and a digital control signal.

[0030] The feeding network motherboard top and bottom signal interfaces are the feeding network motherboard top pad and the feeding network motherboard bottom pad, and are used for matching the double-sided needle spring button inside the supporting metal body and the antenna mounting plate button elastic connection.

[0031] The advanced packaging module adopts a silicon-based packaging module or a ceramic packaging module or a glass-based packaging module.

[0032] In another aspect, the application also provides a sandwich type comprehensive feeding network assembly method for realizing the above-mentioned easy-to-disassemble tile radio frequency front end architecture, comprising the following steps:

[0033] Step one, after completing the feeding network motherboard test, the feeding network motherboard and the supporting metal body are fastened together through the feeding network motherboard screw;

[0034] Step two, the double-sided needle spring button is placed on the supporting metal body by aligning the internal mounting hole of the supporting metal body;

[0035] Step three, the advanced packaging module is tested, and after passing the test, the advanced packaging module is welded on the feeding network sub-board through the BGA solder ball and is subjected to a qualification test;

[0036] Step four, the feeding network sub-board is fastened by aligning the supporting metal body through the feeding network sub-board screw, realizing the complete assembly of the advanced packaging module and the easy-to-disassemble sandwich type comprehensive feeding network.

[0037] Compared with the prior art, the significant advancement of this invention lies in the following: This invention employs a feed network sub-board, a supporting metal body, and a feed network motherboard to form an easily detachable sandwich-style integrated feed network architecture. The connection with the antenna and the back end only involves one reflow oven soldering process where the advanced packaging module is soldered onto the feed network sub-board. This reduces the number of times the advanced packaging module undergoes reflow oven soldering, extending its service life. Furthermore, the feed network sub-board can be split into rows or columns as needed to form multiple rows or columns of feed network sub-boards, avoiding large-area soldering and reducing the risk of poor soldering when soldering the advanced packaging module. The row or column feed network sub-boards can be tested and assembled separately, reducing assembly difficulty and increasing testability.

[0038] To more clearly illustrate the functional characteristics and structural parameters of the present invention, further explanation is provided below in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0039] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings:

[0040] Figure 1 This is a schematic diagram of the architecture of the present invention;

[0041] Figure 2 This is a schematic diagram of the sandwich-type integrated power supply network structure of the present invention;

[0042] Figure 3 This is a schematic diagram of the sub-board structure of the row feeder network of the present invention;

[0043] Figure 4 This is a schematic diagram of the sub-board structure of the power supply network of the present invention.

[0044] The reference numerals in the figure are as follows: Antenna mounting plate screw 101, Antenna 102, Antenna mounting plate 103, Antenna mounting plate button 104, Bottom pad of feed network motherboard 105, Screw of feed network motherboard 106, Feed network motherboard 107, Top pad of feed network motherboard 108, Threaded hole of antenna supporting metal body 109, Threaded hole of supporting metal body motherboard 110, Double-sided spring pin button 111, Supporting metal body 112, Threaded hole of supporting metal body daughterboard 113, Lower pad of feed network daughterboard 114, Feed network daughterboard 115, Feed network daughterboard screw 116, Through hole of feed network motherboard 219, Sandwich integrated feed network assembly 220, Advanced packaging module 118, BGA solder ball 117, Row feed network daughterboard 315, Column feed network daughterboard 415. Detailed Implementation

[0045] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] This invention provides an easily detachable tile-type radio frequency front-end architecture, combined with Figure 1 It includes an advanced packaging module 118, BGA solder balls 117, a sandwich-type integrated feed network assembly 220, antenna mounting plate screws 101, antenna 102, antenna mounting plate 103, and antenna mounting plate fasteners 104.

[0047] The advanced packaging module 118 has BGA solder balls 117 for implementing radio frequency architecture functions.

[0048] The BGA solder balls 117 are embedded at the bottom of the advanced packaging module 118 for signal interconnection between the advanced packaging module 118 and the sandwich integrated power supply network component 220.

[0049] The bottom of the sandwich-type integrated power supply network assembly 220 is connected to the antenna mounting plate button 104.

[0050] The antenna mounting plate button 104 is embedded in the top of the antenna mounting plate 103 and is used for signal interconnection between the antenna mounting plate 103 and the sandwich-type integrated feed network assembly 220;

[0051] The antenna mounting plate 103 is located below the sandwich-type integrated feed network assembly 220 and is used to install the antenna.

[0052] The antenna 102 is mounted on the antenna mounting plate 103 to realize the system antenna function;

[0053] The antenna mounting plate screw 101 is located inside the antenna mounting plate 103 and the sandwich-type integrated feed network assembly 220, and is used to fasten both.

[0054] Combination Figure 2 The sandwich-type integrated feed network assembly 220 includes a feed network sub-board screw 116, a feed network sub-board 115, a lower pad 114 on the feed network sub-board, a threaded hole 113 on the supporting metal body sub-board, a supporting metal body 112, a double-sided spring pin button 111, a threaded hole 110 on the supporting metal body mother plate, a threaded hole 109 on the supporting metal body antenna, a top pad 108 on the feed network mother plate, a feed network mother plate 107, a feed network mother plate screw 106, a bottom pad 105 on the feed network mother plate, and a through hole 219 on the feed network mother plate.

[0055] The power supply network sub-board screw 116 is located inside the power supply network sub-board 115 and the supporting metal body 112, and is used to fasten the two.

[0056] The power supply network sub-board 115 is located below the advanced packaging module 118 and is used for power supply and signal input / output of the advanced packaging module 118.

[0057] The lower pad 114 of the power supply network subboard is located at the bottom of the power supply network subboard 115 and is used for signal interconnection at the bottom of the power supply network subboard 115;

[0058] The threaded hole 113 on the supporting metal body sub-board is the threaded hole at the top of the supporting metal body 112, and is used for screw fastening of the power supply network sub-board 115;

[0059] The double-sided spring-loaded button 111 is provided inside the supporting metal body 112 to realize the signal connection between the power supply network sub-board 115 and the power supply network motherboard 107;

[0060] The double-sided spring-loaded button 111 is embedded in the supporting metal body 112 and is used for signal interconnection between the power supply network sub-board 115 and the power supply network motherboard 107;

[0061] The threaded hole 110 on the supporting metal body mother plate is the threaded hole at the bottom of the supporting metal body 112, and is used for screw fastening of the power supply network mother plate 107;

[0062] The threaded hole 109 of the supporting metal body antenna is an internal threaded hole of the supporting metal body 112, used for fastening the screws of the antenna mounting plate 103.

[0063] The top pad 108 of the power supply network motherboard is located on the top of the power supply network motherboard 107 and is used for signal interconnection on the top of the power supply network motherboard 107;

[0064] The power supply network motherboard 107 is located below the supporting metal body 112 and is used for the conversion and interconnection of all signals;

[0065] The power supply network mother plate screw 106 is located between the power supply network mother plate 107 and the supporting metal body 112, and is used to fasten the power supply network mother plate 107 and the supporting metal body 112;

[0066] The bottom pad 105 of the power supply network motherboard is located at the bottom of the power supply network motherboard 107 and is used for interconnection of signals of the power supply network motherboard 107;

[0067] The through hole 219 of the power supply network motherboard is an internal threaded hole of the power supply network motherboard 107, used to fasten the power supply network motherboard 107 and the antenna mounting plate 103.

[0068] Combination Figure 3 and Figure 4 The power supply network sub-board 115 is a row power supply network sub-board 315 or a column power supply network sub-board 415;

[0069] Both the row power supply network sub-board 315 and the column power supply network sub-board 415 have the advanced packaging module 118 arranged in rows or columns in the middle of the board surface, and the power supply network sub-board screws 116 are evenly distributed on both sides of the board surface.

[0070] The signal connection types of the power supply network sub-board 115 and the power supply network motherboard 107 include: radio frequency signals, power signals and digital control signals.

[0071] The top and bottom signal interfaces of the power supply network motherboard 107 are the top pad 108 and the bottom pad 105 of the power supply network motherboard, which are used to match the double-sided spring pin button 111 inside the supporting metal body 112 and the antenna mounting plate button 104 for elastic connection.

[0072] The advanced packaging module 118 adopts a silicon-based packaging module, a ceramic packaging module, or a glass-based packaging module.

[0073] The sandwich-style integrated feed network assembly method based on the above-mentioned easily detachable tile RF front-end architecture includes the following steps:

[0074] Step 1: After completing the test of the power supply network motherboard 107, fasten the power supply network motherboard 107 and the supporting metal body 112 together with the power supply network motherboard screws 106.

[0075] Step 2: Align the double-sided spring-loaded button 111 with the mounting hole inside the supporting metal body 112 and place it on the supporting metal body 112;

[0076] Step 3: Test the advanced packaging module 118. After passing the test, solder the advanced packaging module 118 onto the power supply network sub-board 115 using the BGA solder balls 117 and perform a pass / fail test on it.

[0077] Step 4: Align the two types of power supply network sub-boards 115, row power supply network sub-boards 315 or column power supply network sub-boards 415, with the supporting metal body 112 and fasten them with the power supply network sub-board screws 116 to achieve complete assembly of the advanced packaging module 118 with the easily detachable sandwich integrated power supply network 220.

[0078] The power supply network sub-board screws 116 and the advanced packaging modules 118 are assembled in rows to form the row power supply network sub-board 315 or in columns to form the column power supply network sub-board 415, so that a single row or column module can be disassembled, avoiding the simultaneous disassembly and assembly of all the advanced packaging modules 118.

[0079] The bottom pad 105 of the power supply network motherboard, the top pad 108 of the power supply network motherboard, the threaded hole 109 of the supporting metal antenna, the threaded hole 110 of the supporting metal motherboard, the bottom pad 114 of the power supply network subboard, and the threaded hole 113 of the supporting metal subboard do not require assembly.

[0080] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0081] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A detachable tile-type radio frequency front-end architecture, characterized in that, Includes advanced packaging module (118), BGA solder ball (117), sandwich integrated feed network assembly (220), antenna mounting plate button (104), antenna mounting plate (103), antenna (102), and antenna mounting plate screw (101). The advanced packaging module (118) includes BGA solder balls (117) for implementing radio frequency architecture functions; The BGA solder balls (117) are embedded at the bottom of the advanced packaging module (118) for signal interconnection between the advanced packaging module (118) and the sandwich integrated power supply network assembly (220); The bottom of the sandwich-type integrated feed network assembly (220) is connected to the antenna mounting plate button (104); The antenna mounting plate button (104) is embedded in the top of the antenna mounting plate (103) for signal interconnection between the antenna mounting plate (103) and the sandwich integrated feed network assembly (220); The antenna mounting plate (103) is located below the sandwich-type integrated feed network assembly (220) and is used to install the antenna; The antenna (102) is mounted on the antenna mounting plate (103) to realize the system antenna function; The antenna mounting plate screw (101) is located inside the antenna mounting plate (103) and the sandwich integrated feed network assembly (220) for fastening both.

2. The easily detachable tile-type RF front-end architecture according to claim 1, characterized in that, The sandwich-type integrated feed network assembly (220) includes a feed network sub-board screw (116), a feed network sub-board (115), a feed network sub-board lower pad (114), a support metal body sub-board threaded hole (113), a support metal body (112), a double-sided spring pin button (111), a support metal body mother board threaded hole (110), a support metal body antenna threaded hole (109), a feed network mother board top pad (108), a feed network mother board (107), a feed network mother board screw (106), a feed network mother board bottom pad (105), and a feed network mother board through hole (219). The feed network sub-board screw (116) is located inside the feed network sub-board (115) and the supporting metal body (112) for fastening both. The power supply network sub-board (115) is located below the advanced packaging module (118) and is used for power supply and signal input / output of the advanced packaging module (118); The lower pad (114) of the power supply network subboard is located at the bottom of the power supply network subboard (115) and is used for signal interconnection at the bottom of the power supply network subboard (115); The threaded hole (113) on the supporting metal body sub-board is the threaded hole on the top of the supporting metal body (112), and is used for screw fastening of the power supply network sub-board (115); The double-sided spring-loaded button (111) is provided inside the supporting metal body (112) to realize the signal connection between the power supply network sub-board (115) and the power supply network motherboard (107); The double-sided spring-loaded button (111) is embedded in the supporting metal body (112) and is used for signal interconnection between the power supply network sub-board (115) and the power supply network motherboard (107); The threaded hole (110) on the mother plate of the supporting metal body is the threaded hole at the bottom of the supporting metal body (112), and is used for screw fastening of the power supply network mother plate (107); The threaded hole (109) of the supporting metal body antenna is an internal threaded hole of the supporting metal body (112) and is used for fastening the screws of the antenna mounting plate (103); The top pad (108) of the power supply network motherboard is located on the top of the power supply network motherboard (107) and is used for signal interconnection on the top of the power supply network motherboard (107); The power supply network motherboard (107) is located below the supporting metal body (112) and is used for the conversion and interconnection of all signals; The power supply network mother plate screw (106) is located between the power supply network mother plate (107) and the supporting metal body (112) for fastening the power supply network mother plate (107) and the supporting metal body (112); The bottom pad (105) of the power supply network motherboard is located at the bottom of the power supply network motherboard (107) and is used for interconnection of signals of the power supply network motherboard (107); The through hole (219) of the power supply network motherboard is an internal threaded hole of the power supply network motherboard (107) and is used to fasten the power supply network motherboard (107) and the antenna mounting plate (103).

3. The easily detachable tile-type RF front-end architecture according to claim 2, characterized in that, The power supply network sub-board (115) adopts a row power supply network sub-board (315) or a column power supply network sub-board (415). Both the row power supply network sub-board (315) and the column power supply network sub-board (415) have the advanced packaging module (118) arranged in rows or columns in the middle of the board surface, and the power supply network sub-board screws (116) are evenly distributed on both sides of the board surface.

4. The easily detachable tile-type RF front-end architecture according to claim 1, characterized in that, The signal connection types of the power supply network sub-board (115) and the power supply network motherboard (107) include: radio frequency signals, power supply signals and digital control signals.

5. The easily detachable tile-type RF front-end architecture according to claim 1, characterized in that, The top and bottom signal interfaces of the power supply network motherboard (107) are the top pad (108) and the bottom pad (105) of the power supply network motherboard, which are used to match the double-sided spring pin button (111) inside the supporting metal body (112) and the antenna mounting plate button (104) for elastic connection.

6. The easily detachable tile-type RF front-end architecture according to claim 1, characterized in that, The advanced packaging module (118) adopts a silicon-based packaging module, a ceramic packaging module, or a glass-based packaging module.

7. A sandwich-style integrated feed network assembly method for implementing the easily detachable tile RF front-end architecture of claim 2, characterized in that, Includes the following steps: Step 1: After the power supply network motherboard (107) has been tested, it is fastened to the supporting metal body (112) by the power supply network motherboard screws (106). Step 2: Align the double-sided spring-loaded button (111) with the mounting hole inside the supporting metal body (112) and place it on the supporting metal body (112); Step 3: Test the advanced packaging module (118). After passing the test, solder the advanced packaging module (118) onto the power supply network sub-board (115) using the BGA solder balls (117) and perform a qualification test on it. Step 4: Align the power supply network sub-board (115) with the supporting metal body (112) and fasten it with the power supply network sub-board screws (116) to complete the assembly of the advanced packaging module (118) and the easily detachable sandwich integrated power supply network (220).

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